JP2018039178A - Liquid discharge head and method of manufacturing liquid discharge head - Google Patents

Abstract

A liquid discharge head capable of discharging liquid with a uniform discharge amount while accurately aligning a plurality of discharge ports, energy generating elements, and liquid supply ports, and a method for manufacturing the same.
In a step of forming a flow path and a discharge port in a flow path forming layer, a first region having a higher arrangement density of liquid supply ports is more than a second region having a lower arrangement density. The discharge port 6 is formed so that the opening area of the discharge port 6 becomes large.
[Selection] Figure 4

Description

  The present invention relates to a liquid discharge head and a method for manufacturing the liquid discharge head.

  A liquid discharge head used in a liquid discharge apparatus such as an ink jet recording apparatus is mainly configured by laminating a flow path forming layer on a substrate. In the flow path forming layer, a plurality of discharge ports and flow paths for guiding the liquid to the individual discharge ports are formed at a pitch corresponding to the discharge density. On the other hand, an energy generating element that generates energy for discharging liquid and a liquid supply port for supplying liquid from the back surface of the substrate are formed on the surface on which the energy generating element is disposed. The liquid supplied from the back surface of the substrate through the supply port is guided to the energy generating element through the flow path formed between the substrate and the flow path forming member, and the meniscus is formed in the vicinity of the discharge port communicating with the atmosphere. Form. When the energy generating element is driven according to the ejection signal, the liquid is ejected from the ejection port as droplets by the energy generated here.

  In such a liquid discharge head, there are a method of forming a liquid supply port, which is a hole penetrating the substrate, after the substrate and the flow path forming layer are bonded together, and a method of forming the liquid supply port before bonding them together. Patent Document 1 discloses a method in which a dry film resist is applied on a substrate on which a liquid supply port has been previously formed, and a flow path forming layer is laminated via the dry film resist. If the method of Patent Document 1 is adopted, even in a configuration in which the discharge ports, the energy generating elements, and the liquid supply ports are arranged at high density, it is possible to perform layout with high accuracy while making these correspond to each other.

JP-A-6-286149

  However, when the method of Patent Document 1 is adopted, the dry film resist sinks into the liquid supply port to some extent in the step of applying the dry film resist on the substrate on which the liquid supply port has been previously formed. The sinking amount depends on the size and arrangement density of the liquid supply ports. On the other hand, the area where the dry film resist exists becomes a flow path that guides the liquid to the individual discharge ports in the end. Therefore, depending on the amount of the dry film resist sinking, the height and volume of the flow channel, the discharge port from the energy generating element Distance, and thus the discharge amount. That is, even if discharge ports of the same size and energy generating elements of the same type are arranged, the discharge amount of each discharge port varies depending on the size and arrangement density of the liquid supply ports formed on the substrate.

  The present invention has been made to solve the above problems. Therefore, the object is to provide a liquid discharge head capable of discharging liquid with a uniform discharge amount while accurately aligning individual discharge ports, energy generating elements and liquid supply ports, and a method for manufacturing the same. Is to provide.

  The present invention provides a step of preparing an energy generating element that generates energy for discharging liquid, a substrate on which a plurality of liquid supply ports for supplying liquid to the energy generating element are arranged, and the energy of the substrate. A lamination step of laminating a flow path forming layer on a surface where the generating elements are arranged, a flow path for guiding the liquid supplied from the liquid supply port to the energy generating element, and the energy generation Forming a discharge port for discharging a liquid by energy generated by an element, wherein the flow path forming layer is opened from a side where the discharge port is opened. When viewed, the flow path forming layer has a first area and a second area in which the arrangement density of the liquid supply ports below the flow path forming layer is smaller than the first area, In the formation process Wherein the opening area of the discharge port than it is the second region of the first region is increased, and forming the discharge port to the flow path forming layer.

  According to the present invention, it is possible to provide a liquid discharge head capable of discharging liquid with a uniform discharge amount while aligning the discharge port, the energy generating element, and the liquid supply port with high accuracy.

