JP2018160517A - Substrate processing apparatus, substrate processing system, and substrate processing method - Google Patents

Abstract

An object of the present invention is to suppress the generation of particles in a processing tank. A substrate processing apparatus for processing a substrate with a chemical solution supplied from a predetermined chemical solution supply source stores the chemical solution supplied from the chemical solution supply source and immerses the substrate in the chemical solution. a processing tank for performing a predetermined process on a substrate by means of a process, a discharging section for discharging the chemical liquid stored in the processing tank from the processing tank, and a discharge section for discharging the chemical liquid stored in the processing tank when the chemical liquid stored in the processing tank is replaced. and a determination unit that determines whether or not it is possible to supply the chemical solution from the chemical solution supply source before the discharge control unit causes the discharge unit to perform the discharge operation, wherein the chemical solution supply When the determination unit determines in the determination process that the chemical liquid can be supplied by the source, the discharge control unit causes the discharge unit to start the discharge operation. [Selection drawing] Fig. 3

Description

  The present invention includes a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a glass substrate for a photomask, a substrate for a solar cell, etc. The present invention relates to a substrate processing technique for performing processing on a substrate simply).

  Patent Document 1 includes a chemical processing unit that stores chemicals, stores lots, and performs processing with chemicals, and a transport unit that transports the lot between the delivery position of the inserted lots and the chemical processing unit. A substrate processing apparatus is shown. The apparatus instructs the chemical solution processing unit to replace the chemical solution in consideration of the time required for the chemical solution replacement and the lot transport time after a predetermined time from the lot injection, and the chemical solution processing unit starts the chemical solution exchange according to the instruction. . The apparatus is intended to prevent a lot processing failure by generating an alarm when the time from the chemical solution exchange to the start of lot processing exceeds an allowable time.

JP 2011-210315 A

  However, in the substrate processing apparatus of Patent Document 1, when the chemical solution processing unit is instructed to replace the chemical solution, the chemical solution processing unit starts the chemical solution exchange regardless of whether the chemical solution can be supplied to the chemical solution processing unit. For this reason, when supply of a chemical | medical solution is impossible, after chemical | medical solution is discharged | emitted from a chemical | medical solution processing part, time until new chemical | medical solution is supplied to a chemical | medical solution processing part becomes long. Thereby, there exists a problem that the chemical | medical solution adhering to the processing tank of a chemical | medical solution processing part dries, and a particle | grain generate | occur | produces.

  The present invention was made to solve these problems, and a substrate processing technique capable of suppressing the generation of particles in a processing tank when the chemical supply source cannot supply the chemical liquid when replacing the chemical stored in the processing tank. The purpose is to provide.

  In order to solve the above problem, a substrate processing apparatus according to a first aspect is a substrate processing apparatus that processes a substrate with a chemical solution supplied from a predetermined chemical solution supply source, and is supplied from the chemical solution supply source. A treatment tank for storing a chemical solution and immersing the substrate in the chemical solution to perform a predetermined process on the substrate; a discharge section for performing a discharge operation for discharging the chemical solution stored in the treatment tank from the treatment tank; A discharge control unit that causes the discharge unit to perform the discharge operation when the chemical solution stored in the processing tank is replaced; and before the discharge control unit causes the discharge unit to perform the discharge operation, A determination unit that performs a determination process for determining whether or not supply is possible, and when the determination unit determines in the determination process that the supply of the chemical solution by the chemical solution supply source is possible, Said Controller out to start the discharging operation to the discharging portion.

  The substrate processing apparatus which concerns on a 2nd aspect is a substrate processing apparatus which concerns on a 1st aspect, Comprising: By discharging | emitting the said chemical | medical solution stored in the said processing tank from the said processing tank, and returning it to the said processing tank again, A circulation system for circulating the chemical solution;

  The substrate processing apparatus which concerns on a 3rd aspect is a substrate processing apparatus which concerns on a 2nd aspect, Comprising: The said circulation system is provided with the filter which filters the said chemical | medical solution.

  The substrate processing apparatus which concerns on a 4th aspect is a substrate processing apparatus which concerns on the 2nd or 3rd aspect, Comprising: The said determination part determined in the said determination process that supply of the said chemical | medical solution by the said chemical | medical solution supply source is not possible In this case, the apparatus further includes a circulation control unit that causes the circulation system to circulate the chemical solution to the treatment tank.

  The substrate processing apparatus which concerns on a 5th aspect is a substrate processing apparatus which concerns on any one 1st-4th aspect, Comprising: The heater which heats the said chemical | medical solution is further provided.

  The substrate processing apparatus which concerns on a 6th aspect is a substrate processing apparatus which concerns on a 5th aspect, Comprising: When the said determination part determines in the said determination process that the said chemical | medical solution supply source cannot supply the said chemical | medical solution And a heating control unit for operating the heater.

  A substrate processing system according to a seventh aspect includes the substrate processing apparatus according to any one of the first to sixth aspects, and the chemical solution supply source.

  The substrate processing method which concerns on an 8th aspect is a substrate processing method which processes a board | substrate with the chemical | medical solution supplied from a predetermined | prescribed chemical | medical solution supply source, Comprising: The said chemical | medical solution is supplied from the processing tank which stores the chemical | medical solution supplied by the said chemical | medical solution supply source. A discharging step for discharging, and a determination step for determining, prior to the discharging step, whether or not the chemical liquid supply source can supply the chemical liquid when replacing the chemical liquid stored in the processing tank, The discharging step is a step of starting discharging the chemical liquid from the processing tank when it is determined in the determining step that the chemical liquid can be supplied from the chemical liquid supply source.

  The substrate processing method which concerns on a 9th aspect is a substrate processing method which concerns on an 8th aspect, Comprising: When it determines in the said determination step that the supply of the said chemical | medical solution by the said chemical | medical solution supply source is not possible, the said processing tank A circulation step is further provided for circulating the chemical solution to the.

  A substrate processing method according to a tenth aspect is the substrate processing method according to the eighth or ninth aspect, wherein when it is determined in the determination step that the chemical liquid cannot be supplied by the chemical liquid supply source, The method further includes a heating step of heating the chemical solution.

  According to the first aspect of the invention, the determination unit performs a determination process for determining whether or not the chemical liquid supply source can supply the chemical before the discharge control unit causes the discharge unit to perform the discharging operation. When the determination unit determines in the determination process that the chemical solution can be supplied from the chemical solution supply source, the discharge control unit causes the discharge unit to start the discharge operation. Therefore, when the chemical solution supply source cannot supply the chemical solution, the discharge unit does not start the discharge operation, and the chemical solution adhering to the treatment tank can be prevented from being exposed for a long time, so that generation of particles in the treatment tank can be suppressed.

