JP2017220529A - Method for manufacturing light source device, light source device, and projector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a light source device allowing a light-emitting element to maintain stable characteristics.SOLUTION: A method for manufacturing a light source device includes the steps of: forming a through hole in an optical element; forming a first member having conductivity in an inner wall of the optical element defining the through hole; joining the optical element and a light source substrate and housing the light-emitting element in a hollow part formed of the optical element and the light source substrate; adjusting the atmosphere of the hollow part through the through hole; and sealing the hollow part by closing the through hole by a second member and forming a through electrode including the first member and the second member and being electrically connected to the light-emitting element.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a light source device manufacturing method, a light source device, and a projector.

  As a light source for a projector or the like, a light source device using a solid light source such as a semiconductor laser or a super luminescent diode (SLD) is known. As solid-state light sources, edge-emitting light-emitting elements and surface-emitting light-emitting elements are known. The edge-emitting light-emitting element can have a higher resonator length than the surface-emitting light-emitting element, so that high output can be achieved.

  In such a light source device, the light emitting element is generally housed in a package or the like. For example, Patent Document 1 discloses a sealing structure in which a semiconductor light emitting element and an optical coupling element are hermetically sealed with a resin mold.

JP-A-8-186327

  Here, in the light source device, when the atmosphere of the space in which the light emitting element is accommodated contains moisture, organic matter, etc. in the air, the light emission is caused by electrode deterioration, organic matter, etc. adhering to the light emitting part. In some cases, the output of the element is lowered or the light emitting element is damaged. Thus, in the light source device, when the atmosphere of the space in which the light emitting element is accommodated cannot be adjusted, the light emitting element may not be able to maintain stable characteristics.

  However, Patent Document 1 does not disclose adjusting the atmosphere of the space in which the semiconductor light emitting element is accommodated. Moreover, in the sealing structure of patent document 1, since the semiconductor light emitting element is sealed with the resin mold, it is difficult to adjust the atmosphere of the space in which the semiconductor light emitting element is accommodated.

  An object of some aspects of the present invention is to provide a method of manufacturing a light source device in which a light emitting element can maintain stable characteristics. Another object of some embodiments of the present invention is to provide a light source device in which a light emitting element can maintain stable characteristics. Another object of some aspects of the present invention is to provide a projector including the light source device.

A method for manufacturing a light source device according to the present invention includes:
Forming a through hole in the optical element;
Forming a conductive first member on the inner wall of the optical element defining the through hole;
Bonding the optical element and the light source substrate, and housing the light emitting element in a hollow portion formed by the optical element and the light source substrate;
Adjusting the atmosphere of the hollow portion through the through hole;
By closing the through hole with a second member, the hollow portion is sealed, and a through electrode having the first member and the second member and electrically connected to the light emitting element is formed. And a step of performing.

  Such a method of manufacturing a light source device includes a step of adjusting the atmosphere of the hollow portion in which the light emitting element is accommodated, and thus a light source device having a light emitting element that can maintain stable characteristics can be manufactured. Further, in such a method for manufacturing a light source device, the hollow portion is sealed and the through electrode is formed by closing the through hole with the second member, so that the manufacturing process can be simplified.

In the method for manufacturing the light source device according to the present invention,
In the step of adjusting the atmosphere of the hollow part, the gas in the hollow part may be exhausted through the through-hole to make the hollow part a vacuum atmosphere.

  In such a light source device manufacturing method, the hollow portion can be easily made into a vacuum atmosphere.

In the method for manufacturing the light source device according to the present invention,
In the step of adjusting the atmosphere of the hollow part, after exhausting the gas in the hollow part through the through-hole, an inert gas is supplied to the hollow part through the through-hole to make the hollow part an inert gas atmosphere. May be.

  In such a method of manufacturing a light source device, the hollow portion can be easily made an inert gas atmosphere.

In the method for manufacturing the light source device according to the present invention,
Including the step of placing the light emitting element on the optical element before the step of housing the light emitting element in the hollow portion;
In the step of bonding the optical element and the light source substrate, the light emitting element is mounted on a mounting surface of the light source substrate,
The light emitting element emits light in an in-plane direction of the mounting surface,
The optical element may include a prism that bends light emitted from the light emitting element in a direction away from the mounting surface.

  In such a light source device manufacturing method, a light source device capable of using an edge-emitting light emitting element as a light emitting element can be manufactured.

The light source device according to the present invention includes:
A light source substrate;
A light emitting element mounted on the light source substrate;
An optical element that constitutes a hollow portion that houses the light emitting element together with the light source substrate;
Including
The optical element has a through hole penetrating from a first surface defining the hollow portion to a second surface opposite to the first surface,
The through hole is sealed by a through electrode having a first member provided on an inner wall of the optical element that defines the through hole, and a second member provided on the inner side of the first member,
The through electrode is electrically connected to the light emitting element.

  In such a light source device, the atmosphere in the hollow portion can be adjusted through the through hole in the manufacturing process. Therefore, in such a light source device, a hollow part can be made into a desired atmosphere, and the light emitting element can maintain the stable characteristic.

In the light source device according to the present invention,
The hollow portion may be a vacuum atmosphere or an inert gas atmosphere.

  In such a light source device, the light emitting element can maintain stable characteristics.

