JP2018101728A - Support apparatus and support method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a support device capable of changing a support pattern of a support object, and a support method.SOLUTION: A support device incudes first support means 20 for supporting a support object WF on a support face 23A of a first support member 23, second support means 30 for supporting the support object WF on a support face 35B of a second support member 35, and a main body part 40 for supporting the first support means 20 and the second support means 30. At least one of the first and second support means 20 and 30 is configured so as to be able to relatively move the first support member 23 or the second support means 35 which constitutes itself with respect to the body 40 between a position where the support faces 23A, 35B face a supported face of the support object WF and a position where they do not face the supported face of the support object WF.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a support device and a support method.

  Conventionally, a first support means for supporting a support object on a support surface of a first support member, a second support means for supporting a support object on a support surface of a second support member, a first support means and a second support. 2. Description of the Related Art A support device including a main body portion that supports means is known (for example, see Patent Document 1).

JP 2012-79789 A

  However, since the conventional support apparatus described in Patent Document 1 has one support pattern for supporting a wafer (support object), for example, the shape, material, characteristics, characteristics, properties, composition, and configuration of the support object. In view of dimensions, weight, and other factors, the support object is supported only by the support surface of the central arm portion 12 (first support member), or the auxiliary arms 13 and 14 (second support member). Even if there is a case where it is desired to support the object to be supported only by the support surface, there is an inconvenience that it cannot be dealt with.

  The objective of this invention is providing the support apparatus and the support method which can change the support pattern of a support target object.

  The present invention employs the configurations described in the claims.

According to the present invention, since at least one of the first support member and the second support member can be moved relative to the main body portion, the support pattern of the support object can be changed.
Further, if the interval changing means is provided, the support object can be reliably supported even if the size of the support object is changed.
Furthermore, if a 3rd support means is provided, a support target object can be supported more reliably.
Moreover, if a positioning means is provided, a support target object can be supported in a fixed position.
Furthermore, if the support object is positioned by relatively moving at least one of the first support member and the second support member that support the support object with respect to the positioning means, the support object can be reliably positioned.
In addition, if at least one of the first support member and the second support member is configured to rotate relative to the main body portion so that the support surface is inverted, the support pattern for supporting the support object can be increased.
Furthermore, if it is set as the structure which can move to the direction which cross | intersects with respect to the to-be-supported surface of a support target object, at least one of a 1st support member and a 2nd support member can support a support target object reliably.

(A), (B) is a schematic plan view of the support apparatus which concerns on one Embodiment of this invention. (A)-(C) are the fragmentary sectional views of the support apparatus of FIG. Operation | movement explanatory drawing of the support apparatus of FIG. Explanatory drawing of a support pattern.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewing from the BD direction shown in FIG. 1A parallel to the Y axis as a reference and showing the direction without giving a reference figure, “up” is the Z axis. In the arrow direction, “down” is the opposite direction, “left” is the arrow direction of the X axis and “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction. The direction.

  1 and 2, the support device 10 of the present invention includes a first support means 20 that supports a semiconductor wafer (hereinafter also simply referred to as a “wafer”) WF as a support object on a support surface 23 </ b> A of a first support member 23. A second support means 30 for supporting the wafer WF on the support surface 35B of the second support member 35, a base member 40 as a main body for supporting the first support means 20 and the second support means 30, and a first support. The third support means 50 that supports the wafer WF positioned between the member 23 and the second support member 35 on the support surface 52A of the third support member 52, and the distance between the first support member 23 and the second support member 35 As a distance changing means 60 capable of changing the distance between the first support member 23 and the third support member 52 and the distance between the second support member 35 and the third support member 52, and a positioning means for positioning the wafer WF. Pin-shaped A-decided Me pins 70 constitute a conveying device 10A by being supported by the moving means 80.

  The first support means 20 includes a linear motor 21 as a driving device supported by the base member 40, a rotating motor 22 as a driving device supported by the slider 21A, and a first motor supported by the output shaft 22A. A support member 23 and five holding means 24 supported so as to be buried in the support surface 23A are provided, and one set is arranged at the center of the base member 40, and the support surface 23A serves as a supported surface of the wafer WF. Between the position facing the lower surface (position indicated by the two-dot chain line in FIG. 1A) and the position not facing the supported surface of the wafer WF (position indicated by the solid line in FIG. 1A) The configured first support member 23 is configured to be relatively movable with respect to the base member 40 (hereinafter, this relative movement is referred to as “reciprocal movement”), and the support surface 23 </ b> A is reversed with respect to the base member 40. Phase to do It is rotatably configured.

