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JP2018010981A - Thermoelectric conversion module and manufacturing method thereof - Google Patents

Thermoelectric conversion module and manufacturing method thereof Download PDF

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JP2018010981A
JP2018010981A JP2016139328A JP2016139328A JP2018010981A JP 2018010981 A JP2018010981 A JP 2018010981A JP 2016139328 A JP2016139328 A JP 2016139328A JP 2016139328 A JP2016139328 A JP 2016139328A JP 2018010981 A JP2018010981 A JP 2018010981A
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conductive polymer
metal layer
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thermoelectric conversion
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JP6781982B2 (en
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雅一 向田
Masakazu Mukoda
雅一 向田
慶碩 衛
Keiseki Ei
慶碩 衛
石田 敬雄
Takao Ishida
敬雄 石田
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National Institute of Advanced Industrial Science and Technology AIST
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Abstract

PROBLEM TO BE SOLVED: To provide a space-saving thermoelectric conversion module of large thermoelectric output, using a P type conductive polymer material.SOLUTION: In a thermoelectric conversion module 100, a conductive polymer layer 1 having P type thermoelectric characteristics and a metal layer 2 are laminated alternately without gap between two metal layers 2 located at the opposite ends, and an isolation layer 3 and electrode layers 4, 5 are boded to the opposite sides of the conductive polymer layer 1. The electrode layers 4, 5 are located at the first end on the front of the conductive polymer layer 1, and the second end on the opposite side to the first end of the back, and the conductive polymer layer 1 and metal layer 2 are connected electrically via the electrode layers 4, 5.SELECTED DRAWING: Figure 1

Description

本発明は、熱電変換モジュールに関し、より具体的には、熱電材料として導電性高分子を用いた熱電変換モジュールとその製造方法に関する。   The present invention relates to a thermoelectric conversion module, and more specifically, to a thermoelectric conversion module using a conductive polymer as a thermoelectric material and a manufacturing method thereof.

熱電変換とは、固体の熱電変換モジュールを用いて熱エネルギーと電気エネルギーを相互に変換する技術である。このうち熱エネルギーを電気エネルギーに変換する技術は、熱電発電と呼ばれ、熱電効果の1つであるゼーベック効果に基づく。熱電発電では、熱電変換モジュールの両端間の温度差が電気エネルギーに直接変換される。   Thermoelectric conversion is a technique for converting heat energy and electrical energy to each other using a solid thermoelectric conversion module. Of these, the technology for converting thermal energy into electrical energy is called thermoelectric power generation and is based on the Seebeck effect, which is one of the thermoelectric effects. In thermoelectric power generation, the temperature difference between both ends of the thermoelectric conversion module is directly converted into electrical energy.

導電性高分子は、材料として軽量、フレキシビリティ、無毒性安価等のメリットがあり、製造プロセスにおいては大量生産、大面積生産、安価等のメリットがあり、電気・電子部材への応用が見込まれる材料である。例えば、特許文献1では、導電性高分子を含む導電性フィルムと絶縁性断熱体を交互に隣接させた構造体の上下に電極を配したいわゆるパイ(π)型の熱電変換モジュールを開示している。   Conductive polymers have advantages such as light weight, flexibility, and non-toxicity as a material, and the manufacturing process has advantages such as mass production, large area production, and low cost, and is expected to be applied to electrical and electronic components. Material. For example, Patent Document 1 discloses a so-called pi (π) type thermoelectric conversion module in which electrodes are arranged above and below a structure in which conductive films containing a conductive polymer and insulating heat insulators are alternately adjacent to each other. Yes.

特許文献1のπ型の熱電変換モジュールでは、P型熱電材料(導電性高分子)からなる導電性フィルムの間の絶縁性断熱体中に上下の各電極を電気的に接続する導電線が設けられており、導電線及び上下電極の配置上余計なスペースが必要となる。   In the π-type thermoelectric conversion module of Patent Document 1, conductive wires that electrically connect the upper and lower electrodes are provided in an insulating heat insulator between conductive films made of a P-type thermoelectric material (conductive polymer). Therefore, an extra space is required for the arrangement of the conductive wires and the upper and lower electrodes.

国際公開WO2013/065856International Publication WO2013 / 065856

本発明は、P型の導電性高分子材料を用いた、熱電出力が大きく、省スペース型の熱電変換モジュールを提供することを目的とする。   It is an object of the present invention to provide a space-saving thermoelectric conversion module that uses a P-type conductive polymer material and has a large thermoelectric output.

