JP2018024948A - Vacuum evaporation apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum evaporation apparatus that is also suitable for vapor deposition treatment with respect to a large object to be treated.SOLUTION: A vacuum evaporation apparatus 100 includes a workpiece holding mechanism 110 and a raw material vaporization mechanism 120 in a treatment furnace 101 obtained by forming a stainless steel material into a rectangular parallelepiped. In the workpiece holding mechanism 110, a support top board 114 is connected to a base body 111 with a side columnar support 113 interposed therebetween, and a workpiece columnar support 116 is attachably and detachably held between the base body 111 and the support top board 114. The workpiece holding mechanism 110 is disposed at a middle part of a bottom of the treatment furnace 101 and is rotationally driven by a driving motor 118. The raw material vaporization mechanism 120 is configured by disposing a raw material holding tool 123 between a pair of positive and negative electrodes 121. The raw material evaporation mechanism 120 is disposed along an inner wall 103 lying outside the workpiece holding mechanism 110 in the treatment furnace 101.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a vacuum vapor deposition apparatus that vaporizes a vapor deposition raw material made of a solid metal in a vacuum environment and adheres it to the surface of an object to be processed.

  2. Description of the Related Art Conventionally, there is a vacuum vapor deposition apparatus that vaporizes a vapor deposition material made of a solid metal in a vacuum environment and adheres it to the surface of an object to be processed. For example, in Patent Document 1 below, a vapor deposition material is disposed at the center of a processing furnace (vacuum furnace) that accommodates the vapor deposition material and the object to be processed, and the object to be processed can revolve and rotate outside the vapor deposition material. A vacuum deposition apparatus (vacuum forming apparatus) provided with a work holding means (holder) for holding is disclosed.

JP 2010-235971 A

  However, in the vacuum vapor deposition apparatus described in Patent Document 1, an object to be treated is disposed around the vapor deposition material in the processing furnace in consideration that the vapor deposition material vaporized from the solid vapor deposition material radiates radially. Therefore, there is a problem that it is unsuitable for vapor deposition processing on a large object to be processed.

  That is, when performing a vapor deposition process on a large object to be processed in a conventional vacuum vapor deposition apparatus, it is necessary to secure a space for accommodating the large object to be processed around the vapor deposition raw material, and the processing furnace is increased in size and installed space. Is difficult to secure, and the processing efficiency is lowered because a large amount of time and energy is required for evacuation and maintaining the vacuum state by exhausting the air in the processing furnace. .

  The present invention has been made to cope with the above problems, and an object of the present invention is to provide a vacuum vapor deposition apparatus suitable for vapor deposition treatment for a large object to be processed.

  In order to achieve the above object, the present invention is characterized in that, in a vacuum vapor deposition apparatus that vaporizes a vapor deposition raw material made of a solid metal in a vacuum environment and adheres to the surface of the treatment target, The processing furnace to be accommodated, the raw material vaporization means for holding and heating the vapor deposition raw material in the processing furnace, the work holding means for holding the workpiece in the processing furnace, and the air in the processing furnace are sucked in Furnace vacuum means for making the inside of the processing furnace in a vacuum state, the processing furnace is formed in a square shape in plan view, and the raw material vaporizing means is adjacent to the inner wall in the processing furnace and is a diagonal line in the processing furnace. It exists in the state arrange | positioned facing up.

  According to the feature of the present invention configured as described above, in the vacuum vapor deposition apparatus, the raw material vaporization means for vaporizing the vapor deposition raw material is disposed adjacent to the inner wall in the processing furnace, in other words, disposed on the outermost side in the processing furnace. Therefore, even if the volume in the processing furnace is the same as that of the conventional processing furnace in which the deposition raw material is arranged in the central part in the processing furnace, it is possible to perform the deposition process by accommodating a larger object to be processed. . That is, according to the vacuum vapor deposition apparatus according to the present invention, even when vapor deposition is performed on a large workpiece, it can be performed in a space-saving manner, and the time required for generating and maintaining a vacuum state in the processing furnace It is possible to efficiently perform the vapor deposition process while suppressing the mechanical burden and the energy burden.

