JP2018166201A - Substrate for imaging apparatus and imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for an image pickup apparatus capable of increasing the joint strength of a lid. SOLUTION: A base portion 11 having a mounting region 1a of an image pickup element 5 on an upper surface and having a rectangular shape in a plan view, and a frame having a rectangular shape in a plan view and surrounding the mounting region 1a provided on the base portion 11. It has a ceramic wiring board 1 including a body portion 12 and a protruding portion 2a which is joined to the upper surface of the frame body portion 12 via a joining member 7 and projects outward from the side surface of the ceramic wiring board 1. The upper surface of the frame-shaped member 2 is provided with a frame-shaped member 2 made of metal, and the height of the upper surface of the frame-shaped member 2 from the upper surface of the frame body portion 12 is higher than the height at the center of the side of the frame body portion 12. The image pickup apparatus substrate 10 having a lower height at the corners of the frame body 12. [Selection diagram] Fig. 3

Description

  The present invention relates to an imaging apparatus substrate and an imaging apparatus on which an imaging element such as a CCD (Charged-Coupled Device) and a CMOS (Complementary Metal-Oxide Semiconductor) is mounted.

  As an image pickup apparatus used for a digital camera or the like, an image pickup apparatus in which an image pickup element such as a CCD or a CMOS is mounted on an image pickup apparatus substrate is used. As a substrate for an imaging device, there is a substrate in which a metal frame used for positioning or the like is bonded to a ceramic wiring substrate having a recess on which an imaging element is mounted. An image pickup device is mounted on an image pickup device substrate, and a light-transmitting lid is bonded to the upper surface of the frame to seal the image pickup device in an airtight manner.

JP 2010-41218 A

  In recent years, there has been a growing demand for higher image quality for mirrorless single-lens digital cameras and compact digital cameras that are more compact and easier to handle than single-lens reflex cameras, and large-sized image sensors have come to be used. An imaging device is required to be small while mounting a large imaging device. And even if the mounting area of an image pick-up element enlarges, the board | substrate for image pick-up elements must make it as small as possible other than that. For this reason, the width of the bonding region between the lid and the imaging device substrate (the width of the bonding material) is reduced, and the bonding strength of the lid may be reduced. When the bonding reliability of the lid is lowered, the reliability of the imaging element may be a problem in the imaging device.

  An imaging device substrate according to an aspect of the present disclosure includes a mounting region for an imaging element on an upper surface, a rectangular base portion in plan view, and a plan view provided on the base portion and surrounding the mounting region. A ceramic wiring board including a rectangular frame body part, and a projection part that is joined to the upper surface of the frame body part via a joining member and projects outward from the side surface of the ceramic wiring board; A frame-shaped member made of metal, and the upper surface of the frame-shaped member has a height from the upper surface of the frame body portion that is higher than a height at a central portion of the side of the frame body portion. The height at the part is lower.

  An imaging device according to an aspect of the present disclosure is bonded to the imaging device substrate, the imaging element mounted on the mounting region of the imaging device substrate, and the upper surface of the frame member with a bonding material, A rectangular lid in plan view that closes the opening of the frame-shaped member.

  According to the imaging device substrate of the present disclosure, the height of the upper surface of the frame-shaped member from the upper surface of the frame body portion is higher than the height at the center of the side of the frame body portion at the corner of the frame body portion. Therefore, when the lid is joined to the upper surface of the frame-like member via the joining material, the thickness of the joining material located at the corner of the lid becomes thicker than the other parts, and the lid is joined. Strength will be high.

  According to the imaging apparatus of the present disclosure, since the imaging apparatus substrate is used, the lid has high bonding strength and high reliability.

(A) is a perspective view which shows an example of an imaging device, (b) is a perspective view which shows an example of the board | substrate for imaging devices. (A) is a top view of the imaging device shown in FIG. 1, (b) is a top view of the board | substrate for imaging devices. 2A is a cross-sectional view taken along line AA in FIG. 2A, FIG. 2B is a cross-sectional view taken along line BB in FIG. 2A, and FIG. It is sectional drawing in CC line. (A) is sectional drawing which expands and shows the A section in FIG.3 (c), (b) is sectional drawing which expands and shows the B section in FIG.3 (c). (A)-(c) is sectional drawing which shows the other example of an imaging device. (A) is sectional drawing which expands and shows a part of FIG.3 (c) in the thickness direction, (b) is sectional drawing which expands and shows the B section of (a).

