JP2018077083A - Exterior appearance inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exterior appearance inspection device that enables four lateral faces of an electronic device to be shot at one position.SOLUTION: An exterior appearance inspection device comprises: a rotor 12 that sequentially conveys an electronic device W held by each support part 11 to a standby position S; position adjustment means 13 that makes the support part 11 move to set the electronic device W from the standby position S to a shooting site T; first optical path adjustment means 14 that has light incidence parts 26 and 30 arranged opposing each of lateral faces A and B of the electronic device W set at the shooting site T, and changes an advancement direction of light incident from the light incidence parts 26 and 30 to make the light head for a first installation location U1; second optical path adjustment means 15 that has light incidence parts 39 and 43 arranged opposing each of lateral faces C and D of the electronic device W set at the shooting site T, and changes an advancement direction of light incident from the light incidence parts 39 and 43 to make the light head for a second installation location U2; first imaging means 16 that is provided at the first installation location U1 to shoot the lateral faces A and B; and second imaging means 17 that is provided at the second installation location U2 to shoot the lateral faces C and D.SELECTED DRAWING: Figure 4

Description

The present invention relates to an appearance inspection apparatus that performs an appearance inspection of an electronic component.

Various electronic components such as a surface acoustic wave (SAW) filter, a light receiving element, a capacitor, an inductor, and a CSP (Chip Size Package) are inspected for cracks, chips, and wrinkles by appearance inspection before shipment. Inspection for the presence of cracks, chips and wrinkles is important for improving the quality of electronic components shipped.
Patent Document 1 describes a specific example of an apparatus for imaging and visual inspection of electronic components.

JP 2003-254726 A

However, the apparatus described in Patent Document 1 has a problem that two of the four side surfaces of the electronic component are objects of appearance inspection, but the remaining two side surfaces are not objects of appearance inspection. Further, when imaging the two side surfaces of the electronic component and the remaining two side surfaces at different locations, it is necessary to secure two locations for imaging the side surfaces of the electronic component on the electronic component transport path.
The present invention has been made in view of such circumstances, and an object thereof is to provide an appearance inspection apparatus capable of inspecting an appearance by imaging four side surfaces of an electronic component at one place.

An appearance inspection apparatus according to the present invention that meets the above-described object is an appearance inspection apparatus that visually inspects an electronic component having a front surface, a back surface, opposed side surfaces A and B, and opposed side surfaces C and D, and holds each of the electronic components. A plurality of supporting portions that are attached in a circle at intervals, rotate intermittently, and sequentially transfer the electronic components held on the respective supporting portions to a standby position; and the standby position A position adjusting means for moving the support part holding the electronic component disposed on the imaging unit and moving the electronic component away from the rotating body at the imaging position; and the electronic component disposed at the imaging position. The light incident portions a and b are arranged to face the side surfaces A and B, respectively. The light reaching the light incident portion a from the side surface A and entering the light incident portion a and the light incident from the side surface B The light that reaches the light part b and enters from the light incident part b First light path adjusting means for changing the traveling direction toward the first installation position, and light incident portions c and d arranged facing the side surfaces C and D of the electronic component arranged at the imaging position, respectively. Light entering the light incident part c from the side C and entering the light incident part c from the side C and light entering the light incident part d from the side D and light entering the light incident part d. A second optical path adjusting means for changing the traveling direction of the light to the second installation position, a first imaging means provided at the first installation position for imaging the side surfaces A and B, and the second Of the side faces A, B, C, and D based on the second image pickup means for picking up the side faces C and D and the images picked up by the first and second image pickup means. Information processing means for detecting an abnormality.

In the appearance inspection apparatus according to the present invention, it is preferable that the support portion sucks and holds the surface of the electronic component.

In the appearance inspection apparatus according to the present invention, it is preferable that the support portion is attached to the rotating body so as to be movable up and down, and the imaging position is below the standby position.

In the appearance inspection apparatus according to the present invention, it is preferable that the first and second imaging means are provided outside the rotating body in plan view.

In the appearance inspection apparatus according to the present invention, the first optical path adjustment means is formed between the light incident portions a and b and above the light incident portions a and b, and the second optical path adjustment means is the light incident portion. It is preferable that the gap between c and d and the upper part be open.

In the appearance inspection apparatus according to the present invention, the second optical path adjusting means is provided such that a portion below the light incident portion c and a portion below the light incident portion d are provided with an interval therebetween, and the first optical path. The adjusting means reflects the light entering from the light incident parts a and b between the part below the light incident part c and the part below the light incident part d of the second light path adjusting means. It is preferable to provide a reflecting portion that changes the traveling direction.

