JP2018020445A - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

An object of the present invention is to provide a resin molding apparatus capable of reducing contamination in the apparatus due to a resin material. A resin molding apparatus is provided for adsorbing a film to a lower surface of a resin material storage frame so as to cover a resin material storage frame having an opening and a lower surface of the resin material storage frame including the opening. A film tension frame 13 provided so as to surround the inner periphery of the suction mechanism 12 and the resin material storage frame 11 and to be able to move up and down, and a stop portion 14 for stopping the film tension frame 13 at a predetermined height. A pressing member 16 for pressing the film tension frame 13 from above, and a driving unit 17 for moving the pressing member up and down. After the resin material P housed inside the film tension frame 13 is supplied to the mold, the pressing member 16 presses and releases the film tension frame 13 to remove the resin material P adhered to the film tension frame 13. The transfer path is prevented from being contaminated by the resin material P during the transfer of the film tension frame member 13 and the like after being separated. [Selection diagram] Fig. 1

Description

  The present invention relates to a resin molding apparatus and a resin molded product manufacturing method for manufacturing a resin molded product such as a resin sealed product in which an electronic component such as a semiconductor chip is resin sealed.

  In order to protect an electronic component from an environment such as light, heat, and moisture, the electronic component is generally sealed with a resin. Examples of the resin sealing method include a compression molding method and a transfer molding method. In the compression molding method, a mold consisting of a lower mold and an upper mold is used, resin material is supplied to the cavity of the lower mold, a board with electronic components mounted is attached to the upper mold, and then the lower mold and the upper mold are heated. However, molding is performed by clamping both of them. In the transfer molding method, the substrate is attached to one of the upper mold and the lower mold, and then the lower mold and the upper mold are heated and both are clamped, and the resin is pressed into the cavity with a plunger. Done. In the transfer molding method, a part of the resin remains in the path for feeding the resin from the plunger to the cavity, resulting in waste, and the problem that the semiconductor substrate and wiring are damaged by the flow of the resin occurs. In recent years, compression molding has become the mainstream.

  Patent Document 1 describes a resin molding apparatus that performs resin sealing by a compression molding method, and has a resin material transfer unit that transfers resin material from a resin material supply apparatus to a lower mold cavity. Yes. As shown in FIG. 8, the resin material transfer unit 90 includes a resin material containing frame 91 provided with an opening 911 having the same planar shape as a cavity MC of a lower mold LM described later, and a resin material including the opening 911. An adsorption mechanism 92 for adsorbing the release film to the lower surface of the resin material accommodation frame 91 so as to cover the lower surface of the accommodation frame 91, and a film provided so as to surround the inner periphery of the resin material accommodation frame 91 and to be movable up and down A tension frame member 93, a stop portion 94 that stops the film tension frame member 93 at a predetermined height position, and a transport mechanism 95 that moves the resin material housing frame 91 and the like between the resin material supply device and the cavity.

  The suction mechanism 92 includes a groove provided on the lower surface of the resin material housing frame 91 and a suction device (not shown) that sucks air in the groove. The film tension frame member 93 is a ring having an inverted L-shaped cross section having a protrusion on the outer peripheral side. The stop portion 94 is such that the lower end portion on the inner peripheral side of the resin material containing frame 91 projects inward. When the protruding portion of the film tension frame member 93 comes into contact with the stop portion 94, the film tension frame member 93 stops at a predetermined height position (see FIG. 8). On the other hand, the height of the film tension frame member 93 is larger than the height of the stop portion 94, and when the resin material housing frame 91 is placed on a flat base, the film tension frame member 93 moves away from the stop portion 94 (FIG. 9). (See (a)). The transport mechanism 95 includes a pair of resin material housing frame gripping portions 951 that sandwich and grip the resin material housing frame 91 from the side, and a release film F provided under each resin material housing frame gripping portion 951. It has a film gripping portion 952 to be gripped, and a moving means (not shown) for moving the resin material containing frame gripping portion 951 and the film gripping portion 952.