In the light source device according to the present invention,
The light emitting element emits light in an in-plane direction of a mounting surface on which the light emitting element of the light source substrate is mounted,
The optical element may include a prism that bends light emitted from the light emitting element in a direction away from the mounting surface.

  In such a light source device, since the optical element has a prism that bends light emitted from the light emitting element in a direction away from the mounting surface of the light source substrate, an edge-emitting light emitting element can be used as the light emitting element. . Therefore, for example, the light output obtained from one light emitting element can be increased as compared with the case where a surface light emitting element is used. Therefore, in such a light source device, high output can be achieved.

In the light source device according to the present invention,
A plurality of the light emitting elements may be mounted on the light source substrate.

  In such a light source device, since a plurality of light emitting elements are mounted on the light source substrate, high output can be achieved.

The projector according to the present invention is
A light source device according to the present invention;
A light modulation device that modulates light emitted from the light source device according to image information;
A projection device for projecting an image formed by the light modulation device;
including.

  Since such a projector includes the light source device according to the present invention, the projector can have a light source capable of maintaining stable characteristics.

The top view which shows typically the light source device which concerns on this embodiment. Sectional drawing which shows typically the light source device which concerns on this embodiment. Sectional drawing which shows typically the light source device which concerns on this embodiment. Sectional drawing which shows typically the light source device which concerns on this embodiment. Sectional drawing which expands and shows a part of light source device which concerns on this embodiment. The flowchart which shows an example of the manufacturing method of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on this embodiment. The flowchart which shows an example of the manufacturing method of the light source device which concerns on a 1st modification. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on a 1st modification. Sectional drawing which shows typically the manufacturing process of the light source device which concerns on a 1st modification. Sectional drawing which shows typically the light source device which concerns on a 2nd modification. 1 is a diagram schematically showing a projector according to an embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. Light Source Device First, a light source device according to the present embodiment will be described with reference to the drawings. FIG. 1 is a plan view schematically showing a light source device 100 according to the present embodiment. 2 is a cross-sectional view taken along the line II-II of FIG. 1 schematically showing the light source device 100 according to the present embodiment. 3 is a cross-sectional view taken along line III-III in FIG. 1 schematically showing the light source device 100 according to the present embodiment. 4 is a cross-sectional view taken along the line IV-IV in FIG. 1 schematically showing the light source device 100 according to the present embodiment. FIG. 5 is an enlarged cross-sectional view showing a part of the light source device 100 according to the present embodiment. 1 to 4 show an X axis, a Y axis, and a Z axis as three axes orthogonal to each other.

  As shown in FIGS. 1 to 5, the light source device 100 includes a light source substrate 10, a light emitting element 20, an optical element 35 having a prism 30, a through electrode 40, wirings 50, 52 and 53, and a collimating lens 60. And an optical element 65 having

  A plurality of light emitting elements 20 are mounted on the light source substrate 10. The light source substrate 10 includes a base (support substrate) 12 and a submount 14.

  The base 12 is, for example, a plate-shaped member (a rectangular parallelepiped member). The material of the base 12 is, for example, Cu, Al, Mo, W, Si, C, Be, Au, a compound thereof (for example, AlN, BeO), an alloy (for example, CuMo), or the like.

  The submount 14 is joined on the base 12. The submount 14 is, for example, a plate-like member. The material of the submount 14 is, for example, AlN, Si, CuW, SiC, BeO, or CuMo. Further, the submount 14 can also be constituted by a multilayer structure (CMC) of a Cu layer and a Mo layer.

  The thermal conductivity of the base 12 is higher than the thermal conductivity of the submount 14, and the thermal conductivity of the submount 14 is higher than the thermal conductivity of the light emitting element 20. Thereby, the base 12 and the submount 14 can function as a heat sink. The thermal expansion coefficient of the submount 14 is preferably close to the thermal expansion coefficient of the light emitting element 20. For example, although not illustrated, when the light emitting element 20 is directly mounted on the base 12 without using the submount 14, due to the difference in thermal expansion coefficient between the base 12 and the light emitting element 20, due to overheating during mounting or heat generation during driving. The light emitting element 20 may be warped and reliability may be reduced. In the present embodiment, by using the submount 14, it is possible to reduce the warpage of the light emitting element 20 caused by the difference in thermal expansion coefficient between the base 12 and the light emitting element 20 and improve the reliability.

The light emitting element 20 is mounted on the main surface 11 (mounting surface) of the light source substrate 10, that is, the upper surface of the submount 14. A plurality of light emitting elements 20 (10 in the illustrated example) are mounted on the light source substrate 10. The plurality of light emitting elements 20 are arranged in a plurality of rows and a plurality of columns (two-dimensional array). In the illustrated example, two rows of five light emitting elements 20 arranged along the Y axis are arranged in the X axis direction. That is, the light emitting elements 20 are arranged in 5 rows and 2 columns. The arrangement of the light emitting elements 20 on the main surface 11 of the light source substrate 10 is not particularly limited.

  The light emitting element 20 is an edge emitting semiconductor light emitting element. The light emitting element 20 is, for example, a semiconductor laser or an SLD (super luminescent diode). Since the SLD can emit light with reduced speckle noise compared to a semiconductor laser and can achieve higher output than an LED, for example, the light source device 100 can be used as a light source such as a projector. It is suitable for use. The light emitting element 20 emits light in the in-plane direction of the main surface 11 of the light source substrate 10 (X-axis direction in the illustrated example). Hereinafter, a case where the light emitting element 20 is an InGaAlP-based (red) SLD will be described with reference to FIG.

