JP2018161661A - Laser processor and plate material processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently remove slag on a work generated during laser machining with a simple configuration. A laser processing apparatus 1 includes a pallet 2 on which a plate-shaped work W is placed, and a laser head arranged above the work W and irradiating a work W placed on the pallet 2 with a laser beam. 4 and the carriage 5 that moves with respect to the work W placed on the pallet 2 and supports the laser head 4 and moves the laser head 4 at least horizontally with respect to the work W, and is vertically installed on the carriage 5. A laser processing apparatus including a brush 6 that comes into contact with the surface of the work W, and a control unit 8 that moves the brush 6 while contacting the surface of the laser-processed work W by moving the carriage 5. [Selection diagram] Fig. 1

Description

  The present invention relates to a laser processing apparatus and a plate material processing system.

  As a device for cutting a workpiece, for example, a laser processing device is known. The laser processing apparatus performs workpiece cutting by moving the laser head relative to the workpiece while irradiating the workpiece placed on the workpiece placing portion with laser light. In such laser processing, the slag that should fall under the workpiece may be blown off by the assist gas and placed on the workpiece during laser processing. For this reason, a laser processing apparatus having a mechanism for removing slag generated by laser processing is known (for example, Patent Document 1 and Patent Document 2 below).

Japanese Utility Model Publication No. 3-095191 JP-A-10-225786

  The laser processing apparatus of Patent Document 1 is provided with a rotating brush via an arm that is swingably attached to the tip of a laser head. However, in the case of the laser processing apparatus of Patent Document 1, a drive device for rotating the bristles of the rotating brush is required, which complicates the configuration of the apparatus and increases the manufacturing cost. Moreover, although the laser processing apparatus of patent document 2 has the brush for removing the slag of the lower surface of a workpiece | work, it cannot remove the slag of the upper surface of a workpiece | work.

  In view of the circumstances as described above, an object of the present invention is to efficiently remove slag on a workpiece generated during laser processing with a simple configuration.

  A laser processing apparatus according to the present invention includes a pallet on which a plate-shaped workpiece is placed, a laser head that irradiates laser light onto the workpiece placed on the pallet, and a workpiece placed on the pallet. A carriage that moves relative to the workpiece and supports the laser head and moves the laser head at least in the horizontal direction relative to the workpiece, a brush that is suspended from the carriage and contacts the surface of the workpiece, and moves the carriage And a controller that moves the brush while making contact with the surface of the workpiece that has been laser processed.

  In addition, the carriage has a long shape that is long in an orthogonal direction orthogonal to the moving direction, the laser head is movable along the long direction of the carriage, and the brush is disposed along the long direction of the carriage. May be. Further, the length of the brush in the orthogonal direction may be set corresponding to a rectangular workpiece having the maximum size that can be placed on the pallet. Further, the brush may be movable between a position in contact with the surface of the workpiece and a position retracted from the surface of the workpiece. Further, the brush may rotate with respect to the carriage and move between a position where the brush contacts the surface of the workpiece and a position where the brush retracts from the surface of the workpiece. Further, at the position where the brush is retracted from the surface of the workpiece, the tip of the brush may be separated from the laser head with respect to the position contacting the surface of the workpiece. Further, the laser head may irradiate the laser beam while ejecting the assist gas. Moreover, you may provide the conveying apparatus which carries out a workpiece | work with respect to a pallet by adsorb | sucking the surface of a workpiece | work.

  Further, the plate material processing system according to the present invention processes the workpiece in the course of transferring the workpiece from the laser processing apparatus by the transfer device, and a transfer device that transfers the workpiece arranged in the laser processing device. And a processing device having a processing tool to perform.

  The laser processing apparatus of the present invention can efficiently remove slag on a workpiece generated during laser processing with a simple configuration. Moreover, since the board | plate material processing system of this invention can remove efficiently the slag on the workpiece | work generate | occur | produced at the time of laser processing, it can suppress the processing defect by the slag on a workpiece | work.

  The length of the carriage in the orthogonal direction orthogonal to the moving direction is long in the orthogonal direction of the pallet, the laser head is movable along the longitudinal direction of the carriage, and the brush is When arranged along the longitudinal direction, the slag on the workpiece can be removed by moving the carriage in one direction, so that the slag on the workpiece can be efficiently removed. In addition, when the length of the brush is set corresponding to a rectangular workpiece of the maximum size that can be placed on the pallet, the entire workpiece is reliably processed with the brush regardless of the size of the workpiece. be able to. Further, when the brush can move between a position in contact with the surface of the workpiece and a position retracted from the surface of the workpiece, the operation of the brush can be made efficient. In addition, when the brush rotates with respect to the carriage and moves between a position where the brush contacts the surface of the workpiece and a position where the brush retracts from the surface of the workpiece, the brush contacts the surface of the workpiece with a simple configuration. It can be moved between the position retracted from the surface of the workpiece. In addition, at the position where the brush is retracted from the surface of the workpiece, when the tip of the brush is separated from the laser head, the deterioration of the brush due to the laser can be suppressed relative to the position where the brush is in contact with the surface of the workpiece. Further, when the laser head irradiates the laser beam while ejecting the assist gas, the work gas melted by the laser beam can be removed by the assist gas, so that the laser processing can be performed with high accuracy. Moreover, when the conveyance apparatus which carries out a workpiece | work with respect to a pallet is provided by adsorb | sucking the surface of a workpiece | work, the workpiece | work W can be carried out efficiently.

