JP2018169191A - Infrared sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an infrared sensor capable of accelerating the convergence of thermal balance, improving thermal responsiveness, and increasing the temperature difference between a detection side and a compensation side. SOLUTION: An insulating film 2, a pair of first terminal electrodes 4A and a second terminal electrode 4B, a first heat sensitive element 5A, a second heat sensitive element 5B, and one surface of an insulating film. A pair of first pattern wiring 6A and a pair of second pattern wiring 6B formed in the above, a light receiving region provided on the other surface of the insulating film and facing the first heat sensitive element, and the other of the insulating film. It is provided with an infrared reflecting film 8 formed on the surface of the surface and covering at least directly above the second heat-sensitive element while avoiding a light receiving region, and the infrared reflecting film is formed in a region directly above at least the second heat-sensitive element. The portion 8a has a light receiving region frame portion 8b formed so as to cover the periphery of the light receiving region, and the insulating film has a hole portion S formed between the light receiving region and the compensating side reflecting portion. ing. [Selection diagram] Fig. 1

Description

  The present invention relates to an infrared sensor that is suitable for measuring the temperature of a heating roller of a copying machine, a printer, or the like and has excellent responsiveness.

In general, in order to measure the temperature of an object to be measured such as a fixing roller used in an image forming apparatus such as a copying machine or a printer, an infrared sensor is disposed opposite the object to be measured and receives the radiant heat to measure the temperature. Is installed.
As such an infrared sensor, an infrared sensor in which a thermal element is formed on a thin insulating film has been developed in recent years.

For example, in Patent Document 1, an insulating film, a first thermal element and a second thermal element provided on one surface of the insulating film, and a first surface of the insulating film are provided on one surface of the insulating film. Conductive first wiring film formed and connected to the first thermal element, and conductive second wiring film connected to the second thermal element, and insulative facing the second thermal element An infrared sensor comprising an infrared reflective film provided on the other surface of the film is described.
Further, Patent Document 2 discloses that an insulating film has an intermediate portion extending in a direction in which the first thermal element and the second thermal element are partitioned between the first thermal element and the second thermal element. An infrared sensor having a long hole portion is described.

JP 2013-160635 A JP 2012-212789 A

The following problems remain in the conventional technology.
That is, in the case of the above-described conventional infrared sensor, if the response performance of the sensor is improved, the signal difference between the two thermosensitive elements may be reduced and the detection sensitivity may be lowered, and an improvement in detection sensitivity is required. Yes.
In the technique of Patent Document 2, horizontal heat transfer between the compensation-side thermal element and the detection-side thermal element is suppressed by the slit (intermediate slot), and the temperature difference between the two thermal elements is reduced. Since a structure that is easily formed is employed, detection sensitivity is improved while suppressing a decrease in response performance. However, when the environmental temperature changes, for example, when the temperature changes on one of the light receiving side and the compensation side due to the influence of the convection of the ambient air, the convergence of the heat balance between the light receiving side and the compensation side becomes slow. As a result, there is a disadvantage that the thermal response is lowered.

  The present invention has been made in view of the above-described problems, and provides an infrared sensor capable of speeding up the convergence of the heat balance, improving the thermal response, and increasing the temperature difference between the detection side and the compensation side. For the purpose.

  The present invention employs the following configuration in order to solve the above problems. That is, the infrared sensor according to the first invention includes an insulating film, a pair of first terminal electrodes and a pair of second terminal electrodes patterned on one surface of the insulating film, and the insulating property. One end of the first and second thermosensitive elements provided on one surface of the film is connected to the first thermosensitive element, and the other end is connected to the pair of first terminal electrodes. One end of the pair of first pattern wirings patterned on one surface of the insulating film and the second thermosensitive element are connected to the other end of the pair of second terminal electrodes. A pair of second pattern wiring patterns formed on one surface of the insulating film, a light receiving region provided on the other surface of the insulating film and facing the first thermal element, and the insulating film Shape on the other side of An infrared reflection film that covers at least the second heat sensitive element and avoids the light receiving area, and the infrared reflection film is formed at least in a region immediately above the second heat sensitive element. And a light receiving region frame portion formed so as to cover the periphery of the light receiving region, and the insulating film has a hole formed between the light receiving region and the compensation side reflecting portion. It is characterized by.

