JP2017228744A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device capable of improving the connection reliability between an electronic component and a circuit board in a region in which a sealing resin part is not formed and the electronic component is mounted.SOLUTION: An electronic device 100 includes a circuit board 10, an external component 20 and built-in components 22 and 23 mounted on the circuit board 10, a sealing resin part 30 sealing the built-in components 22 and 23, and a case 40. The external component 20 is provided outside the sealing resin part 30. The electronic device 100 also includes a sealing region in which the sealing resin part 30 and a first through hole arranged along a sidewall of the sealing resin part 30 are formed, and a non-sealing region in which the sealing resin part 30 and the first through hole are not formed and the external component 20 and a third through hole 14 are formed. The case 40 includes a fixing terminal 44 provided in a position facing the third through hole, mechanically connected to the third through hole, and supporting the non-sealing region.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic device including a circuit board on which electronic components are mounted and a mounted body to which the circuit board is attached.

  Conventionally, there is an electronic device disclosed in Patent Document 1. In this electronic device, a circuit board on which electronic components are mounted and sealed with a sealing resin portion is housed in a housing recess so that one surface faces the bottom surface. The electronic device has a plurality of through-holes arranged in two opposite sides of the circuit board along the sealing resin portion, and fixing holes serving as through holes are formed at the four corners of the circuit board. Yes.

  In the electronic device, a plurality of connection terminals protruding from the bottom surface of the case are inserted into the through hole and electrically connected to the through hole via solder. Further, in the electronic device, the mechanical connection portion protruding from the bottom surface of the case is fitted into the fixing hole, the tip of the mechanical connection portion is heat staked, and the circuit board is supported by the case.

JP 2015-26820 A

  By the way, an electronic device may include an electronic component that is not suitable for sealing with a sealing resin portion. In this case, in the electronic device, electronic components are mounted around the sealing resin portion on the circuit board. And in the electronic device of patent document 1, it is possible to extend a circuit board so that the electronic component which is not suitable for sealing can be mounted. Therefore, the circuit board can be divided into a region where the sealing resin portion is formed and a region where the sealing resin portion is not formed and the electronic component is mounted.

  In addition, vibration may propagate from the outside in the electronic device. As described above, in the electronic device disclosed in Patent Document 1, a plurality of through holes are arranged on two opposite sides of the circuit board along the sealing resin portion, and are connected to a plurality of connection terminals protruding from the case via solder. Has been. For this reason, even if vibration propagates to the electronic device, the region where the sealing resin portion is formed is difficult to vibrate.

  On the other hand, the region where the sealing resin portion is not formed and the electronic component is mounted is not connected to the terminal protruding from the case, and thus easily vibrates when vibration propagates to the electronic device. Therefore, there is a possibility that the reliability of connection between the electronic component and the circuit board is lowered due to vibration without the sealing resin portion formed.

  The present invention has been made in view of the above problems, and provides an electronic device that can improve the connection reliability between an electronic component and a circuit board in a region where the sealing resin portion is not formed and the electronic component is mounted. The purpose is to do.

In order to achieve the above object, the present invention provides:
A conductor pattern that has one surface (11a) and an opposite surface (11b), and is a part of the wiring, and a plurality of first hole connection portions (12) that are electrically connected to the conductor pattern are formed. A circuit board (10),
A first electronic component (22, 23) mounted on one side of the substrate;
A sealing resin portion (30) formed on one side of the substrate and sealing the first electronic component;
A second electronic component (20) mounted on the substrate without being sealed in the sealing resin portion, and an electronic structure including:
A case (40) that contains an electronic structure and includes a fixing part that fixes the circuit board at at least three of the corners of the circuit board,
The electronic structure is
A sealing region (A1) in which a sealing resin portion and a first hole-shaped connecting portion disposed along the side wall of the sealing resin portion are formed;
The sealing resin portion and the first hole-shaped connecting portion are not formed, the second electronic component is mounted, and the second hole-shaped connecting portion (14) different from the first hole-shaped connecting portion is formed. Sealing regions (A21, A22),
The case is
A rod-shaped connection terminal (42) provided at a position facing the first hole-shaped connection portion and electrically connected to the first hole-shaped connection portion in a state of being inserted into the first hole-shaped connection portion;
A rod-like shape provided at a position opposite to the second hole-shaped connecting portion and mechanically connected to the second hole-shaped connecting portion while being inserted into the second hole-shaped connecting portion to support the non-sealing region. And a support terminal (44).

  Thus, the present invention includes a sealing region and a non-sealing region. Even when vibration is propagated from the outside, the sealing region is less likely to vibrate due to the relatively heavy sealing resin portion. Moreover, since the 1st hole-shaped connection part arrange | positioned along the side wall of the sealing resin part is being fixed to the case via the connection terminal, a sealing area | region is hard to vibrate. Furthermore, although the non-sealing region does not include a sealing resin portion that is relatively heavy, the supporting terminal is mechanically connected to the second hole-shaped connecting portion and is supported by the case. For this reason, even if it is a case where a vibration propagates from the outside, this invention can suppress that a non-sealing area | region vibrates. Therefore, the present invention can improve the connection reliability between the second electronic component and the circuit board.

  It should be noted that the reference numerals in parentheses described in the claims and in this section indicate the correspondence with the specific means described in the embodiments described later as one aspect, and the technical scope of the invention It is not limited.

It is a top view which shows schematic structure of the electronic device in 1st Embodiment. It is sectional drawing which follows the II-II line of FIG. It is sectional drawing which follows the III-III line of FIG. It is a top view which shows schematic structure of the electronic device in 2nd Embodiment. It is a top view which shows schematic structure of the electronic device in 3rd Embodiment. It is sectional drawing which shows schematic structure of the electronic device in 4th Embodiment. It is a top view which shows schematic structure of the electronic device in 5th Embodiment. It is a top view which shows schematic structure of the electronic device in 6th Embodiment.

  Hereinafter, a plurality of embodiments for carrying out the invention will be described with reference to the drawings. In each embodiment, portions corresponding to the matters described in the preceding embodiment may be denoted by the same reference numerals and redundant description may be omitted. In each embodiment, when only a part of the configuration is described, the other configurations described above can be applied to other portions of the configuration.

(First embodiment)
The electronic device 100 according to the first embodiment of the present invention will be described with reference to FIGS. The electronic device 100 is mounted on a vehicle such as an automobile, for example, and is applied as a device for controlling each device for the vehicle. For this reason, the vibration of the vehicle propagates through the electronic device 100. In other words, the electronic device 100 propagates, for example, vibration caused by a road surface state when the vehicle travels, vibration caused by the operation of the engine, vibration caused by the operation of the electric motor, and the like as the vibration of the vehicle. For this reason, it can be said that the component of the electronic device 100 resonates with the vibration of the vehicle.

  Since the vehicle is mounted with the electronic device 100, it can be said that the vehicle is a mounted portion. Moreover, a to-be-mounted part is not limited to a vehicle, A moving body other than a vehicle etc. may be sufficient.

  As shown in FIGS. 1 and 2, the electronic device 100 includes a circuit board 10, an external component 20, built-in components 22, 23, a sealing resin portion 30, a case 40, and the like. The external component 20 and the built-in components 22 and 23 are circuit components mounted on the circuit board 10. Therefore, in the following, when it is not necessary to distinguish between the external component 20 and the built-in components 22 and 23, the external component 20 and the built-in component 22 may be collectively referred to as a mounted component.

