JP2018085636A - Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic device, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure, an ultrasonic device, an ultrasonic probe, an ultrasonic device, and an electronic device, which can increase an aspect ratio of a resin protrusion on which wiring is formed.SOLUTION: An ultrasonic device 22 includes: an element substrate 41; a sealing plate 42 corresponding to the substrate; an acoustic layer 43; and a protective film 44. The sealing plate 42 is provided with a groove portion 421, a conductive portion 5, a through electrode 424, and a lower electrode wiring line 425. The mounting structure includes; a semiconductor substrate 420A and an insulating layer 420B provided with the groove portion 421; and the conductive portion 5.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a mounting structure, an ultrasonic device, an ultrasonic probe, an ultrasonic apparatus, and an electronic apparatus.

  When mounting electronic components on a circuit board, a mounting method is known in which wiring on the circuit board side and wiring on the electronic component side are electrically connected via bump electrodes (see, for example, Patent Document 1).

  In Patent Document 1, an electronic component is configured by providing an electronic element (functional element) such as an IC chip and a bump electrode connected to the functional element on a substrate. Among these, the bump electrode includes a wiring connected to an electrode pad drawn from the functional element, and a resin protrusion capable of elastic deformation. The conductive film is drawn from the functional element to the resin protrusion formed on the peripheral edge of the substrate, straddles the resin protrusion, and covers a part of the surface of the resin protrusion. On the other hand, the circuit board is a substrate on which a liquid crystal panel is formed, and electrode terminals are formed outside the region where the liquid crystal elements are arranged. The bump electrode on the electronic component side is brought into contact with the electrode terminal on the circuit board side and elastically deformed, whereby the bump electrode and the electrode terminal are electrically connected.

JP 2007-180166 A

  By the way, the resin protrusion as described in Patent Document 1 is formed in a substantially hemispherical shape by, for example, solidifying the resin material provided on the substrate after heating and melting. That is, the resin protrusion is formed so as to gradually rise from the substrate surface as it goes toward the center in a plan view as viewed from the substrate thickness direction. Therefore, when forming the wiring over the resin protrusion from the substrate surface, for example, compared to the resin protrusion having a side surface substantially orthogonal to the substrate surface, the wiring can be easily formed at the boundary between the resin protrusion and the substrate, Wiring formation defects can be suppressed.

  However, when the resin material is heated and melted as described above, if the height of the resin protrusion (the dimension in the thickness direction) is increased, the planar dimension of the resin protrusion (the dimension in the direction parallel to the substrate surface) also increases. For this reason, there existed a subject that it was difficult to enlarge the aspect ratio (ratio of the height dimension with respect to a plane dimension) of the resin protrusion. In addition, since the aspect ratio cannot be increased, it is not easy to increase the integration of resin protrusions and thus to increase the integration of wiring.

  An object of the present invention is to provide a mounting structure, an ultrasonic device, an ultrasonic probe, an ultrasonic device, and an electronic apparatus that can increase the aspect ratio of a resin protrusion on which a wiring is formed.

  A mounting structure according to an application example of the present invention includes a substrate, a groove formed on one surface of the substrate, a resin protrusion provided in the groove, a wiring provided from the substrate to the resin protrusion, It is characterized by providing.

In this application example, the resin protrusion is provided in a groove formed on the substrate. In such a configuration, for example, the aspect ratio of the resin protrusion can be increased as compared with a structure in which the resin protrusion is provided on the flat surface of the substrate. That is, as described above, when the resin protrusion is formed by heating and melting and solidifying on the flat surface of the substrate, the resin protrusion expands along the flat surface, for example, becomes substantially hemispherical. On the other hand, by providing the resin protrusion in the groove portion, it is possible to suppress the resin material that has been heated and melted from spreading in the planar direction, and the aspect ratio of the resin protrusion can be increased.
In addition, the planar shape of the resin protrusion in a plan view can be a shape corresponding to the shape of the groove. Therefore, it is easy to form resin protrusions having desired planar dimensions and height dimensions in desired areas, and as a result, the resin protrusions and wirings can be highly integrated.

In the mounting structure according to this application example, it is preferable that the groove portion is open on the one surface of the substrate, has an opening edge that forms the opening, and the resin protrusion is in contact with the opening edge.
In this application example, no gap is formed between the resin protrusion and the substrate at the opening edge that is the boundary position between the resin protrusion and the substrate. Therefore, when forming the wiring from the substrate to the resin protrusion, the formation of the wiring due to the gap does not occur, and the wiring can be appropriately formed at the boundary position.

In the mounting structure according to this application example, it is preferable that the groove inner surface of the groove is curved in a concave shape.
In this application example, the resin protrusion can be held by the inner surface of the groove that curves in a concave shape. For example, when the resin projection is formed by heating and melting the resin material, the melted resin material can be stably held in the groove portion.

In the mounting structure according to this application example, it is preferable that the mounting structure includes a wall portion surrounding the groove and the resin protrusion in a plan view as viewed from the thickness direction of the substrate.
In this application example, the resin protrusion is provided in the recess formed on the one surface side of the substrate by the groove and the wall. In such a configuration, the wall portion can more reliably suppress the molten resin material from spreading along one surface of the substrate. For example, the height of the resin protrusion can be increased by increasing the volume of the resin material. However, in the configuration in which the wall portion is not formed, if the volume of the resin material exceeds an allowable amount with respect to the volume of the groove portion, the molten resin material may spread to the outside of the groove portion. On the other hand, by providing the wall portion, the resin protrusion can be provided in the concave portion having a volume larger than that of the groove portion, and the expansion of the resin material can be more reliably suppressed. Moreover, the tolerance of the volume of the resin material can be increased, and the height of the resin material can be further increased.

In the mounting structure according to this application example, it is preferable that the wall portion has a top surface opposite to the substrate in the thickness direction, and the resin protrusion is in contact with an inner peripheral edge of the top surface.
In this application example, no gap is formed between the resin protrusion and the wall portion at the inner peripheral edge that is the boundary position between the resin protrusion and the wall portion. Therefore, when the wiring is formed from the substrate to the resin protrusion so as to straddle the wall portion, the formation of the wiring due to the gap does not occur, and the wiring can be appropriately formed at the boundary position.

In the mounting structure according to this application example, it is preferable that the wall portion has an inner surface on the groove portion side in a plan view in the thickness direction of the substrate, and the inner surface is curved in a concave shape.
In this application example, the resin protrusion is held by the inner side surface of the wall portion curved in a concave shape. For this reason, for example, when the resin projection is formed by heating and melting the resin material, the melted resin material can be stably held in the groove.

In the mounting structure according to this application example, the wall portion includes a top surface opposite to the substrate in the thickness direction, and an outer surface opposite to the groove portion in the plan view, and the outer surface. It is preferable to have an inclined portion that inclines toward the outside in the plan view as it goes from the top surface to the substrate and in which the wiring is formed.
In this application example, the top surface of the wall portion and one surface of the substrate are connected by the inclined portion of the outer surface, and the dimension in the thickness direction of the wall portion gradually decreases toward the outside in the planar direction. For this reason, when the wiring is formed from one surface to the top surface of the wall portion, it is possible to avoid the wiring from being formed across the step in the thickness direction, and the wiring can be more appropriately formed.

In the mounting structure according to the application example, the wiring structure includes a base wiring that is provided from the groove portion side of the wall portion to the opposite side of the groove portion and covers at least a part of the wall portion in the plan view. Is preferably provided in the base wiring at a position overlapping the wall in the plan view.
In this application example, the base wiring is formed so as to cover at least a part of the wall portion from the groove portion side to the opposite side thereof, that is, the inside and outside of the wall portion. The wiring is formed on the base wiring at a position overlapping the wall portion. In such a configuration, the wiring formed from the groove portion to the substrate is formed on the base wiring at the boundary position between the resin portion and the wall portion or on the wall portion at the boundary position between the wall portion and the substrate. . Thereby, it can suppress that a wiring breaks on each boundary position and a wall part, and can improve connection reliability.