  As illustrated in FIG. 5, the light emitting element 20 includes a stacked body 201 including an active layer 206, a first electrode 210, and a second electrode 212.

  The stacked body 201 includes a base layer 202, a first cladding layer 204, an active layer 206, and a second cladding layer 208. The stacked body 201 is formed by epitaxially growing the first cladding layer 204, the active layer 206, and the second cladding layer 208 in this order on the base layer 202.

  The base layer 202 includes, for example, a semiconductor substrate and a buffer layer. As the semiconductor substrate, for example, a first conductivity type (for example, n-type) GaAs substrate or the like can be used. The buffer layer is, for example, an n-type GaAs layer, an AlGaAs layer, an InGaP layer, or the like. When the buffer layer is epitaxially grown, the crystallinity of the layer formed thereabove can be improved.

  The first cladding layer 204 is, for example, an n-type InGaAlP layer.

  The active layer 206 is sandwiched between the first cladding layer 204 and the second cladding layer 208. The active layer 206 has, for example, a multiple quantum well (MQW) structure in which three quantum well structures each composed of an InGaP well layer and an InGaAlP barrier layer are stacked.

  The active layer 206 is a layer capable of generating light by being injected with current. A part of the active layer 206 constitutes an optical waveguide 209 that guides light generated in the active layer 206.

  The optical waveguide 209 connects the side surface of the active layer 206 on the −X axis direction side and the side surface of the active layer 206 on the + X axis direction side. Although not shown, the optical waveguide 209 is about 0.5 to 10 degrees with respect to the perpendicular of the light emitting end face 22 when viewed from the Z-axis direction (stacking direction of the active layer 206 and the first cladding layer 204). Inclined to form an angle. Thereby, laser oscillation can be suppressed.

  The light generated in the active layer 206 is emitted in the + X-axis direction from the light emission end face 22 provided on the side surface on the + X-axis direction side of the active layer 206 and is emitted on the side surface on the −X-axis direction side. Injected from the end face 22 in the −X-axis direction.

  The second cladding layer 208 is, for example, a second conductivity type (for example, p-type) InGaAlP layer.

The first electrode 210 is provided under the second cladding layer 208. A contact layer (not shown) may be provided between the first electrode 210 and the second cladding layer 208. For example, the current path between the electrodes 210 and 212 is determined by the planar shape (the shape viewed from the Z-axis direction) of the contact surface between the first electrode 210 and a layer (contact layer) in ohmic contact with the first electrode 210. As a result, the planar shape of the optical waveguide 209 is determined. The second electrode 212 is provided on the base layer 202. The first electrode 210 is connected to the first wiring 50. The second electrode 212 is connected to the second wiring 52.

  The light emitting element 20 is mounted on the light source substrate 10 in a junction-down state. That is, the light emitting element 20 is mounted such that the active layer 206 is positioned closer to the submount 14 than the base layer 202. Thereby, since the active layer 206 which is a heat generation source can be brought close to the submount 14, heat dissipation can be improved.

  The light-emitting element 20 may be a so-called refractive index waveguide type in which light is confined by providing a refractive index difference in the active layer 206, or an optical waveguide generated by injecting a current becomes a waveguide region as it is. A so-called gain waveguide type may be used.

  Although the InGaAlP light emitting element has been described above, any material system capable of forming an optical waveguide can be used as the light emitting element 20. For example, semiconductor materials such as AlGaN, GaN, InGaN, GaAs, AlGaAs, InGaAs, InGaAsP, InP, GaP, AlGaP, and ZnCdSe can be used.

  The prism 30 changes the optical path of the light emitted from the light emitting element 20. Specifically, the prism 30 bends the light emitted from the light emitting element 20 in a direction away from the main surface 11 of the light source substrate 10. In the illustrated example, the prism 30 bends light emitted from the light emitting element 20 and traveling in the X-axis direction in the + Z-axis direction.

  The prism 30 is reflected by the incident surface 32a on which the light emitted from the light emitting element 20 is incident, the reflecting surface 32b that reflects the light incident from the incident surface 32a, and changes the optical path of the light, and the reflecting surface 32b. And an emission surface 32c from which light is emitted.

  The incident surface 32 a is a surface perpendicular to the main surface 11 of the light source substrate 10. Although not shown, an antireflection film may be formed on the incident surface 32a.

  The reflection surface 32 b is inclined 45 degrees with respect to the main surface 11 of the light source substrate 10. That is, the reflecting surface 32 b is inclined 45 degrees with respect to the optical axis of the light emitted from the light emitting element 20. Although not shown, the reflective surface 32b is provided with a reflective film. The reflective film is, for example, a dielectric multilayer film. The light emitted from the light emitting element 20 is reflected by the reflecting surface 32 b and bent in a direction away from the main surface 11 of the light source substrate 10. In addition, the inclination with respect to the optical axis of the light of the reflecting surface 32b is not limited to 45 degrees, and the light traveling in the in-plane direction of the main surface 11 of the light source substrate 10 is bent in the direction away from the main surface 11 (+ Z axis direction side). Any tilt can be used.

