JP2017132033A - Grinding device and grinding method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grinding device capable of reducing total thickness fluctuation by generating a large grinding area on the surface of article to be ground, executing grinding with an equal quantity, and smoothly discharging chips.SOLUTION: This grinding device is provided with: a table 200 that has a mounting rotary shaft 220 and rotates around the mounting rotary shaft 220; an article 300 that is positioned on the table 200 to be ground; a grindstone base 400 that has a grindstone rotary shaft 420 and rotates around the grindstone rotary shaft 420; and grinding teeth 500 that are connected to the grindstone base 400 and that come into contact with the article 300 to grind the same, generate a corresponding grinding area by grinding the surface of the article 300, and cross virtual radiations intersecting the center of a grindstone disk 410 and the center of the grinding teeth 500 at the grinding angles of 0 to 35 degrees.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a grinding apparatus and a grinding method using the same, and more particularly, to a grinding apparatus and a grinding method capable of reducing a variation in the total thickness of an object to be ground after grinding.

  Grinding is one of the most important processes in the manufacturing or precision grinding field. In general, a conventional grindstone head forms a grindstone group by combining grinding teeth when used, and this grindstone group is connected to a grindstone rotating motor via a grindstone rotating shaft to perform a grinding operation. The grinding teeth are installed so as to correspond to the center of the wheel head and to be radial. However, since the displacement direction of the grinding tooth and the extending direction of the grinding side surface of the grinding tooth are perpendicular to each other, the scrap of the object to be ground collects and accumulates on the grinding side facing the displacement direction of the grinding tooth. The quality of the grinding is generally not high. In addition, since the grinding scraps easily accumulate on the side surfaces of the grinding teeth, a phenomenon of heat storage is caused, the grinding function is greatly reduced, and the service life is shortened.

  Other commonly used wheel heads, when in use, combine grinding teeth to form a grinding wheel group, and connect the grinding wheel group to a grinding wheel rotation motor via a grinding wheel rotation shaft to perform grinding operations. Has a specific grinding angle, and the grinding angle often used in the industry is 35 to 45 degrees. Such a structure contributes to the removal of debris, but since the area of frictional contact is always too small, the effectiveness and quality of the grinding are reduced, and the total thickness variation (TTV) is too large. It will not meet the manufacturer's needs.

  According to the above, since there is no grinding apparatus and grinding method that can smoothly discharge waste in the current market and reduce the total thickness fluctuation of the workpiece after grinding, any person skilled in the art can study the solution. It is carried out.

  Therefore, according to the present invention, the rotation speed and the rotation direction can be controlled by a special grinding angle to generate a large grinding area on the surface of the object to be ground and to be ground in an equal amount. Provided are a grinding apparatus and a grinding method using the same, which reduce a total thickness variation of an object. In addition, by a combination of a certain range of grinding angles and appropriate parameters, the grinding apparatus can not only smoothly discharge waste during grinding but also reduce the chipping rate. In addition, it is possible to grind a plurality of objects to be ground at a predetermined display position at the same time, not only greatly increasing the production amount but also improving the economic effect and reducing the production cost.

  According to one aspect of the present invention, a mounting board that performs a rotation operation, at least one object to be ground positioned on the mounting board, a grindstone disk that performs a rotation operation on the mounting board, and a grindstone disk A plurality of grinding teeth that contact and grind the workpiece, each grinding tooth grinding the surface of the workpiece to produce a grinding area, Provided is a grinding device that intersects virtual radiation intersecting the center at a grinding angle greater than 0 degree and less than 35 degrees.

  As a result, the grinding apparatus of the present invention adjusts the rotation speed and the rotation direction with a special grinding angle to generate a large grinding area on the surface of the workpiece, and at the same time, grinds the same amount and smoothly performs the waste. Can be discharged, and the variation in the total thickness of the workpiece after grinding can be reduced.

  According to the grinding apparatus, the grinding angle may be greater than 0 degree and 20 degrees or less. In addition, the above-mentioned mounting plate and a grindstone disk are circular. Each of the grinding teeth is rectangular or arched and is arranged in a spiral. The workpiece may be circular, elliptical, square or triangular. In addition, the above-described mounting plate may rotate clockwise or counterclockwise, and the grindstone disk may also rotate clockwise or counterclockwise. The mounting rotating shaft and the grindstone rotating shaft are parallel to each other, the surface of the mounting plate and the grinding surface of each grinding tooth are parallel to each other, and the mounting rotating shaft and the surface of the mounting plate are perpendicular to each other. The grinding device may include a mounting rotation motor and a grindstone rotation motor. Among these, the mounting rotation motor is connected to a mounting rotation shaft connected to the mounting board and controls the mounting board to rotate at the mounting rotation speed. The grindstone rotating motor is connected to a grindstone rotating shaft connected between the grindstone disk and controls the grindstone disk to rotate at the grindstone rotating speed. The mounting rotation speed is equal to or lower than the grindstone rotation speed. Each of the grinding teeth has a proximal end having a proximal end width and a distal end having a distal end width. The proximal end and the center of the grindstone disk are separated from each other by a proximal distance, and the distal end and the center of the grindstone disk are separated from each other by the distal end distance. The proximal distance is smaller than the distal distance, and the proximal width is different from the distal width. Each of the grinding teeth may have a first side and a second side, and the first side corresponds to the second side. The proximal end and the distal end are planar or curved, and the first side and the second side are planar or curved. The side length of the first side is equal to or shorter than the side length of the second side and is larger than the base end width.