本発明の一態様では、両端に位置する2つの金属層の間でP型の熱電特性を有する導電性高分子層と金属層が交互に隙間なく積層され、導電性高分子層の両面に絶縁層と電極層が接合しており、電極層が、導電性高分子層の表面の第1端部と、裏面の第1端部とは反対側の第2端部とに位置し、導電性高分子層と金属層が電極層を介して電気的接続する、熱電変換モジュールを提供する。   In one embodiment of the present invention, a conductive polymer layer having a P-type thermoelectric property and a metal layer are alternately stacked between two metal layers located at both ends without any gap, and insulation is provided on both surfaces of the conductive polymer layer. The electrode layer is located at the first end of the surface of the conductive polymer layer and the second end opposite to the first end of the back surface, and is electrically conductive. Provided is a thermoelectric conversion module in which a polymer layer and a metal layer are electrically connected via an electrode layer.

本発明の他の一態様では、従来の上下の電極が不要であり、隙間なく積層されたP型の導電性高分子層と金属層の間を層間の電極層を介して発電時の電流が流れるので、単位面積当たりの熱電出力が大きい省スペース型の熱電変換モジュールを得ることができる。   In another aspect of the present invention, the conventional upper and lower electrodes are unnecessary, and a current during power generation is generated between the P-type conductive polymer layer and the metal layer that are stacked without any gap through the interlayer electrode layer. Since it flows, a space-saving thermoelectric conversion module having a large thermoelectric output per unit area can be obtained.

本発明の一態様では、熱電変換モジュールの製造方法が提供される。その製造方法は、(a)表面の端部に電極層が形成され、表面の前記電極層以外の領域に絶縁層が形成された第1金属層を準備するステップと、(b)両面の端部に電極層が形成され、両面の電極層以外の領域に絶縁層が形成された第2金属層を準備するステップであって、その両面の端部は表面と裏面とで互いに反対側に位置するステップと、(c)少なくとも2以上の導電性高分子層を準備し、隣り合う2つの導電性高分子層の間に、第2金属層を接合した積層構造を作るステップと、(d)積層構造の両端の導電性高分子層の各々の表面に、表面の電極層及び絶縁層が接するように第1金属層を接合するステップと、を含む。   In one embodiment of the present invention, a method for manufacturing a thermoelectric conversion module is provided. The manufacturing method includes the steps of (a) preparing a first metal layer in which an electrode layer is formed at an end of a surface and an insulating layer is formed in a region other than the electrode layer on the surface; Preparing a second metal layer in which an electrode layer is formed on the surface and an insulating layer is formed in a region other than the electrode layers on both surfaces, and the end portions on both surfaces are positioned on opposite sides of the front surface and the back surface And (c) preparing at least two or more conductive polymer layers and forming a laminated structure in which a second metal layer is bonded between two adjacent conductive polymer layers, and (d) Bonding a first metal layer to the surface of each of the conductive polymer layers at both ends of the laminated structure so that the electrode layer and the insulating layer on the surface are in contact with each other.

本発明の他の一態様では、熱電変換モジュールを構成する各層を予め準備し、求められる熱電出力に応じて、必要となる数の各層を隙間なく積層(接合)させるという比較的簡易な方法で、単位面積当たりの熱電出力が大きい省スペース型の熱電変換モジュールを得ることができる。   In another aspect of the present invention, each layer constituting the thermoelectric conversion module is prepared in advance, and according to the required thermoelectric output, a required number of layers are laminated (bonded) without gaps in a relatively simple method. A space-saving thermoelectric conversion module having a large thermoelectric output per unit area can be obtained.

本発明の一実施形態の熱電変換モジュールの構成を示す断面図である。It is sectional drawing which shows the structure of the thermoelectric conversion module of one Embodiment of this invention. 本発明の一実施形態の熱電変換モジュールの製造工程を示す図である。It is a figure which shows the manufacturing process of the thermoelectric conversion module of one Embodiment of this invention. 本発明の一実施形態の熱電変換モジュールの製造工程を説明するための図である。It is a figure for demonstrating the manufacturing process of the thermoelectric conversion module of one Embodiment of this invention. 本発明の一実施例の熱電変換モジュールの外観を示す図である。It is a figure which shows the external appearance of the thermoelectric conversion module of one Example of this invention. 本発明の一実施例の熱電変換モジュールの特性を示す図である。It is a figure which shows the characteristic of the thermoelectric conversion module of one Example of this invention. 本発明の一実施例の熱電変換モジュールの特性を示す図である。It is a figure which shows the characteristic of the thermoelectric conversion module of one Example of this invention. 本発明の一実施例の熱電変換モジュールの特性を示す図である。It is a figure which shows the characteristic of the thermoelectric conversion module of one Example of this invention. 本発明の一実施例の熱電変換モジュールで利用可能な電極(金属)材料の接触抵抗を示す図である。It is a figure which shows the contact resistance of the electrode (metal) material which can be utilized with the thermoelectric conversion module of one Example of this invention.

