JP2018159069A - Photocurable resin composition and adhesive - Google Patents

Abstract

The present invention provides a photocurable resin composition that is suppressed from thermal oxidative degradation and has little yellowing.
The present invention relates to a photocurable resin composition that is cured by light. It contains at least one of (A) a monofunctional epoxy compound and (F) a monofunctional oxetane compound, (B) a polyfunctional epoxy compound, and (C) a photocation generator. The said (B) polyfunctional epoxy compound contains the polyfunctional epoxy compound processed by (B3) hydrogenation reaction. Furthermore, it contains (G) elastomer, and the (G) elastomer contains (G2) an elastomer treated by a hydrogenation reaction.
[Selection] Figure 1

Description

  The present invention relates to a photocurable resin composition and an adhesive. Specifically, the present invention relates to a photocurable resin composition that is cured by light and an adhesive containing the photocurable resin composition.

  In recent years, UV curable resin compositions that are cured with ultraviolet rays (UV) regardless of thermal energy have been widely used as transparent adhesives. Such a UV curable resin composition is preferably used as an adhesive for optical parts such as optical pickup parts and camera module parts, as a display sealing material used for PDP (Plasma Display Panel), LCD (Liquid Crystal Display), and the like. Can be used.

JP 2009-298888 A JP 2010-21183 A

  However, the conventional UV curable resin composition has a problem that it tends to yellow due to thermal oxidative degradation. Such yellowing becomes a problem particularly when a UV curable resin composition is used for an optical system member such as a display panel used in a smartphone or the like.

  This invention is made | formed in view of this situation, Comprising: Thermal oxidation deterioration is suppressed and it aims at providing the photocurable resin composition with little yellowing. Moreover, it aims at providing the adhesive agent using the said photocurable resin composition.

  The photocurable resin composition according to the present invention is a photocurable resin composition that is cured by light, and includes (A) at least one of a monofunctional epoxy compound and (F) a monofunctional oxetane compound; It contains a functional epoxy compound, (C) a photocation generator, and (G) an elastomer, and the (B) polyfunctional epoxy compound contains (B3) a polyfunctional epoxy compound treated by a hydrogenation reaction. Is.

  The photocurable resin composition according to the present invention is a photocurable resin composition that is cured by light, and includes (A) at least one of a monofunctional epoxy compound and (F) a monofunctional oxetane compound; It contains a functional epoxy compound, (C) a photocation generator, and (G) an elastomer. The (G) elastomer contains (G2) an elastomer treated by a hydrogenation reaction.

  The adhesive according to the present invention contains the photocurable resin composition.

  In the present invention, by using the raw material processed by the hydrogenation reaction, the double bond content is reduced by maintaining the physical properties of the composition using the raw material not processed by the hydrogenation reaction. Bond breakage is less likely to occur, the occurrence of thermal oxidative degradation can be suppressed, and yellowing can be reduced.

FIG. 1A is a graph showing measurement results of storage elastic modulus and loss elastic modulus immediately after irradiating an active energy ray to an example of an adhesive according to an embodiment of the present invention. FIG. 1B is a graph showing the measurement results of the storage elastic modulus after irradiating active energy rays to an example of the adhesive of the above.

  Hereinafter, modes for carrying out the present invention will be described.

1. Photocurable resin composition The photocurable resin composition of the present embodiment (hereinafter, also referred to as composition (X)) is a photocurable resin composition that is cured by irradiation with light. Here, light includes ultraviolet rays and may include visible light.

In this specification, the curing reaction that proceeds during the irradiation of light on the composition (X) is referred to as primary curing. A curing reaction that starts after a predetermined time from primary curing and progresses steeply is called secondary curing. In addition, a state from when the storage elastic modulus of the composition (X) becomes larger than the loss elastic modulus by primary curing until the secondary curing reaction is started is referred to as a primary cured state. A state in which the adhesive force of the composition (X) is 1 N / cm ² or more by secondary curing is referred to as a secondary curing state. The secondary curing is completed and the composition (X) is completely cured is called complete curing. The time from the start of secondary curing to complete curing is referred to as curing completion time. A state in which the storage elastic modulus of the composition (X) is saturated is referred to as a completely cured state.

  Composition (X) comprises (A) a monofunctional epoxy compound (hereinafter also referred to as (A) component), (B) a polyfunctional epoxy compound (hereinafter also referred to as (B) component), and (C) a photocation generator. (Hereinafter also referred to as (C) component), (D) acrylic compound (hereinafter also referred to as (D) component), (E) photo radical generator (hereinafter also referred to as (E) component), (F) single Contains a functional oxetane compound (hereinafter also referred to as component (F)), (G) an elastomer (hereinafter also referred to as component (G)), and (H) a polyfunctional oxetane compound (hereinafter also referred to as component (H)). ing. In the composition (X), the component (B), the component (C), and the component (G) are essential, at least one of the component (A) or the component (F) is essential, and the other components are optional components. .

  Hereinafter, the components (A), (B), (C), (D), (E), (F), (G), and (H) will be described.

1-1. Component (A) The component (A) is a compound having one epoxy group per molecule. In other words, the component (A) is a compound having a monofunctional epoxy group in one molecule. The component (A) causes the composition (X) to exhibit delayed curability. The delayed curing property means a property that the time until the composition (X) is completely cured after being irradiated with light is longer than the irradiation time of light. In the composition (X), polymerization of the component (A) preferentially proceeds over the components (B) and (H), and gelation due to crosslinking of the components (B) and (H) is delayed. It will have delayed curing.

  The component (A) preferably contains a monofunctional epoxy compound (A1) having a polyether skeleton in one molecule (hereinafter also referred to as the component (A1)). Of course, the component (A) may contain a monofunctional epoxy compound (A2) (hereinafter also referred to as the component (A2)) having no polyether skeleton in one molecule. The polyether skeleton means a chemical structural formula shown in the following formula (1).

(In Formula (1), R is a C1-C30 hydrocarbon group and m is an integer of 2-60).

  In the formula (1), R is preferably a hydrocarbon group having 1 to 10 carbon atoms. In this case, it is possible to increase the time until the composition (X) is completely cured after being irradiated with light.

  Examples of the compound contained in the component (A1) include polyethylene glycol monoglycidyl ether, polypropylene glycol monoglycidyl ether, and polytetramethylene glycol monoglycidyl ether. (A) It is preferable that a component contains 1 or more types of compounds among these.

