JP2018020454A - Mask cleaning device, printing machine, mask cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress deterioration of a mask due to an excessive negative pressure acting on the mask when cleaning the mask by suction of the mask. A cleaning head having a suction port facing a mask having an opening, a drive unit that relatively moves the cleaning head with respect to the mask, and the interior of the cleaning head communicating with the suction port are exhausted. , An exhaust unit that sucks a suction target range facing the suction port of the mask, a detection unit that detects a change in pressure inside the cleaning head, and an exhaust unit that makes the pressure inside the cleaning head close to a target pressure. And a control unit that feedback-controls the exhaust speed of exhausting the inside of the cleaning head based on the detection result of the detection unit. [Selection diagram] Figure 2

Description

  The present invention relates to a technique for cleaning a mask used in a printing machine that prints a paste onto a substrate stacked on the back surface of the mask by spreading the paste on the surface of the mask having an opening.

  Conventionally, in a printing machine that prints a paste on a substrate using a mask, cleaning of the mask is performed as appropriate in order to remove the paste adhering to the back surface of the mask or the wall surface of the opening. For example, the printing machine of patent document 1 is provided with the air injection mechanism and air suction mechanism which are arrange | positioned on both sides of a mask, and an air suction mechanism attracts | sucks the air which the air injection mechanism injected, and produces | generates an airflow. And this printing machine moves the air injection mechanism and the air suction mechanism along the mask while removing the paste from the suction target range sandwiched between the air injection mechanism and the air suction mechanism, Clean the mask.

  Especially patent document 1 makes it a subject to remove a paste reliably from the part where the minute opening part concentrates, and in order to respond | correspond to this, the flow volume of airflow is controlled. Specifically, when there is a portion where minute openings are concentrated in the suction target range sandwiched between the air injection mechanism and the air suction mechanism, control for increasing the flow rate of the airflow is executed.

JP-A-6-238866

  By the way, in recent years, the thickness of the mask tends to be thin, whereas the above-described control described in Patent Document 1 may not always be appropriate for a thin mask. In other words, the above control increases the flow rate of the airflow when a portion where minute openings are concentrated exists in the suction target range. However, even if there is a portion where the minute openings are concentrated, if the area occupied by the openings is small in the entire suction target range, the negative pressure acting on the mask is increased as the flow rate of the airflow increases. In some cases, the pressure was excessive. When such an excessive negative pressure acts on a thin mask, the mask may be deteriorated.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of suppressing deterioration of a mask due to an excessive negative pressure acting on the mask when the mask is cleaned by suction of the mask.

  A mask cleaning apparatus according to a first aspect of the present invention communicates with a cleaning head having a suction port facing a mask having an opening, a drive unit that moves the cleaning head relative to the mask, and the suction port. By exhausting the inside of the cleaning head, the exhaust part for sucking the suction target range facing the suction port in the mask, the detection part for detecting the pressure change inside the cleaning head, and the pressure inside the cleaning head A control unit that feedback-controls an exhaust speed at which the exhaust unit exhausts the interior of the cleaning head so as to approach the target pressure based on a detection result of the detection unit;

  The mask cleaning method according to the first aspect of the present invention includes a step of moving the cleaning head relative to the mask while directing the suction port of the cleaning head toward the mask having an opening, and a cleaning head communicating with the suction port. And a step of sucking a suction target range facing the suction port of the mask by exhausting the inside of the cleaning head at an exhaust speed according to a result of detection of a change in the internal pressure by the detection unit. The feedback control is performed based on the detection result of the detection unit so that the pressure inside the cleaning head approaches the target pressure.

  In the invention thus configured (mask cleaning device, mask cleaning method), the inside of the cleaning head having the suction port facing the mask is exhausted, so that the suction target range of the mask facing the suction port is suctioned. Is done. Then, the suction target range moves relative to the mask with the cleaning head, whereby the mask is cleaned. At this time, the change in the pressure inside the cleaning head is detected by the detection unit, and the exhaust speed inside the cleaning head is feedback-controlled based on the detection result of the detection unit so that the pressure inside the cleaning head approaches the target pressure. Is done. Therefore, even when the area occupied by the opening in the suction target range is small, negative pressure acting on the mask can be suppressed, and deterioration of the mask can be suppressed.

  In addition, the control unit may configure the mask cleaning device so as to change the target pressure according to the thickness of the mask. Accordingly, the negative pressure acting on the mask can be appropriately controlled according to the thickness of the mask, and the deterioration of the mask can be more effectively suppressed.