図面を参照しながら本発明の実施形態について説明する。図1は、本発明の一実施形態の熱電変換モジュール100の構成を示す断面図である。(a)に示すように、熱電変換モジュール100は、導電性高分子層1と金属層2が交互に積層された構造を備える。その際に、両端には金属層2が配置される。導電性高分子層1はP型の熱電特性を有する材料からなる。金属層2は電気的接続用の金属からなる。したがって、本発明の一実施形態の熱電変換モジュールは、P型の熱電材料(導電性高分子層)と電気的接続材料(金属層)が交互に積層された構成を有する。   Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing a configuration of a thermoelectric conversion module 100 according to an embodiment of the present invention. As shown to (a), the thermoelectric conversion module 100 is equipped with the structure where the conductive polymer layer 1 and the metal layer 2 were laminated | stacked alternately. In that case, the metal layer 2 is arrange | positioned at both ends. The conductive polymer layer 1 is made of a material having P-type thermoelectric characteristics. The metal layer 2 is made of a metal for electrical connection. Therefore, the thermoelectric conversion module according to one embodiment of the present invention has a configuration in which P-type thermoelectric materials (conductive polymer layers) and electrical connection materials (metal layers) are alternately stacked.

導電性高分子層1は、例えばPEDOT:PSS膜からなる。PEDOT:PSSは、poly(3,4-ethylenedioxythiophen)(PEDOT)とpoly(styrenesulfonate)(PSS)とから構成される電荷移動複合体(charge transfer complex)である。PEDOT:PSSは、P型の熱電特性を有する。PEDOT:PSSでは、ドーパントとして働くPSSからキャリアがPEDOTに供給され、これによりPEDOTに良好な導電性が生じる。また、エチレングリコール(EG)をPEDOT:PSS膜の製膜時に添加する事により結晶方向がそろい製膜後のPEDOT:PSS膜の電気伝導度を向上させることができる。   The conductive polymer layer 1 is made of, for example, a PEDOT: PSS film. PEDOT: PSS is a charge transfer complex composed of poly (3,4-ethylenedioxythiophene) (PEDOT) and poly (styrenesulfonate) (PSS). PEDOT: PSS has P-type thermoelectric properties. In PEDOT: PSS, carriers are supplied to PEDOT from PSS acting as a dopant, and this results in good conductivity in PEDOT. Further, by adding ethylene glycol (EG) during the formation of the PEDOT: PSS film, the electric conductivity of the PEDOT: PSS film after film formation with the same crystal orientation can be improved.

金属層2は、例えばニッケル(Ni)膜からなる。一般的な金属は、熱電特性的にN型であるため、金属層2はモジュール構成上電気的接続のみでなくN型としての熱電特性が大きい金属が望ましい。NiはN型の熱電特性を有し、20mV/Kのゼーベック係数を有する。ただし、詳細は後述するように、Ni膜とPEDOT:PSS膜との接触抵抗が大きいので、本発明では以下に述べる電極層を用いる。   The metal layer 2 is made of, for example, a nickel (Ni) film. Since a general metal is N-type in terms of thermoelectric characteristics, the metal layer 2 is preferably a metal that has not only electrical connection but also high N-type thermoelectric characteristics in terms of module configuration. Ni has N-type thermoelectric properties and has a Seebeck coefficient of 20 mV / K. However, as will be described in detail later, since the contact resistance between the Ni film and the PEDOT: PSS film is large, the electrode layer described below is used in the present invention.

