JP2018157039A - Substrate holding device, lithographic apparatus, and article manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the driving time of a support member and a holding member while preventing damage to a substrate. SOLUTION: In a substrate holding device 500 according to the present invention, a substrate 300 is carried in above a holding surface 502b or a substrate 300 is carried out from above a holding surface 502b in a state where a support member 503 protrudes from the holding surface 502b. Will be done. The board holding device 500 has a driving means 501 for driving the support member 503 in the height direction, and the driving means 501 is a support member 503 when the board 300 is carried in or when the board 300 is carried out. The height of the upper end of the substrate 300 is changed based on the curved state of the substrate 300. [Selection diagram] Fig. 5

Description

  The present invention relates to a substrate holding apparatus, a lithographic apparatus, and an article manufacturing method.

  In recent years, with the diversification of manufacturing processes of semiconductor devices and the like, substrates with large warpage are increasingly handled. An example of a substrate that easily warps is shown in FIG. A plurality of unit regions 106 are arranged on the substrate 100 shown in FIG. 13A, and FIG. 13B is an enlarged view of a part of FIG. The unit region 106 has a configuration in which the semiconductor chip 101 and the electrode pad 104 are connected via the wiring 103 on the molding material 102, and a plurality of unit regions 106 are arranged while securing the cutting region 105. In addition, a thin substrate is also an example of a substrate that is easily warped. These substrates that are easily warped tend to be greatly curved when being transported by a transport hand or being supported with a narrow contact area.

  Patent Document 1 describes a substrate holding device that holds a substrate carried in a curved state while flattening the substrate. In the substrate holding device, each of the plurality of lift pins (support members) is gradually driven up until it comes into contact with the substrate, and then the lift pins are driven down to transfer the substrate to the holding surface of the chuck (holding member). In addition, it is described that the lift pins are kept at the lowest position with respect to the holding surface before the lift pins are raised, that is, until the substrate is carried over the holding surface.

JP2013-191601A

  In the technique described in Patent Document 1, the lift pin is kept at the lowest position with respect to the holding surface, thereby causing a collision between the substrate and the lift pin until the substrate is loaded above the holding surface. It is possible to prevent damage to the substrate. However, if the lift pins are raised from the lowest position with respect to all the substrates, it takes time to contact the substrates depending on the drive amount of the lift pins. Thereby, it may take more time than necessary to complete the holding of the substrate by the substrate holding device.

  An object of the present invention is to provide a substrate holding device capable of shortening the driving time of a support member and a holding member while preventing breakage of the substrate.

  A substrate holding apparatus according to the present invention includes a holding member that holds a substrate on a holding surface, and a support member that can support the substrate above the holding surface by protruding from the holding surface, and In a substrate holding apparatus in which the substrate is carried in above the holding surface or unloaded from above the holding surface in a state in which the support member protrudes from the surface, the support member is moved in the height direction. Driving means for driving, wherein the driving means sets the height of the upper end of the support member when the substrate is carried in or when the substrate is carried out to the curved state of the substrate. It is characterized by changing based on.

  According to the present invention, it is possible to shorten the driving time of the support member and the holding member while preventing the substrate from being damaged.

It is a figure which shows the structure of the holding | maintenance apparatus which concerns on 1st Embodiment. It is a figure explaining control of the holding device concerning a 1st embodiment. It is a figure explaining the memory | storage part which concerns on 1st Embodiment. It is a figure which shows the structure of the detection part which concerns on 1st Embodiment. 3 is a flowchart according to the first embodiment. It is a figure explaining the drive of the pin in the case of the 1st bending amount. It is a figure explaining the drive of the pin in the case of the 2nd bending amount. It is a figure explaining the drive of the pin in the case of the 3rd bending amount. It is a drive profile of the pin which concerns on 1st Embodiment. It is a figure explaining the change-over operation of the board | substrate concerning 4th Embodiment. It is a figure which shows the structure of the exposure apparatus which concerns on 5th Embodiment. It is a figure which shows the structure of the conveyance system which concerns on 5th Embodiment. It is a figure which shows the structure of the board | substrate which is easy to curve.

[First Embodiment]
(Configuration of substrate holding device)
A substrate holding device 500 (hereinafter referred to as a holding device 500) according to the first embodiment will be described with reference to FIGS. In the following description, a vertical axis is a Z axis, and two axes orthogonal to each other in a plane perpendicular to the Z axis are an X axis and a Y axis. In all the drawings, the same members are denoted by the same reference numerals, and the same members are not described repeatedly for the second and subsequent times.

  FIG. 1A and FIG. 1B are diagrams showing a configuration of a holding device 500 that holds a substrate. FIG. 1A is a view of a part of the holding device 500 as viewed from the + Z direction. FIG. 1B is a cross-sectional view taken along one-dot chain line A-A ′ in FIG.

