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JP2018170339A - Display device - Google Patents

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JP2018170339A
JP2018170339A JP2017065093A JP2017065093A JP2018170339A JP 2018170339 A JP2018170339 A JP 2018170339A JP 2017065093 A JP2017065093 A JP 2017065093A JP 2017065093 A JP2017065093 A JP 2017065093A JP 2018170339 A JP2018170339 A JP 2018170339A
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light emitting
substrate
emitting elements
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positive electrode
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JP6861068B2 (en
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神野 優志
Masashi Jinno
優志 神野
勝美 青木
Katsumi Aoki
勝美 青木
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Kyocera Display Corp
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Abstract

【課題】 発光波長の異なる複数種類の発光素子がそれぞれ所定の位置に正確に配置され得る表示装置とすること。【解決手段】 基板1と、基板1上に設置され、磁性体から成る正電極13Ra,13Ga,13Baおよび磁性体から成る負電極13Rb,13Gb,13Bbをそれぞれ有するとともに発光波長が互いに異なる複数種類の発光素子3R,3G,3Bと、を有しており、基板1は、正電極13Ra,13Ga,13Baに対向し接続され、永久磁性体から成る正電極端子と、負電極13Rb,13Gb,13Bbに対向し接続され、永久磁性体から成る負電極端子と、を有している表示装置であって、複数種類の発光素子3R,3G,3Bは、平面視形状が同じ輪郭形状であり、種類ごとに正電極13Ra,13Ga,13Baおよび負電極13Rb,13Gb,13Bbの配置構成が異なっている。【選択図】 図2PROBLEM TO BE SOLVED: To provide a display device capable of accurately arranging a plurality of types of light emitting elements having different light emitting wavelengths at predetermined positions. SOLUTION: A substrate 1 and a plurality of types of positive electrodes 13Ra, 13Ga, 13Ba made of a magnetic material and negative electrodes 13Rb, 13Gb, 13Bb made of a magnetic material, which are installed on the substrate 1, and have different emission wavelengths, respectively. It has light emitting elements 3R, 3G, 3B, and the substrate 1 is connected to the positive electrodes 13Ra, 13Ga, 13Ba facing each other, and is connected to the positive electrode terminals made of a permanent magnetic material and the negative electrodes 13Rb, 13Gb, 13Bb. It is a display device having a negative electrode terminal made of a permanent magnetic material, which is connected to face each other, and a plurality of types of light emitting elements 3R, 3G, and 3B have the same contour shape in a plan view, and each type has the same contour shape. The arrangement configurations of the positive electrodes 13Ra, 13Ga, 13Ba and the negative electrodes 13Rb, 13Gb, 13Bb are different. [Selection diagram] Fig. 2

Description

本発明は、基板上に発光ダイオード(Light Emitting Diode:LED)等の発光素子が複数設けられた表示装置に関するものである。   The present invention relates to a display device in which a plurality of light emitting elements such as light emitting diodes (LEDs) are provided on a substrate.

従来、LED等の発光素子を含む画素部を複数有する、バックライト装置が不要な自発光型の表示装置が知られている。そのような表示装置の基本構成のブロック回路図を図9に示す。表示装置は、ガラス基板等から成る基板51上に、発光素子73(LD11,LD12,LD13,LD21,LD22,LD23,LD31,LD32,LD33〜)のそれぞれに発光信号を入力するためのスイッチ素子としての薄膜トランジスタ(Thin Film Transistor:TFT)71と、発光制御信号(画像信号線SLを伝達する信号)のレベル(電圧)に応じた、正電圧(アノード電圧:3〜5V程度)と負電圧(カソード電圧:−3V〜0V程度)の電位差(発光信号)から発光素子73を電流駆動するための駆動素子としてのTFT72と、を含む発光部(画素部ともいう)74(P11,P12,P13,P21,P22,P23,P31,P32,P33〜)が多数配置されている。   2. Description of the Related Art Conventionally, a self-luminous display device that includes a plurality of pixel portions including light emitting elements such as LEDs and does not require a backlight device is known. A block circuit diagram of the basic configuration of such a display device is shown in FIG. The display device is a switching element for inputting a light emission signal to each of the light emitting elements 73 (LD11, LD12, LD13, LD21, LD22, LD23, LD31, LD32, LD33) on a substrate 51 made of a glass substrate or the like. Thin film transistor (TFT) 71 and a positive voltage (anode voltage: about 3 to 5 V) and a negative voltage (cathode) according to the level (voltage) of the light emission control signal (signal transmitting the image signal line SL). A light emitting portion (also referred to as a pixel portion) 74 (P11, P12, P13, P21) including a TFT 72 as a driving element for current-driving the light emitting element 73 from a potential difference (light emission signal) of voltage: about −3V to 0V. , P22, P23, P31, P32, P33-) are arranged in large numbers.

TFT71,72はpチャネル型TFTであり、それらのゲート電極にロー信号(L信号)が入力されることによって、ソース−ドレイン間が導通しオン状態となり電流が流れる。そして、TFT72は、そのゲート電極に発光制御信号が入力されており、その発光制御信号のレベルに応じた電位差により生じた電流(発光信号)が発光素子73の正電極(アノード電極)と負電極(カソード電極)の間に流れる。発光素子73の正電極には正電圧入力線75を介して正電圧が入力され、発光素子73の負電極には負電圧入力線76を介して負電圧が入力される。正電圧入力線75の入力端部にはスルーホール等から成る貫通導体78があり、貫通導体78を介して、基板51の裏面側にある駆動素子あるいは電源部等に電気的に接続されている。負電圧入力線76の入力端部にはスルーホール等から成る貫通導体79があり、貫通導体79を介して、基板51の裏面側にある駆動素子あるいは電源部等に電気的に接続されている。またTFT72は、ゲート電極にロー信号が入力されている間オン状態となり、発光素子73に電流を流す。また、TFT72のゲート電極とソース電極とを接続する接続線上には容量素子が配置されており、容量素子はTFT72のゲート電極に入力された発光制御信号の電圧を次の書き換えまでの期間(1フレームの期間)保持する保持容量として機能する。   The TFTs 71 and 72 are p-channel TFTs. When a low signal (L signal) is input to their gate electrodes, the source and the drain are brought into conduction, and an electric current flows. The light emission control signal is input to the gate electrode of the TFT 72, and a current (light emission signal) generated by a potential difference corresponding to the level of the light emission control signal is generated by the positive electrode (anode electrode) and the negative electrode of the light emitting element 73. It flows between (cathode electrodes). A positive voltage is input to the positive electrode of the light emitting element 73 via the positive voltage input line 75, and a negative voltage is input to the negative electrode of the light emitting element 73 via the negative voltage input line 76. A through conductor 78 formed of a through hole or the like is provided at the input end of the positive voltage input line 75, and is electrically connected to a driving element or a power supply unit on the back side of the substrate 51 through the through conductor 78. . A through conductor 79 made of a through hole or the like is provided at the input end of the negative voltage input line 76, and is electrically connected to a driving element or a power supply unit on the back side of the substrate 51 through the through conductor 79. . The TFT 72 is turned on while a low signal is input to the gate electrode, and a current flows through the light emitting element 73. In addition, a capacitive element is arranged on a connection line connecting the gate electrode and the source electrode of the TFT 72, and the capacitive element uses a period (1) until the next rewriting of the voltage of the light emission control signal input to the gate electrode of the TFT 72. It functions as a holding capacity to hold).

また、基板51上には、第1の方向(例えば、行方向)に形成された複数本のゲート信号線52(GL1,GL2,GL3〜)と、第1の方向と交差する第2の方向(例えば、列方向)にゲート信号線52と交差させて形成された複数本の画像信号線(ソース信号線)53(SL1,SL2,SL3〜)と、ゲート信号線52と画像信号線53の各交差部に対応して形成された画素部74と、を有する構成である。なお、図9において、70は表示部、61は、基板51の裏面側にある駆動素子からゲート信号を伝達するためのスルーホール等から成る貫通導体である。なお、駆動素子は、例えば、基板51の裏面にCOG(Chip On Glass)方式等の手段によって搭載される。また、基板51の裏面側には、駆動素子との間で引き出し線を介して駆動信号、制御信号等を入出力するための回路基板(Flexible Printed Circuit:FPC)が設置されている場合がある。   Further, a plurality of gate signal lines 52 (GL1, GL2, GL3˜) formed in a first direction (for example, a row direction) on the substrate 51, and a second direction intersecting the first direction. A plurality of image signal lines (source signal lines) 53 (SL1, SL2, SL3˜) formed to intersect with the gate signal line 52 (for example, in the column direction), the gate signal line 52, and the image signal line 53 And a pixel portion 74 formed corresponding to each intersecting portion. In FIG. 9, reference numeral 70 denotes a display unit, and 61 denotes a through conductor made up of a through hole or the like for transmitting a gate signal from a driving element on the back side of the substrate 51. The drive element is mounted on the back surface of the substrate 51 by means such as a COG (Chip On Glass) method. In addition, a circuit board (Flexible Printed Circuit: FPC) for inputting / outputting a drive signal, a control signal, and the like to / from the drive element via a lead line may be provided on the back side of the substrate 51. .