In the visual inspection apparatus according to the present invention, it is preferable that the first and second imaging means have parallel imaging directions and one is arranged directly below the other.

In the appearance inspection apparatus according to the present invention, a third optical path adjustment unit that changes the traveling direction of light from the back surface of the electronic component disposed at the imaging position and directs it to a third installation position; and It is preferable to further include a third imaging unit that is provided at the installation position and images the back surface of the electronic component.

Light incident portions a and b disposed opposite to the side surfaces A and B of the electronic component disposed at the imaging position, respectively, and light that has entered the light incident portion a from the side surface A and entered from the light incident portion a First light path adjusting means for changing the traveling direction of the light from the side surface B to the light incident portion b and entering the light incident portion b toward the first installation position, and electrons arranged at the imaging position The light incident portions c and d are arranged so as to face the side surfaces C and D of the component, respectively. The light reaching the light incident portion c from the side surface C and entering from the light incident portion c and the light incident portion d from the side surface D And the second light path adjusting means for changing the light traveling direction to the second installation position, and the side surfaces A and B are provided at the first installation position. Since the first image pickup means for picking up images and the second image pickup means for picking up images of the side surfaces C and D are provided at the second installation position, four electronic components are provided. Side it is possible by capturing for visual inspection at one place.

1 is a plan view of an appearance inspection apparatus according to a first embodiment of the present invention. It is explanatory drawing of a 1st, 2nd optical path adjustment means and a 1st, 2nd imaging means. It is explanatory drawing of a 1st, 2nd optical path adjustment means and a 1st, 2nd imaging means. It is explanatory drawing which shows a mode that the side surfaces A and B of an electronic component are imaged. It is explanatory drawing which shows a mode that the side surfaces C and D of an electronic component are imaged. It is explanatory drawing of the external appearance inspection apparatus which concerns on the 2nd Embodiment of this invention. It is explanatory drawing of the same external appearance inspection apparatus.

Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
As shown in FIGS. 1 to 5, the appearance inspection apparatus 10 according to the first embodiment of the present invention includes an electron having a front surface P, a back surface Q, opposing side surfaces A and B, and opposing side surfaces C and D. An apparatus for inspecting the appearance of a component W, in which a plurality of support portions 11 that respectively hold the electronic components W are attached in a circular shape at intervals, and are rotated intermittently to be held in each support portion 11. A position at which the rotating member 12 that sequentially conveys the component W to the standby position S and the support unit 11 that holds the electronic component W that is disposed at the standby position S are moved, and the electronic component W is disposed at the imaging position T. The adjusting means 13 and the light path adjusting means 14 for directing the light from each of the side surfaces A and B of the electronic component W arranged at the imaging position T to the installation position U1 (first installation position) while changing the traveling direction of the light. (First optical path adjusting means) and the side of the electronic component W arranged at the imaging position T An optical path adjusting means 15 (second optical path adjusting means) for directing light from each of C and D to an installation position U2 (second installation position) by changing the traveling direction of the light, and an installation position U1 An imaging unit 16 (first imaging unit) and an imaging unit 17 (second imaging unit) provided at the installation position U2 are provided. Details will be described below.

In the present embodiment, an electronic component W that is an object of appearance inspection has opposed front and rear surfaces P and Q, opposed side surfaces A and B, and opposed side surfaces C and D, as shown in FIGS. And it is formed in a rectangular parallelepiped shape (rectangular shape or square shape in plan view). That is, the front surface P and the back surface Q are parallel, the side surfaces A and B are parallel, and the side surfaces C and D are parallel. The back surface Q and the side surfaces A, B, C, and D are objects to be inspected by the appearance inspection apparatus 10, and the surface P is inspected before the electronic component W is supplied to the appearance inspection apparatus 10.

As shown in FIGS. 1 and 3, the appearance inspection apparatus 10 is provided with a plurality of support parts 11 (in the present embodiment, the number is not limited to twelve, but is not limited thereto) so as to be movable up and down and arranged horizontally. A disk-shaped rotating body 12 and a plurality of position adjusting means 13 for pushing down the support portion 11 are provided.
As shown in FIG. 1, the rotating body 12 has a rotating shaft 18 connected to the center, and is rotated intermittently at a predetermined angle by being given a driving force from a servo motor (not shown) via the rotating shaft 18. In the present embodiment, the rotating body 12 rotates 30 ° by one rotation operation.