  The chuck (holding member) 502 has a holding surface 502b on the side into which the substrate is carried (+ Z direction side), and holds the substrate with the holding surface 502b. Specifically, an opening (not shown) provided in the holding surface 502b is connected to an exhaust unit 505 provided with exhaust means such as a vacuum pump, and the holding surface 502b and the substrate are interposed through the opening. The substrate is sucked and held by exhausting the space.

  The lift pins 503 (hereinafter referred to as pins 503) are support members that can support the substrate by protruding from the holding surface 502b. The pin 503 supports the substrate at its upper end. The pin 503 has an opening (not shown) connected to the exhaust unit 506 through the pipe 504 on the side where the substrate is carried. When the substrate is supported, the pin 503 temporarily adsorbs the substrate by exhausting the space between the upper end of the pin 503 and the substrate through the opening.

  Note that the adsorption of the substrate by the pins 503 and the adsorption of the substrate by the chuck 502 may not be based on the vacuum adsorption force using the exhaust parts 505 and 506 such as a vacuum pump. For example, electrostatic force may be used, or mechanical pressing may be used.

  The drive unit (first drive unit) 501 drives the pin 503 along the height direction (Z-axis direction) so that the pin 503 protrudes from the holding surface 502b. The drive unit (second drive unit) 507 drives the chuck 502 along the height direction (the direction in which the pin 503 protrudes from the holding surface 502b).

  The driving units 501 and 507 drive the pins 503 and the chuck 502 for transferring the substrate between the pins 503 and the holding surface 502b. For example, the holding device 500 supports the substrate with only the pins 503 in a state where the pins 503 protrude from the holding surface 502b, and then gradually reduces the protruding amount from the holding surface 502b to the substrate from the pins 503 to the chuck 502. Hand over. The drive for causing the pin 503 to protrude from the holding surface 502b may be performed by at least one of the drive units 501 and 507. When the protrusion amount is large, the driving time may be shortened by driving the chuck 502 and the pin 503 in parallel by the driving units 501 and 507.

  The drive units 501 and 507 are each one of various actuators such as a linear motor, an electromagnetic actuator, and a piezo actuator. The drive unit 501 and the drive unit 507 may be the same type of actuator or different types of actuators.

  The control unit 700 is connected to the drive units 501 and 507 and the exhaust units 505 and 506 via a wired or wireless communication line, and controls them. FIG. 2 is a diagram for explaining the control of the holding device 500. In particular, control for driving the chuck 502 and the pin 503 will be described.

  The control unit 700 is connected to a detection unit 900 that detects a substrate bending state (warping state). FIG. 3 is a diagram illustrating a configuration of the detection unit 900. The detection unit 900 includes a detection unit 901, a calculation unit 902, a hand 903, and a mounting table 904.

  The mounting table 904 includes a columnar member (columnar member) 904 a for supporting the substrate 300. The member 904a supports the substrate 300 at its upper end (support portion). The substrate 300 supported by the member 904a may be supported in a state of being curved in a downward convex shape or an upward convex shape.

  The hand 903 is a moving member that moves in the out-of-plane direction (Z-axis direction) of the substrate 300 based on an instruction from the command unit 701 of the control unit 700. The detection unit 901 detects contact between the hand 903 and the substrate 300 while the hand 903 is moving.

  The detection unit 901 includes an exhaust unit connected to an opening (not shown) provided on the upper surface of the hand 903 and a pressure sensor that measures pressure on the exhaust path. The detection unit 901 detects contact between the hand 903 and the substrate 300 by detecting that the pressure sensor has changed from atmospheric pressure to negative pressure.

  The term “while the hand 903 is moving” includes not only continuous movement but also intermittent movement. For example, it may include a case where pressure detection is performed every time the hand 903 is driven up by a predetermined amount (100 μm or less).

  The calculation unit 902 calculates the bending amount (warpage amount) of the substrate as the bending state of the substrate. The calculation unit 902 calculates a difference D between the position of the upper surface of the member 904a and the position of the hand 903 at the timing when the detection unit 901 detects contact between the hand 903 and the substrate 300 in the Z-axis direction. The calculation unit 902 outputs the difference D calculated to the determination unit 702 of the control unit 700 as the amount of bending of the substrate.

  Furthermore, the calculation unit 902 may determine whether the substrate 300 is upwardly convex or downwardly convex from the result of determining whether the difference D is positive or negative.

  Returning to the description of FIG. The control unit 700 includes a command unit 701 that inputs drive commands to the drive units 501 and 507 and the hand 903, a determination unit 702 that determines the drive command, and a storage unit 703.

  The determination unit 702 determines a drive profile of the pin 503 corresponding to the amount of bending of the substrate output from the detection unit 900 according to the program 706 stored in the storage unit 703 and inputs the drive profile to the command unit 701.

  The command unit 701 gives a drive command to the drive units 501 and 507 based on the drive profile determined by the determination unit 702. The drive command input to the drive units 501 and 507 is an electric signal such as a current value necessary for controlling the drive units 501 and 507.