  The operation of the resin material transfer unit 90 will be described with reference to FIG. First, after the release film F is stretched on the flat table TB, the resin material storage frame 91 and the film tension frame member 93 are placed on the release film F by the transport mechanism 95 (a). At this stage, the film tension frame member 93 is away from the stop portion 94 as described above. Next, the resin material P is supplied to the inside of the film tension frame member 93 from the resin material supply device (b). As the apparatus and method for supplying the resin material P to the resin material transfer unit 90, a known apparatus and method (see, for example, Patent Document 2) are used.

  Next, the release film F is sucked by the suction mechanism 92, and then the resin material storage frame 91 is sandwiched by the resin material storage frame gripping portion 951 and the periphery of the release film F is gripped by the film gripping portion 952. Subsequently, the resin material housing frame 91 is lifted by the transport mechanism 95 (c). At that time, by appropriately setting the suction strength of the release film F by the suction mechanism 92, the film tension frame member 93 is lowered to a position where it comes into contact with the stop portion 94 by its own weight, and the release film F Is in close contact with the lower surface of the resin material housing frame 91 while being pushed and extended by the film tension frame member 93. In this way, tension is applied to the release film F on which the resin material P in the film tension frame member 93 is placed, and the resin material accommodation portion PC is formed by the film tension frame member 93 and the release film F.

  Subsequently, the resin material transfer unit 90 is moved to the position directly above the cavity MC of the lower mold LM by the transfer mechanism 95 (d) and then lowered (e), thereby introducing the resin material container PC into the cavity MC. Then, after releasing the suction of the release film F by the suction mechanism 92 and the gripping by the film gripping portion 952, the resin material accommodation frame 91 is raised (f). Thus, the resin material P is supplied into the cavity MC in a state where the inner surface of the cavity MC is covered with the release film F. Further, the film tension frame member 93 rises together with the resin material accommodation frame 91 while being hooked on the stop portion 94. Thereafter, the resin material transfer unit 90 is returned to the resin material supply device for supply of the next resin material.

JP 2015-222760 JP 2007-125783 A

  Recently, as electronic parts and wiring become more precise, the particle size of the resin material used tends to be smaller in order to further reduce the movement of the resin when melted in the cavity. Also, in flip-chip connection where the electronic component and the substrate are connected by solder bumps, the height of the solder bump (distance between the electronic component and the substrate) is low, so the particle size of the filler contained in the resin material is also low. It is getting smaller. Conventionally, a technique that can cope with such a small particle size resin or filler has not been proposed.

  The problem to be solved by the present invention is to provide a resin molding apparatus and a resin molded product manufacturing method capable of dealing with a resin material containing a resin or filler having a small particle size.

The resin molding apparatus according to the present invention, which has been made to solve the above problems,
a) a resin material containing frame having an opening;
b) an adsorption mechanism for adsorbing a film to the lower surface of the resin material containing frame so as to cover the lower surface of the resin material containing frame including the opening;
c) a film tension frame material provided so as to be capable of ascending and descending so as to surround the inner periphery of the resin material accommodation frame;
d) a stop portion for stopping the film tension frame member at a predetermined height position;
e) a pressing member for pressing the film tension frame member from above;
and f) a drive unit that moves the pressing member up and down.

The resin molded product manufacturing method according to the present invention includes:
Arranging the film so as to cover the lower surface including the opening of the resin material containing frame having the opening;
Supplying a resin material to the inside of a film tension frame member provided so as to be movable up and down so as to surround the inner periphery of the resin material housing frame;
By adsorbing the film to the lower surface of the resin material housing frame, the film tension frame material is lowered by raising the resin material housing frame and stopped at a predetermined height position so that the film moves downward. A step of projecting and forming a resin material accommodating portion in which the resin material is accommodated;
Storing the resin material container in a cavity of a mold;
Releasing the adsorption of the film to the lower surface of the resin material housing frame, and raising the resin material housing frame;
And a step of pressing the film tension frame member from above with a pressing member and pulling the pressing member upward.