It is a perspective view which shows the laser processing apparatus which concerns on 1st Embodiment. (A) to (C) are explanatory diagrams of laser processing. (A) And (B) is a figure which shows a carriage, (A) is a front view, (B) It is the arrow view seen from the A direction shown to (A). It is a figure which shows operation | movement of a brush. (A) to (C) is a diagram showing the operation of the transport device. It is a flowchart which shows operation | movement of a laser processing apparatus. It is a top view which shows the board | plate material processing system which concerns on 2nd Embodiment.

  Hereinafter, embodiments will be described with reference to the drawings. However, the present invention is not limited to this. Further, in the drawings, in order to describe the embodiment, the scale is appropriately changed and expressed by partially enlarging or emphasizing. In the following drawings, directions in the drawings will be described using an XYZ coordinate system. In this XYZ coordinate system, the vertical direction is the Z direction, and the horizontal direction is the X direction and the Y direction. For each of the X direction, the Y direction, and the Z direction, the side of the arrow is appropriately referred to as a + side (eg, + X side), and the opposite side is referred to as a − side (eg, −X side).

[First embodiment]
FIG. 1 is a perspective view showing a laser processing apparatus according to the first embodiment. A laser processing apparatus (first processing apparatus) 1 performs laser processing on a metal plate-like workpiece W. The laser processing apparatus 1 cuts a part of the workpiece W into a product Wa having a desired shape by performing laser processing on the workpiece W. The laser processing device 1 includes a pallet 2, a pallet transport device 3, a laser head 4, a carriage 5, a brush 6, a transport device 7, and a control unit 8.

  The machining area R1 is an area where the workpiece W is machined by the laser machining apparatus 1. The processing region R1 is set so as to be surrounded by the frame 10. The frame 10 includes two plate-like main frames 10a that stand in the vertical direction and extend in the X direction, and a lower frame 10b that connects the two at the lower part of the two main frames 10a. The main frame 10a is disposed along the X direction on each of the + Y side and the −Y side of the processing region R1 and supports the carriage 5. The lower frame 10b is disposed below the processing region R1 and supports the pallet 2. The configuration of the frame 10 is arbitrary, and the shape, size, and number of the main frame 10a and the lower frame 10b are arbitrary. Further, the frame 10 may include an elevating device for elevating the pallet 2.

  The pallet 2 (processing pallet) mounts a plate-shaped workpiece W. The pallet 2 has a base plate 2a and a support plate 2b. The support plate 2b is arranged side by side in the X direction while standing on the upper surface of the rectangular base plate 2a. The support plate 2b supports the lower surface of the workpiece W at its upper end. A plurality of support plates 2b are provided side by side in the X direction. The upper end portion of each support plate 2b is formed in a sawtooth shape, for example. Thereby, each support plate 2b can make the contact area with respect to the workpiece | work W small, and can suppress that the workpiece | work W welds to the support plate 2b by laser processing. The upper end portion of each support plate 2b is formed so that the height from the base plate 2a (position in the Z direction) is the same.

  The workpiece W is placed on the plurality of support plates 2b. The workpiece W is placed almost horizontally on the pallet 2 because the height of the upper end of each support plate 2b is the same. In addition, the upper end part of each support plate 2b is not limited to a sawtooth shape as shown in FIG. 1, and may be a sword mountain shape or a wave shape, for example. Further, the pallet 2 is not limited to using the plurality of support plates 2b, and for example, the pallet 2 may be arranged with a plurality of pins standing on the base plate 2a.

  The pallet carrying device 3 is used for carrying in and carrying out the pallet 2 into the processing region R1. The pallet transport device 3 includes rails (transport routes) 12. The pallet 2 is movable along the rail 12 while holding the workpiece W. The pallet 2 includes wheels that can travel on the rail 12. The rail 12 extends linearly in the X direction from the processing region R1 to the unload position UP. The unload position UP is a position where the workpiece W is arranged when the product Wa is extracted from the workpiece W on which the product Wa is formed by laser processing. The pallet transport device 3 transports the pallet 2 along the rails 12 by pulling the pallet 2. For example, a hook connected to a wire is hung on the pallet 2, and the pallet 2 is pulled by winding the wire around the drive unit. Note that the mechanism for moving the pallet 2 can be changed as appropriate. For example, the pallet 2 may be self-propelled.

