JP2018146923A - Liquid crystal display - Google Patents

Abstract

An object of the present invention is to prevent wiring corrosion near a terminal portion of a liquid crystal display device having a liquid crystal display panel having a touch panel function. A liquid crystal display device in which a first substrate 100 on which video signal lines and scanning lines are formed and a second substrate 200 are bonded together by a sealing material 30 and liquid crystal is sealed inside is provided. A display region 90 and a frame region are formed in a portion where the substrate 100 and the second substrate 200 overlap, and a terminal portion 150 is formed in a portion where the first substrate 100 and the second substrate 200 do not overlap. The second substrate 200 includes a first frame region formed on the first side adjacent to the terminal portion 150, a second side facing the first side, the first side, and the second side. Corresponding to the first frame region in the third or fourth side and the width of the portion of the sealing material 30 corresponding to the first side. The width 30 of the portion of the sealing material corresponds to the display area 90 of the third side or the fourth side. Greater than the width of the sealing material 31 of the portion. [Selection] Figure 10

Description

  The present invention relates to a display device, and more particularly to a liquid crystal display device having improved reliability by preventing corrosion of terminal wiring in a liquid crystal display device having a touch panel.

  In a liquid crystal display device, a TFT substrate in which pixels having pixel electrodes and thin film transistors (TFTs) are formed in a matrix and a counter substrate are arranged opposite the TFT substrate, and liquid crystal is sandwiched between the TFT substrate and the counter substrate. ing. For each pixel, an image is formed by controlling light transmittance with liquid crystal molecules. Since liquid crystal display devices are flat and lightweight, they are used in various fields.

  In recent years, touch panel type liquid crystal display devices have increased as input methods. Conventionally, as a touch panel system, a type in which a liquid crystal display panel and a touch panel are separately manufactured and a touch panel is mounted on a counter substrate of the liquid crystal display panel has been used. Japanese Patent Application Laid-Open No. 2005-228561 describes a configuration in a liquid crystal display device having a touch panel that prevents bubbles from being generated by an external impact or the like in the liquid crystal display panel.

  In Patent Document 1, in the liquid crystal display panel, the generation of bubbles is prevented by preventing the deviation between the counter substrate and the TFT substrate. For this purpose, the seal material between the counter substrate and the TFT substrate is used as the inner seal material. And an outer seal material. However, the inner sealing material is formed in a flying manner, and liquid crystal exists between the inner sealing material and the outer sealing material.

JP-A-10-153786

  There is an increasing demand to make the entire liquid crystal display device as thin as possible. In order to meet this demand, a method has been developed in which the liquid crystal display panel itself has a touch panel function. In this method, one electrode for the touch panel is formed outside the counter substrate of the liquid crystal display panel, and the other electrode is formed in the liquid crystal display panel.

  In this case, one electrode of the touch panel formed on the TFT substrate side is formed at the same time as the common electrode of the liquid crystal display panel, but is formed electrically separated from the common electrode. The other electrode formed outside the counter substrate is generally covered with an inorganic film such as silicon oxide (hereinafter referred to as SiO) or silicon nitride (hereinafter referred to as SiN).

  In order to confirm the reliability of the liquid crystal display device having such a configuration, an environmental test is performed. The environmental test is performed, for example, in a high temperature and high humidity environment. In the energization test for the touch panel, for example, a voltage of about 8 V is applied to one electrode formed on the TFT substrate side. One electrode is formed of a large number of electrodes and wirings.

  In such an environmental test, corrosion occurred in a part of the wiring. An object of the present invention is to realize a highly reliable liquid crystal display device that does not corrode wiring even in such a current-carrying test in a harsh environment.

  The present invention overcomes the above-mentioned problems, and main specific means are as follows.

  (1) A liquid crystal display device in which a first substrate on which video signal lines and scanning lines are formed and a second substrate are bonded together by a sealing material and liquid crystal is sealed therein, and the first substrate A display region and a frame region are formed in a portion where the second substrate overlaps, and a terminal portion is formed in a portion where the first substrate and the second substrate do not overlap, The substrate includes: a first frame region formed on a first side adjacent to the terminal portion; a second side facing the first side; the first side and the second side Corresponding to the first frame region in the third side or the fourth side and the width of the portion of the sealing material corresponding to the first side The width of the sealing material of the portion to be processed is that of the sealing material of the portion corresponding to the display area of the third side or the fourth side. The liquid crystal display device and greater than.

  (2) A liquid crystal display device in which a first substrate on which video signal lines and scanning lines are formed and a second substrate are bonded together by a sealing material and liquid crystal is sealed therein, and the first substrate A display region and a frame region are formed in a portion where the second substrate overlaps, and a terminal portion is formed in a portion where the first substrate and the second substrate do not overlap, The substrate includes: a first frame region formed on a first side adjacent to the terminal portion; a second frame region formed on a second side opposite to the first side; A third side and a fourth side connecting the first side and the second side, the width of the sealing material corresponding to the first side and the third side or the fourth side The width of the portion of the sealing material corresponding to the first frame area in the display area of the third side or the fourth side The width of the seal material of the portion corresponding to the second side and the width of the portion corresponding to the second frame region in the third side or the fourth side is larger than the width of the seal material of the corresponding portion. The width of the sealing material is larger than the width of the sealing material corresponding to the display area on the third side or the fourth side.