TFT71,72は、例えば、アモルファスシリコン(a-Si)、低温多結晶シリコン(Low-Temperature Poly Silicon:LTPS)等から成る半導体膜を有し、ゲート電極、ソース電極、ドレイン電極の3端子を有する構成であり、また双方ともnチャネル型TFTである構成、双方ともpチャネル型TFTである構成、一方がnチャネル型TFTで他方がpチャネル型TFTである構成を採用できる。そして、ゲート電極に所定電位の電圧を印加することにより、ソース電極とドレイン電極の間の半導体膜(チャネル)に電流を流す、スイッチング素子(ゲートトランスファ素子)として機能する。基板51がガラス基板から成り、駆動素子は、LTPSから成る半導体膜を有するTFTを用いて構成された駆動回路である場合、基板51上にTFTをCVD(Chemical Vapor Deposition)法等の薄膜形成法によって直接的に形成することができる。   The TFTs 71 and 72 have a semiconductor film made of, for example, amorphous silicon (a-Si), low-temperature polycrystalline silicon (LTPS), and the like, and have three terminals of a gate electrode, a source electrode, and a drain electrode. It is possible to adopt a configuration in which both are n-channel TFTs, both are p-channel TFTs, and one is an n-channel TFT and the other is a p-channel TFT. Then, by applying a voltage of a predetermined potential to the gate electrode, it functions as a switching element (gate transfer element) that causes a current to flow through the semiconductor film (channel) between the source electrode and the drain electrode. When the substrate 51 is made of a glass substrate and the drive element is a drive circuit configured using a TFT having a semiconductor film made of LTPS, the TFT is formed on the substrate 51 by a thin film formation method such as a CVD (Chemical Vapor Deposition) method. Can be formed directly.

なお、フルカラー表示の表示装置とするために、発光部としての画素部74は、それぞれが赤色発光用の副画素、緑色発光用の副画素、青色発光用の副画素から成る場合がある。赤色発光用の副画素は赤色LED等から成る赤色発光素子を有し、緑色発光用の副画素は緑色LED等から成る緑色発光素子を有し、青色発光用の副画素は青色LED等から成る青色発光素子を有している。例えば、これらの副画素は、列方向に並んでいる。   In order to obtain a full-color display device, the pixel unit 74 as a light emitting unit may include a red light emitting subpixel, a green light emitting subpixel, and a blue light emitting subpixel. The sub pixel for red light emission has a red light emitting element such as a red LED, the sub pixel for green light emission has a green light emitting element such as a green LED, and the sub pixel for blue light emission consists of a blue LED or the like. It has a blue light emitting element. For example, these subpixels are arranged in the column direction.

そして、発光制御信号は、貫通導体64から画像信号線(発光制御信号線ともいう)53を介して各発光部74に入力される。   The light emission control signal is input from the through conductor 64 to each light emitting unit 74 via an image signal line (also referred to as a light emission control signal line) 53.

図10は、図9のC部を拡大して示す図であり、(a)は拡大平面図、(b)は(a)のD1−D2線における断面図である。図10に示すように、発光素子73は、一方面(表面であり発光部設置面)およびその反対側の他方面(裏面)を有する基体73bと、一方面の側に配置された発光部73aと、他方面の側に配置されて発光部73aに駆動電圧を印加するための、それぞれ磁性体から成る正電極83aおよび負電極83bと、を有している。また基板51は、正電極83aに対応して配置され、永久磁性体から成る正電極端子81aと、負電極83bに対応して配置され、永久磁性体から成る負電極端子81bと、を有している。正電極83aと正電極端子81aは、ハンダ等から成る導電性接続部材82aを介して接続され、負電極83bと負電極端子81bは、ハンダ等から成る導電性接続部材82bを介して接続される。正電極端子81aは、配線85aおよびTFT2を介して正電圧入力線75に接続され、負電極端子81bは、配線85bを介して負電圧入力線76に接続される。   FIG. 10 is an enlarged view of a portion C in FIG. 9, (a) is an enlarged plan view, and (b) is a sectional view taken along line D1-D2 in (a). As shown in FIG. 10, the light emitting element 73 includes a base 73b having one surface (front surface and light emitting portion installation surface) and the other surface (back surface) on the opposite side, and a light emitting portion 73a disposed on the one surface side. And a positive electrode 83a and a negative electrode 83b each made of a magnetic material for applying a driving voltage to the light emitting portion 73a, which are arranged on the other surface side. The substrate 51 has a positive electrode terminal 81a made of a permanent magnetic material and corresponding to the positive electrode 83a, and a negative electrode terminal 81b made of a permanent magnetic material and arranged in correspondence with the negative electrode 83b. ing. The positive electrode 83a and the positive electrode terminal 81a are connected via a conductive connecting member 82a made of solder or the like, and the negative electrode 83b and the negative electrode terminal 81b are connected via a conductive connecting member 82b made of solder or the like. . The positive electrode terminal 81a is connected to the positive voltage input line 75 via the wiring 85a and the TFT 2, and the negative electrode terminal 81b is connected to the negative voltage input line 76 via the wiring 85b.

また、他の従来例として、基板上に発光素子を配列して形成される表示装置において、基板上の発光素子の配列位置及び発光素子の底部に磁性体膜が形成され、基板上に発光素子が散乱されて発光素子が配列して形成される表示装置、また、基板上に発光素子を配列して形成される表示装置において、底部の形状が異なるように発光素子が形成され、基板上に、発光素子の底部に勘合する嵌合部が形成され、基板上に発光素子が同時に散乱された後に基板に物理的外力が与えられ、その物理的外力により発光素子が配列する表示装置が提案されている(例えば、特許文献1を参照)。   As another conventional example, in a display device formed by arranging light emitting elements on a substrate, a magnetic film is formed on the substrate and at the bottom of the light emitting elements, and the light emitting elements are formed on the substrate. In a display device in which light emitting elements are arrayed by being scattered and a display device in which light emitting elements are arrayed on a substrate, the light emitting elements are formed with different bottom shapes on the substrate. A display device is proposed in which a fitting portion that fits into the bottom of a light emitting element is formed, and a physical external force is applied to the substrate after the light emitting elements are simultaneously scattered on the substrate, and the light emitting elements are arranged by the physical external force. (For example, refer to Patent Document 1).

特開2003−216052号公報Japanese Patent Laid-Open No. 2003-216052

しかしながら、図9、図10に示す上記従来の表示装置においては、以下の問題点があった。多数個の発光素子73を、それぞれ所定の画素に配置する場合、画素の数が10万個程度〜100万個程度と非常に多く、かつ発光素子73の平面視形状およびサイズが、一辺が数10μm〜数100μm程度の矩形状等であるために、きわめて小型の発光素子73の多数個をそれぞれ所定の位置に正確に配置することがむつかしいという問題点があった。また、一つの表示装置に使用する発光素子73の数が非常に多いために、それらを基板51上に設置するのに長時間を要し、製造の作業性および効率がきわめて低いという問題点があった。さらに、互いに異なる波長の光を放射する複数の発光素子73、例えば赤色発光素子と緑色発光素子と青色発光素子を、それぞれ所定の副画素に配置する場合、副画素の数が数10万個程度〜数100万個程度と非常に多いために、上記の問題点がより顕著になっていた。   However, the conventional display device shown in FIGS. 9 and 10 has the following problems. When a large number of light emitting elements 73 are arranged in each predetermined pixel, the number of pixels is as large as about 100,000 to about 1 million, and the shape and size of the light emitting element 73 in plan view are several on a side. Since it has a rectangular shape of about 10 μm to several 100 μm, there is a problem that it is difficult to accurately arrange a large number of extremely small light emitting elements 73 at predetermined positions. In addition, since the number of light emitting elements 73 used in one display device is very large, it takes a long time to install them on the substrate 51, and the workability and efficiency of manufacturing are extremely low. there were. Further, when a plurality of light emitting elements 73 that emit light of different wavelengths, for example, a red light emitting element, a green light emitting element, and a blue light emitting element are arranged in a predetermined subpixel, the number of subpixels is about several hundred thousand. The above problem has become more prominent because of the very large number of about ~ 1 million.

本発明は、上記の問題点に鑑みて完成されたものであり、その目的は、発光波長の異なる複数種類の発光素子がそれぞれ所定の位置に正確に配置され得る表示装置とすることである。また、良好な作業性および高い製造効率でもって製造し得る表示装置とすることである。   The present invention has been completed in view of the above problems, and an object of the present invention is to provide a display device in which a plurality of types of light emitting elements having different emission wavelengths can be accurately arranged at predetermined positions. Another object is to provide a display device that can be manufactured with good workability and high manufacturing efficiency.