  According to the resin molding apparatus and the resin molded product manufacturing method according to the present invention, it is possible to deal with a resin material containing a resin having a small particle size or a filler.

The longitudinal cross-sectional view which shows the structure of the resin material transfer part in one Embodiment of the resin molding apparatus which concerns on this invention. The front view (a) which shows the state which raised the press member in the resin molding apparatus of this embodiment, the front view (b) which shows the state which lowered the press member, and the side view which shows the state where the press member was raised (c). The top view of the resin material accommodation frame in the resin molding apparatus of this embodiment, a film tension frame material (solid line), and a press member (dashed line). The figure which shows each operation | movement until it introduce | transduces the resin material accommodating part into a shaping | molding die among the operation | movement of the resin material transfer part in the resin molding apparatus of this embodiment. The figure which shows the operation | movement for releasing the resin material adhering to the film tension frame material among the operation | movement of the resin material transfer part in the resin molding apparatus of this embodiment. Schematic which shows an example of a compression molding part. Schematic which shows the example of a resin molding apparatus provided with a material acceptance module, a shaping | molding module, and a payout module. The longitudinal cross-sectional view which shows an example of a structure of the resin material transfer part in the conventional resin molding apparatus. The longitudinal cross-sectional view which shows operation | movement of the conventional resin material transfer part. The longitudinal cross-sectional view which shows the modification of the structure of the resin material transfer part in the conventional resin molding apparatus.

  In the resin molding apparatus according to the present invention, the resin material is supplied to the inner side of the film tension frame member after the film is adsorbed to the lower surface of the resin material accommodation frame by an adsorption mechanism so as to cover the lower surface of the resin material accommodation frame. By lifting the material storage frame, the film tension frame member protrudes downward, whereby the film protrudes downward to form a resin material storage portion in which the resin material is stored. Next, after introducing the resin material accommodation portion into the cavity of the mold, the adsorption by the adsorption mechanism is released to raise the resin material accommodation frame. Up to this point, it is the same as the above-described conventional resin molding apparatus. After that, by repeating the operation of pressing the film tension frame member with the pressing member by moving the pressing member up and down by the drive unit, the resin or filler of the resin material adhering to the film tension frame member is removed from the film tension frame member. Remove and drop into the cavity.

  Therefore, after the resin material is supplied into the cavity, the transfer path is contaminated by the resin or filler when the resin material storage frame or the film tension frame material is transferred in order to store the next resin material in the resin material storage portion. Is reduced. This transfer path is also used as a carry-in path for carrying the substrate before resin molding into the mold, and a carry-out path for carrying out the resin molded product after resin molding from the mold. It is possible to reduce the contamination of the substrate and the resin molded product with the resin and the filler. In addition, since the resin material accommodated in the resin material accommodating portion is introduced into the cavity without adhering to the film tension frame material, the required amount of resin material can be more accurately placed in the cavity than the conventional technique described above. Can be supplied.

  When the resin material is transferred to the mold, the film tension frame material may vibrate up and down relatively with respect to the resin material housing frame. When such vibration occurs in the conventional resin material transfer unit 90 described above, the resin material enters between the film tension frame member 93 and the release film F, and the resin material accommodation frame is formed from the lower surface of the film tension frame member 93. It adheres to the lower surface of 91. Patent Document 1 describes that a spring 96 (see FIG. 10) for biasing the film tension frame member 93 downward is used to suppress vibration of the film tension frame member. On the other hand, in the present invention, in order to solve such a problem, when the resin material is transferred to the mold, the driving unit maintains the state of pressing the film tension frame material from above, thereby the film tension frame. A state in which the material is pressed from above toward the stop member can be maintained. As a result, the vibration of the film tension frame material can be suppressed, thereby reducing the intrusion of the resin material between the film tension frame material and the release film, so that the resin material is compressed and fixed to the film tension frame material. It becomes difficult to do. Moreover, the above-mentioned action of removing the resin material adhering to the film tension frame material (without compression) and the action of reducing the resin material from entering between the film tension frame material and the release film are common. It can play by the structure of.