図1(b)は(a)の楕円で囲まれた領域、すなわち2つの導電性高分子層1の間の金属層2を含む構成の詳細を示す。金属層2の両面に絶縁層3と電極層4、5が接合している。電極層4が、金属層2の表面の一方の端部に位置し、電極層5は裏面の一方の端部とは反対側の他方の端部に位置する。   FIG. 1B shows details of the configuration including the metal layer 2 between the two conductive polymer layers 1, that is, the region surrounded by the ellipse of FIG. The insulating layer 3 and the electrode layers 4 and 5 are bonded to both surfaces of the metal layer 2. The electrode layer 4 is located at one end of the surface of the metal layer 2, and the electrode layer 5 is located at the other end opposite to the one end of the back surface.

なお、図1(b)では絶縁層3及び電極層4、5と導電性高分子層1との間にスペースがあるが、これは構成をわかりやすく見せるために空けたものであり、実際には絶縁層3及び電極層4、5は導電性高分子層1にも接合している。したがって、(b)の2つの導電性高分子層1の内側の表面から観ると、電極層4が一方の導電性高分子層1の表面の一方の端部に位置し、電極層5は他方の導電性高分子層1の表面の一方の端部とは反対側の他方の端部に位置する。その結果、導電性高分子層1と金属層2は電極層4、5を介して電気的に直列接続することになる。   In FIG. 1 (b), there is a space between the insulating layer 3 and the electrode layers 4, 5 and the conductive polymer layer 1, but this is a space for easy understanding of the configuration. The insulating layer 3 and the electrode layers 4 and 5 are also bonded to the conductive polymer layer 1. Accordingly, when viewed from the inner surface of the two conductive polymer layers 1 of (b), the electrode layer 4 is located at one end of the surface of one of the conductive polymer layers 1, and the electrode layer 5 is the other The conductive polymer layer 1 is located at the other end opposite to one end of the surface. As a result, the conductive polymer layer 1 and the metal layer 2 are electrically connected in series via the electrode layers 4 and 5.

図1(c)は(b)の構成(積層構造)が複数接合された状態(多段)の熱電変換モジュール100が熱電変換により発電する様子を示すイメージ図である。熱電変換モジュールの下側に熱源があって加熱されており、ゼーベック効果によりモジュール内で発生する電流が矢印6で示すように順次流れて外部回路へ出力されると共に、その上側から放熱する。モジュール内では、導電性高分子層1内で発生し上側へ流れる電流が、接合する電極層4を介して隣の金属層1へ流れ込む。電流は金属層2内を下側へ向けて流れ、接合する電極層5を介して隣の導電性高分子層1へ流れ込む。以下、同様な電流経路6が繰り返される。   FIG.1 (c) is an image figure which shows a mode that the thermoelectric conversion module 100 of the state (multistage) in which the structure (laminated structure) of (b) was joined is produced | generated by thermoelectric conversion. There is a heat source on the lower side of the thermoelectric conversion module and it is heated, and the current generated in the module by the Seebeck effect flows sequentially as shown by the arrow 6 and is output to the external circuit and radiates heat from the upper side. In the module, a current generated in the conductive polymer layer 1 and flowing upward flows into the adjacent metal layer 1 through the electrode layer 4 to be joined. The current flows downward in the metal layer 2 and flows into the adjacent conductive polymer layer 1 through the electrode layer 5 to be joined. Thereafter, the same current path 6 is repeated.

図1に示すように、本発明の一実施形態の熱電変換モジュール100において、導電性高分子層1と金属層2を直接接合して電気的な直列接続、言い換えれば両者間の電流経路を形成せずに、両者に接合する電極層4、5を介して両者間の電流経路を形成するのは、既に上述した導電性高分子層1にPEDOT:PSSを用い、金属層2にNiを用いた場合のように、導電性高分子層1と金属層2との接合界面における接触抵抗が大きい場合を想定しているからである。   As shown in FIG. 1, in the thermoelectric conversion module 100 of one embodiment of the present invention, the conductive polymer layer 1 and the metal layer 2 are directly joined to form an electrical series connection, in other words, a current path between the two. Without using the PEDOT: PSS for the conductive polymer layer 1 and using Ni for the metal layer 2, the current path between the two is formed via the electrode layers 4 and 5 bonded to each other. This is because it is assumed that the contact resistance at the bonding interface between the conductive polymer layer 1 and the metal layer 2 is large, as in the case of the case.

