JP2018182230A - Imprint apparatus, method of generating control data, and method of manufacturing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the superposition accuracy of a pre-existing area to be processed on a substrate and a pattern area newly formed on the area to be processed. An imprint device 1 of the present invention illuminates a mark 33 provided on a substrate 9 with illumination light, and detects light from the mark 33 illuminated by the illumination light, and by heating. It has a deforming means 24 for deforming the region 9a to be processed. The deforming means 24 has the shape of the pattern portion 10 based on the difference between the shape of the pattern portion 10 of the mold 7 and the shape of the area to be processed 9a and the calorific value distribution of the illumination light on the substrate 9 when the mark 33 is illuminated. The region 9a to be processed is deformed so that the difference between the shape of the region 9a to be processed and the shape of the region 9a to be processed is reduced. [Selection diagram] Fig. 8

Description

  The present invention relates to an imprint apparatus, a method of generating control data, and a method of manufacturing an article.

  An imprint apparatus is known as an apparatus for forming a fine pattern on a substrate for manufacturing a semiconductor device or the like. The imprint apparatus brings an imprint material on a substrate into contact with a mold having a pattern portion which is a portion on which a pattern is formed, and applies an energy for curing to the imprint material to cure on the substrate. It is an apparatus which forms the pattern of printing material.

  In Patent Document 1, parallel to the deformation of the pattern portion of the mold and the processing area based on the difference between the shape of the pattern portion of the mold and the shape of the processing area, the horizontal direction of the mold and the substrate is It is described that the alignment mark provided in the processing area for illumination detection is illuminated.

Japanese Patent Application Laid-Open No. 2016-060305

  In order to improve the overlay accuracy in the imprint apparatus, it is expected that the alignment between the pattern area of the mold and the processing area be performed with high accuracy. For that purpose, it is necessary to detect the alignment mark provided on the pattern portion of the mold and the processing area with high accuracy. The inventors of the present application have found out that while the examination for increasing the luminance of the illumination light illuminating the alignment mark is being promoted to improve the detection accuracy of the alignment mark, it is newly found that the region to be treated can be deformed by the illumination light. The

  The present invention has been made in view of the above-mentioned notice, and provides an imprint apparatus which is advantageous for improving the overlay accuracy of a region to be processed which is previously present on a substrate and a pattern of an imprint material to be newly formed thereon. Intended to be provided.

  The present invention is an imprint apparatus for forming a pattern of an imprint material on a processing target region of a substrate using a mold, wherein a mark provided on the substrate is illuminated by illumination light, and the illumination light is illuminated. A mark detection system for detecting light from the mark, and deformation means for deforming the processing area by heating, wherein the deformation means has a shape of the pattern portion of the mold and a shape of the processing area And the processing area such that the difference between the shape of the pattern portion and the shape of the processing area is reduced based on the difference between the above and the heat distribution of the illumination light on the substrate when the mark is illuminated. It is characterized in that

  According to the present invention, it is possible to improve the overlay accuracy of the region to be processed already formed on the substrate side and the pattern of the imprint material formed on the substrate.

It is a figure showing composition of an imprint device concerning a 1st embodiment. It is a figure which shows the structure of a deformation | transformation mechanism. It is a figure which shows the structure of a heating mechanism. It is FIG. 1 which shows the mode of pattern area vicinity. It is a flowchart which shows an imprint process. It is a figure which shows the thermal distribution information by alignment light. It is a figure which shows the temporary calorie | heat amount distribution information by a heating mechanism. It is a figure which shows calorie distribution information by a heating mechanism. It is FIG. 2 which shows the mode of pattern area vicinity. It is a figure which shows the deformation | transformation defect area | region by DMD. It is a figure explaining the change of the illumination position of alignment light. It is a figure which shows the manufacturing method of articles | goods.

First Embodiment
(Configuration of imprint apparatus)
The configuration of the imprint apparatus 1 will be described using FIGS. 1 to 4. In the present specification, the same members are denoted by the same reference numerals, and overlapping detailed description will be omitted. An axis in the vertical direction is a Z axis, and two axes orthogonal to each other in a plane perpendicular to the Z axis are an X axis and a Y axis.

  FIG. 1 is a view showing the arrangement of an imprint apparatus 1 according to the first embodiment. The imprint apparatus 1 is configured such that the photocurable imprint material 15 supplied on the pattern area 9a of the substrate 9 (on the processing area) is in contact with the mold 7 (mold). Is cured, and the cured imprint material 15 and the mold 7 are separated. Thereby, the pattern of the imprint material 15 is formed on the substrate 9. The process for forming the pattern of the imprint material 15 is called an imprint process.

  The irradiation unit 2 emits ultraviolet light (curing light) 2 a for curing the imprint material 15 in order to irradiate the imprint material 15 on the substrate 9. The ultraviolet light 2 a emitted from the irradiation unit 2 is reflected vertically downward by an optical element (for example, a dichroic mirror) 29, transmitted through the mold 7, and irradiated to the imprint material 15.

  The mold 7 has a pattern portion 10 in which a three-dimensional pattern is formed on the surface facing the substrate 9. A pattern of the imprint material 15 having the same size as that of the pattern portion 10 is formed on the substrate 9 in one imprint process.

  In the present embodiment, the case where the pattern area 9a which is the processing area is the same size as the shot area is described as an example, but the pattern area 9a may be the size of a plurality of shot areas. The shot area is a unit area of the underlayer on which the pattern has already been formed by the exposure device or the like. The size of one shot area is, for example, about 26 mm × 33 mm. In one shot area, one or more patterns of chip sizes desired by the user are formed.

  The outer peripheral shape of the mold 7 is a rectangular shape, and has a cylindrical recess on the opposite side to the substrate 9. A sealed space 13 is formed by the recess, the opening 12 of the mold chuck 16 that holds the mold 7, and the transparent member 14. When the pattern portion 10 and the imprint material 15 are brought into contact with each other, the pressure of the space 13 is adjusted by a pressure adjusting device (not shown) so that the pattern portion 10 is deformed to be convex downward. Contact with the imprint material 15 from the center. Thereby, the mixture of air bubbles between the pattern portion 10 and the imprint material 15 is suppressed, and the concave portion of the pattern portion 10 is easily filled with the imprint material 15.

  When the imprint material 15 is a photocurable material as in the present embodiment, the mold 7 and the transparent member 14 must be materials that can transmit the ultraviolet light 2a. Furthermore, it must be a material that can transmit the heating light 24 a emitted from the heating mechanism (deforming means) 24 described later. For example, glasses such as quartz glass, silica glass, calcium fluoride, magnesium fluoride, and acrylic glass may be used. The material of the mold may be a resin such as sapphire, gallium nitride, polycarbonate, polystyrene, acrylic or polypropylene. Or these arbitrary laminated materials may be sufficient.

