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JP2018032799A - Light irradiation device - Google Patents

Light irradiation device Download PDF

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JP2018032799A
JP2018032799A JP2016165194A JP2016165194A JP2018032799A JP 2018032799 A JP2018032799 A JP 2018032799A JP 2016165194 A JP2016165194 A JP 2016165194A JP 2016165194 A JP2016165194 A JP 2016165194A JP 2018032799 A JP2018032799 A JP 2018032799A
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substrate
light
light irradiation
axis direction
led elements
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JP6533501B2 (en
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正志 藤野
Masashi Fujino
正志 藤野
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Hoya Candeo Optronics Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a light irradiation device which irradiates an irradiation object relatively moving in one direction, with light in such a manner that integrated light quantity becomes uniform.SOLUTION: The light irradiation device is provided that irradiates an irradiation object relatively moving in a first direction, with linear light extending in a second direction orthogonal to the first direction and having a predetermined line width in the first direction. The light irradiation device comprises a plurality of light irradiation modules each of which includes a substrate disposed substantially in parallel to the first direction and the second direction and a plurality of light sources arranged on the surface of the substrate and outputting light, the light irradiation modules being disposed in a manner to be coupled in the second direction. Each substrate is comprised of: a substrate center portion in which a plurality of light sources are arranged in the first direction and the second direction with first density; and a substrate end portion in which a plurality of light sources are arranged with second density higher than the first density. The substrate end portion of each substrate engages with the substrate end portion of an adjacent substrate to form a substrate adjacent portion. In the substrate adjacent portion, the density of the plurality of light sources is substantially equal to the first density.SELECTED DRAWING: Figure 2

Description

本発明は、一方向に相対的に移動する照射対象物に対して、ライン状の光を照射する光照射装置に関し、特に、複数の光源がライン状に配置された光照射モジュールを複数備えた光照射装置に関する。   The present invention relates to a light irradiation apparatus that irradiates a line-shaped light to an irradiation object that moves relatively in one direction, and in particular, includes a plurality of light irradiation modules in which a plurality of light sources are arranged in a line. The present invention relates to a light irradiation apparatus.

従来、オフセット枚葉印刷用のインキとして、紫外光の照射により硬化する紫外線硬化型インキが用いられている。また、液晶パネルや有機EL(Electro Luminescence)パネル等、FPD(Flat Panel Display)回りの接着剤として、紫外線硬化樹脂が用いられている。このような紫外線硬化型インキや紫外線硬化樹脂の硬化には、一般に、紫外光を照射する紫外光照射装置が用いられるが、特にオフセット枚葉印刷やFPDの用途においては、幅広の照射領域を照射する必要があるため、ライン状の照射光を照射する紫外光照射装置が用いられる。   Conventionally, as an ink for offset sheet-fed printing, an ultraviolet curable ink that is cured by irradiation with ultraviolet light has been used. Further, an ultraviolet curable resin is used as an adhesive around an FPD (Flat Panel Display) such as a liquid crystal panel or an organic EL (Electro Luminescence) panel. For curing such UV-curable inks and UV-curable resins, generally, an ultraviolet light irradiation device that irradiates ultraviolet light is used. However, particularly in offset sheet-fed printing and FPD applications, a wide irradiation region is irradiated. Therefore, an ultraviolet light irradiation apparatus that irradiates linear irradiation light is used.

紫外光照射装置としては、従来から高圧水銀ランプや水銀キセノンランプ等を光源とするランプ型照射装置が知られているが、近年、消費電力の削減、長寿命化、装置サイズのコンパクト化の要請から、従来の放電ランプに替えて、LEDを光源として利用した紫外光照射装置が開発されている。   As an ultraviolet light irradiation device, a lamp type irradiation device using a high-pressure mercury lamp, a mercury xenon lamp, or the like as a light source has been conventionally known, but in recent years, there has been a demand for reduction in power consumption, longer life, and downsizing of the device size. Therefore, in place of the conventional discharge lamp, an ultraviolet light irradiation apparatus using an LED as a light source has been developed.

このようなLEDを光源として利用した紫外光照射装置は、例えば、特許文献1に記載されている。特許文献1に記載の紫外光照射装置は、複数の発光素子(LED)が搭載された光照射デバイス等を有する光照射モジュールを複数備えている。複数の光照射モジュールは、放熱用部材上に一列に並べて配置されており、複数の光照射モジュールに対向して配置された照射対象物の所定領域に対してライン状の紫外光が照射されるようになっている。   An ultraviolet light irradiation apparatus using such an LED as a light source is described in Patent Document 1, for example. The ultraviolet light irradiation apparatus described in Patent Document 1 includes a plurality of light irradiation modules including a light irradiation device on which a plurality of light emitting elements (LEDs) are mounted. The plurality of light irradiation modules are arranged in a line on the heat radiating member, and linear ultraviolet light is irradiated to a predetermined region of the irradiation object arranged to face the plurality of light irradiation modules. It is like that.

特開2015−153771号公報Japanese Patent Laid-Open No. 2015-153771

特許文献1の構成のように、複数の光照射モジュールを連結してライン状の(つまり、長尺の)光照射装置を構成すると、各光照射モジュールの基板サイズを小さく抑えることができる。このため、基板の反りの発生を抑制することができ、放熱用部材からの基板の浮きを抑制できるため、LEDの熱を放熱用部材に効率よく伝達することができる。また、特許文献1の構成においては、使用する光照射モジュールの数を変更することによって照射幅を容易に変更することができるため、照射対象物の幅に応じて(つまり、仕様に応じて)使用する光照射モジュールの数を決定すればよく、様々なサイズの照射対象物に対応することができる点で有効である。   When a plurality of light irradiation modules are connected as in the configuration of Patent Document 1 to form a linear (that is, long) light irradiation device, the substrate size of each light irradiation module can be kept small. For this reason, since generation | occurrence | production of the curvature of a board | substrate can be suppressed and the floating of the board | substrate from the heat radiating member can be suppressed, the heat | fever of LED can be efficiently transmitted to the heat radiating member. Moreover, in the structure of patent document 1, since the irradiation width can be easily changed by changing the number of the light irradiation modules to be used, according to the width of the irradiation object (that is, according to the specification). What is necessary is just to determine the number of the light irradiation modules to be used, which is effective in that it can deal with irradiation objects of various sizes.

しかしながら、特許文献1の構成のように、複数の光照射モジュールを連結すると、隣接する光照射モジュールとの連結部(つまり、継ぎ目部分)において、LEDの配置が連続しない(つまり、LEDの間隔が広くなってしまう)といった問題がある。特に、オフセット枚葉印刷の用途等、照射対象物が光照射装置に対して相対的に移動する場合には、照射対象物上において所定の積算光量が必要とされるところ、隣接する光照射モジュールとの連結部(つまり、継ぎ目部分)において、LEDの間隔が広くなってしまうと、この部分の積算光量が他の部分の積算光量と比較して低くなってしまうため(つまり、積算光量が均一にならないため)、インキを均一に硬化できない(つまり、硬化むらが発生する)といった問題がある。   However, when a plurality of light irradiation modules are connected as in the configuration of Patent Document 1, the arrangement of LEDs is not continuous in a connection portion (that is, a joint portion) between adjacent light irradiation modules (that is, the interval between the LEDs is small). There is a problem of becoming wide). In particular, when the irradiation object moves relative to the light irradiation device, such as for use in offset sheet printing, a predetermined integrated light quantity is required on the irradiation object, and the adjacent light irradiation module When the LED interval becomes wide at the connecting portion (that is, the joint portion), the integrated light amount of this part becomes lower than the integrated light amount of other portions (that is, the integrated light amount is uniform). Therefore, there is a problem that the ink cannot be uniformly cured (that is, uneven curing occurs).

本発明は、このような事情に鑑みてなされたものであり、その目的とするところは、複数の光照射モジュールを連結する構成を採りつつも、一方向に相対的に移動する照射対象物に対して、積算光量が均一となるように光を照射する光照射装置を提供することである。   This invention is made | formed in view of such a situation, The place made into the objective is the irradiation object which moves relatively in one direction, taking the structure which connects a some light irradiation module. On the other hand, it is to provide a light irradiation apparatus that irradiates light so that the integrated light quantity becomes uniform.

上記目的を達成するため、本発明の光照射装置は、第1方向に相対的に移動する照射対象物上に、第1方向と直交する第2方向に延び、かつ、第1方向に所定の線幅を有するライン状の光を照射する光照射装置であって、第1方向及び第2方向に略平行な基板と、基板の表面に配置され、光を出射する複数の光源と、をそれぞれ有し、第2方向に連結するように配置された複数の光照射モジュールを備え、各基板は、複数の光源が第1方向及び第2方向に第1の密度で配列される基板中央部と、複数の光源が第1の密度よりも高い第2の密度で配列される基板端部と、からなり、各基板の基板端部は、隣接する基板の基板端部と係合して、基板隣接部を形成し、基板隣接部において、複数の光源の密度が、第1の密度と略等しいことを特徴とする。   In order to achieve the above object, a light irradiation apparatus of the present invention extends on an irradiation object relatively moving in a first direction, extends in a second direction orthogonal to the first direction, and is predetermined in the first direction. A light irradiation device for irradiating line-shaped light having a line width, and a substrate substantially parallel to the first direction and the second direction, and a plurality of light sources arranged on the surface of the substrate and emitting light, respectively. A plurality of light irradiation modules arranged to be connected in the second direction, and each substrate includes a central portion of the substrate in which the plurality of light sources are arranged at the first density in the first direction and the second direction. A plurality of light sources arranged at a second density higher than the first density, and the substrate end of each substrate is engaged with a substrate end of an adjacent substrate to form a substrate An adjacent portion is formed, and the density of the plurality of light sources is substantially equal to the first density in the adjacent portion of the substrate. That.

