JP2018014304A - Protective sheet, structure, and organic device manufacturing method - Google Patents

Abstract

A protective sheet, a structural body, and a method for manufacturing an organic device are provided that can suppress deterioration in the quality of an organic device. A protective sheet (1) includes a flexible substrate (3) and spacers (5) provided on one surface (3a) of the substrate (3). [Selection drawing] Fig. 2

Description

  The present invention relates to a protective sheet, a structure, and a method for manufacturing an organic device.

  As a conventional protective sheet, for example, a sheet described in Patent Document 1 is known. The protective sheet described in Patent Document 1 has a flexible support, a gas barrier layer, and a laminated structure of three or more layers. This protective sheet is rolled up on the organic functional layer after the organic functional layer is formed in the manufacturing process of the organic device.

JP 2009-123532 A

  A conventional protective sheet is rolled up on the organic functional layer. Therefore, the conventional protective sheet contacts the organic functional layer. In this case, there is a possibility that a defect may occur in the organic functional layer in contact with the protective sheet. Thereby, there exists a possibility that the quality of an organic device may fall.

  An object of this invention is to provide the manufacturing method of the protective sheet, structure, and organic device which can suppress the fall of the quality of an organic device.

  The protective sheet which concerns on 1 side of this invention is a protective sheet which protects an organic device, Comprising: The base material which has flexibility, and the spacer provided in the at least one surface of the base material are provided.

  In this protective sheet, a spacer is provided on at least one surface of the substrate. Thereby, in a protective sheet, it can suppress that an organic functional layer and a base material of an organic device contact, for example. Therefore, it is possible to suppress the occurrence of problems such as breakage in the organic device. Moreover, a protective sheet can suppress that a dust, dust, etc. adhere to an organic device with a base material. As a result, the protective sheet can suppress deterioration of the quality of the organic device.

  In one embodiment, the spacer is provided on the first adhesive layer provided on one surface of the substrate, the spacer layer provided on the first adhesive layer, and the spacer layer. A first adhesive layer, and the first adhesive layer may have a higher adhesive force than the second adhesive layer. With this configuration, it is possible to ensure the peelability of the second adhesive layer while ensuring the adhesion between the base material and the spacer. Therefore, the protective film can be easily peeled from the organic device at the time of use.

  In one embodiment, the spacer may have an opening that defines a concave space with the substrate. In this configuration, the organic device can be accommodated in the space defined by the opening. Therefore, contact between the substrate and the organic device can be suppressed.

  In one embodiment, the substrate extends in one direction, and the spacer extends in one direction of the substrate and has a predetermined interval in another direction orthogonal to the one direction of the substrate. You may arrange | position facing. In this configuration, the contact between the base material and the organic device can be suppressed by the spacer, and adhesion of dust and dirt to the organic device can be more reliably suppressed.

  In one embodiment, the substrate extends in one direction, and the spacers extend in the other direction orthogonal to the one direction of the substrate and are arranged at a predetermined interval in one direction. Also good. In this configuration, the contact between the base material and the organic device can be suppressed by the spacer.

  In one embodiment, a desiccant may be applied to one surface of the substrate. In this structure, it can suppress that a water | moisture content is contained in the organic device protected by a protective sheet. As a result, deterioration of the quality of the organic device can be suppressed.

  A structure according to one aspect of the present invention is a support provided with any of the above protective sheets and an organic device or an intermediate body in which a part of the layers constituting the organic device is formed. A spacer, and a spacer is disposed in a region where no organic device or intermediate is formed on the support substrate.

  In the structure according to one aspect of the present invention, the spacer of the protective sheet is arranged in a region where the organic device or the intermediate is not formed on the support substrate. Thereby, in a structure, it can suppress that an organic functional layer and a base material of an organic device contact, for example. Therefore, it is possible to suppress the occurrence of problems such as breakage in the organic device. Moreover, in a structure, it can suppress that a dust, dust, etc. adhere to an organic device with a base material. As a result, in the structure, deterioration of the quality of the organic device can be suppressed.

  An organic device manufacturing method according to an aspect of the present invention is an organic device manufacturing method for manufacturing an organic device on a flexible support substrate, and the organic device or the organic device is formed on the support substrate. A forming step of forming an intermediate in which a part of the constituent layers is formed, and a base that has flexibility and extends in one direction on the support substrate on which the organic device or the intermediate is formed A sticking step of attaching a protective sheet provided with a spacer provided on at least one surface of the material and the base material, and in the sticking step, the spacer is arranged in a region where no organic device or intermediate is formed on the support substrate A protective sheet is affixed to the support substrate.

