JP2018032775A - Electronic component heat dissipation structure and assembly method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure a desired heat dissipation effect of an electronic component which requires heat dissipation, and to efficiently solder all electronic components, including the electronic component, to a wiring board.SOLUTION: A heat dissipation structure includes: a wiring board which has a surface side, on which an electronic component is arranged, and a back face side opposite thereto; a heat dissipation electronic component which requires heat dissipation among the electronic components; a heat dissipation member, which is arranged on the surface side of the wiring board in a state of contacting to the heat dissipation electronic component, for the heat dissipation of the heat dissipation electronic component; and a heat sink arranged on the back face side of the wiring board to radiate heat from the heat dissipation member to the outside. The heat dissipation member and the heat sink are connected on the back face side, so that heat dissipation can be efficiently performed on the back face side of the electronic component which is disposed on the surface side.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a heat dissipation structure for an electronic component that requires heat dissipation, and more particularly to an apparatus that can efficiently attach various electronic components including the electronic component to a wiring board and an assembling method thereof.

Electronic components attached to the wiring board include electronic components having various uses and functions. These include electronic components that become hot during operation. Such components need to dissipate heat outside the wiring board. For this reason, it is conventionally known that a heat radiating plate is attached on a wiring board and heat from an electronic component that needs to be radiated is radiated to the outside through the heat radiating plate so that heat is not accumulated inside.
For example, Patent Document 1 shown below discloses a configuration for radiating heat through a plurality of heat radiating plates.

Japanese Patent Laid-Open No. 2015-220338

When attaching a component that requires heat dissipation to a wiring board, conventionally, first, an electronic component that requires heat dissipation is temporarily attached to a heat sink, and an operation of determining the positional relationship between the substrate and the electronic component is first performed. Next, the temporarily attached heat radiating plate is once removed, and a predetermined soldering operation is performed. And after that, the operation | work which fixes so that a heat sink may contact again with the electronic component which needs heat radiation so that heat radiation was needed was needed.
The reason for temporarily attaching the heat-radiating electronic component and the heat-dissipating plate in this way is that it is not easy to position the wiring board that requires soldering with the electronic component. There are circumstances.
When attaching electronic components to the wiring board, a through hole is provided that penetrates from the surface (front surface) side of the wiring board on which the electronic components are placed to the back surface side, and the positional relationship between the electronic component and the wiring board is determined. It is necessary to pass the component lead wires from the front surface side to the back surface side and perform soldering processing on the back surface side to attach the electronic component to the wiring board. However, as the number of electronic components attached to the wiring board increases, the lead wires for penetrating the lead wires of the respective electronic parts from the front side to the back side through through holes called through holes provided on the wiring board. Since the number increases and it becomes complicated to set the positional relationship, there arises a problem that the position setting of the through hole on the wiring board becomes complicated.
On the other hand, the lead wire from the electronic component does not extend vertically and the arrangement of the lead wire of the electronic component is precisely set, so it is not easy to determine the positional relationship with the through hole. . In addition, when fixing electronic components that require heat dissipation to the wiring board by soldering, ensure a stable and good contact state with the heat sink in order to achieve a sufficient heat dissipation effect of the electronic components that require heat dissipation. Another requirement must be met.
For this reason, in the structure of the wiring board of the electronic component including the electronic component that requires heat radiation to the conventional heat sink, the heat radiation is required by temporarily attaching the heat sink and the electronic component that requires heat radiation to the wiring board. It is necessary to confirm in advance the positional relationship between the electronic component and the wiring board so that the soldering process of all the electronic components including the electronic component to the wiring board can be performed without any trouble.
However, the number of processes increases by the amount that requires temporary attachment between the electronic component that requires heat dissipation and the heat sink, and in some cases, temporary attachment between the electronic component and the wiring substrate or between the heat sink and the wiring substrate. become.
And when soldering and fixing electronic components that require heat dissipation to the wiring board, after temporarily positioning the heat sink and the electronic components as described above, the heat sink is once removed and soldered, After that, a complicated operation of attaching the heat radiating plate again is required, so that there is a problem that the working efficiency is remarkably lowered.
Accordingly, an object of the present invention is to provide a technique capable of efficiently soldering all electronic components including the electronic component to a wiring board while ensuring a desired heat dissipation effect of the electronic component that requires heat dissipation. .