図8に導電性高分子層1としてPEDOT:PSSを用いた場合の複数の金属材料との接触抵抗を示す。Ni以外では、Alは接触抵抗が大きいので電極層としては明らかに不向きである。電極層としては、Au、Pt、Ag、C、またはCuを用いることができる。より好ましくは、接触抵抗が低く酸化しにくい金属であるAu、PtまたはAgを電極層として用いることができる。なお、図8の“20nmAu−Ni”は、PEDOT:PSS膜上のNi上に重ねて20nm厚さのAuを形成した場合の接触抵抗である。この構成は、図1の本発明の一実施形態の熱電変換モジュール100における導電性高分子層1(PEDOT:PSS)、金属層2(Ni)及び電極層(Au)4、5の組み合わせと同じである。   FIG. 8 shows contact resistances with a plurality of metal materials when PEDOT: PSS is used as the conductive polymer layer 1. Other than Ni, Al is obviously unsuitable as an electrode layer because of its high contact resistance. As the electrode layer, Au, Pt, Ag, C, or Cu can be used. More preferably, Au, Pt, or Ag, which is a metal that has low contact resistance and is difficult to oxidize, can be used as the electrode layer. In addition, “20 nm Au—Ni” in FIG. 8 is a contact resistance when Au having a thickness of 20 nm is formed on Ni on the PEDOT: PSS film. This configuration is the same as the combination of the conductive polymer layer 1 (PEDOT: PSS), the metal layer 2 (Ni), and the electrode layers (Au) 4 and 5 in the thermoelectric conversion module 100 of the embodiment of the present invention shown in FIG. It is.

絶縁層3としては、例えば絶縁性高分子を用いることができる。絶縁性高分子としては、例えば液体のり(PVAL:ポリビニルアルコール)を用いることができる。   As the insulating layer 3, for example, an insulating polymer can be used. As the insulating polymer, for example, liquid glue (PVAL: polyvinyl alcohol) can be used.

図2と図3を参照しながら図1の本発明の一実施形態の熱電変換モジュールの製造方法について説明する。図2のステップ(a)において、第1金属層を準備する。図3(a)に示すように、金属層(例えばNi箔)2の表面に最初に端部を覆うマスクを用いて電極層(例えばAu)4を真空蒸着などの従来の薄膜形成技術を用いて形成する。次に、電極層を覆うマスクを用いて絶縁層(絶縁性高分子、例えば液体のり)3を形成(例えば塗布)する。その後、所定時間加熱して(例えば50〜100度で数十分間)絶縁性高分子を固定し平坦化する。本発明では、この金属箔2の表面に絶縁層3と電極層4が形成された形態(図3のA)を第1金属層と呼ぶ。   A method for manufacturing the thermoelectric conversion module according to the embodiment of the present invention shown in FIG. 1 will be described with reference to FIGS. In step (a) of FIG. 2, a first metal layer is prepared. As shown in FIG. 3 (a), a conventional thin film forming technique such as vacuum deposition of an electrode layer (for example, Au) 4 is performed on the surface of the metal layer (for example, Ni foil) 2 by using a mask that first covers an end portion. Form. Next, an insulating layer (insulating polymer, for example, a liquid paste) 3 is formed (for example, coated) using a mask that covers the electrode layer. Thereafter, the insulating polymer is fixed and flattened by heating for a predetermined time (for example, several tens of minutes at 50 to 100 degrees). In the present invention, the form in which the insulating layer 3 and the electrode layer 4 are formed on the surface of the metal foil 2 (A in FIG. 3) is referred to as a first metal layer.

図2のステップ(b)において、第2金属層を準備する。図3(b)に示すように、金属層(例えばNi箔)2の両面(表と裏)にステップ(a)と同様な方法によって電極層(例えばAu)4、5と絶縁層(絶縁性高分子、例えば液体のり)3を形成(例えば塗布)する。その際、金属層(例えばNi箔)2の表面の電極層4と裏面の電極層5が互いに反対側の端部に位置するようにする。本発明では、この金属箔2の両面に絶縁層3と電極層4、5が形成された形態(図3のB)を第2金属層と呼ぶ。   In step (b) of FIG. 2, a second metal layer is prepared. As shown in FIG. 3B, electrode layers (for example, Au) 4 and 5 and insulating layers (insulating properties) are formed on both surfaces (front and back) of a metal layer (for example, Ni foil) 2 by the same method as in step (a). A polymer (for example, a liquid paste) 3 is formed (for example, coated). At this time, the electrode layer 4 on the front surface of the metal layer (for example, Ni foil) 2 and the electrode layer 5 on the back surface are positioned at opposite ends. In the present invention, the form in which the insulating layer 3 and the electrode layers 4 and 5 are formed on both surfaces of the metal foil 2 (B in FIG. 3) is referred to as a second metal layer.

