JP2018186148A - Operational method for substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an operational method for substrate processing apparatus, capable of reducing power consumption of a substrate processing apparatus.SOLUTION: The operational method for substrate processing apparatus includes: switching an operational mode of a substrate processing part 100 from a standby mode to a processing mode; processing a substrate with the substrate processing part 100; switching the operational mode of the substrate processing part 100 from the processing mode to the standby mode; and shutting down a power line 109 to at least one motor of the substrate processing part 100.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a method for operating a substrate processing apparatus for processing a substrate such as a wafer.

  The substrate processing apparatus is a composite processing apparatus that can polish, clean, and dry a plurality of substrates. This substrate processing apparatus consumes a certain amount of power until the processing of one substrate is completed. In particular, when a plurality of substrates are processed at the same time, the processing load is overlapped, resulting in an increase in power consumption.

  FIG. 12 is a graph showing the power demand of the substrate processing apparatus. In FIG. 12, the vertical axis represents power [W] consumed by the substrate processing apparatus, and the horizontal axis represents time [seconds]. The plurality of substrates are sequentially loaded into the polishing unit of the substrate processing apparatus and polished sequentially. Further, the polished substrate is sequentially carried into the cleaning unit of the substrate processing apparatus, and is sequentially cleaned and dried. As can be seen from the graph shown in FIG. 12, the power demand of the substrate processing apparatus varies periodically according to the processing operation of the substrate. In particular, a large amount of power is consumed when the maximum number of substrates is being processed.

Japanese Patent No. 5927223

  Therefore, an object of the present invention is to provide a method of operating a substrate processing apparatus that can reduce power consumption of the substrate processing apparatus.

  According to one embodiment of the present invention, the operation mode of the substrate processing unit is switched from the standby mode to the processing mode, the substrate is processed by the substrate processing unit, and the processing mode of the substrate processing unit is changed after the processing of the substrate is completed. A method for operating a substrate processing apparatus, comprising switching from a processing mode to a standby mode and cutting off a power line to at least one motor of the substrate processing unit.

In a preferred aspect of the present invention, the at least one motor includes a table motor that rotates a polishing table for polishing the substrate, and a head motor that rotates a polishing head for polishing the substrate. .
In a preferred aspect of the present invention, the at least one motor includes a drive motor of a transfer robot for transferring the substrate.
In a preferred aspect of the present invention, the at least one motor includes a cleaning tool motor that rotates a cleaning tool of a cleaning unit for cleaning the substrate.
In a preferred aspect of the present invention, the method further includes a step of shutting off a power line to a drive motor of a loader for carrying the substrate into the substrate processing unit after the processing of the substrate is completed.
In a preferred aspect of the present invention, the substrate processing unit is a polishing unit for polishing a substrate or a cleaning unit for cleaning the substrate.
In a preferred aspect of the present invention, the method further includes a step of reducing the flow rate of the utility used in the substrate processing unit after the processing of the substrate is completed.

In one aspect of the present invention, the volume of the first utility used in the substrate processing unit is converted into the power consumption to calculate the first converted power consumption, and the volume of the second utility used in the substrate processing unit. Is converted into power consumption to calculate the second converted power consumption, the power consumption in the substrate processing unit is calculated, the first converted power consumption, the second converted power consumption, An operation method of a substrate processing apparatus, wherein power consumption in a substrate processing unit is recorded.
In a preferred aspect of the present invention, a graph of the first converted power consumption, the second converted power consumption, and the power consumption in the substrate processing unit is created.

  According to the present invention, the power consumption of the substrate processing apparatus can be reduced by cutting off the power line to the motor.

It is a schematic diagram which shows one Embodiment of a substrate processing apparatus. It is a perspective view which shows a 1st grinding | polishing unit typically. It is sectional drawing which shows the grinding | polishing head shown in FIG. It is a side view of a washing | cleaning part. It is a perspective view which shows one Embodiment of a 1st washing | cleaning unit. It is a side view which shows typically the substrate processing apparatus shown in FIG. It is a graph of power consumption and conversion power consumption. It is a schematic diagram which shows other embodiment for reducing the power consumption of a substrate processing apparatus. It is a schematic diagram which shows other embodiment for reducing the power consumption of a substrate processing apparatus. It is a schematic diagram which shows other embodiment for reducing the power consumption of a substrate processing apparatus. It is a schematic diagram which shows the structure of an operation control part. It is a graph which shows the electric power demand of a substrate processing apparatus.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic view of an embodiment of a substrate processing apparatus for polishing a substrate such as a wafer, cleaning the polished substrate, and drying the cleaned substrate. As shown in FIG. 1, the substrate processing apparatus includes a substantially rectangular housing 1, and the interior of the housing 1 is divided into a load / unload unit 2, a polishing unit 3 and a cleaning unit 4 by partition walls 1a and 1b. It is partitioned. The substrate processing apparatus includes an operation control unit 5 that controls a substrate processing operation.

  The load / unload unit 2 includes a front load unit 20 on which a substrate cassette that stores a large number of substrates (for example, wafers) is placed. A rail mechanism 21 is laid along the front load section 20 in the load / unload section 2, and a transfer robot (loader) 22 that can move along the arrangement direction of the substrate cassettes on the rail mechanism 21. is set up. The transfer robot 22 can access the substrate cassette mounted on the front load unit 20 by moving on the rail mechanism 21. Further, the transfer robot 22 is configured to be able to move up and down. The transfer robot 22 includes a drive motor (not shown) as a power source.

  The polishing unit 3 includes a plurality of polishing units that can polish a plurality of substrates in parallel. The polishing unit 3 of this embodiment includes a first polishing unit 3A, a second polishing unit 3B, a third polishing unit 3C, and a fourth polishing unit 3D. However, the number of polishing units is not limited to this embodiment.

  As shown in FIG. 1, the first polishing unit 3A has a first polishing table 30A to which a polishing pad 10 having a polishing surface is attached and a substrate pressed against the polishing pad 10 on the polishing table 30A for polishing. For dressing the first polishing head 31A, the first liquid supply nozzle 32A for supplying a polishing liquid (for example, slurry) or a dressing liquid (for example, pure water) to the polishing pad 10, and the polishing surface of the polishing pad 10. The first dresser 33A and a first atomizer 34A for spraying a mixed fluid of a liquid (for example, pure water) and a gas (for example, nitrogen gas) to the polishing surface of the polishing pad 10 in the form of a mist.

