JP2018085279A - Display panel and organic EL panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display panel and an organic EL panel which improve electrolytic corrosion durability.SOLUTION: An organic EL panel 100 includes: a substrate 1 having a light-transmitting property, in which a plurality of wiring lines 4, 9 and a plurality of light-emitting pixels 20 are formed. As the plurality of wiring lines 4, 9, a plurality of anode wiring portions 4 for turning on the light emitting pixels 20 by supplying a predetermined current and at least one electrolytic corrosion countermeasure wiring portion 9, formed between each of the plurality of anode wiring portions 4, to which second potential is applied, the second potential being smaller than first potential applied to the anode wiring portions 4 when the light emitting pixels 20 are turned on.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a display panel and an organic EL panel.

  Patent Document 1 discloses a COG (Chip On Glass) type organic EL panel in which an IC (Integrated Circuit) chip is directly mounted on a substrate. The panel according to Patent Document 1 has bumps (projection electrodes, bumps) formed on the mounting surface of the IC chip in a plan view (when viewed from the direction perpendicular to the panel) of the wiring on the substrate ("drawing wiring 109"). "Output bump power 114b") is drawn so as to overlap, and the wiring and the bump are connected via an anisotropic conductive material such as ACF (Anisotropic Conductive Film). The other end of the wiring is connected to an electrode (“anode electrode 102”), and a signal (current) is supplied.

JP 2007-287609 A

  In recent years, organic EL panels have increased driving current values due to higher luminance, and wiring resistance has been increased due to longer wiring lengths due to larger size. As a result, the driving peak value (voltage value) in the on state (light emission) of the pixel (organic EL element) is high. When such a high-luminance large panel continues to be turned on in a high-temperature and high-humidity environment, depending on the pattern of the on-state, galvanic corrosion progresses quickly, resulting in poor conduction due to disconnection. Therefore, there is room for improvement in the electrolytic corrosion durability in the organic EL panel.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a display panel and an organic EL panel that can have good electrolytic corrosion durability.

In order to achieve the above object, a display panel according to the first aspect of the present invention provides:
A plurality of wirings and a plurality of pixels are formed, and includes a light-transmitting substrate.
The plurality of wirings are formed between each of the plurality of first wirings that turn on the pixel by supplying a predetermined current and the plurality of first wirings, and the pixel is in the on state. And at least one second wiring to which a second potential smaller than the first potential applied to the first wiring is applied is formed.
It is characterized by that.

In order to achieve the above object, an organic EL panel according to the second aspect of the present invention includes:
A plurality of wirings and a plurality of organic EL elements are formed, and includes a light-transmitting substrate.
The plurality of wirings are formed between a plurality of first wirings that cause the organic EL element to emit light when a predetermined current is supplied, and the plurality of first wirings. At least one second wiring to which a second potential lower than the first potential applied to the first wiring when light emission is applied is formed;
It is characterized by that.

  According to the present invention, the electrolytic corrosion durability can be improved.

It is a disassembled perspective view of the organic electroluminescent panel which concerns on one Embodiment of this invention. FIG. 2 is a schematic plan view of the organic EL panel shown in FIG. 1. (A) is a schematic sectional drawing in the AA line shown to Fig.2 (a) of an organic electroluminescent panel, (b) is a schematic sectional drawing in the BB line shown to Fig.2 (a), (C) is a schematic sectional drawing in CC line shown to Fig.2 (a). (A) is a figure which shows a part of anode wiring part of the conventional organic EL panel, (b) shows a part of anode wiring part and electrolytic corrosion countermeasure wiring part of the organic EL panel shown in FIG. FIG.

  An embodiment of the present invention will be described with reference to the drawings.

  As shown in FIGS. 1 to 3, an organic EL (Electro-Luminescence) panel 100 according to this embodiment includes a substrate 1, a light emitting unit 2, a sealing unit 3, an anode wiring unit 4, and a cathode wiring unit. 5, a connection wiring portion 6, an anisotropic conductive material 7, and an IC (Integrated Circuit) chip 8.

  Hereinafter, for easy understanding, description will be made as appropriate using X, Y, and Z axes orthogonal to each other (see FIG. 1 and the like). Also, the direction in which the arrow indicating each axis faces is the + (plus) direction of each axis, and the opposite direction is the-(minus) direction.

