JP2018073989A - Imprint method, imprint device and method for manufacturing article - Google Patents

Abstract

An object of the present invention is to prevent the occurrence of problems caused by imprint material being supplied to a region on the outer peripheral side of a position of a step existing in a peripheral region of a substrate. In an imprint method for forming a pattern of an imprint material 8 on a substrate having a step 22 in a peripheral region, based on the position of the step 22 of the substrate, the position of the step 22 of the substrate Generating a control information for controlling a process of arranging the imprint material 8 on the substrate so that the imprint material 8 is not arranged in a region on the outer peripheral side, and a generation process of the substrate based on the control information. An arrangement step of disposing the imprint material 8 thereon and a curing step of bringing the mold into contact with the imprint material 8 on the substrate and curing the imprint material are included. [Selection] Figure 14

Description

  The present invention relates to an imprint method, an imprint apparatus, and an article manufacturing method.

  As a new lithography technology, there is an imprint technology in which an imprint material is placed on a substrate and the pattern of the mold is transferred onto the substrate by curing the imprint material while the mold is in contact with the imprint material. Attention has been paid. A mold is also called a mold or a template. In the imprint technique, it is important to place the imprint material at an appropriate position on the substrate.

  Patent Document 1 describes an imprint apparatus that includes a dropping control device, an inkjet head, a stage, and a light source. The imprint apparatus of Patent Document 1 drops an imprint material onto a substrate and presses the template against the substrate to form a template pattern on the substrate. In the imprint apparatus of Patent Document 1, the movement direction of the stage and the ejection amount of the imprint material are corrected so that the positional deviation amount of the template with respect to the stage and the positional deviation amount of the nozzle row of the inkjet head with respect to the movement direction of the stage are corrected. Is controlled.

  Patent Document 2 describes an imprint apparatus that forms an imprint material supplied on a substrate using a mold. The imprint apparatus of Patent Document 2 has a plurality of nozzles that eject droplets of imprint material, and controls the ejection of droplets at each nozzle according to a map that indicates the arrangement of imprint materials to be supplied onto the substrate. . This map is updated so that the thickness of the imprint material formed using the mold falls within an allowable range.

JP 2012-69758 A Japanese Patent Laid-Open No. 2015-213130

  In an imprint apparatus, generally, a substrate that has been processed to remove a layer of a certain width from the edge of the substrate can be sent to the imprint apparatus. This process is called an edge bead removal (EBR) process. In the EBR process, a layer having a constant width can be removed from the edge of the substrate by supplying a solvent to the outer peripheral portion of the substrate while rotating the substrate. A step formed on the substrate by the EBR process can be referred to as an EBR step.

  When the EBR step formed by the EBR process is greatly deviated from the target position, the outer region of the EBR step (region between the EBR step and the edge of the substrate) is formed when a pattern is formed in the peripheral region of the substrate in the imprint apparatus. An imprint material may be supplied. In this case, there is a possibility that a pattern is not normally formed in the shot area. In addition, if the imprint material supplied to the outer peripheral area from the position of the EBR step is volatilized and adheres to the mold and then hardens, pattern imperfections may occur in the subsequent imprint process, The mold may be damaged when the mold is brought into contact with the imprint material.

  The present invention has been made based on the recognition of the above problems, and prevents the occurrence of problems caused by the imprint material being supplied to a region on the outer peripheral side of the position of the step existing in the peripheral region of the substrate. The purpose is to do.

  One aspect of the present invention relates to an imprint method for forming a pattern with an imprint material on a substrate having a step in a peripheral region, the imprint method based on the position of the step on the substrate. A generation step of generating control information for controlling a process of arranging the imprint material on the substrate so that the imprint material is not arranged in a region on the outer peripheral side of the substrate from the position of the step of the substrate; and the control An arrangement step of disposing an imprint material on the substrate based on information, and a curing step of bringing the mold into contact with the imprint material on the substrate and curing the imprint material.

  According to the present invention, it is possible to prevent the occurrence of problems due to the imprint material being supplied to the outer region of the step existing in the peripheral region of the substrate.

The figure which shows the structure of the imprint apparatus of one Embodiment of this invention. The figure explaining an EBR level | step difference. The figure explaining an EBR level | step difference. The figure explaining an EBR level | step difference. The figure explaining an EBR level | step difference. The figure explaining the problem resulting from the shift | offset | difference of an EBR level | step difference. The figure explaining the problem resulting from the shift | offset | difference of an EBR level | step difference. The figure explaining the procedure of the imprint method of one Embodiment of this invention. The figure explaining the procedure of the other imprint method of one Embodiment of this invention. The figure which illustrates the method of calculating | requiring the position of an EBR level | step difference. The figure which illustrates the structure of the imprint apparatus which can implement the measurement of the position of an EBR level | step difference, and pattern formation in parallel. The figure which illustrates the method of implementing the measurement of the position of an EBR level | step difference, and pattern formation in parallel. The figure which illustrates the relationship between the edge of a board | substrate, an EBR level | step difference, and a shot layout. The figure for demonstrating correction | amendment of a map. Relationship between the driving speed of the substrate by the substrate driving mechanism and the interval of the imprint material (droplet) (a), and the driving frequency of the driving element for discharging the imprint material and the interval of the imprint material (droplet) The figure which illustrates the relationship (b) with. The figure for demonstrating correction | amendment of a map. The figure for demonstrating correction | amendment of a map. The figure which illustrates an article manufacturing method.

