JP2018164129A - Quartz crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a quartz crystal device which can suppress the fluctuation of an oscillating frequency of a tuning-fork type crystal element.SOLUTION: A quartz crystal device comprises: a substrate 110a; a first frame; a second frame 110c; electrode pads 111 provided on the substrate 110a; a tuning-fork type crystal element 120 having a quartz crystal base part 121, a quartz crystal vibration part 123, weight parts 128 provided on a leading end of the quartz crystal vibration part 123, excitation electrodes 125 and 126 provided on the quartz crystal vibration part 123, and extraction electrodes 127 electrically connected to the excitation electrodes 125 and 126; a first concave portion K1 formed by the substrate 110a and the first frame 110b, and provided between the electrode pads 111; a second concave portion K2 formed by the substrate 110a and the first frame 110b, and provided at such a position that it is opposed to the quartz crystal vibration part 123; and a third concave portion K3 formed by the substrate 110a and the first frame 110b, and provided at such a position that it is opposed to the weight parts 128.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a crystal device used in electronic equipment and the like.

  The crystal device generates a specific frequency by using the piezoelectric effect of the tuning fork type crystal element. For example, there is provided a crystal device including a substrate, a package having a frame on the upper surface of the substrate to provide a recess, and a tuning fork type crystal element mounted on an electrode pad provided on the upper surface of the substrate. Known (for example, see Patent Document 1 below)

JP2012-119920A

  The above-described quartz device is remarkably miniaturized, but the mounted tuning fork type quartz element is also miniaturized. When the vibrating arm of such a tuning fork type crystal element comes into contact with the substrate, the bending vibration is hindered and the oscillation frequency may be changed.

  This invention is made | formed in view of the said subject, and makes it a subject to provide the quartz crystal device which can suppress the fluctuation | variation of the oscillation frequency of a tuning fork type crystal element.

  A quartz crystal device according to one aspect of the present invention includes a substrate, a first frame provided along the outer periphery of the substrate, a second frame provided along the outer periphery of the first frame, and the substrate. A pair of electrode pads provided along the upper short side direction, a rectangular crystal base, a crystal vibration part that is a part of the crystal base extending from the side surface of the crystal base, and a tip of the crystal vibration part A tuning-fork type quartz element having a weight portion provided, excitation electrodes provided on the upper and lower surfaces of the crystal vibrating portion, and a lead electrode provided from the crystal vibrating portion to the crystal base and electrically connected to the excitation electrode And a first recess provided between the electrode pads and a second recess formed between the substrate and the first frame and provided at a position facing the crystal vibrating part. And a third recess provided at a position facing the weight portion. It has a, and.

  A quartz crystal device according to one aspect of the present invention includes a substrate, a first frame provided along the outer periphery of the substrate, a second frame provided along the outer periphery of the first frame, and the substrate. A pair of electrode pads provided along the upper short side direction, a rectangular crystal base, a crystal vibration part that is a part of the crystal base extending from the side surface of the crystal base, and a tip of the crystal vibration part A tuning-fork type quartz element having a weight portion provided, excitation electrodes provided on the upper and lower surfaces of the crystal vibrating portion, and a lead electrode provided from the crystal vibrating portion to the crystal base and electrically connected to the excitation electrode And a first recess provided between the electrode pads and a second recess formed between the substrate and the first frame and provided at a position facing the crystal vibrating part. And a third recess provided at a position facing the weight portion. It has a, and. Thus, when the tuning fork type crystal element 120 is mounted on the electrode pad 111, even if the tuning fork type crystal element 120 is inclined, the vibrating arm part 122 and the weight part 128 are in contact with the upper surface of the substrate 110a. Therefore, the fluctuation and stop of the oscillation frequency of the tuning fork type crystal element 120 can be suppressed.

1 is an exploded perspective view showing a crystal device according to a first embodiment. (A) It is AA sectional drawing of FIG. 1, (b) It is BB sectional drawing of FIG. (A) It is the plane perspective view seen from the upper surface of the package which comprises the crystal device which concerns on 1st embodiment, (b) The external terminal formation surface seen from the upper surface of the board | substrate of the package which comprises the crystal device which concerns on 1st embodiment FIG. It is a top view of the tuning fork type crystal element which constitutes the crystal device concerning a first embodiment. It is a disassembled perspective view of the crystal device which concerns on 2nd embodiment. It is CC sectional drawing of FIG. (A) The plane perspective view seen from the upper surface of the package which comprises the crystal device which concerns on 2nd embodiment, (b) The plane perspective view seen from the 1st frame body side of the package which comprises the crystal device which concerns on 2nd embodiment. It is. (A) Plane perspective view seen from the substrate side of the package constituting the crystal device according to the second embodiment, (b) Connection terminal formation seen from the upper surface of the substrate of the package constituting the crystal device according to the second embodiment It is a plane perspective view of the surface side. (A) It is a top view seen from the upper surface of the mounting base | substrate which comprises the crystal device which concerns on 2nd embodiment, (b) is an external terminal formation surface seen from the upper surface of the mounting base | substrate which comprises the crystal device which concerns on this embodiment. FIG.

(First embodiment)
The crystal device in the first embodiment includes a package 110 and a tuning fork type crystal element 120 mounted on the upper surface of the package 110 as shown in FIGS. The package 110 includes a substrate 110a, a first frame body 110b, and a second frame body 110c. A first recess K1, a second recess K2, and a third recess K3 are formed by the substrate 110a and the first frame 110b, and a fourth recess K4 is formed by the first frame 110b and the second frame 110c. Yes. Further, the tuning fork type crystal element 120 is provided with a crystal base part 121 and a crystal vibration part 123. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  As shown in FIGS. 1 and 4, the tuning fork type crystal element 120 includes a crystal base 121 and a crystal vibrating part 123. The surface of the tuning fork type crystal element 120 includes excitation electrodes 125 a, 125 b, 126 a and 126 b, extraction electrodes 127 a and 127 b, a weight portion 128 and a frequency adjustment electrode 129.

  The crystal base 121 supports a crystal vibrating part 123 described later, and holds and fixes the tuning fork type crystal element 120 on the package 110. When the crystal base 121 is an orthogonal coordinate system in which the electrical axis is the X axis, the mechanical axis is the Y axis, and the optical axis is the Z axis, the crystal axis 121 is within a range of −5 ° to + 5 ° around the X axis. The plate is a substantially rectangular flat plate in a plan view in which the direction of the Z ′ axis rotated in the above direction is the thickness direction.

  The crystal vibrating portion 123 is, for example, for exciting vibrations at a desired frequency by forming excitation electrodes 125 and 126 having a desired pattern on the surface and applying a potential to the excitation electrodes 125 and 126. is there. The crystal vibrating part 123 is composed of a vibrating arm part 122 and a weight part 128. A hammer head-shaped weight portion 128 is provided at the distal end portion of the vibrating arm portion 122, that is, at the end portion of the vibrating arm portion 122 opposite to the crystal base portion 121. In addition, the quartz crystal vibrating unit 123 includes a first quartz crystal vibrating unit 123a and a second quartz crystal vibrating unit 123b. The first crystal vibrating part 123a and the second crystal vibrating part 123b are extended from one side of the crystal base 121 in parallel to the Y′-axis direction. The vibrating arm portion 122 includes a first vibrating arm portion 122a and a second vibrating arm portion 122b. Such a tuning fork type crystal element 120 forms a tuning fork shape integrally with the crystal base part 121 and each crystal vibration part 123, and is manufactured by a photolithography technique and a chemical etching technique.