  Examples of the compound contained in the component (A2) include alkyl glycidyl ether, phenyl glycidyl ether, para tertiary butyl phenyl glycidyl ether, cresyl glycidyl ether, biphenyl glycidyl ether, glycol glycidyl ether, alkylphenol glycidyl ether, cyclohexene oxide, and Fatty acid glycidyl ester is included. The component (A) may include one or more compounds among these.

  Moreover, as for (A) component, it is more desirable that it is a compound which does not contain a carbon-carbon double bond or hardly contains it. In the compound having a carbon-carbon double bond, the β bond is easily cleaved by heat and light, and the composition (X) and the cured product thereof are discolored (particularly yellowing due to thermal oxidative degradation) due to this cleavage. This is because it becomes easier. Here, the compound containing almost no carbon-carbon double bond refers to a compound in which the double bond in the structure is treated by a hydrogenation reaction and the hydrogenation rate is 70% or more. In a compound having a hydrogenation rate of less than 70%, the carbon-carbon double bond is broken by heat and light, and the composition (X) and its cured product are likely to be discolored (particularly yellowing due to thermal oxidative degradation). Therefore, it is not desirable. By using such a compound containing almost no carbon-carbon double bond, discoloration of the composition (X) and its cured product can be suppressed. As the monofunctional epoxy compound containing almost no carbon-carbon double bond, a monofunctional epoxy compound treated by a hydrogenation reaction can be used.

1-2. Component (B) The component (B) is a compound having two or more epoxy groups per molecule. In other words, the component (B) is a compound having an epoxy group having two or more functional groups in one molecule.

  The component (B) preferably contains a polyfunctional epoxy compound (B1) having a polyether skeleton in one molecule (hereinafter also referred to as the component (B1)). Of course, the component (B) may include a polyfunctional epoxy compound (B2) having no polyether skeleton in one molecule (hereinafter also referred to as the component (B2)). In particular, when both the component (A) and the component (B) have a polyether skeleton, after curing of the composition (X), the polyether skeleton part bleeds out (to the surface of the cured product of the composition (X)). Of the polyether skeleton portion).

  Examples of the compound contained in the component (B1) include polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, and polytetramethylene glycol diglycidyl ether. (B) It is preferable that a component contains 1 or more types of compounds among these.

  Examples of compounds contained in the component (B2) include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, biphenyl type epoxy resins having a biphenyl skeleton, naphthalene ring-containing epoxy resins, anthracene ring-containing epoxies. Resin, cycloaliphatic epoxy resin, dicyclopentadiene type epoxy resin having dicyclopentadiene skeleton, phenol novolac type epoxy resin, cresol novolac type epoxy resin, triphenylmethane type epoxy resin, bromine-containing epoxy resin, aliphatic epoxy resin , Aliphatic polyether epoxy resin, and triglycidyl isocyanurate. The component (B) may include one or more compounds among these.

  The component (B) preferably contains a polyfunctional epoxy compound (B3) (hereinafter also referred to as the component (B3)) treated by a hydrogenation reaction. In the polyfunctional epoxy compound having a double bond, the β bond is easily cleaved by heat and light, and the composition (X) and the cured product thereof are discolored (especially yellowing due to thermal oxidative degradation) by this cleaving. It becomes easy. A hydrogenation reaction (sometimes referred to as “hydrogenation”) is a reduction reaction in which hydrogen is added to a double bond originally contained in the structure of the compound, leaving the structure of the compound before the hydrogenation treatment. As such, the number of double bonds in the compound can be reduced. For this reason, in the compound treated by the hydrogenation reaction, the β bond is less likely to be cleaved by heat, light, or the like than the compound not subjected to the hydrogenation treatment. Therefore, the composition (X) preferably contains, as the component (B), a component (B3) that has been treated by a hydrogenation reaction (hydrogenation) and has almost no double bond. Discoloration of the product (X) and its cured product can be reduced. Here, the compound containing almost no carbon-carbon double bond refers to a compound in which the double bond in the structure is treated by a hydrogenation reaction and the hydrogenation rate is 70% or more. In a compound having a hydrogenation rate of less than 70%, the carbon-carbon double bond is broken by heat and light, and the composition (X) and its cured product are likely to be discolored (particularly yellowing due to thermal oxidative degradation). Therefore, it is not desirable. As the component (B3), a polyfunctional epoxy compound treated by hydrogenation reaction (hydrogenation) such as hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, hydrogenated polybutadiene type epoxy resin, or the like is used. Is possible. By using hydrogenated raw materials, the double bond content is reduced by reducing the double bond content while maintaining the physical properties of the composition before hydrogenation, and the occurrence of thermal oxidative degradation is suppressed. And yellowing can be reduced.

1-3. Component (C) The component (C) is a compound that generates a cationic species that is a strongly acidic chemical species when irradiated with light such as ultraviolet rays and visible light. This chemical species can ring-open self-polymerize an epoxy group or an oxetane ring. Therefore, the component (C) is an initiator for ring-opening self-polymerization of the epoxy group or the oxetane ring. The component (C) may contain an ionic photoacid generator, may contain a nonionic photoacid generator, or may contain both of them.

  Examples of compounds contained in the ionic photoacid generator include onium salts such as aromatic diazonium salts, aromatic halonium salts, aromatic sulfonium salts, iron-allene complexes, titanocene complexes, iodonium salts, arylsilanol-aluminum complexes. And organometallic complexes. (C) component can contain a 1 or more types of compound among these. The component (C) may contain a commercially available ionic acid generator. Examples of commercially available ionic acid generators include “Adekaoptomer SP150” and “Adekaoptomer SP170” series products manufactured by Asahi Denka Kogyo Co., Ltd., and a product name “CPI- 210S "," CPI-310B ", a trade name" UVE-1014 "manufactured by General Electronics, a trade name" CD-1012 "manufactured by Sartomer, and the like. (C) component can contain a 1 or more types of ionic photo-acid generator among these.

  Examples of the compound contained in the nonionic photoacid generator include nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenolsulfonic acid ester, diazonaphthoquinone, and N-hydroxyimidophosphonate. The component (C) can contain one or more compounds among these.

1-4. (D) Component (D) A component is either a monomer, an oligomer, or a polymer that is a raw material for an acrylic resin. In other words, the component (D) is a compound having a reactive acrylic group or methacryl group having one or more functional groups in one molecule. Examples of the compound contained in the component (D) include monofunctional acrylates, polyfunctional acrylates, monofunctional methacrylates, polyfunctional methacrylates, and polymers containing a reactive acrylic group or methacrylic group in the molecule. It is known that these cured resins such as acrylic resins and methacrylic resins generally have high weather resistance and are unlikely to cause discoloration. Increasing the proportion of the component that hardly causes such discoloration can contribute to prevention of discoloration of the composition (X).