It is a perspective view which shows an example of the liquid discharge head of this invention. It is a figure for demonstrating the manufacturing process of a liquid discharge head. It is a figure which shows the relationship between the opening area of a discharge outlet, and flow path height. FIG. 3 is a diagram illustrating a layout of a liquid supply port and a discharge port in Embodiment 1. 6 is a diagram illustrating a layout of a liquid supply port and a discharge port in Embodiment 2. FIG. FIG. 10 is a diagram illustrating a layout of a liquid supply port and a discharge port in Example 3. FIG. 9 is a diagram illustrating a layout of liquid supply ports and discharge ports in Example 4. FIG. 10 is a diagram illustrating a layout of a liquid supply port and a discharge port in Example 5.

  FIG. 1 is a perspective view showing an example of the liquid discharge head of the present invention. The liquid discharge head 100 has an orifice plate 2 that is a flow path forming layer on the surface in the + Z direction of the substrate 1. The substrate 1 is preferably formed of silicon (100) whose surface in the + Z direction has a crystal orientation (100).

  The substrate 1 is formed with energy generating elements 3 and liquid supply ports 5 at a predetermined pitch. As the energy generating element 3, a heating resistor or a piezoelectric element can be used, and these are arranged on the surface of the substrate 1 in the + Z direction. The individual energy generating elements 3 may be formed so as to be in contact with the surface in the + Z direction of the substrate 1 or may be formed in a state including a part of the hollow. Each of the liquid supply ports 5 penetrates the substrate 1 in the ± Z direction, and supplies the liquid received from the −Z direction side to the energy generating elements 3 arranged in the + Z direction. In the figure, an example is shown in which the energy generating elements 3 and the liquid supply ports 5 are associated one-to-one, but these may be associated one-to-many, plural-to-one, and plural-to-multiple. Good.

  The orifice plate 2 laminated on the surface in the + Z direction of the substrate 1 is made of resin. In the orifice plate 2, a flow path 7 that guides the liquid from each liquid supply port 5 to the corresponding energy generating element, and a discharge port 6 that penetrates in the Z direction corresponding to each of the energy generating elements 3 are formed. . The discharge port opens in the orifice plate. The side on which the discharge port of the orifice plate opens is the side from which liquid is discharged. Electrodes 4 for driving individual energy generating elements 3 are arranged at the end of the surface of the substrate 1 in the + Z direction.

  With the above configuration, the liquid supplied from the −Z direction side of the substrate 1 through the liquid supply port 5 is guided to the vicinity of the discharge port through the flow path 7 to form a convex meniscus in the −Z direction. To do. Then, when electric energy through the electrodes is supplied to the individual energy generating elements 3 according to the discharge signal, the liquid existing between the energy generating elements 3 and the discharge ports 6 is discharged from the discharge ports 6 in the + Z direction. .

  2A to 2H are views for explaining a manufacturing process of the liquid ejection head 100. FIG. Each figure shows a cross-sectional view at the cutting position of II-II in FIG.

  First, as shown in FIG. 2A, a plurality of liquid supply ports 5 penetrating in the Z direction and a substrate 1 having a plurality of energy generating elements formed on the surface in the + Z direction are prepared. The liquid supply port 5 can be formed on the silicon (100) substrate 1 by wet etching using TMAH (tetramethylammonium hydroxide) or by dry etching using a Bosch process. . Whichever method is employed, holes penetrating in the Z direction can be formed in the silicon (100) substrate 1 with high density.

  On the other hand, it is assumed that the energy generating element 3 of this example is made of a heat generating resistor and the surface thereof is covered with a protective film such as SiN or SiO2. Then, by applying a predetermined voltage pulse to the heating resistor, film boiling occurs in the liquid in contact with the heating resistor, the liquid is pushed out from the discharge port 6 as the generated bubbles grow, Liquid is discharged by communicating with the atmosphere. At this time, the liquid discharge amount Vd is determined by the size of the bubbles generated by the heating resistor until they are communicated with the atmosphere.

