JP2018069570A - 3D modeling apparatus, mounting member, and manufacturing method of 3D model - Google Patents

Abstract

[PROBLEMS] To easily achieve a mounting member having a mounting surface layer having two or more properties and functions that are difficult to achieve with a single material, and to solve various problems in a three-dimensional modeling apparatus. And In a three-dimensional modeling apparatus that models a three-dimensional structure with a modeling material placed on a mounting surface of a mounting member, the mounting member is a mounting surface layer that forms the mounting surface. Is formed of two or more different materials 41 and 42, thereby solving the above-mentioned problem. [Selection] Figure 10

Description

  The present invention relates to a three-dimensional modeling apparatus, a mounting member, and a method for manufacturing a three-dimensional modeled object.

  2. Description of the Related Art Conventionally, a three-dimensional modeling apparatus that models a three-dimensional model using a modeling material placed on a mounting surface of a mounting member is known.

  For example, Patent Document 1 discloses a three-dimensional modeling apparatus that models a three-dimensional modeled object by a hot melt lamination method. This three-dimensional modeling apparatus sequentially stacks layered structures on the base plate by moving the modeling head part that discharges while heating the modeling material in the two-dimensional direction along the surface of the base plate (mounting member). Finally, a three-dimensional structure is formed.

  Further, for example, Patent Document 2 discloses a three-dimensional modeling apparatus that models a three-dimensional modeled object by a powder sintering lamination method. This three-dimensional modeling apparatus forms a solidified layer that is solidified by irradiating a predetermined position of the powder layer with a light beam after forming a powder layer of a predetermined thickness on a modeling plate (mounting member), A new powder layer is formed thereon, and a process of repeatedly irradiating a predetermined portion of the powder layer with a light beam and laminating the solidified layer is repeated, and finally a three-dimensional structure is formed.

When modeling a three-dimensional structure with a modeling material placed on the mounting surface of the mounting member, such as a hot melt lamination method or a powder sintering lamination method, the mounting member is a three-dimensional modeling during modeling. Adhesion to objects (adhesive strength) is required. On the other hand, when the three-dimensional structure is deformed by cooling or the like, followability (flexibility) to the deformation is required, and when the three-dimensional structure is peeled from the mounting member, peelability is also required. It has been difficult to achieve both of these properties with existing mounting members.
In addition, the subject that this coexistence is difficult is a subject which may arise not only between the property of adhesiveness (adhesion force), follow-up property to deformation (flexibility), and peelability.

  In order to solve the above-described problem, the present invention provides a three-dimensional modeling apparatus that forms a three-dimensional structure with a modeling material placed on a placement surface of a placement member. The mounting surface layer for forming the film is formed of two or more different materials.

  ADVANTAGE OF THE INVENTION According to this invention, there exists an outstanding effect that the mounting member provided with the mounting surface layer which has the property and function which are hard to make compatible can be implement | achieved easily, and various problems in a three-dimensional modeling apparatus can be solved.

It is explanatory drawing which shows typically the structure of the three-dimensional modeling apparatus in embodiment. It is a perspective view which shows the external appearance of the chamber provided in the inside of the same three-dimensional modeling apparatus. It is a perspective view of the state which cut | disconnected and excluded the near part in FIG. 2 of the same three-dimensional modeling apparatus. It is a control block diagram of the same three-dimensional modeling apparatus. It is a flowchart which shows the flow of the preheat processing and modeling process in embodiment. It is a schematic diagram which shows the state which the layered structure formed on the conventional highly rigid modeling plate peeled. It is sectional drawing which shows typically the modeling plate in embodiment. It is a top view which shows the same modeling plate typically. It is a schematic diagram which shows the state which the deformation | transformation layer of the modeling plate deform | transforms following a deformation | transformation of a layered structure. It is sectional drawing which shows typically a state when forming the layered structure of the 1st layer on the modeling plate. It is a top view which shows typically an example of the modeling plate comprised so that a dispersion material might be disperse | distributed at random and a dispersion material might be unevenly distributed. It is a top view which shows typically an example of the modeling plate which disperse | distributed two types of dispersion materials with a different dimension. It is a top view which shows typically an example of the modeling plate which disperse | distributed three types of dispersion materials with a different dimension. It is a top view which shows typically an example of the modeling plate which disperse | distributed two types of dispersing materials regularly. It is a top view which shows typically the other example of the modeling plate which disperse | distributed two types of dispersing materials regularly. It is a top view which shows typically an example of the modeling plate which has arrange | positioned the dispersing material with the regularity which has a rotational symmetry. It is a top view which shows typically the other example of the modeling plate which has arrange | positioned the dispersing material with the regularity which has a rotational symmetry.

Hereinafter, an embodiment in which the present invention is applied to a three-dimensional modeling apparatus that models a three-dimensional modeled object by a hot melt lamination method (FDM) will be described.
The three-dimensional modeling apparatus to which the present invention is applied is not limited to the hot melt lamination method (FDM), and a heated modeling material is placed on the surface of the mounting table or on the mounting plate held by the mounting table. If it is a 3D modeling apparatus that stacks a layered structure to be cooled and solidified and models a 3D model, it can also be applied to a 3D model apparatus that models a 3D model by other modeling methods. .

FIG. 1 is an explanatory diagram showing a configuration of a three-dimensional modeling apparatus 1 in the present embodiment.
FIG. 2 is a perspective view showing an appearance of a chamber provided inside the three-dimensional modeling apparatus 1 in the present embodiment.
FIG. 3 is a perspective view of a state in which the front portion of the three-dimensional modeling apparatus 1 in the present embodiment is cut and excluded.

  The three-dimensional modeling apparatus 1 includes a three-dimensional modeling chamber (hereinafter referred to as “chamber”) 3 inside a main body frame 2. The interior of the chamber 3 is a processing space for modeling a three-dimensional structure, and a stage 4 as a mounting table is provided in the processing space, that is, inside the chamber 3. In the present embodiment, a modeling plate 40 as a mounting member is held on the stage 4, and a three-dimensional modeled object is modeled on the modeling plate 40.

  The method of holding the modeling plate 40 with respect to the stage 4 is not particularly limited, and it is held using a holding member such as a screw, a clip, or a claw, or the press-fitted part on the modeling plate 40 is press-fitted into the press-fitting part of the stage 4 The modeling plate 40 may be guided and held using a rail or the like provided on the stage 4. Also, it may be held by an adsorption fixing method by suction, a fixing method using electromagnetic force such as electrostatic force or magnetic force, a method of fixing by pressure bonding by heat, a method of fixing material by an adhesive material, etc. .

  Most or all of the wall portion surrounding the processing space in the chamber 3 is a heat insulating wall having a heat insulating function. Specifically, the ceiling wall portion of the chamber 3 is a heat insulating wall configured by a plurality of slide heat insulating members 3A and 3B, as will be described later. Further, the side wall portion 3C of the chamber 3, that is, both wall portions in the left-right direction of the apparatus (the left-right direction in FIGS. 2 and 3 = X-axis direction) is provided with a heat insulating material containing glass wool or the like between the inner plate and the outer plate. It is a heat insulating wall with a sandwiched structure. The bottom wall portion 3D of the chamber 3 is also a heat insulating wall having a structure in which a heat insulating material containing glass wool or the like is sandwiched between an inner plate and an outer plate. The rear wall portion and the front wall portion 3E of the chamber 3 are also heat insulating walls having a structure in which a heat insulating material containing glass wool or the like is sandwiched between an inner plate and an outer plate.

  In the present embodiment, the front wall 3E of the chamber 3 is provided with an opening / closing door 3a as shown in FIG. The open / close door 3a constitutes a heat insulating wall in the same manner as the front wall portion 3E, and is configured to exhibit a sufficient heat insulating function. Further, a window 3b is provided in the front wall 3E of the chamber 3 as shown in FIG. This window 3b has a double glass structure with an air layer interposed therebetween, and constitutes a heat insulating wall in the same manner as the front wall portion 3E.

  In addition, if the heat insulation structure of each wall part of the chamber 3 is a structure which can exhibit a required heat insulation function, it will not be restricted to the thing of this embodiment, The thing of all heat insulation structures can be utilized. In the present embodiment, the processing space in the chamber 3 becomes a high temperature of 200 ° C. or higher during the modeling process, and even at such a high temperature, a heat insulating function can be exhibited so that the outside temperature of the chamber 3 is kept at approximately 40 ° C. or lower. A heat insulating wall is preferred.

  A modeling head 10 as a modeling material discharge unit is provided above the stage 4 in the chamber 3. The modeling head 10 has an injection nozzle 11 that injects a filament, which is a modeling material, below the modeling head 10. In the present embodiment, four injection nozzles 11 are provided on the modeling head 10, but the number of injection nozzles 11 is arbitrary. Further, the modeling head 10 is provided with a head heating unit 12 as a modeling material heating unit that heats the filament supplied to each injection nozzle 11.

  The filament has an elongated wire shape, is set in the three-dimensional modeling apparatus 1 in a wound state, and is supplied to each injection nozzle 11 on the modeling head 10 by the filament supply unit 6. In addition, a filament may differ for every injection nozzle 11, and the same may be sufficient as it. In the present embodiment, the filament supplied from the filament supply unit 6 is heated by the head heating unit 12 to be melted (or softened), and the molten filament is ejected by being pushed out from a predetermined ejection nozzle 11. The layered modeling structure is sequentially laminated on the modeling plate 40 held on the stage 4 to model a three-dimensional modeled object.