In order to achieve the above object, the heat dissipation structure of the present case includes a wiring board having a front surface side on which electronic components are arranged and a back surface side on the opposite side,
Of the electronic components, heat dissipation electronic components that require heat dissipation,
A heat dissipating member disposed on the surface side of the wiring board in contact with the heat dissipating electronic component, and dissipating heat from the heat dissipating electronic component;
A heat dissipating plate disposed on the back side of the wiring board for dissipating heat from the heat dissipating member to the outside,
The heat radiating member and the heat radiating plate are connected on the back surface side.
In a preferred embodiment, the heat radiating member and the heat radiating plate are not limited to being directly connected, but may be indirectly connected in a form that ensures heat transfer from the heat radiating member.
In another preferred embodiment, the heat dissipation member and the wiring board are penetrated. That is, the heat dissipating member is configured to extend from the front surface side to the back surface side of the wiring board, transfers heat received from the heat dissipating electronic component to the back surface side on the front surface side, and is disposed on the heat dissipating plate disposed on the back surface side of the wiring board. Dissipate heat. The terminals of the electronic component can be soldered on the back side by dipping the wiring board.
Conventionally, the heat dissipating electronic component is arranged on the back side to facilitate connection to the heat sink.
On the other hand, in the present invention, since the heat dissipating electronic component is arranged on the front surface side together with other electronic components, it is possible to solder by dipping the back surface side of the wiring board. Thereby, the work efficiency of soldering can be improved dramatically.
According to another feature of the invention,
Prepare a wiring board with a front side for placing electronic components and a back side on the opposite side,
Placing the electronic component on the wiring board;
Solder the terminals of the electronic component on the back side,
A heat dissipating member for dissipating a heat dissipating electronic component that needs to dissipate among the electronic components is brought into contact with the heat dissipating electronic component on the surface side,
There is provided a method for assembling a heat dissipation structure for an electronic component, including connecting the heat dissipating member to a heat dissipating plate for dissipating heat from the heat dissipating member to the outside on the back surface side.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component arrange | positioned on a wiring board can be efficiently radiated | emitted, and the attachment of an electronic component to a wiring board | substrate can be performed efficiently.

It is a perspective view showing a heat dissipation structure concerning one embodiment of the present invention. It is the perspective view which looked at the thermal radiation structure from the back side. It is sectional drawing of the thermal radiation structure of FIG. It is explanatory drawing which shows the assembly procedure of a thermal radiation structure in a cross section. It is explanatory drawing which shows 1 aspect of the assembly procedure of a thermal radiation structure in a cross section. It is explanatory drawing which shows 1 aspect of the assembly procedure of a thermal radiation structure in a cross section. It is explanatory drawing which shows 1 aspect of the assembly procedure of a thermal radiation structure in a cross section. It is explanatory drawing which shows the aspect of the assembly procedure of a thermal radiation structure in a cross section. It is a side view of a thermal radiation structure. It is a top view of a thermal radiation structure.