In this infrared sensor, the infrared reflecting film has a compensation-side reflecting portion and a light receiving region frame, and the insulating film has a hole formed between the light receiving region and the light receiving region frame. Therefore, the thermal balance between the detection side and the compensation side can be quickly converged at the light receiving area frame, and the horizontal heat conduction between the detection side and the compensation side can be suppressed by the hole.
That is, since the light receiving region frame covers the periphery of the light receiving region, the change in the environmental temperature is transmitted to the entire periphery of the light receiving region, and the convergence of the heat balance can be accelerated. In addition, the hole portion can suppress heat transfer in the horizontal direction between the light receiving region and the compensation side reflection portion, and can increase the temperature difference between the detection side and the compensation side. Therefore, the temperature gradient due to air convection between the first thermal element side and the second thermal element side is reduced, the response speeds of the two thermal elements can be made equal, and the detection side and the compensation are compensated. The temperature difference from the side increases and high sensitivity can be obtained.

For example, in the case of only the compensation side reflection part, that is, when the infrared reflection film is formed only in the region facing the second heat sensitive element, when air flows from the second heat sensitive element side due to the convection of the surrounding air The infrared reflective film above the second thermosensitive element cools and the temperature of the insulating film changes locally. On the other hand, in the infrared sensor of the present invention, since the infrared reflecting film is formed so as to cover the periphery of the light receiving region facing the first thermal element, the region on the second thermal element side is cooled by the air flow. However, the temperature around the light receiving region also decreases due to the thermal conductivity of the infrared reflecting film, and the difference in temperature hardly occurs as a whole, and it is difficult to be affected by the convection of the surrounding air. The light receiving area above the first thermosensitive element is not covered with the infrared reflecting film, and the hole is also outside the light receiving area, so that the infrared light from the measurement object is not hindered.
As described above, the temperature difference between the detection side and the compensation side can be reduced by the light receiving area frame portion with respect to the change of the environmental temperature, and the light receiving area and the compensation are made by the hole portion with respect to infrared incident from the measurement object. In order to suppress the direct heat conduction between the side reflection portion, the temperature difference between the detection side and the compensation side increases, and high sensitivity can be obtained.

The infrared sensor according to a second aspect of the present invention is the infrared sensor according to the first aspect, wherein the hole is a slit-like long hole extending in a direction of partitioning the light receiving region and the compensation-side reflecting part. It is characterized by.
That is, in this infrared sensor, since the hole is a slit-like long hole extending in a direction separating the light-receiving region and the compensation-side reflecting portion, the light-receiving region and the compensation are compensated by the slit-like long hole. The heat transfer in the horizontal direction between the side reflection portions can be interrupted between them, and the temperature difference between the detection side and the compensation side can be further increased.

An infrared sensor according to a third invention is characterized in that, in the first invention, a plurality of the hole portions are provided side by side in a direction separating the light receiving region and the compensation side reflection portion. To do.
That is, in this infrared sensor, a plurality of hole portions are provided in a direction separating the light receiving region and the compensation-side reflection portion, so that thermal conductivity or The rigidity of the insulating film can be adjusted.

An infrared sensor according to a fourth aspect of the present invention is the infrared sensor according to the second aspect, wherein the light receiving area frame is formed so as to cover the entire circumference of the light receiving area, and the hole is formed between the light receiving area frame and the compensation side reflection. And the infrared reflection film has an outer connection portion that connects the light receiving region frame portion and the compensation side reflection portion outside the hole portion and on the outer peripheral edge side of the insulating film. It is characterized by.
That is, in this infrared sensor, the hole is formed between the light receiving region frame that covers the entire circumference of the light receiving region and the compensation side reflecting portion, and the infrared reflecting film includes the light receiving region frame and the compensation side reflecting portion. Since the outer connecting portion is connected to the outer peripheral side of the insulating film on the outer side of the hole portion, the heat transmitted from the entire periphery of the light receiving region to the light receiving region frame portion is passed through the outer connecting portion outside the hole portion. It is transmitted to the compensation side reflection section, and higher response can be obtained.