  The storage unit 703 stores a table 704, a driving profile 705 indicating driving conditions in each transport mode, and a program 706 for a driving profile determination method.

  An example of the table 704 is shown in FIG. The table 704 includes a conveyance mode (row 11a), a range of the amount of bending of the substrate (row 11b), whether the pins 503 are driven up and down (row 11c) when the substrate is loaded, and a drive profile name (row 11d). , Are associated data. Although the unit of the numerical value described in the column 11b is arbitrary, it is [mm], for example. Note that the amount of bending as a threshold value for each conveyance mode illustrated in FIG. 4A is an example, and is not limited thereto.

  A drive profile 705 shown in FIG. 4B is information indicating the raising / lowering drive of the chuck 502 and the pin 503. Specifically, for example, at least one of a relationship between time (time) and driving speed, a relationship between time and position, and a relationship between time and acceleration is included.

(Driving profile determination method)
When the substrate is carried in above the holding surface 502b, if the pins 503 are not retracted sufficiently, the pins 03 and the substrate may collide, and the substrate may be damaged. Therefore, the determination unit 702 determines the drive profile so that the distance between the substrate loading / unloading path and the pin 503 when the substrate is loaded changes according to the warp of the substrate. As a result, the drive unit 501 drives the pin 503 so that the height of the upper end of the pin 503 changes based on the amount of curvature of the substrate.

  The contents of the program 706 executed by the determining unit 702 to realize this will be described with reference to the flowchart 1000 of FIG.

  In step S <b> 101, the determination unit 702 acquires the amount of board curvature calculated by the calculation unit 902. Next, the determination unit 702 determines the optimum transport mode by looping the flow of S102 to S105 for each transport mode included in the table 704.

  For example, in the first loop, in S103, the determination unit 702 acquires the minimum value and the maximum value of the bending amount of the substrate in the transport mode 1. Next, in S104, the determination unit 702 determines whether or not “minimum value acquired in S103 ≦ bending amount acquired in S101 <maximum value acquired in S103” is satisfied.

  When it is determined No in S104, S103 to S104 are similarly repeated in the next transport mode. If the corresponding transport mode is not found even after repeating S103 to S104 for the number of transport modes, the process proceeds to S106, and the determination unit 702 notifies the user of an error. The notification method may be display of an error message on the user interface or lighting of a predetermined lamp.

  When the determination unit 702 determines Yes in S104, the process proceeds to S107. In S107, the determination unit 702 refers to the table 704 and acquires the profile name of the pin 503 corresponding to the corresponding transport mode from the column 11d. In S108, the drive profile having the profile name acquired in S107 is acquired from the plurality of drive profiles 705.

  In S109, the determination unit 702 notifies the command unit 701 of the acquired drive profile. Thus, the program 706 is finished.

(Pin driving method)
Next, driving of the pin 503 when the pin 503 is driven based on the driving profile determined by the determining unit 702 will be described with reference to FIGS. 6, 7, and 8 sequentially drive the pin 503 and the chuck 502 when the substrate bending amount is the first amount, the second amount, and the third amount (first amount <second amount <third amount). FIG.

  FIG. 6 is a diagram illustrating the operation of the holding device 500 when the bending amount of the substrate 300 is the first amount and the transfer mode 1 of the table 704 is set. That is, when the substrate 300 is carried over the chuck 502, the pins 503 are not driven up and down (see the column 11c in FIG. 4).

  As shown in FIG. 6A, the drive unit 507 lowers the chuck 502 to a predetermined height. FIG. 6B is a diagram illustrating a state in which the substrate 300 is carried above the chuck 502 by the hand 400 without driving the pin 503 along the Z-axis direction. The hand 400 carries the substrate 300 along the loading / unloading path 400a when loading and unloading the substrate. The height of the carry-in / out route 400 a shown in the figure is the height of the hand 400.

  FIG. 6C shows a state where the substrate 300 is transferred to the pins 503 when the hand 400 is slightly lowered. At this time, the holding device 500 sucks the substrate 300 with the pins 503 using the exhaust part 506a. FIG. 6D shows a state where the chuck 502 is raised to the original position and the hand 400 is retracted. Thereafter, the holding device 500 sucks and holds the substrate 300 on the holding surface 502 b using the exhaust unit 505.

  As described above, in the transfer mode 1, when the bending amount of the substrate 300 is smaller than the allowable value, the pin 503 is not lowered when the substrate 300 is carried in. Even in this case, the collision between the pins 503 and the substrate 300 and the breakage of the substrate can be avoided.

  FIG. 7 is a diagram illustrating the operation of the holding device 500 when the bending amount of the substrate 300 is the second amount and the transfer mode 2 of the table 704 is set. That is, when the substrate 300 is carried above the chuck 502, the pins 503 need to be moved up and down.