このような構成によれば、複数の光照射モジュールを連結する構成を採りつつも、基板中央部と基板隣接部において、光源の密度を略等しくなるため、照射対象物上において、積算光量が均一となる。   According to such a configuration, while adopting a configuration in which a plurality of light irradiation modules are connected, the density of the light sources is substantially equal at the central portion of the substrate and the adjacent portion of the substrate, so that the integrated light amount is uniform on the irradiation object. It becomes.

また、基板中央部において、複数の光源は、第1方向に沿って第1の間隔をおいてM個(Mは2以上の整数)並び、第2方向に沿って第2の間隔をおいてN個(Nは4以上の整数)並び、基板隣接部において、複数の光源は、第2方向に沿って前記第2の間隔よりも狭い第3の間隔をおいて並ぶように構成することができる。また、この場合、基板隣接部において、複数の光源は、第1方向に沿って第1の間隔をおいて並ぶことが望ましい。   Further, in the central portion of the substrate, the plurality of light sources are arranged with M (M is an integer of 2 or more) at a first interval along the first direction, and at a second interval along the second direction. N (N is an integer of 4 or more) are arranged, and in the substrate adjacent portion, the plurality of light sources may be configured to be arranged at a third interval narrower than the second interval along the second direction. it can. In this case, it is desirable that the plurality of light sources are arranged at a first interval along the first direction in the substrate adjacent portion.

また、基板隣接部において、複数の光源は、第1方向に沿って第1の間隔よりも狭い第4の間隔をおいて並ぶことが望ましい。   Further, in the substrate adjacent portion, it is desirable that the plurality of light sources are arranged at a fourth interval that is narrower than the first interval along the first direction.

また、各基板の基板端部と隣接する基板の基板端部が、相互に補完する形状を有することが望ましい。   Further, it is desirable that the substrate end portion of each substrate and the substrate end portion of the substrate adjacent to each other have shapes complementary to each other.

また、各基板の基板端部と隣接する基板の基板端部との間に、光源が配置されない接合部を有し、各基板の基板端部が接合部を介して隣接する基板の基板端部と係合するように構成することが望ましい。   Moreover, it has the junction part which a light source is not arrange | positioned between the board | substrate edge part of each board | substrate, and the board | substrate edge part of an adjacent board | substrate, and the board | substrate edge part of the board | substrate which the board | substrate edge part of each board | substrate adjoins via a junction part Is preferably configured to engage.

また、接合部が、第1方向に対して傾斜するように構成することができる。また、この場合、各基板の形状が平行四辺形であることが望ましい。   Moreover, it can comprise so that a junction part may incline with respect to a 1st direction. In this case, the shape of each substrate is preferably a parallelogram.

また、接合部が、階段状に形成されることが望ましい。   In addition, it is desirable that the joint is formed in a stepped shape.

また、接合部が、くの字状に形成されることが望ましい。   In addition, it is desirable that the joint portion is formed in a dogleg shape.

以上のように、本発明によれば、一方向に移動する立体の照射対象物に対して、積算光量が均一となるように光を照射する光照射装置が実現される。   As described above, according to the present invention, a light irradiation apparatus that irradiates light to a three-dimensional irradiation object moving in one direction so that the integrated light amount is uniform is realized.

本発明の第1の実施形態に係る光照射装置の概略構成を説明する外観図である。It is an external view explaining the schematic structure of the light irradiation apparatus which concerns on the 1st Embodiment of this invention. 本発明の第1の実施形態に係る光照射装置に備わるLEDモジュールの構成を説明する図である。It is a figure explaining the structure of the LED module with which the light irradiation apparatus which concerns on the 1st Embodiment of this invention is equipped. 本発明の第1の実施形態に係る光照射装置を用いて、照射対象物上に紫外光を照射したときの積算光量を示すグラフである。It is a graph which shows the integrated light quantity when using the light irradiation apparatus which concerns on the 1st Embodiment of this invention, and irradiated an ultraviolet light on the irradiation target object. 本発明の第1の実施形態に係る光照射装置の比較例の構成を説明する図である。It is a figure explaining the structure of the comparative example of the light irradiation apparatus which concerns on the 1st Embodiment of this invention. 図4の比較例の構成を用いて、照射対象物上に紫外光を照射したときの積算光量を示すグラフである。It is a graph which shows the integrated light quantity when irradiating an ultraviolet-ray on an irradiation target object using the structure of the comparative example of FIG. 本発明の第1の実施形態に係る光照射装置の比較例の構成を説明する図である。It is a figure explaining the structure of the comparative example of the light irradiation apparatus which concerns on the 1st Embodiment of this invention. 図6の比較例の構成を用いて、照射対象物上に紫外光を照射したときの積算光量を示すグラフである。It is a graph which shows the integrated light quantity when irradiating an ultraviolet-ray on an irradiation target object using the structure of the comparative example of FIG. 本発明の第2の実施形態に係る光照射装置の構成を説明する図である。It is a figure explaining the structure of the light irradiation apparatus which concerns on the 2nd Embodiment of this invention. 本発明の第2の実施形態に係る光照射装置を用いて、照射対象物上に紫外光を照射したときの積算光量を示すグラフである。It is a graph which shows the integrated light quantity when irradiating an ultraviolet-ray on an irradiation target object using the light irradiation apparatus which concerns on the 2nd Embodiment of this invention. 本発明の第3の実施形態に係る光照射装置の構成を説明する図である。It is a figure explaining the structure of the light irradiation apparatus which concerns on the 3rd Embodiment of this invention. 本発明の第3の実施形態に係る光照射装置を用いて、照射対象物上に紫外光を照射したときの積算光量を示すグラフである。It is a graph which shows the integrated light quantity when irradiating an ultraviolet-ray on an irradiation target object using the light irradiation apparatus which concerns on the 3rd Embodiment of this invention. 本発明の第4の実施形態に係る光照射装置の構成を説明する図である。It is a figure explaining the structure of the light irradiation apparatus which concerns on the 4th Embodiment of this invention. 本発明の第4の実施形態に係る光照射装置を用いて、照射対象物上に紫外光を照射したときの積算光量を示すグラフである。It is a graph which shows the integrated light quantity when ultraviolet light is irradiated on the irradiation target object using the light irradiation apparatus which concerns on the 4th Embodiment of this invention.

以下、本発明の実施の形態について図面を参照して詳細に説明する。なお、図中同一又は相当部分には同一の符号を付してその説明は繰り返さない。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent part in a figure, and the description is not repeated.

(第1の実施形態)
図1は、本発明の実施形態に係る光照射装置10の概略構成を説明する外観図である。本実施形態の光照射装置10は、オフセット枚葉印刷用のインキとして用いられる紫外線硬化型インキを硬化させる光源装置に搭載される装置であり、照射対象物に対向して配置され、相対的に移動する照射対象物に対してライン状の紫外光を出射する。本明細書においては、光照射装置10から出射されるライン状の紫外光の長手(線長)方向をX軸方向(第2方向)、短手(線幅)方向(すなわち、照射対象物の移動方向)をY軸方向(第1方向)、X軸及びY軸と直交する方向(すなわち、鉛直方向)をZ軸方向と定義して説明する。なお、図1(a)は、本実施形態の光照射装置10の正面図(Z軸方向から見た図)であり、図1(b)は、底面図(Y軸方向から見た図)であり、図1(c)は、右側面図(X軸方向から見た図)である。
(First embodiment)
FIG. 1 is an external view illustrating a schematic configuration of a light irradiation apparatus 10 according to an embodiment of the present invention. The light irradiation device 10 of the present embodiment is a device mounted on a light source device that cures ultraviolet curable ink used as ink for offset sheet-fed printing, and is disposed to face an irradiation object, and is relatively A linear ultraviolet light is emitted to the moving irradiation object. In the present specification, the longitudinal (line length) direction of the line-shaped ultraviolet light emitted from the light irradiation device 10 is the X-axis direction (second direction), and the short (line width) direction (that is, the irradiation target object). In the following description, the movement direction is defined as the Y-axis direction (first direction), and the direction orthogonal to the X-axis and the Y-axis (that is, the vertical direction) is defined as the Z-axis direction. 1A is a front view (viewed from the Z-axis direction) of the light irradiation apparatus 10 of the present embodiment, and FIG. 1B is a bottom view (viewed from the Y-axis direction). FIG. 1C is a right side view (viewed from the X-axis direction).

