JP2018074618A - Power supply heat dissipation structure, in-vehicle power supply - Google Patents

Abstract

A heat dissipation structure for a power supply device capable of realizing good heat dissipation characteristics without using cooling water.
A first housing 2a that houses a first heat-generating component 1a, a second housing 2b that houses a second heat-generating component 1b, and / or an outer surface of the first housing 2a and / or Radiation fins 3a and 3b are formed on the outer surface of the second casing 2b, and the first casing 2a and the second casing 2b are thermally coupled via the radiation fins 3a and 3b. A heat dissipation structure for a power supply device including connection portions 4a and 4b.
[Selection] Figure 5

Description

  The present invention relates to a heat dissipation structure for a power supply device and an in-vehicle power supply device.

  In recent years, with respect to power supply devices such as inverter devices and charging devices used in electric vehicles, there is an increasing demand for downsizing and weight reduction in order to increase the cruising distance. However, power semiconductors used in inverter devices and charging devices do not reduce the amount of heat generated even if they are reduced in size, so it is necessary to further increase the heat dissipation power of the downsized housing itself.

  Patent Document 1 discloses a heat dissipation structure for effectively cooling an inverter device and a charging device using cooling water.

Japanese Patent Laid-Open No. 7-038025

  By the way, in an electric vehicle (for example, a micro EV or an electric commuter), there is a vehicle in which no cooling water is mounted because the engine is not used. In such a vehicle, when applying a heat dissipation structure using cooling water as in Patent Document 1, it is necessary to separately provide a cooling water facility, which not only leads to an increase in cost but also affects the shape of the vehicle body. , It will squeeze the indoor space.

  On the other hand, even in a vehicle equipped with cooling water, routing the circulation circuit for circulating the cooling water inside the vehicle will affect the shape of the vehicle body as described above. There is also a demand for a configuration that uses as little cooling water as possible.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a heat dissipation structure for a power supply device and an in-vehicle power supply device that can realize good heat dissipation characteristics without using cooling water.

  The main present invention for solving the above-described problems includes a first housing that houses a first heat-generating component, a second housing that houses a second heat-generating component, an outer surface of the first housing, A power supply comprising: a heat dissipating fin formed on an outer surface of the second housing; and a connecting portion that thermally couples the first housing and the second housing via the heat dissipating fin. It is the heat dissipation structure of the apparatus.

  According to the heat dissipation structure of the power supply device according to the present invention, good heat dissipation characteristics can be realized without using cooling water.

The perspective view which looked at the thermal radiation structure of the power supply device which concerns on 1st Embodiment from upper direction The perspective view which looked at the thermal radiation structure of the power supply device which concerns on 1st Embodiment from the downward direction The side view of the thermal radiation structure of the power supply device which concerns on 1st Embodiment The figure which planarly viewed the heat dissipation structure of the power supply device which concerns on 1st Embodiment in the position between housing | casing. The figure explaining operation | movement of the thermal radiation structure of the power supply device which concerns on 1st Embodiment. The figure explaining operation | movement of the thermal radiation structure of the power supply device which concerns on 1st Embodiment. The figure which shows typically the thermal radiation structure of the power supply device which concerns on the modification 1 of 1st Embodiment. The figure which shows typically the thermal radiation structure of the power supply device which concerns on the modification 2 of 1st Embodiment. The figure which looked at the case of the heat dissipation structure of the power unit concerning a 2nd embodiment from the upper part The figure which looked at the case of the heat dissipation structure of the power unit concerning a 2nd embodiment from the lower part The side view of the heat dissipation structure of the power supply device which concerns on 2nd Embodiment Side surface sectional drawing of the thermal radiation structure of the power supply device which concerns on 2nd Embodiment

(First embodiment)
Hereinafter, an example of the configuration of the heat dissipation structure of the power supply device A according to the present embodiment will be described with reference to FIGS.

