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JP2018141782A - Method of quantifying deposited contaminants and method of analyzing samples - Google Patents

Method of quantifying deposited contaminants and method of analyzing samples Download PDF

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JP2018141782A
JP2018141782A JP2018029623A JP2018029623A JP2018141782A JP 2018141782 A JP2018141782 A JP 2018141782A JP 2018029623 A JP2018029623 A JP 2018029623A JP 2018029623 A JP2018029623 A JP 2018029623A JP 2018141782 A JP2018141782 A JP 2018141782A
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JP7024490B2 (en
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信満 押村
Nobumitsu Oshimura
信満 押村
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Sumitomo Metal Mining Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To enable accurate quantification of contaminants deposited on a surface of a sample when analyzing the sample using a transmission electron microscope.SOLUTION: A method of quantifying contaminants deposited on a surface of a sample when analyzing the sample using a transmission electron microscope is provided, the method comprising: a deposition step for irradiating the surface of the sample with an electron beam to allow deposition contaminants originating from hydrocarbon components present in the atmosphere to deposit in an irradiated area; an acquisition step for irradiating the surface of the sample with the electron beam covering the area in which the deposition contaminants deposit in order to acquire a high-angle annular dark-field image; and a quantification step for measuring brightness of the area with the deposited contaminants in the high-angle annular dark-field image to quantify the deposited contaminants from the brightness.SELECTED DRAWING: Figure 1

Description

本発明は、汚染堆積物の定量方法および試料分析方法に関する。   The present invention relates to a method for quantifying contaminated deposits and a sample analysis method.

材料開発において、材料の物性を詳細に解析することは特性発現メカニズムを理解する上で重要である。近年では、目的とする材料特性を発現させるために、微細構造を形成したり、試料最表面に薄く機能性を持たせる成膜や処理を行ったりすることで新しい材料を開発する場合が多くなっている。このような微細な領域の物性を解析するため、透過電子顕微鏡が多く用いられている(例えば特許文献1を参照)。   In material development, it is important to understand the physical properties of materials in detail to understand the physical properties. In recent years, in order to develop the desired material properties, new materials have often been developed by forming microstructures or forming and processing thin films with functionality on the outermost surface of the sample. ing. In order to analyze the physical properties of such a fine region, a transmission electron microscope is often used (see, for example, Patent Document 1).

透過電子顕微鏡(以下、TEMともいう)は、例えば100nm以下の厚さまで薄片化した試料の分析箇所に、高電圧で加速した電子線を照射して透過させ、試料内で起こる様々な相互作用を受けた電子線を用いて分析する手法である。TEMによれば、走査電子顕微鏡に比べて電子線を狭く照射し、空間分解能が高い分析ができるため、極微細領域の形態や結晶構造、組成、化学状態などを解析することができる。   A transmission electron microscope (hereinafter also referred to as TEM), for example, irradiates and transmits an electron beam accelerated at a high voltage to an analysis portion of a sample sliced to a thickness of 100 nm or less, and causes various interactions occurring in the sample. This is an analysis method using the received electron beam. According to TEM, an electron beam is irradiated more narrowly than a scanning electron microscope and analysis with high spatial resolution can be performed, so that the form, crystal structure, composition, chemical state, etc. of the ultrafine region can be analyzed.

TEMによる試料の分析では、試料をTEMのチャンバ内に載置して電子線を照射する。このときチャンバ内に炭化水素系ガスが存在していると、例えば元々チャンバ内に残留していたり試料などから発生したりすると、電子線により炭化水素成分からカーボン成分が解離し試料表面に堆積することがある。カーボン成分が試料表面に堆積すると、例えば試料の分析箇所が厚くなったり、照射した電子線がカーボン成分内で相互作用を受けたりすることで、透過する電子線が減少し、また透過する電子線に不要な情報が混ざってしまうため、高精度な分析ができなくなる。このように、カーボン成分は汚染堆積物としてコンタミネーションを引き起こす。   In analysis of a sample by TEM, the sample is placed in a TEM chamber and irradiated with an electron beam. At this time, if a hydrocarbon-based gas exists in the chamber, for example, if it remains in the chamber or is generated from the sample, the carbon component is dissociated from the hydrocarbon component by the electron beam and deposited on the sample surface. Sometimes. When the carbon component is deposited on the surface of the sample, for example, the analysis site of the sample becomes thick, or the irradiated electron beam receives an interaction within the carbon component, so that the transmitted electron beam decreases and the transmitted electron beam. Because unnecessary information is mixed, it becomes impossible to perform highly accurate analysis. Thus, the carbon component causes contamination as a contaminated deposit.

そこで、TEMによる試料分析では、コンタミネーションによる影響を抑えるために、装置や試料を加熱したり、プラズマを用いて試料から汚染堆積物の元となる物質を除去したりすることが行われている。   Therefore, in the sample analysis by TEM, in order to suppress the influence of contamination, the apparatus and the sample are heated, or the source substance of the contaminated deposit is removed from the sample by using plasma. .

特開2014−240780号公報JP 2014-240780 A

TEMによる試料分析においてはコンタミネーションの抑制が重要である一方、分析精度をより高める観点からはコンタミネーションが生じたときにその量を把握することも重要となっている。例えばコンタミネーションの量が少なければ分析精度が高いといったようにコンタミネーションの量によって分析精度を確認することができるからである。ところが、これまでは試料表面に汚染堆積物があるかどうかでコンタミネーションの有無が判定されるだけで、その堆積量を定量的に評価する方法が確立されていない。   In the sample analysis by TEM, it is important to suppress contamination. On the other hand, from the viewpoint of further improving the analysis accuracy, it is also important to grasp the amount of contamination when it occurs. This is because the analysis accuracy can be confirmed by the amount of contamination, for example, the analysis accuracy is high when the amount of contamination is small. However, until now, a method for quantitatively evaluating the amount of deposition has not been established only by determining the presence or absence of contamination based on the presence or absence of contaminated deposits on the sample surface.

本発明は、上記課題に鑑みて成されたものであり、透過電子顕微鏡で試料分析を行うときに試料表面に堆積する汚染堆積物を精度良く定量する技術を提供することを目的とする。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique for accurately quantifying contaminated deposits deposited on the surface of a sample when the sample is analyzed with a transmission electron microscope.