  An ultrasonic device according to an application example of the present invention includes a substrate, a groove formed on one surface of the substrate, a resin protrusion provided in the groove, a wiring provided from the substrate to the resin protrusion, And an ultrasonic transducer electrically connected to the wiring.

In this application example, similarly to the piezoelectric device of the application example, the resin protrusion is provided in a groove formed on the substrate. In such a configuration, for example, compared to a configuration in which the resin protrusion is provided on the flat surface of the substrate, the groove can suppress the resin material that has been heated and melted from spreading in the planar direction, and increase the aspect ratio of the resin protrusion. Can do.
In addition, the planar shape of the resin protrusion in a plan view can be a shape corresponding to the shape of the groove. Therefore, it is easy to form resin protrusions having desired planar dimensions and height dimensions in desired areas, and as a result, the resin protrusions and wirings can be highly integrated.

  An ultrasonic probe according to an application example of the present invention includes a substrate, a groove formed on one surface of the substrate, a resin protrusion provided in the groove, and a wiring provided from the substrate to the resin protrusion. And an ultrasonic transducer that is electrically connected to the wiring, and a housing that houses the ultrasonic device.

In this application example, similarly to the piezoelectric device of the application example, the resin protrusion is provided in a groove formed on the substrate. In such a configuration, for example, compared to a configuration in which the resin protrusion is provided on the flat surface of the substrate, the groove can suppress the resin material that has been heated and melted from spreading in the planar direction, and increase the aspect ratio of the resin protrusion. Can do.
In addition, the planar shape of the resin protrusion in a plan view can be a shape corresponding to the shape of the groove. Therefore, it is easy to form resin protrusions having desired planar dimensions and height dimensions in desired areas, and as a result, the resin protrusions and wirings can be highly integrated.

  An ultrasonic device according to an application example of the present invention includes a substrate, a groove formed on one surface of the substrate, a resin protrusion provided in the groove, a wiring provided from the substrate to the resin protrusion, An ultrasonic transducer electrically connected to the wiring, and a control unit that controls the ultrasonic transducer are provided.

In this application example, similarly to the piezoelectric device of the application example, the resin protrusion is provided in a groove formed on the substrate. In such a configuration, for example, compared to a configuration in which the resin protrusion is provided on the flat surface of the substrate, the groove can suppress the resin material that has been heated and melted from spreading in the planar direction, and increase the aspect ratio of the resin protrusion. Can do.
In addition, the planar shape of the resin protrusion in a plan view can be a shape corresponding to the shape of the groove. Therefore, it is easy to form resin protrusions having desired planar dimensions and height dimensions in desired areas, and as a result, the resin protrusions and wirings can be highly integrated.

  An electronic apparatus according to an application example of the present invention includes a substrate, a groove formed on one surface of the substrate, a resin protrusion provided in the groove, a wiring provided from the substrate to the resin protrusion, A functional element electrically connected to the wiring, and a control unit that controls the functional element are provided.

In this application example, similarly to the piezoelectric device of the application example, the resin protrusion is provided in a groove formed on the substrate. In such a configuration, for example, compared to a configuration in which the resin protrusion is provided on the flat surface of the substrate, the groove can suppress the resin material that has been heated and melted from spreading in the planar direction, and increase the aspect ratio of the resin protrusion. Can do.
In addition, the planar shape of the resin protrusion in a plan view can be a shape corresponding to the shape of the groove. Therefore, it is easy to form resin protrusions having desired planar dimensions and height dimensions in desired areas, and as a result, the resin protrusions and wirings can be highly integrated.

1 is a perspective view showing a schematic configuration of an ultrasonic measurement apparatus according to a first embodiment. 1 is a block diagram showing a schematic configuration of an ultrasonic measurement apparatus according to a first embodiment. 1 is a cross-sectional view showing a schematic configuration of an ultrasonic device according to a first embodiment. The top view which shows schematic structure of the element board | substrate in the ultrasonic device of 1st Embodiment. The top view which shows schematic structure of the sealing plate in the ultrasonic device of 1st Embodiment. Sectional drawing which shows schematic structure of the sealing plate in the ultrasonic device of 1st Embodiment. The top view which shows schematic structure of the sealing plate in the ultrasonic device of 1st Embodiment. Sectional drawing which shows schematic structure of the sealing board which concerns on a comparative example. Sectional drawing which shows schematic structure of the sealing board in the ultrasonic device of 2nd Embodiment. The top view which shows schematic structure of the sealing board in the ultrasonic device of 2nd Embodiment. Sectional drawing which shows schematic structure of the sealing board in the ultrasonic device of 2nd Embodiment. The top view which shows schematic structure of the sealing board in the ultrasonic device of 2nd Embodiment. Sectional drawing which shows schematic structure of the sealing plate which concerns on the modification 1. FIG. Sectional drawing which shows schematic structure of the sealing plate which concerns on the modification 2. As shown in FIG. The top view which shows schematic structure of the sealing plate which concerns on the modification 3. FIG. The top view which shows schematic structure of the sealing plate which concerns on the modification 4. FIG. The top view which shows schematic structure of the sealing plate which concerns on the modification 5. FIG. Sectional drawing which shows schematic structure of the sealing plate which concerns on the modification 6. As shown in FIG.

[First Embodiment]
Hereinafter, the ultrasonic measurement apparatus according to the first embodiment will be described with reference to the drawings.
FIG. 1 is a perspective view showing a schematic configuration of the ultrasonic measurement apparatus 1. FIG. 2 is a block diagram showing a schematic configuration of the ultrasonic measurement apparatus 1.
The ultrasonic measurement device 1 corresponds to an ultrasonic device, and includes an ultrasonic probe 2 and a control device 10 electrically connected to the ultrasonic probe 2 via a cable 3 as shown in FIG. .
The ultrasonic measurement apparatus 1 causes an ultrasonic probe 2 to abut on the surface of a living body (for example, a human body), and transmits ultrasonic waves from the ultrasonic probe 2 into the living body. In addition, the ultrasonic wave reflected by the organ in the living body is received by the ultrasonic probe 2, and based on the received signal, for example, an internal tomographic image in the living body is obtained, or the state of the organ in the living body (for example, Blood flow etc.).

[Configuration of control device]
The control device 10 corresponds to a control unit, and includes, for example, an operation unit 11, a display unit 12, a storage unit 13, and a calculation unit 14, as illustrated in FIG. For example, the control device 10 may be a terminal device such as a tablet terminal, a smartphone, or a personal computer, or may be a dedicated terminal device for operating the ultrasonic probe 2.
The operation unit 11 is a UI (user interface) for a user to operate the ultrasonic measurement apparatus 1 and can be configured by a touch panel provided on the display unit 12, operation buttons, a keyboard, a mouse, and the like.
The display unit 12 is configured by a liquid crystal display, for example, and displays an image.
The storage unit 13 stores various programs and various data for controlling the ultrasonic measurement apparatus 1.
The arithmetic unit 14 is configured by an arithmetic circuit such as a CPU (Central Processing Unit) and a storage circuit such as a memory. Then, the calculation unit 14 reads and executes various programs stored in the storage unit 13, thereby generating a transmission signal for causing the ultrasonic probe 2 to transmit ultrasonic waves and controlling output processing. Control of various processes (for example, frequency setting and gain setting of a received signal) for causing 2 to receive ultrasonic waves is performed.

[Configuration of ultrasonic probe]
The ultrasonic probe 2 corresponds to an ultrasonic probe, and a circuit provided with a housing 21, an ultrasonic device 22 housed in the housing 21, a driver circuit for controlling the ultrasonic device 22, and the like. And a substrate 23 (see FIG. 2). The ultrasonic device 22 and the circuit board 23 constitute an ultrasonic sensor 24, and the ultrasonic sensor 24 constitutes an ultrasonic module.

