JP2018101708A - Package, light emitting device, and method of manufacturing light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package and a light emitting device having excellent heat dissipation. SOLUTION: The package includes a lead and a molding resin and has a recess, and the lead has a first and a second lead, and the first and second leads have a thin-walled portion and a thick-walled portion, respectively. It has a metal base material provided with a base material and a plating layer provided on the surface of the base material, and the recess has a first lead including a thin-walled portion of the base material and a second lead including a thin-walled portion of the base material. A bottom surface comprising a lead and a molding resin between them, a first lead including a thick portion of the substrate, a second lead including a thick portion of the substrate, and a molding resin between them. The side walls constitute the outer surface of the package, each having first to fourth outer surfaces arranged to face in different directions, the entire surface of the first outer surface. A package consisting of a first lead and a plating layer and a base material provided on a thick portion of the base material of the first lead. [Selection diagram] FIG. 1A

Description

  The present invention relates to a package, a light emitting device, and a method for manufacturing the light emitting device.

  A package using a metal substrate is used as a package of a light emitting device such as an LED (Light Emitting Diode) using a semiconductor light emitting element (hereinafter also referred to as “light emitting element”). Since it is easy to corrode if the base material of a metal substrate is exposed, it is known to coat | cover with protective films, such as a ceramic and resin (for example, patent document 1, 2).

JP 2006-332382 A JP 2012-28422 A

  However, by covering the surface of the metal substrate that is the outer surface with a protective film, the heat dissipation tends to be lowered. In addition, since the number of steps for forming the protective film increases, the cost is likely to increase.

The present disclosure includes the following configurations.
A package having a lead and a molding resin and having a recess, wherein the lead has first and second leads, and each of the first and second leads has a thin part and a thick part. And a plating layer provided on the surface of the substrate, and the recess includes a first lead including the thin portion of the substrate, a second lead including the thin portion of the substrate, and these A side wall comprising: a bottom surface comprising a molding resin between; a first lead including a thick portion of the substrate; a second lead including a thick portion of the substrate; and a molding resin therebetween. , And the side wall constitutes the outer surface of the package and has first to fourth outer surfaces arranged to face different directions, and the entire first outer surface is formed from the first lead. And a package which is a plating layer and a base material provided on the thick part of the base material of the first lead.

  As described above, a package and a light-emitting device with excellent heat dissipation can be obtained.

FIG. 1A is a schematic perspective view illustrating a package according to an embodiment. FIG. 1B is a schematic top view illustrating the package according to the embodiment. 1A is a schematic cross-sectional view taken along line 1C-1C in FIG. 1A. FIG. 1D is a schematic side view showing the package according to the embodiment. FIG. 1E is a schematic side view showing the package according to the embodiment. FIG. 1F is a schematic side view illustrating the package according to the embodiment. FIG. 1G is a schematic side view showing the package according to the embodiment. FIG. 1H is a schematic bottom view showing the package according to the embodiment. FIG. 2A is a top view showing a modified example of the package according to the embodiment. FIG. 2B is a top view showing a modified example of the package according to the embodiment. FIG. 3 is a schematic perspective view illustrating the light emitting device according to the embodiment. FIG. 4A is a schematic top view showing the lead frame according to the embodiment. FIG. 4B is a schematic cross-sectional view illustrating the lead frame according to the embodiment. FIG. 5 is a schematic top view showing the package assembly according to the embodiment. FIG. 6A is a schematic top view illustrating the method for manufacturing the light emitting device according to the embodiment. FIG. 6B is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the embodiment.

  A mode for carrying out the present invention will be described below with reference to the drawings. However, the embodiments described below exemplify a package and a light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the package and the light emitting device to the following.

  Further, the present specification by no means specifies the member shown in the claims as the member of the embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present disclosure only to that unless otherwise specified. It is just an example. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. In the following description, terms indicating a specific direction or position (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. . The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms.

<Embodiment 1> Package An example of a package 10 according to Embodiment 1 is shown in FIGS. 1A to 1H. The package 10 includes a pair of leads 20 and a molding resin 30 and includes a recess 11 that opens to the upper surface 14 side. The recess 11 includes a bottom surface 12 and a side wall 13. The bottom surface 12 of the recess 11 is a surface on which an electronic component such as a light emitting element is placed.

  The shape of the package 10 as viewed from above can be rectangular. Specifically, the shape of the package 10 as viewed from above is a rectangle having a long side and a short side. The shape of the package 10 in a top view is not limited to this, and may be any shape that includes at least four outer surfaces arranged so as to face different directions. For example, it can be a polygon such as a square or a hexagon, a combination of these, a shape with a part cut away, or the like. The “outer surface facing in different directions” refers to outer surfaces facing in different directions when viewed from above, for example, four rectangular side surfaces.