  The second support means 30 includes a single rotary motor 32 as a driving device supported by the support plate 31, three rotary bearings 33 supported by the support plate 31, and an output shaft 32 </ b> A of the rotary motor 32. In addition, four holding rollers 34 supported by the respective rotary shafts 33A supported by the respective rotary bearings 33 and V grooves 34A formed on the outer peripheral portions of the respective holding rollers 34 are formed on both front and rear sides. 2nd support member 35 in which the pointed part 35A entered and supported, and four holding means 36 supported so as to be buried in the support surface 35B, are arranged in two sets before and after the first support means 20 The position where the support surface 35B faces the supported surface of the wafer WF (the position indicated by the two-dot chain line in FIG. 1A) and the position where it does not face the supported surface of the wafer WF (the solid line in FIG. 1A) Position) Relative movement (hereinafter, referred to as "reciprocation" The relative movement) of the second supporting member 35 constituting the relative to the base member 40 is configured to be capable.

  The third support means 50 includes a third support member 52 supported by an output shaft 51A of a linear motion motor 51 as a drive device, and two holding means 53 supported so as to be buried in the support surface 52A. The positioning pins 70 are supported on the support surface 52A, and two sets are arranged before and after the first support means 20, and the support surfaces 52A face the supported surface of the wafer WF (two points in FIG. 1A). The third support member 52 constituting itself between the base member 40 and the position that does not oppose the supported surface of the wafer WF (the position indicated by the solid line in FIG. 1A). On the other hand, relative movement (hereinafter referred to as “reciprocating movement”) is possible.

Each of the holding means 24, 36, and 53 in this embodiment includes both an air supply means such as a pressurizing pump and a turbine for sending gas and an air intake means such as a decompression pump and a vacuum ejector for returning the gas. The air intake / intake means (not shown) provided with each are individually and independently connected. Each holding means 24, 36, 53 blows gas radially along one surface of the wafer WF by the air intake / intake means, so that the inside of the radially blown gas and one surface of the wafer WF By using the Bernoulli's theorem to form a decompression region between the two and the suction and holding of the wafer WF (hereinafter, this adsorption is referred to as “air feeding adsorption”), and by sucking the gas by the air feeding and intake means, Adsorption using reduced pressure (hereinafter referred to as “intake adsorption”) can be performed. Accordingly, the term “support” as used in the present invention means that the support surfaces 23A, 35B, and 52A are supported by contacting the supported surface of the support object, and the support surfaces 23A, 35B, and 52A are supported by the support object. Also included are those that are supported without being brought into contact with each other.
Further, the support surfaces 23A, 35B, 52A are positioned in the same plane in the state of FIG.

  The interval changing means 60 includes a linear motor 61 as a driving device supported by the base member 40, the support plate 31 is supported by the first slider 61A, and the linear motor 51 is supported by the second slider 61B. Two sets are arranged before and after the first support means 20.

  The moving means 80 includes an articulated robot 81 as a driving device, and the base member 40 is supported on the tip arm 81 A of the articulated robot 81.

Operation | movement of 10 A of conveying apparatuses provided with the above support apparatus 10 is demonstrated.
The transfer device 10A takes out the wafers WF placed one by one on the pair of left and right bars WC2 formed at a predetermined interval in the vertical direction in the wafer cassette WC from the wafer cassette WC. It shall be conveyed on the conveyance stand of a predetermined conveyance destination.
First, a user (hereinafter simply referred to as a “user”) of the transfer device 10A has a control panel or personal user with respect to the transfer device 10A in which each member is disposed at an initial position indicated by a solid line in FIG. A size such as a diameter dimension or a thickness dimension of the wafer WF is input via an operation unit (not shown) such as a computer. Thereafter, when the user inputs a signal for starting automatic operation, the moving means 80 drives the articulated robot 81, and as shown by the solid line in FIG. 1A, the wafer WF and the support surfaces 23A, 35B in the top view. , 52A so that the support device 10 is opposed to the opening WC1 of the wafer cassette WC. Thereby, each support surface 23A, 35B, 52A of the 1st, 2nd, 3rd support member 23, 35, 52 is arrange | positioned in the position which does not oppose the to-be-supported surface of the wafer WF. At this time, the moving unit 80 arranges the support surfaces 23A, 35B, and 52A below the lower surface of the wafer WF to be transferred. Note that the initial position of the transfer apparatus 10A and the position where the support apparatus 10 is disposed to face the opening WC1 of the wafer cassette WC may be the same position or different positions.