  Further, as will be described later, the mounting component, the sealing resin portion 30, and the circuit board 10 on which the mounting component is mounted and provided with the sealing resin portion 30 are integrally configured to form an electronic structure. Yes. Therefore, in the following, a device in which the mounting component, the sealing resin portion 30, and the circuit board 10 on which the mounting component is mounted and provided with the sealing resin portion 30 is integrally configured is referred to as an electronic structure. For this reason, it can be said that the electronic device 100 includes the electronic structure and the case 40.

  The circuit board 10 is a board in which conductive wiring is formed on an electrically insulating resin member. For example, the circuit board 10 may include a multilayer board that includes a core layer and a build-up layer and in which a conductor pattern that is a part of wiring is laminated. Thus, the circuit board 10 is a so-called printed wiring board.

  The circuit board 10 has a rectangular parallelepiped shape having one surface 11a and an opposite surface 11b which is the back surface of one surface. Therefore, the circuit board 10 has a rectangular shape in the shape of the one surface 11a and the opposite surface 11b and the shape of the four side walls.

  The circuit board 10 has a land 11a formed on one surface 11a as a part of the conductor pattern. Built-in components 22 and 23 to be described later are mounted on the lands of the circuit board 10. In the following, the land of the circuit board 10 is simply referred to as a land.

  The circuit board 10 is provided with a first through hole 12 to a third through hole 14 penetrating from one surface 11a to the opposite surface 11b. That is, the circuit board 10 is provided with a through hole in the resin member of the circuit board 10, and a conductor which is a part of the wiring is formed on the wall surface forming the through hole, so that the first through hole 12 to the third through A through hole 14 is formed. In other words, the circuit board 10 is provided with a first through hole 12 to a third through hole 14 that are subjected to metal plating or the like connected to the conductor pattern.

  The first through hole 12 is provided for electrically and mechanically connecting the circuit board 10 and the case 40. The first through hole 12 corresponds to a first hole-shaped connection portion. More specifically, the first through hole 12 is electrically and mechanically connected to the board connecting terminal 42 via the first solder 51 in a state where the board connecting terminal 42 of the case 40 is inserted. In FIG. 1, the first solder 51 is not shown. Further, in FIG. 1, illustration of the second solder 52 and the third solder 53 described later is also omitted. The board connection terminal 42 and the first through hole 12 may be electrically and mechanically connected with a conductive connection material different from solder.

  A plurality of first through holes 12 are arranged side by side along two opposite sides of the sealing resin portion 30 described later. Here, the first through holes 12 provided at a plurality of locations along each of the two longitudinal side walls are employed on both sides of the sealing resin portion 30. That is, the circuit board 10 is provided with a plurality of first through holes 12 along one longitudinal side wall of the sealing resin portion 30, and is provided with a plurality of first through holes 12 along the other longitudinal side wall. ing.

  For this reason, it can be said that the 1st through hole 12 is provided so that the sealing resin part 30 may be inserted | pinched. Note that the number of first through holes 12 to be formed varies depending on the circuit scale of the circuit board 10. That is, in the circuit board 10, the number of first through holes 12 increases as the circuit scale increases, and the number of first through holes 12 decreases as the circuit scale decreases. For example, the circuit board 10 may be provided with tens to hundreds of first through holes 12.

  In the present embodiment, the stress applied to the first solder 51 is relieved based on the arrangement of the first through holes 12 so that the breakage of the first solder 51 can be suppressed. That is, the electronic device 100 can suppress the vibration of the region where the sealing resin portion 30 is provided in the circuit board 10 by providing the plurality of first through holes 12 along the longitudinal side wall of the sealing resin portion 30. The stress applied to the first solder 51 can be relaxed.

  Furthermore, as shown in FIG. 1, the first through holes 12 may be provided in a plurality of rows along each of the two longitudinal side walls. Here, an example in which the first through holes 12 are provided in two rows is adopted. However, the first through holes 12 may be provided one by one, or may be provided by three or more rows.

  Each of the plurality of first through holes 12 is provided so that the distance between the first through holes 12 adjacent in the direction along the longitudinal side wall is the shortest while maintaining electrical and structural reliability. May be. That is, the interval between the first through holes 12 is such that the first solders 51 formed in the adjacent first through holes 12 are not in contact with each other, the resin member between the adjacent first through holes 12 is not cracked, and , May be provided to be the shortest. Further, each of the plurality of first through holes 12 may be provided from the end of the longitudinal side wall to the end with the shortest distance from the adjacent first through holes 12 in this way.

  Each of the plurality of first through holes 12 is preferably provided at equal intervals with the first through holes 12 adjacent in the direction along the longitudinal side wall, but is not particularly limited.

  The second through hole 13 is provided for electrically and mechanically connecting the circuit board 10 and the external component 20. The second through hole 13 corresponds to a third hole-shaped connection portion. As will be described later, in this embodiment, an external component 20 that is a through-hole mounting component having a component terminal 21 is employed. Therefore, as shown in FIG. 3, the second through hole 13 is electrically and mechanically connected to the component terminal 21 via the second solder 52 in a state where the component terminal 21 is inserted. The component terminal 21 and the second through hole 13 may be electrically and mechanically connected with a conductive connection material different from solder.

  The number of the second through holes 13 required for electrical connection between the circuit board 10 and the external component 20 is provided. Here, an example in which the second through holes 13 are provided at a plurality of locations along one short side wall of the sealing resin portion 30 is employed. However, when a surface mount component is employed as the external component 20, the circuit board 10 may not be provided with the second through hole 13.

  The third through hole 14 is provided for electrically and mechanically connecting the circuit board 10 and the case 40. The third through hole 14 corresponds to a second hole-shaped connection portion. As shown in FIG. 2, the third through hole 14 is electrically and mechanically connected to the fixing terminal 44 via the third solder 53 in a state where the fixing terminal 44 is inserted. Note that the fixing terminal 44 and the third through hole 14 may be electrically and mechanically connected with a conductive connecting material different from solder.

  Further, the third through hole 14 is provided at a plurality of locations along one short side wall of the sealing resin portion 30, similarly to the second through hole 13. Further, the third through hole 14 is provided on the same virtual straight line B <b> 1 as the second through hole 13. Since this virtual straight line B1 is a straight line on which the second through hole 13 and the third through hole 14 are formed, it can also be said to be a forming line B1.

  As will be described later, the second through hole 13 and the third through hole 14 can be connected to the component terminal 21 and the fixing terminal 44 by drag soldering. In the drag soldering, a drag soldering tool is moved to perform soldering.

  Therefore, in the case where the second through hole 13 and the third through hole 14 are provided on the same forming line B1, the electronic device 100 moves the tool along the forming line B1 so that the second through hole 13 and the third through hole 14 are moved to the second forming hole B1. The through hole 13 and the third through hole 14 can be soldered. That is, the electronic device 100 is preferable because it can simplify the movement of the tool when performing drag soldering.

  Further, it is preferable that the circuit board 10 has no solder for connecting the surface-mounted element and the land at a position along the formation line B1 on the one surface 11a or the opposite surface 11b. The surface-mount element is a surface-mount type circuit element. The solder connecting the surface mount element and the land can also be said to be surface mount solder.