  Next, as shown in FIG.2 (b), the dry film 10 supported by the support body 9 is prepared. The dry film 10 is a film of a photosensitive resin that is easily dissolved in an organic solvent, and its softening point is preferably 40 ° C. or higher and 120 ° C. or lower. As such a resin, for example, an epoxy resin, an acrylic resin, a urethane resin, or the like is preferably used. Examples of the epoxy resin include bisphenol A type, cresol novolac type, and alicyclic epoxy resin, examples of the acrylic resin include polymethyl methacrylate, and examples of the urethane resin include polyurethane. Examples of the solvent for dissolving these resins include PGMEA (propylene glycol methyl ether acetate), cyclohexanone, methyl ethyl ketone, xylene and the like. The viscosity of the resin composition in which the resin is dissolved in a solvent is preferably 5 cP or more and 150 cP or less. This resin composition is applied onto the support 9 by spin coating or slit coating, and dried at 50 ° C. or more. To do. Thereby, the dry film 10 of the state supported by the support body 9 as shown in FIG.2 (b) can be formed. In addition, it is preferable that the thickness after drying of the dry film 10 on the support body 9 shall be 5 micrometers or more and 30 micrometers or less.

  As the support 9, a film, glass, silicon, or the like can be used. However, considering that the dry film 10 is peeled later, a film is preferable. Examples of the film include a PET (polyethylene terephthalate) film, a polyimide film, a polyamide film, and a polyaramid film. In addition, in order to make it easy to peel the support body 9 from the dry film 10, you may perform a mold release process on the surface of the support body 9. FIG.

  Subsequently, the dry film 10 in the state shown in FIG. 2B is brought into contact with the substrate 1 shown in FIG. 2A from the + Z direction side, and only the support 9 is peeled off. Thereby, as shown in FIG. 2C, the dry film 10 is transferred to the + Z direction surface of the substrate 1. At this time, the adhesion between the dry film 10 and the substrate 1 can be enhanced by heating the dry film 10 to a temperature higher than its softening point and transferring it while applying pressure in the −Z direction. In addition, it is preferable that such a transfer process is performed while adopting a roll method in a vacuum environment in consideration of the discharge of bubbles.

  The liquid supply port 5 is closed by the transferred dry film 10 by the transfer process. At this time, a part of the dry film 10 is pressed by a pressure during transfer, as shown in FIG. ) Enters the liquid supply port 5. For this reason, the height d ′ in the Z direction from the surface of the substrate 1 is smaller than the height d of the left and right end regions where the liquid supply port 5 does not exist.

  Next, as shown in FIG. 2D, the surface in the + Z direction of the substrate 1 is exposed with the mask 11 interposed. As a result, the solubility of the exposed region 12 of the dry film 10 made of a photosensitive resin is lowered, and the state of the original resin is maintained in the non-exposed region 13. Here, the non-exposed area 13 is an area that will later become a flow path. Here, since the negative type dry film 10 is used, the region desired to remain is set as the exposure region 12. However, when the positive type dry film is used, the region desired to remain becomes a non-exposure region. What is necessary is just to prepare a mask.

  Next, as illustrated in FIG. 2E, a new resin layer 15 different from the dry film 10 is formed on the + Z direction surface of the dry film 10. For example, as with the dry film 10, the resin layer 15 is applied to the support 9 using a spin coating method or a slit coating method, and this is transferred to the surface of the dry film 10 by a laminating method or a pressing method. Further, it can be formed by further drying.

  Next, as shown in FIG. 2F, the surface in the + Z direction (surface of the resin layer 15) of the substrate 1 is exposed with a new mask 14 interposed. Thereby, the solubility of the exposed region 16 of the resin layer 15 is lowered, and the non-exposed region 17 is maintained in the original resin state. The non-exposure area 17 is an area that later becomes an ejection port. In the present embodiment, the pattern of the mask 14 used in this step is characterized, and details thereof will be described later. Even in this step, when a positive resin layer is used, it can be handled by preparing a mask in which a region desired to remain is a non-exposed region.

  After the exposure process is completed, the substrate 1 on which the dry film 10 and the resin layer 15 are laminated is immersed in a developer. Thereby, the non-exposed region 13 and the non-exposed region 17 are dissolved and removed, and the orifice plate 2 in which the flow path 7 and the discharge port 6 as shown in FIG. 2G are formed is completed. As the developer, PGMEA, tetrahydrofuran, cyclohexanone, methyl ethyl ketone, xylene, or the like can be used.

