JP2018194280A - Radiation panel for air conditioning and manufacturing method thereof - Google Patents

Abstract

A radiation panel with improved air conditioning efficiency is provided. A radiating panel includes, for example, a substrate, a heat sink, and a pipe. The heat sink and the substrate are bonded by an epoxy adhesive. On the lower surface of the heat sink 4 and the upper surface (back surface) of the substrate 3, a group of recesses 8 having a micron level is formed, and high adhesion is secured by an anchor effect in which the adhesive 7 enters the recess 8. it can. Therefore, it is possible to prevent a gap from being generated between the substrate 3 and the heat sink 4. As a result, the heat transfer performance can be improved by reducing the thickness of the adhesive 7 as much as possible. When a nano level auxiliary recess is formed in the recess 8 or a resin primary film is formed, the adhesive strength can be further improved. [Selection] Figure 2

Description

  The present invention relates to a radiation panel for air conditioning and a method for manufacturing the same.

  There is a radiation air-conditioning system (radiation air-conditioning system) that uses a liquid (fluid) such as water as a heat medium and cools or heats it with a radiant panel cooled or heated by the liquid. There is an advantage such as no comfort and excellent comfort, and it is becoming widespread. The radiant panel used in this radiant air-conditioning system has a structure in which a pipe is attached to the back surface of the substrate (radiation plate), and heat is exchanged between the heat medium (generally water) flowing through the pipe and the substrate. ing.

  The substrate is generally made of aluminum, and is a simple flat plate mode, a punching metal mode in which a large number of small holes are formed (for example, Patent Document 1), or a structure having a large number of ribs on the lower surface (for example, Patent Document 2). There is. When the back surface (upper surface) of the substrate is flat, a heat sink with a holder that holds the pipe is often fixed to the back surface of the substrate. Improving efficiency. In the case where the substrate is formed in a concavo-convex shape by extrusion processing, a holder portion for holding the pipe is also formed integrally with the substrate.

  In the holder portion of the substrate and the heat sink, the substantially lower half of the pipe is fitted tightly, and the pipe is also forcedly fitted into the holder portion. On the other hand, the heat sink is adhered to the substrate with an adhesive, or is adhered to the substrate with a double-sided adhesive tape. In any case, if a gap is generated between the holder part and the pipe, or a gap is generated between the substrate and the heat sink, the heat transfer property may be reduced and the air conditioning efficiency may be reduced. When the pipe is directly bonded to the substrate without using a heat sink, the problem of a decrease in heat transfer due to the gap is particularly noticeable.

  On the other hand, Patent Document 3 describes that a pipe and a substrate are bonded with an adhesive having a high thermal conductivity. By using this Patent Document 3 in Patent Documents 1 and 2, It is considered that the air-conditioning efficiency can be improved by suppressing heat exchange loss by firmly bonding the heat sinks or the heat sink and the substrate with an adhesive.

Design Registration No. 1505946 Design Registration No. 1496807 JP 2002-174434 A

  However, since the substrate is made of a metal plate and may be warped, simply bonding with an adhesive may cause a gap without partial adhesion, or the adhesive may peel off over time. There is a risk of gaps. Regarding this point, it is considered that the adhesive force should be increased by increasing the amount of the adhesive, but if the thickness of the adhesive layer is increased, the heat transfer property is lowered and the air conditioning efficiency is deteriorated. Therefore, when bonding with an adhesive, the thickness of the adhesive layer should be as thin as possible.

  The present invention has been made to improve such a current situation, and aims to improve the heat transfer performance as easily as possible while ensuring the adhesive force necessary for preventing peeling.

  The present invention has various configurations, which are specified in the respective claims. Of these, the invention of claim 1 relates to a radiation panel for air conditioning, and the radiation panel for air conditioning according to the present invention has a metal pipe on which a heat medium for air conditioning flows adhered to the back surface of a metal substrate with an adhesive. The bonding surface of one or both of the substrate and the pipe is formed in a porous surface having a recess formed of a group of holes or grooves having a micron level size, Adhesive is allowed to enter the recess.

  The invention of claim 2 also relates to an air-conditioning radiant panel, wherein the air-conditioning radiant panel has a metal pipe through which an air-conditioning heat medium flows on the back surface of a metal substrate, and a holder portion for the pipe. It is arranged via a metal heat sink, and the substrate and the heat sink are bonded by an adhesive, and either or both of the bonding surfaces of the substrate and the heat sink are bonded, A recess composed of a group of holes or grooves having a micron level is formed in the open porous surface, and the adhesive is allowed to enter the recess. In claim 2, the heat sink and the pipe can also be bonded using the porous surface.