本発明の第1の態様によれば、
試料を透過電子顕微鏡で分析するときに試料表面に堆積する汚染堆積物を定量する方法であって、
試料表面に電子線を照射し、雰囲気中に存在する炭化水素成分に由来する汚染堆積物を照射領域に堆積させる堆積工程と、
前記汚染堆積物が堆積する領域を含むように前記試料表面に電子線を照射し、高角度環状暗視野像を取得する取得工程と、
前記高角度環状暗視野像における前記汚染堆積物が堆積する領域の輝度を測定し、前記輝度から前記汚染堆積物を定量する定量工程と、を有する、汚染堆積物の定量方法が提供される。
According to a first aspect of the invention,
A method for quantifying contaminated deposits deposited on a sample surface when the sample is analyzed with a transmission electron microscope,
A deposition step of irradiating the sample surface with an electron beam and depositing contaminated deposits derived from hydrocarbon components present in the atmosphere on the irradiated region;
An acquisition step of irradiating the surface of the sample with an electron beam so as to include a region where the contaminated deposit is deposited, and acquiring a high-angle annular dark field image;
There is provided a method for quantifying contaminated deposits, comprising: measuring a luminance of a region where the contaminated deposits are deposited in the high-angle annular dark field image, and quantifying the contaminated deposits from the luminance.

本発明の第2の態様は、第1の態様において、
前記定量工程では、前記高角度環状暗視野像から輝度プロファイルを求め、前記輝度プロファイルにおける前記汚染堆積物が堆積する領域とその他の領域との輝度差から前記汚染堆積物の厚さを求める。
According to a second aspect of the present invention, in the first aspect,
In the determination step, a luminance profile is obtained from the high-angle annular dark field image, and a thickness of the contaminated deposit is obtained from a luminance difference between the region where the contaminated deposit is deposited and other regions in the luminance profile.

本発明の第3の態様は、第1又は第2の態様において、
前記取得工程では、前記堆積工程よりも低い倍率で電子線を照射する。
According to a third aspect of the present invention, in the first or second aspect,
In the acquisition step, the electron beam is irradiated at a lower magnification than in the deposition step.

本発明の第4の態様は、第1〜第3の態様のいずれかにおいて、
前記堆積工程では、倍率を10万倍以上100万倍以下の倍率で電子線を照射する。
According to a fourth aspect of the present invention, in any one of the first to third aspects,
In the deposition step, the electron beam is irradiated at a magnification of 100,000 to 1,000,000 times.

本発明の第5の態様は、第1〜第4の態様のいずれかにおいて、
前記取得工程では、倍率を1万倍以上10万倍以下の倍率で電子線を照射する。
According to a fifth aspect of the present invention, in any one of the first to fourth aspects,
In the acquisition step, the electron beam is irradiated at a magnification of 10,000 to 100,000.

本発明の第6の態様は、第1〜第5の態様のいずれかにおいて、
前記堆積工程は、
前記試料表面に電子線を照射し、前記試料表面に第1の汚染堆積物を堆積させる第1堆積工程と、
前記第1の汚染堆積物が堆積する領域を含むように前記試料表面に電子線を照射し、第2の汚染堆積物を堆積させる第2堆積工程と、を有する。
According to a sixth aspect of the present invention, in any one of the first to fifth aspects,
The deposition step includes
A first deposition step of irradiating the sample surface with an electron beam to deposit a first contaminated deposit on the sample surface;
And a second deposition step of depositing a second contaminated deposit by irradiating the surface of the sample with an electron beam so as to include an area where the first contaminated deposit is deposited.

本発明の第7の態様は、第6の態様において、
前記第2堆積工程では、前記第1堆積工程よりも低い倍率で電子線を照射する。
According to a seventh aspect of the present invention, in the sixth aspect,
In the second deposition step, the electron beam is irradiated at a lower magnification than in the first deposition step.

本発明の第8の態様によれば、
透過電子顕微鏡により試料を分析する試料分析方法であって、
試料の分析箇所以外の領域に電子線を照射し、雰囲気中に存在する炭化水素成分に由来する汚染堆積物を照射領域に堆積させる堆積工程と、
前記汚染堆積物が堆積する領域を含むように前記試料表面に電子線を照射し、高角度環状暗視野像を取得する取得工程と、
前記高角度環状暗視野像において前記汚染堆積物が堆積する領域の輝度を測定し、前記輝度から前記汚染堆積物を定量する定量工程と、
前記定量工程の結果に応じて、前記試料表面の分析箇所に電子線を照射して透過電子像を取得し分析する分析工程と、を有する、試料分析方法が提供される。
According to an eighth aspect of the present invention,
A sample analysis method for analyzing a sample with a transmission electron microscope,
A deposition step of irradiating an electron beam to an area other than the analysis location of the sample, and depositing contaminated deposits derived from hydrocarbon components present in the atmosphere in the irradiated area;
An acquisition step of irradiating the surface of the sample with an electron beam so as to include a region where the contaminated deposit is deposited, and acquiring a high-angle annular dark field image;
A quantification step of measuring a luminance of a region where the contaminated deposit is deposited in the high-angle annular dark field image, and quantifying the contaminated deposit from the luminance;
According to the result of the quantification step, there is provided a sample analysis method including an analysis step of acquiring and analyzing a transmission electron image by irradiating an analysis site on the sample surface with an electron beam.

本発明の第9の態様は、第8の態様において、
前記定量工程では、前記高角度環状暗視野像から輝度プロファイルを求め、前記輝度プロファイルにおける前記汚染堆積物が堆積する領域とその他の領域との輝度差を求め、
前記分析工程では、前記輝度差が所定値以下であれば、分析を行う。
According to a ninth aspect of the present invention, in the eighth aspect,
In the quantitative determination step, a luminance profile is obtained from the high-angle annular dark field image, and a luminance difference between the region where the contaminated deposit is deposited and other regions in the luminance profile is obtained,
In the analysis step, if the luminance difference is equal to or less than a predetermined value, analysis is performed.

本発明によれば、透過電子顕微鏡で試料分析を行うときに試料表面に堆積する汚染堆積物を精度良く定量することができる。   ADVANTAGE OF THE INVENTION According to this invention, when performing sample analysis with a transmission electron microscope, the contaminated deposit deposited on the sample surface can be quantified accurately.

