JP2018083893A - Solid resin composition for sealing and rearrangement wafer therewith, semiconductor package, and production method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid resin composition for sealing in which a pseudo-wafer is suppressed from warpage that may cause a decrease in productivity in the WLP (wafer level packaging), and a rearrangement wafer therewith, a semiconductor package, and a production method thereof.SOLUTION: A solid resin composition including: (A) an epoxy resin, (B) a phenol curing agent, (C) a maleimide resin, (D) a phosphorus atom-containing curing promoter, and (E) a solid resin composition containing a filler, in which among a total mass of (A)+(B)+(C), the (C) is 30 to 70% by mass. A rearrangement wafer in which many semiconductor chips are arranged on a substrate followed by sealing with the solid resin composition for sealing. Semiconductor packages obtained by individualizing the rearrangement wafer.SELECTED DRAWING: None

Description

  The present invention relates to a solid resin sealing composition for a solid sealing material, a rearranged wafer using the same, a semiconductor package, and a method for manufacturing a semiconductor package.

Reflecting the recent trend of downsizing, weight reduction, high integration, and high-speed operation of electronic devices, the area and volume of the semiconductor chip in the semiconductor package are increased, and the wiring in the semiconductor package is miniaturized and shortened. ing.
Conventionally, as a method of electrically connecting such a semiconductor chip to a wiring board, there is a mounting method called flip-chip connection in which bump electrodes are formed on the semiconductor chip and the bumps are collectively bonded to the wiring board by the bumps. is there. In this method, for example, when the semiconductor chip is downsized, the wiring pattern on the wiring board must be changed, leading to a time lag and cost increase during development, and not suitable for high-mix low-volume production.
Therefore, a method called a wafer level package (WLP) has been devised in which bumps for electrical connection are provided and the entire wafer is sealed before the wafer on which the semiconductor circuit is formed is cut into individual semiconductor chips. For example, see Patent Document 1).
Since WLP does not require flip-chip connection using a wiring board, it is suitable for high-mix low-volume production. However, in WLP, the upper limit of the number of mounting IO (input / output) bumps per unit area, which increases as the function of a semiconductor package increases, is proportional to the area of the semiconductor chip, and cannot support an IO semiconductor chip packed with functions in a small chip. .
Therefore, semiconductor chips that have been cut in advance are arranged on a carrier serving as a support, and after sealing them with a sealing resin in the form of a wafer (pseudo-wafering), rewiring is performed on the circuit surface of the semiconductor chip, thereby providing a semiconductor. There has been proposed a technology that can deal with an excessive number of I / Os with respect to the size of a semiconductor chip while dealing with chip design changes at low cost (see, for example, Patent Document 2).
However, in this type of WLP, the pseudo wafer is warped due to internal stress caused by the difference in thermal expansion coefficient between the sealing resin and the carrier. Has become a problem, and productivity is lowered.

Japanese Patent No. 3616615 US Patent Application Publication No. 2007/205513

  The present invention relates to a solid resin composition for a solid encapsulant that suppresses the warpage of a pseudo wafer that causes a decrease in productivity in WLP (wafer level package), a rearranged wafer using the same, a semiconductor package, and a method for manufacturing the same Is to provide.

The present invention is as follows.
[1] A solid resin composition containing (A) an epoxy resin, (B) a phenol curing agent, (C) a maleimide resin, (D) a phosphorus atom-containing curing accelerator, and (E) a filler, ) + (B) + (C) of the total mass of the solid resin composition for a sealing material, wherein (C) is 30 to 70% by mass.
[2] The solid resin composition for a sealing material according to [1], wherein (C) includes at least two maleimide groups and has a saturated or unsaturated hydrocarbon group.
[3] The solid resin composition for a sealing material according to [1] or [2], wherein the saturated or unsaturated hydrocarbon group (C) has 8 to 100 carbon atoms.
[4] The solid resin composition for a sealing material according to any one of [1] to [3], having a structure in which the saturated or unsaturated hydrocarbon group of (C) is bonded to a maleimide group.
[5] The solid resin composition for a sealing material according to any one of [1] to [4], wherein the (C) has a structure represented by the following general formula (I).

（一般式（Ｉ）中、Ｘは、８〜１００の整数である。）
［６］前記（Ｃ）が下記一般式（ＩＩ）で表される、［１］〜［５］のいずれか一項に記載の封止材用固形樹脂組成物。

(In general formula (I), X is an integer of 8 to 100.)
[6] The solid resin composition for a sealing material according to any one of [1] to [5], wherein (C) is represented by the following general formula (II).