  According to a third aspect of the present invention, in the first or second aspect, an adhesion auxiliary coating made of a resin primary coating or a metal coating is formed on the porous surface made of the recess. In the case of a resin primary coating, it can be applied to any part by a spray method or the like. For example, the entire back surface of the substrate is formed into a porous surface, and the resin primary coating is formed only on the bonding surface of the substrate, pipe or heat sink. Can also do.

  In the present invention, the micron level relating to the size of the recess means a size that can be normally expressed in units of microns, and specifically means a numerical value from a comma margin to several tens of microns. As a specific example, in claim 4, the majority of the group of the recesses has a hole diameter or groove width in a range of approximately 0.5 to 20 μm and a depth in a range of 0.5 to 10 μm. .

  In the present invention, it is possible to form a nano level fine auxiliary recess on the inner surface of the recess. Specifically, for example, as described in Japanese Patent No. 5094839, it is possible to form a fine auxiliary recess of about 10 to 100 nanometers and to form an oxide film having a thickness of 2 nm or more on the surface thereof. It is. Alternatively, as described in JP-A-5-70741, a micron-level recess covered with a cured film of 10 to 200 mm is formed, and the anchoring effect is used to increase the adhesive strength of the adhesive. The structure which raises may be sufficient. The formation of an oxide film having a porous surface using an alkaline solution is also disclosed in Japanese Patent Application Laid-Open No. 61-279531.

  The radiating panel for air conditioning of the present invention is not a mechanical element and is not basically subjected to external force (load / load). Therefore, the adhesive strength as required by Japanese Patent No. 5094839 is not necessarily required. Therefore, an auxiliary recess is not necessarily required (of course, it is preferable to form an auxiliary recess), but an oxide film or a primary resin film is formed on the porous surface from the viewpoint of improving adhesive strength and preventing rust. Is preferred.

  The adhesive is preferably an epoxy type, and in particular, the types disclosed in Japanese Patent No. 5094839 and Japanese Patent Application Laid-Open No. 2011-148937 are suitable. In JP-A-5-70741, a thermosetting material is used, and in JP-A-2011-148937, a low-viscosity solvent type is used, but any of the present invention can be used. Of course, adhesives other than those described in these publications can also be used. As a means for improving heat conductivity, a metal filler or metal powder can be added to the adhesive.

The present invention also includes a method for manufacturing a radiation panel for air conditioning. In Claim 5, the manufacturing method of the radiation panel for air conditioning described in Claim 1 is specified, and this manufacturing method is
Preparing a substrate having a smooth outer surface;
Forming a pipe bonding surface on at least the back surface of the substrate into a porous surface in which the group of recesses is opened by etching using an alkaline solution;
A step of applying the adhesive to a predetermined position of the substrate and then pressing and holding the pipe so that the adhesive enters the recess of the substrate and bonds the pipe to the substrate.

Invention of Claim 6 is a manufacturing method of the radiation panel for air conditioning as described in Claim 2, This invention,
Preparing a substrate having a smooth outer surface;
Forming a pipe bonding surface on at least the back surface of the substrate into a porous surface in which the group of recesses is opened by etching using an alkaline solution;
Applying an adhesive to one of the substrates or the heat sink; and
Bonding the heat sink to the substrate by allowing the adhesive to enter the recess by superimposing the heat sink and the substrate;
Attaching the pipe to the heat sink,
The step of attaching the pipe to the heat sink is performed after or before the step of bonding the heat sink to the substrate.

  7. The manufacturing method according to claim 5, wherein the porous surface formed of the group of recesses may be formed only on the adhesive surface where the members overlap each other, the entire back surface of the substrate (or the entire front and back surfaces), the entire surface of the heat sink, etc. You may form in. For example, caustic soda can be used as the alkaline solution.

  When the surface of the substrate is formed as a porous surface, the surface area of the substrate is increased and the radiation is increased. However, it is preferable to suppress the heat dissipation from the back surface on which the pipe is arranged. Therefore, it is beneficial for improving the air conditioning efficiency to take measures such as forming only the adhesive surface as a porous surface or coating the portion of the back surface excluding the adhesive surface.