  A mask cleaning device according to a second aspect of the present invention communicates with a cleaning head having a suction port facing a mask having an opening, a drive unit that moves the cleaning head relative to the mask, and the suction port. By exhausting the inside of the cleaning head, the area ratio of the exhaust portion that sucks the suction target range facing the suction port of the mask and the opening portion relative to the suction target range is reduced as the cleaning head moves relative to the mask. Accordingly, the exhaust unit includes a storage unit that stores an exhaust pattern that reduces the exhaust rate of exhausting the inside of the cleaning head, and a control unit that controls the exhaust rate of the exhaust unit according to the exhaust pattern.

  The mask cleaning method according to the second aspect of the present invention includes a step of moving the cleaning head relative to the mask while directing the suction port of the cleaning head toward the mask having an opening, and a cleaning head communicating with the suction port. A step of sucking the suction target range facing the suction port of the mask by exhausting the inside at an exhaust speed indicated by the exhaust pattern stored in the storage unit, and the exhaust pattern moves relative to the mask relative to the cleaning head. Accordingly, as the area ratio of the opening to the suction target range decreases, the exhaust speed at which the exhaust section exhausts the inside of the cleaning head is decreased.

  In the invention thus configured (mask cleaning device, mask cleaning method), the inside of the cleaning head having the suction port facing the mask is exhausted, so that the suction target range of the mask facing the suction port is suctioned. Is done. The suction target range moves relative to the mask with the cleaning head, and the mask is cleaned. At this time, the exhaust inside the cleaning head is executed according to the exhaust pattern stored in the storage unit. Therefore, the exhaust speed at which the exhaust unit exhausts the interior of the cleaning head decreases as the area ratio of the opening to the suction target range decreases with the relative movement of the cleaning head with respect to the mask. Therefore, even when the area occupied by the opening in the suction target range is small, negative pressure acting on the mask can be suppressed, and deterioration of the mask can be suppressed.

  A printing machine according to the present invention is a printing machine for printing a paste on a substrate stacked on the back surface of the mask by spreading the paste on the surface of the mask having an opening, and includes the mask cleaning device described above. The back surface of the mask is cleaned with a cleaning device. Therefore, even when the area occupied by the opening in the suction target range is small, negative pressure acting on the mask can be suppressed, and deterioration of the mask can be suppressed.

  As described above, according to the present invention, when a mask is cleaned by suction of the mask, it is possible to suppress deterioration of the mask due to excessive negative pressure acting on the mask.

FIG. 1 is a front view schematically showing an example of a printing machine to which the present invention is applied. The block diagram which shows the electrical constitution with which the printing machine of FIG. 1 equipped with the mask cleaning apparatus which concerns on 1st Embodiment is provided. FIG. 3 is a cross-sectional view partially showing an example of the configuration of a cleaning head included in the cleaning unit. FIG. 4 is a plan view partially showing an example of a configuration of a cleaning head included in the cleaning unit. 6 is a flowchart illustrating an example of a cleaning operation in the first embodiment. The block diagram which shows the electrical constitution with which the printing machine of FIG. 1 equipped with the mask cleaning apparatus which concerns on 2nd Embodiment is provided. The figure which shows an example of the exhaust speed characteristic which prescribes | regulates the relationship between the area ratio of the opening part with respect to the suction | inhalation object range, and exhaust speed. The figure which shows an example of the exhaust pattern set using the exhaust speed characteristic of FIG. 9 is a flowchart showing an example of a cleaning operation in the second embodiment.

  FIG. 1 is a front view schematically showing an example of a printing machine to which the present invention is applied. FIG. 2 is a block diagram showing an electrical configuration provided in the printing machine of FIG. 1 equipped with the mask cleaning device according to the first embodiment. In FIG. 1 and the following drawings, XYZ orthogonal coordinate axes with the Z direction as a vertical direction and the X direction and the Y direction as horizontal directions are shown as appropriate. The printing machine 1 includes a mask holding unit 2 that holds a mask M, a substrate holding unit 4 that is disposed below the mask M, a squeegee unit 6 that is disposed above the mask M, a substrate holding unit 4 and a Y And a cleaning unit 8 arranged side by side in the direction (FIG. 1).