  As shown in FIG. 7A, the drive unit 507 lowers the chuck 502 to a predetermined height. Next, as shown in FIG. 7B, the drive unit 501 lowers the pin 503 by a distance D1. FIG. 7C is a diagram illustrating a state in which the substrate 300 is carried over the chuck 502 by the hand 400. Thereafter, the drive unit 501 raises the pin 503 by the distance D1 as shown in FIG. 7D, and the hand 400 is slightly lowered as shown in FIG. Pass to 503.

  FIG. 7D shows a state where the chuck 502 is raised to the original position and the hand 400 is retracted.

  FIG. 8 is a diagram illustrating the operation of the holding device 500 when the bending amount of the substrate 300 is the third amount and the transfer mode 3 of the table 704 is set. That is, when the substrate 300 is carried above the chuck 502, the pins 503 need to be moved up and down.

  As shown in FIG. 8A, the drive unit 507 lowers the chuck 502 to a predetermined height. Next, as shown in FIG. 8B, the drive unit 501 lowers the pin 503 by a distance D2. Here, the relationship between the distance D1 and the distance D2 is D1 <D2, and the height of the upper end of the pin 503 is made lower than that in the transport mode 2.

  FIG. 8C is a view showing a state in which the substrate 300 is carried above the chuck 502 by the hand 400. Thereafter, the drive unit 501 raises the pin 503 by the distance D2 as shown in FIG. 8D, and the hand 400 slightly falls as shown in FIG. Pass to 503.

  FIG. 8D shows a state where the chuck 502 is raised to the original position and the hand 400 is retracted.

  As shown in FIGS. 7 and 8, when the substrate 300 is bent more than a predetermined amount, the pins 503 are lowered when the substrate 300 along the loading / unloading path 400a is loaded. In the control unit 700, the determination unit 702 determines a drive profile based on the detection result of the detection unit 900, and drives the drive unit 501 based on the drive profile. Specifically, when the substrate 300 having the second bending amount larger than the first bending amount is loaded, the driving unit 501 has the pin 503 having a larger amount than that when the substrate 300 having the first bending amount is loaded. Reduce the height of the top edge. Accordingly, when the height of the substrate 300 having the first bending amount and the substrate 300 having the second bending amount when the substrate 300 is carried into the upper side of the holding surface 502b is equal to the loading / unloading path 400a. Is greater when the substrate 300 having the second bending amount is loaded.

  Thereby, the collision between the pins 503 and the substrate 300 can be avoided, and the substrate 300 can be prevented from being damaged. Furthermore, compared to the case where the height of the upper end of the pin 503 is set to a constant value regardless of the bending amount of the substrate 300, it is possible to shorten the useless driving time of the pin 503 when the substrate 300 is loaded. it can. Thereby, the time until the substrate 300 is held on the chuck 502 can be shortened.

  For example, there is a difference of about 400 msec between the lowering and rising of the pin 503 between the transfer mode 1 and the transfer mode 3, and this time can be reduced per transfer of the substrate 300.

  This embodiment is a preferred embodiment when the substrate 300 may interfere with other members when the loading / unloading path 400a is shifted to the + Z direction side. In addition, this embodiment is a preferred embodiment when the variation in the amount of curvature of the substrate 300 to be loaded is large.

(Modification of the first embodiment)
A modification of the holding device 500 will be described below.

  When the holding unit 500 does not have the driving unit 507, the pin 503 may be protruded from the holding surface 502b by raising the pin 503 by the driving unit 501.

  The curved state of the substrate input to the determination unit 702 may include whether the substrate 300 is upwardly convex or downwardly convex. In this case, the determining unit 702 considers that the amount of curvature of the substrate 300 is 0 when the substrate 300 has a downward convex shape (a shape curved in the direction opposite to the shape shown in FIGS. 7 and 8). If the conveyance mode 1 is selected so that the pins 503 are not lowered when the substrate 300 is loaded above the chuck 502, the useless driving time of the pins 503 can be shortened.

  The holding device 500 may perform the operations shown in FIGS. 7A and 7B in the reverse order or in parallel. Similarly, the holding device 500 operates as shown in FIGS. 8A and 8B, as shown in FIGS. 7E and 7D, and as shown in FIGS. 8E and 8D. Each of the operations shown may be performed in the reverse order or in parallel.

  The bending state of the substrate detected by the detection unit 900 is not necessarily the amount of bending of the substrate 300. For example, when the row 11 b of the table 704 is defined by the position in the height direction of the hand 903, the detection unit 900 does not go through the calculation unit 902 and the hand 903 is in contact with the hand 903. The position in the height direction may be output.

  The shape of the substrate 300 when the detection unit 900 detects the amount of bending of the substrate 300 and the shape of the substrate 300 when it is carried in by the hand 400 may be different depending on the holding method. If the amount of bending of the substrate 300 when supported by the mounting table 904 is larger than the amount of bending of the substrate 300 when carried by the hand 400, collision between the substrate 300 and the pins 503 can be prevented.

