JP2018022583A - Induction heating cooker - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an induction heating cooker in which circuit noise is less likely to occur due to component mounting that maximizes a circuit pattern area, and which realizes stable IH operation and low noise operation by a ventilation path with suppressed ventilation resistance. SOLUTION: A top plate 2 installed on the upper surface of a main body 1, a first heating coil 3a provided below the top plate, and a first heating coil are arranged below the first heating coil, and high frequency power is supplied to the first heating coil. For supplying the first substrate 7a, the first metal supporting plate 1a on which the first substrate is mounted, the second heating coil 3a provided below the top plate, and the second heating coil below the second heating coil. The second substrate 7b, which is arranged and supplies high-frequency power to the second heating coil, and the second metal supporting plate 1b on which the second substrate is mounted are provided. An induction cooker in which the second metal supporting plate is arranged higher than the substrate and the second metal supporting plate is arranged higher than the first metal supporting plate. [Selection diagram] Fig. 6

Description

  The present invention relates to an induction heating cooker.

  An induction heating cooker is a device that performs cooking by using Joule heating due to eddy currents generated at the bottom of a pan when magnetic lines generated by passing a high-frequency current through a heating coil pass through a metal pan. Since heat is generated not only from the pan but also from the heating coil and the substrate that controls the heating coil during heating, air cooling is performed using a fan device.

  In addition, the induction heating cooker arranged in the system kitchen is mainly composed of cooking such as grilled fish in a heating chamber (grill chamber) equipped with a heat source such as an electric heater, in addition to induction heating of the cooking pan on the top plate. It is.

  In a conventional induction heating cooker, the main components that have a large calorific value and are to be cooled are a plurality of heating coils and a substrate. The heating coil is placed directly under the top plate above the main body, and the substrate is surplus on the side of the grill cabinet. The structure accommodated in space is common (patent document 1).

  Further, in order to efficiently heat the cooking pan with the heating coil, it is important to optimally lay out the electronic components of the inverter circuit that supplies power to the heating coil. In general, the optimum layout means that components are arranged in an ideal circuit pattern in which the distance between components is narrow (high integration) and is not easily affected by noise from other electronic components such as a power supply.

  In Patent Document 2, there is a control board (board) having a control unit that drives and controls the heating unit below the heating unit (heating coil) support plate, and the fan motor (fan device) generates heat from the components on the control board. They are cooled, and they are also housed in a box-like outer shell (main body) provided with an opening in the upper part provided below the heating part support plate. Therefore, the circuit board is configured such that the control board is configured on one side like the induction heating cooker described in Patent Document 2 and there is no wiring (jumper wire etc.) between the boards or between the electronic parts on the board. A circuit that is effective in improving efficiency and that has good heating efficiency can also suppress the generation of electromagnetic noise.

  On the other hand, in an induction heating cooker, the greater the heating power, the quicker and more efficiently the cooking pan can be heated, which improves usability. For example, a large amount of hot water required for boiling noodles can be boiled quickly. Therefore, the maximum heating power (input power) of the induction heating cooker tends to increase to 3 kW or more, and the electromagnetic noise of the board increases with the large heating power.

JP 2011-3372 A JP 2014-142125 A

  A conventional general induction heating cooker such as Patent Document 1 has a circuit configuration in which a plurality of substrates are divided and stacked on the side of the grill cabinet and have a plurality of wirings connecting the substrates ( (There is a limit to optimization), and the heating efficiency is deteriorated. Due to the electromagnetic noise generated in the dense boards and electronic components, adverse effects such as malfunction and circuit loss (heat generation) are likely to occur. In order to reduce the influence of noise between the stacked substrates, an aluminum sheet or a metal plate is inserted below each substrate to magnetically shield it. However, the magnetic shield increases costs. .

  Further, the fan device for cooling the heating coil and the substrate is housed in a narrow space, and various members are arranged close to each other in the vicinity of the intake / exhaust portion of the fan device. For this reason, the turbulence of the intake air flow due to the wind speed distribution caused by the arrangement of the members and the increase of the ventilation resistance deteriorate the blowing performance of the fan device, resulting in a decrease in component cooling performance and an increase in fan noise.