  Examples of compounds contained in the monofunctional acrylate or monofunctional methacrylate include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, normal propyl acrylate, normal propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, normal butyl acrylate, normal butyl methacrylate, Examples include isobutyl acrylate, isobutyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, lauryl acrylate, lauryl methacrylate, stearyl acrylate, stearyl methacrylate, methacryloxypropyltrimethoxysilane, and methionacrylamide. Examples of the compound contained in the polyfunctional acrylate or polyfunctional methacrylate include 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, triethylene glycol diacrylate, tetra Ethylene glycol diacrylate, cyclohexane dimethanol diacrylate, ethoxylated bisphenol A diacrylate, tricyclodecane dimethanol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dendrimer acrylate, 1,4-butane Diol dimethacrylate, 1,6-hexanediol dimethacrylate, triethylene glycol dimethacrylate, ethoxylation Scan phenol A dimethacrylate, and trimethylol propane trimethacrylate. Examples of polymers containing reactive acrylic or methacrylic groups in the molecule include epoxy acrylate, urethane acrylate, polyester acrylate, acrylic modified silicone, epoxy methacrylate, urethane methacrylate, polyester methacrylate, and methacryl modified silicone. The component (D) may include one or more compounds among these.

1-5. (E) component (E) A component is a compound which generate | occur | produces a radical by irradiating light, such as an ultraviolet-ray and visible light. This radical can radically polymerize an acrylic compound. In other words, the component (E) is a radical photopolymerization initiator. (E) A component is not specifically limited, A well-known radical photopolymerization initiator can be included. It is known that curing with these photo radical generators generally has low corrosivity. By increasing the proportion of such components, it is possible to obtain a cured product with less corrosiveness.

  Examples of the compound contained in the component (E) include acetophenone-based, benzoin-based, benzophenone-based, thioxan-based, alkylphenone-based, and acylphosphine oxide-based photoradical polymerization initiators. The component (E) may include one or more compounds among these.

1-6. Component (F) The component (F) is a compound having one oxetane ring per molecule. The component (F) causes the composition (X) to exhibit delayed curability. The delayed curing property means a property that the time until the composition (X) is completely cured after being irradiated with light becomes longer. In the composition (X), the polymerization of the (F) component proceeds in preference to the (B) component and the (H) component, and the gelation due to the crosslinking of the (B) component and the (H) component is delayed. It will have delayed curing.

  Examples of the compound contained in the component (F) include 3-ethyl-3-hydroxymethyloxetane, 2-ethylhexyloxetane, 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane, 3-ethyl-3- (Cyclohexyloxy) methyl oxetane, 3-ethyl-3- (phenoxymethyl) oxetane, and the like. (F) A component can contain 1 or more types of compounds among these.

1-7. (G) Component (G) A component is an elastomer. The composition (X) containing an elastomer can have a higher viscosity than the composition (X) not containing an elastomer. Moreover, the intensity | strength of the hardened | cured material of a composition (X), an elasticity modulus, and elongation rate can be controlled rather than the hardened | cured material of the composition (X) which does not contain an elastomer. Thereby, the viscosity of composition (X) can be adjusted to the range suitable for the application | coating process. Moreover, the elasticity modulus and elongation rate of composition (X) can be adjusted to the range according to the member to bond.

  Examples of the compound contained in the elastomer include a polymer material such as polyolefin, polystyrene, polyester, polyurethane, silicone, and acrylic polymer. The component (G) may include one or more polymer substances among these. When the composition (X) contains an elastomer, the form of the elastomer may be particulate, may be a solution, and the particulate elastomer and the solution elastomer may coexist.

  The component (G) more preferably contains an elastomer (G2) (hereinafter also referred to as the component (G2)) treated by a hydrogenation reaction. In the elastomer having a double bond, the β bond is easily cleaved by heat and light, and the composition (X) and the cured product thereof are easily discolored (yellowed) by this cleaving. Therefore, the composition (X) preferably contains, as the component (G), a component (G2) that has been treated by a hydrogenation reaction and has almost no double bond, whereby the composition (X) And discoloration of the cured product can be reduced. Here, the compound containing almost no carbon-carbon double bond refers to a compound in which the double bond in the structure is treated by a hydrogenation reaction and the hydrogenation rate is 70% or more. In a compound having a hydrogenation rate of less than 70%, the carbon-carbon double bond is broken by heat and light, and the composition (X) and its cured product are likely to be discolored (particularly yellowing due to thermal oxidative degradation). Therefore, it is not desirable. As the component (G2), it is possible to use an elastomer treated by a hydrogenation reaction (hydrogenation) such as a hydrogenated polystyrene elastomer or a hydrogenated polybutadiene elastomer. By using hydrogenated raw materials, the double bond content is reduced by reducing the double bond content while maintaining the physical properties of the composition before hydrogenation, and the occurrence of thermal oxidative degradation is suppressed. And yellowing can be reduced.

1-8. Component (H) The component (H) is a compound having two or more oxetane rings per molecule. The component (H) improves the curing steepness of the composition (X). Curing steepness is a property in which the curing rate (increased viscosity per unit time) of the composition (X) rapidly increases in a short time, and the time until the composition (X) is completely cured increases. Means.

  Examples of the compound contained in the component (H) include xylylene bisoxetane, 3-ethyl-3 {[(3-ethyloxetane-3-yl) methoxy] methyl} oxetane, oxetanyl silicate and the like. The component (H) can contain one or more compounds among these.

  The component (H) is more preferably a compound that does not contain or hardly contains a carbon-carbon double bond. In the compound having a carbon-carbon double bond, the β bond is easily cleaved by heat and light, and the composition (X) and the cured product thereof are discolored (particularly yellowing due to thermal oxidative degradation) due to this cleavage. This is because it becomes easier. Here, the compound containing almost no carbon-carbon double bond refers to a compound in which the double bond in the structure is treated by a hydrogenation reaction and the hydrogenation rate is 70% or more. In a compound having a hydrogenation rate of less than 70%, the carbon-carbon double bond is broken by heat and light, and the composition (X) and its cured product are likely to be discolored (particularly yellowing due to thermal oxidative degradation). Therefore, it is not desirable. As the polyfunctional oxetane compound containing almost no carbon-carbon double bond, a polyfunctional oxetane compound treated by a hydrogenation reaction can be used. When a polyfunctional oxetane compound containing little or no carbon-carbon double bond is used, the curing steepness can be improved without causing yellowing.