  FIG. 1 is a perspective view of the heat dissipation structure of the power supply device A as viewed from above. FIG. 2 is a perspective view of the heat dissipation structure of the power supply device A as viewed from below. FIG. 3 is a side view of the heat dissipation structure of the power supply device A. FIG. FIG. 4 is a plan view of the heat dissipation structure of the power supply device A at a position between the housing 2a and the housing 2b. Note that the right diagram in FIG. 3 is an enlarged view of the area surrounded by the dotted line in the left diagram.

  The heat dissipation structure of the power supply device A according to the present embodiment is applied to, for example, an in-vehicle power supply device, and is used to dissipate heat generated by a power supply circuit such as an inverter device or a charging device to the outside.

  The power supply device A according to the present embodiment includes a housing 2a that houses the heat generating component 1a and a housing 2b that houses the heat generating component 1b. And the power supply device A which concerns on this embodiment is equipped with the radiation fins 3a and 3b, the connection parts 4a and 4b, and the fan 5 as a structure for radiating the heat from the said heat-emitting component 1a and the heat-emitting component 1b. Note that at least one of the heat generating components 1a and 1b corresponds to a power supply circuit.

  The heat generating component 1a, the heat radiating fin 3a, and the connecting portion 4a are each provided in the upper housing 2a, and the heat generating component 1b, the heat radiating fin 3b, and the connecting portion 4b are respectively provided in the lower housing 2b. It has been. However, it is needless to say that the housing 2a and the housing 2b may be arranged on the left and right instead of being arranged on the top and bottom.

  The heat generating component 1a is a heat generating member housed in the upper housing 2a, and the heat generating component 1b is a heat generating member housed in the lower housing 2b.

  As the heat generating components 1a and 1b, from the viewpoint of heat radiation characteristics described later, a heat generating component that performs an exclusive operation (represents that there is no state in which both operate simultaneously, the same applies hereinafter), or a heat generating component that generates a different amount of heat. It is desirable that a combination be applied. Examples of the combination of the heat generating components 1a and 1b that perform the exclusive operation include an inverter device and a charging device (hereinafter also referred to as “inverter device 1a” and “charging device 1b”).

  The inverter device 1a is a power supply circuit for supplying electric power from a vehicle-mounted battery (not shown) to the motor, and has a large heat generation amount in a power element that controls electric power. The charging device 1b is a power supply circuit for charging an in-vehicle battery from an external commercial power supply or the like, and has a large heat generation amount in a power element or a reactor that controls electric power. The inverter device 1a is a power circuit that operates mainly during vehicle travel, and the charging device 1b is a power circuit that operates mainly during charging when the vehicle is stopped. That is, both have an exclusive operation.

  However, it goes without saying that the heat generating components 1a and 1b may be other combinations such as an inverter device and a DCDC converter device. Further, both the heat generating components 1a and 1b do not necessarily need to be power supply circuits, and either one may be a power supply circuit, and the other may be a heat generating component other than the power supply circuit such as a motor.

  The housings 2a and 2b are housed in a sealed state in order to protect the electrical devices (inverter device, charging device, electronic device, etc.) to be stored from surrounding moisture and the like (in FIGS. 1 and 2) For convenience of explanation, a part of the wall surface is omitted). The electric device may be the heat generating components 1a and 1b itself, or may be another electronic device or the like housed together with the heat generating components 1a and 1b.

  The housing 2a and the housing 2b are disposed adjacent to each other in the vertical direction. And the housing | casing 2a and the housing | casing 2b each have the radiation fin 3a and the radiation fin 3b in the outer surface which mutually opposes.

  In the housings 2a and 2b, at least the wall surface on the side where the heat dissipating fins 3a and 3b are formed is composed of a member having high thermal conductivity (for example, aluminum material). Further, the heat generating components 1a and 1b are arranged so that at least a part thereof is in contact with the wall surface. As a result, the heat generated by the heat generating components 1a and 1b is transmitted from the wall surfaces of the casings 2a and 2b to the radiation fins 3a and 3b, and is radiated to the outside.

