JP2018072157A - Electrical contact and electrical connection device including the same - Google Patents

Abstract

In an electrical contact, contact resistance of a contact portion can be stabilized, and wear of the contact portion due to sliding of the contact portion of the electrical contact can be reduced. An inspection probe (16Ai) is selectively applied to a device side plunger (26) as a first plunger having a contact part that selectively contacts an electrode part (DVb) of a semiconductor device (DV) and a contact pad of a printed wiring board (18). A substrate-side plunger including a substrate-side plunger 24 as a second plunger having a contact portion that abuts, and a coil spring portion 22 that urges the device-side plunger 26 and the substrate-side plunger 24 in a direction away from each other. 24, the other end 24Lae of the engagement piece 24La is formed with a contact portion 24Laf that protrudes close to the inner peripheral edge of the long hole 26STa with a predetermined gap, and the other end of the engagement piece 24Lb of the substrate side plunger 24 is formed. 24Lbe has a contact portion 24Lb that protrudes close to the other inner peripheral edge of the long hole 26STa with a predetermined gap. f is formed. [Selection] Figure 1

Description

  The present invention relates to an electrical contact and an electrical connection device including the electrical contact.

  For example, as shown in Patent Document 1, in a semiconductor element as an electronic component mounted on a printed wiring board of an electronic device, for example, as shown in Patent Document 1, at a stage before mounting. A test for removing the potential defect is performed through an IC socket (referred to as a test socket in Patent Document 1). The IC socket includes a plurality of inspection probes (referred to as contacts in Patent Document 1) for electrically connecting the above-described semiconductor device and the printed wiring board in its base member. The inspection probe includes an upper contact pin, a lower contact pin, and a spring that biases the upper contact pin and the lower contact pin away from each other in order to reduce the number of components and facilitate assembly. (See FIG. 5 and FIG. 6 in Patent Document 1). The upper contact pin and the lower contact pin are manufactured from a sheet metal material by sheet metal processing. The upper contact pin and the lower contact pin have the same configuration. The upper contact pin includes a V-shaped contact portion, two support protrusions, and a main body portion. The main body has two tongues each having a hook at the tip. Grooves are formed on the inner side surrounded by the rib portions orthogonal to the two tongues and the two tongues in the main body portion. The groove of the upper contact pin is held between two tongue hooks of the lower contact pin. As a result, each hook of the lower contact pin is in electrical contact with the side wall surface forming the groove in the main body, and the hooking surface of the hook of the lower contact pin is engaged with the locking surface of the rib portion of the upper contact pin. Stopped.

  In such a configuration, since the contact state between the upper contact pin and the lower contact pin is likely to vary, it is difficult to obtain a stable electrical contact state. In addition, since the contact positions of the upper contact pin and the lower contact pin cannot be accurately determined, it is necessary to strictly manage the dimensional tolerances of the components, resulting in an increase in manufacturing cost. Moreover, since each hook always contacts the side wall surface that forms the groove in the main body, repeated sliding of each hook may result in wear of the hook and the side wall surface, resulting in unstable contact resistance.

  Therefore, as shown in Patent Document 2 and Patent Document 3, probe pins with high contact stability and low manufacturing costs have been proposed. The probe pin disclosed in Patent Document 2 includes a first plunger having a first elastic piece and a second elastic piece having different lengths, and a guide groove into which a guide protrusion of the second elastic piece of the first plunger is fitted. A second plunger having a contact portion provided, and a coil spring that urges the first plunger and the second plunger in a direction away from each other are configured. In such a configuration, the first elastic piece and the second elastic piece of the first plunger are slidably held with respect to the second plunger. Thereby, the 1st elastic piece of the 1st plunger is always press-contacted to the single side | surface of the contact part of a 2nd plunger with self elastic restoring force. That is, the first plunger and the second plunger are conducted through the contact portion of the first elastic piece of the first plunger and the contact portion of the second plunger. The sliding movement between the first plunger and the second plunger is performed along the guide groove. At that time, the sliding movement between the first plunger and the second plunger is regulated in the guide groove by the above-described guide protrusion and the end of the guide groove.

Japanese Patent No. 4620737 Japanese Patent Laying-Open No. 2015-40734 Japanese Patent Laying-Open No. 2016-3920

  However, in the above-mentioned Patent Document 2, the contact portion of the first elastic piece of the first plunger is in contact with the contact portion of the second plunger at one location, so that the contact resistance is difficult to stabilize. Further, since the second plunger is held only by the guide protrusion of the second elastic piece of the first plunger, there is a problem that the holding force along the direction separating the first plunger and the second plunger from each other is weak. Furthermore, since the first elastic piece of the first plunger is always in pressure contact with one surface of the contact portion of the second plunger by its own elastic restoring force, sliding of the contact portion of the first elastic piece of the first plunger is repeated. As a result, the contact resistance may become unstable due to wear of the contact portion.

  In view of the above problems, the present invention provides an electrical contact and an electrical connection device including the electrical contact, which can stabilize the contact resistance of the contact portion, and also slide the contact portion of the electrical contact. An object of the present invention is to provide an electric contactor capable of reducing wear of a contact portion accompanying movement, and an electric connecting device including the electric contactor.

  In order to achieve the above-mentioned object, an electrical contact according to the present invention includes a contact terminal portion having a contact portion that contacts either one of an electrode portion of an object to be inspected or an electrode portion of a wiring board, and a contact terminal A first plunger having an opening penetrating a flat plate portion connected to the portion, and an electrode portion of the wiring board facing the electrode portion of the object to be inspected or the electrode portion of the wiring board in contact with the contact portion of the first plunger. A contact terminal portion having a fixed contact portion that comes into contact with the electrode portion of the test object, and a contact portion arranged adjacent to the inner peripheral edge forming the opening of the first plunger with a predetermined gap, connected to the contact terminal portion, A second plunger having a pair of engaging pieces so as to face each other through the opening of the first plunger, an end portion of the contact terminal portion of the first plunger, and a contact terminal portion of the second plunger Between the first A spring portion for biasing the plunger and the second plunger in a direction away from each other, and when the first plunger and the second plunger are brought close to each other against the biasing force of the spring portion, the pair of second plungers The contact portion of at least one of the engagement pieces is in contact with a part of the opening of the first plunger.

The total length of the pair of engagement pieces of the second plunger may be different from each other, and the contact portion of the engagement piece of the second plunger is integrated with the end of the engagement piece by pressing. It may be formed and protrude toward the opening of the first plunger. The pair of engagement pieces may be formed such that the contact portions of the pair of engagement pieces of the second plunger are close to each other through the opening of the first plunger, or the pair of engagements of the second plunger The pair of engagement pieces may be formed such that the contact points of the pieces are separated from each other through the opening of the first plunger.
The contact portion of the pair of engaging pieces of the second plunger may have a protruding portion raised toward the inner peripheral edge forming the opening of the first plunger. The pair of engaging pieces of the second plunger may have a narrowed portion narrower than the thickness of the flat plate-like portion of the first plunger between the contact portion and the end of the contact terminal portion of the second plunger. The flat plate-like portion of the first plunger inserted between the pair of engaging pieces of the second plunger has the second plunger when the first plunger and the second plunger are brought close to each other against the biasing force of the spring portion. It may have a convex part with which each contact part of a pair of engagement pieces contacts.

  Furthermore, the electrical contact according to the present invention includes a contact terminal portion having a contact portion that contacts either one of the electrode portion of the object to be inspected or the electrode portion of the wiring board, and a pair of first contacts connected to the contact terminal portion. A first plunger provided with an engagement piece, and an electrode portion of a wiring board or an electrode portion of the wiring board facing the electrode portion of the wiring board or the electrode portion of the wiring board that contacts the contact portion of the first plunger. A contact terminal portion having a fixed contact portion and a contact portion connected to the contact terminal portion and arranged close to the inner peripheral edge of the pair of first engaging pieces of the first plunger with a predetermined gap are provided on the first plunger. A second plunger having a pair of second engaging pieces respectively facing each other through the pair of first engaging pieces, an end of a contact terminal portion of the first plunger, and a second plunger A first plunger disposed between the contact terminal portion and the first plunger; And a spring portion that urges the second plunger in a direction away from each other, and when the first plunger and the second plunger are brought close to each other against the urging force of the spring portion, the pair of second plungers in the second plunger It contacts with a part of at least one 2nd engagement piece of 2 engagement pieces, It is characterized by the above-mentioned.

  Furthermore, an electrical connection device according to the present invention includes the above-described plurality of electrical contacts, a probe housing that houses the electrical contacts, and an electrode portion that contacts the contact portion of the first plunger of each electrical contact. A semiconductor device mounting portion that detachably accommodates a plurality of semiconductor devices, and a housing disposed on a wiring board that is electrically connected to the electrical contact.

  According to the electrical contact according to the present invention and the electrical connection device including the electrical contact, when the first plunger and the second plunger are brought close to each other against the biasing force of the spring portion, the pair of engagements of the second plunger. Since the contact portion of at least one of the engagement pieces contacts a part of the opening of the first plunger, the contact resistance of the contact portion can be stabilized, and the contact portion of the electric contact It is possible to reduce the wear of the contact portion due to sliding.