[Case configuration]
As shown in FIG. 1, the casing 21 is formed in, for example, a box shape having a rectangular shape in plan view, and a sensor window 21 </ b> B is provided on one surface (sensor surface 21 </ b> A) orthogonal to the thickness direction. A part of 22 is exposed. Further, a passage hole 21C of the cable 3 is provided in a part (side surface in the example shown in FIG. 1) of the housing 21, and the cable 3 is connected to the circuit board 23 inside the housing 21 through the passage hole 21C. The Further, the gap between the cable 3 and the passage hole 21 </ b> C is filled with, for example, a resin material, so that waterproofness is ensured.
In the present embodiment, a configuration example in which the ultrasonic probe 2 and the control device 10 are connected using the cable 3 is shown, but the present invention is not limited to this. For example, the ultrasonic probe 2 and the control device 10 are wirelessly connected. They may be connected by communication, and various configurations of the control device 10 may be provided in the ultrasonic probe 2.

[Configuration of circuit board]
The circuit board 23 is joined with the ultrasonic device 22 and provided with a driver circuit and the like for controlling the ultrasonic device 22. As illustrated in FIG. 2, the circuit board 23 includes a selection circuit 231, a transmission circuit 232, and a reception circuit 233.

Based on the control of the control apparatus 10, the selection circuit 231 is connected in any one of a transmission connection for connecting the ultrasonic device 22 and the transmission circuit 232 and a reception connection for connecting the ultrasonic device 22 and the reception circuit 233. Switch to.
When the transmission circuit 232 is switched to the transmission connection under the control of the control device 10, the transmission circuit 232 outputs a transmission signal indicating that the ultrasonic device 22 transmits ultrasonic waves via the selection circuit 231.
When the reception circuit 233 is switched to the reception connection under the control of the control device 10, the reception circuit 233 outputs the reception signal input from the ultrasonic device 22 to the control device 10 via the selection circuit 231. The reception circuit 233 includes, for example, a low-noise amplifier circuit, a voltage control attenuator, a programmable gain amplifier, a low-pass filter, an A / D converter, and the like. The reception circuit 233 converts the received signal into a digital signal, removes a noise component, and is desired. After performing each signal processing such as amplification to the signal level, the received signal after processing is output to the control device 10.

[Configuration of ultrasonic device]
FIG. 3 is a cross-sectional view of the ultrasonic device 22. FIG. 4 is a plan view of the element substrate 41 in the ultrasonic device 22 as viewed from the sealing plate 42 side. FIG. 5 is a plan view schematically showing the ultrasonic transducer 45 viewed from the protective film 44 side. FIG. 3 is a cross-sectional view of the ultrasonic device 22 taken along line AA in FIG.
As shown in FIG. 3, the ultrasonic device 22 includes an element substrate 41, a sealing plate 42 corresponding to the substrate, an acoustic layer 43, and a protective film 44. Among these, the element substrate 41 and the sealing plate 42 are electrically connected via the conducting portion 5 of the sealing plate 42 and the wiring portion 415 of the element substrate 41 as shown in FIG. 3.
Here, in the following description, the surface of the element substrate 41 facing the sealing plate 42 is referred to as a back surface 41A, and the surface opposite to the back surface 41A is referred to as an operation surface 41B. The surface of the sealing plate 42 facing the element substrate 41 is referred to as an inner surface 42A, and the surface opposite to the inner surface 42A is referred to as an outer surface 42B. Note that the thickness directions of the element substrate 41 and the sealing plate 42 substantially coincide with the Z direction.

(Configuration of element substrate)
As shown in FIG. 3, the element substrate 41 includes a substrate body 411 and a vibration film 412 stacked on the substrate body 411. Further, as shown in FIG. 4, the element substrate 41 has a piezoelectric element 413, a lower electrode connection line 414, a wiring part 415, an upper electrode lead line 416, and a bonding member on the sealing plate 42 side of the vibration film 412. Part 417. Among these, the ultrasonic transducer 45 that transmits and receives ultrasonic waves is configured by the flexible portion 412 </ b> A that is the vibration region of the vibration film 412 and the piezoelectric element 413.
As shown in FIG. 4, in the array region Ar <b> 1 located at the center of the element substrate 41, a plurality of ultrasonic transducers 45 that transmit and receive ultrasonic waves intersect in the X direction and the X direction (in the present embodiment, orthogonal). Arranged in a matrix along the Y direction. The plurality of ultrasonic transducers 45 constitute an ultrasonic array UA.

  The substrate body 411 is a semiconductor substrate such as Si. An opening 411A corresponding to each ultrasonic transducer 45 is provided in the array region Ar1 in the substrate body 411. Each opening 411A is separated by a partition 411B. Each opening 411A is closed by a vibration film 412 provided on the sealing plate 42 side (−Z side).

The vibration film 412 is made of, for example, SiO ₂ , a laminated body of SiO ₂ and ZrO ₂ , and is provided to cover the entire −Z side of the substrate body 411. A portion of the vibration film 412 that closes the opening 411A constitutes a flexible portion 412A that can be elastically deformed. The thickness dimension (thickness) of the vibration film 412 is sufficiently small with respect to the substrate body 411 (thickness). When the substrate body 411 is made of Si and the vibration film 412 is made of SiO ₂ , the vibration film 412 having a desired thickness (thickness) can be easily formed by oxidizing the substrate body 411, for example. It becomes possible. In this case, the opening 411A can be easily formed by etching the substrate body 411 using the SiO ₂ vibration film 412 as an etching stopper.

  In addition, piezoelectric elements 413 are provided on the flexible portions 412A of the vibration film 412 that close the openings 411A. The flexible portion 412A and the piezoelectric element 413 constitute one ultrasonic transducer 45. The piezoelectric element 413 is configured as a stacked body of a lower electrode 413A, a piezoelectric film 413B, and an upper electrode 413C.

The lower electrode 413A and the upper electrode 413C include one or more layers made of a conductive material. As such a conductive material, for example, electrode materials such as Au, Al, Cu, Ir, Pt, IrOx, Ti, TiW, and TiOx can be used. In the present embodiment, for example, the lower electrode 413A is configured by sequentially stacking a TiW layer (50 nm) and a Cu layer (100 nm) on the vibration film 412.
The piezoelectric film 413B is formed using, for example, a transition metal oxide having a perovskite structure, more specifically, lead zirconate titanate containing Pb, Ti, and Zr.

  In such an ultrasonic transducer 45, by applying a rectangular wave voltage of a predetermined frequency between the lower electrode 413A and the upper electrode 413C, the flexible portion 412A located in the opening region of the opening 411A is moved in the Z direction. The ultrasonic waves can be sent out by vibrating along. Further, when the flexible portion 412A is vibrated by the ultrasonic wave reflected from the object, a potential difference is generated above and below the piezoelectric film 413B. Therefore, the received ultrasonic wave can be detected by detecting the potential difference generated between the lower electrode 413A and the upper electrode 413C.

  In the present embodiment, as shown in FIG. 4, two ultrasonic transducers 45 arranged in the Y direction out of the plurality of ultrasonic transducers 45 arranged along the X direction and the Y direction are each one. An ultrasonic transducer group 45A, which is a transmission / reception channel, is configured. That is, the ultrasonic array UA is configured as a two-dimensional array in which a plurality of ultrasonic transducer groups 45A, which are transmission / reception channels, are arranged along the X direction and the Y direction.

  The lower electrodes 413A of the ultrasonic transducers 45 constituting the ultrasonic transducer group 45A are connected by a lower electrode connection line 414. The lower electrode connection line 414 is formed integrally with each lower electrode 413A. That is, the lower electrode connection line 414 is configured by stacking a TiW layer (50 nm) and a Cu layer (100 nm), for example, similarly to the lower electrode 413A. The lower electrode connection line 414 may be provided separately from the lower electrode 413A.

  The upper electrode lead line 416 is connected to each upper electrode 413C of the ultrasonic transducer 45. The upper electrode lead wire 416 is formed of a conductive material, and includes a plurality of lead wiring portions 416A, a connecting portion 416B that connects the lead wiring portions 416A and the upper electrode 413C, and a connection terminal portion disposed in the wiring region Ar2. 416C.