  On the other hand, in the case of an induction heating cooker having a grill cabinet which is the most mainstream configuration, as in Patent Document 2, it is not possible to store a plurality of fan devices and substrates arranged in one plane between the grill cabinet and the top plate. The volume is insufficient. In a general system kitchen, the gap between the grill cabinet and the top plate is only about 60 mm, and the grill cabinet is about half the width of the main body. For this reason, when it is going to store a board | substrate in a main body by arrange | positioning on a substantially identical surface, the clearance gap of the height direction from a grill warehouse to a heating coil will be about 20-30 mm, and a component mounting volume is conventionally (patent document 1). Also decreases. Here, a heat sink is mounted on the substrate to dissipate and dissipate electronic components that generate high heat, and a heat sink having a height of about 40 to 50 mm is used for the substrate stacked and stored on the side of the grill cabinet. The cooling of electronic components that generate high heat is determined by the volume of the heat sink and the amount of air flowing through the heat sink. Therefore, if the heat sink volume is reduced, a large fan device with high pressure is required. In other words, it is impossible to simply store the substrates stacked on the side of the grill cabinet side by side under the heating coil.

  Further, in Patent Document 2, the substrates are arranged at the same height below the heating coil, and the electromagnetic noise generated for each inverter easily propagates in the horizontal direction. The larger the heating power, the more stable operation is caused by the influence of the electromagnetic noise. It tends to occur. Since most of the substrate is disposed below the heating coil, all the substrates are easily affected by electromagnetic noise caused by the heating coil.

  In view of this, the present invention achieves both induction of IH operation that is stable during cooking and electromagnetic noise from the substrate, and low noise operation by the airflow path that suppresses ventilation resistance by mounting components with the circuit pattern area being maximized. It is an object to provide a cooking device.

  In order to solve the above problems, an induction heating cooker according to the present invention includes a top plate installed on an upper surface of a main body, a first heating coil provided below the top plate, and the first heating coil. A first substrate disposed below and supplying high frequency power to the first heating coil, a first metal support plate on which the first base is placed, and a second substrate provided below the top plate The second heating coil, a second substrate that is disposed below the second heating coil and supplies high-frequency power to the second heating coil, and a second metal support plate on which the second base is placed The second substrate is disposed higher than the first substrate, and the second metal support plate is disposed higher than the first metal support plate.

  ADVANTAGE OF THE INVENTION According to this invention, the induction heating cooking appliance which can reduce the influence of the electromagnetic noise between board | substrates and can achieve high cooling performance, and can implement | achieve comfort by low noise driving | operation can be provided.

The perspective view of the induction heating cooking appliance of Example 1. 1 is an exploded perspective view of the induction heating cooker shown in FIG. Side sectional view cut along line AA shown in FIG. 1 is an exploded perspective view of the fan device shown in FIG. Front sectional view cut along line BB shown in FIG. Front sectional view cut along line CC shown in FIG. The layout of the board and fan device in the board cover cut along the line DD shown in FIG. Side sectional view when the heating coil of FIG. 1 is installed 1 is an exploded perspective view of the heating coil of FIG. Side surface sectional drawing of the induction heating cooking appliance of Example 2. Sectional drawing of the modification of the induction heating cooking appliance of Example 1.

  Embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In addition, on the basis of the user's line of sight relative to the induction heating cooker Z (see FIG. 1), as shown in FIG.

  The induction heating cooker Z of a present Example is an apparatus which generates an eddy current at the bottom of a cooking pot (not shown) made of metal and generates the cooking pot itself by Joule heat due to the eddy current. This eddy current is generated at the bottom of the pan by flowing a high frequency current of, for example, 20 kHz or more through the heating coil to change the magnetic flux with time. Below, the built-in type IH (Induction Heating) cooking heater provided with the grill warehouse which heats to-be-cooked material with an electric heater etc. is explained as an example.

  FIG. 1 is a perspective view of an induction heating cooker Z according to the first embodiment, and FIG. 2 is an exploded perspective view of FIG. As shown here, the induction heating cooker Z mainly includes the main body 1, the top plate 2, the heating coils 3a, 3b, and 3c, and the substrates 7a and 7b placed on the substrate bases 73a and 73b, Substrate covers 6a and 6b provided to cover the substrates 7a and 7b, and a fan device 9 are provided.

  In addition, the grill compartment 5 on the left side of the front face of the main body 1 is provided with an insertion port 5b for slid back and forth to install an object to be cooked (not shown). An operation panel P <b> 2 for mainly adjusting the heating condition in the grill 5 is provided on the front right side of the main body 1.