(A) is a perspective view which shows the whole structure of 1st Example of the electrical contact which concerns on this invention, (B) shows the state which removed the coil spring part in the example shown by (A). It is a perspective view, (C) is a perspective view used for operation | movement description of the test | inspection probe shown by (A), (D) removed the coil spring part in the example shown by (C). It is a perspective view which shows a state. (A), (B), and (C) are perspective views each used for explaining the assembly of the inspection probe shown in FIG. 1 (A). It is sectional drawing which shows roughly the whole structure of an example of the electrical connection apparatus which concerns on this invention. (A) is a front view which shows the state which removed the coil spring part in the example shown by FIG. 1 (A), (B) is sectional drawing shown along the IVB-IVB line | wire in (A). is there. (A) is the front view which shows the state which removed the coil spring part in the example shown by FIG. 1 (A), and is provided for operation | movement description of a test probe, (B) is VB in (A). FIG. 6 is a cross-sectional view taken along the line VB. (A) is a front view which shows the state which removed the coil spring part in the example shown by FIG. 1 (A), (B) is sectional drawing shown along a VIB-VIB line. (A) is a front view of the device side plunger which comprises a part of test | inspection probe shown by FIG. 1 (A), (B) is a part of test | inspection probe shown by FIG. 1 (A). FIG. 4C is a front view of the substrate-side plunger constituting the substrate side, FIG. 5C is a side view of the substrate-side plunger shown in FIG. 5B, and FIG. 4D is a bottom view of the substrate-side plunger shown in FIG. is there. (A) is a front view of a substrate-side plunger constituting a part of the inspection probe shown in FIG. 1 (A), and (B) is a side view of the substrate-side plunger shown in (A). (C) is a top view of the substrate side plunger shown in (A). (A), (B), and (C) are the figures which expand and show the principal part in the example shown by FIG. 8 (A), (B), and (C), respectively. . (A), (B), and (C) are the figures which expand and show the principal part of the modification of the board | substrate side plunger which comprises a part of test | inspection probe, respectively. (A), (B), and (C) are the figures which expand and show the principal part of the modification of the board | substrate side plunger which comprises a part of test | inspection probe, respectively. (A) is a front view which shows the structure of 2nd Example of the electrical contact which concerns on this invention in the state from which the coil spring part was removed, (B) is a side view of the example shown by (A). (C) is a top view in the example shown in (A). (A) is the elements on larger scale which expand and show the principal part in the example shown by FIG. 12 (B), (B) is sectional drawing shown along the XIVB-XIVB line | wire in (A). . (A) is the elements on larger scale which expand and show the principal part of the modification of the example shown by FIG. 13 (A) partially, (B) is along the XIVB-XIVB line | wire in (A). It is sectional drawing shown, (C) is an enlarged view which expands and shows a part of engagement piece shown to (A), (D) is a top view of the example shown to (C). is there. (A) is the elements on larger scale which partially expand and show the principal part of the modification in the example shown in Drawing 12 (A), (B), and (C), (B) It is sectional drawing shown along the XVB-XVB line | wire in A). (A) is the elements on larger scale which expand and show the principal part of the modification of the example shown by FIG. 15 (A) and (B) partially, (B) is XVIB-XVIB in (A). It is sectional drawing shown along a line, (C) is an enlarged view which expands and shows a part of engagement piece shown in (A), (D) is XVID-XVID in (C). It is sectional drawing shown along a line. (A) is a front view which shows the structure of 3rd Example of the electrical contact which concerns on this invention in the state from which the coil spring part was removed, (B) is a side view of the example shown by (A). It is. (A) And (B) is a figure which is provided for operation | movement description in the example shown by FIG. 17 (A), respectively. (A) is an enlarged view showing a part of the main part in the example shown in FIG. 17 (B) in an enlarged manner, and (B) is a part of the main part in the example shown in FIG. 18 (B). (C) is a cross-sectional view taken along the line XIXC-XIXC in (B). (A) is a front view which shows the structure of 4th Example of the electrical contact which concerns on this invention in the state from which the coil spring part was removed, (B) is a side view of the example shown by (A). It is. (A) And (B) is a figure which is provided for operation | movement description in the example shown by FIG. 20 (A), respectively. (A) is an enlarged view showing the main part in the example shown in FIG. 20 (B), and (B) is an enlarged view showing the main part in the example shown in FIG. 21 (B). (C) is sectional drawing shown along the XXIIC-XXIIC line in (B). (A) is a front view which shows the structure of 5th Example of the electrical contact which concerns on this invention in the state from which the coil spring part was removed, (B) is a side view of the example shown by (A). It is. (A) And (B) is a figure with which it uses for operation | movement description in the example shown by FIG. 23 (A), respectively. (A) is an enlarged view showing a main part in the example shown in FIG. 23 (A) partially enlarged, and (B) is a part of the main part in the example shown in FIG. 24 (A). (C) is sectional drawing shown along the XXVC-XXVC line in (B). (A) is a front view which shows the whole structure of 6th Example of the electric contactor which concerns on this invention, (B) and (C) are side views of the example shown by (A), respectively, It is a top view. (A) is a front view showing the overall configuration of a modification of the example shown in FIG. 26 (A), and (B) and (C) are side views of the example shown in (A), respectively. FIG. (A) is a front view which shows the whole structure of the 7th Example of the electrical contactor which concerns on this invention, (B) is a side view of the example shown by (A). (A) is a front view of a substrate side plunger constituting a part of the inspection probe shown in FIG. 28 (A), and (B) is a side view of the substrate side plunger shown in (A). .

  FIG. 3 schematically shows a configuration of an example of the electrical connection device according to the present invention.

  In FIG. 3, a plurality of IC sockets as an example of an electrical connection device are arranged on a mounting surface of a predetermined printed wiring board 18. In FIG. 3, one IC socket is representatively shown. The IC socket electrically connects a contact pad formed on the mounting surface of the printed wiring board (test board) 18 and the electrode portion DVb of the semiconductor device DV mounted as an object to be inspected. For example, the semiconductor device DV includes an integrated circuit in a BGA type package. A plurality of substantially hemispherical electrode portions DVb are formed vertically and horizontally at the bottom of the semiconductor device DV. The semiconductor device is not limited to the BGA type package, but may be an LGA type package, for example.

  The printed wiring board 18 is made of, for example, glass epoxy resin, and has an electrode group (not shown) composed of a plurality of contact pads in a substantially central portion of one surface portion in this example. This electrode group is formed in a lattice shape corresponding to the arrangement of inspection probes 16Ai (i = 1 to n, n is a positive integer) described later. In this example, four holes 18b into which a small screw BS1 described later is inserted are formed around the periphery.

  A housing 10 described later of the IC socket is provided with a through hole 10C into which the machine screw BS1 is inserted. In this embodiment, the through holes 10C are formed at four positions at each corner around the semiconductor device mounting portion 10A, corresponding to the through holes 18b of the printed wiring board 18.

  In the IC socket, a small screw BS1 is inserted into each through hole 18b and each through hole 10C of the above-described printed wiring board 18, and is fastened with four nuts Nu via a flat washer Wa and a spring washer SW. By this, it is fixed to the mounting surface of the printed wiring board 18.

  The IC socket is mainly composed of the plurality of inspection probes 16Ai described above, and the housing 10 and the lower plate 12 that accommodate the inspection probes 16Ai inside.

  As shown in FIG. 3, the housing 10 is made of an insulating material, for example, plastic, and has a recess-shaped semiconductor device mounting portion 10 </ b> A at the center in the upper portion. The semiconductor device mounting portion 10A accommodates the semiconductor device DV in a detachable manner, and positions each electrode portion DVb of the semiconductor device DV with respect to a contact portion of each inspection probe 16Ai. The semiconductor device DV is positioned with respect to the contact portion of each inspection probe 16Ai by fitting the outer peripheral portion thereof to the inner peripheral portion of the semiconductor device mounting portion 10A. A contact portion of each inspection probe 16Ai, which will be described later, protrudes from the bottom of the semiconductor device mounting portion 10A.

  An inspection probe 16Ai as a first embodiment of the electric contact according to the present invention is inserted into a plurality of through holes 10bi (i = 1 to n, n is a positive integer) in the probe housing portion 10B. The probe accommodating portion 10 </ b> B forms a lower portion of the semiconductor device mounting portion 10 </ b> A in the housing 10. One end of the through hole 10bi opens at the bottom of the semiconductor device mounting portion 10A, and the other end opens at a lower plate mounting portion 10D into which a lower plate 12 described later is fitted. The through hole 10bi accommodates the shoulder portions 26fa and 26fb of the device side plunger 26 in the inspection probe 16Ai, the flat plate portion 26ST, the pair of engaging pieces 24La and 24Lb of the substrate side plunger 24, the coil spring portion 22 and the like. The large-diameter portion 10f and the small-diameter portion 10d that is connected to the large-diameter portion 10f and through which the contact terminal portion 26B of the device-side plunger 26 passes are formed. Thereby, a stepped portion for retaining is formed at a boundary portion between the large diameter portion 10f and the small diameter portion 10d.