As shown in FIG. 4, the lead wiring portions 416 </ b> A are provided, for example, every other row among the plurality of ultrasonic transducers 45 arranged along the Y direction. In the lead wiring portion 416A, the upper electrode 413C of each ultrasonic transducer 45 is connected by a connecting portion 416B.
The connection terminal portion 416C is formed in the wiring region Ar2 on the outer peripheral portion of the element substrate 41, and is connected to the lead wiring portion 416A. Although not shown, the connection terminal portion 416C is connected to a ground circuit (not shown) of the circuit board 23 via a wiring member, and is set to a reference potential (for example, 0 potential). That is, the upper electrode 413C is a common electrode to which a reference potential is applied.

  The joint portion 417 joins the element substrate 41 and the sealing plate 42 configured as described above. The joint 417 is disposed at a position along the outer edge of the element substrate 41 or a position along the ultrasonic transducer 45. For example, as illustrated in FIG. 4, the joint portion 417 is disposed along the X direction at a position overlapping the partition wall portion 411 </ b> B of the back surface 41 </ b> A.

  The joint portion 417 is formed using a material capable of joining the element substrate 41 and the sealing plate 42, for example, a resin material such as various adhesives or a photosensitive resin material (photoresist). In the present embodiment, the joint portion 417 is formed using a photosensitive resin material. Thereby, the joining part 417 can be formed in a desired shape at a desired position.

(Wiring configuration)
The wiring portion 415 has conductivity, is provided at a position different from the ultrasonic transducer 45 on the back surface 41A, and is electrically connected to the ultrasonic transducer 45 via the lower electrode connection line 414. Specifically, the wiring portion 415 has a substantially rectangular outer shape in a plan view as viewed from the Z direction, and protrudes from the lower electrode connection line 414 toward the sealing plate 42 at a position overlapping the partition wall portion 411B. And is electrically connected to a conduction portion 5 described later. That is, the lower electrode 413A of each ultrasonic transducer 45 is electrically connected to the conduction part 5 via the lower electrode connecting line 414 and the wiring part 415. One wiring section 415 is provided for each of the plurality of ultrasonic transducer groups 45A.

  As shown in FIG. 3, the end surface (hereinafter also referred to as end portion 415A) of the wiring portion 415 on the sealing plate 42 side is the end surface on the −Z side (hereinafter referred to as Z-side end surface) of the piezoelectric element 413 of the ultrasonic transducer 45. (Also referred to as 413D) on the sealing plate 42 side. Thereby, interference with the member (for example, conduction | electrical_connection part 5 etc.) provided in the sealing plate 42 side and the ultrasonic transducer 45 can be suppressed. For example, even if the ultrasonic transducer 45 is driven and the Z-side end surface 413D of the piezoelectric element 413 moves to the sealing plate 42 side, the interference between the piezoelectric element 413 and the conductive portion 5 can be suppressed.

Such a wiring portion 415 is formed using a conductive material such as a metal material or a resin material containing a conductive filler, for example. For example, the wiring part 415 is formed by depositing a metal material on the lower electrode connection line 414 by electroplating.
Note that the planar shape of the wiring portion 415 in a plan view viewed from the Z direction is not limited to a rectangular shape, and may be a circular shape, an elliptical shape, various polygonal shapes, or the like.

(Configuration of sealing plate)
The sealing plate 42 shown in FIGS. 3 and 5 is formed of, for example, a semiconductor substrate or the like, and is bonded to the element substrate 41 by the bonding portion 417 to reinforce the strength of the element substrate 41. As shown in FIG. 3, the sealing plate 42 includes a semiconductor substrate 420A made of Si or the like and an insulating layer 420B formed on the surface of the semiconductor substrate 420A. The insulating layer 420B is formed by performing a thermal oxidation process on the semiconductor substrate 420A. In FIG. 3, the insulating layer 420B is illustrated only on the inner surface 42A side. In addition, since the material and thickness of the sealing plate 42 affect the frequency characteristic of the ultrasonic transducer 45, it is preferable to set the sealing plate 42 based on the center frequency of ultrasonic waves to be transmitted and received.
As shown in FIG. 3, the sealing plate 42 is provided with a groove portion 421, a conduction portion 5, a through electrode 424, and a lower electrode wiring 425. The mounting structure is configured to include the semiconductor substrate 420 </ b> A and the insulating layer 420 </ b> B (sealing plate 42) provided with the groove 421 and the conductive portion 5.

(Configuration of through electrode and lower electrode wiring)
The through electrode 424 is formed of a conductive material and penetrates the sealing plate 42 in the Z direction as shown in FIG. The through electrode 424 is connected to the conduction portion 5 on the inner surface 42A side, and is connected to the lower electrode wiring 425 on the outer surface 42B side.
The lower electrode wiring 425 is individually provided on the outer surface 42 </ b> B of the sealing plate 42 with respect to the through electrode 424. The lower electrode wiring 425 is connected to the circuit board 23 via wiring (not shown) formed along the outer surface 42B. That is, the conduction part 5 is connected to the circuit board 23 via the through electrode 424 and the lower electrode wiring 425. Note that at least one penetrating electrode 424 may be formed with respect to one conductive portion 5, and may be three or more.

(Configuration of groove)
FIG. 6 is a cross-sectional view showing a schematic configuration of a part of the sealing plate 42 including the conductive portion 5 and the groove portion 421, and FIG. 7 is a plan view.
As shown in FIGS. 3 and 5, the groove portion 421 is a groove formed in the inner surface 42 </ b> A at a position overlapping the wiring portion 415 in plan view. As shown in FIG. 6, the groove portion 421 of the present embodiment is formed across the semiconductor substrate 420A through the insulating layer 420B from the inner surface 42A toward the outer surface 42B. As shown in FIG. 7, the groove portion 421 has a substantially circular opening end edge 422 in a plan view. The groove portion 421 is formed in a mortar shape, and the groove inner surface 423 is curved. In other words, the groove inner surface 423 has a curved surface 423A that curves in a concave shape in plan view. That is, the diameter dimension of the groove part 421 in a cross section parallel to the XY plane decreases from the inner surface 42A toward the outer surface 42B. In the present embodiment, the groove inner surface 423 has a flat bottom surface and a curved surface 423A surrounding the periphery of the bottom surface in plan view. Such a groove 421 is formed by dry etching or the like. In other words, the curved surface 423A has a substantially semicircular cross section (for example, a YZ cross section) passing through the planar center O of the groove and extending along the Z direction.

(Configuration of conduction part)
As shown in FIGS. 3, 5, and 6, the conductive portion 5 covers the resin portion 51 provided in the groove portion 421 formed on the inner surface 42 </ b> A, a part of the resin portion 51, and the penetrating electrode 424. A conductive film 52 that is electrically connected.
As shown in FIG. 3, the conductive portion 5 is in close contact with and electrically connected to the wiring portion 415 provided on the element substrate 41. That is, when the sealing plate 42 is bonded to the element substrate 41, the conductive portion 5 is pressed against the end portion 415 </ b> A of the wiring portion 415, and the resin portion 51 and the conductive film 52 that constitute the conductive portion 5 are elastically deformed. The conductive film 52 is in close contact with the wiring portion 415 by the restoring force of the elastically deformed resin portion 51. Thereby, the reliability of the electrical connection between the conduction | electrical_connection part 5 and the wiring part 415 improves.

  The conductive film 52 corresponds to a wiring and is provided from the position overlapping the through electrode 424 on the inner surface 42 </ b> A of the sealing plate 42 to the resin portion 51. The conductive film 52 is provided along the Y direction in a plan view, covers at least a part of the resin part 51 including the end on the + Z side, and is connected to the through electrode 424. By making the thickness of the conductive film 52 sufficiently thinner than the resin part 51, the resin part 51 and the conductive film 52 can be elastically deformed.