本発明の表示装置は、基板と、前記基板上に設置され、磁性体から成る正電極および磁性体から成る負電極をそれぞれ有するとともに発光波長が互いに異なる複数種類の発光素子と、を有しており、前記基板は、前記正電極に対向し接続され、永久磁性体から成る正電極端子と、前記負電極に対向し接続され、永久磁性体から成る負電極端子と、を有している表示装置であって、前記複数種類の発光素子は、平面視形状が同じ輪郭形状であり、種類ごとに前記正電極および前記負電極の配置構成が異なっている構成である。   The display device of the present invention includes a substrate and a plurality of types of light-emitting elements that are provided on the substrate and each have a positive electrode made of a magnetic material and a negative electrode made of a magnetic material, and having different emission wavelengths. And the substrate has a positive electrode terminal made of a permanent magnetic material and connected to the positive electrode, and a negative electrode terminal made of a permanent magnetic material and connected to the negative electrode. In the apparatus, the plurality of types of light emitting elements have the same outline shape in plan view, and the arrangement configuration of the positive electrode and the negative electrode is different for each type.

本発明の表示装置は、好ましくは、前記複数種類の発光素子は、平面視形状が非対称性を有する形状である。   In the display device of the present invention, it is preferable that the plurality of types of light emitting elements have an asymmetric shape in plan view.

また本発明の表示装置は、好ましくは、前記複数種類の発光素子は、種類が異なるものを輪郭を重ねて平面視したときに、前記正電極が互いに重ならない位置にあり前記負電極が互いに重ならない位置にある。   In the display device of the present invention, it is preferable that the plurality of types of light emitting elements are in positions where the positive electrodes do not overlap each other when the different types of light emitting elements are viewed in plan with overlapping outlines, and the negative electrodes overlap each other. It is in a position that cannot be.

また本発明の表示装置は、好ましくは、前記基板上に設置された前記複数種類の発光素子のそれぞれを平面視したときに、前記正電極端子は前記正電極の内側にあり、前記負電極端子は前記負電極の内側にある。   In the display device of the present invention, preferably, when each of the plurality of types of light-emitting elements installed on the substrate is viewed in plan, the positive electrode terminal is inside the positive electrode, and the negative electrode terminal Is inside the negative electrode.

本発明の表示装置は、基板と、前記基板上に設置され、磁性体から成る正電極および磁性体から成る負電極をそれぞれ有するとともに発光波長が互いに異なる複数種類の発光素子と、を有しており、前記基板は、前記正電極に対向し接続され、永久磁性体から成る正電極端子と、前記負電極に対向し接続され、永久磁性体から成る負電極端子と、を有している表示装置であって、前記複数種類の発光素子は、平面視形状が同じ輪郭形状であり、種類ごとに前記正電極および前記負電極の配置構成が異なっている構成であることから、以下の効果を奏する。複数種類の発光素子は、種類ごとに正電極および負電極の配置構成が異なっているので、ある種類の発光素子が他の種類の発光素子が配置されるべき部位に配置される誤配置(ミスセッティング)が生じることを効果的に抑えることができる。従って、発光波長の異なる複数種類の発光素子がそれぞれ所定の位置に正確に配置されることとなる。また、良好な作業性および高い製造効率でもって表示装置を製造することができる。   The display device of the present invention includes a substrate and a plurality of types of light-emitting elements that are provided on the substrate and each have a positive electrode made of a magnetic material and a negative electrode made of a magnetic material, and having different emission wavelengths. And the substrate has a positive electrode terminal made of a permanent magnetic material and connected to the positive electrode, and a negative electrode terminal made of a permanent magnetic material and connected to the negative electrode. The plurality of types of light-emitting elements have the same contour shape in plan view, and the arrangement configuration of the positive electrode and the negative electrode is different for each type. Play. Since a plurality of types of light emitting elements have different arrangement configurations of positive electrodes and negative electrodes for each type, a certain type of light emitting element is misplaced (missed) at a position where another type of light emitting element is to be disposed. Setting) can be effectively suppressed. Accordingly, a plurality of types of light emitting elements having different emission wavelengths are accurately arranged at predetermined positions. In addition, a display device can be manufactured with good workability and high manufacturing efficiency.

本発明の表示装置は、前記複数種類の発光素子は、平面視形状が非対称性を有する形状である場合、基板上に配置された発光素子の方向性を確認することが容易になるので、発光素子の正電極と負電極の配置状態を確認することが容易になる。従って、発光素子の誤配置が生じることをより効果的に抑えることができる。   In the display device according to the present invention, when the plurality of types of light emitting elements have an asymmetric shape in plan view, it becomes easy to confirm the directionality of the light emitting elements arranged on the substrate. It becomes easy to confirm the arrangement state of the positive electrode and the negative electrode of the element. Therefore, it is possible to more effectively suppress the occurrence of misplacement of the light emitting elements.

また本発明の表示装置は、前記複数種類の発光素子は、種類が異なるものを輪郭を重ねて平面視したときに、前記正電極が互いに重ならない位置にあり前記負電極が互いに重ならない位置にある場合、発光素子の誤配置が生じることをさらに効果的に抑えることができる。   In the display device of the present invention, when the plurality of types of light emitting elements are viewed in plan with different types of overlapping, the positive electrodes do not overlap each other and the negative electrodes do not overlap each other. In some cases, it is possible to more effectively suppress the misplacement of the light emitting elements.

また本発明の表示装置は、前記基板上に設置された前記複数種類の発光素子のそれぞれを平面視したときに、前記正電極端子は前記正電極の内側にあり、前記負電極端子は前記負電極の内側にある場合、発光素子の誤配置が生じることをさらに効果的に抑えることができる。   In the display device of the present invention, when each of the plurality of types of light-emitting elements installed on the substrate is viewed in plan, the positive electrode terminal is inside the positive electrode, and the negative electrode terminal is the negative electrode terminal. When it exists inside an electrode, it can suppress more effectively that incorrect arrangement | positioning of a light emitting element arises.

図1は、本発明の表示装置について実施の形態の1例を示す図であり、基板上に設置された複数種類の発光素子の平面図である。FIG. 1 is a diagram showing an example of an embodiment of a display device of the present invention, and is a plan view of a plurality of types of light emitting elements installed on a substrate. 図2は、図1の表示装置について、各種類の発光素子の正電極および負電極の配置構成を示す発光装置の平面図である。FIG. 2 is a plan view of the light-emitting device showing the arrangement of the positive and negative electrodes of each type of light-emitting element in the display device of FIG. 図3は、本発明の表示装置について実施の形態の他例を示す図であり、基板上に設置された複数種類の発光素子における各種類の発光素子の正電極および負電極の配置構成を示す発光装置の平面図である。FIG. 3 is a diagram showing another example of the embodiment of the display device of the present invention, and shows the arrangement of the positive electrode and the negative electrode of each type of light emitting element in a plurality of types of light emitting elements installed on the substrate. It is a top view of a light-emitting device. 図4は、本発明の表示装置について実施の形態の他例を示す図であり、基板上に設置された複数種類の発光素子における各種類の発光素子の正電極および負電極の配置構成を示す発光装置の平面図である。FIG. 4 is a diagram showing another example of the embodiment of the display device of the present invention, and shows the arrangement of the positive electrode and the negative electrode of each type of light-emitting element in a plurality of types of light-emitting elements installed on a substrate. It is a top view of a light-emitting device. 図5は、本発明の表示装置について実施の形態の他例を示す図であり、図4の構成において、発光素子の正電極と正電極端子との大きさおよび配置の関係、負電極と負電極端子との大きさおよび配置の関係を示す発光装置の平面図である。FIG. 5 is a diagram showing another example of the embodiment of the display device of the present invention. In the configuration of FIG. 4, the relationship between the size and arrangement of the positive electrode and the positive electrode terminal of the light emitting element, the negative electrode and the negative electrode, It is a top view of the light-emitting device which shows the magnitude | size and arrangement | positioning relationship with an electrode terminal. 図6(a),(b)は、図4に示す発光装置の製造方法を示す図であり、(a)は発光素子を位置合わせして配置するための位置合わせ治具の開口に、発光素子を挿入している状態の発光素子を示す平面図、(b)は(a)のA1−A2線における断面図である。6A and 6B are diagrams showing a method for manufacturing the light-emitting device shown in FIG. 4, and FIG. 6A shows light emitted from the opening of the alignment jig for aligning and arranging the light-emitting elements. The top view which shows the light emitting element of the state which has inserted the element, (b) is sectional drawing in the A1-A2 line of (a). 図7(a),(b)は、図6の製造方法によって基板上に設置された発光素子を示す図であり、(a)は位置合わせ治具を取り除いた状態の発光素子を示す平面図、(b)は(a)のB1−B2線における断面図である。FIGS. 7A and 7B are views showing the light emitting element installed on the substrate by the manufacturing method of FIG. 6, and FIG. 7A is a plan view showing the light emitting element in a state where the alignment jig is removed. (B) is sectional drawing in the B1-B2 line of (a). 図8は、図6に示す発光装置の製造方法に関する図であり、複数の発光素子を位置合わせ治具の上方から散布することによって、位置合わせ治具の開口に発光素子を落下させて挿入する製造方法を示す断面図である。FIG. 8 is a diagram relating to a method for manufacturing the light emitting device shown in FIG. 6, in which a plurality of light emitting elements are sprayed from above the alignment jig so that the light emitting elements are dropped and inserted into the openings of the alignment jig. It is sectional drawing which shows a manufacturing method. 図9は、従来の表示装置の基本構成のブロック回路図である。FIG. 9 is a block circuit diagram of a basic configuration of a conventional display device. 図10は、図9のC部を拡大して示す図であり、(a)は拡大平面図、(b)は(a)のD1−D2線における断面図である。FIG. 10 is an enlarged view of a portion C in FIG. 9, (a) is an enlarged plan view, and (b) is a sectional view taken along line D1-D2 in (a).