  According to the fourth aspect of the invention, the circulation control unit causes the circulation system to circulate the chemical solution to the treatment tank when it is determined that the chemical solution cannot be supplied from the chemical solution supply source in the determination process. Therefore, the uniformity of the chemical solution in the treatment tank can be improved even during a period in which the chemical solution supply source cannot supply the chemical solution.

  According to the sixth aspect of the invention, when the determination unit determines that the chemical solution cannot be supplied from the chemical supply source in the determination process, the heating control unit operates the heater. Therefore, the chemical solution in the treatment tank can be heated even during a period in which the chemical solution supply source cannot supply the chemical solution. Thereby, the increase in the viscosity of a chemical | medical solution can be suppressed.

  According to the eighth aspect of the invention, the determination step is executed before starting the exchange of the chemical solution stored in the processing tank. In the determination step, when it is determined that the chemical liquid can be supplied from the chemical liquid supply source, the discharge step is executed, and the discharge of the chemical liquid from the processing tank is started. Therefore, when the chemical solution supply source cannot supply the chemical solution, the discharge of the chemical solution from the processing tank is not started. Thereby, since it can suppress that the chemical | medical solution adhering to the processing tank is exposed over a long time, generation | occurrence | production of the particle in a processing tank can be suppressed.

  According to the ninth aspect of the present invention, when it is determined in the determination step that the chemical liquid cannot be supplied from the chemical liquid supply source, the circulation step is executed to circulate the chemical liquid to the treatment tank. Therefore, the uniformity of the chemical solution in the treatment tank can be improved even during a period in which the chemical solution supply source cannot supply the chemical solution.

  According to the tenth aspect of the present invention, when it is determined in the determination step that the chemical liquid cannot be supplied from the chemical liquid supply source, the heating step is executed to heat the chemical liquid. Therefore, the chemical solution in the treatment tank can be heated even during a period in which the chemical solution supply source cannot supply the chemical solution. Thereby, the increase in the viscosity of a chemical | medical solution can be suppressed.

It is a top view which shows an example of schematic structure of the substrate processing system provided with the substrate processing apparatus which concerns on embodiment. It is a block diagram which shows an example of schematic structure of the substrate processing system of FIG. It is a schematic diagram which shows an example of schematic structure of the substrate processing system of FIG. It is a block diagram which shows an example of schematic structure of the process liquid supply source of FIG. 3 is a time chart showing an example of a chemical solution exchange operation of the substrate processing apparatus of FIG. 1. 3 is a flowchart showing an example of a chemical processing operation of the substrate processing apparatus of FIG. 1. It is a flowchart which shows an example of the operation | movement which concerns on replacement | exchange of the chemical | medical solution of FIG.

  Hereinafter, embodiments will be described with reference to the drawings. The following embodiment is an example embodying the present invention, and is not an example of limiting the technical scope of the present invention.

<1. Configuration of Substrate Processing Apparatus 1 (Substrate Processing System 100)>
FIG. 1 is a plan view illustrating an example of a schematic configuration of a substrate processing system 100 including a substrate processing apparatus 1 according to the embodiment. FIG. 2 is a block diagram illustrating an example of a schematic configuration of the substrate processing system 100.

  The substrate processing system 100 is, for example, an apparatus for performing chemical liquid processing, pure water cleaning processing, and drying processing on the substrate W. The substrate processing system 100 includes a substrate processing apparatus 1 and a chemical solution supply source 65 that supplies a chemical solution to the substrate processing apparatus 1 via a supply pipe 67. The substrate processing apparatus 1 includes an input unit 3, a dispensing unit 7, a first transport mechanism CTC, a second transport mechanism WTR, a drying processing unit LPD, a first processing unit 19, and a second processing unit 21. Contains. The detailed structure of the chemical solution supply source 65 will be described later.

  The input unit 3 includes two mounting tables 5 for mounting the cassette 2. On the mounting table 5, the cassette 2 in which the unprocessed substrates W are stored is mounted. The cassette 2 stores a plurality of sheets (for example, 25 sheets) in a horizontal posture. For example, a plurality of substrates W in the cassette 2 are handled as one lot which is a unit of processing in the substrate processing apparatus 1. However, even a single substrate W may be accommodated in the cassette 2 and handled as one lot.

  A payout unit 7 is provided at a position adjacent to the input unit 3. The payout unit 7 includes two mounting tables 9 for mounting the cassette 2. The substrate W that has been subjected to the substrate processing by the substrate processing apparatus 1 is accommodated in the cassette 2 on the mounting table 9. When one lot of substrates W is stored in the cassette 2, the cassette 2 is discharged from the mounting table 9 to the outside of the substrate processing apparatus 1 by a cassette transport robot (not shown).

  A first transport mechanism CTC configured to be movable between them is disposed at a position along the input unit 3 and the payout unit 7. The first transport mechanism CTC takes out the lot stored in the cassette 2 placed on the input unit 3 and then transports the lot to the second transport mechanism WTR. The first transport mechanism CTC stores the lot in the cassette 2 after receiving the processed lot from the second transport mechanism WTR. The second transport mechanism WTR is movable in the longitudinal direction of the substrate processing apparatus 1. The first transport mechanism CTC counts the number of substrates W stored in the cassette 2 when the substrates W are unloaded from the cassette 2. In other words, the first transport mechanism CTC recognizes the lot and recognizes the number of substrates W constituting the lot. The count value obtained by the first transport mechanism CTC is transmitted to the control unit 25 and used when determining whether or not the replacement timing of the chemical stored in the processing tank 41 has arrived. In the above, the number of lots or the number of substrates W put into the substrate processing apparatus 1 is counted by the first transport mechanism CTC, but is counted by an element other than the first transport mechanism CTC, for example, the second substrate transport mechanism WTR. You may do it.

  A drying processing unit LPD for storing and drying a plurality of substrates W in a low-pressure chamber is provided on the foremost side in the moving direction of the second transport mechanism WTR when transporting the unprocessed substrate W. . The drying processing unit LPD accommodates the lot in a low-pressure chamber and dries it.

