JP2018015831A - Work carrier and method for manufacturing work carrier - Google Patents

Abstract

A work carrier having high integration between a carrier substrate and a resin insert portion is provided. A work carrier provided with a resin insert portion along an inner peripheral surface of a work holding hole formed in a metal carrier substrate. In the work holding hole 2, a positively inclined surface (positively inclined portion 21) and a negatively inclined surface (negatively inclined portion 22) whose inclinations with respect to the front and back directions are opposite to each other are continuously formed in the circumferential direction. The resin insert portion 3 is formed in close contact with the positive inclined surface and the negative inclined surface. [Selection diagram] Fig. 1

Description

  The present invention relates to a work carrier used for holding a work when a thin plate-like work such as silicon wafer, glass, ceramics, or quartz is polished by a polishing apparatus, and a method for manufacturing the work carrier.

  It is known to hold a work on a work carrier having a work holding hole when polishing both sides or one side of a work such as a silicon wafer by a polishing apparatus (see Patent Documents 1-3).

  Since the carrier substrate that is the main body of the work carrier is formed of a hard metal material such as SK steel or stainless steel, if the workpiece is held directly in the workpiece holding hole drilled in the carrier substrate, May come into contact with the inner peripheral surface of the work holding hole, and the work may be damaged such as cracking or chipping.

  Therefore, as disclosed in Patent Documents 1-3, a soft insert made of synthetic resin is attached along the inner peripheral surface of the work holding hole, and processing to prevent damage to the work during polishing is performed. .

  Patent Document 1 discloses an occlusal structure in which convex teeth are provided at intervals in the circumferential direction on the inner peripheral surface of a work holding hole, and convex teeth of a synthetic resin protective ring (insert) are fitted in a tooth gap between the convex teeth. Is disclosed. This document also describes that inclined surfaces in opposite directions are alternately provided on the side edges of the convex teeth in order to make it difficult for the synthetic resin protective ring to come off in the vertical direction.

  On the other hand, Patent Document 2 discloses a structure in which an upwardly opening tapered surface is formed on the inner peripheral surface of the holding hole, and the resin insert is fitted into the holding hole through the tapered surface.

  In Patent Document 3, a groove is provided along the inner peripheral surface of the work holding hole of the carrier substrate, and a soft ring-shaped insert is provided by injection molding so that a synthetic resin material enters the groove. Is described.

Japanese Patent No. 3552108 Japanese Patent No. 4605233 Japanese Patent No. 5114113

  However, the occlusal structure disclosed in Patent Document 1 is a structure in which an inclined surface is provided only on the side edge of the convex tooth, and no inclined surface is provided in the back of the tooth gap. That is, the inclined surface is not provided continuously on the inner peripheral surface of the work holding hole.

  Moreover, since the taper surface of the holding hole disclosed in Patent Document 2 is only an upwardly inclined surface, it is possible to prevent the resin insert from falling downward, but to prevent it from coming off upward. I can't.

  Accordingly, an object of the present invention is to provide a work carrier having a high unity between the carrier substrate and the resin insert portion and a method for manufacturing the work carrier.

  In order to achieve the above object, a work carrier according to the present invention is a work carrier provided with a resin insert portion along an inner peripheral surface of a work holding hole formed in a metal carrier substrate, the work holding In the hole, a positively inclined surface and a negatively inclined surface that are alternately inclined in the circumferential direction are alternately formed in the circumferential direction, and the resin insert portion is in close contact with the positively inclined surface and the negatively inclined surface. It is formed.

  Here, the workpiece holding hole may be configured such that unevenness is formed in the circumferential direction, and the positive inclined surface or the negative inclined surface is formed over the entire length of the unevenness.

  Further, the positive inclined surface may be formed continuously with a plurality of irregularities, and the negative inclined surface may be formed continuously with a plurality of adjacent irregularities.

  Further, the invention of the method for manufacturing a work carrier is any one of the above-described methods for manufacturing a work carrier, wherein an interval is provided in a circumferential direction from the front side of the carrier substrate in order to drill the work holding hole in the carrier substrate. Cutting the positive inclined surface, forming the workpiece holding hole by cutting the negative inclined surface between the positive inclined surface from the back side of the carrier substrate, and the workpiece holding hole. And a step of providing a resin insert portion by injection molding.

  The work carrier of the present invention configured as described above is formed by continuously forming a positive inclined surface and a negative inclined surface that are opposite to each other in the circumferential direction of the work holding hole, and the inclined surfaces are opposite to each other. A resin insert portion is provided in close contact with.

