JP2018181725A - Method for forming transparent electrode wiring - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming transparent electrode wiring which is inexpensive, has a high transmittance and excellent reliability, and is to be used for a touch panel sensor, by shortening a process of forming transparent electrode wiring to make a waste liquid treatment process unnecessary, and by selectively forming a transparent conductive material in a portion necessary for the transparent electrode wiring.SOLUTION: The method for forming transparent electrode wiring includes, upon forming electrode wiring in at least a view area (display unit) of a touch panel, disposing a photosensitive resin layer on a support substrate, printing the surface of the photosensitive resin layer with a coating liquid for forming a conductive layer containing conductive fibers and an organic solvent or water as a dispersion solvent, by an inkjet method, and irradiating these layers with UV rays to cure the photosensitive resin layer.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of forming a transparent electrode wiring used for a touch panel sensor.

  The view area of the touch panel is a sensor panel that forms transparent electrode wiring on a transparent glass plate or thin film transparent film that is a supporting substrate, and senses information touched by a human finger or the like without blocking display information on the screen. .

  The transparent electrode wiring of the touch panel view area is formed as follows.

<First method>
The transparent electrode wiring of the touch-panel view area widely employ | adopted is the material which formed the transparent conductive layer in the whole surface of the single side | surface or both surfaces of the transparent glass plate which is a support base material, and a thin film transparent film. The method of forming the transparent conductive layer is generally a method of forming ITO (indium tin oxide film) by a sputtering method, and a method of forming a coating liquid containing a conductive fiber by a coating method. First, a photosensitive etching resist film is bonded to a transparent conductive layer applied on a supporting substrate, and exposure is performed using a film mask or a glass mask as a photomask for forming a wiring of a predetermined pattern. Thereafter, the photosensitive etching resist film of the portion unnecessary for the wiring is removed by development, and then the transparent conductive layer exposed from the photosensitive etching resist is etched away to dissolve and remove the exposed transparent conductive layer. Further, the photosensitive etching resist film remaining on the transparent conductive layer is peeled off and removed to obtain a transparent electrode wiring.

  FIG. 2 is a schematic cross-sectional view showing a method of forming the first transparent electrode wiring. A photosensitive etching resist film 4a is bonded to the surface of the transparent conductive layer 3 of the laminate (b) in which the transparent conductive layer 3 is formed on the supporting substrate 1 (c), and a photomask for forming a wiring of a predetermined pattern It exposes using 5 (d). Next, development (e) and etching (f) dissolve and remove the photosensitive etching resist film 4a of the portion unnecessary for the wiring and the transparent conductive layer 3. Furthermore, it consists of the process (g) which peels and removes the photosensitive etching resist film 4b which remained on the transparent conductive layer.

<Second method>
The second method, as described in Patent Document 1, comprises inkjetting a matrix layer 7 including conductive nanoscale additives 8 such as silver nanowires on the glass or ceramic glass which is the glass substrate 6 of FIG. A transparent conductor that is formed by the method and cured by ultraviolet irradiation is proposed, which reduces the photomask, the exposure process, the development process, and the peeling process for forming transparent electrode wiring of a predetermined pattern with respect to the first method. It is possible.

JP, 2015-76407, A

  In a touch panel employed in a high-end smartphone or the like, high-quality and high-definition transparent electrode wiring is required because the appearance of the function and the appearance of the screen are emphasized. On the other hand, in middle-level smartphones and lower, prices are emphasized.

  In the first method, the steps required to form a transparent electrode wire are long and the investment cost is increased, and a photomask adapted to the shape of the transparent electrode wire to be formed is required. It is difficult to manufacture a transparent electrode wiring board at a low cost, since it is dissolved and removed by etching the conductive material in a portion which does not require the processing and the wiring is unnecessary.

  In the second method, it is possible to form a transparent electrode wiring by inkjet, but in order to print a mixed solution of a highly conductive additive and a photosensitive resin to be a matrix layer, the number of contacts between the highly conductive additives Becomes unstable, which causes the operation failure of the touch panel due to the variation in pattern resistance value and the decrease in reliability.

  By increasing the content ratio of the high conductivity additive, the operation failure and the reliability are improved, but a defect such as the deterioration of the visibility of the touch panel screen due to the decrease of the total light transmittance occurs.