  As shown in FIG. 4, the excitation electrode 125a is provided on the front and back main surfaces of the first vibrating arm portion 122a of the first crystal vibrating portion 123a. In addition, the excitation electrode 126b is provided on both opposing side surfaces of the first vibrating arm portion 122a of the first crystal vibrating portion 123a. One lead electrode 127a is provided on the crystal base 121 in plan view. The other lead electrode 127 b is electrically connected to the excitation electrodes 125 a and 126 a and is provided on the front and back main surfaces near the boundary of the crystal base 121.

  In addition, as shown in FIG. 4, the excitation electrode 125b is provided on the front and back main surfaces of the second vibrating arm portion 122b of the second crystal vibrating portion 123b. In addition, the excitation electrode 126a is provided on both opposite side surfaces of the second vibrating arm portion 122b of the second crystal vibrating portion 123b. The other lead electrode 127 b is electrically connected to the excitation electrodes 125 b and 126 b and is provided on the front and back main surfaces of the crystal base 121. The other lead electrode 127 b is provided on the crystal base 121.

  The weight portion 128 is provided in the form of a hammerhead at the end of the crystal vibrating portion 123 on the opposite side to the crystal base portion 121. The weight portion 128 is for adjusting the frequency of the bending vibration generated in the crystal vibration portion 123. Specifically, by providing the weight portion 128, it is possible to approach the state in which the weight is provided on the distal end side of the crystal vibrating portion 123. Therefore, the frequency of the flexural vibration generated in the crystal vibrating portion 123 does not have the weight portion 128. The frequency of the bending vibration generated in the crystal vibration unit 123 is adjusted to a desired frequency. The weight portion 128 includes a first weight portion 128a provided at the distal end portion of the first crystal vibrating portion 123a and a second weight portion 128b provided at the distal end portion of the second crystal vibrating portion 123b. Has been.

  The frequency adjustment electrode 129 is for adjusting the frequency of the bending vibration generated in the crystal vibration unit 123 to be a desired frequency by cutting with a laser or the like. The frequency adjustment electrode 129 includes a first frequency adjustment electrode 129a and a second frequency adjustment electrode 129b. The first frequency adjustment electrode 129a is provided at the front main surface and the front end of the side surface of the first weight portion 128a, and the second frequency adjustment electrode 129b is provided at the front main surface and the front end portions of both side surfaces of the second weight portion 128b. Is provided.

  The tuning fork type crystal element 120 can adjust the frequency value to a desired value by increasing or decreasing the amount of metal constituting the frequency adjustment electrode 129. As shown in FIG. 3, the excitation electrodes 125b and 126b and the first frequency adjustment electrode 129a are electrically connected by an extraction electrode 127b provided on the surface of the crystal piece. The excitation electrodes 125 a and 126 a and the second frequency adjustment electrode 129 b are electrically connected by a lead electrode 127 a provided on the surface of the crystal base 121.

  When the tuning fork type crystal element 120 is vibrated, an alternating voltage is applied to the extraction electrodes 127a and 127b. When an electrical state after application is instantaneously captured, the excitation electrode 126b of the second crystal vibrating part 123b has a + (plus) potential, the excitation electrode 126a has a-(minus) potential, and an electric field is generated from + to-. . On the other hand, the excitation electrode 126 of the first crystal oscillating portion 123a at this time has a polarity opposite to the polarity generated in the excitation electrode 126 of the second crystal oscillating portion 123b. These applied electric fields cause an expansion / contraction phenomenon in the first crystal oscillating portion 123a and the second crystal oscillating portion 123b, and a bending vibration having a resonance frequency set in each crystal oscillating portion 123 is obtained.

  The crystal base 121 and the case where the long side dimension when viewed in plan is 0.8 to 1.2 mm and the short side dimension when viewed in plan is 0.2 to 0.7 mm are taken as an example. The crystal vibration unit 123 will be described. The long side dimension when the crystal base 121 is viewed in plan is 0.1 to 0.3 mm, and the short side dimension when viewed in plan is 0.1 to 0.3 mm. The long side dimension when the crystal vibrating part 123 is viewed in plan is 0.6 to 0.9 mm, and the short side dimension when viewed in plan is 0.04 to 0.2 mm.

  Here, the operation of the tuning fork type crystal element 120 will be described. In the tuning-fork type crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 127 to the crystal vibration unit 123 via the excitation electrodes 125 and 126, the crystal vibration unit 123 excites in a predetermined vibration mode and frequency. It is like that.

  Here, a manufacturing method of the tuning fork type crystal element 120 will be described. First, the tuning fork type crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle, and the crystal base 121, the crystal vibrating part 123, and the crystal support part 124 are formed on both main surfaces of the crystal piece by photolithography. Thereafter, the excitation electrodes 125 and 126 and the extraction electrode 127 are formed by depositing a metal film by a photolithography technique, a vapor deposition technique, or a sputtering technique.

  The substrate 110a has a rectangular shape, and functions as a mounting member for mounting the tuning fork type crystal element 120 on the upper surface. An electrode pad 111 for mounting the tuning fork type crystal element 120 is provided on the upper surface of the substrate 110a. A first electrode pad 111a and a second electrode pad 111b for joining the tuning fork type crystal element 120 are provided along one side of the long side of the substrate 110a.

  The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern 113 and a via conductor 114 for electrically connecting the electrode pad 111 provided on the upper surface and the external terminal 112 provided on the lower surface of the substrate 110a are provided on and inside the substrate 110a. Yes.

  The first frame 110b is disposed along the outer peripheral edge of the upper surface of the substrate 110a, and is for forming the first recess K1, the second recess K2, and the third recess K3 on the upper surface of the substrate 110a. The second frame 110c is disposed along the outer peripheral edge of the upper surface of the first frame 110b, and is for forming the fourth recess K4 on the upper surface of the first frame 110b. The opening of the fourth recess K4 has a rectangular shape when viewed in plan. The first frame 110b and the second frame 110c are made of a ceramic material such as alumina ceramics or glass-ceramics, and are formed integrally with the substrate 110a.

  The first recess K1 is provided between the pair of electrode pads 111, and when the tuning fork type crystal element 120 described later is mounted, the first adhesive K1 is in contact with the conductive adhesive 140 provided on the adjacent pair of electrode pads 111. It is for suppressing. The first recess K1 is formed by the upper surface of the substrate 110a and the first frame 110b. By doing so, even if the conductive adhesive 140 provided on the pair of adjacent electrode pads 111 overflows from the electrode pad 111 when the tuning fork type crystal element 120 is mounted, the first recess K1. It can further suppress that the adjacent electrode pad 111 short-circuits by entering in.

