JP2018174184A - Cooling device and lighting device provided with cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooler exhibiting excellent cooling performance by heating a base plate, receiving heat from an electrical heating element, smoothly and evenly throughout, thereby improving radiation action of radiation fins.SOLUTION: A cooler for cooling an electrical heating element mounted on a board includes a base having a first base plate one side of which is thermally connected with the board, and a first heat conduction member connected thermally with the first base plate, and conducting heat along the face thereof, and a heat sink having a second base plate thermally connected with the other side of the first base plate on one side, a second heat conduction member conducting heat along the face of the second base plate, and connected thermally with the second base plate having heat conduction direction different from that of the first heat conduction direction, and radiation fins standing on the other side of the second base plate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cooling device for cooling a heating element, for example, a cooling device for cooling a semiconductor element such as an LED element. Moreover, this invention relates to the illuminating device provided with the cooling device which cools lighting fixtures, such as an LED element.

  As a conventional cooling device, a heat sink in which heat dissipating fins are provided on a base plate made of a heat conductor such as aluminum has been used. By thermally connecting the heat sink to a heating element such as a semiconductor element, the heat of the heating element is transmitted to the heat sink and released from the radiating fins into the atmosphere, thereby cooling the heating element.

  On the other hand, in recent years, since the output of heating elements such as semiconductor elements has increased and the mounting density has been increased, the heat sink is required to have a higher heat dissipation amount per unit area. Therefore, a heat sink using a base plate that holds a heating element on one surface and in which heat radiating fins are arranged in parallel on the other surface, wherein at least one heat pipe is provided over the entire length of the base plate. There has been proposed a heat sink including a heat pipe characterized by being embedded and disposed (Patent Document 1). In Patent Document 1, heat from the heat generating element is transported to the entire base plate, thereby improving the heat dissipating action by the heat dissipating fins and, as a result, improving the cooling performance.

  However, in Patent Document 1, since the heat transfer direction of the heat pipe provided on the base plate is limited to a certain direction of the base plate, it is not sufficient to equalize the base plate, and the heat radiation action is sufficiently improved by the heat radiation fins. There was a problem that was not. In particular, when the heat sink of Patent Document 1 is applied as a cooling device for a high-power semiconductor element, it is necessary to provide a larger number of heat pipes in order to improve the heat radiation action by the heat radiation fins. There have been problems such as an increase in production cost due to an increase in size, base plate processing costs, and heat pipe costs.

  In addition, it is conceivable to adopt a water cooling method as a heat dissipation method with a high heat generation density. For example, when applied to an electrical device, additional installation of insulation means for electrical parts, a leakage prevention structure for cooling water circulation system, cooling water circulation There are problems such as ensuring the reliability of the pump, installing a heat exchanger for water and air, and the problem that maintenance and inspection are complicated compared to an air-cooled cooling device.

JP 2005-76979 A

  The present invention has been made in view of the above-described problems of the prior art, and the base plate that has received heat from the heating element is smoothed uniformly throughout, thereby improving the heat dissipating action of the heat dissipating fins and being excellent. It aims at providing the cooling device which exhibits cooling performance.

  An aspect of the present invention is a cooling device for cooling a heating element mounted on a substrate, wherein the first base plate is thermally connected to one surface, and the surface of the first base plate A first heat conducting member thermally connected to the first base plate and conducting heat along the first base plate, heat on one side and the other side of the first base plate A second base plate connected to the second base plate and thermally conductive to the second base plate that conducts heat along the surface of the second base plate and has a different heat conduction direction from the first heat conducting member. It is a cooling device provided with the heat sink part which has the connected 2nd heat conductive member, and the radiation fin erected on the other surface of this 2nd base plate.

  In the above aspect, the cooling device has a heat sink structure, the heat of the heating element is transmitted from the heating element to the first base plate, and the heat transmitted to the first base plate is transmitted by the first heat conducting member to the first base plate. It is transmitted along the surface of the base plate. The heat transferred along the surface of the first base plate is transferred from the first base plate to the second base plate, and transferred along the surface of the second base plate by the second heat conducting member. The heat transferred along the surface of the second base plate is released to the external environment from the heat radiating fins standing on the second base plate.

