JP2018088471A - Printed-circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board capable of adjusting an inductance value after manufacturing the printed wiring board. SOLUTION: A printed wiring board 10 adjusts an inductance by stacking coil wiring boards 1 including coil wirings 1 arranged in a spiral shape in the same layer on at least one surface in a plane direction and electrically connecting them. [Selection diagram] Fig. 1

Description

  The present disclosure relates to a printed wiring board capable of adjusting inductance.

  Conventionally, as a coil antenna mounted on a printed wiring board and used for wireless power feeding or the like, for example, a spiral winding coil (coil wiring) as shown in the cited document 1 is used. Since this coil wiring can increase the inductance depending on the length, the number of turns of the coil is increased to increase the inductance.

Japanese Examined Patent Publication No. 61-061538

  The printed wiring board of the present disclosure adjusts the inductance by stacking and electrically connecting coil wiring boards including coil wirings arranged at least on one side in the same layer and spirally in the plane direction.

  The printed wiring board adjustment method according to the present disclosure is a printed wiring board in which coil wiring boards including coil wirings arranged at least on one side in a spiral layer are stacked and electrically connected in a plane direction to adjust inductance. Form.

It is a perspective view showing the printed wiring board for antennas concerning one embodiment of this indication. It is a side view of FIG. FIG. 2 is a top view of FIG. 1. The wiring pattern of the two-layer printed wiring board which provided the coil wiring in the single side | surface is shown, (a-1)-(a-4) and (b-1)-(b-4) are respectively the 1st layer It is a top view of the second layer. It is a top view showing a coil wiring board provided with coil wiring concerning one embodiment of this indication. It is explanatory drawing which shows the wiring pattern of each layer of the printed wiring board provided by connecting the coil wiring board of FIG. 5 in series. It is explanatory drawing which shows the wiring pattern of each layer of the printed wiring board provided by carrying out the parallel wiring of the coil wiring board of FIG. It is a wiring pattern of the printed wiring board which provided the coil wiring on the surface, and the via land on the back surface, (a) is explanatory drawing from the front side, (b) is a perspective view from the back side. It is a cross-sectional perspective view in the AA line of Fig.8 (a).

When the inductance value of the coil wiring of the printed wiring board is not a value as designed, conventionally, it is necessary to redesign the coil wiring and manufacture the printed wiring board again. This operation is repeated until the designed value is obtained. That is, in order to increase the inductance, the spiral of the coil wiring is increased in the plane direction of the printed wiring board. When wiring in the plane direction cannot be achieved due to the limitation of the wiring area of the printed wiring board, the coil wiring layer (wiring layer) is increased via the insulating layer in the thickness direction of the printed wiring board (another layer), and the via Etc. are used to connect the coil wiring of each layer.
However, if the number of wiring layers of the printed wiring board is increased to, for example, 2 layers, 4 layers, and 6 layers only for the coil wiring, the difficulty in manufacturing the printed wiring board increases and the cost increases. End up.

  Since the coil wiring of the printed wiring board is fixed, adjustment is impossible even if the inductance is increased after the printed wiring board is manufactured. Therefore, when the specification is changed after the printed wiring board is manufactured and the inductance value is changed, the coil wiring must be redesigned and the printed wiring board must be manufactured again.

  The printed wiring board of the present disclosure adjusts the inductance by stacking and electrically connecting coil wiring boards including coil wirings arranged at least on one side in the same layer and spirally in the plane direction.

  Therefore, a coil wiring board including coil wirings arranged in the same layer in a spiral shape is prepared in advance, and this is stacked in the surface direction on the coil wiring portion on the printed wiring board and attached by bonding or bonding. If the connections are made, the inductance can be easily adjusted only by adjusting the number of coil wiring boards to be stacked and the arrangement in the winding direction. The printed wiring board can be attached by selecting the coil wiring winding direction as necessary. The printed wiring board may be a single-sided printed wiring board in which coil wiring is provided on one side, or a double-sided printed wiring board in which coil wiring is provided on both sides. Further, the coil wiring boards can be wired in parallel or in series. In particular, by connecting the coil wirings in the same winding direction in parallel, the printed wiring board can reduce the resistance value of the coil wiring while minimizing the decrease in inductance.

  This printed wiring board is suitable not only for matching only the inductance but also for devices that require a physical coil wiring length (for example, a printed wiring board used for a wireless power feeding antenna or a printed wiring board on which an antenna wiring is formed). . Therefore, even a flexible printed wiring board that is difficult to increase in number of layers can be attached.