  Moreover, the shape of the opening part of the recessed part 11 can be made into the rectangle provided with the rounded corner | angular part. The shape of the opening of the recess 11 is not limited to this, and may be a track shape, an ellipse, a polygon, a combination of these, a shape with a part cut away, a rounded shape, or the like. The shape of the bottom surface 12 of the recess 11 can be a rectangle with rounded corners as with the opening. The shape of the bottom surface 12 of the recess 11 is not limited to this, and may be a track shape, an ellipse, a polygon, a combination of these, a shape with a part cut away, or a rounded shape.

  The package 10 can include one recess 11. One package may be provided with a plurality of recesses. The recess 11 includes one bottom surface 12 and four side walls 13. The four side walls 13 oppose the first side wall 131, the second side wall 132 facing the first side wall 131, the third side wall 133 between the first side wall 131 and the second side wall 132, and the third side wall 133. And a fourth side wall 134. The first side wall 131 and the second side wall 132 constitute the short side of the package 10, and the third side wall 133 and the fourth side wall 134 constitute the long side of the package 10. The inner surface 17 of the recess 11 can function as a surface to which light from the light emitting element is irradiated. Therefore, the inner side surface 17 is preferably an inclined surface. Moreover, it is good also as the inner surface 17 provided with the level | step difference. The outer surface 16 of the recess 11 is an outer surface of the package 10 and is also an outer surface of the light emitting device 100. The side wall upper surface 18 of the recess 11 is the upper surface of the package 10 and is a part of the upper surface of the light emitting device 100.

  The lead 20 is made of metal. The lead 20 includes a first lead 21 and a second lead 22. The first lead 21 and the second lead 22 function as a pair of electrodes for supplying power to a semiconductor element such as a light emitting element placed on the package 10. The first lead 21 and the second lead 22 are insulated by an insulating molding resin 30.

  1C is a schematic cross-sectional view taken along line 1C-1C in FIG. 1A. Here, the lead 20 is a schematic cross-sectional view of the second lead 22, but the first lead 21 has the same configuration, and therefore, the lead 20 will be described without being limited to the second lead 22. The lead 20 includes a base material 24 and a plating layer 27 provided on the surface thereof. The lead 20 includes a thin portion 26 having a small thickness in the height direction and a thick portion 25 having a large thickness in the height direction. Specifically, the base material 24 includes a thin portion 26 and a thick portion 25. The thin portion 26 and the thick portion 25 are different in thickness of the base material 24, and the thick portion 25 indicates a portion thicker than the thin portion 26. The thick part 25 constitutes a part of the side wall 13 of the recess 11. The thin portion 26 constitutes a part of the bottom surface 12 of the recess 11.

  The plating layer 27 is provided on the surface of the base material 24. Specifically, it is provided on the surface (upper surface, side surface, lower surface) of the thin portion 26 and the thick portion 25 of the substrate 24. The plated layer 27 has substantially the same thickness in the thin portion 26 and the thick portion 25.

  Of the four side walls 13 of the recess 11, the first side wall 131 includes the first lead 21, all of which is metal. Specifically, the first outer side surface 161, the first inner side surface 171, the first side wall upper surface 181 and the lower surface 15 of the first side wall 131 are made of metal.

  As shown in FIG. 1D, the first outer surface 161 is composed of a plating layer 27 and a base material 24A. The base material 24 </ b> A is positioned away from the first side wall upper surface 181 and the lower surface 15. In other words, the base material 24 </ b> A is positioned away from the upper end and the lower end of the first outer surface 161. Furthermore, the base material 24 </ b> A is located at a position away from the third outer surface 163 and the fourth outer surface 164. In other words, the base material 24 </ b> A is located away from the right end and the left end of the first outer surface 161. That is, the base material 24 </ b> A is surrounded by the plating layer 27 on the first outer surface 161. As a result, the entire first outer surface 161 becomes a metal surface, and a package with excellent heat dissipation can be obtained. Further, the portion where the base material is exposed is only the base material 24A having a small area, and a package which is not easily corroded can be obtained.

  Similar to the first side wall 131, the second side wall 132 is composed of the second leads 22, all of which are metal. Specifically, the second outer side surface 162, the second inner side surface 172, and the second side wall upper surface 182 of the second side wall 132 are made of metal.

  As shown in FIG. 1E, the second outer side surface 162 includes a plated layer 27 and a base material 24A. The base material 24 </ b> A is positioned away from the second side wall upper surface 182 and the lower surface 15. In other words, the base material 24 </ b> A is positioned away from the upper end and the lower end of the second outer surface 162. Furthermore, the base material 24 </ b> A is located at a position away from the third outer surface 163 and the fourth outer surface 164. In other words, the base material 24 </ b> A is positioned away from the right end and the left end of the second outer surface 162. That is, the base material 24 </ b> A is surrounded by the plating layer 27 on the second outer side surface 162. As a result, the entire second outer surface 162 is a metal surface, and a package with excellent heat dissipation can be obtained. Further, the portion where the base material is exposed is only the base material 24A having a small area, and a package which is not easily corroded can be obtained.