  Similarly, the second polishing unit 3B includes a second polishing table 30B to which the polishing pad 10 is attached, a second polishing head 31B, a second liquid supply nozzle 32B, a second dresser 33B, and a second atomizer 34B. The third polishing unit 3C includes a third polishing table 30C to which the polishing pad 10 is attached, a third polishing head 31C, a third liquid supply nozzle 32C, a third dresser 33C, and a third atomizer. The fourth polishing unit 3D includes a fourth polishing table 30D to which the polishing pad 10 is attached, a fourth polishing head 31D, a fourth liquid supply nozzle 32D, a fourth dresser 33D, 4 atomizer 34D.

  The first polishing unit 3A, the second polishing unit 3B, the third polishing unit 3C, and the fourth polishing unit 3D have the same configuration. Hereinafter, the first polishing unit 3A will be described with reference to FIG. FIG. 2 is a perspective view schematically showing the first polishing unit 3A. In FIG. 2, the dresser 33A and the atomizer 34A are omitted.

  The polishing table 30A is connected to a table motor 19 disposed below the table shaft 30a, and the table motor 19 rotates the polishing table 30A in the direction indicated by the arrow. A polishing pad 10 is affixed to the upper surface of the polishing table 30A, and the upper surface of the polishing pad 10 constitutes a polishing surface 10a for polishing the substrate W. The polishing head 31A is connected to the lower end of the head shaft 16A. The polishing head 31A is configured to hold the substrate W on its lower surface by vacuum suction.

  The head shaft 16A is rotatably supported by the head arm 35A. A head motor 37A for rotating the head shaft 16A and the polishing head 31A about their axes is fixed to the head arm 35A. The head shaft 16A is connected to the rotation shaft of the head motor 37A directly or via a power transmission mechanism (for example, a belt and a pulley).

  In the head arm 35A, a turning motor 39A for turning the polishing head 31A and the entire head arm 35A around the turning shaft 38A is disposed. The turning motor 39A is connected to the turning shaft 38A. By driving the turning motor 39A, the polishing head 31A can move between a polishing position shown in FIG. 2 and a transfer position (described later) outside the polishing table 30A. Further, the head shaft 16A and the polishing head 31A are configured to be moved up and down by a vertical movement mechanism (not shown) disposed in the head arm 35A.

  Polishing of the substrate W is performed as follows. The polishing head 31A and the polishing table 30A are rotated in directions indicated by arrows, respectively, and a polishing liquid (slurry) is supplied onto the polishing pad 10 from the liquid supply nozzle 32A. In this state, the polishing head 31 </ b> A presses the substrate W against the polishing surface 10 a of the polishing pad 10. The surface of the substrate W is polished by the chemical action of the polishing liquid and the mechanical action of the abrasive grains contained in the polishing liquid. After polishing, dressing (conditioning) of the polishing surface 10a by the dresser 33A shown in FIG. 1 is performed, and a high-pressure fluid is supplied from the atomizer 34A shown in FIG. 1 to the polishing surface 10a and remains on the polishing surface 10a. Polishing debris and slurry are removed.

  FIG. 3 is a cross-sectional view showing the polishing head 31A. The polishing head 31A surrounds the disc-shaped carrier 41, a circular flexible elastic membrane (membrane) 43 that forms a plurality of pressure chambers D1, D2, D3, D4 below the carrier 41, and the elastic membrane 43. And a retainer ring 45 that presses the polishing surface 10 a of the polishing pad 10. The pressure chambers D1, D2, D3, and D4 are formed between the elastic film 43 and the lower surface of the carrier 41. The carrier 41 is fixed to the lower end of the head shaft 16A.

  The elastic film 43 has a plurality of annular partition walls 43a, and the pressure chambers D1, D2, D3, and D4 are partitioned from each other by the partition walls 43a. The central pressure chamber D1 is circular, and the other pressure chambers D2, D3, D4 are circular. These pressure chambers D1, D2, D3, D4 are arranged concentrically. The number of pressure chambers is not particularly limited, and the polishing head 31A may include more than four pressure chambers.

  The pressure chambers D1, D2, D3, and D4 are connected to the fluid lines G1, G2, G3, and G4, and pressurized fluid (for example, pressurized air) passes through the fluid lines G1, G2, G3, and G4. It is supplied in D2, D3 and D4. Pressure regulators R1, R2, R3, and R4 are attached to the fluid lines G1, G2, G3, and G4, respectively. The pressure regulators R1, R2, R3, and R4 can independently adjust the pressure of the pressurized fluid in the pressure chambers D1, D2, D3, and D4. Thereby, the polishing head 31A can polish the corresponding four regions of the substrate W, that is, the central portion, the inner intermediate portion, the outer intermediate portion, and the peripheral portion with the same polishing load or different polishing loads.

  An annular elastic membrane 46 is disposed between the retainer ring 45 and the carrier 41. An annular pressure chamber D5 is formed inside the elastic film 46. The pressure chamber D5 is connected to the fluid line G5, and pressurized fluid (for example, pressurized air) is supplied into the pressure chamber D5 through the fluid line G5. A pressure regulator R5 is attached to the fluid line G5. The pressure of the pressurized fluid in the pressure chamber D5 is adjusted by the pressure regulator R5. The pressure in the pressure chamber D5 is applied to the retainer ring 45, and the retainer ring 45 can directly press the polishing surface 10a of the polishing pad 10 independently of the elastic film (membrane) 43. Flow meters K1, K2, K3, K4, and K5 are attached to the fluid lines G1, G2, G3, G4, and G5, respectively.

  During polishing of the substrate W, the elastic film 43 presses the substrate W against the polishing surface 10 a of the polishing pad 10, while the retainer ring 45 presses the polishing surface 10 a of the polishing pad 10 around the substrate W. Although not shown, the polishing heads 31B to 31D also have the same configuration as the polishing head 31A described above.

