JP2018182271A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

A treatment liquid that returns to a tank after temperature adjustment in two stages is returned to the tank without cooling. A substrate processing apparatus includes an upstream heater that heats a processing liquid flowing in a circulation flow path, a plurality of temperature regulators that change the temperature of the processing liquid flowing in a plurality of upstream flow paths, and a plurality of temperature controllers. And a plurality of flow rate adjustment valves 50 for changing the flow rate of the processing liquid flowing in the upstream flow path 48 of the first flow channel 48. The plurality of temperature controllers 53 include a cooler for cooling the processing liquid or a cooling / heating unit for heating and cooling the processing liquid. The set temperatures T1 to T4 of the plurality of temperature controllers 53 and the set flow rates V1 to V4 of the plurality of flow rate adjusting valves 50 are set so that the temperature of the processing liquid returning to the tank 41 is equal to or lower than the temperature of the processing liquid in the tank 41. Is done. [Selection] Figure 1

Description

  The present invention relates to a substrate processing apparatus for processing a substrate and a substrate processing method. Substrates to be processed include, for example, semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, and photomasks. Substrates, ceramic substrates, substrates for solar cells, etc. are included.

In a manufacturing process of a semiconductor device, a liquid crystal display device, and the like, a substrate processing apparatus that processes a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is used.
Patent Document 1 discloses a single-wafer substrate processing apparatus that processes substrates one by one. The substrate processing apparatus includes a chemical solution tank storing chemical solutions discharged from a plurality of discharge ports, an upstream heater which adjusts the temperature of the chemical solution in the chemical solution tank by heating the chemical solution, and a chemical solution heated by the upstream heater. And a supply channel which guides toward a plurality of discharge ports. The substrate processing apparatus further includes a plurality of upstream flow paths branched from the supply flow path, a plurality of downstream heaters for heating the chemical solutions flowing in the plurality of upstream flow paths, and a chemical solution tank heated with the plurality of downstream heaters. And a cooler for cooling the chemical solution supplied from the plurality of return channels.

JP, 2016-157852, A

  In patent document 1, the chemical | medical solution heated by the upstream heater is further heated by the downstream heater, and it is guided to the direction of a chemical | medical solution tank by several return flow path after that. Since the temperature of the chemical solution guided by the plurality of return flow paths is higher than the temperature of the chemical solution in the chemical solution tank, the chemical solution returns to the chemical solution tank after being cooled by the cooler. However, when the substrate processing apparatus is provided with a cooler, the substrate processing apparatus becomes larger.

In paragraph 0077 of Patent Document 1, “If the chemical solution in the chemical solution tank 41 can be maintained near the set temperature by adjusting the flow rate of the chemical solution returned to the chemical solution tank 41 via the return channel 54, the cooler 56 is omitted. That is, the chemical solution flowing through the return flow channel 54 may be returned to the chemical solution tank 41 without being cooled by the cooler 56. "
However, since the chemical solution returned to the chemical solution tank is heated by only the upstream heater or both the upstream heater and the downstream heater, the heat loss is not extremely large, regardless of how the flow rate of the chemical solution returned to the chemical solution tank is adjusted. As long as the chemical solution higher in temperature than the chemical solution in the chemical solution tank returns to the tank. Since the upstream heater can not cool the chemical solution, when the temperature of the chemical solution in the tank rises above the set temperature, it has to wait until the set temperature is lowered. Therefore, the chemical solution in the tank can not be supplied to the substrate during that time, and the throughput (the number of processed substrates per unit time) decreases.

  Therefore, one of the objects of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of returning the processing liquid returned to the tank after being temperature-controlled in two steps to the tank without cooling it.

  In order to achieve the above object, according to the first aspect of the present invention, there is provided a substrate holding means for rotating the substrate about a vertical rotation axis passing through a central portion of the substrate while holding the substrate horizontally, and the substrate holding means. A plurality of discharge ports for discharging the processing liquid toward the substrate, a tank for storing the processing liquid discharged from the plurality of discharge ports, a circulation flow path for circulating the processing liquid in the tank, and the inside of the tank A liquid feeding apparatus for sending a treatment liquid to the circulation channel, an upstream heater for heating the treatment liquid flowing in the circulation channel, and a feed flow for guiding the treatment liquid in the circulation channel toward the plurality of discharge ports A channel, a plurality of upstream channels branched from the supply channel and guiding the treatment liquid in the supply channel toward the plurality of discharge ports, and a cooler for heating the treatment liquid or heating the treatment liquid And cooling unit for cooling, A plurality of temperature regulators which are respectively provided in a number of upstream channels and which change the temperature of the processing liquid flowing in the plurality of upstream channels by at least one of heating and cooling, and are respectively provided in the plurality of upstream channels A plurality of flow control valves for changing the flow rate of the processing liquid sent to the plurality of temperature regulators, and the plurality of upstream flow paths downstream of the plurality of temperature regulators, A plurality of return flow paths for guiding the treatment liquid whose temperature has been changed by the plurality of temperature regulators toward the tank, and the plurality of discharges of the treatment liquid supplied from the supply flow path to the plurality of upstream flow paths Between a plurality of states including a discharge state supplied to the outlet and a discharge stop state in which the processing liquid supplied from the supply flow path to the plurality of upstream flow paths is supplied to the plurality of return flow paths Switched The temperature of the processing liquid that has passed through the plurality of temperature regulators is the switching unit, the in-tank temperature control unit that controls the upstream heater so that the temperature of the processing liquid in the tank becomes the in-tank temperature setting value. Each of the plurality of in-pipe temperature setting values becomes the maximum value of the plurality of in-pipe temperature setting values becomes equal to or more than the in-tank temperature setting value, and the minimum value of the plurality of in-pipe temperature setting values is the in-tank temperature setting The in-pipe temperature control unit for controlling the plurality of temperature regulators and the flow rate of the processing liquid that has passed through the plurality of flow rate adjustment valves are each set to a plurality of flow rate setting values so as to be smaller than the value. A flow rate control unit for controlling a plurality of flow rate adjusting valves, and a calculated value of the heat quantity of all the processing solutions returning from the plurality of return flow paths to the tank in unit time, the plurality of return flows in the unit time The set temperature in the tank, the temperature in the plurality of pipes, so that the predicted return temperature, which is a value obtained by dividing the calculated value of the volume of all the processing solutions returning from the passage to the tank, becomes lower than the set temperature in the tank. A substrate processing apparatus, comprising: a set point; and a return temperature control unit configured to set a plurality of flow rate set points.

  The temperature of the processing solution may greatly affect the processing of the substrate. If the temperature controller is stopped while discharge is stopped, it takes time for the temperature of the processing solution heated or cooled by the temperature controller to stabilize at the intended temperature when the temperature controller starts or resumes operation. . Therefore, the discharge of the treatment liquid can not be immediately started or restarted, and the throughput is reduced. Therefore, it is preferable to make the temperature controller heat or cool the liquid even while the discharge is stopped.

  According to this configuration, the processing liquid is supplied to the upstream flow path even while the discharge is stopped, and the temperature controller is heated or cooled. Therefore, the temperature controller can maintain a stable temperature even while the discharge is stopped. Therefore, the discharge of the treatment liquid can be resumed immediately. Furthermore, since the treatment liquid heated or cooled by the temperature controller is returned to the tank via the return flow channel during the discharge stop, the consumption of the treatment liquid can be reduced. Moreover, since the processing liquid having a temperature equal to or lower than the temperature of the processing liquid in the tank returns to the tank, a cooler for cooling the processing liquid returning to the tank may not be provided. Thus, the substrate processing apparatus can be prevented from being enlarged.