  Further, according to the feature of the present invention, the vacuum vapor deposition apparatus has the raw material vaporization means disposed in a state of facing the diagonal line in the processing furnace formed in a square shape in a plan view, so that the raw material vaporization means is treated. The corner in the processing furnace can be effectively used while securing an appropriate distance (position where the vaporized vapor deposition material can radiate to the half surface of the object to be processed). In this case, the processing furnace can be configured in a rectangular parallelepiped shape or a cubic shape formed in a rectangular shape or a square shape in a plan view.

  Another feature of the present invention resides in that, in the vacuum vapor deposition apparatus, the raw material vaporizing means is disposed so as to surround the work holding means.

  According to another feature of the present invention configured as described above, according to the vacuum vapor deposition apparatus, since the raw material vaporization means is disposed so as to surround the work holding means, the workpiece is separated from a plurality of positions. Evaporation processing can be performed efficiently. The raw material vaporizing means is preferably arranged evenly when the vapor deposition process is performed over the entire circumference of the work holding means, but when the vapor deposition process is performed on a specific part of the workpiece, the vapor deposition process is performed. It may be arranged at a position corresponding to the part.

  Another feature of the present invention is that, in the vacuum deposition apparatus, the work holding means holds the workpiece and rotates it along the direction in which the raw material vaporizing means is arranged.

  According to another feature of the present invention configured as described above, the vacuum deposition apparatus is configured so that the work holding means holds the object to be processed and rotates along the arrangement direction of the raw material vaporization means. On the other hand, the vapor deposition process can be performed efficiently.

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  Another feature of the present invention is that, in the vacuum evaporation apparatus, the raw material vaporization means includes a pair of positive and negative electrodes extending in a vertical direction between a floor surface side and a ceiling surface side in the processing furnace, and a positive and negative pair. And a raw material holder for holding a vapor deposition raw material, which is composed of a plurality of heating wires installed between the electrodes along the vertical direction.

  According to another feature of the present invention configured as described above, the vacuum evaporation apparatus has a long object to be processed because the material vaporization means holds a plurality of evaporation materials along the height direction of the object to be processed. Therefore, the vapor deposition process can be performed with high accuracy.

  Another feature of the present invention is that in the vacuum deposition apparatus, the processing furnace is a foil-like or plate-like structure made of the same material as the deposition raw material on the wall surface and / or each surface of the component in the processing furnace. The cover body is provided.

  According to another feature of the present invention configured as described above, the vacuum vapor deposition apparatus is made of the same material as the vapor deposition raw material (for example, aluminum material) on at least a part of the inner wall surface of the processing furnace, the raw material vaporizing means, and the work holding means. Since the cover body having a configured foil shape (for example, aluminum foil) or plate shape (for example, aluminum plate) is provided, the vapor deposition raw material that has not adhered to the object to be processed among the vaporized vapor deposition raw materials is covered. It is possible to prevent fouling in the processing furnace by adhering to the substrate, and to efficiently collect the vapor deposition raw material that has not adhered to the object to be processed and to recycle the entire cover body.

  Another feature of the present invention is that, in the vacuum deposition apparatus, a gas supply port for introducing a deposition promoting gas into the processing furnace is further provided on the floor side of the processing furnace.

  According to another feature of the present invention configured as described above, the vacuum vapor deposition apparatus is provided with a gas supply port for introducing a vapor deposition promoting gas into the processing furnace on the floor side in the processing furnace. The vapor deposition promoting gas can be efficiently supplied also to an object to be processed which is a heavy object disposed at the bottom in the processing furnace. As the vapor deposition promoting gas supplied into the processing furnace, argon gas is preferably used when an aluminum material is used as the vapor deposition material, and nitrogen gas is used when a titanium nitride material or a titanium oxide material is used as the vapor deposition material. Oxygen is preferably used when a glass material is used as an evaporation source.