  Hereinafter, an imaging apparatus according to the present disclosure will be described with reference to the drawings. In addition, the distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the imaging device substrate or the like is actually used. FIG. 1A is a perspective view illustrating an example of the imaging apparatus 100, and FIG. 1B is a perspective view illustrating an example of the imaging apparatus substrate 10. FIG. 2A is a plan view of the imaging apparatus 100 shown in FIG. 1, and FIG. 2B is a plan view of the imaging apparatus substrate 10. 3A is a cross-sectional view taken along line AA in FIG. 2A, FIG. 3B is a cross-sectional view taken along line BB in FIG. 2A, and FIG. It is sectional drawing in the CC line of Fig.2 (a). 4A is an enlarged cross-sectional view showing an A portion in FIG. 3C, and FIG. 4B is an enlarged cross-sectional view showing a B portion in FIG. 3C.

  The imaging apparatus 100 includes the imaging apparatus substrate 10, the imaging element 5, and the lid 3 as in the example illustrated in FIGS. 1 to 3.

  The imaging device substrate 10 has a mounting area 1a for the imaging element 5 on the upper surface, a rectangular base portion 11 in plan view, and a rectangular shape in plan view that is provided on the base portion 11 and surrounds the mounting area 1a. A ceramic wiring substrate 1 including a frame body portion 12 and a frame-shaped member 2 made of a plate-like metal having an opening portion bonded to the upper surface of the frame body portion 12 by a bonding member 7 are provided. The frame-like member 2 has a protruding portion 2 a that protrudes outward from the side surface of the ceramic wiring substrate 1. The mounting region 1 a is located on the bottom surface of the recess formed by the upper surface of the base body portion 11 and the frame body portion 12 of the ceramic wiring substrate 1.

  The imaging element 5 is mounted on the mounting area 1 a of the imaging device substrate 10, and the lid 3 is joined to the upper surface of the frame-shaped member 2, so that the concave portion of the ceramic wiring substrate 1 and the opening of the frame-shaped member 2 are formed. The image sensor 5 is sealed. The lid 3 is bonded to the upper surface of the frame-shaped member 2 with a bonding material 4. More specifically, the outer edge portion of the lower surface of the lid 3 and the lower surface side of the side surface and the region along the opening of the upper surface of the frame-shaped member 2 are bonded by the bonding material 4.

  3 and FIG. 4, the upper surface of the frame-like member 2 of the imaging device substrate 10 has a height from the upper surface of the frame body portion 12 at the center of the side of the frame body portion 12. The height Hc at the corners of the frame body 12 is lower than the height Hs.

The height of the upper surface of the frame-shaped member 2 from the upper surface of the frame body portion 12 is lower than the height Hc at the corners of the frame body portion 12 than the height Hs at the center of the side of the frame body portion 12. Therefore, when the lid 3 is joined to the upper surface of the frame-like member 2 via the joining material 4, the thickness Tcs of the joining material 4 positioned at the corner of the lid 3 is at the center of the side of the lid 3. It becomes thicker than the thickness Tss of the bonding material 4 positioned. Since the stress applied to the bonding material 4 is most likely to increase at the corner portion far from the center of the lid 3, the stress is relieved by increasing the thickness of the bonding material 4, so that the bonding strength at the corner portion is increased. The bonding strength and bonding reliability of the lid 3 are high. When the shape of the frame body 12 in plan view is a rectangle, the height Hc of the upper surface of the frame-shaped member 2 at the corner of the frame body 12 is at least the long side of the sides of the frame body 12. As long as it is lower than the height of the upper surface of the frame-shaped member 2 at the center, the height of the upper surface of the frame-shaped member 2 at the center of the short side of the frame 12 may be the same.

