JP2018006490A - Manufacturing method of sheet molding, and manufacturing method of light-emitting device using the same - Google Patents

Abstract

Provided is a manufacturing method for easily forming a sheet molded body having a phosphor-containing region of a desired shape in which phosphors are contained substantially uniformly.
A step of cutting a semi-cured first sheet in which a phosphor is contained substantially uniformly in a resin with a mold having a plurality of through holes or recesses to form a plurality of small pieces 40 that are spaced apart from each other. A step of curing the plurality of small pieces, a step of covering a part of the surface of the cured plurality of small pieces with at least a semi-cured second sheet 20 made of resin, and curing the second sheet. And a step of forming a sheet molded body.
[Selection] Figure 3

Description

  The present invention relates to a method for producing a sheet molded body and a method for producing a light emitting device using the same.

  A light-emitting device in which a wavelength conversion layer containing a phosphor is placed on a light-emitting element such as an LED is known. For example, Patent Document 1 includes a light emitting element and a color conversion plate placed on the light emitting element and containing at least first and second phosphors. In the color conversion plate of Patent Document 1, a plurality of first regions including a first phosphor are arranged at a predetermined interval on the light emitting element side surface, and a second phosphor including a second phosphor on the opposite surface. The regions are arranged at predetermined intervals, and the phosphors are not included in other regions. If such a color conversion plate is used, the light emitted from each phosphor is difficult to be absorbed by other phosphors, and the light from the light emitting element can efficiently reach each phosphor.

  The color conversion plate as described above, for example, as described in Patent Document 1, uses a mold and a resin, and forms a substrate having recesses of a desired shape on both sides, and a predetermined phosphor is formed in the recesses. It can form by providing resin to contain by the printing method or the dripping method.

Japanese Patent Laying-Open No. 2015-122485

  However, as described in Patent Document 1, when a resin containing a phosphor is provided in the concave portion by a printing method or a dropping method, the phosphor settles in a liquid resin, and depending on the sedimentation condition, the light is emitted from the light emitting device. Color unevenness may occur in the emitted light.

  Then, embodiment of this invention aims at forming the sheet | seat molded object which has the fluorescent substance containing area | region of the desired shape in which the fluorescent substance was contained substantially uniformly. Furthermore, it aims at manufacturing the light-emitting device with little color unevenness using the said sheet molded object.

  In the method for producing a sheet molded body according to an embodiment of the present invention, a semi-cured first sheet in which a phosphor is contained in a resin in a substantially uniform manner is die-cut with a mold having a plurality of through holes or recesses, A step of forming a plurality of spaced apart small pieces, a step of curing the plurality of small pieces, and a step of covering a part of the surface of the cured plurality of small pieces with at least a semi-cured second sheet made of resin. And a step of curing the second sheet to form a sheet molded body.

  In the method for manufacturing a light emitting device according to an embodiment of the present invention, a light emitting element having a first main surface having a pair of electrodes and a second main surface opposite to the first main surface is formed on the small piece. A light-reflective member so as to cover the step of placing the second main surface so as to cover a part and side surfaces of the first main surface of the light emitting element and the upper surface of the sheet molded body. Forming a step.

  Furthermore, in the method for manufacturing a light emitting device according to an embodiment of the present invention, the sheet molded body includes a first main surface having a pair of electrodes and a second main surface opposite to the first main surface. A step of placing the small piece on the light emitting element on the light emitting element placed so that one main surface side is arranged; a part of the first main surface of the light emitting element; Forming a light reflecting member so as to cover the side surface and the lower surface and side surface of the sheet molded body.

  According to the manufacturing method according to the embodiment of the present invention, it is possible to easily form a sheet molded body having a phosphor-containing region having a desired shape in which the phosphor is contained substantially uniformly. Furthermore, a light-emitting device with little color unevenness can be manufactured using the sheet molded body.

1A is a schematic cross-sectional view showing a small piece forming step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. FIG. 1B is a schematic cross-sectional view illustrating a small piece forming step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 1C is a schematic cross-sectional view illustrating a small piece forming step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 1D is a schematic plan view illustrating a small piece forming step in the method for manufacturing a sheet molded body according to the first embodiment. FIG. 2A is a schematic cross-sectional view illustrating a small piece coating step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 2B is a schematic cross-sectional view illustrating a small piece covering step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. 3 is a schematic cross-sectional view of a sheet molded body manufactured by the manufacturing method according to the first embodiment. FIG. 4 is a schematic cross-sectional view showing a singulation process in the method for manufacturing a sheet molded body according to the first embodiment. FIG. 5A is a schematic cross-sectional view illustrating a small piece forming step in the method for manufacturing a sheet molded body according to the second embodiment. FIG. 5B is a schematic cross-sectional view illustrating a second sheet partial removal step in the method for manufacturing a sheet molded body according to the second embodiment. FIG. 5C is a schematic cross-sectional view of a sheet molded body manufactured by the manufacturing method according to Embodiment 2. FIG. 6 is a schematic cross-sectional view illustrating a light-emitting element mounting step in the method for manufacturing a light-emitting device according to Embodiment 3. FIG. 7 is a schematic cross-sectional view illustrating a light reflective member forming step in the method for manufacturing the light emitting device according to the third embodiment. FIG. 8 is a schematic cross-sectional view showing the singulation process in the method for manufacturing a light emitting device according to Embodiment 3. FIG. 9A is a schematic cross-sectional view of a light emitting device manufactured by the manufacturing method according to Embodiment 3 using the sheet molded body formed in Embodiment 1. FIG. FIG. 9B is a schematic cross-sectional view of another light emitting device manufactured by the manufacturing method according to Embodiment 3 using the sheet molded body formed in Embodiment 1. FIG. 9C is a schematic cross-sectional view of a light emitting device manufactured by the manufacturing method according to Embodiment 3 using the sheet molded body formed in Embodiment 2. FIG. 9D is a schematic cross-sectional view of the light-emitting device manufactured by the manufacturing method according to Embodiment 3. FIG. 9E is a schematic cross-sectional view of a sheet molded body used in the light-emitting device shown in FIG. 9C. FIG. 10 is a schematic cross-sectional view illustrating a sheet molded body placing step in the method for manufacturing a light emitting device according to the fourth embodiment. FIG. 11 is a schematic cross-sectional view showing a light reflective member forming step in the method for manufacturing a light emitting device according to Embodiment 4. FIG. 12 is a schematic cross-sectional view showing a singulation process in the method for manufacturing a light emitting device according to Embodiment 4. FIG. 13 is a schematic cross-sectional view of a light emitting device manufactured by the manufacturing method according to the fourth embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the manufacturing method and configuration of the sheet molded body and the light emitting device described below are for embodying the technical idea of the embodiment, and are not limited to the following. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts do not limit the scope of the present invention unless otherwise specified. In addition, the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. The embodiments described below can be applied by appropriately combining the components.

<Embodiment 1>
(Manufacturing method of sheet compact)
In the method for manufacturing a sheet molded body according to Embodiment 1, a semi-cured first sheet in which a phosphor is contained substantially uniformly in a resin is die-cut with a mold having a plurality of through holes or recesses, and separated from each other. A small piece forming step for forming the plurality of small pieces, a small piece curing step for curing the plurality of small pieces, and a small piece for covering a part of the surface of the cured plurality of small pieces with at least a semi-cured second sheet made of resin. A coating step and a second sheet curing step of curing the second sheet to form a sheet molded body. The sheet molded body may be separated into pieces by appropriately cutting the cured second sheet between a plurality of small pieces. In addition, a sheet molded object is mounted on a light emitting element in a light emitting device, and plays a role of a wavelength conversion layer that converts the light of the light emitting element into desired light.
Hereinafter, each process of the manufacturing method of the sheet molded object 100 which concerns on Embodiment 1 is demonstrated in detail.

(Small piece forming process)
1A to 1D are schematic cross-sectional views illustrating a small piece forming step in the method for manufacturing a sheet molded body according to the first embodiment. In the small piece forming step, a plurality of small pieces separated from each other are formed by punching out the first sheet with a mold.