A heat dissipation structure according to the present invention will be described with reference to the drawings. The heat dissipation structure according to this example includes a wiring board 1 on which a plurality of electronic components are arranged. In FIGS. 1 and 2 of this example, the electronic component 2 indicates an electronic component that does not require heat dissipation, and the electronic component 3 indicates a heat dissipation electronic component that requires heat dissipation. Are arranged on the front side 12 of the wiring board 1. The heat dissipating electronic component 3 that needs to dissipate heat is connected to the heat dissipating member 4 that absorbs the heat generated in the heat dissipating electronic component 3 on the surface side 12 of the wiring board 1. The heat radiating member 4 is formed of a metal material such as aluminum having a high thermal conductivity. In this example, the heat radiating member 4 extends through the wiring substrate 1 from the front surface side 12 to the back surface side 13 of the wiring substrate 1 as shown in FIG.
Specifically, the heat dissipation member 4 has a side surface that can come into surface contact with the heat dissipation electronic component 2. More specifically, the heat dissipating member 4 is a prismatic body having a polygonal cross section, and has an upper portion located on the upper surface side 12 of the wiring substrate 1 and a lower portion located on the lower surface side 13 of the wiring substrate 1. The upper portion has a plurality of side surfaces that can come into surface contact with the side surfaces of the heat dissipation electronic component 3. The heat dissipating member 4 is inserted into a through hole 14 having a shape similar to the cross-sectional shape of the heat dissipating member 4 and having a size that allows the heat dissipating member 4 to be inserted from the front surface side 12 to the back surface side 13 of the wiring substrate 1. 1 extends through.
And in this example, the front-end | tip of the back surface side of the heat radiating member 4 is connected to the heat sink 6 extended in parallel with the wiring board 1 through the insulating member 5. FIG. The radiator plate 6 is also made of a material having high thermal conductivity. Specifically, the back surface of the heat radiating member 4 and the surface of the rectangular heat sink 6 are made to face each other and are connected using a connecting means such as a screw 8.
The heat capacity of the heat radiating plate 6 of the present invention is set to be much higher than the heat capacity of the heat radiating member 4, and the heat generated from the heat radiating electronic component 2 is generated from the heat radiating electronic component 2 by being made of a highly heat conductive material. Thus, heat conduction is efficiently conducted to the heat radiating plate 6.
The heat dissipating electronic component 3 is further pressed against the side surface of the heat dissipating member from the side opposite to the contact surface by the elastic clamp 7.
Next, a method for assembling the heat dissipation structure for the electronic component of this example will be described.
As shown by an arrow A in FIG. 4, first, electronic components 2 and 3 are arranged at predetermined positions on the wiring board 1. In the wiring board 1, positions for arranging the respective electronic components 2 and 3 are determined in advance at the design stage, and corresponding conductive portions are already embedded. Through holes 14 corresponding to the lead wires 21 and 31 including the terminals of the respective electronic components 2 and 3 are also provided at predetermined positions.
Next, as shown by the arrows in FIG. 4, the lead wires 21 and 31 of the electronic components 2 and 3 are passed through the wiring board 1 from the front surface side 12 to the back surface side 13 through the through holes 14.
Next, as shown in FIG. 5, the terminals of the electronic components 2 and 3 are soldered by dipping the wiring board 1 on the back side 13.
When dipping, the electronic component 2 that does not require heat dissipation and the electronic component 3 that requires heat dissipation are soldered at once with a solder layer.
Next, as shown in FIG. 6, the wiring board 1 on which the heat dissipating electronic component 3 and the other electronic components 2 are mounted is fixed to the large heat dissipating plate 6 with screws 8 or the like through the base 11 or the like.
Next, as shown in FIG. 7, the heat dissipating member 4 for the heat dissipating electronic component 3 is fixed to the large heat dissipating plate 6 with the screw 8 through the through hole 14 of the wiring board 1.
In this case, the heat radiating member 4 and the heat radiating plate 6 are not limited to being directly connected as described above, but may be indirectly connected so as to ensure heat transfer from the heat radiating member 4. For example, as shown in FIG. 8, insulation is performed between the wiring board 1, the heat dissipating electronic component 3 that needs to dissipate heat, the other electronic component 2, the heat dissipating member 4 for the heat dissipating electronic component 3, and the large heat dissipating plate 6. If necessary, an insulator 5 can be interposed between the heat dissipation member 4 for the heat dissipation electronic component 3 and the large heat dissipation plate 6. An insulator 5 can be interposed between the screw 8 and the heat radiating member 4 as necessary.
Next, as shown in FIGS. 9 and 10, the heat radiating member 4 for the heat radiating electronic component 3 and the heat radiating electronic component 3 are fixed by the clamp 7.
In this case, the heat dissipating member 4 is formed in a polygonal shape, and the heat dissipating electronic component 3 is in close contact with one surface thereof, and an opening 41 is provided inside.
In this example, a through hole 42 extending from the front surface 12 to the back surface 13 is provided inside the opening 41, and the screw 8 is screwed into the heat radiating plate 6 through the insulating member 5. The wiring board 1 is further integrated with the heat sink 6 so as to be in the state shown in FIG.
Further, by inserting the screw insulating material 5 positioned around the screw 8 at the bottom in the opening 41 between the heat radiating member 4, the insulation between the screw 8 and the heat radiating member 4 can be secured.
According to this example, it is possible to efficiently dissipate an electronic component that needs to be dissipated disposed on the wiring board, and to efficiently attach the electronic component to the wiring board.
In particular, with regard to the soldering process, the conventional soldering process shown in the prior art document 1 and the like is performed separately for both the electronic component disposed on the front surface side of the wiring board and the heat dissipating electronic component disposed on the back surface side. Although it was necessary to perform the soldering process, according to this example, since the electronic components are arranged only on the front surface side of the wiring board, it is only necessary to perform the soldering process from the back surface side. Can be improved. Specifically, since the soldering process can be performed collectively by dipping the back surface side of the wiring substrate, the soldering work efficiency can be dramatically improved.