  5 is a front sectional view taken along line BB shown in FIG. 1, and FIG. 6 is a front sectional view taken along line CC shown in FIG. The heating chamber 50 in the grill cabinet 5 is a space in which cooked food such as fish is placed, for example, and an electric heater (upper heater 51 and lower heater 52) as a heat source, cooking fish, and the like are placed thereon. It has a grill 54 and a tray 53 arranged below the grill 54. The heating chamber 50 is disposed in a left region in the main body 1 when viewed from above, and an inner tray 53 and the like can slide in the front-rear direction with respect to the main body 1.

  Note that the heat source of the heating chamber 50 is not limited to the electric heater, and the food may be heated by microwaves, water vapor, or a combination thereof. Further, a temperature controller may be provided and oven heating may be performed. FIG. 1 shows an induction heating cooker Z provided with a grill 5 having a size of ½ or more of the main body width.

  The top plate 2 includes three pan mounting parts 21a, 21b, 21c corresponding to the installation positions of the three heating coils 3a, 3b, 3c, an operation part 22 for adjusting the heating of the cooking pot, and an exhaust. And an opening H2. The exhaust opening H2 is a plurality of holes for discharging air blown from the fan device 9, and is provided at the rear (right side / left side) of the top plate 2.

  3 is a side cross-sectional view taken along line AA shown in FIG. The fan device 9 and the substrate covers 6a and 6b (see FIG. 2) are connected via the air duct 63, and the substrate 7a is cooled by the air sucked through the air inlet 9a of the fan device 9. This configuration also has an effect of suppressing the temperature rise of the substrate cover 6a caused by providing the substrate 7a and the heating coil 3a close to each other via the substrate cover 6a. Since the heating coil 3a during cooking rises to a temperature close to about 200 ° C., the temperature of the substrate cover 6a rises due to the radiant heat of the heating coil 3a. Since the air duct 63 that guides the board cover 6a flows from the lower side toward the board cover 6a, thermal deformation due to radiant heat can be suppressed.

  An intake opening H <b> 1 for taking in air from the outside by driving the fan device 9 is provided on the back side of the main body 1. Air blown out from the fan device 9 into the main body 1 is discharged from an exhaust opening H2 provided behind the top plate 2.

  As shown in FIG. 3, the heating coil 3a is cooled, and the air (F2) flowing through the gap between the substrate cover 6a and the top plate 2 is discharged toward the exhaust opening H2 at the rear of the main body 1. The exhaust opening H2 is covered with an exhaust cover 25 in which a plurality of small-diameter holes are provided in a metal plate, so that liquid (not shown) that flows when spillage occurs on the top plate is difficult to enter. Yes. The exhaust cover 25 is detachable and can be removed and cleaned when it becomes dirty.

  In addition to the rear of the main body 1, for example, if an intake opening is provided on the lower front side, relatively low temperature air can be easily taken into the main body 1. Further, by providing the intake opening H1 on the back side far from the grill 5 located on the left side (see FIG. 2), it is difficult to suck in high-temperature air from the intake opening H1.

  8 is a side sectional view of the heating coil 3a installed on the substrate cover 6a, and FIG. 9 is an exploded perspective view of the heating coil 3a. As shown in FIG. 8 and FIG. 9, the heating coil 3a is mounted on a coil base 31 in which rod-like ferrite 33, which is a magnetic body, is radially incorporated. For example, an elastic spring or the like is used. It is hold | maintained by the three support parts 32 via the outer periphery support groove | channel 31a. The ferrite 33 is arranged so that the magnetic flux around the heating coil 3a generated by the high-frequency current supplied from the inverter board 7a to the heating coil 3a is directed to the cooking pot. The ferrite 33 may be fan-shaped instead of rectangular with respect to the heating coil. If it is fan-shaped, it becomes easy to cover the lower surface of the heating coil with ferrite, and leakage of magnetic flux can be reduced.

  The support portion 32 is installed on the substrate covers 6a and 6b and the casing 90a (see FIG. 2), and supports the coil base 31 from below. In the present embodiment, the support portion 32 is constituted by a spring inserted into the support groove 31a, and the coil base 31 is pressed against the top plate 2 while positioning the heating coil 3a, and the heating coil 3a and the top plate 2 are pressed. Are in close proximity.