  The third side wall 133 includes the first lead 21 and the second lead 22 and the third resin side wall portion 323 therebetween. Specifically, the third outer surface 163, the third inner surface 173, and the third side wall upper surface 183 include the first lead 21, the second lead 22, and the third resin side wall portion 323 therebetween. Similarly, the fourth side wall 134 includes the first lead 21 and the second lead 22 and a fourth resin side wall portion 324 therebetween. Specifically, the fourth outer surface 164, the fourth inner surface 174, and the fourth side wall upper surface 184 include the first lead 21, the second lead 22, and the fourth resin side wall portion 324 therebetween.

  The third side wall 133 and the fourth side wall 134 are provided with the side surface resin portion 32 in order to insulate the first lead 21 and the second lead 22, but most of the side wall 133 is constituted by the lead 20 made of a metal material. . Therefore, it can be set as the package 10 excellent in heat dissipation. The first lead 21 and the second lead 22 constituting the third outer surface 163 and the fourth outer surface 164 are constituted by a plating layer 27 and a base material 24A. FIG. 1A shows an example in which, on the third outer surface 163, the first lead 21 includes only the plating layer 27, and the second lead 22 includes the plating layer 27 and the base material 24A. Not limited to this, the first lead 21 of the third outer surface 163 may also include the base material 24A. In addition, on the third outer surface 163, two base materials 24A are arranged, and are surrounded by a plating layer 27, respectively. Not limited to this, one or a plurality of base materials 24A may be arranged.

  The third resin side wall part 323 in the third side wall 133 and the fourth resin side wall part 324 in the fourth side wall 134 are members for electrically insulating the first lead 21 and the second lead 22. The third resin side wall portion 323 and the fourth resin side wall portion 324 have thicknesses reaching from the upper end to the lower end in the third side wall 133 and the fourth side wall 134, respectively. In other words, the heights of the first lead 21 and the second lead, and the third resin side wall portion 323 and the fourth resin side wall portion 324 are the same height. Further, here, the third resin side wall portion 323 and the fourth resin side wall portion 324 are arranged at positions where the distance from the first side wall 131 is different. In other words, the 3rd resin side wall part 323 and the 4th resin side wall part 324 are arrange | positioned so that it may not oppose. By arranging the molding resin at such a position, the strength of the package 10 can be improved. In addition, not only this but the 3rd resin side wall part 323 and the 4th resin side wall part 324 may be arrange | positioned in the position which opposes.

  Moreover, the 3rd resin side wall part 323 and the 4th resin side wall part 324 are each formed with the same width | variety. Not only this but the 3rd resin side wall part 323 and the 4th resin side wall part 324 are good also as a different width | variety. In order to suppress migration, the third resin side wall portion 323 and the fourth resin side wall portion 324 are preferably set to have a width of 200 μm or more, for example.

  The bottom surface 12 of the recess 11 includes a first thin portion 212 of the first lead 21, a second thin portion 222 of the second lead 22, and a resin bottom portion 31 sandwiched therebetween. On the bottom surface 12 of the recess 11, the first lead 21 includes a first main body portion 212 a, a first extending portion 212 b extending from the first main body portion 212 a toward the second lead 22, and a first extending portion 212 b continuous from the first extending portion 212 b. 1 tip part 212c. Similarly, the second lead 22 includes a second main body portion 222a, a second extending portion 222b extending from the second main body portion 222a toward the first lead 21, and a second distal end portion 222c continuous from the second extending portion 222b. And comprising.

  The first tip portion 212 c is disposed at a position closest to the second main body portion 222 a in the first lead 21. Similarly, the second distal end portion 222 c is disposed at a position closest to the first main body portion 212 a in the second lead 22. The first tip portion 212c and the second tip portion 222c arranged at such positions can be regions to which a wire or the like is connected in the light emitting device described later. Further, in the short direction of the package 10, the width of the first tip portion 212c is narrower than the width of the first main body portion 212a and wider than the width of the first extending portion 212b. The width of the second tip portion 222c is narrower than the width of the second main body portion 222a and wider than the width of the second extending portion 222b.

  In the longitudinal direction of the package 10, the second tip portion 222c is located between the first main body portion 212a and the first tip portion 212c. In the longitudinal direction of the package 10, the first tip portion 212c is located between the second main body portion 222a and the second tip portion 222c.

  The first tip portion 212c and the second tip portion 222c are formed with such a width that they are arranged on the same straight line in a direction parallel to the long side of the package 10. For example, both the first tip portion 212c and the second tip portion 222c are located on the center line L1 shown in FIG. 1B. In the package 10, the molding resin 30 that integrally holds the first lead 21 and the second lead 22 is only disposed between the first lead 21 and the second lead 22. Therefore, by using the first lead 21 and the second lead 22 provided with such a tip portion, the joint strength can be improved.