  Each invention of this application can adhere | attach a pipe and a board | substrate or a heat sink and a board | substrate firmly by the anchor effect by an adhesive agent entering a recess. For this reason, even if the thickness of the adhesive layer between the members is made as thin as possible, it is possible to ensure a high adhesive strength that does not peel off due to the warp of the members. As a result, it is possible to improve air conditioning efficiency by ensuring high heat insulation performance between members while eliminating gaps between members.

  In radiant panels for air conditioning, the substrate is generally made of metal from the viewpoint of heat transfer, strength, fire resistance, etc., while the pipe is made entirely of resin or resin on the outer surface to ensure corrosion resistance. Layers are also formed, but since the adhesion between the resin and metal is poor, it is difficult to firmly bond the pipe to the metal substrate if at least the outer surface is made of resin . In particular, when the substrate is a punching metal, the bonding area is reduced, so that it is particularly difficult to secure the necessary bonding force.

  On the other hand, if a heat sink is used as in claim 2 of the present application, the adhesive force per unit area between the heat sink and the substrate can be significantly improved. By doing so, a pipe made of resin or resin can be used without any problem. Therefore, in claim 2, it is possible to improve durability and reliability by making the pipe excellent in corrosion resistance while ensuring high heat transfer between the heat sink and the pipe.

  Furthermore, since the adhesion force can be further improved by forming the adhesion auxiliary layer as in claim 3, it is possible to further improve the peeling prevention function and more accurately prevent the generation of gaps (particularly nano level in the recesses). If an oxide film or a resin primary film is formed while forming a group of auxiliary recesses, a very high adhesive force can be secured, which can further contribute to an improvement in air conditioning efficiency.)

  In the case of claim 1, it is easy to ensure high heat transfer performance even with a simple structure in which a pipe is laminated and bonded to a flat metal plate. Therefore, the structure of the radiant panel for air conditioning is simplified and reduced in weight. You can contribute, and you can easily respond to design changes such as changes in pipe placement. Further, as described above, when the substrate is punching metal, it was difficult to firmly bond the pipe. However, in the present invention, since the bonding performance per unit area can be remarkably improved, the substrate made of punching metal It is also possible to directly attach the pipe to the door, and the design freedom can be improved.

  As a technique for forming a group of recesses in a metal plate, there is a mechanical method such as sand blasting, but this has a limit on the size of the recesses that can be formed, for example, it is difficult to form a recess of several μm. . In this respect, when the recess is formed using an alkaline solution as in the present invention, a recess having a size of several μm can be formed uniformly and an auxiliary recess can be easily formed. Can be assured.

It is a perspective view of the room interior of the building to which the embodiment is applied. It is a figure which shows 1st Embodiment applied to the radiation | emission panel with a heat sink, (A) is a schematic partial front view, (B) is BB sectional drawing of (A), (C) is typical of a modification. A partial front view and (D) are sectional views showing the middle of an adhesion process. It is a fragmentary front sectional view of 2nd-7th embodiment which shows embodiment which concerns on the radiation | emission panel with a heat sink. It is typical sectional drawing of 8th-10th embodiment. It is a figure which shows 11th Embodiment, (A) is a top view of a radiation | emission panel, (B) is a BB view of (A). FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. (A) is an enlarged view of FIG. 6, (B) is a cross-sectional view taken along the line BB of (A), and (C) is another example of the same portion as (B).

(1) Overall Configuration of First Embodiment Next, an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, the present embodiment is applied to a radiant panel 1 for a ceiling, and a ceiling portion of a room includes a large number of radiant panels 1 arranged in a vertical and horizontal direction.

  The radiating panel 1 has a rectangular shape in plan view (bottom view), the long side edges of the adjacent radiating panels 1 overlap with each other without any gap, and a space is formed between the short side edges of the adjacent radiating panels 1. The space is closed with a joint material (T-bar) 2 (the end of the radiation panel 1 is placed on the joint material 2). In this embodiment, regarding the direction, for convenience, the longitudinal direction of the radiating panel 1 is the front-rear direction and the width direction is the left-right direction.

  As shown in FIG. 2, the radiating panel 1 includes a substrate 3, a heat sink 4 that overlaps the back surface (upper surface) thereof, and a pipe 5 that is held by the heat sink 4. The substrate 3 is an aluminum flat plate, and a rolled product or an extruded product can be used. The pipe 5 is also made of a metal such as aluminum, and an inner surface and an outer surface are provided with a resin inner layer 5a and a resin outer layer 5b made of polyethylene or the like in order to improve corrosion resistance. The pipe 5 is bent in a zigzag shape in plan view, and the straight portion overlaps the heat sink 4.