  The mold stage 3 includes a mold chuck 16 for holding the mold 7 by vacuum suction or electrostatic force, a drive mechanism 17 for moving the mold 7 together with the mold chuck 16, and a deformation mechanism (deformation means) 18 for deforming the pattern portion 10 Have. The mold chuck 16 and the drive mechanism 17 have an opening 12 at the center so that the ultraviolet light 2 a from the irradiation unit 2 reaches the substrate 9.

  The drive mechanism 17 moves the mold 7 in the Z-axis direction. As a result, an operation (pressing operation) for bringing the mold 7 and the imprint material 15 into contact with each other and an operation for releasing the mold 7 and the imprint material 15 (release operation) are performed. As an actuator of the drive mechanism 17, for example, there is a linear motor or an air cylinder. The drive mechanism 17 may be composed of a plurality of drive systems such as a coarse movement drive system and a fine movement drive system. In addition to the Z-axis direction, a drive mechanism may be provided to move the mold 7 in the X-axis direction and the Y-axis direction, and in the rotational direction around each axis. Thereby, highly accurate positioning of the mold 7 is possible.

  The substrate stage 4 positions the substrate 9 together with the chuck (not shown) for holding the substrate 9 by vacuum suction or electrostatic force, the top plate 19 on which the chuck is mounted, and the top plate 19 in the XY plane. And a drive mechanism 20 of

  The drive mechanism 20 has, for example, a linear motor or an air cylinder as an actuator. The drive mechanism 20 may include a plurality of drive systems such as a coarse movement drive system and a fine movement drive system. In addition to the X-axis direction and the Y-axis direction, a drive mechanism may be provided to move the substrate 9 in the Z-axis direction and in the rotational direction around each axis. This enables highly accurate positioning of the substrate 9. The position of the top 19 is measured by a mirror 30 and an interferometer 31 provided on the side of the top 19.

  The reference mark 21 provided on the top 19 is used to measure the horizontal position of the held mold 7 or the horizontal position of the substrate 9 with respect to the top 19.

  An illuminance meter 37 provided on the top 19 receives ultraviolet light 2 a from the irradiation unit 2 to measure the illuminance.

  The forming means for forming the pattern of the imprint material 15 on the pattern area 9 a has means for performing at least a pressing operation, curing of the imprint material 15, release operation and the like. In the present embodiment, the forming means includes at least the drive mechanism 17, the irradiation unit 2, and the supply unit 5.

  The supply unit 5 supplies the uncured imprint material 15 in an amount required for one imprint process to the pattern area 9a. That is, every time the imprint process is completed, the substrate stage 4 reciprocates the substrate 9 between the lower position of the mold 7 and the lower position of the supply unit 5.

  In order to improve the overlay accuracy of the pattern already formed in the pattern area 9a and the pattern of the imprint material 15 newly formed, the positional deviation in the horizontal direction between the pattern portion 10 and the pattern area 9a can be reduced; It is necessary to reduce these differences in shape.

  First, a configuration for reducing positional deviation in the horizontal direction between the pattern unit 10 and the pattern area 9a will be described.

  The imprint system 1 is an alignment system (mark detection for accurately determining the amount of positional deviation between the pattern portion 10 and the pattern area 9 a in order to reduce the positional deviation in the horizontal direction between the pattern portion 10 and the pattern area 9 a System 26 and a control unit 100.

  The alignment system 26 illuminates the substrate 9 with alignment light (illumination light), and detects light from an alignment mark 33 (hereinafter referred to as mark 33) provided on the substrate 9 and illuminated by the alignment light. The alignment system 26 includes a light source 11, a scope 22, a drive mechanism 23, and an optical system 25. The light source 11 illuminates the mold 7 and the substrate 9 with alignment light via the scope 22.

  In the present embodiment, the alignment marks 32 (hereinafter referred to as marks 32) provided in the pattern section 10 and the marks 33 provided in the pattern area 9a are diffraction gratings formed of stripe patterns having different pitches, for example. Moire fringes are formed on the image plane of the scope 22 by causing the diffracted light from the mark 32 illuminated by the alignment light and the diffracted light from the mark 33 to interfere with each other. The optical system 25 includes an optical element for guiding the diffracted light from the mark 32 and the diffracted light from the mark 33, and the drive mechanism 23 is an imaging field of an imaging element (not shown) disposed on the image plane of the scope 22. The scope 22 is driven in the horizontal direction so that the moire fringes fit inside.

  The control unit 100 analyzes the detection result (imaging result) of the moiré fringes of the imaging element to detect the positional deviation amount (ΔX, ΔY) between the pair of marks 32 and the mark 33 per detection result of one scope 22 Be done. Although not illustrated in FIG. 1, in the present embodiment, the imprint apparatus 1 includes scopes 22, drive mechanisms 23, and an optical system 25 as many as the number of pairs of marks 32 and marks 33. Then, the control unit 100 calculates displacement amounts (ΔX, ΔY, ΔωZ) between the pattern unit 10 and the pattern area 9 a based on the detection results of the plurality of scopes 22.

  The alignment light is light of a wavelength that does not cure the imprint material 15. In order to be less susceptible to detection errors due to the process of the substrate 9, the alignment light may be light including continuous or discrete wavelength bands in the wavelength band of 400 nm to 1000 nm.

  In the present embodiment, the alignment system 26 is a detection target of the moiré fringes formed by the marks 32 and the marks 33, but the detection target of the alignment system 26 is not limited to this. For example, the marks 32 and 33 may be marks for overlay inspection (Box in Box etc.) as detection targets.

  It is not essential for the alignment system 26 to simultaneously detect the light from the mark 32 and the light from the mark 33, and the alignment light may separately detect the light from the mark 32 and the mark 33 illuminated. In this case, the difference between the position of the mark 32 and the position of the mark 33 may be detected as a positional deviation amount.

  The imprint apparatus 1 performs detection of moire fringes formed by diffracted light from the marks 32 and 33 and alignment of the mold 7 and the substrate 9 from a predetermined timing until immediately before curing the imprint material 15. When the alignment is performed before the mold 7 and the imprint material 15 are brought into contact with each other, the marks to be detected may be changed before and after the contact with the imprint material 15.

