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JP2017218469A - 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法 - Google Patents

導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法 Download PDF

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Publication number
JP2017218469A
JP2017218469A JP2016111395A JP2016111395A JP2017218469A JP 2017218469 A JP2017218469 A JP 2017218469A JP 2016111395 A JP2016111395 A JP 2016111395A JP 2016111395 A JP2016111395 A JP 2016111395A JP 2017218469 A JP2017218469 A JP 2017218469A
Authority
JP
Japan
Prior art keywords
solvent
printing
conductive pattern
pattern
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016111395A
Other languages
English (en)
Japanese (ja)
Inventor
佐藤　武
Takeshi Sato
武 佐藤
彩 岡田
Aya Okada
彩 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DNP Fine Chemicals Co Ltd
Original Assignee
DNP Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DNP Fine Chemicals Co Ltd filed Critical DNP Fine Chemicals Co Ltd
Priority to JP2016111395A priority Critical patent/JP2017218469A/ja
Priority to TW106118083A priority patent/TW201817826A/zh
Priority to PCT/JP2017/020533 priority patent/WO2017209266A1/ja
Publication of JP2017218469A publication Critical patent/JP2017218469A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/10—Intaglio printing ; Gravure printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/04—Printing plates or foils; Materials therefor metallic
    • B41N1/06—Printing plates or foils; Materials therefor metallic for relief printing or intaglio printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Printing Methods (AREA)
JP2016111395A 2016-06-03 2016-06-03 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法 Pending JP2017218469A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016111395A JP2017218469A (ja) 2016-06-03 2016-06-03 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法
TW106118083A TW201817826A (zh) 2016-06-03 2017-06-01 導電性圖案印刷用組成物及具有導電性圖案之基板的製造方法
PCT/JP2017/020533 WO2017209266A1 (ja) 2016-06-03 2017-06-02 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016111395A JP2017218469A (ja) 2016-06-03 2016-06-03 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018008135A Division JP6431219B2 (ja) 2018-01-22 2018-01-22 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法

Publications (1)

Publication Number Publication Date
JP2017218469A true JP2017218469A (ja) 2017-12-14

Family

ID=60478749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016111395A Pending JP2017218469A (ja) 2016-06-03 2016-06-03 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法

Country Status (3)

Country Link
JP (1) JP2017218469A (zh)
TW (1) TW201817826A (zh)
WO (1) WO2017209266A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019203050A1 (ja) * 2018-04-16 2019-10-24 株式会社ブイ・テクノロジー 配線修正装置および配線修正方法
JP2020111651A (ja) * 2019-01-09 2020-07-27 凸版印刷株式会社 塗布剤、印刷物及び印刷物の製造方法
JP2022018051A (ja) * 2020-07-14 2022-01-26 住友ベークライト株式会社 ペースト状樹脂組成物、高熱伝導性材料、および半導体装置
JP2023140758A (ja) * 2022-03-23 2023-10-05 株式会社ノリタケカンパニーリミテド 導電性インクジェットインク

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109986599B (zh) * 2017-12-29 2020-10-02 北京纳米能源与系统研究所 摩擦电光智能皮肤、机械手及机器人
JP2020004524A (ja) * 2018-06-26 2020-01-09 ナミックス株式会社 真空印刷用導電性ペースト
TWI905231B (zh) * 2020-08-24 2025-11-21 日商日油股份有限公司 導電性組合物

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757545A (ja) * 1993-07-19 1995-03-03 Dainippon Printing Co Ltd 透明導電性印刷物
WO2012014481A1 (ja) * 2010-07-30 2012-02-02 太陽ホールディングス株式会社 オフセット印刷用導電性ペースト
JP2013114837A (ja) * 2011-11-28 2013-06-10 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物
JP2013114836A (ja) * 2011-11-28 2013-06-10 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物
JP2013131385A (ja) * 2011-12-21 2013-07-04 Taiyo Holdings Co Ltd 導電性ペースト
WO2015077145A2 (en) * 2013-11-22 2015-05-28 C3Nano Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
JP2015160397A (ja) * 2014-02-28 2015-09-07 国立大学法人山形大学 グラビアオフセット印刷用ブランケット及びこれを用いた配線パターンの形成方法
JP2015172103A (ja) * 2014-03-11 2015-10-01 Dic株式会社 導電性インキ組成物、導電性パターンの製造方法及び導電性回路
WO2015151941A1 (ja) * 2014-04-01 2015-10-08 株式会社ダイセル 凹版オフセット印刷用銀ナノ粒子含有インク及びその製造方法
WO2015163076A1 (ja) * 2014-04-25 2015-10-29 株式会社ダイセル 銀粒子塗料組成物

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757545A (ja) * 1993-07-19 1995-03-03 Dainippon Printing Co Ltd 透明導電性印刷物
WO2012014481A1 (ja) * 2010-07-30 2012-02-02 太陽ホールディングス株式会社 オフセット印刷用導電性ペースト
JP2013114837A (ja) * 2011-11-28 2013-06-10 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物
JP2013114836A (ja) * 2011-11-28 2013-06-10 Kyoto Elex Kk 加熱硬化型導電性ペースト組成物
JP2013131385A (ja) * 2011-12-21 2013-07-04 Taiyo Holdings Co Ltd 導電性ペースト
WO2015077145A2 (en) * 2013-11-22 2015-05-28 C3Nano Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
JP2015160397A (ja) * 2014-02-28 2015-09-07 国立大学法人山形大学 グラビアオフセット印刷用ブランケット及びこれを用いた配線パターンの形成方法
JP2015172103A (ja) * 2014-03-11 2015-10-01 Dic株式会社 導電性インキ組成物、導電性パターンの製造方法及び導電性回路
WO2015151941A1 (ja) * 2014-04-01 2015-10-08 株式会社ダイセル 凹版オフセット印刷用銀ナノ粒子含有インク及びその製造方法
WO2015163076A1 (ja) * 2014-04-25 2015-10-29 株式会社ダイセル 銀粒子塗料組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
南原聡: "フォトシンタリング型導電性銅ナノインクの特長と有版印刷用インクの特性", コンバーテック, vol. ２０１５年７月号, JPN6017041176, 15 July 2015 (2015-07-15), JP, pages 28 - 31, ISSN: 0003669065 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019203050A1 (ja) * 2018-04-16 2019-10-24 株式会社ブイ・テクノロジー 配線修正装置および配線修正方法
JP2020111651A (ja) * 2019-01-09 2020-07-27 凸版印刷株式会社 塗布剤、印刷物及び印刷物の製造方法
JP2022018051A (ja) * 2020-07-14 2022-01-26 住友ベークライト株式会社 ペースト状樹脂組成物、高熱伝導性材料、および半導体装置
JP7577949B2 (ja) 2020-07-14 2024-11-06 住友ベークライト株式会社 ペースト状樹脂組成物、高熱伝導性材料、および半導体装置
JP2023140758A (ja) * 2022-03-23 2023-10-05 株式会社ノリタケカンパニーリミテド 導電性インクジェットインク
JP7744861B2 (ja) 2022-03-23 2025-09-26 ノリタケ株式会社 導電性インクジェットインク

Also Published As

Publication number Publication date
TW201817826A (zh) 2018-05-16
WO2017209266A1 (ja) 2017-12-07

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