  As shown in FIG. 2D, the inner surface of the pipe 5 is covered with a resin inner layer 5a, and the outer layer of the pipe 5 is covered with a resin outer layer 5b. Therefore, the pipe 5 has three layers as a whole, and has a structure excellent in corrosion resistance both inside and outside. The inner and outer layers 5a and 5b are made of, for example, polyethylene. In addition, when the pipe 5 is held by the heat sink 4, not only a pipe made of metal such as aluminum is covered with the resin inner layer 5a and the resin outer layer 5b, but pipes made of various materials, for example, It is also possible to use as the pipe 5 a metal tube whose inner surface is coated with a resin, a metal tube whose outer surface is coated with a resin, a simple metal tube having no resin layer inside or outside, or a simple resin tube. .

  The heat sink 4 has a holder portion 6 into which a pipe 5 is fitted, and flat left and right flanges integrally connected thereto. In the holder portion 6 of this embodiment, the interval between the opening edges is slightly narrower than the outer diameter of the pipe 5. Accordingly, the pipe 5 is attached to the holder portion 6 by forced fitting using elastic deformation.

  As schematically shown in FIG. 2B, the substrate 3 and the heat sink 4 are bonded (bonded) with an epoxy adhesive 7. The thickness of the adhesive 7 (thickness of the layer between the heat sink 4 and the substrate 3 is not particularly limited, but it can be said that it may be several μm to several tens of μm (note that the dimensional error of the member and the coating thickness The thickness may vary depending on the location due to variations, etc.) The back surface of the substrate 3 and the bottom surface of the heat sink 4 are porous surfaces on which a number of fine recesses (holes) 8 are formed. The adhesive 7 is inserted between the heat sink 4 and the substrate 3. Thus, the heat sink 4 and the substrate 3 are firmly bonded to each other by the anchor effect due to the adhesive 7 entering the recess 8. Has been.

  And since the thickness of the adhesive agent 7 can be made as small as possible by having strong adhesion | attachment, it is excellent also in heat-transfer performance. In addition, by using the heat sink 4 having the holder portion 6, the pipe 5 can be a metal tube or a resin tube in which at least one of the outer surface and the inner surface is coated with resin, so that high corrosion resistance and high conductivity can be used. Both thermal performance can be achieved.

  The inner diameter of the recess 8 is such that the adhesive 7 can enter and is preferably not so large. Specifically, 0.5 to 10 μm is preferable, and in particular, about 1 to 5 μm is considered preferable. In the illustrated embodiment, the recess 8 is formed on the heat sink 4 only on the lower surface, but it may be formed on the entire outer surface. Further, it is possible to form only the substrate 3 without forming it on the heat sink 4. Conversely, it can be formed only on the heat sink 4. When the recess 8 is formed only on the substrate 3, it may be formed on both front and back (upper and lower) surfaces, or may be formed only on the back surface (upper surface). Moreover, even if the recess 8 is formed in any member, it may be formed only on the bonding surface with the counterpart material, or may be formed entirely, and is selected in consideration of workability and the like. I should do it.

  The group of recesses 8 constituting the porous surface is preferably formed independently and evenly, but there may be a mode in which the recesses 8 intersect in a complicated manner in the form of grooves. In the figure, the depth of the recess 8 is drawn slightly larger than the inner diameter, but the inner diameter (groove width) and the depth are about the same, or conversely, the inner diameter (groove width) is larger than the depth. Also good. Each recess 8 may vary in size.

  Since the pipe 5 is forcibly fitted to the holder portion 6, it is not necessary to bond the pipe 5 and the heat sink 4 in terms of attachment strength. However, in order to fill the gap and improve heat transfer, It is possible to bond the heat sink 4. In this case, if a large amount of metal filler or metal powder is mixed in the adhesive, it is suitable for improving heat transfer (in this case, the adhesive is mainly used as a filler). .

  When the group of the recesses 8 is formed on the entire surface of the heat sink 4, the group of the recesses 8 is formed on the inner surface of the holder portion 6, so that the adhesive 7 is interposed between the pipe 5 and the heat sink 4. This can be said to be suitable for eliminating the air layer and ensuring heat conductivity. In particular, if a large amount of fine metal powder (for example, a particle diameter of 1 μm or less) is mixed in the adhesive 7, the pipe 5 and the heat sink 4 are joined via the metal layer, so It can be said that it is quite beneficial for improvement.