  The injection nozzle 11 on the modeling head 10 may be supplied with a support material that does not constitute a three-dimensional structure, instead of a filament of a modeling material. This support material is usually formed of a material different from the filament of the modeling material, and finally removed from the three-dimensional structure formed of the filament. This support material is also heated and melted by the head heating unit 12, and the molten support material is injected so as to be pushed out from a predetermined injection nozzle 11, and sequentially laminated in layers.

  The modeling head 10 is connected to the X-axis drive mechanism 21 extending in the left-right direction of the apparatus (left-right direction in FIGS. 2 and 3 = X-axis direction) via the connecting member 21a in the longitudinal direction of the X-axis drive mechanism 21 ( (Movable along the X axis direction). The modeling head 10 can move in the left-right direction of the apparatus (X-axis direction) by the driving force of the X-axis driving mechanism 21. Since the modeling head 10 is heated by the head heating unit 12 and becomes a high temperature, it is preferable that the connecting member 21 a has a low heat conductivity so that the heat is not easily transmitted to the X-axis drive mechanism 21.

  Both ends of the X-axis drive mechanism 21 are respectively in the longitudinal direction (Y of the Y-axis drive mechanism 22 with respect to the Y-axis drive mechanism 22 extending in the apparatus front-rear direction (front-rear direction in FIGS. 2 and 3 = Y-axis direction). It is held so as to be slidable along the axial direction. As the X-axis drive mechanism 21 moves along the Y-axis direction by the driving force of the Y-axis drive mechanism 22, the modeling head 10 can move along the Y-axis direction.

  In the present embodiment, the bottom wall 3D of the chamber 3 is fixed to the main body frame 2 with respect to the Z-axis drive mechanism 23 extending in the vertical direction of the apparatus (vertical direction in FIGS. 2 and 3 = Z-axis direction). The Z-axis drive mechanism 23 is held so as to be movable along the longitudinal direction (Z-axis direction). The bottom wall 3 </ b> D of the chamber 3 can be moved in the vertical direction of the apparatus (Z-axis direction) by the driving force of the Z-axis driving mechanism 23. Since the stage 4 is fixed on the bottom wall portion 3D, the stage 4 and the modeling plate 40 held by the stage 4 can be moved in the Z-axis direction by the driving force of the Z-axis driving mechanism 23.

  The peripheral edge portion of the bottom wall portion 3D of the chamber 3 is in close contact with both side wall portions 3C of the chamber 3 and the inner wall surfaces of the front wall portion 3E and the rear wall portion. When the bottom wall portion 3D of the chamber 3 is moved in the Z-axis direction by the Z-axis drive mechanism 23, the bottom wall portion 3D has a peripheral edge portion of the side wall portion 3C, the front wall portion 3E, and the rear wall portion of the chamber 3. Move while sliding each inner wall. Thereby, the shielding property in the chamber 3 is ensured, and sufficient heat insulation in the chamber 3 is obtained. If sufficient heat insulation in the chamber 3 is obtained, the peripheral edge portion of the bottom wall portion 3D of the chamber 3 and the inner wall surfaces of the side wall portions 3C, the front wall portion 3E and the rear wall portion of the chamber 3 There may be a slight gap between them. By forming such a gap, the bottom wall 3D can be moved smoothly and accurately, and the stage 4 can be moved smoothly and accurately.

  In the present embodiment, a chamber heater 7 is provided inside the chamber 3 (processing space) as processing space heating means for heating the inside of the chamber 3. In this embodiment, in order to model a three-dimensional modeled object by the hot melt lamination method (FDM), it is desirable to perform the modeling process while maintaining the temperature in the chamber 3 at the target temperature. Therefore, in the present embodiment, pre-heat treatment is performed in which the temperature in the chamber 3 is raised to the target temperature in advance before the modeling process is started. The chamber heater 7 heats the chamber 3 to raise the temperature of the chamber 3 to the target temperature during the pre-heat treatment, and maintains the temperature in the chamber 3 at the target temperature during the modeling process. Therefore, the inside of the chamber 3 is heated. The operation of the chamber heater 7 is controlled by the control unit 100.

  In the present embodiment, the X-axis drive mechanism 21, the Y-axis drive mechanism 22, and the Z-axis drive mechanism 23 are arranged outside the chamber 3. Therefore, the X-axis drive mechanism 21, the Y-axis drive mechanism 22, and the Z-axis drive mechanism 23 are not exposed to the high temperature in the chamber 3, and stable drive control is realized. The X-axis drive mechanism 21 and the Y-axis drive mechanism 22 are not limited to be configured to be disposed outside the chamber 3, but may be configured to be partially or entirely disposed inside the chamber 3. .

  Here, the driving target of the X-axis drive mechanism 21 and the Y-axis drive mechanism 22 in this embodiment is the modeling head 10, and a part of the modeling head 10 (the tip portion of the modeling head 10 including the injection nozzle 11) is a chamber. 3 is arranged. In the present embodiment, the inside of the chamber 3 is shielded from the outside even when the modeling head 10 is moved in the X-axis direction. Specifically, in the ceiling wall portion of the chamber 3, as shown in FIGS. 2 and 3, a plurality of X-axis slide heat insulating members 3A that are long in the Y-axis direction are arranged side by side in the X-axis direction. The adjacent X-axis slide heat insulating members 3A are configured to be slidable relative to each other in the X-axis direction. Thereby, even if the modeling head 10 is moved in the X-axis direction by the X-axis drive mechanism 21, the plurality of X-axis slide heat insulating members 3 </ b> A slide in the X-axis direction accordingly, and the processing space in the chamber 3 The upper part is always covered with the X-axis slide heat insulating member 3A.

  Similarly, in the ceiling wall portion of the chamber, as shown in FIGS. 2 and 3, a plurality of Y-axis slide heat insulating members 3B are arranged side by side in the Y-axis direction. The adjacent Y-axis slide heat insulating members 3B are configured to be slidable relative to each other in the Y-axis direction. Thereby, even if the modeling head 10 on the X-axis drive mechanism 21 is moved in the Y-axis direction by the Y-axis drive mechanism 22, the plurality of Y-axis slide heat insulating members 3B slide and move in the Y-axis direction accordingly. The upper part of the processing space in the chamber 3 is always covered with the Y-axis slide heat insulating member 3B.

  In addition, the drive target of the Z-axis drive mechanism 23 in the present embodiment is the bottom wall 3D of the chamber 3 or the stage 4 (or the modeling plate 40). In the present embodiment, the inside of the chamber 3 is shielded from the outside even if the bottom wall 3D or the stage 4 is moved in the Z-axis direction. Specifically, as shown in FIGS. 2 and 3, slide holes 3c that penetrate through the connecting portion between the Z-axis drive mechanism 23 and the bottom wall 3D are formed in the Z-axis direction on both side walls 3C of the chamber 3. It is formed to extend. The slide hole 3c is sealed by a flexible seal member 3d made of a heat insulating material. When the bottom wall portion 3D is moved in the Z-axis direction by the Z-axis drive mechanism 23, the connecting portion between the Z-axis drive mechanism 23 and the bottom wall portion 3D is configured to slide the slide hole 3c while elastically deforming the flexible seal member 3d. Along the Z axis. Therefore, the slide holes 3c formed in the both side walls 3C of the chamber 3 are always covered with the seal member 3d.

  In addition, in this embodiment, nozzle cleaning for cleaning the in-device cooling device 8 for cooling the space inside the 3D modeling apparatus 1 outside the chamber 3 and the injection nozzle 11 of the modeling head 10. A part 9 and the like are provided.

FIG. 4 is a control block diagram of the three-dimensional modeling apparatus 1 of the present embodiment.
In the present embodiment, an X-axis position detection mechanism 24 that detects the position of the modeling head 10 in the X-axis direction is provided. The detection result of the X-axis position detection mechanism 24 is sent to the control unit 100. The control unit 100 controls the X-axis drive mechanism 21 based on the detection result to move the modeling head 10 to the target X-axis direction position.

  In the present embodiment, a Y-axis position detection mechanism 25 that detects the Y-axis direction position of the X-axis drive mechanism 21 (the Y-axis direction position of the modeling head 10) is provided. The detection result of the Y-axis position detection mechanism 25 is sent to the control unit 100. The control unit 100 moves the modeling head 10 on the X-axis drive mechanism 21 to a target position in the Y-axis direction by controlling the Y-axis drive mechanism 22 based on the detection result.

  In the present embodiment, a Z-axis position detection mechanism 26 that detects the position in the Z-axis direction of the modeling plate 40 held on the stage 4 is provided. The detection result of the Z-axis position detection mechanism 26 is sent to the control unit 100. The control unit 100 controls the Z-axis drive mechanism 23 based on the detection result to move the modeling plate 40 on the stage 4 to a target position in the Z-axis direction.

  The control unit 100 controls the movement of the modeling head 10 and the stage 4 in this way, thereby determining the relative three-dimensional position between the modeling head 10 in the chamber 3 and the modeling plate 40 on the stage 4 as a target. It can be located in a three-dimensional position.