  5A to 5C are cross-sectional views illustrating other examples of the imaging apparatus. FIG. 6 is also a cross-sectional view of the imaging apparatus, and in order to make the shape of the frame-like member 2 in FIG. 3 (c) easy to understand, the lid 1 is similar to FIGS. 5 (a) to 5 (c). It is the figure which exaggerated and showed the part between a ceramic wiring board 1 in the thickness direction. Moreover, in the imaging device 100 shown in FIG. 6, the arrangement of the joining member 7 is also changed with respect to the example shown in FIG. In any example, the upper surface of the frame-shaped member 2 is such that the height from the upper surface of the frame body portion 12 is higher than the height Hs at the center of the side of the frame body portion 12. Is lower.

  In the example shown in FIG. 5A, the upper surface of the frame-shaped member 2 has a step whose height is lowered above the corner portion of the frame-shaped body 12. In other words, the frame-shaped member 2 has a thickness of a portion outside the corner portion of the frame-shaped body 12 (corner portion of the frame-shaped member 2) thinner than the other portion (center portion). The height Hc at the corner is lower than the height Hs at the side.

  The example shown in FIG. 5B is inclined with respect to FIG. 5A between the thick central portion and the thin corner portion, and the upper surface of the frame-shaped member 2 is the center of the side. The height gradually decreases from the corner to the corner. With such a configuration, since the thickness of the bonding material 4 gradually increases from the central portion of the side to the corner portion, stress is easily dispersed even in the vicinity of the corner portion, so that the bonding strength and bonding reliability are further increased. The imaging device 100 having a high value. If the corners adjacent to the inclined surface are rounded, the stress is less likely to be concentrated in the bonding material 4, so that the reliability is higher.

  In the example shown in FIG. 5C, the upper surface of the frame-shaped member 2 has a curved surface with a convex central portion of the side, and the change in the thickness of the frame-shaped member 2 is more gentle. Therefore, there is no portion where stress is more dispersed and concentrated, so that the imaging device 100 with higher joint strength and joint reliability is obtained.

  As shown in FIGS. 5A and 5B, when the central portion of the side is flat, the lid 3 is bonded to the frame body 2 along the flat central portion, thereby imaging. Since it becomes easy to arrange the lid 3 on the upper surface of the element 5 in parallel, the imaging apparatus 100 can be easily assembled.

  In the example shown in FIG. 5C, only the upper surface of the frame-shaped member 2 is a convex curved surface, whereas in the example shown in FIG. 6, the frame-shaped member 2 is warped upward. The upper surface is a convex curved surface. In this case, since the frame-shaped member 2 manufactured by press work is excellent in mass productivity, it can be made a structure in which stress is not concentrated while manufacturing cost is suppressed. Note that the protrusion 2a protruding from the side surface of the ceramic wiring board 1 of the frame-like member 2 is less warped than the portion overlapping the ceramic wiring board 1, or substantially parallel to the mounting region 1a as in the example shown in FIG. If it is flat, the positional accuracy of the frame-shaped member 2 is increased.

As in the example shown in FIGS. 3 and 6, when the frame-shaped member 2 has a shape along the convex upward, the space between the frame-shaped member 2 and the frame body portion 12 of the ceramic wiring board 1. The thickness of the bonding member 7 located in the position is opposite to the thickness distribution of the bonding material 4. That is, in the joining member 7, the thickness Tcb on the corner portion of the frame body portion 12 is thinner than the thickness Tsb on the center portion of the side of the frame body portion 12. This means that the thickness Tcb of the bonding member 7 located on the corner portion of the ceramic wiring board 1 where the thermal stress generated between the frame-like member 2 and the ceramic wiring board 1 increases is thin.

  On the other hand, in the example shown in FIG. 6, in addition to the lower surface of the frame-shaped member 2 and the upper surface of the ceramic wiring substrate 1 being bonded by the bonding material 7, the lower surface of the protruding portion 2 a of the frame-shaped member 2 The side surface of the ceramic wiring substrate 1 is joined by a joining member 7. By setting it as such a structure, the joining strength of the frame-shaped member 2 and the ceramic wiring board 1 becomes higher. Thereby, for example, the possibility that a crack or the like occurs in the bonding member 7 due to thermal stress repeatedly applied while the imaging device 100 is used is reduced, and the imaging device 100 with high reliability is obtained.