  The adhesive 7 used for bonding the heat sink 4 and the substrate 3 uses an epoxy system, but the heat sink 4 and the pipe 5 may be bonded together. For example, when bonding between the heat sink 4 and the pipe 5, when the resin outer layer 5b is polyethylene or when the entire pipe 5 is polyethylene, an olefin-based adhesive may be used. However, when the pipe 5 is forcibly fitted to the holder portion 6 as in the embodiment, the adhesive force is basically not necessary as described above, so select one having a higher heat transfer than the adhesive force. Can be said to be preferable. When the pipe 5 is made of metal and the outer surface is not covered with the resin layer, the same adhesive 7 as that used for bonding the heat sink 4 and the substrate 3 may be used.

  As shown in FIG. 2 (C), if the adhesive surface auxiliary coating 9 that covers the inner surface of the recess 8 is formed on the porous surface of the substrate 3 or the heat sink 4 on which the recess 8 is formed, the adhesive force is further increased. it can. The adhesive surface auxiliary coating 9 can be a resin primary coating or a base material oxide coating. Since the oxide film is integrated with the substrate 3 or the heat sink 4, it can be said that it is particularly excellent in terms of improving the adhesive force.

  In this case, as disclosed in Japanese Patent No. 5094039, an auxiliary recess (not shown) having a hole diameter of 10 to several hundred nm is formed on the inner surface of the recess 8 (the entire bonding surface) When a thin oxide film is formed on the whole, an extremely high adhesive force can be secured. Therefore, it can be said that application to the present invention is preferable. More specifically, in Japanese Patent No. 5094039, aluminum is generally used in processes such as pickling materials, washing with water, fine etching using an alkaline solution such as caustic soda, ultra fine etching using hydrated hydrazine or ammonia, washing with water, and drying. Although it is disclosed that the surface of the material is roughened, the substrate 3 and the heat sink 4 of the present embodiment can also form a porous surface by such a method.

  On the other hand, as described above, Japanese Patent Application Laid-Open No. 61-279531 and Japanese Patent Application Laid-Open No. 5-70741 disclose that an oxide film having a rough surface structure is formed. The heat sink 4 can also form a group of recesses 8 by adopting this method. In this case, it is preferable to form a resin primer film in the recess 8.

  As shown in FIG. 2 (D), in the pipe 5 attachment step, the adhesive 7 is applied to a predetermined position of the substrate 3, and then the heat sink 4 is overlapped to sandwich the adhesive 7 so that the adhesive 7 is recessed. Enter 8 Before attaching the heat sink 4 to the substrate 3, the pipe 5 may be attached to the heat sink 4 in advance, and the three of the pipe 5, the heat sink 4 and the substrate 3 may be strongly clamped. The pipe 5 may be attached to the heat sink 4 after being attached. In FIG. 2 (D), there is a gap between the pipe 5 and the holder portion 6, but in actuality, they are in close contact with each other (therefore, the pipe 5 is drawn with a slightly smaller diameter than the actual size). ing.).

(2) Second to Seventh Embodiments In the second embodiment shown in FIG. 3 (A), punching metal having a large number of small holes 10 is used as the substrate 3 in the system including the heat sink 4. In this embodiment, in order to prevent the adhesive 7 from dripping from the small holes 10, it is preferable that the adhesive 7 is applied to the lower surface of the heat sink 4 and then bonded to the substrate 3. As in the first embodiment, the pipe 5 is not only a tube in which a metal tube such as aluminum is covered with a resin inner layer and a resin outer layer, but a metal tube in which only the inner surface is covered with resin, and only the outer surface is made of resin. A coated metal tube, a simple metal tube having no resin layer inside or outside, or a simple resin tube can also be used.

  In the third embodiment shown in FIG. 3B, in the system including the heat sink 4, a large number of ribs 11 extending along the longitudinal direction are formed on the lower surface of the substrate 3. The adhesion structure is the same as in the first embodiment. On the upper surface of the substrate 3, a pair of positioning ribs 11 a that hold the heat sink 4 so as not to be laterally shifted are provided. In the figure, the cross-sectional display is omitted. As in the first embodiment, the pipe 5 is not only a tube in which a metal tube such as aluminum is covered with a resin inner layer and a resin outer layer, but a metal tube in which only the inner surface is covered with resin, and only the outer surface is made of resin. A coated metal tube, a simple metal tube having no resin layer inside or outside, or a simple resin tube can also be used.