  The laser head 4 emits laser light downward. The laser head 4 is mounted on the carriage 5. The laser head 4 has a nozzle 14 (see FIG. 3A) that opens downward, and emits laser light from the nozzle 14. The laser head 4 irradiates the workpiece W placed on the pallet 2 arranged in the processing region R1 with laser light. The laser head 4 is connected to a laser light source (not shown) through an optical transmission body (not shown) such as an optical fiber. As the laser light source, for example, a solid-state laser light source such as a fiber laser is used. As a result, for example, laser light having a higher heat density than that of a carbon dioxide laser can be obtained, so that cutting or the like can be performed at high speed. The laser head 4 is connected to the control unit 8, and operations such as output of laser light are controlled by the control unit 8.

  The assist gas G is supplied to the laser head 4 (see FIG. 3A). The laser head 4 irradiates the laser beam while ejecting the assist gas G from the nozzle 14. The laser head 4 melts the work W by irradiating the work W with laser light, and blows off the melted work W by ejecting the assist gas G from the nozzle 14 at a high speed. When the laser head 4 irradiates the laser beam while ejecting the assist gas G from the nozzle 14, the melt of the workpiece W by the laser beam can be removed by the assist gas G, so that laser processing can be performed with high accuracy. The injection of the assist gas G is controlled by the control unit 8.

  Next, the carriage 5 will be described. The carriage 5 (laser head drive unit) supports the laser head 4 and moves the laser head 4. The carriage 5 moves in the X direction with respect to the workpiece W placed on the pallet 2, and moves the laser head 4 in at least the horizontal direction (X direction and Y direction) with respect to the workpiece W. The carriage 5 is disposed above the workpiece W. The carriage 5 has a long shape that is long in the orthogonal direction (Y direction) orthogonal to the movement direction (X direction). For example, the length of the carriage 5 in the orthogonal direction (Y direction) is set to be longer than the length of the pallet 2 in the orthogonal direction (Y direction). The laser head 4 is movable along the longitudinal direction (Y direction) of the carriage 5. The carriage 5 includes a gantry 5a, a slider 5b, an elevating unit 5c, a brush 6, and a brush driving unit 16 (see FIG. 3B). The gantry 5a supports each part. The gantry 5a extends in the Y direction and is disposed along the Y direction. The length of the gantry 5a in the orthogonal direction (Y direction) is set longer than the length of the pallet 2 in the orthogonal direction (Y direction). The gantry 5a is disposed on a pair of guide rails 5d formed on the upper surface side of the main frame 10a. The pair of guide rails 5d are arranged in parallel to each other along the X direction with the processing region R1 sandwiched in the Y direction. The carriage 5 has a drive device (not shown) that moves the gantry 5a in the X direction. This drive device is, for example, an actuator such as a motor. The gantry 5a can be moved in the X direction along the guide rail 5d by a driving device. This drive device is connected to the control unit 8, and the operation is controlled by the control unit 8.

  A guide 5e is provided on the upper surface (the surface on the + Z side) of the gantry 5a. The guide 5e is formed along the Y direction and guides the slider 5b. The slider 5b is arranged from the upper surface of the gantry 5a to the surface on the −X side. The carriage 5 has a drive device (not shown) that moves the slider 5b in the X direction. This drive device is, for example, an actuator such as a motor. The slider 5b can be moved in the Y direction along the guide 5e by this driving device. This drive device is connected to the control unit 8, and the operation is controlled by the control unit 8. The guide for guiding the slider 5b may be formed on the −X side surface of the gantry 5a.

  A guide 5f is provided on the surface on the -X side of the slider 5b. The guide 5f is formed along the up-down direction and guides the elevating part 5c. The elevating part 5c is disposed on the −X side surface of the slider 5b. The carriage 5 has a drive mechanism (not shown) that moves the elevating unit 5c in the vertical direction. This drive device is, for example, an actuator such as a motor. The elevating part 5c can be moved in the vertical direction along the guide 5f by this drive mechanism. This drive device is connected to the control unit 8, and the operation is controlled by the control unit 8.