FIG. 5 is a flowchart showing the flow of pre-heat treatment and modeling processing in the present embodiment.
In the present embodiment, when the modeling is started by the user's instruction operation or the like, the controller 100 first turns on the energization to the chamber heater 7, the head heating unit 12, and the stage heating unit 5 to operate them ( S1). Further, the control unit 100 controls the Z-axis drive mechanism 23 to raise the stage 4 from a predetermined standby position (for example, the lowest point) by the driving force of the Z-axis drive mechanism 23 (S2). When the stage 4 reaches the preheating position described above (Yes in S3), the driving of the Z-axis drive mechanism 23 is stopped (S4).

  When the temperature of the processing space reaches the target temperature (Yes in S5), the control unit 100 subsequently proceeds to modeling processing. The three-dimensional shape data of the three-dimensional structure to be modeled by the three-dimensional modeling apparatus 1 of the present embodiment is obtained from an external device such as a personal computer connected to the three-dimensional modeling apparatus 1 so that data communication can be performed by wire or wirelessly. Entered. The control unit 100 generates data (slice data for modeling) of a large number of layered structures decomposed in the vertical direction based on the input three-dimensional shape data. The slice data corresponding to each layered structure corresponds to each layered structure formed by the filament ejected from the modeling head 10 of the three-dimensional modeling apparatus 1, and the thickness of the layered structure is three-dimensional. It is appropriately set according to the capability of the modeling apparatus 1.

  In the modeling process, first, the control unit 100 creates a lowermost layered structure on the surface of the modeling plate 40 held on the stage 4 according to the slice data of the lowermost layer (first layer) (S6). Specifically, the control unit 100 controls the X-axis drive mechanism 21 and the Y-axis drive mechanism 22 based on the slice data of the lowermost layer (first layer) to target the tip of the injection nozzle 11 of the modeling head 10. The filament is ejected from the ejection nozzle 11 while sequentially moving to a position (target position on the XY plane). Thereby, the layered structure according to the slice data of the lowest layer (first layer) is formed on the surface of the modeling plate 40 on the stage 4. In addition, although the support material which does not comprise a three-dimensional structure may be created together, description here is abbreviate | omitted.

  Next, the control unit 100 controls the Z-axis drive mechanism 23 to lower the stage 4 by a distance corresponding to one layer of the layered structure, and the modeling plate 40 on the stage 4 is moved to the next layer (first layer). The position is lowered to a position for creating a (two-layer) layered structure and positioned (S8). Thereafter, the control unit 100 controls the X-axis drive mechanism 21 and the Y-axis drive mechanism 22 based on the slice data of the second layer, and sequentially moves the tip of the injection nozzle 11 of the modeling head 10 to the target position. A filament is injected from the injection nozzle 11. Thereby, the layered structure according to the slice data of the second layer is formed on the lowermost layered structure formed on the modeling plate 40 of the stage 4 (S6).

  In this way, the control unit 100 controls the Z-axis drive mechanism 23 and repeats the process of laminating and modeling each layered structure in order from the lower layer while sequentially lowering the stage 4. When the creation of the uppermost layered structure is completed (Yes in S7), a three-dimensional structure according to the input three-dimensional shape data is formed on the modeling plate 40.

  When the modeling process is thus completed, the control unit 100 controls the Z-axis drive mechanism 23 to lower the stage 4 to a predetermined extraction position (the lowest point in the present embodiment) (S9). This take-out position is set at a position where the open / close door 3a provided on the front wall 3E of the chamber 3 is opened and the three-dimensional structure on the stage 4 is easily taken out of the chamber 3.

  Since the processing space in the chamber 3 is still hot immediately after the modeling process is completed, the user cannot immediately open the open / close door 3a and take out the three-dimensional modeled object in the processing space. Therefore, after the temperature in the processing space is lowered to a temperature at which the user can take out, the user opens the door 3a and takes out the three-dimensional structure in the processing space while being fixed to the modeling plate 40. The control unit 100 provides a cooling period in which the open / close door 3a is locked until the temperature in the processing space decreases to a temperature at which it can be taken out. It is preferable to release the locked state.

  Here, when modeling the three-dimensional modeled object with the three-dimensional modeling apparatus 1 of the present embodiment, the softened filament 50 heated by the head heating unit 12 and injected from the injection nozzle 11 is the modeling plate in the chamber 3. 40 is injected onto. The inside of the chamber 3 is heated by the chamber heater 7 or the like, but since the temperature in the chamber 3 is lower than the softening temperature of the filament 50 in the head heating section 12, the softened filament injected onto the modeling plate 40 The temperature of will gradually decrease. Thereby, the filament 50 is fixed to the surface of the modeling plate 40, and the hardness is increased so that the shape as a layered structure can be maintained.

  The filament 50 injected onto the modeling plate 40 causes thermal contraction in the process of gradually decreasing the temperature. Conventionally, as shown in FIG. 6, the modeling plate 40 ′ is composed of a highly rigid member that is not easily deformed. Therefore, the internal stress of the lowermost layered structure fixed to the plate increases due to thermal contraction. . In addition, since the layered structure after the second layer laminated on the lowermost layer also causes thermal shrinkage, the internal stress of the layered structure after the second layer also increases, thereby causing the layered structure of the lowermost layer. The internal stress increases further. The internal stress of the lowermost layered structure that increases in this way causes the lowermost layered structure to warp and peels off the end of the lowermost layered structure from the highly rigid modeling plate 40 '. Generate power.

  When the internal stress of the lowermost layered structure increases so that a peeling force exceeding the fixing force between the lowermost layered structure and the highly rigid modeling plate 40 ′ is generated, as shown in FIG. 6, the lowermost layered structure The object is peeled off from the modeling plate 40 ′. If the lowermost layered structure is peeled off from the modeling plate 40 ′ during the modeling process, the position of the layered structure already formed moves on the modeling plate 40 ′, and a new layer is formed on the layered structure. The relative position with the layered structure shifts and the modeling process cannot be continued properly.

  As a method for suppressing peeling, it is conceivable to increase the adhesion between the lowermost layered structure and the highly rigid modeling plate 40 '. For example, there is a method in which a highly rigid modeling plate 40 ′ is coated with a surface film that improves chemical bonding and mechanical bonding with the layered structure, and the adhesion between the modeling plate 40 ′ and the lowermost layered structure is increased. Can be mentioned. However, since there is a limit to increasing the fixing force, it is difficult to solve the problem that the lowermost layered structure is peeled off from the modeling plate 40 ′ when the lowermost layered structure has a large peeling force.

  Here, the case where thermal contraction occurs is described, but the same applies to the case where thermal expansion occurs. For example, due to temperature variation in the chamber 3, the layered structure may thermally expand during the modeling process, and peeling force may occur due to such thermal expansion.

FIG. 7 is a cross-sectional view schematically showing the modeling plate 40 in the present embodiment.
FIG. 8 is a plan view schematically showing the modeling plate 40 in the present embodiment.
As shown in FIG. 7, the modeling plate 40 according to the present embodiment includes a rigid substrate 41 that is a rigid layer and a deformation layer 42 that is a mounting surface layer formed on the rigid substrate 41. The deformation layer 42 is firmly fixed on the rigid substrate 41 and is a flexible layer that can be deformed following the deformation of the lowermost layered structure fixed to the deformation layer 42. The deformable layer 42 of the present embodiment has such flexibility, so that the layered structure formed on the deformable layer 42 of the modeling plate 40 causes thermal contraction and is fixed to the deformable layer 42 as a lowermost layer. Even if the structure is deformed to be warped, the deformation layer 42 is also deformed following the deformation as shown in FIG. As a result, the peeling force generated between the deformable layer 42 and the lowermost layered structure can be kept small, and the lowermost layered structure can be prevented from peeling from the modeling plate 40 during the modeling process. Therefore, the position of the layered structure already formed in the middle of the modeling process does not move on the modeling plate 40 beyond the allowable range, and the modeling process can be performed appropriately.

  On the other hand, when the deformation layer 42 of the modeling plate 40 is deformed following the deformation of the lowermost layered structure, the lowermost layered structure is deformed during the modeling process, and the modeling is performed. The modeling accuracy of the three-dimensional structure to be performed can be lowered. However, if peeling occurs during the modeling process, the advantage of being able to model the three-dimensional model is greater even if the modeling accuracy is low, compared to the fact that it is impossible to model the three-dimensional model.

  Further, even when the deformation layer 42 of the modeling plate 40 is deformed following the deformation of the lowermost layered structure, a deformation resistance force is generated against the deformation when the deformation layer 42 is deformed, and the deformation resistance force is This is a force that suppresses deformation of the lowermost layered structure. Therefore, by adjusting the flexibility of the deformation layer 42 so as to generate a deformation resistance that can sufficiently suppress the deformation of the lowermost layered structure, it is possible to form a three-dimensional structure with an acceptable modeling accuracy. Is possible.

  Further, in the present embodiment, the three-dimensional structure that is fixed to the modeling plate 40 is cooled to a temperature that can be taken out in the chamber 3 (for example, near room temperature) after the modeling process is finished, and then from the chamber 3. It is taken out. In this cooling process, the lowermost layered structure of the three-dimensional structure that adheres to the modeling plate 40 causes a larger thermal shrinkage than during the modeling process. Therefore, since a larger peeling force is generated, in the conventional high-rigidity modeling plate 40 ′, the lowermost layered structure is warped in the process of cooling the three-dimensional structure fixed to the modeling plate 40 ′. The lowermost layered structure is peeled off from the modeling plate 40 ′. When peeling occurs in such a cooling process, an external force that resists deformation due to thermal contraction of the three-dimensional structure does not act at all thereafter, so that the deformation of the three-dimensional structure proceeds and the modeling accuracy deteriorates.