  Here, for example, the casings 2a and 2b and the radiation fins 3a and 3b are integrally configured by die casting. Thereby, compared with the case where the heat radiation fin by which extrusion molding was carried out is separately installed in a housing | casing, it can form cheaply. However, in die casting, it is difficult to make the interval (fin pitch) between the protrusions of the heat radiating fins finer, and the heat radiating performance is inferior compared to extrusion molding.

  Therefore, in the present invention, the housing 2a and the housing 2b are arranged so that the heat dissipating fins 3a of the housing 2a and the heat dissipating fins 3b of the housing 2b are alternately arranged, and the heat dissipating fins 3a of the housing 2a are disposed in the housing. The heat dissipating fins 3b of the housing 2b are in contact with the housing 2a in contact with the body 2b. Thereby, it becomes possible to radiate the heat generated in the housing 2a or the housing 2b by using both the heat radiation fins 3a of the housing 2a and the heat radiation fins 3b of the housing 2b without using cooling water. Inexpensive and good heat dissipation characteristics can be realized.

  The upper radiating fins 3a are formed on the outer surface of the housing 2a, and the lower radiating fins 3b are formed on the outer surface of the housing 2b. As will be described later, the heat radiating fins 3a and 3b integrally dissipate heat generated by the heat generating components 1a and 1b to the outside.

  More specifically, the upper radiating fin 3a is formed by a plurality of protrusions formed on the lower surface of the upper casing 2a. The protrusions of the heat radiating fins 3a extend to a position where they contact the upper surface of the lower housing 2b, and are thermally coupled to the housing 2b through the connection portions 4a.

  Similarly, the lower radiating fin 3b is formed by a plurality of protrusions formed on the upper surface of the lower casing 2b. The protrusion of the heat radiating fin 3b extends to a position where it comes into contact with the lower surface of the lower housing 2a, and is thermally coupled to the housing 2a via the connecting portion 4b.

  And the protrusion part of the upper side radiation fin 3a and the protrusion part of the lower side radiation fin 3b are arrange | positioned so that it may mutually combine in the state mutually spaced apart (refer FIG. 4). Further, the protrusions of the upper radiating fins 3 a and the protrusions of the lower radiating fins 3 b both have a plate shape, and are arranged in parallel so that the longitudinal plate surface is along the blowing direction of the fan 5. ing.

  The radiating fins 3a and 3b may have other shapes such as a pin shape instead of the plate shape. However, when the projections of the heat radiating fins 3a and 3b have other shapes, similarly, it is desirable to arrange them so as to be alternately combined in a state of being separated from each other.

  The heat radiation fins 3a and 3b are both formed by die casting integrally with the housings 2a and 2b. As a result, the strength and sealing performance of the housings 2a and 2b are ensured, and the housing 2a and the radiation fins 3a can be integrally molded, and the housing 2b and the radiation fins 3b can be integrally molded. In addition, the manufacturing process for forming the housings 2a and 2b and the radiation fins 3a and 3b can be simplified. The heat radiation fins 3a and 3b are formed of an aluminum material or the like, similarly to the housings 2a and 2b.

  The connecting portion 4a thermally couples the upper radiating fin 3a and the lower casing 2b. Further, the connecting portion 4b thermally couples the lower radiating fin 3b and the upper casing 2a.

  More specifically, the connecting portion 4a is provided at the tip of the upper radiating fin 3a, and connects the upper radiating fin 3a and the outer surface of the lower casing 2b. Further, the connecting portion 4b is provided at the tip of the lower radiating fin 3b, and connects the lower radiating fin 3b and the outer surface of the upper casing 2a. The connecting portions 4a and 4b connect the members using, for example, soldering, welding, a heat radiation adhesive, aluminum brazing, or the like so that heat conduction between the members is performed satisfactorily. As the connection portions 4a and 4b, those having a high thermal conductivity are particularly desirable.

  The connecting portions 4a and 4b may be configured to connect the heat radiation fins 3a and the heat radiation fins 3b instead of connecting the tips of the heat radiation fins 3a and 3b and the outer surfaces of the housings 2a and 2b.