  The emission surface 32 c is a surface parallel to the main surface 11 of the light source substrate 10. The exit surface 32 c is a surface from which light is emitted in the prism 30. The exit surface 32 c is connected to the base portion 36 of the optical element 35.

  The optical element 35 includes a plurality of prisms 30. The optical element 35 is an element in which a plurality of prisms 30 are arranged in a plurality of rows and a plurality of columns (array form). That is, the plurality of prisms 30 are integrally formed. The optical element 35 is formed, for example, using a transparent substrate made of an inorganic material such as glass or quartz, or a resin material such as plastic as a base material.

  The optical element 35 has a first surface 37a (a surface facing the −Z-axis direction) that defines the hollow portion 2 (the bottom surface of the recess) and a second surface 37b (a + Z-axis direction opposite to the first surface 37a). Surface). In the optical element 35, a portion that protrudes in a prism shape from the first surface 37 a constitutes the prism 30. One prism 30 is provided for one light emitting end face 22 of the light emitting element 20. The plurality of prisms 30 corresponding to the plurality of light emission end faces 22 arranged along the Y-axis direction may be continuous. In the example illustrated in FIG. 1, a plurality (five) of prisms 30 corresponding to the light emission end faces 22 of the plurality (five) of light emitting elements 20 arranged along the Y axis are continuous.

  The optical element 35 has a recess. The concave portion of the optical element 35 forms a space (hollow portion 2) in which the light emitting element 20 is accommodated. Specifically, the optical element 35 constitutes the hollow portion 2 together with the light source substrate 10, and the light emitting element 20 is accommodated in the hollow portion 2. That is, the light emitting element 20 is accommodated in a space (hollow part 2) surrounded by the light source substrate 10 and the optical element 35. The light emitting element 20 can be hermetically sealed by the light source substrate 10 and the optical element 35.

  The hollow part 2 is a vacuum (pressure lower than atmospheric pressure) atmosphere or an inert gas (for example, nitrogen gas) atmosphere. The hollow portion 2 may be in a dry air (dry air) atmosphere.

  The optical element 35 has a support portion 38 bonded to the light source substrate 10. The support portion 38 is bonded to the main surface 11 of the light source substrate 10.

  The through electrode 40 is provided in the optical element 35. As shown in FIG. 1, the through electrode 40 is provided at an end in the + Y-axis direction and an end in the −Y-axis direction of the optical element 35 in a plan view (viewed from the Z-axis direction). The position where the through electrode 40 is provided is not particularly limited, and may be provided at the center of the optical element 35 in plan view. A plurality of through electrodes 40 (12 in the illustrated example) are provided, but the number is not particularly limited.

  The through electrode 40 is provided in the through hole 34 penetrating from the first surface 37 a to the second surface 37 b of the optical element 35. The through electrode 40 is electrically connected to the light emitting element 20. With the through electrode 40, the wiring in the hollow portion 2 can be electrically connected to the wiring outside the hollow portion 2. In the illustrated example, the through electrode 40 electrically connects the second wiring 52 formed on the first surface 37 a of the optical element 35 and the third wiring 53 formed on the second surface 37 b of the optical element 35. Connected. Further, the through electrode 40 (second member 44) also functions as a sealing member that closes the through hole 34. The through electrode 40 includes a first member 42 and a second member 44.

  The first member 42 is provided on the inner wall of the optical element 35 that defines the through hole 34. The first member 42 is a conductive layer, for example, a metal layer (metallized layer).

  The second member 44 is provided inside the first member 42. The second member 44 is filled in a space inside the first member 42. The second member 44 is a sealing member that seals the through hole 34. The second member 44 has conductivity. The material of the second member 44 is, for example, a metal such as solder or copper. The second member 44 may be insulative. In this case, the material of the second member 44 is glass, resin, or the like.

  The first wiring 50 is provided on the main surface 11 of the light source substrate 10. The first wiring 50 is electrically connected to the first electrode 210 of the light emitting element 20. The second wiring 52 is provided on the first surface 37 a of the optical element 35. The second wiring 52 is electrically connected to the second electrode 212 of the light emitting element 20.

  The first wiring 50 and the second wiring 52 are wirings for driving the light emitting element 20. The plurality of light emitting elements 20 arranged along the Y-axis direction are connected in series by the plurality of first wirings 50 and the plurality of second wirings 52.

  As shown in FIG. 4, between the adjacent light emitting elements 20, the first wiring 50 connected to the first electrode 210 of one light emitting element 20 and the second electrode 212 of the other light emitting element 20 are connected. The second wiring 52 is connected. In the illustrated example, the second wiring 52 is formed on the convex portion 39 provided on the first surface 37 a of the optical element 35, whereby the first wiring 50 and the second wiring 52 are connected.

  The second end 52 of the plurality of second lines 52 connecting the plurality of light emitting elements 20 in series is connected to the through electrode 40. The plurality of light emitting elements 20 connected in series are connected to the flexible substrate 54 through the through electrode 40 and the third wiring 53.

  The third wiring 53 is provided on the second surface 37 b of the optical element 35. The third wiring 53 electrically connects the through electrode 40 and the flexible substrate 54.