FIG. 1 is an exploded perspective view of the organic EL panel 100 and shows a state before a connecting member 200 and an IC chip 8 to be described later are arranged.
FIG. 2 is a schematic plan view of the organic EL panel 100 as viewed from the + Z direction, and shows a portion on the left side of the center line O shown in FIG. Note that the portion on the right side of the center line O is configured to be substantially line-symmetric with the left portion, and thus description thereof will be omitted as appropriate.
3A is a schematic cross-sectional view taken along line AA of the organic EL panel 100, FIG. 3B is a schematic cross-sectional view taken along line BB of the organic EL panel 100, and FIG. FIG. 3 is a schematic cross-sectional view of the organic EL panel 100 taken along the line CC. In FIG. 3, hatching that represents the cross section of the substrate 1, the sealing portion 3, and the IC chip 8 is omitted for easy viewing.
FIG. 4A is a diagram showing a part of the anode wiring portion of the conventional organic EL panel (before countermeasures), and FIG. 4B is the anode wiring portion and the electric corrosion countermeasure wiring of the organic EL panel 100. It is a figure which shows a part of part.

  The substrate 1 is made of glass, for example, and is formed in a rectangular shape as shown in FIG. The substrate 1 has translucency and electrical insulation. On the substrate 1 (on the surface facing the + Z direction), the light emitting section 2 (see FIGS. 3A and 3B), the anode wiring section 4, the cathode wiring section 5, and the connection wiring section 6 (FIG. 1, FIG. Etc.) are formed.

  As shown in FIGS. 3A and 3B, the light emitting unit 2 includes an anode 21, an organic layer 22, and a cathode 23. Although not shown, in a plan view (when viewed from the Z direction), the anodes 21 are formed in a strip shape along the Y direction, and a plurality of anodes 21 are arranged at predetermined intervals in the X direction. Similarly, although not shown in the figure, in plan view, the cathodes 23 are formed in a strip shape along the X direction, and a plurality of cathodes 23 are arranged at predetermined intervals in the Y direction. In the light emitting unit 2 according to the present embodiment, a plurality of light emitting pixels (organic EL) formed by a portion where the anode 21 and the cathode 23 intersect and the organic layer 22 is sandwiched between the anode 21 and the cathode 23. It is a passive matrix type light emitting section capable of emitting light by the element 20 (see FIG. 2). The plurality of light emitting pixels 20 are provided in a matrix along the X direction and the Y direction in plan view. The light emitting unit 2 can display a predetermined image by a combination of light emission and non-light emission of the plurality of light emitting pixels 20. That is, the organic EL panel 100 functions as a display panel.

  The anode 21 is a transparent electrode, for example, and functions as an anode for injecting holes. The anode 21 is formed by forming a conductive material (hereinafter referred to as a translucent conductive material) such as ITO (Indium Tin Oxide), AZO (Aluminum Zinc Oxide), or IZO (hereinafter referred to as a translucent conductive material) on the substrate 1. A film is formed and patterned into a desired shape by a photolithography method. As shown in FIG. 3A, one end portion (the end portion on the −Y side) of each anode 21 is connected to the anode wiring portion 4 composed of a plurality of corresponding anode wirings.

  Note that an insulating layer, a partition, and the like (not shown) are formed on the substrate 1. The insulating layer is made of, for example, a polyimide-based electrically insulating material, and is formed on the anode 21 so as to be positioned between the anode 21 and the cathode 23. The insulating layer prevents a short circuit between the anode 21 and the cathode 23 and defines each light emitting pixel 20 by the formed opening. The insulating layer is also extended between the cathode wiring part 5 and the cathode 23 and has a contact hole for connecting the cathode wiring part 5 and the cathode 23. The partition wall is made of, for example, a phenol-based electrically insulating material and is formed on the insulating layer. A plurality of partition walls are formed at equal intervals in a direction orthogonal to the anode 21. The partition walls are provided in order to divide each of the organic layer 22 and the cathode 23 during the formation process.

  The organic layer 22 is formed on the anode 21, and is formed by sequentially laminating a hole injection layer, a hole transport layer, an organic light emitting layer, and an electron transport layer by means such as vapor deposition or sputtering. It is formed. In addition, the organic layer 22 should just have an organic light emitting layer at least.

  The cathode 23 is an opaque electrode, for example, and functions as a cathode for injecting electrons. The cathode 23 is a low resistance conductive film formed on the organic layer 22. For the cathode 23, for example, a conductive material containing a single metal or an alloy such as Al, Ag, Mg, Co, Li, and Zn (hereinafter referred to as an opaque conductive material) is formed by means such as sputtering or vapor deposition. It is made. The cathode 23 is connected to the cathode wiring part 5 through a contact hole (not shown) provided in the insulating layer.