Furthermore, a lower plate mounting portion 10 </ b> D having a concave shape is formed at a lower end portion of the housing 10 that is directly below the semiconductor device mounting portion 10 </ b> A. In this lower plate mounting part 10D,
A plate-like lower plate 12 is screwed by a small screw BS2 and a female screw hole of the housing 10. As shown in FIG. 3, the lower plate 12 is positioned relative to the lower plate mounting portion 10D by the positioning pins 14 fixed to the housing 10 being fitted into the positioning holes 12c.

  The lower plate 12 has a plurality of through-holes 12bi (i = 1 to n, n is a positive integer) concentrically with the above-described plurality of through-holes 10bi. One opening end of the through hole 12bi opens to the through hole 10bi.

  The through-hole 12bi has a large diameter that accommodates the shoulder portions 24fa and 24fb of the substrate-side plunger 24 in each inspection probe 16Ai, the remaining portion of the coil spring portion 22, and the remaining portions of the pair of engaging pieces 24La and 24Lb of the substrate-side plunger 24. It is formed of a portion 12f and a small-diameter portion 12d that is connected to the large-diameter portion 12f and through which the contact terminal portion 24B of the substrate-side plunger 24 passes. As a result, a stepped portion for retaining is formed at the boundary between the large diameter portion 12f and the small diameter portion 12d. The diameter of the large diameter portion 12f of the through hole 12bi is set to be substantially the same as the diameter of the large diameter portion 10f of the through hole 10bi.

  As shown in FIG. 3, positioning pins 10 </ b> P that are fitted into the positioning holes 18 </ b> P of the printed wiring board 18 are provided around the lower plate mounting portion 10 </ b> D in the housing 10.

  1A, the inspection probe 16Ai includes a device-side plunger 26 as a first plunger, a substrate-side plunger 24 as a second plunger, a device-side plunger 26, and a substrate-side plunger. 24 and a coil spring portion 22 that urges 24 in a direction away from each other. The device-side plunger 26, the substrate-side plunger 24, and the coil spring portion 22 are disposed on the same axis.

  A contact portion 26BP that selectively contacts the electrode portion DVb of the semiconductor device DV is provided at the tip of the device-side plunger 26 (located at the upper end in FIG. 1A). In addition, a contact portion 24BP that selectively contacts the contact pad of the printed wiring board 18 is formed as a convex arcuate curved surface at the tip of the substrate side plunger 24 (located at the lower end in FIG. 1A). ing.

  The device-side plunger 26 and the substrate-side plunger 24 are each integrally formed by a series of pressing processes using a thin plate material made of a copper alloy as a nonmagnetic metal. Examples of the copper alloy thin plate material include phosphor bronze and beryllium copper. After the forming, the device side plunger 26 and the substrate side plunger 24 are plated with one or a plurality of metals selected from the nonmagnetic metal group or an alloy thereof.

  4A and 7A, the device-side plunger 26 has a contact terminal portion 26B having a contact portion 26BP and a flat plate shape continuous to the contact terminal portion 26B along the central axis. Part 26ST. In the example shown in FIGS. 4A and 7A, the contact portion 26BP is formed of a concave arcuate curved surface corresponding to the spherical shape of the electrode portion DVb of the semiconductor device DV. Note that the shapes of the contact portions 24BP and 26BP may be arbitrarily selected and formed in accordance with the shapes of the objects to be contacted with each other.

A pair of shoulder portions 26fa and 26fb are formed at a portion (base end side) where one end of the flat plate-like portion 26ST is continuous in the contact terminal portion 26B. Shoulders 26fa and 26fb
It is formed so as to project along the X coordinate axis of the orthogonal coordinates in FIG. In the example shown in FIG. 4A and a plurality of embodiments described later, the Y coordinate axis of the orthogonal coordinates shown in the figure is set to be parallel to the central axis L1 of the device side plunger 26. Has been.

  4A, the flat plate-like portion 26ST extending along the Y coordinate axis has a long hole 26STa having a predetermined width and length on the central axis. The central axis in the longitudinal direction of the long hole 26STa is on the same axis as the central axis L1 of the plate-like portion 26ST. Since the end portions of the flat plate portion 26ST are connected in this way, it is possible to further miniaturize since it is not necessary to provide a clearance required when an engagement piece (see FIG. 28A) described later is provided. It becomes.

  As shown in an enlarged view in FIG. 7B, the substrate side plunger 24 is in contact with a contact terminal portion 24B having a pointed contact portion 24BP at the tip (located at the lower end in FIG. 7B). It is configured to include engagement pieces 24La and 24Lb that are integrally connected to a pair of shoulder portions 24fa and 24fb of the terminal portion 24B. Shoulder portions 24fa and 24fb are formed at the base end portions of the engagement pieces 24La and 24Lb in the contact terminal portion 24B, respectively. The shoulder portions 24fa and 24fb are formed so as to project sideways along the X coordinate axis in FIG.

  The engagement pieces 24La and 24Lb of the substrate side plunger 24 extending along the Y coordinate axis in FIGS. 4A and 7B have different overall lengths. In the example shown in FIG. 4A, the full length of the engagement piece 24La is set larger than the full length of the engagement piece 24Lb.

  One ends of the engaging pieces 24La and 24Lb are formed in parallel to each other at a predetermined interval along the X coordinate axis. As shown in FIGS. 4A and 7B, the engagement piece 24La has a predetermined amount on the left side with respect to the center axis L2 that is the center line in the width direction (X coordinate axis direction) of the substrate-side plunger 24. It is biased. The engagement piece 24Lb is biased to the right by a predetermined amount with respect to the central axis L2. Thereby, a predetermined gap 24C is formed between the engagement pieces 24La and 24Lb.

  Further, as shown in FIG. 7C, one engagement piece 24La has a predetermined amount (FIG. 7 (FIG. 7) with respect to the central axis L3 that is the center line in the thickness direction (Z coordinate axis direction) of the substrate-side plunger 24. In C), the left side is biased, and the other engagement piece 24Lb is biased to a predetermined amount (right side in FIG. 7C) with respect to the central axis L3. Thereby, a predetermined gap 24D corresponding to the thickness of the flat plate-like portion 26ST along the Z coordinate axis is formed between the engagement piece 24La and the engagement piece 24Lb.

  As shown in enlarged views in FIGS. 6A, 6B, and 7C, a contact portion 24Laf is formed at the other end 24Lae of the engagement piece 24La. The contact portion 24Laf protrudes close to one inner peripheral edge 26STa1 of the long hole 26STa along the Z coordinate axis with a predetermined relatively small gap. Further, a contact portion 24Lbf is formed at the other end 24Lbe of the engagement piece 24Lb. The contact portion 24Lbf projects close to the other inner peripheral edge 26STa2 of the long hole 26STa along the Z coordinate axis with a predetermined relatively small gap.

  Accordingly, as shown in FIG. 6B, the contact portion 24Laf and the contact portion 24Lbf have end faces 24Las and 24Lbs that face each other in a direction close to each other in the long hole 26STa. Thus, by changing the length of the two engagement pieces 24La and 24Lb (also referred to as two beams) and shifting the positions of the contact portion 24Laf and the contact portion 24Lbf (also referred to as two protrusions), It becomes possible to cope with further miniaturization.

  As shown in FIGS. 9A, 9B, and 9C partially enlarged, the contact portion 24Laf and the contact portion 24Lbf in the engagement pieces 24La and 24Lb of the substrate side plunger 24 are, for example, It is formed by crushing part of the end portions 24Lae and 24Lbe of the engaging pieces 24La and 24Lb with a cold forging die in the Z coordinate axis direction in FIG. 9A.

  The formation of the contact portion 24Laf and the contact portion 24Lbf is not limited to such an example. For example, as shown in FIGS. 10 (A), (B), and (C), the substrate-side plunger 24 is formed. Each of the contact portions 34Laf and 34Lbf may be formed by pressing the end portions 34Lae and 34Lbe of the engagement pieces 34La and 34Lb with a predetermined pair of dies in the Z coordinate axis direction in FIG. 9A. . Further, for example, as shown in FIGS. 11A, 11B, and 11C, the contact portions 44Laf and 44Lbf of the board side plunger 24 are connected to the end portions 44Lae and 44Lbe of the engaging pieces 44La and 44Lb. May be formed by bending in the Z coordinate axis direction so as to be close to each other in FIG.

  The coil spring portion 22 as an urging member is made of an elastic spring material, for example, a spring stainless steel wire. As shown enlarged in FIG. 1A, one end of the coil spring portion 22 (in FIG. 1A, one end corresponds to the upper end position of the coil spring portion) is a pair of shoulders of the device side plunger 26. The other end of the coil spring portion 22 (the other end corresponds to the lower end position of the coil spring portion in FIG. 1A) is supported by a pair of shoulder portions 24fa and 24fb of the substrate side plunger 24. It is supported. As a result, the coil spring portion 22 is wound concentrically along the outer periphery of the flat plate portion 26ST of the device side plunger 26 and the engagement pieces 24La and 24Lb of the substrate side plunger 24.