  In the method for producing an organic device according to one aspect of the present invention, in the attaching step, the protective sheet is attached to the support substrate so that the spacer is arranged in a region where the organic device or the intermediate is not formed in the support substrate. Thereby, it can suppress that the organic functional layer of an organic device, for example, and a base material contact. Therefore, it is possible to suppress the occurrence of problems such as breakage in the organic device. Moreover, it can suppress that a dust, dust, etc. adhere to an organic device with a base material. As a result, in the method for manufacturing an organic device, deterioration in the quality of the organic device can be suppressed.

  In one embodiment, in the attaching step, a protective sheet having spacers extending in another direction orthogonal to one direction of the base material and arranged at a predetermined interval in one direction is attached to the support substrate and attached. After the step, a cutting step of cutting the protective sheet and the support substrate along the other direction at the position where the spacer is arranged may be included. As a result, even when the spacer is cut, the organic device is sealed in the space defined by the base material, the spacer and the support substrate. It can suppress adhering. Therefore, even when the spacer is cut and the organic device is singulated and stored, deterioration of the quality of the organic device can be suppressed.

  According to one aspect of the present invention, it is possible to suppress deterioration in the quality of an organic device.

It is a figure which shows the protective sheet which concerns on one Embodiment. It is a figure which shows the cross-sectional structure along the II-II line | wire in FIG. (A) is a figure which shows the state attached to the support sheet in which the organic EL device was formed in (a), (b) is a figure which shows the cross-sectional structure along the bb line in (a). It is a figure which shows the protective sheet which concerns on other embodiment. It is a figure which shows the protective sheet which concerns on other embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted.

  As shown in FIG. 1, the protective sheet 1 includes a base material 3 and a spacer 5. In FIG. 1, the state which looked at the protection sheet 1 from the spacer 5 side is shown. The protective sheet 1 is a member for protecting the organic EL element (organic device) 17 (see FIG. 3).

  The base material 3 is a plastic film. The base material 3 extends in one direction. The material of the base material 3 is, for example, polyethylene terephthalate (PET). The thickness of the base material 3 is, for example, 30 μm to 50 μm. The base material 3 has one surface 3a.

  As shown in FIG. 2, the spacer 5 includes a first adhesive layer 7, a spacer layer 9, and a second adhesive layer 11.

  The first adhesive layer 7 is provided on one surface 3 a of the substrate 3. The first adhesive layer 7 is made of, for example, a photocurable or thermosetting acrylate resin, or a photocurable or thermosetting epoxy resin. The first adhesive layer 7 is a resin film that can be fused with other commonly used impulse sealers, such as ethylene vinyl acetate copolymer (EVA), polypropylene (PP) film, polyethylene (PE) film, polybutadiene (PB) film. A heat-fusible film such as the above can also be used. A thermoplastic resin can also be used. The adhesive strength of the first adhesive layer 7 is 10 to 50 N / 25 mm. The thickness of the first adhesive layer 7 is, for example, about 5 μm.

  The spacer layer 9 is disposed on the first adhesive layer 7 (the surface opposite to the surface in contact with the one surface 3a of the substrate 3 in the first adhesive layer 7). The spacer layer 9 is disposed between the first adhesive layer 7 and the second adhesive layer 11. The material of the spacer layer 9 is, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), or the like. The thickness of the spacer layer 9 is appropriately set according to the thickness (height) of the organic EL element 17. Specifically, the thickness of the spacer layer 9 is set so that the thickness of the spacer 5 is larger than the thickness of the organic EL element 17.

  The second adhesive layer 11 is provided on the spacer layer 9 (the surface on the side opposite to the surface in contact with the first adhesive layer 7 in the spacer layer 9). The second adhesive layer 11 is formed of the same material as the first adhesive layer 7, for example. The adhesive strength of the second adhesive layer 11 is 0.1 to 1.0 N / 25 mm. That is, the adhesive force of the second adhesive layer 11 is lower than the adhesive force of the first adhesive layer 7. In other words, the adhesive strength of the first adhesive layer 7 is higher than the adhesive strength of the second adhesive layer 11. The adhesive strength of the second adhesive layer 11 is set so as to be removable again with respect to the object to be bonded. The thickness of the second adhesive layer 11 is, for example, about 5 μm.

