JP2018014434A - Manufacturing method of multilayer board with built-in component and multilayer board with built-in component - Google Patents

Abstract

Provided is a method of manufacturing a multilayer board with a built-in component, in which a coil can be arranged at a desired position, and a multilayer board with a built-in component. Adhesives (61, 62, 63) are applied to the outer regions of the arrangement region of the electronic components (50, 51, 52) and the arrangement region of the coil (40) on the substrate (60) by printing, and the arrangement region of the electronic component on the substrate (60) The electronic components 50, 51, and 52 are disposed on the adhesive, the adhesive 61 is cured, and the electronic components 50, 51, and 52 are adhered, and the adhesives 62 and 63 in the area where the coil 40 is disposed are cured. The coil 40, which is formed by connecting the pattern and the outer winding pattern by the connecting portions 41, 42, 43, is arranged in a state where the coil 40 is positioned by the adhesives 62, 63 having the outer shape of the arrangement area of the coil 40. Laminate. [Selection diagram] FIG.

Description

  The present invention relates to a method for manufacturing a component-embedded multilayer substrate and a component-embedded multilayer substrate.

  In the method for manufacturing a circuit board disclosed in Patent Document 1, a first coil having a number of turns of 1 is formed in a planar shape from a metal plate, and is formed in a planar shape from the metal plate to other portions adjacent to both ends of the coil. A second coil having four turns connected via the connecting portion is formed, and the pair of the first coil and the second coil are overlapped to face each other with a resin plate on which a plurality of prepregs are stacked interposed therebetween. After that, the connection part is released from the connection.

Republished WO2011 / 027792

Incidentally, it is desired to arrange the coil at a desired position.
An object of the present invention is to provide a method for manufacturing a component-embedded multilayer substrate and a component-embedded multilayer substrate in which a coil can be arranged at a desired position.

  The invention according to claim 1 includes at least one component-embedded substrate having an insulating layer in which a plurality of turns of coils and electronic components are embedded, and the component-embedded multilayer substrate in which the component-embedded substrate is laminated. A first step of applying an adhesive to the outer shape of the arrangement region of the electronic component and the arrangement region of the coil on the base material by printing, and after the first step, the electron on the base material A second step of placing an electronic component in a placement region of the component and curing the adhesive to bond the electronic component and curing an adhesive having an outer shape of the placement region of the coil; and after the second step, A third step of arranging a coil in which a winding pattern and an outer winding pattern are connected by a connecting portion in a state where the coil is positioned with an adhesive having an outer shape in the arrangement region of the coil, and after the third step, the base material A fourth step of laminating a prepreg, that has a the gist.

  According to the first aspect of the present invention, in the first step, the adhesive is applied to the outer shape of the electronic component placement region and the coil placement region on the substrate by printing, and in the second step, after the first step. The electronic component is arranged in the arrangement region of the electronic component on the substrate, the adhesive is cured and the electronic component is adhered, and the outer shape adhesive in the arrangement region of the coil is cured. In the third step, after the second step, the coil in which the inner winding pattern and the outer winding pattern are connected by the connecting portion is arranged in a state where the coil is positioned with the outer shape adhesive in the arrangement region of the coil. In 4 processes, a prepreg is laminated | stacked on a base material after a 3rd process. Therefore, a coil can be arrange | positioned in a desired position.

  In the method for manufacturing a component-embedded multilayer substrate according to claim 1, the fifth step of deleting the joint portion of the coil after the prepreg is cured after the fourth step. It is good to have.

  According to a third aspect of the present invention, there is provided a component-embedded multi-layer substrate including at least one component-embedded substrate having an insulating layer in which a coil having a plurality of turns and an electronic component are embedded, and the component-embedded substrate is laminated. Then, the gist of the coil is that the cured adhesive is arranged on the outer shape of the arrangement area of the coil.

  According to invention of Claim 3, a coil is positioned with the adhesive agent after hardening arrange | positioned at the external shape of the arrangement | positioning area | region of a coil. Therefore, a coil can be arrange | positioned in a desired position.

  According to the present invention, the coil can be disposed at a desired position.