In addition, according to this example, since a single-sided board on which wiring pattern formation and electronic component mounting are performed on only one side can be used, double-sided board on which wiring pattern formation and electronic component mounting are provided on both sides Compared with the case of using, manufacturing efficiency including manufacturing cost and process can be improved.
The present invention can be implemented in various forms without departing from the gist thereof.
For example, the heat dissipating member of the present example has a quadrangular cross section, and one heat dissipating electronic component is in surface contact with one of the side surfaces, but the heat dissipating member is not limited to this. May have a cross-sectional shape having at least one side surface that can come into surface contact with the heat dissipation electronic component, and from the viewpoint of improving the degree of freedom in circuit design, a plurality of heat dissipation electronic components are provided on one side surface. It may be configured to be in surface contact, or may be configured to have a polygonal cross-section, and each radiating electronic component is in surface contact with each side surface of the heat radiating member having a plurality of side surfaces. In the case of a heat dissipation member having a plurality of side surfaces, even if the heat dissipation electronic components are in surface contact with all of the side surfaces, the heat dissipation electronic components are in surface contact with some of the side surfaces. May be.
Further, for example, the heat dissipation member of this example penetrates the inside of the wiring board in the front and back direction, but is not limited to this, for example, from the viewpoint of improving the degree of freedom in circuit design, the heat dissipation member is placed outside the wiring board. It can also be arranged. Specifically, the side surface of the heat radiating member can be installed to face the side surface of the wiring board. More specifically, a wiring board having a front surface side for placing electronic components and a back surface side opposite thereto, a heat dissipating electronic component that requires heat radiation among the electronic components, and a contact with the heat dissipating electronic component In this state, the heat dissipating member is disposed on the front surface side of the wiring board and dissipates heat from the heat dissipating electronic component, and the heat dissipating member is disposed on the back surface side of the wiring substrate to dissipate heat from the heat dissipating member to the outside. And the heat dissipating member is disposed with its side surface facing the side surface of the wiring board, and the side surface of the heat dissipating member is disposed opposite to the side surface of the heat dissipating plate, or It can also be set as the heat radiating structure which installs with a side surface facing the side surface of a wiring board, and makes the bottom face oppose the surface of the said heat sink.
Further, for example, in this example, a clamp is used to closely attach the heat dissipation member and the heat dissipation electronic component facing the heat dissipation member, and the side surface opposite to the side surface of the heat dissipation electronic component having the side surface facing the heat dissipation member is provided. Although it was set as the structure which hold | maintains by elastically pressing in a heat radiating member direction, it is not restricted to this, What is necessary is just to provide the holding means which can hold | maintain the heat radiating electronic component in the surface contact state with respect to the heat radiating member. For example, the heat dissipation electronic component may be held by the heat dissipation member using an elastic annular member, or may be screwed to the heat dissipation member via a crank-shaped fitting.
Further, for example, in this example, the state in which one heat dissipating electronic component is in surface contact with the heat dissipating member is held by one clamp. However, the present invention is not limited to this, for example, from the viewpoint of improving manufacturing efficiency, The state in which the electronic component is in surface contact with the heat radiating member may be held by one holding means.
For example, in this example, although the case where one wiring board was used was shown, you may use not only this but a several wiring board. For example, from the viewpoint of improving the degree of freedom in circuit design, a heat dissipation structure including at least two wiring boards can be provided. Specifically, the wiring board is multi-layered, that is, a first wiring board having a front surface side on which electronic components are arranged and a back surface side opposite thereto, and is arranged on the front surface side of the first wiring board. A second wiring board having a front surface side for disposing the electronic component and a back surface side opposite to the second wiring substrate, a heat dissipating electronic component that requires heat dissipation among the electronic components, and the heat dissipating electronic component being in contact with each other In a state, disposed on the front surface side of the first wiring board and the front surface side of the second wiring board, and disposed on the back surface side of the first wiring board, and a heat radiating member for radiating heat from the heat radiating electronic component A heat radiating plate for radiating heat from the heat radiating member to the outside, wherein the heat radiating member and the heat radiating plate are connected on the back side of the first wiring board. it can. In this embodiment, it is preferable that the heat dissipating member is a heat dissipating structure that penetrates the first wiring board and the second wiring board.
Further, for example, in this example, the back surface of the heat radiating member and the front surface of the rectangular plate-shaped heat radiating plate are opposed, and a screw is screwed into a through hole provided in the opening of the heat radiating member, thereby However, the present invention is not limited to this, and any configuration may be used as long as it includes connection means that can connect the heat dissipation member and the heat dissipation plate. For example, it may be connected via a heat-dissipating grease having viscosity such as silicon grease, and a screw is screwed into a through hole provided in the heat-dissipating plate to connect the heat-dissipating member and the heat-dissipating plate. Also good.
Further, for example, various known soldering processes can be used for the soldering process shown in this example. Preferably, in addition to a method using a stationary tank that does not move the solder liquid level, a jet type (flow type) that makes waves on the solder liquid level can be used. Note that the dip of the present invention includes a method using a stationary tank that does not move the solder liquid level, a jet-type method that makes waves on the solder liquid level, and the like.