  As shown in FIG. 1, the spacer 5 is provided with an opening 13. The opening 13 is a portion where the first adhesive layer 7, the spacer layer 9, and the second adhesive layer 11 are cut out in the spacer 5. In the present embodiment, the opening 13 has a rectangular shape when viewed from the stacking direction of the first adhesive layer 7, the spacer layer 9, and the second adhesive layer 11 in the spacer 5. That is, the spacer 5 extends at least in another direction (width direction) orthogonal to one direction (extension direction) of the base material 3 and is disposed at a predetermined interval in one direction. A plurality of openings 13 are provided in the spacer 5 at a predetermined interval in one direction of the substrate 3. The opening 13 defines a concave space for accommodating the organic EL element 17 in cooperation with the base material 3. The dimensions (vertical and horizontal widths) of the opening 13 may be appropriately set according to the size of the organic EL element 17.

  The manufacturing method of the protection sheet 1 which has the said structure is demonstrated. First, the sheet-like first adhesive layer 7, the spacer layer 9, and the second adhesive layer 11 are laminated to create the spacer 5. Next, a predetermined portion of the spacer 5 is punched to form the opening 13. Subsequently, the spacer 5 is attached to one surface 3 a of the base material 3. At this time, the spacer 5 is affixed to the base material 3 so that the arrangement direction of the openings 13 is along one direction of the base material 3. Thus, the protective sheet 1 is manufactured. The opening 13 may be formed by half-cutting after the spacer 5 is attached to the substrate 3.

  As shown in FIGS. 3A and 3B, the protective sheet 1 is attached to the support substrate 15 on which the organic EL element 17 is formed. Specifically, the second adhesive layer 11 of the protective sheet 1 is attached to one main surface 15 a of the support substrate 15. The organic EL element 17 formed on one main surface 15 a of the support substrate 15 is accommodated in the opening 13 of the spacer 5. Thereby, the organic EL element 17 is enclosed in a space defined by the protective sheet 1 (base material 3 and spacer 5) and the support substrate 15.

  Then, the manufacturing method of the organic EL element 17 using the said protection sheet 1 is demonstrated.

  In the form in which the support substrate 15 is flexible and extends in the longitudinal direction, a roll-to-roll method can be adopted as a method for manufacturing the organic EL element 17. When manufacturing the organic EL element 17 by the roll-to-roll method, while continuously transporting the long flexible support substrate 15 stretched between the unwinding roll and the winding roll by the transporting roll, Each layer is formed in order from the support substrate 15 side.

  First, the support substrate 15 is prepared and heated to dry (drying process). The support substrate 15 is made of a resin that is transparent to visible light (light having a wavelength of 400 nm to 800 nm). The support substrate 15 is a film-like substrate. The thickness of the support substrate 15 is, for example, 30 μm or more and 500 μm or less. When the support substrate 15 is a resin, it is preferably 45 μm or more from the viewpoint of substrate twist, wrinkle, and elongation when the roll-to-roll system is continuous, and 125 μm or less from the viewpoint of flexibility. A gas barrier layer or a moisture barrier layer may be disposed on one main surface 15 a of the support substrate 15. The other main surface 15b of the support substrate 15 is a light emitting surface.

  Subsequently, an anode layer is formed on the support substrate 15 (anode layer forming step). As the anode layer, an electrode layer exhibiting optical transparency is used. As the electrode exhibiting light transmittance, a thin film containing metal oxide, metal sulfide and metal having high electrical conductivity can be used, and a thin film having high light transmittance is preferably used. For example, a thin film containing indium oxide, zinc oxide, tin oxide, indium tin oxide (abbreviated as ITO), indium zinc oxide (abbreviated as IZO), gold, platinum, silver, copper, or the like is used. Among these, a thin film made of ITO, IZO, or tin oxide is preferably used.

  As the anode layer, an organic transparent conductive film such as polyaniline and derivatives thereof, polythiophene and derivatives thereof may be used. Further, as the anode layer, an electrode obtained by patterning metal or metal alloy or the like into a mesh shape, or an electrode in which nanowires containing silver are formed in a network shape may be used. Examples of the method for forming the anode layer include a vacuum deposition method, a sputtering method, an ion plating method, a plating method, and a coating method.