  According to this embodiment, even if the lowermost layered structure is deformed in such a cooling process, the deformable layer 42 of the modeling plate 40 is deformed following the deformation. Also at this time, when the deformation layer 42 is deformed, a deformation resistance force resisting the deformation is generated, and the deformation resistance force is a force for suppressing the deformation of the lowermost layered structure. Therefore, the deformation layer 42 can also prevent the three-dimensional structure from being deformed by thermal contraction during the cooling process after the forming process, and the deterioration of the forming accuracy due to peeling can also be suppressed.

  By controlling the stage heating unit 5 and adjusting the temperature of the stage 4 to change the temperature environment in the vicinity of the stage 4 and to control the thermal contraction rate of the three-dimensional structure, the adhesion and It is possible to further improve the modeling accuracy.

  The deformable layer 42 may be a plastically deformable layer having a small or no restoring force as long as it can be deformed following the deformation of the lowermost layered structure. However, in this embodiment, an elastic layer having a large deformation restoring force is used as the deformation layer 42. With such an elastic layer, the restoring force of deformation acts continuously as a deformation resistance force against the deformation of the lowermost layered structure, so the effect of suppressing the deformation of the lowermost layered structure is high. . Therefore, it becomes possible to model a three-dimensional structure with higher modeling accuracy.

  As the rigid substrate 41 of the modeling plate 40, even if the deformable layer 42 is deformed following the deformation of the lowermost layered structure, it has a hardness that can support the deformable layer 42 without substantially deforming. That's fine. However, in this embodiment, since the modeling plate 40 is exposed to a high temperature in the chamber 3, the rigid substrate 41 preferably has flame resistance and heat resistance.

  Materials for the rigid substrate 41 include styrene resin, phenol resin, acrylic resin, methacrylic resin, urethane resin, melamine resin, polyamide resin, polyester resin, polyether resin, polyvinyl ether resin, polyolefin resin, epoxy resin, ketone resin, silicone Resins such as resin and fluororesin can be used. From the viewpoint of flame retardancy, for example, fluorine-based resins such as PVDF and ETFE, polyimide resin or polyamideimide resin are preferable, and from the viewpoint of mechanical strength (high elasticity) and heat resistance, epoxy resin, polyimide resin or polyamideimide is preferable. Resins are preferred.

  The material of the rigid substrate 41 is more preferably a metal material than a resin material from the viewpoint of thermal conductivity and mechanical strength. Even in the case of using a metal material, any material can be used as long as it has hardness and heat resistance that can support the deformable layer 42 without substantially deforming, and is highly versatile, such as iron, aluminum, stainless steel, true casting. Titanium, steel, copper and the like can be used, but stainless steel and aluminum are preferable from the viewpoints of cost, mechanical strength, thermal conductivity, and surface workability.

  Further, the surface of the rigid substrate 41 of the modeling plate 40 may be roughened by roughening or the like to increase the contact area or improve the adhesion between the rigid substrate 41 and the deformation layer 42 due to the anchor effect. Good. Examples of the method for forming such irregularities include known roughening treatments such as plating, surface coating, plasma treatment, surface modification, and formation of a primer layer. Sand blasting, shot blasting, plating, polishing, etc. may be used.

Moreover, as a material of the deformation layer 42, materials such as general-purpose resins, elastomers, and rubbers can be used, but elastomer materials and rubber materials are preferably used.
Examples of the elastomer material include thermoplastic elastomers such as polyester, polyamide, polyether, polyurethane, polyolefin, polystyrene, polyacryl, polydiene, silicone-modified polycarbonate, and fluorine copolymer. . Examples of thermosetting include polyurethane, silicone-modified epoxy, and silicone-modified acrylic.
Examples of the rubber material include isoprene rubber, styrene rubber, butadiene rubber, nitrile rubber, ethylene propylene rubber, butyl rubber, silicone rubber, chloroprene rubber, acrylic rubber, chlorosulfonated polyethylene, fluorine rubber, urethane rubber, and hydrin rubber. .
Of these various elastomers and rubbers, a material that can obtain the desired characteristics as the above-described deformation layer 42 is appropriately selected. In the present embodiment, the flexibility of the deformation layer 42 (deformation followability of the layered structure) is selected. And acrylic rubber is preferable as the material of the deformable layer 42 from the viewpoint of adhesion to the rigid substrate 41 formed of a metal material.

  In the present embodiment, since the modeling plate 40 is exposed to a high temperature in the chamber 3, the deformable layer 42 is a material that can obtain desired characteristics as the deformable layer 42 described above under such a high temperature environment. It is desirable to select. From this viewpoint, the material of the deformable layer 42 is preferably silicone rubber, fluorine rubber, or the like, and more preferably silicone rubber from the viewpoint of flame retardancy.

  The hardness of the deformed layer 42 to be laminated affects the modeling quality. Specifically, if the hardness is too high, it will be difficult to deform and inferior in followability, whereas if the hardness is too low, the deformation of the three-dimensional structure will be allowed and the modeling quality will deteriorate. . Examples of a method for measuring the hardness of the deformable layer 42 include a method of measuring a microhardness such as Martens hardness and Vickers hardness. In this method, only the shallow region in the bulk direction of the measurement site, that is, the hardness in the vicinity of the surface is measured, so it is difficult to evaluate the deformation performance of the entire deformation layer 42. Therefore, it is preferable to use a method of measuring the micro rubber hardness that can evaluate the deformation performance of the entire deformation layer 42. The micro rubber hardness can be measured using a commercially available micro rubber hardness meter. Specifically, it can be measured using, for example, “Micro Rubber Hardness Meter MD-1” manufactured by Kobunshi Keiki Co., Ltd. The micro rubber hardness of the deformation layer 42 is preferably 10 or more and 50 or less, and more preferably 15 or more and 40 or less in an environment of 23 ° C. and 50% RH.

  As described above, the deformation layer 42 is appropriately adjusted so that the amount of deformation is suppressed within an allowable range that does not deteriorate the molding quality while reducing the peeling force by deforming following the warping of the lowermost layered structure. Hardness (flexibility) is required. However, when trying to realize the deformable layer 42 having such flexibility, it is difficult to obtain sufficient adhesion between the lowermost layered structure and the deformable layer 42 depending on the type of modeling material. There is a case. For example, when a modeling material having a large thermal shrinkage such as polyether ether ketone (PEEK), which is a crystalline material engineering plastic, is used, sufficient adhesion between the lowermost layered structure and the deformable layer 42 is ensured. Difficult to get to. That is, if the hardness (flexibility) of the deformation layer 42 is set to an appropriate hardness that can be suppressed within an allowable range in which the deformation amount does not deteriorate the modeling quality, the effect of lowering the peeling force due to the follow-up deformation is insufficient, and the lowermost layer shape The structure may peel from the modeling plate 40.

  As a method for improving the adhesion between the lowermost layered structure and the deformable layer 42, there is a method of selecting a material having a high bonding force such as an intermolecular force with the modeling material as the material of the deformable layer 42. Conceivable. However, when such a material is selected, there are many cases where the deformation layer 42 having the appropriate hardness (flexibility) as described above cannot be formed.

  Similarly to the adhesion between the rigid substrate 41 and the deformation layer 42 described above, the surface of the deformation layer 42 is roughened by roughening or the like, and the contact area between the lowermost layered structure and the deformation layer 42 is obtained. A method of increasing the adhesiveness due to the increase in the thickness and the anchor effect can be considered. However, an elastomer material or a rubber material suitable for realizing the deformation layer 42 having an appropriate hardness (flexibility) as described above is difficult to roughen as compared with a metal material such as the rigid substrate 41. Therefore, it is difficult to form an uneven surface that can provide a sufficient anchor effect. Moreover, in the case of an elastomer material or a rubber material, even if the surface can be made uneven, if the deformable layer 42 is deformed following as described above, cracks are likely to occur and durability will be reduced. Furthermore, the convex part on the surface of the deformation layer 42 is also formed of a relatively soft material such as an elastomer material or a rubber material, and it is difficult to obtain a sufficient anchor effect in this respect as well.

  If large irregularities are formed on the surface of the deformable layer 42, it is possible to obtain a sufficient anchor effect even with an elastomer material or a rubber material. Concavities and convexities are also generated in the layered structure formed on the substrate, resulting in a problem that the modeling accuracy is lowered.

  As described above, the deformable layer 42 having the above-described appropriate hardness (flexibility) and having high adhesion to the lowermost layered structure is formed as a single layer that forms the deformable layer 42. It is difficult to realize with the material.

  Therefore, in the present embodiment, the deformation layer 42 is formed of two different materials. Specifically, as shown in FIGS. 7 and 8, the deformation layer 42 of the present embodiment includes a dispersion material 42 b made of a material harder than the base material 42 a on a base material 42 a such as an elastomer material or a rubber material. It is distributed. In the present embodiment, a large number of dispersing materials 42b are dispersedly arranged with respect to the base material 42a so that a large number of convex portions are formed by the dispersing material 42b. Thereby, the unevenness | corrugation according to the dimension of the dispersion material 42b is formed in the surface of the deformation | transformation layer 42. FIG. Therefore, as shown in FIG. 10, by appropriately setting the size of the dispersion material 42b, it is possible to exhibit high adhesion due to an increase in the contact area and an anchor effect with small unevenness that does not cause a decrease in modeling accuracy. It becomes.