The support part 11 is a nozzle provided at equal intervals along the circumferential direction on the outer peripheral part of the rotating body 12, and holds the electronic component W below the rotating body 12 as shown in FIG. 3. The support part 11 adsorbs the surface P of the electronic component W by vacuum pressure to hold the electronic component W, and releases the state in which the electronic component W is held by vacuum break. As shown in FIGS. 1 to 3, the electronic component W has side surfaces A and B disposed on the radially outer side and the inner side of the rotating body 12, and the side surfaces C and D are downstream and upstream in the rotating direction of the rotating body 12. It is arrange | positioned by the side and it hold | maintains by the support part 11 in the state by which the back surface Q was distribute | arranged directly under the surface P.

The support part 11 repeats the movement and temporary stop along the circumferential direction of the rotary body 12 by intermittent rotation of the rotary body 12. As shown in FIGS. 1, 2, and 4, the electronic component W held by the support unit 11 is placed at a standby position S above the imaging position T where the electronic component W is imaged by the rotation of the rotating body 12. It is sequentially conveyed and paused.

As shown in FIGS. 1 and 3 to 5, the position adjusting means 13 is supported by a fixing tool (not shown) and is provided above the rotating body 12 at a position where the support portion 11 is temporarily stopped. And a downward force is applied to the support portion 11 using the driving force of the servo motor.
The support portion 11 is attached to the rotating body 12 while being urged upward by an elastic body (not shown). Therefore, the support portion 11 is arranged at the uppermost position in a state where no downward force is applied from the position adjusting means 13, and is pushed down to a predetermined height position by being applied with the downward force from the position adjusting means 13. It is done.

As shown in FIG. 3, the electronic component W is transported to the standby position S by the rotation of the rotating body 12 with the support portion 11 disposed at the uppermost position, and is provided above the standby position S. As shown in FIGS. 4 and 5, the actuator 13 is moved down together with the support portion 11 to be placed at the imaging position T below the standby position S. The support unit 11 arranges the electronic component W at the imaging position T without changing the arrangement of the supported electronic component W with respect to the support unit 11. Therefore, the position adjusting means 13 moves the support part 11 holding the electronic component W arranged at the standby position S, and places the electronic component W away from the rotating body 12 at the imaging position T.

In the vicinity of the imaging position T, as shown in FIGS. 1 to 5, the imaging means 16 for imaging the side surfaces A and B of the electronic component W arranged at the imaging position T, and the side surfaces A and B of the electronic component W Illuminations 19 and 20 for irradiating light, imaging means 17 for imaging the side surfaces C and D of the electronic component W, and illuminations 21 and 22 for irradiating light to the side surfaces C and D of the electronic component W, respectively, are provided. . The illuminations 19 to 22 are arranged at the same height as the electronic component W arranged at the imaging position T. The positions where the imaging means 16 and 17 are provided are set as installation positions U1 and U2, respectively.

In plan view, the imaging means 16 and 17 are provided outside the rotating body 12 as shown in FIGS. 1, 2, and 3, and the imaging directions R1 and R2 are directed to the rotating shaft 18 (ie, The imaging direction R1 of the imaging means 16 and the imaging direction R2 of the imaging means 17 are parallel as shown in FIG.
Near the imaging position T, as shown in FIGS. 2 to 5, optical path adjusting means 14 and 15 for changing the traveling direction of light are provided. In FIGS. 4 and 5, a part of the optical path adjusting means 14 and 15 is not shown.

As shown in FIGS. 2 to 4, the optical path adjusting unit 14 reflects the light reflected by the side surface A of the electronic component W arranged at the imaging position T a plurality of times and proceeds downward, A prism block 24 that reflects the light reflected by the side surface B of the component W a plurality of times and travels downward is provided, and a prism 25 through which light traveling downward from the prism blocks 23 and 24 enters.

As shown in FIG. 4, the prism block 23 is disposed at the same height as the electronic component W disposed at the imaging position T (that is, facing the side surface A of the electronic component W disposed at the imaging position T). A light incident portion 26 (light incident portion a) and a reflective portion 27; a reflective portion 28 disposed below the reflective portion 27; and a reflective portion 29 disposed at the same height as the reflective portion 28. doing. The reflection unit 27 is located farther from the prism block 24 and the imaging position T than the light incident unit 26, and the reflection unit 29 is located closer to the prism block 24 than the reflection unit 28.