図1に示すように、本実施形態の光照射装置10は、不図示のケース内に、ベースプレート100と、2個のLEDモジュール210、220(光照射モジュール)を有している。   As shown in FIG. 1, the light irradiation apparatus 10 of this embodiment has the baseplate 100 and the two LED modules 210 and 220 (light irradiation module) in the case not shown.

ベースプレート100は、LEDモジュール210、220を固定する金属(例えば、アルミニウムや銅等)の矩形板状の部材である。図1に示すように、本実施形態のベースプレート100の表面には、2個のLEDモジュール210、220が載置され、不図示のネジによって固定されている。なお、本実施形態のベースプレート100は、各LEDモジュール210、220からの熱を空気中に放熱するヒートシンクの機能も有している。   The base plate 100 is a rectangular plate-shaped member made of metal (for example, aluminum or copper) that fixes the LED modules 210 and 220. As shown in FIG. 1, two LED modules 210 and 220 are placed on the surface of the base plate 100 of the present embodiment, and are fixed by screws (not shown). Note that the base plate 100 of the present embodiment also has a function of a heat sink that dissipates heat from the LED modules 210 and 220 into the air.

LEDモジュール210、220は、紫外光を出射する部材であり、平面視で略平行四辺形の平板状の基板202と、基板202上に配置された複数のLED素子205と、を備えている。図1に示すように、本実施形態のLEDモジュール210、220は、各基板202がX軸方向に連結して配置されるが、従来技術において述べたように、連結部(つまり、継ぎ目部分)において、各LED素子205の間隔が部分的に広くなってしまうと、積算光量が均一にならなくなってしまうという問題がある。そこで、かかる問題を解決するため、本実施形態においては、各基板202の形状を略平行四辺形とし、各基板202の斜辺と隣接する基板202の斜辺とが係合するように配置されると共に、この係合部(つまり、各基板202のX軸方向の端部(図2に示す「基板端部Q」))において、LED素子205の配置密度を高くしている。   The LED modules 210 and 220 are members that emit ultraviolet light, and include a substantially parallelogram-shaped flat substrate 202 in a plan view and a plurality of LED elements 205 arranged on the substrate 202. As shown in FIG. 1, the LED modules 210 and 220 of this embodiment are arranged with the substrates 202 connected in the X-axis direction. However, as described in the prior art, the connecting portion (that is, the joint portion). However, if the interval between the LED elements 205 is partially widened, there is a problem that the integrated light quantity does not become uniform. Therefore, in order to solve such a problem, in the present embodiment, the shape of each substrate 202 is a substantially parallelogram, and the oblique sides of each substrate 202 and the oblique sides of the adjacent substrate 202 are engaged with each other. The arrangement density of the LED elements 205 is increased at the engaging portion (that is, the end portion of each substrate 202 in the X-axis direction (“substrate end portion Q” shown in FIG. 2)).

基板202は、熱伝導率の高い材料(例えば、窒化アルミニウム)で形成された配線基板であり、その表面には、20個(X軸方向)×10列(Y軸方向)の態様で、200個のLED素子205がCOB(Chip On Board)実装されている。基板202上には、各LED素子205に電力を供給するためのアノードパターン(不図示)及びカソードパターン(不図示)が形成されており、各LED素子205は、アノードパターン及びカソードパターンにそれぞれ電気的に接続されている。また、基板202は、不図示の配線ケーブルによって不図示のドライバ回路と電気的に接続されており、各LED素子205には、アノードパターン及びカソードパターンを介して、ドライバ回路から駆動電流が供給されるようになっている。そして、各LED素子205に駆動電流が供給されると、各LED素子205からは駆動電流に応じた光量の紫外光(例えば、波長365nm、385nm、405nm)が出射される。なお、本実施形態の各LED素子205は、略等しい光量の紫外光を出射するように各LED素子205に供給される駆動電流が調整されている。   The substrate 202 is a wiring substrate formed of a material having high thermal conductivity (for example, aluminum nitride). The surface of the substrate 202 is 20 pieces (in the X-axis direction) × 10 rows (in the Y-axis direction). The LED elements 205 are mounted on a COB (Chip On Board). An anode pattern (not shown) and a cathode pattern (not shown) for supplying power to each LED element 205 are formed on the substrate 202, and each LED element 205 is electrically connected to the anode pattern and the cathode pattern, respectively. Connected. The substrate 202 is electrically connected to a driver circuit (not shown) via a wiring cable (not shown), and a driving current is supplied to each LED element 205 from the driver circuit via an anode pattern and a cathode pattern. It has become so. When a driving current is supplied to each LED element 205, each LED element 205 emits ultraviolet light (for example, wavelengths 365 nm, 385 nm, and 405 nm) with a light amount corresponding to the driving current. In addition, the drive current supplied to each LED element 205 is adjusted so that each LED element 205 of this embodiment radiates | emits the ultraviolet light of a substantially equal light quantity.

図2は、本実施形態のLEDモジュール210、220の各LED素子205の配置を説明する図である。なお、図2において、(1)〜(10)は、各LED素子205の列番号を示している。   FIG. 2 is a diagram illustrating the arrangement of the LED elements 205 of the LED modules 210 and 220 according to the present embodiment. In FIG. 2, (1) to (10) indicate the column numbers of the LED elements 205.

図2に示すように、本実施形態のLEDモジュール210、220は、平行四辺形の基板202の底辺がX軸方向と平行となる向きで、X軸方向に沿って並べられ、LEDモジュール210の基板202の一方斜辺(図2において右側の斜辺)がLEDモジュール220の基板202の他方斜辺(図2において左側の斜辺)と当接する(係合する)ように配置されて固定されている。そして、LEDモジュール210、220の各列(1)〜(10)のLED素子205が、継ぎ目部J(接合部)を挟んで、X軸方向に連続するように配置されている。なお、継ぎ目部Jにおいては、物理的にLED素子205を配置することができないため、LED素子205の間隔が部分的に広くなっている。また、本実施形態においては、各列(1)〜(10)の間隔(つまり、Y軸方向の間隔)は略3mmに設定されている。   As shown in FIG. 2, the LED modules 210 and 220 of the present embodiment are arranged along the X-axis direction with the base of the parallelogram substrate 202 being parallel to the X-axis direction. One oblique side of the substrate 202 (right oblique side in FIG. 2) is disposed and fixed so as to contact (engage) the other oblique side (left oblique side in FIG. 2) of the substrate 202 of the LED module 220. And LED element 205 of each row | line | column (1)-(10) of LED module 210,220 is arrange | positioned so that the X-axis direction may be continued on both sides of the joint part J (joining part). In addition, in the joint part J, since the LED element 205 cannot be physically disposed, the interval between the LED elements 205 is partially widened. In the present embodiment, the interval between the columns (1) to (10) (that is, the interval in the Y-axis direction) is set to approximately 3 mm.