Next, the first, second, and third support means 20, 30, 50 drive the linear motor 21, the rotation motor 32, and the linear motion motor 51, and the first, second, and third motors 51, 30, 50 correspond to the input size of the wafer WF. 2. The third support members 23, 35, and 52 are protruded to the right by a predetermined length. As a result, as indicated by the two-dot chain line in FIG. 1A, the support surfaces 23A, 35B, 52A of the first, second, and third support members 23, 35, 52 are opposed to the supported surfaces of the wafer WF. It is arranged at the position to do.
As shown in FIG. 1A, in the case of a small-sized wafer WF 1, the interval changing means 60 drives the linear motor 61 to bring the second and third support members 35 and 52 closer to the first support member 23. 1B, in the case of a large-sized wafer WF2, the interval changing unit 60 drives the linear motor 61 and moves the second and third support members 35 and 52 away from the first support member 23. .

  Thereafter, the moving means 80 drives the articulated robot 81 to raise the support device 10 so that the support surfaces 23A, 35B, 52A come into contact with the supported surface of the wafer WF, and the first, second, and third support members. The wafer WF is supported by 23, 35, and 52, and is floated from the crosspiece WC2. Next, after the first, second, and third support means 20, 30, and 50 respectively drive the air intake / intake means (not shown) and suck the wafer WF by the holding means 24, 36, and 53, the moving means 80 is articulated. The robot 81 is driven to take out the wafer WF from the wafer cassette WC. Next, after the first, second, and third support means 20, 30, and 50 stop driving the air intake / intake means (not shown), the first and second support means 20, 30 become the linear motor 21 and the rotation motor. 32 is driven to move the first and second support members 23 and 35 to the left. As a result, both the first and second support members 23 and 35 that support the wafer WF and the positioning pins 70 are relatively moved, and the wafer WF is brought into contact with the positioning pins 70 to position the wafer WF.

  When the positioning of the wafer WF is completed, the first, second, and third support means 20, 30, and 50 drive the air supply / intake means (not shown), and the holding means 24, 36, and 53 perform suction suction. Next, the moving unit 80 drives the articulated robot 81 to transfer the wafer WF supported by the support device 10 to a predetermined transfer destination and support it by the first, second, and third support members 23, 35, and 52. The surface of the non-wafer WF (the surface opposite to the supported surface) is brought into contact with a transfer table (not shown). Then, after the first, second and third support means 20, 30, 50 stop driving the air intake / intake means (not shown), the moving means 80 drives the articulated robot 81, and the first, second, third The support members 23, 35 and 52 are separated from the wafer WF. Thereafter, each means drives each driving device to return each member to the initial position, and thereafter the same operation as described above is repeated.

Here, in the above description of the operation of the support device 10, the first, second, and third support means 20, 30, and 50 project all of the first, second, and third support members 23, 35, and 52, As shown in FIG. 4A, the case where the first support member 23, the second support member 35, and the third support member 52 support the wafer WF from one surface side is shown. The third support means 20, 30, 50 project any one or two of the first, second, third support members 23, 35, 52, and are shown in FIGS. 4 (2) to (4). As described above, the wafer WF may be supported only by the first support member 23, only the second support member 35, or only the third support member 52, or the first, second, and third support means 20, 30, 50. However, any two of the first, second, and third support members 23, 35, and 52 are protruded and shown in FIGS. 4 (5) to (7). Thus, the wafer WF is supported by the first support member 23 and the second support member 35, by the first support member 23 and the third support member 52, or by the second support member 35 and the third support member 52. Alternatively, the first support member 20 drives the rotation motor 22, and the first support member 23 can be rotated relative to the base member 40 so that the support surface 23A is reversed as shown in FIG. For example, a support pattern as shown in FIGS. 4 (8) to (11) can be adopted.
The first support member 23 may rotate the first support member 23 relative to the base member 40 so that the support surface 23A is reversed while supporting the wafer WF while supporting the wafer WF. The first support member 23 may be rotated relative to the base member 40 in the previous state, and then the wafer WF may be supported by the first support member 23.
The first, second, and third support means 20, 30, and 50 are configured so that one or two of the first, second, and third support members 23, 35, and 52 are attached to the base member 40. Then, when the support surfaces 23A, 35B, and 52A are rotated relative to each other so as to be reversed, the holding means 24, 36, and 53 are spaced apart from the support member that is not rotated relative to the thickness of the wafer WF. The wafer WF may be sucked and sucked by all, or the wafer WF may be held by separating the sucking suction and suction suction by the support member that is relatively rotated and the support member that is not relatively rotated. In the case where the supporting object may be deformed, the wafer WF may be sucked and sucked by all the holding means 24, 36, and 53.
Further, any one or two of the first, second, and third support members 23, 35, and 52 are rotated relative to the base member 40 so that the support surfaces 23A, 35B, and 52A are reversed, Since the distance from the support member that has not been relatively rotated may be less than or equal to the thickness of the wafer WF, or the support surface of the wafer WF may be uneven, the first, second, and third support means 20 may be used. , 30, 50 may be configured so that at least one of the first, second, third support members 23, 35, 52 can be moved in a direction intersecting the supported surface of the wafer WF.