1 is a partially omitted front view showing an outline of an external configuration of a vacuum vapor deposition apparatus according to an embodiment of the present invention. It is sectional drawing which shows schematically the internal structure of the processing furnace in the vacuum evaporation system seen from the 2-2 line shown in FIG. It is a block diagram of the control system which controls the action | operation of the vacuum evaporation system shown in FIG. It is a front view which shows the outline of the external slow effect of the raw material vaporization mechanism in the vacuum evaporation system shown in FIG. FIG. 2 is a partially omitted front view showing a state in which an object to be processed different from the object to be processed shown in FIG. 1 is set in the vacuum vapor deposition apparatus shown in FIG. 1. It is sectional drawing which shows schematically the internal structure of the processing furnace in the vacuum evaporation system seen from the 6-6 line shown in FIG.

  Hereinafter, an embodiment of a vacuum deposition apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a partially omitted front view showing an outline of an external configuration of a vacuum vapor deposition apparatus 100 according to the present invention. FIG. 2 is a cross-sectional view showing an outline of the internal configuration of the processing furnace in the vacuum vapor deposition apparatus 100 as viewed from line 2-2 shown in FIG. FIG. 3 is a block diagram of a control system for controlling the operation of the vacuum vapor deposition apparatus 100 shown in FIG. The vacuum deposition apparatus 100 forms a deposition material M made of vaporized aluminum, titanium oxide, titanium nitride, or silicon dioxide on the surface of a workpiece WK made of resin, metal, ceramic, or wood. It is a mechanical device that is attached in the form of layers or layers.

(Configuration of the vacuum deposition apparatus 100)
The vacuum evaporation apparatus 100 includes a processing furnace 101. The processing furnace 101 is a metal container (for example, made of stainless steel) for performing a vapor deposition process for containing the workpiece WK and the vapor deposition raw material M and attaching the vapor deposition raw material M vaporized on the surface of the workpiece WK. Further, it is formed in a rectangular parallelepiped shape extending upward with respect to the floor surface G on which the vacuum vapor deposition apparatus 100 is installed. The processing furnace 101 is configured with sufficient rigidity so that the shape can be maintained without being deformed even when the internal space is in a vacuum state. Is fixedly installed.

  In addition, the processing furnace 101 includes a door 105 that can be opened and closed via a hinge 104 on one of four side surfaces that rise from the floor G. Thus, two states of being opened through the opening 106 can be selectively performed. In order to ensure rigidity, the door 105 is curved to be convex outward, and a lock handle 103 a is provided on the outer surface of the end opposite to the hinge 104. In the present embodiment, the processing furnace 101 has an internal dimension that is the size of the internal space of the processing furnace 101, a width of 1300 mm, a depth of 1300 mm, and a height of 2500 mm.

  Inside the processing furnace 101, a work holding mechanism 110 and a raw material vaporization mechanism 120 are mainly provided. The workpiece holding mechanism 110 is a device that holds the workpiece WK fixedly or movably in the processing furnace 101, and is provided along the vertical direction at the center in the processing furnace 101. The workpiece holding mechanism 110 mainly includes a base body 111, side columns 113, a support top plate 114, and a workpiece support column 116.

  The base body 111 is a metal (for example, stainless steel) part that supports the workpiece WK via the workpiece support pillar 116, and is freely rotatable via a bearing (not shown) at the center of the bottom of the processing furnace 101. It is attached. The base body 111 includes a ring portion 111a formed in a flat ring shape and overhang portions 111b projecting in the opposite directions from the outer periphery of the ring portion 111a toward the radially outer side. Among these, four support pillars 112a to 112d are equally arranged in the ring portion 111a.

  The column supports 112a to 112d are components for supporting the workpiece support column 116 in an upright state, and are formed in a ring shape having a hole portion into which the workpiece support column 116 can be inserted. Of these support pillars 112a to 112d, the support pillars 112a and the support pillars 112b that are formed on the same straight line on the ring part 111a are fixed to the ring part 111a. The support column 116 is fixedly supported on the ring portion 111a.