  Subsequently, an organic functional layer is formed on the anode layer (organic functional layer forming step). The organic functional layer includes a light emitting layer. The organic functional layer usually contains a light emitting material that mainly emits fluorescence and / or phosphorescence, or a light emitting layer dopant material that assists the light emitting material. The dopant material for the light emitting layer is added, for example, in order to improve the light emission efficiency or change the light emission wavelength. Note that the light-emitting material that emits fluorescence and / or phosphorescence may be a low-molecular compound or a high-molecular compound. Examples of the organic substance constituting the organic functional layer include a light emitting material that emits fluorescence and / or phosphorescence, such as the following dye materials, metal complex materials, and polymer materials, and a dopant material for the light emitting layer.

  The thickness of the organic functional layer is usually about 2 nm to 200 nm. The organic functional layer is formed by, for example, a coating method using a coating liquid (for example, ink) containing a light emitting material. The solvent of the coating solution containing the light emitting material is not limited as long as it dissolves the light emitting material. The light emitting layer may be formed by vacuum deposition.

  Subsequently, a cathode layer is formed on the organic functional layer (cathode layer forming step). As a material for the cathode layer, for example, alkali metal, alkaline earth metal, transition metal, Group 13 metal of the periodic table, and the like can be used. Specific examples of the material for the cathode layer include lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, aluminum, scandium, vanadium, zinc, yttrium, indium, cerium, samarium, and europium. , Terbium, ytterbium, etc., two or more of these metals, one or more of these metals, and among gold, silver, platinum, copper, manganese, titanium, cobalt, nickel, tungsten, tin An alloy with one or more of these, graphite, or a graphite intercalation compound is used. Examples of alloys include magnesium-silver alloys, magnesium-indium alloys, magnesium-aluminum alloys, indium-silver alloys, lithium-aluminum alloys, lithium-magnesium alloys, lithium-indium alloys, calcium-aluminum alloys, and the like. it can.

  Moreover, as a cathode layer, the transparent conductive electrode which consists of a conductive metal oxide, a conductive organic substance, etc. can be used, for example. Specific examples of conductive metal oxides include indium oxide, zinc oxide, tin oxide, ITO, and IZO. Examples of conductive organic substances include polyaniline and derivatives thereof, polythiophene and derivatives thereof, and the like. Can do. The cathode layer may be composed of a laminate in which two or more layers are laminated.

  The thickness of the cathode layer is set in consideration of electric conductivity and durability. The thickness of the cathode layer is usually 10 nm to 10 μm, preferably 20 nm to 1 μm, and more preferably 50 nm to 500 nm.

  Examples of the method for forming the cathode layer include a vacuum deposition method, a sputtering method, a laminating method for thermocompression bonding a metal thin film, and a coating method. Thus, the organic EL element 17 is formed on the support substrate 15 (formation process).

  Subsequently, the protective sheet 1 is attached to the support substrate 15 (attachment step). Specifically, as shown in FIGS. 3A and 3B, the second adhesive adhesion of the protective sheet 1 so that the organic EL element 17 is accommodated in the opening 13 of the spacer 5. The layer 11 is bonded to the support substrate 15. That is, the protective sheet 1 is bonded to the support substrate 15 so that the spacer 5 is located in the region of the support substrate 15 where the organic EL element 17 is not formed. Thereby, the structure 20 provided with the protective sheet 1 and the support substrate 15 provided with the organic EL element 17 is configured.

  Subsequently, the structure 20 composed of the support substrate 15 and the protective sheet 1 is wound into a roll (winding step). The structure 20 is wound around a core (not shown). Thereby, a roll is formed. And a roll is stored, for example in a storage (storage process).

  Subsequently, the stored roll is prepared, and the protective sheet 1 is peeled from the support substrate 15 (peeling step). After peeling off the protective sheet 1, the organic EL element 17 is sealed with a sealing member (not shown) (sealing step). Thus, the organic EL element 17 is manufactured.

  In addition, when storing the structure 20, it is not necessary to wind up in roll shape. The structure 20 may be stored in a sheet-like state. Further, as shown in FIGS. 3A and 3B, the structure 20 may be cut along the cutting line L (cutting step), and the structure 20 may be singulated and stored. In the example shown in FIGS. 3A and 3B, the cutting line L is set so that one organic EL element 17 is included. The cutting line L is set at the position of the spacer 5. Thereby, even when the structure 20 is cut, the organic EL element 17 is enclosed in the space defined by the base material 3, the spacer 5, and the support substrate 15. Can be prevented from adhering to the organic EL element 17. When the structure 20 is separated, for example, the cutting line L may be set so as to include a plurality of organic EL elements 17 and cut.