  Furthermore, heat treatment at 150 ° C. or higher for the purpose of improving heat resistance is required, and there is a disadvantage that it can not be used in a touch panel using a transparent film as a support substrate.

  It is an object of the present invention to shorten the process of forming a transparent electrode wiring, eliminate the need for a waste liquid treatment process, and selectively form a transparent conductive material in a portion necessary as a transparent electrode wiring to achieve low cost and low transmittance. It is to propose a method of forming a transparent electrode wiring used for a touch panel sensor which is high in reliability and excellent in reliability.

In order to solve the said subject, this invention provides a photosensitive resin layer in a support base material in [1] transparent electrode wiring formation of a touch panel view area at least, and contains an electroconductive fiber in the surface of the said photosensitive resin layer. A coating liquid for forming a conductive layer, which uses an organic solvent or water as a dispersion solvent, is printed by an inkjet method, and the photosensitive resin layer is cured by irradiating ultraviolet rays, thereby forming a transparent electrode wiring. is there.
Moreover, this invention is a formation method of the transparent electrode wiring as described in said [1] whose [2] support base material is a transparent film.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing process of the transparent electrode wiring of a touch panel is simplified by printing the coating liquid for conductive layer formation with a photosensitive resin layer on a support base material by an inkjet system, and an inexpensive touch panel is provided. It is possible to form a transparent electrode wiring which is high in transmittance and excellent in reliability.

It is a schematic cross section which shows one Embodiment of the formation method of transparent electrode wiring of this invention. It is a schematic cross section for describing one Embodiment of the formation method <1st method> of the conventional transparent electrode wiring. It is a schematic cross section for describing one Embodiment of the formation method <2nd method> of the conventional transparent electrode wiring. It is a model top view of a transparent electrode wiring pattern used by the example of the present invention, and a comparative example.

  FIG. 1 is a schematic cross-sectional view showing an embodiment of a method of forming a transparent electrode wiring of the present invention.

  A photosensitive resin layer 2 is formed (FIG. 1 (b)) so that the transparent electrode wiring 3 'is in close contact with the supporting substrate 1 to facilitate formation. The photosensitive resin layer 2 can be formed by screen printing, drum printing, or laminating a photosensitive resin film to form a laminate. Thereafter, a coating solution for forming a conductive layer using an organic solvent containing conductive fibers or water as a dispersion solvent is printed by an inkjet method to form a transparent electrode wiring 3 '(FIG. 1 (c)). Furthermore, in order to improve the adhesive force between the photosensitive resin layer 2 and the transparent electrode wiring 3 'and the supporting substrate 1, the transparent electrode wiring operable as a touch panel by irradiating the ultraviolet light to the photosensitive resin layer 2 and curing it. Is formed.

(Supporting base material)
Examples of the supporting substrate 1 include polymer films having heat resistance and solvent resistance such as transparent glass plates or transparent films, polyethylene terephthalate films, polypropylene films, and polycarbonate films. Among these, it is preferable to use a polyethylene terephthalate film from the viewpoint of transparency and heat resistance.

(Photosensitive resin layer)
The photosensitive resin layer 2 is formed by applying a photosensitive resin to the support base 1 or laminating a photosensitive film.

  The photosensitive resin layer 2 is preferably composed of a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photosensitive resin composition containing a photopolymerization initiator.

(Binder polymer)
As a binder polymer, an acrylic resin, a styrene resin, an epoxy resin, an amide resin, an amide epoxy resin, an alkyd resin, a phenol resin etc. are mentioned, for example. These can be used singly or in combination of two or more.

The above-mentioned binder polymer can be produced, for example, by radical polymerization of a polymerizable monomer. Examples of the polymerizable monomer include polymerizable styrene derivatives substituted at the α-position or aromatic ring such as styrene, vinyl toluene, α-methylstyrene, acrylamides such as diacetone acrylamide, acrylonitrile, vinyl -Esters of vinyl alcohol such as n-butyl ether, (meth) acrylic acid alkyl ester, (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic acid diethylaminoethyl ester, ( (Meth) acrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, (meth) acrylic acid, α-bromo (meth) acrylic Acid, α-chloro ( Ta) Acrylic acid, β-furyl (meth) acrylic acid, β-styryl (meth) acrylic acid, maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate, maleic acid monoester such as monoisopropyl maleate, Examples include fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid and propiolic acid.
In addition, (meth) acrylic acid means acrylic acid... Or methacrylic acid. Likewise, (meth) acrylate means acrylate or methacrylate.