  The printing machine 1 includes a main control unit 10 which is a computer composed of a CPU (Central Processing Unit) and a RAM (Random Access Memory), and a storage unit 11 composed of an HDD (Hard Disk Drive). Provide (FIG. 2). The main control unit 10 controls the units 4 and 6 according to the printing program stored in the storage unit 11, so that the upper surface of the substrate B is opposed to the lower surface of the mask M by the substrate holding unit 4. The tip of the squeegee 60 is slid in the Y direction on the upper surface of the mask M (printing operation). As a result, the solder SP (paste) supplied to the upper surface of the mask M is printed on the upper surface of the substrate B through the opening A (FIG. 4) penetrating the mask M. Further, the main control unit 10 controls the units 4 and 8 according to the cleaning program stored in the storage unit 11 so that the cleaning unit 8 removes the solder SP from the mask M while moving the cleaning unit 8 in the Y direction. (Cleaning operation).

  Incidentally, the printing press 1 includes a drive control unit 12 (FIG. 2) for controlling the driving of each movable unit provided in the apparatus, and the main control unit 10 controls the units 4, 6, and 8 by the drive control unit 12. By controlling each movable part, the above-described printing operation and cleaning operation are executed. Further, the printing machine 1 includes a display unit 14 configured by, for example, a liquid crystal display and an input unit 15 configured by input devices such as a keyboard and a mouse. Therefore, the operator can confirm the operation status of the printing press 1 by confirming the display content of the display unit 14, and can input a command to the printing press 1 by operating the input unit 15. Note that the display unit 14 and the input unit 15 may be integrally configured by a touch panel.

  As shown in FIG. 1, the mask holding unit 2 has a clamp member 21, and the mask M is detachably held by the clamp member 21. Accordingly, the mask M having a flat plate shape is held horizontally by the mask holding unit 2. An opening A having a shape corresponding to the print pattern on the substrate B passes through the mask M.

  The squeegee unit 6 includes a print head 61 having a squeegee 60 and a unit main body 62 that holds the print head 61 so as to be movable up and down in the Z direction. The unit main body 62 is movable in the Y direction together with the print head 61 along a Y-axis guide rail 621 extending in parallel with the Y direction. Further, the squeegee unit 6 includes a Z-axis drive unit M61 that drives the print head 61 in the Z direction, and a Y-axis drive unit M62 that drives the unit main body 62 in the Y direction. The Z-axis drive unit M61 and the Y-axis drive unit M62 are composed of, for example, a ball screw and a motor that drives the ball screw. And the drive control part 12 presses the squeegee 60 on the upper surface of the mask M by controlling the Z-axis drive part M61. Further, the drive control unit 12 controls the Y-axis drive unit M62 to move the squeegee 60 pressed by the mask M in the Y direction. As a result, a printing operation is performed on the substrate B held by the substrate holding unit 4.

  The substrate holding unit 4 is disposed below the mask M held by the mask holding unit 2 and has a function of aligning the position of the substrate B with respect to the mask M. The substrate holding unit 4 includes a pair of conveyors 41 that convey the substrate B, a substrate holding unit 42 that holds the substrate B received from the conveyor 41, and a table drive mechanism 43 that supports the conveyor 41 and the substrate holding unit 42. Have.

  The pair of conveyors 41 are arranged in parallel to the X direction with a gap in the Y direction, and support both ends of the substrate B in the Y direction from below on their upper surfaces. And each conveyor 41 carries in board | substrate B with respect to the printing machine 1 by carrying the board | substrate B to a X direction.

  The substrate holding unit 42 includes a flat plate-like lift table 421 and a slide column 422 that can slide in the Z direction with respect to the Z-axis table 47 of the table drive mechanism 43, and the lift table 421 is at the upper end of the slide column 422. It is supported. Further, a plurality of backup pins 423 erected in the Z direction are arranged on the upper surface of the lifting table 421 at intervals in the X direction and the Y direction. When the slide column 422 moves up and down, the backup pin 423 moves up and down together with the lifting table 421. For example, when the substrate B is carried in by the conveyor 41, the upper end of each backup pin 423 is positioned below the upper surface of the conveyor 41. Then, when the conveyor 41 carries the substrate B directly above the backup pin 423, the slide column 422 rises, and the upper end of the backup pin 423 protrudes upward from the upper surface of the conveyor 41. As a result, the substrate B is transferred from the upper surface of the conveyor 41 to the upper end of each backup pin 423. On the other hand, by executing the reverse procedure, the substrate B can be transferred from the upper end of each backup pin 423 to the conveyor 41, and the substrate B can be carried out by the conveyor 41.