  A first processing unit 19 is disposed adjacent to the drying processing unit LPD and on the opposite side of the first transport mechanism CTC across the drying processing unit LPD. The first processing unit 19 includes a pure water cleaning processing unit ONB1 and a chemical processing unit CHB1. The pure water cleaning processing unit ONB1 performs pure water cleaning processing on the lot. The chemical processing unit CHB1 performs chemical processing on the lot. In addition, the first processing unit includes a sub-transport mechanism LFS1. The sub transport mechanism LFS1 delivers a lot to and from the second transport mechanism WTR and can be raised and lowered only at the positions of the pure water cleaning processing unit ONB1 and the chemical solution processing unit CHB1.

  A second processing unit 21 is disposed at a position adjacent to the first processing unit 19. The second processing unit 21 has the same configuration as the first processing unit 19 described above. That is, the second processing unit 21 includes a pure water cleaning processing unit ONB2, a chemical processing unit CHB2, and a sub-transport mechanism LFS2.

  The first transport mechanism CTC, the second transport mechanism WTR, the sub transport mechanisms LFS1, and LFS2 are substrate transport mechanisms 6 that transport the substrate W (lot).

  An instruction unit 23 is attached to the side surface of the mounting table 5. The instruction unit 23 is operated by an operator of the apparatus. The operator operates the instruction unit 23 to instruct a recipe number for associating, for example, a recipe that defines a procedure for processing a lot with a lot of the cassette 2 placed on the placement table 5.

  The substrate processing system 100 configured as described above is comprehensively controlled by the control unit 25 as shown in the block diagram of FIG.

  The control unit 25 includes a CPU and a scheduling unit (not shown). A memory 31 is electrically connected to the control unit 25. The memory 31 stores a program PG1 for creating a schedule, the created schedule, a program PG2 for executing the schedule, and the like. The program PG1 for creating a schedule defines at what timing the lot is transported to each processing unit based on the recipe instructed by the instruction unit 23. The CPU of the control unit 25 also operates as the discharge control unit 26, the determination unit 27, the circulation control unit 28, and the heating control unit 29 by executing the program PG2.

  In addition, the memory 31 has, for example, a “life count” that defines the number of substrates W to be processed and the number of lots that are allowed to be processed by the chemical stored in the processing tank 41, and a newly generated chemical. “Lifetime” that defines the period during which the chemical solution can be used is further stored. The lifetime and the life count are determined in advance by experiments or the like. As the life count, a life count used for partial liquid replacement described later and a life count used for all liquid replacement described later may be stored in the memory 31.

  The discharge control unit 26 causes the discharge unit 84 described later to perform a discharge operation when replacing the chemical solution stored in the treatment tank 41 of the chemical solution processing unit CHB1 (CHB2). The determination unit 27 executes determination processing for determining whether or not the chemical solution supply source 65 can supply the chemical solution before the discharge control unit 26 causes the discharge unit 84 to perform the discharge operation. When it is determined that the chemical solution supply source 65 can supply the chemical solution, the discharge control unit 26 causes the discharge unit 84 to start the discharge operation.

  When the determination unit 27 determines in the determination process that the chemical solution supply source 65 cannot supply the chemical solution, the circulation control unit 28 causes the circulation system 52 described later to circulate the chemical solution to the processing tank 41.

  In addition, a notification unit 33 is electrically connected to the control unit 25. The notification unit 33 is, for example, a lamp that notifies by emitting light, or a buzzer or speaker that notifies by sound. When a predetermined waiting time elapses while the chemical solution supply source 65 performs the above determination process, the notification unit 33 notifies the waiting time by light emission or sound.

  FIG. 3 is a schematic diagram illustrating an example of a schematic configuration of the substrate processing system 100. The substrate processing system 100 includes a substrate processing apparatus 1 and a chemical supply source 65. The chemical solution supply source 65 is a device provided outside the substrate processing apparatus 1 and supplies a chemical solution to the substrate processing apparatus 1 from the outside of the substrate processing apparatus 1. The substrate processing apparatus 1 processes the substrate W with the chemical solution supplied from the chemical solution supply source 65. In the substrate processing system 100, the chemical solution supply source 65 is arranged outside the substrate processing apparatus 1, but the chemical solution supply source 65 may be arranged inside the substrate processing apparatus 1.

  The substrate processing apparatus 1 includes a chemical processing unit CHB1 (CHB2), a control unit 25, and a memory 31. The chemical solution processing unit CHB1 (CHB2) includes a processing tank 41 and a holding arm 47. The processing tank 41 stores a chemical solution supplied by the chemical solution supply source 65 and performs a predetermined process by immersing the substrate W in this chemical solution. The processing tank 41 includes an inner tank 43 and an outer tank 45 that recovers the chemical liquid overflowing from the inner tank 43. The holding arm 47 abuts and supports the plurality of substrates W constituting the lot in an upright posture. The holding arm 47 is configured to be movable up and down, and raises and lowers the supported substrate W between a processing position in the inner tank 43 and a standby position above the inner tank 43. The sub-transport mechanism LFS1 (LFS2) described above includes the holding arm 47.

  The chemical processing unit CHB1 (CHB2) further includes a circulation system 52 and a discharge unit 84. The circulation system 52 is configured to circulate the chemical liquid by discharging the chemical liquid stored in the processing tank 41 from the processing tank 41 and returning it to the processing tank 41 again through the circulation pipe 53. The discharge unit 84 is configured to perform a discharge operation for discharging the chemical stored in the processing tank 41 from the processing tank 41.

  The inner tank 43 of the processing tank 41 includes a pair of ejection pipes 49 for supplying a chemical solution at the bottom. Moreover, the outer tank 45 is equipped with the discharge port 51 for discharging | emitting the collect | recovered chemical | medical solution in the bottom part. The ejection pipe 49 and the discharge port 51 are connected in communication by a circulation pipe 53. In this circulation pipe 53, a pump 55, a heater 57, and a filter 59 are disposed in order from the discharge port 51 side. The chemical liquid overflowing from the inner tank 43 to the outer tank 45 is guided to the circulation pipe 53 from the discharge port 51 by the operation of the pump 55, and flows into the inner tank 43 from the pair of ejection pipes 49 through the circulation pipe 53. Thereby, the chemical | medical solution in the processing tank 41 circulates in the processing tank 41 again from the pair of jet pipes 49 through the circulation pipe 53 from the discharge port 51. The circulation system 52 includes a discharge port 51, a circulation pipe 53, a pair of ejection pipes 49, and a pump 55.

