JP2018086794A - Compression molding device, compression molding method, and manufacturing method of compression molded article - Google Patents

Abstract

Disclosed is a compression molding apparatus that can easily suppress variations in package thickness. A mold 10 includes an upper mold 100 to which a substrate 1 is fixed, a lower mold 200 having a mold cavity 204 to which a resin material is supplied, and a depth of the mold cavity 204 at the time of mold clamping to a predetermined depth. Positioning mechanism 207, surplus resin container 205 that stores surplus resin not accommodated in mold cavity 204 at the time of mold clamping, and surplus resin separating member 103. At least a part of the end surface on the side of the surplus resin container 205 comes into contact with the surplus resin separation member 103, so that resin leakage from the end surface of the substrate 1 is suppressed or prevented, and the resin in the mold cavity 204 and the surplus resin are cured. Later, the surplus resin separating member 103 is moved up and down by the upper mold 100 and the lower mold 200, so that the resin hardened in the mold cavity 204 and the surplus resin container 205 Cured the compression molding apparatus and excess resin are separated. [Selection] Figure 2

Description

  The present invention relates to a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product.

  As a method for manufacturing a resin molded product, compression molding (for example, Patent Document 1) is used.

JP 2007-301950 A

  However, in compression molding, when the amount of resin supplied to the mold cavity varies, the thickness of the package (resin portion in the resin molded product) may also vary.

  Therefore, an object of the present invention is to provide a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product that can easily suppress variation in package thickness.

In order to achieve the above object, the compression molding apparatus of the present invention comprises:
Including molds,
The mold is
Upper mold,
With the lower mold,
Mold cavity to which resin material is supplied;
A positioning mechanism for holding the depth of the mold cavity at a predetermined depth during mold clamping;
A surplus resin container for accommodating surplus resin that is not accommodated in the mold cavity at the time of mold clamping;
An excess resin separating member,
Of the upper mold and the lower mold, one mold has the mold cavity, and the other mold is a mold to which the substrate is fixed.
At the time of clamping the upper mold and the lower mold, at least a part of the end surface of the substrate on the surplus resin accommodating portion side is in direct or indirect contact with the surplus resin separating member or the one mold, Resin leakage from the end face of the substrate is suppressed or prevented,
After the resin in the mold cavity and the surplus resin are cured, the surplus resin separating member is raised or lowered relative to one or both of the upper mold and the lower mold, so that the inside of the mold cavity The resin cured in step (b) is separated from the surplus resin cured in the surplus resin container.

The compression molding method of the present invention comprises:
A resin material supply step of supplying a resin material into a mold cavity of one of the upper mold and the lower mold of the mold;
A substrate fixing step of fixing a substrate to the other of the upper mold and the lower mold;
A mold clamping step of clamping the upper mold and the lower mold of the mold;
A surplus resin housing step of housing surplus resin that is not housed in the mold cavity in the mold clamping step;
A mold opening step of opening the upper mold and the lower mold;
A surplus resin separation step of separating the surplus resin from the resin cured in the mold cavity,
In the mold clamping step, at least part of the end surface of the substrate on the surplus resin housing portion side is brought into direct or indirect contact with the surplus resin separating member or the one mold, thereby preventing resin leakage from the substrate end surface. Suppress or prevent,
The surplus resin separation step is performed by raising or lowering the surplus resin separation member relative to one or both of the upper mold and the lower mold after the resin in the mold cavity and the surplus resin are cured. It is characterized by that.

  The method for producing a compression molded product of the present invention is characterized in that a resin is compression molded by the compression molding method of the present invention.

  ADVANTAGE OF THE INVENTION According to this invention, the compression molding apparatus which can suppress the dispersion | variation in package thickness easily, the compression molding method, and the manufacturing method of a compression molding product can be provided.

FIG. 1 is a cross-sectional view schematically showing an example of the configuration of a molding die in the compression molding apparatus of the present invention. FIG. 2 is a cross-sectional view schematically showing one step in an example of the compression molding method of the present invention using the mold of FIG. FIG. 3 is a cross-sectional view schematically showing another step of the compression molding method of FIG. FIG. 4 is a cross-sectional view schematically showing still another process of the compression molding method of FIG. FIG. 5 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. FIG. 6 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. FIG. 7 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. FIG. 8 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. FIG. 9 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. FIG. 10 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. FIG. 11 is a cross-sectional view schematically showing another example of the configuration of the molding die in the compression molding apparatus of the present invention. FIG. 12 is a cross-sectional view schematically showing still another example of the configuration of the molding die in the compression molding apparatus of the present invention. FIG. 13 is a cross-sectional view schematically showing one step in another example of the compression molding method of the present invention using the mold of FIG. FIG. 14 is a cross-sectional view schematically showing another step of the compression molding method of FIG. FIG. 15 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. FIG. 16 is a cross-sectional view schematically showing still another example of the configuration of the molding die in the compression molding apparatus of the present invention and one step in an example of the compression molding method of the present invention using the molding die. FIG. 17 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 18 is a cross-sectional view schematically showing still another process of the compression molding method of FIG. FIG. 19 is a cross-sectional view schematically showing one step of a substrate setting method for setting a substrate in the compression molding apparatus of the present invention using a substrate loader. 20 is a cross-sectional view schematically showing another step of the substrate setting method of FIG. FIG. 21 is a cross-sectional view schematically showing yet another step of the substrate setting method of FIG. FIG. 22 is a cross-sectional view schematically showing yet another step of the substrate setting method of FIG. FIG. 23 is a cross-sectional view schematically showing yet another step of the substrate setting method of FIG. FIG. 24 is a cross-sectional view schematically showing yet another step of the substrate setting method of FIG. FIG. 25 is a plan view schematically showing an example of the configuration of the compression molding apparatus of the present invention. FIGS. 26A to 26C are plan views each schematically showing an example of the configuration of the compression molded product and the surplus resin manufactured according to the present invention. FIGS. 27A to 27C are plan views schematically showing still another example of the configuration of the compression molded product and the surplus resin, respectively.

  Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

  In the compression molding apparatus of the present invention, for example, by attaching a release film to the mold surface of the one mold, the substrate end surface and the one mold are interposed via the release film at the time of clamping. It may be possible to make contact.

In the compression molding apparatus of the present invention, for example,
The one mold has a bottom member and a side member,
The bottom member is fixed to a base member;
The side member is connected to the base member via an elastic member,
The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
The positioning mechanism includes a stopper fixed to the base member;
When the upper mold and the lower mold are clamped, the side surface member may come into contact with the stopper, so that the depth of the mold cavity may be held at a predetermined depth.

  The compression molding apparatus of the present invention may further include, for example, a control unit that controls the operation of the mold. Further, for example, the control unit may control clamping of the mold, and the positioning mechanism may include the control unit.

The compression molding apparatus of the present invention is, for example,
And a control unit for controlling the operation of the mold.
The one mold has a bottom member and a side member,
The bottom member is fixed to a base member;
The side member is connected to the base member via an elastic member,
The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
The positioning mechanism includes the control unit;
When the upper mold and the lower mold are clamped, one or both of the ascending position and the descending position of one or both of the upper mold and the lower mold are controlled by the control unit, so that the mold cavity The depth may be held at a predetermined depth.