1-9. Other components The composition (X) may contain various resins, additives, and the like as necessary.

1-10. Preparation of Composition (X) Composition (X) is composed of the components (A), (B), (C), (D), (E), (F), and (G). The component (H) and other components as required are blended at a predetermined mass ratio, adjusted to a temperature of 20 ° C. or higher and 100 ° C. or lower, and then stirred until uniform using a disper or the like. This composition (X) is almost transparent, in particular light yellow.

  The composition (X) comprises the components (A), (B), (C), (D), (E), (F), (G), and (H) below. It can contain in the ratio.

  (A) The content rate of a component is 0 to 40 mass parts with respect to 100 mass parts of compositions (X), Preferably it is 1 to 30 mass parts.

  (B) The content rate of a component is 10 to 95 mass parts with respect to 100 mass parts of composition (X), Preferably it is 15 to 70 mass parts.

  (C) The content rate of a component is 0.05 to 5 mass parts with respect to 100 mass parts of composition (X), Preferably it is 0.1 to 3 mass parts.

  (D) The content rate of a component is 0 to 70 mass parts with respect to 100 mass parts of composition (X), Preferably it is 5 to 30 mass parts.

  (E) The content rate of a component is 0 to 5 mass parts with respect to 100 mass parts of composition (X), Preferably it is 0.1 to 3 mass parts.

  (F) The content rate of a component is 0 to 90 mass parts with respect to 100 mass parts of composition (X), Preferably it is 2 to 30 mass parts. (F) It is preferable that the content rate of a component is 5 mass parts or more, and 5 mass parts or more and 90 mass parts or less may be sufficient.

  (G) The content rate of a component is 0 to 80 mass parts with respect to 100 mass parts of composition (X), Preferably it is 1 to 50 mass parts.

  (H) The content rate of a component is 1 to 30 mass parts with respect to 100 mass parts of composition (X), Preferably it is 2 to 15 mass parts.

  The total ratio of the component (A) and the component (B) and the component (D) is preferably in the range of 5:95 to 90:10. In this case, when light is irradiated to the coating film of composition (X), it can be set to the primary hardening state which has adhesiveness and adhesiveness, hold | maintaining the shape of a coating film. Here, the adhesiveness can be attached to the base material by eliminating the space with the base material, can be peeled off with a predetermined force, can be attached again, and is the same as in the initial stage. It refers to a function having adhesive force. In addition, the adhesiveness refers to a property that physically or chemically adheres to the substrate, loses the adhesiveness once peeled off, and significantly lowers the adhesive strength (specifically, 50% or less). Since the shape of the coating film is maintained by the primary curing, the coating film on the member can be prevented from being deformed when the member on which the coating film is formed is transported, and a plurality of members are pasted through the coating film. When combining, it can suppress that composition (X) protrudes from an adhesive member. In addition, even when the member has a curved surface because it is applied to the member when it is liquid, a uniform coating film can be formed and the shape of the coating film can be maintained by temporary curing, so members with different curvatures can be bonded together with a constant film thickness be able to.

  (A) component, (B) component, and mass ratio become like this. Preferably it exists in the range of 10: 90-70: 30, More preferably, it exists in the range of 15: 85-60: 40, More preferably, it is 20 : 80 to 50:50.

  The time from the primary curing to the start of the secondary curing, that is, the time during which the composition (X) is in the primary curing state varies depending on the blending amount and type of each component, but is included in the composition (X) (B) The shorter the component and (H) component, the shorter, and the longer the component (A) and component (F), the longer. When the time of a primary hardening state is long, several members (to-be-adhered object) can be bonded together with margin by composition (X). Since it has shape-retaining properties and moderate adhesiveness, the composition (X) does not flow out to other members and does not easily shift in position, making it very easy to use in production. Moreover, since the coating film of composition (X) hardens | cures after bonding a some member, a some member can be adhere | attached without being influenced by the light transmittance of a member. Moreover, since it is not influenced by the light transmittance of a member, composition (X) can be hardened with the light of the wavelength range which composition (X) hardens | cures more efficiently. Moreover, the hardening state of composition (X), hardening time, etc. can be controlled uniformly. This eliminates the need for a light source for secondary curing, simplifies the manufacturing process, and eliminates the need for light adjustment and confirmation even if member changes occur during the manufacturing process. Furthermore, the present invention can be applied to adhesion of a light-shielding member, and it is possible to increase options for the member. In addition, after a plurality of members are bonded together, if a problem is found in the primary curing state, each of the plurality of members is separated, the defect in the primary curing state is corrected, and then bonded again, so-called Easy to rework.

  The total amount of the epoxy compound having a polyether skeleton in one molecule (that is, the sum of the monofunctional epoxy compound (A1) and the polyfunctional epoxy compound (B1) with respect to 100 parts by mass of the component (A) and the component (B). The amount is preferably in the range of 0.01 to 90 parts by mass, and more preferably in the range of 0.1 to 30 parts by mass.

  It is preferable that the compounding quantity of (C) component with respect to a total of 100 mass parts of (A) component and (B) component is 0.01 mass part or more. In this case, the cationic polymerization reaction is not sufficiently performed, and it is possible to suppress the occurrence of uncured composition (X). Moreover, it is preferable that the compounding quantity of (C) component with respect to a total of 100 mass parts of (A) component and (B) component is 10 mass parts or less. In this case, it can suppress that the reaction rate of cationic polymerization reaction is too fast, and it becomes impossible to ensure pot life, and that the deep-curability of composition (X) falls.

  The blending amount of the component (E) with respect to the total of 100 parts by weight of the component (D) is preferably in the range of 0.01 parts by mass or more and 10 parts by mass or less. When the blending amount of component (E) is less than 0.01 parts by mass, uncured component (D) may occur and resin leakage due to poor curing may occur. Moreover, when there are more compounding quantities of (E) component than 10 mass parts, hardened | cured material may become weak by overcuring of composition (X).

  The blending amount of the component (F) with respect to the total of 100 parts by mass of the component (A) and the component (B) is preferably in the range of 0.1 parts by mass or more and 30 parts by mass or less. In this case, the viscosity increasing behavior at the time of curing of the composition (X) can be made steeper. Thereby, the curing time to complete hardening after bonding a plurality of members can be shortened. Moreover, the position shift after bonding a some member can be suppressed more.

