JP2018014410A - Surface lighting device - Google Patents

Abstract

Even when a side view type LED is used, a narrow frame is realized. A planar illumination device according to an embodiment is a standing surface that is disposed on a mounting surface of a substrate and the substrate and extends in a direction intersecting with the mounting surface, on which an electrode pattern is formed. A base having an installation surface, a light emitting unit disposed on the mounting surface, connected to the electrode pattern, and having a light emitting surface on the opposite side to the surface facing the standing installation surface, a side surface side of the light emitting unit, And it is arrange | positioned between the said light emission surface and the said standing surface, and the conduction | electrical_connection member which conducts the said board | substrate and the said electrode pattern is provided. [Selection] Figure 8

Description

  The present invention relates to a planar lighting device.

  Conventionally, there is a planar illumination device in which a side-view type LED (Light Emitting Diode) is disposed so as to face a light incident surface of a light guide plate. In such a conventional planar illumination device, for example, in an LED including a rectangular parallelepiped light-emitting part and a base having a dimension in the longitudinal direction larger than that of the light-emitting part, the electrode terminal is formed in a U-shape when viewed from above. The light emitting surface side, the side end surface side, and the side opposite to the light emitting surface at both ends in the longitudinal direction of the substrate are integrally covered (for example, see Patent Document 1).

JP 2014-107307 A

  However, in the conventional planar illumination device described above, the light emitting surface side, the side end surface side, and the side opposite to the light emitting surface at both ends in the longitudinal direction of the base are integrally covered, so that the entire LED in the optical axis direction is covered. The thickness must be thick. As a result, in the conventional planar illumination device, it is difficult to realize a narrow frame on the light incident surface side.

  The present invention has been made in view of the above, and an object of the present invention is to provide a planar illumination device that can realize a narrow frame even when a side view type LED is used.

  In order to solve the above-described problems and achieve the object, a planar lighting device according to an aspect of the present invention is a stand, which is disposed on a mounting surface of a substrate and extends in a direction intersecting the mounting surface. A base having an upstanding surface on which an electrode pattern is formed, and a light emitting surface disposed on the mounting surface, connected to the electrode pattern and opposite to the surface facing the upstanding surface And a conductive member that is disposed between a side surface of the light emitting unit and between the light emitting surface and the standing surface, and electrically connects the substrate and the electrode pattern.

  According to one embodiment of the present invention, a narrow frame can be realized even when a side-view type LED is used.

FIG. 1 is a front view illustrating an example of the appearance of the planar illumination device according to the embodiment. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a perspective view of the LED according to the embodiment. 4 is a cross-sectional view of the light emitting section taken along line BB in FIG. FIG. 5 is a front view of the base according to the embodiment. FIG. 6 is a diagram illustrating an example of a state in which the light emitting unit and the base according to the embodiment are connected. FIG. 7 is a top view of the FPC according to the embodiment. FIG. 8 is a perspective view of the FPC according to the embodiment and the LED mounted on the mounting surface of the FPC. FIG. 9 is a side view of the FPC according to the embodiment and the LED mounted on the mounting surface of the FPC. FIG. 10 is a perspective view of an FPC according to a modification of the embodiment and LEDs mounted on the mounting surface of the FPC. FIG. 11 is a side view of an FPC according to a modification of the embodiment and an LED mounted on the mounting surface of the FPC.

  Hereinafter, a planar illumination device according to an embodiment will be described with reference to the drawings. In addition, the relationship of the dimension of each element in a drawing, the ratio of each element, etc. may differ from reality. Even between the drawings, there are cases in which portions having different dimensional relationships and ratios are included.