  The substrate holding part 42 has a pair of clamp plates 424 arranged above the pair of conveyors 41 with an interval in the X direction. The upper surface of each clamp plate 424 is a plane parallel to the X direction and the Y direction, and is located at the same height. When the substrate B on the backup pin 423 rises between the pair of clamp plates 424, one of the two clamp plates 424 approaches the other, and the substrate B is moved in the Y direction (horizontal direction) by the clamp plates 424. Clamped from.

  The table driving mechanism 43 that supports the substrate holding unit 42 includes a Y-axis table 44, an X-axis table 45 attached to the Y-axis table 44, an R-axis table 46 attached to the X-axis table 45, And a Z-axis table 47 attached to the R-axis table 46. Furthermore, the table drive mechanism 43 includes a Y-axis drive unit M44 that drives the Y-axis table 44 along a Y-axis guide rail 441 that extends parallel to the Y direction, and an X that extends parallel to the X direction on the top surface of the Y-axis table 44. An X-axis drive unit M45 that drives the X-axis table 45 along the axis guide rail 451, and the R-axis table 46 with respect to the X-axis table 45 in the R direction (rotation direction about an axis parallel to the Z direction) An R-axis drive unit M46 for driving and a Z-axis drive unit M47 for driving the Z-axis table 47 in the Z direction with respect to the R-axis table 46 are provided. The Y-axis drive unit M44, the X-axis drive unit M45, and the Z-axis drive unit M47 are configured by, for example, a ball screw and a motor that drives the ball screw, and the R-axis drive unit M46 is configured by, for example, a motor.

  Therefore, the drive control part 12 can drive the conveyor 41 and the board | substrate holding part 42 arrange | positioned at the Z-axis table 47 to a X, Y, Z, R direction by controlling each drive part M44-M47. . For example, when positioning the loaded substrate B with respect to the mask M, the drive control unit 12 determines the position of the substrate B clamped on the clamp plate 424 by the Y / X / R axis driving units M44 to M46. In-plane adjustment and adjustment in the Z direction by the Z-axis drive unit M47. Accordingly, the upper surfaces of the clamp plate 424 and the substrate B are in contact with the lower surface of the mask M.

  Next, the configuration relating to the cleaning unit 8 will be described in detail with reference to FIGS. Here, FIG. 3 is a sectional view partially showing an example of the configuration of the cleaning head included in the cleaning unit, and FIG. 4 is a plan view partially showing an example of the configuration of the cleaning head included in the cleaning unit. 3 and 4 show the configuration of the mask M and the like in addition to the cleaning head. In particular, in FIG. 4, the portion of the cleaning head hidden behind the mask M is indicated by a broken line.

  The cleaning unit 8 has a unit body 81 that is long in the X direction. The unit main body 81 is detachably engaged with the table driving mechanism 43 of the substrate holding unit 4 in the same manner as the cleaner unit described in Japanese Patent Application Laid-Open No. 2008-265153. Therefore, in a state where the unit main body 81 is engaged with the table drive mechanism 43, the drive control unit 12 drives the cleaning unit 8 in the Y direction by driving the table drive mechanism 43 in the Y direction by the Y-axis drive unit M44. can do.

  The cleaning unit 8 also includes a cleaning head 82 that is long in the X direction, and a Z-axis drive unit M82 that raises and lowers the cleaning head 82 in the Z direction. The Z-axis drive unit M82 is configured by an actuator such as a cylinder or a solenoid, and is accommodated in the unit body 81. On the other hand, the cleaning head 82 is disposed above the Z-axis drive unit M82. When the Z-axis drive unit M82 raises the cleaning head 82, the cleaning head 82 moves upward from the unit body 81, and the Z-axis drive unit M82 When the cleaning head 82 is lowered, the cleaning head 82 is accommodated in the unit main body 81.

  Further, the cleaning unit 8 includes a sheet supply mechanism 83 that supplies the cleaning sheet S to the upper surface of the cleaning head 82. The sheet supply mechanism 83 includes a supply roller 831 that supplies the cleaning sheet S, a collection roller 832 that collects the cleaning sheet S, and a plurality of rollers 833 that support the cleaning sheet S between the supply roller 831 and the collection roller 832. 836. In this way, the cleaning sheet S is stretched along the supply path from the supply roller 831 to the collection roller 832 via the upper surface of the cleaning head 82. In such a configuration, when the drive control unit 12 issues an ascent command to the Z-axis drive unit M82, the upper surface of the cleaning head 82 that has advanced upward contacts the lower surface of the mask M across the cleaning sheet S as shown in FIG. Touch.