The prism block 24 is disposed at the same height as the electronic component W disposed at the imaging position T (that is, disposed opposite to the side surface B of the electronic component W disposed at the imaging position T). 30 (light-incident part b) and the reflection part 31, the reflection part 32 distribute | arranged under the reflection part 31, and the reflection part 33 distribute | arranged to the reflection part 32 and the same height. The reflecting part 32 is located farther from the prism block 23 and the imaging position T than the light incident part 30, and the reflecting part 33 is located closer to the prism block 23 than the reflecting part 32.
The prism 25 is a triangular prism disposed on the lower side of the prism blocks 23 and 24, and has reflecting portions 34 and 35 disposed below the reflecting portions 29 and 33 on one inclined surface. The upper end of the optical path adjusting means 14 (the upper ends of the prism blocks 23 and 24) is at a position lower than the standby position S as shown in FIG.

The light reflected from the side surface A of the electronic component W arranged at the imaging position T and moving away from the side surface A in the horizontal direction reaches the light incident portion 26 and enters the prism block 23 from the light incident portion 26 as shown in FIG. Then, the light is reflected by the reflecting portion 27 and travels downward. The light is reflected by the reflecting portion 28 and travels in the horizontal direction toward the reflecting portion 29. Then, the light reaching the reflection unit 29 is reflected by the reflection unit 29 and travels downward, exits the prism block 23 and enters the prism 25, is reflected by the reflection unit 34, and is reflected by the imaging unit 16 (installation position U1). Go horizontally toward.

The light reflected from the side surface B of the electronic component W arranged at the imaging position T and moving away from the side surface B in the horizontal direction reaches the light incident unit 30 and enters the prism block 24 from the light incident unit 30, and is reflected by the reflecting unit 31. The reflected light travels downward, is reflected by the reflective portion 32, travels in the horizontal direction, and travels toward the reflective portion 33. Then, the light reaching the reflection unit 33 is reflected by the reflection unit 33 and travels downward, exits the prism block 24, enters the prism 25, is reflected by the reflection unit 35, and is reflected by the imaging unit 16 (installation position U1). Go horizontally toward.
Therefore, the imaging unit 16 can image the side surfaces A and B of the electronic component W. The imaging unit 16 captures an image in which the side surfaces A and B of the electronic component W are housed in a state where the illuminations 19 and 20 are turned on.

As shown in FIGS. 2 to 5, the optical path adjustment means 15 reflects the light reflected by the side surface C of the electronic component W arranged at the imaging position T a plurality of times and proceeds downward, A prism block 37 that reflects the light reflected by the side surface D of the component W a plurality of times and travels downward, and a prism 38 into which light traveling downward from the prism blocks 36 and 37 enters.

As shown in FIG. 5, the prism block 36 is disposed at the same height as the electronic component W disposed at the imaging position T (that is, facing the side surface C of the electronic component W disposed at the imaging position T). A light incident portion 39 (light incident portion c) and a reflective portion 40; a reflective portion 41 disposed below the reflective portion 40; and a reflective portion 42 disposed at the same height as the reflective portion 41. doing. The reflecting unit 40 is located farther from the prism block 37 and the imaging position T than the light incident unit 39, and the reflecting unit 42 is located closer to the prism block 37 than the reflecting unit 41.

The prism block 37 is disposed at the same height as the electronic component W disposed at the imaging position T (that is, disposed opposite to the side surface D of the electronic component W disposed at the imaging position T). 43 (light incident part d) and the reflection part 44, the reflection part 45 arranged below the reflection part 44, and the reflection part 46 arranged at the same height as the reflection part 45. The reflection part 44 is located farther from the prism block 36 and the imaging position T than the light incident part 43, and the reflection part 46 is located closer to the prism block 36 than the reflection part 45.

As shown in FIGS. 4 and 5, the prism 38 is a triangular prism disposed below the prism blocks 36 and 37 and directly below the prism block 25, and is disposed below the reflecting portions 42 and 46, respectively. The reflecting portions 47 and 47a are provided on one inclined surface. The upper end of the optical path adjusting means 15 (the upper ends of the prism blocks 36 and 37) is at a position lower than the standby position S as shown in FIGS.
As shown in FIGS. 3 to 5, the optical path adjusting means 14 is formed between the light incident portions 26 and 30 and the upper portion thereof being opened, and the optical path adjusting means 15 is formed between the light incident portions 39 and 43 and the upper portion thereof. Is formed open. Therefore, a space in which the electronic component W can move from the standby position S to the imaging position T is secured.