  The second recess K2 is provided at a position facing a vibrating arm portion 122 of the tuning fork type crystal element 120 described later, and is for suppressing the vibrating arm portion 122 from contacting the upper surface of the substrate 110a. The second recess K2 is formed by the upper surface of the substrate 110a and the first frame 110b, and is provided at a position facing the vibrating arm portion 122 of the tuning fork type crystal element 120. Thus, when the tuning fork type crystal element 120 is mounted on the electrode pad 111, even if the tuning fork type crystal element 120 is inclined, the vibrating arm portion 122 is prevented from coming into contact with the upper surface of the substrate 110a. Therefore, the fluctuation and stop of the oscillation frequency of the tuning fork type crystal element 120 can be suppressed.

  The third recessed portion K3 is provided at a position facing a weight portion 128 of the tuning fork type crystal element 120 described later, and is for suppressing the weight portion 128 from contacting the upper surface of the substrate 110a. The third recess K3 is formed by the upper surface of the substrate 110a and the first frame 110b, and is provided at a position facing the weight portion 128 of the tuning fork type crystal element 120. In this way, when the tuning fork type crystal element 120 is mounted on the electrode pad 111, even if the tuning fork type crystal element 120 is inclined, the weight portion 128 is prevented from coming into contact with the upper surface of the substrate 110a. Therefore, it is possible to reduce fluctuation and stop of the oscillation frequency of the tuning fork type crystal element.

  The fourth recess K4 is for mounting a tuning fork type crystal element 120 described later. The fourth recess K4 is formed by the upper surface of the first frame 110b and the second frame 110c.

  The first recess K1 is provided so that the second recess K2 and the third recess K3 are connected to the space. By doing so, even if the conductive adhesive 140 provided on the pair of adjacent electrode pads 111 overflows from the electrode pad 111 when the tuning fork type crystal element 120 is mounted, the first recess K1. By entering the inside and flowing out from the first recess K1 to the third recess K3 through the second recess K2, it is possible to further prevent the adjacent electrode pads 111 from being short-circuited.

  Further, when viewed in a plan view, the length parallel to the X axis that is the crystal axis direction of the first recess K1 is smaller than the length parallel to the X axis that is the crystal axis direction of the second recess K2. The length parallel to the X axis that is the crystal axis direction of the second recess K2 is set to be smaller than the length parallel to the X axis that is the crystal axis direction of the third recess K3. By doing in this way, since the exclusive area of the 1st frame 110b becomes small as it goes to the 3rd recessed part K3 from the 1st recessed part K1, it becomes easy to generate | occur | produce a stress in the location of the 3rd recessed part K3. Since the stress applied to the electrode pad 111 provided on the upper surface of the first frame 110b in the vicinity of the recess K1 can be reduced, it is possible to suppress the tuning-fork type crystal element 120 from being peeled off from the electrode pad 111. .

  External terminals 112 are provided at the four corners of the lower surface of the substrate 110a. In addition, two of the four external terminals 112 are electrically connected to the tuning fork type crystal element 120. The first external terminal 112a and the second external terminal 112b that are electrically connected to the tuning fork type crystal element 120 are provided so as to be located diagonally on the lower surface of the substrate 110a.

  The electrode pad 111 is for mounting the tuning fork type crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the first frame 110b, and are provided adjacent to each other along one side of the first frame 110b. The electrode pad 111 is provided on the lower surface of the substrate 110a via the wiring pattern 113 and the via conductor 114 provided on the upper surface of the first frame 110b and the substrate 110a as shown in FIGS. It is electrically connected to the external terminal 112.

  As shown in FIG. 3A, the electrode pad 111 includes a first electrode pad 111a and a second electrode pad 111b. The external terminal 112 includes a first external terminal 112a, a second external terminal 112b, a third external terminal 112c, and a fourth external terminal 112d, as shown in FIG. The via conductor 114 includes a first via conductor 114a, a second via conductor 114b, and a third via conductor 114c. The wiring pattern 113 is composed of a first wiring pattern 113a and a second wiring pattern 113b. The first electrode pad 111a is electrically connected to one end of the first wiring pattern 113a provided on the substrate 110a. The other end of the first wiring pattern 113a is electrically connected to the first external terminal 112a through the first via conductor 114a. Therefore, the first electrode pad 111a is electrically connected to the first external terminal 112a. The second electrode pad 111b is electrically connected to one end of the second wiring pattern 113b provided on the substrate 110a. The other end of the second wiring pattern 113b is electrically connected to the second external terminal 112b through the second via conductor 114b. Therefore, the second electrode pad 111b is electrically connected to the second external terminal 112b.

  In addition, the arithmetic average surface roughness of the electrode pad 111 is 0.02 to 0.10 μm, and the arithmetic average surface roughness of the surface of the substrate 110a is 0.5 to 1.5 μm. Therefore, although the conductive adhesive 140 spreads in the direction of the wiring pattern 113, the conductive adhesive 140 does not easily spread from the electrode pad 111 onto the substrate 110a.

  The external terminal 112 is used for electrical connection with a mounting board (not shown) such as an electronic device. The external terminals 112 are provided at the four corners of the lower surface of the substrate 110a. Two of the external terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110a. The third external terminal 112c is electrically connected to the sealing conductor pattern 117 via the third via conductor 114c.

  The wiring pattern 113 is for electrical connection with the electrode pad 111 and the via conductor 114. One end of the wiring pattern 113 is electrically connected to the electrode pad 111, and the other end of the wiring pattern 113 is electrically connected to the via conductor 114. The wiring pattern 113 includes a first wiring pattern 113a and a second wiring pattern 113b. The wiring pattern 113 is provided so as to overlap the second frame 110c in plan view. By doing so, the crystal device suppresses the generation of stray capacitance between the wiring pattern 113 and the tuning fork type crystal element 120, so that this stray capacitance is not given to the tuning fork type crystal element 120. Therefore, fluctuations in the oscillation frequency can be suppressed. Even if an external force is applied to the quartz device and a bending moment is generated in the long side direction of the second frame 110c, the first frame 110b and the second frame 110c are provided in addition to the substrate 110a. The portion where the second frame 110c is provided is not easily deformed. Therefore, the wiring pattern 113 provided at a position overlapping the second frame 110c in plan view is less likely to be disconnected, and can prevent the oscillation frequency from being output.

  The first wiring pattern 113a is electrically connected to the first electrode pad 111a and the first via conductor 114a. The first wiring pattern 113a extends in the long side direction of the second frame 110c adjacent to the first electrode pad 111a, and a part of the first wiring pattern 113a is exposed. The second wiring pattern 113b is electrically connected to the second electrode pad 111b and the second via conductor 114b. The second wiring pattern 113b extends in the long side direction of the second frame 110c adjacent to the second electrode pad 111b, and a part of the second wiring pattern 113b is exposed.