  The fan 5 is attached to the outside of the housings 2a and 2b, and blows air toward the position where the radiation fins 3a and 3b are provided. More specifically, the fan 5 blows air along the longitudinal direction of the plate-like heat radiation fins 3a and 3b. In the present embodiment, by providing the fan 5, heat exchange between the heat radiation fins 3a and 3b and the air is promoted to improve heat radiation characteristics. If the cooling liquid is used, the solder material and the heat dissipating adhesive of the connecting portions 4a and 4b are dissolved in the cooling liquid, resulting in poor heat transfer between the members, debris is generated, and the cooling liquid is There is a risk of falling into a bad state.

  The fan 5 is not limited to a blower fan, and may be a suction fan. In addition, the fan 5 can be omitted when sufficient heat dissipation characteristics can be obtained even by natural convection, such as when the power supply device A is disposed at a position where air flowing through the vehicle hits.

[Heat dissipation of power supply]
The present inventors have intensively studied in order to realize good heat dissipation characteristics and downsizing, and the heat generating component 1a and the heat generating component 1b such as an inverter device and a charging device mounted on a vehicle are not necessarily operated simultaneously. In addition, the above-described heat dissipation structure has been conceived by paying attention to the fact that the heat generating component 1a and the heat generating component 1b do not emit the same amount of heat.

  5 and 6 are diagrams illustrating the heat dissipation operation of the power supply device A. FIG.

  FIG. 5 is a diagram illustrating an example of a heat dissipation operation during vehicle travel. While the vehicle is running, the inverter device 1a operates to supply power to the motor, while the charging device 1b does not operate. Therefore, only the inverter device 1a is in a state of generating heat.

  The heat generated by the inverter device 1a is radiated to the outside through the bottom surface of the upper casing 2a and the heat radiation fins 3a. Further, since the upper casing 2a is hotter than the lower radiating fin 3b, the heat generated by the inverter device 1a is simultaneously applied to the lower radiating fin 3b via the connecting portion 4b. Communicated. In addition, the arrow in FIG. 5 represents the heat flow at this time.

  That is, the heat generated by the inverter device 1a is radiated to the outside from both the upper radiating fins 3a and the lower radiating fins 3b. As a result, the surface area for dissipating the heat generated by the inverter device 1a is larger than in the case where heat is radiated only from the upper radiation fins 3a, and the amount of heat that can be radiated per unit time is also increased.

  FIG. 6 is a diagram illustrating an example of a heat radiation operation during charging when the vehicle is stopped. During charging when the vehicle is stopped, the charging device 1b operates while the inverter device 1a does not operate. Therefore, only the charging device 1b is in a state of generating heat.

  The heat generated by the charging device 1b is radiated to the outside through the upper surface of the lower housing 2b and the heat radiation fins 3b. Further, since the lower casing 2b is hotter than the upper radiating fin 3a, the heat generated by the charging device 1b is simultaneously applied to the upper radiating fin 3a via the connecting portion 4a. introduce. In addition, the arrow in FIG. 6 represents the heat flow at this time.

  That is, the heat generated by the charging device 1b is radiated from both the upper radiating fin 3a and the lower radiating fin 3b. As a result, the surface area for dissipating the heat generated by the charging device 1b is larger than in the case where heat is dissipated only from the lower heat dissipating fins 3b, and the amount of heat dissipated per unit time is also increased.

  The above effect is mainly due to the connecting portions 4a and 4b, and the speed of heat transfer between the metals is very high compared to the speed of heat transfer between the metal and air. . Therefore, if the connection portions 4a and 4b are not provided, a gap is formed between the outer surface of the housing 2a and the heat radiating fins 3b or between the outer surface of the housing 2b and the heat radiating fins 3a. As a result, the speed at which heat is transferred from the housing 2a to the lower radiating fins 3b or the speed at which heat is transferred from the housing 2b to the upper radiating fins 3a is considerably reduced, resulting in good heat dissipation characteristics. It will be in an unobtainable state.