Light that is reflected by the side surface C of the electronic component W disposed at the imaging position T and moves away from the side surface C in the horizontal direction reaches the light incident unit 39 and enters the prism block 36 from the light incident unit 39 as shown in FIG. Is reflected by the reflecting portion 40 and proceeds downward, reflected by the reflecting portion 41 and proceeds in the horizontal direction toward the reflecting portion 42. Then, the light reaching the reflection part 42 is reflected by the reflection part 42 and travels downward, exits the prism block 36 and enters the prism 38, and is reflected by the reflection part 47 as shown in FIGS. Then, it proceeds horizontally toward the imaging means 17 (installation position U2). The image pickup means 17 is arranged immediately below the image pickup means 16, and in plan view, an empty area outside the rotating body 12 (a space where devices and members can be installed) is reduced by the installation of the image pickup means 16 and 17. Can be suppressed.

Light that is reflected by the side surface D of the electronic component W disposed at the imaging position T and moves away from the side surface D in the horizontal direction reaches the light incident portion 43, and enters the prism block 37 from the light incident portion 43 as shown in FIG. 5. Is reflected by the reflecting portion 44 and proceeds downward, reflected by the reflecting portion 45 and proceeds in the horizontal direction toward the reflecting portion 46. Then, the light that reaches the reflecting portion 46 is reflected by the reflecting portion 46 and travels downward, exits the prism block 37 and enters the prism 38, and is reflected by the reflecting portion 47a as shown in FIGS. Then, it proceeds horizontally toward the imaging means 17 (installation position U2). Therefore, the imaging means 17 can image the side surfaces C and D of the electronic component W arranged at the imaging position T.
As shown in FIG. 5, the imaging unit 17 captures an image in a state where the illuminations 21 and 22 are lit, and obtains an image in which the side surfaces C and D of the electronic component W are stored. In the present embodiment, imaging of the side surfaces A and B and imaging of the side surfaces C and D are performed simultaneously.

The optical path adjusting means 15 is lower than the light incident part 39 and the reflective part 40 of the prism block 36 and higher than the reflective part 41 (a part below the light incident part 39 of the prism block 36), the light incident part 43 of the prism block 37, and A region lower than the reflecting portion 44 and higher than the reflecting portion 45 (a portion below the light incident portion 43 of the prism block 37) is provided with an interval. Then, the optical path adjusting means 14 includes a region where the reflecting portions 29, 34, 33, and 35 are lower than the light incident portion 39 and the reflecting portion 40 of the prism block 36 and higher than the reflecting portion 41, and the light incident portion 43 and It is provided between regions lower than the reflection portion 44 and higher than the reflection portion 45.

The electronic component W on which the side surfaces A, B, C, and D are imaged at the imaging position T is disposed at the uppermost position (standby position S) and then conveyed by the rotation of the rotating body 12.
The images picked up by the image pickup means 16 and 17 are given to an information processing means (not shown), and the information processing means uses the images A and B of the electronic component W based on the images picked up by the image pickup means 16 and 17. An abnormality in the appearance of D is detected.
As shown in FIG. 1, the appearance inspection apparatus 10 includes a taping unit 48 that accommodates an electronic component W in which no cracks or the like are found on the side surfaces A, B, C, and D, and the side surfaces A, B, and C. , D is provided with a sorter 49 for discharging the electronic component W in which a crack or the like is found as a defective product.

As described above, the appearance inspection apparatus 10 can image the side surfaces A and B of the electronic component W with the imaging unit 16 and can capture the side surfaces C and D of the electronic component W with the imaging unit 17. Compared to imaging the side surfaces A, B, C, and D of the electronic component W, an appearance inspection with a high resolution is possible.
In addition, among a plurality of temporary stop positions of the electronic component W due to intermittent rotation of the rotating body 12, only one temporary stop position is used for imaging the side surfaces A, B, C, and D of the electronic component W. Therefore, compared to imaging the side surfaces A, B, C, and D of the electronic component W at a plurality of temporary stop locations, the temporary stop locations used for imaging the side surfaces A, B, C, and D of the electronic component W Can be reduced. Therefore, increasing the number of temporary stop points that can be used for processing other than the imaging of the side surfaces A, B, C, and D of the electronic component W (for example, laser marking on the electronic component W, inspection of electrical characteristics of the electronic component W, etc.) Can do.