(Photopolymerizable Compound Having Ethylenically Unsaturated Bond)
As a photopolymerizable compound having an ethylenically unsaturated bond, for example, a compound obtained by reacting an α, β-unsaturated carboxylic acid with a polyhydric alcohol, 2,2-bis (4-((meth) acryloxy) Polyethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypolypropoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane Etc., a compound obtained by reacting an α, β-unsaturated carboxylic acid with a glycidyl group-containing compound, a urethane monomer such as a (meth) acrylate compound having a urethane bond, γ-chloro- β-Hydroxypropyl-β '-(meth) acryloyloxyethyl-o-phthalate, β-hydroxyethyl- '- (meth) acryloyloxyethyl -o- phthalate, beta-hydroxypropyl -Beta'- (meth) acryloyloxyethyl -o- phthalate, and (meth) acrylic acid alkyl ester. These are used alone or in combination of two or more.

(Polymerization initiator)
Examples of the polymerization initiator include benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N, N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4 '. -Dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1 and the like Aromatic ketones, 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2- Quinones such as methylanthraquinone, 1,4-naphthoquinone, 9,10-phenantaraquinone, 2-methyl 1,4-naphthoquinone, 2,3-dimethylanthraquinone, benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, etc. Benzoin compounds such as benzoin ether compounds, benzoin, methylbenzoin, ethylbenzoin, 1,2-octanedione, 1- [4- (phenylthio)-, 2- (o-benzoyloxime)], ethanone, 1- [9- Oxime ester compounds such as ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (o-acetyl oxime), benzyl derivatives such as benzyl dimethyl ketal, 2- (o-chlorophenyl) -4,5-Diphenylimidazole Body, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) ) 2, 4, 5-triarylimidazole dimers such as 4, 5-diphenylimidazole dimer, 2- (p-methoxyphenyl)-4, 5-diphenylimidazole dimer, 9-phenylacridine, There may be mentioned acridine derivatives such as 1,7-bis (9,9'-acridinyl) heptane, N-phenylglycine, N-phenylglycine derivatives, coumarin compounds and oxazole compounds. Also, the substituents of the aryl groups of the two 2,4,5-triarylimidazoles may give identical and symmetrical compounds, or they may give differently asymmetric compounds. Further, as in the combination of diethylthioxanthone and dimethylaminobenzoic acid, the thioxanthone compound and the tertiary amine compound may be combined. Among these, from the viewpoint of transparency, aromatic ketone compounds such as 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 1,2-octanedione, 1- [4 An oxime ester compound such as-(phenylthio)-, 2- (o-benzoyloxime)] is more preferable. These are used alone or in combination of two or more.

  The content ratio of the photopolymerization initiator is preferably 0.1 to 30 parts by mass, and more preferably 1 to 10 parts by mass with respect to 100 parts by mass of the total of the binder polymer and the photopolymerizable compound. If the content ratio is less than 0.1 parts by mass, the photosensitivity tends to be insufficient, and if it exceeds 30 parts by mass, absorption at the surface of the composition during exposure is increased and the internal photocuring is insufficient. Tends to

  The photosensitive resin composition can be applied by a known method such as roll coating, comma coating, gravure coating, air knife coating, die coating, bar coating, spray coating, and the like. Moreover, drying can be performed at 70-150 degreeC for about 5 to 30 minutes.

  Although the thickness of the photosensitive resin layer 2 changes with uses, it is preferable that it is 1-200 micrometers in thickness after drying, and it is more preferable that it is 1-20 micrometers. If the thickness is less than 1 μm, coating tends to be difficult industrially, and if it exceeds 200 μm, the sensitivity due to the decrease in light transmission is insufficient and the photocurability of the photosensitive resin layer 2 tends to be reduced.