  By forming the first lead 21 and the second lead 22 on the bottom surface 12 of the recess 11 as described above, only the molding resin 30 is formed on an arbitrary virtual straight line parallel to the short side or the long side of the package 10. The area consisting of is eliminated. In other words, the first lead 21 or the second lead 22 always exists on an arbitrary virtual straight line parallel to the short side or the long side of the package 10. Thereby, it can suppress that the molding resin 30 is damaged by the stress etc. concerning the package 10.

  On the bottom surface 12 of the recess 11, the resin bottom surface portion 31 between the first lead 21 and the second lead 22 is bent from the third side wall 133 to the fourth side wall 134 so as to be S-shaped. That is, the resin bottom surface portion 31 has a length of one straight portion shorter than the width of the bottom surface of the recess 11 of the package 10.

  In the top view, the width of the first main body 212 a is the same as the width of the bottom surface 12 of the recess 11. Elements such as a light emitting element or a protective element can be placed on each of the first main body 212a and the second main body 222a. The sizes of the first main body portion 212a and the second main body portion 222a can be adjusted according to the number and size of the light emitting elements and the like to be mounted.

  The distance between the first tip portion 212c and the second body portion 222a, the distance between the first tip portion 212c and the second extension portion 222b, and the distance between the first extension portion 212b and the second tip portion 222c In this example, the distance between the first main body 212a and the second tip 222c is substantially the same. The width of the resin bottom surface portion 31 may be different in at least a part of the distance or in all the distances in each of the aforementioned portions.

  FIG. 1H is a schematic bottom view showing the bottom surface 15 of the package 10. On the lower surface 15, the first lead 21, the second lead 22, and the resin bottom surface portion 31 are flush with each other. The first main body portion 212 a, the first extending portion 212 b, and the first tip portion 212 c of the first lead 21 have substantially the same shape as the bottom surface 12 of the recess 11. Similarly, the second main body portion 222 a, the second extending portion 222 b, and the second tip end portion 222 c of the second lead 22 are substantially the same shape as the bottom surface 12 of the recess 11. Since most of the lower surface 15 is made of a metal lead, a package with excellent heat dissipation can be obtained.

  FIG. 2A shows a package 10A according to a modification. The first thin portion 212A of the first lead 21A of the package 10A includes a first main body portion 212Aa and a first tip portion 212Ac. The first main body 212Aa and the first tip 212Ac are connected by a first thick part 211A. Similarly, the second thin portion 222A of the second lead 22A includes a second main body portion 222Aa and a second tip portion 222Ac. The second main body portion 222Aa and the second tip end portion 222Ac are connected by the second thick portion 221A. The width of the first tip portion 212Ac and the second tip portion 222Ac of the package 10A shown in FIG. 2A is wider than the width of the first tip portion 212c and the second tip portion 222c of the package 10 shown in FIG. 1B. Therefore, the length extending beyond the center line L2 of the package 10A shown in FIG. 2A is long. Thus, you may provide the front-end | tip part which does not provide an extending | stretching part in a thin part.

  FIG. 2B shows a package 10B according to a modification. The package 10B has a square shape when viewed from above. The first thin portion 212B of the first lead 21B includes a first main body portion 212Ba, a first extending portion 212Bb, and a first tip portion 212Bc. The first extending portion 212Bb is disposed on the center line L3 of the package 10B. And two 1st front-end | tip parts 212Bc are arrange | positioned from this 1st extending | stretching part 212Bb to an up-down direction. The two first tip portions 212Bc are respectively arranged on virtual straight lines L4 and L5 that are parallel to the center line L3.

  The second thin portion 222B of the second lead 22B includes a second main body portion 222Ba, a second extending portion 222Bb, and a second tip portion 222Bc. Two second extending portions 222Bb are arranged so as to sandwich the first extending portion 212Bb. And 2nd front-end | tip part 222Bc which continues from two 2nd extending | stretching part 222Bb is arrange | positioned so that it may extend toward 1st extending | stretching part 212Bb. The first tip portion 212Ac and the second tip portion 222Bc are located on the virtual straight line L4 and L5, respectively.

  Hereinafter, each member will be described in detail.

(Lead)
The lead mainly functions as an electrode of the light emitting device, and includes at least two leads, a positive electrode lead and a negative electrode lead. The lead is a plate-shaped metal member patterned in a predetermined shape, and includes a base material serving as a base material and a plating layer formed on the surface thereof. Moreover, the lead may have a heat radiating member as a member which does not function as an electrode, for example.