  Next, a configuration for correcting the shapes of the pattern portion 10 and the pattern area 9a to reduce the difference between the shape of the pattern portion 10 and the shape of the pattern area 9a will be described. Even if the outer peripheral shape of the surface on the side facing the substrate 9 of the pattern portion 10 is as designed, the shape of the pattern region 9a is often deformed into various shapes due to the influence of the semiconductor process. In addition to simple components such as magnification components, they may be deformed into shapes including higher-order components such as parallelograms and trapezoidal components. The imprint apparatus 1 has a deformation mechanism 18 and a heating mechanism 24 in order to reduce the difference between the shape of the pattern portion 10 and the shape of the pattern area 9 a.

  The deformation mechanism 18 has pressing portions 18a to 18p (shown in FIG. 2) disposed so as to surround the side surfaces of the mold 7, and applies force in the horizontal direction to the side surfaces of the mold 7 by the pressing portions 18a to 18p. Do. The shape of the pattern portion 10 is corrected by individually controlling the force applied using the pressing portions 18a to 18p. The pressing portions 18a to 18p are linear motors, piezo actuators, or the like. The deformation mechanism 18 drives the pressing unit 18 in accordance with control data indicating a control amount determined by the control unit 103 described later. The control amount for the pressing portions 18a to 19p is a current command value corresponding to the target position of the tip of the pressing portions 18a to 18p or the target force given by the pressing portions 18a to 18p.

  The heating mechanism 24 corrects the shape of the pattern area 9a by heating the pattern area 9a while controlling the illuminance distribution of the heating light 24a.

  The detailed configuration of the heating mechanism 24 will be described with reference to FIG. In FIG. 3, the bending of the optical path by the mirror 38 of FIG. 1 is omitted to simplify the description.

  The light source 61 emits light for heating. The light for heating is preferably light of a wavelength at which the uncured imprint material 15 is not cured and is easily absorbed as heat by the substrate 9. For example, 400 nm to 2000 nm. The light from the light source 61 enters a DMD (Digital Micro-mirror Device) 64 through the optical fiber 62 and the optical system 63. Only light selectively reflected by the DMD 64 (hereinafter referred to as heating light 24a) is irradiated onto the substrate 9 through the projection optical system 65 for guiding the heating light 24a to the pattern area 9a.

  For the light source 61, for example, a high power semiconductor laser is used. In the optical system 63, a condensing optical system (not shown) for condensing the light emitted from the light source 61, a uniform illumination optical system for illuminating the DMD 64 by equalizing the intensity of the light from the condensing optical system Not shown). The uniform illumination optical system includes an optical element such as, for example, an MLA (Micro Lens Array) (not shown).

  The DMD 64 includes a plurality of micro mirrors (not shown) arranged in two dimensions. The DMD 64 tilts each micro mirror at an angle of -12 degrees (ON state) or +12 degrees (OFF state) with respect to the arrangement surface of the micro mirrors based on the instruction of the irradiation control unit 66.

  The light reflected by the micromirror in the ON state is imaged on the substrate 9 by the projection optical system 65 which makes the DMD 64 and the substrate 9 an optically conjugate relationship as heating light 24 a. The light reflected by the micromirror in the OFF state is reflected in the direction that does not reach the substrate 9.

  The irradiation control unit 66 has a CPU, and controls the DMD 64 based on a control amount instructed from a control unit (generation unit, acquisition unit) 103 described later. The control data for the heating mechanism 24 is an illuminance profile indicating a drive command of each micro mirror in the ON state or the OFF state. In the pattern area 9a, the light energy of the heating light 24a is converted into heat energy, and the heating mechanism 24 causes the pattern area 9a to generate heat distribution according to the illuminance profile, and the shape of the pattern area 9a becomes a desired shape It can be deformed.

  The mold 7 has the property of stretching in the other direction when a force is applied in one direction. Therefore, when high overlay accuracy is required, or when the pattern area 9a is deformed into a shape including high-order components, not only the deformation mechanism 18 but also the heating mechanism 24 is used to reduce the minute shape difference. I am trying to

  FIG. 4 is a view showing the relationship between the mark 33, the illumination area 35 by the heating mechanism 24, and the pattern area 9a. A case where six chip areas 34 are provided in the pattern area 9a is illustrated, and marks 33 are formed in the vicinity of the four corners of the pattern area 9a, which are portions not overlapping the chip area 34. The illumination area 35, which is the largest area heated by the heating mechanism 24, also includes an area 36 adjacent to the pattern area 9a inside the pattern area 9a and outside the pattern area 9a.

  Since the shape in the vicinity of the outer periphery of the pattern area 9a can not be accurately corrected when only the inside of the pattern area 9a is heated, the area 36 is also heated so that the shape of the pattern area 9a is accurately corrected.

  As in the case of the DMD 64, an element other than the DMD 64 may be used as long as the element can be deformed with a distribution to the pattern area 9a. For example, an LCD (Liquid Crystal Display) may be used.

  The control unit 105 is connected to the irradiation unit 2, the heating mechanism 24, the mold stage 3, the substrate stage 4, the supply unit 5, the alignment system 26, the interferometer 31, and the storage unit 106 via a communication line.

  The control unit 105 includes a CPU, a memory, and the like, reads a program shown in the flowchart of FIG. 5 described later stored in the storage unit 106, and controls the aforementioned control object connected to the control unit 105. Run. Further, the control unit 105 reads out from the storage unit 106 or writes in the storage unit 106 a variable necessary for control of the control target.

  Parts of the control unit 105 that execute the main functions are illustrated by the control units 100, 101, 103. The control units 100, 101, and 103 can mutually transmit and receive an output.

  The control unit 100 calculates the positional deviation between the pattern unit 10 and the pattern area 9 a from the detection result of the alignment system 26. The control unit 101 controls the substrate stage 4 based on the calculation result of the control unit 100 and the measurement result of the interferometer 31.

  The control unit 103 controls the pattern unit 10 and the pattern area based on the heat quantity distribution information of the alignment light when the alignment system 26 detects the moiré fringes, and the difference between the shape of the pattern unit 10 and the shape of the pattern area 9a. The shape correction amount of 9a is calculated. Here, the heat quantity distribution information is information indicating the distribution of the heat quantity in a region including at least the illumination region 35. The heat quantity distribution information may be, for example, a set of information in which the position of a minute area in the illumination area 35 is associated with the pixel value corresponding to the quantity of heat generated in the minute area. Then, the control unit 103 generates control data for controlling the heating mechanism 24 and the deformation mechanism 18 for each of the heating mechanism 24 and the deformation mechanism 18 based on the calculated shape correction amount.

  The illuminance profile is generated from the heat quantity distribution information corresponding to the desired shape correction amount of the pattern area 9a (see FIGS. 7 to 8). In the drawing, a minute area (unit area) of one section of the heat quantity distribution information corresponds to an area irradiated with the heating light 24a by a plurality of micro mirrors, and corresponds to each section from the temperature of the heat quantity to be generated in each section. It is calculated from the usage rate [%] of the micromirrors. Depending on the usage rate, the time during which each micro mirror is in the ON state, and the distribution of the mirrors among the plurality of micro mirrors in the ON state and the micro mirrors in the OFF state at the same timing are changed.