  The collimating lens 60 collimates the light reflected by the prism 30 (folded light). The light that has passed through the collimating lens 60 is emitted from the collimating lens 60 as parallel light (or substantially parallel light). A plurality of collimating lenses 60 (20 in the illustrated example) are provided in a one-to-one correspondence with the plurality of prisms 30.

  The optical element 65 includes a plurality of collimating lenses 60. The optical element 65 is an element in which a plurality of collimating lenses 60 are arranged in a plurality of rows and a plurality of columns (array form). That is, the plurality of collimating lenses 60 are integrally formed. The optical element 65 is formed using, for example, a transparent substrate made of an inorganic material such as glass or quartz, or a resin material such as plastic. The optical element 65 is bonded onto the optical element 35.

  In the light source device 100, the light emitted from the light emitting end face 22 of the light emitting element 20 is incident from the incident surface 32 a of the prism 30, reflected by the reflecting surface 32 b, and bent in a direction away from the main surface 11 of the light source substrate 10. . The light reflected by the reflecting surface 32 b is collimated by the collimator lens 60 and emitted as parallel light (or substantially parallel light) L. Since the light source device 100 includes the plurality of light emitting elements 20, the light source device 100 can emit a light beam composed of a plurality of parallel lights L.

  The light source device 100 has the following features, for example.

  In the light source device 100, the optical element 35 has a through hole 34 that penetrates from the first surface 37 a that defines the hollow portion 2 to the second surface 37 b, and the through hole 34 is formed on the inner wall of the optical element 35 that defines the through hole 34. It is sealed by a through electrode 40 having a first member 42 provided and a second member 44 provided inside the first member 42. Therefore, in the light source device 200, the atmosphere in the hollow portion 2 can be adjusted through the through hole 34 in the manufacturing process, as will be described later. Therefore, in the light source device 100, the hollow part 2 can be made into a desired atmosphere, and the light emitting element 20 can maintain the stable characteristic.

  Further, in the light source device 100, since the through electrode 40 also serves as a sealing member for closing the through hole 34, the number of parts can be reduced.

In the light source device 100, the light emitting element 20 emits light in the in-plane direction of the main surface 11 of the light source substrate 10, and the optical element 35 separates the light emitted from the light emitting element 20 from the main surface 11 of the light source substrate 10. It has a prism 30 that bends in the direction. Therefore, in the light source device 100, an edge-emitting light-emitting element can be used as the light-emitting element 20. For example, the light output obtained from one light-emitting element 20 can be increased compared to the case where a surface-emitting light-emitting element is used. can do. Further, in the light source device 100, since a plurality of edge-emitting light emitting elements 20 can be mounted on the light source substrate 10, high output can be achieved.

2. Method for Manufacturing Light Source Device Next, a method for manufacturing the light source device 100 according to the present embodiment will be described with reference to the drawings. FIG. 6 is a flowchart illustrating an example of a method for manufacturing the light source device 100 according to the present embodiment. 7 to 19 are cross-sectional views schematically showing the manufacturing process of the light source device 100. 7, 10, 15, and 18 correspond to FIG. 2. 8, FIG. 11, FIG. 13 and FIG. 16 correspond to FIG. 9, FIG. 12, FIG. 14, FIG. 17, and FIG. 19 correspond to FIG.

  First, as shown in FIGS. 7 to 9, an optical element 35 on which a plurality of prisms 30 are formed is prepared.

  Next, the through hole 34 is formed in the optical element 35 (step S100). The through hole 34 can be formed by, for example, etching or laser processing.

  Next, as shown in FIGS. 10 to 12, a metal layer (metallized layer) to be the first member 42 is formed on the inner wall of the optical element 35 that defines the through hole 34 (step S <b> 102). The first member 42 is formed by a plating method or the like.

  Next, the second wiring 52 is formed on the first surface 37a of the optical element 35, and the third wiring 53 is formed on the second surface 37b of the optical element 35 (step S104). The second wiring 52 and the third wiring 53 are formed so as not to block the through hole 34. That is, the second wiring 52 and the third wiring 53 are formed avoiding the through hole 34. The second wiring 52 and the third wiring 53 are formed by, for example, a vacuum deposition method, a sputtering method, a plating method, or the like.

  In addition, you may form the 1st member 42, the 2nd wiring 52, and the 3rd wiring 53 simultaneously by the same process. In this case, the first member 42, the second wiring 52, and the third wiring 53 may be formed by, for example, a plating method.

  Next, as shown in FIGS. 13 and 14, the light emitting element 20 is aligned with the optical element 35 (prism 30), and the light emitting element 20 is placed (fixed) on the optical element 35 (step S106).

  Specifically, the light emitting element 20 is moved on the second wiring 52 formed in the optical element 35 to align with the prism 30, and then the light emitting element 20 is attached to the optical element by using a solder material such as AuSn. 35. At this time, the second electrode 212 of the light emitting element 20 is electrically connected to the second wiring 52 formed in the optical element 35.

  The light emitting element 20 is bonded to the optical element 35 by curing the silver paste in an oven or the like after aligning the light emitting element 20 with the prism 30 in a state where silver paste or the like is applied onto the second wiring 52. May be.

  Next, as shown in FIGS. 15 to 17, the optical element 35 on which the light emitting element 20 is placed and the light source substrate 10 are joined to form a hollow portion 2 formed by the optical element 35 and the light source substrate 10. The light emitting element 20 is accommodated (step S108).