  On the other hand, the column support body 112c and the column support body 112d formed on the same straight line on the ring portion 111a are provided so as to be rotatable with respect to the ring portion 111a. Support for rotation on the top. More specifically, the column support bodies 112c and 112d are connected to the base body 111 through a gear (not shown) inside the base body 111, and are driven to rotate according to the rotation of the base body 111. In other words, the workpiece support column 116 supported by the support pillars 112c and 112d is rotationally driven (revolved) along the circumferential direction of the ring portion 111a by the rotational drive of the base body 111, and rotates the support supports 112c and 112d. Rotation drive (spin) as the center.

  The base body 111 is connected to the support top plate 114 via the side columns 113 provided in a standing state on the overhang portions 111b. The side column 113 is a metal (for example, stainless steel) component for connecting the support top plate 114 to the base body 111 and transmitting the rotational driving force of the support top plate 114 to the base body 111. It is formed in a rod shape that extends along the vertical direction.

  The support top plate 114 is a metal (for example, stainless steel) component that transmits a rotational driving force of a drive motor 118 described later to the base body 111 and supports the work support pillar 116 in cooperation with the base body 111. In the state where it is connected to a drive motor 118 provided on the upper surface of the processing furnace 101, it is hung directly under the ceiling surface in the processing furnace 101. The support top plate 114 extends in a direction corresponding to the protruding portion 111b of the base body 111 and has a cross shape in a plan view extending in a direction orthogonal to the same direction, that is, in a direction facing the column support bodies 112b and 112d. Is formed. Further, on the lower surface of the support top plate 114 facing the base body 111, support column fitting portions 115a to 115d (115d are 115d) in which work support columns 116 are detachably fitted at positions corresponding to the support columns 112a to 112d, respectively. (Not shown) are provided.

  The workpiece support column 116 is a metal (for example, stainless steel) part that supports the workpiece WK, and is supported in a standing state by the base body 111 and the support top plate 114 to support the workpiece WK. It is a part made of metal (for example, made of stainless steel), and is formed to extend in a rod shape having a length that can be inserted into the base body 111 and the support top plate 114, respectively. A holding rod 117 for detachably holding the workpiece WK extends in a cross-like branch shape in a plan view at substantially equal intervals along the longitudinal direction of the workpiece support column 116 on the workpiece support column 116. Is provided.

  The drive motor 118 is an electric motor for rotationally driving the entire work holding mechanism 110 via the support top plate 114. The drive motor 118 is disposed on the upper surface of the processing furnace 101, and its rotational drive is controlled by a control device 150 described later. This work holding mechanism 110 corresponds to the work holding means according to the present invention.

  As shown in FIG. 4, the raw material vaporization mechanism 120 is a device for holding and vaporizing the vapor deposition raw material M, and mainly includes an electrode 121 and a raw material holder 123. The electrode 121 is a component made of a conductor (for example, a copper material) for supplying electricity to the raw material holder 123, and is composed of a pair of positive and negative electrodes, that is, a positive electrode and a negative electrode. The electrodes 121 are formed in a bar shape extending in parallel with each other upward from the bottom of the processing furnace 101. In this case, the electrode 121 extends to a height at which the support top plate 114 is provided. The pair of positive and negative electrodes 121 are connected to the power feeding device 122, respectively. The power feeding device 122 is controlled by the control device 150 to supply an alternating current to the raw material holder 123 via the electrode 121.

  The raw material holder 123 is a component for holding and heating the vapor deposition raw material M, and is configured by winding a conducting wire (for example, a tungsten material) in a spiral shape. This raw material holder 123 is installed between a pair of positive and negative electrodes 121 at a predetermined interval along the longitudinal direction of the electrodes 121. In the present embodiment, five raw material holders 123 are provided at substantially equal intervals along the longitudinal direction of the electrode 121. However, the number of arrangement and the arrangement interval are appropriately set according to the workpiece WK and processing conditions. However, the present invention is not limited to this embodiment.