  In this way, a part of the wiring pattern 113 is provided so as to extend from the electrode pad 111 toward the long side of the second frame 110c and to be exposed at the fourth recess K4. When the crystal element 120 is mounted, the conductive adhesive 140 that is about to overflow flows out along the conductive adhesive 140 and the wiring pattern 113 having good wettability. It is possible to prevent the conductive adhesive 140 from adhering to the excitation electrodes 125 and 126 of the crystal vibrating portion 123 without flowing out.

  The via conductor 114 is provided inside the substrate 110a, and both ends thereof are electrically connected to the wiring pattern 113 or the sealing conductor pattern 117. The via conductor 114 is provided by filling a conductor in a through hole provided in the substrate 110a. The via conductor 114 includes a first via conductor 114a, a second via conductor 114b, and a third via conductor 114c, as shown in FIGS.

  Here, when the package 110 is viewed in plan, the dimension of one side is 1.0 to 3.2 mm, and the vertical dimension of the package 110 is 0.2 to 1.5 mm as an example. The sizes of K, the electrode pad 111, and the support pad 115 will be described. The length of the long side of the recess K is 0.7 to 2.0. mm, and the length of the short side is 0.5 to 1.5 mm. Moreover, the length of the up-down direction of the recessed part K is 0.1-0.5 mm. The length of the side of the electrode pad 111 parallel to one side of the substrate 110a is 0.25 to 0.40 mm. The length of the side of the electrode pad 111 that is parallel to the side that intersects with one side of the substrate 110a is 0.25 to 0.40 mm. The length of the thickness of the electrode pad 111 in the vertical direction is 10 to 50 μm.

  The sealing conductor pattern 117 plays a role of improving the wettability of the bonding member 131 when bonded to the lid 130 via the bonding member 131. The sealing conductor pattern 117 is provided so as to surround the upper surface of the second frame 110c. As shown in FIGS. 1 and 3, the sealing conductor pattern 117 is electrically connected to the third external terminal 112a via the third via conductor 114a. The sealing conductor pattern 117 is, for example, 10 to 25 μm in thickness by applying nickel plating and gold plating to the surface of the conductor pattern made of tungsten or molybdenum, for example, so as to surround the upper surface of the second frame 110c in an annular shape. Is formed.

  The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example. The lid 130 is for hermetically sealing the fourth recess K4 in a vacuum state or the fourth recess K4 filled with nitrogen gas or the like. Specifically, the lid 130 is placed on the second frame 110c of the package 110 in a predetermined atmosphere, and the sealing conductor pattern 117 of the second frame 110c and the bonding member 131 of the lid 130 are connected. By applying heat so as to be joined, the joining member 131 is melted and joined to the second frame 110c. The lid 130 is electrically connected to the third external terminal 112c on the lower surface of the substrate 110a via the sealing conductor pattern 117 and the third via conductor 114c. Therefore, the lid 130 is electrically connected to the third external terminal 112c.

  The joining member 131 is provided at a location of the lid body 130 facing the sealing conductor pattern 117 provided on the upper surface of the second frame 110c of the package 110. The joining member 131 is provided by, for example, silver solder or gold tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin.

  Here, a method for manufacturing the substrate 110a will be described. When the substrate 110a is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel plating, gold plating, silver palladium, or the like is applied to a predetermined portion of the conductor pattern, specifically, the electrode pad 111, the external terminal 112, the wiring pattern 113, the via conductor 114, and the sealing conductor pattern 117. It is produced by applying. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  The quartz crystal device according to the first embodiment includes a substrate 110a, a first frame 110b provided along the outer periphery of the substrate 110a, and a second frame provided along the outer periphery of the first frame 110b. 110c, a pair of electrode pads 111 provided along the short side direction on the substrate 110a, a rectangular crystal base 121, and a crystal vibration that is a part of the crystal base 121 extending from the side surface of the crystal base 121 Part 123, a weight part 128 provided at the tip of the crystal vibrating part 123, excitation electrodes 125 and 126 provided on the upper and lower surfaces of the crystal vibrating part 123, and excitation provided from the crystal vibrating part 123 to the crystal base part 121. A tuning fork crystal element 120 having a lead electrode 127 electrically connected to the electrodes 125 and 126, a substrate 110 a and a first frame 110 b, and between the electrode pads 111. The first recess K1 provided, the substrate 110a and the first frame 110b, the second recess K2 provided at a position facing the crystal vibrating portion 123, the substrate 110a and the first frame 110b. And a third concave portion K3 formed at a position facing the weight portion 128.

  Thus, when the tuning fork type crystal element 120 is mounted on the electrode pad 211, even if the tuning fork type crystal element 120 is inclined, the vibrating arm part 122 is caused by the second recess K2 and the third recess K3. In addition, since the weight 128 can be prevented from coming into contact with the upper surface of the substrate 210a, the crystal device can suppress fluctuation and stop of the oscillation frequency of the tuning fork type crystal element 120. Further, in the crystal device, even if the conductive adhesive 140 provided on the pair of adjacent electrode pads 111 is overflowed from the electrode pad 111 when the tuning fork type crystal element 120 is mounted by the first recess K1. By entering the first recess K1, it is possible to further suppress the adjacent electrode pads 111 from being short-circuited.

  The crystal device according to the first embodiment is provided so that the first recess K1, the second recess K2, and the third recess K3 are connected. By doing in this way, even if the conductive adhesive 140 provided on the pair of adjacent electrode pads 111 overflows from the electrode pad 111 when mounting the tuning fork type crystal element 120, the first recess K1. By entering the inside and flowing out from the first recess K1 to the third recess K3 through the second recess K2, it is possible to further prevent the adjacent electrode pads 111 from being short-circuited.

(Second embodiment)
As shown in FIGS. 5 and 6, the crystal device according to the second embodiment is bonded to the package 210, the tuning fork type crystal element 120 bonded to the upper surface of the package 210, and the lower surface of the package 210. And an integrated circuit element 150 which is one of the electronic components. The package 110 is formed with a fourth recess K4 surrounded by the upper surface of the first frame 210b and the inner surface of the second frame 210c. In addition, a mounting region surrounded by the lower surface of the substrate 210a and the inner surface of the mounting substrate 160 is formed. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 210a has a rectangular shape for mounting the tuning fork type crystal element 120 mounted on the upper surface and the integrated circuit element 150 mounted on the lower surface. The substrate 210a is provided with an electrode pad 211 for mounting the tuning fork type crystal element 120 on the upper surface and a connection pad 215 for mounting the integrated circuit element 150 on the lower surface. A first electrode pad 211a and a second electrode pad 211b for joining the tuning fork type crystal element 120 are provided along one side of the substrate 210a. Bonding terminals 212 are provided at the four corners of the lower surface of the substrate 210a. In addition, a pair of measurement pads 219 is provided in the center of the lower surface of the substrate 210a, and six connection pads 215 for mounting the integrated circuit element 150 are provided so as to surround the pair of measurement pads 219. In addition, the junction terminals 212 are electrically connected to the four outside the connection pads 215.