  The optical element 35 and the light source substrate 10 are joined by joining the support portion 38 of the optical element 35 and the submount 14. The support 38 of the optical element 35 and the submount 14 are joined using solder, silver paste, UV curable adhesive, thermosetting adhesive, low melting point glass, or the like.

  In addition, when joining the support part 38 and the submount 14 using a solder or silver paste, it is preferable to perform a metallization process on the joining surface of the support part 38 in advance. By joining the optical element 35 to the light source substrate 10, the hollow portion 2 is formed, and the light emitting element 20 is accommodated in the hollow portion 2.

  The light emitting element 20 is mounted on the light source substrate 10 at the same time as the optical element 35 and the light source substrate 10 are joined. Specifically, the first electrode 210 of the light emitting element 20 and the first wiring 50 formed on the submount 14 are connected using solder such as AuSn, silver paste, or the like. Similarly, the first wiring 50 and the second wiring 52 formed on the convex portion 39 of the optical element 35 are connected using solder such as AuSn, silver paste, or the like. Thereby, the light emitting element 20 is mounted on the light source substrate 10.

  The light source substrate 10 is formed by joining the base 12 and the submount 14.

  Next, the atmosphere of the hollow portion 2 is adjusted through the through hole 34 (step S110).

  When making the hollow part 2 into a vacuum atmosphere, the gas in the hollow part 2 is exhausted outside through the through-hole 34, and the pressure in the hollow part 2 is reduced to make the hollow part 2 into a vacuum atmosphere.

  Further, when the hollow portion 2 is set to an inert gas atmosphere, after the gas in the hollow portion 2 is exhausted to the outside through the through hole 34, an inert gas (for example, nitrogen gas) is supplied to the hollow portion 2 through the through hole 34. Then, the inside of the hollow portion 2 is made an inert gas atmosphere. The same applies to the case where the hollow portion 2 is in a dry air atmosphere.

  Next, as shown in FIG. 18 and FIG. 19, the through hole 34 is closed by the second member 44, thereby sealing the hollow portion 2 and forming the through electrode 40 (step S112).

  For example, a spherical solder ball (not shown) is disposed in the through hole 34 and the solder ball is melted by laser irradiation, whereby the through hole 34 can be closed with the second member 44. When making the inside of the hollow part 2 into a vacuum atmosphere, the sealing process of the through hole 34 by the second member 44 is performed in a vacuum atmosphere. Similarly, when making the inside of the hollow part 2 into an inert gas atmosphere, the sealing process of the through hole 34 by the second member 44 is performed in an inert gas atmosphere.

  Next, as shown in FIGS. 2 to 4, the optical element 65 is placed (bonded) on the optical element 35. Next, the flexible substrate 54 is connected to the first wiring 50.

  The light source device 100 can be manufactured through the above steps.

  The manufacturing method of the light source device 100 according to the present embodiment has the following features, for example.

In the method for manufacturing the light source device 100 according to the present embodiment, the optical element 35 and the light source substrate 10 are joined to accommodate the light emitting element 20 in the hollow portion 2, and the atmosphere of the hollow portion 2 is adjusted through the through hole 34. And a process. Thus, in this embodiment, since the process of adjusting the atmosphere of the hollow part 2 in which the light emitting element 20 is accommodated is included, the light source device 100 having the light emitting element 20 capable of maintaining stable characteristics can be manufactured.

  Further, the method for manufacturing the light source device 100 according to the present embodiment includes a step of sealing the hollow portion 2 and forming the through electrode 40 by closing the through hole 34 with the second member 44. Thus, in this embodiment, since the hollow part 2 is sealed and the through electrode 40 is formed by closing the through hole 34 with the second member 44, the manufacturing process can be simplified. .

  In the method for manufacturing the light source device 100 according to the present embodiment, in the step of adjusting the atmosphere of the hollow portion 2, the gas in the hollow portion 2 is exhausted through the through-hole 34 to make the hollow portion 2 into a vacuum atmosphere. Therefore, the hollow part 2 can be easily made into a vacuum atmosphere.

  In the method of manufacturing the light source device 100 according to the present embodiment, in the step of adjusting the atmosphere of the hollow portion 2, after exhausting the gas in the hollow portion 2 through the through hole 34, the inert gas enters the hollow portion 2 through the through hole 34. To make the hollow portion 2 an inert gas atmosphere. Therefore, the hollow part 2 can be easily made into an inert gas atmosphere.

  In the method for manufacturing the light source device 100 according to the present embodiment, the light emitting element 20 includes the step of placing the light emitting element 20 on the optical element 35, and in the step of bonding the optical element 35 and the light source substrate 10, The main surface 11 is mounted. Therefore, in the present embodiment, it is possible to manufacture the light source device 100 that can use an edge-emitting light emitting element as the light emitting element 20. Furthermore, since a plurality of edge-emitting light emitting elements 20 can be mounted on the light source substrate 10, the light source device 100 capable of achieving high output can be manufactured.

3. Modified Example Next, a modified example of the light source device 100 according to the present embodiment will be described. Hereinafter, differences from the example of the light source device 100 described above will be described, and description of similar points will be omitted.