  As shown in FIGS. 3 and 4, a plurality of suction ports 821 extending in parallel with the X direction pass through the upper surface of the cleaning head 82, and each of the plurality of suction ports 821 aligned in the Y direction is each the cleaning head 82. Communicated with the interior 822. Further, an exhaust port 823 that communicates with the interior 822 of the cleaning head 82 is provided at one end in the X direction of the cleaning head 82. By exhausting the interior 822 of the cleaning head 82 from the exhaust port 823, a suction port 821 is provided. A negative pressure can be generated. In addition, a pressure sensor 824 (atmospheric pressure sensor) is disposed in the interior 822 of the cleaning head 82, and the pressure (atmospheric pressure) in the interior 822 of the cleaning head 82 can be measured by the pressure sensor 824.

  Further, the printing press 1 includes an exhaust unit 9 that exhausts the interior 822 of the cleaning head 82 and an exhaust control unit 16 that controls exhaust by the exhaust unit 9. The exhaust unit 9 includes a blower 91 connected to the exhaust port 823 of the cleaning head 82 via a pipe or the like, and an inverter 92 that adjusts the rotational speed of the blower 91. In contrast, the exhaust control unit 16 has a deviation Δ (= Pt−) between the target pressure Pt (target negative pressure) stored in the storage unit 11 and the detected pressure Pd (detected negative pressure) detected by the pressure sensor 824. Based on Pd), the exhaust speed of the blower 91 is feedback-controlled. That is, the exhaust control unit 16 transmits an exhaust signal E calculated by multiplying the deviation Δ by a gain to the inverter 92, and the inverter 92 rotates the blower 91 at a rotational speed corresponding to the exhaust signal E received from the exhaust control unit 16. Let As a result, the interior 822 of the cleaning head 82 is exhausted at an exhaust rate (liter / second) corresponding to the exhaust signal E. Thus, the exhaust speed at which the interior 822 of the cleaning head 82 is exhausted is feedback-controlled so that the detected pressure Pd approaches the target pressure Pt.

  By the way, the storage unit 11 stores a plurality of target pressures Pt that differ depending on the thickness Mt of the mask M. In the exhaust control unit 16, a target pressure Pt corresponding to the thickness Mt of the mask M set via the input unit 15 is set by the main control unit 10. As a result, the thinner the thickness Mt of the mask M, the higher the target pressure Pt (that is, the weaker target negative pressure) is set, and the exhaust control unit 16 approaches the detected pressure Pd of the pressure sensor 824 to the set target pressure Pt. Execute feedback control.

  In such a configuration, when the cleaning head 82 is in contact with the lower surface of the mask M via the cleaning sheet S (FIG. 3), the suction target range R facing the suction ports 821 is exhausted from the lower surface of the mask M. Suctioned by part 9. Then, the cleaning unit 8 moves in the cleaning direction Dc parallel to the Y direction, thereby sucking and removing the solder SP in the suction target range R while moving the suction target range R in the cleaning direction Dc (cleaning operation). Next, this cleaning operation will be described.

  FIG. 5 is a flowchart showing an example of the cleaning operation in the first embodiment. This flowchart is executed by the main control unit 10 controlling the drive control unit 12 and the exhaust control unit 16 according to the cleaning program stored in the storage unit 11. In step S101, the cleaning head 82 is moved to the cleaning start position Ls set on the upstream side in the cleaning direction Dc from the region where the opening A is formed on the lower surface of the mask M. Specifically, the drive control unit 12 controls the Y-axis drive unit M44 to move the cleaning head 82 below the cleaning start position Ls, and then the drive control unit 12 controls the Z-axis drive unit M82. As a result, the cleaning head 82 is raised. As a result, the upper surface of the cleaning head 82 contacts the cleaning start position Ls on the lower surface of the mask M via the cleaning sheet S.

  Subsequently, the exhaust control unit 16 transmits a rotation start command to the inverter 92, and the inverter 92 that has received the rotation start command starts the rotation of the blower 91 (step S102). Along with this, the pressure in the interior 822 of the cleaning head 82 starts to decrease from the atmospheric pressure toward the target pressure Pt. When the difference between the detected pressure Pd and the target pressure Pt becomes equal to or smaller than a predetermined value, the drive control unit 12 controls the Y-axis drive unit M44 and starts moving the cleaning head 82 in the cleaning direction Dc (step S103). ).