  In the embodiment shown in FIGS. 3C to 3F, a metal pipe 5 such as aluminum is directly attached to the substrate 3 without providing the substrate 3 with a heat sink. Among them, in the fourth embodiment shown in FIG. 3C, the circular pipe 5 is bonded to a simple flat substrate 3 with an adhesive 7, and in the fifth embodiment shown in FIG. A circular pipe 5 is bonded to the substrate 3. As shown by a dotted line, a group of recesses is also formed on the outer surface of the pipe 5, and a porous surface comprising the group of recesses is indicated by a dotted line and denoted by reference numeral 12.

  When punching metal is used as the substrate 3, the contact area between the substrate 3 and the pipe 5 becomes small. Therefore, peeling may occur only by simple bonding, and it may be difficult to firmly attach the pipe 5 to the substrate 3. In the embodiment, since a high adhesive force can be secured even if the bonding area is small, it is easy to directly attach the pipe 5 without using the heat sink 4 even if the substrate 3 is made of punching metal. In particular, when an auxiliary recess or auxiliary adhesive film is formed, it can be said that it can be attached in a stable state even by a direct attachment method.

  In the sixth embodiment shown in FIG. 3 (E), the pipe 5 is formed in an oval cross section, and in the seventh embodiment shown in FIG. 3 (F), the pipe 5 is formed in a cross section. The surface is bonded to the substrate 3 with an adhesive 7. Also in these, it goes without saying that a punching metal can be used as the substrate 3.

(3). Eighth to Tenth Embodiments FIG. 4 shows an embodiment relating to processing of a portion of the substrate 3 where the heat sink 4 and the pipe 5 are not bonded (that is, an exposed surface that is not an adhesive surface). In other words, since the surface (lower surface) of the substrate 3 is a radiation surface for the room, the surface needs to be as excellent in heat dissipation and heat absorption as possible, while the back surface has as much heat dissipation and heat absorption as possible. Although it is preferable to suppress it, if the group of the recesses 8 is formed, the surface area is increased and the heat insulating property is increased. Therefore, the recesses 8 are effectively used to improve the air conditioning performance.

  In FIG. 4A, a thin surface coating 14 is formed on the entire surface (lower surface) of the substrate 3, and a thick back surface coating 15 is applied to the exposed surface of the back surface (upper surface). A thin coating is generally applied to the radiation surface of the substrate 3, and it is known that the radiation performance is enhanced by applying such a thin coating.

  Accordingly, the surface coating 14 follows the conventional structure. However, in the eighth embodiment of (A), the coating of the surface coating 14 enters the respective recesses 8 and the lower surface of the surface coating 14 is as a whole. It is flat. Accordingly, the unevenness due to the formation of the recess 8 does not appear on the lower surface of the surface coating 14. The surface coating 14 is thick at the recess 8, but when the depth of the recess 8 is several μm, the radiation characteristics are not affected even if the surface coating 14 is partially thick. The radiation performance of the surface of the substrate 3 is proportional to the surface area of the substrate 3 itself rather than the surface area of the surface coating 14, but the lower surface of the substrate 3 is a porous surface and the surface area becomes very large. Therefore, it can be said that the air conditioning performance can be improved.

  Since the paint is composed of a resin component having poor heat conductivity, if the thickness of the coating becomes more than a certain level, the heat dissipation and heat absorption properties deteriorate. Therefore, the back surface coating 15 is set to a thickness at which the heat conductivity is remarkably reduced, for example, 20 μm or more. Thereby, it can be said that the air conditioning efficiency can be improved by suppressing the amount of heat escaping from the back side of the substrate 3 to the ceiling space. Although the paint of the back surface coating 15 also enters the recess 8, it is possible to use a paint having a high viscosity so that the location of the recess 8 becomes a cavity (in this case, heat insulation of air The heat transfer performance is further reduced by the action.)

  In the ninth embodiment shown in (B), the surface coating 14 is applied following the recess 8. Therefore, the surface coating 14 is in a satin state in which countless fine dents are formed and is presumed to exhibit an effect like matting. Moreover, since the surface area is increased by the porous surface, heat dissipation and heat absorption can be improved. When the inner diameter of the recess 8 is as large as about 10 μm, for example, it can be said that the embodiment as shown in (B) is preferable.