An infrared sensor according to a fifth aspect of the present invention is the infrared sensor according to any one of the first to fourth aspects, wherein the hole is disposed in proximity to the second thermal element.
That is, in this infrared sensor, since the hole is arranged close to the second thermosensitive element, heat conduction from the detection side can be suppressed in the vicinity of the second thermosensitive element. Can be made larger.

An infrared sensor according to a sixth aspect of the present invention is the infrared sensor according to any one of the first to fifth aspects, wherein the light receiving region frame portion is disposed close to a part of the first pattern wiring. To do.
That is, in this infrared sensor, the light receiving area frame is disposed in close proximity to a part of the first pattern wiring, so that the light receiving area frame is thermally coupled to a part of the first pattern wiring. A change in environmental temperature can be efficiently transmitted between the detection side and the compensation side, and the convergence of the thermal balance between the detection side and the compensation side is accelerated, and the thermal response is further improved. In addition, since the insulating film is thin, the heat on one surface is quickly transferred to the infrared reflecting film on the other surface, and particularly when the infrared reflecting film is a metal film, it has high thermal conductivity and has a detection side and a compensation side. And can transfer heat to each other to quickly converge the heat balance.

The present invention has the following effects.
That is, according to the infrared sensor according to the present invention, the infrared reflecting film has the compensation side reflecting portion and the light receiving region frame portion, and the insulating film partitions the light receiving region and the element facing region in a direction separating them. In the light receiving area frame, the heat balance of the detection side and the compensation side can be quickly converged, and the horizontal portion between the detection side and the compensation side is provided by the hole. The heat conduction in the direction can be suppressed.
Therefore, the infrared sensor of the present invention has high thermal response and high sensitivity, and is suitable for measuring the temperature of a heating roller such as a copying machine or a printer.

It is the top view (a) and back view (b) which show 1st Embodiment of the infrared sensor which concerns on this invention. In the infrared sensor according to the present embodiment, the infrared reflective film on the back side is also a plan view illustrated by broken lines. It is a back view which shows the infrared sensor which shows 2nd Embodiment of the infrared sensor which concerns on this invention. It is the top view (a) and back view (b) which show 3rd Embodiment of the infrared sensor which concerns on this invention. It is the top view (a) and back view (b) which show 4th Embodiment of the infrared sensor which concerns on this invention. It is the top view (a) and back view (b) which show 5th Embodiment of the infrared sensor which concerns on this invention.

  Hereinafter, a first embodiment of an infrared sensor according to the present invention will be described with reference to FIGS. 1 and 2.

  As shown in FIGS. 1 and 2, the infrared sensor 1 of this embodiment includes an insulating film 2, a pair of first terminal electrodes 4 </ b> A patterned on one surface (surface) of the insulating film 2, and One end of the pair of second terminal electrodes 4B, the first thermal element 5A and the second thermal element 5B provided on one surface of the insulating film 2, and the first thermal element 5A are connected. In addition, the other end is connected to the pair of first terminal electrodes 4A and one end is connected to the pair of first pattern wirings 6A patterned on one surface of the insulating film 2 and the second thermal element 5B. And the other end of the insulating film 2 and the other surface (light receiving side) of the insulating film 2 and the other end connected to the pair of second terminal electrodes 4B and patterned on one surface of the insulating film 2. First surface, back surface) A light receiving region D opposing the A, and a infrared reflection film 8 is formed on the other surface of the insulating film 2 while avoiding the light receiving region D that covers directly above at least a second heat sensitive element 5B.

The infrared reflecting film 8 has at least a compensation-side reflecting portion 8a formed in a region immediately above the second thermosensitive element 5B, and a light receiving region frame portion 8b formed so as to cover the periphery of the light receiving region D. ing.
The insulating film 2 has a hole S formed between the light receiving region D and the compensation side reflecting portion 8a. The hole S is a slit-like long hole extending in a direction in which the light receiving region D and the compensation-side reflecting portion 8a are partitioned.
In the present embodiment, the light receiving area frame portion 8b is formed so as to cover the entire circumference of the light receiving area D. That is, the inside of the light receiving area frame portion 8b is the light receiving area D.