以下、本発明の表示装置の実施の形態について、図面を参照しながら説明する。但し、以下で参照する各図は、本発明の表示装置の実施の形態における構成部材のうち、本発明の表示装置を説明するための主要部を示している。従って、本発明に係る表示装置は、図に示されていない回路基板、配線導体、制御IC,LSI等の周知の構成部材を備えていてもよい。   Embodiments of a display device of the present invention will be described below with reference to the drawings. However, each drawing referred to below shows a main part for explaining the display device of the present invention among the constituent members in the embodiment of the display device of the present invention. Therefore, the display device according to the present invention may include known constituent members such as a circuit board, a wiring conductor, a control IC, and an LSI that are not shown in the drawing.

図1〜図8は、本発明の表示装置について各種実施の形態の例を示す図である。図1、図2に示すように、本発明の表示装置は、基板1と、基板1上に設置され、磁性体から成る正電極13Ra,13Ga,13Baおよび磁性体から成る負電極13Rb,13Gb,13Bbをそれぞれ有するとともに発光波長が互いに異なる複数種類の発光素子3R,3G,3Bと、を有しており、基板1は、正電極13Ra,13Ga,13Baに対向し接続され、永久磁性体から成る正電極端子(図5に11Ra,11Ga,11Baの符号で示す)と、負電極13Rb,13Gb,13Bbに対向し接続され、永久磁性体から成る負電極端子(図5に11Rb,11Gb,11Bbの符号で示す)と、を有している表示装置であって、複数種類の発光素子3R,3G,3Bは、平面視形状が同じ輪郭形状であり、種類ごとに正電極13Ra,13Ga,13Baおよび負電極13Rb,13Gb,13Bbの配置構成が異なっている構成である。この構成により、複数種類の発光素子3R,3G,3Bは、種類ごとに正電極13Ra,13Ga,13Baおよび負電極13Rb,13Gb,13Bbの配置構成が異なっているので、ある種類の発光素子(例えば、発光素子3R)が他の種類の発光素子(例えば、発光素子3G)が配置されるべき部位に配置される誤配置が生じることを効果的に抑えることができる。従って、例えば一つの表示装置において10万個〜数100万個におよぶ小型の発光素子がそれぞれ所定の位置に正確に配置されることとなる。また、良好な作業性および高い製造効率でもって表示装置を製造することができる。   FIGS. 1-8 is a figure which shows the example of various embodiment about the display apparatus of this invention. As shown in FIGS. 1 and 2, the display device of the present invention includes a substrate 1, a positive electrode 13Ra, 13Ga, 13Ba made of a magnetic material and a negative electrode 13Rb, 13Gb made of a magnetic material. Each of the light emitting elements 3R, 3G, and 3B has a light emission wavelength different from each other, and the substrate 1 is connected to be opposed to the positive electrodes 13Ra, 13Ga, and 13Ba, and is made of a permanent magnetic material. A positive electrode terminal (indicated by reference numerals of 11Ra, 11Ga, and 11Ba in FIG. 5) and a negative electrode terminal made of a permanent magnetic material and connected to the negative electrodes 13Rb, 13Gb, and 13Bb (in FIG. 5, of 11Rb, 11Gb, and 11Bb) The plurality of types of light emitting elements 3R, 3G, and 3B have the same outline shape in plan view, and each type has a positive power supply. 13Ra, 13Ga, 13Ba and the negative electrode 13Rb, 13Gb, a configuration in which arrangement of 13Bb are different. With this configuration, the plurality of types of light-emitting elements 3R, 3G, and 3B have different arrangements of the positive electrodes 13Ra, 13Ga, and 13Ba and the negative electrodes 13Rb, 13Gb, and 13Bb for each type. , It is possible to effectively suppress the occurrence of misplacement in which the light emitting element 3R) is disposed at a portion where another type of light emitting element (for example, the light emitting element 3G) is to be disposed. Therefore, for example, in one display device, 100,000 to several million small light emitting elements are accurately arranged at predetermined positions. In addition, a display device can be manufactured with good workability and high manufacturing efficiency.

本発明の表示装置において、基板1は、ガラス基板、プラスチック基板等の透明基板であってもよいが、不透明なものであってもよい。基板1が不透明なものである場合、基板1は着色されたガラス基板、摺りガラスから成るガラス基板、プラスチック基板、セラミック基板、金属基板、あるいはそれらの基板を積層した複合基板であってもよい。また基板1の厚みは、例えば0.3mm〜5mm程度である。   In the display device of the present invention, the substrate 1 may be a transparent substrate such as a glass substrate or a plastic substrate, but may be opaque. When the substrate 1 is opaque, the substrate 1 may be a colored glass substrate, a glass substrate made of frosted glass, a plastic substrate, a ceramic substrate, a metal substrate, or a composite substrate in which these substrates are laminated. The thickness of the substrate 1 is, for example, about 0.3 mm to 5 mm.

発光素子3R,3G,3Bとしては、マイクロチップ型の発光ダイオード(LED)、モノリシック型の発光ダイオード、有機EL、無機EL、半導体レーザ素子等の自発光型の素子であれば採用し得る。   As the light-emitting elements 3R, 3G, and 3B, any self-light-emitting element such as a microchip light-emitting diode (LED), a monolithic light-emitting diode, an organic EL, an inorganic EL, or a semiconductor laser element can be adopted.

発光素子がマイクロチップ型の発光ダイオード(LED)である場合、図6に示すように、発光素子3は、一方面(表面であり発光部設置面)およびその反対側の他方面(裏面)を有する樹脂、セラミック等から成る基体3bと、一方面の側に配置された発光部3aと、他方面の側に配置されて発光部3aに駆動電圧を印加するための、それぞれ磁性体から成る正電極13aおよび負電極13bと、を有している。また基板1は、正電極13aに対応して配置され、永久磁性体から成る正電極端子11aと、負電極13bに対応して配置され、永久磁性体から成る負電極端子11bと、を有している。正電極13aと正電極端子11aは、ハンダ等から成る導電性接続部材12aを介して接続され、負電極13bと負電極端子11bは、ハンダ等から成る導電性接続部材12bを介して接続される。正電極端子11aは、配線15aおよびTFTを介して正電圧入力線に接続され、負電極端子11bは、配線15bを介して負電圧入力線に接続される。   When the light-emitting element is a microchip light-emitting diode (LED), as shown in FIG. 6, the light-emitting element 3 has one surface (the surface and the light-emitting portion installation surface) and the other surface (the back surface) on the opposite side. A base 3b made of resin, ceramic, etc., a light emitting portion 3a arranged on one side, and a positive electrode made of a magnetic material for applying a driving voltage to the light emitting portion 3a arranged on the other side. An electrode 13a and a negative electrode 13b. The substrate 1 is disposed corresponding to the positive electrode 13a and has a positive electrode terminal 11a made of a permanent magnetic material, and a negative electrode terminal 11b made of a permanent magnetic material and arranged corresponding to the negative electrode 13b. ing. The positive electrode 13a and the positive electrode terminal 11a are connected via a conductive connecting member 12a made of solder or the like, and the negative electrode 13b and the negative electrode terminal 11b are connected via a conductive connecting member 12b made of solder or the like. . The positive electrode terminal 11a is connected to the positive voltage input line via the wiring 15a and the TFT, and the negative electrode terminal 11b is connected to the negative voltage input line via the wiring 15b.