  Alternatively, when it is possible to predict the curved state of the substrate 300 when it is carried by the hand 400 from the curved state of the substrate 300 when supported by the mounting table 904, the curved shape of the substrate 300 predicted from the detected curved amount. The height of the upper end of the pin 503 may be changed based on the shape.

  The detection means for detecting the curved state of the substrate is not limited to the detection unit 900 described above. For example, a measurement unit that measures the distance to the substrate 300 using a capacitance sensor, an eddy current sensor, a laser interferometer, or the like may be provided, and the curved state of the substrate 300 may be detected based on the measurement result of the measurement unit. . Further, these detection means are not necessarily provided in the holding device 500 and may be provided outside the holding device 500. In this case, the determination unit 702 receives information on the bending state of the substrate 300 detected by the external detection unit via the communication line, and drives the height of the upper end of the pin 503 to change based on the received information. Determine the profile.

  When transferring the substrate 300 from the hand 400 to the pin 503 and raising the pin 503 and lowering the hand 400 in parallel, if the pin 503 and the substrate 300 collide vigorously, There is a risk of damage. Therefore, it is preferable that the driving profile of the transport mode 3 is set so that the absolute value of the acceleration of the pin 503 immediately before contacting the substrate 300 is equal to or less than the predetermined value α regardless of the driving amount of the pin 503.

  FIG. 9A is a diagram showing a drive profile when the pin 503 once lowered in the transport mode 2 is raised. FIG. 9B is a diagram showing a drive profile when the pin 503 once lowered in the transport mode 3 is raised. 9A and 9B, the horizontal axis indicates time, the vertical axis indicates speed, and the positive direction of speed is the + Z direction.

  As shown in FIG. 9A, the driving unit 501 accelerates the pin 503 at the maximum acceleration at time t0 to t1, and at a constant speed at time t1 to t2. From time t2 to t3, the absolute value is increased while decelerating at an acceleration of a predetermined value α or less.

  As shown in FIG. 9B, the driving unit 501 raises the pin 503 while accelerating at the maximum acceleration at time t0 to t1, constant speed at time t1 to t2, and decelerating at the maximum acceleration at time t2 to t3. Next, if the pin 503 and the substrate 300 contact with each other while continuing to decelerate at the maximum acceleration, the substrate 300 may be damaged. Therefore, the drive unit 501 moves the pin 503 at a constant speed from time t3 to time t4. From time t4 to t4, the absolute value is increased while decelerating at an acceleration that is less than or equal to the predetermined value α.

  That is, in the conveyance mode 3, the absolute value of the acceleration of the pin 503 at the time of deceleration is changed in multiple stages so that the absolute value of the acceleration of the pin 503 immediately before contacting the substrate 300 is equal to or less than the predetermined value α. As a result, it is possible to prevent the pin 503 and the substrate 300 from colliding and the substrate 300 from being damaged while the driving unit 501 drives the pin 503 in a direction to approach the carry-in / out path 400a.

[Second Embodiment]
In the first embodiment, the lowering amount of the pin 503 when the substrate 300 is carried in is set to be the same as the subsequent rising amount of the pin 503. However, when the amount of curvature of the substrate 300 is large, the height of the central portion of the substrate 300 may be high. Therefore, it may take time to deliver the hand 400 to the pin 503.

  Therefore, in the holding device 500 of the present embodiment, a drive profile is set that increases the amount by which the pins 503 are raised after the substrate 300 is loaded above the chuck 502b as the amount of curvature of the substrate 300 increases. Thereby, in addition to the same effects as those of the first embodiment, it is possible to shorten the time until the substrate 300 is transferred from the hand 400 to the pins 503 after the substrate 300 is carried over the chuck 502.

[Third Embodiment]
The holding device 500 according to the third embodiment relates to control when the substrate 300 is carried out. The substrate 300 is unloaded in the reverse order from the loading to holding of the substrate 300 described in the first embodiment. When the hand 400 unloads the substrate 300 from above the holding surface 502b along the loading / unloading path 400a, the outer peripheral portion of the substrate 300 and the pin 503 may collide if the upper end of the pin 503 is at a high position. .

  Therefore, in the holding device 500 according to the present embodiment, the determination unit 702 determines the drive profile so that the height of the upper end of the pin 503 changes based on the amount of bending of the substrate received from the detection unit 900. Thus, after the substrate 300 is transferred from the pin 503 to the hand 400, the hand 400 can move in the horizontal direction along the loading / unloading path 400a so that the upper end of the pin 503 does not interfere with the substrate 300.

  The determination unit 702 may determine the height of the upper end of the pin 503 when the substrate 300 is unloaded to be the same as the height of the upper end of the pin 503 when the substrate 300 is loaded above the holding surface 502. . When the substrate 300 is deformed and the bending amount changes after the substrate 300 is carried in to before it is carried out, the determining unit 702 drives the driving profile of the pin 503 so as to have a height corresponding to the changed bending amount. May be determined. The amount of bending of the substrate 300 during unloading may be detected every time the substrate 300 is unloaded. Alternatively, the amount of bending of the representative substrate 300 may be detected after the representative substrate 300 is unloaded, and the result may be regarded as the amount of bending of the substrate 300 that is subsequently held.