  For example, the heater 57 has a function of heating the chemical solution flowing through the circulation pipe 53, and heats the chemical solution to a temperature within a predetermined range (for example, 120 to 180 ° C.) under the control of the heating control unit 29. The filter 59 has a function of removing particles and the like in the chemical solution by filtering the chemical solution flowing through the circulation pipe 53. In the circulation pipe 53, an opening / closing valve 61 is disposed between the discharge port 51 and the pump 55, and an opening / closing valve 63 is disposed between the pump 55 and the heater 57.

  One end of a supply pipe 67 is connected to the chemical solution supply source 65 in communication. The supply pipe 67 is provided with a control valve 69 capable of controlling the flow rate. The other end side of the supply pipe 67 is connected to a nozzle 71 provided in the upper part of the outer tub 45. The nozzle 71 includes a discharge port that faces the outer tub 45. The chemical liquid supplied from the chemical liquid supply source 65 is supplied from the nozzle 71 to the outer tank 45 through the supply pipe 67 at a flow rate determined by the opening degree of the control valve 69.

  In the circulation pipe 53 described above, a branch portion 73 is disposed between the pump 55 and the on-off valve 63. A portion upstream of the branching portion 73 in the circulation pipe 53 is also used for a purpose of discharging the chemical solution in the outer tank 45. In addition, a bottom discharge port 75 used for discharging the chemical solution in the inner tank 43 is formed at the bottom of the inner tank 43. The bottom discharge port 75 and a part of the circulation pipe 53 on the upstream side of the pump 55 are connected in communication by a bottom discharge pipe 77. The bottom discharge pipe 77 is provided with an on-off valve 79. The branch portion 73 is provided with a drainage pipe 81 for guiding the chemical solution flowing through the circulation pipe 53 to a waste liquid tank or the like. The drainage pipe 81 is provided with an on-off valve 83.

  When the chemical liquid in the processing tank 41 is discharged, the chemical liquid in the outer tank 45, the chemical liquid in the inner tank 43, and the chemical liquid remaining in the circulation pipe 53 are discharged in this order. When the on-off valve 63 is closed and the on-off valve 61 and the on-off valve 83 are opened, the pump 55 is operated, so that the chemical solution in the outer tub 45 passes through the discharge port 51, the circulation pipe 53, and the drain pipe 81. Is discharged through. By operating the pump 55 with the on-off valve 63 closed and the on-off valve 79 and the on-off valve 83 open, the chemical liquid in the inner tank 43 flows into the bottom outlet 75, the bottom outlet 77, and the circulation pipe 53. The liquid is discharged through the drain pipe 81. In addition, a portion of the circulation pipe 53 that is closer to the pair of jet pipes 49 (downstream side) than the branch part 73 is inclined so that the pair of jet pipes 49 are located above the branch part 73. Accordingly, the chemical liquid remaining in the circulation pipe 53 is discharged through the drain pipe 81 by the action of gravity when the on-off valve 63 and the on-off valve 83 are opened to stop the pump 55. The discharge part 84 includes a discharge port 51, a circulation pipe 53, a bottom discharge port 75, a bottom discharge pipe 77, a drain pipe 81, and a pump 55.

  Each structure mentioned above is controlled by the control part 25 centralizedly. For example, the control unit 25 operates the on-off valve 83, the control valve 69, the chemical liquid supply source 65, and the like based on at least one of the life count and the lifetime stored in the memory 31 to change all liquids or partially liquid. Exchange.

  In the partial liquid exchange, for example, after the number of processed substrates W (or the number of processed lots) reaches the life count for partial liquid exchange, a predetermined amount of chemical liquid corresponding to a part of the chemical liquid in the processing tank 41 is drained. In this process, the new chemical liquid corresponding to the predetermined amount is supplied from the nozzle 71 to the processing tank 41 while being discharged from the nozzle 81.

  For example, after the chemical solution is generated and supplied into the treatment tank 41, the total liquid replacement is performed after the usage period of the chemical solution reaches the lifetime, and then a predetermined amount of the chemical solution corresponding to the total amount of the chemical solution in the treatment tank 41 is drained. In this process, the liquid is discharged from the pipe 81 and a new chemical solution corresponding to the predetermined amount is supplied from the nozzle 71 to the processing tank 41.

  FIG. 4 is a block diagram showing an example of a schematic configuration of the chemical solution supply source 65. The chemical solution supply source 65 mainly includes a sulfuric acid electrolysis tank 101, an anolyte tank 106, a catholyte tank 114, and a control unit 130 that performs overall control of the operation of each unit of the chemical solution supply source 65. The control unit 130 is configured by, for example, a general computer.

  The sulfuric acid electrolytic cell 101 is partitioned into an anode chamber 104 and a cathode chamber 112 by a diaphragm 102, a conductive diamond anode 103 is provided in the anode chamber 104, and a cathode 111 is provided in the cathode chamber 112. An anolyte tank 106 is provided outside the sulfuric acid electrolysis tank 101.

  First, 98% by mass of concentrated sulfuric acid and ultrapure water are supplied from a concentrated sulfuric acid supply line (not shown) and an ultrapure water supply source (not shown) from the concentrated sulfuric acid supply line 124 and the ultrapure water supply line 125 according to the control of the control unit 130. Pure water is supplied respectively. Thereby, in the anolyte tank 106, the 1st sulfuric acid solution with a density | concentration of 70 mass% or less is created. When the concentration of the first sulfuric acid solution is 70% by mass or less, the current efficiency is 40% or more, and efficient electrolysis can be performed.

  The first sulfuric acid solution is supplied into the anode chamber 104 via an anolyte supply line 109 that connects the anolyte tank 106 and the anode chamber 104. More specifically, the anolyte supply line 109 is provided with an anolyte circulation pump 105 and an anode chamber valve 119. The control unit 130 operates the anolyte circulation pump 105 and opens the anode chamber valve 119. As a result, the first sulfuric acid solution is supplied from the anolyte tank 106 to the anode chamber 104 as the anolyte.

  The first sulfuric acid solution supplied into the anode chamber 104 is subjected to electrolysis to generate first electrolytic sulfuric acid containing an oxidizing substance. Electrolytic sulfuric acid refers to an electrolytic product obtained by electrolyzing sulfuric acid. In addition to sulfuric acid added as an electrolytic solution, oxidizing substances produced by electrolysis of peroxomonosulfuric acid, peroxodisulfuric acid, ozone, hydrogen peroxide, etc. It is a thing including. In addition, peroxomonosulfuric acid and peroxodisulfuric acid are collectively referred to as persulfuric acid.