  The substrate 210a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 210a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern 213 and a via conductor 214 for electrically connecting the electrode pad 211 provided on the upper surface and the measurement pad 219 provided on the lower surface of the substrate 210a are provided on and inside the substrate 210a. Yes. In addition, a connection pad 215 and a measurement pad 219 provided on the lower surface are provided on the surface of the substrate 210a.

  The first frame 210b is disposed on the upper surface of the substrate 210a, and is for forming the first recess K1, the second recess K2, and the third recess K3 on the upper surface of the substrate 210a. The second frame 210c is disposed on the upper surface of the first frame 210b, and is for forming the fourth recess K4 on the upper surface of the first frame 210b. The first frame 210b and the second frame 210c are made of a ceramic material such as alumina ceramics or glass-ceramics, and are formed integrally with the substrate 210a.

  The electrode pad 211 is for mounting the tuning fork type crystal element 120. A pair of electrode pads 211 are provided on the upper surface of the substrate 210a, and are provided adjacent to each other along one side of the substrate 110a. The electrode pad 211 is electrically connected to the bonding terminal 212 provided on the lower surface of the substrate 210a through the wiring pattern 213 and the via conductor 214 provided on the upper surface of the substrate 210a as shown in FIGS. It is connected to the.

  As shown in FIG. 7, the electrode pad 211 includes a first electrode pad 211a and a second electrode pad 211b. The via conductor 214 includes a first via conductor 214a, a second via conductor 214b, a third via conductor 214c, a fourth via conductor 214d, a fifth via conductor 214e, a sixth via conductor 214f, a seventh via conductor 214g, and an eighth via. It is constituted by a conductor 214h. The wiring pattern 213 includes a first wiring pattern 213a, a second wiring pattern 213b, a third wiring pattern 213c, and a fourth wiring pattern 213d. The measurement pad 219 includes a first measurement pad 219a and a second measurement pad 219b. The first electrode pad 211a is electrically connected to one end of the first wiring pattern 213a provided on the substrate 210a.

  The other end of the first wiring pattern 213a is electrically connected to one end of the third wiring pattern 213c via the first via conductor 214a. The other end of the third wiring pattern 213c is electrically connected to the first measurement pad 219a via the seventh via conductor 214g. Therefore, the first electrode pad 211a is electrically connected to the first measurement pad 219a. The second electrode pad 211b is electrically connected to one end of the second wiring pattern 213b provided on the substrate 210a. The other end of the second wiring pattern 213b is electrically connected to one end of the fourth wiring pattern 213d through the second via conductor 214b. The other end of the fourth wiring pattern 213d is electrically connected to the second measurement pad 219b through the eighth via conductor 214h. Therefore, the second electrode pad 211b is electrically connected to the second measurement pad 219b.

  The first measurement pad 219a is electrically connected to the third connection pad 215c. Therefore, the first electrode pad 211a is electrically connected to the third connection pad 215c. Further, the second measurement pad 219b is electrically connected to the sixth connection pad 215f. Therefore, the second electrode pad 211b is electrically connected to the sixth connection pad 215f.

  The bonding terminal 212 is used for electrically bonding to the bonding pad 161 of the mounting substrate 160. As shown in FIG. 8B, the joining terminals 212 are provided at the four corners of the lower surface of the substrate 210a, and are configured by the first joining terminals 212a, the second joining terminals 212b, the third joining terminals 212c, and the fourth joining terminals 212d. Has been. The junction terminals 212 are electrically connected to connection pads 215 provided on the lower surface of the substrate 210a. The first joint terminal 212a is electrically connected to the sealing conductor pattern 217 through the third via conductor 214c.

  The wiring pattern 213 is provided on the upper surface of the substrate 210a, and is drawn from the electrode pad 211 toward the via conductor 214 of the nearby substrate 210a. As shown in FIG. 3, the wiring pattern 213 includes a first wiring pattern 213a, a second wiring pattern 213b, a third wiring pattern 213c, and a fourth wiring pattern 213d.

  The via conductor 214 is provided inside the substrate 210 a, and both ends thereof are electrically connected to the wiring pattern 213 and the measurement pad 219. The via conductor 214 is provided by filling a conductor in a through hole provided in the substrate 210a. The via conductor 214 includes a first via conductor 214a, a second via conductor 214b, a third via conductor 214c, a fourth via conductor 214d, a fifth via conductor 214e, a sixth via conductor 214f, a seventh via conductor 214g, and an eighth via. It is constituted by a conductor 214h. Further, the via conductors 214 provided at the four corners of the substrate 210a are provided at positions overlapping the mounting base 160 as shown in FIG. By doing so, the quartz crystal device of the present embodiment reduces the stray capacitance generated between the mounting pattern on the mounting board of the electronic device or the like and the via conductor 214, so that the tuning fork type quartz crystal element 120 is provided. Since no stray capacitance is added, fluctuations in the oscillation frequency of the tuning fork type crystal element 120 can be reduced.

  The seventh via conductor 214g and the eighth via conductor 214h are provided so as to be positioned between the pair of crystal vibrating portions 123 when viewed in plan. In this way, a tuning fork type quartz crystal is used to suppress the generation of additional capacitance between the excitation electrodes 125 and 126 provided in the crystal vibrating portion 123 and the seventh via conductor 214g and the eighth via conductor 214h. Fluctuations in the oscillation frequency of the element 120 can be reduced.

  The connection pad 215 is used for mounting the integrated circuit element 150. Further, as shown in FIG. 8, the connection pad 215 includes a first connection pad 215a, a second connection pad 215b, a third connection pad 215c, a fourth connection pad 215d, a fifth connection pad 215e, and a sixth connection pad 215f. It is configured. The first connection pad 215a is electrically connected to the first joint terminal 212a, and the second connection pad 215b is electrically connected to the second joint terminal 212b. The third connection pad 215c is electrically connected to the first measurement pad 219a, and the sixth connection pad 215f is electrically connected to the second measurement pad 219b. The fourth connection pad 215d is electrically connected to the third joint terminal 212c, and the fifth connection pad 215e is electrically connected to the fourth joint terminal 212d.

  The sealing conductor pattern 217 serves to improve the wettability of the bonding member 131 when bonded to the lid 130 via the bonding member 131. As shown in FIGS. 3 and 4, the sealing conductor pattern 117 is electrically connected to the first joint terminal 212 a through the third via conductor 214 c. The sealing conductor pattern 217 has a thickness of, for example, 10 to 25 μm by sequentially applying nickel plating and gold plating on the surface of the conductor pattern made of tungsten or molybdenum, for example, so as to surround the upper surface of the second frame 210c in an annular shape. Is formed.

  The measurement pad 219 is for measuring the characteristics of the tuning fork type crystal element 120 by bringing a contact pin or the like into contact therewith. The measurement pad 219 is provided at a position overlapping the integrated circuit element 150 in plan view. By doing so, the stray capacitance generated between the mounting pattern on the mounting substrate of the electronic device or the like and the measurement pad 219 is reduced, so that the stray capacitance is not added to the tuning fork type crystal element 120. Fluctuations in the oscillation frequency of the crystal element 120 can be reduced.