また、基板202の形状公差及びパターン配線上の制約から、基板202の端から所定距離(例えば、1mm)以内にLED素子205を配置することができないため、本実施形態においては、2列毎にLED素子205の配置をX軸方向にシフトしている。より具体的には、図2に示すように、列(1)、(2)のLED素子205は、X軸方向において同じ位置に配置され、また、列(3)、(4)のLED素子205はX軸方向において同じ位置に配置され、列(1)、(2)のLED素子205に対してX軸方向にシフトしている。また、列(5)、(6)のLED素子205は、X軸方向において同じ位置に配置され、列(3)、(4)のLED素子205に対してX軸方向にシフトしている。また、列(7)、(8)のLED素子205は、X軸方向において同じ位置に配置され、列(5)、(6)のLED素子205に対してX軸方向にシフトしている。また、列(9)、(10)のLED素子205は、X軸方向において同じ位置に配置され、列(7)、(8)のLED素子205に対してX軸方向にシフトしている。そして、本実施形態の各LED素子205は、Y軸方向においても整列しており、Y軸方向に10個のLED素子205が並ぶ領域(基板中央部P)のLED素子205(図2において、白色の□(白抜き四角)で示すLED素子205)は、X軸方向に略3mmの間隔で配置されており、Y軸方向に10個よりも少ないLED素子205が並ぶ領域(基板端部Q)のLED素子205(図2において、黒色の■(黒塗り四角)で示すLED素子205)は、X軸方向に略2.5mmの間隔で配置されている。つまり、基板端部QにおけるLED素子205のX軸方向の配置密度が、基板中央部PにおけるLED素子205のX軸方向の配置密度よりも高くなるように構成している。そして、2つのLEDモジュール210、220の基板端部Qが継ぎ目部Jを挟んで隣接している領域(つまり、図2の基板隣接部R)における、LED素子205の配置密度は、60個(基板隣接部RのLED素子205の数)/15mm(基板隣接部Rの幅)となり、各LEDモジュール210、220の基板中央部Pにおける、LED素子205の配置密度(基板中央部Pにおける15mmあたりのLED素子205の数:60個)と略等しくなるように設定されている。そして、このような構成によって、図2に示すように、基板隣接部RにおけるLED素子205の配置がX軸方向及びY軸方向に等間隔とならない部分ができたとしても、相対的に移動する照射対象物上において、略均一な積算光量が得られるようになっている。   Further, because of the shape tolerance of the substrate 202 and restrictions on the pattern wiring, the LED elements 205 cannot be arranged within a predetermined distance (for example, 1 mm) from the end of the substrate 202. The arrangement of the LED elements 205 is shifted in the X-axis direction. More specifically, as shown in FIG. 2, the LED elements 205 in the columns (1) and (2) are arranged at the same position in the X-axis direction, and the LED elements in the columns (3) and (4). 205 is arranged at the same position in the X-axis direction and is shifted in the X-axis direction with respect to the LED elements 205 in the columns (1) and (2). The LED elements 205 in the rows (5) and (6) are arranged at the same position in the X-axis direction, and are shifted in the X-axis direction with respect to the LED elements 205 in the rows (3) and (4). The LED elements 205 in the rows (7) and (8) are arranged at the same position in the X-axis direction, and are shifted in the X-axis direction with respect to the LED elements 205 in the rows (5) and (6). The LED elements 205 in the rows (9) and (10) are arranged at the same position in the X-axis direction, and are shifted in the X-axis direction with respect to the LED elements 205 in the rows (7) and (8). The LED elements 205 of the present embodiment are also aligned in the Y-axis direction, and the LED elements 205 (in FIG. 2, in the region where the 10 LED elements 205 are arranged in the Y-axis direction (substrate central portion P)). LED elements 205 indicated by white squares (outlined squares) are arranged at an interval of about 3 mm in the X-axis direction, and are regions in which fewer than ten LED elements 205 are arranged in the Y-axis direction (substrate end portion Q). ) LED elements 205 (LED elements 205 indicated by black squares (solid squares in FIG. 2)) are arranged at an interval of approximately 2.5 mm in the X-axis direction. That is, the arrangement density of the LED elements 205 in the X-axis direction at the substrate end Q is configured to be higher than the arrangement density of the LED elements 205 in the X-axis direction at the substrate center P. The arrangement density of the LED elements 205 in the region where the substrate end portions Q of the two LED modules 210 and 220 are adjacent to each other with the joint portion J interposed therebetween (that is, the substrate adjacent portion R in FIG. 2) is 60 ( The number of LED elements 205 in the substrate adjacent portion R) / 15 mm (width of the substrate adjacent portion R), and the arrangement density of the LED elements 205 in the substrate central portion P of each LED module 210, 220 (per 15 mm in the substrate central portion P) The number of LED elements 205 is 60). With such a configuration, as shown in FIG. 2, even if the LED elements 205 in the substrate adjacent portion R are not evenly spaced in the X-axis direction and the Y-axis direction, they move relatively. A substantially uniform integrated light quantity can be obtained on the irradiation object.

図3は、本実施形態の光照射装置10を用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射したときの積算光量を示すグラフである。図3の「WD5」及び「WD10」は、照射対象物のワークディスタンス(つまり、走行位置)を示し、「WD5」は、光照射装置10から5mm離れた位置を走行する照射対象物上の積算光量を示し、「WD10」は、光照射装置10から10mm離れた位置を走行する照射対象物上の積算光量を示している。なお、図3の縦軸は、積算光量(W/cm)を示し、図3の横軸は、光照射装置10の長手方向中央を0mmとして、光照射装置10の長手方向(つまり、X軸方向)に対応する位置を示している。なお、光照射装置10のX軸方向の有効照射エリアは、±40mm(つまり、80mm)である。   FIG. 3 is a graph showing an integrated light amount when the light irradiation apparatus 10 of the present embodiment is used to irradiate ultraviolet light onto an irradiation object that moves at a constant speed in the Y-axis direction. “WD5” and “WD10” in FIG. 3 indicate the work distance (that is, the travel position) of the irradiation object, and “WD5” is an integrated value on the irradiation object that travels 5 mm away from the light irradiation device 10. “WD10” indicates the integrated light amount on the irradiation object traveling at a position 10 mm away from the light irradiation device 10. The vertical axis in FIG. 3 indicates the integrated light quantity (W / cm), and the horizontal axis in FIG. 3 indicates the longitudinal direction of the light irradiation apparatus 10 (that is, the X axis) with the center in the longitudinal direction of the light irradiation apparatus 10 being 0 mm. The position corresponding to (direction) is shown. The effective irradiation area in the X-axis direction of the light irradiation device 10 is ± 40 mm (that is, 80 mm).

図3に示すように、本実施形態の光照射装置10によれば、「WD5」の位置の照射対象物上において均一度:1.9%の積算光量が得られ、「WD10」の位置の照射対象物上において均一度:4.1%の積算光量が得られる。なお、本明細書において、均一度とは、有効照射エリア内の積算光量の最大値を「MAX」とし、最小値を「MIN」としたときに、(MAX−MIN)/(MAX+MIN)×100で示される値であり、本実施形態においては、均一度(つまり、有効照射エリア内の積算光量分布のムラ)が6%未満であるときに、略均一な積算光量であると評価している。   As shown in FIG. 3, according to the light irradiation apparatus 10 of the present embodiment, an integrated light amount of 1.9% is obtained on the irradiation object at the position “WD5”, and the position at the position “WD10” is obtained. An integrated light quantity of 4.1% is obtained on the irradiation object. In the present specification, the uniformity refers to (MAX−MIN) / (MAX + MIN) × 100 when the maximum value of the integrated light quantity in the effective irradiation area is “MAX” and the minimum value is “MIN”. In this embodiment, when the degree of uniformity (that is, unevenness of the integrated light amount distribution in the effective irradiation area) is less than 6%, it is evaluated that the light amount is substantially uniform. .

ここで、本実施形態の効果を説明するために、いくつかの比較例を示す。図4は、第1の比較例の光照射装置10Xが有するLEDモジュール210X、220Xの構成を説明する図である。また、図5は、光照射装置10Xを用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射したときの積算光量を示すグラフである。   Here, in order to explain the effect of this embodiment, some comparative examples will be shown. FIG. 4 is a diagram illustrating the configuration of LED modules 210X and 220X included in the light irradiation apparatus 10X of the first comparative example. FIG. 5 is a graph showing the integrated light quantity when the light irradiation apparatus 10X is used to irradiate ultraviolet light onto an irradiation target that moves at a constant speed in the Y-axis direction.

図4に示すように、LEDモジュール210X、220Xにおいては、矩形状の基板202X上に、20個(X軸方向)×10列(Y軸方向)の態様で、200個のLED素子205が正方格子状(3mm×3mm)にCOB(Chip On Board)実装されている。つまり、LEDモジュール210X、220Xは、基板202Xの形状が異なると共に、LED素子205の配置密度が高い基板端部Qを備えていない点で本実施形態のLEDモジュール210、220と異なっている。そして、このような構成を採ると、連結部(つまり、継ぎ目部J)において、各LED素子205の間隔が広くなってしまうため、図5に示すように、光照射装置10Xの長手方向略中央において積算光量が落ち込み、均一にはならないことが分かる。なお、図5において、「WD5」の位置の照射対象物上の均一度は、10.3%であり、「WD10」の位置の照射対象物上の均一度は、7.1%であった。   As shown in FIG. 4, in the LED modules 210X and 220X, 200 LED elements 205 are square on a rectangular substrate 202X in the form of 20 (X-axis direction) × 10 columns (Y-axis direction). COB (Chip On Board) is mounted in a grid (3 mm × 3 mm). That is, the LED modules 210X and 220X are different from the LED modules 210 and 220 of the present embodiment in that the shape of the substrate 202X is different and the substrate end Q where the arrangement density of the LED elements 205 is not provided. And if such a structure is taken, since the space | interval of each LED element 205 will become wide in a connection part (namely, joint part J), as shown in FIG. 5, the longitudinal direction approximate center of the light irradiation apparatus 10X It can be seen that the integrated light quantity drops and does not become uniform. In FIG. 5, the uniformity on the irradiation target at the position “WD5” was 10.3%, and the uniformity on the irradiation target at the position “WD10” was 7.1%. .

図6は、第2の比較例の光照射装置10Yが有するLEDモジュール210Y、220Yの構成を説明する図である。また、図7は、光照射装置10Yを用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射したときの積算光量を示すグラフである。   FIG. 6 is a diagram illustrating the configuration of LED modules 210Y and 220Y included in the light irradiation apparatus 10Y of the second comparative example. Further, FIG. 7 is a graph showing the integrated light amount when the light irradiation apparatus 10Y is used to irradiate ultraviolet light onto an irradiation object that moves at a constant speed in the Y-axis direction.