  A film 16 is bonded to the back surface of the substrate 3. Therefore, the group of the recesses 8 forms an air layer and exhibits a high heat insulating effect. As a result, heat exchange between the substrate 3 and the ceiling space is remarkably suppressed, and it is expected that the air conditioning efficiency can be greatly improved. It is also possible to combine the structure of (A) and the structure of (B).

  In the embodiments of (A) and (B), the recess 8 is formed in the entire substrate 3, but in the tenth embodiment shown in (C) to (E), the heat sink 4 is formed on the back surface of the substrate 3. The porous surface 12 composed of the recess 8 is formed only at the location excluding the adhesive surface. As the procedure, by applying the back surface coating 15 in advance to the portion of the back surface excluding the bonding surface, for example, the recess 8 is not formed on the non-bonding surface even if the entire substrate 3 is immersed in an alkaline solution. I am doing so. That is, etching for forming the recess 8 is performed in a state where the non-adhesive surface is masked with the back surface coating 15.

  Prior to etching, the surface coating 14 may be applied to the surface of the substrate 3. However, as described above, the surface recess 14 is a positive factor for improving the radiation characteristics. It can be said that it is preferable to apply after etching. If it is not preferable to form the recess 8 on the surface from the point of reflection of light, etc., it may be etched after masking with the surface coating 14 first, or covered with something like a rubber plate Etching in a state may prevent the etching from reaching the surface.

(4). Eleventh Embodiment FIGS. 5 to 7 show an eleventh embodiment in which the pipe 5 is directly attached to the substrate 3. In this embodiment, the radiating panel 1 uses six substrates 3 arranged in parallel in the front-rear direction and pipes 5 attached to the upper surface as core members. The substrate 3 has an elongated shape that is long in the left-right direction. Even if it is unitized as the radiation panel 1, the substrate 3 is formed in a rectangular shape that is long in the left-right direction. Each substrate 3 has three rows of semicircular downward projections 17 arranged side by side. Therefore, the lower surface of each substrate 3 has an uneven shape in a side view, and the radiating panel 1 also has an uneven shape in a side view.

  As shown in FIG. 6, in each substrate 3, one long side edge of the front and rear long side edges is a stepped-up portion 3 a, and the other long side edge side edge is a stepped-down portion 3 b. By superposing the combined stepped-up portion 3a and stepped-down portion 3b, the radiating panel 1 has an appearance like a single plate as a whole.

  On the other hand, the pipe 5 is bent zigzag in a plan view, and the straight portion of the pipe 5 is fitted in the downward protrusion 17 located at the center of each substrate 3. The downward protrusion 17 has a depth slightly smaller than the outer diameter of the pipe 5.

  The pipe 5 is overlapped with a longitudinally pressing frame 18 from above. The holding frame 18 has a U-shaped configuration that opens downward, and a plurality of slit engagement grooves 19 are formed on the front and rear side plates of the holding frame 18. The engaging rib 20 to be fitted is integrally formed, and a claw formed on the tip edge of the engaging rib 20 is cut open and engaged with the step portion of the engaging groove 19, whereby the pipe 5 is placed on the substrate by the holding frame 18. In addition to being pressed and held by 3, the six substrates 3 are connected in a single plate shape.

  And as shown in FIG. 6, the holding | suppressing flame | frame 9 is suspended and supported by the suspending volt | bolt 21 suspended from the ceiling slab (not shown) directly or via the intermediate member. A nut 22 is screwed to the suspension bolt 21.

  The substrate 3 employs an extruded product made of aluminum. Note that the radiating panel 1 can be constituted by a single substrate 3, and when the radiating panel 1 is constituted by a plurality of substrates 3, the number can be arbitrarily assumed. The same applies to the pipe 5.

As shown in FIG. 7A, the entire back surface of the substrate 3 is a porous surface 12 (the surface is also preferably formed on the porous surface). In this embodiment, the pipe 5 is bonded to the downward protrusion 17 with the adhesive 7. The pipe 5 is made of a metal such as an aluminum pipe, the inner surface is covered with a resin inner layer 5a, and the outer surface exposes the metal surface. The outer surface of the pipe 5 is preferably formed with a porous oxide film by alumite treatment or the like.
It is preferable to perform the anticorrosion treatment.