  Hereinafter, the present invention will be described through exemplary embodiments thereof with reference to the accompanying drawings.

  FIG. 1 shows a configuration of an imprint apparatus 100 according to an embodiment of the present invention. The imprint apparatus 100 is an apparatus that performs an imprint method for forming a pattern of the imprint material 8 on the substrate 3. As the imprint material 8, a curable composition (also referred to as an uncured resin) that is cured by applying curing energy is used. As the energy for curing, electromagnetic waves, heat, or the like can be used. The electromagnetic wave can be, for example, light having a wavelength selected from a range of 10 nm to 1 mm, for example, infrared rays, visible rays, ultraviolet rays, and the like. The curable composition may be a composition that is cured by light irradiation or by heating. Among these, the photocurable composition cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary.

  The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component. The imprint material can be disposed on the substrate in the form of droplets or islands or films formed by connecting a plurality of droplets by the discharge unit 11. The viscosity of the imprint material (viscosity at 25 ° C.) can be, for example, 1 mPa · s or more and 100 mPa · s or less. As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin, or the like can be used. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate 3 is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

  In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which a direction parallel to the surface of the substrate 3 is an XY plane. In the XYZ coordinate system, the directions parallel to the X, Y, and Z axes are the X, Y, and Z directions, respectively, and rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are θX and θY, respectively. , ΘZ. The control or drive related to the X axis, Y axis, and Z axis means control or drive related to the direction parallel to the X axis, the direction parallel to the Y axis, and the direction parallel to the Z axis, respectively. The control or drive related to the θX axis, θY axis, and θZ axis relates to rotation around an axis parallel to the X axis, rotation around an axis parallel to the Y axis, and rotation around an axis parallel to the Z axis. Means control or drive. The position is information that can be specified based on the coordinates of the X axis, the Y axis, and the Z axis, and the posture is information that can be specified by the values of the θX axis, the θY axis, and the θZ axis. Positioning means controlling position and / or attitude.

  The imprint apparatus 100 includes, for example, a substrate drive mechanism 4 that holds and drives the substrate 3, a mold drive mechanism 2 that holds and drives the mold 1, a curing unit 7, a supply unit 11, measuring instruments 5 and 15, and a control unit 9. Can be prepared. The substrate drive mechanism 4 and the mold drive mechanism 2 constitute a drive mechanism that drives at least one of the substrate 3 and the mold 1 so that the relative position between the substrate 3 and the mold 1 is adjusted. The substrate driving mechanism 4 can be configured to drive the substrate 3 about a plurality of axes (for example, three axes of the X axis, the Y axis, and the θZ axis). The mold drive mechanism 2 can be configured to drive the mold 1 with respect to a plurality of axes (for example, six axes of X axis, Y axis, Z axis, θX axis, θY axis, and θZ axis).

  The measuring instrument 5 is a device for measuring the position of a step such as an EBR step existing in the peripheral region of the substrate 3. The measuring instrument 5 can include a microscope, for example. Alternatively, the measuring instrument 5 can include a sensor such as a displacement meter. The sensor is preferably a non-contact type. The measuring instrument 15 is an apparatus for measuring a measurement object via the mold 1. The measuring instrument 15 may include, for example, a microscope for observing the alignment mark of the mold 1 while observing the alignment mark of the substrate 3 through the mold 1. The measuring instrument 15 may be used to measure the position of a step such as an EBR step existing in the peripheral region of the substrate 3. The curing unit 7 supplies energy (for example, light such as ultraviolet rays) for curing the imprint material 8 to the imprint material 8 on the substrate 3.

  The supply unit 11 (dispenser) supplies or arranges the imprint material 8 on the substrate 3. For example, the supply unit 11 discharges the imprint material 8 in synchronization with the driving of the substrate 3 by the substrate drive mechanism 4, and supplies or arranges the imprint material 8 at a target position on the substrate 3. The mold driving mechanism 2, the measuring instruments 5 and 15, and the curing unit 7 can be supported by a structure 6 that is supported by a floor via a mount 10. Mount 10 is configured to block or reduce transmission of vibrations from the floor to structure 6.