図1(a)は、試料表面に汚染堆積物を堆積させたときの試料表面の平面図であり、図1(b)は、(a)において汚染堆積物を堆積させた領域を含むように撮像した高角度環状暗視野像であり、図1(c)は、(b)中の矢印方向の輝度プロファイルである。FIG. 1A is a plan view of a sample surface when a contaminated deposit is deposited on the sample surface, and FIG. 1B includes a region in which the contaminated deposit is deposited in FIG. FIG. 1C illustrates a luminance profile in the arrow direction in FIG. 1B. 図2は、透過電子顕微鏡の概略断面図である。FIG. 2 is a schematic sectional view of a transmission electron microscope. 図3(a)は、実施例の試料Aについて汚染堆積物を堆積させた後の高角度環状暗視野像であり、図3(b)は、(a)の矢印方向に輝度を抽出した輝度プロファイルを示す。FIG. 3A is a high-angle annular dark field image after depositing a contaminated deposit on the sample A of the example, and FIG. 3B is a luminance obtained by extracting the luminance in the arrow direction of FIG. Indicates a profile. 図4(a)は、実施例の試料Bについて汚染堆積物を堆積させた後の高角度環状暗視野像であり、図4(b)は、(a)の矢印方向に輝度を抽出した輝度プロファイルを示す。FIG. 4A is a high-angle annular dark field image after depositing a contaminated deposit on Sample B of the example, and FIG. 4B is a luminance obtained by extracting luminance in the arrow direction of FIG. Indicates a profile. 図5(a)は、実施例の試料Cについて汚染堆積物を堆積させた後の高角度環状暗視野像であり、図5(b)は、(a)の矢印方向に輝度を抽出した輝度プロファイルを示す。FIG. 5A is a high-angle annular dark field image after depositing a contaminated deposit on the sample C of the example, and FIG. 5B is a luminance obtained by extracting the luminance in the arrow direction of FIG. Indicates a profile.

本発明の実施形態の説明に先立ち、本発明者が得た知見について説明する。   Prior to the description of the embodiments of the present invention, knowledge obtained by the present inventor will be described.

本発明者は上記課題を解決するための手段について検討を行い、TEMにおいて試料に電子線を照射して取得できる高角度環状暗視野像に着目した。   The present inventor has studied means for solving the above-described problems, and has focused on a high-angle annular dark field image that can be obtained by irradiating an electron beam onto a sample in a TEM.

TEMでは、図2に示すように、試料に電子線を照射し、試料を透過した透過電子線をCCDカメラやBF検出器で検出して結像することで、明視野像(Bright Fiefd Image:BF像)が取得できる。BF像によれば、回折を起こしている箇所は暗く、起こしていない箇所は明るく見え、試料の格子欠陥や膜厚を測定することができる。ただし、試料を透過した電子線は、試料中を透過する際に結晶構造や歪、組成などに起因して様々な相互作用を受けるため、透過電子線を結像したBF像は複雑なコントラストを有しており、像の解釈が困難である。   In the TEM, as shown in FIG. 2, a bright field image (Bright Field Image) is formed by irradiating a sample with an electron beam and detecting a transmission electron beam transmitted through the sample with a CCD camera or a BF detector. BF image) can be acquired. According to the BF image, the part where the diffraction occurs is dark and the part where the diffraction does not occur appears bright, and the lattice defect and film thickness of the sample can be measured. However, since the electron beam that has passed through the sample undergoes various interactions due to the crystal structure, strain, composition, etc. when passing through the sample, the BF image formed by imaging the transmitted electron beam has a complex contrast. It is difficult to interpret the image.

一方、電子線を細く絞って試料に照射し、試料を透過した電子線の中で比較的大きく散乱した電子線を円環型検出器で検出して結像することで、高角度環状暗視野(High Angle Annular Dark Field)像(以下、HAADF像ともいう)が取得できる。   On the other hand, a high-angle annular dark field is formed by irradiating the sample with a finely focused electron beam, and detecting and imaging a relatively large amount of electron beam that has been scattered through the sample with an annular detector. (High Angle Annual Dark Field) image (hereinafter also referred to as HAADF image) can be acquired.

HAADF像においては、試料を構成する原子の原子番号が大きくなるほど、試料を通過して高角度で散乱する電子線の確立が高くなることから、原子番号の大きいものほど明るく、原子番号の小さいものほど暗く観察される。また、試料が厚くなるのに応じて相互作用を与える原子数が増えて、高角度で散乱する電子線の量が増えることから、厚い箇所ほど明るく、薄い箇所ほど暗く観察される。また、HAADF像は、試料による相互作用の影響が少ないため、明確なコントラストが得られる。このように、HAADF像では、組成や厚さを表す単純なコントラストから像を容易に解釈することができ、原子番号の大きな原子が存在したり試料が厚かったりする箇所が相対的に明るく観察されることになる。   In the HAADF image, the higher the atomic number of the atoms constituting the sample, the higher the establishment of an electron beam that passes through the sample and scatters at a high angle. Therefore, the higher the atomic number, the brighter the atomic number. Observed as dark. Further, as the sample becomes thicker, the number of atoms that interact with each other increases, and the amount of electron beams scattered at a high angle increases, so that the thicker part is observed brighter and the thinner part is observed darker. In addition, since the HAADF image is less influenced by the interaction with the sample, a clear contrast can be obtained. In this way, in the HAADF image, the image can be easily interpreted from a simple contrast representing the composition and thickness, and a portion where an atom with a large atomic number is present or the sample is thick is observed relatively brightly. Will be.

本発明者はさらに検討を行い、汚染堆積物が堆積した試料表面についてHAADF像を取得し、そのコントラストを解析したところ、汚染堆積物を定量的に捉えられることを見出した。具体的には、HAADF像においては電子線の透過方向のカーボン成分の量、つまりカーボン成分を含む汚染堆積物の厚さに起因して、汚染堆積物が堆積した領域と堆積していない領域との間でコントラストが変化しており、そのコントラストを輝度で判断することによって汚染堆積物を厚さで定量的に評価できることを見出した。   The present inventor further examined and obtained a HAADF image of the sample surface on which the contaminated deposit was deposited and analyzed the contrast, and found that the contaminated deposit could be captured quantitatively. Specifically, in the HAADF image, due to the amount of the carbon component in the transmission direction of the electron beam, that is, the thickness of the contaminated deposit containing the carbon component, It was found that the contrast was changed between the two, and the contaminated deposit could be quantitatively evaluated by the thickness by judging the contrast by the brightness.