  The imaging apparatus 100 is joined to the imaging apparatus substrate 10, the imaging element 5 mounted on the mounting area 1 a of the imaging apparatus substrate 10, and the upper surface of the frame-shaped member 2 with the bonding material 4. And a rectangular lid body 3 in a plan view that closes the two openings. In the imaging device 100, the bonding material 4 is such that the thickness Tcs at the corner of the lid 3 is thicker than the thickness Tss at the center of the side of the lid 3. Therefore, the bonding strength of the lid 3 is high and the reliability is high.

  The ceramic wiring board 1 includes a base body portion 11 and a frame body portion 12 and a wiring conductor 13 made of a ceramic material. The base part 11 and the frame part 12 are integrally formed by firing. The base portion 11 is a flat plate portion having a rectangular shape in plan view. In addition, the base portion 11 has a mounting area 1 a for the imaging element 5 on the upper surface, and the mounting area 1 a is located, for example, in a central area on the upper surface of the base portion 11. The frame body portion 12 has, for example, a shape and dimensions corresponding to the planar shape of the base body portion 11, and has an opening corresponding to the mounting region 1 a of the base body portion 11. The base part 11 and the frame part 12 are formed by laminating insulating layers made of a ceramic material, for example. In the example shown in FIG. 3, the base portion 1 is composed of two insulating layers, and the frame portion 12 is composed of three insulating layers. However, the number of insulating layers is not limited to this. .

The base part 11 and the frame part 12 are made of a ceramic material, and examples thereof include an aluminum oxide (alumina: Al ₂ O ₃ ) sintered body or an aluminum nitride (AlN) sintered body. When the base body portion 11 and the frame body portion 12 of the ceramic wiring board 1 are made of an aluminum oxide sintered body, the ceramic wiring board 1 is less likely to warp due to its high mechanical strength, and has an appropriate thermal conductivity. Therefore, it is easy to dissipate the heat generated from the image sensor 5 to the outside. Therefore, when the ceramic wiring board 1 is made of an aluminum oxide sintered body, the ceramic wiring board 1 is preferable in terms of mechanical strength, thermal conductivity, and cost.

  The wiring conductor 13 is for electrical connection with the image sensor 5 and connection with an external circuit. For example, the wiring conductor 13 is arranged adjacent to the mounting region 1a, and is connected to the electrode 5a of the image pickup device 5 and the bonding wire 6 or the like, the external electrode provided on the lower surface of the base portion 1, and the electrical connection between them. In order to make a connection, an internal wiring provided between insulating layers, a through conductor that connects the upper and lower wirings through the insulating layer, and the like are included. In the example shown in FIG. 3, the frame body portion 12 has a stepped portion inside, and the wiring conductor 13 is provided from the upper surface of the stepped portion of the frame body portion 12 to the lower surface of the base body portion 11. It is also possible to provide the wiring conductor 13 from a region adjacent to the mounting region 1 a on the upper surface of the base portion 11 to the lower surface of the base portion 11 with the frame body portion 12 having no stepped portion.

The wiring conductor 13 is formed as a metallized layer using a metal powder such as tungsten, molybdenum, copper, or silver. In order to improve the bondability to the exposed surface of the wiring conductor 13 with the bonding wire for protection of the wiring conductor 13 and the connection with the imaging element 5 or the solder for connection with an external circuit, for example, Nickel and gold plating films can be formed.

If the base body portion 11 and the frame body portion 12 of the ceramic wiring substrate 1 are made of, for example, an aluminum oxide sintered body, they can be manufactured as follows. First, an appropriate organic solvent, solvent, etc. are added to and mixed with raw material powders such as alumina (Al ₂ O ₃ ) or silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. A ceramic green sheet (hereinafter also referred to as a green sheet) that is formed into a sheet shape by using a doctor blade method or a calender roll method and becomes an insulating layer can be obtained.

  A conductor paste for the wiring conductor 13 is printed on the surface of the ceramic green sheet to form a wiring conductor pattern. When the through conductor is provided, a through hole is formed in the green sheet prior to the printing of the conductor paste, and the through hole is filled with the conductor paste. The conductor paste can be prepared by kneading the metal powder as described above and an organic component such as an organic solvent or a binder.

  Thereafter, a plurality of green sheets on which wiring conductor patterns are formed are laminated to produce a laminate, and the laminate is fired at a temperature of, for example, about 1600 (° C.), whereby the ceramic wiring substrate 1 is produced. .