  However, the above-described effects can be obtained even when the heat generation components 1a and 1b have different heat generation amounts or the heat dissipation fins 3a and 3b, even if the heat generation components that perform the exclusive operation like the inverter device 1a and the charging device 1b are not combined. If the heat dissipating power is different, it can also be exerted on those that generate heat at the same time.

  For example, when the heat generating component 1a is an inverter device and the heat generating component 1b is a battery, the inverter device and the battery generate heat at the same time. However, since the heat generation amount of the battery is small, the heat generated by the inverter device is radiated downward on the battery side. It transmits to the fin 3b. As a result, similarly to the above, the heat generated by the inverter device is radiated from both the upper side radiating fins 3a and the lower side radiating fins 3b, and good heat radiating characteristics can be ensured.

  As described above, the heat dissipating structure of the power supply device A according to the present embodiment thermally couples the upper heat dissipating fins 3a and the lower housing 2b via the connecting portion 4a, and connects the connecting portion 4b. The lower radiating fins 3b and the upper casing 2a are thermally coupled to each other. Therefore, the heat generated by the heat generating components 1a and 1b is distributed to the heat radiating fins 3a and the heat radiating fins 3b and radiated from both. As a result, the heat dissipation characteristics of the power supply device A as a whole can be improved.

  Further, according to the heat dissipation structure of the power supply device A according to the present embodiment, at least a part of the protrusions of the upper heat dissipating fins 3a and the protrusions of the lower heat dissipating fins 3b are separated from each other. It arrange | positions so that it may combine alternately. As a result, the air blown from the fan 5 can be made to flow smoothly, and the density of the number of protrusions of the heat radiation fins 3a and 3b can be increased, so that downsizing and improvement of heat radiation characteristics can be achieved. In particular, since the radiating fins 3a and 3b according to the present embodiment are formed by die casting, there is a limit to downsizing the radiating fins and reducing the fin pitch. In this respect, with the above-described configuration, it is possible to configure a heat dissipation structure that is small and has excellent heat dissipation characteristics.

  Moreover, since the heat dissipation structure of the power supply device A according to the present embodiment employs air cooling, cooling equipment such as a cooling water circulation circuit and a circulation pump is unnecessary, and space saving and cost reduction can be achieved. it can.

  In the above embodiment, as an example of the heat dissipation structure of the power supply device A, the aspect in which the two casings 2a and 2b are thermally coupled using the connection portion 4a and the connection portion 4b is shown. However, even if only one of the connection portion 4a and the connection portion 4b is used, it is possible to improve certain heat dissipation characteristics.

  On the other hand, in addition to the housings 2a and 2b, when the housings are disposed adjacent to each other, the fins and the connection portions may be provided for the housings. In this way, by thermally coupling a plurality of housings, the heat dissipation characteristics can be further improved while ensuring the degree of freedom of design.

(Modification 1 of the first embodiment)
In the above embodiment, the upper radiating fin 3a is thermally coupled to the outer surface of the housing 2b via the connecting portion 4a, and the lower radiating fin 3b is connected to the outer surface of the housing 2a via the connecting portion 4b. The embodiment is shown in which it is thermally coupled with. However, the heat radiating structure for sharing the heat radiating fins between the housing 2a and the housing 2b may be in another form.

  FIG. 7 is a diagram schematically illustrating a heat dissipation structure of the power supply device A according to the first modification. 7 shows a side cross-sectional view of the heat dissipation structure of the power supply device A.

  The heat dissipation structure of the power supply device A according to the modified example 1 is different from the above embodiment in that the heat dissipation fins 3a and the heat dissipation fins 3b are connected via the connection portions 4c. In addition, description is abbreviate | omitted about the structure which is common in the said embodiment (Hereafter, it is the same also about other embodiment).

  More specifically, the radiating fin 3a and the radiating fin 3b are disposed so as to face each other, as in the above-described embodiment, and the tip end portion of the radiating fin 3a and the tip end portion of the radiating fin 3b define the connection portion 4c. It is the structure connected via. In other words, the connection portion 4c thermally couples the heat radiating fins 3a and the heat radiating fins 3b.