(Conductive fiber)
The conductive fibers contained in the coating solution for forming a conductive layer used for forming the transparent electrode wiring 3 'are metal fibers and nanotubes. For example, silver, copper, gold, aluminum, nickel, platinum, palladium, and alloys thereof can be used, but using silver fiber (nanowire) to optimize conductivity and transparency Most preferred.

  The fibers contained in the coating liquid for forming a conductive layer have a fiber diameter of 1 to 50 nm, preferably 2 to 30 nm, more preferably 3 to 10 nm, and the metal fiber has a fiber length of 1 to 100 μm, preferably 2 to 50 μm, more preferably Is 3 to 40 μm, more preferably 5 to 35 μm. The fiber diameter and the fiber length can be measured by a scanning electron microscope.

(Thickness of transparent electrode wiring 3 ')
The thickness of the transparent electrode wiring 3 'formed by inkjet printing varies depending on the application of the transparent electrode film to be formed, the wiring pattern and the required conductivity, but it is 1 μm or less, preferably 1 nm to 0.5 μm, more preferably 5 nm It is ̃0.1 μm. When the thickness of the transparent electrode wiring 3 'is 1 μm or less, the light transmittance in the wavelength range of 450 to 650 nm is high, which is preferable.

(UV)
As a light source of ultraviolet light used for ultraviolet curing, a known light source such as a carbon arc lamp, a mercury vapor arc lamp, an ultra-high pressure mercury lamp, a high pressure mercury lamp, a xenon lamp and the like can be used.

To cure the photosensitive resin layer ^2, 500~5,000mJ / cm 2 as ultraviolet ray quantity, preferably irradiated with ultraviolet rays so that the integrated light quantity of 1,000~2,000mJ / cm ^2.

  As a device used for ultraviolet irradiation, a batch-type table-type exposure device, a conveyor-type ultraviolet irradiation furnace, or the like can be used.

  The formation of the photosensitive resin layer 2 and the printing by the inkjet method of the transparent electrode wiring 3 'and the curing by the ultraviolet light can connect the respective facilities and can be manufactured consistently, but it is transparent after the photosensitive resin layer is formed. It is also possible to paste the protective film after forming the electrode wiring, wind it up, and manufacture it discontinuously.

  As a protective film used when manufacturing it discontinuously, the polymer film which has heat resistance and solvent resistance, such as a polyethylene terephthalate film, a polypropylene film, a polyethylene film, can be used, for example. You may use the polymer film similar to the above-mentioned support base film as a protective film.

  The thickness of the protective film is preferably 1 to 100 μm, more preferably 5 to 50 μm, still more preferably 5 to 30 μm, and particularly preferably 15 to 30 μm. If the thickness of the protective film is less than 1 μm, the protective film tends to be easily broken during lamination, and if it exceeds 100 μm, the price tends to be high.

  A protective film is used to form a flat plate or take up a cylindrical shape around a winding core, which enables storage between processes and after formation of a transparent electrode wiring.

  Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited thereto.

<Preparation of solution of photosensitive resin composition>
[Synthesis of binder polymer (acrylic resin)]
In a flask equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel and a nitrogen gas inlet tube, a mixed solution of methyl cellosolve and toluene (methyl cellosolve / toluene = 3/2 (mass ratio), hereinafter, “solution s And heated at 80 ° C. with stirring while blowing in nitrogen gas. On the other hand, a solution (hereinafter referred to as "solution a") was prepared by mixing 100 g of methacrylic acid, 250 g of methyl methacrylate, 100 g of ethyl acrylate and 50 g of styrene as monomers and 0.8 g of azobisisobutyronitrile. . Next, the solution a was added dropwise over 4 hours to the solution s heated to 80 ° C., and then the mixture was kept at 80 ° C. for 2 hours while being stirred. Further, a solution of 1.2 g of azobisisobutyronitrile in 100 g of solution s was dropped into the flask over 10 minutes. Then, the solution after dropping was kept at 80 ° C. for 3 hours while being stirred, and then heated to 90 ° C. for 30 minutes. The mixture was kept at 90 ° C. for 2 hours and cooled to obtain a binder polymer solution. Acetone was added to the binder polymer solution to prepare a non-volatile component (solid content) of 50% by mass to obtain a binder polymer solution. The weight average molecular weight of the obtained binder polymer was 80,000. This was designated as acrylic polymer A.