  As a conductive material for forming such a conductive film 52, Au, Ag, TiW, Cu, Ni, Pd, Al, Cr, Ti, W, NiCr, or the like, lead-free solder, or the like can be used. In the present embodiment, for example, the conductive film 52 is configured by laminating a TiW layer (50 nm) and an Au layer (100 nm) from the inner surface 42A side.

  The resin part 51 corresponds to a resin protrusion and is formed of a resin material having elasticity. As shown in FIG. 3, the resin part 51 is provided in the groove part 421, that is, provided in a position overlapping the wiring part 415 in a plan view, and protrudes toward the element substrate 41 from the inner surface 42A. The resin portion 51 is provided along the groove inner surface 423 and is in contact with the groove inner surface 423 and the opening edge 422. That is, the resin part 51 is formed in the groove part 421 so that a gap is not generated between the resin part 51 and the opening edge 422 in a plan view. The resin portion 51 is formed so that the diameter dimension of a cross section (substantially circular) parallel to the XY plane decreases toward the element substrate 41 side.

The resin part 51 as described above is made of a resin material provided in the groove part 421, and is formed by, for example, thermally melting the resin material and then solidifying it. As a result, the resin portion 51 is formed along the groove inner surface 423.
As a forming material of the resin portion 51, a photosensitive resin material (photoresist) can be used. In this case, it is easy to form the resin part 51 in a desired shape at a desired position. In addition to the photosensitive resin material, various elastic resin materials such as polyimide resin, acrylic resin, phenol resin, epoxy resin, silicone resin, and modified polyimide resin are used as the material for forming the resin portion 51. Can do.

FIG. 8 is a cross-sectional view schematically showing the conduction portion 6 in the comparative example.
As shown in FIG. 8, the conductive portion 6 includes a resin portion 61 provided on the flat inner surface 42 </ b> A and a conductive film 62 provided across the resin portion 61 from the inner surface 42 </ b> A. The conducting part 6 of the comparative example is basically formed in substantially the same manner as the conducting part 5 except that the resin part 61 is not provided in the groove part 421. That is, the resin portion 61 is formed in a substantially hemispherical shape by solidifying the resin material provided on the inner surface 42A after being melted by heat. Here, when the maximum radius (the radius of the bottom surface) of the resin portion 61 in a plan view is Lc and the height (dimension in the Z direction) of the resin portion 61 is Ld, the maximum radius Lc in the resin portion 61 is the height. It is substantially the same as Ld (Lc = Ld).

On the other hand, in the resin part 51 of the present embodiment, when the maximum radius of the resin part 51 in plan view is La, the height of the resin part 51 with respect to the inner surface 42A (the protruding amount in the Z direction with respect to the inner surface 42A) is Lb. La <Lb, and La and Lb satisfy the following formula (1). In the present embodiment, the maximum radius La of the resin part 51 is the opening radius of the groove part 421.
For example, when the maximum diameter is the same between the conducting portion 5 of this embodiment and the conducting portion 6 of the comparative example, the height Lb of the conducting portion 5 of this embodiment is larger than the height dimension of the conducting portion 6 of the comparative example. That is, when La = Lc, Lb> Ld. Further, when the conducting portion 5 of the present embodiment and the conducting portion 6 of the comparative example have the same height, the maximum radius La of the conducting portion 5 is smaller than the maximum radius Lc of the conducting portion 6 of the comparative example. That is, when Lb = Ld, La <Lc.
That is, by providing the resin part 61 in the groove part 421, the dimension in the Z direction can be made larger than the dimension in the X direction and the Y direction compared to the case where the groove part 421 is not provided as in the comparative example. That is, the resin part 51 has a larger aspect ratio than the comparative example.

[Equation 1]
Lb / La> 1 (1)

[Effects of First Embodiment]
With the ultrasonic device 22 according to the first embodiment configured as described above, the following effects can be obtained.
The resin part 51 constituting the conduction part 5 is provided in the groove part 421 formed in the sealing plate 42. In such a configuration, the aspect ratio of the resin portion 51 can be increased as compared with a configuration in which the resin portion 51 is not provided in the groove portion 421. That is, as shown in FIG. 8, when the resin material is heated and melted without being provided with the groove portion 421 and re-solidified, the resin portion 61 having a substantially hemispherical shape (that is, the aspect ratio is about 1) is formed as described above. Is done. On the other hand, by providing the resin part 51 in the groove part 421, it is possible to suppress the heat-melted resin material from spreading in the planar direction (X direction and Y direction), and to increase the aspect ratio of the resin part 51. it can. In addition, since the thickness of the electrically conductive film 62 is very small with respect to the resin part 51, the aspect ratio of the conduction | electrical_connection part 5 can be increased by increasing the aspect ratio of the resin part 51. FIG.

Moreover, the planar shape of the resin part 51 can be prescribed | regulated by the groove part 421, and the resin part 51 can be formed in a desired position and range. Therefore, it is possible to suppress the resin material from expanding beyond the design value and interfering with other configurations (for example, other wirings) provided on the sealing plate 42, and to achieve high integration of the conductive portion 5. it can.
In addition, by restricting the expansion range of the resin material by the groove portion 421, the planar shape of the resin portion 51 in a plan view can be changed to a shape corresponding to the shape of the groove portion 421. Therefore, it is easy to form the resin part 51 having a desired planar dimension and height dimension in a desired region, and as a result, the resin part 51 and the conductive film 52 can be highly integrated.

  The resin part 51 is in contact with the opening edge 422. That is, no gap is formed between the resin portion 51 and the sealing plate 42 at the opening edge 422 that is the boundary position between the resin portion 51 and the sealing plate 42. Therefore, when forming the conductive film 52 extending from the sealing plate 42 to the resin portion 51, a defective formation of the wiring does not occur at the boundary position due to the gap, and the conductive film 52 can be appropriately formed.

The groove inner surface 423 of the groove part 421 is formed in a mortar shape. That is, the groove inner surface 423 has a curved surface 423A that is curved concavely. The resin portion 51 is formed along the groove inner surface 423 and is held by the groove inner surface 423. Therefore, for example, when the resin portion 51 is formed by heating and melting the resin material, the molten resin material can be stably held by the groove inner surface 423.
The groove portion 421 having the curved groove inner surface 423 can be easily formed by performing wet etching on the sealing plate 42.

[Second Embodiment]
Hereinafter, a second embodiment will be described.
In the second embodiment, the sealing plate 42 is formed with a wall portion surrounding the groove portion 421 and is different from the configuration of the first embodiment in that a resin protrusion is provided inside the wall portion.
In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

FIG. 9 is a cross-sectional view schematically showing an enlarged part of the sealing plate 42 of the second embodiment, and FIG. 10 is a plan view.
As shown in FIGS. 9 and 10, the inner surface 42 </ b> A of the sealing plate 42 is provided with an annular wall portion 7 that surrounds the groove portion 421 and the resin portion 51 in a plan view.
The wall portion 7 includes a base end portion 71 in contact with the sealing plate 42, a top surface 72 opposite to the inner surface 42A (+ Z side) of the sealing plate 42, and an inner surface on the groove portion 421 side (inner side) in plan view. 73 and an outer surface 74 on the opposite side (outer side) from the groove portion 421. A concave portion 70 including the groove portion 421 is formed by the inner side surface 73 and the groove inner surface 423 of the wall portion. The resin portion 51 is provided in the recess 70 and is held by the groove inner surface 423 and the inner surface 73.

The base end portion 71 has an inner base end side inner periphery 711 and an outer base end side outer periphery 712 in plan view. The proximal end inner peripheral edge 711 overlaps the opening edge 422 in plan view. That is, the wall 7 is formed along the opening edge 422 in plan view.
The top surface 72 has an inner distal end side inner periphery 721 and an outer distal end side outer periphery 722 in plan view. In plan view, the distal end side inner peripheral edge 721 is positioned outside the proximal end side inner peripheral edge 711, and the distal end side outer peripheral edge 722 is positioned inside the proximal end side outer peripheral edge 712.