（ただし、ｎ＝０〜５０、Ｘは、８〜１００の整数である。）
［７］［１］〜［６］のいずれか一項に記載の封止用樹脂組成物を用いて、半導体チップを支持体に多数個配置し、封止した再配置ウエハー。
［８］［１］〜［６］のいずれか一項に記載の封止材用固形樹脂組成物を用いて、半導体チップを支持体に多数個配置し（圧縮成形により）封止した再配置ウエハー。
［９］［７］または［８］に記載の再配置ウエハーを個片化した半導体パッケージ。
［１０］［１］〜［６］のいずれか一項に記載の封止材用固形樹脂組成物を用いて作製される半導体パッケージの製造方法であって、半導体チップを支持体に多数個配置する工程、この上に前記固形の封止材用固形樹脂組成物を散布する工程、金型により成形する工程、を含む半導体パッケージの製造方法。

(However, n = 0 to 50 and X is an integer of 8 to 100.)
[7] A rearranged wafer in which a large number of semiconductor chips are arranged on a support and sealed using the sealing resin composition according to any one of [1] to [6].
[8] Relocation in which a large number of semiconductor chips are arranged on a support (by compression molding) and sealed using the solid resin composition for a sealing material according to any one of [1] to [6] Wafer.
[9] A semiconductor package obtained by separating the rearranged wafer according to [7] or [8].
[10] A method for manufacturing a semiconductor package produced using the solid resin composition for a sealing material according to any one of [1] to [6], wherein a plurality of semiconductor chips are arranged on a support. The manufacturing method of a semiconductor package including the process to carry out, the process of sprinkling the solid resin composition for solid sealing materials on this, the process of shape | molding with a metal mold | die.

  INDUSTRIAL APPLICABILITY According to the present invention, a solid resin composition for a solid encapsulant that suppresses warpage of a pseudo wafer that causes a decrease in productivity in WLP (wafer level package), a rearranged wafer using the same, a semiconductor package, and a manufacturing method thereof Can be provided.

  In this specification, the term “process” is not limited to an independent process, and is included in the term if the intended purpose of the process is achieved even when it cannot be clearly distinguished from other processes. . In the present specification, numerical ranges indicated using “to” indicate ranges including the numerical values described before and after “to” as the minimum value and the maximum value, respectively. Further, in the present specification, the content of each component in the composition is the total amount of the plurality of substances present in the composition unless there is a specific notice when there are a plurality of substances corresponding to each component in the composition. Means.

The present invention is a solid resin composition comprising (A) an epoxy resin, (B) a phenol curing agent, (C) a maleimide resin, (D) a phosphorus atom-containing curing accelerator, (E) a filler, (A) Of the total mass of (B) + (C), (C) is a solid resin composition for encapsulant having a content of 30 to 70% by mass, and a rearranged wafer, a semiconductor package and the like using the same It is a manufacturing method. The solid resin composition for a sealing material of the present invention can be used for sealing electronic parts.
Hereinafter, the present invention will be described in detail.

<(A) Epoxy resin>
The epoxy resin (A) used in the present invention has two or more epoxy groups in one molecule, regardless of properties at normal temperature (15 to 35 ° C. is defined as normal temperature in the present invention), molecular weight and structure are also included. It is not limited. For example, novolak type epoxy resins such as phenol novolac type epoxy resin and cresol novolak type epoxy resin, bisphenol A / F type epoxy resin, N, N-diglycidylaniline, N, N-diglycidyltoluidine, diaminodiphenylmethane type glycidylamine, Aromatic glycidyl type epoxy resin such as aminophenol type glycidylamine, hydroquinone type epoxy resin, biphenyl type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, triphenolpropane type epoxy resin, alkyl-modified triphenolmethane type Epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, phenol aralkyl type epoxy resin having phenylene and / or biphenylene skeleton, Fatty substances such as epoxy resins such as aralkyl type epoxy resins such as naphthol aralkyl type epoxy resins having a nylene and / or biphenylene skeleton, and alicyclic epoxies such as vinylcyclohexene dioxide, dicyclopentadiene oxide, and alicyclic diepoxy-adipade Group epoxy resin.
In the present invention, a triphenolmethane type epoxy resin and a triphenolpropane type epoxy resin effective for lowering the elasticity are preferable from the viewpoint of reducing warpage, and biphenyl type epoxy resin is preferably applied from the viewpoint of mechanical properties. These may be used alone or in combination of two or more.

<(B) Phenol curing agent>
The (B) phenol curing agent used in the present invention has two or more phenolic hydroxyl groups in one molecule, regardless of properties at room temperature (15 to 35 ° C. is defined as room temperature in the present invention), molecular weight, The structure is not limited. For example, novolac resins such as phenol novolac resins, cresol novolac resins, bisphenol A / F phenol resins, hydroquinone phenol resins, biphenyl phenol resins, stilbene phenol resins, triphenolmethane phenol resins, triphenolpropane Type phenol resin, alkyl-modified triphenol methane type phenol resin, naphthol type phenol resin, naphthalene type phenol resin, phenol aralkyl type phenol fat having phenylene and / or biphenylene skeleton, naphthol aralkyl type resin having phenylene and / or biphenylene skeleton, etc. Aralkyl-type phenolic resins, and aliphatic phenolic resins such as alicyclic phenolic resins such as dicyclopentadiene. .
In the present invention, a triphenolmethane type phenol resin and a triphenolpropane type phenol resin effective for lowering the elasticity are preferable from the viewpoint of warpage reduction, and a naphthol aralkyl type phenol resin having a phenylene and / or biphenylene skeleton from the viewpoint of mechanical properties. It is preferable to apply an aralkyl type phenol resin such as These may be used alone or in combination of two or more.
The blending amount of the phenol curing agent is preferably in a range where the equivalent ratio of epoxy resin / phenol curing agent is 0.7 to 1.5, more preferably in a range of 0.8 to 1.2, and 0.9 to 1 A range of .1 is more preferred. When it is out of the above range, the curability, moisture resistance reliability, productivity and workability of the composition may be lowered.