(A) is a schematic plan view of the component-embedded multilayer substrate in the embodiment, and (b) is a schematic cross-sectional view taken along line AA of (a). (A) is a top view for demonstrating the manufacturing method of a component built-in type multilayer substrate, (b) is sectional drawing in the AA of (a). (A) is a top view for demonstrating the manufacturing method of a component built-in type multilayer substrate, (b) is sectional drawing in the site | part corresponding to the AA line of (a), (c) is A of (a). FIG. (A) is a top view for demonstrating the manufacturing method of a component built-in type multilayer substrate, (b) is sectional drawing in the AA of (a). (A) is a top view for demonstrating the manufacturing method of a component built-in type multilayer substrate, (b) is sectional drawing in the AA of (a). (A) is a top view for demonstrating the manufacturing method of a component built-in type multilayer substrate, (b) is sectional drawing in the AA of (a). (A) is a top view for demonstrating the manufacturing method of a component built-in type multilayer substrate, (b) is sectional drawing in the AA of (a). (A) is a top view for demonstrating the manufacturing method of the component built-in type multilayer substrate in a comparative example, (b) is sectional drawing in the AA of (a).

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings.
As shown in FIGS. 1A and 1B, the component-embedded multilayer substrate 9 is formed by laminating a plurality of component-embedded substrates 10 and 11 via an insulating layer 31. The component-embedded substrate 10 includes a conductive layer 20, an insulating layer (resin layer) 30, and a wiring pattern 21. A planar type coil 40 is embedded in the insulating layer 30. Electronic components 50, 51, 52 are embedded in the insulating layer 30. An insulating layer 30 is formed on the conductive layer (a metal plate such as a copper plate) 20. The coil 40 is formed by punching a metal plate, specifically, for example, a copper plate into a desired shape. The coil 40 is a flat coil having a spiral shape as a winding pattern and having a number of turns of “2”. A wiring pattern 21 is formed on the insulating layer 30.

  The plurality of component-embedded substrates (10, 11) do not necessarily have the coil 40 and the electronic components 50 to 52, and the coil 40 and the electronic components 50 to 52 are included in at least one component-embedded substrate 10. If you do.

  As described above, the component-embedded multilayer substrate 9 includes at least one component-embedded substrate 10 having the insulating layer 30 in which a plurality of turns of the coil 40 and the electronic components 50 to 52 are housed. Are stacked. The kind of electronic components 50-52 is not ask | required. For example, a resistor, a capacitor, a switching element, and the like can be given.

  In the coil 40, the cured adhesives 62 and 63 are arranged on the outer shape of the arrangement area of the coil 40. Specifically, the cured adhesives 62 and 63 have a predetermined height, and can position the coil 40 when the coil 40 is disposed. Regarding the cured adhesives 62 and 63, a circular adhesive 63 is disposed on the center side of the coil 40 (center of the winding pattern). Further, a circular adhesive 62 is disposed on the outer diameter side of the coil 40 (the outer peripheral end of the winding pattern). That is, a wall surface is made on the center side (inner diameter portion of the winding pattern) of the coil 40 by the adhesive 63, and a wall surface is made on the outer diameter side (outer diameter side of the winding pattern) of the coil 40 by the adhesive 62. The coil 40 is positioned on the wall surface by the cured adhesives 62 and 63, and the coil 40 is placed at a desired position while maintaining a constant distance between the winding pattern 40a on the inner diameter side and the winding pattern 40b on the outer diameter side. Has been placed.

  A circular through hole 75 is formed at the center of the coil 40 (the center of the winding) in the component-embedded substrate 10. A cutout 76 and a through hole 77 are formed on the outer diameter side of the coil 40 (outer peripheral end of the winding pattern) in the component-embedded substrate 10. The through hole 75, the notch 76 and the through hole 77 penetrate the component built-in multilayer substrate 9.

  From one side of the component built-in multilayer substrate 9, the E-type core 80 is arranged so that the central leg 80 a passes through the through hole 75 and the both leg portions 80 b and 80 c pass through the notch 76 and the through hole 77. The I-type core 81 is disposed on the other surface of the component-embedded multilayer substrate 9 so that the front end surface of the central leg portion 80a of the E-type core 80 and the front end surfaces of both side leg portions 80b and 80c abut against each other.

Next, a method for manufacturing the component-embedded multilayer substrate 9 will be described.
As shown in FIGS. 2A and 2B, a base material 60 is prepared. The substrate 60 is a metal flat plate, for example, a copper flat plate.