  In step S104, it is determined whether or not the cleaning head 82 has reached the cleaning end position Le set on the downstream side in the cleaning direction Dc from the region where the opening A is formed on the lower surface of the mask M. If the cleaning head 82 has not reached the cleaning end position Le (“NO” in step S104), the exhaust control unit 16 acquires the detected pressure Pd from the pressure sensor 824 (step S105), and this detection. By sending an exhaust signal E corresponding to the pressure Pd to the inverter 92, the exhaust speed by the blower 91 is feedback-controlled (step S106). The feedback control in steps S105 and S106 is repeatedly executed until the cleaning head 82 reaches the cleaning end position Le. When the cleaning head 82 reaches the cleaning end position Le, the exhaust by the blower 91 is ended (step S107). The flowchart of FIG. 5 ends. Thus, the solder SP adhered to the lower surface of the mask M and the wall surface of the opening A can be removed from the cleaning start position Ls to the cleaning end position Le.

  As described above, the reason why the exhaust speed for exhausting the inside 822 of the cleaning head 82 is feedback-controlled based on the result of detecting the pressure inside the cleaning head 82 by the pressure sensor 824 is as follows. As described above, the cleaning of the mask M is performed while moving the suction target range R of the suction port 821 in the cleaning direction Dc. At this time, as can be seen from FIG. 4, as the suction target range R moves in the cleaning direction Dc, the area (total area) of the opening A existing in the suction target range R varies. Therefore, in the control for exhausting the interior 822 of the cleaning head 82 at a constant exhaust speed, if the area occupied by the opening A in the suction target range R is small, the pressure in the interior 822 of the cleaning head 82 decreases, and the mask M In some cases, a strong negative pressure is applied to the mask M to deteriorate the mask M.

  On the other hand, in the first embodiment, the exhaust speed of the interior 822 of the cleaning head 82 is feedback-controlled so that the pressure Pd detected by the pressure sensor 824 approaches the target pressure Pt. Therefore, even when the area occupied by the opening A in the suction target range R is small, the negative pressure acting on the mask M can be suppressed, and deterioration of the mask M can be suppressed.

  Moreover, in this embodiment, since the exhaust speed is appropriately suppressed according to the area of the opening A within the suction target range R, it is possible to save electric power and reduce the environmental load. .

  The main control unit 10 changes the target pressure Pt according to the thickness Mt of the mask M. Accordingly, the negative pressure acting on the mask M can be appropriately controlled according to the thickness Mt of the mask M, and deterioration of the mask M can be more effectively suppressed.

  FIG. 6 is a block diagram showing an electrical configuration of the printing machine of FIG. 1 equipped with the mask cleaning device according to the second embodiment. Since the second embodiment is different from the first embodiment mainly in the control of the exhaust speed by the exhaust control unit 16, the following description will be made mainly on the differences, and the common points will be appropriately denoted by the corresponding reference numerals. Description is omitted.

  As shown in FIG. 6, in the second embodiment, instead of performing feedback control as in the first embodiment, exhaust speed control based on the exhaust pattern Pe stored in the storage unit 11 is executed. Therefore, the pressure sensor 824 is not necessary. The exhaust pattern Pe is a pattern for adjusting the exhaust speed by the blower 91 in accordance with the change in the area ratio of the opening A to the suction target range R. Here, the areas of the suction target range R and the opening A are the respective areas in a plan view from the normal direction of the mask M.

  FIG. 7 is a diagram showing an example of the exhaust speed characteristic that defines the relationship between the area ratio of the opening to the suction target range and the exhaust speed, and FIG. 8 shows the exhaust pattern set using the exhaust speed characteristic of FIG. It is a figure which shows an example. In the exhaust speed characteristic Ce of FIG. 7, the exhaust speed V is set higher as the area ratio F of the opening A with respect to the suction target range R is larger, and the exhaust speed is increased as the area ratio F of the opening A with respect to the suction target range R is smaller. Indicates that V is set low. In the second embodiment, the exhaust speed characteristic Ce and mask data Dm indicating the position of the opening A in the mask M are stored in the storage unit 11. As the mask data Dm, Gerber data, image data obtained by capturing the mask M, or the like can be used.

