JP2017511162A - Fingerprint recognition device, manufacturing method thereof, and electronic apparatus - Google Patents

Abstract

Disclosed are a fingerprint recognition apparatus having an improved structure so that a driving element of an integrated circuit has durability, a manufacturing method thereof, and an electronic apparatus. The fingerprint recognition apparatus includes: an integrated circuit electrically connected to at least one sensor electrode; a first circuit board disposed on the integrated circuit and provided with the at least one sensor electrode; A second circuit board positioned under the integrated circuit, a molding layer provided under the first circuit board to protect the integrated circuit from the outside and surrounding the integrated circuit, and the first circuit board. A connection part that electrically connects the circuit board and the second circuit board may be included.

Description

  The present invention relates to a fingerprint recognition device, a manufacturing method thereof, and an electronic apparatus, and more particularly, to a fingerprint recognition device having an improved structure so as to have durability against physical and environmental factors, a manufacturing method thereof, and an electronic device. It relates to equipment.

  In general, mobile terminals such as mobile terminals, PDAs (Personal Digital Assistants), and tablet PCs adopt a user interface such as a key pad or a touch pad.

  Recently, in order to support communication services and Internet services using mobile terminals, wireless Internet services and mobile communication services such as WIBR (Wireless Broadband) have been commercialized, such as mobile phones and PDAs. In order to support GUI (Graphical User Interface), mobile terminals have adopted operating systems such as Windows (registered trademark) Mobile and Android (Android).

  With the development of communication technology, the mobile terminal provides a variety of additional services to users, and the GUI-based operating system makes it convenient to provide additional services using mobile electronic devices.

  In addition, a pointing device is used for more convenient use of electronic devices, but a pointer such as a cursor is moved by detecting a signal that changes according to the movement of a finger as a subject, It is applied to an electronic device so as to receive input of desired information or instructions.

  A sensor is applied to the pointing device so that a cursor (pointer on the screen) can be moved by detecting a finger change, and a dome switch or the like is provided so that a menu or icon where the cursor is located can be selected. Can be installed together.

  In general, fingerprint recognition technology is mainly used to prevent security incidents by going through user registration and authentication procedures, including personal and organizational networking protection, content and data protection, computer It is applied to secure access (Access) control for mobile devices and the like.

  Recently, with the development of mobile technology, fingerprint recognition technology is also applied to devices such as pointing device Bio Trackpad (BTP) that detects the image data of fingerprints of fingers and performs pointer operations. It is getting wider.

  For such a fingerprint recognition technology, a fingerprint recognition sensor is applied as a pointing device sensor. The fingerprint recognition sensor is a device for recognizing a fingerprint pattern of a human hand, and is a fingerprint recognition device. Sensors are classified into optical sensors, electrical (capacitance and conductive), ultrasonic sensors, and thermal sensors according to the sensing principle. Each type of fingerprint recognition sensor is fingerprinted from the finger according to its driving principle. Get image data.

  Various types of packaging processes have been proposed for each type of pointing device including a fingerprint recognition sensor. However, in the case of an electrical sensor, since it is an individual component including an integrated circuit, other types of sensors are used. Compared to this, there is a difficulty in developing package technology. A wafer level fan-out packaging process has been proposed as a packaging technology for a fingerprint recognition sensor including an integrated circuit. However, when the wafer level fan-out packaging process is used, the driving element portion of the integrated circuit is exposed on the surface exposed to the outside. Can be located close together. Therefore, when the pointing device manufactured by the wafer level fan-out package process is used for an electronic product to which a periodic impact is applied, such as a button, it is difficult to avoid damage to driving elements of the integrated circuit.

  Further, the wafer level fan-out packaging process increases the process cost because the efficiency of rearranging the I / O of the integrated circuit on the wafer decreases as the area of the pointing device is larger than the area of the integrated circuit. Since the integrated circuit of the pointing device has a small area, if a wafer level fan-out packaging process is used to implement a button size of a certain size like a home key of a smartphone, there is a large economic loss.

  As related prior art documents, there is Korean Published Patent Publication No. 10-2011-0055364 (pointing device and electronic device).

  One aspect of the present invention provides a fingerprint recognition device having an improved structure so that the fingerprint recognition device can be used as a mechanical button, a manufacturing method thereof, and an electronic apparatus.

  Another aspect of the present invention provides a fingerprint recognition apparatus having an improved structure so that a driving element of an integrated circuit has durability, a manufacturing method thereof, and an electronic apparatus.

  A fingerprint recognition apparatus according to the idea of the present invention includes an integrated circuit electrically connected to at least one sensor electrode, a first circuit board positioned on the integrated circuit and provided with the at least one sensor electrode, A second circuit board that is electrically connected to the first circuit board and is located under the integrated circuit, and is provided under the first circuit board so as to protect the integrated circuit from the outside and surrounds the integrated circuit. The molding layer may include a connecting part that electrically connects the first circuit board and the second circuit board.

  The first circuit board may have a structure in which a plurality of circuit layers are rearranged so that a signal sensed from the at least one sensor electrode is transmitted to the integrated circuit.

  The at least one sensor electrode may be provided on a surface of the first circuit board exposed to the outside.

  The at least one sensor electrode may be provided inside the first circuit board so as to be adjacent to a surface of the first circuit board exposed to the outside.