  Also with such a configuration, heat transfer occurs between the heat radiating fins 3a and the heat radiating fins 3b, and the heat generated by the heat generating components 1a and 1b can be integrally dissipated to the outside. This configuration is suitable, for example, when the housing 2a and the housing 2b are separated to some extent.

(Modification 2 of the first embodiment)
FIG. 8 is a diagram schematically illustrating a heat dissipation structure of the power supply device A according to the second modification. 8 shows a side cross-sectional view of the heat dissipation structure of the power supply device A.

  The heat dissipating structure of the power supply device A according to the modification 2 is different from the above embodiment in that the heat dissipating fins are formed only on one of the housings 2a and 2b.

  More specifically, the housing 2a includes the heat radiating fins 3a, and the heat radiating fins 3a are thermally coupled to the housing 2b via the connection portions 4a, as in the above embodiment. On the other hand, the housing 2b has a configuration that does not have heat radiating fins.

  Also with such a configuration, heat transfer is generated in the radiating fin 3a via the connection portion 4a, and the heat generated by the heat generating components 1a and 1b can be integrally radiated to the outside. This configuration is effective in that, for example, when it is possible to make the interval (fin pitch) between the protrusions of the heat radiation fins 3a fine, it is not necessary to provide heat radiation fins on the other housing 2b.

(Second Embodiment)
Next, with reference to FIGS. 9-12, the thermal radiation structure of the power supply device A which concerns on 2nd Embodiment is demonstrated. The heat dissipation structure of the power supply device A according to the present embodiment is different from that of the first embodiment in that it has a conducting portion 7 and an opening portion 8 for conducting the conductive wire 6 between the housing 2a and the housing 2b. . Note that a description of the same configuration as in the first embodiment is omitted.

  FIG. 9 is a view of the housing 2a of the heat dissipation structure of the power supply device A according to the present embodiment as viewed from above. FIG. 10 is a view of the housing 2b of the heat dissipation structure of the power supply device A according to the present embodiment as viewed from below. FIG. 11 is a side view of the heat dissipation structure of the power supply device A according to the present embodiment. FIG. 12 is a diagram schematically showing a cross-sectional side view of the heat dissipation structure of the power supply device A according to the present embodiment.

  In the present embodiment, an electric circuit including the heat generating component 1a accommodated in the housing 2a (hereinafter also referred to as “electric circuit 1a”) and an electric circuit including the heat generating component 1b accommodated in the housing 2b (hereinafter referred to as “electrical”). The circuit 1b "is also electrically connected by a conductive line 6 (for example, a bus bar).

  The conducting portion 7 and the opening 8 are configured to route the conductive wire 6 between them while maintaining the inside of the housing 2a and the inside of the housing 2b in a sealed state.

  The conducting portion 7 according to the present embodiment is a cylindrical protrusion that is formed integrally with the housing 2a on the lower surface of the housing 2a and protrudes toward the housing 2b. The opening 8 is an opening formed on the upper surface of the housing 2b and leading to the inside of the housing 2b.

  The conduction portion 7 extends to the upper surface of the housing 2b and is connected to the upper surface of the housing 2b at the position of the opening 8. And the hollow area | region inside the conduction | electrical_connection part 7 is connected with the opening part 8 formed in the upper surface of the housing | casing 2b. In addition, a conductive wire 6 having one end connected to the electric circuit 1a of the housing 2a and the other end connected to the electric circuit 1b of the housing 2b is disposed in the hollow region inside the conducting portion 7.

  Here, the conducting part 7 and the housing 2b are connected so that the inside of the conducting part 7 is sealed by a connecting part 4d such as solder, welding, or aluminum brazing. Thereby, the conduction | electrical_connection part 7 for electrically connecting the electric circuit 1a and the electric circuit 1b can be contributed to a heat dissipation improvement, maintaining the waterproofness inside the housing | casing 2a and the housing | casing 2b. In addition, by configuring the connection portion 4d and the connection portions 4a and 4b with the same member, it is possible to form the connection portions 4a and 4b and the connection portion 4d in the same manufacturing process, which also reduces the manufacturing cost. Contribute.