  Thereby, the collision between the pins 503 and the substrate 300 when the substrate 300 is carried out can be avoided, and the substrate 300 can be prevented from being damaged. Furthermore, compared to the case where the height of the upper end of the pin 503 is set to a constant value regardless of the amount of curvature of the substrate 300, it is possible to shorten the useless driving time of the pin 503 when the substrate 300 is carried out. it can. Thereby, the time until the substrate 300 is carried out from above the chuck 502 can be shortened.

[Fourth Embodiment]
The holding device 500 according to the fourth embodiment performs a holding operation of the substrate 300 in order to change the relative position of the chuck 502 and the substrate 300 in the rotation direction. In the holding operation, the pin 503 is protruded from the holding surface 502b from the state where the substrate 300 is held by the chuck 502, and the substrate 300 is rotated by θ along the holding surface 502b while being supported by the pin 503, and then the chuck 502 is moved. This is an operation to re-hold.

  In addition to the table 704, the storage unit 703 stores a table in which the change mode, the range of the amount of bending of the substrate, the presence / absence of the lifting / lowering of the pin 503 associated with the change operation, and the drive profile name are associated. Further, the storage unit 703 stores drive profile names corresponding to each holding mode.

  The determination unit 702 determines the driving profile of the chuck 502 and the pin 503 corresponding to the bending amount of the substrate 300 based on the bending amount bending state of the substrate 300 input from the detection unit 900 or the like. Then, the determined drive profile is input to the command unit 701.

  The holding device 500 according to the present embodiment includes a driving unit 501 and a driving unit 507 as driving means that drives at least one of the chuck 502 and the pin 503 along the direction in which the pin 503 projects from the holding surface 502b.

  In the holding device 500 according to the present embodiment, the driving unit 501 also has a function as a rotating unit that relatively rotates the chuck 502 and the substrate 300 along the holding surface 502b. The opening 502a is configured to be larger than the circle of the diameter of the pin 503.

  FIG. 10 is a diagram illustrating a state of the change-over operation. FIG. 10A shows a state where the chuck 502 holds the substrate 300 by suction. Next, as illustrated in FIG. 10B, the drive unit 507 lowers the chuck 502 and the drive unit 501 raises the pin 503 based on the drive command determined by the determination unit 702. As a result, the pin 503 protrudes from the holding surface 502b by the protrusion amount D3.

  Here, the determination unit 702 determines a drive profile for changing the protrusion amount of the pin 503 based on the bending amount of the substrate 300 received from the detection unit 900. In other words, the drive units 501 and 507 have a protruding amount when holding the substrate 300 having the second bending amount larger than the protruding amount when holding the substrate 300 having the first bending amount. The chuck 502 and the pin 503 are driven so as to be larger.

  Then, the driving unit 501 rotates the substrate 300 with respect to the holding surface 502b while the pins 300 are supporting the substrate 300. In this rotation operation, the center of gravity of the three pins 503 in the in-plane direction of the holding surface 502b is set as the rotation center, and the three pins 503 are held on the holding surface without changing the relative positional relationship of the three pins 503. This is an operation of rotating in the in-plane direction 502b.

  If a desired amount of rotation cannot be obtained within one movable range, the substrate 300 is once transferred to the chuck 502, the suction of the substrate 300 by the pins 503 is released, and the horizontal position of the three pins 503 is rotationally driven. Return to the previous position. Thereafter, the drive unit 501 causes the pins 503 to protrude again from the holding surface 502b, and rotationally drives the three pins 503. These operations may be repeated until a desired rotation amount is obtained.

  Thereby, even when the substrate 300 has a warp, the collision between the substrate 300 and the chuck 502 when the substrate 300 is rotated can be prevented. Further, since the protrusion amount of the pin 503 is changed based on the bending amount of the substrate 300, the pin 503 protrudes from the holding surface 502b as compared with the case where the holding operation is performed with a constant protrusion amount according to the maximum bending amount of the substrate 300. The time required for the operation to be performed can be shortened.

  Note that the rotation unit that relatively rotates the chuck 502 and the substrate 300 may be a mechanism that rotates the chuck 502 along the holding surface 502 b with respect to the pin 503.

  This embodiment is suitable, for example, when the holding device 500 is mounted on a lithography apparatus such as an exposure apparatus. The exposure apparatus has an alignment system that detects marks arranged around each processing region. If the processing region formed on the substrate 300 once held is displaced more than expected, the alignment system The mark may not fit in the detection field. By performing the holding operation performed in such a case with the holding device 500 according to the present embodiment, the time required for alignment measurement can be shortened.

(Modification of the fourth embodiment)
A modification of the holding device 500 will be described below. The holding device 500 may have only one of the drive units 501 and 507 as long as the pin 503 can protrude from the holding surface 502b.