  Examples of the material for the substrate include Cu, Al, Ag, Au, Zn, Cr, W, Co, No, Rh, Ru, and alloys thereof. These may be a single layer or a laminated structure (for example, a clad material). A metal plate containing 90% or more of Cu as a main component is preferable. Moreover, non-metals, such as Si and P, may be contained as a trace content element.

  The thickness of the thin portion of the substrate is preferably, for example, about 100 μm to 300 μm, and more preferably about 150 μm to 250 μm. The thickness of the thick part of the base material is preferably, for example, about 200 μm to 800 μm, and more preferably about 300 μm to 600 μm. For example, the thickness of the connecting portion of the base material is preferably about 50 μm to 90 μm, and more preferably about 60 μm to 80 μm.

  A plating layer is provided on the surface of the substrate. As the plating layer, a material having a higher reflectance than the base material is preferable. For example, the plating layer includes Ni, Ag (silver), Au (gold), Pt, Pd, Al, W, Mo, Ru, Rh, and the like. Examples of the laminated structure include Ni / Pd / Au, Ni / Pt / Au, Ni / Au / Ag, etc. Among them, Ni / Pd / Au is preferable. By making the outermost surface a metal such as Au that hardly corrodes, it is possible to suppress a decrease in solder wettability when the light emitting device is mounted on a secondary substrate or the like. The outer side plating layer and the inner side plating layer may have different configurations. For example, the inner surface may be Ag on the outermost surface and the outer surface may be Au on the outermost surface.

  The thickness of the plating layer is preferably about 1 to 10 μm, and more preferably 1.5 to 6 μm.

(Molded resin)
The molded resin functions as a holding member that integrally holds at least two leads in the package and the light emitting device, and further functions as a member that controls optical characteristics such as light reflectivity and light shielding properties. The molding resin is provided between the pair of leads and also functions as an insulating member that prevents the positive and negative leads from contacting each other.

  Examples of the resin material used for the molding resin include resins such as thermosetting resins and thermoplastic resins. Specifically, the thermosetting resin includes an epoxy resin composition, a modified epoxy resin composition, a silicone resin composition, a modified silicone resin composition, a silicone modified epoxy resin, an epoxy modified silicone resin composition, and a polyimide resin composition. , Modified polyimide resin compositions, resins such as unsaturated polyesters, etc. Thermoplastic resins include polyamide, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, Examples of the resin include a phenol resin, an acrylic resin, and a PBT resin, and a resin including at least one of them can be used. In particular, a thermosetting resin is preferable. In particular, when a light emitting device is used, the molding resin preferably has a reflectance with respect to light from the light emitting element of 60% or more, more preferably 70%, 80%, or 90% or more.

  The molding resin may contain a light reflecting material such as titanium oxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, zinc oxide, boron nitride, mullite. Thereby, the light from a light emitting element can be reflected efficiently. Moreover, black materials, such as carbon black, may contain. The light reflecting material or the black material can be appropriately adjusted depending on molding conditions such as a resin molding method and resin fluidity, and characteristics such as reflectance and mechanical strength. For example, when titanium oxide is used, it is preferably contained in an amount of 10 to 60% by weight, more preferably 15 to 50% by weight, based on the total weight of the molding resin.

<Embodiment 2> Light-Emitting Device An example of a light-emitting device 100 according to Embodiment 2 is shown in FIG. The light emitting device 100 includes the package 10 according to the first embodiment, the light emitting element 40 placed in the recess 11 of the package 10, and the sealing member 50 disposed in the recess 11 and covering the light emitting element 40. . The light emitting device 100 has the upper surface 14 side as a light emitting surface. In this case, when the lower surface 15 of the light emitting device 100 is used as a mounting surface, a so-called top view type light emitting device 100 can be obtained. Further, the third outer surface 163 or the fourth outer surface 164 may be a mounting surface, and in that case, a so-called side view type light emitting device 100 can be obtained.

  Hereinafter, each member which comprises a light-emitting device is explained in full detail. The details of the package 10 are omitted because they are the same as those in the first embodiment.

(Light emitting element)
The light emitting element 40 is mounted on the upper surface of the second lead 22 disposed on the bottom surface 12 of the recess 11 via a bonding member. Here, an example in which two light emitting elements 40 are mounted is shown. The two light emitting elements 40 are connected in series using a wire 60. The number of the light emitting elements 40 may be one, or three or more.

  The light emitting element is composed of a semiconductor layer including a light emitting layer stacked on an element substrate. Or you may be comprised from the semiconductor layer obtained by laminating | stacking the semiconductor layer containing a light emitting layer on an element substrate, and removing a board | substrate.

  The element substrate is not particularly limited, and examples thereof include those usually used for growing a nitride semiconductor layer. Of these, a translucent substrate is preferable. Here, the term “transmittance” refers to the property of transmitting about 60%, 65%, 70%, or 80% or more of the light emitted from the light emitting element. Examples of the element substrate include sapphire and GaN.