  The stop part may be formed integrally with the resin material housing frame, or may be formed of a member different from the resin material housing frame.

  In the method of manufacturing a resin molded product, the film tension frame material is moved from above by a pressing member from the time when the resin material is supplied to the inside of the film tension frame material until the resin material accommodating portion is accommodated in the cavity of the mold. It is desirable to maintain the pressing state.

  Hereinafter, a more specific embodiment of the resin molding apparatus and the resin molded product manufacturing method according to the present invention will be described with reference to FIGS.

  The resin molding apparatus according to this embodiment includes a resin material transfer unit 10 illustrated in FIG. 1 and a compression molding unit 20 (described later) having a mold clamping device and the like. First, the configuration and operation of the resin material transfer unit 10 will be described.

  The resin material transfer unit 10 includes a resin material storage frame 11, an adsorption mechanism 12, a film tension frame member 13, a stop unit 14, a transport mechanism 15, a pressing member 16, and a drive unit 17.

  The resin material accommodation frame 11 has a rectangular opening 111 corresponding to the planar shape of the cavity MC of the lower mold LM described later. The suction mechanism 12 has a groove provided on the lower surface of the resin material housing frame 11 and a suction device (not shown) for sucking air in the groove. The film tension frame member 13 is a rectangular frame member corresponding to the shape of the opening 111, and is a ring having a reverse L-shaped cross section having a protrusion 131 on the outer peripheral side. The stop portion 14 is a portion in which a lower end portion on the inner peripheral side of the resin material housing frame 11 projects inward. The film tension frame member 13 is provided so as to be movable up and down relatively with respect to the resin material housing frame 11, and the downward movement is stopped when the protruding portion 131 hits the stop portion 14. Yes. The transport mechanism 15 grips a pair of resin material housing frame grips 151 that sandwich and grip the resin material housing frame 11 from the side, and grips a release film provided under each resin material housing frame grip 151. And a moving means (not shown) for moving the resin material storage frame gripping portion 151 and the film gripping portion 152.

  The pressing member 16 is a member that presses the upper surface of the film tension frame member 13, and a pin 162 that contacts the film tension frame member 13 when pressed is attached to the lower surface of the plate portion 161. The drive unit 17 includes a cylinder 171, a piston 172 pushed downward from the cylinder 171, and a power source (not shown) that moves the piston 172. The tip of the piston 172 is fixed to the upper surface of the plate portion 161 of the pressing member 16. With the configuration of the pressing member 16 and the driving unit 17, the pressing member 16 descends and presses the film tension frame member 13 when the piston 172 is pushed downward. In this embodiment, two sets of two plates 162 attached to one plate portion 161 (therefore, two plate portions 161 and two pins 162 are combined) are used, and each plate portion 161 has a piston 172. 1 (and accordingly, two pistons 172 and one cylinder 171) are used (FIG. 2). A total of four pins 162 press the four corners of the rectangular film tension frame member 13 (FIG. 3).

  Operation | movement of the resin material transfer part 10 in the resin molding apparatus of this embodiment is demonstrated using FIG.4 and FIG.5. First, the release film F is stretched on the upper surface of the flat table TB. At that time, by providing a suction device for sucking gas from the upper surface of the table TB, the release film F can be fixed on the table TB. Next, the resin material storage frame 11 and the film tension frame member 13 are placed on the release film F by the transport mechanism 15 (FIG. 4A). As a result, the film tension frame member 13 moves upward relative to the resin material housing frame 11 due to the reaction from the upper surface of the table TB, and the protruding portion 131 is separated from the stop portion 14. . At this time, the pressing member 16 does not press the upper surface of the film tension frame member 13.

  Next, the resin material P is supplied from the resin material supply device to the inside of the film tension frame member 13 (b). As the resin material P, for example, a mixture of a resin made of epoxy resin powder and a filler made of silica powder can be used. As the supply apparatus and supply method for the resin material P, for example, a known apparatus and method described in Patent Document 2 can be used.