(Embodiment)
FIG. 1 is a front view illustrating an example of the appearance of the planar illumination device according to the embodiment. As shown in the example of FIG. 1, one end side in the longitudinal direction of the planar lighting device 10 according to the embodiment is covered with a light shielding sheet 30 including a first light shielding sheet 30a and a second light shielding sheet 30b. Further, the other end side in the longitudinal direction of the planar illumination device 10 is covered with a light shielding sheet 31. The planar illumination device 10 emits light from an emission region (also referred to as an effective area) 90 that is not covered with the light shielding sheets 30 and 31. That is, the effective area 90 is defined by the light shielding sheets 30 and 31. The planar illumination device 10 according to the present embodiment is used as a backlight of a liquid crystal display device. Such a liquid crystal display device is used, for example, in a smartphone.

  Here, in FIG. 1, the light shielding sheet 31 is wider than the light shielding sheet 30. This is because the light shielding sheet 30 covers a relatively wide area including the LED 11 and the FPC 13 and the like which will be described later, and the light shielding sheet 31 is relatively narrow and does not include the LED 11 and the FPC 13 and the like which will be described later. This is to cover the area.

  2 is a cross-sectional view taken along line AA in FIG. As shown in FIG. 2, the planar illumination device 10 includes an LED 11, a light guide plate 12, an FPC 13, a diffusion sheet 15, a prism sheet 16, a frame 17, a reflection sheet 18, and a light shielding sheet 30. In FIG. 2, illustration of electrode patterns 11q and 11r described later is omitted.

  The frame 17 houses the LED 11, the light guide plate 12, the FPC 13, the diffusion sheet 15, the prism sheet 16, and the reflection sheet 18. The frame 17 has a side wall 17a and a bottom portion 17b. The frame 17 is, for example, a stainless steel sheet metal frame having high rigidity and light reflectivity.

  The bottom portion 17b has a shape that spreads along a main surface 12b described later of the light guide plate 12. The bottom portion 17b has a floor surface 17c that is a surface on the light guide plate 12 side. On the floor surface 17c, a reflective sheet 18 and a strip-shaped FPC 13 extending in the long side direction of the light incident side surface 12c described later (the short side direction of the planar lighting device 10) are placed. The side wall 17a is a direction in which light is emitted from the planar illumination device 10 from the bottom portion 17b along the long side of the light incident side surface 12c described later of the light guide plate 12 (the normal direction of the floor surface 17c, the direction indicated by the arrow 40). It is a part that stands up together.

  The LED 11 that is a point light source (point light source) is, for example, a pseudo-white LED composed of a blue LED and a yellow phosphor, and is formed as a substantially rectangular parallelepiped as a whole and has a light emitting surface 11dd on one side surface. It is a view type LED. That is, in a state where the LED 11 is mounted on a mounting surface 13a (described later) of the FPC 13, the surface 11e of the LED 11 placed on the mounting surface 13a is parallel to a surface substantially orthogonal to the light emitting surface 11dd. The plurality of LEDs 11 are mounted on the mounting surface 13a at a predetermined interval along the long side direction of the mounting surface 13a in a state where the light emitting surface 11dd faces the short side direction of the mounting surface 13a of the FPC 13. Thereby, in the planar illumination device 10, the plurality of LEDs 11 have their light emitting surfaces 11dd facing the light incident side surface 12c described later of the light guide plate 12 along the long side direction of the light incident side surface 12c. They are arranged at a predetermined interval.

  The light guide plate 12 is formed in a rectangular shape in a top view using a transparent material (for example, polycarbonate resin). The light guide plate 12 has two main surfaces 12 a and 12 b and a light incident side surface (light incident surface) 12 c which is a side surface on which the LED 11 is disposed on the outer surface thereof. The light emitted from the LED 11 is incident on the light incident side surface 12c. One main surface 12a of the two main surfaces 12a and 12b is an emission surface from which light incident from the light incident side surface 12c (light emitted from the LED 11) is emitted. Therefore, in the following description, “main surface 12a” may be referred to as “exit surface 12a”. For example, an optical path changing pattern composed of a plurality of dots is formed on a portion of the light guide plate 12 on the main surface 12b side that is the surface opposite to the exit surface 12a. By forming the optical path changing pattern, the traveling direction of the light traveling in the light guide plate 12 is changed, and light is emitted from the emission surface 12a. That is, the planar illumination device 10 according to the embodiment is a so-called edge light type illumination device. As described above, the light guide plate 12 has the light incident side surface (side surface) 12c arranged so that the light emitting surface 11dd of the LED 11 faces and emits light incident on the light incident side surface 12c.