  The compression molding apparatus of the present invention further includes, for example, a resin pressurizing member that can move up and down with respect to the surplus resin containing portion, and the resin pressurizing member allows the inside of the mold cavity and the surplus resin containing portion. The resin may be pressurized.

  The compression molding apparatus of the present invention may further include, for example, a surplus resin containing portion resin material supply mechanism that supplies a resin material to the surplus resin containing portion.

  In the compression molding apparatus of the present invention, the surplus resin separating member may be capable of being fixed by sandwiching the surplus resin between the surplus resin housing portion, for example.

  In the compression molding method of the present invention, for example, by attaching a release film to the mold surface of the one mold, the substrate end face and the one mold are interposed via the release film at the time of clamping. You may use the shaping | molding die which can be made to contact.

In the compression molding method of the present invention, for example,
The one mold has a bottom member and a side member,
The bottom member is fixed to a base member;
The side member is connected to the base member via an elastic member,
The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
The positioning mechanism includes a stopper fixed to the base member;
The mold cavity may be held at a predetermined depth by bringing the side member into contact with the stopper during the mold clamping step.

  In the compression molding method of the present invention, for example, the mold has a resin pressure member that can move up and down with respect to the surplus resin container, and in the mold clamping step, the mold is formed by the resin pressure member. The resin in the cavity and the excess resin container may be pressurized.

  In the compression molding method of the present invention, for example, in the resin material supply step, a resin material may also be supplied to the surplus resin container.

  Although the apparatus for performing the compression molding method of the present invention is not particularly limited, for example, the compression molding apparatus of the present invention can be used.

  Moreover, the order which performs each process in the compression molding method of this invention is not specifically limited. That is, as long as it can be performed, each step in the compression molding method of the present invention may be performed in any order, and a plurality of steps may be performed simultaneously.

  As described above, the method for producing a compression molded product of the present invention is characterized in that a resin is compression molded by the compression molding method of the present invention. Other than this, the production method of the compression molded product of the present invention is not particularly limited, and includes, for example, other steps than the step of compression molding the resin by the compression molding method of the present invention (compression molding step). It does not have to be included. The other steps are not particularly limited, and may be, for example, a cutting step in which an intermediate product manufactured by the compression molding step is cut to separate a final compression molded product. More specifically, for example, an intermediate product is manufactured by compression molding (resin sealing) a plurality of chips arranged on one substrate by the compression molding step, and further, the intermediate product is cut by the cutting step. Then, individual chips may be separated into compression molded products (finished products) sealed with resin.

  In addition, in this invention, it does not restrict | limit especially as said resin material (resin for resin sealing), For example, thermosetting resins, such as an epoxy resin and a silicone resin, may be sufficient as thermoplastic resin. There may be. Further, it may be a composite material partially including a thermosetting resin or a thermoplastic resin. Examples of the form of the resin supplied to the resin sealing device include a granular resin, a fluid resin, a sheet-like resin, a tablet-like resin, and a powder-like resin.

  In the present invention, the “fluid resin” is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the term “liquid” means fluidity at normal temperature (room temperature) and fluidity by applying a force, regardless of the degree of fluidity, in other words, the degree of viscosity. That is, in the present invention, the “liquid resin” refers to a resin that has fluidity at room temperature (room temperature) and flows when a force is applied. In the present invention, the “molten resin” refers to a resin that is in a liquid or fluid state by melting, for example. Although the form of the said molten resin is not specifically limited, For example, it is a form which can be supplied to the cavity etc. of a shaping | molding die.

  In general, the term “electronic component” refers to a chip before resin-sealing and a state in which the chip is resin-sealed, but in the present invention, simply referred to as “electronic component” Unless otherwise specified, it means an electronic component (an electronic component as a finished product) in which the chip is sealed with a resin. In the present invention, the “chip” means a chip in which at least a part is exposed without being resin-sealed, and a chip before resin sealing, a chip partially sealed with resin, or a plurality of chips. A chip in which at least one of them is exposed without being resin-sealed is also included. Specific examples of the “chip” in the present invention include chips such as ICs, semiconductor chips, and semiconductor elements for power control. The “chip” in the present invention includes a flip chip. In the present invention, a chip in which at least a part is exposed without being resin-sealed is referred to as a “chip” for convenience in order to distinguish it from an electronic component after resin-sealing. However, the “chip” in the present invention is not particularly limited as long as at least a part of the chip is exposed without being sealed with resin, and may not be in a chip shape. Moreover, in the electronic component (resin-encapsulated electronic component) of the present invention, the entire chip may be resin-encapsulated, but only a part may be resin-encapsulated. That is, when a state in which a part of the chip is not resin-sealed is a finished product of an electronic component (resin-sealed electronic component) as a product, such a state is also referred to as “electronic component (resin-sealed) in the present invention. Electronic components) ”.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, each drawing is schematically drawn with appropriate omission, exaggeration, and the like.

  FIG. 1 is a cross-sectional view showing an example of the configuration of a molding die in the compression molding apparatus of the present invention. As illustrated, the mold 10 includes an upper mold 100 and a lower mold 200. The mold 10 is a mold for resin-sealing one surface of the substrate. The lower mold 200 has a mold cavity (lower mold cavity) 204, and the upper mold 100 is a mold on which the substrate is fixed.

  The lower mold 200 includes a bottom surface member (lower mold bottom surface member) 202 and a side surface member (lower mold side surface member) 203. The lower mold bottom member 202 is fixed to the base member 201. The lower mold side member 203 is connected to a base member (lower mold base member or lower mold base block) 201 via elastic members 208, 209 and 210. In addition, each elastic member in the compression molding apparatus of FIG. 1 is not specifically limited, For example, a spring etc. may be sufficient. A lower mold cavity 204 is formed by a space surrounded by the upper surface of the lower mold bottom surface member 202 and the inner peripheral surface of the lower mold side surface member 203. Stoppers 207 are fixed to both ends of the upper surface of the lower mold base member 201, respectively. The stopper 207 corresponds to at least a part of the “positioning mechanism” of the compression molding apparatus including the molding die 10. When the upper mold 100 and the lower mold 200 are clamped, the lower mold side surface member 203 comes into contact with the stopper 207, whereby the depth of the lower mold cavity 204 is held at a predetermined depth.

  The lower mold side surface member 203 further has an excess resin accommodating portion 205 that accommodates an excess resin that is not accommodated in the lower mold cavity 204 when the mold is clamped. The lower mold cavity 204 and the surplus resin container 205 are connected, and the resin can move. The lower mold 200 further includes a resin pressure member 206 that can move up and down with respect to the surplus resin container 205. The resin pressure member 206 is not particularly limited, but may be a resin pressure pin, for example. The resin pressure member 206 is connected to the lower mold base member 201 via the elastic member 211. The lower mold side member 203 has a through hole penetrating from the bottom surface of the surplus resin accommodating portion 205 to the lower surface (lower end) of the lower mold side member 203, and the resin pressure member 206 can move up and down in the through hole. Then, the resin pressurizing member 206 pressurizes the resin in the lower mold cavity 204 and the surplus resin accommodating portion 205.