  Returning to FIG. 1, a first linear transporter 6 is disposed adjacent to the first polishing unit 3A and the second polishing unit 3B. The first linear transporter 6 is a transfer robot that transfers a substrate between four transfer positions (a first transfer position TP1, a second transfer position TP2, a third transfer position TP3, and a fourth transfer position TP4). Further, the second linear transporter 7 is disposed adjacent to the third polishing unit 3C and the fourth polishing unit 3D. The second linear transporter 7 is a transfer robot that transfers a substrate between three transfer positions (fifth transfer position TP5, sixth transfer position TP6, and seventh transfer position TP7). The first linear transporter 6 and the second transporter 7 include a drive motor (not shown) as a power source.

  The substrate is transported to the first polishing unit 3A and / or the second polishing unit 3B by the first linear transporter 6. The polishing head 31A of the first polishing unit 3A moves between the upper position of the polishing table 30A and the second transport position TP2 by the swing operation. Therefore, the transfer of the substrate between the polishing head 31A and the first linear transporter 6 is performed at the second transport position TP2.

  Similarly, the polishing head 31B of the second polishing unit 3B moves between the upper position of the polishing table 30B and the third transport position TP3, and transfers the substrate between the polishing head 31B and the first linear transporter 6. Is performed at the third transfer position TP3. The polishing head 31C of the third polishing unit 3C moves between the upper position of the polishing table 30C and the sixth transport position TP6, and the transfer of the substrate between the polishing head 31C and the second linear transporter 7 is the sixth. This is performed at the transfer position TP6. The polishing head 31D of the fourth polishing unit 3D moves between the upper position of the polishing table 30D and the seventh transport position TP7, and the transfer of the substrate between the polishing head 31D and the second linear transporter 7 is the seventh. This is performed at the transfer position TP7. The polishing heads 31A, 31B, 31C, 31D also function as a substrate transfer device that transfers the substrate between the polishing position on the polishing pad 10 and the transfer positions TP2, TP3, TP6, TP7.

  A lifter 11 for receiving a substrate from the transfer robot 22 is disposed at the first transfer position TP1. The lifter 11 is disposed between the transfer robot 22 and the first linear transporter 6. The substrate is transferred from the transfer robot 22 to the first linear transporter 6 through the lifter 11. A shutter (not shown) is provided in the partition wall 1a between the lifter 11 and the transfer robot 22, and when transferring the substrate, the shutter is opened so that the substrate is transferred from the transfer robot 22 to the lifter 11. It has become.

  Between the first linear transporter 6, the second linear transporter 7, and the cleaning unit 4, a swing transporter 12 that is a transport robot for transporting the substrate is disposed. The substrate is transported from the first linear transporter 6 to the second linear transporter 7 by the swing transporter 12. The substrate is transported to the third polishing unit 3C and / or the fourth polishing unit 3D by the second linear transporter 7.

  On the side of the swing transporter 12, a temporary placement stage 72 for a substrate installed on a frame (not shown) is disposed. As shown in FIG. 1, the temporary placement stage 72 is disposed adjacent to the first linear transporter 6 and is positioned between the first linear transporter 6 and the cleaning unit 4. The swing transporter 12 transports the substrate between the fourth transport position TP4, the fifth transport position TP5, and the temporary placement stage 72. The swing transporter 12 and the temporary placement stage 72 are disposed in the polishing unit 3. The swing transporter 12 includes a drive motor (not shown) as a power source.

  The transfer robot 22, the polishing heads 31 </ b> A to 31 </ b> D, the linear transporters 6 and 7, and the swing transporter 12 constitute a polishing side substrate transfer system that carries the substrate into the polishing unit 3 and transfers the substrate within the polishing unit 3. . The operation of the polishing side substrate transfer system is controlled by the operation control unit 5.

  The cleaning unit 4 includes first cleaning units 73A and 73B and second cleaning units 74A and 74B for cleaning the polished substrates, and drying units 75A and 75B for drying the cleaned substrates. The first cleaning unit 73A is disposed above the first cleaning unit 37B, and the second cleaning unit 74A is disposed above the second cleaning unit 74B. The drying unit 75A is disposed above the drying unit 75B.

  The cleaning unit 4 further includes a first transfer robot 77 and a second transfer robot 78 for transferring the substrate. The substrate placed on the temporary placement stage 72 is carried into the cleaning unit 4 by the first transport robot 77. The first transfer robot 77 is disposed between the first cleaning units 73A and 73B and the second cleaning units 74A and 74B. The first transfer robot 77 operates to transfer the substrate from the temporary placement stage 72 to the first cleaning unit 73A or the first cleaning unit 73B. The second transfer robot 78 is disposed between the second cleaning units 74A and 74B and the drying units 75A and 75B.

  FIG. 4 is a side view of the cleaning unit 4. As shown in FIG. 4, the first cleaning unit 73A is disposed above the first cleaning unit 37B, and the second cleaning unit 74A is disposed above the second cleaning unit 74B. The drying unit 75A is disposed above the drying unit 75B. The first transfer robot 77 is supported by the first lifting shaft 80 and is configured to be movable up and down on the first lifting shaft 80. The second transfer robot 78 is supported by the second lifting shaft 81 and is configured to be movable up and down on the second lifting shaft 81.

  The first transfer robot 77 operates to transfer the substrate from the first cleaning unit 73A or the first cleaning unit 73B to the second cleaning unit 74A or the second cleaning unit 74B. The second transfer robot 78 operates to transfer the substrate from the second cleaning unit 74A or the second cleaning unit 74B to the drying unit 75A or the drying unit 75B. In the present embodiment, the first transfer robot 77 and the second transfer robot 78 constitute a cleaning-side substrate transfer system that transfers the substrate within the cleaning unit 4. The operation of the cleaning side substrate transfer system is controlled by the operation control unit 5 shown in FIG.

  Since the cleaning unit 4 includes two first cleaning units 73A and 73B, two second cleaning units 74A and 74B, and two drying units 75A and 75B, the two substrates are arranged in parallel. Two wash lanes can be configured for washing and drying. The “cleaning lane” is a processing path in which one substrate is cleaned and dried by a plurality of cleaning units and drying units in the cleaning unit 4. For example, as shown in FIG. 4, one substrate is transported in the order of the first cleaning unit 73A, the second cleaning unit 74A, and the drying unit 75A (first cleaning lane), and in parallel with this, the other The substrate can be transported in the order of the first cleaning unit 73B, the second cleaning unit 74B, and the drying unit 75B (second cleaning lane). Thus, two parallel cleaning lanes can clean and dry two substrates in parallel.