  The controller 9 is, for example, PLD (abbreviation of Programmable Logic Device) such as FPGA (abbreviation of Field Programmable Gate Array), or ASIC (abbreviation of Application Specific Integrated Circuit). It can be constituted by a computer or a combination of all or part of them. The control unit 9 controls the substrate drive mechanism 4, the mold drive mechanism 2, the curing unit 7, the supply unit 11, and the measuring instruments 5 and 15. For example, the control unit 9 can be connected to a general control unit of a factory in which the imprint apparatus 100 is arranged via a network.

  FIG. 2A illustrates the relationship between the edge 21 (outer periphery of the substrate), the EBR step 22 and the shot layout 29 of the substrate 3. The shot layout 29 is configured by an array of a plurality of shot areas 28. In FIG. 2A, for the sake of simplicity, the scribe lines between the plurality of shot regions 28 are not shown. The shot area 28 is an area where a pattern is formed by one imprint. The imprinting is an operation of bringing the mold 1 into contact with the imprinting material 8 on the substrate 3 and curing the imprinting material 8. The shot area 28 includes at least one chip area, and typically includes a plurality of chip areas.

  A shot region having a region that protrudes to a region on the outer peripheral side (outside) (hereinafter referred to as an outer region) from the position of the EBR step 22 of the substrate 3 is a missing shot region. The missing shot area can include at least one chip area. The shot area that does not protrude into the outer area of the EBR step 22 of the substrate 3 is a non-missing shot area (or a complete shot area).

  A region where a pattern is formed by imprinting is an inner region of the EBR step 22. When a pattern is formed by imprinting in the missing shot area, the imprint material should be disposed only in the area inside the EBR step 22. When the imprint material is disposed in the outer region of the EBR step 22, the imprint material not only becomes a foreign substance, but also chemically contaminates the imprint apparatus or adheres to the mold 1 to cause pattern defects. Or the mold 1 may be damaged.

  2B and 2C are enlarged views of the portion 23 in FIG. FIG. 2B schematically shows a state in which the imprint material 8 (droplets) is disposed in the missing shot region 24 in order to form a pattern in the missing shot region 24. FIG. 2C schematically shows a state in which the imprint material 8 (droplets) is arranged in the missing shot region 24 in order to form a pattern in the non-missing shot region 25. The arrangement of the imprint material 8 can be determined according to the shape of the shot area, the width and density of the pattern of the mold 1 and the like.

  The EBR step 22 will be described with reference to FIG. FIG. 3A schematically shows the EBR process. The substrate 3 can be composed of a semiconductor substrate 35 and one or more layers 33 and 34 disposed on the semiconductor substrate 35. In the example of FIG. 3A, a plurality of 33 and 34 exist on the semiconductor substrate 35. The semiconductor substrate 35 has an effective area 36 and an ineffective area 37 that is an outer area of the effective area 36. The effective area 36 is an area where a pattern can be formed by imprinting, and the invalid area 37 is an area where a pattern cannot be formed by imprinting. The layers 33 and 34 in the ineffective region 37 of the semiconductor substrate 35 are removed by the EBR apparatus. The EBR apparatus, for example, supplies the chemical solution 32 from the nozzle 31 to the invalid region 37 of the semiconductor substrate 35 while rotating the substrate 3 by rotating the chuck that holds the substrate 3, thereby causing the layer 33 in the invalid region 37, 34 is removed. Thereby, the layers 33 and 34 in the invalid region 37 are removed, and the substrate 3 having the EBR step 22 is obtained. The EBR step 22 is constituted by the side surfaces SS of the layers 33 and 34. Here, the EBR step 22 can be understood as a boundary between the effective region 36 and the invalid region 37, but even if the boundary between the effective region 36 and the invalid region 37 is determined at a position a predetermined distance from the EBR step 22. Good. The EBR step 22 is a step existing in the peripheral region 38 of the substrate 3.

  The distance between the edge 21 of the substrate 3 (semiconductor substrate 35) and the EBR step 22 (the removal width of the layer by EBR processing) can be determined according to the process conditions. The EBR step 22 is typically circular. The EBR step 22 formed by the EBR apparatus preferably has a circular shape that is concentric with the center of the substrate 3. However, for example, if the conveyance accuracy of the substrate 3 to the EBR apparatus is insufficient, the center of the substrate 3 is decentered from the center of the chuck that holds the substrate 3, whereby the center of the circular EBR step 22 is the substrate 3. Eccentric from the center. Alternatively, if the position of the nozzle 31 that discharges the chemical liquid 32 or the setting of the pressure of the nozzle 31 for EBR processing deviates from the ideal value, the diameter of the circular EBR step 22 deviates from the target EBR step diameter.