  The upper mold 100 includes an upper mold base member (upper mold base block) 101, a substrate set part (upper mold substrate set part) 102, and an excess resin separation member (excess resin separation block) 103. The upper mold substrate setting portion 102 is fixed to the lower surface (lower end) of the upper mold base member 101. For example, a substrate can be fixed to the lower surface (lower end) of the upper mold substrate setting unit 102 by a substrate fixing member (not shown) or the like. The substrate fixing member is not particularly limited, and examples thereof include a clamp. The surplus resin separating member 103 is fixed to the lower surface (lower end) of the upper mold base member 101 via the elastic member 104, and can move up and down in a hole opened in the upper mold substrate setting portion 102. The surplus resin separating member 103 is disposed immediately above the surplus resin accommodating portion 205, and the surplus resin can be pressed by the surplus resin separating member 103.

  A compression molding method (a method for producing a compression molded product) using the compression molding apparatus of FIG. 1 can be performed, for example, as shown in the process cross-sectional views of FIGS.

  First, as shown in FIG. 2, the substrate 1 and the release film 2 are set on the mold 10. More specifically, it is as follows. That is, as illustrated, the substrate 1 is set on the lower surface of the upper mold substrate setting unit 102. At this time, for example, the substrate 1 may be transported to the position of the upper mold substrate setting unit 102 using a substrate transport mechanism (not shown). At this time, as shown in FIG. 2, at least a part of the end surface of the substrate 1 on the surplus resin housing portion 205 side is brought into contact with the surplus resin separation member 103. Thereby, the clearance gap between the edge part (end surface) by the side of the excess resin storage part 205 of the board | substrate 1 and the excess resin separation member 103 can be eliminated. Accordingly, resin leakage from the end surface of the substrate 1 on the surplus resin accommodating portion 205 side is suppressed or prevented. Therefore, it is possible to suppress or prevent the adhesion of the resin to the end portion (end surface) of the substrate 1 on the surplus resin housing portion 205 side. In order to bring the substrate 1 into contact with the excess resin separation member 103, for example, as described later, after the substrate 1 is transported, the substrate 1 is moved toward the excess resin separation member 103 by the substrate alignment mechanism (substrate alignment member). It may be applied (contacted). For example, the substrate alignment mechanism (substrate alignment member) may be provided in the mold 10 or the substrate conveyance mechanism. Further, as described above, the substrate 1 can be fixed (set) to the lower surface of the upper mold substrate setting portion 102 by a substrate fixing member (not shown) or the like. Further, for example, a substrate suction hole (not shown) is provided at an appropriate position on the lower surface of the upper mold substrate setting unit 102, and the inside of the substrate suction hole is sucked by a suction mechanism (a suction pump or the like, not shown). By reducing the pressure, the substrate 1 may be sucked and fixed to the lower surface of the upper mold substrate setting unit 102. An arbitrary number of one or more types of arbitrary components may be mounted on the lower surface of the substrate 1 or may not be mounted. Examples of the optional component include, but are not limited to, a chip, a wire, an electrode, and a capacitor (passive element). These parts may be resin-sealed by compression molding. On the other hand, the release film 2 is adsorbed (set) to the entire upper surface of the lower mold 200 (the upper surfaces of the lower mold bottom surface member 202, the lower mold side surface member 203, and the resin pressure member 206). As a result, the entire mold surfaces of the lower mold cavity 204 and the excess resin container 205 are covered with the release film 2. For example, suction holes (not shown) are provided at appropriate locations on the upper surface of the lower mold 200, and the suction holes (suction pump, etc., not shown) are sucked into the suction holes to reduce the pressure. The release film 2 may be adsorbed on the upper surface of the mold 200. The substrate 1 and the release film 2 may be transported to a position between the upper mold 100 and the lower mold 200 by a transport mechanism (not shown), and then set as shown in FIG. Good. The transport mechanism (substrate transport mechanism) for the substrate 1 is as described above.

  Next, as shown in FIG. 3, a resin material (granular resin) 20a is supplied (set) in the lower mold cavity 204 (resin material supply step). At this time, the resin material 20a is supplied slightly more than the amount required for compression molding (the amount corresponding to the target package thickness or package volume). In addition, although the resin material 20a is a granular resin in a figure, as above-mentioned, it is not limited to this. 2 and 3 show an example in which the resin material 20a is supplied (set) after the release film is set, the present invention is not limited to this. For example, in a state where the resin material 20a is placed on the release film 2, the transfer material (not shown) conveys the resin material 20a together with the release film 2 to a position between the upper mold 100 and the lower mold 200. Then, the resin material 20 a may be supplied (set) by adsorbing the release film 2 to the upper surface of the lower mold 200.

  Next, as shown in FIG. 4, the resin material (granular resin) 20a is melted to obtain a fluid resin (molten resin) 20b. The melting of the resin material 20a can be performed, for example, by heating (heating) the lower mold 200 with a heating mechanism (heater, not shown). For example, prior to the step of FIG. 3 (resin material supply step), the lower mold 200 may be heated (heated up) in advance. For example, instead of the lower mold 200 or in addition to the lower mold 200, the upper mold 100 may be heated (heated up) by a heating mechanism (heater, not shown). In this case, the upper mold 100 may be heated (heated up) prior to the process of FIG. 3 (resin material supply process).

  Next, as shown in FIGS. 5-7, the process (clamping process) of clamping the upper mold | type 100 and the lower mold | type 200 is performed. First, as shown in FIG. 5, the entire lower mold 200 is raised in the direction of the arrow X <b> 1, and the surplus resin separation member 103 and the surplus resin container 205 are brought into contact via the release film 2.

  Next, as shown by the arrow X2 in FIG. 6, the entire lower mold 200 is further raised. At this time, the excess resin separation member 103 is pushed up by the lower mold side member 203, and the elastic member 104 contracts. At this time, as shown in FIG. 6, the end portion of the substrate 1 on the surplus resin housing portion 205 side remains in contact with the surplus resin separation member 103. Thereby, it can suppress or prevent that resin adheres to the said edge part. On the other hand, the end portion of the substrate 1 opposite to the surplus resin housing portion 205 is sandwiched between the upper mold substrate setting portion 102 and the lower mold side member 203 as shown in FIG. At this time, the board | substrate 1 and the lower mold | type side surface member 203 do not contact directly, but contact | connect through the release film 2 as shown in the figure. Further, as shown in FIG. 6, in this state, a resin passage 205 a is formed between the lower mold cavity 204 and the surplus resin container 205. The fluid resin 20b can move between the lower mold cavity 204 and the surplus resin container 205 through the resin passage 205a.