  According to the embodiment as described above, since both the first support member 23 and the second support member 35 can be moved relative to the base member 40, the support pattern of the wafer WF can be changed.

  The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the main body can support the first support means and the second support means, there is no limitation as long as it is within the technical scope in light of the common general technical knowledge at the time of filing ( The other means and steps are the same, and the description thereof is omitted).

  Two or more sets of the first support means 20 may be used, or the first support member 23 that does not rotate relative to the base member 40 so that the support surface 23A is reversed may be employed. Alternatively, the first support member 23 may be formed of a member having another shape such as a columnar shape or a prismatic shape, or the first support member 23 may be configured in the same manner as the second support means 30 or the third support means 50 or other configurations. The first support member 23 may be configured to reciprocate, or in the case where the second support member 35 is configured to reciprocate, the first support member 23 may be configured not to reciprocate.

The second support means 30 may be one set or three or more sets. The second support means 30 supports the holding roller 34 by the output shaft 32A of each of the plurality of rotation motors 32, and rotates the plurality of holding rollers 34 to 1 The body support member may be moved, the number of the holding rollers 34 may be two, three, five or more, and the member may be other shapes such as a columnar or prismatic shape instead of a plate shape. The second support member 35 may be configured, or the second support member 35 that rotates relative to the base member 40 so that the support surface 35B is reversed may be employed. In this case, FIG. The support pattern as shown in (17) can be adopted, and the second support member 35 may be rotated relative to the base member 40 while the wafer WF is supported, or before the wafer WF is supported. In this state, the second support member 35 is Were allowed to rotate relative to the scan member 40, it may be configured to support the wafer WF in the second supporting member 35.
The second support means 30 may be configured such that the second support member 35 can reciprocate by the same configuration as the first support means 20 and the third support means 50, other configurations, or the like, or the first support member 23. In the configuration in which the second support member 35 is capable of reciprocating, the second support member 35 may be configured not to reciprocate.

  The main body may be composed of a member having another shape such as a columnar shape or a prismatic shape instead of a plate shape, and may be anything as long as it can support the first support means 20 and the second support means 30, The moving means 80 may not be supported.

The third support means 50 may be one set or three or more sets, or the third support member 52 may be configured by a member having another shape such as a columnar shape or a prismatic shape instead of a plate shape, It may be configured to rotate relative to the base member 40 so that the support surface 52A is reversed. In this case, a support pattern as shown in FIGS. 4 (18) to (26) can be taken, The third support member 52 may be rotated relative to the base member 40 while the wafer WF is supported, or the third support member 52 may be moved relative to the base member 40 before the wafer WF is supported. The wafer WF may be supported by the third support member 52 after the relative rotation.
The third support unit 50 may be configured such that the third support member 52 can reciprocate by the same configuration as the first support unit 20 or the second support unit 30 or other configurations, or may not reciprocate. Alternatively, the supporting device 10 of the present invention may not be provided.

  The interval changing means 60 may be configured to move the first support member 23, or may be configured to support the first support member 23, the second support member 35, and the third support with separate drive devices or with a single drive device. The distance between the first support member 23 and the third support member 52 may be changed. Alternatively, the distance between the first support member 23 and the third support member 52 may be changed. Only the interval between the second support member 35 and the third support member 52 may be changed, or the support device 10 of the present invention may not be provided.

  The positioning means may be configured by any shape member such as a plate shape, a block shape, a spherical shape, a cylindrical shape other than the pin shape, and is not supported by the third support member 52, for example, the first support member. 23, the second support member 35, the base member 40, etc., may be composed of one body, may be composed of three or more bodies, and is provided in the support device 10 of the present invention. It does not have to be.