また、試料の分析箇所に電子線を照射して分析する前に、試料の分析箇所以外の領域に汚染堆積物を堆積させて定量し、試料についてコンタミネーションが生じにくいことを把握した後に分析を行うことにより、高精度な分析を効率よく行うことができることを見出した。   Also, before irradiating the sample analysis site with an electron beam, analysis is performed after depositing and quantifying contaminated deposits in areas other than the sample analysis site, and confirming that contamination is unlikely to occur in the sample. By doing so, it was found that highly accurate analysis can be performed efficiently.

本発明はこのような知見に基づいて成されたものである。   The present invention has been made based on such findings.

<本発明の一実施形態>
以下、本発明の一実施形態にかかる試料分析方法について説明する。本実施形態では、TEMを用いて、試料の分析箇所以外の領域に汚染堆積物を堆積させて汚染堆積物を定量し、試料についてのコンタミネーションの具合を把握した後に、試料分析を行う。本実施形態の試料分析方法は、準備工程、堆積工程、取得工程、定量工程および分析工程を有する。各工程について図1(a)〜(c)を用いて詳述する。図1(a)は、試料表面に汚染堆積物を堆積させたときの試料表面の平面図であり、図1(b)は、(a)において汚染堆積物を堆積させた領域を含むように撮像した高角度環状暗視野像であり、図1(c)は、(b)中の矢印方向の輝度プロファイルである。
<One Embodiment of the Present Invention>
Hereinafter, a sample analysis method according to an embodiment of the present invention will be described. In the present embodiment, using TEM, the contaminated deposit is deposited in a region other than the analysis portion of the sample to quantify the contaminated deposit, and after the degree of contamination of the sample is grasped, the sample analysis is performed. The sample analysis method of this embodiment includes a preparation process, a deposition process, an acquisition process, a quantitative process, and an analysis process. Each step will be described in detail with reference to FIGS. FIG. 1A is a plan view of a sample surface when a contaminated deposit is deposited on the sample surface, and FIG. 1B includes a region in which the contaminated deposit is deposited in FIG. FIG. 1C illustrates a luminance profile in the arrow direction in FIG. 1B.

(準備工程)
まず、分析対象となる試料を準備する。試料としては、TEMで分析できるものであれば特に限定されない。例えば粉末試料を樹脂に埋め込み、この樹脂成形体を例えば厚さ100nm以下まで薄片化したものを用いることができる。
(Preparation process)
First, a sample to be analyzed is prepared. The sample is not particularly limited as long as it can be analyzed by TEM. For example, it is possible to use a powder sample embedded in a resin and the resin molded body is sliced to a thickness of, for example, 100 nm or less.

(堆積工程)
続いて、試料を、HAADF検出器を備え付けたTEMの真空チャンバ内に導入する。その後、図1(a)に示すように、試料10の表面における分析箇所以外の領域に電子線を照射して走査する。これにより、雰囲気中に存在する炭化水素成分に由来する汚染堆積物11を電子線の照射領域に堆積させる。なお、雰囲気中に存在する炭化水素成分は、試料10から生じたり、チャンバ内に残留していたりする成分を示す。
(Deposition process)
Subsequently, the sample is introduced into a TEM vacuum chamber equipped with a HAADF detector. Then, as shown to Fig.1 (a), it scans by irradiating an electron beam to areas other than the analysis location on the surface of the sample 10. FIG. Thereby, the contaminated deposit 11 derived from the hydrocarbon component present in the atmosphere is deposited in the electron beam irradiation region. In addition, the hydrocarbon component which exists in atmosphere shows the component which arises from the sample 10 or remains in the chamber.

堆積工程では、倍率を10万倍〜100万倍として電子線を照射することが好ましい。このような倍率で電子線を照射することにより、単位面積当たりの照射量を大きくして汚染堆積物を効率よく堆積させることができるので、汚染堆積物を精度良く定量することができる。   In the deposition process, it is preferable to irradiate the electron beam with a magnification of 100,000 to 1,000,000 times. By irradiating the electron beam at such a magnification, the amount of irradiation per unit area can be increased and the contaminated deposit can be deposited efficiently, so that the contaminated deposit can be accurately quantified.

(取得工程)
続いて、汚染堆積物11が堆積する領域を含むような撮像領域12を決定し、撮像領域12に電子線を照射して走査する。そして、試料10や汚染堆積物11内を透過した電子線のうち、高角度で散乱した電子線を検出して撮像し、図1(b)に示すような高角度環状暗視野像(HAADF像)を取得する。図1(b)に示すHAADF像においては、カーボン成分を含む汚染堆積物11が堆積する領域は、汚染堆積物11が堆積していない他の領域と比べて、輝度が高く明るく観察される。すなわち、汚染堆積物11が堆積する領域と堆積していない領域との間では所定のコントラストが得られる。
(Acquisition process)
Subsequently, the imaging region 12 including the region where the contaminated deposit 11 is deposited is determined, and the imaging region 12 is irradiated with an electron beam and scanned. Then, among the electron beams transmitted through the sample 10 and the contaminated deposit 11, an electron beam scattered at a high angle is detected and imaged, and a high angle annular dark field image (HAADF image) as shown in FIG. ) To get. In the HAADF image shown in FIG. 1B, the area where the contaminated deposit 11 containing the carbon component is deposited is observed to be brighter and brighter than other areas where the contaminated deposit 11 is not deposited. That is, a predetermined contrast is obtained between a region where the contaminated deposit 11 is deposited and a region where the contaminated deposit 11 is not deposited.

取得工程では、電子線を照射したときに汚染堆積物11を生成させないようにする観点から、堆積工程よりも倍率を低くして電子線を照射することが好ましい。具体的には、倍率を1万倍〜10万倍として電子線を照射することが好ましい。1万倍以上とすることで汚染堆積物を適度な大きさで観察することができ、10万倍以下とすることで観察中での再堆積を抑制することができる。すなわち、再堆積を抑制しつつ、堆積工程で形成した汚染堆積物を適度な大きさで観察することができる。   In the acquisition process, it is preferable to irradiate the electron beam at a lower magnification than the deposition process from the viewpoint of preventing generation of the contaminated deposit 11 when the electron beam is irradiated. Specifically, it is preferable to irradiate an electron beam with a magnification of 10,000 to 100,000. By setting it to 10,000 times or more, the contaminated deposit can be observed with an appropriate size, and by setting it to 100,000 times or less, redeposition during observation can be suppressed. That is, the contaminated deposit formed in the deposition process can be observed with an appropriate size while suppressing redeposition.