  Then, as shown in FIGS. 3A and 3B, adhesives 61, 62, and 63 are applied to the outer shapes of the arrangement area of the electronic component and the arrangement area of the coil 40 on the base material 60 by screen printing. . Specifically, as shown in FIG. 3B, a patterned metal mask 65 is disposed on the upper surface of the substrate 60, and a liquid adhesive before curing is printed using the metal mask 65 to obtain a predetermined Place the adhesive before curing in position.

  After applying the adhesive using the metal mask 65, the metal mask 65 is removed from the upper surface of the substrate 60 as shown in FIG. Therefore, the adhesive 61 is arranged in the arrangement area of the square electronic component. The adhesive 63 is circular and is arranged to form a wall surface on the center side of the arrangement area of the coil 40. The adhesive 62 has a circular shape and is arranged to form a wall surface on the outer diameter side of the arrangement area of the coil 40. The adhesive (61, 62, 63) is a thermosetting adhesive.

  Next, as shown in FIGS. 4A and 4B, the electronic components 50, 51, 52 are arranged in the arrangement region of the electronic components in the base material 60 and the adhesive 61 is cured, so that the electronic components 50, 51, 52 and the adhesives 62 and 63 having the outer shape in the arrangement region of the coil 40 are cured. That is, the adhesive (61, 62, 63) is cured by heating.

  Thereafter, as shown in FIGS. 5A and 5B, the coil 40 is arranged in a state where the coil 40 is positioned by the adhesives 62 and 63 having the outer shape in the arrangement region of the coil 40. The coil 40 connects the inner winding pattern 40 a and the outer winding pattern 40 b by connecting portions 41, 42, and 43. That is, the coil 40 has a spiral shape and is a planar coil with the number of turns “2”, and has three connecting portions 41, 42, and 43. The connecting portion 41 connects the inner and outer patterns on the inner end side of the spiral coil. The connecting portion 43 connects the inner and outer patterns on the outer end side of the spiral coil. The connecting portion 42 connects the inner and outer patterns at an intermediate position between the inner end and the outer end of the spiral coil. The connecting portions 41, 42, 43 connect the inner winding pattern 40a and the outer winding pattern 40b.

  Since the coil 40 has the connecting portions 41, 42, and 43 as described above, the coil 40 is not deformed even when stress is applied by a springback or the like after punching from the copper plate. Moreover, since the coil 40 has the connection parts 41, 42, and 43, even if it touches the coil 40 with a hand, it does not deform | transform. In this way, the positional relationship between the parts of the coil 40 can be kept unchanged.

Thereafter, as shown in FIGS. 6A and 6B, the prepreg 70 and the conductive layer 20 are sequentially laminated on the base material 60.
Thereafter, the prepreg 70 is cured by heating and pressing with a lamination press to form the insulating layer 30. Thereafter, the substrate 60 is patterned by etching to form a wiring pattern 21. And the connection parts 41, 42, and 43 of the coil 40 are deleted as shown to Fig.7 (a), (b). Specifically, the through hole 45 passing through the connecting portion 41 is formed by a drill, and the connecting portion 41 is cut. A through hole 46 passing through the connecting portion 42 is formed by a drill, and the connecting portion 42 is cut. A through hole 47 passing through the connecting portion 43 is formed by a drill, and the connecting portion 43 is cut. In this way, the component built-in substrate 10 is created.

Note that the base material 60, the prepreg 70, and the conductive layer 20 may be formed by machining later, even if the through holes 75 and 77 and the notches 76 are provided in advance.
A plurality (two in the present embodiment) of component-embedded substrates 10 and 11 are prepared and laminated via a prepreg (31) to produce a component-embedded multilayer substrate 9. The insulating layer 31 is a cured prepreg between the component-embedded substrates 10 and 11.

  Further, as shown in FIGS. 1A and 1B, an EI type core composed of an E type core 80 and an I type core 81 is assembled with the knitted block (laminated body) turned upside down. Specifically, from one surface of the component built-in type multilayer substrate 9, the central leg portion 80 a of the E-type core 80 is passed through the through-hole 75, and both the leg portions 80 b and 80 c of the E-type core 80 are inserted into the notch 76 and the through-hole 77. The I-type core 81 is disposed on the other surface of the component-embedded multilayer substrate 9, and the front end surface of the central leg portion 80 a and the front end surfaces of both side leg portions 80 b and 80 c of the E-type core 80 are connected to the I-type core 81. Strike.