  The FPC 13 is a substrate having two main surfaces 13a and 13b. Of the two main surfaces 13a and 13b, one main surface 13a is a mounting surface on which the LED 11 is mounted. For this reason, “main surface 13a” may be referred to as “mounting surface 13a”. The mounting surface 13 a faces the surface 11 e of the LED 11. The LED 11 is driven by the control of a drive circuit (not shown) via the FPC 13 to emit light.

  The reflection sheet 18 reflects the light leaked from the main surface 12b opposite to the emission surface 12a and returns it to the light guide plate 12 again. The reflection sheet 18 is disposed between the main surface 12b of the light guide plate 12 and the floor surface 17c while being fixed on the floor surface 17c by the double-sided tape 19.

  The double-sided tapes 19 and 20 are, for example, white double-sided tapes. One end of the double-sided tape 19 is attached to the side wall 17a side of the reflection sheet 18 and the floor surface 17c. Further, the other end of the double-sided tape 19 is affixed to a portion of the mounting surface 13 a of the FPC 13 where the LED 11 is not located and to the LED 11 side of the main surface 12 b of the light guide plate 12. As a result, the reflective sheet 18 is fixed to the frame 17 by the double-sided tape 19, and the light guide plate 12 is fixed to the mounting surface 13 a of the FPC 13.

  One surface of the double-sided tape 20 is affixed to the main surface 13 b of the FPC 13, and the other surface is affixed to the floor surface 17 c of the frame 17. As a result, the FPC 13 is fixed to the frame 17 by the double-sided tape 20.

  The diffusion sheet 15 is disposed on the emission surface 12a side of the light guide plate 12, and diffuses light emitted from the emission surface 12a. Explaining with a specific example, the diffusion sheet 15 is arranged so as to cover a part of the emission surface 12a and the surface 11ab, and diffuses the light emitted from the emission surface 12a. Here, the surface 11ab is a surface opposite to the surface 11e of the LED 11.

  The prism sheet 16 is disposed on a surface opposite to the surface facing the emission surface 12a of the diffusion sheet 15, and performs light distribution control of light diffused by the diffusion sheet 15 to perform light distribution control. Is emitted.

  The light shielding sheet 30 is disposed so as to cover a part of the prism sheet 16 on the side wall 17 a side, and shields light emitted from a part of the emission surface 12 a of the light guide plate 12.

  The light shielding sheet 30 includes a first light shielding sheet 30a and a second light shielding sheet 30b. For example, the first light shielding sheet 30a is a single-sided tape that can shield light. One end side of the first light shielding sheet 30 a is attached to the outer surface of the side wall 17 a of the frame 17. Further, the other end side of the first light shielding sheet 30 a is attached to the side wall 17 a side of the prism sheet 16. For example, the 2nd light shielding sheet 30b is a double-sided tape which can block light. Of the two main surfaces of the second light shielding sheet 30b, one main surface is affixed to a portion on the other end side of the first light shielding sheet 30a, and the other main surface backlights the planar illumination device 10. Is attached to a liquid crystal display device used as

  Next, the LED 11 according to the embodiment will be described with reference to FIGS. FIG. 3 is a perspective view of the LED according to the embodiment. 4 is a cross-sectional view of the light emitting section taken along line BB in FIG. FIG. 5 is a front view of the base according to the embodiment. FIG. 6 is a diagram illustrating an example of a state in which the light emitting unit and the base according to the embodiment are connected, and is a top view of the light emitting unit and the base that are electrically connected. FIG. 7 is a top view of the FPC according to the embodiment.