  The anolyte chamber 104 and the anolyte tank 106 are also connected by an anolyte circulation line 110. By the operation of the anolyte circulation pump 105, the first electrolytic sulfuric acid and the anode gas are circulated between the anode chamber 104 and the anolyte tank 106 through the anolyte supply line 109 and the anolyte circulation line 110. For this reason, the 1st electrolytic sulfuric acid containing the produced | generated oxidizing substance is fully stirred. The anode gas is gas-liquid separated in the anolyte tank 106 and discharged from the anode gas exhaust line 107 to the outside of the chemical liquid supply source 65.

  A concentrated sulfuric acid supply line (not shown) is also connected to the catholyte tank 114 by a concentrated sulfuric acid supply line (not shown), and an ultrapure water supply source (not shown) is connected by an ultrapure water supply line (not shown). Are connected. Under the control of the control unit 130, 98% by mass of concentrated sulfuric acid and ultrapure water are respectively supplied from the concentrated sulfuric acid supply source and the ultrapure water supply source. As a result, a sulfuric acid solution having the same concentration as the first sulfuric acid solution supplied into the anode chamber 104 is prepared in the catholyte tank 114. The catholyte supply line 118 connects the cathode chamber 112 and the catholyte tank 114. The catholyte supply line 118 is provided with a catholyte circulation pump 113. When the control unit 130 operates the anolyte circulation pump 105, the catholyte composed of the sulfuric acid solution prepared in the catholyte tank 114 is transferred from the catholyte tank 114 to the cathode chamber 112 via the catholyte supply line 118. Supplied.

  After being subjected to electrolysis, the catholyte is circulated between the cathode chamber 112 and the catholyte tank 114 through the catholyte supply line 118 and the catholyte circulation line 117 together with the generated cathode gas. This circulation is performed by operating the catholyte circulation pump 113. The cathode gas is gas-liquid separated in the catholyte tank 114 and discharged from the cathode gas exhaust line 115 to the outside of the chemical liquid supply source 65. The anolyte supply line 109 is provided with a pressure flow meter 108 that detects the pressure and flow rate of the anolyte, and the catholyte supply line 118 is provided with a pressure flow meter 116 that detects the pressure and flow rate of the anolyte. It has been.

  Next, under the control of the control unit 130, 98% by mass of concentrated sulfuric acid is added into the anolyte tank 106 to prepare a second sulfuric acid solution having a concentration higher than that of the first sulfuric acid solution. The concentration of the second sulfuric acid solution is preferably adjusted to 80% by mass or more in the anolyte tank 106. The second sulfuric acid solution is supplied into the anode chamber 104 of the sulfuric acid electrolysis tank 101 via the anolyte supply line 109, mixed with the first electrolytic sulfuric acid, and used for electrolysis. Thereby, the 2nd electrolytic sulfuric acid containing an oxidizing substance is generated. The generated second electrolytic sulfuric acid and anode gas are circulated between the anode chamber 104 and the anolyte tank 106 via the anolyte supply line 109 and the anolyte circulation line 110 when the anolyte circulation pump 105 is operated. . For this reason, the 2nd electrolytic sulfuric acid containing the produced | generated oxidizing substance is fully stirred.

  Resist stripping performance by electrolytic sulfuric acid is good at sulfuric acid concentration of 80% by mass or more. At sulfuric acid concentration below this level, stripping performance is not high even if the oxidizing substance concentration is high, and it takes a long time to strip the resist. become.

  In addition, the second electrolytic sulfuric acid containing the oxidizing substance generated as described above is sufficiently stirred, so that it becomes a uniform chemical solution (“cleaning solution”). Note that the concentration of the sulfuric acid solution supplied to the cathode chamber 112 is desirably the same as that of the first sulfuric acid solution supplied to the anode chamber 104. A supply pipe 67 is connected to the anolyte supply line 109, and a chemical liquid supply valve 120 is provided in the supply pipe 67.

  The chemical supply source 65 cannot immediately generate the second electrolytic sulfuric acid in an amount that can be supplied to the chemical treatment unit CHB1 (CHB2). Therefore, the chemical solution supply source 65 is configured to notify whether or not the second electrolytic sulfuric acid, that is, the chemical solution can be supplied to the chemical solution processing unit CHB1 (CHB2). Specifically, for example, the control unit 130 can supply the chemical solution (second electrolytic sulfuric acid) to the substrate processing apparatus 1 when a predetermined time has elapsed since the start of the second electrolytic sulfuric acid generation process. The signal 92 indicating that the chemical solution can be supplied is supplied to the control unit 25 of the control unit 130. The signal 92 is set to a value (for example, “High” level) indicating that the chemical liquid can be supplied. When the second electrolytic sulfuric acid cannot be supplied to the substrate processing apparatus 1, the control unit 130 supplies the control unit 25 with a signal 91 indicating that the chemical solution cannot be supplied. The signal 91 is set to a value (for example, “Low” level) indicating that the chemical solution cannot be supplied.

  As a method for determining whether or not the second electrolytic sulfuric acid can be supplied to the substrate processing apparatus 1 by the control unit 130, a method other than the determination method based on the processing time described above may be employed. For example, a branch line that branches from the anolyte supply line 109 and joins the anolyte supply line 109 again is provided, and a concentration sensor that measures the concentration of the second electrolytic sulfuric acid oxidizing substance is provided in the branch line. Whether or not the second electrolytic sulfuric acid can be supplied may be determined based on the concentration of the oxidizing substance measured by the concentration sensor. As such a concentration sensor, for example, an oxidant concentration monitoring device disclosed in Japanese Patent No. 6024936 can be employed. Further, for example, a thermometer is provided in the anolyte supply line 109, the temperature of the second electrolytic sulfuric acid is measured with the thermometer, and the control unit 130 determines the second based on the concentration and temperature of the second electrolytic sulfuric acid. It may be determined whether or not the electrolytic sulfuric acid can be supplied.

  Further, the chemical solution supply source 65 further includes, for example, a storage tank having a capacity capable of supplying a sufficient amount of the chemical solution to the processing tank 41 of the substrate processing apparatus 1, and stores the generated second electrolytic sulfuric acid in the storage tank, The control unit 130 may determine whether or not the chemical solution can be supplied depending on whether or not the second electrolytic sulfuric acid having a predetermined capacity has accumulated in the storage tank.

  If the control unit 130 of the chemical solution supply source 65 receives the signal 95 instructing the start of the supply of the second electrolytic sulfuric acid (chemical solution) from the control unit 25 of the substrate processing apparatus 1, if the chemical solution can be supplied, Open the supply valve 120. Thereby, the chemical solution is supplied to the substrate processing apparatus 1 via the anode chamber valve 119, the chemical solution supply valve 120, and the supply pipe 67.