  In assembling the inspection probe 16Ai, first, as shown in FIG. 2A, the flat plate portion 26ST of the device side plunger 26 and the engaging pieces 24La and 24Lb of the substrate side plunger 24 are connected to both ends of the coil spring portion 22. To face. Next, as shown in FIG. 2 (B), the flat plate portion 26ST of the device side plunger 26 is inserted from one end (upper end) of the coil spring portion 22, and the engagement pieces 24La and 24Lb of the substrate side plunger 24 are further inserted. Is inserted from the other end (lower end) of the coil spring portion 22. At that time, the pair of shoulder portions 24fa and 24fb of the substrate side plunger 24 and the pair of shoulder portions 26fa and 26fb of the device side plunger 26 are pressed against each other against the biasing force of the coil spring portion 22. As a result, the contact portions 24Laf and 24Lbf of the engagement pieces 24La and 24Lb of the substrate-side plunger 24 are temporarily elastically displaced so as to be separated from each other in the Z coordinate axis direction in FIG. After the sliding contact, it is inserted into the long hole 26STa of the flat plate portion 26ST. As a result, as shown in FIG. 2C, the contact portion 24Lbf is locked to one end of the long hole 26STa, so that the device side plunger 26 and the substrate side plunger 24 hold the coil spring portion 22 in a sandwiched state. Is done. Therefore, the assembly of the inspection probe 16Ai is completed.

  In such a configuration, as shown in FIG. 3, after each inspection probe 16Ai is mounted in each through-hole 10bi in the probe housing portion 10B of the housing 10 and in the through-hole 12bi in the lower plate 12, the IC The socket is fixed to the mounting surface of the printed wiring board 18. At that time, the contact portion 24BP of the substrate side plunger 24 is pushed into the through hole 12bi of the lower plate 12 against the urging force of the coil spring portion 22 by the contact pad of the printed wiring board 18. When the semiconductor device DV is positioned and attached to the inner peripheral portion of the semiconductor device mounting portion 10A, the contact side 26BP of the device side plunger 26 is in contact with the electrode portion DVb of the semiconductor device DV, and the device side A part of the plunger 26 is pushed into the through hole 10bi in the probe accommodating portion 10B. At that time, as shown enlarged in FIGS. 1D, 5A, and 5B, the contact portion 24Lbf is separated from one end of the long hole 26STa, and the substrate is placed at a predetermined position. Since the engagement pieces 24La and 24Lb of the side plunger 24 rotate and tilt with respect to the flat plate portion 26ST of the device side plunger 26 according to the gap in the X coordinate direction, the contact portion 24Laf and the contact portion 24Lbf are respectively shown in FIG. ), As indicated by a two-dot chain line, they are brought into contact at two different locations on the inner peripheral surface of the long hole 26STa. Therefore, the contact portion 24Laf and the contact portion 24Lbf are brought into contact with each other at two different positions on the inner peripheral surface of the long hole 26STa at a predetermined position, so that the contact resistance of the contact portion can be stabilized. Moreover, since the moving contact portion 24Laf and the contact portion 24Lbf are not in sliding contact with the inner peripheral surface of the long hole 26STa, it is possible to reduce wear of the contact portion due to sliding of the contact portion of the electric contactor. In addition, the two beam portions (engagement pieces 24La and 24Lb) having protrusions at the tips hold the engagement between the two plungers and the two beam portions (engagement pieces 24La). And 24Lb), it is possible to obtain conduction and more reliably hold and conduct. Since such holding does not depend on the clamping force, the clamping force and the contact force for obtaining conduction can be managed separately. That is, the degree of freedom of design and setting is greater, and production management becomes easier.

  FIGS. 12A and 12B show the main configuration of an inspection probe as a second embodiment of the electrical contact according to the present invention.

  12A, the inspection probe includes a device-side plunger 56 as a first plunger, a substrate-side plunger 54 as a second plunger, a device-side plunger 56, and a substrate-side plunger 54. And a coil spring portion (not shown) that urges them in a direction away from each other. Note that the configuration of the coil spring portion has the same configuration as the configuration of the coil spring portion 22 shown enlarged in FIG.

  The device-side plunger 56 has a contact portion 56BP that selectively comes into contact with the electrode portion DVb of the semiconductor device DV. The board-side plunger 54 has a contact part 54BP that selectively contacts the contact pad of the printed wiring board 18.

  The engagement pieces 24La and 24Lb of the substrate side plunger 24 in the inspection probe 16Ai shown in FIG. 1A are formed substantially parallel to each flat surface of the flat plate portion 26ST of the device side plunger 26 with a predetermined gap. On the other hand, in the second embodiment shown in FIG. 12A, the engagement pieces 54La and 54Lb of the substrate side plunger 54 are only in the vicinity of the contact portion 54Laf and the contact portion 54Lbf, and the length of the device side plunger 56 is long. The holes 56STa are inclined with a predetermined gradient in directions close to each other so as to come into contact with the peripheral edge of the hole 56STa with a predetermined pressure.

  The device-side plunger 56 and the substrate-side plunger 54 are each integrally formed by a series of press working steps to be described later, using a copper alloy thin plate material as a nonmagnetic metal. The material and the plating treatment of the device side plunger 56 and the substrate side plunger 54 are the same as the material and the plating treatment of the device side plunger 26 and the substrate side plunger 24 described above.

  12A, the device-side plunger 56 includes a contact terminal portion 56B having a contact portion 56BP at the tip (in FIG. 12A, the contact portion is located at the upper end); The contact terminal portion 56B includes a pair of shoulder portions 54fa and 54fb including a flat plate portion 56ST that is continuous along the central axis L1. The contact part 56BP is formed in an arc shape corresponding to the shape of the electrode part DVb of the semiconductor device DV.

  A pair of shoulder portions 56fa and 56fb are formed at the base end portion of the contact terminal portion 56B so as to protrude along the X coordinate axis of the orthogonal coordinates in FIG. . 12A, the flat plate portion 56ST extending along the Y coordinate axis has a long hole 26STa having a predetermined width and length on the central axis L1. The central axis in the longitudinal direction of the long hole 26STa is on the same axis as the central axis of the flat plate portion 56ST.

  As shown in an enlarged view in FIG. 12A, the substrate-side plunger 54 is connected to a contact terminal portion 54B having a pointed contact portion 54BP and a pair of shoulder portions 54fa and 54fb of the contact terminal portion 54B. It is configured including the combined pieces 54La and 54Lb. A pair of shoulder portions 54fa and 54fb are formed at the base end portions of the engagement pieces 54La and 54Lb in the contact terminal portion 54B so as to protrude sideways along the X coordinate axis in FIG. Yes.

  The engagement pieces 54La and 54Lb of the substrate side plunger 54 extending along the Y coordinate axis in FIG. 12B have different overall lengths. For example, the overall length of the engagement piece 54La is set to be larger than the overall length of the engagement piece 54Lb. One ends of the engagement pieces 54La and 54Lb are formed in parallel to each other at a predetermined interval along the X coordinate axis. As shown in FIG. 12A, the engagement piece 54La is biased to the left by a predetermined amount with respect to the central axis L2 of the substrate side plunger 54. The engaging piece 54Lb is biased to the right by a predetermined amount with respect to the central axis L2 of the substrate side plunger 54. As a result, a predetermined gap 54C is formed between the engagement pieces 54La and 54Lb. Also, as shown in FIG. 12B, a predetermined gap 54D corresponding to the thickness of the flat plate portion 56ST along the Z coordinate axis is formed between the engagement piece 54La and the engagement piece 54Lb. .

  As enlarged and shown in FIGS. 13A and 13B, a contact portion 54Laf is formed at the other end 54Lae of the engagement piece 54La. The contact portion 54Laf protrudes in close proximity to one inner peripheral edge 56STa1 of the long hole 56STa along the Z coordinate axis with a predetermined gap. Moreover, as enlarged and shown in FIGS. 13A and 13B, a contact portion 54Lbf is formed at the other end 54Lbe of the engagement piece 54Lb. The contact portion 54Lbf protrudes close to the other inner peripheral edge 56STa2 of the long hole 56STa along the Z coordinate axis with a predetermined gap. Therefore, as shown in FIG. 13B, the contact portion 54Laf and the contact portion 54Lbf protrude in opposite directions with respect to the long hole 56STa. At that time, as shown in FIGS. 13A and 13B, the contact surface 54Las at the other end 54Lae of the engagement piece 54La is out of the pair of end surfaces facing the flat plate portion 56ST of the device side plunger 56. The contact surface 54Lbs at the other end 54Lbe of the engagement piece 54Lb contacts the other end surface of the pair of end surfaces facing the flat plate portion 56ST of the device side plunger 56. The contact surface 54Las and the contact surface 54Lbs are formed by a predetermined length at the other ends 54Lae and 54Lbe along the longitudinal direction of the engagement pieces 54La and 54Lb.