  An aspect of the present invention is a cooling device in which the first heat conducting member is a heat pipe.

  An aspect of the present invention is a cooling device in which the second heat conducting member is a heat pipe.

  An aspect of the present invention is a cooling device in which a groove or a hole for attaching the first heat conducting member is provided in the first base plate.

  An aspect of the present invention is a cooling device in which a groove or a hole for attaching the second heat conducting member is provided in the second base plate.

  In the above aspect, the first heat conduction member and the second heat conduction member are attached to the groove portions or the hole portions of the first base plate and the second base plate, respectively, so that the first heat is applied to the first base plate. The conductive member is thermally connected, and the second heat conductive member is thermally connected to the second base plate.

  An aspect of the present invention is the cooling device in which a heat conduction direction of the first heat conduction member is perpendicular to a heat conduction direction of the second heat conduction member.

  An aspect of the present invention is the cooling device in which the substrate is connected to a position corresponding to an end portion of the second heat conducting member in the heat conducting direction.

  An aspect of the present invention is a cooling device for cooling LED lighting.

  An aspect of the present invention is a substrate on which an LED element is mounted, a cooling device for cooling the LED element, the first base plate thermally connected to one surface, the first base plate, A base portion having a first heat conducting member thermally connected to the first base plate that conducts heat along the surface of the one base plate, and the other side of the first base plate A second base plate thermally connected at the surface of the second base plate, and the second base plate thermally conducting along the surface of the second base plate and having a heat conduction direction different from that of the first heat conducting member. A cooling device comprising: a second heat conducting member thermally connected to the base plate; and a heat sink portion having a heat radiating fin standing on the other surface of the second base plate. It is a lighting device.

  An embodiment of the present invention is the lighting device in which the thickness of the substrate is 2.0 mm or greater and 5.0 mm or less.

  According to an aspect of the present invention, in the above illumination device, instead of the substrate, the first base plate is provided with an insulating portion including an electrode and a wiring for connecting the LED element, and the LED element is provided on the electrode. Is a lighting device mounted.

  According to the aspect of the cooling device of the present invention, the heat conduction direction of the first heat conduction member thermally connected to the first base plate and the second heat conduction member thermally connected to the second base plate. Therefore, the second base plate that has received heat from the heating element through the base portion by the heat transfer action of the first heat conductive member and the second heat conductive member is entirely in the direction. The temperature is smoothed over the entire surface. Therefore, since the heat radiation efficiency of the heat radiating fins standing on the second base plate surface is improved, excellent cooling performance can be exhibited. As described above, since the heat dissipation efficiency of the heat dissipation fins is improved, the output of the heat generating element such as a semiconductor element is increased, and even if the mounting density of the heat generating element is increased, the heat sink is increased in size due to the increase in the heat conduction member. Excellent cooling performance can be exhibited while suppressing an increase in manufacturing cost.

  According to the aspect of the present invention, the cooling efficiency is further improved by using the heat pipe as the first heat conducting member and the second heat conducting member.

  According to the aspect of the present invention, since the heat conductive member is attached to the groove or the hole of the base plate, the base plate and the heat conductive member can be in direct contact with each other, so that the thermal connectivity between the base plate and the heat conductive member is improved. This improves the temperature of the base plate.

  According to the aspect of the present invention, the substrate is connected to the position corresponding to the end portion of the second heat conducting member in the heat conducting direction, so that the second heat conduction can be achieved even if the installation posture of the cooling device is changed. The heat transfer effect of the member is reliably exhibited.

  According to the aspect of the lighting device of the present invention, by providing the substrate on which the LED element is mounted and the cooling device, the output of the LED element mounted on the substrate is increased, and the mounting density is increased. However, since the said cooling device has the outstanding cooling performance, it can cool an LED element reliably.