  Thereafter, the electrode 4 and the like are formed, and the electrical connection to the energy generating element 3 is formed, whereby the liquid ejection head 100 shown in FIG. 1 is completed.

  Next, a characteristic configuration of the present invention will be described in detail. As already described with reference to FIG. 2C, the height in the + Z direction on the surface of the dry film 10 is reduced by the amount that the dry film 10 has entered the liquid supply port 5. That is, as the opening area and the arrangement density of the liquid supply ports 5 are higher, the amount of the dry film 10 entering the liquid supply ports 5 becomes larger, so that the height of the flow path 7 in the + Z direction and the flow path volume become smaller. .

  Here, the arrangement density of the liquid supply ports 5 is considered. When the orifice plate (flow path forming layer) 2 is viewed from the side where the discharge port opens, the orifice plate (flow path forming layer) 2 has a first region and a second region. The arrangement density of the liquid supply ports 5 under the orifice plate (flow path forming layer) 2 is different between the first area and the second area. Specifically, the arrangement density of the liquid supply ports 5 under the orifice plate (flow path forming layer) is lower in the second region than in the first region. That is, the arrangement density of the liquid supply ports 5 differs depending on the position of the orifice plate 2 in the XY plane. For example, even when the plurality of liquid supply ports 5 are two-dimensionally arranged at equal intervals on the XY plane, the arrangement density of the central region is higher than that of the end region, and the flow path is in the direction perpendicular to the XY plane (Z direction) The height d tends to be lower than the end region. As a result, when equivalent energy is applied to the heat generating resistor which is the energy generating element 3, bubbles generated by the heat generating resistor in the central region communicate with the atmosphere without growing as much as the end region, and the discharge port 6 Thus, the discharge amount Vd of the liquid discharged from the nozzle is kept small. As described above, even if the discharge ports of the same size or the same type of energy generating elements are arranged at a constant pitch, the discharge amount of each discharge port 6 tends to vary depending on the position.

  On the other hand, the discharge amount at each discharge port 6 depends not only on the flow path height d but also on the opening area S of the discharge port 6. In general, when the opening area of the discharge port 6 is S and the flow path height is d, the discharge amount Vd can be expressed as Vd = k × S × d using a coefficient k related to discharge efficiency. That is, the discharge amount Vd is proportional to both the flow path height d and the discharge port area S.

  In view of such a situation, the inventors adjust the opening area S of the discharge ports 6 according to the arrangement density of the liquid supply ports 5 in order to make the discharge amount Vd uniform at the plurality of discharge ports 6. Judging that it is effective. Specifically, in the XY plane of the orifice plate 2, the region (first region) where the arrangement density of the liquid supply ports 5 in the substrate 1 under the channel forming layer (orifice plate) 2 is high is the channel height. d tends to be small. Therefore, a discharge port having a relatively large opening area S is formed in the flow path forming layer in the first region. On the other hand, in the region (second region) where the arrangement density of the liquid supply ports 5 is low, the flow path height d tends to be large, so that a discharge port having a relatively small opening area S is formed. By doing in this way, the discharge amount Vd of all the discharge ports 6 can be uniformly stabilized irrespective of the position of the orifice plate 2 plane.

  3A and 3B are diagrams showing the relationship between the opening area S of the discharge ports 6 and the flow path height d with respect to the arrangement density of the liquid supply ports 5. FIG. 3A shows a mode in which one liquid supply port 5 is provided in the vicinity of one energy generating element 3 and liquid is supplied therefrom. On the other hand, FIG. 3B shows a form in which four liquid supply ports 5 are arranged around one energy generating element 3 and liquid is supplied from these. The shapes of the individual liquid supply ports 5 and the energy generating elements 3 are the same in both figures.

  When the orifice plate 2 as shown in FIGS. 3A and 3B is formed, in the transfer process shown in FIG. 2C, the arrangement density of the liquid supply ports 5 is higher in FIG. The penetration amount of the dry film 10 becomes larger than that in FIG. 3A where the arrangement density is low. As a result, the height d of the flow path 7 formed after the development processing is lower in FIG. 3B than in FIG. 3A, and the distance from the energy generating element 3 to the discharge port 6 is also shortened.