  Moreover, when at least one of the component (A) and the component (B) has a polyether skeleton, the reaction rate of the cationic polymerization reaction can be more effectively slowed down. Thereby, the radical polymerization reaction that occurs during light irradiation and the cationic polymerization reaction that proceeds after a predetermined time after irradiation can be separated in time.

  Further, at least one of the component (A) and the component (B) has a polyether skeleton, and the blending amount of the component (H) is 0.1 parts by mass with respect to 100 parts by mass in total of the components (A) and (B). When it is within the range of 30 parts by mass or less, the radical polymerization reaction that occurs during light irradiation and the photocation reaction that proceeds after a predetermined time after irradiation can be separated in time, and after a predetermined time has elapsed The progress of the cationic polymerization reaction can be made steep, and the curing completion time can be shortened.

  In other words, the component (A) and the component (B) cause the composition (X) to be in a primary cured state by radical polymerization during irradiation of the composition (X) with light, and a predetermined time after the light irradiation ends. Makes it possible to bond a plurality of members together. A sufficient bonding time can be secured by this predetermined time. Further, after the bonding, the cationic polymerization reaction proceeds rapidly due to the component (F), and the composition (X) is completely cured. By shortening the curing completion time, the product can be shipped in a short time. As a result, in-process inventory in the factory process can be kept particularly small, and the manufacturing cost can be reduced.

  When composition (X) contains an elastomer (component (G)), the blending amount of component (G) is preferably 0.1 with respect to 100 parts by mass of the total of component (A) and component (B). It is in the range of not less than 90 parts by mass. In this case, various functions can be imparted to the composition (X) and the cured product of the composition (X). For example, the viscosity of the composition (X) can be adjusted according to the function of the production equipment in the factory. Moreover, since the elasticity modulus of the hardened | cured material of composition (X) can be adjusted, the elasticity modulus control of composition (X) required when there exists a thermal expansion difference between the members to bond can be performed. .

  The composition (X) is not treated with a hydrogenation reaction, and the content of the compound having no double bond is 50 parts by mass (50% by mass) or more with respect to 100 parts by mass of the composition (X). preferable. As above-mentioned, the compound which has a double bond tends to discolor composition (X) and its hardened | cured material. In particular, thermal yellowing due to thermal oxidative degradation is likely to occur. The more the content of the compound having no double bond, the more difficult the composition (X) and the cured product thereof are discolored. Therefore, the compound not treated with the hydrogenation reaction and having no double bond is the composition (X ) In 100 parts by mass is preferably 50 parts by mass or more. Furthermore, in the composition (X), the content of the compound treated by the hydrogenation reaction (hydrogenation) is 20 parts by mass (20% by mass) or more with respect to 100 parts by mass of the composition (X). More preferred. Thereby, it can reduce that a composition (X) and its hardened | cured material discolor by heat, light, etc.

2. Curing characteristics of composition (X) The composition (X) is liquid before irradiation with light. When the coating film of the composition (X) is disposed on the member, the composition (X) follows the shape of the member, so that bubbles can be prevented from entering between the member and the coating film. Moreover, since composition (X) is easy to be kept in a liquid state unless it is irradiated with light, it is excellent in storage stability and can be stored at room temperature without being stored in a cold place like a thermosetting resin.

  The composition (X) has a storage elastic modulus higher than the loss elastic modulus during light irradiation, and is in a primary cured state. Thereby, since the fluidity | liquidity of composition (X) falls, the shape of the coating film of composition (X) can be hold | maintained. For this reason, when conveying the member by which the coating film of composition (X) is arrange | positioned, the shape of a coating film is hold | maintained, a deformation | transformation is suppressed and a film thickness is also maintained. Moreover, when a plurality of members are bonded together via a coating film, the protrusion of the composition (X) is suppressed. And since the composition (X) of a primary hardening state has adhesiveness, it can keep members in the state where it is hard to move by fixing members at the optimal position. Moreover, the coating film which has arbitrary shapes can also be formed. For example, the first cured film may be formed into a sheet by irradiating the composition (X) with light after disposing the composition (X) in a mold. For example, the present invention may be applied to bonding members having complicated shapes by forming a linear coating film. That is, since the composition (X) is a liquid at the time of coating film formation, it can be applied in an arbitrary shape according to the shape of the member, and can be cured in an arbitrary shape by irradiation with light. It becomes possible to make it adhere.

  The phenomenon that the composition (X) is in a primary cured state is derived from the acrylic compound and the photo radical generator. The mechanism by which the composition (X) of the present embodiment becomes a primary cured state is as follows. When the composition (X) absorbs light, radicals derived from the photoradical generator are instantly generated. By reacting this radical with the acrylic compound, a radical polymerization reaction of the acrylic compound occurs. This radical polymerization reaction proceeds rapidly. The radical polymerization reaction proceeds only during light irradiation, and after the irradiation is completed, the radical is deactivated and the radical polymerization reaction is completed. For this reason, the composition (X) rapidly increases in viscosity, becomes a primary cured state, and the fluidity decreases. Moreover, when there are too many compounding quantities of the acryl-type compound in composition (X), composition (X) will fully harden | cure. For this reason, it is preferable that the quantity of the acryl-type compound contained in composition (X) is contained to such an extent that composition (X) is not fully hardened by radical polymerization reaction. Immediately after the light irradiation, the epoxy compound described later reacts to produce a cation derived from the photocation generator, and the cationic polymerization reaction is performed by using the monofunctional epoxy compound of component (A) and the polyfunctional component of component (B). It is difficult to proceed with epoxy compounds.

  FIG. 1A shows the storage elastic modulus (G′Pa) and loss elastic modulus (G “Pa) of the composition (X) immediately after irradiation of the composition (X) as an example of the present embodiment. The measurement results are shown with a meter (MCR-102 manufactured by Anton Paar), where “storage” indicates the properties of the elastic body and “loss” indicates the properties of the viscous body. According to this, immediately after the light irradiation, the storage elastic modulus (G′Pa) is larger than the loss elastic modulus (G “Pa). That is, the composition (X) immediately after the light irradiation is an elastic body. The composition (X) in such a state is easy to maintain its shape, and the composition of the composition (X) is deformed and bonded. The protrusion of the object (X) can be suppressed.