磁性体から成る正電極13aおよび磁性体から成る負電極13bは、鉄、コバルト、ニッケルまたそれらの合金、フェライト等の強磁性体から成ることが好ましい。この場合、正電極13aと正電極端子11aの磁力による吸着力、負電極13bと負電極端子11bの磁力による吸着力が大きくなり、発光素子3の配置が容易になる。強磁性体のなかでも保磁力が小さい軟磁性体がより好ましく、例えば鉄、ケイ素鋼、パーマロイ、センダスト、パーメンジュール、ソフトフェライト、アモルファス磁性合金、ナノクリスタル磁性合金等がよい。正電極13aおよび負電極13bは、強磁性体の材料を蒸着法、スパッタリング法、CVD(Chemical Vapor Deposition)法等の薄膜形成法によって、基体3b上に形成される。あるいは、強磁性体の粉末、樹脂、アルコール、水等を含有するペーストを基体3bの所定の部位に塗布し、乾燥、焼成することによって、基体3b上に形成される。   The positive electrode 13a made of a magnetic material and the negative electrode 13b made of a magnetic material are preferably made of a ferromagnetic material such as iron, cobalt, nickel, an alloy thereof, or ferrite. In this case, the attracting force due to the magnetic force between the positive electrode 13a and the positive electrode terminal 11a and the attracting force due to the magnetic force between the negative electrode 13b and the negative electrode terminal 11b are increased, and the arrangement of the light emitting element 3 is facilitated. Among the ferromagnetic materials, a soft magnetic material having a small coercive force is more preferable. For example, iron, silicon steel, permalloy, sendust, permendur, soft ferrite, amorphous magnetic alloy, nanocrystal magnetic alloy, and the like are preferable. The positive electrode 13a and the negative electrode 13b are formed on the substrate 3b by a thin film forming method such as vapor deposition, sputtering, or CVD (Chemical Vapor Deposition) using a ferromagnetic material. Alternatively, a paste containing ferromagnetic powder, resin, alcohol, water or the like is applied to a predetermined portion of the substrate 3b, dried and fired to form the substrate 3b.

永久磁性体から成る正電極端子11aおよび永久磁性体から成る負電極端子11bは、永久磁石として用いられる、保磁力が大きい硬磁性体から成り、例えばアルニコ磁性体、フェライト磁性体、サマリウムコバルト磁性体、ネオジム鉄ボロン磁性体、サマリウム鉄窒素磁性体等から成る。正電極端子11aおよび負電極端子11bは、硬磁性体のブロックに外部磁場を印加して永久磁性体のブロックとなし、永久磁性体のブロックを切削加工法等によって所定の大きさ、形状の端子体とし、その端子体を基板1上に固着することによって、基板1上に形成される。あるいは、正電極13aおよび負電極13bと同様にして形成した、永久磁性体化していない正電極端子11aおよび負電極端子11bに、外部磁場を印加して永久磁性体化することもできる。   The positive electrode terminal 11a made of a permanent magnetic material and the negative electrode terminal 11b made of a permanent magnetic material are made of a hard magnetic material having a large coercive force and used as a permanent magnet, for example, an alnico magnetic material, a ferrite magnetic material, and a samarium cobalt magnetic material. , Neodymium iron boron magnetic material, samarium iron nitrogen magnetic material and the like. The positive electrode terminal 11a and the negative electrode terminal 11b are formed into a permanent magnetic block by applying an external magnetic field to the hard magnetic block, and the permanent magnetic block has a predetermined size and shape by a cutting method or the like. The terminal body is formed on the substrate 1 by fixing the terminal body on the substrate 1. Alternatively, an external magnetic field may be applied to the positive electrode terminal 11a and the negative electrode terminal 11b, which are formed in the same manner as the positive electrode 13a and the negative electrode 13b and are not made permanent magnetic, so that the permanent magnetic material can be obtained.

発光波長が互いに異なる複数種類の発光素子3R,3G,3Bは、例えば赤色光の発光素子3R(発光波長660nm程度)、緑色光の発光素子3G(発光波長520nm程度)、青色光の発光素子3B(発光波長450nm程度)であるが、これに限らず黄色光の発光素子、燈色光の発光素子、紫色光の発光素子、白色光の発光素子等であってもよい。赤色光の発光素子3Rの発光部は、アルミニウムガリウムヒ素(AlGaAs)、ガリウムヒ素リン(GaAsP)、リン化ガリウム(GaP)、ペロブスカイト半導体等の材料から成る。緑色光の発光素子3Gの発光部は、インジウム窒化ガリウム(InGaN)、窒化ガリウム(GaN)、アルミニウム窒化ガリウム(AlGaN)、リン化ガリウム(GaP)、セレン化亜鉛(ZnSe)、アルミニウムインジウムガリウムリン(AlGaInP)、ペロブスカイト半導体等の材料から成る。青色光の発光素子3Bの発光部は、インジウム窒化ガリウム(InGaN)、窒化ガリウム(GaN)、アルミニウム窒化ガリウム(AlGaN)、セレン化亜鉛(ZnSe)等の材料から成る。   A plurality of types of light emitting elements 3R, 3G, 3B having different emission wavelengths are, for example, a red light emitting element 3R (emission wavelength of about 660 nm), a green light emitting element 3G (emission wavelength of about 520 nm), and a blue light emitting element 3B. Although not limited to this, a yellow light emitting element, an amber light emitting element, a violet light emitting element, a white light emitting element, or the like may be used. The light emitting portion of the red light emitting element 3R is made of a material such as aluminum gallium arsenide (AlGaAs), gallium arsenide phosphorus (GaAsP), gallium phosphide (GaP), or a perovskite semiconductor. The light emitting part of the green light emitting element 3G includes indium gallium nitride (InGaN), gallium nitride (GaN), aluminum gallium nitride (AlGaN), gallium phosphide (GaP), zinc selenide (ZnSe), aluminum indium gallium phosphide ( (AlGaInP) and a perovskite semiconductor. The light emitting portion of the blue light emitting element 3B is made of a material such as indium gallium nitride (InGaN), gallium nitride (GaN), aluminum gallium nitride (AlGaN), or zinc selenide (ZnSe).

本発明の発光素子は、図2に示すように、各種類の発光素子3R,3G,3Bの平面視形状が同じ輪郭形状であり、正方形、長方形、六角形、円形、楕円形等の中心点Pに対して点対称の形状であってもよい。この場合、例えば発光素子3Rについていうと、正電極13Raと負電極13Rbが中心点Pに対して点対称な位置にないことが好ましい。この理由は、図6〜図8に示す発光装置の製造方法によって発光素子3を、基板1上の所定の部位に配置するときに、好都合であるからである。図6〜図8に示す製造方法は、発光素子3を位置合わせして配置するための位置合わせ治具20の開口20aに、発光素子3を散布等して挿入し配置するものである。そして、発光素子3の平面視形状が、中心点Pに対して点対称の形状である長方形であると、配置の方向性に異方性がないために、逆方向に配置される場合がある。すなわち、図6(b)において、正電極13aが負電極端子11bに対向し接続され、負電極13bが正電極端子11aに対向し接続されることとなるために、そのままであれば発光素子3に印加される電圧が正常時と逆極性になる。しかしながら、図2に示すように、正電極13Raと負電極13Rbが中心点Pに対して点対称な位置にない場合、発光素子3Rが開口20aに逆方向に挿入され配置されたとしても、正電極13Raが負電極端子11bに対向し接続され、負電極13Rbが正電極端子11aに対向し接続されることを防ぐことができる。なお、発光素子3Rが開口20aに逆方向に挿入され配置されたとしても、正電極13Raが負電極端子11bに対向しないのでそれらは磁力によって吸着せず、負電極13Rbが正電極端子11aに対向しないのでそれらは磁力によって吸着しない。その結果、開口20aに逆方向に挿入され配置された発光素子3Rは、真空吸引手段、基板1から落下させる手段等の手段によって、基板1上から容易に取り除くことができる。   As shown in FIG. 2, the light-emitting elements of the present invention have the same outline shape in plan view for each type of light-emitting elements 3R, 3G, 3B, and center points such as squares, rectangles, hexagons, circles, ellipses, etc. The shape may be point-symmetric with respect to P. In this case, for example, regarding the light emitting element 3R, it is preferable that the positive electrode 13Ra and the negative electrode 13Rb are not in a point-symmetrical position with respect to the center point P. This is because it is convenient when the light emitting element 3 is arranged at a predetermined position on the substrate 1 by the method of manufacturing the light emitting device shown in FIGS. In the manufacturing method shown in FIGS. 6 to 8, the light emitting elements 3 are scattered and inserted into the openings 20 a of the alignment jig 20 for aligning and arranging the light emitting elements 3. And when the planar view shape of the light emitting element 3 is a rectangle which is a point-symmetrical shape with respect to the center point P, there is no anisotropy in the directionality of the arrangement, and thus the light emitting element 3 may be arranged in the opposite direction. . That is, in FIG. 6B, the positive electrode 13a faces and is connected to the negative electrode terminal 11b, and the negative electrode 13b faces and is connected to the positive electrode terminal 11a. The voltage applied to is opposite in polarity to normal. However, as shown in FIG. 2, when the positive electrode 13Ra and the negative electrode 13Rb are not point-symmetric with respect to the center point P, even if the light emitting element 3R is inserted and arranged in the opposite direction to the opening 20a, It is possible to prevent the electrode 13Ra from being connected to the negative electrode terminal 11b and the negative electrode 13Rb from being connected to the positive electrode terminal 11a. Even if the light emitting element 3R is inserted and arranged in the opposite direction to the opening 20a, the positive electrode 13Ra does not oppose the negative electrode terminal 11b, so they are not attracted by magnetic force, and the negative electrode 13Rb opposes the positive electrode terminal 11a. They do not adsorb by magnetic force. As a result, the light emitting element 3R inserted and arranged in the reverse direction in the opening 20a can be easily removed from the substrate 1 by means such as vacuum suction means and means for dropping from the substrate 1.