Here, the front end side inner peripheral edge 721 is an opening edge of the recess 70. The resin portion 51 is in contact with the inner peripheral edge 721 of the distal end side. That is, the radius of the distal end side inner periphery 721 corresponds to the maximum radius La of the resin portion 51. Also in the present embodiment, the maximum radius La of the resin portion 51 and the height Lb of the resin portion 51 with respect to the inner surface 42A satisfy the above formula (1).
Further, the maximum radius Le of the wall portion 7 (that is, the radius of the circular proximal end outer peripheral edge 712) and the height Lb of the resin portion 51 satisfy the following formula (2). For this reason, when the height of the resin part is the same as the configuration in which the groove part 421 and the wall part 7 are not provided as shown in FIG. 8, the wall part 7 has a larger radius than the maximum radius Lc of the resin part 61 of the comparative example of FIG. 8. The maximum radius Le can be reduced, and wiring can be highly integrated.

[Equation 2]
Lb / Le> 1 (2)

The inner side surface 73 is a mortar-shaped curved surface located between the proximal end side inner peripheral edge 711 and the distal end side inner peripheral edge 721, and is curved in a concave shape.
The outer side surface 74 corresponds to an inclined portion, and is inclined from the proximal end side outer peripheral edge 712 toward the distal end side outer peripheral edge 722. That is, the outer side surface 74 is inclined so as to go outward in plan view as it goes from the top surface 72 toward the sealing plate 42 (base end portion 71). In the example shown in FIG. 9, the outer surface 74 is curved in a concave shape. Further, the outer surface 74 is formed with an inclined portion over the entire circumference, but an inclined portion may be formed on a part of the outer surface 74.
The conductive film 52 is formed along the Y direction so as to straddle the outer surface 74, the top surface 72, and the resin portion 51.

The above-mentioned wall portion 7 can be formed by performing dry etching or the like using a metal material or an oxide material. As the metal material, for example, Au, Ag, TiW, Cu, Ni, Pd, Al, Cr, Ti, W, NiCr, or the like can be used. By using a metal material, it is possible to suppress a decrease in connection reliability due to disconnection of the conductive film 52 in the wall 7.
Examples of the oxide material include various metal oxides such as ZrO ₂ and Al ₂ O ₃ , and SiO ₂ . By using the oxide material, the adhesion between the wall portion 7 and the resin portion 51 can be improved as compared with the metal material.

[Effects of Second Embodiment]
In 2nd Embodiment, in addition to the effect similar to 1st Embodiment, the following effects can be obtained.
The resin part 51 is provided in a concave part 70 formed by the groove part 421 and the wall part 7 formed on the inner surface 42A. In such a configuration, as in the first embodiment, the aspect ratio of the resin portion 51 can be increased as compared with the case where the resin portion 51 is not provided in the recess 70 but provided on the flat inner surface 42A.

Here, a higher resin portion 51 can be formed by increasing the volume of the resin material. However, in the configuration in which the wall portion 7 is not formed, if the volume of the resin material exceeds an allowable amount with respect to the volume of the groove portion 421, there is a possibility that the molten resin material spreads outside the groove portion 421.
On the other hand, by providing the wall part 7, the resin part 51 can be provided in the recessed part 70 which has a larger volume than the groove part 421, and the expansion of the resin material can be suppressed more reliably.
Further, the allowable volume of the resin material can be increased, and the height of the resin material can be increased.

  No gap is formed between the resin part 51 and the wall part 7 at the inner peripheral edge 721 on the front end side, which is the boundary position between the resin part 51 and the wall part 7. Therefore, when the conductive film 52 is formed from the sealing plate 42 to the resin portion 51 so as to straddle the wall portion 7, it is possible to suppress a problem that the conductive film 52 is not appropriately formed due to the gap, and the boundary position The conductive film 52 can be formed appropriately.

  The inner side surface 73 is curved in a concave shape. Accordingly, when the resin part 51 is formed by melting the resin material, the melted resin material can be stably held by the groove part 421 and the inner side surface 73.

  The outer side surface 74 inclines toward the outer side in plan view as it goes from the top surface 72 toward the base end portion 71. The conductive film 52 is formed on the inclined outer surface 74. In such a configuration, compared to the configuration in which the conductive film 52 is formed so as to straddle the step between the top surface 72 and the inner surface 42A without the outer surface 74 being inclined, the formation failure of the conductive film 52 occurs. It is difficult to form an appropriate conductive film 52 more easily.

[Third Embodiment]
Hereinafter, the third embodiment will be described.
The third embodiment is different from the configuration of the second embodiment in that it includes a base wiring formed across the wall 7 from the groove 421 to the sealing plate 42.
In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

FIG. 11 is a cross-sectional view schematically showing an enlarged part of the sealing plate 42 of the third embodiment, and FIG. 12 is a plan view.
As shown in FIGS. 11 and 12, the base wiring 8 is provided across the wall 7 and the groove 421 in plan view. That is, the base wiring 8 is formed so as to cover the wall portion 7 and the groove portion 421. A resin portion 51 and a conductive film 52 are laminated on the base wiring 8. That is, the resin part 51 is formed along the base wiring 8 on the inner side of the front end side inner periphery 721 of the top surface 72 of the wall part 7 in plan view. In addition, the conductive film 52 is provided on the base wiring 8 outside the resin portion 51 in a plan view, that is, at a position overlapping the wall portion 7.

  The base wiring 8 is formed using various conductive wiring materials. As the wiring material, for example, a metal material such as Au, Ag, TiW, Cu, Ni, Pd, Al, Cr, Ti, W, and NiCr can be used. Here, the base wiring 8 preferably has good adhesion to the conductive film 52. Thereby, it can suppress that the electrically conductive film 52 peels from the base wiring 8, and can improve the reliability of electrical connection.

Although the base wiring 8 covers the groove 421 and the wall 7, it may cover at least a part of the wall 7. For example, the base wiring 8 may be provided at a position overlapping at least the wall 7 and the conductive film 52 in plan view.
Furthermore, in this case, a metal oxide or resin material having good adhesion to the resin part 51 may be used as the wall part 7. That is, the resin part 51 is formed on the wall part 7 having good adhesion to the resin part 51 in a region that does not overlap the conductive film 52 of the wall part 7 in plan view. Thereby, the adhesiveness with respect to the sealing plate 42 of both the resin part 51 and the electrically conductive film 52 can be improved.

[Effects of Third Embodiment]
In 3rd Embodiment, in addition to the effect similar to 2nd Embodiment, the following effects can be obtained.
The underlying wiring 8 covers at least a part of the wall portion over the inside and outside of the wall portion 7, and the conductive film 52 is formed on the underlying wiring 8. In such a configuration, the conductive film 52 has a base position on the boundary position between the inner side surface 73 (top surface 72) and the resin portion 51, the boundary position between the outer side surface 74 and the sealing plate 42, and the wall portion 7. It is formed on the wiring 8. Therefore, disconnection of the conductive film 52 on each boundary position or on the top surface 72 can be suppressed, and connection reliability can be improved.

[Modification of Embodiment]
Note that the present invention is not limited to the above-described embodiments, and the present invention includes configurations obtained by modifying, improving, and appropriately combining the embodiments as long as the object of the present invention can be achieved. Is.
(Modification 1)
FIG. 13 is a cross-sectional view schematically showing an enlarged part of the sealing plate 42 in the first modification.
In each of the embodiments described above, the groove 421 is formed across the semiconductor substrate 420A through the insulating layer 420B from the inner surface 42A toward the outer surface 42B, but is not limited thereto. For example, as shown in FIG. 13, the groove 421 may be formed only in the insulating layer 420B. In such a configuration, for example, the groove 421 can be formed by selectively removing only the insulating layer 420B by dry etching or the like. The depth of the groove portion 421 can be adjusted by adjusting the thickness dimension of the insulating layer 420B.

  In each of the above embodiments, the semiconductor substrate 420A is thermally oxidized to form the insulating layer 420B and then the groove 421 is formed. For example, after the groove 421 is formed in the semiconductor substrate 420A, the insulating layer 420B is formed. May be formed. In this case, the insulating layer 420B can be formed also on the groove inner surface 423 of the groove part 421, and the insulating property of the sealing plate 42 can be improved.

