JP2018001290A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2018001290A JP2018001290A JP2016127393A JP2016127393A JP2018001290A JP 2018001290 A JP2018001290 A JP 2018001290A JP 2016127393 A JP2016127393 A JP 2016127393A JP 2016127393 A JP2016127393 A JP 2016127393A JP 2018001290 A JP2018001290 A JP 2018001290A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- mount
- spindle
- wheel
- chuck table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
- B23B31/02—Chucks
- B23B31/36—Chucks with means for adjusting the chuck with respect to the working-spindle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- H10P52/00—
-
- H10P90/123—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
10 加工ユニット
18 スピンドル
22 ホイールマウント
24 研削ホイール(第1工具)
32 エアシリンダ
34 チャンバー
35a 第1エア供給路
35b 第2エア供給路
36 ピストン
37 ピストンロッド
38 第2工具用マウント
42 研磨パッド(第2工具)
52 加工ユニット送り機構
56 チャックテーブル
62 バイトホイール(第1工具)
Claims (2)
- 被加工物を保持する保持面を有するチャックテーブルと、該チャックテーブルに保持された被加工物に加工を施す加工手段とを備えた加工装置であって、
該加工手段は、
スピンドルと、
該スピンドルを回転駆動するモータと、
該スピンドルの一端に連結され該チャックテーブルの該保持面に対面するホイールマウントと、
該ホイールマウントの被装着面に着脱自在に装着される第1の直径を有する第1工具と、
該ホイールマウントの該被装着面と反対側の背面側で該スピンドルに回転不能且つ該スピンドルの軸方向に移動可能に取り付けられ、該ホイールマウントと該ホイールマウントに装着された該第1工具とを収容する収容部と、該収容部を囲繞する該第1の直径よりも大きい内径の第2工具装着部とを有する第2工具用マウントと、
該第2工具用マウントに着脱可能に装着された該第1の直径よりも大きい内径を有する第2工具と、
該第2工具マウントを該スピンドルの軸方向に移動させる移動手段と、を備え、
該移動手段は、該チャックテーブルに保持された被加工物に該第1工具が接触するが該第2工具は接触しない退避位置と、該チャックテーブルに保持された被加工物に該第1工具は接触しないが該第2工具は接触する第2工具作用位置とに、該第2工具用マウントを位置付け可能な加工装置。 - 該移動手段で該第2工具用マウントを該退避位置に位置付けることで該第1工具は該第2工具用マウントの該収容部から露出し、該ホイールマウントの背面側から該ホイールマウントに該第1工具を固定する固定部が露出する請求項1記載の加工装置。
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016127393A JP2018001290A (ja) | 2016-06-28 | 2016-06-28 | 加工装置 |
| TW106115666A TW201800179A (zh) | 2016-06-28 | 2017-05-11 | 加工裝置 |
| KR1020170068312A KR20180002020A (ko) | 2016-06-28 | 2017-06-01 | 가공 장치 |
| US15/630,033 US20170368659A1 (en) | 2016-06-28 | 2017-06-22 | Processing apparatus |
| CN201710492700.0A CN107538317A (zh) | 2016-06-28 | 2017-06-26 | 加工装置 |
| DE102017210775.8A DE102017210775A1 (de) | 2016-06-28 | 2017-06-27 | Bearbeitungsvorrichtung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016127393A JP2018001290A (ja) | 2016-06-28 | 2016-06-28 | 加工装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2018001290A true JP2018001290A (ja) | 2018-01-11 |
Family
ID=60579400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016127393A Pending JP2018001290A (ja) | 2016-06-28 | 2016-06-28 | 加工装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20170368659A1 (ja) |
| JP (1) | JP2018001290A (ja) |
| KR (1) | KR20180002020A (ja) |
| CN (1) | CN107538317A (ja) |
| DE (1) | DE102017210775A1 (ja) |
| TW (1) | TW201800179A (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022038718A (ja) * | 2020-08-27 | 2022-03-10 | 株式会社ディスコ | 加工装置 |
| KR20220040984A (ko) * | 2020-09-24 | 2022-03-31 | 가부시기가이샤 디스코 | 가공 장치 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6947135B2 (ja) * | 2018-04-25 | 2021-10-13 | 信越半導体株式会社 | 研磨装置、ウェーハの研磨方法、及び、ウェーハの製造方法 |
| JP7517897B2 (ja) * | 2020-08-05 | 2024-07-17 | 株式会社ディスコ | 研削方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009190127A (ja) * | 2008-02-15 | 2009-08-27 | Disco Abrasive Syst Ltd | 半導体製造装置 |
| JP2013118324A (ja) * | 2011-12-05 | 2013-06-13 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
| JP2014050899A (ja) * | 2012-09-05 | 2014-03-20 | Disco Abrasive Syst Ltd | 加工装置 |