  The heating coils 3a, 3b, and 3c are installed below the top plate 2, and a temperature sensor 34 that detects the temperature of the pan bottom is installed near the center. The heating coils 3a, 3b, and 3c are disposed on the downstream side of the fan device 9, and after the cooling air blown from the fan device 9 cools the substrates 7a and 7b in the substrate covers 6a and 6b, The heating coils 3a, 3b and 3c are cooled via the front discharge part 60a. The heating coils 3 a, 3 b, and 3 c are coils through which high-frequency current flows when the inverter circuit is driven, and are placed on the coil base 31. In this embodiment, the heating coils 3a, 3b, and 3c are provided one by one on the right, left, and center back in plan view. The coil base 31 is supported by three support portions 32 (for example, springs), and an upward biasing force is given by the support portions 32. Thereby, the heating coil is pressed against the lower surface of the plate 2, and the distance between the cooking pot and the heating coils 3a, 3b, 3c is kept constant.

  Near the center of the coil base 31, a contact-type temperature sensor 34 such as a thermistor for detecting the temperature of the cooking pot indirectly from the contact temperature with the top plate 2 is arranged via a sensor base 34a. The sensor base 34a is provided with a shaft portion (not shown) penetrating the support hole 31b in the center of the coil base 31, and the temperature sensor 34 on the sensor base 34a is topped by a spring 34b provided on the shaft portion. It is configured to press against the plate 2. The smaller the gap between the heating coil 3a and the top plate 2, the better the electrical coupling with the cooking pan. Therefore, the smaller the gap, the more efficient the heating. The heating coil 3a of the present embodiment has a configuration in which a litz wire obtained by twisting a plurality of strands is spirally wound, and the heating coil 3a is composed of an outer litz wire 30a and an inner litz wire 30b, and is formed in a donut shape in the radial direction. It has a divided structure. The configuration as described above is an effective arrangement for uniformly heating the cooking pan. If a temperature sensor is separately provided between the outer litz wire 30a and the inner litz wire 30b, A sensor can be arranged at a position close to the maximum temperature part, and the cooking pot temperature can be appropriately controlled. Here, the temperature sensor may be a non-contact sensor such as an infrared sensor instead of the thermistor.

  The cooking pot is placed on the pan placing portion 21a of the top plate 2, and the heat treatment is started by operating the operation portion 22 (see FIG. 1) by the user. The operation unit 22 is a touch key and can be operated by touching a key printed on the top plate 2.

  A high frequency current is supplied from the inverter circuit to the heating coil 3a located below the cooking pan in response to a command from a control device (not shown), and the cooking pan is induction-heated. When the cooking pan is induction-heated by the heating coil 3a, the high heating element 72 and the electronic component 71 constituting the inverter circuit generate heat in addition to the heating coil 3a.

  With the start of the heat treatment, the fan device 9 is driven in response to a command from a control device (not shown). When the fan device 9 is driven, a negative pressure is generated at the inlet of the impeller 91, and air flowing from the intake opening H1 through the chamber portion F0 is taken into the fan device 9. The air discharged from the fan device 9 is diverted to the substrate covers 6a and 6b via the discharge ports 64a and 64b of the blower duct 63, and absorbs heat from the heat sink 8a on the substrate 7a. The high heat generating element 72 is cooled by heat radiation through the heat sink 8a, and the other electronic components 71 mounted on the substrate 7a are also cooled by heat exchange with air. The air that has cooled the substrate 7a flows from the discharge part 60a above the substrate cover 6a toward the heating coil 3a, cools the heating coil 3a, and is then discharged through the exhaust opening H2.

  Next, the configuration unique to this embodiment will be described in detail with reference to FIGS. As shown in FIG. 2 and the like, the main body 1 is a housing having an outer shell corresponding to a space (predetermined left / right width / front / rear width / height) in which the induction heating cooker Z is installed, and the upper part is opened. It has a box shape (concave shape). The main body 1 is provided with a lower left grill box 5 and metal partition plates 1a and 1b (metal support plates) that divide the space between the grill box 5 and the substrates 7a and 7b vertically. The substrates 7a and 7b placed on the substrate stands 73a and 73b are arranged on the partition plates 1a and 1b, respectively. Here, the partition plates 1 a and 1 b are flat plates made of sheet metal, for example, and have a step 10 in the vertical direction of the main body 1. That is, the partition plate 1b is disposed so as to be higher than the substrate 7a.