Further, the hole S is disposed in the vicinity of the second thermal element 5B.
The infrared reflection film 8 has an outer connection portion 8 c that connects the light receiving region frame portion 8 b and the compensation side reflection portion 8 a on the outer side of the hole S and on the outer peripheral edge side of the insulating film 2.
That is, the light receiving region frame portion 8b is connected to the compensation side reflection portion 8a by the two outer connection portions 8c formed on the outer peripheral edge side of the insulating film 2.

Further, the light receiving area frame portion 8b is disposed in proximity to a part of the first pattern wiring 6A.
That is, the light receiving region frame portion 8b has a thermal coupling portion C opposed to a part of the first pattern wiring 6A in the thickness direction.
The thermal coupling portion C is a portion for thermally coupling with a part of the first pattern wiring 6A.

  The pair of first pattern wirings 6A has a pair of first adhesive electrodes 3A connected to the first thermal element 5A at one end. Further, the pair of second pattern wirings 6B has a pair of second adhesive electrodes 3B connected to the second heat sensitive element 5B at one end.

  In addition, the infrared sensor 1 of the present embodiment is connected to the pair of first adhesive electrodes 3A separately from the first pattern wiring 6A, and has a thermal conductivity higher than that of the insulating film 2 on one surface of the insulating film 2. A pair of heat transfer films 7 which are high-thin and patterned in the vicinity of the first adhesive electrode 3A are provided.

The first pattern wiring 6A extends to the vicinity of the second thermal element 5B. Further, the thermal coupling portion C of the light receiving region frame portion 8b has a compensation side neighboring coupling portion C1 facing a portion extending in the vicinity of the second thermal element 5B in the first pattern wiring 6A.
Further, the first pattern wiring 6 </ b> A further extends to a region near the outer edge of the insulating film 2. Further, the thermal coupling portion C of the light receiving region frame portion 8b has an outer edge neighboring coupling portion C2 facing the first pattern wiring 6A in the neighboring region.

In this way, the pair of first pattern wirings 6A extends from the pair of first adhesive electrodes 3A toward the side opposite to the pair of first terminal electrodes 4A, and further the pair of heat transfer films 7. Each of the first terminal electrodes 4A reaches the corresponding first terminal electrode 4A.
That is, the first pattern wiring 6A first extends between the pair of heat transfer films 7 from the first adhesive electrode 3A toward the second heat sensitive element 5B, and ends of the pair of heat transfer films 7 In the vicinity, it extends in the direction along the short side of the insulating film 2 and toward the long side. A part of the light receiving region frame portion 8b is formed to face the extending portion, and is used as a compensation side vicinity coupling portion C1. Furthermore, the first pattern wiring 6 </ b> A extends outside the heat transfer film 7 along the long side of the insulating film 2 to the first terminal electrode 4 </ b> A. The light-receiving region frame portion 8b extends in the vicinity of the outer edge of the insulating film 2 so as to face the extended portion, and this portion serves as the outer edge vicinity coupling portion C2.
The second pattern wiring 6B extends at a shorter distance than the first pattern wiring 6A and reaches the second terminal electrode 4B.

The first pattern wiring 6A and the heat transfer film 7 are not in direct contact with each other, but are indirectly connected through the first adhesive electrode 3A.
The heat transfer film 7 is formed in a larger area than the first pattern wiring 6A.
The corresponding terminal electrodes of the first thermal element 5A and the second thermal element 5B are bonded to the first adhesive electrode 3A and the second adhesive electrode 3B, respectively, with a conductive adhesive such as solder.
The light receiving region frame portion 8b is formed so as to avoid a position directly above the pair of heat transfer films 7.

As described above, in the present embodiment, the first thermal element 5A disposed immediately below the infrared light receiving surface is used as an infrared detection element, and the second thermal element 5B disposed directly below the infrared reflection film 8 is used for compensation. It is considered as an element.
In FIG. 2, the infrared reflective film 8 on the back side is shown by a broken line. 1A and 1B, each terminal electrode, each pattern wiring, the heat transfer film 7, and the infrared reflection film 8 are hatched.