(Modification 2)
FIG. 14 is a cross-sectional view schematically showing an enlarged part of the sealing plate 42 in the second modification.
The wall portion 7 of the second embodiment includes an inner side surface 73 that is a concave curved surface that inclines toward the inner side of the groove portion 421 and an outer side that inclines toward the outer side, from the top surface 72 toward the base end portion 71 side. Side surface 74. On the other hand, in the wall portion 7A of the modified example 2 shown in FIG. 14, the inner side surface 73 and the outer side surface 74 stand up in the Z direction (normal direction of the inner surface 42A).
Such a wall portion 7A is formed, for example, by performing dry etching or the like on a layer of a metal material or an oxide film material. Further, the wall portion 7A is formed by depositing a metal on a base layer provided in advance by an electroplating method.
The wall portion 7A is formed by applying an adhesive, which is a resin material, around the groove portion 421. When using a resin material, a material having a melting point higher than that of the resin material constituting the resin portion 51 is used. Thereby, even if the resin part 51 is formed by heat melting, melting and deformation of the wall part can be suppressed.

  As shown in FIG. 14, connection reliability at the boundary position between the inner side surface 73 (top surface 72) and the resin portion 51 is formed by forming the base wiring 8 of the third embodiment so as to cover the wall portion 7 </ b> A. Can be improved. Similarly, the connection reliability at the boundary position between the top surface 72 and the outer surface 74 or between the outer surface 74 and the sealing plate 42 can be improved.

(Modification 3)
FIG. 15 is a plan view schematically showing an enlarged part of the sealing plate 42 in the third modification.
In each of the above embodiments and modifications, the resin part 51 and the groove part 421 are formed in a substantially circular shape in plan view, but the present invention is not limited to this.
As shown in FIG. 15, a groove 426 is formed on the inner surface 42 </ b> A of the sealing plate 42. The groove portion 426 is formed in substantially the same manner as the groove portion 421 of each of the above embodiments, except that the groove portion 426 has an oval shape (oval shape) whose longitudinal direction is the X direction in plan view. That is, the groove inner surface of the groove portion 426 is curved in a mortar shape. The groove portion 426 has a uniform width portion 426A having the same dimension in the Y direction.

5 A of conduction | electrical_connection parts are provided in the groove part 426, and are formed so that the resin part 51A which has an oval shape similarly to the said groove part 426, and the resin part 51A may be straddled along the Y direction orthogonal to a longitudinal direction (FIG. 15). 2) conductive films 52.
In the central portion 511 provided in the equal width portion 426A of the groove portion 426 in the resin portion 51A, the height dimension (dimension in the Z direction) increases toward the center in the Y direction before elastic deformation. In the central portion 511, the height dimension (maximum dimension) at the center position in the Y direction is substantially constant along the X direction. A cross section parallel to the YZ plane passing through the central portion 511 is substantially the same as in the first embodiment (see FIG. 6).
The plurality of conductive films 52 are provided so as to straddle the equal width part 426A of the groove part 421, that is, straddle the central part 511 in plan view. The plurality of conductive films 52 are each provided with a through electrode 424 and are individually connected to the circuit board 23.
Note that the cross section of the sealing plate 42 of Modification 3 on a plane that passes through the central portion 511 and the conductive film 52 and is parallel to the YZ plane is substantially the same as the configuration of the first embodiment shown in FIG.

In the configuration according to the modification example 3, since the conducting portion 5A has an oval shape with the X direction as the longitudinal direction, a plurality of conductive films can be formed along the Y direction.
The conductive film 52 is provided so as to straddle the equal width portion 426A of the groove portion 421 in a plan view. That is, since the plurality of conductive films 52 are provided so as to straddle the central portion 511 where the maximum dimension in the Z direction is substantially constant along the X direction, variations in the maximum position of the conductive film 52 in the Z direction are suppressed. The connection reliability between the conductive portion 5A and the wiring portion 415 can be improved.

(Modification 4)
FIG. 16 is a plan view schematically showing an enlarged part of the sealing plate 42 in Modification 4. As shown in FIG.
As shown in FIG. 16, in the same manner as the second embodiment with respect to the first embodiment, in addition to the configuration of the modification example 3, a wall portion 7A surrounding the groove portion 426 and the resin portion 51A is formed on the sealing plate 42. Also good.
The wall portion 7A is configured in the same manner as the wall portion 7 of the second embodiment, except that the outer shape in plan view is an oval shape whose longitudinal direction is the X direction. That is, the wall portion 7A is formed along the opening edge of the groove portion 426, and the resin portion 51A is in contact with the inner peripheral edge of the top surface of the wall portion 7A. The wall portion 7A has two linear portions 75 that are linearly formed in the X direction along the equal width portion 426A of the groove portion 426. The two straight portions 75 are provided at positions that sandwich the central portion 511 in the Y direction.
Moreover, it is preferable that the inner surface of the wall portion 7A bends in a concave shape. By this inner surface, the resin portion 51A can be more securely held with respect to the sealing plate 42. Further, it is preferable that the outer surface of the wall portion 7A is inclined, so that the conductive film 52 can be appropriately formed at a position overlapping the outer surface in plan view, and connection reliability can be improved.

By forming the wall portion 7A with an insulating material such as an oxide film material or a resin material, it is possible to prevent the plurality of conductive films 52 from being electrically connected. Therefore, the plurality of conductive films 52 can be individually connected to the circuit board 23.
For example, when a signal common to each conductive film 52 is input or output, the wall portion 7A may be formed of a metal material that is a conductive material. Accordingly, the plurality of conductive films 52 can be connected to each other via the wall portion 7A without providing connection wiring for connecting the plurality of conductive films 52.

(Modification 5)
FIG. 17 is an enlarged plan view schematically showing a part of the sealing plate 42 in the fifth modification.
As shown in FIG. 17, in the same manner as the third embodiment relative to the second embodiment, in addition to the configuration of the modified example 4, the base wiring 8 </ b> A may be formed on the sealing plate 42.
The base wiring 8A is provided at least at a position overlapping with each of the plurality of conductive films 52 in plan view. In Modification 5 shown in FIG. 17, the base wiring 8A is formed linearly along the Y direction in plan view, and covers a part of the groove 426 and the wall 7A. In a plan view, the resin portion 51A and the conductive film 52 are laminated on the underlying wiring 8A at a position overlapping the groove portion 426. Further, in a plan view, the conductive film 52 is laminated on the base wiring 8 </ b> A outside the groove portion 426.

When a signal common to the plurality of conductive films 52 is input or output, the wall portion 7A is formed of an insulating material, and one base wiring 8A is provided at a position overlapping all of the plurality of conductive films 52. It may be formed. Accordingly, the plurality of conductive films 52 can be connected to each other via the wall portion 7A without providing connection wiring for connecting the plurality of conductive films 52.
In the case where a signal common to all the conductive films 52 is input or output, one base wiring 8A may be formed at a position overlapping all the conductive films 52.

(Modification 6)
FIG. 18 is an enlarged plan view schematically showing a part of the sealing plate 42 in Modification 6. As shown in FIG.
As shown in FIG. 18, in the modified example 6, the diameter dimension of the opening end edge 422 of the groove part 421 is larger than the diameter dimension of the base end side inner peripheral edge 711 of the wall part 7 in the second embodiment. That is, in the plan view, the base end side inner peripheral edge 711 is located inside the opening end edge 422. The resin part 51 is filled in the groove part 421, is a region between the base end side inner peripheral edge 711 and the opening end edge 422 in a plan view, and is also filled below the wall part 7 (−Z side). The That is, the resin portion 51 is provided in the recess 70 so that the proximal inner peripheral edge 711 of the wall portion 7 is inserted toward the plane center (center in the X direction and the Y direction) of the resin portion 51. In such a configuration, when the shear stress in the direction parallel to the XY plane acts on the resin portion 51, it is possible to more reliably suppress the resin portion 51 from peeling from the sealing plate 42.