  For example, in the electronic device 100, when surface mount solder is formed on the forming line B1, the tool passes over the surface mount solder when the second through hole 13 and the third through hole 14 are pulled and soldered. Will do. In this case, the surface mount solder may be melted by the heat from the tool. However, since the surface mounting solder is not formed at the position along the forming line B1 in the electronic device 100, when the second through hole 13 and the third through hole 14 are pulled and soldered, the surface mounting solder is not formed. It can suppress melting.

  Note that the third through hole 14 and the fixing terminal 44 are provided to suppress vibration of the non-sealing region A21 described later, and therefore may be mechanically connected and electrically connected. It does not have to be. That is, the conductor of the third through hole may not be a part of the wiring. In other words, the conductor of the third through hole may not be electrically connected to the conductor pattern. That is, the third through hole 14 and the fixing terminal 44 may be a dummy through hole and a dummy terminal.

  Further, the circuit board 10 is provided with a fixing hole 15. The fixing hole 15 is a through hole provided in the resin member of the circuit board 10 like the first through hole 12 and the like, but is not subjected to metal plating or the like. In the fixing hole 15, a part of a fixing portion 43 described later is inserted in order to fix the circuit board 10 to the case 40.

  The fixing holes 15 are provided at the four corners of the circuit board 10. However, the fixing holes 15 may be provided in at least three of the four corners of the circuit board 10. Further, it can be said that the fixing holes 15 are provided as many as the fixing portions 43.

  The external component 20 and the built-in components 22 and 23 are circuit components mounted on the circuit board 10. The external component 20 and the built-in components 22 and 23 are electrically and mechanically connected to the land, and constitute a circuit together with the circuit board 10. The external component 20 and the built-in components 22 and 23 are mounted on at least one surface 11a. Therefore, the external component 20 and the built-in components 22 and 23 may be mounted on the opposite surface 11b.

  As the external component 20, a surface mounting component, a through-hole mounting component, or the like can be adopted. The external component 20 corresponds to a second electronic component. The external component 20 is mounted on the circuit board 10 but is not covered with the sealing resin portion 30. That is, the external component 20 is mounted on the circuit board 10 outside the sealing resin portion 30. The external component 20 is a component that is not suitable for sealing with resin. More specifically, the external component 20 is a component that cannot withstand the forming pressure when the sealing resin portion 30 is formed. The through-hole mounting component corresponds to an insertion type electronic component.

  Therefore, when such a component is mounted on the circuit board 10, it is necessary to mount it around the sealing resin portion 30 without sealing with the sealing resin portion 30. Here, an electrolytic capacitor which is a through-hole mounting component is adopted as the external component 20. Therefore, in the following, the same reference numeral 20 as that of the external component 20 is used for the electrolytic capacitor.

  As shown in FIG. 3, the electrolytic capacitor 20 includes a main body portion and component terminals 21. The main body portion has a rectangular parallelepiped shape or a cylindrical shape. On the other hand, the component terminal 21 has, for example, a shape that protrudes from the side wall of the main body and is bent from the protruding tip. In this case, it can be said that the component terminal 21 has an L shape. In the electrolytic capacitor 20, the component terminal 21 and the second through hole 13 are electrically and mechanically connected via the third solder 53 in a state where the component terminal 21 is inserted into the second through hole 13.

  Thus, since the external component 20 is a component that is electrically connected to the circuit board 10 with the component terminal 21 inserted into the second through hole 13, it can also be referred to as a through-hole mounting component. The component terminal 21 and the second through hole 13 may be electrically and mechanically connected with a conductive connection material different from solder.

  The built-in components 22 and 23 are mounted on the circuit board 10 and are covered with the sealing resin portion 30. The built-in components 22 and 23 correspond to first electronic components. The built-in components 22 and 23 are mounted on the circuit board 10 via solder. In the present embodiment, an example in which the built-in components 22 and 23 and the circuit board 10 are connected via solder is employed. However, the present invention is not limited to this, and a conductive connecting member different from solder can be employed.

  As the built-in components 22 and 23, surface mounting components, through-hole mounting components, or the like can be adopted. In the present embodiment, passive elements and semiconductor elements are employed as the built-in components 22 and 23. Therefore, in the following, reference numeral 22 is used for passive elements and reference numeral 23 is used for semiconductor elements.

  Examples of the passive element 22 include a chip resistor, a chip capacitor, and a crystal resonator. The passive element 22 is mounted on the circuit board 10 with an electrode electrically and mechanically connected to the land via solder. It can be said that the junction between the circuit board 10 and the passive element 22 includes a land, an electrode of the passive element 22, and solder.

  Examples of the semiconductor element 23 include a power element that generates a large amount of heat, such as a microcomputer, a control element, an IGBT (Insulated Gate Bipolar Transistor), or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). Here, as an example, the semiconductor element 23 in which electrodes are formed on both surfaces is employed. The semiconductor element 23 is mounted on the circuit board 10 such that the electrode on one surface is electrically and mechanically connected to the land via solder. In addition, the semiconductor element 23 is electrically and mechanically connected to one end of the conductive plate member via the solder on the other surface. The other end of the plate member is electrically and mechanically connected to the land through solder. It can be said that the joint portion between the circuit board 10 and the semiconductor element 23 includes the land, the electrode on one surface, the solder, and the other end of the plate member.

  The sealing resin portion 30 includes a thermosetting resin such as an epoxy resin. The sealing resin portion 30 is formed by, for example, a transfer molding method using a mold or a compression molding method. For this reason, the sealing resin part 30 can also be said to be mold resin.

  As shown in FIGS. 1 and 2, the sealing resin portion 30 is provided on the one surface 11 a. In other words, the sealing resin portion 30 partially covers the one surface 11a. More specifically, the sealing resin portion 30 covers a part of the one surface 11 a, the passive element 22 and the semiconductor element 23, the junction between the circuit board 10 and the passive element 22, and the junction between the circuit board 10 and the semiconductor element 23. ing. Moreover, the sealing resin part 30 has covered the board member in addition to these.

  Thus, the sealing resin part 30 is provided in a part on the one surface 11a side. However, the sealing resin portion 30 is not provided on the opposite surface 11b side. Therefore, the electronic structure has a so-called half mold structure in which a part on the one surface 11a side is sealed with the sealing resin portion 30 and the opposite surface 11b side is exposed without being sealed with the sealing resin portion 30. ing.

  Moreover, the sealing resin part 30 has comprised the cube shape as shown in FIG.1 and FIG.2. Here, as an example, a rectangular parallelepiped sealing resin portion 30 is employed. Therefore, as for the sealing resin part 30, the shape of an upper surface and the shape of four side walls are rectangular shapes. The four side walls are provided perpendicular to the surface 11a. The upper surface of the sealing resin portion 30 is a surface that is not in contact with the one surface 11a and is parallel to the one surface 11a. If these shapes are errors in manufacturing the sealing resin portion 30, they are regarded as rectangular shapes. Furthermore, the shape of the sealing resin part 30 is not limited to this.