  Further, as shown by an arrow X3 in FIG. 7, the lower mold base member 201 is further raised. At this time, since the lower mold side member 203 is in direct or indirect contact with the upper mold 100 as described above, it does not rise any further. On the other hand, the lower mold bottom member 202 and the resin pressure member 206 rise together with the lower mold base member 201, and the elastic members 208, 209, 210, and 211 contract. As shown in the figure, the stopper 207 contacts the lower mold side surface member 203, so that the lower mold base member 201 does not rise any further and is fixed at that position. Therefore, the depth of the lower mold cavity 204 is a predetermined depth. Retained. At this time, as shown, the lower mold cavity 204 is filled with the fluid resin 20b. At the same time, the surplus fluid resin 20b (surplus resin) flows into the surplus resin container 205 through the resin passage 205a, and is filled as the surplus fluid resin (surplus resin) 20c. At this time, the extension force of the elastic member 211 is transmitted to the resin pressure member 206, so that the resin pressure member 206 causes the fluid resin 20b in the lower mold cavity 204 and the fluid resin in the excess resin container 205 (surplus) Resin) 20c is pressurized. At this time, since the elastic member 211 can be expanded and contracted, the resin pressure member 206 can be moved up and down, whereby the capacity of the surplus resin container 205 can be changed. Therefore, even if the amount of resin in the surplus resin container 205 varies, it is possible to suppress or prevent the resin from being unfilled in the surplus resin container 205 (resin pressure is not applied). Thereby, for example, molding defects such as occurrence of unfilled resin (voids, chips, etc.) in the package can be suppressed or prevented.

  Further, as shown in FIGS. 8 to 10, a process of opening the upper mold 100 and the lower mold 200 (mold opening process) is performed. At this time, a process of separating the excess resin in the excess resin housing portion 205 from the resin cured in the lower mold cavity 204 (surplus resin separation process) is performed substantially simultaneously. First, as shown in FIG. 8, after the fluid resins 20b and 20c are cured (solidified) to be cured resins 20 and 20d, the lower mold base member 201 is lowered in the direction of the arrow X4. As shown in the figure, the cured resin (sealing resin) cured in the lower mold cavity 204 is indicated by reference numeral 20, and the excess resin cured at other locations (in the excess resin accommodating portion 205 and in the resin passage 205 a) , 20d. The fluidizing resins 20b and 20c are cured (solidified) when the fluidizing resins 20b and 20c are thermosetting resins. And 20c may be continued. When the fluid resins 20b and 20c are thermoplastic resins, for example, the fluid resins 20b and 20c can be solidified by stopping the heating of the mold 10 and leaving it for a while. Then, as the lower mold base member 201 descends, as shown in FIG. 8, the lower mold bottom surface member 202 and the resin pressure member 206 descend together with the lower mold base member 201, and from the bottom surface of the cured resin 20 and the cured excess resin 20 d. Torn apart.

  Next, as shown by an arrow X5 in FIG. 9, the entire lower mold 200 is further lowered. As a result, the lower mold side member 203 is separated from the cured resin 20 cured in the lower mold cavity 204. Accordingly, the surplus resin separation block 103 is lowered together with the lower mold 200 by the restoring force (extension force) of the elastic member 104. That is, the surplus resin separation block 103 is lowered relative to the upper mold 100. As a result, the cured surplus resin 20d is also lowered together with the lower mold 200 and the surplus resin separation block 103. At this time, as shown in the figure, the cured resin (sealing resin) 20 cured in the lower mold cavity 204 remains separated from the excess resin 20d because it remains fixed to the upper mold substrate set portion 102 together with the substrate 1. In this manner, the compression molded product (resin molded product) 30 formed from the cured resin (sealing resin, package) 20 and the substrate 1 can be separated from the surplus resin 20d.

  Then, as indicated by an arrow X6 in FIG. 10, the entire lower mold 200 is further lowered to a predetermined position (the same position as in FIGS. 1 to 4 and before the mold clamping). Thereby, the surplus resin 20d is separated from the surplus resin container 205. The cured surplus resin 20d may be removed from the mold 10 by separating (releasing) from the surplus resin separation block 103 and then transporting it to the outside of the mold 10 using a transport mechanism (not shown). Good. As described above, the compression molding method using the compression molding apparatus of FIG. 1 can be performed. This compression molding method is also a method for manufacturing the compression molded product 30.

  The compression molding apparatus and the compression molding method shown in FIGS. 1 to 10 can be changed as appropriate without departing from the spirit of the present invention. For example, although the example which sets the release film 2 to the lower mold | type 200 was shown in FIGS. 2-10, the compression molding method can also be implemented without using a release film.

  In the present invention, compression molding is used as the resin molding method.

  In general, compression molding and transfer molding are used as resin molding methods. Transfer molding has the advantage that the resin thickness (package thickness) of the resin molded product can be easily maintained because the amount of resin in the mold cavity during molding is easily kept constant. On the other hand, in transfer molding, since resin flows into the mold cavity during molding, the resin flow causes defective parts of the resin molded product (for example, deformation, cutting, contact, etc. of the wire), voids (bubbles), unfilled There is a risk of problems such as parts.

  In order to solve the problem of variation in resin amount (variation in package thickness) in compression molding, the following method can be considered. That is, a molding resin containing a surplus amount in addition to the amount necessary for compression molding is previously stored in the mold cavity of the compression mold. Then, at the time of compression molding (die clamping), the excess resin flows out from the mold cavity so that only the amount of the resin necessary for compression molding remains in the mold cavity. After the compression molding, the compression molded product (resin molded product) is removed from the mold together with the excess resin. Thereafter, the excess resin is separated from the compression molded product outside the mold. However, in this method, it is necessary to separately prepare a mechanism (process) for removing excess resin from the molded substrate in addition to the mold, so that the apparatus size of the compression molding apparatus becomes large or complicated. Moreover, in this method, the manufacturing process of the compression molded product becomes complicated due to the separation operation of the surplus resin. Furthermore, in this method, it is necessary to transport the compression molded product before separation from the surplus resin to the outside of the mold together with the surplus resin. In the compression molded product, for example, as shown in FIG. 27B described later, surplus resin is adhered to the outer periphery of the molded substrate. As a result, the size of the substrate viewed in plan is substantially larger by the surplus resin in the molded substrate than in the substrate before molding. That is, the substrate size changes substantially before and after molding. Thereby, for example, two substrate transport mechanisms are prepared, or a substrate transport mechanism having a variable size is prepared in one system. For this reason, the apparatus size of the compression molding apparatus further increases or becomes complicated.

  On the other hand, in the present invention, after the compression molding, the resin molded product and the excess resin can be separated in the molding die without taking out the resin molded product and the excess resin from the molding die. That is, according to the present invention, a compression molding method including a step of separating the excess resin can be easily performed. Thereby, as above-mentioned, it is possible to suppress the dispersion | variation in the thickness of a package (resin part in a resin molded product) simply. Further, according to the present invention, for example, it is possible to suppress or prevent a change in size when the substrate is viewed in plan between the substrate before molding and the molded substrate (compression molded product). According to this, it is not necessary to prepare two systems of substrate transport mechanisms or to prepare a substrate transport mechanism having a variable size in one system, and the configuration of the substrate transport mechanism can be simplified.

  11 (a) and 11 (b) show another example of a molding die in the compression molding apparatus of the present invention. In the figure, the same components as those in FIGS. 1 to 10 are denoted by the same reference numerals. As shown in the figure, this mold 10 a is the same as the mold 10 of FIGS. 1 to 10 except that it has an ejector pin 105. In FIG. 11, 210 of the elastic members 208, 209, and 210 connecting the lower mold side member 203 and the lower mold base member 201 is omitted. However, the present invention is not limited to this, and is similar to FIGS. The elastic member 210 may be provided.