<(C) Maleimide resin>
The maleimide resin (C) used in the present invention is preferably a maleimide resin having at least two maleimide groups and a saturated or unsaturated hydrocarbon group. Furthermore, it is more preferable that it is a compound represented by the following general formula (I). The maleimide group may be bonded to an aromatic ring or an aliphatic chain. In addition, the saturated or unsaturated hydrocarbon group preferably has 8 to 100 carbon atoms, more preferably 8 to 50 carbon atoms, and still more preferably 8 to 40 carbon atoms. The hydrocarbon group contained in the maleimide resin may have a linear, branched, or cyclic structure, and may contain an aliphatic alicyclic skeleton and an aromatic skeleton. From the viewpoint of warpage, the compounding amount of the maleimide resin is 30 to 70% by mass with respect to the total mass of the (A) epoxy resin, (B) phenol curing agent, and (C) maleimide resin.

（一般式（Ｉ）中、Ｘは、８〜１００の整数である。）

(In general formula (I), X is an integer of 8 to 100.)

  The (C) maleimide resin used in the present invention is preferably a compound represented by the following general formula (II) having at least two maleimide groups and having a saturated or unsaturated hydrocarbon group.

（一般式（ＩＩ）中、ｎ＝０〜５０、Ｘは、８〜１００の整数である。）
一般式（Ｉ）又は一般式（ＩＩ）で表される化合物は、長鎖アルキルビスマレイミド樹脂である。

(In general formula (II), n = 0 to 50, and X is an integer of 8 to 100.)
The compound represented by general formula (I) or general formula (II) is a long-chain alkyl bismaleimide resin.

The long-chain alkyl bismaleimide resin is a long-chain alkyl bismaleimide resin having a side chain in an alkylene chain, preferably a main chain containing an alkylene chain having 10 or more carbon atoms and a side containing an alkyl group bonded to the alkylene chain. And has a chain. The long-chain alkyl bismaleimide resin has a thermosetting portion with two or more maleimides in one molecule and a flexible expression portion with an alkylene chain. The maleimide group may be bonded to an aromatic ring or an aliphatic chain, but is preferably bonded to an aliphatic chain.
The main chain constituting the long chain alkyl bismaleimide resin preferably includes an alkylene chain having 10 to 102 carbon atoms, more preferably includes an alkylene chain having 12 to 52 carbon atoms, and has 14 to 22 carbon atoms. More preferably, it contains an alkylene chain. The side chain preferably contains an alkyl group having 2 to 50 carbon atoms, more preferably contains an alkyl group having 3 to 25 carbon atoms, and further preferably contains an alkyl group having 4 to 10 carbon atoms.
The molecular weight of the component (C) is not particularly limited. From the viewpoint of handleability, the lower limit of the weight average molecular weight (Mw) of the component (C) may be 500 or more, 1000 or more, 1500 or more, or 1700. Moreover, 10,000 or less, 9000 or less, 7000 or less, or 5000 or less may be sufficient as the upper limit of Mw of (C) component from a fluid viewpoint. From the viewpoint of handleability, fluidity and embedding property, Mw of component (C) is preferably 500 to 10,000, more preferably 1000 to 9000, still more preferably 1500 to 9000, and 1500 to More preferably, it is 7000, and it is very preferable that it is 1700-5000.
(C) Mw of a component can be measured by a gel permeation chromatography (GPC) method. Detailed GPC conditions are as follows.
Pump: L-6200 [manufactured by Hitachi High-Technologies Corporation]
Detector: L-3300 RI [manufactured by Hitachi High-Technologies Corporation]
Column oven: L-655A-52 [manufactured by Hitachi High-Technologies Corporation]
Guard column and column: TSK Guardcolumn HHR-L + TSKgel G4000HHR + TSKgel G2000HHR [All trade names, manufactured by Tosoh Corporation]
Column size: 6.0 × 40 mm (guard column), 7.8 × 300 mm (column)
Eluent: Tetrahydrofuran Sample concentration: 30 mg / 5 mL
Injection volume: 20 μL
Flow rate: 1.00 mL / min Measurement temperature: 40 ° C