  In addition, at least one signal movement path is formed on the first circuit board so that a signal sensed from the at least one sensor electrode is transmitted to the integrated circuit. The at least one signal movement path is The first circuit layer where the at least one sensor electrode is located, the second circuit layer where the electrode provided under the first circuit board is located, and the first circuit layer and the second circuit layer are electrically connected. Micro vias can be included.

  The at least one signal moving path further includes at least one third circuit layer positioned between the first circuit layer and the second circuit layer, and the micro via has a stacked structure. One third circuit layer and the second circuit layer can be electrically connected.

  The electrodes and the integrated circuit may be electrically connected by a connecting member such that a signal sensed from the at least one sensor electrode is transmitted to the integrated circuit through the at least one signal moving path.

  The connection member may include a solder bump.

  The fingerprint recognition device according to the idea of the present invention further includes an underfill resin layer formed between the integrated circuit and a lower surface of the first circuit board facing the integrated circuit so as to reinforce the durability of the connection member. Can be included.

  The second circuit board may include a hard board, a soft board, a rigid flex board, and a rigid flex separation bonding board.

  The connection part includes at least one of a through mold via and a solder ball that electrically connect the first circuit board and the second circuit board through the molding layer. be able to.

  The connecting part may be bonded to the second circuit board by one of gold-tin eutectic bonding, ACA / NCA bonding, solder bonding, and gold-gold bonding.

  Various hues may be implemented on the upper end of the first circuit board to inspire aesthetics.

  The first circuit board and the molding layer may contain a ceramic or a metal filler so as to reinforce durability.

  A receiving groove recessed toward the integrated circuit may be formed on a bottom surface of the molding layer, and the second circuit board is received in the receiving groove and separated from a structure positioned below the molding layer. obtain.

  The housing groove and the second circuit board housed in the housing groove can be bent.

  The receiving groove may be formed at the center of the bottom surface of the molding layer.

  The receiving groove may be formed on a side surface of the bottom surface of the molding layer.

  The receiving groove may be formed at one end of the bottom surface of the molding layer.

  The bottom surface of the molding layer may be formed with a coupling portion that protrudes toward the structure or sinks toward the integrated circuit so that the molding layer is coupled to the structure.

  The fingerprint recognition apparatus according to the idea of the present invention further includes a fixing layer so that the second circuit board is fixed to the receiving groove, and the fixing layer is formed between the receiving groove and the second circuit board. Alternatively, it may be formed under the second circuit board so as to face the structure.

  The fixing layer may surround the second circuit board received in the receiving groove.

  The fixing layer may include at least one of an epoxy resin, an acrylic resin, a silicon resin, and a urethane resin.

  The fixing layer may be formed between the receiving groove and the second circuit board so as to cover a part of the second circuit board.

  The second circuit board is formed with at least one of a depressed portion and a punched portion, and at least one of the depressed portion and the punched portion is filled with the molding layer.

  At least one of the depressed portion and the punched portion may be positioned below the integrated circuit so as to correspond to the integrated circuit.

  The molding layer surrounds the second circuit board.

  The fingerprint recognition apparatus according to the present invention may further include a reinforcing layer made of a metal material positioned below the second circuit board or the molding layer.

  The fingerprint recognition device according to the idea of the present invention is an integrated circuit that is electrically connected to at least one sensor electrode, and is located above the integrated circuit, and a signal sensed from the at least one sensor electrode therein is the A first circuit board on which at least one signal movement path is formed to be transmitted to the integrated circuit, the integrated circuit, and the first circuit board to electrically connect the integrated circuit and the first circuit board. And a molding layer that is provided under the first circuit board so as to protect the integrated circuit from the outside and surrounds the integrated circuit and the connecting member.

  A receiving groove that is recessed toward the integrated circuit is formed on the bottom surface of the molding layer, and one end of the first circuit board may be bent so as to face the lower surface of the integrated circuit and received in the receiving groove. .

  One end of the first circuit board may be bent along the molding layer in a direction away from the integrated circuit.

  The first circuit board has a structure in which a plurality of circuit layers to be rearranged are stacked such that a signal sensed from the at least one sensor electrode is transmitted to the integrated circuit. Can include a rigid flex substrate and a rigid flex separation bonded substrate.

  According to another aspect of the present invention, there is provided a method of manufacturing a fingerprint recognition device, wherein a connection member electrically connects a first circuit board provided with an integrated circuit and at least one sensor electrode, and protects the integrated circuit from the outside. Forming a molding layer on the first circuit board to surround the integrated circuit may be included.

  The first circuit board may be formed by stacking a plurality of circuit layers.

  According to another aspect of the present invention, there is provided a method of manufacturing a fingerprint recognition device, wherein a connection member electrically connects a first circuit board provided with an integrated circuit and at least one sensor electrode, and protects the integrated circuit from the outside. A molding layer surrounding the integrated circuit is formed on a first circuit board having a plurality of layers, one end portion is formed as a contact portion in contact with the first circuit board having the plurality of layers, and the other end portion of the connection portion is a second circuit. The plurality of layers of the first circuit board and the second circuit board may be electrically connected to be in contact with the board.