  The sealing part 3 accommodates the light emitting part 2 in an airtight manner, and is formed, for example, from glass into a plate shape. The sealing part 3 is arrange | positioned on the board | substrate 1 through the seal | sticker 3a.

  The anode wiring portion 4 is a wiring for electrically connecting the anode 21 and the IC chip 8 and is drawn out from the sealing portion 3 toward the −Y direction as shown in FIGS. 2 and 3A. It is formed so as to be pulled out from the substantially sealed space formed by the sealing portion 3. The anode wiring section 4 is supplied with a driving current (an example of a predetermined current) from a corresponding output bump 83 (an example of a first protruding electrode) in a bump group 80 (an example of a protruding electrode group) described later. These are a plurality of wirings for bringing the connected light emitting pixels 20 into a light emitting state (an example of an on state). The anode wiring part 4 is formed from, for example, a light-transmitting conductive material. In addition, the anode wiring part 4 may be comprised from the laminated body of a translucent conductive material and a translucent conductive material.

  In FIG. 2, for ease of viewing, the IC chip 8 is represented by a broken line, and a bump group 80 described later is represented by a dotted line. 1 and 2 schematically show the shapes of the anode wiring portion 4, the cathode wiring portion 5 and the connection wiring portion 6 described below in order to facilitate understanding of the configuration.

  The cathode wiring portion 5 is a wiring for electrically connecting the cathode 23 and the IC chip 8 and is formed so as to be drawn from the sealing portion 3 in the direction of approximately −Y as shown in FIG. ing. The cathode wiring part 5 is a wiring for scanning an arbitrary connected cathode 23 by applying a scanning potential (for example, a ground potential) from a corresponding output bump 82 in a bump group 80 described later. The cathode wiring part 5 is formed from, for example, a light-transmitting conductive material. In addition, the cathode wiring part 5 may be comprised from the laminated body of a translucent conductive material and a translucent conductive material.

  The connection wiring part 6 is a wiring for connecting the IC chip 8 and an external circuit. As shown in FIG. 2, the connection wiring portion 6 is formed on the substrate 1 at a lower end portion of the substrate 1 in FIG. 2 while being separated from the anode wiring portion 4 and the cathode wiring portion 5. The connection wiring part 6 is formed from, for example, a light-transmitting conductive material. In addition, the connection wiring part 6 may be comprised from the laminated body of a translucent conductive material and a translucent conductive material. The connection wiring portion 6 is connected to a connection member 200 whose lower end portion (end portion on the −Y side) in FIG. 2 extends from an external circuit. The connecting member 200 is made of, for example, FPC (Flexible Printed Circuits).

  The anisotropic conductive material 7 electrically connects the IC chip 8 and each of the anode wiring part 4, the cathode wiring part 5, and the connection wiring part 6. The anisotropic conductive material 7 is located between the IC chip 8 and the substrate 1 as shown in FIG. The anisotropic conductive material 7 is made of, for example, a film-like adhesive called ACF (Anisotropic Conductive Film) or a paste-like adhesive called ACP (Anisotropic Conductive Paste). ACF and ACP are obtained by dispersing conductive particles (such as nickel particles and gold-plated plastic particles) in an adhesive composed of a thermosetting resin such as an epoxy resin. The anisotropic conductive material 7 is also provided between the connection wiring part 6 and the connection member 200, and electrically connects both. In FIG. 1, the location (first location) of the anisotropic conductive material 7 corresponding to the arrangement area of the IC chip 8 and the arrangement of the anisotropic conductive material 7 corresponding to the arrangement area of the connecting member 200 are indicated by dotted lines. A location (second location) is shown. As shown in FIG. 1, the second location is located closer to the end of the substrate 1 (the end on the −Y side) than the first location.

  The IC chip 8 is a driving IC that is mounted on the substrate 1 by the COG method and constitutes a driving circuit (signal line driving circuit and scanning line driving circuit) that drives the light emitting unit 2 to emit light. The IC chip 8 has a bump group 80 composed of a plurality of bumps (for example, protruding electrodes made of a highly conductive metal such as gold), and is connected to various wirings formed on the substrate 1 by the bump group 80.