  This is because the generation positions of noise generated on the substrates when the substrates 7a and 7b are driven simultaneously are also staggered in the vertical direction, and the noise from the upper substrate 7b toward the lower substrate 7a is shielded by the upper partition plate 1b. At the same time, noise from the lower substrate 7a toward the upper substrate 7b is also shielded by the partition plate 1b, and the planar influence of electromagnetic noise propagating in the horizontal direction is reduced.

  The step 10 between the partition plate 1a and the partition plate 1b is preferably larger than the height of the electronic component on the lower substrate 7a, and the partition plate 1b is disposed higher than the upper end of the electronic component on the substrate 7a. . For example, when the tallest electronic component on the board 7a is a capacitor having a height of about 20 mm, the electromagnetic noise can be sufficiently suppressed by setting the step 10 to a component height of about 20 mm or more. Yes, more stable IH operation can be realized.

  In this embodiment, the partition plates 1a and 1b are formed of individual flat plates, but may be a continuous configuration integrally formed by bending. Alternatively, for example, unevenness may be provided by drawing or the like, which may be used for improving mechanical strength and for heat insulation by an air heat insulating layer. In the main body 1, the right side of the grill cabinet 5 is normally a cavity (chamber portion F 0), so that the partition plate 1 a can be easily disposed below the partition plate 1 b, and the illustrated vertical step 10 is configured. In addition, the fan apparatus 9 is arrange | positioned under the partition plate 1a, ie, the chamber part F0 of the right side of the grill warehouse 5, and it becomes the structure to which cooling air is supplied from the downward direction of the board | substrate 7a. Therefore, the substrates 7a and 7b can be mounted in an area that occupies most of the main body 1 in a top view. This makes it easier to mount components with less electromagnetic noise more efficiently by maintaining the tolerance of the circuit pattern of each substrate and configuring the line with an appropriate wiring distance.

  The substrates 7a and 7b are covered with substrate covers 6a and 6b, respectively, and the heating coils 3a, 3b and 3c, the display unit P1 and the like are installed above the substrate covers 6a and 6b, and the top is covered with a top. Plate 2 is installed. Here, the electronic component 71 on the boards 7a and 7b is an integrated circuit, an inverter circuit, a capacitor, a resistor, or the like used for supplying a high-frequency current to the heating coils 3a and 3b or driving the fan device 9. is there. The board bases 73a and 73b are insulating members (resin members) for fixing the boards 7a and 7b, and are fixed to the inner wall of the main body 1 and the partition plates 1a and 1b.

  Here, in the present embodiment, an inverter circuit for inductively heating a non-magnetic metal pan such as an aluminum pan or a copper pan is mounted on the right substrate 7a located above the fan device 9, and compared with the left substrate 7b. The heat generating element 72 and the heat sink 8a on which the high heat generating element 72 is installed and the number of electronic components 71 such as capacitors are large. This is because it is an inverter circuit that requires a high-frequency current of about 90 kHz (about four times that of induction heating of a magnetic metal pan) for induction heating of a nonmagnetic metal pan. Here, the induction heating of the nonmagnetic metal pan has lower heating efficiency than the magnetic metal pan, and the amount of heat generated by the high heat generating element 72 and the heating coil 3a on the substrate 7a increases. In the present embodiment, the inverter circuit for induction heating the non-magnetic metal pan is mounted on the right substrate 7a close to the fan device 9, so that the high-pressure cooling air can be efficiently supplied. In addition, since electromagnetic noise is likely to occur, the influence of noise from the substrate 7a to the substrate 7b can be reduced by arranging the substrate 7a at a lower position than the substrate 7b. The substrate 7a may be an inverter circuit that induces a magnetic metal pan. In addition, as in the present embodiment, a configuration in which the lower part of the pan mounting part 21 of all three openings is not the heating coils 3a, 3b, 3c but an electric heater (radiant heater) instead of the heating coil 3c may be used. . In the present invention, an inverter circuit that supplies a high-frequency current to at least two heating coils having a large heating power may be arranged separately on the left and right substrates 7a and 7b.