  A method for manufacturing a fingerprint recognition device according to the idea of the present invention is to electrically connect a first circuit board on which an integrated circuit and at least one sensor electrode are provided with a connecting member, and one end portion of the first circuit board having a plurality of layers. A plurality of first circuit boards and the second circuit board are electrically connected so that the other end of the connection part contacts the second circuit board, and the integrated circuit is externally connected. Forming a molding layer surrounding the integrated circuit and the second circuit board on the first circuit board of the plurality of layers so as to protect the circuit board.

  In the electronic device according to the present invention using a fingerprint recognition device, the fingerprint recognition device is an integrated circuit electrically connected to at least one sensor electrode, and is located on the integrated circuit, and the at least one sensor electrode. A first circuit board provided with a first circuit board, a second circuit board electrically connected to the first circuit board, and a lower part of the first circuit board so as to protect the integrated circuit from the outside. And a molding layer surrounding the integrated circuit, and the periphery of the fingerprint recognition device may be curved.

  A receiving groove recessed toward the integrated circuit is formed on the bottom surface of the molding layer, and the second circuit board is received in the receiving groove and separated from the structure.

  The first circuit board and the second circuit board may be integrally formed.

  The fingerprint recognition apparatus may further include a connection unit that electrically connects the first circuit board and the second circuit board.

  The electronic apparatus according to the idea of the present invention may further include a coating layer provided on the first circuit board so as to implement various hues and patterns.

  The molding layer surrounds the second circuit board.

  By using the first circuit board formed of a plurality of circuit layers, it is possible to prevent the integrated circuit drive element from being damaged by separating the integrated circuit drive element vulnerable to external impact from the outside.

  Since the manufacturing process is simpler than the wafer level fan-out packaging process for manufacturing the fingerprint recognition device, the time required for manufacturing can be reduced, and the economy can be improved.

1 is a cross-sectional view illustrating a fingerprint recognition apparatus according to an embodiment of the present invention. 1 is an enlarged view of a part of a fingerprint recognition apparatus according to an embodiment of the present invention. 1 is an enlarged view of a part of a fingerprint recognition apparatus according to an embodiment of the present invention. 1 is a perspective view illustrating an appearance of a fingerprint recognition device according to an embodiment of the present invention. FIG. 4 is a diagram illustrating a bottom surface of the fingerprint recognition apparatus illustrated in FIG. 3. 6 is a diagram illustrating a bottom surface of a fingerprint recognition apparatus according to another embodiment of the present invention. 6 is a diagram illustrating a bottom surface of a fingerprint recognition apparatus according to another embodiment of the present invention. 1 is a diagram illustrating a structure in which an underfill resin layer is included in a fingerprint recognition device according to an embodiment of the present invention. 1 is a diagram illustrating a structure in which a coating layer is included in a fingerprint recognition apparatus according to an embodiment of the present invention. 5 is a flowchart illustrating a method for manufacturing a fingerprint recognition device according to an embodiment of the present invention (Flow Chart). FIG. 6 is a cross-sectional view illustrating a fingerprint recognition device according to another embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating a structure in which a depressed portion is formed on a second circuit board of a fingerprint recognition device according to another embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating a structure in which a punched portion is formed on a second circuit board of a fingerprint recognition device according to another embodiment of the present invention. FIG. 5 is a cross-sectional view illustrating a structure in which a reinforcing layer is included in a fingerprint recognition device according to another embodiment of the present invention. 6 is a flowchart illustrating a method for manufacturing a fingerprint recognition apparatus according to another embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating a fingerprint recognition apparatus according to another embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating a fingerprint recognition apparatus according to another embodiment of the present invention. FIG. 16 is a flowchart showing a manufacturing method of the fingerprint recognition apparatus shown in FIGS. 14 and 15 (Flow Chart). 1 is a perspective view illustrating an electronic apparatus according to an embodiment of the present invention. FIG. 18 is an enlarged view of a part of the electronic device illustrated in FIG. 17.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view illustrating a fingerprint recognition apparatus according to an embodiment of the present invention, and FIGS. 2A and 2B are enlarged views of a part of the fingerprint recognition apparatus according to an embodiment of the present invention.

  As shown in FIGS. 1, 2 a, and 2 b, the fingerprint recognition device 1 may include an integrated circuit 10, a first circuit board 20, a second circuit board 30, a molding layer 40, and a connecting part 50.

  The first circuit board 20 may include at least one sensor electrode 21. At least one sensor electrode 21 senses electrostatic signals derived from fingerprint ridges and valleys. A signal sensed by the at least one sensor electrode 21 is converted into an electrical signal and amplified through an amplifier (not shown), and the fingerprint recognition device through a connector (Connector) such as the connection unit 50 or the second circuit board 30. It can be transmitted to one microcomputer.

  A signal sensed from the at least one sensor electrode 21 is transmitted to the integrated circuit 10 electrically connected to the at least one sensor electrode 21. The integrated circuit 10 serves to calculate a signal sensed from at least one sensor electrode 21.

  The first circuit board 20 positioned on the integrated circuit 10 may have a structure in which a plurality of circuit layers 24, 25, and 26 are stacked. The plurality of circuit layers 24, 25, and 26 included in the first circuit board 20 transmit a signal sensed from at least one sensor electrode 21 to the integrated circuit 10 located below the first circuit board 20 through a rearrangement process. To be. In addition, a driving element (not shown) of the integrated circuit 10 that is easily damaged by an external impact includes a plurality of circuit layers constituting the first circuit board 20 from the surface of the first circuit board 20 that can be contacted by a part of the user's body. Since it can be separated from the surface of the first circuit board 20 by a thickness of 24, 25, 26, it can be protected from external impact.