  As mentioned above, although the specific example of this invention was demonstrated in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

  For example, in the above-described embodiment, the configuration in which the connection portions (4a, 4b) are provided in all the radiation fins (3a, 3b) is exemplified. However, as the configuration in which the connection portions (4a, 4b) are provided only in some of the radiation fins. Also good.

  Further, for example, when the heat generation amount of the heat generating component 1a (electric circuit 1a) stored in the housing 2a is large and the heat generation amount of the heat generating component 1b (electric circuit 1b) stored in the housing 2b is small, heat is radiated from the housing 2a. You may provide a connection part (4a, 4b) so that it may carry out easily. Specifically, taking FIG. 5 as an example, only the connection portion 4b (thermal connection between the housing 2a and the heat radiation fin 3b) may be provided, and the connection portion 4a may not be provided.

  Further, for example, when only a part of the heat generating component 1a (electric circuit 1a) housed in the housing 2a has a large heat generation amount, the connection portions (4a, 4b) are provided only in the vicinity of the component having a large heat generation amount to generate other heat generation. It is good also as a structure which does not provide a connection part (4a, 4b) in a location with small quantity.

  At least the following matters will become apparent from the description of the present specification and the accompanying drawings.

  A first housing 2a for housing the first heat generating component 1a, a second housing 2b for storing the second heat generating component 1b, an outer surface of the first housing 2a and / or the second housing. Radiation fins 3a and 3b are formed on the outer surface of the housing 2b, and the connection portion 4 that thermally couples the first housing 2a and the second housing 2b via the heat radiation fins 3a and 3b; , A heat dissipation structure for a power supply device A is disclosed. According to the heat dissipation structure of the power supply device A, the heat dissipation characteristics of the power supply device as a whole can be improved.

  Further, in the heat dissipation structure of the power supply device A, heat dissipation fins are formed on the outer surface of the first casing 2a, and heat dissipation fins are formed on the outer surface of the second casing. You may provide the connection part which couple | bonds at least one part of a thermal radiation fin and said 2nd housing | casing thermally.

  In the heat dissipation structure of the power supply device A, the first casing 2a houses the first electric circuit including the first heat generating component 1a, and the second casing 2b includes the second casing 2b. The second electric circuit including the heat generating component 1b is housed, and a conduction portion 7 is formed on the outer surface of the first housing 2a for conducting the first electric circuit and the second electric circuit. An opening 8 corresponding to the conducting portion 7 is formed on the outer surface of the second casing 2b, and the conducting portion 7 and the opening 8 may be coupled by the connecting portion 4d. Good.

  The heat dissipation structure of the power supply device A further includes a second connection portion 4b that thermally couples at least a part of the heat dissipation fins 3b of the second casing 2b and the first casing 2a. May be.

  In the heat dissipation structure of the power supply device A, the first casing 2a and the second casing 2b are disposed adjacent to each other so that the outer surfaces on which the heat dissipation fins 3a and 3b are formed face each other. It may be a thing.

  In the heat dissipation structure of the power supply device A, the heat dissipation fins 3a and 3b of the first and second casings 2a and 2b are each formed by a plurality of protrusions, and the first and second casings are formed. 2a and 2b may be arranged so that at least a part of the plurality of protrusions of the heat radiation fins 3a and 3b are alternately assembled in a state of being separated from each other. According to the heat dissipation structure of the power supply device A, the air blown from the fan 5 can be smoothly passed, and the density of the protrusions of the heat dissipation fins 3a and 3b can be increased to reduce the size and improve the heat dissipation characteristics. Can do.

  In the heat dissipation structure of the power supply device A, the heat generated by the first or second heat generating component 1a, 1b is dissipated through the air flowing through the area where the heat dissipation fins 3a, 3b are disposed. It may be a thing.