  As described above, the protective sheet 1 according to the present embodiment is provided with the spacer 5 on the one surface 3 a of the base material 3. Thereby, in the protective sheet 1, it can suppress that the organic functional layer and the base material 3 of the organic EL element 17 contact, for example. Therefore, it is possible to suppress the occurrence of problems in the organic EL element 17. As a result, in the protective sheet 1, deterioration in the quality of the organic EL element 17 can be suppressed.

  In the protective sheet 1 according to this embodiment, the spacer 5 includes a first adhesive layer 7, a spacer layer 9, and a second adhesive layer 11. In this configuration, the protective sheet 1 is bonded to the support substrate 15 by the second adhesive layer 11. Thereby, when the support substrate 15 is wound up, it can suppress that the protective sheet 1 slip | deviates. Therefore, troubles such as repair of the displacement of the protective sheet 1 do not occur, and the organic EL element 17 can be efficiently manufactured.

  In the protective sheet 1 according to the present embodiment, the spacer 5 has an opening 13. The opening 13 defines a space for accommodating the organic EL element 17 together with the base material 3. Thereby, in the protective sheet 1, since the organic EL element 17 is accommodated in space, the contact with the base material 3 and the organic EL element 17 can be suppressed. Moreover, in the protection sheet 1, it can respond to the organic EL element 17 of various shapes by changing the shape of the opening part 13. FIG.

  In the protective sheet 1 according to this embodiment, the thickness of the spacer 5 is set to be larger than the thickness of the organic EL element 17. Thereby, it can suppress more reliably that the base material 3 and the organic EL element 17 contact.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  In the said embodiment, although the form in which the opening part 13 of the spacer 5 was a rectangular shape was demonstrated to an example, the shape of an opening part is not limited to this. The shape of the opening may be a shape that can accommodate the organic EL element 17.

  In the said embodiment, the form which the spacer 5 has the 1st adhesive layer 7, the spacer layer 9, and the 2nd adhesive layer 11 demonstrated as an example. However, the configuration of the spacer is not limited to this. For example, the spacer may have another layer. The spacer may be formed of two or less layers.

  In the above embodiment, in the method for manufacturing the organic EL element 17, the form in which the protective sheet 1 is attached to the support substrate 15 after forming the cathode layer as the organic EL element 17 has been described as an example. However, the timing for attaching the protective sheet 1 to the support substrate 15 is not limited to this. For example, the protective sheet 1 is attached to the support substrate 15 after forming an intermediate body in which a part of layers constituting the organic EL element 17 such as an organic functional layer is formed on the support substrate 15. May be. The organic functional layer may be formed of a plurality of layers. In this case, the protective sheet 1 may be attached to the support substrate 15 after at least one of the plurality of layers forming the organic functional layer is formed. Further, the protective sheet 1 may be attached to the support substrate 15 after forming the anode layer.

The configuration of the organic EL element 17 is not limited to the above embodiment. The organic EL element 17 may have the following configuration.
(A) Anode layer / light emitting layer / cathode layer (b) Anode layer / hole injection layer / light emitting layer / cathode layer (c) Anode layer / hole injection layer / light emitting layer / electron injection layer / cathode layer (d) Anode layer / hole injection layer / light emitting layer / electron transport layer / electron injection layer / cathode layer (e) Anode layer / hole injection layer / hole transport layer / light emitting layer / cathode layer (f) anode layer / hole Injection layer / hole transport layer / light emitting layer / electron injection layer / cathode layer (g) anode layer / hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer / cathode layer (h) ( Anode layer) / light-emitting layer / electron injection layer / cathode layer (i) (anode layer) / light-emitting layer / electron transport layer / electron injection layer / cathode layer Here, the symbol “/” indicates each layer sandwiching the symbol “/” Indicates that they are stacked adjacent to each other.

  In the embodiment described above, an example in which the opening 13 is provided in the spacer 5 of the protective sheet 1 and the organic EL element 17 is accommodated in the space defined by the opening 13 has been described. However, the configuration of the protective sheet is not limited to this.