  Here, since the IH cooking heater provided with the grill cabinet 5 is taken as an example, as shown in FIG. 6, the fan device 9 is provided below the lower right substrate 7a where the grill cabinet 5 is not disposed. However, in the case of an IH cooking heater that does not include the grill cabinet 5, as shown in FIG. 11, a fan device 9 is provided below the upper left substrate 7b, and an inverter circuit for induction heating a nonmagnetic metal pan is mounted on the substrate 7b. It is good also as a structure. In this case, the main body 1 can be made thinner than when the fan device 9 is provided below the lower right substrate 7a.

  FIG. 4 is a perspective view of the fan device 9 provided below the partition plate 1a. The fan device 9 is a centrifugal fan including an impeller 91, casings 90 a and 90 b provided with the impeller 91 sandwiched therebetween, and a motor 92 that penetrates the casing 90 a and is connected to the impeller 91. That is, the impeller 91 is housed in a space surrounded by the casing 90a provided with the motor 92 and the casing 90b provided with the air inlet 9a, and the rotating shaft 92a of the motor 92 is prevented from contacting the casings 90a and 90b. Is supported rotatably. Therefore, the fan device 9 has the rotating shaft 92a of the impeller 91 in the vertical direction of the main body 1, sucks air from below, blows out air toward the side ventilation duct 65, and heat sinks of the substrates 7a and 7b shown in FIG. Cooling air is supplied to 8a and 8b. The intake port 9a of the casing 90b has a bell mouth shape (not shown).

  As shown in FIG. 3, a cavity (chamber part F0) is formed on the lower side of the partition plate 1a in which the fan device 9 is housed, that is, on the right side of the grill box 5. The chamber F0 provided between the intake opening H1 and the fan device 9 relaxes the wind speed distribution of the air flowing in from the intake opening H1, and supplies a less turbulent airflow along the bell mouth of the intake opening 9a. Therefore, the separation of the flow at the impeller 91 downstream of the intake port 9a can be suppressed, and the impeller 91 can blow air while working efficiently. Therefore, the fan device 9 can keep the rotational speed for obtaining the required cooling air volume low. Therefore, the fan device 9 can be rotationally driven with low noise and a large air volume, and becomes an induction heating cooker with low operation sound.

  That is, when the fan device 9 is incorporated in the induction heating cooker Z, a predetermined pressure increase of the impeller 91 can be secured, so that it is not necessary to increase the number of rotations more than necessary, and operation is possible with low noise. The fan device 9 is arranged below the partition plate 1a (see FIG. 2), and is configured to easily accommodate an impeller having a large diameter and a large blade width (impeller outlet height). Here, in this embodiment, the centrifugal fan having the rotating shaft of the impeller 91 in the vertical direction of the main body 1 is used, but the fan device 9 may be an axial fan or the like. However, the configuration in which the large air volume fan is efficiently mounted in the space on the side of the grill cabinet 5 is the configuration of this embodiment.

The fan device 9 in induction heating cooking has a sufficient air flow resistance (for example, 100 to 200 Pa) in the main body 1, and the air flow necessary for cooling at a low speed rotation (the air flow characteristic of sufficient pressure-air flow). For example, 1.0 to 1.5 m ³ / min) can be obtained, so that the substrates 7a and 7b and the heating coils 3a, 3b, and 3c can be efficiently cooled, and the operation noise during use is reduced by low-speed rotation. Becomes easy.

  The air blown from the fan device 9 flows on the substrate 7a installed in the gap between the substrate stand 73a and the substrate cover 6a (F1), and the substrate cover toward the heating coil 3a installed on the substrate cover 6a downstream thereof. It flows through the gap between 6a and the top plate 2 (F2).

  As shown in FIGS. 2 and 3, the board 7a, 7b on which the electronic component 71 is mounted and the fan device 9 for allowing air to flow through the air passages in the board covers 6a, 6b are provided on the top plate 2. Since it is arranged on the exhaust opening H2 side, a right region space (chamber portion F0) in the main body 1 shown in FIG. 5 showing a front cross section of the heating coil 3c and FIG. 6 showing a front cross section of the heating coils 3a and 3b. ). Further, as shown in FIG. 6, in this embodiment, the substrate 7a is disposed below the right heating coil 3a, and the substrate 7b is disposed below the left heating coil 3b, and the right heating coil is disposed on the substrate 7a. An inverter circuit for supplying power to 3a is mounted on the substrate 7b, and an inverter circuit for supplying power to the left heating coil 3b and the back heating coil 3c is mounted. The substrates 7a and 7b are respectively arranged in a space in which the substrate base 73a and the substrate cover 6a and the substrate base 73b and the substrate cover 6b are vertically combined, and the inside of the space becomes an air flow path (F1). The substrate covers 6a and 6b have a structure that covers at least the upper surfaces of the charging portions of the substrates 7a and 7b.