  As shown in FIG. 3, the LED 11 includes a light emitting unit 11a, a base 11b, and external electrodes 11c and 11d.

  The light emitting portion 11a is formed in a substantially rectangular parallelepiped shape, and has a light emitting surface 11dd on the side opposite to a surface 11z facing a standing surface 11p described later of the base body 11b. The light emitting unit 11a is disposed on the mounting surface 13a (see FIG. 2) of the FPC 13, and is connected to electrode patterns 11q and 11r described later. As shown in FIG. 4, the light emitting part 11a includes a resin part 11f, a light emitting element 11g, and a translucent material 11h.

  The resin part 11f is a matrix of the light emitting part 11a, and is formed of a light-reflective material in which particles of a light-reflective substance are contained in a light-transmitting resin. The resin portion 11f is formed with a concave portion 11j having an opening 11i on the front surface. The concave portion 11j is formed so that the width of the concave portion 11j becomes wider from the bottom portion 11k of the concave portion 11j toward the light emitting surface 11dd. The bottom 11k is one surface of the recess 11j whose normal direction is a direction parallel to the optical axis of the LED 11. A light emitting element 11g is provided on the bottom 11k. A pair of holes 11l and 11m are formed in the bottom portion 11k, and internal electrodes 11n and 11o, which are a pair of electrodes of the light emitting element 11g, are inserted into the pair of holes 11l and 11m, respectively. Here, the hole 11l is formed in the bottom part 11k corresponding to the internal electrode 11n. The hole 11m is formed in the bottom part 11k corresponding to the internal electrode 11o. The translucent material 11h is filled in the space formed by the recess 11j provided with the light emitting element 11g on the bottom 11k. By filling the translucent material 11h, a light emitting surface 11dd that emits light emitted from the light emitting element 11g is formed.

  As shown in FIG. 3, the base body 11b is a plate-like member standing on the mounting surface 13a (see FIG. 2) of the FPC 13, and is provided on the surface 11z (see FIG. 2) side of the light emitting portion 11a. That is, the base body 11b is disposed on the mounting surface 13a. As shown in FIG. 2, the surface 11z is a surface opposite to the light emitting surface 11dd of the light emitting unit 11a. As shown in FIG. 3, the length of the base body 11b in the longitudinal direction (direction indicated by the arrow 44) is longer than the length of the light emitting section 11a in the longitudinal direction (direction indicated by the arrow 44).

  As shown in FIG. 5, the base 11b has a surface 11p that faces the surface 11z (see FIG. 2) of the light emitting portion 11a. This surface 11p is a surface extending in a direction orthogonal to the mounting surface 13a of the FPC 13 (the normal direction of the mounting surface 13a indicated by the arrow 40 in FIGS. 2 and 5). Hereinafter, “surface 11p” may be referred to as “standing surface 11p”. In addition, the standing surface 11p may not be a surface extending in a direction completely orthogonal to the mounting surface 13a, and may be a surface extending in a direction intersecting with the mounting surface 13a. On the standing surface 11p, metallic electrode patterns (electrode terminals) 11q and 11r are formed along the long side direction of the standing surface 11p (the direction indicated by the arrow 41 in FIG. 5). The electrode pattern 11q has a connection portion 11s at one end in the long side direction of the standing surface 11p and a connection portion 11t at the other end. The electrode pattern 11r has a connecting portion 11u at one end in the long side direction of the standing surface 11p and a connecting portion 11v at the other end. That is, the connecting part 11t is formed on the standing surface 11p corresponding to the internal electrode 11n of the light emitting element 11g. Further, the connecting portion 11u is formed on the standing surface 11p corresponding to the internal electrode 11o of the light emitting element 11g. Further, the connecting portion 11s is formed on the standing surface 11p corresponding to the external electrode 11c. The connection portion 11v is formed on the standing surface 11p corresponding to the external electrode 11d.