  Then, the main control unit 10 generates the exhaust pattern Pe based on the exhaust speed characteristic Ce and the mask data Dm. Specifically, when the suction port 821 of the cleaning head 82 is moved in the cleaning direction Dc, an area ratio change curve indicating how the area ratio F of the opening A to the suction target range R changes is calculated. Is required. Then, by converting the area ratio F of the area ratio change curve into the exhaust speed V using the exhaust speed characteristic Ce of FIG. 7, the exhaust pattern Pe of FIG. 8 is obtained. The exhaust pattern Pe thus obtained defines the relationship between the position (horizontal axis) of the cleaning head 82 in the cleaning direction Dc and the exhaust velocity V (vertical axis) at which the interior 822 of the cleaning head 82 is exhausted. That is, the exhaust pattern Pe defines the exhaust speed V according to the position of the cleaning head 82 in the cleaning direction Dc, and the main control unit 10 controls the exhaust speed V according to the exhaust pattern Pe, so that the cleaning direction As the cleaning head 82 moves to Dc, the exhaust speed V is adjusted in accordance with the change in the area ratio F of the opening A to the suction target range R. In the second embodiment, the cleaning operation is performed while controlling the exhaust speed V according to the exhaust pattern Pe.

  FIG. 9 is a flowchart showing an example of the cleaning operation in the second embodiment. Steps S101 to S104 are executed in the same manner as in the first embodiment. If the cleaning head 82 has not reached the cleaning end position Le (“NO” in step S104), the exhaust control unit 16 acquires the position of the cleaning head 82 in the cleaning direction Dc (step S202). . Specifically, the exhaust control unit 16 acquires the output value of the encoder of the motor constituting the Y-axis drive unit M44 as information indicating the position of the cleaning head 82. Then, the exhaust control unit 16 obtains an exhaust speed V corresponding to the acquired position of the cleaning head 82 based on the exhaust pattern Pe, and transmits an exhaust signal E to the inverter 92 so as to perform exhaust at this exhaust speed V. (Step S202). Then, the control in steps S201 and 202 is repeatedly executed until the cleaning head 82 reaches the cleaning end position Le. When the cleaning head 82 reaches the cleaning end position Le, the exhaust by the blower 91 is ended (step S107). The flowchart of 9 ends. Thus, the solder SP adhered to the lower surface of the mask M and the wall surface of the opening A can be removed from the cleaning start position Ls to the cleaning end position Le.

  In the second embodiment configured as described above, the exhaust unit 9 moves to the cleaning head 82 as the area of the opening A within the suction target range R decreases as the cleaning head 82 moves relative to the mask M. The exhaust speed V for exhausting the interior 822 of the engine is reduced. Therefore, even when the area occupied by the opening A in the suction target range R is small, the negative pressure acting on the mask M can be suppressed, and deterioration of the mask M can be suppressed.

  Also in this embodiment, since the exhaust velocity V is appropriately suppressed according to the area of the opening A within the suction target range R, it is possible to save electric power and reduce the environmental load. ing.

  Thus, in the above embodiment, the mask M corresponds to an example of the “mask” of the present invention, the opening A corresponds to an example of the “opening” of the present invention, and the printing machine 1 corresponds to the “printing machine” of the present invention. The mask cleaning device MC comprising the cleaning unit 8, the exhaust unit 9, the Y-axis drive unit M44, the main control unit 10, the storage unit 11, the drive control unit 12 and the exhaust control unit 16 is the present invention. The cleaning head 82 corresponds to an example of the “cleaning head” of the present invention, the suction port 821 corresponds to an example of the “suction port” of the present invention, and the cleaning head 82 The interior 822 corresponds to an example of “the inside of the cleaning head” of the present invention, the Y-axis drive unit M44 corresponds to an example of the “drive unit” of the present invention, and the exhaust unit 9 is an example of the “exhaust unit” of the present invention. Equivalent to The target range R corresponds to an example of the “suction target range” of the present invention, the pressure sensor 824 corresponds to an example of the “detection unit” of the present invention, and the target pressure Pt corresponds to an example of the “target pressure” of the present invention. The exhaust control unit 16 corresponds to an example of the “control unit” of the present invention, the storage unit 11 corresponds to an example of the “storage unit” of the present invention, and the exhaust pattern Pe corresponds to an example of the “exhaust pattern” of the present invention. It corresponds to.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, the exhaust unit 9 is composed of a blower 91 and an inverter 92. However, the specific configuration of the exhaust unit 9 is not limited to this, and the exhaust unit 9 may be configured by, for example, an ejector and an electropneumatic regulator.