(定量工程)
続いて、取得工程で得られたHAADF像について、汚染堆積物11が堆積する領域の輝度を測定する。HAADF像においては、汚染堆積物11の堆積量(厚さ)が増えるほど、汚染堆積物11が堆積する領域が明るく観察され、輝度の数値が高くなる。そのため、汚染堆積物11が堆積する領域の輝度の数値から汚染堆積物11の量を把握することができる。例えば、汚染堆積物11の厚さと輝度との相関を予め求め、HAADF像から得られた輝度の数値から汚染堆積物11の厚さを算出するとよい。
(Quantitative process)
Then, the brightness | luminance of the area | region where the contaminated deposit 11 accumulates is measured about the HAADF image obtained at the acquisition process. In the HAADF image, as the deposition amount (thickness) of the contaminated deposit 11 increases, the area where the contaminated deposit 11 is deposited is observed brighter, and the luminance value increases. Therefore, the amount of the contaminated deposit 11 can be grasped from the luminance value of the region where the contaminated deposit 11 is deposited. For example, the correlation between the thickness of the contaminated deposit 11 and the luminance may be obtained in advance, and the thickness of the contaminated deposit 11 may be calculated from the luminance value obtained from the HAADF image.

汚染堆積物をより精度よく定量する観点からは、定量工程において、HAADF像の輝度プロファイルを求め、汚染堆積物11が堆積する領域とその他の領域との輝度差から汚染堆積物11の厚さを求め、汚染堆積物11を定量することが好ましい。具体的に説明すると、図1(c)に示すように、汚染堆積物11が堆積する領域は輝度が高い一方、堆積していない領域は輝度が低くなる。それぞれの輝度の数値はそれぞれの領域における厚さ情報を含んでおり、それらの輝度差によれば厚みの差、つまり汚染堆積物11の厚さを求めることができる。なお、輝度プロファイルは、HAADF像を画像解析することにより求めるとよい。   From the viewpoint of quantifying the contaminated deposit with higher accuracy, the luminance profile of the HAADF image is obtained in the quantitative process, and the thickness of the contaminated deposit 11 is determined from the luminance difference between the region where the contaminated deposit 11 is deposited and other regions. It is preferable to determine and quantify the contaminated deposit 11. More specifically, as shown in FIG. 1C, the area where the contaminated deposit 11 is deposited has a high luminance, while the area where it is not deposited has a low luminance. Each luminance value includes thickness information in each region, and the difference in thickness, that is, the thickness of the contaminated deposit 11 can be obtained from the difference in luminance. Note that the luminance profile may be obtained by image analysis of the HAADF image.

(分析工程)
続いて、定量工程の結果に応じて分析工程を行う。具体的には、定量工程の結果に基づいて試料10のコンタミネーションの生じやすさを評価し、コンタミネーションが少なければ、試料10の元素の種類と量を特定するための分析を行う。例えば、汚染堆積物11の厚さと相関する、汚染堆積物が堆積する領域とその他の領域との輝度差が所望の値以下であれば、電子線照射によるコンタミネーションが少なく、所望の測定精度が維持されると判断し、定量工程の後にそのまま元素の種類と量を特定するための分析工程を行う。分析工程では試料10表面の分析箇所に電子線を照射して透過電子線を検出し試料10の分析を行う。一方、汚染堆積物が堆積する領域とその他の領域との輝度差が所望の値を超えるような場合、試料10は電子線照射によりコンタミネーションが生じやすく、分析精度を高く維持できないものと判断し、分析工程を行わない。この場合、コンタミネーションの原因を特定して試料10の作製条件を見直し、再びコンタミネーションを定量し分析工程を行うとよい。なお、コンタミネーションの評価基準となる汚染堆積物が堆積する領域とその他の領域との輝度差の数値は、要求される精度に応じて適宜変更するとよく、高い精度が求められる場合であれば汚染堆積物が堆積する領域とその他の領域との輝度差は低い数値に設定するとよい。
(Analysis process)
Subsequently, an analysis process is performed according to the result of the quantitative process. Specifically, the likelihood of contamination of the sample 10 is evaluated based on the result of the quantification process, and if the contamination is small, analysis for specifying the type and amount of the element of the sample 10 is performed. For example, if the brightness difference between the area where the contaminated deposit is deposited and other areas, which correlate with the thickness of the contaminated deposit 11, is less than or equal to a desired value, there is less contamination due to electron beam irradiation, and the desired measurement accuracy can be achieved. It is judged that it is maintained, and the analysis process for specifying the kind and amount of the element is performed as it is after the determination process. In the analysis step, the sample 10 is analyzed by irradiating an analysis site on the surface of the sample 10 with an electron beam to detect a transmission electron beam. On the other hand, if the brightness difference between the area where the contaminated sediment is deposited and the other area exceeds a desired value, the sample 10 is likely to be contaminated by electron beam irradiation, and it is determined that the analysis accuracy cannot be maintained high. The analysis process is not performed. In this case, it is advisable to identify the cause of contamination, review the production conditions of the sample 10, quantify the contamination again, and perform the analysis process. In addition, the numerical value of the luminance difference between the area where the contaminated sediment is deposited and the other area as the evaluation standard for contamination may be changed as appropriate according to the required accuracy. The luminance difference between the area where the deposit is deposited and the other area may be set to a low value.

<本実施形態にかかる効果>
本実施形態によれば、以下に示す1つ又は複数の効果を奏する。
<Effect according to this embodiment>
According to the present embodiment, the following one or more effects are achieved.

本実施形態によれば、試料表面に電子線を照射して汚染堆積物を堆積させた後にHAADF像を取得し、そのHAADF像において汚染堆積物が堆積する領域の輝度を求め、その輝度から汚染堆積物を定量している。これにより、試料について電子線を照射したときのコンタミネーション量を把握することができる。   According to the present embodiment, the HAADF image is acquired after the sample surface is irradiated with the electron beam to deposit the contaminated deposit, and the brightness of the area where the contaminated deposit is deposited is obtained from the HAADF image. The sediment is quantified. Thereby, the amount of contamination when the sample is irradiated with an electron beam can be grasped.