  The sealing resin portion 30 is provided so that each of the four side walls is parallel to each of the four side walls of the circuit board 10. In other words, each of the two long side walls of the sealing resin portion 30 is parallel to each of the two long side walls of the circuit board 10, and each of the two short side walls is two of the two side walls of the circuit board 10. Parallel to each of the short side walls. In addition, the sealing resin portion 30 has a virtual plane along each of the two long side walls parallel to a virtual plane along each of the two long side walls of the circuit board 10, and each of the two short side walls. The virtual plane along the parallel plane is parallel to each of the virtual planes along the two short side walls of the circuit board 10.

  As shown in FIG. 1, the sealing resin portion 30 is provided without reaching the edge of the circuit board 10, that is, the four side walls of the circuit board 10. That is, the sealing resin portion 30 is provided so that there is a gap between a virtual plane along each side wall and a virtual plane along each side wall of the circuit board 10 facing them. Therefore, the circuit board 10 has a portion where the sealing resin portion 30 is not provided in a region from its edge to each side wall of the sealing resin portion 30. This is because the first through hole 12 to the third through hole 14 and the fixing hole 15 are provided in the circuit board 10 or the external component 20 is mounted on the circuit board 10.

  In the present embodiment, the sealing region in which the sealing resin portion 30 is formed on the basis of the virtual plane sandwiched between the sealing resin portion 30 and the external component 20 among the virtual plane along the side wall of the sealing resin portion 30. The electronic structure is partitioned into A1 and a non-sealing region A21 where the external component 20 is provided. This virtual plane serving as a reference is also referred to as a sealing reference plane. Therefore, it can be said that the electronic structure is divided into the sealing region A1 and the non-sealing region A21 with the sealing reference plane as a boundary. Further, the sealing region A1 and the non-sealing region A21 can be said to be a region from the sealing reference surface to the side wall of the circuit board 10 parallel to the sealing reference surface with the sealing reference surface as a boundary. The sealing reference surface corresponds to a virtual plane in the claims. That is, the sealing reference plane is a virtual plane that passes through the side wall on the short side of the sealing resin portion 30.

  Further, the sealing region A1 and the non-sealing region A21 can also be expressed by a sealing reference surface and two virtual planes along the side wall of the circuit board 10. The two virtual planes here are virtual planes parallel to the sealing reference plane among the virtual planes along the side wall of the circuit board 10 and are referred to as substrate reference planes. The two substrate reference surfaces are a first substrate reference surface on the sealing resin portion 30 side with respect to the sealing reference surface, and a second substrate reference surface on the opposite side of the sealing resin portion 30 with respect to the sealing reference surface. It is. Therefore, it can be said that the sealing region A1 is a region sandwiched between the sealing reference surface and the first substrate reference surface in the electronic structure. On the other hand, the non-sealing region A21 can be said to be a region sandwiched between the sealing reference surface and the second substrate 2 reference surface in the electronic structure.

  For this reason, the sealing region A <b> 1 includes the first through hole 12 and the fixing hole 15 in addition to the sealing resin portion 30. On the other hand, the non-sealing region A <b> 21 includes the second through hole 13, the third through hole 14, and the fixing hole 15 in addition to the external component 20. In other words, in the sealing region A <b> 1, the sealing resin portion 30, the first through hole 12, and the fixing hole 15 are provided for the circuit board 10. In the non-sealing region A21, the external component 20, the second through hole 13, the third through hole 14, and the fixing hole 15 are provided on the circuit board 10.

  The circuit board 10 included in the sealing region A1 includes a facing region that faces the sealing resin portion 30 and a peripheral region of the facing region. As described above, the first through hole 12 and the fixing hole 15 are provided in the peripheral region. On the other hand, the circuit board 10 in the non-sealing region A21 is provided with the external component 20, the second through hole 13, the third through hole 14, and the fixing hole 15 as described above. For this reason, the circuit board 10 in the non-sealing region A21 has a larger area on the one surface 11a and the opposite surface 11b than in the peripheral region.

  Since the sealing resin portion 30 is provided, the sealing region A1 is heavier than the non-sealing region A21. That is, when the electronic structure is cut along a virtual plane serving as a reference, the sealing area A1 is heavier than the non-sealing area A21.

  Further, since the first through hole 12 is provided in the sealing region A1, the sealing region A1 is more firmly fixed to the case 40 than the non-sealing region A21. The fixing structure between the case 40 and the electronic structure will be described in detail later.

  In the present embodiment, the region indicated by reference numeral A21 is employed as the non-sealing region. However, the present invention is not limited to this, and the region indicated by reference sign A22 may be adopted as the non-sealing region. In this case, the non-sealing region A22 includes the electrolytic capacitor 20, and is a region from the sealing reference plane to a virtual plane passing through the fixing portion 43 in parallel with the sealing reference plane. The virtual plane corresponds to a virtual fixed surface. Similarly, the sealing area A1 may be an area from the sealing reference plane to a virtual plane that is parallel to the sealing reference plane and passes through the fixing portion 43. However, the virtual fixing surface for defining the non-sealing region A22 and the virtual fixing surface for defining the sealing region A1 are different surfaces.

  The case 40 accommodates the electronic structure and the external device in a state in which the electronic structure is accommodated, so that the accommodation part 41, the board connection terminal 42, the fixing part 43, and the fixing part 43 are fixed. The terminal 44, the connector part 45, and the external connection terminal 46 are provided.

  The housing part 41 and the connector part 45 are mainly composed of, for example, a resin having electrical insulation properties such as PPS (polyphenylene sulfide) and PBT (polybutylene terephthalate), and are provided integrally. The housing part 41 and the connector part 45 are embedded with the constituent members of the board connection terminal 42, the fixing terminal 44 and the external connection terminal 46 partially exposed.

  The board connection terminal 42 and the fixing terminal 44 are portions exposed from the housing portion 41 in the constituent members. On the other hand, the external connection terminal 46 is a portion exposed from the connector portion 45 in the constituent member. For example, the board connection terminal 42, the fixing terminal 44, and the external connection terminal 46 are insert-molded in the housing part 41 and the connector part 45. For example, the substrate connecting terminal 42 and the fixing terminal 44 may be made of a copper alloy plated with tin or nickel. That is, it can be said that each of the board connection terminal 42 and the fixing terminal 44 is a metal terminal.

  The accommodating part 41 includes a side part 41a and a bottom part 41b, and is configured to accommodate an electronic structure. In the present embodiment, as an example, a storage portion 41 including rectangular side portions 41a provided at four locations and a rectangular bottom portion 41b provided at one location is employed.

  The accommodating part 41 is provided with a side part 41a in an annular shape, and a bottom part 41b is provided continuously with one end of the side part 41a. That is, the accommodating portion 41 has a structure in which one open end of the side portion 41a provided in an annular shape is closed by the bottom portion 41b. For this reason, as for the accommodating part 41, the other opening end of the side part 41a is not obstruct | occluded. In other words, the accommodating part 41 has an opening facing the bottom 41b.

  Thus, the accommodating part 41 is an area opposite to the bottom 41b and the area surrounded by the side part 41a is a concave accommodating space for accommodating the electronic structure. Moreover, the accommodating part 41 can be said to be a bottomed box member. Therefore, the electronic structure is accommodated in the accommodating space of the accommodating portion 41. The accommodating portion 41 may be one in which an opening facing the bottom portion 41b, that is, an opening end that is not blocked by the bottom portion 41b in the side portion 41a is closed by a lid member.