It is a top view of a liquid crystal display device. It is sectional drawing of the display area | region of the liquid crystal display device of an IPS system. It is a perspective view which shows the wiring in the case of giving a liquid crystal display device the function of a touch panel. It is sectional drawing in the case of using a liquid crystal display device as a touch panel. It is a top view at the time of forming the electrode for touch panels in a TFT substrate. It is an enlarged plan view which shows the electrode arrangement | positioning for touchscreens in a TFT substrate. It is AA sectional drawing of FIG. It is sectional drawing of the electrode for touchscreens. It is BB sectional drawing of FIG. 1 is a plan view of Example 1. FIG. FIG. 3 is an enlarged view of a frame region on the terminal portion side in Example 1. 6 is a plan view showing a manufacturing process of Example 1. FIG. FIG. 13 is a plan view showing a manufacturing process following FIG. 12. 6 is a plan view of Example 2. FIG. 10 is a plan view showing a first form of Example 3. FIG. It is a top view which shows the 2nd form of Example 3. FIG.

  The contents of the present invention will be described in detail below using examples.

  FIG. 1 is a plan view of a liquid crystal display device according to the present invention. In FIG. 1, a TFT substrate 100 and a counter substrate 200 are bonded together by a sealing material 30, and liquid crystal is sealed inside. A display region 90 is formed in a portion where the TFT substrate 100 and the counter substrate 200 overlap. In the display area 90, the scanning lines 11 extend in the horizontal direction and are arranged in the vertical direction. The video signal lines 12 extend in the vertical direction and are arranged in the horizontal direction. Pixels 13 are formed in a region surrounded by the scanning lines 11 and the video signal lines 12.

  The TFT substrate 100 is formed larger than the counter substrate 200, and a portion where the TFT substrate 100 and the counter substrate 200 do not overlap with each other is a terminal portion 150. A driver IC 160 for driving the liquid crystal display device is mounted on the terminal portion 150, and a flexible wiring board 170 for supplying power and signals to the liquid crystal display device is connected. Various wirings are concentrated near the terminal portion 150.

  There is a strong demand for the liquid crystal display device to increase the display area 90 while keeping the outer shape small, and the width from the end of the display area 90 to the end of the counter substrate 200 (hereinafter referred to as a frame area) is small. Is required to do. The width of the frame region is slightly different depending on the side. The demand for the frame width on the long side is the strictest. In FIG. 1, for example, w1 is about 0.5 mm. In order to cope with this, the width w11 of the sealing material is as narrow as about 0.35 mm.

  On the other hand, the frame width w2 on the short side opposite to the terminal portion 150 is slightly larger than the frame width on the long side. In FIG. 1, the width w22 of the sealing material on the short side opposite to the terminal portion 150 is equal to the width w11 of the sealing material on the long side. On the other hand, even on the short side, the frame width w3 is smaller on the side where the terminal portion 150 is formed than on the other side because of the concentration of wiring and large peeling stress. w33 is also getting bigger. On the terminal portion 150 side, the width w33 of the sealing material is, for example, 0.7 mm. For this reason, on the side on the terminal portion 150 side, for example, when the sealing material is formed by a dispenser, the sealing material 30 is applied twice in the planar direction.

  FIG. 2 is a cross-sectional view of the liquid crystal display panel of FIG. FIG. 2 is a cross-sectional view of an IPS liquid crystal display device. Hereinafter, an IPS liquid crystal display device will be described as an example. Note that the present invention is not limited to the IPS system and can be applied to other liquid crystal display devices such as VA and TN as long as a wiring for a touch panel described later can be formed.

  In FIG. 2, a first base film 101 made of SiN and a second base film 102 made of SiO are formed on a glass substrate 100 by CVD (Chemical Vapor Deposition). The role of the first base film 101 and the second base film 102 is to prevent impurities from the glass substrate 100 from contaminating the semiconductor layer 103.

  A semiconductor layer 103 is formed on the second base film 102. The semiconductor layer 103 is formed by forming an amorphous silicon (hereinafter a-Si) film on the second base film 102 by CVD, and converting it into a polycrystalline silicon (hereinafter poly-Si) film by laser annealing. It is. The poly-Si film is patterned by photolithography.

A gate insulating film 104 is formed on the semiconductor layer 103. This gate insulating film 104 is a SiO ₂ film made of TEOS (tetraethoxysilane). This film is also formed by CVD. A gate electrode 105 is formed thereon. The gate electrode 105 also serves as the scanning line 10 shown in FIG. For example, the gate electrode 105 is formed of a MoW film. When it is necessary to reduce the resistance of the gate electrode 105 or the scanning line 11, an Al alloy is used.