In the appearance inspection apparatus 10 described above, only the side surfaces A, B, C, and D are imaged in a state where the electronic component W is disposed at the imaging position T, but the present invention is not limited to this.
Hereinafter, with reference to FIGS. 6 and 7, an appearance inspection apparatus 60 that images the side surfaces A, B, C, and D and the back surface Q of the electronic component W arranged at the imaging position T will be described. In the appearance inspection device 60, the same reference numerals are given to the same components as those of the appearance inspection device 10, and detailed description thereof is omitted.

As shown in FIGS. 6 and 7, the appearance inspection apparatus 60 according to the second embodiment of the present invention indicates the traveling direction of light from each of the side surfaces A and B of the electronic component W arranged at the imaging position T. The optical path adjustment means 61 (first optical path adjustment means) that changes to the installation position U3 (first installation position), and the installation position by changing the traveling direction of light from each of the side surfaces C and D of the electronic component W An optical path adjusting means 62 (second optical path adjusting means) directed toward U4 (second installation position) and an installation position U5 (third installation position) by changing the traveling direction of light from the back surface Q of the electronic component W ) To the optical path adjusting means 63 (the optical path adjusting means of 3), provided at the installation position U3, provided at the imaging position 64 (first imaging means) for imaging the side surfaces A and B, and provided at the installation position U4. Imaging means 65 (second imaging means) for imaging the side surfaces C and D, and the installation position Provided U5, includes an imaging unit 66 for imaging the back surface Q (the third image pickup unit).

The imaging means 64, 65, 66 are provided outside the rotating body 12 in a plan view, and are arranged so that the imaging directions are parallel to each other. The imaging unit 65 is provided immediately below the imaging unit 64, and the imaging unit 66 is disposed obliquely above the imaging unit 65.
The optical path adjusting unit 61 reflects the light reflected by the side surface A of the electronic component W arranged at the imaging position T a plurality of times and proceeds downward, and the light reflected by the side surface B of the electronic component W. Prism block 68 that reflects the light multiple times and travels downward, and prism 69 through which light traveling downward from prism blocks 67 and 68 enters. In FIG. 7, the prism block 67 is not shown.

As shown in FIG. 6, the prism block 67 includes a light incident part 70 (light incident part a) disposed opposite to the side surface A at the same height as the electronic component W disposed at the imaging position T, and light incident. And a reflection part 71 arranged at the same height as the part 70 and reflection parts 72 and 73 arranged at positions lower than the light incident part 70 and the reflection part 71. The prism block 68 has a light incident part 74 (light incident part b) disposed opposite to the side surface B at the same height as the electronic component W disposed at the imaging position T, and the same height as the light incident part 74. The reflection part 75 arranged and the reflection part 76 and 77 arranged at a position lower than the light incident part 74 and the reflection part 75 are provided. The prism 69 is a triangular prism and includes reflecting portions 78 and 79 arranged below the reflecting portions 73 and 77, respectively.

Light that is reflected by the side surface A of the electronic component W disposed at the imaging position T and moves away from the side surface A in the horizontal direction enters the prism block 67 from the light incident unit 70, is reflected downward by the reflection unit 71, and is reflected by the reflection unit. 72 is reflected in the horizontal direction, is reflected by the reflecting unit 73 and proceeds downward, exits the prism block 67 and enters the prism 69, is reflected by the reflecting unit 78, and proceeds horizontally toward the imaging means 64. Light that is reflected by the side surface B of the electronic component W arranged at the imaging position T and moves away from the side surface B in the horizontal direction enters the prism block 68 from the light incident unit 74, is reflected downward by the reflection unit 75, and is reflected by the reflection unit. The light is reflected in the horizontal direction by 76, reflected by the reflecting portion 77, proceeds downward, exits the prism block 68, enters the prism 69, is reflected by the reflecting portion 79, and proceeds horizontally toward the imaging means 64. Therefore, the imaging unit 64 can image the side surfaces A and B of the electronic component W arranged at the imaging position T.

As shown in FIGS. 6 and 7, the optical path adjusting unit 62 reflects the light reflected by the side surface C of the electronic component W arranged at the imaging position T a plurality of times and proceeds downward, A prism block 81 that reflects light reflected by the side surface D of the component W a plurality of times and travels downward is provided, and a prism 82 into which light traveling downward from the prism blocks 80 and 81 enters.