図2のステップ(c)において、導電性高分子層1を準備する。例えば導電性高分子層1としてPEDOT:PSSを用いる場合は、キャスト法を用いて、PEDOT:PSSの水性分散液に例えば3%のEGを添加したものを基板上に塗布して所定の温度でゆっくりと乾燥させる(例えば100度以下で数十時間)。乾燥後のPEDOT:PSS(EG)膜を基板から剥離して、図3(c)に示すように、金属箔(例えばNi箔)2と同様なサイズのPEDOT:PSS(EG)膜1を得る。   In step (c) of FIG. 2, the conductive polymer layer 1 is prepared. For example, when PEDOT: PSS is used as the conductive polymer layer 1, a cast method is used to apply an aqueous dispersion of PEDOT: PSS, for example, with 3% EG applied on the substrate, and at a predetermined temperature. Allow to dry slowly (eg, tens of hours at 100 degrees or less). The PEDOT: PSS (EG) film after drying is peeled off from the substrate to obtain a PEDOT: PSS (EG) film 1 having the same size as the metal foil (for example, Ni foil) 2 as shown in FIG. .

図2のステップ(d)において、図3(d)に示すように、ステップ(c)で作成した導電性高分子層(例えばPEDOT:PSS(EG)膜)1上に第2金属層Bと導電性高分子層1を交互に積層した積層構造を形成する。積層する第2金属層Bと導電性高分子層1の数は、求める熱電出力(熱起電力)に応じて決めることができる。積層構造は必要に応じて加工、整形され、全体のサイズやその断面(図3の(d)の上面及び下面)の平坦性などが調整される。   In step (d) of FIG. 2, as shown in FIG. 3 (d), the second metal layer B and the conductive polymer layer (for example, PEDOT: PSS (EG) film) 1 prepared in step (c) are formed. A laminated structure in which the conductive polymer layers 1 are alternately laminated is formed. The number of the second metal layer B and the conductive polymer layer 1 to be laminated can be determined according to the desired thermoelectric output (thermoelectromotive force). The laminated structure is processed and shaped as necessary, and the overall size and the flatness of the cross section (the upper surface and the lower surface in FIG. 3D) are adjusted.

図2のステップ(e)において、図3(e)に示すように、ステップ(d)で作成した積層構造の両端面に第1金属層Aを接合する。その際に第1金属層Aの金属層2が外側(表面)になるように第1金属層Aを接合する。その接合後の構造体を所定の圧力で加圧しながら所定の温度で加熱して(例えば、100〜300kgf、80〜150度で数十分間)、熱電変換モジュールを得ることができる。     In step (e) of FIG. 2, as shown in FIG. 3 (e), the first metal layer A is bonded to both end faces of the laminated structure created in step (d). At this time, the first metal layer A is bonded so that the metal layer 2 of the first metal layer A is on the outside (surface). The bonded structure is heated at a predetermined temperature while being pressed at a predetermined pressure (for example, 100 to 300 kgf, 80 to 150 degrees for several tens of minutes) to obtain a thermoelectric conversion module.

図2に示した製造方法(工程)を用いて、実際に図1の熱電変換モジュール100を作製した。導電性高分子層1と第2金属層Bを1ユニット(組)として10ユニット(組)からなる熱電変換モジュール100を作製した。電性高分子層1としてPEDOT:PSS(EG)膜(厚さ:50〜100μm)を用い、金属層2としてNi箔(厚さ:約5μm)を用い、絶縁層3として液体のり(PVAL:ポリビニルアルコール)を用い、電極層4としてAu(20〜30nm)を用いた。全体のサイズは、22mm×22mm、厚さ2mmである。図4にその作製した熱電変換モジュールの外観を示す。図4(b)の表面の光って見えるのが外側層をなすNi箔である。   The thermoelectric conversion module 100 of FIG. 1 was actually produced using the manufacturing method (process) shown in FIG. A thermoelectric conversion module 100 composed of 10 units (group) was produced with the conductive polymer layer 1 and the second metal layer B as one unit (group). A PEDOT: PSS (EG) film (thickness: 50 to 100 μm) is used as the electroconductive polymer layer 1, a Ni foil (thickness: about 5 μm) is used as the metal layer 2, and a liquid paste (PVAL: Polyvinyl alcohol) was used, and Au (20 to 30 nm) was used as the electrode layer 4. The overall size is 22 mm × 22 mm and the thickness is 2 mm. FIG. 4 shows the appearance of the produced thermoelectric conversion module. The Ni foil forming the outer layer is visible on the surface of FIG.