8A and 8B are comparative examples.
8A and 8B, a jig (guide shaft) 110 serving as a guide for the coil 120 is fixed to the substrate 100 in advance with an adhesive. Then, the coil 120 is placed in the guide jig 110 at the time of lamination, and the guide jig 110 is taken out from the substrate 100 after the lamination.

  Thus, in the comparative example, after forming the winding pattern in the coil, the gap between the inner diameter side winding pattern and the outer diameter side winding pattern is reduced by the stress due to the springback, There are problems that it is necessary to arrange a plurality of guide jigs in order to prevent the position of the winding pattern from shifting when embedding, and that it takes time to puncture the guide jigs after embedding the coils. That is, a guide is required to prevent the gap between the winding pattern on the inner diameter side and the winding pattern on the outer diameter side from being reduced due to the stress due to the spring back, and to prevent the coil winding pattern from being misaligned.

  In this embodiment, when applying an adhesive for fixing the electronic components 50, 51, 52, the adhesive 62, 63 is applied around the coil 40 to form a positioning wall surface (bank). Then, the coil 40 is put into the positioning wall surface (bank), the prepreg 70 and the conductive layer 20 are laminated, the prepreg 70 is cured, and then the connecting portions 41, 42, and 43 are cut with a drill.

  Therefore, in the coil to which the stress due to the spring back is applied, the distance between the winding pattern on the inner diameter side and the winding pattern on the outer diameter side is determined by the guide jig 110 in the comparative example of FIGS. In the positioning, the design value cannot be maintained, and the gap between the winding pattern on the inner diameter side and the winding pattern on the outer diameter side is difficult to fit in the intended interval.

  On the other hand, in the present embodiment, a gap between the winding pattern 40a on the inner diameter side and the winding pattern 40b on the outer diameter side can be secured at the connecting portions 41, 42, and 43 of the winding pattern until the coil 40 is fixed. The value can be maintained.

  Further, in the case of FIGS. 8A and 8B, the guide jig 110 requires a number for fixing the position, and includes the tolerance and manufacturing tolerance of the guide jig 110 itself, so that the positioning accuracy is lowered. In addition, an operation for setting the guide jig 110 occurs.

  On the other hand, in the present embodiment, positioning wall surfaces (banks) can be formed by the adhesives 62 and 63 for bonding and fixing the built-in electronic components 50, 51, and 52, and there is no occurrence of extra steps. In addition, positioning accuracy can be increased due to manufacturing tolerances only for the formation of positioning wall surfaces (banks).

  Further, regarding the removal of the guide jig 110, in the case of FIGS. 8A and 8B, the number of the jigs (guide shafts) 110 is as many as the number of jigs (guide shafts) 110, that is, 14 places in FIGS. 8A and 8B. Drilling is required, and a large number of holes are required. On the other hand, in this embodiment, only the number of the connecting portions (41, 42, 43), that is, three holes may be formed, and a small number of holes may be formed as compared with the comparative example.

  In this way, a part of the gap between the winding pattern 40a on the inner diameter side and the winding pattern 40b on the outer diameter side in the coil 40 is connected, and the dimension due to the stress due to the spring back after the change changes. Can be prevented. Further, the wall surfaces can be created and positioned by using the adhesives 62 and 63 at the time of mounting the built-in components, so that the guide jig can be eliminated, and the number of components can be reduced and the work can be improved.

According to the above embodiment, the following effects can be obtained.
(1) As shown in FIGS. 1A and 1B, the component-embedded multilayer substrate 9 includes a component-embedded substrate 10 having an insulating layer 30 in which a plurality of turns of coils 40 and electronic components 50 to 52 are embedded. The component-embedded substrate 10 is stacked. As a method of manufacturing the component built-in multilayer substrate 9, the first step, the second step, the third step, and the fourth step are included.