  Next, the pressing member 16 is lowered by the driving unit 17 and the upper surface of the film tension frame member 13 is pressed by the pressing member 16 (c). Then, the release film F is sucked by the suction mechanism 12, the resin material housing frame 11 is sandwiched by the resin material housing frame gripping portion 151, and the periphery of the release film F is gripped by the film gripping portion 152. Then, the resin material storage frame 11 is lifted by the transport mechanism 15 (d). At that time, by appropriately setting the suction strength of the release film F by the suction mechanism 12, the film tension frame member 13 is lowered to a position where it comes into contact with the stop portion 14 by its own weight, and the release film F Is in close contact with the lower surface of the resin material housing frame 11 while being pushed and extended by the film tension frame member 13. Thus, tension is applied to the release film F on which the resin material P in the film tension frame member 13 is placed, and the resin material accommodation portion PC is formed by the film tension frame member 13 and the release film F. . In addition, when wrinkles are generated in the release film F at this time, the film gripping part 152 may reduce the generation of wrinkles by pulling the release film F in the lateral direction of FIG. Further, in order to reliably suppress vibration during the movement of the entire resin material transfer unit 10 described later, the force for pressing the upper surface of the film tension frame member 13 by the pressing member 16 at the stage (d) is increased, You may maintain the state which increased this force.

  Next, while maintaining the state in which the upper surface of the film tension frame member 13 is pressed by the pressing member 16, the transport mechanism 15 moves the entire resin material transfer unit 10 to a position directly above the cavity MC of the lower mold LM (e). Thus, by maintaining the state where the upper surface of the film tension frame member 13 is pressed by the pressing member 16 during the movement, the state of pressing the film tension frame member 13 from above toward the stop portion 14 is maintained. The vibration of the moving film tension frame member 13 is suppressed. Therefore, it is reduced that the resin material P enters between the film tension frame member 13 and the release film F or between the resin material accommodation frame 11 and the release film F, and the resin material P is compressed and the film tension frame member. 13 and the resin material housing frame 11 are difficult to adhere.

  Next, the resin material container PC is introduced into the cavity MC by lowering the entire resin material transfer unit 10 moved to just above the cavity MC (f). Then, after releasing the suction of the release film F by the suction mechanism 12 and the grip by the film gripping part 152, the resin material housing frame 11 is raised (g).

  Subsequently, the operation of moving the pressing member 16 up and down by the driving unit 17 is repeated (FIG. 5). Accordingly, the upper surface of the film tension frame member 13 is repeatedly pressed so as to be hit by the pins 162 of the pressing member 16, and vibration is applied to the film tension frame member 13. As a result, the resin material P adhering to the film tension frame member 13 is detached from the film tension frame member 13 and falls into the cavity MC. Accordingly, since the resin material supplied from the resin material supply device 10 to the resin material transfer unit 10 is introduced into the cavity MC without remaining attached to the film tension frame material, the required amount of resin material can be accurately added. It can be supplied into the cavity MC.

  Thereafter, the entire resin material transfer unit 10 is returned to the table TB. At that time, since the resin material P has already detached from the film tension frame member 13, the transport path does not fall on the transport path (transfer path, return path), and the transport path is not the resin material P (resin and filler). ) To reduce contamination.

  Although the compression molding part 20 is the same as that in the conventional resin molding apparatus, a structure and operation | movement are demonstrated easily using FIG. 6 below.