  FIG. 4A shows a state where the center 42 of the circular EBR step 22 is coincident with the center 41 of the substrate 3, that is, a state where the circular EBR step 22 and the edge 21 of the substrate 3 are concentric. Has been. FIG. 4B shows a state in which the center 42 of the circular EBR step 22 does not coincide with the center 41 of the substrate 3, that is, a state where the circular EBR step 22 and the edge 21 of the substrate 3 are not concentric. Has been. FIG. 5 illustrates a state where the center 42 of the circular EBR step 22 coincides with the center 41 of the substrate 3, but the diameter of the circular EBR step 22 is different from the target diameter of the EBR step 51. .

  FIG. 6 schematically shows a problem that occurs when a pattern is formed by imprinting on the substrate 3 in which the actual EBR step 22 is shifted from the target position of the EBR step 52. As shown in FIG. 6A, when the actual EBR level difference 22 is located on the inner side (substrate center side) than the target EBR level difference 52, the imprint material 8 ′ ejected from the supply unit 11 has the layers 33 and 34. It can be disposed on the semiconductor substrate 35 (outside region of the EBR step 22) instead of on the substrate.

  The imprint material 8 ′ disposed on the semiconductor substrate 35 (outer region of the EBR step 22) volatilizes when the mold 1 is brought into contact with the imprint material 8 on the layers 33 and 34, and the imprint material 8. Can be adhered to the mold 1 as the imprint material 8 is irradiated with energy by the curing unit 7 in order to cure the imprint material 8 on the layers 33, 34. Material 8 "can also be cured. The cured imprint material 8 ″ remains in the mold 1 as a foreign matter.

  For example, consider a case where pattern formation is performed on the non-missing shot region 82 after pattern formation on the missing shot region 81 shown in FIG. In this case, the imprint material 8 ″ adheres to the mold 1 and is cured when the pattern is formed on the chipped shot region 81, and the imprint material 8 ″ is formed on the non-missed shot region when the pattern is formed on the non-chipshot region 82. 82 may adhere as foreign matter. In one example, a plurality of foreign matters 8 ″ can be arranged in the shot area so as to be arranged in an arc shape. The imprint material 8 ″ adhered and solidified on the mold 1 is also used in pattern formation for other shot areas. Can adhere as foreign matter.

  In order to solve the above problems, in the imprint apparatus 100 according to the present embodiment, the imprint material 8 applied to the substrate 3 by the supply unit 11 is prevented from being disposed in the outer region of the EBR step 22. Supply is controlled. FIG. 8 shows a procedure of an imprint method executed in the imprint apparatus 100. The imprint method shown in FIG. 8 can be controlled by the control unit 9. Here, an example in which the substrate 3 has the EBR step 22 will be described, but the present invention can also be applied to a case where the substrate 3 has another step in its peripheral region.

  First, in step S901 (transfer process), the control unit 9 controls a transfer mechanism (not shown) to transfer the substrate 3 to the substrate chuck of the substrate drive mechanism 4 and hold it on the substrate chuck. In step S902 (acquisition step), the control unit 9 acquires information indicating the position of the EBR step 22. For example, the control unit 9 can obtain the position of the EBR step 22 by performing a measurement process for measuring the position of the EBR step 22 using the measuring instrument 5. Or the control part 9 can acquire the position of the EBR level | step difference 22 by implementing the measurement process for measuring the position of the EBR level | step difference 22 using the measuring device 15 for measuring the position of an alignment mark. . Or the control part 9 may acquire this information by receiving the information which shows the position of the EBR level | step difference 22 from another apparatus.

  When acquiring information indicating the position of the EBR step 22 using the measuring instrument 5 or 15, the control unit 9 acquires the information in global alignment measurement for specifying the positions of a plurality of shot areas on the substrate 3. Also good. Here, in the global alignment measurement, the positions of a plurality of sample shot areas selected from the plurality of shot areas on the substrate 3 are measured by the measuring device 15 and the positions of the plurality of shot areas on the substrate 3 are specified based on the results. It is processing to do. In order to measure a plurality of sample shot areas with the measuring instrument 15, it is preferable to include a via position for measuring the position of the EBR step 22 in the path for driving the substrate 3 by the substrate driving mechanism 4. That is, the measurement of the EBR step 22 can be performed during the global alignment measurement. Here, it is preferable to determine the path so that the path for driving the substrate 3 is as short as possible. Thereby, the time required for the global alignment measurement and the measurement of the position of the EBR step 22 can be shortened as compared with the case where the global alignment measurement and the measurement of the position of the EBR step 22 are separately performed.

  In step S903 (generation step), the control unit 9 places the imprint material on the substrate 3 so that the imprint material is not disposed in the outer region of the EBR step 22 based on the information (position of the EBR step 22) acquired in step S902. Control information for controlling the process of arranging the imprint material is generated. Here, the control information may include information indicating a region where the imprint material is to be disposed and / or a map indicating a plurality of positions where the imprint material is to be disposed.