  The composition (X) is kept in a primary cured state in which the shape can be maintained for a predetermined time after irradiation with light, and has adhesiveness but does not have adhesiveness. In addition, the composition (X) is fixed by being completely cured. That is, the composition (X) has delayed curing properties. For this reason, composition (X) has the time allowance which bonds several members after light irradiation, and has the time (pot life) which can bond several members. For this reason, after bonding a plurality of members, it is easy to separate and rework is easy. On the other hand, if the pot life is too long, the bonding process takes a lot of time, and productivity is lowered. The advantage is that the curing properties can be designed at a time suitable for the production process. Further, after bonding a plurality of members, the composition (X) can be cured only by light irradiation before the members are bonded, without additionally applying energy such as heat to the composition (X). It can proceed spontaneously to complete the curing. For example, even when a light-shielding member, a member with low light transmittance, or the like is bonded, uncured composition (X) can be suppressed. The delayed curing property of the composition (X) is such that at least one of a monofunctional epoxy compound (component (A)) and a monofunctional oxetane compound (component (F)), a polyfunctional epoxy compound (component (B)), and a photocation Derived from the generator (component (C)).

In FIG. 1B, the change in the storage elastic modulus (G′Pa) of the composition (X) as an example of the present embodiment with respect to the elapsed time after light irradiation is measured with a rheometer (MCR-102 manufactured by Anton Paar). The results are shown. According to this, the storage elastic modulus is low before irradiation with light, and the composition (X) is liquid. Further, from the time immediately after the irradiation of light to the end of the irradiation, the storage elastic modulus rapidly increases due to the primary curing, and the composition (X) becomes a primary cured state, resulting in stickiness. Further, the storage elastic modulus is kept constant for a certain time from the end of light irradiation. That is, the composition (X) is maintained in the primary cured state. Thereafter, the storage elastic modulus starts to increase rapidly by secondary curing. The time when the storage elastic modulus rapidly increases is the curing start time of the secondary curing. Moreover, the state in which the storage elastic modulus is rapidly increased and the adhesive force of the composition (X) is 1 N / cm ² or more is the secondary cured state. That is, the adhesive force of the composition (X) is expressed by secondary curing. Thereafter, when the storage elastic modulus is saturated, the increase in the storage elastic modulus is moderated, and the composition (X) is completely cured. The time from the start time of the secondary curing to the complete curing is the curing completion time.

The time during which the composition (X) is in the primary curing state varies depending on the composition of the composition (X), the irradiation intensity of light, the temperature of the composition (X), and the like. That is, the time from when the composition (X) is irradiated with light until the start of secondary curing can be controlled. Assuming that a plurality of members are actually bonded to each other with the composition (X), immediately after light having a wavelength of 365 nm is irradiated with an irradiation dose of 50 mJ / cm ² or more in an atmosphere at a temperature of 25 ° C., 60 seconds or more. Within 1 minute is the primary curing state, and then it is preferable to cure within 12 hours. It is preferable to adjust the composition and the like of the composition (X) so as to achieve such properties.

The time during which the composition (X) is in the primary cured state is less than 5 seconds, so there is less time to bond a plurality of members, but if it exceeds 60 minutes, the surrounding temperature changes and artificial factors may also occur. In addition, the possibility of misalignment of a plurality of members is increased, and the time required until the composition (X) is completely cured is increased. The curing completion time is considered to be reasonable within 12 hours from the viewpoint of productivity, but the shorter this time is more preferable. In addition, it is appropriate that the light irradiation amount is 50 mJ / cm ² or more, but if it is less than this, the amount of the cation species generated by light irradiation is small, and there is a possibility that the cationic polymerization reaction stops, poor curing, or the like occurs. is there. In addition, as the amount of light irradiation increases, the cationic polymerization reaction becomes faster, and the time during which the composition (X) is in the primary curing state and the curing completion time are shortened. In the cationic polymerization reaction, the amount of cationic species generated and the amount of light irradiation have a positive correlation. On the other hand, light is not involved in the cationic polymerization reaction and is affected by temperature. For this reason, the cationic polymerization reaction is slow at low temperatures, and the cationic polymerization reaction is fast at high temperatures. By applying this phenomenon and irradiating with light at a low temperature, the time during which the composition (X) is in the primary cured state can be lengthened. Moreover, the curing time can be shortened by heating after bonding. The mechanism in which the composition (X) of the present embodiment exhibits delayed curing is presumed as follows.

  When the composition (X) absorbs light, a cation species derived from the photocation generator (component (C)) is generated. The cationic species reacts with the monofunctional epoxy compound (component (A)) and the monofunctional oxetane compound (component (F)) to initiate the cationic polymerization reaction. Since the component (A) has one epoxy group in the molecule, it is not three-dimensionally crosslinked by the cationic polymerization reaction. Since the component (F) has one oxetane ring in the molecule, it is not three-dimensionally crosslinked by the cationic polymerization reaction. For this reason, only the (A) component and the (F) component react and a crosslinking reaction does not occur for a fixed time after irradiating the composition (X) with light. That is, the composition (X) is not completely cured. For this reason, the elastic modulus hardly increases from the composition (X) that has been in a primary cured state by the cationic polymerization reaction of the acrylic compound. For this reason, it seems that composition (X) is maintained with the primary hardening state. Thereafter, the cationic polymerization reaction of the polyfunctional epoxy compound (component (B)) and the polyfunctional oxetane compound (component (H)) proceeds, and the crosslinking reaction proceeds, whereby the elastic modulus of the composition (X) increases. I will do it. The cationic polymerization reaction also occurs when the cationic species reacts with the component (B) and the component (H). Since the component (B) has two or more epoxy groups in the molecule, a three-dimensional crosslinked structure is formed by a cationic polymerization reaction. In addition, since the component (H) has two or more oxetane rings in the molecule, it forms a three-dimensional crosslinked structure by a cationic polymerization reaction. For this reason, the composition (X) is completely cured after a lapse of a certain time after the composition (X) is irradiated with light.

  In addition, the composition which shows the behavior of delayed hardening exists conventionally. However, the conventional delayed curable composition traps the cationic species derived from the photocation generator with a delayed curing agent such as a polyether or thioether, and delays the start time of the cationic polymerization reaction. The composition (X) is different from the conventional delayed curable composition in that the polymerization reaction itself, that is, the growth reaction is controlled, not the initiation time of the cationic polymerization reaction.

  In addition, when the composition (X) is irradiated with light once, the radical polymerization reaction and the cationic polymerization reaction are started, and the cationic polymerization reaction proceeds spontaneously. For this reason, the irradiation time of light with respect to the composition (X) may be one time and may be short, and it is not necessary to continue irradiating light until the composition (X) hardens | cures. For this reason, when hardening composition (X), it is not necessary to perform several processes like an ultraviolet-ray and a heat | fever, or an ultraviolet-ray and humidity. The mechanism by which the cationic polymerization reaction proceeds spontaneously is assumed as follows.