  The calculated values of the heat quantities of all the processing solutions returned from the plurality of return channels to the tank in unit time are the sum of the products of the in-pipe temperature set values and the flow rate set values in the plurality of upstream channels. The calculated values of the volumes of the processing solutions which return from the plurality of return flow channels to the tank in the unit time are the sum of the plurality of flow rate setting values. Therefore, if the in-pipe temperature set value and the flow rate set value in each upstream flow path are known, the expected return temperature can be obtained.

The invention according to claim 2 is the substrate processing apparatus according to claim 1, wherein each of the plurality of temperature regulators is the cooling unit.
According to this configuration, since all the temperature regulators are cooling units, it is possible to heat and cool the treatment liquid in any upstream flow path. Therefore, the temperature of the processing liquid discharged from the plurality of discharge ports can be set more freely as compared with the case where the plurality of temperature regulators include the heater. Furthermore, since the cooling unit can also cool the treatment liquid, the temperature of the treatment liquid returned to the tank can be made equal to or lower than the temperature of the treatment liquid in the tank. Thereby, the cooler which cools the process liquid returned to a tank can be abbreviate | omitted.

The invention according to claim 3 is that the value obtained by subtracting the expected return temperature from the in-tank temperature set value is smaller than the minimum value of the difference between the plurality of in-pipe temperature set values. It is a substrate processing apparatus as described.
Even if the expected return temperature is equal to the in-tank temperature set value, heat loss always occurs, so that the processing liquid having a temperature slightly lower than the in-tank temperature set value returns to the tank. Even if the actual temperature of the treatment liquid returned to the tank is lower than the actual temperature of the treatment liquid in the tank, if the treatment liquid is heated by the upstream heater, the temperature of the treatment liquid in the tank is returned to the in-tank temperature set value. be able to. However, if the actual temperature of the treatment liquid returned to the tank is lower than the actual temperature of the treatment liquid in the tank, the time for the temperature of the treatment liquid in the tank to return to the in-tank temperature set value increases. I will.

  According to this configuration, the value obtained by subtracting the expected return temperature from the in-tank temperature set value is smaller than the minimum value of the differences between the plurality of in-pipe temperature set values. That is, even if the predicted return temperature is a value below the tank temperature set value, the difference between the two is small. If the difference between the two is large, the processing solution, which is significantly cooler than the actual temperature of the processing solution in the tank, will return to the tank. Therefore, by reducing the difference between the in-tank temperature set value and the expected return temperature, the fluctuation of the temperature of the processing liquid in the tank can be suppressed.

The invention according to claim 4 further comprises a new liquid flow path for guiding a new treatment liquid having a liquid temperature equal to or lower than the in-tank temperature setting value into the tank. It is a substrate processing apparatus.
According to this configuration, when the amount of processing liquid in the tank falls below the specified amount, new processing liquid is supplied to the tank from the new liquid flow path. As a result, the amount of processing liquid in the tank is maintained at or above the specified amount. The temperature of the new processing solution is equal to or lower than the temperature setting value in the tank (for example, room temperature (20 to 30 ° C.)). Therefore, even if a new processing solution is replenished to the tank, the temperature of the processing solution in the tank does not exceed the temperature setting value in the tank. Thus, the supply of the processing liquid to the substrate may not be stopped until the temperature of the processing liquid in the tank falls to the temperature setting value in the tank.

The invention according to claim 5 further includes a collective return channel which is connected to each of the plurality of return channels and guides the processing liquid from the plurality of return channels to the tank. The substrate processing apparatus according to any one of the above.
According to this configuration, the processing liquid that has flowed from the plurality of upstream flow channels to the plurality of return flow channels flows to the collective return flow channel. The processing solutions supplied to the collective return channel flow toward the tank while being mixed in the collective return channel. That is, the processing solutions having different temperatures are mixed in the collecting return flow path, and a mixture having a temperature substantially equal to the temperature setting value in the tank is formed. Therefore, compared with the case where processing solutions having different temperatures are separately supplied to the tank, fluctuation of the temperature of the processing solution in the tank can be suppressed.

In the invention according to claim 6, the substrate according to any one of claims 1 to 5, wherein the plurality of discharge ports are respectively arranged at a plurality of positions different in horizontal distance from the rotation axis. It is a processing device.
According to this configuration, the processing liquid discharged from the plurality of discharge ports comes into contact with the plurality of landing positions in the upper surface of the substrate. The plurality of landing positions are different in horizontal distance from the rotation axis of the substrate. Therefore, the uniformity of processing can be improved as compared with the case where the processing liquid is discharged toward only the central portion of the substrate. Furthermore, the temperature of the processing liquid when discharged from the plurality of discharge ports is changed by the plurality of temperature regulators. Therefore, the temperature of the processing liquid at the time of liquid deposition on the upper surface of the substrate can be intentionally made nonuniform, and the processing quality can be controlled.

  The invention according to claim 7 is the substrate rotating step of rotating the substrate about the vertical rotation axis passing through the central portion of the substrate while holding the substrate horizontally by the substrate holding means, and the substrate held by the substrate holding means. A process liquid discharge process for discharging a process liquid to a plurality of discharge ports, a process liquid storage process for storing a process liquid discharged from the plurality of discharge ports in a tank, and a process flow path for circulating the process liquid in the tank A circulation step of circulating the water, a liquid feeding step of sending the treatment liquid from the tank to the circulation flow passage to the liquid feeding device, an upstream temperature control step of heating the treatment liquid flowing in the circulation flow passage to the upstream heater, A supply step of guiding the treatment liquid in the circulation passage toward the plurality of discharge ports in the flow passage, and a plurality of treatment solutions in the supply passage in the plurality of upstream passages branched from the supply passage Guide to the outlet of The flow guiding step, the cooler for cooling the processing liquid, or the cooling unit for heating and cooling the processing liquid, the plurality of temperature regulators respectively provided in the plurality of upstream flow paths, the heating and / or cooling A downstream temperature control step of changing the temperature of the processing liquid flowing through the plurality of upstream flow paths, and a flow rate of the processing liquid sent to the plurality of temperature regulators to the plurality of flow rate adjusting valves respectively provided in the plurality of upstream flow paths And a plurality of return flow paths respectively connected to the plurality of upstream flow paths downstream of the plurality of temperature regulators, with the processing solution whose temperature has been changed by the plurality of temperature regulators. A return step of guiding the solution to the tank, and a discharge state in which the processing liquid supplied from the supply flow path to the plurality of upstream flow paths is supplied to the plurality of discharge ports; A discharge switching step of switching the switching unit between a plurality of states including a discharge stop state in which the processing liquid supplied from the supply flow path to the plurality of upstream flow paths is supplied to the plurality of return flow paths; The in-tank temperature control step of causing the in-tank temperature control unit to control the upstream heater so that the temperature of the processing liquid in the tank becomes the in-tank temperature setting value, and the processing liquid having passed through the plurality of temperature regulators. The temperatures become a plurality of in-pipe temperature set values, the maximum value of the plurality of in-pipe temperature set values becomes equal to or more than the in-tank temperature set value, and the minimum value of the plurality of in-pipe temperature set values is in the tank The in-pipe temperature control step of causing the in-pipe temperature control unit to control the plurality of temperature regulators so as to be smaller than the temperature setting value, and the plurality of flow rates of the processing liquid passing through the plurality of flow rate adjustment valves The flow rate control step of causing the flow rate control unit to control the plurality of flow rate adjustment valves so as to achieve the set value, and the calculated values of the heat quantities of all the processing solutions returning from the plurality of return channels to the tank in unit time The return temperature control unit so that the predicted return temperature, which is a value obtained by dividing the calculated value of the volume of all the processing solutions returning from the plurality of return channels to the tank in unit time, is equal to or lower than the in-tank temperature set value. And a return temperature control step of setting the in-tank temperature set value, the plurality of in-pipe temperature set values, and the plurality of flow rate set values. According to this configuration, the same effects as the effects of claim 1 can be obtained.