  The material shown in Table 1 was compounded by the compounding quantity (unit: mass part) shown to the same table, and the solution of the photosensitive resin composition was prepared.

１）メタクリル酸：メタクリル酸メチル：アクリル酸エチル：スチレン＝２０：５０：２０：１０の質量比率のアクリルポリマー。

1) Acrylic polymer having a weight ratio of methacrylic acid: methyl methacrylate: ethyl acrylate: styrene = 20: 50: 20: 10.

<Preparation of Conductive Fiber>
[Preparation of silver fiber by polyol method]
In a 2000 ml three-necked flask, 500 ml of ethylene glycol was placed and heated to 160 ° C. in an oil bath while stirring with a magnetic stirrer under a nitrogen atmosphere. A solution of ₂ mg of PtCl ₂ separately prepared in 50 ml of ethylene glycol was added dropwise to this. After 4 to 5 minutes, a solution of 5 g of AgNO ₃ dissolved in 300 ml of ethylene glycol and a solution of 5 g of polyvinyl pyrrolidone (manufactured by Wako Pure Chemical Industries, Ltd.) having a weight average molecular weight of 40,000 in 150 ml of ethylene glycol The resulting solution was added dropwise over 1 minute from the dropping funnel and then stirred at 160 ° C. for 60 minutes.

  The reaction solution was allowed to stand at 30 ° C. or less, diluted 10-fold with acetone, centrifuged at 2,000 rpm for 20 minutes using a centrifuge, and the supernatant was decanted. Acetone was added to the precipitate, and after stirring, it was centrifuged under the same conditions as above, and acetone was decanted. Then, it centrifuged similarly twice using distilled water, and obtained silver fiber. When the obtained silver fiber was observed with an optical microscope, the fiber diameter (diameter) was about 5 nm, and the fiber length was about 5 μm.

[Preparation of silver fiber dispersed conductive coating solution (coating solution 1 for forming conductive layer)]
0.2% by mass of the silver fiber obtained above is dispersed in pure water, and dodecyl-pentaethylene glycol as a surfactant is dispersed at a concentration of 0.1% by mass, and a coating liquid for forming a conductive layer I got one.

[Preparation of carbon nanotube dispersed conductive coating solution (coating solution 2 for forming conductive layer)]
In pure water, 0.4% by mass of a high purity product of Unico's Hipco single-walled carbon nanotubes, and 0.1% by mass of dodecyl-pentaethylene glycol as a surfactant are dispersed to conduct electricity. The coating liquid 2 for layer formation was obtained.

<Production of photosensitive film>
The solution of the photosensitive resin composition described above is applied to the surface of a support film of 100 μm thick polyethylene terephthalate film (PET film, manufactured by Toyobo Co., Ltd., trade name “A4100”, single-sided easy adhesion treatment) Were uniformly applied, and dried for 10 minutes with a hot air convection dryer at 100 ° C. to form a photosensitive resin layer. The film thickness after drying of the photosensitive resin layer was 5 μm. Furthermore, the photosensitive resin layer was covered with a protective film made of polyethylene (manufactured by Tamapoly Co., Ltd., trade name "NF-13") to obtain a transparent photosensitive film 1.

<Preparation of transparent electrode wiring>
Example 1
On the photosensitive resin layer of the transparent photosensitive film 1 from which the protective film has been peeled off, the coating liquid 1 for forming a conductive layer is ejected at a discharge amount of 25 g / m ² by the ink jet method. Electrode wiring of 500 μm in width and 10 cm in length shown in FIG. After printing 100 of 10 with a gap of 200 μm and transparent electrode wiring (3 cm × 3 cm square pattern) 11, it was dried with a hot air convection dryer at 100 ° C. for 10 minutes to form a transparent electrode wiring.

Then, the ultraviolet-ray of 1,000 mJ / cm < ² > of accumulated light quantity was irradiated from the transparent electrode wiring side with a conveyor type ultraviolet irradiation machine, and the transparent electrode wiring board for touch panels was obtained. In addition, the film thickness of the transparent electrode wiring after drying was about 0.1 micrometer.