  As schematically shown in FIG. 1, a plurality of bump groups 80 are arranged in the X direction and the Y direction. Various wirings formed on the substrate 1 are formed in consideration of the arrangement of the bump groups 80 as shown in FIG. In FIG. 2, a part of the bump group 80 of the IC chip 8 mounted on the substrate 1 is indicated by a dotted line.

  The bump group 80 is electrically connected to the input bump group electrically connected to the connection wiring part 6 via the anisotropic conductive material 7 and to each of the anode wiring part 4 and the cathode wiring part 5 via the anisotropic conductive material 7. And output bump groups to be connected.

  In FIG. 2, an input bump 81 represents an arbitrary input bump in the input bump group. The input bump 81 is conductively connected to one of the wirings constituting the connection wiring part 6 through the anisotropic conductive material 7. Other input bumps are not shown in the figure, but a plurality of input bumps are provided, for example, at positions overlapping the formation region of the connection wiring part 6 according to the wiring constituting the connection wiring part 6.

  Further, the output bump 82 indicates two output bumps connected to the cathode wiring portion 5 in the output bump group. The output bump 82 can output a scanning potential and is electrically connected to the cathode wiring portion 5 through the anisotropic conductive material 7 as shown in FIG. Further, the output bump 83 shows six output electrode bumps that are electrically connected to the anode wiring portion 4 in the output bump group. The output bump 83 can output a drive current, and is electrically connected to the anode wiring portion 4 via the anisotropic conductive material 7 as shown in FIG.

  In addition to such input bumps and output bumps, the bump group 80 has a plurality of dummy bumps 80 d that are not electrically connected to various wirings formed on the substrate 1. The dummy bumps 80d are provided, for example, from the viewpoint of stability of placement of the IC chip 8 on the substrate 1. In FIG. 2, a plurality of dummy bumps 80 d are arranged in the Y direction together with the output bumps 82, and a plurality of dummy bumps 80 d are arranged in the X direction together with the input bumps 81. Hereinafter, the input bumps and the output bumps are also referred to as “drive bumps” in comparison with the dummy bumps 80d.

  The bump group 80 has a plurality (six in this embodiment) of anti-corrosion bumps 80m that are electrically connected to the anti-corrosion wiring portion 9 formed on the substrate 1. The electric corrosion countermeasure bump 80m can output an arbitrary intermediate potential (an example of a second potential), and applies the intermediate potential to the electric corrosion countermeasure wiring portion 9. Details of the intermediate potential will be described later. As shown in FIG. 3B, the electric corrosion countermeasure bump 80 m is electrically connected to the electric corrosion countermeasure wiring portion 9 through the anisotropic conductive material 7.

  Each bump (drive bump and dummy bump 80d) constituting the bump group 80 is formed in a rectangular shape in plan view (when viewed from the Z direction), and its short side faces the outer shape of the IC chip 8. Is arranged. For example, the bumps arranged along the Y direction are arranged at equal intervals. For example, the bumps arranged along the X direction are arranged at equal intervals.

  The electrolytic corrosion countermeasure wiring portion 9 is a wiring that is not connected to any of the plurality of light emitting pixels 20, and as shown in FIG. It is formed so as to be pulled out to a position overlapping with the anti-eating bump 80m. Note that the end portion on the sealing portion 3 side of the electric corrosion countermeasure wiring portion 9 may be grounded (grounded) or may be opened. The electrolytic corrosion countermeasure wiring section 9 is formed between the wirings of the anode wiring section 4, and at least one or more intermediate potentials are applied from the corresponding electrolytic corrosion countermeasure bump 80m of the bump group 80 (in the present embodiment, 6). The electric corrosion countermeasure wiring part 9 is formed of, for example, a light-impermeable conductive material. In addition, the electric corrosion countermeasure wiring part 9 may be comprised from the laminated body of a translucent conductive material and a translucent conductive material.

  The organic EL panel 100 configured as described above operates under the control of an external circuit via the IC chip 8 mounted on the substrate 1. The IC chip 8 scans the drive current from the output bump 83 to each anode 21 via the anode wiring portion 4 and the each bump 23 from the output bump 82 via the cathode wiring portion 5 based on the drive signal from the external circuit. Supply potential. Thereby, a drive current flows through the organic layer 22 between the anode 21 and the cathode 23 in the light emitting pixel 20, and the light emitting pixel 20 (organic light emitting layer) emits light (becomes an ON state). Note that the organic EL panel 100 of the present embodiment is of a bottom emission type that emits light emitted from the organic light emitting layer from the substrate 1 side.