The insulating film 2 is formed of a polyimide resin sheet in a substantially rectangular shape, and the infrared reflection film 8, each pattern wiring, each terminal electrode, each adhesive electrode, and the heat transfer film 7 are formed of copper foil. That is, these are double-sided flexible substrates in which an infrared reflecting film 8, each pattern wiring, each terminal electrode, each adhesive electrode, and a heat transfer film 7 are patterned with copper foil on both surfaces of a polyimide substrate to be an insulating film 2. It was produced by.
The pair of first terminal electrodes 4 </ b> A and the pair of second terminal electrodes 4 </ b> B are disposed in the vicinity of the corners of the insulating film 2.

The infrared reflection film 8 is composed of the copper foil described above and a gold plating film laminated on the copper foil.
The infrared reflecting film 8 is formed of a material having an infrared reflectance higher than that of the insulating film 2 and is formed by applying a gold plating film on the copper foil as described above. In addition to the gold plating film, for example, a mirror-deposited aluminum vapor deposition film or an aluminum foil may be used.

  The first thermal element 5A and the second thermal element 5B are chip thermistors in which terminal electrodes (not shown) are formed at both ends. As this thermistor, there are thermistors of NTC type, PTC type, CTR type and the like. In this embodiment, for example, NTC type thermistors are employed as the first thermal element 5A and the second thermal element 5B. This thermistor is formed of a thermistor material such as a Mn—Co—Cu-based material or a Mn—Co—Fe-based material.

  As described above, in the infrared sensor 1 of the present embodiment, the infrared reflection film 8 includes the compensation side reflection portion 8a and the light receiving region frame portion 8b, and the insulating film 2 includes the light reception region D and the compensation side reflection portion 8a. Since the hole S extending in the direction in which they are divided between the light receiving region frame 8b, the heat balance between the detection side and the compensation side can be quickly converged by the light receiving region frame 8b. Horizontal heat conduction between the detection side and the compensation side can be suppressed.

  That is, since the light receiving region frame portion 8b covers the periphery of the light receiving region D, the change in the environmental temperature is transmitted to the entire periphery of the light receiving region D, so that the heat balance can be quickly converged. Moreover, the hole S can suppress the heat transfer in the horizontal direction between the light receiving region D and the compensation side reflection part 8a, and can increase the temperature difference between the detection side and the compensation side. Accordingly, the temperature gradient due to air convection between the first thermal element 5A side and the second thermal element 5B side is reduced, the response speeds of the two thermal elements can be made equal, and the detection side And the temperature difference between the compensation side increases and high sensitivity can be obtained.

  Further, since the hole S is a slit-like long hole extending in a direction separating the light receiving region D and the compensation-side reflecting portion 8a, the slit-shaped hole S compensates for the light receiving region D and the compensation region. The heat transfer in the horizontal direction between the side reflecting portions 8a can be blocked between them, and the temperature difference between the detection side and the compensation side can be further increased.

Further, the hole S is formed between the light receiving region frame portion 8b covering the entire circumference of the light receiving region D and the compensation side reflection portion 8a, and the infrared reflection film 8 is formed between the light reception region frame portion 8b and the compensation side reflection portion 8a. Are connected to the outer periphery of the insulating film 2 and the outer peripheral edge of the insulating film 2, the heat transmitted from the entire periphery of the light receiving region D to the light receiving region frame portion 8 b. It is transmitted to the compensation-side reflecting portion 8a via the outer connecting portion 8c on the outer side, and higher responsiveness can be obtained.
Moreover, since the hole S is disposed in the vicinity of the second thermal element 5B, heat conduction from the detection side can be suppressed in the vicinity of the second thermal element 5B, and the temperature difference can be further increased. Can be bigger.