  By providing a positive inclined surface and a negative inclined surface that are opposite to each other, it is possible to prevent the resin insert portion from falling out of the work holding hole in both the front and back directions of the carrier substrate, and the inclined surface Since it is continuously provided in the circumferential direction of the workpiece holding hole, the holding force for holding the resin insert portion by the workpiece holding hole can be increased. For this reason, it can be set as the work carrier with high integrity of a carrier substrate and a resin insert part.

  In particular, by forming unevenness in the circumferential direction of the work holding hole, the carrier substrate and the resin insert portion are formed by the synergistic effect of the fitting by the unevenness and the positive inclined surface and the negative inclined surface formed over the entire length of the unevenness. High integrity can be ensured. Moreover, if a positively inclined surface and a negatively inclined surface are formed continuously with a plurality of irregularities, cutting can be performed efficiently.

  Further, in the work carrier manufacturing method invention, the work substrate includes a step of cutting the positive inclined surface at a circumferential interval from the front side of the carrier substrate and a step of cutting the negative inclined surface from the back side of the carrier substrate. The holding hole can be drilled and the inclined surface can be formed simultaneously, which is efficient.

It is a top view which expands and demonstrates the internal peripheral surface vicinity of the workpiece | work holding hole of the workpiece | work carrier of this Embodiment. It is a top view explaining schematic structure of a work carrier. It is a flowchart explaining the process of the manufacturing method of the work carrier of this Embodiment. It is a perspective view which expands and demonstrates the inner peripheral surface vicinity of a workpiece | work holding hole. It is sectional drawing seen in the AA arrow direction of FIG. It is sectional drawing seen in the BB arrow direction of FIG. It is sectional drawing seen in the CC arrow direction of FIG. It is sectional drawing seen in the DD arrow direction of FIG. It is sectional drawing of the same position as FIG. 5A explaining the structure which provided the resin insert part in the internal peripheral surface of a workpiece | work holding hole. It is sectional drawing of the same position as FIG. 5B explaining the structure which provided the resin insert part in the internal peripheral surface of a workpiece | work holding hole. It is sectional drawing of the same position as FIG. 5C explaining the structure which provided the resin insert part in the internal peripheral surface of a workpiece | work holding hole. It is sectional drawing of the same position as FIG. 5D explaining the structure which provided the resin insert part in the internal peripheral surface of a workpiece | work holding hole. It is a top view which expands and demonstrates the internal peripheral surface vicinity of the workpiece | work holding hole of an Example. It is sectional drawing seen in the EE arrow direction of FIG. It is sectional drawing seen in the FF arrow direction of FIG. It is a top view explaining the schematic structure of the work carrier of another embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are diagrams for explaining the configuration of the work carrier 10 according to the present embodiment. FIG. 2 shows the overall schematic configuration, and FIG. 1 is an enlarged view of the vicinity of the inner peripheral surface of the workpiece holding hole 2. Show.

  The work carrier 10 is used by being attached to a flat polishing apparatus that polishes both or one side of a work such as a silicon wafer or glass. For example, a flat surface polishing apparatus that polishes both surfaces of a workpiece is an upper surface plate and a lower surface plate that are surface plates, a sun gear that is rotatably disposed at the center of the upper surface plate and the lower surface plate, and an upper surface plate and a lower surface plate. And an internal gear arranged on the outer peripheral side of the panel.

And the work carrier 10 as shown in FIG. 2 is arrange | positioned between the upper surface plate and lower surface plate of a plane polishing apparatus.
The work carrier 10 has a disk-shaped main body formed of a metal carrier substrate 1. For example, circular work holding holes 2,... And abrasive supply holes 12,. A resin insert portion 3 is provided along the inner peripheral surface of the workpiece holding hole 2.

  The work carrier 10 is provided with a tooth portion (not shown) that meshes with the sun gear and the internal gear in the outer shape portion 11 serving as an outer edge, and rotates and revolves as the sun gear and the internal gear rotate. Yes. Then, due to the rotation and revolution of the work carrier 10, both surfaces of the work arranged in the work holding hole 2 of the work carrier 10 are polished.

  The carrier substrate 1 is cut out from a metal plate into a disk shape. As the metal plate, stainless steel (SUS), high carbon chromium bearing steel, carbon tool steel (SK steel), high speed tool steel, alloy tool steel, high tensile steel, titanium, and the like can be used.