  The raw material vaporization mechanism 120 is provided at a corner where two inner walls 103 in the processing furnace 101 are orthogonal to each other. In the present embodiment, the raw material vaporization mechanism 120 includes two corners on the back side of the four corners in the processing furnace 101 and one corner on the door 105 side and on the hinge 104 side, in other words, It is provided at a corner other than the corner opposite to the hinge 104 on the door 105 side. In this case, each raw material vaporizing mechanism 120 is provided in a direction in which each raw material holder 123 faces the workpiece holding mechanism 110. This raw material vaporization mechanism 120 corresponds to the raw material vaporization means according to the present invention.

  Inside the processing furnace 101, a gas supply port 130 and an air pressure adjusting hole 132 are provided. The gas supply port 130 is a pipe for introducing a vapor deposition accelerating gas for accelerating the vapor deposition process to the workpiece WK into the processing furnace 101, and opens upward in the center of the bottom of the processing furnace 101. Is provided. More specifically, the gas supply port 130 is provided for each type of vapor deposition promoting gas inside the ring portion 111 a of the base body 111 in the processing path 101. In the present embodiment, the gas supply port 130 is provided for each of three three deposition promoting gases, argon gas, nitrogen gas, and oxygen gas.

  These three gas supply ports 130 are connected to gas cylinders (not shown) that store the respective vapor deposition promoting gases via electromagnetic valves 131. The electromagnetic valve 131 is an instrument for adjusting the flow rate of the vapor deposition promoting gas supplied from each gas cylinder, and its operation is controlled by the control device 150. That is, the amount of each vapor deposition promoting gas supplied into the processing furnace 101 is controlled by the control device 150.

  The air pressure adjusting hole 132 is a hole for sucking air from the inside of the processing furnace 101 to bring the inside of the processing furnace 101 into a vacuum state and introducing air from outside into the processing furnace 101 to bring it into an atmospheric pressure state. , And formed through the side wall of the processing furnace 101. The air pressure adjusting hole 132 is connected to the suction pump 133 via a pipe (not shown), and is connected to an atmospheric pressure release valve 134 communicating with the outside. The suction pump 133 is a mechanical device that sucks air from the inside of the processing furnace 101 and controls the inside of the processing furnace 101 to be in a vacuum state by operation control by the control device 150. The atmospheric pressure release valve 134 is a device for adjusting the amount of air from outside introduced into the processing furnace 101 by operation control by the control device 150. The air pressure adjusting hole 132 and the suction pump 133 correspond to the in-furnace vacuum means according to the present invention.

  Further, the outer surface of the inner wall 103 in the processing furnace 101, the base body 111 constituting the work holding mechanism 110, the side support pillar 113, the support top plate 114, and the electrode 121 constituting the raw material vaporization mechanism 120 is covered with the cover body 140. Covered with. The cover 140 is a component for preventing the vaporized vapor deposition material M from directly adhering to the surface of each part exposed inside the processing furnace 101, and is configured by forming the same material as the vapor deposition material M in a foil shape. Has been. In the present embodiment, the cover body 140 is made of an aluminum foil (so-called aluminum foil). 1 and FIG. 2 show a state in which the cover body 140 is provided only on the inner wall surface of the processing furnace 101, but in reality, there are parts (raw material holders 123) that are present in the processing furnace 101 and exposed. (Except for).

  A control device 150 is provided in the vicinity of the processing furnace 101. The control device 150 is configured by a microcomputer including a CPU, a ROM, a RAM, and the like, and comprehensively controls the overall operation of the vacuum vapor deposition device 100. More specifically, the control device 150 executes a control program stored in advance in a storage device such as a ROM in accordance with an instruction from the operator via the operation panel 151, so that the drive motor 118, the power supply device 122, Each operation | movement of the solenoid valve 131, the suction pump 133, and the atmospheric pressure release valve 134 is controlled. The operation panel 151 includes an operation key 151a for inputting support from the operator to the control device 150, and a liquid crystal display device 151b for displaying the operation state of the control device 150, that is, the operation state of the vacuum deposition apparatus 100, to the operator. It is a provided user interface.