  Here, the size of the measurement pad 219 will be described by taking an example in which the dimension of one side when the package 210 is viewed in plan is 1.0 to 2.0 mm. The length of the long side of the measurement pad 219 is 0.5 to 0.8 mm, and the length of the short side is 0.45 to 0.75 mm. Further, since the tuning fork type crystal element 120 is measured before the mounting substrate 160 is mounted, the area of the measurement pad 219 can be increased as compared with the conventional piezoelectric oscillator. Since the area of the measurement pad 219 can be increased, contact failure between the contact pin and the measurement pad 219 can be reduced. Accordingly, since remeasurement of the tuning fork type crystal element 120 caused by contact failure between the contact pin and the measurement pad 219 can be suppressed, the productivity of the crystal device can be improved.

  Further, as an electrical characteristic measuring instrument used when measuring the characteristics of the tuning fork type crystal element 120, it is possible to measure equivalent parameters such as inductance, capacitance, etc. in addition to the resonance frequency and crystal impedance of the tuning fork type crystal element 120. A network analyzer or an impedance analyzer that can be used is used. The contact pin is composed of a highly conductive pin in which the surface of an alloy such as copper or silver is gold-plated and a re-sectorable socket having a spring property that suppresses an impact at the time of contact. The measurement is performed by contacting with pressing.

  Here, a method for manufacturing the substrate 210a is described. When the substrate 210a is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel plating is applied to a predetermined portion of the conductor pattern, specifically, the electrode pad 211, the bonding terminal 212, the wiring pattern 213, the via conductor 214, the connection pad 215, the sealing conductor pattern 217, and the measurement pad 219. Moreover, it produces by giving gold plating, silver palladium, etc. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  The mounting substrate 160 is bonded to the lower surface of the substrate 210a and forms a mounting region for mounting the integrated circuit element 150 on the lower surface of the substrate 210a. A pair of mounting bases 160 are provided along the facing sides of the substrate 210. The mounting substrate 160 is made of, for example, an insulating substrate such as a glass epoxy resin, and is bonded to the lower surface of the substrate 210 a via the conductive bonding material 170. Inside the mounting substrate 160, a conductor portion 163 for electrically connecting a bonding pad 161 provided on the upper surface and an external terminal 162 provided on the lower surface of the mounting substrate 160 is provided. Bonding pads 161 are provided at both ends of the upper surface of the mounting substrate 160, and external terminals 162 are provided at both ends of the lower surface. The external terminal 162 is electrically connected to the integrated circuit element 150.

  The mounting substrate 160 is formed of a glass epoxy substrate. By doing in this way, the base material of the mounting substrate 160 and the base material of the mounting substrate (not shown) constituting the electronic device or the like are made of the same resin material, thereby reducing the difference in thermal expansion coefficient. can do. For this reason, even when the mounting substrate is deformed by heating, the stress due to the deformation is relieved by the presence of the mounting substrate 160, and as a result, the stress applied to the solder is also relieved. Such a crystal device can reduce occurrence of peeling from a mounting substrate such as an electronic device.

  The bonding pad 161 is for electrically bonding to the bonding terminal 212 of the substrate 210a via the conductive bonding material 170. As shown in FIG. 9, the bonding pad 161 includes a first bonding pad 161a, a second bonding pad 161b, a third bonding pad 161c, and a fourth bonding pad 161d. As shown in FIG. 9, the external terminal 162 includes a first external terminal 162a, a second external terminal 162b, a third external terminal 162c, and a fourth external terminal 162d. The conductor part 163 includes a first conductor part 163a, a second conductor part 163b, a third conductor part 163c, and a fourth conductor part 163d. The first bonding pad 161a is electrically connected to the first external terminal 162a via the first conductor portion 163a, and the second bonding pad 161b is connected to the second external terminal 162b via the second conductor portion 163b. Electrically connected. The third bonding pad 161c is electrically connected to the third external terminal 162c via the third conductor portion 163c, and the fourth bonding pad 161d is connected to the fourth external terminal 162d via the fourth conductor portion 163d. Electrically connected.

  The external terminal 162 is for mounting on a mounting board such as an electronic device. The external terminals 162 are provided at the four corners of the lower surface of the mounting substrate 160. The external terminals 162 are electrically connected to four of the six connection pads 215 provided on the lower surface of the substrate 210a. The first external terminal 162a is connected to a mounting pad connected to a ground potential that is a reference potential on a mounting substrate of an electronic device or the like. As a result, the lid 130 joined to the sealing conductor pattern 217 is connected to the first external terminal 162a that is at the ground potential. Therefore, the shielding property in the 4th recessed part K4 by the cover body 130 improves. The first external terminal 162a is used as a ground terminal, the third external terminal 162c is used as a functional terminal, and the fourth external terminal 162d is used as a power supply voltage terminal. The function terminal is used as a write / read terminal and a frequency control terminal. Here, the writing / reading terminal is a terminal for writing the temperature compensation control data into the storage element section or reading the temperature compensation control data written in the storage element section. The frequency control terminal is a terminal for correcting the temperature characteristic of the tuning fork type crystal element 120 by changing the load capacitance of the variable capacitance diode of the oscillation circuit section when a voltage is applied.

  The conductor portion 163 is for electrically connecting the bonding pad 161 on the upper surface of the substrate 210a and the external terminal 162 on the lower surface. The conductor portion 163 is formed by providing through holes at the four corners of the mounting base 160, forming a conductive member on the inner wall surface of the through hole, closing the upper surface with the bonding pad 161, and closing the lower surface with the external terminals 162. Yes.

  A method for bonding the mounting substrate 160 to the substrate 210a will be described. First, the conductive bonding material 170 is applied onto the first bonding pad 161a, the second bonding pad 161b, the third bonding pad 161c, and the fourth bonding pad 161d by, for example, a dispenser and screen printing. The substrate 210 a is transported so that the bonding terminals 212 of the substrate 210 a are positioned on the conductive bonding material 170, and is placed on the conductive bonding material 170. The conductive bonding material 170 is cured and contracted by being heated and cured. As a result, the bonding terminal 112 of the substrate 210a is bonded to the bonding pad 161. That is, the first bonding terminal 212a of the substrate 210a is bonded to the first bonding pad 161a, and the second bonding terminal 212b of the substrate 210a is bonded to the second bonding pad 161b. Further, the third bonding terminal 212c of the substrate 210a is bonded to the third bonding pad 161c, and the fourth bonding terminal 212d of the substrate 210a is bonded to the fourth bonding pad 161d.

  Further, the bonding terminal 212 of the substrate 210a and the bonding pad 161 of the mounting substrate 160 are bonded via the conductive bonding material 170, so that the thickness of the conductive bonding material 170 between the substrate 210a and the mounting substrate 160 is increased. A gap portion corresponding to the sum of the thickness of the bonding terminal 212 and the bonding pad 161 is provided. When the insulating resin 180 enters and fills the gap, the bonding strength between the substrate 210a and the mounting substrate 160 can be improved. In addition, the outer shape of the mounting substrate 160 is provided so as to be larger than the outer shape of the substrate 210a in plan view, and the insulating resin 180 is formed from the outer peripheral edge of the lower surface of the substrate 210a. The slope is provided so that the thickness in the vertical direction becomes thinner. In this way, even when the entire structure of the piezoelectric device is reduced in size, it is possible to secure a wide area for attaching the insulating resin 180 to the substrate 210a. It becomes possible to firmly bond to the substrate 210a.