In the small piece forming step, first, a first sheet 10 and a mold 30 for punching the first sheet 10 are prepared. The first sheet 10 is translucent and is a semi-cured phosphor sheet in which a phosphor is contained substantially uniformly in a resin that is a base material. In addition, the state in which the phosphor is contained substantially uniformly refers to a state in which the phosphor is contained at a substantially uniform concentration in the base resin. Moreover, the semi-cured state in the first sheet 10 refers to a state in which the mold can be removed with a mold or the like, and is, for example, about half the hardness in the main cured state of the resin used for the first sheet 10. For example, when a silicone resin is used, it is preferable that the Shore D hardness is 10 to 30 or the Shore A hardness is 10 to 30. By using the semi-cured first sheet 10 in this way, it is possible to easily perform die cutting with a mold as compared with the case of using a sheet having a relatively high hardness.
The first sheet may contain a plurality of different phosphors, and may contain, for example, a diffusing agent or a colorant in addition to the resin and the phosphor. The first sheet 10 is preferably placed on a substrate such as a film.

As shown in FIGS. 1A and 1B, the mold 30 has a plurality of through holes or recesses 31 through which the first sheet 10 can be punched. In addition, when using the metal mold | die 30 which has the recessed part 31, it is preferable to use the height (depth is smaller than the thickness of the 1st sheet | seat 10 to prepare. Thereby, the 1st sheet | seat 10 is made into a recessed part. It is possible to die-cut into 31 shapes.
In the first embodiment, a mold having a plurality of semicircular spherical recesses 31 is used. It is preferable that the through-hole or the concave portion 31 has a tapered shape because the punched piece is easily detached from the mold. The shape of the recess 31 is not limited to a semicircular sphere, but depends on the shape of a small piece to be formed, such as a polygonal prism such as a triangular prism or a quadrangular prism, a polygonal pyramid such as a triangular pyramid or a quadrangular pyramid, It can be selected appropriately. Similarly, the shape of the through hole can be appropriately selected depending on the shape of a small piece to be formed, such as a vertical surface, an inclined surface, a curved surface, and an uneven surface. The shape of the small piece is preferably selected as appropriate depending on the planar shape of the light emitting element of the light emitting device using the sheet molded body, and details will be described later.
Further, if the mold 30 is such that the inner surface of the through-hole or the recess 31 has a small friction, for example, is processed with polytetrafluoroethylene (PTFE) or the like, the die-cut small piece is easily detached from the mold. preferable.

  Here, the term “mold” is used in the present specification, but the material is not limited to metal, and the structure is not particularly limited as long as the first sheet can be punched. In particular, when the first sheet is punched while being heated, the first sheet is easily deformed and can be easily punched. Therefore, a mold that can be punched while being heated can be suitably used.

  Next, as shown in FIG. 1A, the first sheet 10 is set so as to face the through hole or the recess 31 of the mold 30. And as FIG. 1B shows, the metal mold | die 30 is lowered | hung and the 1st sheet | seat 10 is die-cut. And by raising the mold 30, a plurality of small pieces 40 can be obtained as shown in FIG. 1C. As described above, when the mold 30 having the concave portion 31 is used to mold the semi-cured first sheet 10, a mold having a through hole or a first sheet having a relatively high hardness is used. Compared to the above, small pieces having a desired shape can be easily formed up to the top.

  In the plurality of small pieces 40 formed in the small piece forming step, the phosphor is contained in the resin at a substantially uniform concentration. Moreover, as FIG. 1C and FIG. 1D show, the some small piece 40 formed in Embodiment 1 is a semicircle, and is provided in the space | interval, respectively. The separation distance is preferably larger than the width of the blade to be used, that is, the extent that the dicing blade does not contact the small piece when the sheet molded body is cut in the subsequent singulation step. The thickness (height) of the small piece is preferably 10 μm or more, and more preferably 50 μm or more. Thereby, when the small piece is provided on the light emitting element as a sheet molded body, the light of the light emitting element can be wavelength-converted. The thickness (height) of the small piece 40 is preferably 500 μm or less, more preferably 200 μm or less. Thereby, in the subsequent small piece covering step, the second sheet can easily cover the plurality of small pieces without gaps. Moreover, it is preferable that the space | interval of the some small piece 40 is 200 micrometers or more, More preferably, it is 1000 micrometers or more. Thereby, in the subsequent singulation step, it is possible to form a sheet molded body in which the second sheet between the plurality of small pieces can be easily cut and the small pieces are not exposed from the side surface.

  As described above, by using the semi-cured first sheet 10 in which the phosphor is contained substantially uniformly, a liquid resin containing the phosphor is used, such as an injection molding, a printing method, a dropping method, or the like. Compared to the case, sedimentation and bias of the phosphor can be suppressed, and a plurality of small pieces 40 in which the phosphor is contained substantially uniformly can be formed. Furthermore, by using the semi-cured first sheet 10, it is easy to remove the mold 30 using the mold 30 as compared with the case of using a relatively high hardness sheet. In particular, if the semi-cured first sheet 10 is die-cut using a mold 30 having a recess 31 instead of a through-hole, a desired shape can be obtained up to the upper portion as compared with the case of using the mold 30 having a through-hole. Since the small piece 40 can be formed, it is preferable.

  When a plurality of small pieces are formed by injection molding or the like, the plurality of small pieces are formed as a single piece partly connected by a connecting portion by a mold runner. As described above, since the plurality of small pieces are connected by the connecting portion, when the sheet molded body is later separated into individual pieces, the connecting portion containing the phosphor is exposed on the cut surface. However, depending on the light required for the light emitting device, it may be preferable that the connecting portion containing the phosphor is not exposed on the side surface of the sheet molded body. Some phosphors are vulnerable to moisture, and when the first sheet contains such a phosphor that is vulnerable to moisture, the phosphor may be deteriorated by moisture during dicing. Therefore, in the above case, it is necessary to perform a step of removing the connecting portion. However, as in the first embodiment, the semi-cured first sheet 10 is die-cut with a mold, so that a plurality of small pieces 40 that are separated from each other can be easily formed without performing the step of removing the connecting portion. It is possible.

  In particular, in the first embodiment, the first sheet is punched with a film sandwiched between the mold 30 and the first sheet 10, thereby making it easier to form a plurality of small pieces 40 that are spaced apart from each other. The film can be disposed on either or both of the upper and lower sides of the first sheet 10, and is preferably disposed on both the upper and lower sides. In the first embodiment, when the connecting portion is formed, the connecting portion is removed, and a plurality of small pieces separated from each other are formed.

(Small piece curing process)
Next, the plurality of small pieces 40 are cured in the small piece curing step. For example, it can be heated at 120 ° C. to 170 ° C. for 15 minutes to 4 hours using an oven, reflow, or the like. In order to prevent the deformation of the small piece 40, the curing is preferably performed in a state where the lower surface of the small piece 40 is horizontal.

(Small piece coating process)
2A and 2B are schematic cross-sectional views showing a small piece covering step in the method for manufacturing a sheet molded body according to Embodiment 1. FIG. In the small piece coating step, a plurality of cured small pieces are covered with the second sheet.
In the small piece covering step, first, the second sheet 20 for covering the plurality of small pieces 40 is prepared. The second sheet 20 is a semi-cured sheet made of at least a resin. The semi-cured state of the second sheet 20 is a state in which when the second sheet 20 is disposed on the plurality of small pieces 40, the second sheet 20 is deformed along the small pieces and a part of the surface of the plurality of small pieces can be covered. Refers to that. Therefore, although it depends on the heights and intervals of the plurality of small pieces 40, the second sheet 20 is preferably about half as hard as the main cured state of the resin used. It is preferable that D hardness is 10-30 or Shore A hardness is 10-30.

  The second sheet 20 to be prepared may have a light-transmitting property or a light-reflecting property, and can be appropriately selected depending on the desired light of the light-emitting device in which the sheet molded body is used. For example, as the second sheet 20, a translucent sheet made of only a resin (hereinafter referred to as a clear sheet), a phosphor sheet containing a phosphor in the resin, and a light-reflective material in the resin The reflective sheet etc. which were made are mentioned. In addition, the 2nd sheet | seat 20 may contain the spreading | diffusion agent and the coloring agent other than fluorescent substance and a light reflection material in resin, for example.