  At least one signal moving path 23 may be formed on the first circuit board 20 such that a signal sensed from at least one sensor electrode 21 is transmitted to the integrated circuit 10. The at least one signal movement path 23 may include a first circuit layer 24, a second circuit layer 25, and a micro via 27.

  At least one sensor electrode 21 may be positioned on the first circuit layer 24, and at least one electrode 28 may be positioned on the second circuit layer 25 provided below the first circuit layer 24. The first circuit layer 24 and the second circuit layer 25 can be electrically connected by a micro via 27.

  The at least one signal movement path 23 may further include at least one third circuit layer 26. At least one third circuit layer 26 may be located between the first circuit layer 24 and the second circuit layer 25. The first circuit layer 24, the at least one third circuit layer 26, and the second circuit layer 25 may have a structure stacked in the direction of the integrated circuit 10, and the micro via 27 is formed in the first circuit layer 24 and at least one first circuit layer. The third circuit layer 26 and the second circuit layer 25 are electrically connected.

  The first circuit layer 24, at least one third circuit layer 26 and the second circuit layer 25 can be formed in a metal layer, and the micro via 27 can be formed in the resin layer 29. Specifically, the micro via 27 penetrates the resin layer 29 and electrically connects the first circuit layer 24, at least one third circuit layer 26 and the second circuit layer 25.

  The number of the plurality of circuit layers 24, 25, 26 included in the first circuit board 20 is based on the number of metal layers on which the first circuit layer 24, at least one third circuit layer 26 and the second circuit layer 25 are provided. Counting can be performed.

  The number of the plurality of circuit layers 24, 25, and 26 is not limited to three.

  The first circuit board 20 may contain a ceramic or metal filler for durability reinforcement, rigidity reinforcement, thermal expansion coefficient complementation, and dielectric constant control.

  Various hues may be implemented on the upper end of the first circuit board 20 so as to inspire the user's aesthetics in consideration of the design aspect. Specifically, the resin layer 29a positioned at the upper end of the first circuit board 20 breathes the aesthetics of the user and has various hues so as to hide at least one sensor electrode 21 positioned inside the first circuit board 20. Can be implemented.

  The at least one sensor electrode 21 provided on the first circuit layer 24 is adjacent to the surface of the first circuit board 20 exposed to the outside so that the body part of the user can come into contact therewith. It can be provided inside the substrate 20. Further, at least one sensor electrode 21 may be provided on the surface of the first circuit board 20 so that a part of the user's body can be in direct contact.

  The second circuit board 30 may be provided below the integrated circuit 10 and electrically connected to the first circuit board 20. Accordingly, a signal sensed from at least one sensor electrode 21 is transmitted to the integrated circuit 10 through at least one signal moving path 23 formed on the first circuit board 20, and a signal calculated by the integrated circuit 10 is a second circuit. It is transmitted to the substrate 30. A signal transmitted to the second circuit board 30 may be transmitted to another electronic component through an output terminal (not shown) formed at one end of the second circuit board 30.

  The second circuit board 30 includes a hard board (Printed Circuit Board), a soft board (Flexible Printed Circuit Board), a rigid flex board (a board having all of a part having rigidity and a soft part), and a rigid flex separation bonding board (hard board). And a substrate in which a soft substrate and a portion having hardness and a portion having softness coexist.

  The molding layer 40 is provided under the first circuit board 20 and protects the integrated circuit 10 from an external environment such as external impact and temperature / humidity change. The molding layer 40 can surround the integrated circuit 10.

  The molding layer 40 may contain a ceramic or metal filler for reinforcing the rigidity, complementing the thermal expansion coefficient of the molding layer 40 and controlling the dielectric constant.

  The connecting part 50 can electrically connect the first circuit board 20 and the second circuit board 30. The connecting part 50 may include a through mold via that passes through the molding layer 40 and electrically connects the first circuit board 20 and the second circuit board 30. The connection part 50 may be filled with a conductive material so that the signal of the integrated circuit 10 is transmitted to the second circuit board 30.

  The connecting part 50 can be bonded to the second circuit board 30 by one of gold-tin eutectic bonding, ACA / NCA bonding, solder bonding, and gold-gold bonding. Solder joints can include through-hole soldering and hot bar soldering.

  The first circuit board 20 and the integrated circuit 10 can be electrically connected by a connection member 60. Specifically, the electrode 28 and the integrated circuit 10 provided in the second circuit layer 25 are connected so that a signal sensed from the at least one sensor electrode 21 is transmitted to the integrated circuit 10 through the at least one signal moving path 23. The member 60 can be electrically connected. The connection member 60 may include a solder bump.

  As illustrated in FIGS. 3 to 5 b, a receiving groove 70 that is recessed toward the integrated circuit 10 may be formed on the bottom surface of the molding layer 40. The second circuit board 30 is received in the receiving groove 70 and may be separated from a structure (not shown) located below the molding layer 40.

  When the fingerprint recognition device 1 is used as a mechanical button, the structure located under the molding layer 40 may include a dome switch (not shown).