  The laser head 4 is held below the elevating part 5c. As the gantry 5a moves in the X direction, the carriage 5 moves in the X direction as a result of the laser head 4, the slider 5b, and the elevating part 5c being integrated. As the slider 5b moves in the Y direction, the laser head 4 and the elevating part 5c move together in the Y direction. As the elevating part 5c moves in the vertical direction, the laser head 4 moves in the vertical direction. Thereby, the laser head 4 can move in the X direction, the Y direction, and the Z direction above the processing region R1. The carriage 5 is not limited to the above configuration as long as the laser head 4 can be moved at least in the horizontal direction (X direction and Y direction). For example, the carriage 5 may be configured not to move the laser head 4 in the Z direction. For example, the laser head 4 (elevating part 5c) may be fixed to the slider 5b.

  Here, slag generated by laser processing will be described. 2A to 2C are explanatory diagrams of laser processing. In laser processing, as shown in FIG. 2 (A), the workpiece W is melted by irradiating the workpiece W with laser light L from the laser head 4, and the melted workpiece W is moved downward with the assist gas G at a high speed. The melt is blown off below the workpiece W. At this time, since a part of the melt of the workpiece W is vaporized, the slag S (dross) may remain on the workpiece W (product Wa).

  In addition, as shown in FIG. 2B, when the support plate 2b is directly under the processing point of the work W, the melt of the work W cannot be blown below the work W by the assist gas G. Slag S (dross) is likely to occur on W. In addition, as shown in FIG. 2C, when performing processing in which a work W piece having a size that floats by injection of the assist gas G is performed, if the support plate 2 b is directly below the processing point of the work W, the assist Since the gas G cannot be blown off below the workpiece W, the workpiece W piece is fitted into the hole or blown above the workpiece W, and tends to remain as slag S on the workpiece W. When the slag S exists on the product Wa (work W) in this way, for example, when the product Wa is transported by the transport device using the suction device, the slag S enters between the product Wa and the suction device, and the Adsorption of the product Wa becomes defective and causes conveyance failure. In addition, when the next process of laser processing is forming processing or tapping processing, if the slag S is present in the portion to be processed, the slag S is formed between a processing tool such as a mold or a tap used for forming and the workpiece W. It is sandwiched between them and causes processing defects.

  Therefore, the laser processing apparatus 1 of the present embodiment includes the brush 6 that removes the slag S on the workpiece W in order to suppress the adverse effects caused by the slag S as described above. 3A and 3B are views showing the carriage. FIG. 3A is a front view seen from the −X side. FIG. 3B is an arrow view seen from the A direction (−Y direction) shown in FIG.

  The brush 6 is provided on the carriage 5. The brush 6 is suspended from the carriage 5 and contacts the surface of the workpiece W. The brush 6 moves while contacting the surface of the workpiece W after the laser processing by the laser head 4 by the control unit 8 moving the carriage 5 in the X direction (see FIG. 3B). When the brush 6 is provided on the carriage 5, the driving device for the carriage 5 is used for the movement of the brush 6. Therefore, it is not necessary to provide a new driving device, and the configuration of the device can be simplified.

  The brush 6 is provided below the gantry 5a. The brush 6 is suspended from the gantry 5a and contacts the surface of the workpiece W. When the brush 6 is provided below the gantry 5a (carriage 5), since the distance between the workpiece W and the brush 6 is short, the size can be reduced. The brush 6 is provided along the longitudinal direction (Y direction) of the carriage of the carriage 5. The brushes 6 are formed in a row along the Y direction without gaps. As described above, the elongated shape is long in the orthogonal direction of the carriage 5, the laser head 4 is movable along the longitudinal direction (Y direction) of the carriage 5, and the brush 6 is along the longitudinal direction of the carriage 5. Since the slag S on the workpiece W can be removed by moving the carriage 5 in one direction (X direction), the slag S on the workpiece W can be efficiently removed.

  The brush 6 is suspended below the gantry 5a via an attachment member 18 on which the brush 6 is mounted. The brush 6 is detachably attached to the attachment member 18. If the brush 6 is removable with respect to the mounting member 18, the brush 6 can be easily replaced. The attachment member 18 is attached below the gantry 5a via the hinge member 19 (see FIG. 3B). The attachment member 18 can be rotated around a rotation axis parallel to the Y direction by a hinge member 19 (rotating member). That is, the attachment member 18 and the brush 6 are rotatable with respect to the gantry 5a (carriage 5). The brush 6 moves between a position (contact position) P1 that is in contact with the surface of the workpiece W and a position (retraction position) P2 that is retracted from the surface of the workpiece by the rotation described above. When the brush 6 can move between the contact position P1 and the retracted position P2, useless operation of the brush 6 can be suppressed, and the operation of the brush 6 can be made efficient. The brush 6 is rotated by driving a brush driving unit 16 that rotates the brush 6 around a rotation axis parallel to the Y direction. The brush drive unit 16 is an actuator such as a motor, for example. The brush drive unit 16 is connected to the control unit 8, and the operation is controlled by the control unit 8. In the example shown in FIG. 3B, the retracted position P2 is set to a position rotated about 90 degrees counterclockwise about the axis parallel to the Y direction from the contact position P1. At the retracted position P2, the tip of the brush 6 is separated from the laser head 4 with respect to the contact position P1. When the brush 6 is rotatable with respect to the carriage 5 and moves between the contact position P1 and the retracted position P2, the brush 6 is moved between the contact position P1 and the retracted position P2 with a simple configuration. Can do. In the retracted position P2, when the tip of the brush 6 is away from the laser head 4 with respect to the contact position P1, deterioration of the brush 6 due to laser light can be suppressed.