  Therefore, in the present invention, in order to make the discharge amount Vd uniform in the cases of FIG. 3A and FIG. 3B, the opening area S of the discharge port 6 of FIG. The opening area S of 3 (b) is designed to be relatively large. At this time, the size of the opening area S is adjusted by the area of the mask region M in the mask 14 used in FIG. In this way, the discharge amount Vd can be made uniform with the configuration shown in FIGS. 3A and 3B regardless of the arrangement density of the liquid supply ports 5.

  Further, as shown in FIG. 3B, the configuration in which liquid can be supplied from a plurality of liquid supply ports 5 to one energy generating element 3 is also effective in making the discharge speed uniform. When the flow path height d decreases as shown in FIG. 3B, the flow path resistance to the liquid increases, the liquid refill speed at the discharge port 6 decreases, the inertance for discharge increases, and the discharge speed increases. . However, if the number of liquid supply ports 5 that can be supplied to one discharge port is increased as in this embodiment, the refill speed is increased accordingly, the inertance for discharge is decreased, and the discharge speed is decreased. That is, as shown in FIG. 3B, in a region where the arrangement density of the liquid supply ports 5 is relatively high, if the liquid can be supplied from a plurality of liquid supply ports 5 to one discharge port, the liquid supply It is possible to reduce variations in discharge speed due to the arrangement density of the ports 5.

  Hereinafter, some examples of the present invention will be described with specific numbers. In any of the liquid discharge heads of the embodiments, the discharge port is designed to be circular, and the opening area S of the discharge port is a monotonically increasing function of the opening diameter φ of the discharge port.

Example 1
4A to 4D are diagrams illustrating the layout of the liquid supply port 5 and the discharge port 6 in the first embodiment. FIG. 4A is a top view when the liquid ejection head 100 is viewed from the + Z direction side. FIG. 4B is a cross-sectional view of FIG. FIG. 4C is a top view showing a region IVC surrounded by a broken line in FIG. Further, FIG. 4D is a top view showing a region IVD surrounded by a broken line in FIG. The positions of the region IVC and the region IVD are also shown in the cross-sectional view of FIG.

  In the present embodiment, the liquid supply port 5, the energy generating element 3, and the discharge port 6 are associated with each other on a one-to-one basis. As shown in FIG. 4A, a set of the liquid supply port 5, the energy generating element 3, and the discharge port 6 are arranged in the X direction at an interval of 600 dpi (dot / inch), that is, a pitch of about 42.1 μm. Thus, one printing element array L is formed. A plurality of such recording element arrays L are further arranged in the Y direction to constitute the liquid ejection head 100 of this embodiment. The distance on the XY plane from each liquid supply port 5 to the corresponding discharge port 6, that is, the length of the flow path 7 is designed to be a distance of 100 μm or less.

  The region IVC is located at the end in the Y direction in the entire array region of the liquid supply ports 5 and includes two discharge port rows and three liquid supply port rows. Is 20%. On the other hand, the region IVD is located at the center in the Y direction in the entire array region of the liquid supply ports 5 and includes three discharge port rows and four liquid supply port rows. The area occupation ratio is 30%. In this case, in the transfer step shown in FIG. 2C, the amount of the dry film 10 entering the liquid supply port 5 is larger in the region IVD than in the region IVC, and the flow path height d after the development processing is Lower. In this embodiment, the channel height of the region IVC is d = 23 μm, and the channel height of the region IVD is d = 20 μm.

  Under the above conditions, in this embodiment, the opening diameter φ of the discharge port 6 included in the region IVC is adjusted to φ = 18 μm, and the opening diameter φ of the discharge port 6 included in the region IVD is adjusted to φ = 20 μm. To do. Specifically, the mask diameter at the position corresponding to the discharge port 6 included in the region IVC is made smaller than the mask diameter at the position corresponding to the discharge port 6 included in the region IVD, and the opening diameter φ is 18 μm and 20 μm, respectively. To be obtained.