作製した熱電変換モジュール100に図1(c)に示すように上下で温度差ΔT(K)を与えて熱起電力(mV)を測定した。図5にその結果を示す。温度差ΔT(K)の上昇と共に熱起電力(mV)がほぼ線形に増加していることがわかる。この時のゼーベック係数Sは、332.7μV/Kであった。   As shown in FIG. 1 (c), the thermoelectric power (mV) was measured by giving a temperature difference ΔT (K) up and down to the produced thermoelectric conversion module 100. FIG. 5 shows the result. It can be seen that the thermoelectromotive force (mV) increases almost linearly as the temperature difference ΔT (K) increases. The Seebeck coefficient S at this time was 332.7 μV / K.

図6に作製した熱電変換モジュール100の電流―電圧(I―V)特性の測定結果を示す。図の線形性からオーミック接合であることがわかり、その抵抗値Rは4.6Ωであった。   FIG. 6 shows the measurement result of the current-voltage (IV) characteristics of the thermoelectric conversion module 100 produced. From the linearity of the figure, it was found that it was an ohmic junction, and its resistance value R was 4.6Ω.

図7に作製した熱電変換モジュール100の出力電圧と出力電力の関係を示す。温度差ΔT(K)が10K、30K、50Kと大きくなると共に、出力電圧(mV)と出力電力(μW)は上昇し、ΔT=50Kで最大電力P=10μW/0.44cm2(22.7μW/cm2)を得ることができた。すなわち、20μW/cm2以上の出力電力密度を得ることができることがわかった。また、ΔT=50Kで出力電圧V=15mVを得ることができることがわかった。 FIG. 7 shows the relationship between the output voltage and output power of the thermoelectric conversion module 100 produced. As the temperature difference ΔT (K) increases to 10K, 30K, and 50K, the output voltage (mV) and output power (μW) increase, and when ΔT = 50K, the maximum power P = 10 μW / 0.44 cm 2 (22.7 μW). / Cm 2 ) could be obtained. That is, it was found that an output power density of 20 μW / cm 2 or more can be obtained. It was also found that an output voltage V = 15 mV can be obtained at ΔT = 50K.

本発明の実施形態について、図を参照しながら説明をした。しかし、本発明はこれらの実施形態に限られるものではない。さらに、本発明はその趣旨を逸脱しない範囲で当業者の知識に基づき種々なる改良、修正、変形を加えた態様で実施できるものである。 Embodiments of the present invention have been described with reference to the drawings. However, the present invention is not limited to these embodiments. Furthermore, the present invention can be implemented in variously modified, modified, and modified forms based on the knowledge of those skilled in the art without departing from the spirit of the present invention.

本発明の熱電変換モジュールは、小型で軽量であるため、身の回りの排熱回収を含めて産業上の幅広い利用が可能である。   Since the thermoelectric conversion module of the present invention is small and lightweight, it can be used in a wide range of industries including exhaust heat recovery around us.

1 導電性高分子層
2 金属層
3 絶縁層
4、5 電極層
6 電流経路
100 熱電変換モジュール
DESCRIPTION OF SYMBOLS 1 Conductive polymer layer 2 Metal layer 3 Insulating layer 4, 5 Electrode layer 6 Current path 100 Thermoelectric conversion module

Claims (10)