  The gate electrode 105 is patterned by photolithography. After this patterning, an impurity such as phosphorus or boron is doped into the poly-Si layer by ion implantation to form the source S or drain D in the poly-Si layer. . Further, an LDD (Lightly Doped Drain) layer is formed between the channel layer of the poly-Si layer and the source S or the drain D using a photoresist when patterning the gate electrode 105.

Thereafter, a first interlayer insulating film 106 is formed of SiO _{2 so as} to cover the gate electrode 105. The first interlayer insulating film 106 is for insulating the gate wiring 105 and the contact electrode 107. A through hole 120 for connecting the source portion S of the semiconductor layer 103 to the contact electrode 107 is formed in the first interlayer insulating film 106 and the gate insulating film 104. Photolithography for forming the through hole 120 in the first interlayer insulating film 106 and the gate insulating film 104 is performed simultaneously.

  A contact electrode 107 is formed on the first interlayer insulating film 106. The contact electrode 107 is connected to the pixel electrode 112 through the through hole 130. The drain D of the TFT is connected to the video signal line 12 shown in FIG.

  The contact electrode 107 and the video signal line 12 are formed in the same layer at the same time. For example, Al (Aluminum) is used for the contact electrode 107 and the video signal line 12 in order to reduce the resistance. Since Al generates hillocks or Al diffuses into other layers, for example, a structure is adopted in which Al is sandwiched by a barrier layer made of Mo (Molybdenum) and a cap layer.

  The contact electrode 107 is covered and an inorganic passivation film (insulating film) 108 is covered to protect the entire TFT. The inorganic passivation film 108 is formed by CVD in the same manner as the first base film 101. An organic passivation film 109 is formed so as to cover the inorganic passivation film 108. The organic passivation film 109 is made of a photosensitive acrylic resin. The organic passivation film 109 can be formed of silicone resin, epoxy resin, polyimide resin, or the like in addition to acrylic resin. Since the organic passivation film 109 has a role as a planarizing film, it is formed thick. The thickness of the organic passivation film 109 is 1 to 4 μm, but in many cases is about 2 μm.

  In order to establish conduction between the pixel electrode 110 and the contact electrode 107, a through hole 130 is formed in the inorganic passivation film 108 and the organic passivation film 109. The organic passivation film 109 uses a photosensitive resin. When this resin is exposed after application of a photosensitive resin, only the portion exposed to light is dissolved in a specific developer. That is, the formation of a photoresist can be omitted by using a photosensitive resin. After the through-hole 130 is formed in the organic passivation film 109, the organic passivation film 109 is completed by baking the organic passivation film at about 230 ° C.

  Thereafter, ITO (Indium Tin Oxide) to be the common electrode 110 is formed by sputtering. The ITO is removed from the through hole 130 and the surrounding area. Although not shown in FIG. 2, as shown in FIG. 6, ITO forming the common electrode 110 also serves as one electrode (vertical electrode 50) of the touch panel. A portion having a slit in a stripe shape and electrically insulating each common electrode 110 is formed. In FIG. 6, the non-formation region of the common electrode 110 on the right video signal line 12 indicates this slit. That is, as shown in FIG. 6, the vertical electrodes 50 shown in FIG. 2 are formed in stripes in the extending direction of the video signal lines so as to cover a plurality of columns of pixels, as shown in FIG.

  Thereafter, SiN to be the second interlayer insulating film 111 is formed on the entire surface by CVD. Thereafter, a through hole is formed in the second interlayer insulating film 111 and the inorganic passivation film 108 in order to make the contact electrode 107 and the pixel electrode 112 conductive in the through hole 130.

  Thereafter, ITO is formed by sputtering and patterned to form the pixel electrode 112. The pixel electrode 112 has a comb shape or a single stripe shape. An alignment film material is applied on the pixel electrode 112 by flexographic printing or inkjet, and is baked to form the alignment film 113. For the alignment treatment of the alignment film 113, photo-alignment using polarized ultraviolet rays is used in addition to the rubbing method.

  When a voltage is applied between the pixel electrode 112 and the common electrode 110, lines of electric force as shown in FIG. 2 are generated. The liquid crystal molecules 301 are rotated by this electric field, and an image is formed by controlling the amount of light passing through the liquid crystal layer 300 for each pixel.

  In FIG. 2, the counter substrate 200 is disposed with the liquid crystal layer 300 interposed therebetween. A color filter 201 is formed inside the counter substrate 200. The color filter 201 is formed with red, green, and blue color filters for each pixel, thereby forming a color image. A black matrix 202 is formed between the color filters 201 to improve the contrast of the image. Note that the black matrix 202 also has a role as a light shielding film of the TFT, and prevents a photocurrent from flowing through the TFT.