  The illuminance profile is generated so that as the amount of heat to be applied to the pattern area 9a increases, more micromirrors in the ON state are generated at the same timing, and the irradiation time of the heating light 24a becomes longer.

  The deformation mechanism 18 corrects the shape of the pattern unit 10 based on the current command value indicated by the generated control data, and the heating mechanism 24 controls the DMD 64 based on the illuminance profile indicated by the generated control data.

  The control unit 105 may be installed in the same housing as the other components of the imprint apparatus 1 or may be installed outside the housing. The control unit 105 may be configured with a control board that is different for each function, and the control unit 105 may be an assembly thereof, or may be configured with the same control board including a plurality of functions.

  The storage unit 106 generates shape difference information on the shape of the pattern unit 10 and the shape and difference of the pattern area 9a, heat distribution information of the alignment light by the light source 11, the program of the flowchart of FIG. The necessary information is stored. The shape difference information may be, for example, a set of data of differences between a first position in the plane of the lower surface of the pattern portion 10 and a second position in the plane of the corresponding pattern area 9a. The difference data may be a component of a vector (Δx, Δy) from the first position to the second position, or may be the magnitude of the vector (Δx, Δy).

  The shape difference information between the pattern unit 10 and the pattern area 9a is (i) information automatically input from an apparatus outside the imprint apparatus 1 or (ii) input from the user via the interface.

  For example, in the case of (i), the information input to the storage unit 106 is the shape correction of the pattern unit 10 and the pattern area 9a with respect to the substrate 9 which has undergone the same process as the substrate 9 to be imprinted. It is an inspection result by the overlay inspection apparatus after performing the imprint process. For example, in the case of (ii), the shape difference information is information on the difference between the design shape of the pattern portion 10 and the shape of the pattern area 9a, or the shapes of the pattern portion 10 and the pattern area 9a were measured by an external measuring device. It is the information of the difference of a result.

  Information necessary for generating the illuminance profile includes the size of the pattern area 9a, the amount of deformation of the substrate 9 per unit heat quantity, the luminance of the heating light 24a, the relationship between the illuminance of the heating light 24a and the temperature of the substrate 9, and alignment light The relationship between the illuminance and the temperature of the substrate 9 or the like.

(Imprinting method)
Next, the imprint method according to the present embodiment will be described with reference to the flowchart shown in FIG. The heating mechanism 24 corrects the shape of the pattern area 9a based not only on the difference between the shape of the pattern portion 10 and the shape of the pattern area 9a but also on the heat distribution of the alignment light.

  In S101, a transport mechanism (not shown) carries the substrate 9 into the imprint apparatus 1.

  In step S102, the control unit 103 acquires the shape of the pattern unit 10 and the shape difference information of the pattern area 9a from the storage unit 106.

  In S103, the control unit 103 acquires heat distribution information of the alignment light stored in the storage unit 106. The heat quantity distribution information of the alignment light according to the present embodiment is shown in FIG. FIG. 6 is a view showing the heat quantity distribution generated in the illumination area 35 of the heating light when the alignment light is illuminated on the four marks 33 of the pattern area 9a. Each grid is a unit area of the illumination area 35. FIG. 6 shows that a large amount of heat is generated in the order of the dark area (area a) to the light area (area g). That is, it shows that heat is generated in the vicinity of the mark 33 more than the other regions.

  In S104, the control unit 103 determines the shape correction amount of the pattern unit 10 and the pattern area 9a based on the information acquired in S102 and S103. That is, it is calculated how much each position in the pattern section 10 and in the pattern area 9a should be shifted in the X and Y directions. The shape correction amount is determined such that the difference between the shape of the pattern portion 10 and the shape of the pattern area 9a approaches zero (so that the shape difference is reduced).

For example, shift amounts (Δd 1, Δd 2,...) Of each position in the pattern section 10 after shape correction with respect to an ideal rectangular shape, and each value in the pattern area 9 a after shape correction with respect to an ideal rectangular shape Difference with the deviation amount (Δd1 ′, Δd2 ′,...) {(Δd1−Δd1 ′), (Δd2−Δd2 ′),.
First, calculate Then, (.DELTA.d1, .DELTA.d2,...) And (.DELTA.d1 ', .DELTA.d2',...) Are calculated such that the sum of squares of each term of equation (1) is minimized. The control unit 103 calculates, from the calculation results, the difference in the shape of the pattern unit 10 before and after the shape correction and the difference in the shape of the pattern area 9a before and after the shape correction as the respective shape correction amounts.

  In step S105, the control unit 103 generates control data necessary for shape correction of the pattern unit 10 and the pattern area 9a based on the shape correction amount determined in step S104.

  At this time, the control unit 103 determines control amounts for the pressing units 18 a to 19 p corresponding to the shape correction amount of the pattern unit 10 calculated in S104.

  Furthermore, before the determination of the illuminance profile, the control unit 103 first determines heat amount distribution information corresponding to the shape correction amount of the pattern area 9a calculated in S104. The heat quantity distribution information obtained at this stage is temporary heat quantity distribution information obtained based on only the shape difference information of the pattern portion 10 and the pattern area 9a. The said temporary calorie | heat amount distribution information is shown in FIG. It is heat amount distribution information which shows that a large amount of heat is given from the right side to the left side.

  However, when the heating light 24a is applied based on the illuminance profile corresponding to the temporary heat distribution information shown in FIG. 7, the heat generated by the illumination of the alignment light is also added to the vicinity of the mark 33, so the vicinity of the mark 33 is excessive. It will warm and deform. Therefore, the control unit 103 corrects the heat quantity distribution information so that the heat quantity to be applied by the heating light 24a becomes the difference between the provisional heat quantity distribution information shown in FIG. 7 and the heat quantity distribution information of alignment light shown in FIG. .

  That is, in each section, the heat quantity distribution information as shown in FIG. 8 is generated by subtracting the heat quantity of the sections corresponding to the same position in FIG. 7 and FIG. 6, and the illuminance profile is corrected based on the corrected heat quantity distribution information. Decide. The heat quantity distribution information after correction is information indicating that the pattern area 9a is heated with a heat quantity smaller than the tentative heat quantity distribution information in the vicinity of the mark 33.

  In S106, the supply unit 5 supplies the imprint material 15 to the pattern area 9a.