  According to the aspect of the present invention, the thickness of the substrate is 2.0 mm to 5.0 mm, thereby maintaining the rigidity of the substrate and preventing the deformation of the substrate due to the attachment of the substrate to the first base plate. The increase in thermal resistance in the thickness direction of the substrate can be prevented.

  According to the aspect of the present invention, the first base plate is provided with the insulating portion including the electrode and wiring for connecting the LED element instead of the substrate, so that the LED element can be connected to the first element without the substrate. Since it can be mounted on the base plate, the influence of thermal expansion of the substrate can be prevented, and heat can be stably conducted from the LED element to the first base plate. Therefore, heat dissipation efficiency can be exhibited stably.

It is a cooling device concerning the example of a 1st embodiment of the present invention, and is an explanatory view in the state where a heating element was attached. It is a cooling device which concerns on the 2nd Example of this invention, Comprising: It is explanatory drawing of the state which attached the heat generating body. It is a partial explanatory view of an illuminating device according to a second embodiment, provided with a cooling device according to an embodiment of the present invention.

  The cooling device according to the first embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the cooling device 1 according to the first embodiment includes a base portion 10 to which the heating element 100 is thermally connected, and a heat sink portion 20 that is thermally connected to the base portion 10. Have.

  The base unit 10 includes a first base plate 11 and a first heat pipe 12 that is a first heat conducting member that is thermally connected to the first base plate 11. The shape of the first base plate 11 is not particularly limited, but the cooling device 1 is a plate-like member having a rectangular shape in plan view. The first base plate 11 has one surface 11-1 (rear surface) that is planar and the other surface 11-2 (front surface) that is also opposite to the one surface 11-1, which is also planar. doing. The substrate 101 on which the heating element 100 is mounted is thermally connected to one surface 11-1 of the first base plate 11. In the present specification, “plan view” means an aspect viewed from the vertical direction with respect to the surface of the first base plate 11.

  In the cooling device 1, the first heat pipe 12 is disposed on the surface portion of the first base plate 11, that is, the other surface 11-2. The shape of the first heat pipe 12 in plan view is linear. Further, along the longitudinal direction of the other surface 11-2 of the first base plate 11, a linear shape extends from one end of the other surface 11-2 to the other end facing the one end. The first heat pipe 12 extends. Therefore, in the cooling device 1, the heat transport direction of the first heat pipe 12 is parallel to the other surface 11-2 of the first base plate 11 and is the longitudinal direction of the first base plate 11. Yes.

  In the cooling device 1, the groove 13 corresponding to the shape and dimensions of the first heat pipe 12 is provided on the other surface 11-2. By fitting the first heat pipe 12 into the groove portion 13, the first heat pipe 12 is attached to the first base plate 11, and the first heat pipe 12 is thermally connected to the first base plate 11. Has been. The outer surface exposed from the first base plate 11 of the first heat pipe 12 fitted in the groove 13 and the other surface 11-2 of the first base plate 11 are located on substantially the same plane.

  The number of the first heat pipes 12 installed is not particularly limited, but a plurality of the first heat pipes 12 are installed in the cooling device 1. In addition, the first heat pipes 12 are arranged substantially at regular intervals and in parallel with each other.

  As shown in FIG. 1, the heat sink unit 20 includes a second base plate 21, a second heat pipe 22 that is a second heat conducting member thermally connected to the second base plate 21, and a second heat pipe 22. And heat radiating fins 24 erected on the base plate 21. The heat sink 20 is thermally connected to the base 10 by the second base plate 21 being thermally connected to the other surface 11-2 of the first base plate 11. The second base plate 21 has one plane 21-1 (back surface) that is planar and the other plane 21-2 (front surface) that is opposite to the one surface 21-1, and that is also planar. doing. The heat sink portion 20 is thermally connected to the base portion 10 by, for example, one surface 21-1 of the second base plate 21 directly contacting the other surface 11-2 of the first base plate 11. Accordingly, the cooling device 1 has a structure in which the first base plate 11 and the second base plate 21 are laminated. As a fixing means of the 2nd base plate 21 to the 1st base plate 11, screwing etc. can be mentioned, for example.

