[go: up one dir, main page]

JP2018051945A - ダイヤモンドツール及びそのスクライブ方法 - Google Patents

ダイヤモンドツール及びそのスクライブ方法 Download PDF

Info

Publication number
JP2018051945A
JP2018051945A JP2016191079A JP2016191079A JP2018051945A JP 2018051945 A JP2018051945 A JP 2018051945A JP 2016191079 A JP2016191079 A JP 2016191079A JP 2016191079 A JP2016191079 A JP 2016191079A JP 2018051945 A JP2018051945 A JP 2018051945A
Authority
JP
Japan
Prior art keywords
substrate
scribing
point
diamond tool
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2016191079A
Other languages
English (en)
Japanese (ja)
Inventor
曽山　浩
Hiroshi Soyama
浩 曽山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2016191079A priority Critical patent/JP2018051945A/ja
Priority to TW106127235A priority patent/TW201815540A/zh
Priority to KR1020170116148A priority patent/KR20180035668A/ko
Priority to CN201710839501.2A priority patent/CN107877716A/zh
Publication of JP2018051945A publication Critical patent/JP2018051945A/ja
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • H10P54/00—
    • H10W10/00—
    • H10W10/01—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP2016191079A 2016-09-29 2016-09-29 ダイヤモンドツール及びそのスクライブ方法 Ceased JP2018051945A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016191079A JP2018051945A (ja) 2016-09-29 2016-09-29 ダイヤモンドツール及びそのスクライブ方法
TW106127235A TW201815540A (zh) 2016-09-29 2017-08-11 鑽石工具及其劃線方法
KR1020170116148A KR20180035668A (ko) 2016-09-29 2017-09-11 다이아몬드 툴 및 이의 스크라이빙 방법
CN201710839501.2A CN107877716A (zh) 2016-09-29 2017-09-15 金刚石刀具及其划线方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016191079A JP2018051945A (ja) 2016-09-29 2016-09-29 ダイヤモンドツール及びそのスクライブ方法

Publications (1)

Publication Number Publication Date
JP2018051945A true JP2018051945A (ja) 2018-04-05

Family

ID=61780689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016191079A Ceased JP2018051945A (ja) 2016-09-29 2016-09-29 ダイヤモンドツール及びそのスクライブ方法

Country Status (4)

Country Link
JP (1) JP2018051945A (zh)
KR (1) KR20180035668A (zh)
CN (1) CN107877716A (zh)
TW (1) TW201815540A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200180994A1 (en) * 2018-12-06 2020-06-11 Schott Ag Glass element with cut edge and method of producing same
WO2020261552A1 (en) * 2019-06-28 2020-12-30 Nec Corporation Spoofing detection apparatus, spoofing detection method, and computer-readable storage medium

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718647U (zh) * 1980-07-04 1982-01-30
JPH11314928A (ja) * 1997-09-25 1999-11-16 Beldex:Kk スクライブ装置および方法
JP2001322824A (ja) * 2000-05-10 2001-11-20 Mitsuboshi Diamond Industrial Co Ltd スクライブ法およびこれに基づくスクライブ装置
US20070089304A1 (en) * 2005-10-05 2007-04-26 Loomis James W Automatic tool tilting apparatus for a scribe tool
JP2015063020A (ja) * 2013-09-24 2015-04-09 三星ダイヤモンド工業株式会社 スクライブヘッド、スクライブ装置およびスクライブ方法
JP2016132181A (ja) * 2015-01-20 2016-07-25 三星ダイヤモンド工業株式会社 マルチポイントダイヤモンドツール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100410196C (zh) * 2001-11-08 2008-08-13 夏普株式会社 切割玻璃基体的方法和装置、液晶板以及制造液晶板的装置
TW200403192A (en) * 2002-07-18 2004-03-01 Mitsuboshi Diamond Ind Co Ltd Method of scribing on brittle material, scribe head, and scribing apparatus with the scribe head
KR20070103188A (ko) * 2006-04-18 2007-10-23 주식회사 탑 엔지니어링 기판 스크라이브 장치
JP2011088382A (ja) * 2009-10-23 2011-05-06 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
JP2011155151A (ja) * 2010-01-27 2011-08-11 Mitsuboshi Diamond Industrial Co Ltd 薄膜太陽電池用スクライブ装置
TWI498293B (zh) * 2011-05-31 2015-09-01 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置
CN203487032U (zh) * 2013-09-18 2014-03-19 永润应用材料股份有限公司 用于光学玻璃的切割设备及其钻石刀
CN203639329U (zh) * 2013-11-08 2014-06-11 蚌埠朝阳玻璃机械有限公司 一种玻璃切割机刀盒

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5718647U (zh) * 1980-07-04 1982-01-30
JPH11314928A (ja) * 1997-09-25 1999-11-16 Beldex:Kk スクライブ装置および方法
JP2001322824A (ja) * 2000-05-10 2001-11-20 Mitsuboshi Diamond Industrial Co Ltd スクライブ法およびこれに基づくスクライブ装置
US20070089304A1 (en) * 2005-10-05 2007-04-26 Loomis James W Automatic tool tilting apparatus for a scribe tool
JP2015063020A (ja) * 2013-09-24 2015-04-09 三星ダイヤモンド工業株式会社 スクライブヘッド、スクライブ装置およびスクライブ方法
JP2016132181A (ja) * 2015-01-20 2016-07-25 三星ダイヤモンド工業株式会社 マルチポイントダイヤモンドツール

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200180994A1 (en) * 2018-12-06 2020-06-11 Schott Ag Glass element with cut edge and method of producing same
US11851361B2 (en) * 2018-12-06 2023-12-26 Schott Ag Glass element with cut edge and method of producing same
WO2020261552A1 (en) * 2019-06-28 2020-12-30 Nec Corporation Spoofing detection apparatus, spoofing detection method, and computer-readable storage medium

Also Published As

Publication number Publication date
KR20180035668A (ko) 2018-04-06
TW201815540A (zh) 2018-05-01
CN107877716A (zh) 2018-04-06

Similar Documents

Publication Publication Date Title
EP3127673B1 (en) Method for cutting brittle-material substrate
TWI406821B (zh) Cutter wheel and its manufacturing method, manual scribing tool and scribing device
KR20150123150A (ko) 스크라이브용 커터 휠 그리고 스크라이브 장치
JP2018051945A (ja) ダイヤモンドツール及びそのスクライブ方法
CN107001103B (zh) 脆性衬底的分断方法
TWI680041B (zh) 多點鑽石刀具
CN106079116B (zh) 脆性材料基板的断开方法
KR20170026118A (ko) 취성 재료 기판에 있어서의 경사 크랙의 형성 방법 및 취성 재료 기판의 분단 방법
TW201628983A (zh) 脆性基板之分斷方法
CN106865967B (zh) 工具支架以及工具支架单元
KR102352243B1 (ko) 멀티포인트 다이아몬드 툴 및 그의 제조 방법
KR20170101126A (ko) 취성 기판의 분단 방법
JP2018015945A (ja) ダイヤモンドツール及びそのスクライブ方法
KR102294044B1 (ko) 멀티포인트 다이아몬드 툴 및 그의 제조 방법
JP2018034493A (ja) ダイヤモンドツール及びそのスクライブ方法
KR20180025173A (ko) 다이아몬드 툴
CN107775825A (zh) 金刚石刀具及其划线方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190823

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20201021

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201027

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201228

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210224

A045 Written measure of dismissal of application [lapsed due to lack of payment]

Free format text: JAPANESE INTERMEDIATE CODE: A045

Effective date: 20210727