The method for producing the component (C) is not limited. The component (C) can be produced, for example, by reacting an acid anhydride and a diamine to synthesize an amine-terminated compound, and then reacting the amine-terminated compound with an excess of maleic anhydride.
An example of the acid anhydride is pyromellitic anhydride.
As the diamine, the structure (c) [H ₂ N-structure (c) -NH ₂ ] sandwiched between amino groups is not particularly limited, and may be linear, branched, or cyclic. Moreover, 8-100 may be sufficient as carbon number of a saturated or unsaturated divalent hydrocarbon group. The structure (c) is preferably an alkylene group which may have a branch having 8 to 100 carbon atoms, more preferably an alkylene group which may have a branch having 10 to 70 carbon atoms, More preferably, it is an alkylene group which may have a branch having 15 to 50 carbon atoms. (C) The component has the structure (c), thereby improving the flexibility of the resin composition according to the present embodiment, and handling properties of the resin film produced from the resin composition (tackiness, cracking, powder falling off). Etc.) and strength can be increased. The structure (c) having the above carbon number is preferable because the molecular structure can be easily made three-dimensional and the free volume of the polymer can be increased to reduce the density.

As the structure (c), for example, an alkylene group such as a nonylene group, a decylene group, an undecylene group, a dodecylene group, a tetradecylene group, a hexadecylene group, an octadecylene group or a nonadecylene group; an arylene group such as a benzylene group, a phenylene group or a naphthylene group; Examples include arylene alkylene groups such as phenylenemethylene group, phenyleneethylene group, benzylpropylene group, naphthylenemethylene group, and naphthyleneethylene group; and arylenealkylene groups such as phenylenedimethylene group and phenylenediethylene group.
A group represented by the following formula (III) is particularly preferable as the structure (c) from the viewpoints of low thermal expansion characteristics, adhesion to a conductor, heat resistance, and low hygroscopicity.

式（ＩＩＩ）中、Ｒ_２及びＲ_３は各々独立に炭素数４〜５０のアルキレン基を示す。柔軟性の更なる向上及び合成容易性の観点から、Ｒ_２及びＲ_３は各々独立に、炭素数５〜２５のアルキレン基であることが好ましく、炭素数６〜１０のアルキレン基であることがより好ましく、炭素数７〜１０のアルキレン基であることが更に好ましい。
式（ＩＩＩ）中、Ｒ_４は炭素数４〜５０のアルキル基を示す。柔軟性の更なる向上及び合成容易性の観点から、Ｒ_４は炭素数５〜２５のアルキル基であることが好ましく、炭素数６〜１０のアルキル基であることがより好ましく、炭素数７〜１０のアルキル基であることが更に好ましい。
式（ＩＩＩ）中、Ｒ_５は炭素数２〜５０のアルキル基を示す。柔軟性の更なる向上及び合成容易性の観点から、Ｒ_５は炭素数３〜２５のアルキル基であることが好ましく、炭素数４〜１０のアルキル基であることがより好ましく、炭素数５〜８のアルキル基であることが更に好ましい。
流動性及び回路埋め込み性の観点からは、構造（ｃ）は（Ｃ）成分中に複数存在すると好ましい。その場合、構造（ｃ）はそれぞれ同一であってもよく、異なっていてもよい。例えば、（Ｃ）成分中に２〜４０の構造（ｃ）が存在することが好ましく、２〜２０の構造（ｃ）が存在することがより好ましく、一分子中に２〜１０の構造（ｃ）が存在することが更に好ましい。

In formula (III), R ₂ and R ₃ each independently represents an alkylene group having 4 to 50 carbon atoms. From the viewpoint of further improvement in flexibility and ease of synthesis, R ₂ and R ₃ are each independently preferably an alkylene group having 5 to 25 carbon atoms, and preferably an alkylene group having 6 to 10 carbon atoms. More preferably, it is a C7-10 alkylene group.
In formula (III), R ₄ represents an alkyl group having ₄ to 50 carbon atoms. From the viewpoint of further improving flexibility and ease of synthesis, R ₄ is preferably an alkyl group having 5 to 25 carbon atoms, more preferably an alkyl group having 6 to 10 carbon atoms, and 7 to 7 carbon atoms. More preferably, it is 10 alkyl groups.
In formula (III), R ₅ represents an alkyl group having 2 to 50 carbon atoms. From the viewpoint of further improvement in flexibility and ease of synthesis, R ₅ is preferably an alkyl group having 3 to 25 carbon atoms, more preferably an alkyl group having 4 to 10 carbon atoms, and 5 to 5 carbon atoms. More preferably, it is an alkyl group of 8.
From the viewpoint of fluidity and circuit embedding properties, it is preferable that a plurality of structures (c) exist in the component (C). In that case, the structures (c) may be the same or different. For example, 2 to 40 structures (c) are preferably present in component (C), more preferably 2 to 20 structures (c) are present, and 2 to 10 structures (c) per molecule. More preferably,

  Examples of the diamine include dimer diamine, 2,2-bis (4- (4-aminophenoxy) phenyl) propane, 1,3-bis (4-aminophenoxy) benzene, and 4,4′-bis (4-aminophenoxy). ) Biphenyl, 4,4'-diamino-3,3'-dihydroxybiphenyl, 4,4'-diamino-3,3'-dimethylbiphenyl, 1,3-bis [2- (4-aminophenyl) -2- Propyl] benzene, 1,4-bis [2- (4-aminophenyl) -2-propyl] benzene, polyoxyalkylenediamine, [3,4-bis (1-aminoheptyl) -6-hexyl-5- ( 1-octenyl)] cyclohexene and the like. These may be used alone or in combination of two or more according to the purpose and application.