図6に示すように、LEDモジュール210Y、220Yにおいては、平面視で略平行四辺形の平板状の基板202Y上に、20個(X軸方向)×10列(Y軸方向)の態様で、200個のLED素子205が等間隔(X軸方向:3mm、Y軸方向:3mm)にCOB(Chip On Board)実装されている。つまり、LEDモジュール210Y、220Yは、LED素子205の配置密度が高い基板端部Qを備えていない点で本実施形態のLEDモジュール210、220と異なっている。そして、このような構成を採ると、連結部(つまり、継ぎ目部J)周辺において、LED素子205の配置密度が低くなってしまうため、図7に示すように、光照射装置10Yの長手方向略中央において積算光量が落ち込み、均一にはならないことが分かる。なお、図7において、「WD5」の位置の照射対象物上の均一度は、9.0%であり、「WD10」の位置の照射対象物上の均一度は、6.2%であった。   As shown in FIG. 6, in the LED modules 210Y and 220Y, 20 (X-axis direction) × 10 rows (Y-axis direction) on a substantially parallelogram-shaped flat plate substrate 202Y in plan view, 200 LED elements 205 are mounted on a COB (Chip On Board) at equal intervals (X-axis direction: 3 mm, Y-axis direction: 3 mm). That is, the LED modules 210Y and 220Y are different from the LED modules 210 and 220 of the present embodiment in that they do not include the substrate end Q where the arrangement density of the LED elements 205 is high. When such a configuration is adopted, the arrangement density of the LED elements 205 is reduced around the connecting portion (that is, the joint portion J). Therefore, as shown in FIG. It can be seen that the integrated light quantity falls in the center and does not become uniform. In FIG. 7, the uniformity on the irradiation object at the position “WD5” was 9.0%, and the uniformity on the irradiation object at the position “WD10” was 6.2%. .

以上説明したように、本実施形態の構成においては、LEDモジュール210、220の各基板202の形状を略平行四辺形とし、各基板202の斜辺と隣接する基板202の斜辺とが係合するように配置されると共に、各基板202の基板端部QにおけるLED素子205のX軸方向の配置密度を基板中央部PにおけるLED素子205のX軸方向の配置密度よりも高くなるように構成している。そして、2つのLEDモジュール210、220がX軸方向に連結されたときに、各基板202の基板端部Qが継ぎ目部Jを挟んで隣接している領域(つまり、図2の基板隣接部R)における、LED素子205の配置密度が、各基板202の基板中央部Pにおける、LED素子205の配置密度と略等しくなるように構成されている。このため、本実施形態の光照射装置10を用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射すると、照射対象物上において、略均一な積算光量が得られる。   As described above, in the configuration of the present embodiment, the shape of each substrate 202 of the LED modules 210 and 220 is a substantially parallelogram, and the oblique sides of each substrate 202 and the oblique sides of the adjacent substrate 202 are engaged. And the arrangement density in the X-axis direction of the LED elements 205 at the substrate end Q of each substrate 202 is configured to be higher than the arrangement density in the X-axis direction of the LED elements 205 at the substrate center P. Yes. Then, when the two LED modules 210 and 220 are connected in the X-axis direction, the substrate end portion Q of each substrate 202 is adjacent to the joint portion J (that is, the substrate adjacent portion R in FIG. 2). The arrangement density of the LED elements 205 is substantially equal to the arrangement density of the LED elements 205 in the substrate central portion P of each substrate 202. For this reason, when the light irradiation apparatus 10 of this embodiment is used to irradiate ultraviolet light onto an irradiation object that moves at a constant speed in the Y-axis direction, a substantially uniform integrated light quantity can be obtained on the irradiation object. .

以上が本実施形態の説明であるが、本発明は、上記の構成に限定されるものではなく、本発明の技術的思想の範囲内において様々な変形が可能である。   The above is the description of the present embodiment, but the present invention is not limited to the above configuration, and various modifications can be made within the scope of the technical idea of the present invention.

例えば、本実施形態の基板202は、平面視で略平行四辺形の形状を呈するものとして説明したが、このような構成に限定されるものではなく、2つの基板202をX軸方向に沿って繋ぎ合わせたときに、2つの基板202が係合し、各基板202の基板端部Qが継ぎ目部Jを挟んでX軸方向及びY軸方向に連続するような形状であればよい。   For example, although the board | substrate 202 of this embodiment was demonstrated as what exhibits a substantially parallelogram shape by planar view, it is not limited to such a structure, Two board | substrates 202 are followed along an X-axis direction. Any shape may be used as long as the two substrates 202 are engaged with each other and the substrate ends Q of the substrates 202 are continuous in the X-axis direction and the Y-axis direction with the joint portion J interposed therebetween.

また、本実施形態においては、2つのLEDモジュール210、220がX軸方向に連結されるものとして説明したが、かかる構成に限定されるものではなく、さらに多くのLEDモジュールがX軸方向に連結されてもよい。   In the present embodiment, the two LED modules 210 and 220 are described as being connected in the X-axis direction. However, the present invention is not limited to this configuration, and more LED modules are connected in the X-axis direction. May be.

(第2の実施形態)
図8は、本発明の第2の実施形態に係る光照射装置10Aの構成を示す図である。なお、説明の便宜のため、図8においては、LEDモジュール210A、220Aのみを示し、その他の構成は省略している。
(Second Embodiment)
FIG. 8 is a diagram showing a configuration of a light irradiation apparatus 10A according to the second embodiment of the present invention. For convenience of explanation, only the LED modules 210A and 220A are shown in FIG. 8, and other configurations are omitted.

図8に示すように、本実施形態の光照射装置10Aは、LEDモジュール210A、220Aの各基板202Aが、くの字状に突出する凸部202Aaと、凸部202Aaを補完するように、くの字状に窪む凹部202Abを有する点で第1の実施形態の光照射装置10と異なり、LEDモジュール210Aの基板202Aの凸部202AaがLEDモジュール220Aの基板202Aの凹部202Abと係合するように配置されて固定されている。そして、LEDモジュール210A、220Aの各列(1)〜(10)のLED素子205が、継ぎ目部Jを挟んで(つまり、LED素子205の間隔が部分的に広くなって)、X軸方向に連続するように配置されている。なお、本実施形態においては、列(1)、(10)のLED素子205は、X軸方向において同じ位置に配置され、また、列(2)、(9)のLED素子205はX軸方向において同じ位置に配置され、列(1)、(10)のLED素子205に対してX軸方向にシフトしている。また、列(3)、(8)のLED素子205は、X軸方向において同じ位置に配置され、列(2)、(9)のLED素子205に対してX軸方向にシフトしている。また、列(4)、(7)のLED素子205は、X軸方向において同じ位置に配置され、列(3)、(8)のLED素子205に対してX軸方向にシフトしている。また、列(5)、(6)のLED素子205は、X軸方向において同じ位置に配置され、列(4)、(7)のLED素子205に対してX軸方向にシフトしている。そして、本実施形態の各LED素子205は、Y軸方向においても整列しており、Y軸方向に10個のLED素子205が並ぶ領域(基板中央部P)のLED素子205(図8において、白色の□(白抜き四角)で示すLED素子205)は、X軸方向に略3mmの間隔で配置されており、Y軸方向に10個よりも少ないLED素子205が並ぶ領域(基板端部Q)のLED素子205(図8において、黒色の■(黒塗り四角)で示すLED素子205)は、X軸方向に略2.5mmの間隔で配置されている。つまり、基板端部QにおけるLED素子205のX軸方向の配置密度が、基板中央部PにおけるLED素子205のX軸方向の配置密度よりも高くなるように構成している。そして、2つのLEDモジュール210A、220Aが継ぎ目部Jを挟んで隣接している領域(つまり、図8の基板隣接部R)における、LED素子205の配置密度は、60個(基板隣接部RのLED素子205の数)/15mm(基板隣接部Rの幅)となり、各LEDモジュール210A、220Aの基板中央部Pにおける、LED素子205の配置密度(基板中央部Pにおける15mmあたりのLED素子205の数:60個)と略等しくなるように設定されている。つまり、本実施形態においても、第1の実施形態と同様、LEDモジュール210A、220Aの各基板202Aが係合するように配置されると共に、各基板202Aの基板端部QにおけるLED素子205のX軸方向の配置密度を基板中央部PにおけるLED素子205のX軸方向の配置密度よりも高くなるように構成している。そして、2つのLEDモジュール210A、220AがX軸方向に連結されたときに、各基板202Aの基板端部Qが継ぎ目部Jを挟んで隣接している領域(つまり、図8の基板隣接部R)における、LED素子205の配置密度が、各基板202Aの基板中央部Pにおける、LED素子205の配置密度と略等しくなるように構成されている。このため、本実施形態の光照射装置10Aを用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射すると、照射対象物上において、略均一な積算光量が得られる。   As shown in FIG. 8, the light irradiation apparatus 10A of the present embodiment is configured so that each substrate 202A of the LED modules 210A and 220A complements the convex portion 202Aa that protrudes in a U-shape and the convex portion 202Aa. Unlike the light irradiation apparatus 10 of the first embodiment, the convex portion 202Aa of the substrate 202A of the LED module 210A is engaged with the concave portion 202Ab of the substrate 202A of the LED module 220A, in that the concave portion 202Ab that is recessed in the shape of a letter is provided. Arranged and fixed. Then, the LED elements 205 in the respective rows (1) to (10) of the LED modules 210A and 220A sandwich the joint portion J (that is, the interval between the LED elements 205 is partially widened) in the X-axis direction. It is arranged to be continuous. In the present embodiment, the LED elements 205 in the rows (1) and (10) are arranged at the same position in the X-axis direction, and the LED elements 205 in the rows (2) and (9) are in the X-axis direction. Are arranged at the same position and are shifted in the X-axis direction with respect to the LED elements 205 in the rows (1) and (10). The LED elements 205 in the columns (3) and (8) are arranged at the same position in the X-axis direction, and are shifted in the X-axis direction with respect to the LED elements 205 in the columns (2) and (9). The LED elements 205 in the columns (4) and (7) are arranged at the same position in the X-axis direction, and are shifted in the X-axis direction with respect to the LED elements 205 in the columns (3) and (8). The LED elements 205 in the columns (5) and (6) are arranged at the same position in the X-axis direction, and are shifted in the X-axis direction with respect to the LED elements 205 in the columns (4) and (7). The LED elements 205 of the present embodiment are also aligned in the Y-axis direction, and the LED elements 205 (in FIG. 8, in the region where the ten LED elements 205 are arranged in the Y-axis direction (substrate central portion P)). LED elements 205 indicated by white squares (outlined squares) are arranged at an interval of about 3 mm in the X-axis direction, and are regions in which fewer than ten LED elements 205 are arranged in the Y-axis direction (substrate end portion Q). ) LED elements 205 (LED elements 205 indicated by black squares (black squares in FIG. 8)) are arranged at an interval of approximately 2.5 mm in the X-axis direction. That is, the arrangement density of the LED elements 205 in the X-axis direction at the substrate end Q is configured to be higher than the arrangement density of the LED elements 205 in the X-axis direction at the substrate center P. And in the area | region (namely, board | substrate adjacent part R of FIG. 8) where two LED module 210A, 220A adjoins across the joint part J, the arrangement density of the LED element 205 is 60 pieces (board | substrate adjacent part R of the board | substrate adjacent part R). The number of LED elements 205) / 15 mm (the width of the board adjacent portion R), and the arrangement density of the LED elements 205 in the substrate center portion P of each LED module 210A, 220A (the LED elements 205 per 15 mm in the substrate center portion P) (Number: 60). That is, in this embodiment as well as the first embodiment, the LED modules 210A and 220A are disposed so that the substrates 202A are engaged with each other, and the X of the LED element 205 at the substrate end Q of each substrate 202A is arranged. The arrangement density in the axial direction is configured to be higher than the arrangement density in the X-axis direction of the LED elements 205 in the substrate central portion P. When the two LED modules 210A and 220A are connected in the X-axis direction, the substrate end Q of each substrate 202A is adjacent to the seam J (that is, the substrate adjacent portion R in FIG. 8). The arrangement density of the LED elements 205 is substantially equal to the arrangement density of the LED elements 205 in the substrate central portion P of each substrate 202A. For this reason, when the irradiation target object moving at a constant speed in the Y-axis direction is irradiated with ultraviolet light using the light irradiation apparatus 10A of the present embodiment, a substantially uniform integrated light amount can be obtained on the irradiation target object. .