  In the present embodiment, as shown in the example of FIG. 6, the internal electrode 11n of the light emitting element 11g included in the light emitting portion 11a and the connecting portion 11t of the electrode pattern 11q are electrically connected. Moreover, the internal electrode 11o of the light emitting element 11g and the connection part 11u of the electrode pattern 11r are electrically connected.

  The external electrodes 11c and 11d shown in FIG. 3 are conductive members that conduct the FPC 13 and the electrode patterns 11q and 11r. The external electrodes 11c and 11d are conductive metals. As shown in FIG. 3, the external electrode 11c is electrically connected to the connecting portion 11s described above. Further, the external electrode 11d is electrically connected to the connection portion 11v described above. As shown in FIG. 3, a portion 11 w at one end of the external electrode 11 c on the mounting surface 13 a (see FIG. 2) side extends in the direction from the standing surface 11 p toward the light emitting surface 11 dd (the direction indicated by the arrow 43). The area of the external electrode 11c connected to a land portion 13c described later is increased. Further, a portion 11x at one end of the external electrode 11d on the mounting surface 13a (see FIG. 2) side extends in a direction (a direction indicated by an arrow 43) from the standing surface 11p toward the light emitting surface 11dd, and a land portion 13d described later. The area of the external electrode 11d connected to is increased. For this reason, the connection strength between the external electrode 11c and the land portion 13c and between the external electrode 11d and the land portion 13d is high. Therefore, according to the planar lighting device 10 according to the present embodiment, it is possible to suppress the occurrence of a failure due to the disconnection of electrical connection.

  As shown in FIG. 7, land portions 13 c and 13 d are formed on the mounting surface 13 a of the FPC 13. Here, the land portions 13c and 13d are portions where, for example, a rectangular hole 13g is formed in the cover lay 13f covering the wiring layer 13e of the FPC 13, and the wiring layer 13e is exposed. The above-described drive circuit (not shown) is connected to the wiring layer 13e. A portion 11w of the external electrode 11c of the LED 11 is electrically connected to the land portion 13c, and a portion 11x of the external electrode 11d of the LED 11 is electrically connected to the land portion 13d.

  FIG. 8 is a perspective view of the FPC according to the embodiment and the LED mounted on the mounting surface of the FPC. As shown in FIG. 8, the land portion 13 c and the portion 11 w are electrically connected, and the land portion 13 d and the portion 11 x are electrically connected, whereby the LED 11 is mounted on the mounting surface 13 a of the FPC 13. In the present embodiment, as shown in FIG. 8, the external electrode 11c is disposed on the side surface 11ac side of the light emitting unit 11a and between the light emitting surface 11dd and the standing surface 11p. The external electrode 11d is disposed on the side surface 11ad side of the light emitting unit 11a and between the light emitting surface 11dd and the standing surface 11p. Here, the side surfaces 11ac and 11ad are surfaces that are continuous with the light emitting surface 11dd and extend in a direction intersecting with the mounting surface 13a (direction indicated by the arrow 45). The electrode patterns 11q and 11r of the base body 11b are formed only on the standing surface 11p of the base body 11b, and are not formed on the surface 11aa opposite to the standing surface 11p of the base body 11b. Thus, in the present embodiment, the external electrodes 11c and 11d are not on the surface 11z (see FIG. 2) opposite to the light emitting surface 11dd of the light emitting portion 11a, and the electrode patterns 11q and 11r are formed on the surface 11aa. Not formed. For this reason, the thickness of the LED 11 in the optical axis direction (the direction indicated by the arrow 43) can be reduced. That is, the thickness TH1 of the LED 11 from the light emitting surface 11dd to the surface 11aa shown in FIG. 2 can be reduced. As the thickness TH1 is reduced, the width of the FPC 13 and the width of the light shielding sheet 30 shown in FIG. 2 can be reduced. Therefore, according to the planar illumination device 10 according to the present embodiment, when the thickness TH1 of the side view type LED 11, the width of the FPC 13 and the width of the light shielding sheet 30 are the width of the frame of the planar illumination device 10, this frame Can be narrowed. Therefore, according to the planar illumination device 10 according to the present embodiment, a narrow frame can be realized even when the side view type LED 11 is used.