  When a clear sheet is used as the second sheet 20, it is possible to form a sheet molded body in which small pieces containing the phosphor substantially uniformly are coated with a translucent resin that does not contain the phosphor. The sheet molded body having such a configuration can protect the phosphor from heat, moisture, and the like. In addition, by placing the light-emitting element on the light-emitting element, it is possible to emit part of the light of the light-emitting element without being wavelength-converted by the phosphor, thereby reducing light absorption by the phosphor and improving light extraction. be able to. Moreover, if a phosphor sheet is used as the second sheet 20, a sheet molded body in which small pieces containing the phosphor substantially uniformly are coated with a translucent resin containing the phosphor can be formed. For example, a sheet molded body is formed using the second sheet 20 including a phosphor that does not absorb the emission color of the phosphor included in the first sheet 10 and is placed on the light emitting element, whereby light absorption by the phosphor is performed. It is possible to form a light emitting device with high emission efficiency that can suppress the above. Furthermore, by using a phosphor sheet in which a phosphor is contained substantially uniformly in a resin, a light emitting device with little color unevenness can be obtained. Moreover, if a reflective sheet is used as the second sheet 20, it is possible to form a sheet molded body in which small pieces containing the phosphor substantially uniformly are coated with a light-reflective resin. In such a sheet molded body, part of the second sheet covering the surface of the plurality of small pieces is removed, the small pieces are exposed, and placed on the light emitting element, so that the parting property is good (that is, the light emitting device). The boundary between the light emitting portion and the light reflecting member surrounding it is relatively clear). In the first embodiment, a clear sheet that does not include a phosphor is used as the second sheet 20.

  The thickness of the prepared second sheet 20 depends on the thickness (height) of the plurality of small pieces 40 and the arrangement interval, but is preferably at least thicker than the plurality of small pieces 40. Thereby, the 2nd sheet | seat 20 can cover a part of surface of the some small piece 40, and can provide the 2nd sheet | seat 20 so that an upper surface may become a substantially plane. In Embodiment 1, the 2nd sheet | seat 20 of 50 micrometers-200 micrometers can be prepared, for example.

  Next, as shown in FIG. 2A, the prepared second sheet 20 is placed on the cured small pieces 40. Then, by appropriately pressing the second sheet 20 from above and applying pressure, the semi-cured second sheet 20 is deformed along the plurality of small pieces 40, and the surface of the plurality of small pieces 40 as shown in FIG. 2B. Cover part. Since the second sheet 20 is in a semi-cured state, the second sheet 20 can be deformed so as to cover a part of the surface of the plurality of small pieces 40 by its own weight after being placed on the plurality of small pieces 40 and being left standing. By applying pressure, a part of the surface of the plurality of small pieces 40 can be more reliably covered with the second sheet 20. In addition, the upper surface of the 2nd sheet | seat 20 can be made into a desired shape by changing the shape of the press surface of the member which presses the 2nd sheet | seat 20. FIG. For example, when the second sheet 20 is pressed with a member having a flat pressing surface, the upper surface of the second sheet 20 can be made substantially flat as shown in FIG. 2B. The pressing force can be appropriately adjusted depending on how much the second sheet is finally formed.

  Here, a part of the surface refers to a surface other than the substrate-side surface (the lower surface in FIGS. 2A and 2B) of the plurality of small pieces 40. Therefore, when the shape of the plurality of small pieces 40 is hemispherical as in the first embodiment, the curved surface of the small pieces is covered with the second sheet 20 as a part of the surface. Moreover, when a some small piece is a square pole, the upper surface and side surface are coat | covered with a 2nd sheet | seat as a part of surface.

  At this time, by pressing the second sheet 20 while heating, the second sheet 20 is more easily deformed, and the plurality of small pieces 40 are easily covered with no gap. Furthermore, since it becomes easy to adhere | attach the some small piece 40 and the 2nd sheet | seat 20 by heating, it is preferable. A mold etc. are mentioned suitably as what can apply a pressure, heating in this way. For example, in Embodiment 1, the 2nd sheet | seat 20 mounted on the some small piece 40 can be pressed at 1 kPa-5 kPa, heating at about 40 to 60 degreeC.

  Thus, by using the semi-cured second sheet 20, the surface of the small piece 40 can be easily coated with the resin. In addition, when a plurality of small pieces are coated with a resin by injection molding or the like, if the resin is not sufficiently filled in the mold, the thickness of the sheet molded body is different between the center and the end of the sheet or becomes thin overall. The surface of the small piece may not be covered. However, by using the semi-cured second sheet 20, the plurality of small pieces 40 can be more reliably covered. In addition, if the semi-cured second sheet 20 containing the phosphor substantially uniformly in the resin is used, compared to the case where a liquid resin containing the phosphor is used for injection molding or the like, the resin in which the small piece 40 is coated is used. The phosphor can be contained substantially uniformly, and if the sheet molded body is placed on the light emitting element, a light emitting device with little color unevenness can be formed.

(Second sheet curing step)
Next, in the second sheet curing step, the sheet molded body 100 can be formed by curing the second sheet 20 that covers a part of the surface of the plurality of small pieces 40. For example, it can be heated at 150 ° C. for 4 hours by a method that can maintain a constant temperature such as an oven. The curing is preferably performed in a state where the small piece 40 and the second sheet 20 are horizontal. As a result, a sheet molded body having a substantially uniform thickness can be formed. In the first embodiment, as shown in FIG. 3, the semi-spherical piece 40 containing the phosphor substantially uniformly has a surface excluding its plane (the lower surface in FIG. 3), and does not contain the phosphor. The sheet molded body 100 covered with the resin (second sheet 20) can be formed.

(Individualization process)
In addition, after the 2nd sheet hardening process, you may have the singulation process which divides the sheet molded object 100 which has the some small piece 40 shown by FIG. 3 into a desired magnitude | size and a shape. FIG. 4 is a schematic cross-sectional view showing a singulation process in the method for manufacturing a sheet molded body according to the first embodiment. In the singulation process, the cured second sheet 20 between the plurality of small pieces 40 of the sheet molded body 100 is cut so that at least one small piece 40 is included. Thereby, the sheet forming body 100a having a desired size and shape can be obtained. In the first embodiment, as illustrated in FIG. 4, a sheet molded body 100 a including one small piece 40 can be formed.

  Thus, in Embodiment 1, since the 2nd sheet | seat 20 between the some small pieces 40 is cut | disconnected, the sheet molded object 100a which does not expose resin (small piece 40) containing a fluorescent substance on a side surface can be formed. Further, since the small piece is not exposed on the cut surface, even if the small piece 40 contains a phosphor that is weak against moisture, the phosphor is not deteriorated by moisture at the time of dicing. Therefore, it is possible to form the sheet molded body 100a using a desired phosphor without deterioration of the material. The substrate is preferably removed before the individualization step.

  As described above, according to the manufacturing method according to Embodiment 1, it is possible to easily form a sheet molded body having a phosphor-containing region (small piece) having a desired shape in which the phosphor is contained substantially uniformly. . More specifically, by using the first sheet 10 in which the phosphor is contained substantially uniformly, compared with the case where a liquid resin containing the phosphor is used, such as an injection molding, printing method, or dropping method, the fluorescence is reduced. Sedimentation of the body can be suppressed, and a plurality of small pieces 40 in which the phosphor is contained substantially uniformly can be formed. Furthermore, by using the semi-cured first sheet 10, it is possible to perform die cutting with the mold 30, and it is possible to easily form a small piece 40 having a desired shape. Further, by cutting the first sheet 10 with the mold 30, it is possible to separate the plurality of small pieces 40 from each other without performing the process of removing the connecting portion, etc. The sheet molded body 100 can be singulated without cutting the small pieces. Therefore, the sheet molded bodies 100 and 100a can be easily formed using the first sheet 10 containing a desired phosphor. Further, by using the semi-cured second sheet 20, it is possible to cover a part of the surface of the plurality of small pieces 40 with a resin without using a mold or the like at a reduced cost.

<Embodiment 2>
(Manufacturing method of sheet compact)
The method for manufacturing the sheet molded body 200 according to the second embodiment is different from the first embodiment in the form of the first sheet and the second sheet to be used. In addition to the steps of the manufacturing method shown in the first embodiment, the second sheet is used. It has a part removal process. Since other manufacturing methods can be substantially the same as those of the first embodiment, detailed description thereof is omitted.