  As the integrated circuit element 150, for example, a rectangular flip-chip type integrated circuit element having a plurality of connection pads is used, and a temperature sensor for detecting an ambient temperature state, a tuning fork is provided on the circuit formation surface (upper surface). Storage element unit for storing temperature compensation data for compensating the temperature characteristics of the quartz crystal element 120, a temperature compensation circuit unit for correcting the vibration characteristics of the tuning fork type crystal element 120 according to the temperature change based on the temperature compensation data, and An oscillation circuit unit that is connected to the temperature compensation circuit unit and generates a predetermined oscillation output is provided. The output signal generated by the oscillation circuit unit is output to the outside of the piezoelectric oscillator via the first external terminal 162a of the mounting substrate 160, and is used as a reference signal such as a clock signal, for example.

  The storage element unit is composed of PROM or EEPROM. Temperature compensation control data for the following three-dimensional function, which is a temperature compensation function, such as the third-order component adjustment value α, the first-order component adjustment value β, and the zero-order component adjustment value γ, are provided at the third external terminal. It is inputted from the writing / reading terminal 162c and stored. A register map is stored in the storage element section. The register map indicates what operation is performed when the control data is input to each address data and the control section reads the data and outputs a signal.

  The temperature compensation circuit unit includes a cubic function generating circuit, a quintic function generating circuit, and the like. For example, in the case of a cubic function generation circuit, the temperature compensation control data input to the storage element section is read, and a voltage derived from the temperature compensation control data with a cubic function is generated for each temperature. The external ambient temperature at this time is obtained from a temperature sensor in the integrated circuit element 150. The temperature compensation circuit unit is connected to the cathode of the variable capacitance diode, and a voltage is applied from the temperature compensation circuit unit. As described above, the frequency temperature characteristic is flattened by applying the voltage from the temperature compensation circuit unit to the variable capacitance diode and correcting the frequency temperature characteristic of the tuning fork type crystal element 120.

  As shown in FIG. 6, the integrated circuit element 150 is mounted on a connection pad 215 provided on the lower surface of the substrate 210a via a conductive bonding material 170 such as solder. The connection terminal 151 of the integrated circuit element 150 is connected to the connection pad 215. The connection pad 215 is electrically connected to the bonding terminal 212. The bonding terminal 212 is electrically connected to the bonding pad 161 via the conductive bonding material 170. The bonding pad 161 is electrically connected to the external terminal 162 through the conductor portion 163. Therefore, the connection pad 215 is electrically connected to the external terminal 162 through the bonding terminal 212. The first external terminal 162a serves as a ground terminal by being connected to a mounting pad that is connected to a ground that is a reference potential on a mounting substrate of an electronic device or the like. Therefore, one of the connection terminals 151 of the integrated circuit element 150 is connected to the ground that is the reference potential.

  A method for bonding the integrated circuit element 150 to the substrate 210a will be described. First, the conductive bonding material 170 is applied to the connection pad 215 by a dispenser, for example. The integrated circuit element 150 is placed on the conductive bonding material 170. The conductive bonding material 170 is melt bonded by heating. Therefore, the integrated circuit element 150 is bonded to the connection pad 215.

  Further, as shown in FIGS. 5 and 6, the integrated circuit element 150 has a rectangular shape, and six connection terminals 151 are provided on the lower surface thereof. Three connection terminals 151 are provided along one side, and three connection terminals 151 are provided along one side facing the one side. The long side length of the integrated circuit element 150 is 0.5 to 1.2 mm, and the short side length is 0.3 to 1.0 mm. The length of the integrated circuit element 150 in the thickness direction is 0.1 to 0.3 mm.

  The conductive bonding material 170 is made of, for example, silver paste or lead-free solder. In addition, the conductive bonding material 170 contains an added solvent for adjusting the viscosity to be easily applied. The component ratio of the lead-free solder is 95 to 97.5% for tin, 2 to 4% for silver, and 0.5 to 1.0% for copper.

  As shown in FIG. 6, the insulating resin 180 is provided between the surface of the integrated circuit element 150 where the connection terminal 151 is provided and the connection pad 215. In this way, the insulating resin 180 can increase the adhesive strength between the integrated circuit element 150 and the lower surface of the substrate 210a. Further, even when a crystal device is mounted on a mounting pad of a mounting substrate of an electronic device or the like, even if a foreign material such as solder enters between the pair of mounting substrates 160, the insulating resin 180 causes the foreign material to Is prevented from adhering between the connection terminals 151 of the integrated circuit element 150, so that a short circuit between the connection terminals 151 of the integrated circuit element 150 can be reduced. The insulating resin 180 is made of an epoxy resin or a resin material such as a composite resin mainly containing an epoxy resin.

  The insulating resin 180 is provided so as to cover the measurement pad 219. By doing so, it is possible to prevent foreign matter from adhering to the measurement pad 219, and thus it is possible to suppress the additional resistance of the foreign matter from being applied to the tuning fork type crystal element 120. Therefore, fluctuations in the oscillation frequency of the tuning fork type crystal element 120 can be reduced.

  The insulating resin 180 is provided in a gap provided between the lower surface of the substrate 210 a and the upper surface of the mounting base 160. Thus, the insulating resin 180 can improve the bonding strength between the lower surface of the substrate 210a and the upper surface of the mounting substrate 160. The insulating resin 180 is provided on the lower surface of the via conductor 214, and the outer peripheral edge of the lower surface of the via conductor 214 is fixed to the substrate 210 a by the insulating resin 180. By doing so, even if the substrate 210a is warped, the via conductor 214 is fixed by the insulating resin 180. Therefore, the via conductor is formed from the interface between the outer peripheral edge of the via conductor 214 and the substrate 210a. It is possible to reduce the peeling of 214. Further, by reducing the peeling of the via conductor 214 from the interface between the outer peripheral edge of the via conductor 214 and the substrate 210a, there is no gap at the interface between the via conductor 214 and the substrate 210a, and the airtightness of the substrate 210a is reduced. Can be improved.

  A method for forming the insulating resin 180 on the substrate 210a will be described. After the contact pin is brought into contact with the measurement pad 219 and the characteristics of the tuning fork type crystal element 120 bonded to the substrate 210a are measured, the tip of the resin dispenser is inserted between the pair of mounting bases 160, and the insulating resin 180 is inserted. Inject. Next, the insulating resin 180 is heated and cured. Therefore, the insulating resin 180 is provided in a gap provided between the lower surface of the substrate 110 a and the upper surface of the mounting base 160 and between the integrated circuit element 150 and the connection pad 215.