  FIG. 9 is a side view of the FPC according to the embodiment and the LED mounted on the mounting surface of the FPC. As shown in FIG. 9, in this embodiment, the thickness TH2 from the standing surface 11p of the base 11b to the surface 11aa opposite to the standing surface 11p is erected from the light emitting surface 11dd of the light emitting portion 11a. It is thinner than the thickness TH3 up to the surface 11z (surface opposite to the light emitting surface 11dd) facing the surface 11p. Therefore, the center of gravity 70 of the LED 11 including the light emitting unit 11a, the base 11b, and the external electrodes 11c and 11d is located in the light emitting unit 11a.

  Furthermore, as shown in FIG. 9, in this embodiment, the center of gravity 70 of the LED 11 is erected through the standing surface 11p and the end 71 on the light emitting surface 11dd side of the portion where the external electrode 11d is connected to the FPC 13. At the time of designing, the above-described thickness TH2 of the base 11b, the length in the longitudinal direction, and the like are set so as to be positioned between the surface 11p and the parallel surface 72. Therefore, in this embodiment, the center of gravity is located at a position where no force is applied to the external electrode 11d that supports the base body 11b and the light emitting portion 11a due to the weight of the entire LED 11 in the direction of tilting toward the light emitting surface 11dd side and the standing surface 11p side. 70 exists. Therefore, according to the planar lighting device 10 according to the present embodiment, the external electrode 11d can be prevented from peeling off from the land portion 13d. That is, it is possible to suppress a decrease in bonding strength between the external electrode 11d and the land portion 13d. Moreover, as a result of suppressing the external electrode 11d from peeling from the land portion 13d, it is possible to suppress the inclination of the optical axis of the LED 11 and the like. Although it has been described that the external electrode 11d is prevented from peeling from the land portion 13d, according to the planar illumination device 10 according to the present embodiment, the external electrode 11c is formed on the land portion 13c on the same principle. It can suppress that it peels from.

  The planar lighting device 10 according to the present embodiment has been described above. As described above, in the planar illumination device 10 according to the present embodiment, the external electrode 11c is disposed on the side surface 11ac side of the light emitting unit 11a and between the light emitting surface 11dd and the standing surface 11p, and the external electrode 11d. Is disposed on the side surface 11ad side of the light emitting portion 11a and between the light emitting surface 11dd and the standing surface 11p. Therefore, as described above, according to the planar illumination device 10 according to the present embodiment, it is possible to reduce the thickness even when the top view type LED 11 is used.

(Modification of the embodiment)
In the above-described embodiment, the example in which the external electrodes 11c and 11d, which are conductive metals and conductive members, cause the FPC 13 and the electrode patterns 11q and 11r to conduct, has been described. 11q and 11r may be made conductive. Therefore, an embodiment in which another conducting member conducts the FPC 13 and the electrode patterns 11q and 11r will be described as a modification of the embodiment. About the structure similar to embodiment mentioned above, the same code | symbol may be attached | subjected and description may be abbreviate | omitted.

  10 is a perspective view of an FPC according to a modification of the embodiment and an LED mounted on the mounting surface of the FPC. FIG. 11 is a perspective view of the FPC according to the modification of the embodiment and the mounting surface of the FPC. It is a side view of mounted LED. The planar illumination device 10a according to the modification shown in FIGS. 10 and 11 is different from the planar illumination device 10 according to the above-described embodiment in that the LED 11 includes solders 95a and 95b instead of the external electrodes 11c and 11d. Different.