  In such a configuration, after the inspection probe is mounted in the plurality of through holes 10bi in the probe housing portion 10B of the housing 10 and the through holes 12bi of the lower plate 12, the IC socket is mounted on the printed wiring board 18. When the semiconductor device DV described above is positioned and mounted on the inner peripheral portion of the semiconductor device mounting portion 10A, the contact portion 56BP of the device side plunger 56 is the electrode portion DVb of the semiconductor device DV. A part of the device-side plunger 56 is pushed into the through hole 10bi in the probe housing portion 10B. At that time, the contact portion 54Lbf of the substrate side plunger 54 is separated from one end of the elongated hole 56STa, and the engagement pieces 54La and 54Lb of the substrate side plunger 54 are in a predetermined position with respect to the flat plate portion 56ST of the device side plunger 56. The contact portion 54Laf and the contact portion 54Lbf are brought into contact with each other at two different locations on the inner peripheral edges 56STa1 and 56STa2 of the long hole 56STa because they rotate and tilt according to the gap in the X coordinate direction. At that time, in addition, a pair of contact surfaces 54Las at the other end 54Lae of the engagement piece 54La are opposed to the flat plate-like portion 56ST of the device side plunger 56 in the direction indicated by the arrows in FIGS. One end face of the end faces is brought into contact with a predetermined pressure, and the contact face 54Lbs at the other end 54Lbe of the engagement piece 54Lb is the other of the pair of end faces facing the flat plate portion 56ST of the device side plunger 56. It abuts on the end face with a predetermined pressure.

  Therefore, the contact portion 54Laf and the contact portion 54Lbf are always brought into contact with each other at two different locations on the inner peripheral edges 56STa1 and 56STa2 of the long hole 56STa at a predetermined position, and the flat plate-like portion 56ST of the device side plunger 56 is The holding surface 54Las and the contact surface 54Lbs are held in the direction indicated by the arrow in FIG.

  In the example shown in FIG. 13A, the contact surface 54Las and the contact surface 54Lbs have contact portions 54Laf and 54Lbf at the other ends 54Lae and 54Lbe along the longitudinal direction of the engagement pieces 54La and 54Lb. However, the present invention is not limited to such an example. For example, as shown in FIG. 14A, the engagement pieces 55La and 55Lb The contact surfaces 55Las1 and 55Lbs1 may be formed only at the root positions of the contact portion 55Laf and the contact portion 55Lbf with a smaller area than the contact surface 54Las and the contact surface 54Lbs.

  14A and 14B, the same components as those in the example shown in FIG. 12A are denoted by the same reference numerals, and redundant description thereof is omitted.

  As shown in enlarged views in FIGS. 14A and 14B, the substrate-side plunger 55 includes a contact terminal portion having a pointed contact portion and engagement pieces 55La and 55Lb connected to the contact terminal portion. It is configured to include. A pair of shoulder portions are formed so as to protrude toward the side at a portion where one ends of the engagement pieces 55La and 55Lb in the contact terminal portion are continuous.

  The engagement pieces 55La and 55Lb of the substrate side plunger 55 extending along the Y coordinate axis in FIG. 14A have different overall lengths. For example, the overall length of the engagement piece 55La is set to be larger than the overall length of the engagement piece 55Lb. One ends of the engagement pieces 55La and 55Lb are formed in parallel with each other at a predetermined interval along the X coordinate axis. The engagement piece 55La is biased to the left by a predetermined amount with respect to the central axis L2 (see FIG. 14B) of the substrate side plunger 55, and the engagement piece 55Lb is the central axis L2 (see FIG. 14 (B)) is biased to the right by a predetermined amount. As a result, a predetermined gap is formed between the engagement pieces 55La and 55Lb.

  As shown in enlarged views in FIGS. 14A and 14B, a contact portion 55Laf is formed at the other end 55Lae of the engagement piece 55La. The contact portion 55Laf protrudes close to the inner peripheral edge of one of the long holes 56STa with a predetermined gap along the Z coordinate axis. Further, a contact portion 55Lbf is formed at the other end 55Lbe of the engagement piece 55Lb. The contact portion 55Lbf protrudes in close proximity to the other inner peripheral edge of the long hole 56STa along the Z coordinate axis with a predetermined gap. Therefore, the contact portion 55Laf and the contact portion 55Lbf protrude in opposite directions to the long hole 56STa. Yes. At that time, as shown in FIGS. 14A and 14B, the contact surface 55Las1 at the other end 55Lae of the engagement piece 55La is out of the pair of end surfaces facing the flat plate portion 56ST of the device-side plunger 56. The contact surface 55Lbs1 at the other end 55Lbe of the engagement piece 55Lb contacts the other end surface of the pair of end surfaces facing the flat plate portion 56ST of the device side plunger 56.

  Since the contact surface 55Las1 and the contact surface 55Lbs1 described above have the same structure, the contact surface 55Lbs1 will be described, and the description of the contact surface 55Las1 will be omitted.

  As shown in a partially enlarged view in FIG. 14C, the contact surface 55Lbs1 is formed only on a plane parallel to the Y coordinate axis extending at the base of the contact portion 55Lbf at the other end 55Lbe.

  As shown in FIGS. 14C and 14D, a stepped portion 55Lbs2 is formed in the engaging piece 55Lb in parallel to the Y coordinate axis at a position separated from the contact surface 55Lbs1. Accordingly, the contact area of the contact surface 55Lbs1 with respect to the end surface of the flat plate portion 56ST is smaller than the contact area of the contact surface 54Las and the contact surface 54Lbs with respect to the end surface of the flat plate portion 56ST. It is possible to reduce the wear of the contact part due to the sliding of the part.

  FIG. 15 (A) shows a modification of the example shown in FIGS. 12 (A), (B), and (C). 15A and 15B, the same components as those in the example shown in FIGS. 12A, 12B, and 12C are denoted by the same reference numerals, The duplicate description is omitted.

  As shown in FIG. 15 (A), the engagement pieces 57La and 57Lb of the substrate side plunger 57 have their contact portions 57Laf and 57Lbf respectively connected to the device by the elastic restoring force of the engagement pieces 57La and 57Lb themselves. The side plunger 56 is always brought into contact with a facing surface of the inner circumferential surface of the long hole 56STa with a predetermined pressure. The contact portion 57Laf and the contact portion 57Lbf are separated from each other in the X-coordinate axis direction in FIG. That is, the contact part 57Laf and the contact part 57Lbf are always brought into contact with the inner peripheral surface of the long hole 56STa with the pressure in the direction indicated by the arrow in FIGS. 15A and 15B, respectively. At that time, a predetermined gap CL is formed between the flat surface 56STF at the periphery of the long hole 56STa in the flat plate-like portion 56ST of the device side plunger 56 and the engagement pieces 57La and 57Lb.

  Further, as a modification of the example shown in FIGS. 15A and 15B, for example, as shown in FIG. 16A, the contact portion of the contact portion 59 Laf has a projecting portion having an arc-shaped cross section. The contact portion 59Lbf may be formed by a protrusion 59Lbp having an arcuate cross section.

  At that time, the protrusion 59Lap of the contact portion 59Laf and the protrusion 59Lbp of the contact portion 59Lbf are press-fitted into the long hole 56STa so as to contact the inner peripheral surface of the long hole 56STa. As a result, the contact resistance of the contact portion of the electric contact can be stabilized, and the wear of the contact portion accompanying the sliding of the contact portion of the electric contact can be reduced.

  16 (A) and 16 (B), the same components as those in the example shown in FIGS. 15 (A) and 15 (B) are denoted by the same reference numerals, and redundant description thereof is omitted. .

  Since the protrusion 59Lap of the contact part 59Laf and the protrusion 59Lbp of the contact part 59Lbf have the same structure, only the protrusion 59Lbp will be described, and the description of the protrusion 59Lap will be omitted.

  As shown in FIG. 16A, the substrate-side plunger 59 includes a contact terminal portion (not shown) having a pointed contact portion and engagement pieces 59La and 59Lb connected to the contact terminal portion. Has been. In the contact terminal portion, a portion where one ends of the engagement pieces 59La and 59Lb are continuous is formed with a pair of shoulder portions projecting sideways, although illustration is omitted.

  The engagement pieces 59La and 59Lb of the substrate side plunger 59 have different overall lengths. For example, the overall length of the engagement piece 59La is set to be larger than the overall length of the engagement piece 59Lb. One ends of the engagement pieces 59La and 59Lb are formed in parallel with each other at a predetermined interval along the X coordinate axis in the orthogonal coordinates shown in FIG. The engagement piece 59La is biased to the left by a predetermined amount with respect to the central axis L2 of the substrate side plunger 59 in FIG. 16B, and the engagement piece 59Lb is a predetermined amount with respect to the central axis L2 of the substrate side plunger 59. , Biased to the right. The central axis L1 of the flat plate portion 56ST and the central axis L2 of the substrate side plunger 59 are on a common straight line. As a result, a predetermined gap is formed between the engagement pieces 59La and 59Lb.

  As shown partially enlarged in FIGS. 16C and 16D, the other end 59Lbe of the engagement piece 59Lb is formed with a protrusion 59Lbp of the contact portion 55Lbf. The protrusion 59Lbp is inserted into the long hole 56STa and protrudes toward the other inner peripheral edge of the long hole 56STa facing the protrusion 59Lap. Therefore, the contact portion 59Laf and the contact portion 59Lbf protrude in the opposite directions to the inside of the long hole 56STa.