  With such a deformable layer 42, the above-mentioned appropriate hardness (flexibility) can be obtained by the base material 42a made of an elastomer material or a rubber material, and the adhesiveness with the lowermost layered structure. Is obtained by unevenness formed by the dispersion material 42b harder than the base material 42a. In this way, by obtaining two properties or functions required for the deformable layer 42 individually by different materials (the materials of the base material 42a and the dispersion material 42b), these properties and functions are obtained. Can be compatible. In addition, since the base material 42a made of an elastomer material or a rubber material is not subjected to the roughening treatment, cracks are hardly generated and a decrease in durability is suppressed.

  The manufacturing method of the modeling plate 40 having the deformable layer 42 as in the present embodiment is not particularly limited. For example, a large number of dispersion materials 42b are dispersed in a base material 42a such as an elastomer material or a rubber material. Can be manufactured by applying the product on the rigid substrate 41. In this case, even if the base material 42a is coated on the surface of the dispersion material 42b constituting the convex portion on the surface of the deformation layer 42, the rigidity of the convex portion is ensured by the hardness of the dispersion material 42b. Therefore, a sufficient anchor effect can be obtained.

  In addition, when the dispersing material 42b is exposed on the surface of the deformable layer 42, the dispersing material 42b adhered to the lowermost layered structure is peeled off from the base material 42a, thereby causing the lowermost layered structure. May peel off from the modeling plate 40. On the other hand, as described above, if the surface of the dispersion material 42b is coated on the base material 42a on the surface of the deformation layer 42, the dispersion material 42b is unlikely to be detached from the base material 42a, and the dispersion material 42b By peeling off from the base material 42a, the situation where the lowermost layered structure is peeled off from the modeling plate 40 is suppressed.

  On the other hand, the dispersion material 42 b may be exposed on the surface of the deformation layer 42. In this case, in addition to an increase in the contact area and anchor effect, adhesion can be improved by intermolecular force between the lowermost layered structure and the dispersion material 42b, thereby realizing higher adhesion. it can. However, as shown in FIG. 7, it is preferable that the height difference h between the convex portion and the concave portion on the surface of the deformation layer 42 is less than 50% of the height H of the dispersion material 42b forming the convex portion. In this case, more than half of the surface area of the dispersing material 42b forming the convex portion comes into contact with the base material 42a, ensuring adhesion between the dispersing material 42b and the base material 42a, and the dispersing material 42b is detached from the base material 42a. Can be sufficiently suppressed.

  The relationship between the height difference h and the height H of the dispersion material 42b here is shown as an average value in the measurement region. The height H and the height difference h of the dispersion material 42b are obtained by observing the cross section of the deformation layer 42 with a scanning electron microscope (SEM), measuring the height H of the dispersion material 42b constituting the convex portion, and measuring the height of the convex portion. The difference between the apex and the deepest portion of the concave portion adjacent to this was measured as the height difference h.

  As the material of the dispersion material 42b in the present embodiment, a resin material or metal material that is harder than the base material 42a and further has heat resistance is preferable. Moreover, when it is set as the structure which exposed the dispersion material 42b on the surface of the deformation | transformation layer 42, it is preferable from the viewpoint of an adhesive improvement that they are resin and metal material with affinity with modeling material. Specific examples of the material of the dispersing material 42b include a material system composed of a thermoplastic elastomer such as polyester resin and acrylic resin, polyamide resin, polyethersulfone resin, polyphenylene sulfide resin, polyamideimide resin, melamine resin, and silicone. Examples thereof include particles mainly composed of a curable resin such as a resin, an epoxy resin, or a fluororesin, an engineering plastic, and a super engineering plastic. Moreover, you may use what coat | covered these resin materials with other resin. In particular, it is preferable to select these materials from the viewpoint of heat resistance.

  In recent years, there is a tendency to use materials having higher strength as modeling materials. In addition to ABS and PLA that have been used so far, engineering plastics such as polycarbonate, polyester, polyamide, polyacetal, polyphenylene ether, polyethylene, Further, polyether ether ketone, polyether imide, polyphenylene sulfide resin, fluororesin, liquid crystal polymer, and polyamide imide resin, which are super engineering plastics, may be used.

  In order to discharge a modeling material having such a high strength, it is necessary to increase the heating temperature in the modeling head 10, and the heat resistance that can withstand the modeling material discharged at such a high temperature, In order to maintain the convex shape and exhibit the anchor effect, it is required for the dispersion material 42b. Therefore, it is preferable to select a material having a melting point or a thermal decomposition temperature higher than the temperature of the modeling material discharged from the modeling head 10 for the dispersion material 42b as well as the base material 42a described above. Therefore, a resin material composed of an engineering plastic or a crosslinkable resin can be suitably used as the material of the dispersion material 42b. Preferably, a polyamide resin, a polyamideimide resin, a crosslinkable epoxy resin, a silicone resin, or a fluorine resin is used. Can be used.

  The shape of the dispersion material 42b in the present embodiment is substantially spherical, but it is not limited to a spherical shape, and may be a polyhedron shape, an elongated rod shape (long chain fiber), or the like.

  Moreover, it is preferable that the volume average particle diameter of the dispersion material 42b in this embodiment is 0.5 [μm] or more and 150 [μm] or less. When the volume average particle size of the dispersion material 42b is less than 0.5 [μm], it is difficult to form unevenness having a height difference that can obtain a sufficient anchor effect on the surface of the deformation layer 42. In the process, it is difficult to make the dispersion material 42b unevenly distributed on the surface of the deformation layer 42. On the other hand, when the volume average particle size of the dispersion material 42b exceeds 150 [μm], the layered structure formed on the surface of the deformable layer 42 also has irregularities, which tends to cause a reduction in modeling accuracy. Further, when the volume average particle size of the dispersion material 42b exceeds 150 [μm], the dispersion material 42b is easily detached from the base material 42a in the configuration in which the dispersion material 42b is exposed on the surface of the deformation layer 42, and the dispersion material 42b is dispersed. When the material 42b is peeled off from the base material 42a, a situation in which the lowermost layered structure is peeled off from the modeling plate 40 is likely to occur.

  In addition, it is preferable that the particle size distribution of the dispersion material 42b in this embodiment is sharp (the size of the dispersion material 42b is within a certain range). Specifically, the width of the particle size distribution is preferably ± (volume average particle diameter × 1/2) or less. However, even if there are variations in dimensions, the dispersion material 42b having a desired dimension may be formed so as to form a convex portion on the surface of the deformation layer 42.

  Further, on the surface of the deformable layer 42 in the present embodiment, it is preferable that the proportion occupied by the convex portions (the convex portion occupation area ratio) by the dispersing material 42b is at least 20% or more. If it is less than 20%, it may be difficult to obtain sufficient adhesion due to an increase in surface area due to unevenness on the surface of the deformation layer 42 or an anchor effect. In addition, it may be a problem that the adhesiveness is too high (for example, when performing the operation of removing the three-dimensional structure from the modeling plate 40 after the modeling process, the operation becomes difficult if the adhesiveness is too high. In such a case, it is preferable to control the adhesiveness due to the increase in the surface area and the anchor effect by adjusting the area occupied by the protrusions.

  In the present embodiment, as shown in FIG. 8, the dispersion material 42b is uniformly dispersed on the surface of the deformation layer 42. However, as shown in FIG. A configuration in which the dispersion material 42b is unevenly distributed and distributed unevenly may be employed.

  In the present embodiment, as shown in FIG. 8, the dispersion material 42b having substantially the same size is used. However, as shown in FIG. 12, two types of dispersion materials 42b1 and 42b2 having different sizes are used. May be dispersed. By dispersing the two types of dispersions 42b1 and 42b2 having different dimensions, the content ratio between the two dispersions 42b1 and 42b2 can be adjusted to control the uneven state, and the surface area can be increased and the adhesion by the anchor effect can be improved. It is possible to control. Further, as shown in FIG. 13, if three types of dispersing materials 42b1, 42b2, and 42b3 having different dimensions are dispersed, the adhesiveness can be controlled more finely.

  Moreover, you may disperse | distribute the 2 or more types of dispersing material which consists of a different material. In this case, for example. The adhesiveness can be controlled by adjusting the content ratio between the two dispersions due to the difference in intermolecular force between the two dispersions and the modeling material. Further, for example, by dispersing two or more types of dispersion materials made of appropriate materials with respect to different modeling materials, a single modeling plate 40 can support a plurality of types of modeling materials. Further, for example, it is possible to add new properties and functions to the deformable layer 42 by increasing the types of dispersion materials having different materials.

  Further, when two or more kinds of dispersing materials having different dimensions or two or more kinds of dispersing materials made of different materials are dispersed, they may be dispersed regularly as shown in FIGS. . By regularly dispersing in this manner, it is easy to avoid a situation where a locally inferior portion may occur on the surface of the deformation layer 42.

  In addition, since the layered structure under modeling is gradually cooled from the surface, deformation often occurs from the vicinity of the surface of the layered structure. Therefore, for example, by providing adhesiveness locally at a position corresponding to the vicinity of the surface of the layered structure (that is, a place where the deformation is fast and the deformation amount is large), it is possible to prevent a decrease in adhesiveness.