FIG. 5A is a schematic cross-sectional view illustrating a small piece forming step in the method for manufacturing a sheet molded body according to the second embodiment. FIG. 5B is a schematic cross-sectional view illustrating a second sheet partial removal step in the method for manufacturing a sheet molded body according to the second embodiment. FIG. 5C is a schematic cross-sectional view of a sheet molded body manufactured by the manufacturing method according to Embodiment 2.
In Embodiment 2, as shown in FIG. 5A, a semi-cured first sheet 10a laminated in two layers is prepared. The first sheet 10a is translucent, and if at least one of the laminated sheets contains the phosphor in the resin substantially uniformly, the first sheet 10a is a layer that does not contain the phosphor. It may be laminated, or three or more sheets may be laminated. In the second embodiment, a first sheet 10a is prepared in which a clear sheet Y made of a resin not including a phosphor is laminated on a phosphor sheet X in which the phosphor is contained substantially uniformly in the resin.

  And like Embodiment 1, the 1st sheet | seat 10a is die-cut with the prepared metal mold | die 30, the several small piece 40a is formed, and it hardens | cures. In the second embodiment, a resin (clear sheet) which is a hemisphere, has a resin (phosphor sheet X) containing phosphors substantially uniformly on the lower surface side (plane side), and does not include the phosphor on the upper surface side. A plurality of small pieces 40a having Y) are formed. In addition, by appropriately adjusting the hardness of the phosphor sheet X and the clear sheet Y in a semi-cured state, it is possible to prevent the boundary between the phosphor sheet X and the clear sheet Y from being distorted or deformed by die cutting. As shown in FIG. 5B, it is possible to form the small piece 40a while keeping the boundary between the sheets substantially flat. Moreover, although the through-hole or the recessed part 31 and the some small piece 40a of the metal mold | die 30 which are shown by FIG. 5A and FIG. 5B are hemispheres, it is not limited to this, It can select suitably.

Next, in Embodiment 2, a semi-cured reflective sheet is used as the second sheet 20a in the small piece covering step. And the reflective sheet which is the 2nd sheet | seat 20a is mounted on the some small piece 40a, is pressed and deform | transformed, and a part of surface of the some small piece 40a is covered and hardened. Here, in Embodiment 2, in the second sheet partial removal step, a part of the cured second sheet 20a that covers the plurality of small pieces 40a is removed by grinding or the like. In the second embodiment, as shown by a broken line in FIG. 5B, a part of the resin (clear sheet Y) that does not include the phosphor of the second sheet 20a and the plurality of small pieces 40a is removed. As a result, as shown in FIG. 5C, it is possible to form the sheet molded body 200 in which the small pieces 40a are exposed from the upper and lower surfaces of the light-reflective resin (second sheet 20a). More specifically, in the second embodiment, the upper part of the semispherical sphere is removed (that is, a substantially truncated cone having a curved side surface), and the upper surface side is made of a resin that does not contain a phosphor (clear sheet Y). A sheet molded body 200 having a small piece 40a made of a resin (phosphor sheet X) containing phosphors substantially uniformly on the lower surface side and coated with a light-reflective resin (second sheet 20a) on its side surface. Can be formed.
In addition, the 2nd sheet | seat which has a through-hole in the position corresponding to several small piece 40a is prepared, and the 2nd sheet partial removal process is abbreviate | omitted by providing a 2nd sheet | seat so that the small piece 40a may be located in a through-hole. Is possible. Moreover, the second sheet having a lower hardness and thinner than the thickness (height) of the plurality of small pieces 40a is prepared and placed on the plurality of small pieces 40a, so that the second sheet is broken by the plurality of small pieces 40a. It is also possible to expose a part of the upper surface of the small piece 40a and to omit the second sheet part removing step.

  Thereafter, similarly to the first embodiment, the sheet molded body 200 may be cut into a desired size and shape by cutting between the plurality of small pieces 40a. When performing the singulation step, it is preferable to remove the substrate before singulation.

As described above, by using the first sheet 10a in which the clear sheet Y is laminated on the phosphor sheet X, the resin not containing the phosphor is laminated on the resin containing the phosphor substantially uniformly. A sheet molded body 200 can be formed. Therefore, the phosphor sheet X can be prevented from being ground in the above-described removal, and the phosphor can be protected from moisture and heat from the outside.
Further, a reflective sheet is used as the second sheet 20a, and a part of the surface of the second sheet 20a is removed so that the small pieces are exposed, whereby the small pieces 40a are light-reflective resin (second sheet 20a) in plan view. Can be formed. By placing such a sheet molded body 200 on a light emitting element, a light emitting device with good parting ability can be formed.

  Furthermore, in the manufacturing method of the second embodiment, in the second sheet partial removal step, only a part of the resin (clear sheet Y) that does not include the phosphor of the part of the second sheet 20a and the plurality of small pieces 40a is removed. . Moreover, the 2nd sheet | seat 20a between the some small pieces 40a is cut | disconnected in an individualization process. Accordingly, since the resin containing the phosphor (phosphor sheet X) is not exposed on the ground surface and the cut surface, even if the phosphor sheet X contains a phosphor that is weak against moisture, the phosphor is caused by moisture during dicing. Will not deteriorate. Therefore, the sheet molded body 200 can be formed using a desired phosphor without deterioration of the material.

  In the second embodiment, a first sheet made of a single-layer sheet containing phosphors substantially uniformly or a first sheet in which two or more sheets containing different phosphors are laminated is prepared, and die cutting is performed. Thus, a plurality of small pieces may be formed, and can be appropriately selected depending on the desired light of the light emitting device in which the sheet molded body is used.

<Embodiment 3>
(Method for manufacturing light emitting device)
In Embodiment 3, a light emitting device is manufactured using the sheet molded body formed in Embodiments 1 and 2. In the manufacturing method of the light emitting device of Embodiment 3, the first main surface 51 having a pair of electrodes and the second main surface 52 on the opposite side are formed on the sheet molded body 100 before separation shown in FIG. A light emitting element placement step of placing the light emitting element 50 having the second principal surface 52 so as to be disposed on the small piece 40 of the sheet molded body 100, and a part and side surfaces of the first principal surface 51 of the light emitting element 50. And a light reflecting member forming step of forming the light reflecting member 60 so as to cover the upper surface of the sheet molded body. In addition, after the light reflective member 60 is formed, an individualizing step of cutting the light reflective member 60 between the plurality of light emitting elements 50 and the second sheet 20 between the plurality of small pieces 40 of the sheet molded body 100 is included. May be.
Hereinafter, each process of the manufacturing method of the light-emitting device which concerns on Embodiment 3 is demonstrated in detail.

(Light emitting element mounting process)
FIG. 6 is a schematic cross-sectional view illustrating a light-emitting element mounting step in the method for manufacturing a light-emitting device according to Embodiment 3. In the light emitting element placing step, as shown in the right end of FIG. 6, the light emitting element is placed on the sheet molded body, and the light emitting elements are fixed to the sheet molded body as shown in the left three.
In the light emitting element mounting step, first, the light emitting element 50 is prepared. One or a plurality of light emitting elements 50 may be prepared. In the third embodiment, a plurality of light emitting elements 50 are prepared. The light emitting element 50 to be prepared includes a first main surface 51, a second main surface 52 opposite to the first main surface 51, and a side surface connecting the first main surface 51 and the second main surface 52. 51 has a pair of electrodes.

Moreover, the sheet molded object 100 for mounting the light emitting element 50 is prepared. In the third embodiment, the sheet molded body 100 having a plurality of small pieces 40 shown in FIG. 3 is used and arranged so that the surface from which the small pieces 40 are exposed faces upward. Here, the shape of the small piece 40 of the sheet molded body 100 to be prepared is preferably selected as appropriate depending on the planar shape of the light emitting element 50 (the shape of the surface in contact with the sheet molded body). For example, the planar shape of the light emitting element 50 is a shape in which the distance from the center to the outer edge is substantially equal (for example, a circle), or a shape having a relatively small difference in distance from the center to the outer edge (for example, a regular polygon such as a square or a regular hexagon). Etc.), it is preferable that the shape of the small piece 40 is a hemisphere. In addition, for example, when the planar shape of the light emitting element is a rectangle or an ellipse, the shape of the small piece is preferably a semi-elliptical sphere. By selecting the shape of the small piece 40 in this manner, the light emitted from the light emitting element 50 is easily wavelength-converted substantially uniformly.
As shown in FIG. 6, it is preferable to place an adhesive Z for fixing the light emitting element 50 on the sheet molded body 100. For the adhesive Z, for example, a translucent resin can be used, and can be appropriately arranged by a desired method such as a dropping method, a drawing method, or a printing method.