  As the component (C), a commercially available compound can also be used. As a commercially available compound, for example, Designer Molecules Inc. Specific examples include BMI-1500, BMI-1700, BMI-3000, BMI-5000, BMI-9000 (all are trade names), and the like. From the viewpoint of obtaining better flexibility, it is more preferable to use BMI-3000 as the component (C).

<(D) Phosphorus atom-containing curing accelerator>
The curing accelerator used in the present invention contains a phosphorus atom, and the substituent bonded to the phosphorus atom is not particularly limited. Examples of the curing accelerator that does not contain a phosphorus atom include imidazoles, but imidazoles are highly effective in promoting the condensation reaction between epoxies, and the curing agent is likely to remain unreacted. Therefore, although there exists a tendency for it to be inferior to reliability compared with a phosphorus atom containing hardening accelerator, imidazoles may also be applied if it does not cause a problem. The blending amount of the curing accelerator is preferably 0.3 to 5 parts by mass from the viewpoint of curability and storage stability, when the total mass of the epoxy resin, the phenol curing agent and the maleimide resin is converted to 100. 4 mass parts is more preferable, and 0.7-3 mass parts is still more preferable.
Curing accelerators containing phosphorus atoms include tetrabutylphosphonium-carboxylate, tetraphenylphosphonium-phthalate, tetraphenylphosphonium-laurate, triphenylphosphine, tri-p-tolylphosphine, diphenylcyclohexylphosphine, tricyclohexyl. Phosphine, 1,4-bisdiphenylphosphinobutane, tetraphenylphosphonium tetra-p-tolylborate, tetraphenylphosphonium tetraphenylborate, triphenylphosphinetriphenylborane, tetraphenylphosphonium thiocyanate, tetraphenylphosphonium dicyanamide, n-butyl Triphenylphosphonium dicyanamide, tetrabutylphosphonium decanoate, triphenylphosphine oxide, di E sulfonyl phosphinyl hydroquinone and the like.

<(E) Filler>
The filler used in the present invention is not particularly limited as long as it is generally used as a sealing material. From the viewpoint of fluidity, the shape of the filler is preferably spherical rather than square. As fillers, fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite , Titania, talc, clay, mica and the like; beads formed by spheroidizing them.
The average particle diameter of the filler is preferably 1 μm to 50 μm, and more preferably 3 μm to 30 μm. When the average particle size of the inorganic filler is 1 μm or more, an increase in the viscosity of the resin composition is easily suppressed, and when it is 50 μm or less, the mixing property between the resin composition and the filler is improved and obtained by curing. There is a tendency that the package is homogenized, variation in characteristics is suppressed, and filling property in a narrow region tends to be improved.
In order to suppress aggregation, a filler having a small particle size of 1 μm or less may be used in combination. The blending amount of the filler is preferably 65 to 90% by volume, more preferably 70 to 88% by volume, and 75 to 85% by volume with respect to the components excluding the filler from the viewpoint of fluidity and reliability. Further preferred.

<Elastomer>
The solid resin composition for a sealing material of the present invention may contain a stress relaxation agent such as silicone oil or silicone rubber particles as a stress relaxation agent as necessary. By containing a stress relaxation agent, it is possible to reduce the amount of warpage deformation and package cracks of the package. As a usable stress relaxation agent, a known flexible agent (stress relaxation agent) generally used in the technical field can be appropriately selected and used.
In general, the flexible agents used are thermoplastic elastomers such as silicone, polystyrene, polyolefin, polyurethane, polyester, polyether, polyamide, polybutadiene, NR (natural rubber), NBR (acrylonitrile-butadiene rubber), and acrylic rubber. Rubber particles such as urethane rubber and silicone powder; Core-shell structures such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, methyl methacrylate-butyl acrylate copolymer And the like. A stress relaxation agent may be used individually by 1 type, or may be used in combination of 2 or more type. Among these, silicone-based flexible agents are preferable, and examples of the silicone-based flexible agents include those having an epoxy group, those having an amino group, and those obtained by modifying these with a polyether.