  Further, when two or more kinds of dispersing materials having different dimensions or two or more kinds of dispersing materials made of different materials are dispersed, as shown in FIGS. 16 and 17, only at least one kind of dispersing materials 42b1 and 42b3 are used. May be arranged regularly. At this time, it is preferable to disperse the dispersive materials 42b1 and 42b3 with regularity having rotational symmetry, such as a region indicated by symbol A in FIG. 16 and a region indicated by symbol B in FIG. In this case, it is easy to obtain high adhesiveness.

  In addition, the modeling plate 40 of the present embodiment is configured by the rigid substrate 41 and the deformation layer 42, but may be configured by directly forming the deformation layer 42 on the stage 4.

[Effect confirmation test]
Next, an effect confirmation test using the modeling plate 40 in the present embodiment will be described.
In this effect confirmation test, a predetermined three-dimensional modeling is performed using a modeling plate 40 having various deformation layers 42 in which the material of the base material 42a and the material of the dispersion material 42b and the volume average particle diameter of the modeling plate 40 are changed. I shaped a thing. Then, the burying rate h / H [%], modeling material diversity, adhesion, and modeling accuracy (warping amount) in these deformable layers 42 were measured and evaluated.

  “Embedding ratio” indicates the ratio of the height difference h between the convex portion on the surface of the deformable layer 42 and the concave portion adjacent thereto with respect to the height H of the dispersion material 42 b forming the convex portion on the surface of the deformable layer 42. As described above, the cross section of the deformation layer 42 was observed and measured with a scanning electron microscope (SEM).

  “Modeling material diversity” indicates the width (the number of types) of materials that can be used as modeling materials. In this effect confirmation test, in order to easily evaluate the modeling material diversity, a highly versatile ABS and PEEK that requires a high heating temperature in the modeling head 10 are used. If a 3D object is modeled and both ABS and PEEK can be modeled, it will be evaluated as “◎”, and if only ABS can be modeled, it will be evaluated as “◯” and modeled with ABS. When the quality did not meet the standard, it was evaluated as “△”.

  As for “adhesiveness”, a cylindrical tertiary cylinder having a diameter of 12.7 [mm] (0.5 inches) and a height of 50.8 [mm] (2 inches) on a modeling plate 40 having various deformation layers 42. The original model was modeled at InfillRate 100%, and the force applied when the top of the three-dimensional model was pushed down with a digital force gauge within 30 seconds immediately after the modeling was completed was calculated. If this calculated force is 10 [N] or more, it is evaluated as “◎”, if it is greater than 5 [N] and smaller than 10 [N], it is evaluated as “◯”, and if it is 5 [N] or less, “Δ” "

  About “modeling accuracy”, a three-dimensional model of a rectangular parallelepiped shape having a width of 20 [mm], a length of 160 [mm], and a thickness of 3 [mm] is formed on the modeling plate 40 having various deformation layers. After the modeling was completed, the model was left until it returned to room temperature, and then the three-dimensional modeled object after the modeling plate 40 was peeled was placed on a surface plate, and the curl amount of the three-dimensional modeled object was measured with a gap gauge. If this measured gap is 5 [mm] or less, it is evaluated as “◎”, if it is larger than 5 [mm] and smaller than 15 [mm], it is evaluated as “◯”, and if it is 15 [mm] or more, “Δ”. "

Hereinafter, the various modeling plates 40 created in this effect confirmation test will be described.
[Example 1]
The modeling plate A of Example 1 uses a heat-resistant and high-strength polyimide resin as the base material 42a, and disperses the dispersion material 42b made of epoxy resin fine particles on the surface of the base material 42a, thereby making the surface uneven. A non-deformable layer is formed on the rigid substrate 41. The polyimide resin used was a polyimide varnish (U-varnish A; Ube Industries, Ltd.) containing a polyimide resin precursor as a main component. Further, Trepearl (manufactured by Toray Industries Inc .: average particle size 20 [μm]) was used as the epoxy resin fine particles. The burying rate h / H of the non-deformable layer in the created modeling plate A was 77 [%].

  On the modeling plate A created in this way, a three-dimensional model was modeled using ABS as a modeling material, and evaluation of resin diversity, adhesiveness and modeling accuracy was performed. All of the modeling accuracy were evaluated to satisfy the acceptance criteria of “◯”.

[Comparative Example 1]
The modeling plate B of Comparative Example 1 is the same as Example 1 except that the non-deformable layer is formed only by the base material 42a without dispersing the dispersion material 42b.
On the modeling plate B created in this manner, as in Example 1 above, a three-dimensional modeled object was modeled using ABS as a modeling material, and evaluation of resin diversity, adhesiveness, and modeling accuracy was performed. Resin diversity, adhesiveness, and modeling accuracy were all evaluated as “Δ”, and none of the evaluations satisfied the acceptance criteria.

  Comparing Example 1 with Comparative Example 1 described above, Example 1 formed irregularities on the surface of the non-deformable layer by the dispersing material 42b, thereby increasing the contact area with the three-dimensional structure and the anchor effect. It was confirmed that the adhesion and modeling accuracy were improved by increasing the adhesion between the non-deformable layer of the modeling plate and the three-dimensional modeled object.

[Comparative Example 2]
The modeling plate C of Comparative Example 2 was the same as the dispersion material 42b except that Trepearl (volume average particle size 0.4 [μm]) having a volume average particle size of 0.4 [μm] was used. The same as in the first embodiment. The burying rate h / H of the non-deformable layer in the created modeling plate C was 76 [%], which was almost the same as in Example 1.
On the modeling plate C created in this manner, as in Example 1, a three-dimensional modeled object was modeled using ABS as a modeling material, and evaluation of resin diversity, adhesiveness, and modeling accuracy was performed. Resin diversity, adhesiveness, and modeling accuracy were all evaluated as “Δ”, and none of the evaluations satisfied the acceptance criteria.

  Comparing Example 1 and Comparative Example 2, when the particle size of the dispersion material 42b is too small, sufficient adhesion cannot be obtained due to surface irregularities of the non-deformable layer by the dispersion material 42b, and the adhesion satisfies the acceptance criteria. It was confirmed that there was a case where the property and modeling accuracy could not be obtained. Considering various experimental results by the present inventors comprehensively, it is desirable that the volume average particle size of the dispersion material 42b is 0.5 [μm] or more in order to obtain adhesiveness and modeling accuracy that satisfy the acceptance criteria. .

[Example 2]
The modeling plate D of Example 2 is the same as Example 1 except that silicone rubber, which is an elastic material, is used as the base material 42a. That is, the modeling plate D of Example 2 is a modeling plate having the deformation layer 42 whose surface is made uneven by a dispersing material, like the modeling plate 40 of the above-described embodiment. In addition, the burying rate h / H of the deformation layer 42 in the created modeling plate D was 75 [%] which is substantially the same as that in the first embodiment.
On the modeling plate D created in this manner, a three-dimensional modeled object is modeled using ABS as a modeling material, and evaluation of resin diversity, adhesion, and modeling accuracy was performed. About resin diversity and adhesion Was evaluated as “◯”, and the modeling accuracy was evaluated as “◎”.

  When the Example 1 and the Example 2 are compared, in the Example 1, a slight peeling may occur locally (peripheral part) between the three-dimensional structure and the non-deformable layer of the modeling plate. In this case, the restraint of the three-dimensional structure by the adhesion with the non-deformable layer of the modeling plate is released in the local area (peripheral part), and a slight warp occurs in the three-dimensional structure due to the internal stress of the three-dimensional structure. obtain. On the other hand, in the second embodiment, the deformation layer 42 of the modeling plate to which the three-dimensional structure is adhered is formed of an elastic material, so that the deformation layer 42 is deformed following the deformation of the three-dimensional structure. The local peeling does not occur. In addition, the restoring force of the deformation layer 42 elastically deformed following the deformation of the three-dimensional structure acts continuously as a deformation resistance force against the deformation of the three-dimensional structure, so that the deformation of the three-dimensional structure is Suppressed and high modeling accuracy was obtained.

[Comparative Example 3]
The modeling plate E of Comparative Example 3 is the same as Example 2 except that the dispersion layer 42b is formed only by the base material 42a without dispersing the dispersion material 42b.
On the modeling plate E created in this manner, as in Example 2 above, a three-dimensional modeled object was modeled using ABS as a modeling material, and evaluation of resin diversity, adhesiveness, and modeling accuracy was performed. Resin diversity, adhesiveness, and modeling accuracy were all evaluated as “Δ”, and none of the evaluations satisfied the acceptance criteria.

  Comparing Example 2 and Comparative Example 3, in both cases, the deformation layer 42 of the modeling plate to which the three-dimensional structure is adhered is deformed following the deformation of the three-dimensional structure. Then, because of insufficient adhesion, local (peripheral) peeling occurs between the three-dimensional structure and the deformed layer of the modeling plate, and the evaluation of adhesiveness and modeling accuracy is “△”. became. On the other hand, in the second embodiment, the surface of the deformation layer is made uneven by the dispersing material 42b, so that the deformation layer of the modeling plate and the three-dimensional modeling are increased by an increase in the contact area with the three-dimensional structure and the anchor effect. Adhesion with the object increased, and local (peripheral part) peeling did not occur between the three-dimensional structure and the deformed layer of the modeling plate, thereby improving adhesion and modeling accuracy.