| JP2016087748A (ja) * | 2014-11-06 | 2016-05-23 | 株式会社ディスコ | 研削装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2621445A (en) * | 1947-04-02 | 1952-12-16 | Chrysler Corp | Apparatus for polishing continuous strip material |
| CH553621A (fr) * | 1972-10-23 | 1974-09-13 | Tatar Alexander | Procede pour l'affutage de forets a quatre faces et machine d'affutage pour la mise en oeuvre de ce procede. |
| JPS6362650A (ja) | 1986-08-29 | 1988-03-18 | Disco Abrasive Syst Ltd | 研摩機 |
| US5185956A (en) * | 1990-05-18 | 1993-02-16 | Silicon Technology Corporation | Wafer slicing and grinding system |
| JP3111892B2 (ja) * | 1996-03-19 | 2000-11-27 | ヤマハ株式会社 | 研磨装置 |
| GB9714427D0 (en) * | 1997-07-10 | 1997-09-10 | Western Atlas Uk Ltd | Machine tools |
| US6368189B1 (en) * | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| US6905398B2 (en) * | 2001-09-10 | 2005-06-14 | Oriol, Inc. | Chemical mechanical polishing tool, apparatus and method |
| US7118446B2 (en) * | 2003-04-04 | 2006-10-10 | Strasbaugh, A California Corporation | Grinding apparatus and method |
| DE10322360A1 (de) * | 2003-05-09 | 2004-11-25 | Kadia Produktion Gmbh + Co. | Vorrichtung zum Feinbearbeiten von ebenen Flächen |
| IT1391211B1 (it) * | 2008-08-05 | 2011-11-18 | Zanetti | Testa di taglio e sbordatura da montare su banchi da taglio di lastre in vetro |
| US8133093B2 (en) * | 2008-10-10 | 2012-03-13 | Strasbaugh, Inc. | Grinding apparatus having an extendable wheel mount |
| JP5236515B2 (ja) * | 2009-01-28 | 2013-07-17 | 株式会社荏原製作所 | ドレッシング装置、化学的機械的研磨装置及び方法 |
| TWM421860U (en) * | 2011-02-18 | 2012-02-01 | Green Energy Technology Inc | Position adjusting mechanism for grinding wheel |
| JP6385734B2 (ja) | 2014-06-30 | 2018-09-05 | 株式会社ディスコ | 研削方法 |
| CN104669086A (zh) * | 2015-02-09 | 2015-06-03 | 德清晶生光电科技有限公司 | 一种晶体片倒角装置 |
-
2016
- 2016-06-28 JP JP2016127393A patent/JP2018001290A/ja active Pending
-
2017
- 2017-05-11 TW TW106115666A patent/TW201800179A/zh unknown
- 2017-06-01 KR KR1020170068312A patent/KR20180002020A/ko not_active Ceased
- 2017-06-22 US US15/630,033 patent/US20170368659A1/en not_active Abandoned
- 2017-06-26 CN CN201710492700.0A patent/CN107538317A/zh active Pending
- 2017-06-27 DE DE102017210775.8A patent/DE102017210775A1/de not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009190127A (ja) * | 2008-02-15 | 2009-08-27 | Disco Abrasive Syst Ltd | 半導体製造装置 |
| JP2013118324A (ja) * | 2011-12-05 | 2013-06-13 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
| JP2014050899A (ja) * | 2012-09-05 | 2014-03-20 | Disco Abrasive Syst Ltd | 加工装置 |
| JP2016087748A (ja) * | 2014-11-06 | 2016-05-23 | 株式会社ディスコ | 研削装置 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022038718A (ja) * | 2020-08-27 | 2022-03-10 | 株式会社ディスコ | 加工装置 |
| JP7517910B2 (ja) | 2020-08-27 | 2024-07-17 | 株式会社ディスコ | 加工装置 |
| KR20220040984A (ko) * | 2020-09-24 | 2022-03-31 | 가부시기가이샤 디스코 | 가공 장치 |
| JP2022052988A (ja) * | 2020-09-24 | 2022-04-05 | 株式会社ディスコ | 加工装置 |
| JP7544547B2 (ja) | 2020-09-24 | 2024-09-03 | 株式会社ディスコ | 加工装置 |
| KR102814217B1 (ko) | 2020-09-24 | 2025-05-28 | 가부시기가이샤 디스코 | 가공 장치 |
| TWI893214B (zh) * | 2020-09-24 | 2025-08-11 | 日商迪思科股份有限公司 | 加工裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201800179A (zh) | 2018-01-01 |
| DE102017210775A1 (de) | 2017-12-28 |
| KR20180002020A (ko) | 2018-01-05 |
| US20170368659A1 (en) | 2017-12-28 |
| CN107538317A (zh) | 2018-01-05 |
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