  An overcoat film 203 is formed to cover the color filter 201 and the black matrix 202. Since the surface of the color filter 201 and the black matrix 202 is uneven, the surface is flattened by the overcoat film 203. The overcoat film 203 prevents the dye from the color filter 201 from diffusing into the liquid crystal. On the overcoat film 203, an alignment film 113 for determining the initial alignment of the liquid crystal is formed. Similar to the alignment film 113 on the TFT substrate 100 side, the rubbing method or the photo-alignment method is used for the alignment process of the alignment film 113.

  The other electrode 40 for causing the liquid crystal display panel to function as a touch panel is formed outside the counter substrate. The relationship between the horizontal electrode and the vertical electrode in the touch panel will be described with reference to FIG. The electrode 40 is covered with a protective film 41 made of SiN or SiO.

  FIG. 3 is a perspective view showing a configuration for causing the liquid crystal display device to function also as a touch panel. In FIG. 3, the counter substrate 200 is formed with a horizontal electrode 40 for a touch panel. This functions as an Rx electrode which is a detection electrode for detecting a touch position. A vertical electrode 50 for a touch panel is formed on a surface of the TFT substrate 100 facing the counter substrate 200. The vertical electrode 50 is formed simultaneously with the common electrode formed on the TFT substrate 100. The vertical electrode 50 functions as a Tx electrode that is a drive electrode to which a voltage pulse for a touch panel is applied.

  FIG. 4 is a cross-sectional view showing the principle for operating the liquid crystal display device as a touch panel. In FIG. 4, a lateral electrode 40 extends laterally outside the counter substrate 200. A vertical electrode 50 extends in the direction perpendicular to the paper surface on the liquid crystal layer 300 side of the TFT substrate 100. The pitch Tpx of the vertical electrodes 50 is an integral multiple of the horizontal pitch of the pixels.

  In FIG. 4, a capacitance 60 is formed between the horizontal electrode 40 and the vertical electrode 50. This capacitance exists at all intersections of the horizontal electrode 40 and the vertical electrode 50. When the counter substrate 200 is touched with a finger or the like, the value of the capacitance 60 changes, so that the touch position can be detected by detecting the position where the capacitance 60 has changed.

  FIG. 5 is a plan view illustrating only the vertical electrode 40 in the TFT substrate 100. In FIG. 5, the vertical electrodes 50 are formed in the display region 90 at a predetermined pitch in the vertical direction. The vertical electrode 50 is bent at the side on the terminal portion 150 side and extends in the direction of the terminal portion 150. In the terminal unit 150, for example, a touch panel drive signal is applied to the vertical electrode 50 from within the driver IC 160. 5 shows an example in which a touch panel drive circuit is incorporated in a driver IC 160 for driving a liquid crystal display device, but an IC may be separately arranged for the touch panel.

  FIG. 6 is a plan view showing a wiring configuration in the display area of the TFT substrate 100. In FIG. 6, the scanning lines 11 extend in the horizontal direction and are arranged in the vertical direction. The video signal lines 12 extend in the vertical direction and are arranged in the horizontal direction. A region surrounded by the scanning lines 11 and the video signal lines 12 is a pixel region, and a plurality of common electrodes 110 extend in the vertical direction in the pixel region. The common electrode 110 also serves as the vertical electrode 50. When displaying an image, a common voltage serving as a reference potential of an image signal applied to the pixel electrode is applied. A drive voltage is applied.

The common electrode 110 (vertical electrode 50) is formed of ITO which is a transparent conductive film. That is, after the ITO is formed on the entire surface by sputtering or the like, the plurality of common electrodes 110 are separated in the vertical direction by photolithography. Common electrode 110 (vertical electrode 50)
In order to reduce the electrical resistance, a metal or alloy metal wiring 70 is superimposed. Since the metal wiring 70 is opaque, it is formed on a part of the video signal lines 12.

  FIG. 7 is a cross-sectional view of the liquid crystal display device corresponding to the AA cross section of FIG. The cross-sectional configuration in FIG. 7 is the same as the configuration described in FIG. In FIG. 7, the video signal line 12 is formed on the interlayer insulating film 106. An inorganic passivation film 108 is formed so as to cover the video signal line 12, and an organic passivation film 109 is formed thereon. On the organic passivation film 109, the common electrode 110 (vertical electrode 50) is formed so as to cover the video signal line 12 when viewed in plan. A metal wiring 70 is formed on the common electrode 110 (vertical electrode 50) in order to reduce electric resistance. Since the metal wiring 70 is made of a metal layer and is opaque, it is arranged between the video signal line 12 and the black matrix 202 so as not to affect the display.

  A counter substrate 200 is disposed opposite the TFT substrate 100 with the liquid crystal layer 300 interposed therebetween. The configuration inside the counter substrate 200 is as described in FIG. A lateral electrode 40 is formed outside the counter substrate 200, and a protective film 41 is formed to cover the lateral electrode 40. In FIG. 7, a capacitance is formed between the horizontal electrode 40 and the vertical electrode 50, and the touch position is detected by detecting a change in the capacitance.