  The length of the brush 6 in the longitudinal direction (orthogonal direction, Y direction) is provided corresponding to the rectangular workpiece W having the maximum size that can be placed on the pallet 2. The length of the brush 6 in the longitudinal direction is set to be slightly longer than the short side of the rectangular workpiece W having the maximum size that can be placed on the pallet 2, for example. When the length of the brush 6 in the longitudinal direction is provided so as to correspond to the rectangular workpiece W having the maximum size that can be placed on the pallet 2, the entire workpiece W is surely independent of the size of the workpiece W. Can be processed with the brush 6.

  The position of the brush 6 is set so that the brush 6 can contact the height of the lower end of the workpiece W, for example. In this case, since the brush 6 reaches the hole (through hole) of the workpiece W, the workpiece W can be reliably processed with the brush 6.

  The material of the brush 6 is a material whose hardness is lower than that of the workpiece W so as not to damage the workpiece W. For example, the material of the brush 6 is resin.

  Next, the operation of the brush 6 will be described. FIG. 4 is a diagram illustrating the operation of the brush. The control unit 8 moves the carriage 5 while being in contact with the surface of the laser-worked workpiece W by moving the carriage 5. The brush 6 operates after the workpiece W is processed by the laser head 4. After machining the workpiece W by the laser head 4, the carriage 6 is driven by the control unit 8 so that the brush 6 has one end portion of the workpiece W (the end portion on the -X side in FIG. 4) as shown by a dotted line in FIG. (-X direction in FIG. 4). Subsequently, the brush 6 is rotated by the brush drive unit 16 and disposed at the contact position P1. Subsequently, the carriage 5 moves the brush 6 to the other end of the work W (the + X side end in FIG. 4) in a state where the brush 6 is in contact with the surface of the work W. By the movement of the brush 6, as shown by a solid line in FIG. 4, the workpiece W is swept by the brush 6, and the slag S existing on the surface of the workpiece W is removed. The slag S removed by the brush 6 is collected by the brush 6. The collected slag S falls from the + X side end of the workpiece W due to the movement of the brush 6 in the + X direction, and is collected in the collection container 21 provided on the other end side of the workpiece W in the pallet 2. When the collection container 21 is provided, the removed slag S is collected, so that the slag S can be easily processed. Thus, when removing slag S using brush 6, since slag S is collected and collect | recovered, the spreading | diffusion of slag S can be suppressed. For example, when removing from the workpiece | work W by blowing off the slag S with gas, the slag S will spread | diffuse. Moreover, when removing the slag S using the brush 6, the slag S on the workpiece W can be effectively removed with a simple configuration. For example, when the slag S is collected by suction by a suction device, the large slag S cannot be collected if the suction force of the suction device is small, and the device becomes complicated and expensive to increase the suction force. In contrast, when the brush 6 is used as in the present embodiment, the slag S having a relatively large size can be easily recovered with a simple configuration. Moreover, when the brush 6 is moved while being in contact with the surface of the workpiece W after the workpiece W is machined by the laser head 4 as in this embodiment, the slugs S on the workpiece W generated by the laser machining are collected at a time. Since it can remove, the slag S on the workpiece | work W can be removed efficiently.

  Next, returning to the description of FIG. 1, the transport device 7 will be described. The conveyance device 7 carries the workpiece W (product Wa) out of the pallet 2 by sucking the surface of the workpiece W (product Wa). The conveyance device 7 carries out the product Wa on the pallet 2 placed at the unload position UP after the laser processing to the product carry-out area PA. The transport device 7 is attached to an X guide 24 that extends in the X direction. The X guide 24 extends from the unload position UP to the product carry-out area PA. The X guide 24 is supported by a traveling carriage (not shown). The X guide 24 moves in the Y direction by the movement of the traveling carriage in the Y direction. The transport device 7 includes, for example, an X moving body 26 that can move along the X guide 24, a Z moving body 27 provided on the X moving body 26, and a suction portion 28 provided on the lower end of the Z moving body 27. Prepare. The X moving body 26 is movable between the upper side of the pallet 2 arranged at the unloading position UP and the product carry-out area PA. The Z moving body 27 is movable in the vertical direction (Z direction) with respect to the X moving body 26 while holding the suction portion 28. The suction unit 28 moves in the Y direction by the traveling carriage, moves in the X direction by the X moving body 26, and moves in the Z direction by the Z moving body 27.