  FIG. 7 is a layout of the board and the fan device in the board cover cut along the line DD shown in FIG. As shown in FIG. 7, the boards 7a and 7b on the partition plates 1a and 1b occupy most of the main body, and electronic components are mounted on almost the entire surface. A heat sink 8a of the substrate 7a is disposed in the vicinity of the downstream side of the discharge port 64a communicating with the air duct 63 downstream of the fan device 9. Further, cooling air is supplied to the heat sink 8b of the substrate 7b through a ventilation duct 65b extending from the discharge port 64b. The heat sinks 8 a and 8 b are heat radiators that absorb heat from the high heat generating element 72, which is an electronic component with high heat generation, and dissipate heat to the air flowing in through the fan device 9. Each of the heat sinks 8a and 8b has fins (not shown) having a predetermined surface area, and is installed on the substrates 7a and 7b. The air discharged from the fan device 9 is guided to the heat sinks 8a and 8b from the two discharge ports 64a and 64b through the ventilation duct 65 as the motor 92 is driven. Since the heat generating elements 72 constituting the inverter circuit are installed in the heat sinks 8a and 8b, a high cooling performance can be obtained by arranging them on the upstream side near the fan device 9.

  In the above-described embodiment, the example in which the rotation axis of the impeller 91 of the fan device 9 is the vertical direction of the main body 1 is shown. However, the rotation axis may be provided in the horizontal direction of the main body. For example, when the rotation shaft is provided in the front-rear direction of the main body 1, the intake ports 9a of the casings 90a and 90b may be set to the front or rear direction of the main body, and the discharge port 95 may be set to the upper direction of the main body.

  According to the present embodiment, when the substrates 7a and 7b are arranged on the entire surface of the main body 1 when viewed from above, electronic mounting that maximizes the circuit pattern area is possible, and the inverter circuit and the power supply circuit can be efficiently used with an optimum circuit pattern. You can layout well. In addition, since the restriction on the component mounting area is relaxed, it is possible to arrange electronic components with excellent noise resistance and cooling efficiency. Furthermore, the board 7a that feeds the right heating coil 3a and the board 7b that feeds the left heating coil 3b are arranged apart from each other in the vertical direction of the main body, and electromagnetic noise generated from one side directly affects the other board. Since it is a difficult structure, the noise influence in the state which both the board | substrates 7a and 7b operate | moved is suppressed, and heat cooking can be performed by stable IH operation | movement.

  In addition, the fan device 9 in which the rotation shaft of the impeller 91 is substantially in the vertical direction of the main body 1 is configured such that the impeller 91 and the casings 90a and 90b have a large volume in the front and rear, right and left, that is, a structure that prevents intake air on the inlet side of the fan device 9 Since there is no structure, it is possible to suppress the separation of the flow at the inlet of the impeller 91. Therefore, even if the motor 92 is not rotated at a high rotational speed, the substrates 7a, 7b and the heating coils 3a, 3b, 3c are large in low noise. Cooling air of the air volume can be supplied. Further, since the fan device 9 and the boards 7a and 7b are arranged apart from each other by the air duct 63, the wind speed distribution of the cooling air is reduced to the heat sinks 8a and 8b, and the wind noise is hardly generated. . In addition, since the fan device 9 is provided below the metal partition plates 1a and 1b, the fan device 9 is hardly affected by electromagnetic noise from the substrates 7a and 7b and exhaust heat from the heating coils 3a, 3b, and 3c. Therefore, the fan device can be operated efficiently and the parts can be cooled. Therefore, according to the configuration of the present invention, it is possible to provide an induction heating cooker that can be cooked with high heating power while maintaining a comfortable use environment that can be cooked with low noise.

  The second embodiment is the same as the first embodiment except for the air path configuration for blowing air from the fan device 9 to the substrates 7a and 7b as compared to the first embodiment. Therefore, the said different part is demonstrated and description is abbreviate | omitted about the part which overlaps with Example 1. FIG.