  When the fingerprint recognition device 1 is used as a mechanical button, the bottom surface of the molding layer 40 may be in contact with a structure located under the molding layer 40 or may be pressurized by a structure located under the molding layer 40. If the connecting part 50 or the second circuit board 30 is in contact with a structure, the connecting part 50 or the second circuit board 30 may be damaged. Therefore, the second circuit board 30 is formed on the bottom surface of the molding layer 40. It can be accommodated in the accommodating groove 70 while avoiding the lower pressure concentration portion (the portion where the bottom surface of the molding layer is in contact with the structure or the portion where the pressure is applied to the molding layer by the structure located below the molding layer) 80.

  In general, the lower pressure concentration portion 80 may be formed at the center of the bottom surface of the molding layer 40. The receiving groove 70 may be formed across the lower pressure concentration portion 80 formed at the center of the bottom surface of the molding layer 40. That is. Lower pressure concentration sites 80 may be located on the left and right sides of the receiving groove 70. In addition, the receiving groove 70 may be formed on the side surface portion of the bottom surface of the molding layer 40 or at one end portion of the bottom surface of the molding layer 40 so as to avoid the lower pressure concentration portion 80 formed in the central portion.

  The lower pressure concentration portion 80 may be formed at the edge portion of the bottom surface of the molding layer 40. The lower pressure concentration portion 80 can be formed at various positions according to the structure located below the molding layer 40, and is not limited to the central portion of the bottom surface of the molding layer 40 or the edge portion of the bottom surface of the molding layer 40.

  The housing groove 70 can be bent so as to avoid the lower pressure concentration portion 80, and the second circuit board 30 housed in the folded housing groove 70 can also be folded.

  On the bottom surface of the molding layer 40, a coupling portion that protrudes toward the structure or sinks toward the integrated circuit 10 so that a structure (not shown) located below the molding layer 40 and the molding layer 40 are coupled to each other. (Not shown) may be formed.

  The fingerprint recognition device 1 can further include a fixed layer 90. The fixing layer 90 may be formed between the receiving groove 70 and the second circuit board 30 so that the second circuit board 30 can be fixed to the receiving groove 70. The fixing layer 90 is formed below the second circuit board 30 so as to face a structure (not shown) located below the molding layer 40 and supports the second circuit board 30 received in the receiving groove 70. can do. The fixed layer 90 can surround the entire second circuit board 30 accommodated in the accommodation groove 70. The fixed layer 90 may be formed between the receiving groove 70 and the second circuit board 30 so as to cover a part of the second circuit board 30. The fixing layer 90 may be formed in various forms so that the second circuit board 30 is not detached from the receiving groove 70.

  The fixing layer 90 may include at least one of an epoxy resin, an acrylic resin, a silicon resin, and a urethane resin.

  FIG. 6 illustrates a structure in which an underfill resin layer is included in a fingerprint recognition apparatus according to an embodiment of the present invention.

  As shown in FIG. 6, the fingerprint recognition device 1 a may further include an underfill resin layer 200. The underfill resin layer 200 is formed on the lower surface of the first circuit board 20 facing the integrated circuit 10 and the integrated circuit so as to reinforce the durability of the connection member 60 that electrically connects the first circuit board 20 and the integrated circuit 10. 10 may be formed. The underfill resin layer 200 can be formed so as to surround the connection member 60.

  FIG. 7 is a view illustrating a structure in which a coating layer is included in a fingerprint recognition apparatus according to an embodiment of the present invention.

  As shown in FIG. 7, the fingerprint recognition device 1 b may further include a paint layer 300.

  The coating layer 300 may be provided on the first circuit board 20. Various colors and patterns can be formed on the coating layer 300. Various patterns and patterns that can be formed on the paint layer 300 can be displayed on the paint layer 300 by at least one of printing, engraving, and laser processing. Alternatively, it may be attached to the paint layer 300 in the form of a sticker. The display method of a pattern or a pattern is not limited to the said example.

  FIG. 8 is a flow chart illustrating a method for manufacturing a fingerprint recognition apparatus according to another embodiment of the present invention.

  As shown in FIG. 8, the manufacturing method of the fingerprint recognition apparatus electrically connects the integrated circuit and the first circuit board on which at least one sensor electrode is provided with a connecting member (P1), and protects the integrated circuit from the outside. A molding layer surrounding the integrated circuit is formed on the first circuit board having a plurality of layers (P2), and a connecting portion having one end in contact with the first circuit substrate having the plurality of layers is formed (P3). The method may include electrically connecting the plurality of layers of the first circuit board and the second circuit board so that the end portion is in contact with the second circuit board (P4).

  The molding layer can be formed using a mold. Specifically, after the integrated circuit and the first circuit board provided with at least one sensor electrode are electrically connected by the connecting member, a molding layer is formed by covering the mold. By forming the accommodation groove in the mold and then molding, the accommodation groove capable of accommodating the second circuit board can be formed on the bottom surface of the molding layer.

  FIG. 9 is a cross-sectional view illustrating a fingerprint recognition apparatus according to another embodiment of the present invention, and FIG. 10 illustrates a structure in which a depression is formed on the second circuit board of the fingerprint recognition apparatus according to another embodiment of the present invention. It is sectional drawing shown in figure. FIG. 11 is a cross-sectional view illustrating a structure in which a punched portion is formed on a second circuit board of a fingerprint recognition apparatus according to another embodiment of the present invention. FIG. 12 illustrates a fingerprint recognition apparatus according to another embodiment of the present invention. It is sectional drawing which illustrated the structure in which the reinforcement layer was included. Hereinafter, the description which overlaps with the content demonstrated in FIGS. 1-8 is abbreviate | omitted. Reference numerals not shown refer to FIGS.