Next, actions and effects of the provision of the electrolytic corrosion countermeasure wiring portion 9 and the electrolytic corrosion countermeasure bump 80m will be described with reference to FIG.
FIG. 4A shows three wirings adjacent to each other in the extending direction of the cathode 23 (generally in the X direction) in the anode wiring portion 4 in the conventional organic EL panel. As a result of intensive studies, the inventor of the present application has found that the progress of electrolytic corrosion differs depending on the display (light emission) pattern in an organic EL panel having a plurality of wirings, particularly three or more wirings, as the anode wiring portion 4. That is, the three light emitting pixels 20 connected to the three wirings are connected when the display patterns that respectively emit light (on state), non-light emission (off state), and light emission (on state) are continuously displayed. The erosion of the wiring where the light emitting pixel 20 does not emit light is accelerated. In particular, the portion 41 exposed to the outside of the wiring, that is, the portion of the anode wiring portion 4 from the end of the IC chip 8 (more precisely, the anisotropic conductive material 7) to the sealing portion 3 is subjected to electrolytic corrosion. Progress is remarkable. This is because the wiring in which the light emitting pixel 20 does not emit light is supplied with a drive current and is sandwiched between the electric fields (potential difference) of the wiring in which the light emitting pixel 20 emits light, thereby causing an electric field that is one of the causes of electrolytic corrosion. This seems to be due to receiving a higher potential. For example, when the connected light emitting pixel 20 emits no light, the potential applied to the anode wiring portion 4 (hereinafter also referred to as off potential) is 0 V, and the connected light emitting pixel 20 emits light. Consider a case where the potential (hereinafter also referred to as drive potential) applied to the anode wiring portion 4 is 8V. In this case, the connected light emitting pixel 20 is sandwiched between the lines that emit light, and the connected light emitting pixel 20 does not emit light receives a potential difference of 8V.
On the other hand, in the organic EL panel 100 according to this embodiment, each wiring of the electrolytic corrosion countermeasure wiring unit 9 is provided between the wirings of the anode wiring unit 4. The intermediate potential applied to the electric corrosion prevention wiring unit 9 is smaller than the driving potential, and from the viewpoint of uniformizing the magnetic field that can be received by each wiring of the anode wiring unit 4, it is between the off potential and the driving potential. A central potential is desirable. For example, when the off potential is 0V and the drive potential is 8V, the intermediate potential is preferably less than 8V and 4V. When the intermediate potential is 4 V, as shown in FIG. 4B, the connected light emitting pixel 20 is sandwiched between the light emitting lines in the anode wiring portion 4 and the connected light emitting pixel 20 is The potential difference received by the non-light-emitting wiring is reduced to 4V. Therefore, the organic EL panel 100 can suppress the progress of electrolytic corrosion as compared with a conventional organic EL panel that does not take any measures.

  In the above description, the bumps (drive bumps, dummy bumps 80d, and electrolytic corrosion countermeasure bumps 80m) constituting the bump group 80 are arranged at equal intervals. However, the present invention is not limited to this. At least a part of the arrangement interval of the bumps may be different.

  In addition, this invention is not limited by the above embodiment and drawing. Changes (including deletion of components) can be made as appropriate without departing from the scope of the present invention.

  In the above, the organic EL panel 100 is an example of a bottom emission type, but may be a top emission type. Moreover, although the organic EL panel 100 has shown an example of the passive matrix type in the above, it may be an active matrix type. In addition, the organic EL panel 100 may not have a matrix-shaped electrode, and may not display an image by combining the light emitting pixels 20. The organic EL panel 100 may be configured as a part of a light emitting device or a lighting device.

  The display panel may be a liquid crystal display panel. In a liquid crystal display panel, a liquid crystal display element constitutes a pixel. Further, the display panel and the organic EL panel are not limited to the COG type panel. A COF (Chip on Film) type panel in which an IC chip that supplies a first current and a second current is mounted on an FPC (Flexible printed circuits), or a COB (Chips on Board) type panel mounted on a printed board. Also good. Any type of panel may be used as long as it includes a light-transmitting substrate 1 on which wiring and pixels are formed.