As shown in FIG. 7, the prism block 80 includes a light incident portion 83 (light incident portion c) disposed opposite to the side surface C at the same height as the electronic component W disposed at the imaging position T, and light incident. The reflection part 84 arranged at the same height as the part 83 and the reflection parts 85 and 86 arranged at positions lower than the light incident part 83 and the reflection part 84 are provided. The prism block 81 has a light incident portion 87 (light incident portion d) disposed opposite to the side surface D at the same height as the electronic component W disposed at the imaging position T, and the same height as the light incident portion 87. The reflection part 88 arranged, and the reflection parts 89 and 90 arranged at a position lower than the light incident part 87 and the reflection part 88 are provided. The prism 82 is a triangular prism and includes reflecting portions 91 and 92 disposed below the reflecting portions 86 and 90, respectively.

The light reflected from the side surface C of the electronic component W arranged at the imaging position T and moving away from the side surface C in the horizontal direction enters the prism block 80 from the light incident portion 83, is reflected downward by the reflecting portion 84, and is reflected by the reflecting portion. 85 is reflected in the horizontal direction, is reflected by the reflecting portion 86 and proceeds downward, exits the prism block 80 and enters the prism 82, is reflected by the reflecting portion 91, and proceeds horizontally toward the imaging means 65. Light that is reflected by the side surface D of the electronic component W disposed at the imaging position T and moves away from the side surface D in the horizontal direction enters the prism block 81 from the light incident portion 87, is reflected downward by the reflection portion 88, and is reflected by the reflection portion. The light is reflected in the horizontal direction by 89, is reflected by the reflecting part 90, proceeds downward, exits the prism block 81, enters the prism 82, is reflected by the reflecting part 92, and proceeds horizontally toward the imaging means 65. Therefore, the imaging unit 65 can capture the side surfaces C and D of the electronic component W disposed at the imaging position T.

As shown in FIGS. 6 and 7, the optical path adjusting means 63 is reflected by the prism 94 that reflects the light that is reflected by the back surface Q of the electronic component W disposed at the imaging position T and travels downward, and is reflected by the prism 94. It has a prism 95 that reflects light and changes the traveling direction.
The prisms 94 and 95 are triangular prisms and are arranged at the same height as shown in FIG. The prism block 81 is located between the prisms 94 and 95.

The prism 94 has a reflecting portion 96 that reflects light traveling downward from the back surface Q of the electronic component W in the horizontal direction below the electronic component W disposed at the imaging position T. The light reflected by the reflection unit 96 passes through the prism block 81 and travels toward the prism 95.
The prism 95 includes a reflection unit 97 that reflects light reflected by the reflection unit 96 and passed through the prism block 81, and the reflection unit 97 changes the traveling direction of light by 90 degrees by reflection, and transmits the light to the imaging unit 66. Move horizontally toward. Therefore, the imaging unit 66 can image the back surface Q of the electronic component W arranged at the imaging position T.

In the vicinity of the prism 95, as shown in FIG. 7, an illumination 98 for irradiating light to the back surface Q of the electronic component W disposed at the imaging position T is provided via the prisms 95 and 94.
The imaging means 64, 65, 66 capture the side surfaces A, B, side surfaces C, D, and the back surface Q of the electronic component W disposed at the imaging position T in a state where the illuminations 19 to 22, 98 are lit. The imaging of the side surfaces A and B, the side surfaces C and D, and the back surface Q of the electronic component W by the imaging means 64, 65, and 66 is performed simultaneously.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all changes in conditions and the like that do not depart from the gist are within the scope of the present invention.
For example, the electronic component does not have to be a rectangular parallelepiped shape.
Further, the support portion does not need to suck and hold the electronic component, and may be, for example, a unit that holds the electronic component.

The rotating body does not need to rotate around a vertically arranged rotating shaft, and may rotate around a horizontally arranged rotating shaft, for example. When adopting a rotating body that rotates around a horizontally disposed rotating shaft, the support portion may be attached to the rotating body so as to be able to advance and retract in the horizontal direction, and the imaging position and the standby position may be provided at the same height. .
Then, when the rotating body rotates about the rotation axis arranged vertically, the first and second imaging means may be provided inside the rotating body in plan view.

In addition, as long as a space in which the electronic component can be moved from the standby position to the imaging position is secured, the first optical path adjusting unit may not be open between the light incident parts a and b and above the second light path part. The optical path adjusting means may not be open between and above the light incident parts c and d.
And the 1st optical path adjustment means does not need to be provided with the reflection part between the site | part below the light entrance part c of the 2nd optical path adjustment means, and the site | part below the light entrance part d.
Furthermore, the second imaging unit does not need to be arranged directly below the first imaging unit. Depending on the design of the first and second optical path adjustment units, the first imaging unit may be replaced with the second imaging unit. It can be placed directly below.