  The curved state of the substrate may include whether the substrate 300 is upwardly convex or downwardly convex. In this case, when the substrate 300 has a downward convex shape (a shape warped in the opposite direction to the shape shown in FIG. 10), the determining unit 702 considers the amount of curvature of the substrate 300 to be 0 and sets the protrusion amount to the lower limit value. Select the change mode.

  The detection means for detecting the curved state of the substrate 300 is not necessarily provided in the holding device 500, and may be provided outside the holding device 500. In this case, the determination unit 702 receives information about the bending state of the substrate 300 detected by the external detection unit via the communication line, and determines a drive profile based on the received information.

  In addition, you may implement combining the holding | maintenance apparatus 500 which concerns on 1st-4th embodiment mentioned above suitably.

[Fifth Embodiment]
As a fifth embodiment, an exposure apparatus 600 according to an embodiment of a lithography apparatus that forms a pattern on a substrate 300 will be described. The exposure apparatus 600 has a holding device 500.

  FIG. 11 is a view showing the arrangement of the exposure apparatus 600. As shown in FIG. In FIG. 11, the optical axis of the projection optical system 610 is parallel to the Z axis. The holding device 500 has the function of at least one of the first to fourth embodiments. In the holding device 500, the components other than the chuck 502 and the pin 503 are not shown.

  In addition to the holding device 500, the exposure apparatus 600 according to the present embodiment has the following configuration as a forming unit that forms a pattern on the substrate 300.

  A reticle (original) 602 is illuminated with illumination light 603 via the illumination optical system 601, and a pattern image formed on the illuminated reticle 602 is projected onto the substrate 300 via the projection optical system 610. The stage 606 holds the reticle 602 and scans in the X-axis direction. The stage 607 moves the substrate 300 held on the chuck 502 by a drive mechanism (not shown) such as a mounted linear motor. The stage 607 may include a coarse movement stage and a fine movement stage that moves with a shorter stroke than the coarse movement stage.

  The exposure apparatus 600 forms a latent image pattern of a resist applied to the substrate 300 while relatively scanning the reticle 602 and the substrate 300 with stages 606 and 607. The interferometer 608 irradiates the mirror 609 and the interferometer 604 irradiates the mirror 611 with laser light, and detects the position of the reticle 602 and the substrate 300 by receiving the reflected light. The detection system 612 detects an alignment mark (not shown) formed on the substrate 300 and a reference mark (not shown) provided on the stage 607.

  The control unit 615 is connected to the stages 606 and 607, the detection system 612, the interferometers 608 and 610, and the holding device 500, and comprehensively controls them. For example, at the time of exposure processing, a pattern formation position is determined based on the detection result of the detection system 612, and the stages 606 and 607 are controlled based on position information obtained from the interferometers 608 and 610. The control unit 615 controls the holding device 500 when the substrate 300 is carried in and out.

  Note that the control unit 615 may be configured in a casing that houses components other than the control unit 615, or may be configured in a casing different from the casing. As long as these control functions are provided, they may be configured on the same control board or may be configured on different control boards.

  Further, the exposure apparatus 600 includes a transport system 4 for transporting the substrate 300 onto the stage 607. FIG. 12 is a diagram illustrating a configuration of the transport system 4.

  The substrate 300 on which a resist is applied by an external coater / developer is temporarily placed on the columnar member 402 of the placement table 403. The hand 405 transports the substrate 300 from the mounting table 403 to the pre-alignment stage 404. The pre-alignment stage 404 adjusts the position in the rotation direction of the substrate 300 by rotating the substrate 300 along the holding surface of the pre-alignment stage 404. The hand 400 receives the substrate 300 from the pre-alignment stage 404 and carries the substrate 300 above the chuck 502. The stage 607 positions the substrate 300 below the projection optical system 610, and the substrate 300 is exposed.

  Here, using the mounting table 403 and the hand 405, the curved state of the substrate 300 may be detected as in the detection unit 900 described above. In addition, using the detection result, it is determined whether or not there is a possibility of collision between the substrate 300 and another member during the transfer of the substrate 300 to the chuck 502, and based on the determination result, when the hands 400 and 405 are transferred. Control in the transport system 4 such as height may be changed.

  In the exposure apparatus 600, the driving time of the pins 503 and the chuck 502 can be shortened when the substrate 300 is carried in and / or when the substrate 300 is carried out, as compared with the conventional technique. As a result, the number of substrates exposed per unit time (throughput) can be improved while preventing damage to the substrate.

  The exposure apparatus 600 is not limited to an exposure apparatus (scanner) that performs exposure by a step-and-scan method, but may be an exposure apparatus (stepper) that performs exposure by a step-and-repeat method. The light used for exposure can be selected from various rays such as g-line (wavelength 436 nm), i-line (wavelength 365 nm), ArF laser light (wavelength 193 nm), EUV light (wavelength 13 nm), and the like.