  The solder 95a is a conducting member that conducts the FPC 13 and the electrode pattern 11q, and the solder 95b is a conducting member that conducts the FPC 13 and the electrode pattern 11r. As shown in at least one of FIGS. 10 and 11, the solder 95a is electrically connected to the connecting portion 11s described above by solder bonding. Further, the solder 95b is electrically connected to the connection portion 11v described above by solder bonding. The solder 95a is electrically connected to the land portion 13c by solder bonding, and the solder 95b is electrically connected to the land portion 13d by solder bonding. Thereby, LED11 is mounted in the mounting surface 13a of FPC13. Similarly to the external electrode 11c according to the above-described embodiment, the solder 95a is disposed on the side surface 11ac side of the light emitting portion 11a and between the light emitting surface 11dd and the standing surface 11p. Similarly to the external electrode 11d according to the above-described embodiment, the solder 95b is disposed on the side surface 11ad side of the light emitting unit 11a and between the light emitting surface 11dd and the standing surface 11p. Therefore, according to the planar illumination device 10a according to the modified example, as in the planar illumination device 10 according to the embodiment, it is possible to reduce the thickness even when the top view type LED 11 is used.

  Note that, instead of the solders 95a and 95b, the FPC 13 and the electrode pattern 11q may be electrically connected and the FPC 13 and the electrode pattern 11r may be electrically connected by a conductive adhesive.

  The embodiments and the modifications of the embodiments have been described above, but the present invention is not limited to the embodiments and the modifications. What was comprised combining each component mentioned above suitably is also contained in this invention. Further effects and modifications can be easily derived by those skilled in the art. Therefore, the broader aspect of the present invention is not limited to the above-described embodiment, and various modifications can be made.

10, 10a Surface illumination device 11 LED (light source)
11a Light emitting part 11b Base 11c, 11d External electrode (conduction member)
12 Light guide plate 13 FPC (substrate)
15 Diffusion sheet 16 Prism sheet 17 Frame 18 Reflective sheet 30 Light shielding sheet 95a, 95b Solder (conductive member)

In order to solve the above-described problems and achieve the object, a planar illumination device according to an aspect of the present invention includes a substrate and a light source, and the light source is disposed on a mounting surface of the substrate, and A standing surface extending in a direction intersecting with the mounting surface, the substrate having the standing surface on which the electrode pattern is formed, and disposed on the mounting surface, connected to the electrode pattern, and opposed to the standing surface A light-emitting portion having a light-emitting surface on the opposite side of the light-emitting surface, a side surface side of the light-emitting portion, and between the light-emitting surface and the standing surface, and conducting the substrate and the electrode pattern. including a member.

Claims (5)

A substrate,
A base that is disposed on the mounting surface of the substrate and extends in a direction crossing the mounting surface, the base having an standing surface on which an electrode pattern is formed;
A light emitting portion disposed on the mounting surface, connected to the electrode pattern, and having a light emitting surface on a side opposite to the surface facing the standing surface;
A conductive member that is disposed on a side surface side of the light emitting unit and between the light emitting surface and the standing surface, and electrically connects the substrate and the electrode pattern;
A planar lighting device.   The thickness from the said standing surface of the said base | substrate to the surface on the opposite side to the said standing surface is thinner than the thickness from the said light emission surface of the said light emission part to the surface facing the said standing surface. The surface illumination device described in 1.   The planar illumination device according to claim 1, wherein a center of gravity of a light source including the base, the light emitting unit, and the conducting member is located in the light emitting unit. The conducting member is electrically connected to the substrate and the electrode pattern by being connected to the substrate and the electrode pattern,
The center of gravity of the light source is located between the standing surface and a surface that is parallel to the standing surface through the end of the light emitting surface side of the portion where the conducting member is connected to the substrate.
The planar illumination device according to claim 3.   The planar illumination device according to any one of claims 1 to 4, further comprising a light guide plate that has side surfaces disposed so that the light emitting surfaces face each other and emits light incident on the side surfaces.