  The shape of the second base plate 21 is not particularly limited, but the cooling device 1 is a plate-like member having a square shape in plan view. The area of the second base plate 21 in plan view is larger than the area of the first base plate 11 in plan view. The length of the first base plate 11 in the longitudinal direction is substantially the same as the length of the second base plate 21 parallel to the longitudinal direction of the first base plate 11. The end surface and the end surface of the second base plate 21 parallel to the longitudinal direction of the first base plate 11 are located on the same plane.

  In the cooling device 1, the second heat pipe 22 is disposed on the back surface of the second base plate 21, that is, on one surface 21-1 facing the other surface 11-2 of the first base plate 11. . The shape of the second heat pipe 22 in plan view is linear. Further, along the one surface 21-1 of the second base plate 21, a second linear shape extending from a predetermined end of the one surface 21-1 to the other end facing the predetermined end. The heat pipe 22 extends. Therefore, the heat transport direction of the second heat pipe 22 is parallel to the one surface 21-1 of the second base plate 11.

  Further, the second heat pipe 22 is arranged so that the heat transport direction of the second heat pipe 22 is not parallel to the heat transport direction of the first heat pipe 12 in plan view. That is, the heat transport direction of the second heat pipe 22 is different from the heat transport direction of the first heat pipe 12. In the cooling device 1, the second heat pipe 22 is arranged so that the heat transport direction of the second heat pipe 22 is substantially orthogonal to the heat transport direction of the first heat pipe 12. That is, each linear second heat pipe 22 is disposed so as to be substantially orthogonal to each linear first heat pipe 12 in plan view.

  In the cooling device 1, the first base plate 11 (the other of the first base plate 11 is positioned at a position corresponding to the center of each second heat pipe 22 on one surface 21-1 of the second base plate 21. The surface 11-2) is thermally connected.

  In the cooling device 1, a groove 23 corresponding to the shape and size of the second heat pipe 22 is provided on one surface 21-1 of the second base plate 21. By fitting the second heat pipe 22 into the groove 23, the second heat pipe 22 is attached to the second base plate 21, and the second heat pipe 12 is thermally connected to the second base plate 21. Has been. The outer surface exposed from the second base plate 21 of the second heat pipe 22 fitted in the groove 23 and the one surface 21-1 of the second base plate 21 are located on substantially the same plane.

  Further, the number of the second heat pipes 22 is not particularly limited, but a plurality of the second heat pipes 22 are installed in the cooling device 1. In addition, the second heat pipes 22 are arranged substantially at regular intervals and in parallel with each other. Moreover, the center part of any second heat pipe 22 is provided at a position overlapping the first base plate 11 in plan view.

  On the other surface 21-2 of the second base plate 21, flat plate-shaped heat radiation fins 24 are erected. Since the radiation fins 24 are erected on the surface portion of the second base plate 21, the second base plate 21 and the radiation fins 24 are thermally connected. The heat radiating fins 24 are erected in the vertical direction with respect to the other surface 21-2 of the second base plate 21. That is, the radiation fins 24 are provided so that the surfaces thereof are substantially perpendicular to the other surface 21-2 of the second base plate 21. Moreover, the radiation fin 24 is erected so as to be substantially orthogonal to the extending direction of the second heat pipe 22 in a plan view. Therefore, the radiation fins 24 are erected substantially in parallel with the extending direction of the first heat pipe 12 in a plan view.

  The number of the radiating fins 24 is not particularly limited, but a plurality of radiating fins 24 are installed in the cooling device 1. Further, the heat radiating fins 24 are arranged substantially at regular intervals and in parallel with each other.

  The method for attaching the radiating fins 24 to the second base plate 21 is not particularly limited. For example, joining means such as soldering, brazing, and welding, or a groove on the other surface 21-2 of the second base plate 21. And a fitting means for fitting the end portion of the radiating fin 24 into the groove.