  As shown in FIGS. 9 to 12, the fingerprint recognition device 2 may include an integrated circuit 10, a first circuit board 20, a second circuit board 30, a molding layer 40, and a connecting part 50.

  The first circuit board 20 positioned on the integrated circuit 10 may have a structure in which a plurality of circuit layers 24, 25, and 26 are stacked.

  The second circuit board 30 may be provided below the integrated circuit 10 and electrically connected to the first circuit board 20. Therefore, a signal sensed from at least one sensor electrode 21 is transmitted to the integrated circuit 10 through at least one signal moving path 23 formed on the first circuit board 20, and the signal calculated by the integrated circuit 10 is the second signal. It is transmitted to the circuit board 30. A signal transmitted to the second circuit board 30 may be transmitted to another electronic component through an output terminal (not shown) formed at one end of the second circuit board 30.

  The second circuit board 30 may be formed with at least one of the depressed portion 31 and the punched portion 31a.

  The second circuit board 30 may be formed with a depressed portion 31 that is depressed away from the first circuit board 20.

  The depression 31 may be positioned below the integrated circuit 10 so as to correspond to the integrated circuit 10.

  Alternatively, a punched portion 31 a can be formed on the second circuit board 30.

  The punched portion 31 a can be positioned below the integrated circuit 10 so as to correspond to the integrated circuit 10. By forming the punched portion 31 a in the second circuit board 30, the second circuit board 30 can be positioned discontinuously under the integrated circuit 10.

  Alternatively, both the depressed portion 31 and the punched portion 31 a can be formed on the second circuit board 30.

  The depressed portion 31 and the punched portion 31a can be filled with a molding layer 40 for rigidity reinforcement. That is, the rigidity of the fingerprint recognition device 2 can be reinforced by filling the depressed portion 31 and the punched portion 31a located at the lower part of the integrated circuit 10 with the molding layer 40 made of a hard material.

  The molding layer 40 is provided under the first circuit board 20 and protects the integrated circuit 10 from an external environment such as external impact and ON humidity change. The molding layer 40 can surround the integrated circuit 10.

  The molding layer 40 can surround not only the integrated circuit 10 but also the second circuit board 30 so as to protect the second circuit board 30 from an external environment such as an external impact and a change in temperature and humidity. Accordingly, the molding layer 40 can be positioned on the upper and lower portions of the second circuit board 30.

  The housing groove 70 can be omitted.

  The connection part 50 includes at least one of a through mold via and a solder ball that electrically connect the first circuit board 20 and the second circuit board 30 through the molding layer 40. be able to.

  The fingerprint recognition device 2 can further include a reinforcing layer 400.

  The reinforcing layer 400 may be positioned under the second circuit board 30 so as to improve the durability of the fingerprint recognition device 2.

  The reinforcing layer 400 may be positioned below the molding layer 40.

  The reinforcing layer 400 may have a metal material. The metal material may include stainless steel (SUS).

  FIG. 13 is a flowchart illustrating a method of manufacturing a fingerprint recognition apparatus according to another embodiment of the present invention.

  As shown in FIG. 13, the manufacturing method of the fingerprint recognition apparatus electrically connects the integrated circuit and the first circuit board on which at least one sensor electrode is provided with a connecting member (R1), and one end portion has a plurality of layers. A connection part that contacts the first circuit board is formed (R2), and the first circuit board and the second circuit board are electrically connected to each other such that the other end of the connection part contacts the second circuit board ( R3), forming a molding layer (R4) surrounding the integrated circuit and the second circuit board on the plurality of first circuit boards so as to protect the integrated circuit from the outside.

  FIG. 14 is a cross-sectional view illustrating a fingerprint recognition apparatus according to another embodiment of the present invention.

  As shown in FIG. 14, the fingerprint recognition device 1c may include an integrated circuit 10a, a first circuit board 20a, a connection member 60a, and a molding layer 40a. In FIG. 9, the same description for the above-described components can be omitted.

  The integrated circuit 10a is a component that performs arithmetic processing on a signal sensed from at least one sensor electrode 21a, and the integrated circuit 10a is electrically connected to at least one sensor electrode 21a.

  The first circuit board 20a is positioned above the integrated circuit 10a, and at least one signal movement path 23a is formed therein so that a signal sensed from at least one sensor electrode 21a is transmitted to the integrated circuit 10a. obtain. The first circuit board 20a may have a structure in which a plurality of circuit layers to be rearranged are stacked so that a signal sensed from at least one sensor electrode 21a is transmitted to the integrated circuit 10a. And a rigid flex separation bonded substrate.

  At least one sensor electrode 21a may be provided inside the first circuit board 20a so as to be close to the surface of the first circuit board 20a.