  FIG. 8 is a cross-sectional view showing the structure of the metal wiring 70. In FIG. 8, a metal wiring 70 is formed on the common electrode 110. The metal wiring 70 includes a lower layer metal 521 made of Mo, an intermediate layer metal 522 made of Al, and an upper layer metal 523 made of Mo. This is because the lower layer metal 521 maintains conductivity with the common electrode 110 made of ITO. The upper layer metal 523 has a role of suppressing hillocks generated from Al. The video signal line 12 has the same layer structure as the metal electrode 70 in FIG.

  In FIG. 8, the thickness of the common electrode 110 is, for example, 40 to 50 nm, the thickness of Mo as the lower layer metal 521 is 10 nm, the thickness of Al as the middle layer metal 522 is 100 nm, and the thickness of Mo as the upper layer metal 523. Is 10 nm. The metal wiring 70 can be formed of Mo alloy, Al alloy, Mo alloy, Al alloy, or other metals or alloys.

  The metal wiring 70 is also used as a lead-out wiring in the terminal portion 150 other than the display area 90, but there is a problem that the layer of the metal wiring 70 is corroded in the frame area near the terminal section 150. Returning to FIG. 5, the vertical electrode 50 extends from the display area 90 to the frame area close to the terminal portion 150. In the terminal-side frame region, many wires are concentrated toward the driver IC 160. In the display area 90, the metal layer forming the metal wiring 70 arranged for reducing the resistance of the vertical electrode 50 is also used as a connection wiring toward the driver IC 160 in the terminal portion 150. The metal layer forming the metal wiring 70 formed above the vertical electrode 50 (a layer close to the liquid crystal layer) has a longer side depending on the environment in which the display panel is placed (particularly in a high temperature and high humidity environment). The inventor has found that the corrosion is larger in the region close to the sealing material 31 of the present invention.

  For example, in FIG. 5, the degree of corrosion of the metal wiring 70 is larger at p1 at the positions p1 and p2. p1 and p2 have the same distance dy from the sealing material 31 on the terminal 150 side, but the distance dx from the sealing material 31 on the long side is close to p1. In FIG. 5, the sealing material 30 is composed of sealing materials 31 and 32, but only the sealing material 31 is provided on the long side, and the sealing material 31 and the sealing material 32 are applied twice on the terminal side. Yes. That is, the degree of corrosion of the metal wiring 70 is affected by the width of the sealing material in plan view.

  9 is a cross-sectional view taken along the line BB in the frame region on the terminal portion 150 side in FIG. In FIG. 9, the liquid crystal 300 is sealed inside the sealing material 31. The layer structure of FIG. 9 is the same as the configuration described in FIG. 2 or FIG. In FIG. 9, the same metal layer as the metal wiring 70 is formed on the organic passivation film 109. A video signal line lead line 121 is formed on the interlayer insulating film 106. The pitch of the video signal line lead lines 121 is much smaller than the pitch of the video signal lines 12 in the display area 90.

  That is, the video signal line lead lines 121 are densely formed in the frame area. Therefore, the influence of the mutual electric field between the metal wiring 70 and the video signal line lead-out line 121 is much larger in the frame area of the terminal portion 150 than in the display area 90. That is, if moisture or the like is present in this region, it is electrolyzed and gasified due to the influence of the surrounding electric field, and the effect is much more serious than that of the display region 90.

  In FIG. 9, the metal wiring 70 is corroded, and the degree of this corrosion varies depending on the distance from the seal material 31 on the long side. Specifically, the degree of corrosion at each position where the distance from the sealing material 31 is dx1 <dx2 <dx3 is the largest in the case of the distance dx1, and the degree of corrosion as the distance increases as dx2, dx3. Is getting smaller.

  In FIG. 5, when the seal part 31 on the long side and the seal part 30 on the terminal side are compared, the seal material 31 on the long side is applied once, whereas the seal material 30 on the terminal side is It is applied twice. That is, the width 30 of the sealing material on the terminal side is twice the width of the sealing material 31 on the long side.

  Moisture from the outside enters the inside from the seal portion, but on the terminal portion 150 side, since the width of the sealing material 30 is larger than the width of the sealing material 31 on the long side, it is difficult for moisture to enter. On the other hand, on the long side, since the width of the sealing material 31 is small, it can be estimated that moisture easily enters from this region. When moisture enters, the water is electrolyzed and gasified into hydrogen and oxygen by the influence of the electric field generated in the vicinity, and the metal wiring 70 which is the metal layer closest to the liquid crystal layer 300 is corroded. Specifically, in the layer structure of the metal wiring 70 shown in FIG. 8, there is a phenomenon that the Mo layer swells and the Al layer oxidizes. That is, the influence of the width of the sealing material 30 on the layer of the metal wiring 70 is very large.