より好ましくは、正電極13Raと負電極13Rbのいずれもが、中心点Pを通り長方形の辺に平行な中心線上にないことがよい。この場合、発光素子3Rが開口20aに逆方向に挿入され配置されたとしても、正電極13Raが負電極端子11bに対向せず、負電極13Rbが正電極端子11aに対向しないようにすることを、確実に行うことができる。   More preferably, neither the positive electrode 13Ra nor the negative electrode 13Rb is on the center line passing through the center point P and parallel to the side of the rectangle. In this case, even if the light emitting element 3R is inserted and arranged in the opposite direction to the opening 20a, the positive electrode 13Ra is not opposed to the negative electrode terminal 11b, and the negative electrode 13Rb is not opposed to the positive electrode terminal 11a. Can be done reliably.

本発明の表示装置において、図3、図4に示すように、複数種類の発光素子3R,3G,3Bは、平面視形状が非対称性を有する形状であることが好ましい。この場合、基板1上に配置された発光素子3R,3G,3Bの方向性を確認することが容易になるので、発光素子3R,3G,3Bの正電極13Ra,13Ga,13Baと負電極13Rb,13Gb,13Bbの配置状態を確認することが容易になる。従って、発光素子3R,3G,3Bの誤配置が生じることをより効果的に抑えることができる。また、図6〜図8に示す発光装置の製造方法によって発光素子3を、基板1上の所定の部位に配置するときに、発光素子3R,3G,3Bの配置の方向性に異方性があるために、逆方向に配置されることがない。すなわち、位置合わせ治具20の開口20aの形状は、発光素子3R,3G,3Bの平面視形状と相補形状、すなわち発光素子3R,3G,3Bの平面視形状に相似的な形状で発光素子3R,3G,3Bの平面視形状よりも僅かに大きい形状、であるために、開口20aに、発光素子3R,3G,3Bが逆方向に挿入されることが不可能だからである。   In the display device of the present invention, as shown in FIGS. 3 and 4, it is preferable that the plurality of types of light emitting elements 3R, 3G, and 3B have asymmetric shape in plan view. In this case, since it becomes easy to confirm the directionality of the light emitting elements 3R, 3G, 3B arranged on the substrate 1, the positive electrodes 13Ra, 13Ga, 13Ba and the negative electrodes 13Rb of the light emitting elements 3R, 3G, 3B, It becomes easy to confirm the arrangement state of 13Gb and 13Bb. Accordingly, it is possible to more effectively suppress the misplacement of the light emitting elements 3R, 3G, and 3B. Further, when the light emitting element 3 is arranged at a predetermined position on the substrate 1 by the method for manufacturing the light emitting device shown in FIGS. 6 to 8, the directionality of the arrangement of the light emitting elements 3R, 3G, 3B has anisotropy. Therefore, it is not arranged in the reverse direction. That is, the shape of the opening 20a of the alignment jig 20 is complementary to the planar view shape of the light emitting elements 3R, 3G, 3B, that is, the light emitting element 3R is similar to the planar view shape of the light emitting elements 3R, 3G, 3B. This is because the light emitting elements 3R, 3G, and 3B cannot be inserted in the reverse direction into the opening 20a because the shape is slightly larger than the planar view shape of 3G, 3B.

従って、図3、図4に示す発光素子3R,3G,3Bの場合、正電極13Ra,13Ga,13Baと負電極13Rb,13Gb,13Bbが中心点Pに対して点対称な位置にあってもよい。   Therefore, in the case of the light emitting elements 3R, 3G, and 3B shown in FIGS. 3 and 4, the positive electrodes 13Ra, 13Ga, and 13Ba and the negative electrodes 13Rb, 13Gb, and 13Bb may be in point-symmetrical positions with respect to the center point P. .

図3に示す発光素子3R,3G,3Bは、平面視形状が台形状であり、中心点Pを通る上下方向の中心線に対しては対称的な形状であるが、中心点Pを通る横方向の中心線に対しては非対称的な形状である。このように、ある方向において非対称的な形状であればよく、発光素子3R,3G,3Bが開口20aに逆方向に挿入されることを防ぐことができる。ただし、図3に示す発光素子3R,3G,3Bは、裏返しになって開口20aに挿入され得るが、その場合裏返しになって開口20aに挿入された発光素子3R,3G,3Bは磁力によって吸着されていないので、基板1上から容易に取り除くことができる。   The light emitting elements 3R, 3G, and 3B shown in FIG. 3 have a trapezoidal shape in plan view, and are symmetrical with respect to the vertical center line passing through the center point P. The shape is asymmetric with respect to the direction center line. Thus, it is sufficient that the shape is asymmetric in a certain direction, and the light emitting elements 3R, 3G, 3B can be prevented from being inserted into the opening 20a in the opposite direction. However, the light emitting elements 3R, 3G, and 3B shown in FIG. 3 can be turned upside down and inserted into the opening 20a. In this case, the light emitting elements 3R, 3G, and 3B turned upside down and inserted into the opening 20a are attracted by magnetic force. Since it is not done, it can be easily removed from the substrate 1.

図4に示す発光素子3R,3G,3Bは、平面視形状が、長方形に突出部3c(図6、図7に示す)を付加した形状となっており、発光素子3R,3G,3Bの平面視形状に非対称性を確実に付与できる形状であり好適である。すなわち、正方形、長方形、六角形、円形等の点対称な形状に、僅かな突出部を付与することによって、発光素子3R,3G,3Bの平面視形状に非対称性を確実に付与できる。突出部は凹み部であってもよい。   The light-emitting elements 3R, 3G, and 3B shown in FIG. 4 have a rectangular shape in which a protrusion 3c (shown in FIGS. 6 and 7) is added to a rectangle, and the planes of the light-emitting elements 3R, 3G, and 3B A shape that can reliably impart asymmetry to the visual shape is preferable. That is, asymmetry can be reliably imparted to the planar view shapes of the light emitting elements 3R, 3G, and 3B by imparting a slight protrusion to a point-symmetric shape such as a square, rectangle, hexagon, or circle. The protrusion may be a recess.

本発明の表示装置は、図2〜図4に示すように、複数種類の発光素子3R,3G,3Bは、種類が異なるものを輪郭を重ねて平面視したときに、正電極13Ra,13Ga,13Baが互いに重ならない位置にあり負電極13Rb,13Gb,13Bbが互いに重ならない位置にあることが好ましい。この場合、発光素子3R,3G,3Bの誤配置が生じることをさらに効果的に抑えることができる。例えば、発光素子3Rが発光素子3Gが配置されるべき部位に誤って配置されたとしても、発光素子3Rの正電極13Raと正電極端子11aは対向しないのでそれらは磁力によって吸着せず、負電極13Rbと正電極端子11bは対向しないのでそれらは磁力によって吸着しない。その結果、誤配置された発光素子3Rは容易に取り除くことができる。   As shown in FIGS. 2 to 4, the display device according to the present invention has a plurality of types of light emitting elements 3 </ b> R, 3 </ b> G, and 3 </ b> B having positive electrodes 13 </ b> Ra, 13 </ b> Ga, It is preferable that 13Ba is in a position where they do not overlap each other, and the negative electrodes 13Rb, 13Gb, 13Bb are in a position where they do not overlap each other. In this case, it is possible to more effectively suppress the misplacement of the light emitting elements 3R, 3G, and 3B. For example, even if the light emitting element 3R is mistakenly disposed at a position where the light emitting element 3G is to be disposed, the positive electrode 13Ra and the positive electrode terminal 11a of the light emitting element 3R are not opposed to each other, so that they are not adsorbed by magnetic force, and the negative electrode Since 13Rb and the positive electrode terminal 11b do not face each other, they are not attracted by magnetic force. As a result, the misplaced light emitting element 3R can be easily removed.

本発明の表示装置は、図5に示すように、基板1上に設置された複数種類の発光素子3R,3G,3Bのそれぞれを平面視したときに、正電極端子11Ra,11Ga,11Baは正電極13Ra,13Ga,13Baの内側にあり、負電極端子11Rb,11Gb,11Bbは負電極13Rb,13Gb,13Bbの内側にあることが好ましい。この場合、発光素子3R,3G,3Bの誤配置が生じることをさらに効果的に抑えることができる。すなわち、正電極端子11Ra,11Ga,11Baの磁力の及ぶ範囲が狭まり、負電極端子11Rb,11Gb,11Bbの磁力の及ぶ範囲が狭まるために、例えば発光素子3Rが発光素子3Gが配置されるべき部位に誤って配置されたとしても、発光素子3Rが磁力によって吸着することをより確実に防ぐことができる。   As shown in FIG. 5, in the display device of the present invention, the positive electrode terminals 11Ra, 11Ga, and 11Ba are positive when the plurality of types of light-emitting elements 3R, 3G, and 3B installed on the substrate 1 are viewed in plan. It is preferable that the electrodes 13Ra, 13Ga, and 13Ba are inside, and the negative electrode terminals 11Rb, 11Gb, and 11Bb are inside the negative electrodes 13Rb, 13Gb, and 13Bb. In this case, it is possible to more effectively suppress the misplacement of the light emitting elements 3R, 3G, and 3B. That is, the range in which the magnetic force of the positive electrode terminals 11Ra, 11Ga, and 11Ba is narrowed and the range of the magnetic force in the negative electrode terminals 11Rb, 11Gb, and 11Bb is narrowed. Even if it is mistakenly arranged, it is possible to more reliably prevent the light emitting element 3R from being attracted by a magnetic force.