  In S107, the substrate stage 4 moves the substrate 9 to a position where the pattern area 9a to which the imprint material 15 is supplied faces the mold 7, and the mold stage 3 lowers the mold 7 so that the pattern portion 10a and the imprint material Contact with 15 (pressing operation).

  In S108, the deformation mechanism 18 starts the shape correction of the pattern area 9a of the pattern unit 10 based on the control amount determined by the control unit 103 in S105 based on the illuminance profile determined in S105 by the control unit 103. Do. Thereby, the difference between the shape of the pattern portion 10 and the shape of the pattern area 9a is reduced. The shape correction operation is continuously performed until the imprint material 15 is cured.

  In S109, the alignment system 26 illuminates the alignment light on the marks 32 and 33 to detect moire fringe marks. Then, the control unit 100 calculates the amount of positional deviation in the horizontal direction based on the detection result, and the substrate stage 4 moves the substrate 9 so as to offset the positional deviation. Due to the illumination of the alignment light, the vicinity of the mark 33 is slightly deformed, and the difference between the shape of the pattern portion 10 and the shape of the pattern area 9a is reduced further than at the stage of S108.

  In S110, the irradiation part 2 injects the ultraviolet light 2a and hardens the imprint material 15 at the timing when the recess of the pattern part 10 is completely filled with the imprint material 15.

  In S111, the mold stage 3 lifts the mold 7 to separate the pattern portion 10a from the imprint material 15 (mold release operation). The alignment system 26 ends the illumination of the alignment light, and the heating mechanism 24 ends the irradiation of the heating light 24 a.

  In S112, it is determined whether or not there is a pattern area 9a in which the pattern of the cured imprint material 15 is not formed by the control unit 105, and if there is, the processing of S106 to S112 is repeated. If it is determined in S112 that there is no pattern area 9a in which the pattern of the imprint material 15 is not formed, the program ends.

  The heating mechanism 24 deforms the pattern area 9 a based on the difference between the shape of the pattern portion 10 and the shape of the pattern area 9 a and the heat quantity distribution of the alignment light on the substrate 9. More specifically, in the illuminance profile generated based on the information obtained by correcting the heat amount distribution generated based on the difference between the shape of the pattern portion 10 and the shape of the pattern region 9a based on the heat amount distribution of the alignment light. Based on the pattern area 9a is deformed.

  Compared with the case where the pattern area 9a is deformed based on only the shape difference information, excessive deformation of the vicinity of the mark 33 can be suppressed. As a result, the overlay accuracy of the pattern area 9 a and the pattern of the imprint material 15 newly formed on the substrate 9 can be improved.

  Although S104 shows the case where the heat quantity distribution information of the alignment light is subtracted from the heat quantity distribution information obtained from the difference in shape, the method of calculating the illuminance profile after correction is not limited to this. For example, based on the result of subtracting the usage rate of the micro mirror in each section corresponding to the heat distribution information of the alignment light from the usage rate of the micro mirror in each section of the heat distribution information obtained from the difference in shape. An illumination profile may be determined.

  Although the case where the square sum of each term becomes the minimum was mentioned as an example when the difference of the shape of Formula (1) becomes the smallest in S104, the application scope of the present invention is not limited to this. The sum of the terms in the equation (1) may be minimized, or the displacement amount corresponding to a representative region may be minimized. Alternatively, each term of equation (1) may be weighted.

  The processes of S102 to S105 may be performed before the substrate 9 to be imprinted is carried into the imprint apparatus 1.

  Either of the steps S102 and S103 may be performed first. Either of the steps S108 and S109 may be performed first.

Second Embodiment
The imprint apparatus 1 according to the second embodiment is the same as that of the first embodiment except for the processing contents performed by the control unit 103 in S104 and S105 of the above-described imprint processing.

  In the first embodiment, the shape change of the pattern area 9a caused by the heat distribution of the alignment light is corrected only by the heating mechanism 24 in the shape correction error. The control amount and the illuminance profile of the heating mechanism 24 are corrected.

  The processing content performed instead of S104 is demonstrated. First, the control unit 103 calculates the amount of change in shape of the pattern area 9 a due to the illumination of the alignment light, based on the heat quantity distribution information of the alignment light on the substrate 9. Next, the shape difference information is corrected by subtracting the amount of change in shape of the pattern area 9a caused by the heat quantity distribution by the alignment light from the shape difference information acquired in S102. Thereafter, based on the shape difference information after correction, the shape correction amounts of the pattern portion 10 and the pattern area 9a are determined in the same manner as in the first embodiment.

  The processing content performed instead of S105 is demonstrated. The control unit 103 determines control amounts necessary for shape correction of the pattern unit 10 and the pattern area 9a, based on the shape correction amounts of the pattern unit 10 and the pattern area 9a determined in S104. Since the change in shape of the pattern area 9a due to the heat distribution of the alignment light is already taken into consideration, the control unit 103 newly performs correction based on the heat distribution of the alignment light such as S105 when determining the illumination profile of the heating mechanism 24. Absent.

  Thereby, the heating mechanism 24 corrects the shape of the pattern area 9a so that the illuminance of the heating light 24a is reduced with respect to the area illuminated with the alignment light as compared with the case where the heat quantity distribution of the alignment system 26 is not considered. Further, the deformation mechanism 18 corrects the shape of the pattern portion 10 to an expanded shape as compared with the case where the heat quantity distribution of the alignment system 26 is not considered.

  Thus, in the present embodiment, the deformation mechanism 18 and the heating mechanism 24 deform the pattern area 9a based on the difference between the shape of the pattern portion 10 and the shape of the pattern area 9a and the heat quantity distribution of the alignment light in the substrate 9. Let As a result, the difference between the shape of the pattern portion 10 and the shape of the pattern area 9 a is reduced, and the overlay accuracy of the pattern area 9 a and the pattern of the imprint material 15 newly formed on the substrate 9 can be improved.

Third Embodiment
The imprint apparatus 1 according to the third embodiment differs from the first and second embodiments in that the change in shape of the pattern area 9a caused by the heat quantity distribution of alignment light in the substrate 9 is corrected only by the deformation mechanism 18. In the following description, the imprint apparatus 1 does not have the heating mechanism 24 in order to simplify the description.

  At this time, the control unit 103 determines the shape correction amount of the pattern unit 10 based on the shape difference information of the pattern unit 10 and the pattern area 9a and the heat distribution information of the alignment light in S104 of the above-described imprint processing. Specifically, based on the heat quantity distribution information by the alignment light acquired in S103, the shape change amount of the pattern area 9a caused by the heat quantity distribution is calculated. Then, the shape correction amount of the pattern portion 10 is determined by subtracting the shape change amount due to the alignment light calculated from the shape difference information between the pattern portion 10 and the pattern area 9 a. In step S108, the control unit 103 determines the control amounts of the pressing units 18a to 18p necessary for shape correction of the pattern unit 10 based on the obtained shape correction amounts.