図9は、本実施形態の光照射装置10Aを用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射したときの積算光量を示すグラフである。図9に示すように、本実施形態の光照射装置10Aによれば、「WD5」の位置の照射対象物上において均一度:3.8%の積算光量が得られ、「WD10」の位置の照射対象物上において均一度:5.0%の積算光量が得られる。   FIG. 9 is a graph showing the integrated light quantity when ultraviolet light is irradiated onto an irradiation object that moves at a constant speed in the Y-axis direction using the light irradiation apparatus 10A of the present embodiment. As shown in FIG. 9, according to the light irradiation apparatus 10A of the present embodiment, an integrated light amount of 3.8% is obtained on the irradiation object at the position “WD5”, and the position at the position “WD10” is obtained. An integrated light amount of 5.0% uniformity is obtained on the irradiation object.

(第3の実施形態)
図10は、本発明の第3の実施形態に係る光照射装置10Bの構成を示す図である。なお、説明の便宜のため、図10においては、LEDモジュール210B、220Bのみを示し、その他の構成は省略している。
(Third embodiment)
FIG. 10 is a diagram showing a configuration of a light irradiation apparatus 10B according to the third embodiment of the present invention. For convenience of explanation, only the LED modules 210B and 220B are shown in FIG. 10, and other configurations are omitted.

図10に示すように、本実施形態の光照射装置10Bは、LEDモジュール210B、220Bの各基板202Bが、階段状に突出する凸部202Baと、凸部202Baを補完するように、階段状に窪む凹部202Bbを有する点で第1の実施形態の光照射装置10と異なり、LEDモジュール210Bの基板202Bの凸部202BaがLEDモジュール220Bの基板202Bの凹部202Bbと係合するように配置されて固定されている。そして、LEDモジュール210B、220Bの各列(1)〜(10)のLED素子205が、継ぎ目部Jを挟んで(つまり、LED素子205の間隔が部分的に広くなって)、X軸方向に連続するように配置されている。なお、本実施形態においては、列(1)〜(5)のLED素子205は、X軸方向において同じ位置に配置され、また、列(6)〜(10)のLED素子205はX軸方向において同じ位置に配置され、列(1)〜(5)のLED素子205に対してX軸方向にシフトしている。そして、本実施形態の各LED素子205は、Y軸方向においても整列しており、Y軸方向に10個のLED素子205が並ぶ領域(基板中央部P)のLED素子205(図10において、白色の□(白抜き四角)で示すLED素子205)は、X軸方向に略3mmの間隔で配置されており、Y軸方向に10個よりも少ないLED素子205が並ぶ領域(基板端部Q)のLED素子205(図10において、黒色の■(黒塗り四角)で示すLED素子205)は、X軸方向に略2.5mmの間隔で配置されている。また、本実施形態の基板隣接部RのLED素子205は、Y軸方向の間隔が2.5mmとなるように配置されている。つまり、基板端部QにおけるLED素子205のX軸方向及びY軸方向の配置密度が、基板中央部PにおけるLED素子205のX軸方向及びY軸方向の配置密度よりも高くなるように構成している。そして、2つのLEDモジュール210B、220Bの基板端部Qが継ぎ目部Jを挟んで隣接している領域(つまり、図10の基板隣接部R)における、LED素子205の配置密度は、60個(基板隣接部RのLED素子205の数)/15mm(基板隣接部Rの幅)となり、各LEDモジュール210、220の基板中央部Pにおける、LED素子205の配置密度(基板中央部Pにおける15mmあたりのLED素子205の数:60個)と略等しくなるように設定されている。つまり、本実施形態においても、第1の実施形態と同様、LEDモジュール210B、220Bの各基板202Bが係合するように配置されると共に、各基板202Bの基板端部QにおけるLED素子205の配置密度が、基板中央部PにおけるLED素子205の配置密度よりも高くなるように構成している。そして、2つのLEDモジュール210B、220BがX軸方向に連結されたときに、各基板202Bの基板端部Qが継ぎ目部Jを挟んで隣接している領域(つまり、図10の基板隣接部R)における、LED素子205の配置密度が、各基板202Bの基板中央部Pにおける、LED素子205の配置密度と略等しくなるように構成されている。このため、本実施形態の光照射装置10Bを用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射すると、照射対象物上において、略均一な積算光量が得られる。   As shown in FIG. 10, the light irradiation device 10B of the present embodiment has a stepped shape so that each substrate 202B of the LED modules 210B and 220B protrudes in a stepped manner and the protruding portion 202Ba complements the protruding portion 202Ba. Unlike the light irradiation apparatus 10 of the first embodiment in that it has a recessed portion 202Bb, the convex portion 202Ba of the substrate 202B of the LED module 210B is arranged to engage with the concave portion 202Bb of the substrate 202B of the LED module 220B. It is fixed. Then, the LED elements 205 in the rows (1) to (10) of the LED modules 210B and 220B sandwich the joint portion J (that is, the interval between the LED elements 205 is partially widened) in the X-axis direction. It is arranged to be continuous. In this embodiment, the LED elements 205 in the rows (1) to (5) are arranged at the same position in the X-axis direction, and the LED elements 205 in the rows (6) to (10) are in the X-axis direction. Are arranged at the same position and are shifted in the X-axis direction with respect to the LED elements 205 in the columns (1) to (5). The LED elements 205 of the present embodiment are also aligned in the Y-axis direction, and the LED elements 205 (in FIG. 10, the central portion P of the substrate) in which the ten LED elements 205 are arranged in the Y-axis direction. LED elements 205 indicated by white squares (outlined squares) are arranged at an interval of about 3 mm in the X-axis direction, and are regions in which fewer than ten LED elements 205 are arranged in the Y-axis direction (substrate end portion Q). ) LED elements 205 (LED elements 205 indicated by black squares (black squares in FIG. 10)) are arranged at an interval of approximately 2.5 mm in the X-axis direction. Further, the LED elements 205 in the substrate adjacent portion R of this embodiment are arranged so that the interval in the Y-axis direction is 2.5 mm. That is, the arrangement density of the LED elements 205 in the X-axis direction and the Y-axis direction at the substrate end Q is configured to be higher than the arrangement density of the LED elements 205 in the X-axis direction and the Y-axis direction in the substrate center P. ing. The arrangement density of the LED elements 205 in a region where the substrate end portions Q of the two LED modules 210B and 220B are adjacent to each other with the joint portion J interposed therebetween (that is, the substrate adjacent portion R in FIG. 10) is 60 ( The number of LED elements 205 in the substrate adjacent portion R) / 15 mm (width of the substrate adjacent portion R), and the arrangement density of the LED elements 205 in the substrate central portion P of each LED module 210, 220 (per 15 mm in the substrate central portion P) The number of LED elements 205 is 60). That is, in the present embodiment as well as the first embodiment, the LED modules 210B and 220B are disposed so that the substrates 202B are engaged with each other, and the LED elements 205 are disposed at the substrate ends Q of the substrates 202B. The density is configured to be higher than the arrangement density of the LED elements 205 in the central portion P of the substrate. Then, when the two LED modules 210B and 220B are connected in the X-axis direction, the substrate end portion Q of each substrate 202B is adjacent to the joint portion J (that is, the substrate adjacent portion R in FIG. 10). The arrangement density of the LED elements 205 in () is substantially equal to the arrangement density of the LED elements 205 in the substrate central portion P of each substrate 202B. For this reason, when the irradiation target object moving at a constant speed in the Y-axis direction is irradiated with ultraviolet light using the light irradiation apparatus 10B of the present embodiment, a substantially uniform integrated light amount can be obtained on the irradiation target object. .