(Operation of vacuum deposition apparatus 100)
Next, the operation of the vacuum vapor deposition apparatus 100 configured as described above will be described. An operator who performs the vapor deposition process of the vapor deposition material M on the workpiece WK first turns on the vacuum vapor deposition apparatus 100 to start it, and then places the workpiece WK in the processing furnace 101 in the vacuum vapor deposition apparatus 100. Set to. Specifically, after opening the door 105 of the processing furnace 101, the worker holds the workpiece WK on the base body 111 or the work support column 116 of the work holding mechanism 110 in the processing furnace 101.

  In this case, as shown in FIGS. 5 and 6, when the size of the workpiece WK is large, the worker moves the workpiece support column 116 in the workpiece holding mechanism 110 from the base body 111 and the support top plate 114. The workpiece WK is directly placed on the base body 111 in the removed state. When the size of the workpiece WK is small, the worker holds the workpiece WK by hooking it on the holding rod 117 of the workpiece support column 116 in the workpiece holding mechanism 110 (FIGS. 1 and 2). reference). Note that the workpiece WK shown in FIGS. 5 and 6 is configured in a desk shape in which rods are provided at the four corners of a rectangular flat plate. Moreover, the workpiece WK shown in FIGS. 1 and 2 is formed in a bottomed cylindrical shape with a bottom portion formed in a curved surface.

  Next, the worker sets the vapor deposition material M in the processing furnace 101. Specifically, the operator sets a small piece of vapor deposition raw material M in the raw material holder 123 in the raw material vaporization mechanism 120 in the processing furnace 101. In this case, the operator determines the amount and arrangement position of the vapor deposition material M according to the size of the workpiece WK and the vapor deposition area. In this embodiment, a rod-shaped aluminum material is used as the vapor deposition material M.

  Next, the operator closes the door 105 in the processing furnace 101 and seals the inside of the processing furnace 101, and then operates the operation panel 151 to set processing conditions for the vapor deposition processing on the control device 150. Specifically, the operator sets whether or not the drive motor 118 is rotationally driven, whether or not the vapor deposition accelerating gas is introduced by opening and closing the electromagnetic valve 131, the flow rate, and selection of the material vaporization mechanism 120 to be energized.

  Next, the operator operates the operation panel 151 to instruct the control device 150 to start the vapor deposition process. In response to this instruction, the control device 150 first controls the operation of the suction pump 133 to suck the air in the processing furnace 101 into a vacuum state. Next, after the processing furnace 101 is in a predetermined vacuum state, the control device 150 controls the operation of the power supply device 122 to energize the pair of positive and negative electrodes 121 in the raw material vaporization mechanism 120. In this case, the control device 150 performs rotation driving of the work holding mechanism 110 by rotation driving control of the driving motor 118 and supply of vapor deposition promoting gas by opening / closing control of the electromagnetic valve 131 according to the processing condition setting contents by the operator. .

  Further, in energizing the electrode 121, the control device 150 energizes only the raw material vaporization mechanism 120 specified by the processing condition setting by the operator. Thereby, the energized material vaporizing mechanism 120 heats and vaporizes the vapor deposition material M by the heat generated by the material holder 123. For this reason, a part of the vapor deposition raw material M which is vaporized from the solid vapor deposition raw material M held by the raw material holder 123 and radiates radially adheres to the surface of the workpiece WK. In this case, since the deposition material M adheres to the surface of the workpiece WK facing the material holder 123, the deposition material M is deposited only on a specific surface of the workpiece WK when the work holding mechanism 110 is not rotated. When the workpiece holding mechanism 110 is driven to rotate, the deposition material M adheres to a wide range on the workpiece WK. Thereby, the vapor deposition material M adheres to the surface of the workpiece WK and the vapor deposition process is performed. In addition, other part of the vapor deposition material M radiating from the solid vapor deposition material M held by the material holder 123 adheres to each part in the processing furnace 101.