  On the other hand, the resin insert portion 3 is formed of a synthetic resin material. As the synthetic resin material, polyamide (PA), polyacetal (POM), polyimide (PI), polyvinyl chloride (PVC), cloth bake, polyamideimide (PAI), polycarbonate (PC), or the like can be used. As will be described later, when the resin insert portion 3 is provided by injection molding, a thermoplastic resin is used.

  As shown in FIG. 1, unevenness is continuously formed in the circumferential direction on the inner peripheral surface of the work holding hole 2 of the present embodiment in order to enhance the integrity with the resin insert portion 3. As the irregularities, concave portions 211 (221) recessed toward the carrier substrate 1 and convex portions 212 (222) protruding toward the center side of the work holding hole 2 are alternately provided.

The concave portions 211 and 221 shown in FIG. 1 are formed in a trapezoidal shape (wedge shape) on the back side (carrier substrate 1 side) in a plan view, and the convex portions 212 and 222 are open side (work holding hole 2 in a plan view). Is formed in a wide trapezoidal shape (wedge shape). The concave portions 211 and 221 and the convex portions 212 and 222 may all have different planar shapes, but in the present embodiment, the convex portions 212 and 222 having substantially the same planar shape as the concave portions 211 and 221 having substantially the same planar shape. A case where 222 is repeatedly formed will be described.
The planar shape of the unevenness is not limited to the wedge shape, and may be any planar shape such as a shape formed by a curve such as a sine wave or a shape without a taper such as a rectangular wave.

  FIG. 4 is a perspective view showing the concave portions 211 and 221 and the convex portions 212 and 222. As shown in the cross-sectional views of FIGS. 5A and 5B as viewed in the direction of arrows AA and BB in FIG. 4, the inner peripheral surface of the convex portion 212 and the concave portion 211 on the workpiece holding hole 2 side is The surface of the carrier substrate 1 is inclined with respect to the front and back direction. The inclined surface spreading from the front side toward the back side is defined as a positive inclined surface 210.

  Then, the range in which the forward inclined surface 210 is formed is defined as the forward inclined portion 21 as shown in FIG. The forward inclined portion 21 is composed of two concave portions 211 and 211 and two convex portions 212 and 212. That is, the positive inclined surface 210 is continuously provided on the side surface exposed to the work holding hole 2 side of the concave portion 211 and the convex portion 212.

  On the other hand, as shown in the sectional views of FIGS. 5C and 5D as viewed in the direction of arrows CC and DD in FIG. 4, the inner periphery of the convex portion 222 and the concave portion 221 on the workpiece holding hole 2 side. The surface is also inclined with respect to the front and back direction of the carrier substrate 1. The inclined surface that narrows from the front side toward the back side is defined as a negative inclined surface 220.

  A range where the negatively inclined surface 220 is formed is defined as a negatively inclined portion 22 as shown in FIG. The negative inclined portion 22 includes two concave portions 221, 221 and two convex portions 222, 222. That is, the negative inclined surface 220 is continuously provided on the side surface exposed to the workpiece holding hole 2 side of the concave portion 221 and the convex portion 222.

  As shown in the cross-sectional views of FIGS. 6A to 6D, the resin insert portion 3 is formed in close contact with the positive inclined surface 210 and the negative inclined surface 220, respectively. That is, at the location where the positive inclined surface 210 is provided on the carrier substrate 1 side, the facing surface to which the resin insert portion 3 is closely attached becomes the negative inclined surface 32 (see FIGS. 6A and 6B).

  On the other hand, in the place where the negative inclined surface 220 is provided on the carrier substrate 1 side, the facing surface to which the resin insert portion 3 is in close contact is the positive inclined surface 31 (see FIGS. 6C and 6D). The inner side surface 33 on the center side of the workpiece holding hole 2 of the resin insert portion 3 is all a vertical surface.

Next, the manufacturing method of the work carrier 10 of this Embodiment is demonstrated, referring FIG.
First, a metal plate is installed in a laser cutting machine, and the metal plate is cut from the front side (step S1). Here, the “front side” of the metal plate refers to the surface on which the cutting process is performed first, and the opposite side surface as the “back side”. In the following description, the cutting process from the front side is sometimes referred to as “front processing”, and the cutting process from the back side is described as “back processing”.