  The first circuit board 20a can be bent so as to face each other across the integrated circuit 10a. Specifically, one end of the first circuit board 20a is received in a receiving groove 70a formed on the bottom surface of the molding layer 40a provided at the lower part of the first circuit board 20a so as to protect the integrated circuit 10a from the outside. obtain. An output terminal (not shown) is formed at one end of the first circuit board 20a received in the receiving groove 70a so that a signal sensed from at least one sensor electrode 21a is transmitted to another electronic device. Can be done. Since the first circuit boards 20a provided at the upper part and the lower part of the integrated circuit 10a are integrated, a connecting portion for electrically connecting the first circuit boards 20a provided at the upper part and the lower part of the integrated circuit 10a is omitted. can do.

  The integrated circuit 10a and the first circuit board 20a can be electrically connected by a connection member 60a. The connection member 60a may be provided between the integrated circuit 10 and the first circuit board 20a located on the integrated circuit 10a. The connection member 60 can include a solder bump.

  FIG. 15 is a cross-sectional view illustrating a fingerprint recognition apparatus according to another embodiment of the present invention. As shown in FIG. 15, the fingerprint recognition device 1d may include an integrated circuit 10b, a first circuit board 20b, a connection member 60b, and a molding layer 40b. In FIG. 10, the same description for the above-described components can be omitted.

  The first circuit board 20b is positioned above the integrated circuit 10b, and at least one signal moving path is provided in the first circuit board 20b so that a signal sensed from at least one sensor electrode 21b is transmitted to the integrated circuit 10b. 23b can be formed.

  The molding layer 40b is provided below the first circuit board 20b so as to protect the integrated circuit 10b from the outside, and surrounds the connection member 60b and the integrated circuit 10b that electrically connect the integrated circuit 10b and the first circuit board 20b. be able to.

  One end of the first circuit board 20b can be bent in a direction away from the integrated circuit 10b along the molding layer 40b. When one end of the first circuit board 20b is bent away from the integrated circuit 10b, a separate receiving groove (not shown) may not be formed on the bottom surface of the molding layer 40b.

  FIG. 16 is a flowchart (Flow Chart) showing a method of manufacturing the fingerprint recognition device according to FIGS. 14 and 15.

  As shown in FIG. 16, in the method of manufacturing the fingerprint recognition device, the integrated circuit and the first circuit board on which at least one sensor electrode is provided are electrically connected by a connecting member (S1), and the integrated circuit is protected from the outside. Forming a molding layer surrounding the integrated circuit on the first circuit board (S2).

  FIG. 17 is a perspective view illustrating an electronic apparatus according to an embodiment of the present invention. FIG. 18 is an enlarged view of a part of the electronic apparatus illustrated in FIG.

  As shown in FIGS. 17 and 18, the electronic device 100 includes a bar-shaped body. However, the body of the electronic device 100 is not limited to a bar shape, and can be applied to various structures such as a slide type, a folder type, a swing type, and a swivel type in which the bodies are coupled so as to be relatively movable.

  The body includes an outer casing. The body may be composed of a front casing 101, a rear casing 102, and a battery cover (not shown). Various electronic components are built in a space formed between the front casing 101 and the rear casing 102. At least one intermediate casing may be further disposed between the front casing 101 and the rear casing 102.

  The casing may be formed by injecting synthetic resin, or may be formed of a metal material such as a metal material such as stainless steel (STS), aluminum (Al), or titanium (Ti).

  A display module 104, a sound output unit 105, a camera 106, a user input unit 107, a microphone (not shown), an interface (not shown), and the like can be arranged on the body of the electronic device, mainly the front casing 101.

  The display module 104 occupies most of the main surface of the front casing 101. The sound output unit 105 and the camera 106 are arranged in an area adjacent to one end of the both ends of the display module 104, and a user input unit 107 and a microphone (not shown) are arranged in an area adjacent to the other end. Be placed. A user input unit 107, an interface (not shown), and the like may be disposed on the side surfaces of the front casing 101 and the rear casing 102.

  The user input unit 107 is operated to receive an instruction to control the operation of the electronic device 100, and can include a plurality of operation units (not shown). The operation unit is sometimes referred to as an operation unit (Manipulating port), and any method can be adopted as long as the user can operate while adding a tactile feeling (Tactile manner). .

  The user input unit 107 may be formed with a home key 108 in which a fingerprint recognition device (not shown) is built. The fingerprint recognition device is provided with at least one sensor electrode, and the at least one sensor electrode senses a difference in electrostatic capacitance (electrostatic signal) generated by a difference in electrical characteristics between a valley and a peak of the fingerprint. The electrostatic signal may be converted into an electrical signal, amplified through an amplifier (not shown), and transmitted to the microcomputer of the electronic device 100 through a connector such as a printed circuit board (not shown).

  The fingerprint recognition device 1e can be used as the home key 108 by itself without a separate packaging process.

  The periphery of the fingerprint recognition device 1e can be curved through numerical processing.

  In order to perform numerical processing, the fingerprint recognition device 1e must be positioned on a separate structure (not shown). For efficient numerical processing, a fixing portion (not shown) may be formed on the bottom surface of the fingerprint recognition device 1e so that the fingerprint recognition device 1e is fixed on a separate structure. Specifically, the fixing part is formed on the bottom surface of the molding layer of the fingerprint recognition device 1e, and may have a shape protruding toward a separate structure or recessed toward the inside of the fingerprint recognition device 1e.

  The fingerprint recognition device may be used to support a user authentication mode using an electric field, a capacitor, a thermistor, or the like.