[Comparative Example 4]
The modeling plate F of Comparative Example 4 is the same as Example 2 except that the burial rate h / H is 31 [%].
On the modeling plate F created in this manner, as in Example 2, a three-dimensional modeled object was modeled using ABS as a modeling material, and evaluation of resin diversity, adhesiveness, and modeling accuracy was performed. Resin diversity, adhesiveness, and modeling accuracy were all evaluated as “Δ”, and none of the evaluations satisfied the acceptance criteria.

  Comparing Example 2 and Comparative Example 4, in Comparative Example 4, as a result of the burial rate h / H of the dispersion material 42b being too low, the contact area between the dispersion material 42b and the base material 42a that holds the dispersion material 42b. The dispersion material 42b is easily peeled off from the base material 42a. Therefore, the adhesive force between the three-dimensional structure and the dispersion material 42b exceeds the adhesive force between the dispersion material 42b and the base material 42a, and the dispersion material 42b remains adhered to the three-dimensional structure from the base material 42a. The phenomenon of peeling occurred. As a result, peeling occurred between the three-dimensional structure and the deformation layer of the modeling plate, and both the adhesion and the modeling accuracy were evaluated as “Δ”. On the other hand, in Example 2, the contact area between the dispersion material 42b and the base material 42a can be sufficiently ensured. As a result, the adhesive force between the dispersion material 42b and the base material 42a is sufficiently high. However, the phenomenon of peeling from the base material 42a while adhering to the three-dimensional structure did not occur, and the adhesion and the modeling accuracy were improved.

Example 3
The modeling plate G of Example 3 is the same as Example 1 except that a silicone resin having higher heat resistance than the polyimide resin is used as the dispersion material 42b. As the silicone resin, Tospearl 120 (manufactured by Momentive Performance Materials: volume average particle size 2.0 [μm]) was used. In addition, the burying rate h / H of the non-deformable layer in the created modeling plate G was 76 [%] which is substantially the same as that in the first embodiment.
On the modeling plate G created in this way, as a modeling material, a three-dimensional modeled object was modeled using PEEK, which is an engineering plastic, and evaluation of resin diversity, adhesion, and modeling accuracy was performed. An evaluation of “◎” was obtained for diversity, and an evaluation of “◯” was obtained for adhesiveness and modeling accuracy.

  Comparing Example 1 and Example 3, in Example 1, since the epoxy resin having a heat-resistant temperature (melting point) of 310 [° C.] is used as the dispersion material 42b, heating by the modeling head 10 is performed. When PEEK having a temperature of 360 [° C.] was used as a modeling material, the dispersion material 42b was softened or melted, and the functions and properties of the dispersion material 42b were not exhibited, and a decrease in adhesiveness and modeling accuracy was observed. On the other hand, in Example 3, since the silicone resin having a high heat-resistant temperature is used as the dispersion material 42b, the dispersion material 42b does not soften or melt even when PEEK is used as a modeling material. Functions and properties were maintained, and adhesion and modeling accuracy were ensured. As a result, the range of materials that can be used as modeling materials has expanded, and the evaluation of modeling material diversity has increased.

Example 4
The modeling plate H of Example 4 is the same as Example 3 except that silicone rubber, which is an elastic material, is used as the base material 42a. That is, the modeling plate H of Example 4 is a modeling plate having the deformation layer 42 whose surface is made uneven by a dispersing material, like the modeling plate 40 of the above-described embodiment. In addition, the burying rate h / H of the deformation layer 42 in the created modeling plate H was 78 [%] which is substantially the same as that in Example 3.
On the modeling plate H created in this manner, a three-dimensional modeled object was modeled using PEEK as a modeling material, and resin diversity, adhesiveness and modeling accuracy were evaluated. Evaluation of “◎” was obtained for any of the modeling accuracy.

  When the Example 3 and the Example 4 are compared, in the Example 3, a slight peeling may occur locally (peripheral part) between the three-dimensional structure and the non-deformable layer of the modeling plate. In this case, the restraint of the three-dimensional structure by the adhesion with the non-deformable layer of the modeling plate is released in the local area (peripheral part), and a slight warp occurs in the three-dimensional structure due to the internal stress of the three-dimensional structure. obtain. On the other hand, in the said Example 4, since the deformation | transformation layer 42 of the modeling plate to which a three-dimensional structure is adhere | attached is formed with the elastic material, the deformation layer 42 deform | transforms following the deformation | transformation of a three-dimensional structure. The local peeling does not occur. In addition, the restoring force of the deformation layer 42 elastically deformed following the deformation of the three-dimensional structure acts continuously as a deformation resistance force against the deformation of the three-dimensional structure, so that the deformation of the three-dimensional structure is Suppressed and high modeling accuracy was obtained.

[Comparative Example 5]
The modeling plate I of Comparative Example 5 is the same as Example 4 except that the burial rate h / H is 39 [%].
On the modeling plate I created in this manner, as in Example 4 above, a three-dimensional model was modeled using PEEK as a modeling material, and the evaluation of resin diversity, adhesiveness and modeling accuracy was performed. The evaluation of “◎” was obtained for the resin diversity, but the evaluation of “Δ” was obtained for the adhesiveness and modeling accuracy, and none of the evaluations satisfied the acceptance criteria.

  Comparing Example 4 and Comparative Example 5, in Comparative Example 5, as a result of the burial rate h / H of the dispersion material 42b being too low, the contact area between the dispersion material 42b and the base material 42a that holds the dispersion material 42b. The dispersion material 42b is easily peeled off from the base material 42a. Therefore, the adhesive force between the three-dimensional structure and the dispersion material 42b exceeds the adhesive force between the dispersion material 42b and the base material 42a, and the dispersion material 42b remains adhered to the three-dimensional structure from the base material 42a. The phenomenon of peeling occurred. As a result, peeling occurred between the three-dimensional structure and the deformation layer of the modeling plate, and both the adhesion and the modeling accuracy were evaluated as “Δ”. On the other hand, in Example 4, the contact area between the dispersion material 42b and the base material 42a can be sufficiently secured. As a result, the adhesive force between the dispersion material 42b and the base material 42a is sufficiently high. However, the phenomenon of peeling from the base material 42a while adhering to the three-dimensional structure did not occur, and the adhesion and the modeling accuracy were improved.

The conditions and results of the above effect confirmation test are summarized as shown in Table 1 below.

  The modeling plate 40 of the present embodiment has a two-layer structure of the rigid substrate 41 and the deformable layer 42, but a layer that makes it impossible to deform the deformable layer 42 following the deformation of the lowermost layered structure. Otherwise, other necessary layers may be added.

  Moreover, in this embodiment, the structure which hold | maintains the modeling plate 40 taken out from the chamber 3 with a three-dimensional structure after a modeling process on the stage 4, and shape | molds a three-dimensional structure on the modeling plate 40 was demonstrated. However, the three-dimensional structure may be formed directly on the stage 4 without using the modeling plate 40. In this case, by providing a deformation layer similar to the deformation layer 42 of the modeling plate 40 on the surface portion of the stage 4, similarly, the layered structure formed on the deformation layer of the stage 4 is deformed by causing thermal contraction. However, the deformation layer of the stage 4 is also deformed following the deformation. Thereby, the position of the layered structure already formed during the modeling process does not move on the modeling plate 40 beyond the allowable range, and the modeling process can be appropriately performed. Also in this case, the deformation resistance that resists the deformation that occurs when the deformation layer on the stage 4 is deformed becomes the force that suppresses the deformation of the lowermost layered structure, and the deterioration of the modeling accuracy can be suppressed.

  In the present embodiment, it is difficult to increase the contact area or roughen the surface to obtain an anchor effect on the base material 42a made of a resin such as polyimide resin or silicone rubber, or rubber. In view of the fact that it is difficult to realize the flexibility that can follow the deformation of the original model and the adhesion due to the increase in the contact area and the anchor effect with a single material, a base made of a material for obtaining flexibility. In the material 42a, a dispersion member 42b for forming irregularities for obtaining adhesion due to an increase in contact area and an anchor effect is dispersed, and different materials are used to achieve both flexibility and adhesiveness. . This concept is not limited to the compatibility between flexibility and adhesiveness, and can be applied to obtaining two or more functions and properties that are difficult to achieve and are required for the modeling plate 40 of the three-dimensional modeling apparatus. That is, the mounting surface of the modeling plate is formed so that two or more functions and properties that are difficult to achieve at the same time are required for the modeling plate 40 of the three-dimensional modeling apparatus with two or more types of materials that can be separately realized. If the mounting surface layer is formed of two or more different materials, it is possible to easily realize a modeling plate with a mounting surface layer having two or more properties and functions that are difficult to achieve with a single material. Various problems in the modeling apparatus can be solved.