  A printed wiring board according to an embodiment of the present disclosure will be described with reference to FIGS. The printed wiring board 10 has four layers of coil wiring boards 10a to 10d each including the coil wiring 1 arranged in a spiral shape on the same layer on at least one surface of an insulating material (insulating resin layer). Electrically connected. The coil wiring boards 10 a to 10 d are fixed up and down with screws 6 and are electrically connected to each other by a pad (solder ball pad) 7. The printed wiring board 10 is connected to a surface pad portion (not shown) of the control circuit board 20 including the capacitor 2 and the control IC 3 through the jumper wiring 5. Further, the printed wiring board 10 may be provided with a chip resistor 4 for switching a current path. The pads 7, 7 ', 7a, 7a' have connection vias and are electrically connected to the back via land.

  The chip resistor 4 mounted on the coil wiring boards 10 a to 10 d is a 0Ω resistor, and switches the current path of the coil wiring 1. For example, when the chip resistor 4 is not mounted on the printed wiring board 10, current can be supplied to the jumper wiring 5 side, and when the chip resistor 4 is mounted, current can be supplied to the coil wiring of the lower coil wiring board.

  As shown in FIG. 3, the jumper wiring 5 that connects the printed wiring board 10 and the control circuit board 20 includes jumper wirings 51 and 52. The jumper wiring 51 connects the coil wiring 1 on the uppermost layer (outermost surface) of the printed wiring board 10 and the control circuit board 20 on the surface layer. The jumper wiring 52 is connected to the coil wiring 1 of the printed wiring board 10d installed at the lowermost layer of the printed wiring board 10 at one end, and the other end is passed through a hole (hole) 53 provided in each of the coil wiring boards 10a to 10c. It connects to the surface pad part (not shown) of the control circuit wiring board 20. An example of the material of the jumper wiring 5 is copper.

  The screw 6 is a screw for fixing the plurality of coil wiring boards 10 a to 10 d and is provided on the outer periphery of the coil wiring 1. Instead of the screws 6, a large number of solder balls or the like may be melted and connected. Further, a fixed interval may be provided by inserting a spacer between the coil wiring boards 10a to 10d.

  The control circuit board 20 shown in FIGS. 1 to 3 includes at least one capacitor 2 and a control IC 3. The capacitor 2 is a resonance adjustment capacitor connected to the printed wiring board 10 and the jumper wiring 5, and is attached to the control circuit board 20 so that it can be removed. By removing this capacitor 2 and replacing it with another capacitor 2, the capacitance of the capacitor can be changed. The control IC 3 is an IC for optimizing the voltage and current connected to the capacitor 2. In addition, the control circuit board 20 may be provided with, for example, a power transmission (power reception) side circuit or a rechargeable battery (not shown).

  The printed wiring board 10 and the control circuit board 20 described above can be used as the antenna printed wiring board 100 for transmission or reception for wireless power feeding. In this wireless power feeding, power is transmitted and received by resonating between the coil wiring on the transmission side and the reception side. The resonance is determined by the ratio between the inductance value due to the length of the coil wiring 1 of the printed wiring board 10 and the capacitance of the capacitor 2 of the control circuit board 20. At this time, the resonating frequency is the most efficient frequency for wireless power feeding. Therefore, since the adjustment of the capacitance of the capacitor 2 and the adjustment of the inductance value of the printed wiring board 10 can both be achieved, the antenna printed wiring board 100 of the present disclosure can adjust the frequency that is most efficient for wireless power feeding. It becomes easy.

(Two-layer (both sides) structure)
An embodiment of the wiring pattern of the printed wiring board will be described with reference to FIG. As shown in FIGS. 4 (a-1) to (a-4) and (b-1) to (b-4), the printed wiring board 110 includes coil wiring boards 11a to 11d and 11a 'to 11d', respectively. It is formed by stacking. The printed wiring board 110 has a two-layer (double-sided) structure composed of a first layer (coil wiring boards 11a to 11d) and a second layer (coil wiring boards 11a 'to 11d'). 1a-1d and 1a'-1d 'are provided on one side.

  The first-layer coil wirings 1a to 1d are opposed to the second-layer coil wirings 1a 'to 1d' via the resin layers between the layers, respectively. At this time, the first layer coil wirings 1a to 1d are wound from the outside to the inside, and the second layer coil wirings 1a 'to 1d' are oppositely wound from the inside to the outside. .