  The first base plate 11, the second base plate 21, and the heat radiating fins 24 are all metallic materials having good thermal conductivity, and are made of aluminum, aluminum alloy, copper, copper alloy, or the like. The container materials of the first heat pipe 12 and the second heat pipe 22 are also made of the same metal material as the first base plate 11, the second base plate 21, and the heat radiation fins 24. Inside the first heat pipe 12 and the second heat pipe 22, a working fluid that matches the compatibility with the container material is sealed in a reduced pressure state. An example of the working fluid is water.

  The cross-sectional shapes of the first heat pipe 12 and the second heat pipe 22 are not particularly limited, and examples thereof include a circle, an ellipse, and a flat shape obtained by flattening a circle. In the cooling device 1, both the first heat pipe 12 and the second heat pipe 22 have a shape obtained by flattening a circular shape on the surface exposed from the base plate.

  The dimensions of the cooling device 1 according to the first embodiment are not particularly limited. For example, the first base plate 11 is 150 mm × 350 mm × thickness 10 mm, the second base plate 21 is 350 mm × 350 mm × thickness 10 mm, and heat dissipation. Examples of the fin 24 include height 150 mm × width 350 mm × thickness 0.5 mm. Moreover, the fin pitch of the radiation fin 24 is not particularly limited, and examples thereof include 5 to 20 mm.

  Next, the operation of the cooling device 1 according to the first embodiment will be described. In the cooling device 1, the case where the substrate 101 on which the heating element 100 is mounted is thermally connected to one end in the longitudinal direction of the one surface 11-1 of the first base plate 11 will be described as an example. To do.

  The heat of the heating element 100 is transmitted from the heating element 100 to one end portion of the first base plate 11, and the heat transferred to one end portion of the first base plate 11 is transferred by the first heat pipe 12. Along one surface 11-1 of the first base plate 11, the first base plate 11 is transported from one end to the other end (vertical direction in FIG. 1) opposite to the one end. One end of the first base plate 11 is cooled by heat transport of the first heat pipe 12, and one end and the other end are soaked. The heat diffused from one end of the first base plate 11 toward the other end is transferred from the first base plate 11 to the second base plate 21. Therefore, the second base plate 21 receives the heat substantially uniformly in the entire portion overlapping the first base plate 11.

  Since the 1st base plate 11 is thermally connected to the position corresponding to the center part of the 2nd heat pipe 22, the center part among the 2nd heat pipes 22 is an evaporation part, and both ends are condensation parts. Function as. Accordingly, the heat transmitted to the second base plate 21 is caused to extend from the central portion of the second base plate 21 toward both ends by the second heat pipe 22 along the one surface 21-1 of the second base plate 21. That is, it is transported in a direction substantially orthogonal to the heat transport direction of the first heat pipe 12 (lateral direction in FIG. 1). The heat diffused in the second base plate 21 in a direction substantially orthogonal to the heat transport direction of the first heat pipe 12 is transmitted from the second base plate 21 to the heat radiating fins 24 and released from the heat radiating fins 24 to the external environment. The

  The heat transport direction of the first heat pipe 12 thermally connected to the first base plate 11 is different from the heat transport direction of the second heat pipe 22 thermally connected to the second base plate 21 ( In the cooling device 1, the second base plate 21 that has received heat from the heating element 100 via the base portion 10 by the heat transport action of the first heat pipe 12 and the second heat pipe 22 is: The temperature is smoothed smoothly throughout. Therefore, since the heat radiation efficiency of the heat radiation fins 24 erected on the second base plate 21 is improved, the cooling device 1 can exhibit excellent cooling performance.

  Next, a cooling device according to a second embodiment of the present invention will be described with reference to the drawings. In addition, about the same component as the cooling device which concerns on 1st Embodiment, it demonstrates using the same code | symbol.

  In the cooling device 1 according to the first embodiment, the first base plate 11 is thermally connected to a position corresponding to the central portion of each second heat pipe 22 in the second base plate 21. However, instead of this, as shown in FIG. 2, in the cooling device 2 according to the second embodiment, the second base plate 21 is located at a position corresponding to one end of the second heat pipe 22. The first base plate 11 is thermally connected. Therefore, in the cooling device 2, the substrate 101 is thermally connected to a position corresponding to the end of the second heat pipe 22.