<Coupling agent>
The solid resin composition for a sealing material of the present invention may contain a coupling agent as needed from the viewpoint of enhancing the adhesion between the resin component and the filler. The type of coupling agent is not particularly limited. As the coupling agent, known coupling agents such as various silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, vinyl silane, titanium compound, aluminum chelate compound, aluminum and zirconium-containing compound may be mentioned. These coupling agents may be used alone or in combination of two or more.
When the solid resin composition for sealing materials contains a coupling agent, it is preferable that the content rate of a coupling agent is 0.05 mass%-5 mass% with respect to (E) filler. 1 mass%-2.5 mass% is more preferable. If it is 0.05% by mass or more, the adhesion to a filler or the like tends to be improved, and if it is 5% by mass or less, the moldability of the package tends to be excellent.

<Other additives>
<Flame Retardant>
The solid resin composition for a sealing material of the present invention may contain a flame retardant as necessary in order to impart flame retardancy. The type of flame retardant is not particularly limited. Specifically, examples of the flame retardant include known organic compounds or inorganic compounds containing a halogen atom, an antimony atom, a nitrogen atom, or a phosphorus atom, a metal hydroxide, and acenaphthylene. A flame retardant may be used individually by 1 type, or may be used in combination of 2 or more type.
The content of the flame retardant is not particularly limited as long as the flame retardant effect is achieved. When the solid resin composition for sealing materials contains a flame retardant, the content of the flame retardant is preferably 1% by mass to 30% by mass and 2% by mass to 15% by mass with respect to (A) the epoxy resin. More preferred.

<Anion exchanger>
The solid resin composition for a sealing material of the present invention may contain an anion exchanger as necessary. In particular, when an epoxy resin composition is used as a molding material for sealing, an anion exchanger may be contained from the viewpoint of improving moisture resistance and high temperature storage characteristics of an electronic component device including an element to be sealed. preferable.
There is no restriction | limiting in particular as an anion exchanger, The thing generally used in the said technical field conventionally is mentioned. Examples of the anion exchanger include hydrosartite compounds represented by the following general formula (IV); hydrous oxides of elements selected from magnesium, aluminum, titanium, zirconium and bismuth; An anion exchanger can be used individually by 1 type or in combination of 2 or more types.

Mg _1-x Al _x (OH) ₂ (CO ₃ ) _{x / 2} · mH ₂ O (IV)
(0 <X ≦ 0.5, m is a positive number)
Hydrosartite compounds are captured by substituting anions such as halogen ions with CO ₃ in the structure, and halogen ions incorporated into the crystal structure are desorbed at about 350 ° C. or higher until the crystal structure is destroyed. It has no properties. Examples of hydrosartite having such properties include Mg ₆ Al ₂ (OH) ₁₆ CO ₃ .4H ₂ O produced as a natural product, and Mg _4.3 Al ₂ (OH) _12.6 as a synthetic product. CO ₃ · mH ₂ O and the like can be mentioned. Moreover, the solid resin composition for sealing materials of this invention shows the acidity of pH 3-5 and the extract of the hardened | cured material which uses a pure water by the influence of the phenol hardener (resin) of (B) component. Therefore, the solid resin composition for a sealing material of the present invention is an environment that is easily corroded with respect to aluminum which is an amphoteric metal, but the hydrosartite compound also has an action of adsorbing an acid, so There is also an effect to bring close to sex. It can be inferred that corrosion of aluminum can be effectively prevented by the action effect of the addition of the hydrosartite compound.
In addition, hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, bismuth and antimony can also be captured by replacing halogen ions with hydroxide ions, and these ion exchanges. The body shows excellent ion exchange capacity on the acidic side. About the solid resin composition for sealing materials of this invention, since an extract becomes an acidic side as mentioned above, these hydrous oxides are especially effective with respect to corrosion prevention of aluminum. Examples of such hydrous oxides are hydrous oxides such as MgO _n H ₂ O, Al ₂ O _3n H ₂ O, ZrO ₂ H ₂ O, Bi ₂ O ₃ H ₂ O, Sb ₂ O ₅ nH ₂ O and the like. Things.
The content of the anion exchanger is not particularly limited as long as it is a sufficient amount that can capture anions such as halogen ions. When the solid resin composition for sealing materials contains an anion exchanger, the content of the anion exchanger relative to the epoxy resin (A) is preferably 0.1% by mass to 30% by mass, and 1% by mass. It is more preferable that it is% -5 mass%.

<Release agent>
The solid resin composition for a sealing material may contain a release agent from the viewpoint of exhibiting good release properties for the mold in the molding step. The kind in particular of a mold release agent is not restrict | limited, A mold release agent well-known in the said technical field is mentioned. Specific examples of the release agent include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, polyolefin waxes such as polyethylene oxide and non-oxidized polyethylene. Can be mentioned. A mold release agent may be used individually by 1 type, or may be used in combination of 2 or more type. Among these, as the release agent, an oxidized or non-oxidized polyolefin wax is preferable.
When the resin composition contains a polyolefin wax as a release agent, the content of the polyolefin wax is preferably 0.01% by mass to 10% by mass, and 0.1% by mass with respect to (A) the epoxy resin. -5 mass% is more preferable. If the content of the polyolefin wax is 0.01% by mass or more, the release property tends to be sufficient, and if it is 10% by mass or less, the adhesiveness tends to be sufficient.
Moreover, when using other mold release agent together with polyolefin-type wax, 0.1 mass%-10 mass% are preferable with respect to (A) epoxy resin, and 0.5 mass is preferable. % To 3% by mass is more preferable.