  FIGS. 17A and 17B each show the main configuration of an inspection probe as a third embodiment of the electric contact according to the present invention.

  As shown in an enlarged view in FIG. 17A, the inspection probe includes a device-side plunger 56 as a first plunger, a substrate-side plunger 64 as a second plunger, a device-side plunger 56 and a substrate-side plunger 64. And a coil spring portion (not shown) that urges them in a direction away from each other. The device side plunger 56 has a contact portion that selectively contacts the electrode portion DVb of the semiconductor device DV. The board-side plunger 64 has a contact portion that selectively contacts the contact pad of the printed wiring board.

  Note that the configuration of the coil spring portion has the same configuration as the configuration of the coil spring portion 22 shown enlarged in FIG. In FIGS. 17A and 17B, the same components as those in the examples shown in FIGS. 12A and 12B are denoted by the same reference numerals, and redundant description thereof is omitted. .

  The material and surface treatment of the substrate side plunger 64 are the same as the material and surface treatment of the device side plunger 56.

  As shown in an enlarged view in FIG. 17A, the substrate-side plunger 64 includes a contact terminal portion 64B having a pointed contact portion 64BP, and engagement pieces 64La and 64Lb connected to the contact terminal portion 64B. It consists of A pair of shoulder portions 64fa and 64fb are formed so as to protrude sideways along the X coordinate axis in FIG. 17A at a portion where one ends of the engagement pieces 64La and 64Lb are continuous in the contact terminal portion 64B. ing.

  The engagement pieces 64La and 64Lb of the substrate-side plunger 64 extending along the Y coordinate axis in FIG. 17B have different overall lengths. For example, the total length of the engagement piece 64La is set larger than the total length of the engagement piece 64Lb. One ends of the engagement pieces 64La and 64Lb are formed in parallel with each other at a predetermined interval along the X coordinate axis in FIG. The engagement piece 64La is biased to the left by a predetermined amount with respect to the center axis L2 of the substrate side plunger 64, and the engagement piece 64Lb is biased to the right by a predetermined amount with respect to the center axis L2 of the substrate side plunger 64. Yes. As a result, a predetermined gap 64C is formed between the engagement pieces 64La and 64Lb.

  The other end 64Lae of the engagement piece 64La is formed with a contact portion 64Laf that protrudes close to the inner peripheral edge of one of the elongated holes 56STa with a predetermined gap along the Z coordinate axis in FIG. The other end 64Lbe of the engagement piece 64Lb is formed with a contact portion 64Lbf that protrudes close to the other inner peripheral edge of the long hole 56STa with a predetermined gap along the Z coordinate axis in FIG. . Therefore, the contact portion 64Laf and the contact portion 64Lbf protrude in the opposite directions to the inside of the long hole 56STa. Further, as shown in FIG. 17B, a predetermined gap 64D corresponding to the thickness of the flat plate portion 56ST along the Z coordinate axis is formed along the central axis L3 of the contact terminal portion 64B with the engagement piece 64La. It is formed between the engagement pieces 64Lb.

  Between the other end 64Lae and one end of the engagement piece 64La, there is formed a convex portion 64Lap that protrudes by a predetermined height along the Z coordinate axis toward the gap 64D. In addition, a protrusion 64Lbp that protrudes by a predetermined height along the Z coordinate axis toward the gap 64D is formed between the other end 64Lbe and the one end of the engagement piece 64Lb. The mutual distance Da (see FIG. 19A) between the end surface of the convex portion 64Lap and the end surface of the convex portion 64Lbp is set slightly smaller than the thickness of the flat plate portion 56ST. Thereby, as shown in FIGS. 18B and 19B, when the device side plunger 56 and the substrate side plunger 64 are brought close to each other, the end of the flat plate portion 56ST is the end surface of the convex portion 64Lap. And the constricted part formed between the end face of the convex part 64Lbp.

  In such a configuration, when the IC socket on which the above-described inspection probe is mounted is fixed to the mounting surface of the printed wiring board 18, the semiconductor device DV is positioned and mounted on the inner peripheral portion of the semiconductor device mounting portion 10A. When the contact portion 56BP of the device-side plunger 56 is in contact with the electrode portion DVb of the semiconductor device DV, a part of the device-side plunger 56 is pushed into the through hole 10bi in the probe housing portion 10B. At that time, as shown in FIGS. 18A and 18B, the contact portion 64Lbf is separated from one end of the long hole 56STa, and the engagement pieces 64La and 64Lb of the board-side plunger 64 are protruded at a predetermined position. Between the end surface of the portion 64Lap and the end surface of the convex portion 64Lbp, the flat plate-like portion 56ST of the device side plunger 56 is pushed. At that time, the contact portion 64Laf and the contact portion 64Lbf are rotated and inclined according to a predetermined gap, and are brought into contact with each other at two different locations on the inner peripheral surface of the long hole 26STa.

  Accordingly, as shown in enlarged views in FIGS. 19B and 19C, the end surface of the convex portion 64Lap and the end surface of the convex portion 64Lbp are respectively different one end surfaces at the opposite end surfaces of the flat plate portion 56ST. The contact portion 64Laf and the contact portion 64Lbf are rotated and inclined according to a predetermined gap and are brought into contact at two different locations on the inner peripheral surface of the long hole 26STa. Therefore, the contact resistance of the contact portion can be stabilized.

  FIGS. 20A and 20B respectively show the main configuration of an inspection probe as a fourth embodiment of the electric contact according to the present invention.

  The inspection probe includes a device-side plunger 66 as a first plunger, a substrate-side plunger 24 as a second plunger, and a coil spring portion that biases the device-side plunger 66 and the substrate-side plunger 24 in a direction away from each other ( (Not shown). The device-side plunger 66 has a contact portion that selectively contacts the electrode portion DVb of the semiconductor device DV. The substrate-side plunger 24 has a contact portion that selectively contacts the contact pad of the printed wiring board.

  Note that the configuration of the coil spring portion has the same configuration as the configuration of the coil spring portion 22 shown enlarged in FIG. 20A and 20B, the same components as those in the example shown in FIGS. 1A and 1B are denoted by the same reference numerals, and redundant description thereof is omitted. .

  The material and surface treatment of the device side plunger 66 are the same as the material and surface treatment of the substrate side plunger 24 described above.

  20A and 20B, the device side plunger 66 has a contact terminal portion having a contact portion 66BP formed in an arc shape corresponding to the shape of the electrode portion DVb of the semiconductor device DV. 66B and a flat plate-like portion 66ST connected to the contact terminal portion 66B along the central axis L1.

  A pair of shoulder portions 66fa and 66fb protrudes along the X coordinate axis of the orthogonal coordinates in FIG. 20A, that is, to the side, at a portion where one end of the flat plate portion 66ST is continuous in the contact terminal portion 66B. It is formed as follows. The flat plate-like portion 66ST extending along the Y coordinate axis has a long hole 66STa having a predetermined width and length on the central axis L1. The central axis in the longitudinal direction of the long hole 66STa is on the same axis as the central axis L1 of the plate-like portion 66ST. A convex portion 66S1 having a predetermined height and a convex portion 66S2 are formed at predetermined positions on the periphery of the long hole 66STa of the flat plate portion 66ST. The convex portion 66S1 is formed, for example, in a middle portion of the left peripheral edge of the long hole 66STa in FIG. 20 (A) so as to protrude a predetermined height along the Z coordinate axis perpendicular to the paper surface. In addition, the convex portion 66S2 is formed, for example, in a middle portion of the right peripheral edge of the long hole 66STa in FIG. 20A so as to bulge to a predetermined height along the Z coordinate axis. Accordingly, as shown in a partially enlarged view in FIG. 22A, the convex portion 66S1 protrudes in a direction facing the engagement piece 24La of the substrate side plunger 24, and the convex portion 66S2 is formed with the engagement piece 24Lb. Raised in the opposite direction. Thus, when the device side plunger 66 and the substrate side plunger 24 are close to each other as shown in an enlarged view in FIG. 21 (B), they are shown in a partially enlarged view in FIG. 22 (B). In addition, the other end 24Lae of the engagement piece 24La of the board-side plunger 24 slides on the convex portion 66S1, and the other end 24Lbe of the engagement piece 24Lb slides on the convex portion 66S2.

  In such a configuration, when the IC socket on which the above-described inspection probe is mounted is fixed to the mounting surface of the printed wiring board 18, the semiconductor device DV is positioned and mounted on the inner peripheral portion of the semiconductor device mounting portion 10A. As shown in FIGS. 21A and 21B, the contact portion 24Lbf is separated from one end of the long hole 66STa, and the engagement pieces 24La and 24Lb of the substrate-side plunger 24 are placed at a predetermined position. The ends 24Lae and 24Lbe are brought into sliding contact with the convex portions 66S1 and 66S2 of the flat plate-like portion 66ST, respectively. At that time, the contact portion 24Laf of the engagement piece 24La and the 24Lbf of the engagement piece 24Lb are rotated and inclined according to a predetermined gap, and are brought into contact with each other at two different locations on the inner peripheral surface of the long hole 66STa.