  FIG. 10 is a plan view of a liquid crystal display device according to the present invention. FIG. 10 differs from FIG. 6 in that in the portion corresponding to the frame region on the terminal portion 150 side, the seal material 30 and the seal material 32 are doubled even on the long side. It exists. 10 is characterized in that the seal material 30 on the long side adjacent to the display region 90 is composed only of the seal material 31, and the width of the seal material 30 is larger than the width of the seal material 30 on the terminal side. Is also small.

  This is because there is a demand for the liquid crystal display device to increase the display area 90 while keeping the outer shape small, and therefore the width of the sealing material 30 in the portion adjacent to the display area 90 cannot be increased. However, in the display area 90, for example, the pitch of the video signal lines 12 is much larger than the pitch of the video signal line lead lines 121 in the frame area on the terminal portion 150 side, and is common between the video signal lines 12 and the metal wiring 70. Since the electrode 110 is also present, the occurrence of water electrolysis due to the action of the electric field due to the video signal line 12 and the scanning line 11 is much smaller than in the frame region on the terminal portion 150 side. For this reason, the problem of corrosion of the metal wiring 70 or the like hardly occurs in the display area. That is, by adopting the configuration as shown in FIG. 10, the problem of corrosion of the metal wiring 70 and the like in the frame region can be solved while keeping the area of the display region 90 large.

  FIG. 11 is a plan view of the frame region on the terminal side in FIG. In FIG. 11, the TFT substrate 100 and the counter substrate 200 are bonded together by the sealing material 30. The sealing material 30 in FIG. 11 is formed by a dispenser. In FIG. 11, the seal material 31 on the long side of the display region 90 is formed by a single application by a dispenser. However, even on the long side, the portion corresponding to the frame region on the terminal portion 150 side is formed. The sealing material 30 is formed by application twice. Therefore, even on the long side, the width w33 of the seal material 30 corresponding to the frame region on the terminal portion 150 side is twice the width w11 of the seal material 31 on the side corresponding to the display region. .

  In order to obtain the shape of the sealing material 30 as shown in FIG. 11, the application shape by the dispenser is bent in a crank shape in the frame region on the terminal portion 150 side. Thus, a region CF without the sealing material 30 is formed at the corner portion of the frame region on the terminal portion 150 side. Regarding the shape of the region CF, for example, the width sw in the short side direction is 400 μm and the width sh in the long side direction is 800 μm. Since there are many cases where no wiring is formed in the region CF, the influence on the wiring density in the frame region on the terminal portion 150 side is small.

  11 and 12 are plan views showing a process in the case of forming the sealing material 30 as shown in FIG. 10 by a dispenser. Since it is inefficient to form the liquid crystal display devices one by one, a large number of liquid crystal display devices are formed on the mother substrate, and after the liquid crystal display devices are completed, they are separated into individual liquid crystal display devices. The mother substrate is formed by bonding a mother TFT substrate on which a large number of TFT substrates 100 are formed and a mother counter substrate 600 on which a large number of counter substrates 200 are formed with a sealant 30 and then separating them. In general, the sealing material 30 is formed on the mother counter substrate 600 side.

  FIG. 12 is a plan view showing a part of the mother counter substrate 600. In FIG. 12, the first sealing material 31 is formed in a ring shape for each counter substrate. In the frame region on the terminal portion 150 side, the first seal material 31 is bent inward in a crank shape. The width of the first sealing material 31 is, for example, 0.3 mm. Note that when the mother counter substrate 600 is bonded to the mother TFT substrate later, the first sealing material 31 spreads to about 0.35 mm.

  FIG. 13 is a plan view showing a state in which the second sealing material 32 is applied after the first sealing material 31 is formed. The second sealing material 32 is applied along the first sealing material 31 in the frame region on the terminal portion 150 side. The width of the second sealing material 32 is also 0.3 mm, which is the same as the width of the first sealing material 31. Then, when the mother counter substrate 600 and the mother TFT substrate are bonded together, the second sealing material 32 also spreads to about 0.35 mm. Therefore, the frame region on the terminal portion 150 side is surrounded by a sealing material having a width of 0.7 mm. In FIG. 13, after the liquid crystal display device is completed, the individual liquid crystal display devices are separated from the mother substrate at a separation line 602. In the counter substrate 200, a portion corresponding to the terminal portion 150 is removed along the separation line 601. As described above, according to the present invention, the frame region on the terminal portion 150 side where the wirings are dense can be surrounded by the wide sealing material 30, so that corrosion of the wiring due to intrusion of moisture from the outside can be prevented. . In addition, wiring corrosion can be prevented while keeping the display area 90 large.

  FIG. 14 is a plan view showing Embodiment 2 of the present invention. 14 is different from FIG. 10 in that the frame region is surrounded by the double sealing material 30 even in the frame region opposite to the terminal portion 150. Depending on the product, there is a configuration in which the lead-out line of the video signal line is routed not only from the terminal unit 150 side but also from the frame region opposite to the terminal unit 150 to the terminal unit 150 side. Moreover, the vertical electrode of a touch panel may extend in this area.