  The circuit board 10 is accommodated in the accommodating portion 41 with the one surface 11a facing the bottom portion 41b. The circuit board 10 is accommodated in the accommodating portion 41 so that the one surface 11a and the opposite surface 11b are parallel to the bottom portion 41b.

  The accommodating portion 41 is provided with a plurality of substrate connection terminals 42. Each board connection terminal 42 is a rod-like terminal provided at a position facing each first through hole 12. The board connection terminal 42 corresponds to the connection terminal in the claims. For example, the board connection terminal 42 is provided so as to protrude from the bottom 41b. That is, it can be said that the board connecting terminal 42 is temporarily fixed to the bottom 41 b and the other end is fixed to the circuit board 10.

  In the present embodiment, in addition to the arrangement of the first through holes 12, the stress applied to the first solder 51 is relieved based on the length y 1 of the board connection terminals 42, and the first solder 51 is damaged. It can be suppressed. The length y1 of the board connection terminal 42 here corresponds to the distance between the bottom 41b and the circuit board 10 or the distance between the bottom 41b and the first solder 51, as shown in FIG. Further, the bottom portion 41 b here is a peripheral portion adjacent to the board connection terminal 42.

  When the region where the sealing resin portion 30 is provided in the circuit board 10 vibrates, the electronic device 100 absorbs vibration at the board connection terminal 42 when the length y1 of the board connection terminal 42 is shorter than the length. It becomes easy. Further, it is preferable that the length y1 of the board connecting terminal 42 is set to such an extent that the board connecting terminal 42 can absorb the vibration of the electronic device 100 due to the vibration of the vehicle. In this way, the electronic device 100 can relieve the stress applied to the first solder 51 and suppress the breakage of the first solder 51.

  The accommodating part 41 is provided with a plurality of fixing parts 43. Each fixing portion 43 is provided at a position facing each fixing hole 15. Therefore, the accommodating part 41 is provided with at least three fixing parts 43. For example, the fixing portion 43 is provided so as to protrude from the bottom portion 41b. The fixing part 43 is a part for fixing the circuit board 10 to the case 40 by caulking. It can be said that the fixing portion 43 is once fixed to the bottom portion 41 b and the other end side is fixed to the circuit board 10.

  As shown in FIG. 2, a part of the fixing part 43 is inserted into the fixing hole 15. And the fixing | fixed part 43 is in the state in which one part was inserted in the fixing hole 15, and the base part arrange | positioned between the one surface 11a and the bottom part 41b, and the intermediate part inserted in the fixing hole 15 are opposite. And a tip portion disposed on the surface 11b side. And as for the fixing | fixed part 43, the root part, the intermediate part, and the front-end | tip part are integrally provided in this order. In other words, each of the root portion, the intermediate portion, and the tip portion is a portion of the fixed portion 43 that is an integral object.

  In FIG. 2, the fixing | fixed part 43 after crimping is shown in figure. As shown in FIG. 2, the fixing portion 43 has a cross-sectional area where the root portion and the tip portion are wider than the opening area of the fixing hole 15. However, the tip portion has a cross-sectional area that is narrower than the opening area of the fixing hole 15 before caulking. That is, the fixing part 43 before caulking can be inserted into the fixing hole 15 at the intermediate part and the tip part. However, the root portion has a shape that cannot be inserted into the fixing hole 15 either before or after caulking. As described above, the fixing part 43 fixes the electronic structure to the case 40 by sandwiching the circuit board 10 between the root part and the tip part with the intermediate part inserted into the fixing hole 15.

  In addition, as shown in FIG. 2, when the electronic structure is disposed in the case 40 with the intermediate portion of the fixing portion 43 inserted into the fixing hole 15, the circuit board 10 remains in contact with the root portion. become. Therefore, it can be said that the root portion has a function as a pedestal that supports the electronic structure.

  Moreover, since the fixing | fixed part 43 is crimped by the front-end | tip part, the occupation area in the opposite surface 11b is wider than each through-hole 12-14. In other words, the occupied area on the opposite surface 11b of the tip is wider than the occupied area on the opposite surface 11b of each through hole 12-14. For this reason, in order to suppress that the physique of the direction along the opposite surface 11b in the circuit board 10 becomes large, the location fixed by the fixing | fixed part 43 has three or four locations. The occupied area on the opposite surface 11b of each through hole 12-14 can be replaced with the occupied area on the opposite surface 11b of each solder 51-53.

  The accommodating portion 41 is provided with a plurality of fixing terminals 44. Each fixing terminal 44 is a rod-shaped terminal provided at a position facing each third through hole 14. The fixing terminal 44 corresponds to the support terminal in the claims. For example, like the board connection terminal 42, the fixing terminal 44 is provided so as to protrude from the bottom 41b. In other words, it can be said that the fixing terminal 44 is once fixed to the bottom 41 b and the other end is fixed to the circuit board 10. The length of the fixing terminal 44 is the same as the length y1 of the board connecting terminal 42 so that vibration can be absorbed together with the board connecting terminal 42 as described above.

  As described above, in the electronic device 100, in addition to the caulking by the fixing portion 43, the first through hole 12 and the board connection terminal 42 are connected by the first solder 51, and the electronic structure is fixed to the case 40. ing. Further, in addition to these, in the electronic device 100, the third through hole 14 and the fixing terminal 44 are connected by the third solder 53, and the electronic structure is fixed to the case 40.

  Further, in the sealing region A1, in addition to the caulking by the fixing portion 43, the first through hole 12 and the board connecting terminal 42 are connected by the first solder 51, and the electronic structure is fixed to the case 40. I can say that. In the non-sealing region A21, in addition to caulking by the fixing portion 43, the third through hole 14 and the fixing terminal 44 are connected by the third solder 53, and the electronic structure is fixed to the case 40. It can be said. Thus, the electronic device 100 has a fixing structure between the case 40 and the electronic structure.

  Further, it can be said that the electronic structure is attached to the case 40 while being connected to the board connection terminal 42, the fixing portion 43, and the fixing terminal 44. For this reason, the case 40 can be said to be an attached body to which the electronic structure is attached.

  In the present embodiment, the case 40 including a concave accommodation space is employed. However, the present invention is not limited to this. The electronic device 100 can be adopted as long as it has a board connection terminal 42, a fixing portion 43, and a fixing terminal 44 so that the electronic structure can be fixed. Therefore, the present invention can be employed even in cases where the side portion 41a is not provided.

  In the present embodiment, an example in which the third through hole 14 is provided on the same virtual straight line B <b> 1 as the second through hole 13 is employed. However, the present invention is not limited to this, and the third through hole 14 may not be provided on the same virtual straight line B <b> 1 as the second through hole 13. For example, the third through hole 14 may be arranged linearly in the non-sealing region A21, or may be arranged in a polygonal shape or a circular shape.

  In the present embodiment, an example in which the third through holes 14 are provided at a plurality of locations is employed. However, the present invention is not limited to this, as long as at least one third through hole 14 is provided in the non-sealing region A21. That is, in the present invention, in the non-sealing region A21, the fixing terminal 44 and the third through hole 14 need only be connected at least at one location in the non-sealing region A21. Since the third through hole 14 is a part that is connected to the fixing terminal 44 and suppresses the vibration of the non-sealing region A21, the third through hole 14 is preferably provided at the center of the non-sealing region A21. The third through hole 14 will be described in other embodiments.