  In two parallel cleaning lanes, a plurality of substrates may be cleaned and dried with a predetermined time difference. The advantages of cleaning at a predetermined time difference are as follows. The first transfer robot 77 and the second transfer robot 78 are shared by a plurality of cleaning lanes. For this reason, when a plurality of cleaning or drying processes are completed at the same time, the transfer robot cannot immediately transfer the substrate, which deteriorates the throughput. In order to avoid such a problem, the processed substrates can be quickly transported by the transport robots 77 and 78 by cleaning and drying a plurality of substrates with a predetermined time difference.

  In the present embodiment, the first cleaning units 73A and 73B and the second cleaning units 74A and 74B are roll sponge type cleaning machines. The roll sponge type cleaning machine is configured to bring the two roll sponges into contact with the upper and lower surfaces of the substrate while rotating the substrate and rotating the two roll sponges arranged above and below the substrate. ing. In the present embodiment, the first cleaning units 73A and 73B and the second cleaning units 74A and 74B have the same structure.

  FIG. 5 is a perspective view showing an embodiment of the first cleaning unit 73A. As shown in FIG. 5, the first cleaning unit 73A includes four holding rollers 85 that hold and rotate the substrate W, and cylindrical roll sponges (cleaning tools) 87 and 88 that contact the upper and lower surfaces of the substrate W. Cleaning tool motors 90 and 91 for rotating the roll sponges 87 and 88, upper rinse liquid supply nozzles 95 and 96 for supplying a rinse liquid (for example, pure water) to the upper surface of the substrate W, and a cleaning liquid for the upper surface of the substrate W. Upper cleaning liquid supply nozzles 97 and 98 for supplying (for example, chemical liquid) are provided. Although not shown, a lower rinsing liquid supply nozzle for supplying a rinsing liquid (for example, pure water) to the lower surface of the substrate W and a lower cleaning liquid supply nozzle for supplying a cleaning liquid (for example, a chemical liquid) to the lower surface of the substrate W are provided. .

  The holding roller 85 can be moved in the direction approaching and separating from the substrate W by a driving mechanism (for example, an air cylinder) (not shown). The four holding rollers 85 are rotated in the same direction by a motor (not shown). When the holding roller 85 rotates in a state where the four holding rollers 85 hold the substrate W, the substrate W rotates about its axis. At the time of cleaning the substrate W, the roll sponges 87 and 88 move in directions close to each other and come into contact with the upper and lower surfaces of the substrate W. As a cleaning tool, a roll brush may be used instead of the roll sponge.

  Next, a process for cleaning the substrate W will be described. First, the substrate W is rotated around its axis by the holding roller 85. Next, the cleaning liquid is supplied to the upper and lower surfaces of the substrate W from the upper cleaning liquid supply nozzles 97 and 98 and the lower cleaning liquid supply nozzle (not shown). In this state, the upper and lower surfaces of the substrate W are scrubbed by the roll sponges 87 and 88 slidably contacting the upper and lower surfaces of the substrate W while rotating around the horizontally extending axis.

  After scrub cleaning, the substrate W is rinsed by supplying pure water as a rinse liquid to the rotating substrate W from the upper rinse liquid supply nozzles 95 and 96 and a lower rinse liquid supply nozzle (not shown). The rinsing of the substrate W may be performed while the roll sponges 87 and 88 are in sliding contact with the upper and lower surfaces of the substrate W, or may be performed with the roll sponges 87 and 88 being separated from the upper and lower surfaces of the substrate W.

  In one embodiment, the first cleaning units 73A and 73B or the second cleaning units 74A and 74B may be pen sponge type cleaning machines. The pen sponge type cleaning machine is configured to bring the pen type sponge into contact with the upper surface of the substrate while rotating the substrate and the pen type sponge, and further move the pen type sponge in the radial direction of the substrate. ing. During the cleaning of the substrate, the cleaning liquid is supplied to the upper surface of the substrate.

The drying units 75A and 75B move pure water and IPA vapor (a mixture of isopropyl alcohol and N ₂ gas) from the pure water nozzle and the IPA nozzle while moving the pure water nozzle and the IPA nozzle in the radial direction of the substrate. It is an IPA type dryer that dries the substrate by supplying to the substrate. The drying units 75A and 75B may be other types of dryers. For example, a spin dry type dryer that rotates the substrate at a high speed can be used.

  In the present embodiment, two first cleaning units 73A and 73B, two second cleaning units 74A and 74B, and two drying units 75A and 75B are provided. The number of the first cleaning unit, the second cleaning unit, and the drying unit may be three or more. That is, three or more cleaning lanes may be provided. In one embodiment, there may be one wash lane. A plurality of third cleaning units may be further provided between the second cleaning units 74A and 74B and the drying units 75A and 75B.

  Next, an example of the operation of the substrate processing apparatus will be described with reference to FIG. The transfer robot 22 takes out the substrate from the substrate cassette and passes it to the lifter 11. The first linear transporter 6 takes out the substrate from the lifter 11, and the substrate is transferred to at least one of the polishing units 3 </ b> A to 3 </ b> D via the first linear transporter 6 and / or the second linear transporter 7. . The substrate is polished by at least one of the polishing units 3A to 3D.

  The polished substrate is transferred to the first cleaning unit 73A and the second cleaning unit 74A via the first linear transporter 6 or the second linear transporter 7, the swing transporter 12, and the first transfer robot 77, and polished. The substrate thus cleaned is sequentially cleaned by the first cleaning unit 73A and the second cleaning unit 74A. Further, the cleaned substrate is transferred to the drying unit 75A by the transfer robot 78, and the cleaned substrate is dried here. As described above, the substrate may be transferred to the first cleaning unit 73B, the second cleaning unit 74B, and the drying unit 75B.

  The dried substrate is taken out from the drying unit 75A by the transfer robot 22 and returned to the substrate cassette on the front load unit 20. In this way, a series of processes including polishing, cleaning, and drying are performed on the substrate.