  The lithographic apparatus is not limited to the exposure apparatus 600, and can be applied to other apparatuses that form a pattern on a substrate. The lithographic apparatus may be, for example, a drawing apparatus that forms a latent image pattern on a substrate by irradiating a charged particle beam or a laser beam. Or the imprint apparatus which forms the uneven | corrugated pattern hardened | cured on the board | substrate using the type | mold may be sufficient.

  The holding device 500 may be mounted on a processing apparatus that performs a predetermined process on the substrate 300 other than the exposure apparatus. For example, the processing apparatus may be an etching apparatus.

[Production Method]
The pattern of the cured product formed by using the imprint apparatus or the pattern of the cured product remaining after developing the latent image pattern formed by using another lithographic apparatus may be permanently or variously used on at least a part of various articles. Temporarily used when manufacturing articles.

  The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  These manufacturing methods for an article include a forming process for forming a pattern on a substrate using a lithography apparatus, and a processing process for processing the substrate on which the pattern is formed for manufacturing the article. The pattern of the cured product formed through the forming process is used as it is as at least a part of the constituent members of the article or temporarily used as a resist mask. In the processing step, after etching or ion implantation is performed, the resist mask is removed.

  The processing steps may further include other known processing steps (development, oxidation, film formation, vapor deposition, planarization, resist stripping, dicing, bonding, packaging, etc.).

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

300 substrate 400 transfer unit 500 holding device (substrate holding device)
501 Drive unit (drive means, rotation means)
507 Drive unit (drive means)
502 Chuck (holding member)
502b Holding surface 503 Pin (support member)

Claims (12)

A holding member for holding the substrate on the holding surface;
A support member capable of supporting the substrate above the holding surface by protruding from the holding surface;
In the substrate holding apparatus in which the substrate is carried into the upper side of the holding surface or the substrate is carried out from the upper side of the holding surface in a state where the support member protrudes from the holding surface.
Drive means for driving the support member in the height direction,
The drive means is configured to change a height of an upper end of the support member when the substrate is carried in or when the substrate is carried out based on a curved state of the substrate. apparatus. Along with the loading or unloading of the substrate having the second bending amount larger than the first bending amount,
2. The substrate holding apparatus according to claim 1, wherein the driving unit makes the height of the upper end lower than when the first curved amount of the substrate is carried in. 3.   The height of the substrate of the first bending amount and the height of the substrate of the second bending amount when being carried in above the holding surface or carried out from above the holding surface are equal to each other. The substrate holding device according to claim 2.   The drive means drives the support member in a direction approaching the substrate after the substrate is carried in, and the acceleration of the support member when the support member contacts the substrate during driving in the approaching direction. The substrate holding apparatus according to claim 1, wherein the support member is driven so that an absolute value is equal to or less than a predetermined value.   The drive means is configured so that the height of the support member is higher after a substrate having a second bending amount larger than the first bending amount is loaded, than after a substrate having the first bending amount is loaded. The substrate holding apparatus according to claim 4, wherein the support member is driven in the approaching direction. The drive means is first drive means, and has second drive means for driving the holding member along the height direction,
The said 2nd drive means drives the said holding member in the direction away from the carrying-in / out path | route of the said board | substrate with carrying in or carrying out of the said board | substrate, The any one of Claim 1 thru | or 5 characterized by the above-mentioned. Substrate holding device. A holding member for holding the substrate on the holding surface;
A support member capable of supporting the substrate above the holding surface by protruding from the holding surface;
Drive means for driving at least one of the holding member and the support member in a height direction;
After the driving means drives the at least one member to project the support member from the holding surface, the holding member and the substrate along the holding surface in a state where the support member supports the substrate. Rotating means for relatively rotating
The drive means changes the amount of protrusion of the support member from the holding surface when the rotating means relatively rotates the holding member and the substrate based on the curved state of the substrate. Substrate holding device.   The driving means has a larger amount of protrusion when supporting a substrate having a second bending amount that is larger than the first amount of bending than the amount of protrusion when supporting the substrate having a first amount of bending. The substrate holding apparatus according to claim 7, wherein the at least one member is driven as described above.   The substrate holding apparatus according to claim 7, wherein the rotating unit moves the support member in an in-plane direction of the holding surface. Detecting means for detecting the amount of bending of the substrate;
The detection means includes
A moving member that moves in an out-of-plane direction of the substrate supported by the support;
Detecting means for detecting contact between the moving member and the substrate;
10. The curved state of the substrate is detected based on a position of the moving member when the detecting unit detects the substrate in the out-of-plane direction. The board | substrate holding apparatus of description. A substrate holding device according to any one of claims 1 to 10,
And a forming unit that forms a pattern on the substrate held by the substrate holding device. Forming a pattern on a substrate using the lithographic apparatus according to claim 11;
A processing step of processing the substrate on which the pattern is formed in the step,
A method for producing an article, comprising producing an article including the treated substrate.

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