It is a schematic diagram which shows the processing liquid supply system of the substrate processing apparatus which concerns on one Embodiment of this invention, and has shown the processing liquid supply system of a discharge state. It is a schematic diagram which shows the processing liquid supply system of the substrate processing apparatus which concerns on one Embodiment of this invention, and has shown the processing liquid supply system of the discharge stop state. It is a typical front view which shows the inside of the processing unit with which the substrate processing apparatus was equipped. It is a schematic plan view which shows the inside of the processing unit with which the substrate processing apparatus was equipped. It is a typical front view showing a plurality of nozzles. It is a schematic plan view showing a plurality of nozzles. It is process drawing for demonstrating an example of the process of the board | substrate performed by a substrate processing apparatus. It is a block diagram showing a functional block of a control device. It is a table showing a concrete example of a temperature setting value in a tank, a temperature setting value in a plurality of pipes, a plurality of flow value setting values, and an expected return temperature.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
1 and 2 are schematic views showing a processing liquid supply system of a substrate processing apparatus 1 according to an embodiment of the present invention. FIG. 1 shows the treatment liquid supply system in the discharge state, and FIG. 2 shows the treatment liquid supply system in the discharge stop state.
The substrate processing apparatus 1 is a sheet-fed apparatus which processes disk-like substrates W such as semiconductor wafers one by one. The substrate processing apparatus 1 includes a processing unit 2 that processes a substrate W with a processing liquid, a transfer robot (not shown) that transfers the substrate W to the processing unit 2, and a control device 3 that controls the substrate processing apparatus 1. . The control device 3 is a computer including a storage unit 3 b that stores information such as a program, and an operation unit 3 a that controls the substrate processing apparatus 1 according to the information stored in the storage unit 3 b.

  The substrate processing apparatus 1 includes a plurality of fluid boxes 5 containing fluid devices such as valves 51 for controlling supply and stop of supply of processing liquid to the processing unit 2, and processing supplied to the processing unit 2 via the fluid box 5. And a storage box 6 for storing a tank 41 for storing the liquid. The processing unit 2 and the fluid box 5 are disposed in the frame 4 of the substrate processing apparatus 1. The chamber 7 and the fluid box 5 of the processing unit 2 are aligned in the horizontal direction. The storage box 6 is disposed outside the frame 4. The storage box 6 may be disposed in the frame 4.

FIG. 3 is a schematic front view showing the inside of the processing unit 2. FIG. 4 is a schematic plan view showing the inside of the processing unit 2.
As shown in FIG. 3, the processing unit 2 rotates the substrate W around a vertical rotation axis A1 passing through the central portion of the substrate W while holding the substrate W horizontally in the box-shaped chamber 7 and the chamber 7. It includes a spin chuck 11 and a cylindrical cup 15 for receiving the processing liquid discharged from the substrate W.

  As shown in FIG. 4, the chamber 7 includes a box-shaped partition wall 8 provided with a carry-in / out port 8a through which the substrate W passes, and a shutter 9 for opening / closing the carry-in / out port 8a. The shutter 9 is movable relative to the partition wall 8 between an open position where the loading / unloading port 8a is opened and a closed position (position shown in FIG. 4) where the loading / unloading port 8a is closed. The transport robot (not shown) carries the substrate W into the chamber 7 through the carry-in / out port 8a, and carries out the substrate W from the chamber 7 through the carry-in / out port 8a.

  As shown in FIG. 3, the spin chuck 11 includes a disk-shaped spin base 12 held in a horizontal posture, and a plurality of chuck pins 13 for holding the substrate W in a horizontal posture above the spin base 12. And a spin motor that rotates the substrate W around the rotation axis A1 by rotating the plurality of chuck pins. The spin chuck 11 is not limited to a clamping type chuck that brings the plurality of chuck pins 13 into contact with the peripheral end face of the substrate W, but adsorbs the back surface (bottom surface) of the substrate W which is a non-device forming surface to the top surface of the spin base 12 It may be a vacuum type chuck which holds the substrate W horizontally by the above.

  As shown in FIG. 3, the cup 15 includes a cylindrical splash guard 17 surrounding the spin chuck 11 around the rotation axis A1, and a cylindrical outer wall 16 surrounding the splash guard 17 around the rotation axis A1. The processing unit 2 has an upper position where the upper end of the splash guard 17 is positioned above the holding position of the substrate W by the spin chuck 11 (the position shown in FIG. 3) A guard lift unit 18 is provided to vertically move the splash guard 17 between a lower position located below the holding position.

  As shown in FIG. 3, the processing unit 2 includes a rinse liquid nozzle 21 that discharges the rinse liquid downward toward the upper surface of the substrate W held by the spin chuck 11. The rinse liquid nozzle 21 is connected to the rinse liquid piping 22 in which the rinse liquid valve 23 is interposed. The processing unit 2 may include a nozzle moving unit that moves the rinse liquid nozzle 21 between the processing position and the standby position.

  When the rinse liquid valve 23 is opened, the rinse liquid is supplied from the rinse liquid pipe 22 to the rinse liquid nozzle 21 and discharged from the rinse liquid nozzle 21. The rinse solution is, for example, pure water (deionized water). The rinse solution is not limited to pure water, and may be any of carbonated water, electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water of a diluted concentration (for example, about 10 to 100 ppm).

  As shown in FIG. 4, the processing unit 2 includes a plurality of nozzles 26 (first nozzle 26A, second nozzle 26B, third nozzle 26C, and fourth nozzle 26D) for discharging the chemical solution downward, and a plurality of nozzles 26. A plurality of nozzles 26 are provided between the processing position (the position shown by the two-dot chain line in FIG. 4) and the standby position (the position shown by the solid line in FIG. 4). And a nozzle moving unit 24 for moving the

  Typical examples of the chemical solution are etching solutions such as TMAH (tetramethyl ammonium hydroxide) and resist stripping solutions such as SPM (mixed solution containing sulfuric acid and hydrogen peroxide solution). The chemical solutions are not limited to TMAH and SPM, but include sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, ammonia water, hydrogen peroxide water, organic acids (eg citric acid, oxalic acid etc.), organic alkalis other than TMAH, surfactants, It may be a liquid containing at least one of the corrosion inhibitors.

As shown in FIG. 3, each nozzle 26 includes a nozzle body 27 cantilevered by a holder 25. The nozzle body 27 includes an arm 28 extending from the holder 25 in the horizontal longitudinal direction D1 and a tip 29 extending downward from the tip 28a of the arm 28. The tip end 28a of the arm portion 28 means a portion farthest from the holder 25 in the longitudinal direction D1 in a plan view.
As shown in FIG. 4, the plurality of arm portions 28 are arranged in the horizontal arrangement direction D2 orthogonal to the longitudinal direction D1 in the order of the first nozzle 26A to the fourth nozzle 26D. The plurality of arms 28 are disposed at the same height. The spacing between the two arm portions 28 adjacent to the arrangement direction D2 may be the same as any other spacing, or may be different from at least one of the other spacings. FIG. 4 shows an example in which a plurality of arm portions 28 are arranged at equal intervals.