また、HAADF像から輝度プロファイルを求め、その輝度プロファイルから汚染堆積物が堆積する領域とその他の領域との輝度差を求めている。これにより、汚染堆積物の厚さを求めることができ、汚染堆積物をより高い精度で定量することができる。   In addition, a luminance profile is obtained from the HAADF image, and a luminance difference between a region where the contaminated deposit is deposited and other regions is obtained from the luminance profile. Thereby, the thickness of the contaminated deposit can be obtained, and the contaminated deposit can be quantified with higher accuracy.

取得工程では、堆積工程よりも低い倍率で電子線を照射することが好ましく、堆積工程は10万倍から100万倍、取得工程は1万倍から10万倍とすることが好ましい。倍率を低くすることで試料表面に電子線を照射したときの単位面積当たりの照射量を低くして汚染堆積物の生成を抑制できる。すなわち、堆積工程では、比較的高い倍率で電子線を照射することで効率的に汚染堆積物を生成させる一方、取得工程では、汚染堆積物の生成を抑制してHAADF像の取得を妨げないようにすることができる。   In the acquisition process, it is preferable to irradiate the electron beam at a magnification lower than that in the deposition process, the deposition process is preferably 100,000 to 1,000,000 times, and the acquisition process is preferably 10,000 to 100,000 times. By reducing the magnification, the amount of irradiation per unit area when the sample surface is irradiated with an electron beam can be reduced to suppress the formation of contaminated deposits. That is, in the deposition process, the contaminated deposit is efficiently generated by irradiating the electron beam at a relatively high magnification. On the other hand, in the acquisition process, the generation of the HAADF image is not hindered by suppressing the generation of the contaminated deposit. Can be.

また本実施形態によれば、定量工程にて試料のコンタミネーション量を把握し、その結果に基づいて分析工程を行っている。すなわち、定量工程でコンタミネーションが少ないことが確認された(汚染堆積物が堆積する領域とその他の領域との輝度差が小さい、もしくは汚染堆積物11が薄い)試料の場合、そのまま分析箇所に電子線を照射することで精度よく分析することができる。一方、コンタミネーションが多いことが確認された試料の場合、分析を行わずに、コンタミネーションの原因を特定して試料を再度作成して分析するとよい。これにより、高い精度の分析を効率よく行うことができる。   Further, according to the present embodiment, the amount of contamination of the sample is grasped in the determination step, and the analysis step is performed based on the result. In other words, in the case of a sample that has been confirmed to have low contamination in the quantitative process (the difference in luminance between the region where the contaminated deposit is deposited and the other region is small, or the contaminated deposit 11 is thin), an electron is directly applied to the analysis location. It is possible to analyze with high accuracy by irradiating the line. On the other hand, in the case of a sample that has been confirmed to have a large amount of contamination, it is preferable to analyze the sample by identifying the cause of contamination without analyzing it. Thereby, a highly accurate analysis can be performed efficiently.

<他の実施形態>
以上、本発明の一実施形態について説明してきたが、本発明は、上述した実施形態に何等限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々に改変することができる。
<Other embodiments>
Although one embodiment of the present invention has been described above, the present invention is not limited to the embodiment described above, and various modifications can be made without departing from the scope of the present invention.

上述の実施形態では、堆積工程において電子線の照射を1回行って汚染堆積物を1層堆積させる場合について説明したが、電子線の照射を2回行い、汚染堆積物を2層積層させることが好ましい。具体的には、第1堆積工程として、試料表面に電子線を照射して試料表面に第1の汚染堆積物を堆積させ、第2堆積工程として、その第1の汚染堆積物が堆積する領域を含むように試料表面に電子線を照射して第2の汚染堆積物を第1の汚染堆積物を覆うように堆積させることが好ましい。このとき、第2堆積工程では第1堆積工程よりも低い倍率で電子線を照射することが好ましい。このように汚染堆積物を高倍率と低倍率とで2回積層させることで、試料について各倍率での堆積のしやすさを把握することができる。   In the above-described embodiment, the case where the electron beam irradiation is performed once in the deposition process to deposit one layer of the contaminated deposit has been described. However, the electron beam irradiation is performed twice to stack two layers of the contaminated deposit. Is preferred. Specifically, as the first deposition step, the sample surface is irradiated with an electron beam to deposit a first contaminated deposit on the sample surface, and as the second deposition step, the region where the first contaminated deposit is deposited. It is preferable to deposit the second contaminated deposit so as to cover the first contaminated deposit by irradiating the sample surface with an electron beam so as to contain the first contaminated deposit. At this time, it is preferable to irradiate the electron beam at a lower magnification in the second deposition step than in the first deposition step. Thus, by stacking the contaminated deposits twice at a high magnification and a low magnification, it is possible to grasp the easiness of deposition at each magnification for the sample.

以下、本発明をさらに詳細な実施例に基づき説明するが、本発明は、これら実施例に限定されない。   Hereinafter, the present invention will be described based on further detailed examples, but the present invention is not limited to these examples.

(実施例)
まず、粉末試料と2液硬化性エポキシ樹脂とを混合して硬化させ、樹脂に粉末試料が埋め込まれた樹脂成形体を形成する。この樹脂成形体を、収束イオン加工装置(日立ハイテクノロジーズ株式会社製「FB−2100」)を用いて薄片化し、厚さが100nm以下のTEM用の薄片試料(以下、単に試料ともいう)を作製した。本実施例では、市販の2液硬化性エポキシ樹脂を3種類用いて、試料A、試料Bおよび試料Cの3つを作製した。
(Example)
First, a powder sample and a two-component curable epoxy resin are mixed and cured to form a resin molded body in which the powder sample is embedded in the resin. The resin molded body was sliced using a focused ion processing apparatus (“FB-2100” manufactured by Hitachi High-Technologies Corporation), and a TEM thin sample (hereinafter also simply referred to as a sample) having a thickness of 100 nm or less was produced. did. In this example, three types of sample A, sample B, and sample C were prepared using three types of commercially available two-component curable epoxy resins.