  The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example. The lid 130 is for hermetically sealing the fourth recess K4 in a vacuum state or the fourth recess K4 filled with nitrogen gas or the like. Specifically, the lid 130 is placed on the second frame 210c of the package 210 in a predetermined atmosphere, and the sealing conductor pattern 217 of the second frame 210c and the bonding member 131 of the lid 130 are connected. By applying a predetermined current so as to be welded and performing seam welding, the second frame 210c is joined. The lid 130 is electrically connected to the second joining terminal 212a on the lower surface of the substrate 210a through the sealing conductor pattern 217 and the third via conductor 214c. The first bonding terminal 212a is electrically connected to the second bonding pad 161b through the conductive bonding material 170. The second bonding pad 161b is electrically connected to the second external terminal 162b through the second conductor portion 163b. Therefore, the lid 130 is electrically connected to the second external terminal 162b of the mounting base 160.

  The quartz crystal device according to the second embodiment includes a pair of mounting bases 160 provided along opposite sides of the substrate 210a and an integrated circuit mounted on the lower surface of the substrate 210a so as to be disposed between the pair of mounting bases 160. Circuit element 150. In this way, as with the crystal device of the first embodiment, even when the tuning fork type crystal element 120 is tilted when the tuning fork type crystal element 120 is mounted on the electrode pad 211, the second recess K2 Since the vibrating arm 122 and the weight 128 can be prevented from coming into contact with the upper surface of the substrate 210a by the third recess K3, fluctuation and stop of the oscillation frequency of the tuning fork crystal element 120 can be suppressed. . Even if the conductive adhesive 140 provided on the pair of adjacent electrode pads 211 overflows from the electrode pad 211 when the tuning fork type crystal element 120 is mounted by the first recess K 1, By entering into K1, it can further suppress that the adjacent electrode pad 211 short-circuits.

  In the quartz crystal device according to the second embodiment, a pair of mounting bases 160 are provided along opposite sides. By doing so, since the long side direction of the substrate 210a is open, the integrated circuit element 150 can be disposed up to the outer periphery of the long side of the substrate 210a. Further, since the connection pad 215 is formed up to the outer peripheral edge of the substrate 210a, the area of the connection pad 215 for mounting one integrated circuit element 150 can be increased, so that the integrated circuit element 150 is connected. It is possible to improve the bonding strength between the integrated circuit element 150 and the connection pad 215 while suppressing the separation from the pad 215.

  The quartz crystal device according to the second embodiment includes a measurement pad 219 electrically connected to the electrode pad 211 on the lower surface of the substrate 210 a, and the measurement pad 219 is covered with the integrated circuit element 150. By doing so, it is possible to reduce the occurrence of stray capacitance between the mounting pattern provided on the upper surface of the mounting substrate of the electronic device or the like and the measurement pad 219, and therefore the oscillation of the tuning fork type crystal element 120 It can reduce that a frequency fluctuates.

  The crystal device according to the second embodiment includes via conductors 214g and 214h that electrically connect the electrode pad 211 and the measurement pad 219. When the via conductors 214g and 214h are viewed in a plan view, It is provided so as to be positioned between the vibration parts 123. By doing so, it is possible to suppress the generation of stray capacitance between the excitation electrodes 125 and 126 provided in the crystal vibrating portion and the via conductors 214g and 214h. Therefore, the oscillation frequency of the tuning-fork type crystal element 120 can be suppressed. It is possible to reduce the fluctuations of.

  The quartz crystal device according to the second embodiment includes an insulating resin 180 provided between the integrated circuit element 150 and the substrate 210a and between the mounting base 160 and the substrate 210a. In this way, the insulating resin 180 can increase the adhesive strength between the integrated circuit element 150 and the lower surface of the substrate 210a. Further, even when a crystal device is mounted on a mounting pad of a mounting substrate of an electronic device or the like, even if foreign matter such as solder enters the second recess K2, the foreign material is accumulated by the insulating resin 180. Since adhesion between the connection terminals 151 of the circuit element 150 is suppressed, a short circuit between the connection terminals 151 of the integrated circuit element 150 can be reduced. Further, in this way, the insulating resin 180 can improve the bonding strength between the lower surface of the substrate 210a and the upper surface of the mounting substrate 160.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where the second frame 110c is integrally formed of a ceramic material in the same manner as the substrate 110a and the first frame 110b has been described. However, the second frame 110c may be made of metal. . In this case, the frame is joined to the conductor film of the substrate via a brazing material such as silver-copper.

110, 210 ... Package 110a, 210a ... Substrate 110b, 210b ... First frame 110c, 210c ... Second frame 111, 211 ... Electrode pads 112, 212 ... Joint terminals 113, 213 ... wiring pattern 114, 214 ... via conductor 115, 215 ... connection pad 117, 217 ... sealing conductor pattern 119, 219 ... measurement pad 120 ... tuning fork crystal Element 121 ... Crystal base part 122 ... Vibrating arm part 123 ... Quartz vibrating part 125, 126 ... Excitation electrode 127 ... Extraction electrode 128 ... Weight part 129 ... Frequency adjustment electrode 130 .. Lid 131... Joining member 140... Conductive adhesive 150... Integrated circuit element 151... Connection terminal 160. ... Junction pad 162 ... External terminal 163 ... Conductor 170 ... Insulating bonding material 180 ... Insulating resin K1 ... First recess K2 ... Second recess K3 ... Third recess K4 ... Fourth recess

Claims (6)

A substrate,
A first frame provided along an outer peripheral edge of the substrate;
A second frame provided along the outer peripheral edge of the first frame;
A pair of electrode pads provided along the short side direction on the substrate;
A rectangular crystal base, a crystal vibration part that is a part of the crystal base extending from a side surface of the crystal base, a weight provided at a tip of the crystal vibration part, an upper surface of the crystal vibration part, and A tuning fork type quartz crystal element having an excitation electrode provided on a lower surface and a lead electrode provided from the quartz crystal vibrating portion to the quartz crystal base portion and electrically connected to the excitation electrode;
A first recess formed between the electrode pad and the substrate and the first frame;
A second recess formed by the substrate and the first frame and provided at a position facing the crystal vibrating part;
A quartz crystal device comprising: a third recess formed by the substrate and the first frame and provided at a position facing the weight portion. The crystal device according to claim 1,
The crystal device, wherein the first recess, the second recess, and the third recess are connected. The crystal device according to claim 1,
A pair of mounting substrates provided along opposite sides of the substrate;
And an integrated circuit element mounted on the lower surface of the substrate so as to be disposed between the pair of mounting substrates. The crystal device according to claim 3,
A measurement pad electrically connected to the electrode pad on the lower surface of the substrate,
The crystal device, wherein the measurement pad is covered with the integrated circuit element. The crystal device according to claim 3,
A via conductor that electrically connects the electrode pad and the measurement pad;
The quartz device, wherein the via conductor is provided so as to be positioned between the pair of quartz vibrating parts when viewed in plan. The crystal device according to claim 3,
A quartz crystal device comprising: an insulating resin provided between the integrated circuit element and the substrate and between the mounting base and the substrate.

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