図11は、本実施形態の光照射装置10Bを用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射したときの積算光量を示すグラフである。図11に示すように、本実施形態の光照射装置10Bによれば、「WD5」の位置の照射対象物上において均一度:5.2%の積算光量が得られ、「WD10」の位置の照射対象物上において均一度:4.0%の積算光量が得られる。   FIG. 11 is a graph showing the integrated light amount when ultraviolet light is irradiated onto an irradiation object that moves at a constant speed in the Y-axis direction using the light irradiation device 10B of the present embodiment. As shown in FIG. 11, according to the light irradiation apparatus 10B of the present embodiment, an integrated light amount of 5.2% is obtained on the irradiation object at the position “WD5”, and the position at the position “WD10” is obtained. An integrated light amount of 4.0% uniformity is obtained on the irradiation object.

(第4の実施形態)
図12は、本発明の第4の実施形態に係る光照射装置10Cの構成を示す図である。なお、説明の便宜のため、図12においては、LEDモジュール210C、220Cのみを示し、その他の構成は省略している。
(Fourth embodiment)
FIG. 12 is a diagram showing a configuration of a light irradiation apparatus 10C according to the fourth embodiment of the present invention. For convenience of explanation, only the LED modules 210C and 220C are shown in FIG. 12, and other configurations are omitted.

図12に示すように、本実施形態の光照射装置10Cは、LEDモジュール210C、220Cの各基板202Cの斜辺の角度が大きく、各基板202C上に、20個(X軸方向)×20列(Y軸方向)の態様で、400個のLED素子205がCOB(Chip On Board)実装されている点で第1の実施形態の光照射装置10と異なる。そして、LEDモジュール210C、220Cの各列(1)〜(20)のLED素子205が、継ぎ目部Jを挟んで(つまり、LED素子205の間隔が部分的に広くなって)、X軸方向に連続するように配置されている。なお、本実施形態においては、列(1)〜(4)のLED素子205は、X軸方向において同じ位置に配置され、また、列(5)〜(8)のLED素子205はX軸方向において同じ位置に配置され、列(1)〜(4)のLED素子205に対してX軸方向にシフトしている。また、列(9)〜(12)のLED素子205は、X軸方向において同じ位置に配置され、列(5)〜(8)のLED素子205に対してX軸方向にシフトしている。また、列(13)〜(16)のLED素子205は、X軸方向において同じ位置に配置され、列(9)〜(12)のLED素子205に対してX軸方向にシフトしている。また、列(17)〜(20)のLED素子205は、X軸方向において同じ位置に配置され、列(13)〜(16)のLED素子205に対してX軸方向にシフトしている。そして、本実施形態の各LED素子205は、Y軸方向においても整列しており、Y軸方向に20個のLED素子205が並ぶ領域(基板中央部P)のLED素子205(図12において、白色の□(白抜き四角)で示すLED素子205)は、X軸方向に略3mmの間隔で配置されており、Y軸方向に20個よりも少ないLED素子205が並ぶ領域(基板端部Q)のLED素子205(図12において、黒色の■(黒塗り四角)で示すLED素子205)は、X軸方向に略2.14mmの間隔で配置されている。つまり、基板端部QにおけるLED素子205のX軸方向の配置密度が、基板中央部PにおけるLED素子205のX軸方向の配置密度よりも高くなるように構成している。そして、2つのLEDモジュール210C、220Cが継ぎ目部Jを挟んで隣接している領域(つまり、図12の基板隣接部R)における、LED素子205の配置密度は、120個(基板隣接部RのLED素子205の数)/約15mm(基板隣接部Rの幅)となり、各LEDモジュール210C、220Cの基板中央部Pにおける、LED素子205の配置密度(基板中央部Pにおける15mmあたりのLED素子205の数:120個)と略等しくなるように設定されている。つまり、本実施形態においても、第1の実施形態と同様、LEDモジュール210C、220Cの各基板202Cが係合するように配置されると共に、各基板202Cの基板端部QにおけるLED素子205のX軸方向の配置密度が、基板中央部PにおけるLED素子205のX軸方向の配置密度よりも高くなるように構成している。そして、2つのLEDモジュール210C、220CがX軸方向に連結されたときに、各基板202Cの基板端部Qが継ぎ目部Jを挟んで隣接している領域(つまり、図12の基板隣接部R)における、LED素子205の配置密度が、各基板202Cの基板中央部Pにおける、LED素子205の配置密度と略等しくなるように構成されている。このため、本実施形態の光照射装置10Cを用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射すると、照射対象物上において、略均一な積算光量が得られる。   As shown in FIG. 12, in the light irradiation apparatus 10C of this embodiment, the angle of the oblique side of each substrate 202C of the LED modules 210C and 220C is large, and 20 pieces (in the X-axis direction) × 20 rows on each substrate 202C ( In the aspect of (Y-axis direction), 400 LED elements 205 differ from the light irradiation apparatus 10 of 1st Embodiment by the point by which COB (Chip On Board) mounting is carried out. Then, the LED elements 205 in each row (1) to (20) of the LED modules 210C and 220C sandwich the joint portion J (that is, the interval between the LED elements 205 is partially widened) in the X-axis direction. It is arranged to be continuous. In the present embodiment, the LED elements 205 in the columns (1) to (4) are arranged at the same position in the X-axis direction, and the LED elements 205 in the columns (5) to (8) are in the X-axis direction. Are arranged at the same position and are shifted in the X-axis direction with respect to the LED elements 205 in the columns (1) to (4). The LED elements 205 in the rows (9) to (12) are arranged at the same position in the X-axis direction, and are shifted in the X-axis direction with respect to the LED elements 205 in the rows (5) to (8). The LED elements 205 in the rows (13) to (16) are arranged at the same position in the X-axis direction, and are shifted in the X-axis direction with respect to the LED elements 205 in the rows (9) to (12). The LED elements 205 in the rows (17) to (20) are arranged at the same position in the X-axis direction, and are shifted in the X-axis direction with respect to the LED elements 205 in the rows (13) to (16). The LED elements 205 of the present embodiment are also aligned in the Y-axis direction, and the LED elements 205 (in FIG. 12, the central portion P of the substrate) where 20 LED elements 205 are arranged in the Y-axis direction. LED elements 205 indicated by white squares (outlined squares) are arranged at an interval of about 3 mm in the X-axis direction, and a region where fewer than 20 LED elements 205 are arranged in the Y-axis direction (substrate end Q) ) LED elements 205 (LED elements 205 indicated by black squares (black squares in FIG. 12)) are arranged at an interval of approximately 2.14 mm in the X-axis direction. That is, the arrangement density of the LED elements 205 in the X-axis direction at the substrate end Q is configured to be higher than the arrangement density of the LED elements 205 in the X-axis direction at the substrate center P. And in the area | region (namely, board | substrate adjacent part R of FIG. 12) where the two LED modules 210C and 220C are adjacent on both sides of the joint part J, the arrangement density of 120 LED elements (of board | substrate adjacent part R) The number of LED elements 205) / about 15 mm (width of the board adjacent portion R), and the arrangement density of the LED elements 205 (the LED elements 205 per 15 mm in the board central portion P) in the board central portion P of each LED module 210C, 220C. The number is set to be approximately equal to 120). That is, in the present embodiment as well, as in the first embodiment, the LED modules 210C and 220C are disposed so that the substrates 202C are engaged with each other, and the X of the LED element 205 at the substrate end Q of each substrate 202C. The arrangement density in the axial direction is configured to be higher than the arrangement density in the X-axis direction of the LED elements 205 in the central portion P of the substrate. Then, when the two LED modules 210C and 220C are connected in the X-axis direction, the substrate end portion Q of each substrate 202C is adjacent to the seam portion J (that is, the substrate adjacent portion R in FIG. 12). The arrangement density of the LED elements 205 is substantially equal to the arrangement density of the LED elements 205 in the substrate central portion P of each substrate 202C. For this reason, when the irradiation target object moving at a constant speed in the Y-axis direction is irradiated with ultraviolet light using the light irradiation apparatus 10C of the present embodiment, a substantially uniform integrated light amount can be obtained on the irradiation target object. .