  In the electronic device 100, the external component 20 that is a surface mounting component instead of the through-hole mounting component may be mounted on the circuit board 10. In this case, it is not necessary to provide the second through hole 13 in the circuit board 10. As described above, it is sufficient that at least one third through hole 14 is provided in the non-sealing region A21, and the third through hole 14 may be arranged linearly or in a polygonal shape or a circular shape. Also good.

  Here, a method for manufacturing the electronic device 100 will be described. First, in the first step, the circuit board 10 on which the wiring, the first through hole 12 to the third through hole 14, and the fixing hole 15 are formed is prepared (prepared). The first step can also be said to be a preparation step.

  In the second process, the electrolytic capacitor 20, the passive element 22, and the semiconductor element 23 are mounted on the circuit board 10 prepared in the first process. In the second step, the passive element 22 and the semiconductor element 23 are disposed on the surface 11a via solder, and the passive element 22 and the semiconductor element 23 and the land are electrically and mechanically connected. However, in the second step, the electrolytic capacitor 20 is temporarily fixed to the circuit board 10 in a state where the electrolytic capacitor 20 is disposed on the one surface 11 a so that the component terminal 21 is inserted into the second through hole 13. That is, in the second step, the component terminal 21 and the second through hole 13 are not connected via the second solder 52. In the present embodiment, in the second step, the plate member is mounted so as to straddle the semiconductor element 23 and the one surface 11a. Note that the second step can be said to be a mounting step.

  In the third step, the sealing resin portion 30 is formed on the circuit board 10 on which the electrolytic capacitor 20 or the like is mounted in the second step by a transfer molding method or a compression molding method. That is, in the third step, the passive element 22 and the semiconductor element 23 mounted on the circuit board 10 are sealed with the sealing resin portion 30. Thereby, an electronic structure is formed. Note that the third step can be said to be a sealing step.

  In the fourth step, the electronic structure is disposed in the accommodating portion 41 of the case 40. In the fourth step, as shown in FIG. 2 and the like, the electronic structure is arranged in the accommodation space of the accommodation portion 41 so that the one surface 11a faces the bottom portion 41b. Further, in the fourth step, the substrate connection terminal 42 is inserted into the first through hole 12, the fixing terminal 44 is inserted into the third through hole 14, and the fixing portion 43 is inserted into the fixing hole 15. Arrange the structure. At this time, since the tip of the fixing portion 43 is not deformed, the tip passes through the fixing hole 15 and the tip protrudes toward the opposite surface 11b. Note that the fourth step can be said to be an arrangement step.

  In the fifth step, caulking is applied to the tip of the fixing portion 43. In the fifth step, the portion of the fixing portion 43 that protrudes to the opposite surface 11b side is deformed by, for example, heat caulking. The fifth step can be said to be a caulking step or a fixing step.

  In the sixth step, the board connection terminal 42 and the first through hole 12 are electrically and mechanically connected via the first solder 51, and the fixing terminal 44 and the third through hole 14 are connected to the third solder. Electrically and mechanically connected through 53. Further, in the sixth step, the component terminal 21 and the second through hole 13 are electrically and mechanically connected via the second solder 52. That is, in the sixth step, the component terminal 21 of the electrolytic capacitor 20 temporarily secured in the second step and the second through hole 13 are electrically and mechanically connected via the second solder 52.

  As described above, in the sixth step, the board connection terminal 42 and the first through hole 12 are soldered, the fixing terminal 44 and the third through hole 14 are soldered, and the component terminal 21 and the second through hole 13 are soldered. Do each of the. In other words, in this manufacturing method, the board connection terminal 42 and the first through hole 12 are soldered, the fixing terminal 44 and the third through hole 14 are soldered, and the component terminal 21 and the second through hole 13 are soldered. Each is performed in the same process. Note that, for example, flow soldering or drag soldering can be employed for the soldering in the sixth step.

  Thereby, reflow soldering is sufficient for soldering in the second step. And the soldering in the sixth step may be only drag soldering, for example. Note that the sixth step can be said to be a connection step.

  The electronic device 100 can be manufactured by performing the first to sixth steps. However, the manufacturing method of the electronic device 100 is not limited to this. In the present manufacturing method, for example, the component terminal 21 and the second through hole 13 may be electrically and mechanically connected by the second solder 52 in the second step. In this case, it is not necessary to solder the component terminal 21 and the second through hole 13 in the sixth step.

  As described above, in the electronic device 100, the third through hole 14 is provided in the non-sealing region A 21, and the third through hole 13 and the fixing terminal 44 fixed to the case 40 are connected by the third solder 53. Yes. Accordingly, the electronic device 100 can firmly fix the non-sealing region A21 to the case 40. In addition, since the electronic device 100 can firmly fix the non-sealing region A21, vibration of the non-sealing region A21 can be suppressed.

  The effect of the electronic device 100 will be described using a comparative electronic device. In the electronic device of the comparative example, the third through hole 14 and the fixing terminal 44 are not connected by the third solder 53, that is, the non-sealing region A21 is fixed to the case 40 only by the fixing portion 43. And Except this point, the electronic device of the comparative example is the same as the electronic device 100. Therefore, in the following, the same reference numerals as those of the electronic device 100 are used for the components of the electronic device of the comparative example.

  When the vibration of the vehicle propagates to the electronic device of the comparative example, the sealing region A <b> 1 includes the sealing resin portion 30, and thus is difficult to vibrate due to the weight of the sealing resin portion 30. Further, since the first through hole 12 provided along the longitudinal side wall of the sealing resin portion 30 is fixed to the case 40, the sealing region A1 is hardly vibrated. Further, the sealing region A1 is less likely to vibrate because two fixing holes 15 provided at the corners are fixed to the case 40. On the other hand, the non-sealing region A21 does not include the sealing resin portion 30 and is fixed to the case 40 only by the two fixing holes 15 provided at the corner portions. It is easy to vibrate with the boundary of. In particular, as in the comparative example and the present embodiment, when the non-sealing region A21 is provided in a portion extending in the longitudinal direction of the sealing resin portion 30, vibration is further easily caused.

  The electronic device of the comparative example has a problem that the connection reliability between the electrolytic capacitor 20 and the circuit board 10 is lowered because the non-sealing region A21 is likely to vibrate. That is, in the electronic device of the comparative example, stress is easily applied to the connection portion between the electrolytic capacitor 20 and the circuit board 10, that is, the second solder 52, due to the vibration of the non-sealing region A 21. In the electronic device of the comparative example, the second solder 52 is damaged when the vibration of the non-sealing region A21 is repeated or when the vibration of the non-sealing region A21 is large. In the electronic device of the comparative example, the second solder 52 is damaged, so that the electrolytic capacitor 20 is detached from the circuit board 10 or the electrical resistance between the circuit board 10 and the electrolytic capacitor 20 is increased.

  On the other hand, in the electronic device 100, the non-sealing region A <b> 21 is fixed to the case 40 via the fixing terminal 44. For this reason, the electronic device 100 can suppress the vibration of the non-sealing region A21 even when the vibration of the vehicle propagates. In addition, since sealing area | region A1 is the structure similar to a comparative example, it is hard to vibrate. For this reason, the electronic device 100 can improve the connection reliability between the electrolytic capacitor 20 and the circuit board 10. That is, since the electronic device 100 can suppress the vibration of the non-sealing region A21, the stress applied to the second solder 52 can be suppressed. Therefore, the electronic device 100 can suppress the electrolytic capacitor 20 from being separated from the circuit board 10 or the electrical resistance between the circuit board 10 and the electrolytic capacitor 20 being increased.