  Thus, in this embodiment, the liquid discharge amount Vd when the predetermined energy is generated in the energy generating element 3 is approximately 5 pl at the discharge port 6 included in the region IVC and the discharge port 6 included in the region IVD. Can be aligned.

(Example 2)
5A to 5D are diagrams illustrating the layout of the liquid supply port 5 and the discharge port 6 in the second embodiment. Also in this embodiment, as shown in FIG. 5 (a), the liquid supply port 5, the energy generating element 3, and the discharge port 6 are spaced at an interval of 600 dpi (dot / inch), that is, at a pitch of about 42.1 μm. A plurality of such recording element arrays L are arranged in the Y direction.

  However, in the liquid discharge head 100 of the present embodiment, the correspondence relationship between the liquid supply port 5, the energy generating element 3, and the discharge port 6 differs depending on the position. More specifically, in the printing element rows L located at both ends in the Y direction, the liquid supply ports 5, the energy generating elements 3, and the ejection ports 6 are associated with each other on a one-to-one basis. On the other hand, in the printing element array L excluding the both ends, the liquid supply port 5, the energy generating element 3, and the ejection port 6 are associated with each other on a two-to-one basis.

  FIG. 5B is a cross-sectional view of FIG. FIG. 5C is a top view showing a region VC surrounded by a broken line in FIG. Further, FIG. 5D is a top view showing a region VD surrounded by a broken line in FIG. The positions of the region VC and the region VD are also shown in the cross-sectional view of FIG.

  The region VC is located at the end in the Y direction in the entire array region, includes two ejection port rows and two liquid supply port rows, and the area occupancy of the liquid supply port 5 is 10%. ing. On the other hand, the region VD is located at the center of the entire array region, includes three ejection port rows and four liquid supply port rows, and the area occupancy of the liquid supply port 5 is 30%. In this case, in the transfer step shown in FIG. 2C, the amount of the dry film 10 entering the liquid supply port 5 is larger in the region VD than in the region VC, and the flow path height after the development processing is low. Become. In this embodiment, the channel height of the region VC is d = 25 μm, and the channel height of the region VD is d = 20 μm.

  Under the above conditions, in this embodiment, the opening diameter φ of the discharge port 6 included in the region VC is adjusted to φ = 16 μm, and the opening diameter φ of the discharge port 6 included in the region VD is adjusted to φ = 20 μm. To do. Specifically, the mask diameter at the position corresponding to the ejection port 6 included in the region VC is made smaller than the mask diameter at the position corresponding to the ejection port 6 included in the region VD, and the opening diameters φ of 16 μm and 20 μm, respectively. To be obtained.

  Thus, in this embodiment, the liquid discharge amount Vd when predetermined energy is applied to the energy generating element 3 is approximately 5 pl at the discharge port 6 included in the region VC and the discharge port 6 included in the region VD. It becomes possible to align. In addition, in this embodiment, two liquid supply ports 5 are made to correspond to one discharge port 6 in a central region where the arrangement density of the liquid supply ports 5 is relatively high. For this reason, even in the central region where the flow path height d is low and the flow path resistance tends to be large, the flow path resistance can be kept low and the discharge speed can be made substantially uniform among all the discharge ports. That is, in the present embodiment, both the discharge amount and the discharge speed can be made substantially uniform at all the discharge ports 6.

(Example 3)
6A to 6D are diagrams showing the layout of the liquid supply port 5 and the discharge port 6 in the third embodiment. FIG. 6A is a diagram of the liquid discharge head 100 viewed from the + Z direction side. FIG. 6B is a cross-sectional view of FIG. FIG. 6C is a top view showing a region VIC surrounded by a broken line in FIG. Further, FIG. 6D is a top view showing a region VID surrounded by a broken line in FIG. The positions of the region VIC and the region VID are also shown in the cross-sectional view of FIG.