  In step S904 (placement step), the control unit 9 controls the substrate drive mechanism 4 and the supply unit 11 based on the control information generated in step S903 for the missing shot region, thereby imprinting the substrate 3. The imprint material 8 is arranged on the target shot area. Here, the shot area to be imprinted means a shot area where a pattern is to be formed by imprinting. The missing shot area is a non-missing shot area in the design shot layout, but may include a shot area that becomes a missing shot area by shifting the actual EBR step 22 from the target EBR step. In step S904 (arrangement step), for the non-missing shot region, the arrangement of the imprint material is controlled without being based on the control information generated in step S903, that is, without being based on the position of the EBR step 22.

  When the control information is information indicating an area where the imprint material is to be arranged, the control unit 9 causes the imprint material 8 to be arranged only within the area where the imprint material is to be arranged based on the information. The substrate driving mechanism 4 and the supply unit 11 can be controlled. When the control information is a map, the control unit 9 can control the substrate driving mechanism 4 and the supply unit 11 so that the imprint material 8 is disposed at each position indicated by the map.

  In step S905 (contact step), the control unit 9 controls the mold driving mechanism 2 to bring the mold 1 into contact with the imprint material 8 on the shot area to be imprinted on the substrate 3. As a result, the imprint material 8 is filled in the recesses constituting the pattern of the mold 1. In step S906 (curing step), the control unit 9 controls the curing unit 7 to irradiate the imprint material 8 with energy for curing the imprint material 8 on the imprint target shot area of the substrate 3. Let Thereby, the imprint material 8 on the shot area to be imprinted is cured. In step S907 (separation step), the control unit 9 controls the mold driving mechanism 2 to separate the mold 1 from the cured imprint material 8 on the shot area to be imprinted.

  In step S908, the control unit 9 determines whether or not the pattern formation for all the shot areas to be imprinted on the substrate 3 is completed. If completed, the process proceeds to step S908. On the other hand, if not completed, the process returns to step S904, and steps S904 to S907 are performed on the unprocessed shot area. In step S909, the control unit 9 controls a transport mechanism (not shown) to carry the substrate 3 out of the imprint apparatus 100 from the substrate drive mechanism 4.

  FIG. 9 shows a procedure of another imprint method executed in the imprint apparatus 100. The imprint method shown in FIG. 9 can be controlled by the control unit 9. Here, an example in which the substrate 3 has the EBR step 22 will be described, but the present invention can also be applied to a case where the substrate 3 has another step in its peripheral region. In the imprint method shown in FIG. 9, step S910 (determination step) and step S911 (warning step) are added to the imprint method shown in FIG.

  Step S910 (determination step) is inserted between step S902 and step S903. In step S910, it is determined whether the position of the EBR step 22 acquired in step S902 is within the allowable range. If the position of the EBR step 22 is within the allowable range, the above-described steps S903 to S909 are executed. To do. On the other hand, if the position of the EBR step 22 is out of the allowable range, the process proceeds to step S909 after issuing a warning in step S911. When the position of the EBR step 22 is within an allowable range, control information for controlling the process of placing the imprint material 8 on the substrate 3 is generated so that the imprint material 8 is not placed in the outer region of the EBR step 22 By doing so, the shift of the position of the EBR step 22 is dealt with. On the other hand, when the position of the EBR step 22 is out of the allowable range, it is useless even if a pattern is formed on such a substrate 3 by the imprint method, and therefore, from the imprint apparatus 100 without forming a pattern. The substrate 3 is unloaded. Whether or not the position of the EBR step 22 is within an allowable range can be determined, for example, by determining whether or not the deviation of the actual EBR step 22 from the target position of the EBR step is equal to or less than a preset threshold value.

  Hereinafter, several methods for obtaining the position of the EBR step 22 will be described as an example. First, an example in which the measuring instrument 5 is a non-contact type displacement meter will be described. In this example, the substrate drive mechanism 4 moves the substrate 3 so that the EBR step 22 of the substrate 3 crosses the measurement axis of the measuring instrument 5. Based on the position of the substrate 3 when the measured displacement value obtained by the measuring instrument 5 changes in a step shape, it can be acquired as the position of the EBR step 22. For example, the position of the EBR step 22 can be acquired based on the position of the substrate 3 when the displacement measurement value exceeds the threshold value. The EBR step 22 is, for example, 50 to 100 nm, and the threshold value can be set within this range.

  Next, an example in which the measuring instrument 5 is a microscope will be described. In this example, the region including the EBR step 22 is placed in the field of view of the measuring instrument 5 and an image of the region including the EBR step 22 is captured by a microscope. Then, the position of the EBR step 22 can be acquired by processing the image (for example, based on a change in luminance). Here, the EBR step 22 can be detected by comparing an image obtained by a microscope with a reference image prepared in advance.