  In addition, since the electronic device 100 electrically and mechanically connects the fixing terminal 44, which is a metal terminal, and the third through hole 14 via the third solder 53, the fixing portion 43 is increased to be unsealed. It can suppress that a physique becomes large rather than the case where the vibration of stop area | region A21 is suppressed. This is because, as described above, the occupied area on the opposite surface 11b of the third through hole 14 is smaller than the occupied area on the opposite surface 11b of the tip. The physique here is a physique in a direction along the opposite surface 11 b of the circuit board 10.

  In the present embodiment, an example in which the first through hole 12 is provided along the longitudinal direction of the sealing resin portion 30 and the non-sealing region A21 is formed in the extension region in the longitudinal direction is employed. However, the present invention is not limited to this, and the first through hole 12 is provided along the short direction of the sealing resin portion 30 and the non-sealing region A21 is formed in the extended region in the short direction. It may be. The present invention can achieve the above effects even with such a configuration.

  Further, in the present invention, the shape of the surface parallel to the one surface 11a in the sealing resin portion 30 may be square. In this case, the electronic device 100 is provided with the first through holes 12 along two opposing sides of the sealing resin portion 30. The non-sealing region A21 is provided in a region different from the sealing region A1. The present invention can achieve the above effects even with such a configuration.

  In the present embodiment, the circuit board 10 is fixed to the case 40 by caulking the fixing portion 43. However, the present invention is not limited to this, and may be screwed to the case 40 at at least three of the four corners of the circuit board 10. For example, the case 40 has a screwing portion as the fixing portion 43. This screwing portion is not provided with the intermediate portion and the tip portion of the fixing portion 43 and corresponds to the structure of only the root portion, and a screw hole is provided on the tip surface facing the circuit board 10. The circuit board 10 is fixed to the case 40 by inserting screws into the fixing holes 15 and the screw holes of the fixing portion 43 from the opposite surface 11 b side.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. Below, 2nd Embodiment and 3rd Embodiment are demonstrated as another form of this invention. The above-described embodiment and the second and third embodiments can be implemented independently, but can also be implemented in combination as appropriate. The present invention is not limited to the combinations shown in the embodiments, and can be implemented by various combinations.

(Second Embodiment)
The electronic device 110 according to the second embodiment of the present invention will be described with reference to FIG. Here, portions of the electronic device 110 that are different from the electronic device 100 are mainly described, and descriptions of the same portions as those of the electronic device 100 are omitted.

  The electronic device 110 is different from the electronic device 100 in that the third through hole 14 is formed. That is, in the electronic device 110, the second through hole 13 and the third through hole 14 are not formed on the same virtual straight line. In other words, in the electronic device 110, a plurality of third through holes 14 are formed at positions deviating from an imaginary straight line where the plurality of second through holes 13 are formed. In the electronic device 110, the plurality of second through holes 13 are provided on the same virtual straight line, and the plurality of third through holes 14 are provided on the same virtual straight line. Furthermore, the row of second through holes 13 and the row of third through holes 14 are provided in parallel. Needless to say, the fixing terminal 44 is provided at a position facing the third through hole 14 as in the above-described mounting form.

  In the electronic device 110, as in the electronic device 100, the first through holes 12 are formed in two rows on both sides of the sealing resin portion 30. Two rows of the first through holes 12 are provided with an interval x1. The rows of the first through holes 12 are provided perpendicular to the rows of the second through holes 13 and the third through holes 14.

  Further, the electronic device 110 is provided such that the interval x2 between the row of the second through holes 13 and the row of the third through holes 14 is equal to the interval x1 between the two rows of the first through holes 12.

  The electronic device 110 can achieve the same effect as the electronic device 100. Further, in the electronic device 110, since the second through hole 13 and the third through hole 14 are not formed on the same virtual straight line, the distance between the second through hole 13 and the third through hole 14 on the virtual straight line. There is no need to consider. Therefore, the electronic device 110 can suppress restrictions on the formation positions of the second through hole 13 and the third through hole 14 in the circuit board 10. In other words, the electronic device 110 can improve the degree of freedom of the formation positions of the second through hole 13 and the third through hole 14 in the circuit board 10.

  Furthermore, since the distance x1 is equal to the distance x2, the electronic device 110 can simplify the movement of the tool when performing drag soldering. In the method of manufacturing the electronic device 110, for example, the first through holes 12 in two rows are soldered using a tool, and then the traveling direction of the tool is changed by 90 degrees, thereby the second through hole 13 and the third through hole. 14 soldering can be performed. Further, in the method of manufacturing the electronic device 110, after the second through hole 13 and the third through hole 14 are soldered, the traveling direction of the tool is changed by 90 degrees, and the remaining two rows of the first through holes 12 are soldered. it can.

  In the present embodiment, the circuit board 10 provided with a plurality of second through holes 13 and a plurality of third through holes 14 is employed. However, the present invention is not limited to this, and the second through hole 13 and the third through hole 14 may be provided one by one with an interval x2.

(Third embodiment)
The electronic device 120 according to the third embodiment of the present invention will be described with reference to FIG. Here, portions of the electronic device 120 that are different from the electronic device 100 are mainly described, and descriptions of the same portions as the electronic device 100 are omitted.

  The electronic device 120 is different from the electronic device 100 in the positional relationship between the second through hole 13 and the third through hole 14. That is, in the electronic device 120, the second through hole 13 and the third through hole 14 are not formed on the same virtual straight line. In other words, in the electronic device 120, the plurality of third through holes 14 are formed at positions deviating from the virtual straight line where the plurality of second through holes 13 are formed. In the electronic device 110, the plurality of second through holes 13 are provided on the same virtual straight line, and the plurality of third through holes 14 are provided on the same virtual straight line. Furthermore, the row of second through holes 13 and the row of third through holes 14 are provided in parallel. Needless to say, the fixing terminal 44 is provided at a position facing the third through hole 14 as in the above-described mounting form.

  The third through hole 14 is provided at a position sandwiching the opposing region of the electrolytic capacitor 20. That is, the opposing region of the electrolytic capacitor 20 is sandwiched between the two third through holes 14.

  The electronic device 120 can achieve the same effect as the electronic device 100. Furthermore, in the electronic device 120, the non-sealing region A21 is likely to vibrate due to the weight of the mounted electrolytic capacitor 20. That is, the electrolytic capacitor 20 promotes vibration of the non-sealing region A21.

  Therefore, in the electronic device 120, the third through hole 14 is provided at a position sandwiching the opposing region of the electrolytic capacitor 20, and is connected to the fixing terminal 44. That is, the electronic device 120 is fixed to the case 40 by sandwiching the opposing region of the electrolytic capacitor 20 that promotes vibration in the non-sealing region A21 with the fixing terminal 44. For this reason, the electronic device 120 can further suppress the vibration of the non-sealing region A21. Therefore, the electronic device 120 can improve the connection reliability between the electrolytic capacitor 20 and the circuit board 10 as compared with the electronic device 100.