  Also in the present embodiment, as in the first embodiment, the liquid supply port 5, the energy generating element 3, and the discharge port 6 are associated with each other on a one-to-one basis. Further, as shown in the top view of FIG. 6A, the pair of liquid supply port 5, energy generating element 3, and discharge port 6 are spaced at an interval of 600 dpi (dot / inch), that is, a pitch of about 42.1 μm. Are arranged in the X direction to form a printing element row L for one row. However, in this embodiment, the plurality of recording element arrays L are not arranged at equal intervals in the Y direction, but are arranged in three groups with predetermined intervals. Such a configuration is used, for example, when the liquid ejection head 100 is an ink jet recording head and ejects ink containing different color materials in each group. In the case of such a configuration, the channel height d in the central region is not necessarily lower than the channel height d at the end.

  In this embodiment, the region VIC is located at the end in the Y direction in the entire array region of the liquid supply ports 5 and includes two discharge port rows and three liquid supply port rows. The area occupancy of 5 is 20%. On the other hand, the region VID is located at the center in the Y direction in the entire array region of the liquid supply ports 5 and includes two discharge port rows and two liquid supply port rows. The area occupation ratio is 20%. In this case, in the transfer process shown in FIG. 2C, the amount of the dry film 10 entering the liquid supply port 5 is larger in the region VID than in the region VIC, and the flow path height d after the development processing is set to be higher. Lower. In this embodiment, the channel height of the region VIC is d = 23 μm, and the channel height of the region VID is d = 25 μm.

  Under the above conditions, in this embodiment, the opening diameter φ of the discharge port 6 included in the region VIC is adjusted to φ = 16 μm, and the opening diameter φ of the discharge port 6 included in the region VID is adjusted to φ = 18 μm. To do. Specifically, the mask diameter at the position corresponding to the discharge port 6 included in the region VIC is made smaller than the mask diameter at the position corresponding to the discharge port 6 included in the region VID, and the opening diameter φ is 18 μm and 20 μm, respectively. To be obtained.

  Accordingly, in this embodiment, the liquid discharge amount Vd when predetermined energy is applied to the energy generating element 3 is approximately 5 pl at the discharge port 6 included in the region VIC and the discharge port 6 included in the region VID. Can be aligned.

Example 4
FIGS. 7A to 7D are diagrams showing the layout of the liquid supply port 5 and the discharge port 6 in the fourth embodiment in the same manner as in the above embodiment. Also in the present embodiment, as in the first embodiment, the liquid supply port 5, the energy generating element 3, and the discharge port are associated with each other on a one-to-one basis. However, in this embodiment, the discharge port 6 and the liquid supply port 5 are associated with each other in the X direction. In other words, each discharge port 6 is supplied with liquid from the liquid supply port 5 adjacent in the X direction instead of the Y direction.

  Even in such a configuration, in the central region such as the region VIIC, the occupied area of the liquid supply port 5 is high and the flow path height d after the development processing is low compared to the end region such as the region VIID. The discharge amount Vd tends to be small. That is, in this embodiment, similarly to the above-described embodiment, by setting the diameter of the discharge port 6 included in the region VIIC to be larger than the diameter of the discharge port 6 included in the region VIID, it is possible to suppress the discharge amount variation in the entire region. be able to.

(Example 5)
FIGS. 8A to 8D are diagrams showing the layout of the liquid supply port 5 and the discharge port 6 in the fifth embodiment in the same manner as in the above-described embodiment. In the present embodiment, the liquid supply port 5 extending in the X direction is configured to be able to supply liquid in common to the plurality of discharge ports 6 arranged on both sides thereof. Such a configuration is used, for example, when the liquid discharge head 100 is an ink jet recording head and inks of different colors are supplied from the individual liquid supply ports 5.

  Also in this embodiment, in the central region such as the region VIIID, the area occupancy of the liquid supply port 5 is high and the flow path height d after the development processing is low compared to the end region such as the region VIIIC. The discharge amount Vd decreases. Therefore, similarly to the above embodiment, the discharge amount Vd can be made uniform in the entire region by making the diameter of the discharge port 6 included in the region VIIID larger than the diameter of the discharge port 6 included in the region VIIIC.

  As described above using a plurality of embodiments, according to the present invention, a plurality of discharge ports, energy generating elements, and liquid supply ports can be aligned with high accuracy while discharging liquid with a uniform discharge amount. It is possible to manufacture a liquid discharge head that can be used.