DESCRIPTION OF SYMBOLS 10: Appearance inspection apparatus, 11: Support part, 12: Rotating body, 13: Position adjustment means, 14, 15: Optical path adjustment means, 16, 17: Imaging means, 18: Rotation axis, 19, 20, 21, 22: Illumination, 23, 24: Prism block, 25: Prism, 26: Light incident part, 27, 28, 29: Reflection part, 30: Light incident part, 31, 32, 33, 34, 35: Reflection part, 36, 37 : Prism block, 38: prism, 39: light incident part, 40, 41, 42: reflection part, 43: light incident part, 44, 45, 46, 47, 47a: reflection part, 48: taping unit, 49: sorter , 60: Appearance inspection apparatus, 61, 62, 63: Optical path adjustment means, 64, 65, 66: Imaging means, 67, 68: Prism block, 69: Prism, 70: Light incident part, 71, 72, 73: Reflection Part, 74: light incident part, 75, 7 77, 78, 79: Reflector, 80, 81: Prism block, 82: Prism, 83: Light incident part, 84, 85, 86: Reflector, 87: Light incident part, 88, 89, 90, 91, 92: Reflector, 94, 95: Prism, 96, 97: Reflector, 98: Illumination, A, B, C, D: Side, P: Front, Q: Back, S: Standby position, T: Imaging position, U1, U2, U3, U4, U5: installation position, W: electronic component

Claims (8)

In an appearance inspection apparatus for inspecting the appearance of an electronic component having a front surface, a back surface, opposing side surfaces A and B, and opposing side surfaces C and D,
A plurality of support portions that respectively hold the electronic components are attached in a circle at intervals, and rotate intermittently to rotate the electronic components held on the support portions sequentially to a standby position. Body,
A position adjusting means for moving the support part holding the electronic component disposed at the standby position and disposing the electronic component at the imaging position away from the rotating body;
It has light incident portions a and b disposed opposite to the side surfaces A and B of the electronic component disposed at the imaging position, and reaches the light incident portion a from the side surface A. First light path adjusting means for directing the light that has entered from the side B and the light that has reached the light incident part b from the side surface B and entered from the light incident part b toward the first installation position by changing the traveling direction of the light; ,
The light incident portions c and d are disposed to face the side surfaces C and D of the electronic component disposed at the imaging position, respectively. The light incident portion c reaches the light incident portion c from the side surface C. Second light path adjusting means for directing the light that has entered from the side surface D and the light that has reached the light incident part d from the side surface D and entered from the light incident part d toward the second installation position by changing the traveling direction of the light; ,
A first imaging means provided at the first installation position for imaging the side surfaces A and B;
A second imaging means provided at the second installation position and imaging the side surfaces C and D;
An appearance inspection apparatus comprising: information processing means for detecting an abnormality in appearance of the side surfaces A, B, C, and D based on images picked up by the first and second image pickup means. The appearance inspection apparatus according to claim 1, wherein the support portion sucks and holds a surface of the electronic component. 3. The appearance inspection apparatus according to claim 1, wherein the support portion is attached to the rotating body so as to be movable up and down, and the imaging position is below the standby position. 4. The appearance inspection apparatus according to claim 3, wherein the first and second imaging means are provided outside the rotating body in plan view. 5. The visual inspection apparatus according to claim 3, wherein the first optical path adjustment means is formed with the light incident portions a and b open and above, and the second optical path adjustment means An appearance inspection apparatus characterized in that it is formed between the writing light portions c and d and above. The visual inspection apparatus according to any one of claims 3 to 5, wherein the second optical path adjusting unit includes a portion below the light incident portion c and a portion below the light incident portion d spaced apart from each other. The first light path adjusting means is provided between the part of the second light path adjusting means below the light incident part c and the part below the light incident part d. An appearance inspection apparatus comprising a reflection section that reflects the light entering from each of the light and changes the traveling direction. The appearance inspection apparatus according to any one of claims 3 to 6, wherein the first and second imaging units have parallel imaging directions and one is arranged directly below the other. Appearance inspection device. 8. The visual inspection apparatus according to claim 1, wherein the third optical path is configured to change the traveling direction of light from the back surface of the electronic component disposed at the imaging position and to move toward the third installation position. An appearance inspection apparatus, further comprising: an adjustment unit; and a third imaging unit that is provided at the third installation position and images the back surface of the electronic component.

Images