  Accordingly, as shown in enlarged views in FIGS. 22B and 22C, the other end 24Lae of the engagement piece 24La and the other end 24Lbe of the engagement piece 24Lb are respectively protruded from the flat plate portion 56ST. The contact portion 24Laf and the contact portion 24Lbf are rotated and inclined according to a predetermined gap, and are brought into contact at two different locations on the inner peripheral surface of the long hole 66STa. It is done. Therefore, the contact resistance of the contact portion can be stabilized.

  By providing protrusions as described above partially on the substrate-side plunger or device-side plunger, a clearance is provided in the normal state to improve slidability. It is also possible to obtain electrical continuity. This not only ensures conduction, but also reduces wear and frictional resistance during sliding, provides a stable contact load, and stabilizes resistance when repeatedly used.

  FIGS. 23A and 23B each show the main configuration of an inspection probe as a fifth embodiment of the electric contact according to the present invention.

  As shown in FIG. 23A in an enlarged manner, the inspection probe includes a device-side plunger 76 as a first plunger, a substrate-side plunger 24 as a second plunger, a device-side plunger 76 and a substrate-side plunger 24. And a coil spring portion (not shown) that urges them in a direction away from each other. As will be described later, the device-side plunger 76 has a contact portion 76BP that selectively contacts the electrode portion DVb of the semiconductor device DV. Moreover, the board | substrate side plunger 24 has the contact part 24BP which contact | abuts selectively to the contact pad of a printed wiring board.

  Note that the configuration of the coil spring portion has the same configuration as the configuration of the coil spring portion 22 shown enlarged in FIG. 23A and 23B, the same components as those in the example shown in FIGS. 1A and 1B are denoted by the same reference numerals, and redundant description thereof is omitted. .

  The material and surface treatment of the device side plunger 76 are the same as the material and surface treatment of the substrate side plunger 24.

  23A and 23B, the device-side plunger 76 has a contact terminal portion having a contact portion 76BP formed in an arc shape corresponding to the shape of the electrode portion DVb of the semiconductor device DV. 76B and a flat plate-like portion 76ST connected to the contact terminal portion 76B along the central axis L1.

  A pair of shoulder portions 76fa and 76fb extend along the X coordinate axis of the orthogonal coordinates in FIG. 23A, that is, to the side, at a portion where one end of the flat plate portion 76ST is continuous in the contact terminal portion 76B. It is formed as follows. The flat plate-like portion 76ST extending along the Y coordinate axis has a long hole 76STa1 having a predetermined width and length formed on the central axis L1, and a width and length wider than the width and length of the long hole 76STa1. A long hole 76STa2 communicating with the opening end of the long hole 76STa1. The central axes in the longitudinal direction of the long holes 76STa1 and 76STa2 are on the same axis as the central axis L1 of the plate-like portion 76ST.

  Step portions 76STE1 and 76STE2 are formed at the outermost end of the inner peripheral surface forming the opening end of the long hole 76STa1 of the flat plate portion 76ST at a portion continuous with the peripheral edge of the long hole 76STa2. In FIG. 23A, the stepped portion 76STE1 is formed on the left periphery of the long hole 76STa2, and the stepped portion 76STE2 is formed on the right periphery of the long hole 76STa2. The position of the stepped portion 76STE1 is closer to the closed end of the long hole 76STa1 than the position of the stepped portion 76STE2. Accordingly, as shown in FIG. 24A in an enlarged manner, when the device side plunger 76 and the substrate side plunger 24 are brought close to each other, as shown in FIG. 25C in a partially enlarged manner. In addition, the contact portion 24Laf of the other end 24Lae of the engagement piece 24La of the board side plunger 24 passes through the stepped portion 76STE1 and is forcibly pushed into the opening end of the long hole 66STa1, and the contact of the other end 24Lbe of the engagement piece 24Lb. The portion 24Lbf passes through the stepped portion 76STE2 and is forced into the open end of the long hole 66STa1. Thereby, the other end 24Lae of the engagement piece 24La and the other end 24Lbe of the engagement piece 24Lb are urged in a direction approaching each other.

  In such a configuration, when the IC socket on which the above-described inspection probe is mounted is fixed to the mounting surface of the printed wiring board 18, the semiconductor device DV is positioned and mounted on the inner peripheral portion of the semiconductor device mounting portion 10A. When the contact portion 76BP of the device side plunger 76 is in contact with the electrode portion DVb of the semiconductor device DV, a part of the device side plunger 76 is pushed into the through hole 10bi in the probe housing portion 10B. At that time, as shown in FIGS. 24A and 24B, the contact portion 24Lbf is separated from one end of the long hole 76STa2, and the other end 24Lae of the engagement piece 24La of the substrate side plunger 24 at a predetermined position. As shown in FIGS. 25B and 25C, the contact portion 24Lf and the contact portion 24Lbf of the other end 24Lbe of the engagement piece 24Lb pass through the step portions 76STE1 and 76STE2, respectively. It escapes from the hole 76STa2 and is pushed into the long hole 76STa1. At that time, the contact portion 24Laf of the engagement piece 24La and the contact portion 24Lbf of the engagement piece 24Lb are brought into contact with each other at two different locations on the inner peripheral surface of the long hole 76STa1. Therefore, the contact resistance of the contact portion can be stabilized.

  FIGS. 26A and 26B respectively show the main configuration of an inspection probe as a sixth embodiment of the electric contact according to the present invention.

  In the example shown in FIG. 1 (A), the coil spring portion 22 of the inspection probe is wound at an equal interval without having a tightly wound portion. In the example shown in (B) and (B), the coil spring portion 32 has a tightly wound portion 32M as a guide portion for the engagement piece. 26 (A), (B), and (C), the same components as those in the example shown in FIGS. 1 (A) and (B) are denoted by the same reference numerals, The duplicate description is omitted.

  As shown in enlarged view in FIG. 26A, the inspection probe includes a device-side plunger 26 as a first plunger, a substrate-side plunger 24 as a second plunger, a device-side plunger 26 and a substrate-side plunger 24. And a coil spring portion 32 that urges them in directions away from each other.

  The coil spring portion 32 as the biasing member is made of a spring material having elasticity, for example, a stainless steel wire for a spring. 26A and 26B, the end turn 32E2 at one end of the coil spring portion 32 is supported by a pair of shoulder portions 26fa and 26fb of the device side plunger 26, and the coil spring portion 32 is shown. The end winding 32E1 at the other end is supported by a pair of shoulder portions 24fa and 24fb of the substrate side plunger 24. At an intermediate position between the end turn 32E1 and the end turn 32E2, a tightly wound portion 32M is formed as a guide portion for the engagement piece. Accordingly, the coil spring portion 32 is wound around the flat plate portion 26ST of the device side plunger 26 and the engagement pieces 24La and 24Lb of the substrate side plunger 24.

  In the example shown in FIGS. 26A and 26B described above, the device-side plunger 26 has a thin plate-like contact portion 26BP formed in an arc shape corresponding to the shape of the electrode portion DVb of the semiconductor device DV. The terminal portion 26B and the flat plate portion 26ST connected to the contact terminal portion 26B along the central axis are configured, but the present invention is not limited to such an example. For example, FIGS. 27 (A) and (B) As shown in FIG. 4, the device-side plunger 26 ′ has a contact terminal portion 26′B having a cylindrical contact portion 26′BP corresponding to the shape of the electrode portion DVb of the semiconductor device DV, and a contact terminal portion 26′B. You may comprise from flat part 26'ST which continues along a central axis. 27 (A), (B), and (C), the same reference numerals are used for the same components as those in the example shown in FIGS. 26 (A), (B), and (C). The duplicate explanation is omitted.

  The contact portion 26'BP has four pointed contact portions 26'BN equally on a common circumference. The contact portion 26'BP is bent into a cylindrical shape by pressing, and then abutted on the abutting portion 26'We.

  As shown in FIG. 27 (A), a pair of shoulder portions 26'fa and 26'fb are directed laterally at a portion where one end of the flat plate portion 26'ST in the contact terminal portion 26'B is continuous. It is formed to overhang.

  The flat plate portion 26'ST has a long hole 26'STa having a predetermined width and length on the central axis. The central axis in the longitudinal direction of the long hole 26'STa is on the same axis as the central axis of the flat plate portion 26'ST.

  FIGS. 28A and 28B each show the main configuration of an inspection probe as a seventh embodiment of the electric contact according to the present invention.

  As shown in an enlarged view in FIG. 28A, the inspection probe includes a device-side plunger 76 as a first plunger, a substrate-side plunger 74 as a second plunger, a device-side plunger 76, and a substrate-side plunger 74. And a coil spring portion (not shown) that urges them in a direction away from each other. As will be described later, the device-side plunger 76 has a contact portion 76BP that selectively contacts the electrode portion DVb of the semiconductor device DV. The board-side plunger 74 has a contact part 74BP that selectively contacts the contact pad of the printed wiring board 18. Note that the configuration of the coil spring portion has the same configuration as the configuration of the coil spring portion 22 shown enlarged in FIG.