(Example 2)
On the photosensitive resin layer of the transparent photosensitive film 1 from which the protective film has been peeled off, the coating liquid 2 for forming a conductive layer is ejected at a discharge amount of 25 g / m ² by the inkjet method. Electrode wiring of 500 μm in width and 10 cm in length shown in FIG. After printing 100 of 10 with a gap of 200 μm and transparent electrode wiring (3 cm × 3 cm square pattern) 11, it was dried with a hot air convection dryer at 100 ° C. for 10 minutes to form a transparent electrode wiring.

Subsequently, ultraviolet light was irradiated from the transparent electrode wiring side with an integrated light amount of 1,000 mJ / cm ² by a conveyor type ultraviolet light irradiation machine to obtain a transparent electrode wiring substrate for a touch panel. In addition, the film thickness of the transparent electrode wiring after drying was about 0.1 micrometer.

(Comparative example 1)
A commercially available ethanolic silver nanowire dispersion having nanowires with an average wire diameter of 40 nm and an average wire length of 35 μm was centrifuged. After decantation of the ethanol, it was added a terpineol-ethanol mixture at a volume ratio of 1: 1 as a solvent. The silver nanowire dispersion was mixed with a sol-gel binder based on aluminum sec-butoxide in a ratio of 40: 1 and stirred to obtain a coating paint. 4 by 100 g of electrode wiring 10 of width 500 μm and length 10 cm with a gap of 200 μm and transparent electrode wiring (square pattern of 3 cm × 3 cm) 11 on a transparent glass ceramic by an inkjet method with a discharge amount of 25 g / m ² And then thermally cured at 200 ° C. for 90 minutes to form a transparent conductive layer. In addition, the film thickness of the transparent electrode wiring after thermosetting was about 0.3 micrometer.

The wiring resistance of the transparent electrode wiring 10 manufactured based on Examples and Comparative Examples using a commercially available current voltmeter, and the surface resistance and total light transmittance using the transparent electrode wiring (3 cm × 3 cm square pattern) 11 It measured. The wiring resistance is digital multimeter "6871E" made by ADC Corporation, the surface resistance is non-contacting surface resistance meter "EC-80P" made by Napson Co., Ltd., and the total light transmittance is "Nippon Denshoku Kogyo Co., Ltd." A haze meter NDH-5000 "was used. Furthermore, the transparent electrode wiring (3 cm × 3 cm square pattern) 11 was left in a high temperature and high humidity environment at 85 ° C. and humidity 85% RH, and the surface resistance after 1,000 hours was similarly measured to calculate the resistance increase rate. .
The measurement results are summarized in Table 2.

  From the above results, it was possible to obtain a touch panel substrate having high conductivity, insulation property, and total light transmittance by forming the transparent electrode wiring by the inkjet method via the photosensitive resin layer.

  At present, applications for touch panels are adopted in a wide range of fields such as smart watches, game consoles, industrial equipment, vehicles, etc. in addition to smartphones and tablet-type terminal devices, and demand for lower prices is advancing. According to the present invention, it is possible to manufacture a transparent electrode wiring board of equivalent performance without requiring a tool such as a photomask and without requiring a chemical treatment process such as development and etching.

  The touch panel substrate manufactured by the method of forming a transparent electrode wiring for a touch panel substrate according to the present invention can be used for forming a flat panel display such as a liquid crystal display element, a touch screen, a display for shielding applications and wiring of the transparent electrode.

1. Support substrate 2. Photosensitive resin layer3. Transparent conductive layer 3 '. Transparent electrode wiring 4a. Photosensitive film (before curing)
4b. Photosensitive film (after curing)
5. Photo mask6. Glass substrate 7. Matrix layer 8. Conductive nanoscale additives9. Conductive layer 10. Transparent electrode wiring (width 500 μm, length 10 cm)
11. Transparent electrode wiring (3 cm × 3 cm square pattern)

Claims (2)

  A photosensitive resin layer is provided on a support base in at least forming a transparent electrode wiring in a touch panel view area, and a conductive fiber is contained on the surface of the photosensitive resin layer and an organic solvent or water is used as a dispersion solvent A method of forming a transparent electrode wiring, comprising: printing a coating liquid by an inkjet method; and curing the photosensitive resin layer by irradiating ultraviolet light.   The method for forming a transparent electrode wiring according to claim 1, wherein the supporting substrate is a transparent film.

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