  The EBR level difference 22 may be actually measured over the entire circumference, or may be actually calculated at a plurality of locations and obtained by calculation or the like based on the result. For example, when the EBR step 22 is circular, the position of the EBR step 22 can be measured at least at three locations, and the center position and the diameter of the EBR step 22 can be obtained by a geometric method based on the result.

  As illustrated in FIG. 10, when the alignment mark AM is present on the substrate 3, the position of the EBR step 22 may be obtained based on the alignment mark AM. That is, the position of the EBR step 22 may be obtained as a relative position with respect to the alignment mark AM.

  When the time required for measurement at the position of the EBR step 22 cannot be allowed, the measurement of the EBR step 22 and the pattern formation by the imprint method may be performed in parallel. As shown in FIGS. 11 and 12, two substrate driving mechanisms 4 are provided, and the position of the EBR step is measured while one substrate driving mechanism 4 drives one substrate, and the other substrate driving mechanism. 4 can be achieved by forming a pattern while driving another substrate.

  Further, for the purpose of shortening the time required for measurement, first, the EBR step is simply measured at several points, and if the deviation of the EBR step with respect to the target position exceeds the threshold, the EBR step is measured in more detail. May be adopted. In the case of processing a plurality of substrates, if it is guaranteed that the variation between them is small, the EBR step difference is measured for at least one leading substrate, and control information is generated based on the result. For other substrates, measurement of the EBR step may be omitted. For example, when a plurality of substrates are processed as the same lot by the same apparatus, it can be considered that the variation between the plurality of substrates is guaranteed to be small.

  Hereinafter, a specific example of the generation step (step S903) for generating control information for controlling the process of arranging the imprint material 8 on the substrate 3 so that the imprint material 8 is not arranged in the outer region of the EBR step 22 will be exemplified. I will explain it. Here, the imprint material is arranged on the substrate 3 by a method in which the supply unit 11 has a plurality of discharge ports, and the substrate driving mechanism 4 discharges the imprint material from the plurality of discharge ports while moving the substrate 3. An example will be described. The control information may include a map indicating a plurality of positions where the imprint material (droplets) is to be placed. If there is no problem even if the total amount of imprint material to be arranged in one shot area is slightly increased or decreased, by increasing or decreasing the plurality of positions where the imprint material (droplets) in the original map should be arranged, A corrected map (control information) can be generated. The original map is, for example, a map (control information) provided to the imprint apparatus 100 from an external apparatus or a console (not shown).

  FIG. 13 illustrates the relationship between the edge 21 of the substrate 3, the EBR step 22, and the shot layout 29. The shot layout 29 is configured by an array of a plurality of shot areas 28. In FIG. 13, for the sake of simplicity, the scribe lines between the plurality of shot regions 28 are not shown.

  FIG. 14A shows an enlarged view of the missing shot region 131, the edge 21 of the substrate 3, and the EBR step 22 in FIG. Further, in FIG. 14A, an arrangement example of the imprint material 8 specified by the original map (control information) MP is indicated by black dots. FIG. 14A shows an example in which the EBR step 22 matches the target position. In this case, the imprint material 8 may be arranged according to the original map MP, and it is not necessary to correct the map MP and generate a new map.

  FIG. 14B shows a state in which the position of the EBR step 22 is closer to the inner side (center side of the substrate 3) than the EBR step 22 shown in FIG. In the example shown in FIG. 14B, an imprint material 81 that is a part of the plurality of imprint materials 8 to be arranged in the shot region 131 is arranged in the vicinity or outside of the EBR step 22. Therefore, when the imprint material 8 is arranged according to the original map MP, the imprint material 81 is arranged in the outer region of the EBR step 22 as described with reference to FIG. sell. Therefore, the control unit 9 corrects the original map (control information) MP to generate a new map (control information) MP ′. As a specific example, the control unit 9 deletes the imprint material 81 (the rightmost column) that may be disposed in the outer region of the EBR step 22 from the original map MP, thereby creating a new map. MP ′ is generated. In FIG. 14C, the control unit 9 creates a new one generated by deleting the imprint material 81 (the rightmost column) that may be arranged in the outer region of the EBR step 22 from the original map MP. A simple map MP ′ is shown. The method described with reference to FIGS. 14B and 14C is useful when no problem occurs even if the total amount (for example, the number of droplets) of the imprint material 8 arranged in the shot region 131 is increased or decreased. is there.

  In the method of generating the corrected map MP ′ by deleting the droplets from the original map MP, there is a possibility that an unfilled portion is generated due to a shortage of the imprint material. In addition, in the method of generating the corrected map MP ′ by adding droplets to the original map MP, there is a possibility that the imprint material may protrude from the shot area due to excessive imprint material.