  When laser processing is performed by a laser cutting machine, the cut surface becomes an inclined surface that spreads from the front side to the back side (see FIGS. 5A and 5B). In step S1, cutting in the range of “surface processing” shown in FIGS. 1 and 4 is performed. The inclined surface formed by this surface processing becomes the positive inclined surface 210. The forward inclined portion 21 that performs surface processing is formed by continuously cutting the concave portion 211, the convex portion 212, the concave portion 211, and the convex portion 212 into the positive inclined surface 210.

  When reaching the back machining area, the cutting process is temporarily interrupted, and the position where the laser beam is irradiated is moved to the start point of the next adjacent front machining area across the back machining area. In this way, intermittent cutting of the surface processing region is performed at intervals in the circumferential direction of the work holding hole 2.

  In the case of the work carrier 10 shown in FIG. 2, all the surface processing regions in the three work holding holes 2, 2, 2 of the carrier substrate 1 are cut. Then, the metal plate is reversed, and the process proceeds to a cutting process from the back side of the metal plate (step S2).

  When a metal plate placed on the back side is installed in the laser cutting machine, the cutting lines cut in step S1 appear at intervals in the circumferential direction. In the back processing, three workpiece holding holes 2, 2, and 2 are cut out by performing a cutting process that connects intermittent cutting lines.

  Also in the back processing, the cut surface is formed as an inclined surface that spreads from the back side to the front side (see FIGS. 5C and 5D). The inclined surface formed by this back processing becomes the negative inclined surface 220. The negatively inclined portion 22 that performs the back processing is continuously cut into the negatively inclined surface 220 by the concave portion 221, the convex portion 222, the concave portion 221, and the convex portion 222.

  Then, when the cutting line is reached by the front processing, the cutting processing is temporarily interrupted, and the position where the laser beam is irradiated is moved to the start point of the next adjacent back processing region across the front processing region. In this way, the intermittent cutting process of the back working region is performed until the cutting line of the work holding hole 2 is connected by one round.

  Further, in step S2, the outer shape portion 11 and the abrasive supply holes 12,. Then, lapping and polishing for adjusting the thickness of the carrier substrate 1 are performed (step S3).

  In the step S4, the resin insert portion 3 is provided on the inner peripheral surfaces of the workpiece holding holes 2,. The resin insert portion 3 is provided by synthetic resin injection molding.

  For example, it is possible to perform injection molding by installing a mold at a position to be the inner side surface 33 shown in FIGS. 6A to 6D, injecting and injecting a synthetic resin heated and melted inside, and solidifying by cooling. . Further, when the mold is not installed along the inner surface 33, a cutting process for forming the inner surface 33 is performed after injection molding.

Next, the effect | action of the manufacturing method of the work carrier 10 of this Embodiment and the work carrier 10 is demonstrated.
The work carrier 10 according to the present embodiment configured in this way is formed in such a manner that a positive inclined surface 210 and a negative inclined surface 220 are alternately formed in the circumferential direction of the work holding hole 2 so that the inclination with respect to the front and back directions is opposite. Then, the resin insert portion 3 is provided in close contact with the inclined surfaces (210, 220).

By providing the positive inclined surface 210 and the negative inclined surface 220 that are opposite in inclination, it is possible to prevent the resin insert portion 3 from falling out of the workpiece holding hole 2 in either the front or back direction of the carrier substrate 1. become.
For example, when the resin insert portion 3 is provided by injection molding, shrinkage occurs when cooled and solidified. However, if the inclined surfaces (210, 220) in both directions are provided, the resin insert portion 3 is somewhat shrunk. Can also be prevented from falling off.

  Moreover, since the positive inclined surface 210 and the negative inclined surface 220 are not only continuous in the range of the positive inclined portion 21 and the negative inclined portion 22, respectively, but are continuously provided in the circumferential direction of the workpiece holding hole 2, resin The opposite surface of the insert portion 3, that is, the surface in contact with the inner peripheral surface of the work holding hole 2 is supported over the entire circumference by the positive inclined surface 210 and the negative inclined surface 220, so that the work holding hole 2 becomes the resin insert portion 3. It is possible to increase the holding force for holding.

  Further, by forming irregularities (concave portion 211 and convex portion 212, concave portion 221 and convex portion 222) in the circumferential direction of the work holding hole 2, the positive inclined surface 210 formed by fitting with the concave and convex portions and the full length of the concave and convex portions. In addition, due to the synergistic effect with the negative inclined surface 220, the work carrier 10 with high integration between the carrier substrate 1 and the resin insert portion 3 can be obtained. In particular, when unevenness is continuously formed in the circumferential direction, the carrier substrate 1 and the resin insert portion 3 can ensure higher integrity.