図6〜図8に示す本発明の表示装置の製造方法は、以下の構成である。正電極端子11aおよび負電極端子11bを含む発光素子設置領域が上面の側に複数配置されている基板1と、基板1の上面の上方に配置され、発光素子3の平面視形状と相補形状の開口20aが発光素子設置領域のそれぞれに対応して複数形成されている位置合わせ治具20と、を準備する第1の工程と、複数の開口20aのそれぞれに、発光素子3を、正電極13aと正電極端子11aが対向し、かつ負電極13bと負電極端子11bが対向する状態で挿入する第2の工程と、正電極13aと正電極端子11a、負電極13bと負電極端子11b、をそれぞれ導電性接続部材12a,12bを介して接続する第3の工程を有する構成である。この構成により、例えば10万個〜数100万個におよぶ多数個の小型の発光素子3をそれぞれ所定の位置に正確に配置させることができる。従って、良好な作業性および高い製造効率でもって表示装置を製造することができる。   The manufacturing method of the display device of the present invention shown in FIGS. 6 to 8 has the following configuration. A plurality of light emitting element installation regions including a positive electrode terminal 11a and a negative electrode terminal 11b are disposed on the upper surface side, and are disposed above the upper surface of the substrate 1, and have a shape complementary to the planar view shape of the light emitting element 3. A first step of preparing an alignment jig 20 in which a plurality of openings 20a are formed corresponding to each of the light emitting element installation regions, and the light emitting element 3 and the positive electrode 13a in each of the plurality of openings 20a. And the positive electrode terminal 11a and the negative electrode 13b and the negative electrode terminal 11b are inserted in a second state, the positive electrode 13a and the positive electrode terminal 11a, the negative electrode 13b and the negative electrode terminal 11b, It is the structure which has a 3rd process connected through the electroconductive connection members 12a and 12b, respectively. With this configuration, for example, a large number of small light emitting elements 3 ranging from 100,000 to several million can be accurately arranged at predetermined positions, respectively. Therefore, the display device can be manufactured with good workability and high manufacturing efficiency.

そして、図8に示すように、複数の開口20aのそれぞれに、発光素子3を、正電極13aと正電極端子11aが対向し、かつ負電極13bと負電極端子11bが対向する状態で挿入する第2の工程において、開口20aの数と同数以上の発光素子3を位置合わせ治具20の上方から散布することがよい。この場合、開口20aに挿入された発光素子3は磁力によって吸着しているので、基板1から除去されず、開口20aに挿入されなかった発光素子3は磁力によって吸着していないので、基板1上から容易に取り除くことができる。複数種類の発光素子3R,3G,3Bを、開口20aに挿入し配置するためには、まず所定の発光波長の発光素子3、例えば発光素子3Rについて、第2の工程において散布工程、除去工程を実施し、場合によっては散布工程、除去工程を繰り返して発光素子3R用のすべての開口20aに挿入し配置する。次に、異なる発光波長の発光素子3、例えば発光素子3Gについて、同様にして発光素子3G用のすべての開口20aに挿入し配置する。次に、さらに異なる発光波長の発光素子3、例えば発光素子3Bについて、同様にして発光素子3B用のすべての開口20aに挿入し配置する。そして、図7に示すように、位置合わせ治具20を取り除き、基板1をリフロー装置に通すことによって導電性接続部材12a,12bを溶融し固化させて、すべての発光素子3R,3G,3Bを基板1上に設置する。この構成により、それぞれの開口20aに1個ずつ発光素子3を挿入していく作業が省かれるので、より良好な作業性およびより高い製造効率でもって表示装置を製造することができる。   As shown in FIG. 8, the light emitting element 3 is inserted into each of the plurality of openings 20a in a state where the positive electrode 13a and the positive electrode terminal 11a face each other and the negative electrode 13b and the negative electrode terminal 11b face each other. In the second step, it is preferable that the same number or more of the light emitting elements 3 as the number of the openings 20 a be dispersed from above the alignment jig 20. In this case, since the light emitting element 3 inserted into the opening 20a is adsorbed by magnetic force, it is not removed from the substrate 1, and the light emitting element 3 not inserted into the opening 20a is not adsorbed by magnetic force. Can be easily removed from. In order to insert and arrange a plurality of types of light emitting elements 3R, 3G, and 3B in the opening 20a, first, for the light emitting element 3 having a predetermined emission wavelength, for example, the light emitting element 3R, in the second step, a spreading process and a removing process are performed. In some cases, the spraying step and the removing step are repeated and inserted into all the openings 20a for the light emitting element 3R. Next, the light emitting elements 3 having different emission wavelengths, for example, the light emitting element 3G, are similarly inserted and arranged in all the openings 20a for the light emitting elements 3G. Next, light emitting elements 3 having different emission wavelengths, for example, the light emitting element 3B, are similarly inserted and arranged in all the openings 20a for the light emitting element 3B. Then, as shown in FIG. 7, the alignment jig 20 is removed, and the conductive connecting members 12a and 12b are melted and solidified by passing the substrate 1 through a reflow apparatus, so that all the light emitting elements 3R, 3G, and 3B are assembled. It is installed on the substrate 1. With this configuration, the operation of inserting one light emitting element 3 into each opening 20a is omitted, so that a display device can be manufactured with better workability and higher manufacturing efficiency.

上記の表示装置の製造方法において、表示装置を製造するために複数種類の位置合わせ治具20を用いてもよい。例えば、発光素子3R,3G,3Bのそれぞれを配置するための3種類の位置合わせ治具20を用いてもよく、また発光素子3R,3Gを配置するための位置合わせ治具20と発光素子3Bを配置するための位置合わせ治具20の2種類の位置合わせ治具20を用いてもよい。例えば、発光素子3R,3G,3Bのそれぞれを配置するための3種類の位置合わせ治具20を位置合わせ治具20R,20G,20Bとした場合、まず位置合わせ治具20Rを用いて発光素子3Rを基板1上に配置し、位置合わせ治具20Rを基板1の上方から取り除いて位置合わせ治具20Gを用いて発光素子3Gを基板1上に配置し、位置合わせ治具20Gを基板1の上方から取り除いて位置合わせ治具20Bを用いて発光素子3Bを基板1上に配置する、という製造方法を採用することができる。   In the above method for manufacturing a display device, a plurality of types of alignment jigs 20 may be used to manufacture the display device. For example, three kinds of alignment jigs 20 for arranging the light emitting elements 3R, 3G, 3B may be used, and the alignment jig 20 for arranging the light emitting elements 3R, 3G and the light emitting element 3B. Two types of alignment jigs 20, i.e., alignment jigs 20 for disposing the components, may be used. For example, when the three kinds of alignment jigs 20 for arranging the light emitting elements 3R, 3G, and 3B are the alignment jigs 20R, 20G, and 20B, first, the light emitting element 3R is used by using the alignment jig 20R. Is disposed on the substrate 1, the alignment jig 20R is removed from above the substrate 1, the light emitting element 3G is disposed on the substrate 1 using the alignment jig 20G, and the alignment jig 20G is disposed above the substrate 1. It is possible to employ a manufacturing method in which the light emitting element 3B is disposed on the substrate 1 by using the alignment jig 20B.

本発明の表示装置を用いてマルチディスプレイを作製する場合、複数種類の発光素子3R,3G,3Bを搭載した基板1の複数を、同じ面上において縦横に配置するとともにそれらの側面同士を接着材、結合導体等によって結合(タイリング)させることによって、複合型かつ大型のマルチディスプレイとすることができる。   When a multi-display is manufactured using the display device of the present invention, a plurality of substrates 1 on which a plurality of types of light emitting elements 3R, 3G, 3B are mounted are arranged vertically and horizontally on the same surface, and the side surfaces are bonded to each other. By combining (tiling) with a connecting conductor or the like, a composite and large multi-display can be obtained.