  The frame-shaped member 2 is bonded to the upper surface of the frame body portion 12 of the ceramic wiring substrate 1 via the bonding member 7. For example, it is made of a metal material such as iron-nickel alloy or stainless steel, and has a plate shape having an opening having the same size as or larger than the opening of the frame body portion 12. The frame-shaped member 2 is disposed so that the opening of the frame body 12 is positioned in the opening of the frame-shaped member 2 in plan view. Further, the frame-like member 2 has a portion protruding from the ceramic wiring substrate 1 in a plan view, and a protruding portion 2 a that protrudes outward from the side surface of the ceramic wiring substrate 1.

  Moreover, the frame-like member 2 has a plurality of alignment holes 2b for alignment with optical members such as a housing as in the examples shown in FIGS. It has a function as a member. This alignment hole 2b is provided in the protrusion 2a. Note that the number, shape, position, and the like of the alignment holes 2b are appropriately set in consideration of the configuration of an optical member such as a housing.

  Further, when the position of the image sensor 5 is determined with reference to the alignment hole 2b and joined to the mounting area 1a, the optical element such as a housing provided above the image sensor 5 and the image pickup apparatus 10 is positioned via the alignment hole 2b. Since it can arrange | position with high precision, since the precision of the optical system of a camera apparatus can be raised now, it becomes possible to reduce the adjustment after an assembly.

  Moreover, you may provide a notch in the outer peripheral part of the frame-shaped member 2 instead of the hole which penetrates the frame-shaped member 2 like the alignment hole 2b as shown in the figure. In the example shown in FIGS. 1 to 3, the outer shape of the frame-shaped member 2 is a rectangular shape, but the shape is not limited to this. You may have the small protrusion part 2a. Moreover, although the frame-shaped member 2 in the example shown in FIGS. 1-3 has the protrusion part 2a which protrudes outside from each side surface of a pair of short side of the ceramic wiring board 1 of planar view rectangular shape. In addition, it may have a protruding portion 2a protruding from the long side. As described above, the shape of the frame-like member 2 is appropriately set in consideration of the configuration of an optical member or the like such as a housing to which the wiring board 1 and the imaging device 100 are attached.

The frame-shaped member 2 is performed, for example, by forming a basic frame-shaped metal plate by press punching a metal plate. At this time, the protruding portion 2a and the alignment hole 2b can be formed simultaneously. The upper surface of the frame-shaped member 2 is a plate whose height from the upper surface of the frame body portion 12 is lower than the height Hs at the center of the side of the frame body portion 12 at the corner H of the frame body portion 12. For example, the following is performed. When the upper surface of the frame-like member 2 has a step as in the example shown in FIGS. 5A and 5B, for example, the upper surface may be ground, or the corners may be formed by pressing. The part may be crushed. When the central part of the side on the upper surface of the frame-shaped member 2 is a convex curved surface as in the example shown in FIG. 5 (c), the upper surface may be ground, or the entire upper surface may be formed by pressing. May be a convex curved surface. When the frame-like member 2 is warped upward as in the example shown in FIG. 6, the upper surface may be ground into a convex surface, and the lower surface may be ground into a concave surface, or the whole may be curved by pressing. . Or it is good also as a tension-molding press process by which a spring back is hold | suppressed when pressing a metal plate, and it is good also as a shape where a side center part warps convexly compared with a corner | angular part.

  Further, the frame-like member 2 is obtained by using a black dyeing or matte nickel plating to color the surface to a black color or a dark color having a low light reflectance, thereby obtaining a corrosion prevention effect. Moreover, optical influences such as unnecessary light can be suppressed. That is, the frame-shaped member 2 can absorb unnecessary light incident on the frame-shaped member 2 by color-processing the surface of the upper surface or the lower surface. Further, the frame-like member 2 is preferably color-processed on the upper surface on the light incident side and the lower surface on which the light reflected by the peripheral portion of the imaging element 5 is incident.