続いて、試料Aを透過電子顕微鏡(日本電子株式会社製「JEM−ARM200F」)に導入し、HAADF像観察を行った。具体的には、まず、試料Aの表面に対して、倍率を100万倍、画素数を1000×1000、30秒/フレームで電子線を照射(第1照射)して走査した。次に、試料Aの表面に対して、第1照射領域を含むように、倍率を50万倍、画素数を1000×1000、30秒/フレームで電子線を照射(第2照射)して走査した。そして最後に、試料Aの表面に対して、第2照射領域を含むように、倍率を10万倍、画素数を1000×1000、30秒/フレームで電子線を照射して走査することで、図3(a)に示すようなHAADF像を取得した。また、図3(a)のHAADF像を解析ソフト(GATAN株式会社製「DigitalMicrograph」)に読み込ませ、図3(b)に示す輝度プロファイルを得た。図3(b)は、図3(a)の矢印方向に輝度を抽出した輝度プロファイルを示し、横軸に矢印の始点からの距離[nm]を、縦軸に輝度(強度)をとって作成したものである。   Subsequently, the sample A was introduced into a transmission electron microscope (“JEM-ARM200F” manufactured by JEOL Ltd.), and HAADF image observation was performed. Specifically, first, the surface of the sample A was scanned by irradiating an electron beam (first irradiation) at a magnification of 1,000,000, a number of pixels of 1000 × 1000, and 30 seconds / frame. Next, the surface of the sample A is scanned by irradiating an electron beam (second irradiation) at a magnification of 500,000, a number of pixels of 1000 × 1000, and 30 seconds / frame so as to include the first irradiation region. did. Finally, the surface of the sample A is scanned by irradiating with an electron beam at a magnification of 100,000 times, a pixel number of 1000 × 1000, 30 seconds / frame so as to include the second irradiation region, A HAADF image as shown in FIG. Further, the HAADF image of FIG. 3A was read by analysis software (“Digital Micrograph” manufactured by GATAN Co., Ltd.) to obtain a luminance profile shown in FIG. FIG. 3B shows a luminance profile in which luminance is extracted in the direction of the arrow in FIG. 3A, and the horizontal axis is the distance [nm] from the starting point of the arrow and the vertical axis is the luminance (intensity) It is a thing.

図3(a)に示すように、試料AのHAADF像では、第1照射および第2照射により2回照射された領域(図中のR領域)が最も明るく、第2照射により1回照射された領域(図中のR領域)が次いで明るく、いずれでも照射されていない領域(図中のR領域)が暗く観察された。このことから、電子線の照射量(照射回数)が多いR領域ほど汚染堆積物が多く、輝度が高く明るく観察されることになる。
図3(b)によれば、図3(a)の明暗に対応するように輝度が変化していることが確認できる。最も明るいR領域と最も暗いR領域との輝度差は汚染堆積物の厚さに対応し、輝度差が大きいほど汚染堆積物の厚さが厚くなる。試料Aは、この輝度差が100万程度であって汚染堆積物が厚く形成されており、電子線照射によるコンタミネーションが生じやすいことが分かった。つまり、試料Aによれば、このまま電子線を照射して透過電子像を取得したとしてもコンタミネーションが多く、精度よく分析できないおそれがある。
As shown in FIG. 3 (a), in the HAADF image of the sample A, irradiated areas twice by the first irradiation and second irradiation brightest (R 1 region in the figure), once the second irradiation irradiation region is followed bright (R 2 region in the figure), any region that is not irradiated even (R 3 region in the drawing) it was observed dark. For this reason, the R 1 region where the amount of irradiation (number of irradiations) of the electron beam is larger, the more contaminated deposits are observed, and the luminance is higher and brighter.
According to FIG.3 (b), it can confirm that the brightness | luminance is changing so as to correspond to the light and darkness of Fig.3 (a). The luminance difference between the brightest R 1 region and the darkest R 3 region corresponds to the thickness of the contaminated deposit, and the greater the luminance difference, the thicker the contaminated deposit. Sample A has a brightness difference of about 1 million, and a thick contaminated deposit is formed. It was found that contamination due to electron beam irradiation is likely to occur. That is, according to the sample A, even if a transmission electron image is acquired by irradiating an electron beam as it is, there is a possibility that there is much contamination and the analysis cannot be performed accurately.

試料Bおよび試料Cについても試料Aと同様にHAADF像を取得するとともに輝度プロファイルを得た。図4(a)は、試料BについてのHAADF像であり、図4(b)は、図4(a)の矢印方向に輝度を抽出した輝度プロファイルを示す。図5(a)は、試料CについてのHAADF像であり、図5(b)は、図5(a)の矢印方向に輝度を抽出した輝度プロファイルを示す。   As for Sample B and Sample C, HAADF images were obtained in the same manner as Sample A, and a luminance profile was obtained. 4A is a HAADF image for the sample B, and FIG. 4B shows a luminance profile obtained by extracting the luminance in the arrow direction of FIG. FIG. 5A is a HAADF image for the sample C, and FIG. 5B shows a luminance profile in which luminance is extracted in the direction of the arrow in FIG.

図4(a)および(b)に示すように、試料Bは、最も明るいR領域と最も暗いR領域との輝度差が試料Aと比べて小さいことから、汚染堆積物の厚さが薄く、コンタミネーションの量が少ないことが確認された。
また、図5(a)および(b)に示すように、試料Cは、R領域からR領域の間で輝度差がほとんどなく、試料Aおよび試料Bに比べてコンタミネーションが生じていないことが確認された。
このことから、試料Bや試料Cは、電子線を照射したときにコンタミネーションが少ないため、透過電子像を取得して精度よく分析できることが分かる。
As shown in FIGS. 4A and 4B, the sample B has a smaller brightness difference between the brightest R 1 region and the darkest R 3 region than the sample A. It was confirmed that it was thin and the amount of contamination was small.
Further, as shown in FIG. 5 (a) and (b), Sample C, little luminance difference between R 1 region of R 3 areas, it does not occur contamination compared to Sample A and Sample B It was confirmed.
From this, it can be seen that Sample B and Sample C have little contamination when irradiated with an electron beam, so that a transmission electron image can be acquired and analyzed with high accuracy.