  Further, in the cooling device 1 according to the first embodiment, the radiating fins 24 are erected so as to be orthogonal to the extending direction of the second heat pipe 22 in a plan view. As shown in FIG. 2, in the cooling device 2 according to the second embodiment, the radiating fins 24 are erected in a direction substantially parallel to the extending direction of the second heat pipe 22 in a plan view. Therefore, in the cooling device 2, the radiating fins 24 are erected so as to be orthogonal to the extending direction of the first heat pipe 12 in plan view.

  The operation of the cooling device 2 according to the second embodiment will be described. The cooling device 2 will be described by taking as an example a case where the substrate 101 on which the heating element 100 is mounted is thermally connected to the central portion in the longitudinal direction of the one surface 11-1 of the first base plate 11.

  The heat of the heating element 100 is transmitted from the heating element 100 to the central portion of the first base plate 11, and the heat transmitted to the central portion of the first base plate 11 is transmitted by the first heat pipe 12 to the first base plate. 11 is transported along the one surface 11-1 from the center to both ends (lateral direction in FIG. 2). The center part of the first base plate 11 is cooled by heat transport of the first heat pipe 12, and the center part and both end parts are soaked. The heat diffused from the center portion toward both ends of the first base plate 11 is transmitted from the first base plate 11 to the second base plate 21. Therefore, the second base plate 21 receives the heat substantially uniformly in the entire portion overlapping the first base plate 11.

  Since the first base plate 11 is thermally connected at a position corresponding to one end portion of the second heat pipe 22, one end portion of the second heat pipe 22 is the evaporation portion, and the other end. The end of this functions as a condensing part. Therefore, the heat transferred to the second base plate 21 is transmitted from the predetermined end of the second base plate 21 along the one surface 21-1 of the second base plate 21 by the second heat pipe 22. It is transported in a direction perpendicular to the heat transport direction of the first heat pipe 12 (vertical direction in FIG. 2) in the direction of the other end facing the predetermined end. The heat diffused in the second base plate 21 in a direction substantially orthogonal to the heat transport direction of the first heat pipe 12 is transmitted from the second base plate 21 to the heat radiating fins 24 and released from the heat radiating fins 24 to the external environment. The

  In the cooling device 2 as well, similarly to the cooling device 1, the second base plate 21 is smoothed uniformly over the entirety by the heat transport action of the first heat pipe 12 and the second heat pipe 22. Therefore, excellent cooling performance can be demonstrated.

  Next, an example of a lighting device including a cooling device according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, a substrate 101 on which an LED element is mounted as a heating element 100 is thermally connected to one surface 11-1 of the first base plate 11, thereby cooling devices 1 and 2. It can be set as the illuminating device which concerns on 1st Embodiment of this invention.

  Since the LED element is easily affected by heat in its lifetime and light emission efficiency, it is required to be constantly cooled during light emission so as to maintain the temperature within an allowable range. By cooling the formed LED element, the LED element can be maintained at a temperature within an allowable range.

  The thickness of the substrate 101 is not particularly limited, but is preferably 2.0 mm or more from the viewpoint of maintaining the rigidity of the substrate 101 and preventing the deformation of the substrate 101 due to the attachment of the substrate 101 to the first base plate 11. 101 mm or less is preferable from the viewpoint of preventing an increase in thermal resistance in the thickness direction of 101.

  Next, an illuminating device according to a second embodiment provided with a cooling device according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 3, as an illumination device according to the second embodiment, instead of the substrate 101 on which the LED element that is the heating element 100 is mounted, the LED element that is the heating element 100 is provided on the first base plate 11. An insulating portion 104 including an electrode 102 and a wiring 103 for connection may be provided. In FIG. 3, the insulating portion 104 is provided in layers on the first base plate 11. Examples of the material of the insulating portion 104 include resin. By mounting the LED element on the electrode 102 by soldering 105 or the like, a lighting device including the cooling device according to the embodiment of the present invention can be obtained.