  The component (A1) and the component (B1) contained in the composition (X) have a polyether skeleton in the molecule. For this reason, when a polyether skeleton and a cationic species are present, association / release between the polyether skeleton and the cationic species occurs according to the concentration of the free cationic species according to the principle of Le Chatelier. That is, when many cationic species are present in the composition (X), the equilibrium is inclined toward the association side, and the free cationic species is reduced. On the other hand, when the number of free cationic species decreases, the equilibrium is inclined to the free side, and free cationic species are supplied.

  Generally, when the component (C) absorbs light, a cationic species is generated. This cationic species reacts with the component (A) and the component (F) to cause a cationic polymerization reaction. At this time, if the amount of the cationic species is large, the cationic polymerization reaction is accelerated, and if the amount of the cationic species is small, the cationic polymerization reaction is delayed.

  Immediately after the composition (X) is irradiated with light, a large amount of cationic species is generated from the component (C). Some of these cationic species are consumed by the cationic polymerization reaction of the components (A) and (F), while the remaining cationic species are associated with the polyether skeleton. When the cationic polymerization reaction is stopped, the amount of the cationic species in the composition (X) decreases, so that the equilibrium of the release / association of the polyether skeleton and the cationic species is inclined to the free side, and there is a new in the composition (X). Cationic species are supplied. The cationic polymerization reaction is continued by this new cationic species. As a result, the cationic polymerization reaction proceeds spontaneously even after the light irradiation to the composition (X) is completed.

  Also, the liberation / association of the polyether skeleton and the cationic species proceeds regardless of light irradiation. For this reason, even after the light irradiation is completed, the cation is supplied with the decrease in the cation concentration due to the deactivation, so that the cation polymerization reaction proceeds. As a result, the composition (X) is kept in a primary cured state for a certain period of time after irradiation with light, and thereafter, the curing is completed without performing light irradiation or heating. The composition (X) suddenly increases in viscosity immediately after irradiation with light and becomes a primary cured state, but the subsequent increase in viscosity becomes gentle, and the time during which the composition (X) is in the primary cured state becomes longer. . As a result, it is possible to take a long time (working time) for bonding the members, and the handleability is excellent.

  In addition, since the composition (X) includes the component (A1) and the component (B1), the polyether skeleton portion bleeds out even after the composition (X) is cured (the stain on the surface of the cured product of the composition (X)). (Protruding and embossing) can be suppressed. If a compound other than an epoxy compound having a polyether skeleton is employed, the compound having a polyether skeleton is less likely to be incorporated into the cured product of the composition (X), and the polyether is removed from the three-dimensional network structure of the cured product. A compound having a skeleton is easily detached. Thereby, the bleed out of the compound having a polyether skeleton is likely to occur.

  Moreover, composition (X) can make the viscosity increase at the time of the hardening start of the secondary curing of composition (X) steep by containing a polyfunctional oxetane compound (component (H)). The mechanism is presumed as follows.

  In the cationic polymerization reaction of the epoxy compound, the cationic species may move into the molecule due to chain transfer of the cationic species, and the reaction may stop. The chain transfer of the cationic species is likely to occur in the epoxy compound, but is difficult to occur in the component (H). For this reason, when composition (X) contains (H) component, the stop of the cationic polymerization reaction by chain transfer can be suppressed. Thereby, the viscosity rise of composition (X) can be made steep. That is, after the composition (X) contains the component (A1) and the component (B1) and the component (F), the initial increase in viscosity is moderated and the predetermined time is maintained in the primary curing state. A steep increase in viscosity is caused by the components. As a result, it is possible to further shorten the time (curing completion time) until sufficient adhesive strength capable of working in the subsequent steps is obtained while securing the pot life.

  The composition (X) as described above has components (A), (B), (C), (D), (E), (F), (G), and (H). By changing the blending ratio, type, and the like of the components, it can be controlled to have desired curing characteristics (the time when the composition (X) is in the primary curing state and the curing completion time).

  The time during which the composition (X) is in the primary curing state varies depending on the composition of the composition (X), the irradiation intensity of light, the temperature of the composition (X), and the like. For example, the reaction rate of the cationic polymerization reaction can be increased by increasing the amount of light irradiation or increasing the temperature at the time of light irradiation. Further, the reaction rate of the cationic polymerization reaction can be slowed by reducing the amount of light irradiation or lowering the temperature at the time of light irradiation. For this reason, by adjusting the irradiation amount at the time of light irradiation or the temperature at the time of light irradiation, the time during which the composition (X) is in the primary curing state and the curing completion time can be arbitrarily adjusted. Further, by measuring the viscoelasticity of the composition (X), the time during which the composition (X) is in the primary curing state can be designed to be within a predetermined range.

  Further, the composition (X) is composed of a radical curable component composed of the component (D) and the component (E), the component (A), the component (B), the component (C), the component (F) and the component (H). When the cation curable component is included, if there are too many radical curable components, the reaction of the cation species required for the cation curing is inhibited, resulting in a problem that sufficient curing is not performed. For this reason, it is necessary to adjust suitably the compounding quantity of a cationic curable component with respect to a radical curable component, and it is preferable to make it the amount of a cationic curable component increase. Specifically, the mass ratio of the cationic curable component to the radical curable component is preferably 55:45 to 90:10. Further, since the component (E) functions only by radical polymerization of the radical curable component during light irradiation, it is not preferable to add more than necessary. The component (E) preferably contains 0.5% by mass or more and 5% by mass or less with respect to the component (D). If the content is 0.5% by mass or more and 5% by mass or less, radical curing is performed by radical polymerization reaction in primary curing. It is possible to sufficiently perform the secondary curing within a predetermined time without causing the reactive component to sufficiently react and inhibiting the reaction of the radical curable component.

  In the present embodiment, even when the component (A) is not included at all, it is possible to effectively impart delayed curability by containing the (F) monofunctional oxetane compound. This is because the initial reaction rate of the monofunctional oxetane compound is slower than that of the monofunctional epoxy compound. Thereby, it becomes possible to remarkably suppress the increase in the viscosity of the composition (X) after the light irradiation, and it is possible to keep the pot life that can be bonded with the liquid even after the light irradiation. Moreover, when the epoxy component of (A) component or (B) component contains an ether bond, it becomes possible to keep a primary hardening state very long together with (F) monofunctional oxetane compound. Furthermore, by using the (H) polyfunctional oxetane compound in combination, it is possible to cause a sudden increase in viscosity after a predetermined time and to shorten the time until complete curing. That is, effective delayed curing can be imparted by combining (F) a monofunctional oxetane compound and (H) a polyfunctional oxetane compound.