  Next, the controller 150 stops energization of the raw material vaporization mechanism 120 after energizing the raw material vaporization mechanism 120 for a predetermined time, that is, after performing a necessary vapor deposition process on the workpiece WK. In this case, when the drive motor 118 and / or the electromagnetic valve 131 are in an operating state, the control device 150 stops the operation of the drive motor 118 and / or the electromagnetic valve 131 as well as the energization of the raw material vaporization mechanism 120 is stopped. Let Next, the control device 150 controls the atmospheric pressure release valve 134 to open and introduces air into the processing furnace 101 to bring the inside of the processing furnace 101 to atmospheric pressure, and then the inside of the processing furnace 101 becomes atmospheric pressure. In this case, the atmospheric pressure release valve 123 is closed.

  Thus, the operator can open the door 105 and take out the workpiece WK on which the vapor deposition process has been performed from the processing furnace 101. In addition, the operator can replace the cover body 140 when the deposition material M is heavily attached to the inner wall surface or each component in the processing furnace 101. In this case, the removed cover body 140 can be reused as a recycling resource.

  As can be understood from the above operation description, according to the above embodiment, the vacuum vapor deposition apparatus 100 is arranged such that the raw material vaporization mechanism 120 for vaporizing the vapor deposition raw material M is arranged adjacent to the inner wall in the processing furnace 101, in other words, the processing furnace. 101 is disposed at the outermost side in 101, so that the workpiece to be processed is larger even if the volume in the processing furnace is the same as that of the conventional processing furnace in which the vapor deposition raw material M is arranged in the central portion in the processing furnace 101. VK can be accommodated and a vapor deposition process can be performed. That is, according to the vacuum vapor deposition apparatus 100 according to the present invention, it is possible to save space even when performing vapor deposition on a large workpiece WK, and to generate and maintain a vacuum state in the processing furnace 101. The deposition process can be efficiently performed while suppressing the time burden and energy burden required for the process.

  Furthermore, in carrying out the present invention, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the object of the present invention.

  For example, in the above-described embodiment, the vacuum vapor deposition apparatus 100 performs the vapor deposition process in a state in which the work support column 116 in the work holding mechanism 120 is held by the support receivers 112c and 112d and the column fitting portions 115c and 115d and does not rotate. I did it. However, the vacuum vapor deposition apparatus 100 can perform the vapor deposition process in a state where the work supporting column 116 in the work holding mechanism 120 is held by the support receiving bodies 112a and 112b and the column fitting portions 115a and 115b and rotated. Of course.

  In the above embodiment, the work holding mechanism 120 is configured to be rotationally driven in the processing furnace 101. However, the workpiece holding mechanism 120 only needs to hold the workpiece WK. Therefore, the workpiece holding mechanism 120 can also be configured to hold the workpiece WK fixedly in the processing furnace 101.

  Moreover, in the said embodiment, the processing furnace 101 was formed in the square shape by planar view. However, the processing furnace 101 can be formed in a shape other than a square shape, for example, a circular shape, an elliptical shape, or a polygonal shape such as a triangular shape or a hexagonal shape in a plan view.

  In the above embodiment, the raw material vaporization mechanism 120 is disposed at three corners of the four corners of the processing furnace 101. However, at least one raw material vaporization mechanism 120 may be provided adjacent to the inner wall 103 in the processing furnace 101. Therefore, the raw material vaporization mechanism 120 may be disposed at, for example, all four corners of the processing furnace 101 (see the two-dot chain line in FIG. 6), or may be disposed at one of the four corners of the processing furnace 101. Good. Further, the raw material vaporization mechanism 120 may be provided adjacent to one inner wall 103 in the processing furnace 101 (for example, in the central portion of the inner wall 103). In these cases, the inner wall 103 is preferably a side wall constituting the inside of the processing furnace 101, but may be a bottom surface or a ceiling surface.

  Moreover, in the said embodiment, the vacuum evaporation system 100 was comprised so that the inner wall 103 in the processing furnace 101, the workpiece | work holding mechanism 110, and the raw material vaporization mechanism 120 might be covered with the cover body 140. FIG. However, if the vacuum deposition apparatus 100 is configured to cover at least a part of the cover body 140 with the inner wall 103, the workpiece holding mechanism 110, and the raw material vaporization mechanism 120 in the processing furnace 101, the inside of the processing furnace 101 at the corresponding location is provided. It is possible to prevent fouling and recover the vapor deposition raw material M. Further, the vacuum vapor deposition apparatus 100 can be configured by omitting the cover body 140 when it is not necessary to consider the prevention of contamination in the processing furnace 101 and the recovery of the vapor deposition raw material M.