  FIGS. 5A to 5C are diagrams illustrating the operation of the transport device. As shown in FIG. 5A, a plurality of suction pads 29 are provided on the lower surface side (−Z side) of the suction portion 28. The adsorbing unit 28 adsorbs the product Wa by vacuum or reduced pressure, but may be adsorbed by magnetism or the like. The suction portion 28 is aligned with the product Wa on the workpiece W by moving in the X direction and the Y direction at the unload position UP. Subsequently, as illustrated in FIG. 5B, the suction unit 28 moves downward (−Z side) to approach the workpiece W and suck the product Wa. In the present embodiment, since the slag S on the workpiece W is removed by the brush 6 as shown in FIG. 4 described above, the product Wa can be reliably adsorbed by the adsorption pad 29. Subsequently, as illustrated in FIG. 5C, the suction unit 28 moves upward (+ Z side) in a state where the product Wa is sucked, lifts the product Wa, and moves the product Wa by movement in the X direction and the Y direction. Is transferred to a predetermined position in the product carry-out area PA (see FIG. 1). In this manner, by adsorbing the surface of the workpiece W, when the transport device 7 for unloading the workpiece W from the pallet 2 is provided, the workpiece W can be efficiently unloaded. In the above example, the transport device 7 carries the workpiece W to a predetermined position. However, the present invention is not limited to this, and the transport device 7 may be a device that loads the workpiece W into the pallet 2.

  The control unit 8 controls each unit of the laser processing apparatus 1. The control unit 8 includes a central processing unit (CPU), a storage device such as a memory and a hard disk, programs necessary for various controls, and the like. The control unit 8 controls, for example, the position of the laser head 4 (drive of the carriage 5), the output of laser light from the laser head 4, the operation of the brush 6, and the like. For example, the control unit 8 moves the carriage 5 while bringing the brush 6 into contact with the surface of the workpiece W subjected to laser processing.

  Next, the operation of the laser processing apparatus 1 will be described. FIG. 6 is a flowchart showing the operation of the laser processing apparatus 1. First, in step S1, the workpiece W is carried into the machining area R1. The workpiece W is carried into the machining area R1 while being placed on the pallet 2 arranged at the unloading position UP shown in FIG. Subsequently, in step S2, the brush 6 is moved to the retracted position P2 (see FIG. 2B). The brush 6 is moved to the retracted position P2 by the brush driving unit 16. Subsequently, the workpiece W is processed by the laser head 4 in step S3. The workpiece W is processed by the laser head 4 by moving the laser head 4 relative to the workpiece W by the carriage 5 and irradiating the workpiece W with laser light while ejecting the assist gas G. Subsequently, in step S4, the brush 6 is moved to one end of the workpiece W. As shown by a dotted line in FIG. 4, the carriage 5 is driven in the −X direction to move the brush 6 to a position away from one end of the workpiece W (the end on the −X side in FIG. 4). To do. Subsequently, in step S5, the brush 6 is moved to the other end of the work W (the + X side end in FIG. 4) while bringing the brush 6 into contact with the surface of the work W. For example, as shown by a solid line in FIG. 4, the brush 5 is moved to the + X side end of the workpiece W by driving the carriage 5 in the + X direction. By the movement of the brush 6, as shown by a solid line in FIG. 4, the workpiece W is swept by the brush 6, and the slag S existing on the surface of the workpiece W is removed. The slag S removed by the brush 6 is collected by the brush 6. The collected slag S falls from the + X side end of the workpiece W due to the movement of the brush 6 in the + X direction, and is collected on the other end side of the workpiece W in the pallet 2 (FIG. 4). To be collected). Subsequently, in step S6, the workpiece W subjected to laser processing is carried out. The pallet transport apparatus 3 shown in FIG. 1 unloads the pallet 2 on which the workpiece W after laser processing is placed from the processing region R1 and moves it to the unload position UP. Subsequently, in step S7, the product Wa is carried out to a predetermined position. As shown in FIGS. 5A to 5C, the suction portion 28 is aligned with the product Wa on the workpiece W by moving in the X direction and the Y direction at the unload position UP, and is below (−Z side). By moving to, the workpiece W is approached and the product Wa is adsorbed. Subsequently, as illustrated in FIG. 5C, the suction unit 28 moves upward (+ Z side) in a state where the product Wa is sucked, lifts the product Wa, and moves the product Wa by movement in the X direction and the Y direction. Are transferred to a predetermined position in the product carry-out area PA.