  As shown in FIG. 11, the ejector pin 105 can move up and down in a through-hole penetrating from the upper end (upper surface) of the upper mold substrate setting portion 102 to the lower end (lower surface) of the surplus resin separating member 103. An ejector pin support member (brim) 106 is fixed to the upper end of the ejector pin 105. The upper mold base member 101 is partially cut out to form an accommodating portion for the ejector pin support member 106. The lower end (lower surface) of the ejector pin support member 106 is connected to the upper mold base member 101 and the upper mold substrate setting section 102 via the elastic member 107 at the bottom surface of the housing section. The ejector pin 105 passes through the elastic members 104 and 107.

  A compression molding method using the molding die 10a of FIG. 11 and a compression molding apparatus including the molding die 10a can be performed, for example, in the same manner as in FIGS. FIG. 11A shows a state after performing the same steps as in FIGS. That is, FIG. 11A shows a state where the entire lower mold 200 is lowered to a predetermined position as indicated by an arrow X6 in FIG. As illustrated, the cured excess resin 20 d is attached to the lower end (lower surface) of the excess resin separation member 103 in a state of being separated from the resin molded product 30. From this state, as shown in FIG. 11B, the ejector pin support member 106 is pushed down in the direction of the arrow Y1, and the ejector pin 105 is lowered. Thereby, as shown in the figure, the excess resin 20d can be pushed down and separated (released) from the excess resin separation member 103. The surplus resin 20d after being separated (released) from the surplus resin separation block 103 may be removed from the mold 10 by, for example, transporting it outside the mold 10 using a transport mechanism (not shown).

  In addition, although the example which does not use a release film was shown in FIG. 11, it is not limited to this, For example, you may use a release film similarly to FIGS.

  FIG. 12 shows still another example of the configuration of the molding die in the compression molding apparatus of the present invention. This mold 10b has two lower mold cavities and can compress and mold two substrates substantially simultaneously. More specifically, as shown in the figure, the molding die 10 b has two lower mold cavities 204, which are arranged on both sides with the surplus resin accommodating portion 205 interposed therebetween. The two lower mold cavities 204 are respectively connected to the surplus resin accommodating portion 205, and the resin can move between the lower mold cavity 204 and the surplus resin accommodating portion 205. Two substrates can be set by setting (fixing) the substrates on the lower surface (lower end) of the upper mold substrate setting portion 102 at positions just above the two lower mold cavities 204, respectively. Except for these, the mold 10b of FIG. 12 is the same as the mold 10 of FIGS.

  The usage method of the compression molding apparatus of FIG. 12 is not specifically limited, For example, it can use similarly to the compression molding apparatus of FIGS. According to the compression molding apparatus of FIG. 12, two substrates can be compression-molded substantially simultaneously, so that the compression molding method (a method for producing a compression-molded product) can be efficiently performed. 12 shows a state in which the granular resin 20a is supplied (set) in the lower mold cavity 204 without using a release film, but the present invention is not limited to this, and the mold release is performed in the same manner as in FIGS. A film may be used.

  13 to 15 schematically show a resin material supply process in another example of the compression molding method using the mold of Example 1 (FIGS. 1 to 10). In this example, in the resin material supply step (step of supplying the resin material into the mold cavity of the mold), in addition to supplying the resin material into the mold cavity, the surplus resin container resin material supply mechanism is used. Resin material is supplied to the surplus resin container.

  First, the substrate 1 and the release film 2 are set as in FIG. In this state, as shown in FIG. 13, two resin supply mechanisms 40 containing a resin material (granular resin) 20 a are inserted between the upper mold 100 and the lower mold 200. One of the two resin supply mechanisms 40 functions as a “mold cavity resin material supply mechanism” that supplies the resin material 20 a into the mold cavity 204, and the other supplies the resin material 20 a into the surplus resin container 205. It functions as a “surplus resin container resin material supply mechanism”. The resin supply mechanism 40 is comprised from the resin supply part 41 and the lower shutter 42 as shown in the figure. The resin supply unit 41 has a frame shape in which openings are formed at the upper end and the lower end. The opening at the lower end of the resin supply unit (frame) 41 is closed by a lower shutter 42. Accordingly, as shown in FIG. 13, the resin material 20 a can be accommodated in a space surrounded by the resin supply part (frame) 41 and the lower shutter 42.

  Next, as shown in FIG. 14, the lower shutter 42 is pulled (horizontally) in the directions of arrows a1 and a2 to open the lower end of the resin supply unit (frame) 41, thereby dropping the resin material 20a from the opening. . Thereby, as shown in the figure, the resin material 20a can be supplied (placed) in the lower mold cavity 204 and the excess resin container 205. Thereafter, when the two resin supply mechanisms 40 are withdrawn from between the upper mold 100 and the lower mold 200, the resin material 20a is supplied into the lower mold cavity 204 and the excess resin storage portion 205 as shown in FIG. It will be in the state. Thereafter, for example, compression molding can be performed by the same steps as in FIGS.

  If the resin material is supplied to the surplus resin container in addition to the mold cavity in the resin material supply step as in the present embodiment, the resin flow can be suppressed to a smaller level in the compression molding step. As a result, problems such as defective parts of the resin molded product (for example, wire deformation / cutting / contact, chip shift, etc.), voids (bubbles), unfilled portions, etc. can be more effectively suppressed or prevented. .

  In FIGS. 13 to 15, the resin material is supplied almost simultaneously using the “mold cavity resin material supply mechanism” and the “surplus resin container resin material supply mechanism”, but the method of supplying the resin material to the excess resin container is shown. Is not limited to this. For example, the order of supplying the resin material 20a to the lower mold cavity 204 and the surplus resin container 205 is substantially the same in FIGS. 13 to 15, but is not limited to this, and either one may be first. Moreover, although the two resin supply mechanisms 40 are used in FIGS. 13-15, it is not limited to this. For example, only one resin supply mechanism 40 may be used, and thereby the resin material 20a may be supplied to the lower mold cavity 204 and the surplus resin container 205 over time rather than substantially simultaneously.

  Further, for example, in the resin material supply step in the compression molding method (FIGS. 2 to 10) of the first embodiment, a resin supply mechanism 40 including a resin supply unit 41 and a lower shutter 42 as in FIGS. 13 to 15. May be used.

  16 to 18 show still another example of a molding die in the compression molding apparatus of the present invention. 16-18, the same component as FIGS. 1-15 (Examples 1-4) is shown with the same code | symbol.

  1 to 15 (Examples 1 to 4), when the upper mold 100 and the lower mold 200 are clamped, at least a part of the end surface of the substrate 1 on the side of the surplus resin accommodating portion 205 is surplus resin separating member 103. It is an example which contacts. On the other hand, in the molding die of this example shown in FIGS. 16 to 18, at the time of clamping the upper die 100 and the lower die 200, at least a part of the end surface on the surplus resin accommodating portion 205 side of the substrate 1 contacts the lower die 200. To do. Thereby, resin leakage from the end surface of the substrate 1 on the surplus resin housing portion 205 side is suppressed or prevented.