  In addition, the positive inclined surface 210 (or the negative inclined surface 220) is continuous to the plurality of concave and convex portions (the concave portion 211, the convex portion 212, the concave portion 211, the convex portion 212 (or the concave portion 221, the convex portion 222, the concave portion 221, and the convex portion 222)). ) Is formed, the number of times of cutting is reduced and cutting can be performed efficiently.

  Furthermore, in the manufacturing method of the work carrier 10 according to the present embodiment, the step of cutting the forward inclined surface 210 at intervals from the front side of the carrier substrate 1 in the circumferential direction, and the circumferential direction from the back side of the carrier substrate 1 By the process of cutting the negative inclined surface 220, the cutting process for drilling the workpiece holding hole 2 and the forming of the inclined surfaces (210, 220) can be performed simultaneously.

  In addition, when cutting is performed, processing strain such as warpage and waviness may occur due to the stress and processing heat acting on the carrier substrate 1, but by performing cutting from both the front side and the back side, Processing strain can be offset and reduced. In particular, it is possible to process the carrier substrate 1 with higher flatness by alternately repeating the front surface processing and the back surface processing at equal intervals in the circumferential direction of the workpiece holding hole 2.

  Furthermore, in step S2 described above, it has been described that the outer shape portion 11 and the abrasive supply hole 12, ... are cut from the back side, but the present invention is not limited to this, and the carrier substrate having higher flatness and parallelism. In order to obtain 1, the outer shape part 11 and the abrasive supply holes 12,... Can also be cut from both the front side and the back side.

  Moreover, the resin insert part 3 can be attached to the carrier substrate 1 without using an adhesive by providing the resin insert part 3 by injection molding. For this reason, when only the resin insert part 3 is worn out, damaged or deteriorated and needs to be replaced, it can be easily removed only by heating the resin insert part 3.

  Hereinafter, an example of a form different from the work carrier 10 described in the above embodiment will be described with reference to FIGS. 7, 8A, and 8B. Note that the description of the same or equivalent parts as the contents described in the above embodiment will be described using the same terms or the same reference numerals.

  The work carrier 10 described in the embodiment is mainly configured by a carrier substrate 1A in which unevenness is not formed on the inner peripheral surface of the work holding hole 2A, and a resin insert portion 3A.

  That is, as shown in FIG. 7, the inner peripheral surface of the work holding hole 2 </ b> A of the carrier substrate 1 </ b> A has a positive inclined surface 210 having a substantially arc shape in plan view and a negative inclined surface 220 having a substantially arc shape in plan view in the circumferential direction. It is formed alternately and continuously.

  The length (range) of the positive inclined portion 21A formed by surface processing and the negative inclined portion 22A formed by back processing can be arbitrarily set. In the embodiment, a case will be described in which positive inclined portions 21A and negative inclined portions 22A having the same length are alternately and repeatedly formed.

  As shown in the respective cross-sectional views of FIGS. 8A and 8B, the resin insert portion 3A is formed in close contact with the positive inclined surface 210 of the positive inclined portion 21A and the negative inclined surface 220 of the negative inclined portion 22A. The

  In the work carrier 10 of the embodiment configured as described above, the positive inclined surface 210 and the negative inclined surface 220 are alternately formed in the circumferential direction of the work holding hole 2A, and the inclination with respect to the front and back directions is opposite to each other. A resin insert portion 3A is provided in close contact with the inclined surfaces (210, 220).

By providing the positive inclined surface 210 and the negative inclined surface 220 that are opposite in inclination, it is possible to prevent the resin insert portion 3A from falling out of the work holding hole 2A in both the front and back directions of the carrier substrate 1A. become.
For example, when the resin insert portion 3A is provided by injection molding, shrinkage occurs when it is cooled and solidified, but if the inclined surfaces (210, 220) in both directions are provided, the resin insert portion 3A is somewhat shrunk. Can also be prevented from falling off.

  Moreover, since the cutting | disconnection line is a circular arc shape and simple shape, 21 A of positive inclination parts and 22 A of negative inclination parts can be cut easily. However, since the positive inclined surface 210 and the negative inclined surface 220 are continuously provided in the circumferential direction of the workpiece holding hole 2A, the opposite surface of the resin insert portion 3A, that is, the surface in contact with the inner peripheral surface of the workpiece holding hole 2A is a positive inclined surface. By being supported by 210 and the negative inclined surface 220 over the entire circumference, the holding force for holding the resin insert portion 3A by the work holding hole 2A can be increased.