なお、本発明の表示装置は、上記実施の形態に限定されるものではなく、適宜の変更、改良が施されていてもよい。例えば、フォトダイオード等の受光素子を、本発明の表示装置における発光素子と基本的に同じ構成として基板上に設置してもよく、その場合、表示装置に受光素子を利用したタッチパネル、指紋認証等の機能を追加することができる。例えば、発光部3aが受光部に変更されている以外は発光素子3と同じ構成である受光素子を、上述した製造方法によって、発光素子3R,3G,3Bに4種類目の素子として付加して基板上に設置すればよい。   The display device of the present invention is not limited to the above-described embodiment, and appropriate changes and improvements may be made. For example, a light receiving element such as a photodiode may be installed on the substrate with basically the same structure as the light emitting element in the display device of the present invention. In that case, a touch panel using the light receiving element for the display device, fingerprint authentication, etc. Can be added. For example, a light receiving element having the same configuration as the light emitting element 3 except that the light emitting part 3a is changed to a light receiving part is added to the light emitting elements 3R, 3G, and 3B as a fourth type element by the above-described manufacturing method. What is necessary is just to install on a board | substrate.

本発明の表示装置は、各種の電子機器に適用できる。その電子機器としては、複合型かつ大型のマルチディスプレイ、自動車経路誘導システム(カーナビゲーションシステム)、船舶経路誘導システム、航空機経路誘導システム、スマートフォン端末、携帯電話、タブレット端末、パーソナルデジタルアシスタント(PDA)、ビデオカメラ、デジタルスチルカメラ、電子手帳、電子書籍、電子辞書、パーソナルコンピュータ、複写機、ゲーム機器の端末装置、テレビジョン、商品表示タグ、価格表示タグ、産業用のプログラマブル表示装置、カーオーディオ、デジタルオーディオプレイヤー、ファクシミリ、プリンター、現金自動預け入れ払い機(ATM)、自動販売機、デジタル表示式腕時計、スマートウォッチ、方向指示機,信号機等の各種インジケータなどがある。   The display device of the present invention can be applied to various electronic devices. The electronic devices include a composite and large multi-display, an automobile route guidance system (car navigation system), a ship route guidance system, an aircraft route guidance system, a smartphone terminal, a mobile phone, a tablet terminal, a personal digital assistant (PDA), Video cameras, digital still cameras, electronic notebooks, electronic books, electronic dictionaries, personal computers, copying machines, terminal devices for game machines, televisions, product display tags, price display tags, industrial programmable display devices, car audio, digital There are various indicators such as an audio player, a facsimile, a printer, an automatic teller machine (ATM), a vending machine, a digital display wristwatch, a smart watch, a direction indicator, and a traffic light.

1 基板
3,3R,3G,3B 発光素子
3a 発光部
3b 基体
3c 突出部
11a,11Ra,11Ga,11Ba 正電極端子
11b,11Rb,11Gb,11Bb 負電極端子
12a,12b 導電性接続部材
13a,13Ra,13Ga,13Ba 正電極
13b,13Rb,13Gb,13Bb 負電極
20 位置合わせ治具
20a 開口
DESCRIPTION OF SYMBOLS 1 Board | substrate 3, 3R, 3G, 3B Light emitting element 3a Light emission part 3b Base | substrate 3c Protrusion part 11a, 11Ra, 11Ga, 11Ba Positive electrode terminal 11b, 11Rb, 11Gb, 11Bb Negative electrode terminal 12a, 12b Conductive connection member 13a, 13Ra, 13Ga, 13Ba Positive electrode 13b, 13Rb, 13Gb, 13Bb Negative electrode 20 Positioning jig 20a Opening

Claims (4)

基板と、
前記基板上に設置され、磁性体から成る正電極および磁性体から成る負電極をそれぞれ有するとともに発光波長が互いに異なる複数種類の発光素子と、を有しており、
前記基板は、前記正電極に対向し接続され、永久磁性体から成る正電極端子と、前記負電極に対向し接続され、永久磁性体から成る負電極端子と、を有している表示装置であって、
前記複数種類の発光素子は、平面視形状が同じ輪郭形状であり、種類ごとに前記正電極および前記負電極の配置構成が異なっている表示装置。
A substrate,
A plurality of types of light-emitting elements, each having a positive electrode made of a magnetic material and a negative electrode made of a magnetic material and having different emission wavelengths, installed on the substrate;
The substrate is a display device having a positive electrode terminal made of a permanent magnetic material and connected to the positive electrode, and a negative electrode terminal made of a permanent magnetic material and connected to the negative electrode. There,
The plurality of types of light-emitting elements have the same outline shape in plan view, and the arrangement configuration of the positive electrode and the negative electrode is different for each type.
前記複数種類の発光素子は、平面視形状が非対称性を有する形状である請求項1に記載の表示装置。   2. The display device according to claim 1, wherein the plurality of types of light emitting elements have an asymmetric shape in plan view. 前記複数種類の発光素子は、種類が異なるものを輪郭を重ねて平面視したときに、前記正電極が互いに重ならない位置にあり前記負電極が互いに重ならない位置にある請求項1または請求項2に記載の表示装置。   3. The plurality of types of light emitting elements are located at positions where the positive electrodes do not overlap each other and the negative electrodes do not overlap each other when the different types of light emitting elements are viewed in plan with overlapping outlines. The display device described in 1. 前記基板上に設置された前記複数種類の発光素子のそれぞれを平面視したときに、前記正電極端子は前記正電極の内側にあり、前記負電極端子は前記負電極の内側にある請求項1乃至請求項3のいずれか1項に記載の表示装置。   The positive electrode terminal is inside the positive electrode and the negative electrode terminal is inside the negative electrode when each of the plurality of types of light emitting elements installed on the substrate is viewed in plan. The display device according to any one of claims 3 to 3.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155428A (en) * 2019-03-18 2020-09-24 アルディーテック株式会社 Manufacturing method of semiconductor chip integration device, semiconductor chip integration device, semiconductor chip ink and semiconductor chip ink ejection device
JPWO2021240297A1 (en) * 2020-05-29 2021-12-02
WO2021256447A1 (en) * 2020-06-20 2021-12-23 アルディーテック株式会社 Semiconductor light-emitting element chip integration device and method for manufacturing same
JP7072933B1 (en) 2020-12-14 2022-05-23 晶呈科技股▲分▼有限公司 Alignment module for magnetic LED die transfer and its alignment method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49103388U (en) * 1972-12-27 1974-09-05
JPS5462677U (en) * 1977-10-13 1979-05-02
JP2001257218A (en) * 2000-03-10 2001-09-21 Sony Corp Method for mounting fine chip
JP2003216052A (en) * 2002-01-17 2003-07-30 Sony Corp Method for arranging elements, method for manufacturing display device, and display device.
JP2006140398A (en) * 2004-11-15 2006-06-01 Sony Corp Element transfer method
JP2014090052A (en) * 2012-10-30 2014-05-15 Nichia Chem Ind Ltd Light-emitting element, light-emitting device and light-emitting device manufacturing method
JP2014225628A (en) * 2013-01-30 2014-12-04 日亜化学工業株式会社 Semiconductor light-emitting element
WO2015163763A1 (en) * 2014-04-24 2015-10-29 Rena Electronics Illumination device and method of making same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49103388U (en) * 1972-12-27 1974-09-05
JPS5462677U (en) * 1977-10-13 1979-05-02
JP2001257218A (en) * 2000-03-10 2001-09-21 Sony Corp Method for mounting fine chip
JP2003216052A (en) * 2002-01-17 2003-07-30 Sony Corp Method for arranging elements, method for manufacturing display device, and display device.
JP2006140398A (en) * 2004-11-15 2006-06-01 Sony Corp Element transfer method
JP2014090052A (en) * 2012-10-30 2014-05-15 Nichia Chem Ind Ltd Light-emitting element, light-emitting device and light-emitting device manufacturing method
JP2014225628A (en) * 2013-01-30 2014-12-04 日亜化学工業株式会社 Semiconductor light-emitting element
WO2015163763A1 (en) * 2014-04-24 2015-10-29 Rena Electronics Illumination device and method of making same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155428A (en) * 2019-03-18 2020-09-24 アルディーテック株式会社 Manufacturing method of semiconductor chip integration device, semiconductor chip integration device, semiconductor chip ink and semiconductor chip ink ejection device
JPWO2021240297A1 (en) * 2020-05-29 2021-12-02
WO2021240297A1 (en) * 2020-05-29 2021-12-02 株式会社半導体エネルギー研究所 Electronic device and electronic device authentication method
US12020513B2 (en) 2020-05-29 2024-06-25 Semiconductor Energy Laboratory Co., Ltd. Electronic device and authentication method of electronic device
WO2021256447A1 (en) * 2020-06-20 2021-12-23 アルディーテック株式会社 Semiconductor light-emitting element chip integration device and method for manufacturing same
JP2022002289A (en) * 2020-06-20 2022-01-06 アルディーテック株式会社 Semiconductor light emitting device chip integration device and manufacturing method thereof
JP7072933B1 (en) 2020-12-14 2022-05-23 晶呈科技股▲分▼有限公司 Alignment module for magnetic LED die transfer and its alignment method
JP2022094269A (en) * 2020-12-14 2022-06-24 晶呈科技股▲分▼有限公司 Alignment module for magnetic led die transfer and alignment method thereof

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