The lengths of the plurality of arm portions 28 in the longitudinal direction D1 are shortened in the order of the first nozzle 26A to the fourth nozzle 26D. The tips of the plurality of nozzles 26 (the tips 28a of the plurality of arm portions 28) are offset in the longitudinal direction D1 so as to be arranged in the order of the first nozzle 26A to the fourth nozzle 26D in the longitudinal direction D1. The tips of the plurality of nozzles 26 are linearly arranged in a plan view.
The nozzle moving unit 24 moves the plurality of nozzles 26 along an arc-shaped path passing through the substrate W in plan view by rotating the holder 25 around the nozzle rotation axis A2 extending vertically around the cup 15 Let As a result, the plurality of nozzles 26 move horizontally between the processing position and the standby position. The processing unit 2 includes a bottomed cylindrical standby pot 35 disposed below the standby position of the plurality of nozzles 26. The waiting pot 35 is disposed around the cup 15 in plan view.

  The processing position is a position where the chemical solution discharged from the plurality of nozzles 26 lands on the upper surface of the substrate W. At the processing position, the plurality of nozzles 26 and the substrate W overlap in plan view, and the tips of the plurality of nozzles 26 in radial direction Dr in the order of the first nozzle 26A to the fourth nozzle 26D from the rotation axis A1 side in plan view. Line up. At this time, the tip of the first nozzle 26A overlaps the central portion of the substrate W in plan view, and the tip of the fourth nozzle 26D overlaps the peripheral portion of the substrate W in plan view.

  The standby position is a position where the plurality of nozzles 26 are retracted such that the plurality of nozzles 26 and the substrate W do not overlap in plan view. In the standby position, the tips of the plurality of nozzles 26 are located outside the cup 15 along the outer peripheral surface (the outer peripheral surface of the outer wall 16) of the cup 15 in plan view, and the order of the first nozzle 26A to the fourth nozzle 26D Aligned in the circumferential direction (direction around the rotation axis A1). The plurality of nozzles 26 are arranged in order of the first nozzle 26A to the fourth nozzle 26D so as to be away from the rotation axis A1.

Next, the plurality of nozzles 26 will be described with reference to FIGS. 5 and 6. Thereafter, the treatment liquid supply system will be described.
In the following description, “first” and “A” may be added to the beginning and the end of the configuration corresponding to the first nozzle 26A, respectively. For example, the upstream flow passage 48 corresponding to the first nozzle 26A may be referred to as "first upstream flow passage 48A". The same applies to the configuration corresponding to the second nozzle 26B to the fourth nozzle 26D. For example, the upstream flow passage 48 corresponding to the second nozzle 26B may be referred to as "second upstream flow passage 48B".

In the following description, the set temperature of the upstream heater 43 may be referred to as the upstream temperature, and the set temperature of the temperature controller 53 may be referred to as the downstream temperature. The set temperatures of the first temperature controller 53 to the fourth temperature controller 53 may be referred to as first to fourth downstream temperatures, respectively.
As shown in FIG. 5, the nozzle body 27 has a resin tube 30 for guiding the treatment liquid, a cored bar 31 having a cylindrical cross section surrounding the resin tube 30, and a resin coating 32 having a cylindrical cross section covering the outer surface of the core 31. And. Each nozzle 26 other than the first nozzle 26A further includes a nozzle head 33 attached to the tip 29 of the nozzle body 27.

  The nozzle body 27 forms one flow path extending along the nozzle body 27. The nozzle head 33 forms a plurality of flow paths for guiding the processing liquid supplied from the nozzle main body 27. The flow passage of the nozzle body 27 forms a discharge port 34 opened on the outer surface of the nozzle body 27. The plurality of flow paths of the nozzle head 33 form a plurality of discharge ports 34 opened on the outer surface of the nozzle head 33. The flow passage of the nozzle body 27 corresponds to a part of the upstream flow passage 48 described later. Each flow path of the nozzle head 33 corresponds to the downstream flow path 52 described later. The downstream ends of the first upstream channel 48A to the fourth upstream channel 48D are respectively disposed at a plurality of positions different in distance from the rotation axis A1.

  5 and 6 show an example in which the total number of the discharge ports 34 provided in the plurality of nozzles 26 is ten. The first nozzle 26 </ b> A includes one discharge port 34 provided in the nozzle body 27. Each nozzle 26 other than the first nozzle 26 </ b> A includes three discharge ports 34 provided in the nozzle head 33. The three discharge ports 34 provided in the same nozzle head 33 have an inner discharge port closest to the rotation axis line A1 among the three discharge ports 34 and an outer side furthest from the rotation axis line A1 among the three discharge ports 34. It is comprised by the discharge port and the intermediate discharge port arrange | positioned between the inner side discharge port and the outer side discharge port.

  As shown in FIG. 6, the plurality of discharge ports 34 are linearly arranged in a plan view. The distance between the two outlets 34 at both ends is equal to or less than the radius of the substrate W. The interval between the two adjacent discharge ports 34 may be the same as any other interval, or may be different from at least one of the other intervals. Also, the plurality of discharge ports 34 may be disposed at the same height, or may be disposed at two or more different heights.

  When the plurality of nozzles 26 are arranged at the processing position, the plurality of discharge ports 34 are respectively arranged at a plurality of positions different in distance from the rotation axis A1 (the shortest distance in plan view). At this time, the innermost discharge port (first discharge port 34A) closest to the rotation axis A1 among the plurality of discharge ports 34 is disposed above the central portion of the substrate W and rotates among the plurality of discharge ports 34. The outermost discharge port (fourth discharge port 34D) farthest from the axis A1 is disposed above the peripheral portion of the substrate W. The plurality of discharge ports 34 are arranged in the radial direction Dr in plan view.

  The first discharge port 34A provided in the first nozzle 26A is a main discharge port that discharges the processing liquid toward the central portion of the upper surface of the substrate W. The second discharge port 34B to the fourth discharge port 34D provided in each nozzle 26 other than the first nozzle 26A are a plurality of sub-discharge ports that discharge the processing liquid toward a part of the upper surface of the substrate W other than the central portion. It is. The first upstream flow path 48A connected to the first discharge port 34A is a main upstream flow path, and the second upstream flow path 48B to fourth upstream flow connected to the second discharge port 34B to the fourth discharge port 34D. The path 48D is a plurality of sub upstream flow paths.

  As shown in FIG. 5, each discharge port 34 discharges the chemical solution in a discharge direction perpendicular to the top surface of the substrate W. The plurality of discharge ports 34 discharge the chemical solution toward a plurality of liquid deposition positions in the upper surface of the substrate W. The plurality of landing positions are different positions at different distances from the rotation axis A1. The liquid deposition position closest to the rotation axis A1 among the plurality of liquid deposition positions is referred to as the first liquid deposition position, and the liquid deposition position closest to the rotation axis A1 second among the plurality of liquid deposition positions is the second liquid deposition. In terms of position, the chemical solution discharged from the first discharge port 34A is deposited at the first liquid deposition position, and the chemical solution discharged from the second discharge port 34B is deposited at the second liquid deposition position.

Next, the treatment liquid supply system will be described in detail with reference to FIGS. 1 and 2.
The treatment liquid supply system includes a chemical solution tank 41 for storing a chemical solution, a circulation channel 42 for circulating the chemical solution in the chemical solution tank 41, and a chemical solution by heating the chemical solution flowing in the circulation channel 42 at an upstream temperature higher than room temperature. It includes an upstream heater 43 for adjusting the temperature of the chemical solution in the tank 41, and a pump 44 for feeding the chemical solution in the chemical solution tank 41 to the circulation flow path 42. The processing liquid supply system further includes a supply flow channel 47 connected to the circulation flow channel 42, a supply valve 45 for opening and closing the supply flow channel 47, and a circulation valve 46 for opening and closing the circulation flow channel 40.