  When receiving a signal 96 for instructing to stop the supply of the second electrolytic sulfuric acid (chemical solution) from the control unit 25 of the substrate processing apparatus 1, the control unit 130 closes the chemical solution supply valve 120. Thereby, the supply of the chemical solution from the chemical solution supply source 65 to the substrate processing apparatus 1 is stopped.

The chemical solution supply source 65 supplies electrolytic sulfuric acid as a chemical solution, but the chemical solution supply source 65 may supply another chemical solution. For example, a chemical solution supply source 65 that adjusts and supplies a phosphoric acid solution containing phosphoric acid (H ₃ PO ₄ ) and pure water as the chemical solution may be employed. Even in this case, the chemical solution supply source 65 is configured to notify the control unit 25 of the substrate processing apparatus 1 by a signal or the like whether or not the chemical solution can be supplied.

<2. Chemical Solution Processing Operation of Substrate Processing Apparatus 1>
FIG. 5 is a time chart showing an example of the chemical solution exchange operation of the substrate processing apparatus 1 (substrate processing system 100). FIG. 6 is a flowchart illustrating an example of a chemical solution processing operation of the substrate processing apparatus 1 (substrate processing system 100). FIG. 7 is a flowchart showing an example of the chemical solution replacement operation. The chemical processing operation of the substrate processing apparatus 1 (substrate processing system 100) will be described with reference to FIGS.

  Here, the chemical solution is discharged in advance with the replacement of all the liquids, and the processing tank 41 is empty, and the chemical solution supply source 65 is in a state in which the chemical solution can be supplied to the processing tank 41 of the substrate processing apparatus 1. Suppose that

  First, the substrate processing apparatus 1 performs the charging of the chemical into the empty processing tank 41 and the temperature adjustment of the charged chemical (Step S10 in FIG. 6). More specifically, the control unit 25 closes the on-off valves 79 and 83 and opens the on-off valves 61 and 63 to transmit a signal 95 for starting supply of the chemical liquid to the control unit 130 of the chemical liquid supply source 65. When receiving the chemical liquid supply source 65, the control unit 130 opens the chemical liquid supply valve 120 and supplies the chemical liquid to the substrate processing apparatus 1. The control unit 25 controls the control valve 69 to adjust the flow rate of the chemical solution flowing through the supply pipe 67 to a predetermined flow rate. The chemical liquid is supplied from the nozzle 71 to the inner tank 43, overflows into the outer tank 45 when filling the inner tank 43, and flows into the circulation pipe 53 from the discharge port 51. After the chemical liquid overflows from the inner tank 43 to the outer tank 45, the circulation control unit 28 operates the pump 55 to start circulation of the chemical liquid in the processing tank 41, and the heating control unit 29 controls the heater 57. The chemical solution is heated to a predetermined temperature.

  For example, the control unit 25 performs processing by comparing the number of lots processed by the chemical processing unit CHB1 (CHB2) with the life count for partial liquid replacement and the life count for total liquid replacement stored in the memory 31. It is determined whether or not the chemical solution in the tank 41 needs to be replaced (step S20). As a result of the determination in step S20, when the chemical solution replacement is not necessary, the control unit 25 puts a plurality of lots of substrates W into the holding tank 47 of the sub-transport mechanism LFS1 (LFS2) into the inner tank 43 (to the processing position). Each substrate W is treated with the chemical solution by immersing each substrate W in the chemical solution for a predetermined time (step S30). Thereafter, the control unit 25 causes the sub-transport mechanism LFS1 (LFS2) of the substrate transport mechanism 6 to unload each substrate W from the inner tank 43 (step S40), and transports and stores each substrate W to the cassette 2 by the substrate transport mechanism 6. To do. And the control part 25 determines whether the process of all the lots was complete | finished (step S50).

  If the processing of all lots is completed as a result of the determination in step S50, the substrate processing apparatus 1 ends the chemical processing operation. As a result of the determination, when the processing of all the lots is not completed, the unprocessed lot is transferred from the cassette 2 to the chemical solution processing unit CHB1 (CHB2), and the determination in step S20 and steps S30 to S40 are performed. This process is repeated, and the determination in step S50 is performed again.

  As a result of the determination in step S20, when the chemical solution needs to be replaced, the determination unit 27 of the control unit 25 starts a process of waiting for the chemical liquid supply source 65 to be able to supply the chemical liquid ("waiting process"). (Step S60 in FIG. 6). The first transport mechanism CTC holds a count value for total liquid exchange and a count value for partial liquid exchange as the number of processed substrates W (or the number of lots), depending on the type of liquid exchange to be performed. Reset the counted value. The discharge of the chemical solution from the processing tank 41 is preferably started so that the lot transportation schedule is observed and the time until the processing target lot is carried into the processing tank 41 does not become long after the chemical solution replacement is completed. . Accordingly, the determination unit 27 starts the waiting process in consideration of the time required for the chemical exchange and the lot transport time. In the example of FIG. 5, the determination unit 27 starts the waiting process at time t2 after time t1 when the chemical solution needs to be replaced. In the example of FIG. 5, the chemical solution can be supplied from the chemical solution supply source 65 at time t3, and immediately after that, drainage from the processing tank 41 is started. For example, time t1 when the chemical solution needs to be replaced Alternatively, the determination unit 27 may start waiting processing. The discharge control unit 26 may cause the discharge unit 84 to start discharging the chemical solution after a while after the determination unit 27 determines that the chemical solution supply source 65 can supply the chemical solution.

  The circulation control unit 28 causes the circulation system 52 to maintain the circulation operation of the chemical solution, and the heating control unit 29 causes the heater 57 to heat the chemical solution to a predetermined temperature and maintain the temperature adjustment operation of the chemical solution (step S70 in FIG. 6). ). In general, when the temperature of the chemical solution decreases, the viscosity increases, and the time required for discharging from the treatment tank 41 increases. If the temperature of the chemical liquid is adjusted while waiting for the chemical liquid supply source 65 to be able to supply the chemical liquid, the chemical liquid supply source 65 can supply the chemical liquid and the chemical liquid is discharged from the processing tank 41. The required time can be shortened. Moreover, the time required for the temperature adjustment of the new chemical | medical solution replaced | exchanged can be shortened when the processing tank 41 is warmed by the chemical | medical solution by which the temperature adjustment was carried out. From the viewpoint of energy saving, the circulation of the chemical solution and the temperature adjustment may be stopped while waiting for the chemical solution supply source 65 to be able to supply the chemical solution.