  In the heat distribution of the alignment light as shown in FIG. 6, the four corners of the pattern area 9a are likely to extend outward. Therefore, the control unit 103 reduces the force applied from the pressing units 18a, 18d, 18e, 18h, 18i, 18l, 18m and 18p to the mold 7 as compared with the case where the heat distribution of the alignment light is not considered. When the deformation mechanism 18 causes the four corners of the pattern portion 10 to extend outward, the difference between the shape of the pattern portion 10 and the shape of the pattern area 9a can be reduced.

  As described above, in the third embodiment, the deformation mechanism 18 deforms the pattern area 9 a based on the difference between the shape of the pattern portion 10 and the shape of the pattern area 9 a and the heat quantity distribution of the alignment light in the substrate 9. Thereby, as compared with the case of correcting the shape of the pattern portion 10 without considering the heat distribution of the alignment light, the overlay accuracy of the pattern region 9a and the pattern of the imprint material 15 newly formed on the substrate 9 It can improve.

  The imprint apparatus 1 according to the present embodiment may have the heating mechanism 24. In this case, the heating mechanism 24 may heat the pattern area 9a according to the illuminance profile generated based on the shape difference information of the pattern portion 10 and the pattern area 9a without considering the heat quantity distribution information of the alignment light.

Fourth Embodiment
The position of the pattern area 9 a may be misaligned within the XY plane of the substrate 9 due to the heat distribution of the alignment light in the substrate 9. The displacement in the XY plane includes at least one of translational displacement and rotational displacement. For example, as shown in FIG. 9, when the marks 33 are not line symmetrical in the vertical and horizontal directions of the pattern area 9a, the pattern area 9a may be rotationally deviated.

  When the pattern area 9a shifts so that the moiré fringes formed by the diffracted light from the marks 32 and 33 do not enter the imaging field of view of the imaging device of the scope 22, the substrate stage to search for a position where the moiré fringes can be detected. 4 needs to move the substrate 9. Therefore, the process of S109 of the imprint process takes too much time.

  Therefore, in the imprint apparatus 1 according to the fourth embodiment, the substrate stage 4 is in a direction (XY plane direction) along the substrate 9 of the pattern area 10 and the pattern area 9a based on the heat quantity distribution information of the alignment light in the substrate 9 Functions as a correction unit that corrects the relative position of

  In step S102 of the above-described imprint process, the control unit 103 determines whether positional deviation occurs in the XY plane of the pattern region 9a from the heat quantity distribution information when acquiring the heat quantity distribution information of the alignment light. When a positional deviation occurs, the control unit 103 calculates the direction and amount of positional deviation of the pattern area 9a. Based on the calculation result, the control unit 101 moves the substrate 9 in a direction (offset direction) to reduce the relative positional deviation between the pattern portion 10 and the pattern area 9a caused by the heat quantity distribution of the alignment light in the substrate 9 on the substrate stage 4 Let

  Instead of the substrate stage 4 or together with the substrate stage 4, the mold stage 3 may be used as a correction means for correcting the relative position of the pattern portion 10 and the pattern area 9a in the direction (XY plane direction) along the substrate 9 .

  As a result, the overlay accuracy of the pattern area 9 a and the pattern of the imprint material 15 newly formed on the substrate 9 can be improved. Furthermore, even if the positional displacement of the pattern area 9a occurs due to the heat input of the alignment light, the alignment between the pattern portion 10 and the pattern area 9a can be performed quickly.

  When the shape change of the pattern area 9a is also caused due to the heat quantity distribution of the alignment light in the substrate 9, the shape of the pattern portion 10 and the shape of the pattern area 9a are implemented by implementing any of the first to third embodiments. It is preferable to reduce the difference between

Fifth Embodiment
When a part of micro mirrors of the DMD 64 breaks down and the mirror can not be turned ON, there may be a case where only a part of the area can not be heated as the area 40 shown in FIG.

  Therefore, in the present embodiment, the alignment system 26 compensates for deformation defects caused by the heating mechanism 24. Specifically, the alignment system 26 selects at least one of the illuminance distribution of the alignment light, the illumination range, the luminance, and the position of the illumination area based on the information indicating the position where the deformation is not good due to the heating mechanism 24. By changing, the deformation failure due to the heating mechanism 24 is compensated. In the present specification, "deformation is defective" does not mean only when the pattern area 9a can not be deformed at all, but the heating mechanism 24 operates normally at least a part of the pattern area 9a. It also includes cases where it can not be deformed as much as it does.

  FIG. 11 is a diagram for explaining the change of the illumination position of the alignment light. For example, if the DMD 64 can not heat the area 40, the illumination area is changed from the area 41 to the area 42. That is, by bringing the center position of the illumination area close to the position where the heating mechanism 24 can not heat it, the deformation failure due to the heating mechanism 24 is compensated. Even if the illumination area is changed to the area 42, the alignment system 26 can observe the moiré fringes generated by the marks 33 because the mark 33 is included in the illumination area.

  When the alignment system 26 includes a plurality of light sources 11 having different luminances, the alignment system 26 is heated by switching to the light source 11 having a higher luminance than the case of illuminating the alignment light just for observing the moire fringes. Deformation defects of the mechanism 24 may be compensated. As compared with the case where the light source 11 is not switched, the amount of heat to be given to the region 40 can be compensated with high accuracy.

  In the case where the alignment system 26 includes means capable of changing the illuminance distribution such as DMD (not shown) in the optical path of the alignment light, the region where the deformation of the heating mechanism 24 becomes defective may be irradiated with the alignment light. The illuminance distribution may be changed.

  The alignment system 26 may expand the illumination range so as to include the area 40 which can not be heated by the heating mechanism 24 to compensate for the deformation failure of the heating mechanism 24. The alignment system 26 may compensate for the deformation defect of the heating mechanism 24 by combining the change of the illuminance distribution, the change of the illumination range, the change of the luminance, and the change of the position of the illumination area of the alignment light. .

  The control unit 103 generates an illuminance profile based on the illuminance distribution of the changed alignment light, the illumination range, the luminance, and the heat quantity distribution generated on the substrate 9 according to the position of the illumination area.

  In the case where the area 40 where the heating mechanism 24 can not be heated occurs at a position away from the mark 33 and the pattern area 9a can be continuously deformed by the residual heat, the alignment system 26 temporarily Detection of the light may be stopped. The alignment system 26 may detect the light from the mark 33 after the region 40 is heated to the same degree or more as in the case of heating by the heating mechanism 24.