  As shown in FIG. 4, in the protective sheet 1 </ b> A, the spacer 5 extends in one direction (extension direction) of the base material 3 and is predetermined in another direction (width direction) orthogonal to the one direction of the base material 3. Are arranged to face each other with an interval of. Specifically, the spacer 5 is arranged along one direction of the base material 3 at both ends of the base material 3 in the other direction. In this configuration, when the protective sheet 1 is attached to the support substrate 15 provided with the organic EL element 17, the organic EL element 17 is positioned between the pair of spacers 5 that face each other in the other direction of the base material 3. To do. One organic EL element 17 or a plurality of organic EL elements 17 may be positioned between the pair of spacers 5. In the protective sheet 1 </ b> A, the spacer 5 can suppress contact between the base material 3 and the organic EL element 17.

  As shown in FIG. 5, in the protective sheet 1 </ b> B, the spacer 5 extends in the other direction (width direction) orthogonal to one direction (extension direction) of the base material 3 and has a predetermined interval in one direction. Are arranged. Specifically, the spacer 5 is positioned substantially parallel to the other direction of the base material 3. In this configuration, when the protective sheet 1 is attached to the support substrate 15 provided with the organic EL element 17, the organic EL element 17 is positioned between the pair of spacers 5 that face each other in one direction of the base material 3. To do. One organic EL element 17 or a plurality of organic EL elements 17 may be positioned between the pair of spacers 5. In the protective sheet 1 </ b> B, the spacer 5 can suppress contact between the base material 3 and the organic EL element 17. Moreover, in this structure, the structure 20 can be separated and stored by cut | disconnecting the structure 20 along the other direction in the position where the spacer 5 is arrange | positioned. In this configuration, even when the structure 20 is cut, the structure 20 is cut because the organic EL element 17 is sealed in the space defined by the base material 3, the spacer 5, and the support substrate 15. It can suppress that the dust etc. which arise in the case adhere to the organic EL element 17. FIG.

  In addition to the above embodiment, a desiccant may be applied to one surface 3a of the substrate 3. Thereby, it can suppress that the organic EL element 17 protected by the protection sheets 1, 1A, 1B contains moisture.

  DESCRIPTION OF SYMBOLS 1 ... Protective sheet, 3 ... Base material, 3a ... One side, 5 ... Spacer, 7 ... 1st adhesive layer, 9 ... Spacer layer, 11 ... 2nd adhesive layer, 13 ... Opening part, 15 ... Support substrate, 17... Organic EL element (organic device).

Claims (9)

A protective sheet for protecting an organic device,
A flexible substrate;
And a spacer provided on at least one surface of the substrate. The spacer is
A first adhesive layer provided on the one surface of the substrate;
A spacer layer provided on the first adhesive layer;
A second adhesive layer provided on the spacer layer,
The protective sheet according to claim 1, wherein the first adhesive layer has higher adhesive force than the second adhesive layer.   The said spacer is a protection sheet of Claim 1 or 2 which has an opening part which defines a concave space with the said base material. The substrate extends in one direction;
3. The spacer according to claim 1, wherein the spacer extends in the one direction of the base material and is opposed to the base material at a predetermined interval in another direction orthogonal to the one direction of the base material. Protection sheet. The substrate extends in one direction;
The said spacer extends in the other direction orthogonal to the said one direction of the said base material, and is a protection sheet of Claim 1 or 2 arrange | positioned at predetermined intervals in the said one direction.   The protective sheet according to claim 1, wherein a drying agent is applied to the one surface of the base material. The protective sheet according to any one of claims 1 to 6,
An organic device, or a support substrate provided with an intermediate in which a part of the layers constituting the organic device is formed, and
A structure in which the spacer is arranged in a region where the organic device or the intermediate is not formed on the support substrate. An organic device manufacturing method for manufacturing an organic device on a flexible supporting substrate,
A forming step of forming an intermediate in which a part of the layers constituting the organic device or the organic device is formed on the support substrate;
A protective sheet comprising a flexible base material extending in one direction and a spacer provided on at least one surface of the base material on the support substrate on which the organic device or the intermediate is formed. A pasting step for pasting, and
The manufacturing method of the organic device which affixes the said protection sheet on the said support substrate so that the said spacer may be arrange | positioned in the said sticking process in the area | region in which the said organic device or the said intermediate body is not formed in the said support substrate. In the attaching step, the protective sheet having the spacer extending in another direction orthogonal to the one direction of the base material and disposed at a predetermined interval in the one direction is attached to the support substrate,
The manufacturing method of the organic device of Claim 8 including the cutting process which cut | disconnects the said protection sheet and the said support substrate along the said other direction in the position where the said spacer is arrange | positioned after the said sticking process.

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