  In such a case, the corrosion of the wiring described in the first embodiment also occurs in the frame region opposite to the terminal portion. In FIG. 14, in order to prevent this, the first sealing material 31 is bent in a crank shape also in the frame region opposite to the terminal portion 150, and the second sealing material 32 is along the first sealing material 31. The width of the sealing material 30 surrounding the frame region on the opposite side to the terminal portion 150 is increased.

  In FIG. 14, the region CF <b> 1 in which the sealing material of the counter substrate 200 is not formed may be the same as the region CF in which the sealing material is not formed on the terminal portion 150 side, but depending on the number of wirings in this region, sw <b> 1. Or sh1 may be adjusted to a size different from that of the terminal portion 150 side.

  Thus, according to the present embodiment, it is possible to prevent the corrosion of the wiring in the frame region on the side opposite to the terminal portion 150 simultaneously with the corrosion of the wiring in the frame region on the terminal portion 150 side.

  In addition, since there are regions CF and CF1 where no sealing material is formed, it becomes easy to form a liquid crystal display device with rounded corners by polishing the end surfaces of these portions in a curved shape.

  In the first and second embodiments, the present invention has been described by taking as an example the case where the sealing material is formed by a dispenser. The sealing material can be formed by printing such as screen printing instead of the dispenser. Unlike the dispenser, printing can define the shape of the sealing material relatively freely by designing a printing mask.

  FIG. 15 is a plan view when the sealing material 30 is formed using the printing method in the configuration of the first embodiment. In FIG. 15, the frame region on the terminal portion 150 side is surrounded by the sealing material 30 having a width w33. That is, in the frame region on the long side terminal portion 150 side, the width of the sealing material is w33. On the other hand, the width of the sealing material 30 on the side corresponding to the long side display area is w11, which is smaller than w33. Further, the width w22 of the sealing material 30 on the short side opposite to the terminal portion 150 is also smaller than w33.

  Similarly to the first embodiment, w11 = w33 / 2 or w22 = w33 / 2 may be set, but this ratio can be freely set according to the printing method. Therefore, the optimum value can be determined in the range of w11 <w33 or w22 <w33 in consideration of the area of the display region 90 and the demand for wiring protection in the frame region on the terminal portion 150 side.

  FIG. 16 is a plan view when the sealing material 30 is formed using the printing method in the configuration of the second embodiment. The configuration of FIG. 16 is the same as that of FIG. 15 except for the frame region on the side opposite to the terminal portion 150. In the frame region on the opposite side of the terminal portion in FIG. 16, the frame region is surrounded by a sealing material having a width w22. That is, in the portion corresponding to the frame region on the long side and opposite to the terminal portion 150, the width w22 of the sealing material 30 is larger than the width w11 of the sealing material 30 corresponding to the long side display region.

  w22 may be the same as w33 or smaller. The ratio of w22 and w33 may be determined in consideration of the wiring density in the frame region on the terminal portion 150 side and the wiring density ratio in the frame region on the opposite side to the terminal portion 150.

  In FIG. 16, since the long side sealant w11 corresponding to the display area 90 is formed to have a small width, the display area 90 can be widened. On the other hand, in the frame region on the terminal portion 150 side where wirings are densely arranged and in the frame region on the opposite side to the terminal portion 150, the width of the sealing material 30 is formed to be large even on the long side. Intrusion of moisture or the like in the wiring can be prevented, and corrosion of the wiring can be prevented.

  In the above description, as the touch panel electrode, it has been described that the counter substrate has a horizontal electrode and the TFT substrate side has a vertical electrode. On the contrary, a vertical electrode may exist on the counter substrate side and a horizontal electrode may exist on the TFT substrate side. Even in such a case, the configuration in which the wirings are densely arranged in the frame region on the terminal side is the same. Therefore, the present invention can be similarly applied to the case where the vertical electrode exists on the counter substrate side and the horizontal electrode exists on the TFT substrate side.

  In the above description, the corrosion of the metal wiring closest to the liquid crystal layer has been described. Even wiring in layers far from the liquid crystal layer, such as video signal line leads, is formed densely at the terminal portion, and there is a risk of corrosion if moisture or the like enters from the seal portion. For example, as shown in FIG. 9, since the video signal line lead line 121 is covered with the inorganic passivation film 108 and the organic passivation film 109, even when moisture enters through the sealing material 31, like the metal wiring 70. Does not corrode immediately. However, when a long time elapses, moisture reaches the video signal line lead line 121 and there is a risk of corroding the video signal line lead line 121. Therefore, the configurations described in the first to third embodiments are effective not only for the wiring in the same layer as the metal wiring 70 but also for the wiring in other layers.