  Further, since the light receiving area frame portion 8b is arranged close to a part of the first pattern wiring 6A, the light receiving area frame portion 8b is detected by being thermally coupled to a part of the first pattern wiring 6A. The change in the environmental temperature can be efficiently transmitted between the detection side and the compensation side, the convergence of the thermal balance between the detection side and the compensation side is accelerated, and the thermal response is further improved. In addition, since the insulating film 2 is thin, heat on one surface is quickly transmitted to the infrared reflection film 8 on the other surface, and particularly when the infrared reflection film 8 is a metal film, the detection side has high thermal conductivity. And the compensation side can transmit heat to each other to quickly converge the heat balance.

  Next, second to fifth embodiments of the infrared sensor according to the present invention will be described below with reference to FIGS. In the following description of each embodiment, the same constituent elements described in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The difference between the second embodiment and the first embodiment is that in the first embodiment, the light receiving area frame portion 8b is formed in a square shape so as to surround the entire circumference of the light receiving area D. In the infrared sensor 21, as shown in FIG. 3, a light receiving area frame portion 28 b that surrounds and covers the light receiving area D in a U shape, and a hole S is formed directly adjacent to the light receiving area D. is there.

That is, in the second embodiment, the hole S is formed directly adjacent to the light receiving region D without providing the light receiving region frame portion 28b in the portion adjacent to the compensation side of the light receiving region D. Further, the infrared reflective film 28 of the infrared sensor 21 does not have an outer connection portion, and a U-shaped light receiving region frame portion 28b is directly connected to the compensation side reflective portion 28a.
Thus, also in the infrared sensor 21 of the second embodiment, the heat transfer in the horizontal direction between the light receiving region D and the compensation-side reflecting portion 8a is blocked by the slit-shaped hole S as in the first embodiment. In addition, the temperature difference between the detection side and the compensation side can be increased.

  Next, the difference between the third embodiment and the first embodiment is that, in the first embodiment, the first pattern wiring 6A extends from the first adhesive electrode 3A toward the second thermal element 5B. Further, while reaching the first terminal electrode 4A via the outside of the heat transfer film 7, the infrared sensor 31 of the third embodiment has a pair of first pattern wirings as shown in FIG. 36A extends in a direction opposite to that of the first embodiment from the pair of first adhesive electrodes 3A, and reaches the corresponding first terminal electrode 4A through a plurality of meandering portions 36a that are bent back and forth. is there.

That is, in the third embodiment, since the first pattern wiring 36A has the meandering portion 36a, the thermal resistance to the first terminal electrode 4A can be increased. Therefore, as in the first embodiment, the first pattern wiring 6A is once extended toward the second heat sensitive element 5B side and extended long without being detoured outside the heat transfer film 7. The heat flowing to the first terminal electrode 4A can be suppressed.
In the third embodiment, the light receiving region frame portion 38b of the infrared reflecting film 38 is adjacent to the first pattern wiring 36A in the thickness direction in the vicinity of the first terminal electrode 4A. They are thermally coupled to each other.

In the third embodiment, since the first pattern wiring 36A does not extend to the second terminal electrode 4B side, the first pattern wiring 36A is interposed between the heat transfer film 37 and the second terminal electrode 4B from the first embodiment. Is also provided with a slit-shaped hole S3 formed to be wide.
Therefore, in the infrared sensor 31 of the third embodiment, the heat transfer in the horizontal direction between the light receiving region D and the compensation-side reflecting portion 38a is further blocked between the light receiving region D and the compensation-side reflecting portion 38a than in the first embodiment by the wide hole S3. The temperature difference between the detection side and the compensation side can be further increased.

Next, the difference between the fourth embodiment and the third embodiment is that the hole S3 is a slit-like long hole, whereas in the infrared sensor 41 of the fourth embodiment, as shown in FIG. The hole S4 has a round hole shape, and a plurality of holes S4 are provided side by side in a direction in which these are separated between the light receiving region D and the compensation side reflection part 48a.
Therefore, in the infrared sensor 41 of the fourth embodiment, a plurality of the holes S4 are provided side by side in the direction of partitioning the light receiving region D and the compensation side reflection part 48a. Depending on the interval, the thermal conductivity and the rigidity of the insulating film 2 can be adjusted.