As shown in FIG. 4A-1, the coil wiring 1a of the coil wiring board 11a has one end connected to a jumper wiring 51 connected to the control circuit board 20 (not shown) and the other end spirally formed. It is connected to the connection via 8a at the substantially central portion. The connection via 8a is electrically connected to the connection via 8a ′ of the lower coil wiring board 11a ′ shown in FIG. 4B-1 and is connected to the coil wiring 1a ′. The coil wiring 1a ′ wound outward from the connection via 8a ′ is connected to the pad 7a through the mounted chip resistor 4. The pad 7a is connected to the pad 7a 'at one end of the coil wiring 1b of the lower coil wiring board 11b (FIG. 4 (a-2)). The coil wiring 1b is connected from the pad 7a ′ to the coil wiring board 11b ′ shown in FIG. 4B-2 through the connection via 8b ′ connected to the connection via 8b.
In the same manner, the layers of the coil wiring boards 11a to 11d and 11a 'to 11d' are connected and connected to the coil wiring 1d (FIG. 4 (a-4)) of the lowermost coil wiring board 11d. The coil wiring 1d is connected to the coil wiring 1d ′ shown in FIG. 4B-4 through connection vias 8d and 8d ′.
Finally, the coil wiring 1d ′ shown in FIG. 4B-4 is connected to the jumper wiring 52, passes through the holes 53 provided on each substrate of the printed wiring board 110, and is on the side of the uppermost coil wiring board 11a. To the control circuit board 20.

  The connection vias 8a to 8d and 8a 'to 8d' are used for connection of each layer of the printed wiring board 110, but the present invention is not limited thereto, and any structure that conducts the layers of the printed wiring board may be used. You may connect using a conductive paste, a copper wire, etc.

  One of the pads 7a and 7a ′, the pads 7b and 7b ′, and the pads 7c and 7c ′ of the printed wiring board 110 may be a solder ball pad, and the other may be a solder ball pad connected to the other.

(Combination of printed wiring boards)
A coil wiring board 90 shown in FIG. 5 is formed using one layer of coil wiring 9 that spirals from the outer pad 7 toward the inner connection via 8. The coil wiring board 90 includes a pad 40 for mounting a 0Ω chip resistor or the like for switching a current path and a hole 53 for passing a jumper wiring on the outside. Note that the above-described members are denoted by the same reference numerals and description thereof is omitted.

  When the coil wiring board 90 is turned upside down and pasted together, the coil wiring board 90 faces outward from the inner connection via 8, and when it is laminated together, the coil wiring board 90 heads from the outer side to the inner connection via 8. Thereby, it is possible to select the winding method and the number of windings of the coil wiring 9 by using the coil wiring board 90 having the same design, and it becomes easy to create a printed wiring board of serial wiring and parallel wiring. Therefore, the inductance value and the wiring resistance value of the coil wiring 9 can be easily adjusted.

(Series wiring)
Using the coil wiring board 90 shown in FIG. 5, a printed wiring board 90a in which coils as shown in FIG. 6 are wired in series is created. The coil wiring boards 91 to 94 are the same as the coil wiring board 90.

  The printed wiring board 90a is composed of four layers of coil wiring boards 91-94. In the first (uppermost layer) coil wiring board 91, the coil wiring 9 is spirally wired from the outer side connected to the jumper wiring 51 toward the inner connection via 81. The second coil wiring board 92 is formed by turning the coil wiring board 91 upside down and overlapping the connection via 81 of the coil wiring board 91 with the solder ball or the like from the inner connection via 82 to the outer pad 7. I'm heading. Further, a chip resistor (0Ω) 4 is mounted in order to secure a current path to the pad 7 connected to the lower coil wiring board 93 with solder balls or the like. The third coil wiring board 93 has the same design as the coil wiring board 91, and is wired from the outer pad 7 conducting to the coil wiring board 92 to the inner connection via 83. The fourth (lowermost layer) coil wiring board 94 is a coil wiring board 93 turned upside down (same design as the coil wiring board 92). The connection via 83 of the coil wiring board 93 and solder balls are used. The inner connection via 84 that conducts is directed to the outer jumper wiring 52. In the coil wiring board 94, the jumper wiring 52 passed through the hole 53 on the surface of the printed wiring board 90a (coil wiring board 91) and the coil wiring 9 are connected.

  In this way, the coil wiring 9 is connected from the upper layer to the lower layer in order from the coil wiring boards 91 to 94, and the printed wiring board 90a of the serial wiring can be created. The printed wiring board 90a is not limited to four layers, and the number of printed wiring boards can be increased until a necessary inductance is obtained. In that case, the printed wiring boards may be alternately turned over and overlapped.

(Parallel wiring)
Using the coil wiring board 90 shown in FIG. 5, a printed wiring board 90b in which coils as shown in FIG. 7 are wired in parallel is created. The coil wiring boards 95 to 98 are the same as the coil wiring board 90.