  DESCRIPTION OF SYMBOLS 11 ... Scanning line, 12 ... Video signal line, 13 ... Pixel, 30 ... Sealing material, 31 ... First sealing material, 32 ... Second sealing material, 40 ... Horizontal electrode for touch panel, 41 ... Protective film, 50 ... For touch panel Vertical electrode, 51 ... ITO layer, 60 ... Capacitance, 70 ... Metal wiring, 90 ... Display area, 100 ... TFT substrate, 101 ... First base film, 102 ... Second base film, 103 ... Semiconductor layer, 104 ... Gate insulation Film 105: gate electrode 106 ... first interlayer insulating film 107 ... contact electrode 108 ... inorganic passivation film 109 ... organic passivation film 110 ... common electrode 111 ... second interlayer insulating film 112 ... pixel electrode, DESCRIPTION OF SYMBOLS 113 ... Orientation film, 115 ... Upper layer, 120 ... 1st through hole, 130 ... 2nd through hole, 150 ... Terminal part, 1 DESCRIPTION OF SYMBOLS 0 ... Driver IC, 170 ... Flexible wiring board, 200 ... Opposite substrate, 201 ... Color filter, 202 ... Black matrix, 203 ... Overcoat film, 300 ... Liquid crystal layer, 301 ... Liquid crystal molecule, 521 ... Lower layer metal, 522 ... Middle layer Metal, upper layer metal ... groove bit, 600 ... mother counter substrate, 601 ... separation line, D ... drain part, S ... source part, LDD ... Lightly Doped Drain

Claims (12)

A liquid crystal display device in which a first substrate on which video signal lines and scanning lines are formed and a second substrate are bonded by a sealing material, and liquid crystal is sealed inside,
A display region is formed in an overlapping portion where the first substrate and the second substrate overlap, and a terminal portion is formed in a non-overlapping portion where the first substrate and the second substrate do not overlap. And
The overlapping portion is formed on the periphery of the display region, on a first frame region formed on a first side adjacent to the terminal portion, and on a second side opposite to the first side. 2 frame regions, a third frame region formed on the third side connecting the first side and the second side, and a fourth frame region formed on the fourth side,
The width of the sealing material corresponding to the first frame region of the third side or the fourth side is equal to the width of the sealing material corresponding to the display region of the third side or the fourth side. A liquid crystal display device characterized by being larger than the width.   2. The liquid crystal according to claim 1, wherein a width of the sealing material corresponding to the display region of the first side is larger than a width of the sealing material corresponding to the display region of the second side. Display device.   The width of the sealing material corresponding to the display area of the first side and the width of the sealing material corresponding to the first frame area of the third side or the fourth side are the third 2. The liquid crystal display device according to claim 1, wherein the width of the sealing material corresponding to the display area of the side or the fourth side is twice.   The width of the sealing material corresponding to the display area of the first side is the same as the width of the sealing material corresponding to the first frame area of the third side or the fourth side. The liquid crystal display device according to claim 1.   The liquid crystal display device according to claim 1, wherein the sealing material is formed of a dispenser.   The liquid crystal display device according to claim 1, wherein the sealing material is formed by printing. A liquid crystal display device in which a first substrate on which video signal lines and scanning lines are formed and a second substrate are bonded by a sealing material, and liquid crystal is sealed inside,
A display region is formed in an overlapping portion where the first substrate and the second substrate overlap, and a terminal portion is formed in a non-overlapping portion where the first substrate and the second substrate do not overlap. And
The overlapping portion is formed on the periphery of the display region, on a first frame region formed on a first side adjacent to the terminal portion, and on a second side opposite to the first side. 2 frame regions, a third frame region formed on the third side connecting the first side and the second side, and a fourth frame region formed on the fourth side,
The width of the sealing material corresponding to the first frame region of the third side or the fourth side is equal to the width of the sealing material corresponding to the display region of the third side or the fourth side. Larger than the width,
The width of the sealing material corresponding to the second frame region of the third side or the fourth side is the width of the sealing material corresponding to the display region of the third side or the fourth side. A liquid crystal display device characterized by being larger than the width.   The width of the sealing material corresponding to the display region of the first side and the width of the sealing material corresponding to the first frame region of the third side or the fourth side are the second The width of the sealing material corresponding to the display area of the side of the side and the width of the sealing material of the portion corresponding to the second frame area of the third side or the fourth side are the same The liquid crystal display device according to claim 7.   The width of the sealing material corresponding to the display region of the second side and the width of the sealing material corresponding to the second frame region of the third side or the fourth side are the third The liquid crystal display device according to claim 7, wherein the width of the sealing material corresponding to the display area of the side or the fourth side is twice.   The width of the sealing material corresponding to the second side is the same as the width of the sealing material corresponding to the second frame region in the third side or the fourth side. The liquid crystal display device according to claim 7.   The liquid crystal display device according to claim 7, wherein the sealing material is formed of a dispenser.   The liquid crystal display device according to claim 7, wherein the sealing material is formed by printing.

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