以上に示すように、試料表面に汚染堆積物を堆積させてHAADF像を取得し、汚染堆積物が堆積する領域の輝度から汚染堆積物の量、つまりコンタミネーション量を把握することができる。また、汚染堆積物が堆積して最も明るく観察される領域と汚染堆積物が堆積せずに最も暗く観察される領域との輝度差から汚染堆積物の量(厚さ)を定量することができる。   As described above, the HAADF image is acquired by depositing the contaminated deposit on the sample surface, and the amount of the contaminated deposit, that is, the amount of contamination can be grasped from the luminance of the region where the contaminated deposit is deposited. In addition, the amount (thickness) of the contaminated deposit can be quantified from the luminance difference between the region where the contaminated deposit is accumulated and observed most brightly and the region where the contaminated deposit is not observed accumulated darkest. .

10 試料
11 汚染堆積物
12 撮像領域
10 Sample 11 Contaminated sediment 12 Imaging region

Claims (9)

試料を透過電子顕微鏡で分析するときに試料表面に堆積する汚染堆積物を定量する方法であって、
試料表面に電子線を照射し、雰囲気中に存在する炭化水素成分に由来する汚染堆積物を照射領域に堆積させる堆積工程と、
前記汚染堆積物が堆積する領域を含むように前記試料表面に電子線を照射し、高角度環状暗視野像を取得する取得工程と、
前記高角度環状暗視野像における前記汚染堆積物が堆積する領域の輝度を測定し、前記輝度から前記汚染堆積物を定量する定量工程と、を有する、汚染堆積物の定量方法。
A method for quantifying contaminated deposits deposited on a sample surface when the sample is analyzed with a transmission electron microscope,
A deposition step of irradiating the sample surface with an electron beam and depositing contaminated deposits derived from hydrocarbon components present in the atmosphere on the irradiated region;
An acquisition step of irradiating the surface of the sample with an electron beam so as to include a region where the contaminated deposit is deposited, and acquiring a high-angle annular dark field image;
A quantification step of measuring a luminance of a region in which the contaminated deposit is deposited in the high-angle annular dark field image, and quantifying the contaminated deposit from the luminance;
前記定量工程では、前記高角度環状暗視野像から輝度プロファイルを求め、前記輝度プロファイルにおける前記汚染堆積物が堆積する領域とその他の領域との輝度差から前記汚染堆積物の厚さを求める、
請求項1に記載の汚染堆積物の定量方法。
In the quantification step, a luminance profile is obtained from the high-angle annular dark field image, and the thickness of the contaminated deposit is obtained from a luminance difference between a region where the contaminated deposit is deposited and other regions in the luminance profile.
The method for quantifying contaminated sediment according to claim 1.
前記取得工程では、前記堆積工程よりも低い倍率で電子線を照射する、
請求項1又は2に記載の汚染堆積物の定量方法。
In the acquisition step, the electron beam is irradiated at a lower magnification than the deposition step.
The method for quantifying contaminated deposits according to claim 1 or 2.
前記堆積工程では、10万倍以上100万倍以下の倍率で電子線を照射する、
請求項1〜3のいずれか1項に記載の汚染堆積物の定量方法。
In the deposition step, the electron beam is irradiated at a magnification of 100,000 times to 1 million times.
The quantification method of the contaminated deposit of any one of Claims 1-3.
前記取得工程では、1万倍以上10万倍以下の倍率で電子線を照射する、
請求項1〜4のいずれか1項に記載の汚染堆積物の定量方法。
In the acquisition step, the electron beam is irradiated at a magnification of 10,000 to 100,000 times.
The quantification method of the contaminated deposit of any one of Claims 1-4.
前記堆積工程は、
前記試料表面に電子線を照射し、前記試料表面に第1の汚染堆積物を堆積させる第1堆積工程と、
前記第1の汚染堆積物が堆積する領域を含むように前記試料表面に電子線を照射し、第2の汚染堆積物を堆積させる第2堆積工程と、を有する、
請求項1〜5のいずれか1項に記載の汚染堆積物の定量方法。
The deposition step includes
A first deposition step of irradiating the sample surface with an electron beam to deposit a first contaminated deposit on the sample surface;
A second deposition step of irradiating the surface of the sample with an electron beam so as to include a region where the first contaminated deposit is deposited, and depositing a second contaminated deposit.
The quantification method of the contaminated deposit of any one of Claims 1-5.
前記第2堆積工程では、前記第1堆積工程よりも低い倍率で電子線を照射する、
請求項6に記載の汚染堆積物の定量方法。
In the second deposition step, the electron beam is irradiated at a lower magnification than in the first deposition step.
The method for quantifying a contaminated deposit according to claim 6.
透過電子顕微鏡により試料を分析する試料分析方法であって、
試料の分析箇所以外の領域に電子線を照射し、雰囲気中に存在する炭化水素成分に由来する汚染堆積物を照射領域に堆積させる堆積工程と、
前記汚染堆積物が堆積する領域を含むように前記試料表面に電子線を照射し、高角度環状暗視野像を取得する取得工程と、
前記高角度環状暗視野像において前記汚染堆積物が堆積する領域の輝度を測定し、前記輝度から前記汚染堆積物を定量する定量工程と、
前記定量工程の結果に応じて、前記試料表面の分析箇所に電子線を照射して透過電子像を取得し分析する分析工程と、を有する、試料分析方法。
A sample analysis method for analyzing a sample with a transmission electron microscope,
A deposition step of irradiating an electron beam to an area other than the analysis location of the sample, and depositing contaminated deposits derived from hydrocarbon components present in the atmosphere in the irradiated area;
An acquisition step of irradiating the surface of the sample with an electron beam so as to include a region where the contaminated deposit is deposited, and acquiring a high-angle annular dark field image;
A quantification step of measuring a luminance of a region where the contaminated deposit is deposited in the high-angle annular dark field image, and quantifying the contaminated deposit from the luminance;
An analysis step of acquiring and analyzing a transmission electron image by irradiating an analysis site on the sample surface with an electron beam according to a result of the quantification step.
前記定量工程では、前記高角度環状暗視野像から輝度プロファイルを求め、前記輝度プロファイルにおける前記汚染堆積物が堆積する領域とその他の領域との輝度差を求め、
前記分析工程では、前記輝度差が所定値以下であれば、分析を行う、請求項8に記載の試料分析方法。
In the quantitative determination step, a luminance profile is obtained from the high-angle annular dark field image, and a luminance difference between the region where the contaminated deposit is deposited and other regions in the luminance profile is obtained,
The sample analysis method according to claim 8, wherein in the analysis step, analysis is performed if the luminance difference is equal to or less than a predetermined value.
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