  Further, when (E) the photoradical generator and (D) the acrylic compound are not included, the primary cured state does not have a shape-retaining property, but remains liquid and protects the shape of the coating resin on the coating member. Delay-curing photo-curing resin that is completely cured in a short time by adding a spacer, etc., with a certain thickness at the time of pasting, and (H) rapid increase in viscosity due to polyfunctional oxetane compound It is also possible to obtain a composition. However, in this case, since it is in a completely liquid state at the time of bonding, it takes time to develop a jig for holding the bonded state and an adhesive force.

  However, when (E) a photoradical generator and (D) an acrylic compound are contained, a primary cured state can be formed as described above, so that shape retention and adhesiveness can be achieved at the time of bonding. If a certain level of force is not applied before curing (secondary curing), it is possible to maintain the bonding, and a primary curing state is created with a photo radical generator and an acrylic compound, and the adhesive state is maintained ( F) The secondary curing time is delayed with a monofunctional oxetane compound or (A) a monofunctional epoxy compound, and (H) the time until complete curing is controlled by causing rapid secondary curing with a polyfunctional oxetane compound. It becomes possible. Therefore, the composition (X) containing (E) a photoradical generator and (D) an acrylic compound, (F) a monofunctional oxetane compound and (H) a polyfunctional oxetane compound is easy to bond and can be reworked. Because it can control the time until complete curing, it is highly productive.

3. Adhesive The composition (X) can be used as an adhesive. In particular, it can be used as an adhesive when bonding an optical system member used for a smart phone or a mobile phone. The composition (X) may be diluted with an appropriate solvent to prepare an adhesive. In addition, when an object that is not an optical system member is bonded, the coloring of the composition (X) does not need to be considered so much. (E) An adhesive containing a photo radical generator and (D) an acrylic compound, (F) a monofunctional oxetane compound and (H) a polyfunctional oxetane compound can retain its shape with a single light irradiation. Since tackiness is developed and then cured as it is, it is very useful for adhesion in a dark portion or a place where light for curing does not reach by applying weathering treatment. Moreover, since it hardens | cures with light, the adaptation to the member which cannot apply temperature is especially effective.

  Hereinafter, the present invention will be specifically described by way of examples.

1. Preparation of Composition (X) Using a Disper made by Primix Co., Ltd., each component blended at a mass ratio shown in Table 1 was uniformly mixed to prepare composition (X). The details of each component shown in Table 1 are as follows.
(A2-1): alkyl glycidyl ether (the alkyl group has 10 to 15 carbon atoms, no double bond)
・ (A2-2): Cresyl glycidyl ether (with double bond)
(B1): Polypropylene glycol diglycidyl ether (no hydrogenation treatment)
-(B2): Bisphenol A type epoxy resin (without hydrogenation treatment)
・ (B3): Hydrogenated bisphenol A type epoxy resin (with hydrogenation treatment)
(C): Triarylsulfonium salt (D-1): Lauryl acrylate (D-2): 1,9-nonanediol diacrylate (E): 1-hydroxy-cyclohexyl-phenyl-ketone (F) ): 2-ethylhexyloxetane / (G1) polybutadiene rubber (without hydrogenation treatment)
・ (G2): Hydrogenated polybutadiene rubber (with hydrogenation treatment)
(H-1): 3-ethyl-3 {[(3-ethyloxetane-3-yl) methoxy] methyl} oxetane (no double bond)
(H-2): Xylylene bisoxetane (with double bond)

2. Evaluation "Discoloration"
Using two glass plates and a spacer, the composition (X) was sandwiched between the glass plates so that the thickness of the resin portion was 1 mm. This was irradiated with active energy rays at 3000 mJ / cm ² and then cured at room temperature for 1 day to prepare a test piece.
The test piece prepared by the above method was put into a constant temperature bath at 95 ° C. and left for a predetermined time, and then the discoloration was measured.

  The degree of discoloration was evaluated by yellowness (YI). CM-5 manufactured by Konica Minolta was used for the measurement.

  The discoloration was measured by the above operation and evaluated as follows.

A: No discoloration B: Mild discoloration but problematic in practical use C: Discoloration occurs D: Large discoloration

3. Results In Examples 1 to 5 containing the polyfunctional epoxy compound or elastomer treated by the hydrogenation reaction, discoloration was reduced. In particular, when both the polyfunctional epoxy compound and the elastomer are processed by a hydrogenation reaction, the discoloration is less, and the monofunctional epoxy compound containing a double bond is not contained and the double bond is contained. Less discoloration was obtained when no monofunctional epoxy compound was used.

Claims (9)

A photocurable resin composition that is cured by light,
(A) at least one of a monofunctional epoxy compound and (F) a monofunctional oxetane compound;
(B) a polyfunctional epoxy compound;
(C) a photocation generator,
(G) containing an elastomer,
The said (B) polyfunctional epoxy compound is a photocurable resin composition containing the polyfunctional epoxy compound processed by (B3) hydrogenation reaction. A photocurable resin composition that is cured by light,
(A) at least one of a monofunctional epoxy compound and (F) a monofunctional oxetane compound;
(B) a polyfunctional epoxy compound;
(C) a photocation generator and (G) an elastomer,
The (G) elastomer is a photocurable resin composition containing (G2) an elastomer treated by a hydrogenation reaction. The photocurable resin composition according to claim 2, wherein the (B) polyfunctional epoxy compound contains (B3) a polyfunctional epoxy compound treated by a hydrogenation reaction. And (H) a polyfunctional oxetane compound.
The photocurable resin composition as described in any one of Claims 1 thru | or 3. Further, at least one of the (A) monofunctional epoxy compound, the (F) monofunctional oxetane compound and the (H) polyfunctional oxetane compound contains a compound treated by a hydrogenation reaction. The photocurable resin composition as described in any one. Furthermore, (D) The photocurable resin composition as described in any one of Claims 1 thru | or 5 containing an acryl-type compound. The mass ratio of the total content of the (A) monofunctional epoxy compound and the (B) polyfunctional epoxy compound and the content of the (D) acrylic compound is 5:95 to 90:10. The photocurable resin composition according to claim 6. The content of a compound not treated with a hydrogenation reaction and having no double bond is 50% by mass or more, and the content of a compound treated with a hydrogenation reaction is 20% by mass or more. 2. The photocurable resin composition according to item 1. The adhesive agent containing the photocurable resin composition of any one of Claims 1 thru | or 8.

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