DESCRIPTION OF SYMBOLS 1 Wiring board 2, 3 Electronic component 4 Heat radiating member 5 Insulating member 6 Heat radiating plate 7 Clamp 8 Screw 9 Solder liquid 10 Solder tank 11 Base 12 Front side 13 Back side 14 Through-hole

Claims (5)

A wiring board having a front side for placing electronic components and a back side opposite to the front side;
Of the electronic components, heat dissipation electronic components that require heat dissipation,
A heat dissipating member disposed on the surface side of the wiring board in contact with the heat dissipating electronic component, and for dissipating the heat dissipating electronic component;
A heat dissipating plate disposed on the back side of the wiring board for dissipating heat from the heat dissipating member to the outside,
The heat dissipation structure for an electronic component, wherein the heat dissipation member and the heat dissipation plate are connected on the back surface side.   The heat dissipation structure according to claim 1, wherein the heat dissipation member and the heat dissipation plate are indirectly connected.   The heat dissipation structure according to claim 1, wherein the heat dissipation member penetrates the wiring board.   The heat dissipation structure according to any one of claims 1 to 3, wherein a terminal of the electronic component is soldered on the back surface side by dipping the wiring board. Prepare a wiring board with a front side for placing electronic components and a back side on the opposite side,
Placing the electronic component on the wiring board;
Solder the terminals of the electronic component on the back side,
A heat dissipating member for dissipating a heat dissipating electronic component that needs to dissipate among the electronic components is brought into contact with the heat dissipating electronic component on the surface side,
Connecting the heat radiating member to the heat radiating plate for radiating the heat from the heat radiating member to the outside on the back surface side;
Connecting an end of the heat dissipation member on the back surface side to the heat dissipation plate, and assembling the heat dissipation structure for an electronic component.

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