What was demonstrated above is an example, and there exists an effect peculiar for every following aspect.
(Aspect A)
In the three-dimensional modeling apparatus 1 that models a three-dimensional structure using a modeling material such as ABS or PEEK placed on a mounting surface of a mounting member such as the modeling plate 40, the above-described mounting member forms the above-described mounting surface. The mounting surface layer such as the deformable layer 42 is formed of two or more different materials.
According to this, among various functions and properties required for the mounting surface layer of the mounting member of the 3D modeling apparatus, functions and properties that are difficult to be compatible, such as flexibility and adhesiveness, are individually made of materials. Can be realized. Thereby, the mounting member provided with the mounting surface layer having properties and functions that are difficult to be compatible can be easily realized, and various problems in the three-dimensional modeling apparatus can be solved.
In particular, after completion of the modeling of the three-dimensional structure, it is necessary to peel off (removal) the mounting member from the three-dimensional structure, and the releasability is a property that is contrary to the adhesion required during the modeling. May be required. As in the embodiment described above, by adjusting the adhesion force of the base material 42a and the dispersant 42b to the three-dimensional structure, the adhesion force that acts between the three-dimensional structure and the mounting member is not a surface. It can also be set as a set, and the peelability after completion of modeling can also be improved.

(Aspect B)
In the aspect A, the placement surface layer is characterized in that at least one type of dispersion material 42b is dispersedly arranged on a base material 42a made of a material different from that of the dispersion material.
A mounting member including a mounting surface layer having two or more properties and functions that are difficult to achieve with a single material can be easily realized over the entire mounting surface layer of the mounting member. The “distributed arrangement” here may be a randomly distributed arrangement as shown in FIGS. 11 to 13 or an arrangement in which at least a part of the arrangement is regularly distributed as shown in FIGS. 14 to 17. But you can.

(Aspect C)
In the aspect B, the placement surface is an uneven surface in which a plurality of convex portions are formed by the dispersing material.
According to this, the adhesion between the mounting surface and the three-dimensional structure formed on the mounting surface can be improved by increasing the contact area due to the unevenness of the mounting surface and the anchor effect. Therefore, even if it is difficult for the material of the base material 42a to make the mounting surface uneven and it is difficult to improve the adhesion, it is possible to improve the adhesion by making the mounting surface uneven by the dispersing material. .

(Aspect D)
In the aspect C, the height difference h between the convex portion and the concave portion on the placement surface is less than 50% of the height H of the dispersion material forming the convex portion.
According to this, it is possible to suppress a situation in which the dispersion material 42b is peeled off from the base material 42a while being adhered to the three-dimensional structure and the adhesiveness to the placement surface of the three-dimensional structure is reduced.

(Aspect E)
In the aspect C or D, the volume average particle diameter of the dispersing material forming the convex portion is 0.5 [μm] or more.
According to this, it is easy to form unevenness with a sufficient height difference on the mounting surface, and it is easy to realize stable adhesiveness.

(Aspect F)
In any one of the above aspects B to E, at least a part of the dispersion material is exposed on the placement surface.
According to this, the function and the property exhibited by the direct contact between the dispersion material and the modeling material can be realized. For example, if the intermolecular force between the dispersion material and the modeling material is higher than the intermolecular force between the base material and the modeling material, the adhesiveness can be increased, and vice versa. Can do.

(Aspect G)
In any of the above aspects B to F, the base material 42a is formed of a material that can be deformed following the deformation of the modeling material placed on the placement surface.
According to this, even if the three-dimensional structure causes thermal expansion or contraction, the mounting surface layer (deformation layer 42) of the mounting member to which the three-dimensional structure is fixed is thermally expanded or contracted. Deforms following the deformation of the three-dimensional structure. Therefore, even if the three-dimensional structure is deformed by causing thermal expansion or contraction, the peeling force generated between the three-dimensional structure and the mounting surface of the mounting member can be suppressed to a small size. It can suppress that an object peels from a mounting member.

(Aspect H)
In the aspect G, the deformable material is an elastic material that exhibits a restoring force against the deformation.
According to this, since the restoring force of deformation acts continuously as a deformation resistance force against the deformation of the three-dimensional structure, a high effect of suppressing the deformation of the three-dimensional structure is obtained. Thereby, it becomes possible to model a three-dimensional modeled object with higher modeling accuracy.

(Aspect I)
In any one of the aspects A to H, a modeling material discharge unit such as the modeling head 10 that discharges heated modeling material such as ABS or PEEK, and a processing space in which the placement member is disposed are provided inside. A layered structure is formed and laminated while relatively moving the chamber 3, a processing space heating means such as a chamber heater 7 for heating the processing space in the chamber, and the mounting member and the modeling material discharge unit. And a modeling control unit such as the control unit 100 for controlling the operation to be performed.
According to this, a mounting member having a mounting surface layer having two or more properties and functions required in a three-dimensional modeling apparatus that models a three-dimensional modeled object by a hot melt lamination method (FDM) is easily realized. And can solve various problems in the three-dimensional modeling apparatus.

(Aspect J)
In the aspect I, the material for forming the placement surface layer has a melting point or a thermal decomposition temperature higher than the temperature of the modeling material discharged from the modeling material discharging unit.
According to this, various materials which form a mounting surface layer can maintain a solid state, and can exhibit the original function and property stably.

(Aspect K)
A mounting member of a three-dimensional modeling apparatus that forms a three-dimensional structure with a modeling material such as ABS or PEEK placed on a mounting surface of a mounting member such as the modeling plate 40, and forms the mounting surface described above The placement surface layer is formed of two or more different materials.
According to this, among various functions and properties required for the mounting surface layer of the mounting member of the three-dimensional modeling apparatus, two or more functions that are difficult to achieve with a single material, such as flexibility and adhesiveness. And properties can be realized separately by materials. Thereby, the mounting member provided with the mounting surface layer having two or more properties and functions that are difficult to achieve with a single material can be easily realized, and various problems in the three-dimensional modeling apparatus can be solved.

(Aspect L)
In the three-dimensional structure manufacturing method for manufacturing a three-dimensional structure using a modeling material such as ABS or PEEK placed on the mounting surface of the mounting member such as the modeling plate 40, the above-mentioned mounting surface It is characterized by using a mounting member in which the mounting surface layer for forming the substrate is formed of two or more different materials.
According to this, among various functions and properties required for the mounting surface layer of the mounting member of the three-dimensional modeling apparatus, two or more functions that are difficult to achieve with a single material, such as flexibility and adhesiveness. And properties can be realized separately by materials. Thereby, the mounting member provided with the mounting surface layer having two or more properties and functions that are difficult to achieve with a single material can be easily realized, and a three-dimensional structure can be manufactured more satisfactorily.

DESCRIPTION OF SYMBOLS 1 Three-dimensional modeling apparatus 3 Chamber 4 Stage 5 Stage heating part 7 Chamber heater 10 Modeling head 11 Injection nozzle 40 Modeling plate 41 Rigid substrate 42 Deformable layer 42a Base material 42b Dispersing material 50 Filament 100 Control part

Japanese Patent No. 5611433 Japanese Patent No. 5189953

Claims (12)

In the three-dimensional modeling apparatus that models the three-dimensional structure with the modeling material placed on the mounting surface of the mounting member,
The mounting member is a three-dimensional modeling apparatus, wherein the mounting surface layer forming the mounting surface is formed of two or more different materials. The three-dimensional modeling apparatus according to claim 1,
The mounting surface layer is a three-dimensional modeling apparatus in which at least one kind of dispersing material is dispersedly arranged on a base material different from the dispersing material. The three-dimensional modeling apparatus according to claim 2,
The three-dimensional modeling apparatus, wherein the placement surface is an uneven surface having a plurality of convex portions formed by the dispersing material. In the three-dimensional modeling apparatus according to claim 3,
The three-dimensional modeling apparatus, wherein the height difference between the convex portion and the concave portion on the placement surface is less than 50% of the height of the dispersion material forming the convex portion. In the three-dimensional modeling apparatus according to claim 3 or 4,
The three-dimensional modeling apparatus characterized in that a volume average particle diameter of the dispersing material forming the convex portion is 0.5 [μm] or more. The three-dimensional modeling apparatus according to any one of claims 2 to 5,
At least a part of the dispersion material is exposed on the mounting surface described above. The three-dimensional modeling apparatus according to any one of claims 2 to 6,
The three-dimensional modeling apparatus, wherein the base material is formed of a material that can be deformed following the deformation of the modeling material placed on the placement surface. The three-dimensional modeling apparatus according to claim 7,
The three-dimensional modeling apparatus, wherein the deformable material is an elastic material that exhibits a restoring force against the deformation. The three-dimensional modeling apparatus according to any one of claims 1 to 8,
A modeling material discharge unit for discharging the heated modeling material;
A chamber provided with a processing space in which the mounting member is disposed;
Processing space heating means for heating the processing space in the chamber;
A three-dimensional modeling apparatus comprising: a modeling control unit that controls an operation of forming and laminating a layered structure while relatively moving the mounting member and the modeling material discharging unit. The three-dimensional modeling apparatus according to claim 9,
The three-dimensional modeling apparatus characterized in that the material forming the placement surface layer has a melting point or a thermal decomposition temperature higher than the temperature of the modeling material discharged from the modeling material discharging unit. A mounting member for a three-dimensional modeling apparatus that models a three-dimensional structure with a modeling material placed on the mounting surface of the mounting member,
A mounting member, wherein the mounting surface layer forming the mounting surface is formed of two or more different materials. In the three-dimensional structure manufacturing method for manufacturing a three-dimensional structure by a modeling material placed on the mounting surface of the mounting member,
The manufacturing method of the three-dimensional structure characterized by using the mounting member in which the mounting surface layer which forms the said mounting surface was formed with 2 or more types of different materials as said mounting member.

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