  As shown in the sectional view of FIG. 16, in this mold 10c, the configuration of the upper mold 100 is the same as that in FIGS. 1 to 10 (Example 1). Moreover, the lower mold | type 200 is the same as FIGS. 1-10 (Example 1) except that the lower mold | type side surface member 203 has a level | step difference. The step of the lower mold side member 203 is provided at a position (position in the middle of the resin passage 205a) just below the boundary between the upper mold substrate set portion 102 and the excess resin separation member 103 as shown in the figure. The side is higher. Further, FIG. 16 shows that the substrate 1 is set on the lower surface of the upper mold substrate setting section 102 and the upper surface of the lower mold 200 (the upper surfaces of the lower mold bottom surface member 202, the lower mold side surface member 203 and the resin pressure member 206) as a whole. In this state, the release film 2 is adsorbed (set). The substrate 1 and the release film 2 can be set in the same manner as in Example 1. However, in FIG. 16, as shown in the figure, the substrate 1 is not brought into close contact with the surplus resin separating member 103, and a gap is formed by the thickness of the release film 2.

  FIG. 17 shows a state in which the lower mold 200 is shown in a side view in the mold 10c of FIG. As described with reference to FIG. 16, the surplus resin container 205 side end surface 221 of the substrate 1 is not in close contact with the surplus resin separation member 103, and is provided with a gap corresponding to the thickness of the release film 2. The release film 2 is adsorbed (set) on the entire upper surface of the lower mold 200 including the step 222 of the lower mold side member 203.

  FIG. 18 shows a state in which the mold 10c of FIGS. 16 and 17 is clamped. In FIG. 18, for convenience of illustration, the upper mold 100 is shown in a sectional view, and the lower mold 200 is shown in a side view. As shown in FIG. 18, in a portion 223 where the end surface 221 on the surplus resin accommodating portion 205 side and the step 222 of the lower mold side surface member 203 are in contact, a part of the end surface on the surplus resin accommodating portion 205 side of the substrate 1 (resin passage 205 a It is indirectly in contact with the surplus resin separation member 103 via the release film 2. Thereby, resin leakage from the end surface of the substrate 1 on the surplus resin accommodating portion 205 side can be suppressed or prevented.

  16 to 18 show an example in which at least a part of the end surface of the substrate 1 on the surplus resin housing portion 205 side is in contact with the lower mold 200 indirectly through the release film 2. However, the present invention is not limited to this. For example, at least a part of the end surface of the substrate 1 on the surplus resin container 205 side may be directly brought into contact with the lower mold 200 without using the release film 2. In addition, the configuration of the mold 10c can be variously changed. For example, the molding die 10c may have an ejector pin similarly to the molding die 10a of the second embodiment (FIG. 11), or the lower mold cavity 204 similarly to the molding die 10b of the third embodiment (FIG. 12). You may have two.

  Moreover, the compression molding method using the compression molding apparatus including the molding die 10c is not particularly limited, but can be performed, for example, in the same manner as in the above embodiments.

  Next, still another example of the present invention will be described.

  In the compression molding method and the compression molding product manufacturing method of the present invention, as described above, the substrate may be brought close to the excess resin separating member and brought into contact with (contact with) the substrate gathering mechanism (substrate gathering member). Specifically, for example, the substrate alignment mechanism (substrate alignment member) may be provided in a mold or a substrate transport mechanism. In the present embodiment, an example of the substrate alignment mechanism (substrate alignment member) and a substrate alignment process using the mechanism will be described.

  19 to 24 show a substrate alignment mechanism (substrate alignment member) and a substrate alignment process using the substrate alignment mechanism in this embodiment. These steps can be said to be an example of a substrate setting method for setting a substrate in the compression molding apparatus of the present invention. 19 to 24, the lower mold 200 is not shown for the sake of simplicity and clarity.

  First, as shown in FIG. 19, the substrate transport mechanism (substrate loader) 300 on which the substrate 1 is placed is moved in the direction of the arrow Z1 (horizontally) to transport the substrate 1. Then, as shown in the drawing, in order to set the substrate on the upper mold 100, the substrate loader 300 is caused to enter the molding mold (position between the upper mold 100 and the lower mold). In addition, although illustration is abbreviate | omitted as above-mentioned about a lower mold | type, it may be the same as that of each said Example, for example. As illustrated, the substrate loader 300 includes a base member 301, a substrate mounting portion 302, and a substrate alignment mechanism (substrate alignment member) 303 as main components. The substrate mounting portion 302 protrudes from a part of the upper surface of the base member 301, and can place the substrate 1 and can move up and down. A substrate alignment mechanism (substrate alignment member) 303 is attached to one end of the upper surface of the base member 301. A part of the substrate moving mechanism 303 is movable in the horizontal direction, and by pressing the substrate 1, the substrate 1 can be moved in the pressed direction.

  Next, as shown in FIG. 20, the substrate mounting portion 302 is moved up to bring the substrate 1 into close contact with the lower surface of the upper mold substrate setting portion 102.

  Further, as shown in FIG. 21, the substrate 1 is temporarily fixed to the lower surface of the upper mold substrate setting portion 102, and the substrate mounting portion 302 is moved downward to be separated from the substrate 1. For temporary fixing of the substrate 1, for example, a substrate fixing member (not shown, for example, a clamp or the like) may be used.

  Then, as shown in FIG. 22, a part of the substrate shifting mechanism 303 is moved horizontally in the direction of the substrate 1 and the excess resin separating member 103 so as to be in close contact with the substrate 1.

  Next, as shown in FIG. 23, part of the substrate shifting mechanism 303 is further moved in the direction of the excess resin separating member 103. Thereby, as shown in the drawing, the substrate 1 is pushed toward the surplus resin separating member 103 and brought into close contact (contact) with the surplus resin separating member 103. Then, the substrate 1 is fixed to the lower surface of the upper mold substrate setting unit 102. For example, a substrate fixing member (not shown, for example, a clamp) may be used to fix the substrate 1. Further, for example, a substrate suction hole (not shown) is provided at an appropriate position on the lower surface of the upper mold substrate setting unit 102, and the inside of the substrate suction hole is sucked by a suction mechanism (a suction pump or the like, not shown). By reducing the pressure, the substrate 1 may be sucked and fixed to the lower surface of the upper mold substrate setting unit 102.

  Further, the substrate loader 300 is moved (horizontally) in the direction of the arrow Z2 shown in FIG.

  As described above with reference to FIGS. 19 to 24, the substrate transporting step and the substrate approaching step can be performed. In the present invention, the substrate conveyance mechanism, the substrate alignment mechanism, the substrate conveyance step, and the substrate alignment step are not limited to the description of FIGS. 19 to 24 and can be arbitrarily changed. Moreover, in this invention, a board | substrate conveyance process and a board | substrate approach process are not essential processes, but are arbitrary. Further, the steps other than the substrate transporting step and the substrate approaching step in the compression molding method (compression molding product manufacturing method) of the present invention are not particularly limited, but can be performed as described in the above embodiments, for example. .