  Hereinafter, a method for generating a corrected map MP ′ while maintaining the total amount of imprint materials in the original map MP will be described as an example. Here, two methods for generating a corrected map MP ′ from the original map MP by changing parameter values that define the interval between droplets of the imprint material will be described as an example.

  In the first example, the map MP ′ corrected from the original map MP based on the relationship between the driving speed of the substrate 3 by the substrate driving mechanism 4 and the arrangement pitch (center-to-center distance) of the droplets of the imprint material 8. Is a method of generating FIG. 15A illustrates the relationship between the driving speed of the substrate 3 by the substrate driving mechanism 4 and the interval between the imprint materials 8 (droplets).

  In the second example, based on the relationship between the drive frequency of a drive element (for example, a piezoelectric element) provided at the discharge port of the supply unit 11 and the arrangement pitch (center distance) of droplets of the imprint material 8, This is a method of generating a corrected map MP ′ from the original map MP. Here, the drive element is an element that drives the imprint material for discharging the imprint material from the discharge port. FIG. 15B illustrates the relationship between the drive frequency of the drive element and the interval between the imprint materials 8 (droplets). The relationships illustrated in FIGS. 15A and 15B can be obtained through experiments or simulations.

  FIG. 16A shows an enlarged view of the missing shot region 131, the edge 21 of the substrate 3, and the EBR step 22 in FIG. Further, in FIG. 16A, an arrangement example of the imprint material 8 designated by the original map (control information) MP is indicated by black dots. FIG. 16A shows an example in which the EBR level difference 22 matches the target position. In this case, the imprint material 8 may be arranged according to the original map MP, and it is not necessary to correct the map MP and generate a new map. In the illustration of FIG. 16A, for example, the arrangement pitch P of the imprint material 8 is 50 μm. A distance of, for example, 10 μm is set between the imprint material 8 in the rightmost column in the map MP and the EBR step 22, thereby preventing the imprint material 8 from being disposed outside the EBR step 22. The

  FIG. 16B shows a state in which the position of the EBR step 22 is closer to the inner side (center side of the substrate 3) than the EBR step 22 shown in FIG. In the example shown in FIG. 16B, an imprint material 81 that is a part of the plurality of imprint materials 8 to be arranged in the shot region 131 is arranged in the vicinity or outside of the EBR step 22. Therefore, when the imprint material 8 is arranged according to the original map MP, the imprint material 81 is arranged in the outer region of the EBR step 22 as described with reference to FIG. sell.

  When the total amount of the imprint material 8 to be arranged in the shot area 81 should not be changed, the control unit 9 can calculate the corrected arrangement pitch P ′ according to the following equation (1).

P ′ = (D−ΔD) ÷ (N−1) (1)
P ′: Corrected arrangement pitch D: Distance from the position of the droplet farthest from the position of the EBR step 22 to the target position of the EBR step 22 ΔD :: The actual EBR step 22 from the target position of the EBR step Position shift amount N: Number of columns in the arrangement of droplets FIG. 16C shows a map according to the corrected arrangement pitch P ′, that is, a corrected map MP ′. The control unit 9 drives the driving speed of the substrate 3 by the substrate driving mechanism 4 or the driving element of the supplying unit 11 based on the relationship of FIGS. 15A and 15B so that the corrected arrangement pitch P ′ is obtained. Change the drive frequency. Thereby, the droplet of the imprint material 8 is arranged at a position according to the corrected map MP ′.

  Hereinafter, another method for generating the corrected map MP ′ while maintaining the total amount of the imprint material in the original map MP will be described as an example. In the method described below, the control unit 9 shifts the position of the droplet disposed near or outside the EBR step 22 in the original map MP to the inside of the EBR step 22 to thereby correct the corrected map MP. Generate '.

  FIG. 17A shows an enlarged view of the missing shot region 132, the edge 21 of the substrate 3, and the EBR step 22 in FIG. Also, in FIG. 17A, an arrangement example of the imprint material 8 specified by the original map (control information) MP is indicated by black dots. In the example of FIG. 17A, the EBR step 22m is shifted inward from the target position T. Therefore, when the imprint material 8 is arranged according to the original map MP, a part of the imprint material 8 can be arranged in the outer region of the EBR step 22m.

  Therefore, as illustrated in FIG. 17B, the control unit 9 shifts the position of the droplet disposed near or outside the EBR step 22 in the original map MP to the inside of the EBR step 22 m. A corrected map MP ′ is generated. FIG. 17C shows an enlarged part of FIG. In FIGS. 17B and 17C, the white circles indicate the position of the imprint material in the original map MP, and the arrows schematically indicate the shift in the arrangement position of the imprint material. The shift can be performed so that the imprint material is not disposed within a predetermined distance from the actual EBR step 22.