  The processing liquid supply system includes a plurality of upstream flow paths 48 for guiding the liquid supplied from the supply flow path 47 toward the plurality of discharge ports 34 and a plurality of flow paths of the liquid flowing in the plurality of upstream flow paths 48. And a plurality of flow control valves 50 for changing the flow rate of the liquid flowing in the plurality of upstream flow paths 48, and a plurality of discharge valves 51 for respectively opening and closing the plurality of upstream flow paths 48. Although not shown, the flow control valve 50 includes a valve body that opens and closes a flow path, and an actuator that changes the opening degree of the valve body. The actuator may be a pneumatic actuator or an electric actuator, or may be an actuator other than these.

The processing liquid supply system includes a plurality of downstream flow paths 52 for guiding the liquid supplied from the upstream flow path 48 toward the plurality of discharge ports 34. The downstream end of each upstream flow passage 48 other than the first upstream flow passage 48A branches into a plurality of downstream flow passages 52. That is, each upstream flow path 48 other than the first upstream flow path 48A is a branched upstream flow path branched to the plurality of downstream flow paths 52.
1 and 2 show an example in which the branch upstream flow channel is branched into two downstream flow channels 52. FIG. 5 shows an example in which the branch upstream flow channel is branched into three downstream flow channels 52. The three downstream flow paths 52 branched from the second upstream flow path 48B are respectively connected to the three discharge ports 34 (inner discharge port, middle discharge port, and outer discharge port) provided in the same nozzle head 33. There is. The third upstream flow passage 48C and the fourth upstream flow passage 48D are the same as the second upstream flow passage 48B. The first upstream flow passage 48A is connected to a first discharge port 34A provided in the first nozzle 26A.

  The processing liquid supply system includes a plurality of temperature regulators 53 which heat or cool the liquid flowing in the plurality of upstream flow paths 48. Each temperature controller 53 is a heating-cooling unit that not only heats but also cools the liquid. The treatment liquid supply system further opens and closes a plurality of return flow paths 54 and a plurality of return flow paths 54 respectively connected to the plurality of upstream flow paths 48 at positions downstream of the plurality of temperature regulators 53. And a collective return flow passage 56 extending from each return flow passage 54 to the chemical solution tank 41. The switching unit includes a plurality of discharge valves 51 and a plurality of return valves 55.

  The processing liquid supply system includes a liquid amount sensor 57 for detecting the amount of chemical in the chemical tank 41, a new liquid flow path 58 for guiding a new chemical liquid into the chemical liquid tank 41, and a new liquid for opening and closing the new liquid flow path 58. And a valve 59. When the amount of the chemical solution in the chemical solution tank 41 falls below the specified amount, the control device 3 opens the new liquid valve 59 and refills the chemical solution tank 41 with a new chemical solution. As a result, the amount of the chemical solution in the chemical solution tank 41 is maintained at or above the specified amount. The new chemical solution is, for example, an unused chemical solution at room temperature.

Next, with reference to FIG. 1, the processing liquid supply system in the discharge state in which the plurality of discharge ports 34 discharge the chemical solution will be described. In FIG. 1, the open valve is shown in black and the closed valve is shown in white.
The drug solution in the drug solution tank 41 is sent to the circulation flow channel 42 by the pump 44. The chemical solution sent by the pump 44 is heated by the upstream heater 43, and then flows from the circulation flow path 42 to the supply flow path 47, and flows from the supply flow path 47 to the plurality of upstream flow paths 48. The chemical solutions supplied to the plurality of upstream channels 48 are heated or cooled by the plurality of temperature regulators 53.

  The chemical solution in the first upstream flow passage 48A is supplied to one first discharge port 34A provided in the first nozzle 26A. The chemical solution in the second upstream flow passage 48B is supplied to the plurality of second discharge ports 34B provided in the second nozzle 26B via the plurality of downstream flow passages 52. The third upstream flow passage 48C and the fourth upstream flow passage 48D are the same as the second upstream flow passage 48B. Thereby, the chemical solution is discharged from all the discharge ports 34.

The first to fourth downstream temperatures T _{1 to} T ₄ increase in the order of the _first to fourth downstream temperatures T _{1 to} T ₄ . The first discharge port 34A ejects the first downstream temperature _{T 1} of the chemical solution. Each second discharge port 34B ejects the second downstream temperature _{T 2} chemicals. Each third discharge port 34C ejects the third liquid chemical downstream temperature _{T 3,} the fourth discharge port 34D ejects a chemical fourth downstream temperature _{T 4.} Therefore, the temperature of the chemical solution discharged from the plurality of discharge ports 34 gradually increases as it is separated from the rotation axis A1.

The first to fourth downstream temperatures T _{1 to} T ₄ correspond to first to fourth in-pipe temperature setting values, respectively. The set temperature _Ttank of the upstream heater 43 corresponds to the in-tank temperature set value. First downstream temperature _{T 1} of the lower than the set temperature T _tank of the upstream heater 43. Fourth downstream temperature T ₄ may be equal to the set temperature T _tank of the upstream heater 43, may be less than the set temperature T of the upstream heater 43 _tank. If the fourth downstream temperature T ₄ is equal to the set temperature T _tank of the upstream heater 43, a fourth temperature regulator 53 is not a cold unit, or may be a heater.

Next, with reference to FIG. 2, the treatment liquid supply system in the discharge stop state in which the discharge of the chemical solution from the plurality of discharge ports 34 is stopped will be described. In FIG. 2, the open valve is shown in black and the closed valve is shown in white.
The drug solution in the drug solution tank 41 is sent to the circulation flow channel 42 by the pump 44. A part of the chemical solution sent by the pump 44 is heated by the upstream heater 43 and then returns to the chemical solution tank 41 via the circulation flow path 40. The remaining chemical solution sent by the pump 44 flows from the circulation flow channel 42 to the supply flow channel 47 and flows from the supply flow channel 47 to the plurality of upstream flow channels 48.

  The chemical solution in the first upstream flow passage 48A is heated or cooled by the temperature controller 53 corresponding to the first upstream flow passage 48A, and then flows into the return flow passage 54. The second upstream flow passage 48B, the third upstream flow passage 48C, and the fourth upstream flow passage 48D are the same as the first upstream flow passage 48A. The chemicals having different temperatures flow from the plurality of return channels 54 to the collective return channel 56 and are mixed in the collective return channel 56. Thereafter, the mixed chemical solution returns to the chemical solution tank 41 from the collective return channel 56. Thereby, all the chemical solutions sent to the circulation flow path 42 by the pump 44 return to the chemical solution tank 41.

FIG. 7 is a process diagram for explaining an example of the processing of the substrate W performed by the substrate processing apparatus 1. The following operations are executed by the control device 3 controlling the substrate processing apparatus 1. In other words, the control device 3 is programmed to perform the following steps. Reference is made below to FIGS. 3 and 4. Reference will be made to FIG. 7 as appropriate.
When the substrate W is processed by the processing unit 2, the plurality of nozzles 26 are retracted from above the spin chuck 11, and the hand of the transfer robot (not shown) with the splash guard 17 positioned at the lower position. , The substrate W is carried into the chamber 7. Thereby, the substrate W is placed on the plurality of chuck pins 13 with the surface directed upward. Thereafter, the hand of the transfer robot is retracted from the inside of the chamber 7, and the loading / unloading port 8 a of the chamber 7 is closed by the shutter 9.