  The plan view of FIG. 25 schematically shows the configuration of another example of the compression molding apparatus of the present invention. As illustrated, the compression molding apparatus 1000 includes a molding unit 1100, a substrate supply unit 1200, a resin material supply unit 1300, and a control unit 1400. The substrate supply unit 1200 and the resin material supply unit 1300 are arranged on opposite sides of the molding unit 1100. A substrate supply mechanism 1210 is disposed in the substrate supply unit 1200. A resin material supply mechanism 1310 is arranged in the resin material supply unit 1300. The controller 1400 is disposed in the substrate supply unit 1200. A molding die (not shown) is arranged in the molding unit 1100. The said shaping | molding die is not specifically limited except having the characteristic as a shaping | molding die in the compression molding apparatus of this invention, It is arbitrary. For example, the mold may be the mold 10 of Example 1 (FIGS. 1 to 10), the mold 10a of Example 2 (FIG. 11), the mold 10b of Example 3 (FIG. 12), or Example 5 (FIG. It may be the same as the mold 10c of FIGS.

  The compression molding apparatus of FIG. 25 can be used for the compression molding method or the compression molding product manufacturing method of the present invention. Although the specific usage method is not specifically limited, For example, it can use for the compression molding method demonstrated in Examples 1-4, or the manufacturing method of a compression molded product.

  More specifically, the compression molding apparatus of FIG. 25 can be used as follows, for example. For example, a substrate for compression molding can be placed in the substrate supply mechanism 1210 in the substrate supply unit 1200, and the substrate can be supplied to the mold. For example, the substrate may be transported to the position of the mold by a substrate transport mechanism (not shown). The substrate transport mechanism may be disposed in the substrate supply unit 1200, for example. In addition, a resin material can be placed in the resin material supply mechanism 1310 in the resin material supply unit 1300, and the resin material can be supplied into the mold cavity of the mold (resin material supply process). For example, the resin material may be transported to the position of the mold by a resin material transport mechanism (not shown). What is necessary is just to arrange | position the said resin material conveyance mechanism in the resin material supply unit 1300, for example. The said resin material conveyance mechanism may convey a resin material using the resin supply mechanism 40 demonstrated in Example 4 (FIGS. 13-15), for example.

  Further, the control unit 1400 controls part or all of the operation of the compression molding apparatus 1000 of FIG. The operation controlled by the control unit 1400 may be, for example, part or all of the steps in the compression molding method or compression molding product manufacturing method of the present invention. For example, one or both of mold clamping and mold opening of the molding die may be performed. A process may be included. For example, the mold clamping may be controlled by the control unit 1400, and the depth of the mold cavity at the time of mold clamping may be held at a predetermined depth. In this case, the control unit 1400 functions as at least a part of the “positioning mechanism” in the compression molding apparatus of the present invention. The “positioning mechanism” may use, for example, a stopper fixed to the base member as described in the first to fourth embodiments, in addition to the mold clamping control by the control unit. Furthermore, the operation controlled by the control unit 1400 includes, for example, substrate supply to the mold by the substrate supply unit 1200 (substrate supply process), and resin material into the mold cavity of the mold by the resin material supply unit 1300. The supply (resin material supply step) may or may not be included.

  Further, the arrangement of the molding unit 1100, the substrate supply unit 1200, the resin material supply unit 1300, and the control unit 1400 is not limited to the arrangement shown in FIG. Furthermore, although the number of the forming units 1100 is three in FIG. 25, the number is not limited to this and is arbitrary, and may be one, two, or four or more. When a plurality of molding units 1100 are provided as shown in FIG. 25, for example, a plurality of substrates can be compression-molded substantially simultaneously, and compression molding efficiency is good. Alternatively, for example, after one surface of the substrate is compression-molded by one molding unit 1100, the other surface of the substrate can be compression-molded by another molding unit 1100. That is, it can cope with compression molding on both sides of the substrate.

  Furthermore, the compression molding apparatus 1000 of FIG. 25 may or may not have any other unit or mechanism not shown. Examples of the other arbitrary unit or mechanism include a release film supply unit that supplies a release film to a mold. The release film supply unit may include, for example, a release film supply mechanism in which the release film is disposed, and a release film transport mechanism that transports the release film to the position of the mold.

  Below, the example of the form of the excess resin at the time of manufacturing the compression molded product by this invention is demonstrated.

  Each of the plan views of FIGS. 26 (a) to 26 (c) shows an example of the configuration of the compression molded product and surplus resin produced according to the present invention. As shown in FIGS. 26A to 26C, the states before the excess resin is separated from the resin molded product including the substrate 1 and the cured resin 20 (for example, the state of FIG. 8 in the first embodiment). Represents. As illustrated, in each of FIGS. 26A to 26C, one surface of the substrate 1 is resin-sealed with a cured resin 20 except for its peripheral edge. Further, the cured surplus resin 20 d is connected to the cured resin 20 and protrudes from the outer periphery of the substrate 1. FIG. 26A shows a form in which the excess resin 20 d protrudes from one side of the substrate 1. FIG. 26B shows a form in which the excess resin 20 d protrudes from the left and right sides of the substrate 1. FIG. 26 (c) shows an example in which two compression molded products are connected to each other through the surplus resin 20d at the respective cured resin 20 portions. Fig.26 (a) can be manufactured using the shaping | molding die of Example 1 (FIGS. 1-10), for example. FIG. 26B can be manufactured using, for example, a mold (not shown) in which surplus resin containing portions are arranged on both the left and right sides of the mold cavity. FIG.26 (c) can be manufactured using the shaping | molding die of Example 3 (FIG. 12), for example.

  FIGS. 27A to 27C show an example of the configuration of the compression molded product and surplus resin that can be produced by the present invention or a general resin molding method.

  Fig.27 (a) shows an example of the structure of the resin molded product which can be manufactured with a general resin molding method. In the resin molded product of the figure, one surface of the substrate 1 is resin-molded with a cured resin 20. The cured resin 20 includes excess resin at the peripheral edge. The surplus resin does not protrude from the outer periphery of the substrate 1. The surplus resin is not separated from the resin molded product and constitutes a part of the resin molded product (product).

  FIG. 27B shows another example of the configuration of a resin molded product that can be manufactured by a general resin molding method. In the resin molded product of the figure, one surface of the substrate 1 is resin-molded with a cured resin 20. An excess resin 20 d is connected to the outer periphery of the cured resin 20. The surplus resin 20 d protrudes from the outer periphery of the substrate 1. The excess resin 20d is separated from the resin molded product after the resin molded product in FIG. 27B is removed (released) from the mold.

  FIG. 27 (c) shows an example of the configuration of a resin molded product (compression molded product) that can be manufactured according to the present invention. The configuration of the resin molded product in the figure is the same as that in FIG. 26B except that the horizontal direction on the paper surface and the vertical direction on the paper surface are reversed.

  When a substrate is molded by a general resin molding method to produce a resin molded product (for example, a resin-encapsulated electronic component in which the chip on the substrate is resin-sealed), there are the following problems.