Next, the difference between the fifth embodiment and the third embodiment is that in the third embodiment, the U-shaped light receiving region frame portion 38b is directly connected to the compensation-side reflecting portion 38a. In the infrared sensor 51 of the fifth embodiment, as shown in FIG. 6, a light receiving area frame portion 58b is formed in a square shape so as to surround the entire circumference of the light receiving area D, as in the first embodiment. The hole portion S5 is formed between the light receiving region frame portion 58b and the compensation-side reflection portion 58a, and the hole portion S5 is formed wider than the first embodiment.
Therefore, in the infrared sensor 51 of the fifth embodiment, the wide hole portion S5 blocks the heat transfer in the horizontal direction between the light receiving region D and the compensation-side reflecting portion 58a more than in the first embodiment, The temperature difference between the detection side and the compensation side can be further increased.

  The technical scope of the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the first thermal element detects heat conducted from the insulating film that directly absorbs infrared rays, but is directly above the first thermal element and is on one side of the insulating film. An infrared absorption film having higher infrared absorption than the insulating film may be formed thereon. In this case, the infrared absorption effect in the first thermal element is further improved, and a better temperature difference between the first thermal element and the second thermal element can be obtained. That is, the infrared absorption film absorbs infrared rays due to radiation from the object to be measured, and the temperature of the first thermosensitive element immediately below is obtained by heat conduction through the insulating film from the infrared absorption film that absorbs infrared rays and generates heat. May be changed.

  1, 2, 31, 41, 51 ... Infrared sensor, 2 ... Insulating film, 3A ... First adhesive electrode, 3B ... Second adhesive electrode, 4A ... First terminal electrode, 4B ... Second terminal electrode 5A ... 1st thermal element, 5B ... 2nd thermal element, 6A, 36A ... 1st pattern wiring, 6B, 36B ... 2nd pattern wiring, 8, 28, 38, 48, 58 ... Infrared reflective film , 8a, 28a, 38a, 48a, 58a ... compensation-side reflecting portion, 8b, 28b, 38b, 48b, 58b ... light receiving region frame portion, 8c ... outer connection portion, D ... light receiving region, S, S3, S4, S5 ... Hole

Claims (6)

An insulating film;
A pair of first terminal electrodes and a pair of second terminal electrodes patterned on one surface of the insulating film;
A first thermal element and a second thermal element provided on one surface of the insulating film;
A pair of first pattern wirings having one end connected to the first thermosensitive element and the other end connected to the pair of first terminal electrodes and patterned on one surface of the insulating film;
A pair of second pattern wirings having one end connected to the second thermosensitive element and the other end connected to the pair of second terminal electrodes and patterned on one surface of the insulating film;
A light receiving region provided on the other surface of the insulating film and facing the first thermal element;
An infrared reflective film that is formed on the other surface of the insulating film and that covers at least the second thermal element, avoiding the light receiving region;
The infrared reflection film has a compensation-side reflection portion formed at least in a region immediately above the second thermosensitive element, and a light-receiving region frame portion formed so as to cover the periphery of the light-receiving region,
The infrared sensor, wherein the insulating film has a hole formed between the light receiving region and the compensation side reflecting portion. The infrared sensor according to claim 1,
The infrared sensor, wherein the hole portion is a slit-like long hole extending in a direction in which the light receiving region and the compensation side reflection portion are separated from each other. The infrared sensor according to claim 1,
An infrared sensor, wherein a plurality of the hole portions are provided side by side in a direction in which the light receiving region and the compensation side reflection portion are partitioned. The infrared sensor according to claim 2,
The light receiving area frame is formed to cover the entire circumference of the light receiving area,
The hole is formed between the light receiving region frame and the compensation side reflection part,
The infrared reflection film has an outer connection portion that connects the light receiving region frame portion and the compensation side reflection portion outside the hole portion and on the outer peripheral edge side of the insulating film. Sensor. In the infrared sensor according to any one of claims 1 to 4,
The infrared sensor, wherein the hole is disposed in proximity to the second thermal element. In the infrared sensor according to any one of claims 1 to 5,
The infrared sensor according to claim 1, wherein the light receiving region frame portion is disposed in proximity to a part of the first pattern wiring.

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