  As described above, the laser processing apparatus 1 of the present embodiment can efficiently remove the slag S on the workpiece W generated during laser processing with a simple configuration.

[Second Embodiment]
In the present embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified. FIG. 8 is a top view showing the plate material processing system according to the second embodiment. The plate material processing system SYS includes a laser processing device 1, a transfer device 30 that transfers (conveys) a workpiece W disposed in the laser processing device 1, and a transfer device 30 that transfers the workpiece W from the laser processing device 1. And a processing device 31 for processing the workpiece W.

  The plate material processing system SYS performs laser processing on the workpiece W in the first processing region R <b> 1 of the laser processing apparatus 1 and performs processing with the processing apparatus 31. The laser processing apparatus 1 includes an opening 35 in the main frame 10a on the -Y side. The processing device 31 includes an opening 36 in the frame 10. The transfer device 30 holds the workpiece W by the workpiece holder 30 a and transfers the workpiece W between the laser processing apparatus 1 and the processing apparatus 31 through the opening 35 and the opening 36. The transfer device 30 is moved in the Y direction by a guide and a drive device (not shown).

  The processing device 31 has a processing tool 38 for processing the workpiece W and processes the workpiece W. The processing device 31 has a second processing region R2 as a region where the workpiece W is processed by the processing tool 38. The second processing region R2 is disposed on the −Y side of the first processing region R1. In the second machining region R2, the workpiece W is transferred in the Y direction by the transfer device 30, and the machining tool 38 moves in the X direction, whereby the machining tool 38 is positioned and machined in an arbitrary part of the workpiece W. Can do. The processing by the processing device 31 is, for example, molding processing or tapping processing. As the processing tool 38, a tool suitable for each processing is used.

  The plate material processing system SYS includes a fork device 40. The fork device 40 receives the workpiece W on the pallet 2 in the first processing region R1 of the laser processing device 1 and functions as a support table. The fork device 40 has a base portion 40a and an arm portion 40b. The base 40a is formed extending in the X direction. The arm portion 40b has a rod shape, and a plurality of arm portions 40b are arranged in the X direction on the upper surface of the base portion 40a. Arm portions 40b of the fork device 40 and rod-like portions 42b of the fixed table 42 described later are alternately arranged. On the upper surface of the arm portion 40b of the fork device 40, brush portions (not shown) may be provided at predetermined intervals. This brush part reduces the resistance at the time of transfer of the workpiece | work W, and suppresses that the lower surface of the workpiece | work W is damaged. A plurality of free ball bearings (balls can roll in all directions) may be arranged instead of the brush portion.

  The fork device 40 includes a drive device (not shown) and a guide (not shown), and can move at least a part of the fork device 40 from the standby region R3 to the first processing region R1. The standby region R3 is disposed on the −Y side of the second processing region R2.

  Further, the plate material processing system SYS includes a fixed table 42. The fixed table 42 is provided from the standby area R3 toward the second machining area R2. The fixed table 42 includes a rod-like support portion 42a extending in the X direction and a plurality of rod-like portions 42b extending from the support portion 42a to the + Y side. The pitch in the X direction of the plurality of rod-like portions 42b is set substantially the same as the pitch in the X direction in the arm portion 40b of the fork device 40. Similarly to the arm portion 40b of the fork device 40, a brush portion (not shown) or a free ball bearing may be provided on the upper surface of each rod-like portion 42b, reducing the resistance when the workpiece W is transferred and reducing the resistance of the workpiece W. Scratches on the lower surface may be suppressed.

  Next, the operation of the plate material processing system SYS will be described. In the plate material processing system, the pallet 2 on which the workpiece W is placed is carried into the laser processing apparatus 1. For example, the pallet 2 travels in the −X direction from the unload position UP (see FIG. 1) and carries the workpiece W therein. The workpiece W placed on the pallet 2 is disposed in the first processing region R1 of the laser processing apparatus 1.

  Next, the transfer device 30 moves in the + Y direction and grips the −Y side end of the workpiece W by the workpiece holder 30a. Subsequently, the laser processing apparatus 1 performs laser processing on the workpiece W arranged in the first processing region R1. The laser processing apparatus 1 processes the workpiece W by moving the laser head 4 relative to the workpiece W and irradiating the laser beam L while ejecting the assist gas G.

  Next, as in the first embodiment, the brush 6 is moved to a position away from one end of the workpiece W by driving the carriage 5 in the −X direction. Subsequently, by driving the carriage 5 in the + X direction, the brush 6 is moved to the other end of the workpiece W while the brush 6 is in contact with the surface of the workpiece W. By the movement of the brush 6, the work W is swept by the brush 6, and the slag S present on the surface of the work W is removed. The slag S removed by the brush 6 is collected by the brush 6. The collected slag S falls from the + X side end of the workpiece W due to the movement of the brush 6 in the + X direction, and is collected on the other end side of the workpiece W in the pallet 2 (see FIG. 4). To be recovered.