  In the heat dissipation structure of the power supply device A, the first and second heat generating components 1a and 1b may be first and second power supply circuits that perform an exclusive operation. Thus, the heat dissipation structure of the power supply device A can be suitably used for a heat generating component.

  In the heat dissipation structure of the power supply device A, the first heat generating component 1a and the second heat generating component 1b may have different heat generation amounts during operation. Thus, the heat dissipation structure of the power supply device A can be suitably used for a heat generating component.

  In the heat dissipation structure of the power supply device A, at least one of the first or second casings 2a and 2b may be integrally formed with the heat dissipation fins 3a and 3b by die casting. The heat dissipation structure of the power supply device A is suitable from the viewpoints of hermeticity, downsizing, manufacturing cost, and the like.

  Further, in the heat dissipation structure of the power supply device A, the connection portion 4a includes a solder material, a welded portion, and the like that connect the tip of the heat dissipation fin 3a of the first housing 2a and the outer surface of the second housing 2b. It may include at least one of a heat radiation adhesive and an aluminum brazing part.

  The present disclosure can be suitably used as a heat dissipation structure for a power supply device.

1a, 1b Heat generation component 2a, 2b Housing 3a, 3b Radiation fins 4a, 4b, 4c, 4d Connection portion 5 Fan 6 Conductive wire 7 Conductive portion 8 Opening portion

Claims (12)

A first housing that houses a first heat-generating component;
A second housing that houses the second heat-generating component;
Radiating fins are formed on the outer surface of the first housing and / or the outer surface of the second housing,
A connecting portion that thermally couples the first housing and the second housing via the heat dissipating fins;
A heat dissipation structure for a power supply device comprising: Radiating fins are formed on the outer surface of the first housing,
Radiating fins are formed on the outer surface of the second casing,
The connecting portion that thermally couples at least a part of the heat dissipating fins of the first housing and the second housing;
The heat dissipation structure for a power supply device according to claim 1. The first housing houses a first electric circuit including the first heat-generating component,
The second casing houses a second electric circuit including the second heat-generating component,
On the outer surface of the first housing, a conduction portion for conducting the first electric circuit and the second electric circuit is formed,
An opening corresponding to the conducting portion is formed on the outer surface of the second casing,
The heat dissipation structure for a power supply device according to claim 1, wherein the conduction portion and the opening are coupled by the connection portion. A second connecting portion that thermally couples at least a part of the heat radiating fins of the second casing and the first casing;
The heat dissipation structure for a power supply device according to claim 1, further comprising: The heat dissipation structure for a power supply device according to claim 4, wherein the first casing and the second casing are disposed adjacent to each other so as to face the outer surfaces on which the heat dissipating fins are formed. Each of the heat dissipating fins of the first and second housings is formed with a plurality of protrusions,
6. The power supply device according to claim 5, wherein the first and second housings are arranged so that at least a part of the plurality of protrusions of the heat radiating fins are alternately assembled in a state of being separated from each other. Heat dissipation structure. The power supply apparatus according to claim 5, wherein the heat generated by the first and second heat generating components is radiated through air flowing through a region where the radiation fins of the first and second casings are disposed. Heat dissipation structure. The heat dissipation structure for a power supply device according to claim 1, wherein the first and second heat generating components are first and second power supply circuits that perform an exclusive operation. The heat dissipation structure for a power supply device according to claim 1, wherein the first heat generating component and the second heat generating component have different heat generation amounts during operation. The heat dissipation structure for a power supply device according to claim 1, wherein at least one of the first or second casing is integrally formed with the heat dissipation fin by die casting. The connection part includes at least one of a solder material, a welding part, a heat radiation adhesive, and an aluminum brazing part that connect a tip of the heat radiation fin of the first housing and an outer surface of the second housing. Item 2. A heat dissipation structure for a power supply device according to Item 1.   A vehicle-mounted power supply device comprising the heat dissipation structure for a power supply device according to claim 1.

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