  As the articulated robot 81, the moving means 80 may adopt any so-called SCARA robot, 6-axis robot, 5-axis or less articulated robot, 7-axis or more articulated robot, or the like, and positions the wafer WF. At this time, the support device 10 is tilted, and the wafer WF supported by at least one of the first support member 23, the second support member 35, and the third support member 52 is moved in the direction of the positioning means and brought into contact therewith. The wafer WF may be positioned, and at the transfer destination, any surface of the wafer WF may be transferred so as to abut on a transfer table (not shown), or may be transferred to the support device 10 of the present invention. It does not have to be provided.

  The transfer device 10A disposes the support device 10 in which each member is in the initial position at a position where the wafer WF and each support surface 23A, 35B, 52A overlap with each other in a top view in the vicinity of the wafer WF. At least one of the second and third support members 23, 35, 52 protrudes from the base member 40, and the moving means 80 drives the articulated robot 81 so that the base member 40 does not overlap the wafer WF when viewed from above. Or at least two of the first, second, and third support members 23, 35, and 52 in advance before the support device 10 faces the opening WC1 of the wafer cassette WC. After the protruding support member is arranged at a position facing the supported surface of the wafer WF, at least one of the protruding support members Other support members may be retracted to a position that does not face the supported surface of the wafer WF, or may be sequentially protruded from the base member 40 with a time difference, or may be retracted sideways or obliquely. The wafer WF may be arranged and supported, or the support surfaces 23A, 35B, and 52A may be arranged above the upper surface of the wafer WF to be transferred, and the upper surface of the wafer WF may be used as the supported surface.

The support device 10 is not only the transport device 10A, but only supports the support target without transporting the support target, for example, an adherend support means or a deposition of a sheet sticking device for sticking an adhesive sheet Body support table, adherend transport means, peeling object support means, peel object support table, peel object transport means, and support object of the sheet peeling apparatus for peeling the adhesive sheet are ground, cut or surface treated. May be employed in processing object support means, processing object support tables, processing object transport means, etc. of various processing devices that inspect, inspect, print or print on a support object, and perform predetermined processing. .
The holding means 24, 36, and 53 may use air, a single gas, or a composite gas as a gas sent by an air supply / intake means (not shown), or 1 each for the first, second, and third support members 23, 35, and 52. The body may be provided, or each may be provided with two or more, and is not limited to the number, and the wafer WF may be held only by intake suction (in this case, the air supply / intake means is There may or may not be an air supply means), and the wafer WF may be held only by air supply adsorption (in this case, the air supply / intake means may or may not have an intake means). The wafer WF may be held by both intake air suction and air supply adsorption, or the wafer WF may be held by switching between intake air suction and air supply adsorption. The wafer WF may be held while switching between and the support surface 23. , 35B, 52A, the holding surface of the holding means may be located on the same plane as the supporting surfaces 23A, 35B, 52A, or the holding surface of the holding means is the supporting surface. 23A, 35B, 52A may be jumped out, the holding surface of the holding means may be retracted from the support surfaces 23A, 35B, 52A, or a plurality of one air supply / intake means may be connected, All the holding means 24 may be connected to one air intake / intake means, all the holding means 36 may be connected to one air intake / intake means, or all the holding means 53 are connected to one air intake / intake means. The holding means 24, 36, 53 may all be connected to a single air intake / intake means. For example, the wafer WF may be only sucked and sucked by suction holding means such as suction pads and suction holes. Hold The wafer WF may be supported by a gripping means such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive, an adhesive, a magnetic force, a driving device, or the like. If you just need to do it, you may or may not.
When the holding unit is in a position where the wafer WF cannot be held when the wafer WF is supported, the holding unit may or may not perform a holding operation for holding the wafer WF such as suction suction or air suction suction.
The first, second, and third support means 20, 30, and 50 rotate at least one of the first, second, and third support members 23, 35, and 52 on an axis that intersects the supported surface of the wafer WF. It is good also as a structure which can reciprocate at least one among the 1st, 2nd, 3rd support members 23, 35, and 52 by carrying out rotational movement as a center.
The support surfaces 23A, 35B, and 52A may not be located in the same plane in the state of FIG.
The protrusion amounts of the first, second, and third support members 23, 35, and 52 from the base member 40, and the distances at which the second and third support members 35 and 52 are moved closer to and away from the first support member 23 are as follows. The user can arbitrarily decide.
When positioning the wafer WF, at least one of the first and second support units 20 and 30 may drive an air intake / intake unit (not shown) and may perform weak intake adsorption on at least one of the holding units 24 and 36. The wafer WF supported by at least one of the first and second support members 23 and 35 may be moved with respect to the stopped positioning pin 70, and the positioning pin 70 may be used. The wafer WF may be positioned, or the positioning pin 70 is moved with respect to the wafer WF that is supported and stopped by at least one of the first and second support members 23 and 35, and the wafer is moved by the positioning pin 70. Positioning of the WF may be performed, or both the wafer WF supported by at least one of the first and second support members 23 and 35 and the positioning pins 70 are brought close to each other, The positioning pins 70 may position the wafer WF. When the positioning member is supported by the base member 40, the wafer WF is supported by at least one of the first, second, and third support members 23, 35, and 52. The wafer WF being moved may be moved toward the positioning pins 70 and the positioning of the wafers WF may be performed with the positioning pins 70.
The wafer WF may not be stored in the wafer cassette WC.
The supported surface of the wafer WF may be the upper surface side, for example, the circuit surface side of the wafer WF, the surface opposite to the circuit surface, or the adhesive sheet side on which the adhesive sheet is attached to the circuit surface. Alternatively, the user can arbitrarily determine the shape, material, characteristics, characteristics, properties, composition, configuration, dimensions, weight, and other factors of the wafer WF.
The first, second, and third support members 20, 30, and 50 have first, second, and third support members 23 such that at least one of the support surfaces 23 </ b> A, 35 </ b> B, and 52 </ b> A is reversed with respect to the base member 40. , 35, 52 may be configured to relatively rotate.