(1) First Modification First, a first modification will be described. FIG. 20 is a flowchart illustrating an example of a method for manufacturing the light source device 100 according to the first modification. 21 and 22 are cross-sectional views schematically showing the manufacturing process of the light source device 100 according to the first modification. 21 corresponds to FIG. 3, and FIG. 22 corresponds to FIG.

  In addition, the structure of the light source device 100 which concerns on a 1st modification is the same as the light source device 100 shown in FIGS. 1-5 mentioned above, and abbreviate | omits illustration and description.

  In the method for manufacturing the light source device 100 described above, as shown in FIG. 6, after the light emitting element 20 is placed on the optical element 35 (after step S106), the optical element 35 and the light source substrate 10 are joined (step). S108).

  On the other hand, in the method for manufacturing the light source device 100 according to the first modified example, as shown in FIG. 20, after the light emitting element 20 is mounted on the light source substrate 10 (after step S206), the light emitting element 20 is mounted. The light source substrate 10 and the optical element 35 thus bonded are bonded (step S208).

  The step of forming the through hole 34 in the optical element 35 (step S200), the step of forming the first member 42 on the inner wall of the optical element 35 that defines the through hole 34 (step S202), and the second wiring 52 in the optical element 35. The step of forming the third wiring 53 (step S204) is the same as step S100, step S102, and step S104 described above, and the description thereof is omitted.

  After the step of forming the second wiring 52 and the third wiring 53 on the optical element 35 (step S204, see FIGS. 10 to 12), the light emitting element 20 is mounted on the light source substrate 10 as shown in FIGS. (Step S206).

  The light emitting element 20 is mounted by connecting the first electrode 210 of the light emitting element 20 and the first wiring 50 formed on the submount 14 using, for example, solder such as AuSn, silver paste, or the like. .

  Next, as shown in FIGS. 15 to 17, the optical element 35 and the light source substrate 10 on which the light emitting element 20 is mounted are joined, and the light emitting element 20 is accommodated in the hollow portion 2 (step S <b> 208).

  Simultaneously with the joining of the optical element 35 and the light source substrate 10, the second electrode 212 of the light emitting element 20 and the second wiring 52 formed on the optical element 35 are connected. Further, the first wiring 50 and the convexity of the optical element 35 are connected. The second wiring 52 formed on the portion 39 is connected.

  Next, a step of adjusting the atmosphere of the hollow portion 2 (step S210) and a step of sealing the hollow portion 2 by closing the through hole 34 with the second member 44 and forming the through electrode 40 (step S212). )I do. Step S210 and step S212 are the same as step S110 and step S112 described above, respectively, and description thereof is omitted.

  The light source device 100 can be manufactured through the above steps.

  According to the method for manufacturing the light source device 100 according to the first modified example, the same effects as those of the method for manufacturing the light source device 100 shown in FIG. 6 described above can be achieved.

(2) Second Modification Next, a second modification will be described. FIG. 23 is a cross-sectional view schematically showing a light source device 200 according to the second modification, and corresponds to FIG. Hereinafter, in the light source device 200, members having the same functions as those of the constituent members of the light source device 100 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the light source device 100 described above, as shown in FIG. 3, the prism 30 (optical element 35) and the collimating lens 60 (optical element 65) are separate bodies.

  On the other hand, in the light source device 200, as shown in FIG. 23, the prism 30 and the collimating lens 60 are provided integrally. The plurality of prisms 30 and the plurality of collimating lenses 60 are provided in one optical element 135.

  The manufacturing method of the light source device 200 is the same as the manufacturing method of the light source device 100 described above, and the description thereof is omitted.

  According to the light source device 200, since the prism 30 and the collimating lens 60 are integrally formed, the number of components can be reduced as compared with the case where the prism 30 and the collimating lens 60 are provided as independent optical elements. Therefore, alignment between parts is easy and manufacturing cost can be reduced.

4). Next, the projector according to the present embodiment will be described with reference to the drawings. FIG. 24 is a diagram schematically showing a projector 900 according to the present embodiment.

  As shown in FIG. 24, the projector 900 includes a red light source 100R that emits red light, green light, and blue light, a green light source 100G, and a blue light source 100B. The red light source 100R, the green light source 100G, and the blue light source 100B are light source devices according to the present invention. Hereinafter, an example in which the light source device 100 is used as the light source device according to the present invention will be described. For the sake of convenience, in FIG. 24, the casing constituting the projector 900 is omitted, and the light sources 100R, 100G, and 100B are simplified.

  The projector 900 further includes transmissive liquid crystal light valves (light modulation devices) 904R, 904G, and 904B, and a projection lens (projection device) 908.

  Light emitted from the light sources 100R, 100G, and 100B is incident on the liquid crystal light valves 904R, 904G, and 904B. Each of the liquid crystal light valves 904R, 904G, and 904B modulates incident light according to image information. The projection lens 908 enlarges and projects the image formed by the liquid crystal light valves 904R, 904G, and 904B onto a screen (display surface) 910.

  In addition, the projector 900 can include a cross dichroic prism (color light combining unit) 906 that combines light emitted from the liquid crystal light valves 904R, 904G, and 904B and guides the light to the projection lens 908.

  The three color lights modulated by the liquid crystal light valves 904R, 904G, and 904B are incident on the cross dichroic prism 906. This prism is formed by bonding four right-angle prisms, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are arranged on the inner surface thereof so as to be orthogonal to each other. These dielectric multilayer films combine the three color lights to form light representing a color image. The synthesized light is projected onto the screen 910 by the projection lens 908 which is a projection optical system, and an enlarged image is displayed.