  In the compression molding unit 20, tie bars 22 (four in total) are erected at four corners of the lower fixed plate 211, and a rectangular upper fixed plate 212 is provided near the upper end of the tie bar 22. A rectangular movable platen 23 is provided between the lower fixed platen 211 and the upper fixed platen 212. The movable platen 23 is provided with holes through which the tie bars 22 pass at the four corners, and can move up and down along the tie bars 22. A mold clamping device 24 that is a device for moving the movable platen 23 up and down is provided on the lower fixed platen 211. A lower heater 251 is disposed on the upper surface of the movable platen 23, and a lower mold LM having a cavity MC is provided on the lower heater 251. A suction port (not shown) is provided on the inner surface of the cavity MC, and when the resin material container PC is introduced into the cavity MC as described above, the suction is performed from the suction port, thereby allowing the inner surface of the cavity MC to be sucked. The release film F of the resin material container PC is in close contact with the resin material container PC. An upper heater 252 is disposed on the lower surface of the upper fixed platen 212, and an upper mold UM is attached below the upper heater 252. A substrate S on which a semiconductor chip is mounted can be attached to the lower surface of the upper mold UM.

  The operation of the compression molding unit 20 is as follows. First, the substrate S on which the semiconductor chip is mounted is attached to the lower surface of the upper mold UM by a substrate moving mechanism (not shown). Next, the resin material container PC is introduced into the cavity MC by the resin material transfer unit 10 (described above), and the release film F is brought into close contact with the inner surface by suction from the suction port on the inner surface of the cavity MC. After the operation of raising and lowering the pressing member 16 is repeated and the resin material P adhering to the film tension frame member 13 is separated from the film tension frame member 13 (described above), the resin material transfer unit 10 is moved from the compression molding unit 20 to the base. Return to TB. . Note that the attachment of the substrate S to the upper mold UM and the introduction of the resin material accommodating portion PC into the cavity MC may be performed in the reverse order.

  In this state, the lower heater 251 softens the resin material P in the cavity MC by heating, and the upper heater 252 heats the substrate S. While the resin material P and the substrate S are heated, the movable platen 23 is raised by the mold clamping device 24, the mold (upper mold UM and lower mold LM) is clamped, and the resin material P is cured. After the resin material P is cured, the mold is opened by lowering the movable platen 23 by the mold clamping device 24. Thereby, a resin-sealed product (resin-molded product) in which the semiconductor chip is resin-sealed is obtained. The obtained resin-sealed product is smoothly released from the lower mold LM because the inner surface of the lower mold LM is covered with the release film.

  With reference to FIG. 7, another embodiment of the resin molding apparatus according to the present invention will be described. The resin molding apparatus 30 according to this embodiment includes a material receiving module 31, a molding module 32, and a dispensing module 33. The material receiving module 31 is a device for receiving the resin material P and the substrate S from the outside and sending them to the molding module 32, and includes a substrate receiving unit 311 and a resin material supply unit 312. One molding module 32 includes one set of the above-described compression molding section 20. Although three molding modules 32 are shown in FIG. 7, an arbitrary number of molding modules 32 can be provided in the resin molding apparatus 30. Even after the resin molding apparatus 30 is assembled and used, the number of molding modules 32 can be increased or decreased. The payout module 33 carries the resin molded product manufactured by the molding module 32 from the molding module 32 and holds it, and has a resin molded product holding portion 331.

  A substrate S, a resin material transfer unit 10, and a main transfer device 36 for transferring the resin molded product are provided so as to penetrate the material receiving module 31, one or a plurality of forming modules 32, and the dispensing module 33. Further, in each module, a sub-transport device 37 that transports the substrate S, the resin material transfer unit 10, and the resin molded product between the main transport device 36 and the devices in the module is provided. The main transport device 36 and the sub transport device 37 have a function as moving means in the transport mechanism 15 described above.