  The substrate processing apparatus has an on-demand operation function for reducing power consumption in the polishing unit 3 and / or the cleaning unit 4. The on-demand operation function is a function that reduces power consumption by cutting off the power line to the motor of the substrate processing unit when the substrate processing unit (polishing unit 3 and / or cleaning unit 4) is in the standby mode. is there. Hereinafter, the on-demand operation function will be described.

  6 is a side view schematically showing the substrate processing apparatus shown in FIG. Reference numeral 100 in FIG. 6 represents a substrate processing unit for processing a substrate. The substrate processing unit 100 may be the polishing unit 3 for polishing the substrate, or may be the cleaning unit 4 for cleaning the substrate, or both the polishing unit 3 and the cleaning unit 4 May be included. The substrate processing apparatus includes a power source 103 that is electrically connected to the commercial power source 101 and a power interruption device 106 that is connected to the power source 103. Each motor of the substrate processing unit 100 is connected to the power source 103 through the power cutoff device 106 by the power line 109. The power interruption device 106 is disposed on the power line 109. Electric power is supplied from the power source 103 to each motor through the electric power line 109 and the electric power interruption device 106.

  The motor of the substrate processing unit 100 includes a table motor 19 that rotates the polishing table 30A, a head motor 37A that rotates the polishing head 31A, a turning motor 39A that rotates the polishing head 31A, a driving motor for the transfer robot of the substrate processing unit 100, a first motor. 1 includes cleaning tool motors 90 and 91 for rotating the cleaning tools 87 and 88 of the cleaning units 73A and 73B. The transfer robot of the substrate processing unit 100 includes the linear transporters 6 and 7 and the swing transporter 12 of the polishing unit 3, and further includes a first transfer robot 77 and a second transfer robot 78 of the cleaning unit 4.

  Similarly, the drive motor of the transfer robot (loader) 22 is connected to the power source 103 through the power interruption device 106 by the power line 109. Although not shown, the table motor, the head motor, and the turning motor of the polishing units 3B, 3C, and 3D, and the cleaning tool motor of the second cleaning units 74A and 74B are also connected to the power source 103 through the power cutoff device 106 by the power line 109. Has been.

  An exhaust duct 110 for forming a negative pressure inside the polishing unit 3 is connected to the polishing unit 3. The exhaust duct 110 is connected to a vacuum source (not shown) (for example, a vacuum pump). A flow control valve 111 and a flow meter 113 are attached to the exhaust duct 110. The flow rate of the gas exhausted from the polishing unit 3 through the exhaust duct 110 is adjusted by the flow rate control valve 111 and measured by the flow meter 113. Similarly, an exhaust duct 114 for forming a negative pressure inside the cleaning unit 4 is connected to the cleaning unit 4. The exhaust duct 114 is connected to a vacuum source (not shown) (for example, a vacuum pump). A flow control valve 115 and a flow meter 116 are attached to the exhaust duct 114. The flow rate of the gas exhausted from the cleaning unit 4 through the exhaust duct 114 is adjusted by the flow rate adjusting valve 115 and measured by the flow meter 116. The operations of the flow control valves 111 and 115 are controlled by the operation control unit 5.

  The load / unload unit 2, the polishing unit 3, and the cleaning unit 4 are disposed in the housing 1. A solar panel 119 and a fan filter unit (FFU) 122 are disposed on the upper wall of the housing 1. The solar panel 119 converts lighting in the factory into electric power and supplies it to the storage battery 121. The electric power stored in the storage battery 121 is supplied to the electrical equipment of the substrate processing apparatus as necessary.

  The fan filter unit 122 supplies clean air into the housing 1 to form a downward flow of clean air in the housing 1. The fan filter unit 122 includes a filter (for example, a HEPA filter) 123, a fan 124, and a fan motor 125 for rotating the fan 124. The fan motor 125 is connected to the power source 103 via a driver (inverter) (not shown). The rotation speed of the fan motor 125 is controlled by the operation control unit 5 via a driver (inverter).

  The power interruption device 106 is a switch that establishes and interrupts electrical connection between the above-described motors of the substrate processing unit 100 and the power source 103. Each motor is electrically connected to the power source 103 by the power interrupt device 106 independently from the other motors, and is electrically disconnected. The power interruption device 106 is connected to the operation control unit 5, and the operation of the power interruption device 106 is controlled by the operation control unit 5.

  The operation control unit 5 is configured to switch the operation mode of the substrate processing unit 100 between the processing mode and the standby mode. The processing mode is an operation mode when processing the substrate (for example, polishing and / or cleaning), and the standby mode is an operation mode after the processing of the substrate is finished. Specifically, the operation control unit 5 switches the operation mode from the standby mode to the processing mode before the substrate to be processed is carried into the substrate processing unit 100, and operates after the substrate is processed by the substrate processing unit 100. Switch the mode from processing mode to standby mode.

  The operation control unit 5 switches the operation mode of the substrate processing unit 100 from the processing mode to the standby mode and issues a command to the power cut-off device 106 after the substrate processing in the substrate processing unit 100 is completed. The power interrupt device 106 is configured to interrupt the power line 109 to at least one motor of 100. For example, after the polishing of the substrate in the polishing unit 3 is completed, the power interruption device 106 receives a command signal from the operation control unit 5 and connects the power line 109 to the table motor 19, the head motor 37A, and the turning motor 39A. Cut off. In one embodiment, the power cutoff device 106 may cut off the power line 109 to the table motor 19, the head motor 37A, the turning motor 39A, the drive motors of the transporters 6 and 7, and the drive motor of the swing transporter 12. .

  After the cleaning and drying of the substrate in the cleaning unit 4 is completed, the power cut-off device 106 receives a command signal from the operation control unit 5 and cuts off the power line 109 to the cleaning tool motors 90 and 91. In one embodiment, the power cut-off device 106 may cut off the power line 109 to the cleaning tool motors 90 and 91 and the drive motors of the transfer robots 77 and 78.