  After the substrate W is placed on the plurality of chuck pins 13, the plurality of chuck pins 13 are pressed against the peripheral portion of the substrate W, and the substrate W is gripped by the plurality of chuck pins 13. Also, the guard lifting and lowering unit 18 moves the splash guard 17 from the lower position to the upper position. Thus, the upper end of the splash guard 17 is disposed above the substrate W. Thereafter, the spin motor 14 is driven to start the rotation of the substrate W. Thereby, the substrate W is rotated at a predetermined liquid processing speed (for example, several hundred rpm).

  Next, the nozzle moving unit 24 moves the plurality of nozzles 26 from the standby position to the processing position. Thereby, the plurality of discharge ports 34 overlap the substrate W in plan view. Thereafter, the plurality of discharge valves 51 and the like are controlled, and the chemical solution is simultaneously discharged from the plurality of nozzles 26 (step S1 in FIG. 7). The plurality of nozzles 26 discharge the chemical solution in a state where the nozzle moving unit 24 keeps the plurality of nozzles 26 stationary. When a predetermined time elapses after the plurality of discharge valves 51 are opened, the discharge of the chemical solution from the plurality of nozzles 26 is simultaneously stopped (Step S2 in FIG. 7). Thereafter, the nozzle moving unit 24 moves the plurality of nozzles 26 from the processing position to the standby position.

  The liquid chemical discharged from the plurality of nozzles 26 lands on the upper surface of the rotating substrate W, and then flows outward (in a direction away from the rotation axis A1) along the upper surface of the substrate W by centrifugal force. The chemical solution that has reached the upper surface peripheral portion of the substrate W is scattered around the substrate W and received on the inner peripheral surface of the splash guard 17. Thus, the chemical solution is supplied to the entire upper surface of the substrate W, and a liquid film of the chemical solution covering the entire upper surface of the substrate W is formed on the substrate W. Thereby, the entire upper surface of the substrate W is treated with the chemical solution.

  After the discharge of the chemical solution from the plurality of nozzles 26 is stopped, the rinse liquid valve 23 is opened, and the discharge of the rinse liquid (pure water) from the rinse liquid nozzle 21 is started (Step S3 in FIG. 7). Thereby, the chemical solution on the substrate W is washed away by the rinse liquid, and a liquid film of the rinse liquid covering the entire upper surface of the substrate W is formed. When a predetermined time passes after the rinse liquid valve 23 is opened, the rinse liquid valve 23 is closed, and the discharge of the rinse liquid from the rinse liquid nozzle 21 is stopped (Step S4 in FIG. 7).

  After the discharge of the rinse liquid from the rinse liquid nozzle 21 is stopped, the substrate W is accelerated in the rotational direction by the spin motor 14, and the substrate W rotates at a drying speed (for example, several thousand rpm) larger than the liquid processing speed. (Step S5 in FIG. 7). Thereby, the rinse liquid adhering to the substrate W is shaken off around the substrate W, and the substrate W is dried. The rotation of the spin motor 14 and the substrate W is stopped when a predetermined time passes after the substrate W starts high-speed rotation.

  After the rotation of the substrate W is stopped, the guard lifting and lowering unit 18 moves the splash guard 17 from the upper position to the lower position. Further, the holding of the substrate W by the plurality of chuck pins 13 is released. The transport robot causes the hand to enter the inside of the chamber 7 with the plurality of nozzles 26 retracted from above the spin chuck 11 and the splash guard 17 positioned at the lower position. Thereafter, the transfer robot picks up the substrate W on the spin chuck 11 with a hand, and unloads the substrate W from the chamber 7.

FIG. 8 is a block diagram showing functional blocks of the control device 3. The control device 3 includes an in-tank temperature control unit 61, a in-pipe temperature control unit 62, a flow rate control unit 63, and a return temperature control unit 64. These are functional blocks that are realized by execution of a program installed in the control device 3 by the operation unit 3a (see FIG. 1) such as a CPU.
The in-tank temperature control unit 61 controls the upstream heater 43 so that the temperature of the chemical solution in the chemical solution tank 41 becomes the in-tank temperature set value. The in-pipe temperature control unit 62 controls the plurality of temperature regulators 53 such that the temperature of the chemical solution that has passed through the plurality of temperature regulators 53 becomes the plurality of in-pipe temperature setting values. The maximum value of the plurality of in-pipe temperature set values is equal to or higher than the in-tank temperature set value, and the minimum value of the plurality of in-pipe temperature set values is less than the in-tank temperature set value. The flow rate control unit 63 controls the plurality of flow rate adjustment valves 50 such that the flow rate of the chemical solution that has passed through the plurality of flow rate adjustment valves 50 becomes a plurality of flow rate setting values. Each flow rate set value may be the same value or may be different from at least one other flow rate set value.

  The return temperature control unit 64 sets the in-tank temperature setting value, the plurality of in-pipe temperature setting values, and the plurality of flow rate setting values such that the predicted return temperature is equal to or less than the in-tank temperature setting value. The predicted return temperature is the calculated value of the heat quantity of all the chemical solutions returned from the plurality of return flow channels 54 to the chemical solution tank 41 per unit time to the volume of all chemical solutions returned from the plurality of return channels 54 to the chemical solution tank 41 per unit time. It is the value divided by the calculated value.

  The calculated values of the heat amounts of all the chemical solutions returned from the plurality of return flow channels 54 to the chemical solution tank 41 in unit time are the sum of the products of the in-pipe temperature set values and the flow rate set values in the plurality of upstream flow channels 48. The calculated values of the volumes of all the chemical solutions returned from the plurality of return flow paths 54 to the chemical solution tank 41 in unit time are the total values of the plurality of flow rate setting values. Therefore, if the in-pipe temperature set value and the flow rate set value in each upstream flow path 48 are known, the expected return temperature can be obtained.

FIG. 9 is a table showing specific examples of the in-tank temperature set value, the plurality of in-pipe temperature set values, the plurality of flow rate set values, and the expected return temperature. In the following, reference is made to FIG. 2 and FIG.
The control device 3 sets the in-tank temperature set value, the plurality of in-pipe temperature set values, and the like so that the temperature of the chemical solution returning from the plurality of return flow paths 54 to the chemical solution tank 41 is equal to or lower than the temperature of the chemical solution in the chemical solution tank 41. Set multiple flow rate settings. FIG. 9 shows a specific example of the in-tank temperature set value, the plurality of in-pipe temperature set values, the plurality of flow rate set values, and the expected return temperature when the expected return temperature is equal to the in-tank temperature set value.

As shown in FIG. 9, the set temperature of the temperature regulator 53 corresponding to the first upstream passage 48A, that is, first downstream temperature T ₁ of is 60 ° C.. The second downstream temperature T ₂ is 65 ° C., the third downstream temperature T ₃ is 75 ° C., and the fourth downstream temperature T ₄ is 80 ° C. The upstream temperature _Ttank, which is the set temperature of the upstream heater 43, is 70 ° C. Therefore, first downstream temperature _{T 1} and a second downstream temperature _{T 2} is lower than the upstream temperature T _tank, a third downstream temperature _{T 3} and a fourth downstream temperature _{T 4} is higher than the upstream temperature T _tank.