  In the above description, photolithography is used as an effective method for forming the flow path 7 and the discharge ports 6 with high density and high accuracy. However, the present invention is not limited to such a form. . These can also be formed using, for example, laser processing or reactive ion etching. The liquid supply port 5 can also be formed by laser processing or sand blasting other than wet etching or dry etching.

1 substrate 2 flow path forming layer (orifice plate)
DESCRIPTION OF SYMBOLS 3 Energy generating element 5 Liquid supply port 6 Discharge port 7 Flow path 100 Liquid discharge head

Claims (12)

A step of preparing a substrate on which a plurality of energy generating elements for generating energy for discharging liquid and a plurality of liquid supply ports for supplying liquid to the energy generating elements are arranged;
A laminating step of laminating a flow path forming layer on a surface of the substrate on which the energy generating elements are arranged;
A flow path for guiding the liquid supplied from the liquid supply port to the energy generating element in the flow path forming layer, and a discharge port for discharging the liquid by the energy generated by the energy generating element, Forming process to form;
A method of manufacturing a liquid discharge head having
When the flow path forming layer is viewed from the opening side of the discharge port, the flow path forming layer includes a first region and the liquid supply below the flow path forming layer than the first region. A second region having a small arrangement density of the mouths, and in the forming step, the flow path is formed so that the opening area of the discharge port is larger in the first region than in the second region. A method of manufacturing a liquid discharge head, wherein the discharge port is formed in a layer. The laminating step includes a step of transferring a photosensitive dry film to a surface of the substrate where the energy generating elements are arranged,
The method of manufacturing a liquid discharge head according to claim 1, wherein in the forming step, the flow path and the discharge port are formed by photolithography.   3. The method of manufacturing a liquid discharge head according to claim 1, wherein in the forming step, the flow path is formed so that liquid is supplied from one of the liquid supply ports to one of the energy generating elements. .   The method of manufacturing a liquid ejection head according to claim 1, wherein, in the forming step, the flow path is formed so that liquid is supplied from a plurality of the liquid supply ports to one of the energy generating elements.   In the forming step, the flow path is formed so that the number of the liquid supply ports for supplying the liquid to one of the energy generating elements is increased in a region where the arrangement density of the liquid supply ports is higher in the substrate. Item 3. A method for manufacturing a liquid discharge head according to Item 1 or 2. An energy generating element that generates energy for discharging liquid; a substrate on which liquid supply ports for supplying liquid to the energy generating element are arranged; and
The substrate is stacked on the surface where the energy generating elements are arranged, and the liquid is supplied by the energy generated by the energy generating elements, and the flow path for guiding the liquid supplied from the liquid supply port to the energy generating elements. A liquid discharge head comprising an orifice plate formed with an orifice plate,
When the orifice plate is viewed from the side where the discharge ports open, the orifice plate has a first region and an arrangement density of the liquid supply ports below the orifice plate lower than the first region. And the height of the flow path in the direction perpendicular to the surface of the flow path is higher in the first region than in the second region, and the opening area of the discharge port is the second region. A liquid ejection head characterized in that a region is larger than the first region.   The liquid discharge head according to claim 6, wherein the flow path is formed so that liquid is supplied from one of the liquid supply ports to one of the energy generating elements.   The liquid discharge head according to claim 6, wherein the flow path is formed so that liquid is supplied from a plurality of the liquid supply ports to one of the energy generating elements.   The flow path is formed so that the number of the liquid supply ports for supplying a liquid to one of the energy generating elements increases in a region where the arrangement density of the liquid supply ports is higher in the substrate. The liquid discharge head described.   The energy generation element is a heating resistor, and liquid is discharged from the discharge port along with the growth of bubbles generated by applying a predetermined voltage pulse to the heating resistor. The liquid discharge head according to claim 1.   11. The liquid discharge head according to claim 6, wherein ink containing a color material is discharged as the liquid by applying energy to the energy generation element in accordance with a discharge signal.   12. The liquid ejection head according to claim 6, wherein in the orifice plate, a length of the flow path from the liquid supply port to the energy generation element is 100 μm or less.

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