(1) The display panel and organic EL panel described above are
A plurality of wirings (anode wiring part 4, anti-corrosion wiring part 9) and a plurality of pixels or a plurality of organic EL elements (light emitting pixels 20) are formed, and includes a transparent substrate 1.
As the plurality of wirings, a plurality of first wirings (anode wiring part 4) for turning on the pixel or emitting light from the organic EL element by supplying a predetermined current (driving current), and the plurality of wirings Formed between each of the first wirings, and is smaller than a first potential applied to the first wiring when the pixel is turned on or the organic EL element emits light. At least one or more second wirings (electric corrosion countermeasure wiring part 9) to which two potentials (intermediate potentials) are supplied are formed.
Since it did in this way, the electric potential of the magnetic field which wiring receives can be reduced and electric corrosion durability can be made favorable.

(2) Moreover, the sealing part 3 which seals the said several pixel is provided,
The second wiring is formed so as to extend from the sealing portion 3 along the first wiring when viewed from the direction perpendicular to the substrate 1, and the plurality of pixels or the plurality of organic EL elements. No connection is made to either.
Since it did in this way, especially the electrolytic corrosion durability of the part 41 where electrolytic corrosion advances among wiring can be made favorable reliably.

An IC chip 8 mounted on the substrate 1,
The IC chip 8 has a protruding electrode group (bump group 80) protruding toward the substrate 1,
The current is supplied to the first wiring from the first protruding electrode (output bump 83) in the protruding electrode group, and the second protruding electrode (electric corrosion countermeasure bump 80m) in the protruding electrode group is used to supply the first current. A potential of 2 is applied to the second wiring.
Also in the COG type panel, the potential of the magnetic field received by the wiring can be reduced, and the electrolytic corrosion durability can be improved.

  In the above description, in order to facilitate understanding of the present invention, descriptions of known technical matters are omitted as appropriate.

  The present invention is suitable for display panels and organic EL panels.

DESCRIPTION OF SYMBOLS 100 ... Organic EL panel 1 ... Board | substrate 2 ... Light emission part 3 ... Sealing part 4 ... Anode wiring part (1st wiring)
DESCRIPTION OF SYMBOLS 5 ... Cathode wiring part 6 ... Connection wiring part 7 ... Anisotropic conductive material 8 ... IC chip 20 ... Light emitting pixel (organic EL element)
80 ... Bump group (projection electrode group)
80d ... Dummy bump (dummy electrode)
80m ... Electric corrosion countermeasure bump (second protruding electrode)
81 ... Input bump 82 ... Output bump 83 ... Output bump (first protruding electrode)
9 ... Electric corrosion countermeasure wiring part (second wiring)

Claims (6)

A plurality of wirings and a plurality of pixels are formed, and includes a light-transmitting substrate.
The plurality of wirings are formed between each of the plurality of first wirings that turn on the pixel by supplying a predetermined current and the plurality of first wirings, and the pixel is in the on state. And at least one second wiring to which a second potential smaller than the first potential applied to the first wiring is applied is formed.
A display panel characterized by that. A sealing portion for sealing the plurality of pixels;
The second wiring is formed so as to extend along the first wiring from the sealing portion when viewed from the direction perpendicular to the substrate, and is not connected to any of the plurality of pixels. Is,
The display panel according to claim 1. An IC chip mounted on the substrate;
The IC chip has a protruding electrode group protruding toward the substrate,
The current is supplied from the first protruding electrode of the protruding electrode group to the first wiring, and the second potential is applied to the second wiring from the second protruding electrode of the protruding electrode group. The
The display panel according to claim 1, wherein the display panel is a display panel. A plurality of wirings and a plurality of organic EL elements are formed, and includes a light-transmitting substrate.
The plurality of wirings are formed between a plurality of first wirings that cause the organic EL element to emit light when a predetermined current is supplied, and the plurality of first wirings. At least one second wiring to which a second potential lower than the first potential applied to the first wiring when light emission is applied is formed;
An organic EL panel characterized by that. A sealing portion for sealing the plurality of organic EL elements;
The second wiring is formed so as to extend from the sealing portion along the first wiring when viewed from the direction perpendicular to the substrate, and for any of the plurality of organic EL elements. Unconnected,
The organic EL panel according to claim 4. An IC chip mounted on the substrate;
The IC chip has a protruding electrode group protruding toward the substrate,
The current is supplied from the first protruding electrode of the protruding electrode group to the first wiring, and the second potential is applied to the second wiring from the second protruding electrode of the protruding electrode group. The
The organic EL panel according to claim 4 or 5, wherein

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