  The frame-shaped member 2 is bonded to the upper surface of the frame body portion 12, that is, the upper surface of the ceramic wiring substrate 1 by the bonding member 7. For the joining member 7, for example, a brazing material such as a resin adhesive or silver-copper brazing can be used. When the brazing material is an active brazing material containing an active metal, it can be joined directly to the frame body portion 12, and when the brazing material does not contain an active metal, a metallized layer is formed on the frame body portion 12. It can join by providing. When the joining member 7 is a resin adhesive, the resin adhesive is mainly composed of, for example, an epoxy resin having a dense three-dimensional network structure, similar to the joining material 4 described later, from the viewpoint of moisture resistance or joining strength. It is possible to use a material that contains a curing agent and a filler as appropriate. A liquid resin adhesive is disposed on the portion sandwiched between the lower surface of the frame-shaped member 2 and the upper surface of the ceramic wiring substrate 1 by coating or the like, and is heated at about 150 ° C. to cure the resin adhesive. The frame-shaped member 2 can be bonded to the upper surface of the ceramic wiring substrate 1 by a certain bonding member 7. Further, when the joining member 7 is an active brazing material, an active brazing material paste is obtained by adding about several percent of an active metal powder such as Ti to a powder that becomes a silver-copper brazing material, and kneading by adding a plasticizer or a solvent. Is placed in a region sandwiched between the lower surface of the frame-like member 2 and the upper surface of the ceramic wiring substrate 1 by a method such as application by printing, and is cured by heating to a temperature at which the brazing filler metal melts in a vacuum. By doing so, the frame-like member 2 can be joined to the upper surface of the ceramic wiring substrate 1 by the joining member 7 which is an active brazing material. At this time, by adjusting the application conditions such as the application position and application amount of the adhesive or the active brazing paste, or by adjusting the heating conditions such as the heating time and the weight applied at the time of heating, as in the example shown in FIG. In addition, the lower surface of the protruding portion 2a and the side surface of the wiring substrate 1 can be joined with an adhesive or an active brazing material.

  The lid 3 is joined to the frame-like member 2 via a joining material 4 so as to close the opening of the frame-like member 2, whereby the image sensor 5 is hermetically sealed. The outer edge portion of the lower surface of the lid 3 that overlaps the portion outside the opening of the frame-like member 2 is joined. The lid 3 is a material that transmits visible light, for example, a transparent glass material such as soda glass or borosilicate glass, and a glass material with high light transmittance is preferable. A quartz plate can be used as the lid 3. Since the quartz plate emits almost no radiation of α rays or β rays, and the S / N of the imaging element 5 is hardly lowered, the imaging device 10 using the quartz plate as the lid 3 obtains a high-quality image. be able to.

Note that the frame-like member 2 is attached to the lid 3 bonded to the upper surface thereof in order to reduce stress applied to the lid 3 and suppress deformation so that stress relaxation by the bonding material 4 is effectively performed. A material having a close thermal expansion coefficient can be used. For example, when the lid 3 is soda glass, the material of the frame-shaped member 2 having a thermal expansion coefficient close to that of soda glass (linear thermal expansion coefficient is about 9.0 × 10 ⁻⁶ / ° C.). SUS430 (thermal expansion coefficient is about 10.4 × 10 ⁻⁶ / ° C.) or 50 alloy (thermal expansion coefficient is about 9.8 × 10 ⁻⁶ / ° C.) can be used. When the lid 3 is D263 glass (borosilicate glass, manufactured by SCHOTT), the thermal expansion coefficient close to that of D263 glass (linear thermal expansion coefficient is about 7.2 × 10 ⁻⁶ / ° C.). As a material of the frame-like member 2 having 45, 45 alloy (thermal expansion coefficient: about 7.1 × 10 ⁻⁶ / ° C.) or 42 alloy (thermal expansion coefficient: about 4.6 × 10 ⁻⁶ / ° C.) can be used. . Further, when the lid 3 is a quartz plate, as a material of the frame-like member 2 having a thermal expansion coefficient close to that of the quartz plate (linear thermal expansion coefficient is approximately 11 × 10 ⁻⁶ / ° C.), SUS430 (thermal expansion coefficient of about 10.4 × 10 ⁻⁶ / ° C.) or 50 alloy (thermal expansion coefficient of about 9.8 × 10 ⁻⁶ / ° C.) can be used. In addition, 50 alloy, 45 alloy, or 42 alloy is an alloy which mix | blended nickel with iron.