  Next, another embodiment of the cooling device of the present invention will be described. In the cooling device of each embodiment described above, the heat pipe is attached to the base plate by being fitted into the groove formed on the surface of the base plate, but instead of the groove, along the plane direction of the base plate. In addition, a hole corresponding to the shape and dimensions of the heat pipe may be provided inside the base plate.

  Further, in the cooling device of each of the above embodiments, the heat transport direction of the second heat pipe and the heat transport direction of the first heat pipe are arranged so as to be substantially orthogonal to each other in plan view. However, the heat transport direction of the second heat pipe and the heat transport direction of the first heat pipe need only be different in plan view, that is, they need not be parallel, for example, 45 ° or more and less than 90 °. But you can.

  In each of the above embodiments, the area of the second base plate in plan view is larger than the area of the first base plate in plan view, but instead, the same area may be used.

  In each of the above embodiments, the heat pipe is used as the first heat conductive member and the second heat conductive member. Instead, a metal having excellent heat conductivity, for example, heat at 25 ° C. Aluminum, copper, or the like having a conductivity of 100 W / (m · K) or more may be used.

  The cooling device of the present invention is used in a wide range of fields because the base plate that has received heat from the heating element is smoothed over the entire surface and exhibits excellent cooling performance by improving the heat dissipating action of the heat dissipating fins. For example, it has high utility value in the field of cooling a heating element having a large calorific value, such as LED lighting.

DESCRIPTION OF SYMBOLS 1, 2 Cooling device 10 Base part 11 1st base plate 12 1st heat pipe 20 Heat sink part 21 2nd base plate 22 2nd heat pipe 24 Radiation fin

Claims (11)

A cooling device for cooling a heating element mounted on a substrate,
A first base plate to which the substrate is thermally connected to one surface; and a first heat thermally connected to the first base plate that conducts heat along the surface of the first base plate. A base member having a conductive member;
A second base plate thermally connected to the other surface of the first base plate and the one surface; heat conduction along a surface of the second base plate; and the first heat conducting member. A heat sink part having a second heat conduction member thermally connected to the second base plate and having a heat conduction direction different from that of the second base plate, and a heat dissipating fin standing on the other surface of the second base plate ,
With cooling device.   The cooling device according to claim 1, wherein the first heat conducting member is a heat pipe.   The cooling device according to claim 1 or 2, wherein the second heat conducting member is a heat pipe.   The cooling device according to any one of claims 1 to 3, wherein a groove or a hole for attaching the first heat conducting member is provided in the first base plate.   The cooling device according to any one of claims 1 to 4, wherein a groove or a hole for attaching the second heat conducting member is provided in the second base plate.   The cooling device according to any one of claims 1 to 5, wherein a heat conduction direction of the first heat conduction member is perpendicular to a heat conduction direction of the second heat conduction member.   The cooling device according to any one of claims 1 to 6, wherein the substrate is connected to a position corresponding to an end portion of the second heat conducting member in a heat conducting direction.   The cooling device according to any one of claims 1 to 7, which is used for cooling LED lighting. A substrate on which an LED element is mounted;
A cooling device for cooling the LED element, wherein the first base plate is thermally connected to one surface, and the first base plate conducts heat along the surface of the first base plate. A first heat conducting member thermally connected to one base plate, and a second base plate thermally connected to the other surface of the first base plate and one surface thereof. A second heat conducting member that conducts heat along the surface of the second base plate and that is thermally connected to the second base plate and has a different heat conduction direction from the first heat conducting member. A heat sink having a heat dissipating fin standing on the other surface of the second base plate, and a cooling device comprising:
A lighting device comprising:   The lighting device according to claim 9, wherein a thickness of the substrate is 2.0 mm or greater and 5.0 mm or less.   The lighting device according to claim 9, wherein instead of the substrate, the first base plate is provided with an insulating portion including an electrode and a wiring for connecting the LED element, and the LED element is provided on the electrode. Implemented lighting device.

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