  Next, the control unit 25 determines whether or not a predetermined waiting time has elapsed (step S80). Here, the substrate transport mechanism 6 transports a lot according to a schedule (transport schedule) created by a scheduling unit (not shown). The waiting time in step S80 is set to a time during which the lot can be transported according to the schedule. When the waiting time elapses, the substrate transfer mechanism 6 cannot transfer according to the schedule. For this reason, when the waiting time has passed as a result of the determination in step S80, the control unit 25 notifies the notifying unit 33 that the waiting time has passed, that is, a failure has occurred (step S86). .

  If the waiting time has not elapsed as a result of the determination in step S80, the determination unit 27 determines whether or not the chemical solution supply source 65 can supply the chemical solution, that is, the chemical solution supply source 65 is the chemical solution. Is waiting to be supplied (step S90). In the example of FIG. 5, the determination unit 27 starts the determination in step S90 at time t2. When the chemical solution supply source 65 cannot supply the chemical solution, the control unit 130 outputs a signal 91 (period before time t3 in FIG. 5). In step S90, the control unit 25 determines that the chemical solution supply source 65 cannot supply the chemical solution based on the signal 91. The control unit 25 repeats the determination process in step S80, and the determination unit 27 determines in step S90. Repeat the process.

  When the chemical solution can be supplied from the chemical solution supply source 65, the control unit 130 outputs a signal 92 to the determination unit 27 of the control unit 25 (period after time t3 in FIG. 5). When the determination unit 27 receives the signal 92, the determination unit 27 determines that the chemical solution supply source 65 can supply the chemical solution ("Yes" in step S90), and proceeds from step S90 to step S100. On the other hand, if “No” is determined in step S90, the process proceeds to step S80. In step S100, the control unit 25 causes the substrate processing apparatus 1 and the chemical liquid supply source 65 to exchange chemicals. In this way, when the chemical solution is replaced, if it is confirmed that the chemical solution can be supplied from the chemical solution supply source 65 and the chemical solution in the processing tank 41 is discharged, a new one is immediately added to the processing tank 41 after the drainage is completed. A chemical solution can be supplied. Thereby, it can suppress that the inner wall of the processing tank 41 is exposed for a long time, and the chemical | medical solution adhering to the exposed inner wall dries and a particle | grain is generated. In the total liquid replacement, the chemical solution in the circulation pipe 53 provided with the filter 59 is also discharged by the discharge unit 84. However, in the substrate processing apparatus 1, after the drainage is completed, a new chemical solution is supplied to the processing tank 41. Since the time until it is put in can be shortened, the filter 59 can be prevented from drying.

  In the chemical solution replacement process, the circulation control unit 28 stops the pump 55 of the circulation system 52 to stop the circulation of the chemical solution in the processing tank 41, and the heating control unit 29 causes the heater 57 to stop the heating of the chemical solution. Thus, the temperature adjustment of the chemical solution is stopped (step S110 in FIG. 7).

  When the chemical solution is exchanged, the control unit 25 of the substrate processing apparatus 1 determines, for example, whether to perform the total solution exchange or the partial solution exchange based on the number of processed lots. Specifically, for example, when the substrate processing apparatus 1 has processed 3 lots, the control unit 25 determines to perform partial liquid replacement, and when the substrate processing apparatus 1 has processed 10 lots, the control is performed. The unit 25 determines that all liquid replacement is performed.

  When the control unit 25 determines to perform the partial liquid replacement process, the discharge control unit 26 discharges a predetermined amount of chemical solution corresponding to the amount of a part of the chemical solution in the processing tank 41 from the processing tank 41 to the discharge unit 84. When the control unit 25 determines that the entire liquid replacement is performed, the discharge control unit 26 supplies the discharge unit 84 with a predetermined amount of chemical solution corresponding to the amount of all the chemical solutions in the processing tank 41. (Step S120 in FIG. 7). In the case of all liquid replacement, the substrate processing apparatus 1 discharges the chemical liquid remaining in the circulation pipe 53 after discharging all the chemical liquid in the processing tank 41. In the example of FIG. 5, the chemical solution supply source 65 can supply the chemical solution at time t <b> 3, and then the discharge control unit 26 causes the discharge unit 84 to exchange a predetermined amount of the chemical solution in the processing tank 41.

  When a predetermined amount of chemical liquid is discharged from the processing tank 41, the control unit 25 instructs the chemical liquid supply source 65 to supply the chemical liquid (step S130 in FIG. 7). When the supply of the chemical solution from the chemical solution supply source 65 is started, the substrate processing apparatus 1 inputs the chemical solution into the processing tank 41 (step S140 in FIG. 7). Specifically, in step S <b> 130, the control unit 25 transmits a signal 95 instructing the supply of the chemical solution to the control unit 130 of the chemical solution supply source 65. When the control unit 130 receives the signal 95, the control unit 130 opens the chemical solution supply valve 120 and starts supplying the chemical solution via the supply pipe 67. In step S <b> 140, the control unit 25 adjusts the opening of the control valve 69 to adjust the amount of the chemical liquid discharged from the nozzle 71, and supplies the chemical liquid from the nozzle 71 to the processing tank 41. In the example of FIG. 7, the control unit 25 transmits a signal 95 at time t4.

  When the supply of the predetermined amount of the chemical solution to the processing tank 41 is completed, the control unit 25 instructs the chemical solution supply source 65 to stop the supply of the chemical solution (step S150 in FIG. 7). Specifically, the control unit 25 transmits a signal 96 for instructing to stop the supply of the chemical solution to the control unit 130 of the chemical solution supply source 65. When the control unit 130 receives the signal 96, the control unit 130 controls the chemical solution supply valve 120. The supply of the chemical solution via the supply pipe 67 is stopped by closing. In the illustration of FIG. 5, the chemical solution supply source 65 stops supplying the chemical solution at time t5. Instead of closing the chemical solution supply valve 120, the control valve 69 may be closed to stop the supply of the chemical solution to the processing tank 41.

  Thereafter, the substrate processing apparatus 1 performs chemical circulation and temperature adjustment (step S160 in FIG. 7). Specifically, the circulation control unit 28 operates the pump 55 to start circulation of the chemical solution in the processing tank 41, and the heating control unit 29 controls the heater 57 to heat the chemical solution to a predetermined temperature. . In the example of FIG. 5, at time t6, the temperature of the chemical solution reaches a predetermined temperature.