  Since the projector 900 includes the light source device 100, the projector 900 can have a light source capable of maintaining stable characteristics.

  The projector 900 is a method (backlight method) in which the light source device 100 is disposed immediately below the liquid crystal light valves 904R, 904G, and 904B, and condensing and uniform illumination are performed simultaneously using the collimating lens 60 (see FIG. 1). . Therefore, the projector 900 can reduce the loss of the optical system and the number of parts.

  In the above example, a transmissive liquid crystal light valve is used as the light modulation device. However, a light valve other than liquid crystal may be used, or a reflective light valve may be used. Examples of such a light valve include a reflection type liquid crystal light valve and a digital micromirror device (Digital Micromirror Device). Further, the configuration of the projection optical system is appropriately changed depending on the type of light valve used.

  Further, the light source 100R, 100G, 100B has scanning means that is an image forming apparatus that displays an image of a desired size on the display surface by causing the light from the light source 100R, 100G, 100B to scan on the screen. The present invention can also be applied to a light source device of a simple scanning image display device (projector).

  In addition, embodiment mentioned above and a modification are examples, Comprising: It is not necessarily limited to these. For example, each embodiment and each modification can be combined as appropriate.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 2 ... Hollow part, 10 ... Light source board | substrate, 11 ... Main surface, 12 ... Base, 14 ... Submount, 20 ... Light emitting element, 22 ... Light emission end surface, 30 ... Prism, 32a ... Incident surface, 32b ... Reflective surface, 32c DESCRIPTION OF SYMBOLS ... Outgoing surface, 34 ... Through-hole, 35 ... Optical element, 36 ... Base part, 37a ... 1st surface, 37b ... 2nd surface, 38 ... Support part, 39 ... Convex part, 40 ... Through electrode, 42 ... 1st member 44 ... 2nd member, 50 ... 1st wiring, 52 ... 2nd wiring, 53 ... 3rd wiring, 54 ... Flexible substrate, 60 ... Collimating lens, 65 ... Optical element, 100 ... Light source device, 100R ... Blue light source, DESCRIPTION OF SYMBOLS 100G ... Green light source, 100B ... Red light source, 135 ... Optical element, 200 ... Light source device, 201 ... Laminated body, 202 ... Base layer, 204 ... 1st clad layer, 206 ... Active layer, 208 ... 2nd clad layer, 209 ... Optical waveguide, 21 ... first electrode, 212: second electrode, 900 ... projector, 904R ... liquid crystal light valve, 904G ... liquid crystal light valve, 904B ... liquid crystal light valve, 906 ... cross dichroic prism 908 ... projection lens 910 ... screen

Claims (9)

Forming a through hole in the optical element;
Forming a conductive first member on the inner wall of the optical element defining the through hole;
Bonding the optical element and the light source substrate, and housing the light emitting element in a hollow portion formed by the optical element and the light source substrate;
Adjusting the atmosphere of the hollow portion through the through hole;
By closing the through hole with a second member, the hollow portion is sealed, and a through electrode having the first member and the second member and electrically connected to the light emitting element is formed. A method of manufacturing a light source device.   2. The method of manufacturing a light source device according to claim 1, wherein, in the step of adjusting the atmosphere of the hollow portion, the gas in the hollow portion is exhausted through the through hole to make the hollow portion into a vacuum atmosphere. .   In the step of adjusting the atmosphere of the hollow portion, after exhausting the gas in the hollow portion through the through-hole, an inert gas is supplied to the hollow portion through the through-hole, so that the hollow portion is brought into an inert gas atmosphere. The method of manufacturing a light source device according to claim 1, wherein: Including the step of placing the light emitting element on the optical element before the step of housing the light emitting element in the hollow portion;
In the step of bonding the optical element and the light source substrate, the light emitting element is mounted on a mounting surface of the light source substrate,
The light emitting element emits light in an in-plane direction of the mounting surface,
4. The method of manufacturing a light source device according to claim 1, wherein the optical element has a prism that bends light emitted from the light emitting element in a direction away from the mounting surface. 5. . A light source substrate;
A light emitting element mounted on the light source substrate;
An optical element that constitutes a hollow portion that houses the light emitting element together with the light source substrate;
Including
The optical element has a through hole penetrating from a first surface defining the hollow portion to a second surface opposite to the first surface,
The through hole is sealed by a through electrode having a first member provided on an inner wall of the optical element that defines the through hole, and a second member provided on the inner side of the first member,
The light source device, wherein the through electrode is electrically connected to the light emitting element.   The light source device according to claim 5, wherein the hollow portion is a vacuum atmosphere or an inert gas atmosphere. The light emitting element emits light in an in-plane direction of a mounting surface on which the light emitting element of the light source substrate is mounted,
The light source device according to claim 5, wherein the optical element includes a prism that bends light emitted from the light emitting element in a direction away from the mounting surface.   The light source device according to claim 5, wherein a plurality of the light emitting elements are mounted on the light source substrate. A light source device according to any one of claims 5 to 8,
A light modulation device that modulates light emitted from the light source device according to image information;
A projection device for projecting an image formed by the light modulation device;
Including a projector.

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