  The material, type, shape, etc. of the support object in the present invention are not particularly limited. For example, the support object may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes. It may be in the form. In addition, such an adhesive sheet is, for example, a single layer having only an adhesive layer, one having only a base sheet and an adhesive layer, and an intermediate layer between the base sheet and the adhesive layer. It may be one layer or two or more layers, such as those having an intermediate layer between adhesive layers. In addition, the support object may be a plate-like member or a non-plate-like member. For example, food, various containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, and circuit boards An information recording substrate such as an optical disk, a glass plate, a steel plate, earthenware, a wooden plate, a resin plate, or any other member or article can be used. It should be noted that the adhesive sheet is replaced with functional and intended readings, for example, any shape such as a label for information description, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, etc. Any sheet, film, tape or the like can be attached to any adherend as described above.

  The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, a combination of them directly or indirectly can be adopted.

DESCRIPTION OF SYMBOLS 10 ... Support apparatus 20 ... 1st support means 23 ... 1st support member 23A ... Support surface 30 ... 2nd support means 35 ... 2nd support member 35B ... Support surface 40 ... Base member (main-body part)
DESCRIPTION OF SYMBOLS 50 ... 3rd support means 52 ... 3rd support member 52A ... Support surface 60 ... Space | interval change means 70 ... Positioning pin (positioning means)
WF ... wafer (supported object)

Claims (8)

First support means for supporting a support object on the support surface of the first support member;
Second support means for supporting the object to be supported by a support surface of a second support member;
A main body for supporting the first support means and the second support means,
At least one of the first support means and the second support means is between a position where the support surface faces the supported surface of the support object and a position where the support surface does not face the support surface of the support object. The support device is configured so that the first support member or the second support member constituting the base member can be moved relative to the main body.   The support device according to claim 1, further comprising an interval changing unit capable of changing an interval between the first support member and the second support member.   The third support means for supporting the object to be supported located between the first support member and the second support member by a support surface of a third support member. Item 3. The support device according to Item 2.   The support device according to claim 1, further comprising positioning means for positioning the support object.   Positioning of the support object is performed by relatively moving at least one of the first support member and the second support member supporting the support object and the positioning means, and bringing the support object into contact with the positioning means. The cutting apparatus according to claim 4, wherein:   6. At least one of the first support member and the second support member is configured to be rotatable relative to the main body so that the support surface is reversed. The support apparatus as described in.   7. At least one of the first support member and the second support member is configured to be movable in a direction that intersects a supported surface of the object to be supported. The support apparatus as described in. First support means for supporting a support object on the support surface of the first support member;
Second support means for supporting the object to be supported by a support surface of a second support member;
A main body for supporting the first support means and the second support means,
At least one of the first support means and the second support means is between a position where the support surface faces the supported surface of the support object and a position where the support surface does not face the support surface of the support object. In the method of supporting the object to be supported in the support device configured to be relatively movable with respect to the main body portion, the first support member or the second support member constituting the device,
A support method, wherein at least one of the first support member and the second support member is selected, and the support object is supported by at least one of the selected support members.

Images