  The user authentication mode means a mode for performing user authentication by contacting a body part such as a finger with the fingerprint recognition sensor. For example, when the user puts his / her finger on the fingerprint recognition device, the fingerprint recognition sensor provided in the fingerprint recognition device recognizes the user's fingerprint and compares the fingerprint data already stored with the user. It is verified whether the user is a legitimate user having content usage authority.

  The fingerprint recognition device can be provided in any device that requires a personal authentication procedure. For example, electronic devices including information terminals, smartphones, game machines, PMPs, tablet PCs, cameras, etc., medical devices, and ATM machines can be included.

  The foregoing has illustrated and described specific embodiments. However, the present invention is not limited to the embodiments described above, and those who have ordinary knowledge in the technical field to which the invention belongs will depart from the gist of the technical idea of the invention described in the following claims. It is possible to implement various changes.

Claims (20)

An integrated circuit electrically connected to at least one sensor electrode;
A first circuit board located on the integrated circuit and provided with the at least one sensor electrode;
A second circuit board electrically connected to the first circuit board and positioned below the integrated circuit;
A molding layer provided under the first circuit board so as to protect the integrated circuit from the outside and surrounding the integrated circuit; and a connecting part for electrically connecting the first circuit board and the second circuit board; A fingerprint recognition device comprising:   The first circuit board has a structure in which a plurality of circuit layers to be rearranged are stacked so that a signal sensed from the at least one sensor electrode is transmitted to the integrated circuit. Item 2. The fingerprint recognition device according to Item 1.   The fingerprint recognition apparatus according to claim 2, wherein the at least one sensor electrode is provided on a surface of the first circuit board exposed to the outside. In Section 2,
The fingerprint recognition apparatus, wherein the at least one sensor electrode is provided in the first circuit board so as to be adjacent to a surface of the first circuit board exposed to the outside. At least one signal movement path is formed on the first circuit board so that a signal sensed from the at least one sensor electrode is transmitted to the integrated circuit.
The at least one signal movement path is:
A first circuit layer on which the at least one sensor electrode is located;
3. The method according to claim 2, further comprising: a second circuit layer in which an electrode provided at a lower portion of the first circuit board is located; and a micro via that electrically connects the first circuit and the second circuit. The fingerprint recognition device described. The at least one signal movement path is:
And further comprising at least one third circuit layer located between the first circuit layer and the second circuit layer,
6. The fingerprint recognition apparatus according to claim 5, wherein the micro via electrically connects the first circuit layer having a stacked structure, the at least one third circuit layer, and the second circuit layer.   The electrode and the integrated circuit are electrically connected by a connecting member so that a signal sensed from the at least one sensor electrode is transmitted to the integrated circuit through the at least one signal moving path. The fingerprint recognition device according to claim 5. A receiving groove that is depressed toward the integrated circuit is formed on the bottom surface of the molding layer,
The fingerprint recognition apparatus according to claim 1, wherein the second circuit board is received in the receiving groove and separated from a structure located under the molding layer.   9. The fingerprint recognition apparatus according to claim 8, wherein the housing groove and the second circuit board housed in the housing groove are bent.   The fingerprint recognition apparatus according to claim 8, wherein the receiving groove is formed at a central portion of a bottom surface of the molding layer.   The fingerprint recognition apparatus according to claim 8, wherein the receiving groove is formed on a side surface of a bottom surface of the molding layer.   The fingerprint recognition apparatus according to claim 8, wherein the receiving groove is formed at one end of the bottom surface of the molding layer. At least one of the depressed portion and the punched portion is formed on the second circuit board,
The fingerprint recognition apparatus according to claim 1, wherein at least one of the depressed portion and the punched portion is filled with the molding layer. A receiving groove that is depressed toward the integrated circuit is formed on the bottom surface of the molding layer,
The fingerprint recognition apparatus according to claim 1, wherein one end of the first circuit board is bent so as to face a lower surface of the integrated circuit and is received in the receiving groove.   The fingerprint recognition apparatus according to claim 1, wherein one end of the first circuit board is bent in a direction away from the integrated circuit along the molding layer. The first circuit board has a structure in which a plurality of circuit layers to be rearranged are stacked so that a signal sensed from the at least one sensor electrode is transmitted to the integrated circuit.
The fingerprint recognition apparatus according to claim 1, wherein the first circuit board includes a rigid flex board and a rigid flex separation bonded board. Electrically connecting the integrated circuit and the first circuit board on which at least one sensor electrode is provided with a connecting member;
A method of manufacturing a fingerprint recognition device, comprising: forming a molding layer surrounding the integrated circuit on the first circuit board so as to protect the integrated circuit from the outside.   The method of claim 17, wherein the first circuit board is formed by laminating a plurality of circuit layers. In electronic devices that use fingerprint recognition devices,
The fingerprint recognition device
An integrated circuit electrically connected to at least one sensor electrode;
A first circuit board located on the integrated circuit and provided with the at least one sensor electrode;
A second circuit board electrically connected to the first circuit board and positioned below the integrated circuit; and the integrated circuit provided below the first circuit board to protect the integrated circuit from the outside. A molding layer surrounding the
An electronic apparatus characterized in that a periphery of the fingerprint recognition device forms a curved surface. A receiving groove that is depressed toward the integrated circuit is formed on the bottom surface of the molding layer,
The electronic apparatus according to claim 19, wherein the second circuit board is received in the receiving groove and separated from the structure.

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