  In general, even when the polishing unit 3 is not polishing the substrate, the polishing table 30A is rotated at a low speed to maintain lubrication of the bearing. Similarly, even when the cleaning unit 4 is not cleaning the substrate, in order to prevent the cleaning tools 87 and 88 of the cleaning unit 73A from being dried, cleaning is performed while supplying pure water to the cleaning tools 87 and 88. The tools 87 and 88 are rotated at a low speed. According to the on-demand operation function of the present embodiment, the power cut-off device 106 cuts off the power line 109 to the motor of the polishing unit 3 or the cleaning unit 4 while the polishing unit 3 or the cleaning unit 4 is in the standby mode. As a result, power consumption in the polishing unit 3 or the cleaning unit 4 in the standby mode can be reduced.

  In one embodiment, after the substrate processing in the substrate processing unit 100 is completed, the operation control unit 5 issues a command to the power cutoff device 106 to connect the power line 109 to the transfer robot (loader) 22 with the power cutoff device. 106 may be blocked. By such an operation, the power consumption of the entire substrate processing apparatus in standby can be further reduced.

  Next, the on-demand control function of the substrate processing apparatus will be described. The on-demand control function is a function that reduces the power consumption and utility consumption of the substrate processing apparatus when the substrate processing unit 100 (the polishing unit 3 and / or the cleaning unit 4) is in the standby mode. Hereinafter, the on-demand control function will be described.

  In the present embodiment, after the substrate processing in the substrate processing unit 100 (the polishing unit 3 and / or the cleaning unit 4) is completed, the operation control unit 5 changes the operation mode of the substrate processing unit 100 from the processing mode to the standby mode. Switching is made and the rotational speed of the fan motor 125 of the fan filter unit 122 is reduced. Specifically, the operation control unit 5 lowers the set value of the rotational speed of the fan motor 125 from the standard set value to a value lower than the standard set value. By such an operation, the power consumption of the substrate processing apparatus can be reduced.

  In one embodiment, the on-demand control function may include a function of reducing the amount of utility used in the substrate processing unit 100 as well as reducing power consumption. Specifically, after the substrate processing in the substrate processing unit 100 (the polishing unit 3 and / or the cleaning unit 4) is completed, the operation control unit 5 changes the operation mode of the substrate processing unit 100 from the processing mode to the standby mode. The flow rate of the utility used for switching and the substrate processing unit 100 is reduced.

  The utility is a consumable fluid necessary for processing the substrate in the substrate processing unit 100 (the polishing unit 3 and the cleaning unit 4). Examples of utilities are pure water, exhaust from the substrate processing unit 100, dry air, and cooling water. The pure water is used, for example, as moisturizing water for the polishing pad 10. Pure water is supplied to the polishing pad 10 from the liquid supply nozzle 32A. The flow rate of pure water is adjusted by the flow rate control valve 130 and measured by the flow meter 131. In addition, the pure water is also used as moisturizing water for the cleaning tools 87 and 88 of the cleaning unit 73A. The flow rate of pure water is adjusted by a flow rate control valve 134 and measured by a flow meter 135.

  The exhaust from the substrate processing unit 100 is a gas exhausted from the substrate processing unit 100 through the exhaust ducts 110 and 114. The gas discharged from the substrate processing unit 100 is mainly air. The flow rate of the exhaust gas is adjusted by the flow rate adjusting valves 111 and 115 and measured by the flow meters 113 and 116.

  The dry air is, for example, a pressurized gas that is supplied to the pressure chamber of the polishing head 31A (see symbols D1 to D5 in FIG. 3). The flow rate of dry air into the pressure chamber is measured by flow meters K1 to K5. Dry air may be used as a working fluid of an air cylinder as an actuator.

  The cooling water is used for cooling the polishing table 30A as shown in FIG. The cooling water channel pipe 140 extends in the polishing table 30A. The polishing table 30 </ b> A whose temperature has risen due to the sliding contact between the substrate and the polishing pad 10 is cooled by the cooling water flowing through the cooling water channel tube 140. The flow rate of the cooling water is adjusted by the flow rate control valve 141 and measured by the flow meter 142.

  The utility uses described above are examples and may be used for other purposes. Other examples of utilities include nitrogen gas and drainage.

SEMI (Semiconductor Equipment and Materials International), an international association of micro / nanoelectronics manufacturing supply chains, provides conversion factors for converting utilities used in semiconductor manufacturing equipment into power consumption. By multiplying the utility volume by the conversion factor, the utility usage can be converted into the power consumption. For example, conversion factor of the exhaust is 0.0037kWh / m ^3, in terms of counts of the dry air is 0.147kWh / m ^3, in terms of counts of the cooling water (temperature 20-25 ° C.) is 1.56kWh / m ^3, The conversion factor for pure water (pressurization) is 9.0 kWh / m ³ .

  The operation control unit 5 stores the conversion coefficients of the above-described utilities in the storage device 210 in advance. The flow meters described above for measuring the flow rates of exhaust, pure water, dry air, and cooling water are connected to the operation control unit 5, and the measured values of the flow rates of the utilities are sent to the operation control unit 5. The operation control unit 5 calculates the volume of each utility used in the substrate processing unit 100 from the measured value of the flow rate, and converts the usage amount of each utility into the power consumption from the volume of each utility and the corresponding conversion factor. Then, the converted power consumption [kWh] is calculated. For example, the operation control unit 5 calculates the converted power consumption of the exhaust by multiplying the volume of the gas exhausted from the substrate processing unit 100 by the corresponding conversion coefficient.

  After the processing of the substrate in the substrate processing unit 100 is completed, the operation control unit 5 operates at least one of the above-described flow rate control valves to operate utilities (exhaust gas, pure water) used in the substrate processing unit 100. , Dry air, or cooling water). By such an operation, the usage amount of the utility when the substrate processing unit 100 is in the standby mode can be reduced. Reduction of utility usage is equivalent to reduction of power consumption. In other words, by reducing the amount of utility used, the power consumption of the entire substrate processing apparatus can be reduced.

  The wattmeter 150 shown in FIG. 6 measures the power supplied from the power supply 103 to the substrate processing unit 100 and transmits the measured power value [W] to the operation control unit 5. The operation control unit 5 calculates the power consumption [kWh] in the substrate processing unit 100 from the measured power value. The operation control unit 5 records the power consumption in the substrate processing unit 100 in the storage device 210 of the operation control unit 5. Similarly, the operation control unit 5 records the converted power consumption calculated for each utility in the storage device 210 of the operation control unit 5. Furthermore, the operation control unit 5 displays on the display device 241 the power consumption and converted power consumption in the substrate processing unit 100 recorded as power consumption data.