  Moreover, in the said embodiment, the vacuum evaporation system 100 performed the vapor deposition process by setting the vapor deposition raw material M of the same material to the three raw material vaporization mechanisms 120, respectively. However, the vacuum vapor deposition apparatus 100 sets the vapor deposition raw materials M of different materials (for example, titanium nitride, titanium oxide, silicon dioxide, etc.) to the three raw material vaporization mechanisms 120 and sets the three raw material vaporization mechanisms 120 at different timings. By energizing with, it is possible to perform a vapor deposition process in which a layer for each vapor deposition material is laminated on the surface of the workpiece WK. In this case, the vacuum vapor deposition apparatus 100 may appropriately supply the vapor deposition promoting gas from the gas supply port 130 according to the timing at which each vapor deposition raw material M is vaporized.

WK ... workpiece, M ... raw material for vapor deposition, G ... ground,
100: Vacuum deposition apparatus,
DESCRIPTION OF SYMBOLS 101 ... Processing furnace, 102 ... Base, 103 ... Inner wall, 104 ... Hinge, 105 ... Door, 106 ... Opening part,
DESCRIPTION OF SYMBOLS 110 ... Work holding | maintenance mechanism, 111 ... Base body, 111a ... Ring part, 111b ... Overhang | projection part, 112a-112d ... Column support body, 113 ... Side column, 114 ... Supporting top plate, 115a-115d ... Column support part, 116 ... work support column, 117 ... holding rod, 118 ... drive motor,
120 ... Raw material vaporization mechanism, 121 ... Electrode, 122 ... Feeding device, 123 ... Raw material holder,
130 ... Gas supply port, 131 ... Solenoid valve, 132 ... Air pressure adjusting hole, 133 ... Suction pump, 134 ... Atmospheric pressure release valve,
140: Cover body.

Claims (6)

In a vacuum deposition apparatus that vaporizes a deposition material made of a solid metal in a vacuum environment and adheres it to the surface of the object to be processed,
A processing furnace for accommodating the vapor deposition material and the object to be processed, and
Raw material vaporization means for holding and heating the vapor deposition raw material in the processing furnace,
A workpiece holding means for holding the workpiece in the processing furnace;
In-furnace vacuum means for sucking air in the processing furnace and making the inside of the processing furnace a vacuum state,
The processing furnace is
It is formed in a square shape in plan view,
The raw material vaporization means includes:
A vacuum vapor deposition apparatus characterized by being disposed adjacent to an inner wall in the processing furnace and facing a diagonal line in the processing furnace. In the vacuum evaporation apparatus according to claim 1,
The raw material vaporization means includes:
A vacuum vapor deposition apparatus characterized in that it is disposed so as to surround the work holding means. In the vacuum evaporation system according to claim 2,
The workpiece holding means is
A vacuum deposition apparatus, wherein the object to be processed is held and rotated along a direction in which the raw material vaporization means is disposed. In the vacuum evaporation system according to any one of claims 1 to 3,
The raw material vaporization means includes:
A pair of positive and negative electrodes extending along the vertical direction between the floor side and the ceiling side in the processing furnace;
A vacuum deposition apparatus, comprising: a raw material holder configured to include a plurality of heating wires installed between the pair of positive and negative electrodes along the vertical direction, and configured to hold the deposition raw material. In the vacuum evaporation system according to any one of claims 1 to 4,
The processing furnace is
A vacuum vapor deposition apparatus characterized in that a foil-like or plate-like cover body made of the same material as the vapor deposition raw material is provided on a wall surface and / or each surface of a component in the processing furnace. The vacuum evaporation apparatus according to any one of claims 1 to 5, further comprising:
A vacuum vapor deposition apparatus, wherein a gas supply port for introducing a vapor deposition promoting gas into the processing furnace is provided on the floor side of the processing furnace.

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