<Colorants etc.>
The solid resin composition for a sealing material of the present invention may contain a colorant such as carbon black, organic dye, organic pigment, titanium oxide, red lead, bengara and the like. In addition, you may contain various additives in the range which does not reduce the effect by this invention as needed.

<Manufacturing method>
As a method for producing the solid resin composition for a sealing material of the present invention, any method may be used as long as various components can be dispersed and mixed uniformly. As a general technique, there can be mentioned a method in which components of a predetermined blending amount are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder or the like, cooled and pulverized. More specifically, the solid resin composition for a sealing material is, for example, a kneader, a roll, an extruder, or the like that is mixed with a predetermined amount of the components described above and stirred and heated to 70 ° C to 140 ° C in advance. After kneading, it can be obtained by a method such as cooling and pulverization. When the solid resin composition for a sealing material is tableted with a size and a mass suitable for the molding conditions of the package, handling becomes easy.

Examples of the semiconductor package of the present invention include the following types, but are not limited thereto.
That is, BGA (Ball Grid Array), FCBGA (Flip Chip BGA), MAPBGA (Molded Array Process BGA), and the like. Further, as a more preferable application example of the solid resin composition for a sealing material of the present invention, there is eWLB (Embedded Wafer-Level BGA), such as Fan-Out type, Fan-In type, SiP (System in Package), and the like. There are forms.

As a method for manufacturing a semiconductor package of the present invention, for example, there is the following method, but the method is not limited to this.
That is, a buffer coating material is spin-coated on a carrier as a support, the buffer coating material is cured to form an insulating film layer, and then an electrode pad portion is opened by a patterning process. Rewiring processing and mounting bump formation are performed by plating or the like from the hole portion to the surface of the buffer coating material (rewiring process). Next, a process of arranging a large number of semiconductor chips known to operate in advance with their active surfaces facing downward (a process of arranging a large number of semiconductor chips on a support), and then reflowing the chips through a reflow process. The step of connecting to the wiring layer (conducting ensuring step), then injecting and curing underfill to protect the chip and the rewiring layer (underfill step), and then the solid resin composition for sealing material of the present invention After the step of uniformly spreading the object (spraying step) and then compression molding (molding step using a mold), the carrier is peeled off to obtain a wafer in which the semiconductor chips are sealed and rearranged (rearranged wafer). Thereafter, the wafer is grinded to an arbitrary thickness, and diced into individual pieces (divided into individual pieces) to obtain a semiconductor package.

EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, it is not limited to these. Unless otherwise specified, “%” is based on mass. Further, “-” in the table means that the corresponding component is not contained. The materials used in Examples and Comparative Examples are shown below.
<(A) Epoxy resin>
(1) EPPN-501HY: triphenylmethane type epoxy resin, manufactured by Nippon Kayaku Co., Ltd. (2) YX-4000H: biphenyl type epoxy resin, manufactured by Mitsubishi Chemical Corporation (3) KF-1001: epoxy-modified silicone, Shin-Etsu Chemical Industrial Co., Ltd. <(B) phenol curing agent>
(4) MEH-7500: Triphenylmethane type phenol resin, manufactured by Meiwa Kasei Co., Ltd. <(C) Maleimide resin>
(5) SFR-2300: long-chain alkyl group-containing bismaleimide resin, manufactured by Hitachi Chemical Co., Ltd. <(D) curing accelerator>
(6) TBP-3S: Tetrabutylphosphonium-carboxylate, manufactured by Hokuko Chemical Co., Ltd. (7) TBP-3: Tetrabutylphosphonium-carboxylate, manufactured by Hokuko Chemical Co., Ltd. (8) TPP-phthalic acid: tetraphenyl Phosphonium-phthalate, manufactured by Hokuko Chemical Co., Ltd. (9) TPPLA: Tetraphenylphosphonium-laurate, manufactured by Hokuko Chemical Co., Ltd. <(E) filler>
(10) ST7010-2: spherical fused silica having an average particle diameter of 11 μm, manufactured by Micron (11) SO-25R: spherical fused silica having an average particle diameter of 0.6 μm, manufactured by Admatex Co., Ltd. <(F) coupling agent>
(12) KBM-403: 3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd. <(G) Colorant>
(13) MA-100: Carbon black, manufactured by Mitsubishi Chemical Corporation <(H) anion exchanger (ion trapper)>
(14) DHT-4A: Hydrotalcite compound, manufactured by Kyowa Chemical Industry Co., Ltd.

<Characteristic evaluation of solid resin composition for sealing material>
The following evaluation was performed about the produced solid resin composition for sealing materials.
The solid resin composition for sealing material was cured under curing conditions of 130 ° C. for 10 minutes and 175 ° C. for 6 hours to prepare a test sample.