  Further, the frame-like member 2 and the lid 3 are joined to each other by a joining material 4 that also functions as a sealing material. The bonding material 4 is made of, for example, a resin adhesive. The resin adhesive can be mainly composed of an epoxy resin having a dense three-dimensional network structure from the viewpoint of moisture resistance or bonding strength. Resin adhesives include, for example, bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, special novolac type epoxy resin, phenol derivative epoxy resin, biphenol skeleton Epoxy resins such as type epoxy resins, which are added with curing agents such as imidazole, amine, phosphorus, hydrazine, imidazole adduct, amine adduct, cationic polymerization, or dicyandiamide. It consists of Note that the bonding material 4 may be a mixture of two or more epoxy resins.

  Moreover, in order to relieve the stress due to the difference in thermal expansion coefficient between the lid 3 and the frame-like member 2, the bonding material 4 can be made of a material having a low elastic modulus. As the bonding material 4, for example, a material having an elastic modulus of 5 GPa or less by adding about 50 (%) or less of externally added acrylic rubber particles or the like as a filler to 100% by mass of the resin adhesive is used. it can.

  A method of joining the frame-like member 2 and the lid 3 using the joining material 4 made of the above-described resin adhesive is, for example, as follows. First, using a conventionally known method such as screen printing, a resin adhesive is formed around the opening of the frame-shaped member 2 or the entire periphery of the outer peripheral edge of the lid 3, and the frame-shaped member 2 and the lid 3 is joined. The frame-shaped member 2 and the lid 3 are bonded via the bonding material 4 by curing the resin adhesive using heat or ultraviolet rays.

  The imaging element 5 is, for example, a CMOS or a CCD, and is mounted on the mounting region 1a of the ceramic wiring substrate 1 and electrically connected to the wiring conductor 13 of the imaging device substrate 10 as in the example shown in FIGS. Connected. The image sensor 5 is fixed to the mounting region 1a via an adhesive or the like, and is electrically connected to the wiring conductor 13 provided on the base portion 11 with a bonding wire. Note that the image sensor 5 may be mounted on the base body 11 by a flip chip method.

  The present invention is not limited to the embodiments described above, and various modifications and improvements can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Ceramic wiring board 1a ... Mounting area | region 11 ... Base | substrate part 12 ... Frame body part 13 ... Wiring conductor 2 ... Frame-shaped member 2a ... Protrusion part 2b ... Position Matching hole 3 ... Lid 4 ... Bonding material 5 ... Imaging element 5a ... Electrode 6 ... Bonding wire 7 ... Joining member 10 ... Substrate for imaging device 100 ... Imaging apparatus

Claims (7)

A ceramic wiring board having a mounting area for the imaging element on the upper surface and having a rectangular base in plan view, and a rectangular frame body in plan view provided on the base and surrounding the mounting area;
A frame-shaped member made of metal, which is bonded to the upper surface of the frame body portion via a bonding member, and has a protruding portion protruding outward from the side surface of the ceramic wiring board;
With
For the imaging device, the upper surface of the frame-shaped member is lower in height from the upper surface of the frame body portion than in a central portion of the side of the frame body portion at a corner portion of the frame body portion. substrate.   The imaging device substrate according to claim 1, wherein the height of the upper surface of the frame-like member gradually decreases from a central portion of the side to the corner portion.   The imaging device substrate according to claim 2, wherein the upper surface of the frame-shaped member is a curved surface having a convex central portion of a side.   The imaging device substrate according to claim 3, wherein the frame-shaped member is warped upward.   The imaging device substrate according to claim 1, wherein a lower surface of the projecting portion of the frame-shaped member and a side surface of the ceramic wiring substrate are joined by the joining member.   The imaging device substrate according to any one of claims 1 to 5, an imaging device mounted on the mounting region of the imaging device substrate, and the upper surface of the frame-shaped member are bonded with a bonding material, An image pickup apparatus comprising: a lid having a rectangular shape in a plan view that closes an opening of the frame-shaped member.   The imaging apparatus according to claim 6, wherein the bonding material has a thickness at a corner portion of the lid body larger than a thickness at a central portion of the side of the lid body.

Images