両端に位置する2つの金属層の間でP型の熱電特性を有する導電性高分子層と金属層が交互に隙間なく積層され、
前記導電性高分子層の両面に絶縁層と電極層が接合しており、
前記電極層が、前記導電性高分子層の表面の第1端部と、裏面の第1端部とは反対側の第2端部とに位置し、前記導電性高分子層と前記金属層が前記電極層を介して電気的接続する、熱電変換モジュール。
Between the two metal layers located at both ends, a conductive polymer layer having a P-type thermoelectric property and a metal layer are alternately laminated without gaps,
An insulating layer and an electrode layer are bonded to both surfaces of the conductive polymer layer,
The electrode layer is positioned at a first end of the surface of the conductive polymer layer and a second end opposite to the first end of the back surface, and the conductive polymer layer and the metal layer Is a thermoelectric conversion module that is electrically connected via the electrode layer.
前記導電性高分子層はPEDOT:PSS膜からなり、前記金属層はNiからなり、前記電極層はAu、Pt、Ag、Cu、及びCの中から選択された1つまたは2以上からなる、請求項1の熱電変換モジュール。   The conductive polymer layer is made of a PEDOT: PSS film, the metal layer is made of Ni, and the electrode layer is made of one or more selected from Au, Pt, Ag, Cu, and C. The thermoelectric conversion module according to claim 1. 前記絶縁層は、絶縁性高分子層からなる、請求項2の熱電変換モジュール。   The thermoelectric conversion module according to claim 2, wherein the insulating layer is made of an insulating polymer layer. 発電時に、前記導電性高分子層を第1方向に流れる電流が、接合する前記電極層を介して隣の前記金属層へ流れ込み、当該金属層を前記第1方向とは逆向きの第2方向に流れる、請求項1の熱電変換モジュール。   During power generation, a current flowing in the conductive polymer layer in the first direction flows into the adjacent metal layer through the electrode layer to be joined, and the metal layer is in a second direction opposite to the first direction. The thermoelectric conversion module according to claim 1, wherein 熱電変換モジュールの製造方法であって、
表面の端部に電極層が形成され、表面の前記電極層以外の領域に絶縁層が形成された第1金属層を準備するステップと、
両面の端部に電極層が形成され、両面の前記電極層以外の領域に絶縁層が形成された第2金属層を準備するステップであって、前記両面の端部は表面と裏面とで互いに反対側に位置する、ステップと、
少なくとも2以上の導電性高分子層を準備し、隣り合う2つの導電性高分子層の間に、前記第2金属層を接合した積層構造を作るステップと、
前記積層構造の両端の前記導電性高分子層の各々の表面に、表面の前記電極層及び前記絶縁層が接するように前記第1金属層を接合するステップと、を含む製造方法。
A method for manufacturing a thermoelectric conversion module, comprising:
Preparing a first metal layer in which an electrode layer is formed at an end of the surface and an insulating layer is formed in a region other than the electrode layer on the surface;
Preparing a second metal layer in which electrode layers are formed at both ends and an insulating layer is formed in a region other than the electrode layers on both surfaces, the end portions on both surfaces being mutually A step located on the opposite side;
Preparing at least two or more conductive polymer layers, and forming a laminated structure in which the second metal layer is bonded between two adjacent conductive polymer layers;
Bonding the first metal layer to the surface of each of the conductive polymer layers at both ends of the laminated structure so that the electrode layer and the insulating layer on the surface are in contact with each other.
前記導電性高分子層はPEDOT:PSS膜からなる、請求項5の製造方法。   The manufacturing method according to claim 5, wherein the conductive polymer layer is made of a PEDOT: PSS film. 前記第1金属層を準備するステップと、前記第2金属層を準備するステップは、
Ni箔の表面の端部にAu、Pt、Ag、Cu、及びCの中から選択された1つまたは2以上からなる金属層を形成するステップと、
前記Ni箔の表面の前記電極層以外の領域に絶縁性高分子層を形成するステップと、を含む請求項6の製造方法。
Preparing the first metal layer and preparing the second metal layer,
Forming a metal layer composed of one or more selected from Au, Pt, Ag, Cu, and C at the end of the surface of the Ni foil;
Forming an insulating polymer layer in a region other than the electrode layer on the surface of the Ni foil.
前記第1金属層を接合後の前記積層構造を加圧及び加熱するステップをさらに含む、請求項7の製造方法。   The manufacturing method according to claim 7, further comprising a step of pressurizing and heating the laminated structure after joining the first metal layer. 前記Ni箔の表面の端部に金属層を形成するステップは、前記Ni箔の表面にマスクを用いてAu、Pt、Ag、Cu、及びCの中から選択された1つまたは2以上の金属を蒸着するステップを含む、請求項7の製造方法。   The step of forming a metal layer on an end portion of the surface of the Ni foil includes one or more metals selected from Au, Pt, Ag, Cu, and C using a mask on the surface of the Ni foil. The manufacturing method of Claim 7 including the step which vapor-deposits. 前記Ni箔の表面の前記電極層以外の領域に絶縁性高分子層を形成するステップは、前記領域に液体のりを塗布し加熱するステップを含む、請求項9の製造方法。   The method according to claim 9, wherein the step of forming the insulating polymer layer in a region other than the electrode layer on the surface of the Ni foil includes a step of applying a liquid paste to the region and heating the region.
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