  Thereby, the exchange of the chemical solution is completed, and the substrate processing apparatus 1 repeats the processing after step S20 in FIG.

  According to the substrate processing apparatus according to the present embodiment configured as described above, the determination unit 27 can supply the chemical supply source 65 before the discharge control unit 26 starts the discharge operation of the discharge unit 84. Judgment processing to determine whether or not. In the determination process, when it is determined that the chemical solution can be supplied from the chemical solution supply source 65, the discharge control unit 26 causes the discharge unit 84 to start the discharge operation. When it is determined in the determination process that the chemical liquid supply source 65 cannot supply the chemical liquid, the discharge control unit 26 does not cause the discharge unit 84 to start the discharge operation. As described above, when the chemical solution supply source 65 cannot supply the chemical solution, the discharge unit 84 does not start the discharging operation, and the chemical solution attached to the treatment tank 41 can be prevented from being exposed for a long time. Generation can be suppressed.

  Further, according to the substrate processing apparatus according to the present embodiment, the circulation control unit 28 circulates the circulation of the chemical liquid to the processing tank 41 when it is determined in the determination process that the chemical liquid supply source 65 cannot supply the chemical liquid. Let system 52 do. Therefore, the uniformity of the chemical solution in the processing tank 41 can be improved even during a period in which the chemical solution supply source 65 cannot supply the chemical solution.

  Further, according to the substrate processing apparatus according to the present embodiment, the heating control unit 29 operates the heater 57 when it is determined in the determination process that the chemical liquid supply source 65 cannot supply the chemical liquid. Therefore, the chemical solution in the processing tank 41 can be heated even during a period in which the chemical solution supply source 65 cannot supply the chemical solution. Thereby, the increase in the viscosity of a chemical | medical solution can be suppressed.

  In addition, according to the substrate processing method according to the present embodiment as described above, the determination step is executed before the replacement of the chemical solution stored in the processing tank 41 is started. In the determination step, when it is determined that the chemical liquid can be supplied from the chemical liquid supply source 65, the discharge step is executed and the discharge of the chemical liquid from the processing tank 41 is started. Accordingly, when the chemical solution supply source 65 cannot supply the chemical solution, the discharge of the chemical solution from the processing tank 41 is not started. Thereby, since it can suppress that the chemical | medical solution adhering to the processing tank 41 is exposed over a long time, generation | occurrence | production of the particle in the processing tank 41 can be suppressed.

  Further, according to the substrate processing method according to the present embodiment, when it is determined in the determination step that the chemical solution cannot be supplied from the chemical solution supply source 65, the circulation step is executed and the chemical solution is circulated to the processing tank 41. Is done. Therefore, the uniformity of the chemical solution in the processing tank 41 can be improved even during a period in which the chemical solution supply source 65 cannot supply the chemical solution.

  Further, according to the substrate processing method according to the present embodiment, when it is determined in the determination step that the chemical solution cannot be supplied from the chemical solution supply source 65, the heating step is executed to heat the chemical solution. Therefore, the chemical solution in the processing tank 41 can be heated even during a period in which the chemical solution supply source 65 cannot supply the chemical solution. Thereby, the increase in the viscosity of a chemical | medical solution can be suppressed.

  Although the invention has been shown and described in detail, the above description is illustrative in all aspects and not restrictive. Therefore, embodiments of the present invention can be modified or omitted as appropriate within the scope of the invention.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 100 Substrate processing system 130 Control part 25 Control part 52 Circulation system 53 Circulation piping 55 Pump 57 Heater 59 Filter 65 Chemical solution supply source 67 Supply piping 77 Bottom discharge pipe 84 Discharge part 91,92,95,96 Signal W board

Claims (10)

A substrate processing apparatus for processing a substrate with a chemical supplied from a predetermined chemical supply source,
A treatment tank for storing a chemical solution supplied from the chemical solution supply source and performing a predetermined process on the substrate by immersing the substrate in the chemical solution;
A discharge unit that performs a discharge operation for discharging the chemical stored in the treatment tank from the treatment tank;
A discharge control unit that causes the discharge unit to perform the discharge operation when replacing the chemical stored in the processing tank;
A determination unit that performs a determination process to determine whether or not the chemical liquid supply source is capable of being supplied before the discharge control unit causes the discharge unit to perform the discharge operation;
With
The substrate processing apparatus, wherein when the determination unit determines in the determination process that the chemical solution can be supplied from the chemical solution supply source, the discharge control unit causes the discharge unit to start the discharge operation. The substrate processing apparatus according to claim 1,
A circulation system for circulating the chemical liquid by discharging the chemical liquid stored in the processing tank from the processing tank and returning it to the processing tank again.
A substrate processing apparatus further comprising: The substrate processing apparatus according to claim 2,
The said circulation system is a substrate processing apparatus provided with the filter which filters the said chemical | medical solution. A substrate processing apparatus according to claim 2 or claim 3, wherein
A substrate further comprising a circulation control unit that causes the circulation system to circulate the chemical solution to the processing tank when the determination unit determines in the determination process that the chemical solution cannot be supplied from the chemical solution supply source. Processing equipment. A substrate processing apparatus according to any one of claims 1 to 4, wherein
A heater for heating the chemical,
A substrate processing apparatus further comprising: The substrate processing apparatus according to claim 5,
A heating control unit that activates the heater when the determination unit determines in the determination process that the chemical solution supply source cannot supply the chemical solution;
A substrate processing apparatus further comprising: The substrate processing apparatus according to any one of claims 1 to 6,
The chemical supply source;
A substrate processing system. A substrate processing method for processing a substrate with a chemical solution supplied from a predetermined chemical solution supply source,
A discharge step of discharging the chemical liquid from a treatment tank storing the chemical liquid supplied by the chemical liquid supply source;
A determination step of determining whether or not the chemical solution supply source can supply the chemical solution prior to the discharging step when replacing the chemical solution stored in the processing tank;
With
The discharging step includes
A substrate processing method, which is a step of starting discharge of the chemical liquid from the processing tank when it is determined in the determination step that the chemical liquid can be supplied from the chemical liquid supply source. The substrate processing method according to claim 8, comprising:
A substrate processing method, further comprising a circulation step for circulating the chemical liquid to the processing tank when it is determined in the determination step that the chemical liquid cannot be supplied from the chemical liquid supply source. The substrate processing method according to claim 8 or 9, wherein
A substrate processing method, further comprising a heating step of heating the chemical solution when it is determined in the determination step that the chemical solution cannot be supplied from the chemical solution supply source.

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