Flow rate setting of the chemical liquid through the flow rate adjustment valve 50 corresponding to the first upstream passage 48A, that is, the first flow rate set value _{V 1} was a x (mL / min). The set value (second flow rate set value V ₂ ) of the flow rate of the chemical solution passing through the flow rate adjustment valve 50 corresponding to the second upstream flow path 48B is also x. Similarly, the set value (third flow rate set value V ₃ ) of the flow rate of the chemical solution passing through the flow rate adjustment valve 50 corresponding to the third upstream flow path 48C is x, and the flow rate adjustment corresponding to the fourth upstream flow path 48D The set value of the flow rate of the chemical solution passing through the valve 50 (fourth flow set value V ₄ ) is x. That is, in this example, the first flow rate set value V ₁ , the second flow rate set value V ₂ , the third flow rate set value V ₃ , and the fourth flow rate set value V ₄ are equal to one another.

Heat of all of the chemical liquid return from a plurality of return flow path 54 to the chemical liquid tank 41 in a unit time is determined from the first to fourth downstream temperature _T 1 through T ₄ and first to fourth flow rate set value _V 1 ~V ₄ Be In the example shown in FIG. 9, the heat quantity of all the chemical solutions returned from the plurality of return flow paths 54 to the chemical solution tank 41 per unit time is 280x (= 60x + 65x + 75x + 80x). The volume of all chemical solutions returned from the plurality of return flow paths 54 to the chemical solution tank 41 in unit time is 4x. Therefore, the temperature of the chemical solution returned to the chemical solution tank 41 from the plurality of return flow paths 54 is 70 ° C. (= 280 × / 4 x), which is equal to the upstream temperature T _tank which is the set temperature of the upstream heater 43.

  The temperature of the chemical solution may greatly affect the processing of the substrate W. When the temperature controller 53 is stopped during the discharge stop, when the operation of the temperature controller 53 is started or restarted, it takes time for the temperature of the chemical solution heated or cooled by the temperature controller 53 to stabilize at the intended temperature. It takes Therefore, the discharge of the drug solution can not be immediately started or restarted, and the throughput is reduced. Therefore, it is preferable to make the temperature controller 53 heat or cool the liquid even while the discharge is stopped.

  In the present embodiment, the chemical solution is supplied to the upstream flow path 48 even while the discharge is stopped, and the temperature controller 53 is heated or cooled. Therefore, even during the discharge stop, the temperature of the temperature regulator 53 can be kept stable. Therefore, the discharge of the chemical solution can be resumed immediately. Furthermore, since the chemical solution heated or cooled by the temperature controller 53 is returned to the chemical solution tank 41 via the return flow passage 54 while the discharge is stopped, the consumption amount of the chemical solution can be reduced. In addition, since the chemical solution having a temperature equal to or lower than the temperature of the chemical solution in the chemical solution tank 41 returns to the chemical solution tank 41, the cooler for cooling the chemical solution returning to the chemical solution tank 41 may not be provided. Thereby, the substrate processing apparatus 1 can be prevented from increasing in size.

  In the present embodiment, since all the temperature regulators 53 are cold units, the chemical solution can be heated and cooled in any of the upstream channels 48. Therefore, as compared with the case where the plurality of temperature regulators 53 include the heater, the temperature of the chemical solution discharged from the plurality of discharge ports 34 can be set more freely. Furthermore, since the cold energy unit can also cool the chemical solution, the temperature of the chemical solution returned to the chemical solution tank 41 can be made equal to or lower than the temperature of the chemical solution in the chemical solution tank 41. Thereby, the cooler which cools the chemical | medical solution returned to the chemical | medical solution tank 41 can be abbreviate | omitted.

  In the present embodiment, when the amount of the chemical solution in the chemical solution tank 41 falls below the specified amount, a new chemical solution is supplied from the new liquid flow path 58 to the chemical solution tank 41. As a result, the amount of the chemical solution in the chemical solution tank 41 is maintained at or above the specified amount. The temperature of the new chemical solution is equal to or lower than the temperature setting value in the tank (for example, room temperature). Therefore, even if a new chemical solution is replenished to the chemical solution tank 41, the temperature of the chemical solution in the chemical solution tank 41 does not exceed the in-tank temperature set value. Thus, the supply of the chemical solution to the substrate W may not be stopped until the temperature of the chemical solution in the chemical solution tank 41 decreases to the temperature setting value in the tank.

  In the present embodiment, the drug solution flowing from the plurality of upstream flow channels 48 to the plurality of return flow channels 54 flows to the collective return flow channel 54. The chemical solutions supplied to the collective return flow channel 54 flow toward the chemical solution tank 41 while being mixed in the collective return flow channel 54. That is, the chemical solutions having different temperatures are mixed in the collective return flow path 54, and a mixed liquid having a temperature substantially equal to the temperature setting value in the tank is formed. Therefore, compared with the case where the chemical solutions having different temperatures are separately supplied to the chemical solution tank 41, it is possible to suppress the fluctuation of the temperature of the chemical solution in the chemical solution tank 41.

  In the present embodiment, the chemical solution discharged from the plurality of discharge ports 34 lands on a plurality of liquid deposition positions in the upper surface of the substrate W. The plurality of landing positions have different horizontal distances from the rotation axis A1 of the substrate W. Therefore, as compared with the case where the chemical solution is discharged toward only the central portion of the substrate W, the uniformity of the processing can be enhanced. Furthermore, the temperature of the chemical solution when discharged from the plurality of discharge ports 34 is changed by the plurality of temperature regulators 53. Therefore, the temperature of the chemical solution at the time of liquid deposition on the upper surface of the substrate W can be intentionally made nonuniform, and the processing quality can be controlled.

Other Embodiments The present invention is not limited to the contents of the above embodiments, and various modifications are possible.
For example, the number of nozzles 26 may be two or three, or five or more.

The nozzle head 33 may be provided to all the nozzles 26 including the first nozzle 26A. On the contrary, all the nozzles 26 may not be provided with the nozzle head 33.
The number of the downstream flow paths 52 and the discharge ports 34 formed in one nozzle head 33 may be two or four or more.
The branched upstream flow path (the upstream flow path 48 other than the first upstream flow path 48A) may branch off outside the chamber 7.

The plurality of ejection ports 34 may not be aligned in the radial direction Dr in a plan view as long as the plurality of ejection ports 34 are respectively disposed at a plurality of positions having different distances from the rotation axis A1.
The plurality of discharge ports 34 may include oblique discharge ports that discharge the processing liquid in a discharge direction inclined with respect to the upper surface of the substrate W so as to approach the rotation axis A1 as the upper surface of the substrate W is approached.

The chemical solution may be discharged to the plurality of nozzles 26 while rotating the plurality of nozzles 26 around the nozzle rotation axis A2.
In the above embodiment, the case where all the discharge valves 51 are opened simultaneously and all the discharge valves 51 are closed simultaneously has been described, but the control device 3 calculates the time during which the outer discharge port 34 discharges the treatment liquid. The plurality of discharge valves 51 may be controlled so as to be longer than the time during which the inner discharge port 34 is discharging the treatment liquid.

The expected return temperature may be a value less than the in-tank temperature set value. In this case, it is preferable that a value obtained by subtracting the expected return temperature from the in-tank temperature set value is smaller than the minimum value of the differences between the _first to fourth downstream temperatures T _{1 to} T ₄ . In the example shown in FIG. 9, since the minimum value of the difference between the _first to fourth downstream temperatures T _{1 to} T ₄ is 5 ° C., the value obtained by subtracting the expected return temperature from the in-tank temperature set value is 5 ° C. It is preferable that it is smaller than that.

  Two or more of all the aforementioned configurations may be combined. Two or more of all the aforementioned steps may be combined.