  In the configuration in which no wall portion is provided as described in the first embodiment, for example, the opening diameter of the semiconductor substrate 420A may be larger than the opening diameter of the insulating layer 420B. In this case, the resin part 51 is provided in the groove part 421 so that the opening edge of the insulating layer 420 </ b> B is inserted into the resin part 51. Thereby, it can suppress more reliably that the resin part 51 peels from the sealing board 42 with a shear stress.

(Other variations)
In the said 2nd Embodiment, although the diameter dimension of the base end side inner periphery 711 of the wall part 7 illustrated larger than the diameter dimension of the opening edge 422 of the groove part 421, it is not limited to this. For example, the diameter dimension of the opening edge 422 of the groove part 421 may be larger than the diameter dimension of the proximal end inner peripheral edge 711 of the wall part 7.
In the configuration in which no wall portion is provided as described in the first embodiment, for example, the opening diameter of the insulating layer 420B may be larger than the opening diameter of the semiconductor substrate 420A.

  In each of the embodiments described above, the wiring part may have a covering part that covers the wiring part. By forming the covering portion using a material having a relatively high electrical conductivity such as Au, the contact resistance between the wiring portion and the conducting portion can be reduced. Further, when the conductive film and the covering portion of the conductive portion are formed using Au, connection reliability can be improved by diffusion bonding between Au layers.

  In each of the above embodiments, the configuration in which the wiring portion is rectangular and protrudes from the element substrate 41 toward the sealing plate 42 is illustrated. However, the wiring portion is not limited to the above configuration, and may be, for example, a conductive film formed on the element substrate 41. That is, the wiring portion may be thin with respect to a functional element such as a piezoelectric element and may not protrude toward the sealing plate 42 side.

  In each of the above embodiments, the ultrasonic transducer group 45A, which is a transmission / reception channel, is configured by the two ultrasonic transducers 45, but the ultrasonic transducer group 45A is configured by three or more ultrasonic transducers 45. May be. Further, the lower electrode 413A of each ultrasonic transducer 45 may be independent, and each ultrasonic transducer 45 may be configured to be individually drivable. In this case, each ultrasonic transducer 45 can also function as one transmission / reception channel.

  In each of the above embodiments, the ultrasonic transducer group 45A as one transmission / reception channel has a two-dimensional array structure arranged in a matrix in the array region Ar1 of the element substrate 41. However, the present invention is not limited to this. For example, the ultrasonic device may have a one-dimensional array structure in which a plurality of transmission / reception channels are arranged along one direction. For example, an ultrasonic transducer group 45A is constituted by a plurality of ultrasonic transducers 45 arranged in the X direction, and a plurality of ultrasonic transducer groups 45A are arranged in the Y direction, and an ultrasonic array UA having a one-dimensional array structure. May be configured.

  In each of the above embodiments, as the ultrasonic transducer 45, the configuration including the vibration film 412 and the piezoelectric element 413 formed on the vibration film 412 is exemplified, but the present invention is not limited to this. For example, the ultrasonic transducer 45 includes a flexible part, a first electrode provided in the flexible part, and a second electrode provided at a position facing the first electrode in the sealing plate. It may be adopted. The first electrode and the second electrode constitute an electrostatic actuator as a vibrator. In such a configuration, an ultrasonic wave is transmitted by driving the electrostatic actuator, and an ultrasonic wave is detected by detecting a capacitance between the electrodes.

  In each of the above-described embodiments, the electronic apparatus is exemplified as an ultrasonic device whose measurement target is an organ in a living body, but is not limited thereto. For example, the structure of the said embodiment and each modification is applicable to the measuring machine which performs the detection of the defect of the said structure, and the test | inspection of aging for various structures. Further, for example, the same applies to a measuring machine that uses a semiconductor package, a wafer, or the like as a measurement target and detects a defect of the measurement target. The same applies to a recording apparatus including an inkjet head that drives a piezoelectric element to eject ink droplets.

  In each of the above embodiments, the configuration in which the ultrasonic transducer is provided on the element substrate is exemplified, but the present invention is not limited to this. For example, an electronic component such as a semiconductor IC, that is, a substrate, a functional element provided on the substrate, a resin portion (resin protrusion), and a conductive film (wiring) connected to the functional element, and from the substrate to another The configurations of the above-described embodiments and modifications can also be adopted for a mounting structure that is electrically connected to a substrate and various electronic devices that include the mounting structure.

  In addition, the specific structure for carrying out the present invention may be configured by appropriately combining the above-described embodiments and modifications within the scope that can achieve the object of the present invention, and may be appropriately changed to other structures and the like. May be.

  DESCRIPTION OF SYMBOLS 1 ... Ultrasonic measuring device, 2 ... Ultrasonic probe, 5, 5A, 6 ... Conducting part, 7, 7A ... Wall part, 8, 8A ... Base wiring, 10 ... Control apparatus, 21 ... Housing, 22 ... Ultrasonic Device 42 ... Sealing plate 42A ... Inner surface 45 ... Ultrasonic transducer 51, 51A, 61 ... Resin part 52 ... Conductive film 72 ... Top surface 420A ... Semiconductor substrate 420B ... Insulating layer 421 426 ... groove part, 422 ... opening edge, 423 ... groove inner surface.

Claims (12)

A substrate,
A groove formed on one surface of the substrate;
A resin protrusion provided in the groove,
And a wiring provided from the substrate to the resin protrusion. The mounting structure according to claim 1,
The groove has an opening edge that opens on the one surface of the substrate and forms the opening.
The mounting structure according to claim 1, wherein the resin protrusion is in contact with the opening edge. In the mounting structure according to claim 1 or 2,
The mounting structure according to claim 1, wherein the groove inner surface of the groove is curved in a concave shape. The mounting structure according to claim 1,
A mounting structure comprising: a wall portion surrounding the groove and the resin protrusion in a plan view as viewed from the thickness direction of the substrate. The mounting structure according to claim 4,
The wall portion has a top surface opposite to the substrate in the thickness direction,
The mounting structure, wherein the resin protrusion is in contact with an inner periphery of the top surface. In the mounting structure according to claim 4 or 5,
The wall portion has an inner surface on the groove portion side in a plan view in the thickness direction of the substrate,
The mounting structure according to claim 1, wherein the inner surface is curved in a concave shape. In the mounting structure according to any one of claims 4 to 6,
The wall portion has a top surface opposite to the substrate in the thickness direction, and an outer surface opposite to the groove portion in the plan view,
The mounting structure according to claim 1, wherein the outer surface has an inclined portion that inclines toward the outside in the plan view as it goes from the top surface to the substrate, and in which the wiring is formed. In the mounting structure according to any one of claims 4 to 7,
Provided from the groove part side of the wall part to the opposite side of the groove part, and in the plan view, comprising a ground wiring covering at least a part of the wall part,
The wiring structure is provided on the base wiring at a position overlapping the wall portion in the plan view. A substrate,
A groove formed on one surface of the substrate;
A resin protrusion provided in the groove,
Wiring provided from the substrate to the resin protrusion;
An ultrasonic device, comprising: an ultrasonic transducer electrically connected to the wiring. A substrate,
A groove formed on one surface of the substrate;
A resin protrusion provided in the groove,
Wiring provided from the substrate to the resin protrusion;
An ultrasonic device electrically connected to the wiring, and an ultrasonic device comprising:
An ultrasonic probe comprising: a housing that houses the ultrasonic device. A substrate,
A groove formed on one surface of the substrate;
A resin protrusion provided in the groove,
Wiring provided from the substrate to the resin protrusion;
An ultrasonic transducer electrically connected to the wiring;
A control unit that controls the ultrasonic transducer. A substrate,
A groove formed on one surface of the substrate;
A resin protrusion provided in the groove,
Wiring provided from the substrate to the resin protrusion;
A functional element electrically connected to the wiring;
And a control unit that controls the functional element.

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