  FIG. 7 is a graph of the power consumption and the converted power consumption displayed on the display device 241 of the operation control unit 5. The vertical axis represents power consumption [kWh], and the horizontal axis represents time. The power consumption shown in FIG. 7 is the sum of the power consumption in the substrate processing unit 100 and the converted power consumption calculated for each utility, that is, the total power consumption. As shown in FIG. 7, the operation control unit 5 can visualize the power consumption that varies with time, and can provide a graph that can contribute to the improvement of the operation method of the substrate processing apparatus.

  The operation control unit 5 can calculate the power consumption per substrate by dividing the integrated value of the total power consumption within a certain time by the number of substrates processed within that time. The power consumption per substrate can be used, for example, for evaluation of substrate polishing recipes and cleaning recipes. Similarly, the operation control unit 5 can also calculate the power consumption per substrate cassette (per lot). Furthermore, the operation control unit 5 can also calculate an integrated value of power consumption from a certain time point to the present time.

  The on-demand control function can be executed simultaneously with the above-described on-demand operation function. For example, after the substrate processing in the substrate processing unit 100 is completed, the operation control unit 5 issues a command to the power cut-off device 106 to cut off the power line 109 to the table motor 19 and the fan of the fan filter unit 122. The rotational speed of the motor 125 may be reduced. Thus, the combination of the on-demand operation function and the on-demand control function can efficiently reduce the overall power consumption of the substrate processing apparatus.

  FIG. 8 is a schematic diagram showing another embodiment for reducing the power consumption of the substrate processing apparatus. Since the configuration of the present embodiment that is not specifically described is the same as the configuration of the above-described embodiment, the redundant description is omitted. The substrate processing apparatus of this embodiment includes a multi-axis integrated amplifier 160 that is electrically connected to a plurality of motors M1, M2, and M3 of the substrate processing apparatus. Normally, electric power is supplied from the power source 103 to the motors M1, M2, and M3 through the multi-axis integrated amplifier 160. The multi-axis integrated amplifier 160 supplies regenerative power generated when one of the plurality of motors M1, M2, M3 is decelerating to the other one of the motors M1, M2, M3. It is configured. Such a multi-axis integrated amplifier 160 can be obtained on the market. In this embodiment, three motors are connected to the multi-axis integrated amplifier 160, but two motors or more than three motors may be connected to the multi-axis integrated amplifier 160.

  Motors M1, M2, and M3 connected to the multi-axis integrated amplifier 160 are the table motor 19 of the four polishing units 3A to 3D, the drive motor of the transfer robot (loader) 22, the drive motor of the first transfer robot 77, the first motor. 2 selected from the drive motor of the transfer robot 78, the drive motor of the linear transporters 6 and 7, the drive motor of the swing transporter 12, and the like. For example, the table motor 19 of the first polishing unit 3A and the table motor 19 of the second polishing unit 3B are connected to the multi-axis integrated amplifier 160. In this configuration, when the table motor 19 of the first polishing unit 3A is decelerated, the regenerative power generated in the table motor 19 passes through the multi-axis integrated amplifier 160 to the table motor 19 of the second polishing unit 3B. Supplied. Therefore, the overall power consumption of the substrate processing apparatus can be reduced. The regenerative power may be stored in the storage battery 121 shown in FIG.

  As shown in FIG. 9, the table motor 19 and the head motor 37A may be connected to the multi-axis integrated amplifier 160. When the rotation speed of the polishing table 30A is higher than the rotation speed of the polishing head 31A during the polishing of the substrate, the head motor 37A generates power. The generated electric power is supplied to the table motor 19 through the multi-axis integrated amplifier 160. Accordingly, the power consumption of the table motor 19 is reduced, and as a result, the overall power consumption of the substrate processing apparatus can be reduced.

  FIG. 10 is a schematic diagram showing another embodiment for reducing the power consumption of the substrate processing apparatus. Since the configuration of the present embodiment that is not specifically described is the same as the configuration of the above-described embodiment, the redundant description is omitted. As shown in FIG. 10, the first polishing unit 3A includes a pan 170 disposed around the polishing table 30A, a fluid conduit 171 extending downward from the bottom of the pan 170, and a gas-liquid separation connected to the fluid conduit 171. A tank 175, a water wheel 177 disposed in the fluid conduit 171, and a generator 179 connected to the water wheel 177 are provided.

  During polishing of the substrate, a polishing liquid (slurry) is supplied to the polishing pad 10 from the liquid supply nozzle 32A. Further, after polishing the substrate, pure water as a dressing liquid is supplied to the polishing pad 10 from the liquid supply nozzle 32A. After the pad dressing, the gas-liquid mixed fluid is supplied to the polishing pad 10 from the atomizer 34A. These fluids are collected in a pan 170 and guided to a gas-liquid separation tank 175 through a fluid conduit 171. The fluid is separated into gas and liquid in the gas-liquid separation tank 175. The gas is exhausted through the exhaust duct 181 and the liquid is exhausted through the drain 182.

  The fluid flowing through the fluid conduit 171 rotates the water turbine 177 and generates power in a generator 179 connected to the water turbine 177. The generated electric power may be supplied to any of the above-described motors of the substrate processing apparatus, or may be stored in the storage battery 121 shown in FIG. Thus, according to this embodiment, the potential energy of the fluid can be converted into electric power, and as a result, the overall power consumption of the substrate processing apparatus can be reduced. In the present embodiment, the water wheel 177 has a spiral shape. This type of water turbine 177 has the advantage of being able to rotate efficiently with a low head. In one embodiment, the water wheel 177 may be another type of water wheel. Although not shown, the second polishing unit 3B to the fourth polishing unit 3D may also have the configuration shown in FIG.