Sixth Embodiment
In the imprint apparatus according to the present embodiment, the alignment system 26 controls the illuminance distribution of the alignment light based on the difference between the shape of the pattern unit 10 and the shape of the pattern area 9a. That is, the control unit 103 determines the relationship between the illumination time of the alignment light and the illumination region based on the shape difference information between the pattern unit 10 and the pattern area 9a acquired by the control unit 103, and alignment is performed based on the determined result. A system 26 illuminates the substrate 9. The alignment system 26 sequentially or alternately performs the deformation of the pattern area 9 a and the illumination of the marks 33. In the case where the substrate 9 is a material that easily stores heat, the pattern area 9a remains deformed due to the residual heat when it is illuminated once.

  The alignment system 26 may perform shape correction so as to contract the pattern area 9a by arranging the center position of the illumination area of the alignment light outside the pattern area 9a. Alternatively, the alignment system 26 may perform shape correction such as expanding the pattern area 9a by arranging the center position of the illumination area of the alignment light outside the pattern area 9a.

  Thereby, pattern region 9a is deformed using alignment system 26 to reduce the difference between the shape of pattern portion 10 and the shape of pattern region 9a, while the moire fringes formed by the light from mark 32 and mark 33 It can be detected. Therefore, the positional deviation reduction in the horizontal direction with the pattern portion 10 and the pattern area 9a and the reduction of the shape difference between them are achieved, and the pattern area 9a and the pattern of the imprint material 15 formed by the imprint process overlap. Alignment accuracy can be improved.

  The alignment system 26 may include a plurality of light sources 11 having different luminances. In this case, the light source 11 may be changed between the case where the alignment system 26 illuminates the alignment light for simple detection of moire fringes and the case where the alignment system 26 illuminates the alignment light for shape correction of the pattern area 9a. . The illumination range may be changed between the case where the alignment system 26 illuminates the alignment light for mere detection of moiré fringes and the case where the alignment light is illuminated for shape correction of the pattern area 9a.

  The present embodiment is an embodiment in which the alignment system 26 is used instead of the heating mechanism 24. The configuration and functions of the imprint apparatus 1 are similar to those of the other embodiments described above except that they relate to the heating mechanism 24. The deformation mechanism 18 may or may not be provided. This embodiment is advantageous when the shape correction amount of the pattern area 9a is relatively small.

Seventh Embodiment
The light source 11 of the alignment light may deteriorate with time, and a decrease in illuminance or a change in illuminance distribution may occur in the illumination region of the alignment light. Along with this, the heat distribution of the alignment light in the substrate 9 may change.

  Therefore, in the imprint apparatus 1 according to the seventh embodiment, the illumination meter (measurement unit) 37 periodically receives the alignment light to measure the illuminance distribution of the alignment light, and the control unit 105 stores the information based on the measurement result. The heat quantity distribution of the alignment light stored in the unit 106 is updated. When the alignment system 26 includes a plurality of light sources 11 having different luminances, the illuminance distribution of each light source 11 is measured to generate a corresponding heat quantity distribution.

  The imprint apparatus 1 measures the illuminance distribution of alignment light at a predetermined timing. The measurement is performed by moving the substrate 9 such that the illumination light 37 is irradiated with the alignment light. When the range that can be measured by the illuminance meter 37 at one time is narrower than the pattern area 9a, the illuminance distribution of the alignment light is obtained by integrating the results of measuring the illuminance of different areas within the illumination area of the alignment light in multiple times. You may get The above-described predetermined timing is, for example, when replacing the mold 7 after maintenance of a predetermined period after processing a predetermined number of substrates, maintenance of the imprint apparatus 1, or the like.

  The present embodiment may be implemented in combination with any of the first to sixth embodiments described above.

  Thereby, even when the heat quantity distribution of the alignment light in the substrate 9 changes due to the deterioration of the light source 11, the difference between the shape of the pattern portion 10 and the shape of the pattern area 9a can be accurately reduced. It will be. Thus, the overlay accuracy of the pattern area 9 a and the pattern of the imprint material 15 newly formed on the substrate 9 can be improved.

Other Embodiments
The heating mechanism 24 does not have to deform the pattern area 9 a using light energy from the heating light 24 a. The pattern area 9a may be deformed by heating with thermal energy generated from the back surface of the substrate 9 (surface opposite to the surface on which the pattern of the imprint material 15 is formed) using a heater or the like.

  As the imprint material 15, not only the above-described photocurable composition, but also a curable composition (sometimes referred to as an uncured resin) that is cured by receiving energy for curing is used. As energy for curing, electromagnetic waves, heat, etc. are used. The electromagnetic wave is, for example, light such as infrared light, visible light or ultraviolet light whose wavelength is selected from the range of 10 nm or more and 1 mm or less.

  The curable composition is a composition which is cured by irradiation of light or by heating. Among these, the photocurable composition which is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a nonpolymerizable compound or a solvent as required. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component and the like.

  The imprint material 15 is applied in a film form on the substrate by a spin coater or a slit coater. Alternatively, the liquid jet head may apply droplets or in the form of islands or films formed by connecting a plurality of droplets onto the substrate. The viscosity (the viscosity at 25 ° C.) of the imprint material is, for example, 1 mPa · s or more and 100 mPa · s or less.

  Glass, ceramics, metals, semiconductors, resins, etc. are used for the substrate, and if necessary, a member made of a material different from the substrate may be formed on the surface. Specifically, the substrate is a silicon wafer, a compound semiconductor wafer, quartz glass or the like.

[Product manufacturing method]
The pattern of the cured product formed using the imprint apparatus 1 is used permanently on at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. The mold may, for example, be a mold for imprinting.

  The pattern of the cured product is used as it is as a component member of at least a part of the article or temporarily used as a resist mask. After etching, ion implantation, or the like is performed in the substrate processing step, the resist mask is removed.

  Next, a specific method of manufacturing an article will be described. FIG. 12 (a) corresponds to the above-described step S106, and prepares a substrate 9 such as a silicon wafer on the surface of which a workpiece 2z such as an insulator is formed, and then, the substrate 9 is processed by the inkjet method or the like. The imprint material 15 is applied to the surface of the material 2z. Here, a state is shown in which a plurality of droplet-shaped imprint materials 15 are applied onto the substrate.

  As shown in FIG. 12B, the mold 7 for imprint is faced with the side on which the concavo-convex pattern is formed facing the imprint material 15 on the substrate. FIG. 12C corresponds to the above-described step S107, in which the substrate 9 provided with the imprint material 15 is brought into contact with the mold 7z, and pressure is applied. The imprint material 15 is filled in the gap between the mold 7z and the workpiece 2z. In this state, when light is irradiated to transmit the mold 7z as energy for curing, the imprint material 15 is cured.