  In the molding die, when the surplus resin container is set at a position inside the substrate, for example, as shown in FIG. 27A, surplus resin that cannot be separated from the resin molded product (product) exists inside the substrate. . In this case, the product area (package area) of the substrate is reduced, and the number of products per substrate (the number of electronic components that can be mounted on the substrate) is reduced.

  On the other hand, in the molding die, when the surplus resin accommodating portion is set at a position outside the substrate, the surplus resin adheres to the outer periphery of the molded substrate, for example, as shown in FIG. As a result, the size of the substrate viewed in plan is substantially larger by the surplus resin in the molded substrate than in the substrate before molding. That is, the substrate size changes substantially before and after molding. Thereby, for example, two substrate transport mechanisms are prepared, or a substrate transport mechanism having a variable size is prepared in one system. For this reason, the apparatus size of a compression molding apparatus becomes large or complicated. Further, since it is necessary to prepare a mechanism (process) for removing excess resin from the molded substrate in addition to the mold, the size of the compression molding apparatus becomes large or complicated. Moreover, the process in the compression molding method becomes complicated.

  However, according to the present invention, the surplus resin can be removed from the molded substrate in the mold even if the surplus resin container is set at a position outside the substrate. For this reason, it can prevent or suppress efficiently that the apparatus size of a compression molding apparatus becomes large or becomes complicated. Further, as described above, it is possible to easily suppress variation in package thickness.

  In the present invention, the configurations of the compression molded product and the surplus resin are not limited to those shown in FIGS. 26 (a) to 26 (c) and FIG. 27 (c), and are arbitrary, for example, as shown in FIG. 27 (b). Etc. However, it is preferable that the compression molded product and the excess resin be easily separated in the mold.

  Furthermore, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Release film 10, 10a, 10b Mold 20a Granule resin 20b Molten resin (flowable resin)
20c Molten (fluid) surplus resin 20d Cured surplus resin 20 Cured resin (sealing resin, package)
30 Compression Molded Product 40 Resin Supply Mechanism 41 Resin Supply Unit 42 Lower Shutter 100 Upper Mold 101 Upper Mold Base Member (Upper Base Block)
102 Upper mold substrate set part 103 Surplus resin separation member (surplus resin separation block)
104 Elastic member 105 Ejector pin 106 Ejector pin support member 107 Elastic member 200 Lower mold 201 Base member (lower mold base member, lower mold base block)
202 Bottom member (lower die bottom member)
203 Side member (lower die side member)
204 mold cavity (lower mold cavity)
205 Excess resin housing portion 205a Resin passage 206 Resin pressure member (resin pressure pin)
207 Stopper (positioning mechanism)
208, 209, 210, 211 Elastic member 221 End surface of surplus resin container 205 side of substrate 1 222 Step 223 of lower mold side member 203 223 221 and 222 contact portion 300 Substrate transport mechanism (substrate loader)
301 Base member 302 Substrate mounting portion 303 Substrate alignment mechanism (Substrate alignment member)
1000 Compression molding apparatus 1100 Molding unit 1200 Substrate supply unit 1210 Substrate supply mechanism 1300 Resin material supply unit 1310 Resin material supply mechanism 1400 Control unit (positioning mechanism)
X1 to X6 Arrows representing the movement direction of the lower die 200 Y1 Arrows representing the movement direction of the ejector pin 105 Z1, Z2 Arrows representing the movement direction of the substrate loader 300 a1, a2 Arrows representing the movement direction of the lower shutter 42

Claims (10)

Including molds,
The mold is
Upper mold,
With the lower mold,
Mold cavity to which resin material is supplied;
A positioning mechanism for holding the depth of the mold cavity at a predetermined depth during mold clamping;
A surplus resin container for accommodating surplus resin that is not accommodated in the mold cavity at the time of mold clamping;
An excess resin separating member,
Of the upper mold and the lower mold, one mold has the mold cavity, and the other mold is a mold to which the substrate is fixed.
At the time of clamping the upper mold and the lower mold, at least a part of the end surface of the substrate on the surplus resin accommodating portion side is in direct or indirect contact with the surplus resin separating member or the one mold, Resin leakage from the end face of the substrate is suppressed or prevented,
After the resin in the mold cavity and the surplus resin are cured, the surplus resin separating member is raised or lowered relative to one or both of the upper mold and the lower mold so that the inside of the mold cavity The compression molding apparatus is characterized in that the resin cured in step (b) is separated from the surplus resin cured in the surplus resin container.   2. The substrate end face and the one mold can be brought into contact with each other through the mold release film when the mold is clamped by bringing a mold release film into close contact with the mold surface of the one mold. Compression molding equipment. The one mold has a bottom member and a side member,
The bottom member is fixed to a base member;
The side member is connected to the base member via an elastic member,
The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
The positioning mechanism includes a stopper fixed to the base member;
The compression molding apparatus according to claim 1 or 2, wherein when the upper mold and the lower mold are clamped, the side surface member comes into contact with the stopper, whereby the depth of the mold cavity is held at a predetermined depth. And a control unit for controlling the operation of the mold.
The one mold has a bottom member and a side member,
The bottom member is fixed to a base member;
The side member is connected to the base member via an elastic member,
The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
The positioning mechanism includes the control unit;
When the upper mold and the lower mold are clamped, one or both of the ascending position and the descending position of one or both of the upper mold and the lower mold are controlled by the control unit, so that the mold cavity The compression molding apparatus according to any one of claims 1 to 3, wherein the depth is held at a predetermined depth. Furthermore, it has a resin pressure member that can move up and down with respect to the surplus resin container,
The compression molding apparatus as described in any one of Claim 1 to 4 with which the resin in the said mold cavity and the said excess resin accommodating part is pressurized by the said resin pressurization member.   Furthermore, the compression molding apparatus as described in any one of Claim 1 to 5 which has a surplus resin accommodating part resin material supply mechanism which supplies a resin material to the said surplus resin accommodating part. A resin material supply step of supplying a resin material into a mold cavity of one of the upper mold and the lower mold of the mold;
A substrate fixing step of fixing a substrate to the other of the upper mold and the lower mold;
A mold clamping step of clamping the upper mold and the lower mold of the mold;
A surplus resin housing step of housing surplus resin that is not housed in the mold cavity in the mold clamping step;
A mold opening step of opening the upper mold and the lower mold;
A surplus resin separation step of separating the surplus resin from the resin cured in the mold cavity,
In the mold clamping step, at least part of the end surface of the substrate on the surplus resin housing portion side is brought into direct or indirect contact with the surplus resin separating member or the one mold, thereby preventing resin leakage from the substrate end surface. Suppress or prevent,
The surplus resin separation step is performed by raising or lowering the surplus resin separation member relative to one or both of the upper mold and the lower mold after the resin in the mold cavity and the surplus resin are cured. A compression molding method characterized by the above. The molding die further has a resin pressure member that can move up and down with respect to the surplus resin container,
The compression molding method according to claim 7, wherein, in the mold clamping step, the resin in the mold cavity and the excess resin container is pressurized by the resin pressing member.   The compression molding method according to claim 7 or 8, wherein in the resin material supply step, a resin material is also supplied to the surplus resin container.   A method for producing a compression-molded article, wherein the resin is compression-molded by the compression molding method according to any one of claims 7 to 9.

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