  As described above, according to the present embodiment, the occurrence of defects due to the supply of the imprint material to the outer region of the step existing in the peripheral region of the substrate, for example, the occurrence of pattern defects or the breakage of the mold, etc. Can be prevented.

  Hereinafter, modifications of the above embodiment will be described. If the variation in the result of measuring the position of the EBR step for at least two substrates at the top of a plurality of substrates constituting the same lot is less than or equal to a predetermined value, the position of the EBR step is measured for other substrates. Instead, pattern formation may be performed based on the result. Thereby, the time required for measuring the position of the EBR step can be shortened and the throughput can be improved.

  The measurement result of the position of the EBR step is fed back to a device that affects the EBR step (for example, an EBR device that performs EBR processing, a transport device that transports a substrate to the EBR device, and a control device that controls them), and thereby the EBR step The position at which is formed may be adjusted. Thereby, it is not necessary to correct the map, and the area of the missing shot area can be made uniform among a plurality of lots. The feedback may be made each time the EBR level difference of each substrate is measured, or may be made on the result of statistical processing of the measurement results of a plurality of substrates.

  The pattern of the cured product formed by using the imprint apparatus as described above is used permanently on at least a part of various articles or temporarily when various articles are manufactured. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

  Next, the article manufacturing method will be exemplarily described. As shown in FIG. 18A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared. Subsequently, the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 3z is applied. Here, a state is shown in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate.

  As shown in FIG. 18 (b), the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the concave / convex pattern is formed facing. As shown in FIG. 18C, the substrate 1 provided with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in a gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

  As shown in FIG. 18D, when the imprint material 3z is cured and then the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the die 4z is transferred to the imprint material 3z. It will be done.

  As shown in FIG. 18 (e), when etching is performed using the pattern of the cured product as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the groove 5z and Become. As shown in FIG. 18 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.

DESCRIPTION OF SYMBOLS 100: Imprint apparatus, 1: type | mold, 2: type | mold drive mechanism, 3: board | substrate, 4: board | substrate drive mechanism, 5: measuring device, 6: structure, 7: hardening part, 8: imprint material, 9: control Part, 11: supply part, 15: measuring instrument

Claims (14)

An imprint method for forming a pattern of an imprint material on a substrate having a step in a peripheral region,
Based on the position of the step of the substrate, the process of arranging the imprint material on the substrate is controlled so that the imprint material is not disposed in the region on the outer peripheral side of the substrate from the position of the step of the substrate. A generation process for generating control information to be performed;
An arrangement step of arranging an imprint material on the substrate based on the control information;
A curing step of bringing the mold into contact with the imprint material on the substrate and curing the imprint material;
The imprint method characterized by including. The substrate includes a semiconductor substrate and a layer disposed on the semiconductor substrate;
The step is constituted by a side surface of the layer.
The imprint method according to claim 1, wherein: The control information includes information indicating an area where the imprint material is to be arranged.
The imprint method according to claim 1, wherein: The control information includes a map indicating a plurality of positions where the imprint material is to be arranged.
The imprint method according to claim 1, wherein the imprint method is performed. It further includes an acquisition step of acquiring the position of the step.
The imprint method according to claim 1, wherein the imprint method is performed. The acquisition step includes a measurement step of measuring the position of the step.
The imprint method according to claim 5. The measurement step is performed by a measuring instrument provided in the imprint apparatus.
The imprint method according to claim 6. The measuring instrument includes a microscope for observing the substrate through the mold.
The imprint method according to claim 7. The measurement step is performed at the time of global alignment measurement for specifying the positions of a plurality of shot regions on the substrate.
The imprint method according to claim 8. The step is arranged to form a circle along the edge of the substrate;
In the measurement step, the position of the circle on the substrate is measured by detecting the position of the step in at least three places on the substrate.
The imprint method according to claim 7, wherein the imprint method is performed. An imprint apparatus for forming a pattern of an imprint material on a substrate having a step in a peripheral region,
A supply unit for supplying an imprint material on the substrate;
Based on the position of the step of the substrate, the imprint material on the substrate by the supply unit is arranged so that the imprint material is not disposed in a region on the outer peripheral side of the substrate with respect to the position of the step of the substrate. A control unit for controlling the supply of
An imprint apparatus comprising: A measuring instrument for measuring the position of the step of the substrate;
The imprint apparatus according to claim 11, wherein the control unit controls supply of the imprint material onto the substrate by the supply unit based on a measurement result of the measuring instrument. Forming a pattern on a substrate by the imprint method according to claim 1;
Processing the substrate on which the pattern is formed;
An article manufacturing method comprising: Forming a pattern on a substrate by the imprint apparatus according to claim 11;
Processing the substrate on which the pattern is formed;
An article manufacturing method comprising:

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