  The operation of the substrate processing apparatus is controlled by the operation control unit 5. In the present embodiment, the operation control unit 5 is configured by a dedicated computer or a general-purpose computer. FIG. 11 is a schematic diagram illustrating a configuration of the operation control unit 5. The operation control unit 5 includes a storage device 210 that stores programs, data, and the like, a processing device 220 such as a CPU (central processing unit) that performs operations according to the programs stored in the storage device 210, data, programs, and An input device 230 for inputting various information to the storage device 210, an output device 240 for outputting processing results and processed data, and a communication device 250 for connecting to a network such as the Internet are provided.

  The storage device 210 includes a main storage device 211 accessible by the processing device 220 and an auxiliary storage device 212 that stores data and programs. The main storage device 211 is a random access memory (RAM), for example, and the auxiliary storage device 212 is a storage device such as a hard disk drive (HDD) or a solid state drive (SSD).

  The input device 230 includes a keyboard and a mouse, and further includes a recording medium reading device 232 for reading data from the recording medium, and a recording medium port 234 to which the recording medium is connected. The recording medium is a computer-readable recording medium that is a non-transitory tangible material, such as an optical disk (eg, CD-ROM, DVD-ROM) or a semiconductor memory (eg, USB flash drive, memory card). is there. Examples of the recording medium reading device 232 include an optical drive such as a CD drive and a DVD drive, and a card reader. An example of the recording medium port 234 is a USB terminal. The program and / or data electrically stored in the recording medium is introduced into the operation control unit 5 via the input device 230 and stored in the auxiliary storage device 212 of the storage device 210. The output device 240 includes a display device 241 and a printing device 242.

  The operation control unit 5 operates according to a program electrically stored in the storage device 210. The program is recorded on a computer-readable recording medium that is a non-transitory tangible object, and is provided to the operation control unit 5 via the recording medium. Alternatively, the program may be provided to the operation control unit 5 via a communication network such as the Internet.

  The embodiment described above is described for the purpose of enabling the person having ordinary knowledge in the technical field to which the present invention belongs to implement the present invention. Various modifications of the above embodiment can be naturally made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Accordingly, the present invention is not limited to the described embodiments, but is to be construed in the widest scope according to the technical idea defined by the claims.

DESCRIPTION OF SYMBOLS 1 Housing 2 Load / unload part 3 Polishing part 3A, 3B, 3C, 3D Polishing unit 4 Cleaning part 5 Operation control part 6 1st linear transporter 7 2nd linear transporter 10 Polishing pad 11 Lifter 12 Swing transporter 16A Head Shaft 19 Table motor 20 Front load part 21 Rail mechanism 22 Transfer robot (loader)
30A, 30B, 30C, 30D Polishing tables 31A, 31B, 31C, 31D Polishing heads 32A, 32B, 32C, 32D Liquid supply nozzles 33A, 33B, 33C, 33D Dressers 34A, 34B, 34C, 34D Atomizer 35A Head arm 37A Head motor 38A Rotating shaft 39A Rotating motor 41 Carrier 43 Elastic film 45 Retainer ring 72 Temporary placement stages 73A and 73B First cleaning units 74A and 74B Second cleaning units 75A and 75B Drying unit 77 First transport robot 78 Second transport robot 80 First Lift shaft 81 Second lift shaft 85 Holding rollers 87, 88 Roll sponge (cleaning tool)
90, 91 Cleaning tool motors 95, 96 Upper rinse liquid supply nozzles 97, 98 Upper cleaning liquid supply nozzle 100 Substrate processing unit 101 Commercial power supply 103 Power supply 106 Power cut-off device 109 Power lines 110, 114 Exhaust ducts 111, 115 Flow rate control valve 113, 116 Flow meter 119 Solar panel 121 Storage battery 122 Fan filter unit (FFU)
123 Filter 124 Fan 125 Fan motor 130 Flow control valve 131 Flow meter 134 Flow control valve 135 Flow meter 140 Cooling water passage pipe 141 Flow control valve 142 Flow meter 150 Watt meter 160 Multi-axis integrated amplifier 170 Pan 171 Fluid conduit 175 Gas-liquid Separation tank 177 Water wheel 179 Generator 181 Exhaust duct 182 Drain 210 Storage device 241 Display devices D1, D2, D3, D4, D5 Pressure chambers G1, G2, G3, G4, G5 Fluid lines R1, R2, R3, R4, R5 Pressure Regulator K1, K2, K3, K4, K5 Flowmeter W Substrate

Claims (9)

Switch the operation mode of the substrate processing unit from standby mode to processing mode,
Processing the substrate in the substrate processing section,
After the processing of the substrate is completed, the operation mode of the substrate processing unit is switched from the processing mode to the standby mode, and the power line to at least one motor of the substrate processing unit is cut off. Driving method.   The substrate according to claim 1, wherein the at least one motor includes a table motor that rotates a polishing table for polishing the substrate and a head motor that rotates a polishing head for polishing the substrate. Operation method of the processing apparatus.   The method of operating a substrate processing apparatus according to claim 1, wherein the at least one motor includes a drive motor of a transfer robot for transferring the substrate.   The operation of the substrate processing apparatus according to any one of claims 1 to 3, wherein the at least one motor includes a cleaning tool motor that rotates a cleaning tool of a cleaning unit for cleaning the substrate. Method.   5. The method according to claim 1, further comprising: shutting off a power line to a drive motor of a loader for carrying the substrate into the substrate processing unit after the processing of the substrate is completed. A method for operating the substrate processing apparatus according to claim 1.   6. The method for operating a substrate processing apparatus according to claim 1, wherein the substrate processing unit is a polishing unit for polishing a substrate or a cleaning unit for cleaning the substrate. .   The method of operating a substrate processing apparatus according to claim 1, further comprising a step of reducing a flow rate of a utility used in the substrate processing unit after the processing of the substrate is completed. . The volume of the first utility used in the substrate processing unit is converted into power consumption to calculate the first converted power consumption,
The volume of the second utility used in the substrate processing unit is converted into power consumption to calculate the second converted power consumption,
Calculate power consumption in the substrate processing unit,
An operation method of a substrate processing apparatus, wherein the first converted power consumption, the second converted power consumption, and the power consumption in the substrate processing unit are recorded. The operation method of the substrate processing apparatus according to claim 8, wherein a graph of the first converted power consumption, the second converted power consumption, and the power consumption in the substrate processing unit is created.

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