  The operation of the resin molding apparatus 30 will be described. The board | substrate S is hold | maintained at the board | substrate receiving part 311 of the material reception module 31 by the user. The main transport device 36 and the sub transport device 37 transport the substrate S from the substrate receiving unit 311 to the compression molding unit 20 in one of the molding modules 32, and the substrate S is an upper mold UM of the compression molding unit 20. Attach to. Next, in the material receiving module 31, the resin material P is supplied to the resin material transfer unit 10 by the above-described method (FIGS. 4A to 4E). The resin material transfer unit 10 is moved to the position immediately above the cavity MC of the lower mold LM in the compression molding unit 20 of the molding module 32 by the sub-conveying device 37 provided in one of the main conveyance device 36 and the molding module 32. It is moved (FIG. 4 (f)), and the resin is supplied to the cavity MC by the above-described method (FIGS. 4 (g), (h), FIG. 5). Next, after the resin material transport unit 10 is carried out to the material receiving module 31 by the main transport device 36 and the sub transport device 37, the compression molding unit 20 performs compression molding. While the compression molding unit 20 is performing compression molding, by performing the same operation as before on the other compression molding units 20, the plurality of compression molding units 20 perform compression in parallel while shifting the time. Molding can be performed. The resin molded product obtained by the compression molding is carried out from the compression molding unit 20 by the main conveyance device 36 and the sub conveyance device 37, and carried into the resin molded product holding unit 331 of the dispensing module 33 and held therein. The user can appropriately take out the resin molded product from the resin molded product holding portion 331.

  Needless to say, the present invention is not limited to the above embodiments, and various modifications are possible.

  In addition, the resin molding apparatus according to the present invention exhibits the above-mentioned effects remarkably when using a powdery resin material, but when using other forms of resin materials such as granules and liquids. Can also be used. For example, in the granular resin material, a fine powder having a smaller particle size may adhere to the surface of the granule. Even if such fine powder once adheres to the film tension frame member, the fine powder is removed from the film tension frame by repeating the operation of pressing the film tension frame member with the pressing member by moving the pressing member up and down by the drive unit. It can be detached from the material, thereby reducing the contamination of the conveying path with the fine powder.

DESCRIPTION OF SYMBOLS 10, ... Resin material transfer part 11, 91 ... Resin material accommodation frame 111,911 ... Opening part 12, 92 ... Adsorption mechanism 13, 93 ... Film tension frame material 131,931 ... Protrusion part 14,94 ... Stop part 15,95 ... transport mechanism 151, 951 ... resin material housing frame gripping part 152, 952 ... film gripping part 16 ... pressing member 161 ... pressing member plate part 162 ... pressing member pin 17 ... driving part 171 ... cylinder 172 ... piston 20 ... compression Molding unit 211 ... Lower fixed platen 212 ... Upper fixed platen 22 ... Tie bar 23 ... Movable platen 24 ... Clamping device 251 ... Lower heater 252 ... Upper heater 30 ... Resin molding device 31 ... Material receiving module 311 ... Substrate receiving unit 312 ... Resin Material supply unit 32... Molding module 33... Dispensing module 331... Molded resin product holding unit 36. ... spring

Claims (3)

a) a resin material containing frame having an opening;
b) an adsorption mechanism for adsorbing a film to the lower surface of the resin material containing frame so as to cover the lower surface of the resin material containing frame including the opening;
c) a film tension frame material provided so as to be capable of ascending and descending so as to surround the inner periphery of the resin material accommodation frame;
d) a stop portion for stopping the film tension frame member at a predetermined height position;
e) a pressing member for pressing the film tension frame member from above;
f) A resin molding apparatus comprising: a drive unit that moves the pressing member up and down. Arranging the film so as to cover the lower surface including the opening of the resin material containing frame having the opening;
Supplying a resin material to the inside of a film tension frame member provided so as to be movable up and down so as to surround the inner periphery of the resin material housing frame;
By adsorbing the film to the lower surface of the resin material housing frame, the film tension frame material is lowered by raising the resin material housing frame and stopped at a predetermined height position so that the film moves downward. A step of projecting and forming a resin material accommodating portion in which the resin material is accommodated;
Storing the resin material container in a cavity of a mold;
Releasing the adsorption of the film to the lower surface of the resin material housing frame, and raising the resin material housing frame;
And a step of pressing the film tension frame member from above with a pressing member and pulling the pressing member upward.   Maintaining a state in which the film tension frame material is pressed from above by the pressing member from the time when the resin material is supplied to the inside of the film tension frame material until the resin material accommodating portion is accommodated in the cavity of the mold. The method for producing a resin molded product according to claim 2.

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