  In the first step, as shown in FIGS. 3A, 3B, and 3C, adhesives 61, 62, 63 is applied. In the second step, after the first step, as shown in FIGS. 4A and 4B, the electronic components 50, 51, 52 are arranged in the arrangement region of the electronic components in the base material 60 and the adhesive 61 is cured. Then, the electronic components 50, 51, 52 are bonded together, and the adhesives 62, 63 in the outer shape of the arrangement area of the coil 40 are cured. In the third step, after the second step, as shown in FIGS. 5A and 5B, the inner winding pattern 40a and the outer winding pattern 40b are connected by connecting portions 41, 42, and 43. The coil 40 is arranged in a state where the coil 40 is positioned by the adhesives 62 and 63 having the outer shape of the arrangement area of the coil 40. In the fourth step, after the third step, the prepreg 70 is laminated on the base material 60 as shown in FIGS.

Therefore, the coil 40 can be disposed at a desired position. Specifically, the coil 40 and the electronic components 50, 51, 52 can be arranged at desired positions.
(2) The method for manufacturing the component-embedded multilayer substrate 9 includes a fifth step. In the fifth step, after the fourth step, after the prepreg 70 is cured, the connecting portions 41, 42, and 43 of the coil 40 are deleted as shown in FIGS. 7 (a) and (b). Therefore, the connection parts 41, 42, and 43 of the coil 40 can be deleted.

  (3) As shown in FIGS. 1A and 1B, the coil 40 is configured such that the cured adhesives 62 and 63 are arranged on the outer shape of the arrangement area of the coil 40 as a configuration of the component built-in multilayer substrate 9. Yes. Therefore, the assembling property of the embedded coil in the component built-in substrate 10 is improved. That is, the coil 40 is positioned by the cured adhesives 62 and 63 arranged on the outer shape of the arrangement area of the coil 40. As a result, the coil 40 can be disposed at a desired position.

The embodiment is not limited to the above, and may be embodied as follows, for example.
-The method of curing the adhesive may be appropriately selected depending on the type of adhesive. For example, when using a room temperature curable adhesive, the adhesive may be cured by, for example, applying an adhesive main agent and mixing the curing agent. That is, although the thermosetting adhesive is used in the above embodiment, the present invention is not limited to this. For example, a room temperature curable adhesive may be used. In this case, for example, a main agent of the adhesive may be applied and the curing agent may be mixed.

  When positioning with the hardened adhesive disposed on the outer shape of the coil arrangement area, the circular adhesive 62 is disposed on the center side of the coil and the circular adhesive 63 is disposed on the outer diameter side of the coil. However, it is not limited to this. For example, the adhesive may be disposed in a discontinuous line instead of being disposed in a continuous line.

  -The number of turns of the coil may be other than "2", and the number of turns may be "3" or more.

  DESCRIPTION OF SYMBOLS 9 ... Component built-in type multilayer substrate, 10 ... Component built-in type substrate, 20 ... Conductive layer, 21 ... Wiring pattern, 30 ... Insulating layer, 31 ... Insulating layer, 40 ... Coil, 41 ... Connecting part, 42 ... Connecting part, 43 ... Connection part, 50, 51, 52 ... Electronic component, 60 ... Base material, 61 ... Adhesive, 62 ... Adhesive, 63 ... Adhesive, 70 ... Prepreg.

Claims (3)

A method for producing a component-embedded multi-layer board including at least one component-embedded substrate having an insulating layer in which a coil having a plurality of turns and an electronic component are housed, and laminating the component-embedded substrate,
A first step of applying an adhesive to the outer shape of the arrangement region of the electronic component and the arrangement region of the coil on the substrate by printing;
After the first step, the electronic component is arranged in the arrangement region of the electronic component on the base material, the adhesive is cured to adhere the electronic component, and the outer adhesive of the arrangement region of the coil is cured. Two steps,
After the second step, a third step of arranging the coil in which the inner winding pattern and the outer winding pattern are connected by a connecting portion in a state where the coil is positioned with the outer shape adhesive in the arrangement region of the coil;
A fourth step of laminating a prepreg on the base material after the third step;
A method for manufacturing a component-embedded multilayer board, comprising:   2. The method of manufacturing a component built-in multilayer substrate according to claim 1, further comprising a fifth step of deleting the joint portion of the coil after the prepreg is cured after the fourth step. A component-embedded multi-layer substrate including at least one component-embedded substrate having an insulating layer containing a plurality of turns of coils and electronic components therein, wherein the component-embedded substrate is laminated,
The component-embedded multilayer board, wherein the coil has a cured adhesive disposed on an outer shape of a coil arrangement region.

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