Next, the prepared light emitting element 50 is placed on the sheet molded body 100 on which the adhesive material Z is disposed. Here, the light emitting element 50 is placed on the sheet molded body 100 such that the second main surface 52 is disposed on the small piece 40. In Embodiment 3, as shown in FIG. 6, the plurality of light emitting elements 50 are placed on the sheet molded body 100 so as to be disposed on the plurality of small pieces 40, respectively. Note that one light emitting element may be placed so as to straddle a plurality of small pieces, or a plurality of light emitting elements may be placed on one small piece, which are appropriately selected according to light required for the light emitting device. Can do.
Thereafter, the light emitting element 50 can be fixed on the sheet molded body 100 by curing the adhesive Z.

(Light reflecting member forming step)
FIG. 7 is a schematic cross-sectional view illustrating a light reflective member forming step in the method for manufacturing the light emitting device according to the third embodiment. In the third embodiment, after the light emitting element mounting step, a part and side surfaces of the first main surface 51 of the light emitting element 50 and the upper surface of the sheet molded body 100 (the surface on the light emitting element 50 side) are covered. The light reflective member 60 is formed by injection molding, compression molding, transfer molding, printing, or the like. In the third embodiment, as shown in FIG. 7, the surface of the first main surface 51 of the light emitting element 50 excluding a part of the pair of electrodes, the adhesive Z that covers the side surfaces of the light emitting element 50, and the sheet molded body 100. The light reflective member 60 is formed so as to cover the upper surface of the substrate, and is cured. When the light reflecting member 60 is provided so as to cover the pair of electrodes of the light emitting element 50, a part of the light reflecting member 60 is ground by grinding or the like so that a part of the pair of electrodes is exposed. Remove.

(Individualization process)
FIG. 8 is a schematic cross-sectional view showing the singulation process in the method for manufacturing a light emitting device according to Embodiment 3. In the third embodiment, after forming the light reflecting member, the light reflecting member 60 between the plurality of light emitting elements 50 and the plurality of small pieces (second sheet 20) of the sheet molded body 100 are cut by dicing, scribing, or the like. . By cutting in this way, the light emitting device 1000A can be formed.
In the third embodiment, as illustrated in FIG. 8, the light reflective member 60 and the sheet molded body 100 are cut so that the light emitting device 1000 includes one light emitting element 50 and one small piece 40. However, the present invention is not limited thereto, and the light reflective member and the sheet molded body may be cut so that the light emitting device has a plurality of light emitting elements, or the light reflective member and the sheet so that the light emitting device has a plurality of small pieces. You may cut | disconnect a molded object.

(Configuration of light emitting devices 1000A and 1000B)
FIG. 9A is a schematic cross-sectional view of a light emitting device 1000A manufactured by the manufacturing method according to the third embodiment using the sheet molded body 100 formed in the first embodiment. FIG. 9B is a schematic cross-sectional view of another light-emitting device 1000B manufactured by the manufacturing method according to Embodiment 3 using the sheet molded body 100 formed in Embodiment 1. The light-emitting device 1000 </ b> A includes a first main surface 51 having a pair of electrodes, a second main surface 52 on the opposite side, and a side surface connecting the first main surface 5 and the second main surface 52. A light reflecting member 60 that covers a part and side surfaces of the first main surface 51 of the light emitting element 50, and a sheet molded body 100 provided on the second main surface 52 and the light reflecting member 60 of the light emitting element 50. Have.

The light reflective member 60 of the light emitting device 1000 </ b> A includes the light emitting element 50 and the sheet molded body 100 so that a part of the pair of electrodes on the first main surface 51 of the light emitting element 50 and the upper surface and side surfaces of the sheet molded body 100 are exposed. Is covered.
In the sheet molded body 100, a semispherical small piece 40 made of a resin in which a phosphor is contained substantially uniformly is covered with a translucent resin (second sheet 20) that does not contain a phosphor. Is exposed from a translucent resin (second sheet 20) that does not contain a phosphor. The sheet molded body 100 of the light emitting device 1000 </ b> A has the surface side where the small piece 40 is exposed from the translucent resin (second sheet 20) facing the light emitting element 50 and the light reflecting member 60, and the light emitting element 50. The small piece 40 is disposed on the second main surface 52.

  Note that the light emitting device 1000 </ b> A includes a translucent adhesive Z that bonds the sheet molded body 100 and the light emitting element 50. For example, as illustrated in FIG. 9A, the adhesive Z includes the side surface of the light emitting element 50, a part of the surface of the sheet molded body 100 on the light emitting element 50 side (the lower surface in FIG. 9A), and the light emitting element 50 and the sheet molded body. 100. As shown in FIG. 6, the adhesive Z that covers the side surface of the light emitting element 50 is placed on the light emitting element 50 from the sheet molded body 100 side when the light emitting element 50 is placed on the sheet molded body 100. It is provided by climbing up to the first main surface 51 side. Therefore, the adhesive Z that covers the side surface of the light emitting element 50 can be provided in a tapered shape from the second main surface 52 side of the light emitting element 50 to the first main surface 51 side. As a result, as shown in FIG. 9A, the inner surface of the light reflective member 60 covering the adhesive Z is inclined outward from the first main surface 51 side to the second main surface 52 side of the light emitting element 50. The light emitted from the side surface of the light emitting element 50 can be efficiently reflected toward the sheet molded body 100.

  In the light emitting device 1000A shown in FIG. 9A of the third embodiment, the sheet molded body 100 is larger than the light emitting element 50 and the small piece 40 of the sheet molded body 100 is larger than the light emitting element 50 in plan view. More specifically, the small piece 40 and the side surfaces of the light emitting element 50 and the light emitting element 50 are covered on the surface where the sheet molded body 100 and the light emitting element 50 and the adhesive Z covering the side surface of the light emitting element 50 face each other. The adhesive material Z has substantially the same size. Moreover, in Embodiment 3, the planar shape of the light emitting element 50 is a square, and the small piece 40 is a semicircle. Furthermore, in Embodiment 3, the side surface of the sheet molded body 100 and the side surface of the light reflective member 60 are provided on substantially the same surface.

In the light emitting device 1000A as described above, the light of the light emitting element 50 passes through the small piece 40 of the sheet molded body 100, undergoes wavelength conversion, and is emitted to the outside of the light emitting device 1000A. In Embodiment 3, since the translucent sheet molding 100 is provided on the light emitting element 50 and the light reflecting member 60, a light emitting device with a wide light distribution can be formed.
Further, the small pieces 40 of the sheet molded body 100 contain the phosphor substantially uniformly, and the sheet molded body 100 and the adhesive Z that covers the side surfaces of the light emitting element 50 and the light emitting element 50 face each other. Since the small piece 40 is larger than the light emitting element 50 and the adhesive Z that covers the side surface of the light emitting element 50, the light emitting device 1000A with less color unevenness can be obtained. Furthermore, it is preferable that the planar shape of the light emitting element 50 is a square and the small piece 40 is a hemispherical shape, so that the emitted light from the light emitting element 50 can be wavelength-converted almost uniformly.

  In addition, it is good also as a structure where the small piece 40 of the sheet molded object 100 is smaller than the light emitting element 50 like the light-emitting device 1000B shown by FIG. More specifically, in the light emitting device 1000 </ b> B, the small piece 40 is formed on the surface where the sheet molded body 100 faces the light emitting element 50 and the adhesive Z covering the side surface of the light emitting element 50. It is smaller than the adhesive material Z which covers the side surface of this. Therefore, in the light emitting device 1000B, part of the light emitted from the light emitting element 50 passes through the translucent resin (second sheet 20) that does not contain the phosphor and is emitted to the outside of the light emitting device 1000B. As described above, part of the light emitted from the light emitting element 50 is emitted without passing through the small piece 40, so that loss due to light absorption of the phosphor is reduced and light extraction of the light emitting device 1000B can be improved. .

  In addition, the shape of the small piece 40 of the sheet molded body 100 of the light emitting devices 1000A and 1000B is not limited to a hemispherical shape, and a light emitting device that emits desired light is appropriately selected according to the planar shape of the light emitting element 50 or the like. Can do. Further, the small piece 40 of the sheet molded body 100 may be approximately the same size as the light emitting element 50 in plan view. Further, the side surfaces of the sheet molded body 100 and the light reflective member 60 of the light emitting device 1000B may not be provided on substantially the same surface.