  Further, the number, shape, or size of the suction ports 821 of the cleaning head 82 can be appropriately changed.

  Further, the position where the pressure sensor 824 is disposed is not limited to the inside 822 of the cleaning head 82. That is, the pressure sensor 824 can be disposed in any of the exhaust paths from the suction port 821 to the blower 91.

  Further, a measuring instrument that can be used to detect a pressure change in the interior 822 of the cleaning head 82 is not limited to the pressure sensor 824. For example, the pressure change in the interior 822 of the cleaning head 82 may be detected by a flow meter provided in any of the exhaust paths from the suction port 821 to the blower 91.

  Further, it is not always necessary to create the exhaust pattern Pe by the main control unit 10 of the printing press 1, and the exhaust pattern Pe created by the arithmetic device provided outside the printing press 1 is stored in the storage unit 11 of the printing press 1. May be.

  Further, the linear drive unit such as the Y-axis drive unit M44 may be constituted by a linear motor, for example.

1 ... Printer,
10 ... main control part,
11 ... storage unit,
12 ... Drive control unit,
16 ... exhaust control unit,
8 ... Cleaning unit,
82 ... cleaning head,
821 ... suction port,
822 ... inside the cleaning head,
824 ... Pressure sensor (detector),
9 ... exhaust part,
91 ... Blower,
92 ... an inverter,
M44 ... Y-axis drive unit (drive unit),
R ... suction target range,
Pt ... Target pressure,
Pd: detected pressure,
Pe ... exhaust pattern,
M ... mask,
Mt ... (mask) thickness,
A ... opening,
B ... Substrate,
SP: Solder (paste),
MC: Mask cleaning device,
V: Exhaust speed,
F ... Area ratio (of opening to suction target range)

Claims (6)

A cleaning head having a suction port facing a mask having an opening;
A drive unit that moves the cleaning head relative to the mask;
By exhausting the inside of the cleaning head communicating with the suction port, an exhaust unit that sucks the suction target range facing the suction port in the mask; and
A detection unit for detecting a change in the internal pressure of the cleaning head;
A mask including a control unit that feedback-controls an exhaust speed at which the exhaust unit exhausts the interior of the cleaning head based on a detection result of the detection unit so that the internal pressure of the cleaning head approaches a target pressure. Cleaning device.   The mask cleaning apparatus according to claim 1, wherein the control unit changes the target pressure according to a thickness of the mask. A cleaning head having a suction port facing a mask having an opening;
A drive unit that moves the cleaning head relative to the mask;
By exhausting the inside of the cleaning head communicating with the suction port, an exhaust unit that sucks the suction target range facing the suction port in the mask; and
As the area ratio of the opening to the suction target range decreases as the cleaning head moves relative to the mask, the exhaust reduces the exhaust speed at which the exhaust exhausts the interior of the cleaning head. A storage unit for storing patterns;
A mask cleaning device comprising: a control unit that controls the exhaust speed of the exhaust unit according to the exhaust pattern. By spreading the paste on the surface of the mask having an opening, it is a printing machine that prints the paste on the substrate superimposed on the back of the mask,
A mask cleaning device according to any one of claims 1 to 3,
The printing machine which cleans the back surface of the mask by the mask cleaning device. Moving the cleaning head relative to the mask while directing the suction port of the cleaning head to the mask having an opening;
By evacuating the inside of the cleaning head at an evacuation speed according to the result of detection by the detector that detects a change in the pressure inside the cleaning head communicating with the suction port, the mask faces the suction port. A step of sucking a suction target range,
The mask cleaning method, wherein the exhaust speed is feedback-controlled based on the detection result of the detection unit so that the internal pressure of the cleaning head approaches a target pressure. Moving the cleaning head relative to the mask while directing the suction port of the cleaning head to the mask having an opening;
And a step of sucking a suction target range facing the suction port in the mask by exhausting the interior of the cleaning head communicating with the suction port at an exhaust speed indicated by an exhaust pattern stored in a storage unit. ,
The exhaust pattern is an exhaust pattern in which the exhaust section exhausts the inside of the cleaning head as the area ratio of the opening to the suction target range decreases as the cleaning head moves relative to the mask. A mask cleaning method that reduces the speed.

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