The first semiconductor layer, the light emitting layer, and the second semiconductor layer constituting the semiconductor layer are not particularly limited. For example, a light-emitting element that emits visible light, such as a blue light-emitting element, a green light-emitting element, or a red light-emitting element, or a light-emitting element that emits ultraviolet light can be used, and can be selected depending on the purpose and application. As a blue light emitting element, a green light emitting element, and an ultraviolet light emitting element, for example, a nitride compound semiconductor such as In _X Al _Y Ga _1- XYN (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferably used. Used. For example, GaAs or the like is preferably used as the red light emitting element.

  The pair of electrodes included in the light-emitting element are arranged on the same surface side or different surface sides of the semiconductor layer. The pair of electrodes may have a single layer structure as long as they are ohmic-connected to the first semiconductor layer and the second semiconductor layer described above so that the current-voltage characteristics are linear or substantially linear, respectively. A laminated structure may be used. Such an electrode can be formed with an arbitrary thickness using materials and configurations known in the art. For example, 10 to 300 μm is preferable.

  Further, as the light emitting element, a white light emitting element in which a phosphor layer is formed in advance, or a white light emitting element in which a side surface of the light emitting element is covered with a reflective layer such as a resin or metal and a phosphor layer is formed on the upper surface may be used. Furthermore, it is also possible to use a light emitting element in which the thickness of the electrode disposed on the mounting surface from the light emitting element is increased and a stress relaxation layer such as a resin (white resin) is provided around the electrode.

(Joining member)
The joining member is a member for fixing the light emitting element on the package. As the bonding member, for example, an insulating bonding member or a conductive bonding member can be used. Examples of the insulating bonding member include a resin, such as a transparent resin or a white resin. Examples of the conductive bonding member include a eutectic material or solder. Preferable eutectic materials include an alloy mainly composed of Au and Sn, an alloy mainly composed of Au and Si, an alloy mainly composed of Au and Ge, and the like. Examples of the solder include an alloy mainly composed of Ag, Cu, and Sn, an alloy mainly composed of Cu and Sn, and an alloy mainly composed of Bi and Sn. Among these, an Au—Sn eutectic alloy is preferable. When an eutectic alloy of Au—Sn is used, deterioration due to thermocompression bonding to the electrode of the light emitting element can be reduced, and the lead can be firmly bonded to the lead.

(Wire)
Examples of the wire for supplying power to the light-emitting element include a conductive wire using a metal such as gold, silver, copper, platinum, and aluminum and an alloy containing at least those metals. In particular, it is preferable to use a wire containing gold having excellent thermal resistance.

  In FIG. 3, two light emitting elements 40 are mounted on the main body portion of the second lead 22 and a wire 60 is connected thereto. Further, the light emitting element 40 is connected to the distal end portion of the first lead 21.

(Sealing member)
The sealing member is a member that protects electronic components mounted on the package, such as a light emitting element, a protective element, and a wire, from dust, moisture, external force, and the like. As a material for the sealing member, a material having a light-transmitting property capable of transmitting light from the light-emitting element and having light resistance that is not easily deteriorated by them is preferable. Specific examples of the material include a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition, which have a light-transmitting property capable of transmitting light from a light-emitting element. An insulating resin composition can be mentioned. In addition, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a hybrid resin containing at least one of these resins can be used. Furthermore, it is not limited to these organic materials, and inorganic materials such as glass and silica sol can also be used. In addition to such materials, a colorant, a light diffusing agent, a light reflecting material, various fillers, a wavelength conversion member (fluorescent member), and the like can be included as desired. The filling amount of the sealing member may be an amount that covers the electronic component.

  The shape of the outer surface of the sealing member can be variously selected according to the light distribution characteristics and the like. For example, the directivity can be adjusted by making the upper surface into a convex lens shape, a concave lens shape, a Fresnel lens shape, or the like. In addition to the sealing member, a lens member may be provided. Furthermore, when using a molded body with a phosphor (for example, a plate-shaped molded body with a phosphor, a dome-shaped molded body with a phosphor, etc.), a material excellent in adhesion to the molded body with a phosphor is used as a sealing member. It is preferable to select. In addition to the resin composition, an inorganic substance such as glass can be used as the phosphor-containing molded body.

Examples of the phosphor include oxide-based, sulfide-based, and nitride-based phosphors. For example, when a gallium nitride-based light emitting device that emits blue light is used as the light emitting device, a YAG system that absorbs blue light to emit yellow to green light, a LAG system, a SiAlON system that emits green light (β sialon), a SCASN that emits red light, Examples of the phosphor include CASN, KSF phosphor (K ₂ SiF ₆ : Mn), and sulfide phosphor.