<Glass transition temperature, 40 ° C. elastic modulus, 200 ° C. elastic modulus>
(A) Glass transition temperature: Using a viscoelasticity measuring device (RSAIII, manufactured by T.A. Instruments Japan Co., Ltd.), a test sample formed into a strip shape was subjected to a distance between spans of 40 mm and a frequency of 1 Hz. The temperature was raised from 20 ° C. to 300 ° C. at 5 ° C./min by a three-point bending method, and the temperature at which tan δ showed the maximum value was taken as the glass transition temperature.
(B) Elastic modulus at 40 ° C .: Measured with the measuring device and conditions of (a) above, and the value of the storage elastic modulus at 40 ° C. was taken as the elastic modulus at 40 ° C.
(C) 200 ° C. elastic modulus: Measured using the measurement apparatus and conditions of (a) above, and the value of the storage elastic modulus at 200 ° C. was defined as the 200 ° C. elastic modulus.

<Coefficient of thermal expansion CTE1, CTE2>
(D) Using a thermomechanical analyzer (TMA2940, manufactured by T.A. Instruments Japan Co., Ltd.), a test sample molded on a square column was compressed at 0 ° C. to 300 ° C. by 5 ° C./min. The tangential slope at 10-30 ° C. was CTE1, and the tangential slope at 200-220 ° C. was CTE 2 (unit: ppm / ° C. = 1 × 10 ⁻⁶ / K).

<Evaluation of warpage>
Using a molding machine (model number CPM-1080) manufactured by TOWA Co., Ltd., a solid resin composition for encapsulant obtained in each of Examples and Comparative Examples on a single-sided silicon wafer having a direct 12 inch (300 mm) and a thickness of 750 μm. A molded article with a wafer having a thickness of 500 μm was obtained by compression molding under conditions of a pressure of 5.0 MPa, a temperature of 130 ° C., and a time of 10 minutes. The obtained molded product with a wafer was post-cured under the conditions of 175 ° C. and 6 hours, and the post-cured molded product with a wafer was subjected to warping after post-curing using a surface shape measuring device (model number Thermoray AXP) manufactured by AKROMETRIC evaluated. The amount of warpage was defined as the amount of warpage of the molded product with wafer, which is the difference between the values of the least warped portion and the most warped portion of the molded product with wafer.
The measurement results are shown in Table 1.

From the results of Table 1, it can be seen that in any case, the composition of the example is cured after molding, and the amount of warpage after post-curing is 0.98 to 1.2 mm, and the warpage is suppressed. This is considered to be due to the low elasticity by the (C) maleimide resin used, the warp suppressing effect by the blending amount, and (D) the high reactivity of the curing accelerator.
On the other hand, in the blending composition shown in the comparative example (the blending amount of (C) maleimide resin is high exceeding 30 to 70% by mass), there are uncured ones after molding, and even those that can be molded ((C) maleimide resin) The thermal expansion coefficient was low, but the warpage amount was a bad level of 2.3 mm, the Tg was low, and the elastic modulus was high.

Claims (10)

  A solid resin composition containing (A) an epoxy resin, (B) a phenol curing agent, (C) a maleimide resin, (D) a phosphorus atom-containing curing accelerator, and (E) a filler, wherein (A) + ( B) Solid resin composition for encapsulant, wherein (C) is 30 to 70% by mass in the total mass of (C).   The solid resin composition for a sealing material according to claim 1, wherein the (C) contains at least two maleimide groups and has a saturated or unsaturated hydrocarbon group.   The solid resin composition for sealing materials according to claim 1 or 2, wherein the saturated or unsaturated hydrocarbon group (C) has 8 to 100 carbon atoms.   The solid resin composition for sealing materials as described in any one of Claims 1-3 which has the structure which the saturated or unsaturated hydrocarbon group of said (C) couple | bonded with the maleimide group. The solid resin composition for sealing materials according to any one of claims 1 to 4, wherein (C) has a structure represented by the following general formula (I).

(In general formula (I), X is an integer of 8 to 100.) The solid resin composition for a sealing material according to any one of claims 1 to 5, wherein (C) is represented by the following general formula (II).

(However, n = 0 to 50 and X is an integer of 8 to 100.)   A rearranged wafer in which a large number of semiconductor chips are arranged on a support using the solid resin composition for an encapsulant according to claim 1 and sealed.   A rearranged wafer in which a large number of semiconductor chips are arranged on a support using the solid resin composition for an encapsulant according to claim 1 and sealed by compression molding.   9. A semiconductor package obtained by separating the rearranged wafer according to claim 7 or 8 into pieces.   A method for producing a semiconductor package produced using the solid resin composition for a sealing material according to any one of claims 1 to 6, wherein a plurality of semiconductor chips are arranged on a support, The manufacturing method of the semiconductor package including the process of spraying the said solid resin composition for sealing materials, and the process of shape | molding with a metal mold | die.