  The material and surface treatment of the device side plunger 76 and the substrate side plunger 74 are the same as the material and surface treatment of the device side plunger 24 described above, respectively.

  As shown in an enlarged view in FIG. 28 (A), the device-side plunger 76 has a contact terminal portion 76B having a contact portion 76BP formed in an arc shape corresponding to the shape of the electrode portion DVb of the semiconductor device DV. Engagement pieces 76ST1 and 76ST2 connected to the terminal portion 76B along the central axis are configured.

  A pair of shoulder portions 76fa and 76fb are arranged along the X coordinate axis of the orthogonal coordinates in FIG. It is formed to overhang.

  The first engaging pieces 76ST1 and 76ST2 extending at the same length in parallel with each other along the Y coordinate axis are formed symmetrically with the central axis L1 as the symmetry axis. Thereby, a gap 76C is formed between the first engagement pieces 76ST1 and 76ST2. Locking portions 76STa and 76STb are formed at the other ends of the first engagement pieces 76ST1 and 76ST2, respectively.

  As shown in an enlarged view in FIG. 28A, the substrate-side plunger 74 includes a contact terminal portion 74B having a pointed contact portion 74BP, and second engagement pieces 74La and 74Lb connected to the contact terminal portion 74B. It is comprised including. A pair of shoulder portions 74fa and 74fb protrudes laterally along the X-coordinate axis in FIG. 28A at a portion where one ends of the second engagement pieces 74La and 74Lb are continuous in the contact terminal portion 74B. Is formed.

  The second engagement pieces 74La and 74Lb of the substrate-side plunger 74 extending along the Y coordinate axis in FIG. 28A have the same overall length. As shown in FIG. 28A, one ends of the second engagement pieces 74La and 74Lb are formed in parallel with each other at a predetermined interval along the X coordinate axis. The second engagement piece 74Lb is biased to the left by a predetermined amount with respect to the central axis L2 of the substrate side plunger 74, and the second engagement piece 74La is a predetermined amount with respect to the central axis L2 of the substrate side plunger 24. , Biased to the right. Accordingly, a predetermined gap 74C is formed between the second engagement pieces 74La and 74Lb.

  As shown in enlarged views in FIGS. 29A and 29B, the other end 74Lae of the second engagement piece 74La is formed on the inner peripheral edge of the first engagement piece 76ST1 along the Z coordinate axis. A contact portion 74Laf that protrudes in close proximity with a predetermined gap is formed. Further, the other end 74Lbe of the second engagement piece 24Lb is formed with a contact portion 74Lbf that protrudes close to the inner peripheral edge of the first engagement piece 76ST2 with a predetermined gap along the Z coordinate axis. Therefore, as shown in FIG. 28B, the contact portion 74Laf and the contact portion 74Lbf protrude in opposite directions with respect to the first engagement pieces 76ST1 and 76ST2, respectively. As shown in FIG. 29B, a predetermined gap 74D along the Z coordinate axis is formed between the second engagement piece 74La and the engagement piece 74Lb. The gap 74D is smaller than the gap 74C, and is set slightly larger than the thickness of the first engagement piece 76ST1 and the first engagement piece 76ST2.

  In such a configuration, when the IC socket on which the above-described inspection probe is mounted is fixed to the mounting surface of the printed wiring board 18, the semiconductor device DV is positioned and mounted on the inner peripheral portion of the semiconductor device mounting portion 10A. The contact portion 74Laf of the second engagement piece 74La and the contact portion 74Lbf of the second engagement piece 74Lb are respectively connected to the locking portion 76STb and the first engagement of the first engagement piece 76ST1. The first engagement piece 76ST1 and the first engagement piece 76ST1 are separated from the locking portion 76STa of the piece 76ST2 and at a predetermined position according to the gap in the X coordinate direction between the contact portion and the first engagement piece. Therefore, the contact portion 74Laf and the contact portion 74Lbf are respectively formed on the inner peripheral surfaces of the first engagement piece 76ST1 and the first engagement piece 76ST2. That is brought into contact with two different points. Therefore, the contact resistance of the contact portion can be stabilized. Since the moving contact portion 74Laf and the contact portion 74Lbf are not slidably contacted with the inner peripheral surfaces of the first engagement piece 76ST1 and the first engagement piece 76ST2, the contact portion 74 Wear can be reduced, and stable operation and contact life can be extended. As a result, it is possible to provide an easily assembled spring probe with high contact resistance stability and high spring design flexibility at low cost.

  In the above example, an example of the electrical contact according to the present invention is applied to the IC socket. However, it is not always necessary to do so. For example, a board-to-board connector, a probe as an electrical connection device Of course, it may be applied to other connectors such as a card connector.

In each of the embodiments according to the present invention described above, the first plunger (device-side plunger) is in contact with the electrode portion of the object to be inspected, and the second plunger (substrate-side plunger) is in contact with the electrode portion of the wiring board. Illustrated. However, the first plunger may be in contact with the electrode portion of the wiring board, and the second plunger may be in contact with the electrode portion of the object to be inspected.
Such modifications are also included within the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Housing 16Ai Inspection probe 18 Printed wiring board 22, 32 Coil spring part 24, 54, 64, 74 Board | substrate side plunger 26, 26 ', 56, 66, 76 Device side plunger DV Semiconductor device

Claims (10)

A first plunger including a contact terminal portion having a contact portion that contacts either one of the electrode portion of the object to be inspected or the electrode portion of the wiring board, and an opening portion that penetrates a flat plate portion connected to the contact terminal portion. When,
A contact terminal portion having a fixed contact portion that contacts the electrode portion of the wiring board or the electrode portion of the inspection object that faces the electrode portion of the inspection object that contacts the contact portion of the first plunger or the electrode portion of the wiring board; Contact points arranged in close proximity with a predetermined gap to the inner peripheral edge forming the opening of the first plunger are connected to the contact terminal part so as to face each other through the opening of the first plunger. A second plunger having a pair of engaging pieces;
A spring portion disposed between the end portion of the contact terminal portion of the first plunger and the contact terminal portion of the second plunger, and biasing the first plunger and the second plunger in a direction away from each other. ,
When the first plunger and the second plunger are brought close to each other against the biasing force of the spring portion, a contact portion of at least one of the engagement pieces of the pair of engagement pieces of the second plunger is An electrical contact that contacts a part of the opening of the first plunger.   The electrical contact according to claim 1, wherein the total length of the pair of engaging pieces of the second plunger is different from each other.   The contact portion of the engagement piece of the second plunger is integrally formed by pressing at an end of the engagement piece, and protrudes into the opening of the first plunger. Electrical contacts.   The pair of engaging pieces are formed so that the contact portions of the pair of engaging pieces of the second plunger are close to each other through the opening of the first plunger. Electric contact.   The pair of engaging pieces are formed so that the contact portions of the pair of engaging pieces of the second plunger are spaced apart from each other through the opening of the first plunger. Electric contact.   2. The electric contact according to claim 1, wherein the contact portions of the pair of engaging pieces of the second plunger have protrusions protruding toward an inner peripheral edge forming the opening of the first plunger.   The pair of engaging pieces of the second plunger have a narrowed portion narrower than the thickness of the flat plate-like portion of the first plunger between the contact portion and the end of the contact terminal portion of the second plunger. The electrical contact according to claim 1, wherein:   In the flat plate portion of the first plunger inserted between the pair of engaging pieces of the second plunger, the first plunger and the second plunger are brought close to each other against the biasing force of the spring portion. 2. The electrical contact according to claim 1, further comprising: a convex portion with which each contact portion of the pair of engagement pieces of the second plunger comes into contact. A first plunger comprising a contact terminal portion having a contact portion that contacts either one of the electrode portion of the object to be inspected or the electrode portion of the wiring board, and a pair of first engagement pieces connected to the contact terminal portion. When,
A contact terminal portion having a fixed contact portion that contacts the electrode portion of the wiring board or the electrode portion of the inspection object that faces the electrode portion of the inspection object that contacts the contact portion of the first plunger or the electrode portion of the wiring board; A contact portion that is connected to the contact terminal portion and is arranged close to the inner peripheral edge of the pair of first engagement pieces of the first plunger with a predetermined gap is provided as a pair of first engagement of the first plunger. A second plunger having a pair of second engaging pieces each having a pair so as to face each other through the pieces;
A spring portion disposed between the end portion of the contact terminal portion of the first plunger and the contact terminal portion of the second plunger, and biasing the first plunger and the second plunger in a direction away from each other. ,
When the first plunger and the second plunger are brought close to each other against the urging force of the spring portion, at least one of the second engagement pieces of the pair of second engagement pieces in the second plunger. An electrical contact that abuts against a part of a piece. A plurality of electrical contacts according to claim 1 or claim 9;
A probe housing for housing the electrical contact;
A semiconductor device mounting portion that detachably accommodates a semiconductor device having a plurality of electrode portions with which the contact portion of the first plunger of each electrical contact contacts, and is electrically connected to the electrical contact A housing disposed on the wiring board;
An electrical connection device comprising:

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