(Configuration of Light Emitting Device 2000)
Moreover, the light-emitting device 2000 can be formed using the sheet molded body 200 shown in FIG. 5C formed in the second embodiment. FIG. 9C is a schematic cross-sectional view of a light-emitting device 2000 manufactured by the manufacturing method according to Embodiment 3 using the sheet molded body 200 formed in Embodiment 2.
The small piece 40a of the sheet molded body 200 of the light emitting device 2000 is a substantially truncated cone having a curved side surface (indicated by a taper shape in the sectional view of FIG. 9C), and does not contain a phosphor on the upper surface side (clear sheet Y). ) And a resin (phosphor sheet X) in which the phosphor is contained substantially uniformly on the lower surface side, and the side surfaces thereof are covered with a light-reflective resin (second sheet 20a). Therefore, the inner surface of the light-reflective resin (second sheet 20a) covering the small piece 40a is inclined inward from the lower surface side to the upper surface side. The sheet molded body 200 is formed so that the resin (phosphor sheet X) side in which the phosphors of the small pieces 40a are contained substantially uniformly is opposed to the light emitting element 50 and the light reflecting member 60. A resin (phosphor sheet X) containing the phosphor substantially uniformly is disposed on the second main surface 52. Other configurations can be the same as those of the light-emitting device 1000B illustrated in FIG. 9B, and thus detailed description thereof is omitted.

  By using such a sheet molded body 200, a light-emitting device 2000 with good parting ability can be obtained. Further, since the inner surface of the light-reflective resin (second sheet 20a) covering the small piece 40a is inclined inward from the light emitting element 50 side to the light emitting side of the light emitting device 2000, the light of the light emitting element 50 is emitted. Is reflected on the inner surface of the light-reflective resin (second sheet 20a) and easily propagates through the phosphor sheet X of the small piece 40a. Thereby, a desired color can be obtained with a smaller amount of phosphor. In addition, the region surrounded by the inner surface of the light-reflective resin (second sheet 20a) is narrower on the upper surface side (light emitting surface side of the light emitting device) than on the lower surface side (light emitting element 50 side). Thus, the light of the light emitting element 50 can be narrowed down.

Further, on the surface where the sheet molded body 200 and the adhesive Z that covers the light emitting element 50 and the side surface of the light emitting element 50 face each other, the small piece 40 a covers the light emitting element 50 and the adhesive material Z that covers the side surface of the light emitting element 50. With the above size, it is possible to suppress the light of the light emitting element 50 from being reflected by the lower surface of the light reflective resin (second sheet 20a) of the sheet molded body 200, and to extract the light of the light emitting device 2000. Can be improved. In the light emitting device 2000, the small piece 40 a covers the side surface of the light emitting element 50 and the light emitting element 50 on the surface where the sheet molded body 200 and the adhesive Z covering the light emitting element 50 and the side surface of the light emitting element 50 face each other. It is good also as a structure smaller than the adhesive material Z to coat | cover.
In addition, although the shape of the small piece 40a of the sheet molded body 200 of the light emitting device 2000 is substantially a truncated cone, the shape is not limited to this, and can be appropriately selected depending on light required for the light emitting device. In addition, the side surfaces of the sheet molded body 200 and the light reflective member 60 of the light emitting device 2000 are provided on substantially the same surface, but may not be provided on substantially the same surface.

(Configuration of Light Emitting Device 3000)
FIG. 9D is a schematic cross-sectional view of the light-emitting device 3000 manufactured by the manufacturing method according to Embodiment 3. FIG. 9E is a schematic cross-sectional view of a sheet molded body 300 used in the light emitting device 3000 shown in FIG. 9D. The light emitting device 3000 illustrated in FIG. 9D is different from the sheet molded body 200 of the light emitting device 2000 illustrated in FIG. 9C in the configuration of the sheet molded body 300. Since other configurations can be the same as those of the light emitting device 2000, detailed description thereof is omitted.

  More specifically, the small piece 40b of the sheet molded body 300 of the light emitting device 3000 is a substantially inverted truncated cone having a curved side surface (indicated by a reverse taper shape in the cross-sectional view of FIG. 9D, that is, a shape widening upward). The upper surface has a resin (clear sheet Y) that does not contain a phosphor, and the lower surface has a resin (phosphor sheet X) that contains the phosphor substantially uniformly, and these side surfaces are light-reflective. It is covered with a resin (second sheet 20b). Therefore, the inner surface of the light-reflective resin (second sheet 20b) covering the small piece 40b is inclined outward from the lower surface side to the upper surface side. The sheet molded body 300 is formed so that the resin (phosphor sheet X) side in which the phosphors of the small pieces 40b are contained substantially uniformly is opposed to the light emitting element 50 and the light reflecting member 60. A resin (phosphor sheet X) containing the phosphor substantially uniformly is disposed on the second main surface 52. Thus, the inner surface of the light-reflective resin (second sheet 20b) covering the small piece 40b is inclined outward from the light emitting element 50 side to the light emitting side of the light emitting device 3000, so that the light emitting element 50 Is reflected on the inner side surface of the light-reflective resin (second sheet 20b) and efficiently emitted to the outside of the light emitting device 3000.

  Such a sheet formed body 300 can be formed by reversing the stacking order of the sheets constituting the first sheet to be prepared as in the second embodiment. That is, a first sheet in which the phosphor sheet Y is laminated on the clear sheet Y is prepared, and is punched and cured with a mold 30 having a semicircular through hole or recess 31 to form a plurality of small pieces 40b. . And the some small piece 40b is coat | covered with the 2nd sheet | seat 20b, it hardens | cures, and the sheet | seat molded object 300 shown by FIG. 9E is shown by removing a part of 2nd sheet | seat 20b and the fluorescent substance sheet X of the some small piece 40b. Can be formed. And the light emitting element 50 is mounted so that the 2nd main surface 52 may be arrange | positioned in the surface by which the fluorescent substance sheet X of the sheet molded object 300 is exposed, A part of 1st main surface 51 of the light emitting element 50 is arrange | positioned. The light reflecting member 60c is formed so as to cover the side surface and the surface of the sheet molded body 300 on the light emitting element 50 side, and the light emitting device 3000 illustrated in FIG. 9D is formed. Can do.

<Embodiment 4>
(Method for manufacturing light-emitting device 4000)
In the fourth embodiment, the light emitting device 4000 is manufactured using the individual sheet molded body 100a shown in FIG. 4 in the first embodiment. In the method for manufacturing a light emitting device of Embodiment 4, a light emitting element 50 having a first main surface 51 having a pair of electrodes and a second main surface 52 opposite to the first main surface 51 is prepared, and the first main surface 51 side is on the substrate. The light emitting element 50 is placed on the base so as to be arranged. Then, a sheet molded body placing step of placing the sheet molded body 100 a on the light emitting element 50 is performed so that the small piece 40 is provided on the light emitting element 50, and then the first main surface 51 of the light emitting element 50. A light reflecting member forming step of forming the light reflecting member 60c so as to cover the portion and the side surface and the lower surface and the side surface of the sheet molded body 100a is performed. Moreover, after forming the light reflective member 60c, you may perform the isolation | separation process which cut | disconnects the light reflective member 60c between the several light emitting elements 50. FIG.
Hereinafter, each process of the manufacturing method of the light-emitting device 4000 which concerns on Embodiment 4 is demonstrated in detail.

(Sheet molded body placement process)
FIG. 10 is a schematic cross-sectional view illustrating a sheet molded body placing step in the method for manufacturing a light emitting device according to the fourth embodiment. In the sheet molded body placing step, as shown in the right end of FIG. 10, the sheet molded body is placed on the light emitting element placed on the base to emit light as shown in the left three. A sheet compact is fixed on the element.
In the sheet molded body placing step, first, a light emitting element 50 for placing the sheet molded body 100a is prepared. One or a plurality of light emitting elements 50 may be prepared. In the fourth embodiment, a plurality of light emitting elements 50 are prepared. The light emitting element 50 has a first main surface 51, a second main surface 52 opposite to the first main surface 51, and a side surface connecting the first main surface 51 and the second main surface 52. It has a pair of electrodes. In the fourth embodiment, the plurality of light emitting elements 50 are placed on the base so that the first main surface 51 side is disposed on the top surface of the base, that is, the second main surface 52 of the light emitting element 50 faces upward. Keep it. Further, the planar shape of the light emitting element 50 can be appropriately selected from a polygon such as a rectangle and a hexagon, a circle and an ellipse.
Note that an adhesive Z for fixing the sheet molded body 100a is preferably disposed on the second main surface 52 of the light emitting element 50. For the adhesive Z, for example, a translucent resin can be used, and can be appropriately arranged by a desired method such as a dropping method, a drawing method, or a printing method.