  The printed wiring board 90b is composed of four layers of coil wiring boards 95-98. The first (top layer) and second coil wiring boards 95 and 96 have the same design, and the coil wiring 9 is spirally wired from the outer side toward the inner connection via 85. The third and fourth (lowermost layer) coil wiring boards 97 and 98 are obtained by turning the first coil wiring board 95 upside down and overlapping each other. The wiring is directed toward the pad 7. Moreover, in the coil wiring board 98, the jumper wiring 52 passed through the hole 53 on the surface of the printed wiring board 90b (coil wiring board 95) and the coil wiring 9 are connected. In addition, the coil wiring boards 95 to 98 are electrically connected by the connection via 85 that each has. The coil wiring boards 95 and 96 are electrically connected by the pad 7. The coil wiring boards 97 and 98 are also electrically connected by a pad 7 ′ different from the pad 7.

  Thus, the coil wiring 9 is connected from the upper layer to the lower layer in order from the coil wiring boards 95 to 98, and the printed wiring board 90b of the parallel wiring can be created. The printed wiring board 90b is not limited to four layers, and the number of printed wiring boards can be increased until a necessary inductance is obtained. In that case, the upper half of the printed wiring board may be overlapped in the same direction, and the remaining half may be overlapped up to the lower layer.

(When chip resistor is not used)
According to the printed wiring board of the present disclosure, even when the chip resistance (0Ω) is not used, the upper and lower layers can be connected to adjust the inductance value. For example, the multilayer printed wiring board 90c shown in FIGS. 8 and 9 is configured by stacking four types of coil wiring boards 99a to 99d in the surface direction. The winding direction of the coil wiring 9 'of the coil wiring boards 99a to 99d is the same. Among these, the printed wiring boards 99a and 99d are arranged on the outer layer surface of the printed wiring board 90c, and the printed wiring boards 99b and 99c are arranged in the inner layer of the printed wiring board 90c. Each of the printed wiring boards 99a to 99d is a double-sided board, and includes a coil wiring 9 'wired in a spiral shape on one side and a via land 80 for connecting the upper and lower layers on the opposite side. The via land 80 may be appropriately formed according to the mounting situation.

  In the printed wiring board 90c, the inductance value can be easily changed. That is, in the printed wiring board 90c, the minimum inductance value is obtained by bonding the coil wiring board 99a and the coil wiring board 99d. In order to increase the inductance value, the coil wiring boards 99b and 99c may be combined into one set, and the necessary sets may be bonded and stacked in the coil wiring boards 99a and 99d. If such coil wiring boards 99a to 99d are previously formed as unit members, the inductance can be adjusted only by attaching a necessary number of inner coil wiring boards 99b and 99c.

  The present disclosure is not limited to the above-described embodiment, and various improvements or improvements are possible. For example, the printed wiring board is not limited to a structure in which four coil wiring boards are stacked, and may be two, six, eight, or the like. Furthermore, the coil wiring is not limited to only one side of the coil wiring board, and may be on both sides. Such a printed wiring board can be prepared in advance as a unit member. Further, if it can be attached and electrically connected to the coil wiring portion of the existing substrate, it is possible to adjust the inductance value after manufacturing the printed wiring board, which has been impossible in the past.

DESCRIPTION OF SYMBOLS 1 Coil wiring 1a-1d Coil wiring 1a'-1d 'Coil wiring 2 Capacitor 3 Control IC
4 Chip resistance 5, 51, 52 Jumper wiring 53 Hole 6 Screw 7, 7 'Pad 7a, 7a' Pad 8 Connection via 8a-8d Connection via 8a'-8d 'Connection via 9, 9' Coil wiring 10 Printed wiring board 10a -10d Coil wiring board 11a-11d Coil wiring board 11a'-11d 'Coil wiring board 20 Control circuit board 80 Via land 81-85 Connection via 91-98 Coil wiring board 99a-99d Coil wiring board 90, 90a, 90b, 90c Printing Wiring board 110 Printed wiring board 100 Printed wiring board for antenna

Claims (6)

  A printed wiring board characterized in that an inductance is adjusted by stacking and electrically connecting coil wiring boards including coil wirings arranged in a spiral shape in the same layer on at least one surface.   The printed wiring board according to claim 1, wherein the coil wiring has the same wiring shape.   The printed wiring board according to claim 1, wherein a 0Ω chip resistor is mounted.   The printed wiring board according to any one of claims 1 to 3, wherein a plurality of coil wiring boards in which coil wirings in the same winding direction are arranged on at least one side are wired in series or in parallel. A printed wiring board according to any one of claims 1 to 4,
A printed wiring board for an antenna for wireless power feeding, including a control circuit wiring board having a capacitor connected to the printed wiring board.   A printed wiring board comprising a coil wiring board including coil wirings arranged in a spiral on the same layer on at least one side, stacked in a plane direction and electrically connected to form a printed wiring board with adjusted inductance Adjustment method.

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