(Fourth embodiment)
The electronic device 130 according to the fourth embodiment of the present invention will be described with reference to FIG. Here, portions of the electronic device 130 that are different from the electronic device 100 will be mainly described, and descriptions of portions similar to the electronic device 100 will be omitted. 6 is a cross-sectional view corresponding to FIG.

  The electronic device 130 is different from the electronic device 100 in the position of the connector portion 45. In the electronic device 130, a connector portion 45 is provided on the bottom portion 41 b of the case 40. That is, in the electronic device 130, the connector portion 45 is provided on the surface opposite to the surface facing the sealing resin portion 30 in the bottom portion 42b.

  The electronic device 130 can achieve the same effect as the electronic device 100. Furthermore, since the electronic device 130 is provided with the connector portion 45 on the bottom 41b of the case 40, vibration of the case 40 can be suppressed.

(Fifth embodiment)
The electronic device 140 according to the fifth embodiment of the present invention will be described with reference to FIG. Here, portions of the electronic device 140 that are different from the electronic device 100 will be mainly described, and descriptions of portions similar to the electronic device 100 will be omitted. FIG. 7 is a plan view corresponding to FIG.

  The electronic device 140 is different from the electronic device 100 in the positional relationship between the sealing resin portion 30 and the circuit board 10. In addition, the electronic device 140 employs an example in which the connector portion 45 is provided on the bottom 41b of the case 40, as in the fourth embodiment. However, similarly to the electronic device 100, the electronic device 140 may be provided with the connector portion 45 on the side wall of the case 40.

  In the sealing resin portion 30, each of the two long side walls is parallel to each of the two short side walls of the circuit board 10, and each of the two short side walls is the two long side walls of the circuit board 10. Parallel to each of the. A plurality of first through holes 12 are arranged side by side along the opposing longitudinal side walls of the sealing resin portion 30. The first through hole 12 is provided along two short side walls of the circuit board 10.

  The electronic device 140 can achieve the same effect as the electronic device 100. In addition, the planar shape of the sealing resin part 30 may be a positive direction. In this case, the first through holes 12 are arranged along the two opposing side walls of the sealing resin portion 30 and arranged along the two short side walls of the circuit board 10. It is done.

(Sixth embodiment)
The electronic device 150 according to the sixth embodiment of the present invention will be described with reference to FIG. Here, portions of the electronic device 150 that are different from the electronic device 100 are mainly described, and descriptions of the same portions as the electronic device 100 are omitted. FIG. 8 is a cross-sectional view corresponding to FIG.

  In the electronic device 150, the board connection terminals 42 and the first through holes 12 are provided along the four sides of the sealing resin part 30, and the external component 20 is provided on each of the four sides of the sealing resin part 30. The electronic device 100 is different from the electronic device 100 in that the electronic device 100 is disposed at a position facing the electronic device 100. Therefore, the electronic device 150 is provided with the second through hole 13, the third through hole 14, and the fixing terminal 44 at positions facing the four sides of the sealing resin portion 30.

  In addition to the sealing resin portion 30, the sealing region A <b> 1 of the electronic device 150 includes the first through hole 12. However, unlike the electronic device 100, the sealing region A1 of the electronic device 150 does not include the fixing hole 15. Further, it can be said that the sealing region A1 of the electronic device 150 is a region surrounded by the substrate connection terminals 42.

  On the other hand, the non-sealing region A <b> 21 of the electronic device 150 includes the second through hole 13, the third through hole 14, and the fixing hole 15 in addition to the external component 20, similarly to the electronic device 100. Further, the non-sealing region A21 of the electronic device 150 is a peripheral region of the sealing region A1, and can be said to be a region from the sealing region A1 to the end of the circuit board 10.

  The electronic device 150 can achieve the same effect as the electronic device 100. In the present embodiment, an example is employed in which the substrate connection terminal 42 and the first through hole 12 are not provided in a portion facing the corner portion of the sealing resin portion 30. However, the electronic device 150 may be provided with the substrate connection terminal 42 and the first through hole 12 at a portion facing the corner. In the electronic device 150, the external component 20 may be mounted on a portion facing the corner portion.

  DESCRIPTION OF SYMBOLS 10 Circuit board, 12 1st through hole, 13 2nd through hole, 14 3rd through hole, 20 External component, 22, 23 Built-in component, 30 Sealing resin part, 40 Case, 41 Housing part, 42 Board connection terminal , 43 fixing part, 44 fixing terminal, 45 connector part, 100 to 150 electronic device

Claims (5)

A conductor pattern having one surface (11a) and the opposite surface (11b) of the one surface, and a plurality of first hole connection portions (12) electrically connected to the conductor pattern; A circuit board (10) formed with:
A first electronic component (22, 23) mounted on one side of the circuit board;
A sealing resin portion (30) formed on one surface side of the circuit board and sealing the first electronic component;
An electronic structure including a second electronic component (20) mounted on the circuit board without being sealed by the sealing resin portion,
A case (40) including a fixing part that accommodates the electronic structure and fixes the circuit board at at least three of the corners of the circuit board,
The electronic structure is
A sealing region (A1) in which the first hole-shaped connecting portion disposed along the side wall of the sealing resin portion and the sealing resin portion is formed;
The sealing resin portion and the first hole connection portion are not formed, the second electronic component is mounted, and a second hole connection portion (14) different from the first hole connection portion is provided. Formed non-sealing regions (A21, A22),
The case is
A rod-shaped connection terminal (42) provided at a position facing the first hole-shaped connection portion and electrically connected to the first hole-shaped connection portion in a state of being inserted into the first hole-shaped connection portion; ,
It is provided at a position opposite to the second hole-shaped connecting portion, and is mechanically connected to the second hole-shaped connecting portion while being inserted into the second hole-shaped connecting portion, thereby supporting the non-sealed region. And a bar-shaped support terminal (44). The sealing resin portion and the circuit board have a rectangular parallelepiped shape,
The first hole-shaped connecting portion is disposed along the side wall on the long side of the sealing resin portion,
The sealing region and the non-sealing region are regions from the virtual plane to the side wall of the circuit board parallel to the virtual plane, with a virtual plane passing through the short side wall of the sealing resin portion as a boundary. The electronic device according to claim 1, wherein The sealing resin portion and the circuit board have a rectangular parallelepiped shape,
The first hole-shaped connecting portion is disposed along the side wall on the long side of the sealing resin portion,
The sealing region and the non-sealing region have a virtual plane passing through the side wall on the short side of the sealing resin portion as a boundary, and from the virtual plane, passing through the fixing portion and parallel to the virtual plane The electronic device according to claim 1, wherein the electronic device is an area up to. The circuit board includes a third hole connection part (13) electrically connected to the conductor pattern in the non-sealing region,
The second electronic component includes an insertion-type electronic component having a rod-shaped component terminal (21),
The insertion-type electronic component is electrically connected to the third hole-shaped connection portion in a state where the component terminal is inserted into the third hole-shaped connection portion, and is mounted on the circuit board.
The electronic device according to any one of claims 1 to 3, wherein the second hole-shaped connection portion and the third hole-shaped connection portion are arranged on the same virtual straight line. In addition to the insertion type electronic component, the second electronic component includes a surface-mounted component that does not have the rod-shaped component terminal,
The electronic device according to claim 4, wherein the surface mount component is electrically connected to the circuit board at a position deviated from the virtual straight line.

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