  Next, the sheet molded body 100a is placed on the light emitting element 50 on which the adhesive material Z is disposed. Here, in the sheet molded body 100 a, the surface on the side where the small piece 40 is exposed faces the second main surface 52 of the light emitting element 50, and the small piece 40 is on the second main surface 52 of the light emitting element 50. It is mounted on the light emitting element 50 so as to be arranged. In the fourth embodiment, as illustrated in FIG. 10, the sheet molded body 100 a is placed on each of the plurality of light emitting elements 50. Note that one sheet molded body may be placed so as to straddle a plurality of light emitting elements, or a plurality of sheet molded bodies may be arranged on one light emitting element, and are selected as appropriate according to the light required for the light emitting device. be able to. Here, the shape of the small piece 40 of the sheet molded body 100a to be prepared is appropriately selected according to the planar shape of the light emitting element 50 (the shape of the surface in contact with the sheet molded body) as described above. A light-emitting device capable of wavelength-converting emitted light substantially uniformly can be manufactured.

Thereafter, the sheet material 100a can be fixed on the light emitting element 50 by curing the adhesive Z. The adhesive material Z may be provided on the side surface of the light emitting element 50, the lower surface (surface on the light emitting element 50 side) and the side surface of the sheet molded body 100a, but the adhesive material Z provided on the side surface of the sheet molded body 100a is removed. It is preferable to do. Thereby, the light of a light emitting element can be permeate | transmitted and can be radiate | emitted outside.
In the fourth embodiment, as shown in FIG. 10, a sheet molded body 100 a larger than the light emitting element 50 is placed. Accordingly, the tapered adhesive Z is easily provided on the side surface of the light emitting element 50 from the second main surface 52 side to the first main surface 51 side, and the inner surface of the light reflecting member that covers the adhesive material Z This is preferable because a light-emitting device that can be easily taken out can be formed. In addition, it is preferable to use a sheet molded body having a size smaller than that of the light emitting element in plan view because the sheet molded body is easily placed on the light emitting element.

(Light reflecting member forming step)
FIG. 11 is a schematic cross-sectional view showing a light reflective member forming step in the method for manufacturing a light emitting device according to Embodiment 4. In the fourth embodiment, after the sheet molded body placing step, a part and a side surface of the first main surface 51 of the light emitting element 50 (in the fourth embodiment, the adhesive Z that covers the side surface of the light emitting element 50), and sheet molding The light reflective member 60c is formed and cured by injection molding, compression molding, transfer molding, printing, or the like so as to cover the lower surface (the surface on the light emitting element 50 side) and the side surface of the body 100a. The part of the first main surface 51 of the light emitting element 50 is a surface excluding a part of the pair of electrodes of the first main surface 51. Therefore, in Embodiment 4, the light-emitting element 50 (and the adhesive Z) and the sheet molded body 100a are formed by the light reflective member 60c so that a part of the pair of electrodes of the light-emitting element 50 and the upper surface of the sheet molded body are exposed. And coat. When the light reflective member 60c is provided so as to cover the upper surface of the sheet molded body 100a, a part of the light reflective member 60c is removed by grinding or the like so that the upper surface of the sheet molded body 100a is exposed. In the fourth embodiment, as shown in FIG. 11, after the light reflective member 60c is formed and cured, the substrate is removed.

(Individualization process)
FIG. 12 is a schematic cross-sectional view showing a singulation process in the method for manufacturing a light emitting device according to Embodiment 4. In the singulation step, after the light reflecting member is formed, the light reflecting member 60c between the plurality of light emitting elements 50 is cut into pieces by dicing, scribing, or the like, thereby forming the light emitting device 4000. In the fourth embodiment, as illustrated in FIG. 12, the light reflective member 60c is cut so that the light emitting device 4000 includes one light emitting element 50 and one sheet molded body 100a. However, the present invention is not limited thereto, and the light reflective member may be cut so that the light emitting device has a plurality of light emitting elements, or the light reflective member may be cut so that the light emitting device has a plurality of sheet molded bodies. Also good.
In the singulation process of the fourth embodiment, the light reflecting member 60c is cut, and therefore, it is preferable to divide the light reflecting member and the sheet molded body as in the second and third embodiments. .

(Configuration of light emitting device 4000)
FIG. 13 is a schematic cross-sectional view of a light emitting device 4000 manufactured by the manufacturing method according to the fourth embodiment. The light emitting device 4000 includes a light emitting element 50 having a first main surface 51 having a pair of electrodes, a second main surface opposite to the first main surface 51, and a side surface connecting the first main surface 51 and the second main surface 52. The sheet molded body 100a provided on the second main surface 52 of the light emitting element 50, a part and side surfaces of the first main surface 51 of the light emitting element 50, the lower surface of the sheet molded body (surface on the light emitting element 50 side), and And a light reflecting member 60c covering the side surface. The light reflective member 60c covers the light emitting element 50 and the sheet molded body 100a so as to expose a part of the pair of electrodes on the first main surface 51 of the light emitting element 50 and the upper surface of the sheet molded body 100a.

In the sheet molded body 100a according to the fourth embodiment, a semi-spherical piece 40 made of a resin in which a phosphor is contained substantially uniformly is coated with a translucent resin (second sheet 20) that does not contain the phosphor. The plane of the small piece 40 is exposed from the resin (second sheet 20) that does not contain the phosphor. In addition, the surface side where the small piece 40 is exposed in the sheet molded body 100 a is provided so as to face the second main surface 52 of the light emitting element 50.
In the light emitting device 4000 of the fourth embodiment, the sheet molded body 100a is larger than the light emitting element 50 and the small piece 40 of the sheet molded body 100a is larger than the light emitting element 50 in plan view. In Embodiment 4, the planar shape of the light emitting element 50 is a square, and the small piece 40 is a hemispherical sphere.

  In the light emitting device 4000, as shown in FIG. 13, the side surface of the light emitting element 50, the surface of the sheet molded body 100a on the light emitting element 50 side (the lower surface in FIG. 13), and between the sheet molded body 100a and the light emitting element 50. Is provided with an adhesive Z. The adhesive Z that covers the side surface of the light emitting element 50 is placed from the sheet molded body 100a side to the first main surface 51 side of the light emitting element 50 when the sheet molded body 100a is placed on the light emitting element 50. Provided by scooping up. Therefore, as shown in FIG. 13, the adhesive Z that covers the side surface of the light emitting element 50 is provided in a tapered shape from the second main surface 52 side of the light emitting element 50 to the first main surface 51 side. Thereby, the inner surface of the light-reflecting member 60c that covers the adhesive Z on the side surface of the light emitting element 50 is an inclined surface that is inclined outward from the first main surface 51 side to the second main surface 52 side of the light emitting element 50. Therefore, the light emitted from the side surface of the light emitting element 50 can be efficiently reflected in the direction of the sheet molded body 100a.

  In the light emitting device 4000 as described above, the light from the light emitting element 50 is emitted through the sheet molded body 100a to the outside of the light emitting device 4000. In Embodiment 4, since the side surface of the translucent sheet molded body 100a is covered with the light reflecting member 60c, a light emitting device with good parting ability can be obtained.

In the light emitting device 4000 of the fourth embodiment, the light emitting element 50 has a square planar shape, and the small pieces 40 of the sheet molded body 100a are hemispherical, so that the emitted light from the light emitting element 50 has a substantially uniform wavelength. It is preferable because it is easily converted.
Further, in the light emitting device 4000 of the fourth embodiment, the sheet molded body 100a is formed on the surface where the sheet molded body 100a and the adhesive Z that covers the side surfaces of the light emitting element 50 and the light emitting element 50 face each other. Since the size of the light-emitting element 50 is larger than the adhesive Z that covers the side surface of the light-emitting element 50, a part of the light of the light-emitting element 50 is a translucent resin (second sheet 20) that does not include the phosphor that covers the small piece 40. ) And is emitted to the outside of the light emitting device 4000. As described above, part of the light is emitted without passing through the small piece 40, so that loss due to light absorption of the phosphor can be suppressed and light extraction of the light emitting device 4000 can be improved.