1: Substrate processing apparatus 2: Processing unit 3: Controller 11: Spin chuck (substrate holding means)
26A: first nozzle 26B: second nozzle 26C: third nozzle 26D: fourth nozzle 34A: first discharge port 34B: second discharge port 34C: third discharge port 34D: fourth discharge port 41: chemical tank (tank )
42: circulation flow path 43: upstream heater 44: pump (liquid transfer device)
45: supply valve 46: circulation valve 47: supply flow channel 48: upstream flow channel 48A: first upstream flow channel 48B: second upstream flow channel 48C: third upstream flow channel 48D: fourth upstream flow channel 49: flow meter 50: Flow adjustment valve 51: Discharge valve (switching unit)
52: downstream flow channel 53: downstream heater 54: return flow channel 55: return valve (switching unit)
57: Liquid level sensor 58: New liquid flow path 59: New liquid valve 61: Temperature control unit in tank 62: Temperature control unit in piping 63: Flow control unit 64: Return temperature control unit A1: Rotation axis W: Substrate

Claims (7)

Substrate holding means for rotating the substrate about a vertical rotation axis passing through the center of the substrate while holding the substrate horizontally;
A plurality of discharge ports for discharging the processing liquid toward the substrate held by the substrate holding means;
A tank for storing the processing liquid discharged from the plurality of discharge ports;
A circulation channel for circulating the processing liquid in the tank;
A liquid sending apparatus for sending the treatment liquid in the tank to the circulation channel;
An upstream heater that heats the processing liquid flowing in the circulation channel;
A supply flow path for guiding the processing liquid in the circulation flow path toward the plurality of discharge ports;
A plurality of upstream flow channels which are branched from the supply flow channel and guide the treatment liquid in the supply flow channel toward the plurality of discharge ports;
A cooler for cooling the processing liquid, or a cooling / heating unit for heating and cooling the processing liquid, provided in each of the plurality of upstream flow channels, which flows in the plurality of upstream flow channels by at least one of heating and cooling With multiple temperature controllers to change the temperature,
A plurality of flow control valves, each provided in the plurality of upstream flow paths, for changing the flow rate of the processing liquid sent to the plurality of temperature regulators;
A plurality of return flow paths respectively connected to the plurality of upstream flow paths downstream of the plurality of temperature regulators, and guiding the processing liquid whose temperature has been changed by the plurality of temperature regulators toward the tank ,
A discharge state in which the processing liquid supplied from the supply flow path to the plurality of upstream flow paths is supplied to the plurality of discharge ports, and the treatment liquid supplied from the supply flow path to the plurality of upstream flow paths is the above A switching unit that switches between a plurality of states including a discharge stop state supplied to the plurality of return flow paths;
An in-tank temperature control unit that controls the upstream heater so that the temperature of the processing liquid in the tank becomes the in-tank temperature setting value;
The temperatures of the processing liquid having passed through the plurality of temperature regulators become the plurality of in-pipe temperature setting values, and the maximum value of the plurality of in-pipe temperature setting values becomes equal to or more than the in-tank temperature setting value. A pipe temperature control unit that controls the plurality of temperature regulators so that the minimum value of the pipe temperature set value is smaller than the tank temperature set value;
A flow rate control unit configured to control the plurality of flow rate adjustment valves such that the flow rate of the processing liquid having passed through the plurality of flow rate adjustment valves becomes a plurality of flow rate setting values, respectively;
The calculated values of the heat amounts of all the processing solutions returning to the tank from the plurality of return flow channels in unit time are divided by the calculated values of the volumes of all the processing solutions returning to the tank from the plurality of return flow channels in the unit time A return temperature control unit configured to set the in-tank temperature set value, the plurality of in-pipe temperature set values, and the plurality of flow rate set values such that the estimated return temperature, which is A substrate processing apparatus comprising:   The substrate processing apparatus according to claim 1, wherein each of the plurality of temperature regulators is the cooling unit.   The substrate processing apparatus according to claim 1, wherein a value obtained by subtracting the predicted return temperature from the in-tank temperature setting value is smaller than a minimum value of differences between the plurality of in-pipe temperature setting values.   The substrate processing apparatus according to any one of claims 1 to 3, further comprising a new liquid flow path for guiding a new processing liquid having a liquid temperature equal to or lower than the in-tank temperature setting value into the tank.   The collection return channel according to any one of claims 1 to 4, further comprising a collective return flow channel connected to each of the plurality of return flow channels and guiding the processing liquid from the plurality of return flow channels to the tank. Substrate processing equipment.   The substrate processing apparatus according to any one of claims 1 to 5, wherein the plurality of discharge ports are respectively arranged at a plurality of positions different in horizontal distance from the rotation axis. A substrate rotating step of rotating the substrate about the vertical rotation axis passing through the central portion of the substrate while holding the substrate horizontally by the substrate holding means;
A process liquid discharge step of discharging a process liquid to a plurality of discharge ports toward the substrate held by the substrate holding means;
A processing liquid storing step of storing the processing liquid discharged from the plurality of discharge ports in a tank;
Circulating a treatment liquid in the tank to a circulation channel;
A liquid sending step of sending a treatment liquid to the liquid feeding device from the tank to the circulation flow path;
An upstream temperature control step of heating the processing solution flowing in the circulation channel to the upstream heater;
Supplying the treatment liquid in the circulation flow channel to the supply flow channel toward the plurality of discharge ports;
An upstream guiding step of guiding the processing liquid in the supply channel toward the plurality of discharge ports to the plurality of upstream channels branched from the supply channel;
The plurality of upstream flow paths including a cooler for cooling the processing liquid or a cooling unit for heating and cooling the processing liquid, the plurality of temperature regulators respectively provided in the plurality of upstream flow paths by at least one of heating and cooling A downstream temperature control step of changing the temperature of the processing solution flowing through the
A flow rate changing step of changing a flow rate of the processing liquid sent to the plurality of temperature regulators to a plurality of flow rate adjustment valves respectively provided in the plurality of upstream flow paths;
A return that guides the processing liquid whose temperature has been changed by the plurality of temperature regulators toward the tank to the plurality of return channels respectively connected to the plurality of upstream channels downstream of the plurality of temperature regulators. Process,
A discharge state in which the processing liquid supplied from the supply flow path to the plurality of upstream flow paths is supplied to the plurality of discharge ports, and the treatment liquid supplied from the supply flow path to the plurality of upstream flow paths is the above A discharge switching step of switching the switching unit between a plurality of states including a discharge stop state supplied to the plurality of return flow paths;
An in-tank temperature control step of causing the in-tank temperature control unit to control the upstream heater so that the temperature of the processing liquid in the tank becomes the in-tank temperature setting value;
The temperatures of the processing liquid having passed through the plurality of temperature regulators become the plurality of in-pipe temperature setting values, and the maximum value of the plurality of in-pipe temperature setting values becomes equal to or more than the in-tank temperature setting value. In-pipe temperature control step of causing the in-pipe temperature control unit to control the plurality of temperature regulators so that the minimum value of the in-pipe temperature setting value becomes smaller than the in-tank temperature setting value;
A flow rate control step of causing the flow rate control unit to control the plurality of flow rate adjustment valves such that the flow rates of the processing liquid having passed through the plurality of flow rate adjustment valves become a plurality of flow rate setting values, respectively;
The calculated values of the heat amounts of all the processing solutions returning to the tank from the plurality of return flow channels in unit time are divided by the calculated values of the volumes of all the processing solutions returning to the tank from the plurality of return flow channels in the unit time The return temperature control unit sets the in-tank temperature set value, the plurality of in-pipe temperature set values, and the plurality of flow rate set values so that the estimated return temperature, which is the predetermined value, becomes equal to or less than the in-tank temperature set value. And a substrate temperature control method.

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