図13は、本実施形態の光照射装置10Cを用いて、Y軸方向に一定の速度で移動する照射対象物上に紫外光を照射したときの積算光量を示すグラフである。図13に示すように、本実施形態の光照射装置10Cによれば、「WD5」の位置の照射対象物上において均一度:4.4%の積算光量が得られ、「WD10」の位置の照射対象物上において均一度:5.3%の積算光量が得られる。   FIG. 13 is a graph showing an integrated light amount when ultraviolet light is irradiated onto an irradiation object moving at a constant speed in the Y-axis direction using the light irradiation apparatus 10C of the present embodiment. As shown in FIG. 13, according to the light irradiation apparatus 10 </ b> C of the present embodiment, an integrated light amount of 4.4% is obtained on the irradiation object at the position “WD5”, and the position at the position “WD10” is obtained. An integrated light amount of 5.3% uniformity is obtained on the irradiation object.

なお、本実施形態においては、LED素子205が20個(X軸方向)×20列(Y軸方向)の態様で並び、第1の実施形態においては、LED素子205が20個(X軸方向)×10列(Y軸方向)の態様で並ぶものとして説明したが、本発明は、かかる構成に限定されるものではなく、基板隣接部Rが形成される限りにおいて、X軸方向にN個(Nは4以上の整数)、Y軸方向にM個(Mは2以上の整数)の態様で並べばよい。   In the present embodiment, 20 LED elements 205 (X-axis direction) × 20 rows (Y-axis direction) are arranged in the form, and in the first embodiment, 20 LED elements 205 (X-axis direction). However, the present invention is not limited to this configuration, and as long as the substrate adjacent portion R is formed, N pieces are arranged in the X-axis direction. (N is an integer of 4 or more), and M (M is an integer of 2 or more) may be arranged in the Y-axis direction.

また、第1乃至第4の実施形態において、基板中央部PのLED素子205は、正方格子状に配置されるものとしたが、本発明は、かかる構成に限定されるものではなく、略一様な配置密度となるように配置されればよい。   In the first to fourth embodiments, the LED elements 205 in the central portion P of the substrate are arranged in a square lattice shape. However, the present invention is not limited to such a configuration, and is substantially one. What is necessary is just to arrange | position so that it may become such arrangement | positioning density.

また、第1乃至第4の実施形態において、基板端部QのLED素子205は、X軸方向及びY軸方向に所定の間隔をおいて配置されるものとしたが、本発明は、かかる構成に限定されるものではなく、各基板がX軸方向に連結されたときに、各基板の基板端部Qが継ぎ目部Jを挟んで隣接している領域(つまり、基板隣接部R)において、略一様な配置密度となるように配置されればよい。   Further, in the first to fourth embodiments, the LED elements 205 at the substrate end Q are arranged at predetermined intervals in the X-axis direction and the Y-axis direction. In the region where the substrate end portions Q of the respective substrates are adjacent to each other with the joint portion J interposed therebetween when the substrates are connected in the X-axis direction (that is, the substrate adjacent portion R), What is necessary is just to arrange | position so that it may become a substantially uniform arrangement density.

なお、今回開示された実施の形態は、全ての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は、上記した説明ではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれることが意図される。   The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

10、10A、10B、10C、10X、10Y 光照射装置
100 ベースプレート
202 基板
202Aa、202Ba 凸部
202Ab、202Bb 凹部
205 LED素子
210、220、210A、220A、210B、220B、210C、220C LEDモジュール
10, 10A, 10B, 10C, 10X, 10Y Light irradiation device 100 Base plate 202 Substrate 202Aa, 202Ba Convex part 202Ab, 202Bb Concave part 205 LED element 210, 220, 210A, 220A, 210B, 220B, 210C, 220C LED module

Claims (10)

第1方向に相対的に移動する照射対象物上に、前記第1方向と直交する第2方向に延び、かつ、前記第1方向に所定の線幅を有するライン状の光を照射する光照射装置であって、
前記第1方向及び前記第2方向に略平行な基板と、前記基板の表面に配置され、前記光を出射する複数の光源と、をそれぞれ有し、前記第2方向に連結するように配置された複数の光照射モジュールを備え、
前記各基板は、前記複数の光源が前記第1方向及び前記第2方向に第1の密度で配列される基板中央部と、前記複数の光源が前記第1の密度よりも高い第2の密度で配列される基板端部と、からなり、
前記各基板の前記基板端部は、隣接する基板の前記基板端部と係合して、基板隣接部を形成し、
前記基板隣接部において、前記複数の光源の密度が、前記第1の密度と略等しい
ことを特徴とする光照射装置。
Light irradiation that irradiates a line-shaped light that extends in a second direction orthogonal to the first direction and has a predetermined line width in the first direction on an irradiation object that moves relatively in the first direction. A device,
A substrate substantially parallel to the first direction and the second direction, and a plurality of light sources arranged on the surface of the substrate and emitting the light, and are arranged so as to be connected in the second direction. A plurality of light irradiation modules,
Each of the substrates includes a substrate central portion in which the plurality of light sources are arranged at a first density in the first direction and the second direction, and a second density in which the plurality of light sources are higher than the first density. And an end portion of the substrate arranged in
The substrate end of each substrate engages with the substrate end of an adjacent substrate to form a substrate adjacent portion;
The light irradiation apparatus according to claim 1, wherein a density of the plurality of light sources is substantially equal to the first density in the substrate adjacent portion.
前記基板中央部において、前記複数の光源は、前記第1方向に沿って第1の間隔をおいてM個(Mは2以上の整数)並び、前記第2方向に沿って第2の間隔をおいてN個(Nは4以上の整数)並び、
前記基板隣接部において、前記複数の光源は、前記第2方向に沿って前記第2の間隔よりも狭い第3の間隔をおいて並ぶ
ことを特徴とする請求項1に記載の光照射装置。
In the central portion of the substrate, the plurality of light sources are arranged with M (M is an integer of 2 or more) at a first interval along the first direction, and at a second interval along the second direction. N (N is an integer of 4 or more) are arranged,
2. The light irradiation apparatus according to claim 1, wherein the plurality of light sources are arranged at a third interval narrower than the second interval along the second direction in the substrate adjacent portion.
前記基板隣接部において、前記複数の光源は、前記第1方向に沿って前記第1の間隔をおいて並ぶことを特徴とする請求項2に記載の光照射装置。   The light irradiation apparatus according to claim 2, wherein the plurality of light sources are arranged at the first interval along the first direction in the substrate adjacent portion. 前記基板隣接部において、前記複数の光源は、前記第1方向に沿って前記第1の間隔よりも狭い第4の間隔をおいて並ぶことを特徴とする請求項2に記載の光照射装置。   3. The light irradiation apparatus according to claim 2, wherein the plurality of light sources are arranged at a fourth interval narrower than the first interval along the first direction in the substrate adjacent portion. 前記各基板の前記基板端部と隣接する基板の前記基板端部が、相互に補完する形状を有することを特徴とする請求項1から請求項4のいずれか一項に記載の光照射装置。   5. The light irradiation apparatus according to claim 1, wherein the substrate end portions of the substrates adjacent to the substrate end portions of the substrates have shapes complementary to each other. 前記各基板の前記基板端部と隣接する基板の前記基板端部との間に、前記光源が配置されない接合部を有し、前記各基板の前記基板端部が前記接合部を介して隣接する基板の前記基板端部と係合することを特徴とする請求項1から請求項5のいずれか一項に記載の光照射装置。   Between the substrate end portion of each substrate and the substrate end portion of the adjacent substrate, there is a joint portion where the light source is not disposed, and the substrate end portion of each substrate is adjacent via the joint portion. The light irradiation device according to claim 1, wherein the light irradiation device is engaged with the substrate end portion of the substrate. 前記接合部が、前記第1方向に対して傾斜していることを特徴とする請求項6に記載の光照射装置。   The light irradiation apparatus according to claim 6, wherein the joint portion is inclined with respect to the first direction. 前記各基板の形状が平行四辺形であることを特徴とする請求項7に記載の光照射装置。   The light irradiation apparatus according to claim 7, wherein the shape of each of the substrates is a parallelogram. 前記接合部が、階段状に形成されていることを特徴とする請求項6に記載の光照射装置。   The light irradiation apparatus according to claim 6, wherein the joint portion is formed in a stepped shape. 前記接合部が、くの字状に形成されていることを特徴とする請求項6に記載の光照射装置。   The light irradiation apparatus according to claim 6, wherein the joint portion is formed in a U shape.
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