  Further, in the fourth embodiment, since the light reflective member (light reflective member 60c) in the light emitting device 4000 is integrally formed, as in the light emitting devices 2000 and 3000 of the third embodiment, the light reflective member. A translucent member such as the adhesive Z is not provided between the members (the second sheet of the sheet molded body and the light reflecting member). Therefore, it can be set as the structure which the light of a light emitting element cannot leak easily from area | regions other than a sheet forming object.

  In the light emitting device 4000, the shape of the small piece 50 is not limited to a hemispherical shape, and the light emitting device 4000 that emits desired light can be obtained by appropriately changing the shape of the small piece 50 depending on the planar shape of the light emitting element 50 or the like. Further, the sheet molded body 100a may be smaller than the light emitting element 50 in a plan view. Furthermore, in Embodiment 4, the small piece 40 of the sheet molded body 100a is larger than the light emitting element 50 in plan view and smaller than the light emitting element 50 and the adhesive Z that covers the side surfaces of the light emitting element 50, but from the light emitting element 50. It may be smaller or larger than the light emitting element 50 and the adhesive Z that covers the side surfaces of the light emitting element 50.

  Hereinafter, the member which comprises the sheet molded object and light-emitting device of Embodiments 1-4 is explained in full detail.

(First sheet)
The first sheet is a semi-cured sheet in which the phosphor is contained substantially uniformly in the resin. As the resin of the first sheet, a thermosetting resin can be used. For example, a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, a urea resin, a phenol resin, or a hybrid containing two or more of these resins Examples thereof include resins. In particular, it is preferable to use a silicone resin from the viewpoint of maintaining a semi-cured state.
Examples of the phosphor include yellow phosphors such as YAG (Y ₃ Al ₅ O ₁₂ : Ce) and silicate, or red phosphors such as CASN (CaAlSiN ₃ : Eu) and KSF (K ₂ SiF ₆ : Mn). In addition, nanocrystals, light emitting substances called quantum dots, and the like may be used.

  In the manufacturing method of the embodiment, it is possible to form a sheet molded body without cutting the phosphor-containing portion of the small piece by dicing or the like, and the exposure of the phosphor-containing portion is performed only on the surface in contact with the light emitting element. can do. Therefore, even if the first sheet contains a non-sintered phosphor (such as KSF or quantum dots) that is weak against moisture and heat, a sheet molded body can be formed while suppressing deterioration of the phosphor. it can. Note that the resin of the first sheet may contain a diffusing agent, a coloring agent, and the like in addition to the phosphor.

(Second sheet)
The second sheet is a semi-cured sheet made of at least resin. As resin, what was mentioned as resin used as a material of a 1st sheet | seat can be used. Use of the same resin as that used for the first sheet is preferable because the adhesion between the plurality of small pieces and the second sheet is improved.
As the second sheet, a clear sheet made of only a resin as described above, a phosphor sheet in which a phosphor is contained substantially uniformly in a resin, or a reflection sheet in which a light reflective material is contained in a resin is selected. be able to. As the phosphor, those listed as the phosphor contained in the first sheet can be used. Examples of the light reflecting material include TiO ₂ , Al ₂ O ₃ , ZnO ₂ , SiO ₂ , BaSO ₄ , Y ₂ O ₃ , and Nb ₂ O ₅ . Note that the resin of the second sheet may contain a diffusing agent, a coloring agent, or the like.

(Light emitting element)
As the light-emitting element, a light-emitting diode or the like generally used in this field can be used. For example, a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) Various semiconductors such as III-V group compound semiconductors such as GaP and GaAs, ZnSe, and II-VI group compound semiconductors can be used. The light-emitting element includes at least a semiconductor layer including a light-emitting layer and a pair of positive and negative electrodes. As the electrode material, for example, metals such as Au, Ag, Cu, Pt, Al, Rh, W, Ti, Ni, and Pd can be used, and these metals may be used in a single layer or a plurality of layers. Good.

  In addition, the light emitting element may have a substrate for growing a semiconductor layer. Examples of the substrate include an insulating substrate such as sapphire and an oxide substrate such as SiC and Si. In particular, the substrate is preferably translucent. The substrate may be removed using a laser lift-off method or the like.

(Light reflective member)
The light reflective member has a light reflectance of about 60% or more, more preferably about 70 to 90% or more. As a material of the light reflective member, for example, a material in which a light reflective material is contained in a base material can be used. Examples of the base material include resin, ceramic, glass, or a composite material containing two or more of these. In particular, a resin that can be easily molded into a desired shape is preferable. As resin, what was mentioned as resin of a 1st sheet | seat and a 2nd sheet | seat can be used. Use of the same resin as that of the second sheet is preferable because the adhesion between the sheet molded body and the light reflecting member is improved. As the light reflective material, those mentioned for the light reflective material of the second sheet can be used. In addition, the light reflective member may contain a diffusing agent, a coloring agent, or the like.

1000A, 1000B, 2000, 3000, 4000 Light emitting device 100, 100a, 200, 300 Sheet molded body 10, 10a First sheet X Phosphor sheet Y Clear sheet 20, 20a, 20b Second sheet 21 Resin 30 Mold 31 Through-hole Or the recessed part 40, 40a, 40b The some small piece 50 Light emitting element 51 1st main surface 52 2nd main surface 60, 60c Light reflective member Z Adhesive material

Claims (13)

A step of cutting a semi-cured first sheet in which a phosphor is contained substantially uniformly in a resin with a mold having a plurality of through-holes or recesses, and forming a plurality of small pieces separated from each other;
Curing the plurality of small pieces;
Coating a part of the surface of the plurality of cured pieces with a second sheet in a semi-cured state made of at least a resin;
A step of curing the second sheet to form a sheet molded body.   The manufacturing method of the sheet molded object of Claim 1 which has the process of cut | disconnecting between these several small pieces, after hardening the said 2nd sheet | seat.   The method for producing a sheet molded article according to claim 1 or 2, wherein the first sheet is formed by laminating a sheet containing no phosphor on a sheet containing the phosphor.   The said 1st sheet | seat is a manufacturing method of the sheet molded object of any one of Claims 1-3 by which the sheet | seat containing a respectively different fluorescent substance is laminated | stacked. The second sheet contains a light reflective material,
The method for producing a sheet molded body according to any one of claims 1 to 4, further comprising a step of removing a part of the surface of the second sheet and exposing the plurality of small pieces after the second sheet is cured.   The method for producing a sheet compact according to any one of claims 1 to 5, wherein the semi-cured first sheet has a Shore D hardness of 10 to 30.   The method for producing a sheet molded article according to any one of claims 1 to 6, wherein the semi-cured second sheet has a Shore D hardness of 10 to 30.   The method for producing a sheet molded body according to any one of claims 1 to 7, wherein an inner side surface of the through hole or the concave portion of the mold is an inclined surface or a curved surface.   The method for producing a sheet molded body according to claim 8, wherein the concave portion of the mold is a semispherical shape. A light emitting device having a first main surface having a pair of electrodes and a second main surface opposite to the first main surface having a pair of electrodes on the sheet molded body manufactured by the method according to any one of claims 1 to 9. Placing the second main surface on a piece; and
Forming a light-reflecting member so as to cover a part and a side surface of the first main surface of the light-emitting element and an upper surface of the sheet molded body. A plurality of the light emitting elements are placed on the sheet molded body,
The method for manufacturing a light-emitting device according to claim 10, further comprising: cutting the light-reflecting member between the plurality of light-emitting elements and the plurality of small pieces of the sheet molded body after forming the light-reflecting member. . The sheet molded body produced by the method according to any one of claims 1 to 9 has a first main surface having a pair of electrodes and a second main surface opposite to the first main surface. Placing the small piece on the light emitting element placed on the light emitting element placed such that the main surface side is disposed; and
Forming a light reflective member so as to cover a part and a side surface of the first main surface of the light emitting element and a lower surface and a side surface of the sheet molded body. A plurality of the light emitting elements are placed on the sheet molded body,
The method for manufacturing a light emitting device according to claim 12, further comprising a step of cutting the light reflecting member between the plurality of light emitting elements after forming the light reflecting member.

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