  Next, the fork device 40 is moved from the standby region R3 in the + Y direction, and the arm portion 40b is disposed below the workpiece W. Next, the pallet 2 is lowered. As a result, the workpiece W is transferred from the support plate 2b of the pallet 2 onto the arm portion 40b. Next, the workpiece | work W is arrange | positioned by the transfer apparatus 30 in 2nd process area | region R2 set in the middle of the transfer of the workpiece | work W. FIG. A predetermined portion of the workpiece W is positioned in the second machining region R2 and is machined by the machining device 31. The processing by the processing device 31 is, for example, molding processing or tapping processing. In this embodiment, since the slag S on the workpiece W is removed by the brush 6, it is possible to suppress processing defects due to the slag S.

  After processing by the processing device 31, the workpiece W may be transferred to the standby region R3 and then transferred to the outside by another transfer device, or transferred again in the + Y direction and laser processed by the laser processing device 1. May be performed. Further, the workpiece W that has been subjected to laser processing again may be transported to the outside of the laser processing apparatus 1 while being placed on the pallet 2.

  As described above, the plate material processing system SYS of the present embodiment can efficiently remove the slag S on the workpiece W generated during laser processing, and therefore suppresses processing defects due to the slag S on the workpiece W. Can do.

  The technical scope of the present invention is not limited to the aspects described in the above-described embodiments. One or more of the requirements described in the above embodiments and the like may be omitted. In addition, the requirements described in the above-described embodiments and the like can be combined as appropriate. In addition, as long as it is permitted by law, the disclosure of all documents cited in the above-described embodiments and the like is incorporated as a part of the description of the text.

  In the above-described example, the example in which the number of brushes 6 is one has been described, but a plurality of brushes 6 may be provided. For example, the brushes 6 shown in FIG. 1 and the like may be provided in two rows side by side in the X direction. In the above-described example, the example of the configuration in which the brush 6 moves between the contact position P1 and the retracted position P2 by rotating with respect to the carriage 5 has been described. However, the configuration for moving the brush 6 is limited to this. For example, the brush 6 may move in the vertical direction (up and down direction) to move between the contact position P1 and the retreat position P2 that retreats from the contact position P1.

DESCRIPTION OF SYMBOLS 1 ... Laser processing apparatus SYS ... Plate material processing system 2 ... Pallet 4 ... Laser head 5 ... Carriage 6 ... Brush 7 ... Conveying device 8 ... Control part G ... Assist gas L ... Laser beam S ... Slag W ... Work Wa ... Product 30 ... Transfer device 31 ... Processing device 38 ... Processing tool

Claims (9)

A pallet on which a plate-shaped workpiece is placed;
A laser head for irradiating the workpiece placed on the pallet with a laser beam;
A carriage that is disposed above the workpiece, moves relative to the workpiece placed on the pallet, supports the laser head, and moves the laser head at least horizontally relative to the workpiece;
A brush suspended from the carriage and in contact with the surface of the workpiece;
A laser processing apparatus comprising: a control unit configured to move the brush while bringing the brush into contact with the surface of the laser processed workpiece; The carriage has a long shape that is long in an orthogonal direction orthogonal to the moving direction,
The laser head is movable along the longitudinal direction of the carriage;
The laser processing apparatus according to claim 1, wherein the brush is disposed along a longitudinal direction of the carriage.   The laser processing apparatus according to claim 2, wherein a length of the brush in the orthogonal direction is set corresponding to the rectangular workpiece having a maximum size that can be placed on the pallet.   The laser processing apparatus according to any one of claims 1 to 3, wherein the brush is movable between a position in contact with the surface of the workpiece and a position retracted from the surface of the workpiece.   The laser processing apparatus according to claim 4, wherein the brush rotates with respect to the carriage and moves between a position in contact with the surface of the workpiece and a position retracted from the surface of the workpiece.   6. The laser processing apparatus according to claim 4, wherein, at a position where the brush is retracted from the surface of the workpiece, a tip of the brush is separated from the laser head with respect to a position where the brush contacts the surface of the workpiece.   The laser processing apparatus according to claim 1, wherein the laser head irradiates the laser light while injecting an assist gas.   The laser processing apparatus according to any one of claims 1 to 7, further comprising a conveying device that carries the workpiece out of the pallet by sucking the surface of the workpiece. The laser processing apparatus according to any one of claims 1 to 8,
A transfer device for transferring the workpiece arranged in the laser processing device;
A plate material processing system comprising: a processing device having a processing tool for processing the workpiece while the workpiece is being transferred from the laser processing device by the transfer device.

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