  Note that the light-emitting device may include a protective element such as a Zener diode or a bridge diode. FIG. 3 shows an example in which the Zener diode 70 is placed on the first lead 21. The Zener diode 70 is mounted on the first main body portion of the first lead 21 via a conductive bonding member. The Zener diode 70 is electrically connected to the second tip portion of the second lead 22 through the wire 60.

<Embodiment 3> Method for Manufacturing Light-Emitting Device The method for manufacturing a light-emitting device includes the following steps. The method includes a step of preparing a lead frame with resin, a step of placing a light emitting element on the lead frame with resin, a step of sealing the light emitting element, and a step of cutting to obtain a light emitting device.

(Process to prepare lead frame with resin)
The lead frame with resin is either a step of forming a base from a metal plate, a step of forming a lead frame by plating on the base, or a step of forming a lead frame with resin by molding a molding resin on the lead frame. Alternatively, it may be prepared through all the steps, or a lead frame with resin may be purchased and prepared.

  FIG. 4A shows a schematic top view of the lead frame 200. A portion that forms one package is referred to as a unit U. One unit U is composed of one first lead 21 and one second lead 22 in a region surrounded by a broken line in FIG. Here, a portion where four units U1 to U4 are arranged in 2 columns × 2 rows is illustrated, and the number of units U arranged in one lead frame 200 is not limited thereto.

  The second lead 22 of the unit U1 and the second lead 22 of the unit U2 are adjacent to each other and are connected by two connecting portions 23. The first lead 21 of the unit U1 and the second lead 22 of the unit U3 are connected by one connecting portion 23. The first lead 21 of the unit U2 and the second lead 22 of the unit U4 are connected by one connecting portion. The second lead 22 of the unit U3 and the second lead 22 of the unit U4 are connected by two connecting portions 23. The first lead 21 of the unit U3 and the first lead 21 of the unit U4 are connected by one connecting portion 23. In addition, here, although each unit has shown the example connected only by the connection part, for example, you may provide the support | pillar etc. which connect connection parts.

  Each unit and connecting portion includes a metal base 24 and a plating layer 27 provided on the surface of the base 24. Each unit includes a thin portion 26 and a thick portion 25. The connecting portion 23 is smaller in thickness than the thick portion 25.

  The connecting portion 23 is disposed so as to connect the unit cities at positions separated from the lower surface and the upper surface of the lead frame 200. The number, position, size, and the like of the connecting portion 23 can be appropriately selected according to the size of the light emitting device.

  Such a lead frame is obtained by patterning a metal plate into a desired shape by a processing method such as etching, pressing, punching, and blasting, and forming a plating layer on a base material having a thick portion and a thin portion. be able to.

  FIG. 5 is a schematic top view showing a lead frame with a resin (package assembly) 300 including the lead frame 200 and the molding resins 30 and 30A shown in FIG. 4A. The molding resin 30 is also provided between each unit and between the first lead 21 and the second lead 22 constituting one unit. The molding resin 30 provided between the first lead 21 and the second lead 22 constitutes a part of the package and finally becomes a member constituting a part of the light emitting device. The molding resin 30 formed between the units is formed so as to embed the connecting portion 23.

(Process for placing light emitting element, process for forming sealing member)
6A and 6B are a schematic top view and a schematic cross-sectional view showing a light emitting device assembly 400 in which a sealing member 50 is formed after the light emitting elements are mounted on the package assembly 300 shown in FIG. Two each of the light emitting elements 40 are mounted on the first leads 21 in the recesses of the package assembly 300 via the joining members. A protection element 70 is placed on the first lead 21.

  The light emitting element 40 and the first lead 21, the light emitting element 40 and the light emitting element 40, the light emitting element 40 and the second lead 22, and the second lead 22 and the protection element 70 are connected by wires 60. Thereafter, the sealing member 50 is supplied into the recess.

(Step of cutting the connecting portion to obtain a light emitting device)
The step of cutting the connecting portion 23 is performed such that the molding resin 30 between the units is removed by the cutting blade 80, as shown in FIG. 6B. An example of the cutting blade 80 is a rotary blade. When cutting, the plating layer on the lateral outer surface of the recess is exposed. Thereby, a plating layer can be arrange | positioned on an outer surface. A part of the plating layer may be removed. In that case, the plating layer on the outer surface becomes a plating layer that is thinner than other portions.

  The connecting portion 23 is also removed by the cutting blade 80. As a result, the base material 24 is exposed. The finally obtained light emitting device includes a base material 24 that is a cut surface of the connecting portion 23 and a plating layer 27 as outer surfaces.

  The lead, package, and light emitting device according to the present disclosure are used for various light emitting devices such as an illumination light source, various indicator light sources, an in-vehicle light source, a display light source, a liquid crystal backlight light source, a sensor light source, and a traffic light. be able to. Further, the present invention can be applied to all light emitting devices using leads, such as a so-called side view type light emitting device.