  In this case, FIG. 7B shows a state in which a layer of the adhesive 7 is formed between the pipe 5 and the downward protrusion 17, and in FIG. 7C, the adhesive 7 is a recess. The pipe 5 and the downward protrusion 17 are in close contact with each other except for the recess 8. By adjusting the application amount and pressing force of the adhesive 7, such a bonding mode can also be adopted. Further, it is presumed that the state of (B) or the state of (C) may be caused by variations in the amount of the adhesive 7 applied, warpage of the substrate 3, or the like.

  Since the substrate 3 of the present embodiment is an extruded product, it is possible to form a holder portion 6 that holds the pipe 5 in a non-detachable manner by forced fitting, as shown by a one-dot chain line in FIG. . In this way, it is possible to bond the pipe 5 and the substrate 3 while forming the holder portion 6.

  On the other hand, when a sheet metal processed product is adopted as the substrate 3, the holder portion 6 cannot be formed, and thus bonding with the adhesive 7 is required, but the substrate 3 and the pipe 5 are firmly bonded using the porous surface 12. So it is beneficial. Therefore, when the substrate 3 is a sheet metal product, the present invention is particularly useful because the heat transfer performance between the substrate 3 and the pipe 5 can be improved without providing a heat sink by forming the downward protrusion 17. It can be said that there is.

  The embodiment of the present invention has been described above, but the present invention can be embodied in various ways. For example, the substrate can be formed in a tray shape opened upward. Further, the substrate may be made of a sintered metal so that a continuous gap exists throughout. In this case, there is an advantage that a recess processing step is not required. The radiant panel does not necessarily have to be for the ceiling, and can be configured for the wall.

  The adhesive does not necessarily have to be applied in the bonding process. It is also possible to apply the adhesive to a predetermined location and harden it first, and then heat and melt it in the bonding process. .

  The present invention can be actually embodied in a radiation panel for air conditioning. Therefore, it can be used industrially.

DESCRIPTION OF SYMBOLS 1 Radiation panel 3 Board | substrate 4 Heat sink 5 Pipe 5a, 5b Resin layer 6 Holder part 7 Adhesive 8 The recess (hole) which forms a porous surface
9 Adhesive surface auxiliary coating 10 Small holes constituting punching metal 12 Porous surface

Claims (6)

It is a configuration in which a metal pipe through which a heat medium for air conditioning flows is bonded to the back surface of the metal substrate with an adhesive,
The bonding surface of one or both members of the substrate and the pipe is formed as a porous surface having a recess made of a group of holes or grooves having a micron size, and the adhesive is used as the recess. Entangled,
Radiant panel for air conditioning. A metal pipe through which the air-conditioning heat medium flows is arranged on the back surface of the metal substrate via a metal heat sink in which the holder portion of the pipe is formed, and the substrate and the heat sink are bonded by an adhesive. Is configured, and
Either or both of the bonding surfaces of the substrate and the heat sink are formed on a porous surface having a recess formed of a group of holes or grooves having a micron level size, and the adhesive is Entering the recess,
Radiant panel for air conditioning. On the porous surface made of the recess, an adhesion auxiliary coating made of a resin primary coating or a metal coating is formed,
The radiant panel for air conditioning according to claim 1 or 2. Most of the group of recesses has a hole diameter or groove width in the range of about 0.5 to 20 μm and a depth in the range of 0.5 to 10 μm.
The radiation panel for air conditioning described in any one of claims 1 to 3. It is a manufacturing method of the radiation panel for air conditioning described in Claim 1,
Preparing a substrate having a smooth outer surface;
Forming a pipe bonding surface on at least the back surface of the substrate into a porous surface in which the group of recesses is opened by etching using an alkaline solution;
A step of applying the adhesive to a predetermined position of the substrate and then pressing and holding the pipe so that the adhesive enters the recess of the substrate and bonds the pipe to the substrate.
A method for manufacturing a radiation panel for air conditioning. It is a manufacturing method of the radiation panel for air conditioning described in Claim 2,
Preparing a substrate having a smooth outer surface;
Forming a pipe bonding surface on at least the back surface of the substrate into a porous surface in which the group of recesses is opened by etching using an alkaline solution;
Applying an adhesive to one of the substrates or the heat sink; and
Bonding the heat sink to the substrate by allowing the adhesive to enter the recess by superimposing the heat sink and the substrate;
Attaching the pipe to the heat sink,
The step of attaching the pipe to the heat sink is performed after or before the step of bonding the heat sink to a substrate.
A method for manufacturing a radiation panel for air conditioning.

Images