  FIG. 10 is a side cross-sectional view of the induction heating cooker according to the second embodiment, in which the air ducts 63 a and 63 b are arranged in the front-rear direction of the fan device 9. Here, the fan device 9 can be mounted with a casing having a discharge port in the front-rear direction with a maximum impeller outer diameter with respect to a determined lateral width. That is, the air duct 63a mainly supplies cooling air to the right substrate 7a, and the air duct 63b mainly supplies cooling air to the left substrate 7b. By separating and configuring the cooling air path for each substrate on the discharge side of the fan device 9, the air volume (pressure loss) balance for each substrate can be easily adjusted based on the pressure in the casing 90b having the highest pressure. In addition, the thermal design is facilitated as compared to the case where a single air passage is branched into multiple air passages. In this embodiment, the air ducts 63a and 63b are provided at the front and rear positions of the substrate 7a, the cooling air is flowed from the front to the rear with respect to the substrate 7a, and from the rear to the front with respect to the substrate 7b. Cooling. Note that the ventilation openings of the air ducts 63a and 63b may be set appropriately according to the arrangement of the heat sinks 8a and 8b, without being in front of and behind the substrate 7a. For example, the air ducts 63a and 63b may be arranged side by side on the right side of the substrate 7a so that the main flow in the main body is directed from right to left.

  As described above, according to the present embodiment, the discharge side of the fan device 9 is set to the front and rear two directions, so that the cooling target components such as the heating coils 3a, 3b, and 3c and the high heating element 72 that are fixed below the top plate 2 are provided. The substrates 7a and 7b can be efficiently cooled. Further, the fan device 9 has a blowing characteristic in which the maximum pressure is reduced and the maximum air volume is increased, and a large air volume can be easily supplied at a low rotation (low noise) due to a decrease in pressure loss (system resistance) of the entire air passage. it can. Therefore, safe and highly reliable cooking can be performed in a more comfortable use environment.

1 Body 1a, 1b Partition plate (metal support plate)
2 Top plate 21a, 21b, 21c Pan mounting part 22 Operation part 3a, 3b, 3c Heating coil 5 Grill box 6a, 6b Substrate cover 7a, 7b Substrate 63, 63a, 63b Ventilation duct 65, 65a, 65b Ventilation duct 71 Electron Component 72 High heating element 73a, 73b Substrate base 8a, 8b Heat sink 9 Fan device 9a Inlet port 90a, 90b Casing 91 Impeller 92 Motor 92a Rotating shaft 64a, 64b, 95 Discharge port 10 Step F0 Chamber portion H1 Intake opening H2 Exhaust opening Part P1 Display Z Induction heating cooker

Claims (9)

A top plate installed on the top surface of the main body;
A first heating coil provided below the top plate;
A first substrate disposed below the first heating coil and supplying high frequency power to the first heating coil;
A first metal support plate on which the first base is placed;
A second heating coil provided below the top plate;
A second substrate disposed below the second heating coil and supplying high frequency power to the second heating coil;
A second metal support plate on which the second base is placed;
Have
The induction heating cooker, wherein the second metal support plate is disposed higher than the first substrate.   The dielectric heating cooker according to claim 1, wherein the second metal support plate is disposed higher than an upper end of an electronic component provided on the first substrate.   The induction heating cooker according to claim 1 or 2, wherein a fan device is provided below the first metal support plate.   The induction heating cooker according to claim 1 or 2, wherein a fan device is provided below the second metal support plate.   5. The discharge port for allowing cooling air supplied from the fan device to pass is provided in front of or behind the first metal support plate or the second metal support plate. 6. Induction heating cooker.   The induction heating cooker according to claim 5, wherein a substrate for supplying a high-frequency current for induction heating of the nonmagnetic metal pan is placed on the metal support plate provided with the discharge port.   The fan device includes an impeller whose rotation shaft is in the vertical direction of the main body, and a casing whose intake port is in the lower direction of the main body and whose discharge port is in the front or rear direction of the main body. Item 5. The induction heating cooker according to Item 3 or 4.   The fan device includes an impeller whose rotation axis is in the front-rear direction of the main body, and a casing whose intake port is in the front or rear direction of the main body and whose discharge port is in the upper direction of the main body. Item 5. The induction heating cooker according to Item 3 or 4.   The induction heating cooker according to any one of claims 1 to 8, wherein the first metal support plate and the second metal support plate are individual flat plates or integrated plates.

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