Furthermore, the alternately inclined positive and negative inclined surfaces 210 and 220 can prevent the resin insert portion 3A from moving (displaced) in the circumferential direction. That is, even if there is no unevenness, the anti-rotation function can be exhibited.
Other configurations and operational effects of the examples are substantially the same as those of the above-described embodiment, and thus the description thereof is omitted.

  The embodiments and examples of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiments and examples, and the gist of the present invention is not deviated. Design changes are included in the present invention.

  For example, in the said embodiment and Example, although the workpiece | work holding holes 2 and 2A demonstrated the circular workpiece | work carrier 10, it is not limited to this. For example, as shown in FIG. 9, the present invention can be applied to a work carrier 10B having a rectangular (including a square) work holding hole 2B. In short, the positive inclined surface 210 and the negative inclined surface 220 are continuously formed in the circumferential direction of the inner peripheral surface of the rectangular workpiece holding hole 2B, and the rectangular resin insert portion 3B is provided along the inner peripheral surface. Can do. Furthermore, the workpiece holding hole may have another shape other than a circle and a rectangle.

  In the above embodiment, the case where the carrier substrate 1 is cut by laser processing has been described. However, the present invention is not limited to this, and inclined surfaces (210, 220) such as water jet processing and wire processing can be formed. Any cutting process may be used.

The water jet process is a cutting process performed by ejecting high-pressure water from a nozzle, and can perform precise cutting while forming an inclined surface. Further, by adding an abrasive to water, cutting is possible even for a hard material.
The wire processing is a cutting process performed by applying a voltage between the wire line and the carrier substrate to cause discharge, and can perform precise cutting while forming an inclined surface.

  Furthermore, in the said embodiment, the positive inclination part 21 (negative inclination part 22) comprised by the two recessed parts 211,211 (221,221) and the two convex parts 212,212 (222,222) is made into an example. Although described, it is not limited to this, The number of unevenness | corrugations, such as the combination of 1 unevenness | corrugation and the combination of 5 unevenness | corrugations, can be set arbitrarily.

  In addition, switching between the positive inclined surface 210 and the negative inclined surface 220 can be performed for each side of the uneven surface in plan view. For example, the lower base of the trapezoidal irregularities is the positive inclined surface 210 and the adjacent side is the negative inclined surface 220, or the two sides adjacent to the lower base are the positive inclined surface 210 and the following two sides are the negative inclined surface 220. For example, the number of sides (the range of the front processing region and the back processing region) that allows the positive inclined surface 210 and the negative inclined surface 220 to be continuous can be arbitrarily set.

  Moreover, although the said embodiment demonstrated the case where an unevenness | corrugation was continuously formed in the perimeter of the internal peripheral surface of the workpiece | work holding hole 2, it is not limited to this, An unevenness | corrugation is constant in the circumferential direction or It may be provided intermittently at an arbitrary interval.

10, 10B Work carrier 1, 1A Carrier substrate 2, 2A, 2B Work holding hole 210 Positive inclined surface 21, 21A Positive inclined portion 211 Concave portion 212 Convex portion 220 Negative inclined surface 22, 22A Negative inclined portion 221 Concave portion 222 Convex portion 3, 3A, 3B resin insert

Claims (4)

A work carrier provided with a resin insert along the inner peripheral surface of a work holding hole formed on a metal carrier substrate,
In the work holding hole, a positive inclined surface and a negative inclined surface that are alternately inclined in the circumferential direction and opposite to the front and back directions are continuously formed,
The work carrier, wherein the resin insert portion is formed in close contact with the positive inclined surface and the negative inclined surface.   2. The work carrier according to claim 1, wherein the work holding hole is formed with unevenness in a circumferential direction, and the positive inclined surface or the negative inclined surface is formed over the entire length of the unevenness.   The work carrier according to claim 2, wherein the positive inclined surface is formed continuously with a plurality of irregularities, and the negative inclined surface is formed continuously with a plurality of irregularities adjacent thereto. . A method for manufacturing a work carrier according to any one of claims 1 to 3,
Cutting the forward inclined surface at intervals in the circumferential direction from the front side of the carrier substrate in order to drill the work holding hole in the carrier substrate;
Forming the workpiece holding hole by cutting the negative inclined surface between the positive inclined surfaces from the back side of the carrier substrate;
And a step of providing a resin insert portion by injection molding with respect to the workpiece holding hole.