  12D corresponds to the above-described step S110, and after curing the imprint material 15, when the mold 7z and the substrate 9 are separated, a pattern of a cured product of the imprint material 15 is formed on the substrate 9 . The pattern of the cured product is such that the recess of the mold corresponds to the protrusion of the cured product and the recess of the mold corresponds to the protrusion of the cured product, that is, the concavo-convex pattern of the mold 7z is transferred to the imprint material 15 It will be done.

  As shown in FIG. 12E, when etching is performed as a processing step using the pattern of the cured product as an etching resistant mask, a portion of the surface of the workpiece 2z where no cured product or thin remaining is removed. It becomes the groove 5z. As shown in FIG. 12 (f), when the pattern of the cured product is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Although the pattern of the cured product is removed here, it may be used, for example, as a film for interlayer insulation included in a semiconductor element or the like, that is, as a component of an article without removing it even after processing.

  After etching, ion implantation or the like is performed in the process of processing the substrate 9, the resist mask is removed. The processing step may further include other known processing steps (development, oxidation, film formation, deposition, planarization, resist removal, dicing, bonding, packaging, etc.).

  Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the present invention.

7 Mold 9 Substrate 9a Pattern Area (Processed Area)
10 pattern portion 15 imprint material 24 heating mechanism (heating means)
26 Alignment system 32, 33 marks

Claims (16)

An imprint apparatus for forming a pattern of an imprint material on a processing target area of a substrate using a mold,
A mark detection system which illuminates a mark provided on the substrate with illumination light and detects light from the mark illuminated by the illumination light;
And deformation means for deforming the processing area by heating.
The deformation means is a shape of the pattern portion based on a difference between the shape of the pattern portion of the mold and the shape of the processing region, and the heat quantity distribution of the illumination light on the substrate when the mark is illuminated. An imprint apparatus characterized in that the processing area is deformed so that the difference between the shape of the processing area and the processing area is reduced.   The imprint apparatus according to claim 1, wherein the deformation unit deforms the processing area while the mark detection system illuminates the illumination light.   The deformation means heats the processing area with a smaller amount of heat relative to the area illuminated with the illumination light than in the case of deforming the processing area based on the distribution of heat quantity of the illumination light. The imprint apparatus according to claim 1 or 2. The deformation means heats the processing area based on heat distribution information on the heat distribution to be applied to the processing area,
The heat quantity distribution information is information obtained by correcting temporary heat quantity distribution information generated based on the shape difference based on a heat quantity distribution of the illumination light. The imprint apparatus as described in a term. The deformation means is a first deformation means, and includes a second deformation means for deforming the pattern portion of the mold,
The second deformation means deforms the pattern portion based on a difference between a shape of the pattern portion and a shape of the processing region, and a heat quantity distribution of the illumination light on the substrate when the mark is illuminated. The imprint apparatus according to any one of claims 1 to 3, wherein The deforming means deforms the processing area by irradiating the processing area with heating light.
The imprint apparatus according to any one of claims 1 to 5, wherein a wavelength band of the heating light is different from a wavelength band of curing light for curing the imprint material.   The mark detection system is at least one of an illuminance distribution, an illumination range, a luminance, and a position of the illumination area of the illumination light based on the information indicating the position where the deformation of the processing area by the deformation means becomes defective. The imprint apparatus according to any one of claims 1 to 6, wherein deformation defects due to the deformation means are compensated by changing. An imprint apparatus for forming a pattern of an imprint material on a processing target area of a substrate using a mold,
A mark detection system which illuminates illumination light on a mark provided on the substrate and detects light from the mark provided on the substrate and illuminated by the illumination light;
And deformation means for deforming the pattern portion of the mold.
The deformation means deforms the pattern portion based on the difference between the shape of the pattern portion and the shape of the processing region, and the heat quantity distribution of the illumination light in the substrate, to thereby form the shape of the pattern portion and the shape portion. What is claimed is: 1. An imprint apparatus characterized by reducing a difference from a shape of a processing target area. A correction unit configured to correct a relative position of the pattern portion and the processing region in a direction along the substrate;
The correction means corrects the relative position so as to reduce the deviation of the relative position caused by the heat of the illumination light, based on the heat quantity distribution of the illumination light on the substrate. The imprint apparatus according to any one of 8. An imprint apparatus for forming a pattern of an imprint material on a processing target area of a substrate using a mold,
A mark detection system which illuminates illumination light on a mark provided on the substrate and detects light from the mark illuminated by the illumination light;
And correction means for correcting the relative position of the pattern part of the mold and the processing area in the direction along the substrate,
The imprint apparatus, wherein the correction means corrects the relative position so as to reduce the deviation of the relative position caused by the heat of the illumination light, based on the heat quantity distribution of the illumination light on the substrate. An imprint apparatus for forming a pattern of an imprint material on a processing target area of a substrate using a mold,
A mark detection system which illuminates a mark provided on the substrate with illumination light and detects light from the mark illuminated by the illumination light;
The said mark detection system controls the illuminance distribution of the said illumination light based on the difference of the shape of the pattern part of the said type | mold, and the shape of the said to-be-processed area.   The mark detection system controls the illuminance distribution based on the shape difference when illuminating the illumination light to a region where the mark is not provided in the processing region. The imprint apparatus described in. It has a measurement part which measures illumination distribution of the above-mentioned illumination light,
The imprint apparatus according to any one of claims 1 to 12, wherein the illuminance distribution of the illumination light on the substrate is updated. And irradiation means for irradiating curing light for curing the imprint material,
The imprint apparatus according to any one of claims 1 to 13, wherein a wavelength range of the illumination light is different from a wavelength range of the curing light. The pattern of the imprint material is formed on the processing area of the substrate using a mold, and a deformation mechanism for deforming at least one of the pattern section of the mold and the processing area on the substrate and the illumination light to the substrate A method of generating control data for controlling the deformation mechanism, for use in an imprint apparatus comprising: a mark detection system for illuminating and detecting light from a mark provided on the substrate and illuminated by the illumination light There,
Obtaining shape difference information on a difference between the shape of the pattern portion and the shape of the processing region, and obtaining heat distribution information of the illumination light on the substrate;
Generating the control data based on the shape difference information and the heat quantity distribution information acquired in the step;
A method of generating control data, comprising: Forming a pattern on a processing target region of a substrate using the imprint apparatus according to any one of claims 1 to 15;
And d) processing the substrate on which the pattern is formed in the above step.
A method of producing an article comprising producing an article comprising at least a portion of the treated substrate.

Images