DESCRIPTION OF SYMBOLS 100 ... Light-emitting device 10, 10A, 10B ... Package 11 ... Recess 12 ... Bottom 13 ... Side wall (131 ... 1st side wall, 132 ... 2nd side wall, 133 ... 3rd side wall, 134 ... 4th side wall)
14 ... Upper surface 15 ... Lower surface 16 ... Outer surface (161 ... First outer surface, 162 ... Second outer surface, 163 ... Third outer surface, 164 ... Fourth outer surface)
17 ... Inner surface (171 ... First inner surface, 172 ... Second inner surface, 173 ... Third inner surface, 174 ... Fourth inner surface)
18 ... Side wall upper surface (181 ... First side wall upper surface, 182 ... Second side wall upper surface, 183 ... Third side wall upper surface, 184 ... Fourth side wall upper surface)
20, 20A ... Lead 21, 21A ... First lead (211, 211A ... First thick part, 212, 212A ... First thin part, 212a, 212Aa ... First main body part, 212b, 212Ab ... First extension part, 212c, 212Ac, 212Bc ... first tip)
22, 22A ... second lead (221, 221A ... second thick part, 222, 222A ... second thin part, 222a, 222Aa ... second body part, 222b, 222Bb ... second extension part, 222c, 222Ac, 222Bc ... second tip)
DESCRIPTION OF SYMBOLS 23 ... Connection part 24 ... Base material 24A ... Exposed part of base material 25 ... Thick part 26 ... Thin part 27 ... Plating layer 30, 30A ... Molding resin 31 ... Resin bottom part 32 ... Resin side wall part (323 ... 3rd resin Side wall part, 324 ... 4th resin side wall part)
40 ... Light emitting element 50 ... Sealing member 60 ... Wire 70 ... Protection element (Zener diode)
200 ... Lead frame 300 ... Lead frame with resin (package assembly)
400 ... Light-emitting device assembly 80 ... Cutting blade U, U1, U2, U3, U4 ... Unit

Claims (7)

A package comprising a lead and a molded resin and having a recess,
The leads have first and second leads, and the first and second leads are provided on a metal base having a thin part and a thick part, respectively, on the surface of the base. And having a plating layer
The recess includes a bottom surface including the first lead including the thin portion of the base, a second lead including the thin portion of the base, and the molding resin therebetween, and the base A side wall comprising: the first lead including the thick portion; the second lead including the thick portion of the base; and the molding resin therebetween.
The side wall constitutes an outer surface of the package and has first to fourth outer surfaces arranged to face different directions, respectively.
The entire surface of the first outer side surface is composed of the first lead, and the plating layer and the base material provided on the thick part of the base material of the first lead.   The entire surface of the second outer surface is the second lead, and is the plating layer and the base material provided in the thick part of the base material of the second lead. package.   The package according to claim 1, wherein the plating layer contains Ag.   The thin portion of the first lead includes a first main body portion, a first extending portion extending from the first main body portion to the second lead side, a first tip portion continuing from the first extending portion, The package as described in any one of Claims 1-3 provided with these.   The thin portion of the second lead includes a second main body portion, a second extending portion extending from the second main body portion to the first lead side, and a second tip portion continuing from the second extending portion. The package as described in any one of Claims 1-4 provided with. A package comprising a lead and a molded resin and having a recess;
A light emitting device placed on the bottom surface of the recess;
A sealing member disposed in the recess and covering the light emitting element;
A light emitting device comprising:
The leads have first and second leads, and the first and second leads are provided on a metal base having a thin part and a thick part, respectively, on the surface of the base. And having a plating layer
The recess includes a bottom surface including a thin portion of the base material of the first lead, a thin portion of the base material of the second lead, and the molding resin therebetween, and the base material of the first lead. A side wall comprising a thick part, a thick part of the base material of the second lead, and the molding resin between them,
The side wall constitutes an outer surface of the package, and has first to fourth outer surfaces arranged to face in different directions, the first outer surface includes the first lead, and The light emitting device as the plating layer and the base material provided in the thick part of the base material of the first lead. Adjacent to a plurality of units each including a first lead and a second lead each including a metal base having a thin part and a thick part and a plating layer provided on the surface of the base. A lead frame that connects the units to each other and includes a connecting portion having a thickness smaller than the thick portion, and at least the connecting portion is embedded, and is disposed between the first lead and the second lead. A plurality of recesses each including the first lead and the second lead, and the molding resin disposed between the first lead and the second lead and having the thick portion as a part of a side wall. Preparing a resin-made lead frame;
Placing a light emitting element on the bottom surface of the recess;
Forming a sealing member for sealing the light emitting element;
Cutting the connecting portion so that the plated layer on the outer surface of the side wall is exposed, and obtaining a light emitting device having the exposed plated layer and the cut surface of the connecting portion as an outer surface;
Manufacturing method of light-emitting device provided with.

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