  According to another embodiment of the aspect of the present invention, the mounting board includes a mounting board and a mounting rotating shaft, and the mounting board is connected to the mounting rotating shaft and rotates around the mounting rotating shaft. A grindstone base having a placing table, a plurality of objects to be positioned on the placing board, a grindstone disk and a grindstone rotating shaft, the grindstone disk being connected to the grindstone rotating shaft and rotating about the grindstone rotating shaft; A plurality of grinding teeth connected to the grinding wheel disk for contacting and grinding the workpiece, each of the grinding teeth generating a grinding area on a surface of the workpiece, the center of the grinding wheel and Virtual radiation that intersects the center of the grinding teeth intersects with a grinding angle greater than 0 degree and less than 35 degrees, the grinding area corresponds to the grinding angle, and the mounting board rotates clockwise or counterclockwise. And the grindstone disc rotates clockwise or counterclockwise and rotates And a grinding wheel rotating shaft are parallel to each other, a surface of the mounting board and each grinding surface of the grinding teeth are parallel to each other, and the mounting rotating shaft and the surface of the mounting board are perpendicular to each other. .

  As a result, the grinding apparatus of the present invention can grind a plurality of objects to be ground at the same time, not only greatly increasing the production amount but also improving the economic effect and reducing the production cost.

  Another aspect of the present invention provides a grinding method using the above grinding apparatus. In this grinding method, a rotating process for rotating the mounting board and the grindstone disk, and the object to be ground are ground and ground by the grinding teeth, and each grinding tooth is ground on the surface of the object to be ground to generate a grinding area. And a virtual radiation that intersects the center of the grinding wheel disk and the center of one grinding tooth, and a grinding process that intersects at a grinding angle that is greater than 0 degree and less than 35 degrees, and whose grinding area corresponds to the grinding angle.

  As a result, the grinding apparatus of the present invention adjusts the rotation speed and grinding area of the mounting table and the grinding wheel table with a special grinding angle to produce a large grinding area on the surface of the work piece and grind with equal amount. Accordingly, the waste can be discharged smoothly, and the variation in the total thickness of the workpiece after grinding can be reduced.

  According to the grinding method, the rotation process may include a rotation speed control sub-process. In this rotational speed control sub-process, the mounting disk is controlled to rotate at the mounting rotational speed by the mounting rotational motor, and the grindstone disk is controlled to rotate at the grinding wheel rotational speed by the grinding wheel rotational motor. The rotational speed is equal to or lower than the grinding wheel rotational speed. Further, the rotation process may include a rotation direction control sub-process. This rotation direction control sub-process controls the mounting board to rotate in the mounting rotation direction and controls the grindstone disk to rotate in the grinding wheel rotation direction, and the mounting rotation direction is clockwise or counterclockwise. The grindstone rotation direction may be clockwise or counterclockwise. The grinding method may include an axial direction control step. This axial direction control step controls the axial direction of the mounting rotary shaft and the grindstone rotating shaft, the mounting rotating shaft is connected to the mounting board, and the grindstone rotating shaft is connected to the grindstone disk. The rotating shaft and the grindstone rotating shaft are parallel to each other, and the mounting board and the grindstone disk are parallel to each other. The grinding angle may be greater than 0 degree and 20 degrees or less. Each of the grinding teeth has a proximal end having a proximal end width and a distal end having a distal end width. The proximal end and the center of the grindstone disk are separated from each other by a proximal distance, and the distal end and the center of the grindstone disk are separated from each other by the distal end distance. The proximal distance is smaller than the distal distance, and the proximal width is different from the distal width. Each of the grinding teeth may have a first side and a second side, and the first side corresponds to the second side. The proximal end and the distal end are planar or curved, and the first side and the second side are planar or curved. The side length of the first side is equal to or shorter than the side length of the second side and is larger than the base end width.

It is a perspective schematic diagram which shows the grinding device of one Example of this invention. It is a top view which shows the grindstone disk of FIG. It is sectional drawing which shows the grindstone disk of FIG. 2A. It is a top view which shows grinding a to-be-ground object with the mounting board and grindstone disk of FIG. It is a top view which shows the grindstone disk of another Example of this invention. It is a perspective schematic diagram which shows the grinding device of another Example of this invention. It is a schematic diagram which shows the flow of the grinding method of one Example of this invention. It is a schematic diagram which shows the flow of the grinding method of another Example of this invention. FIG. 4 is a data diagram of total thickness variation corresponding to grinding angle at a 254 millimeter wheel disc diameter of three 4 inch wafers. FIG. 6 is a data diagram of total thickness variation corresponding to grinding angle at a grinding disk diameter of 304 millimeters for five 4-inch wafers. It is a top view which shows the grindstone disk of the grinding apparatus of the other Example of this invention. It is a schematic diagram which shows the grinding tooth of FIG. 10A. It is a top view which shows grinding a to-be-ground object with the mounting board of FIG. 10A, and a grindstone disk. It is a schematic diagram which shows the grinding tooth of the other Example of this invention. It is a schematic diagram which shows the grinding tooth of the other Example of this invention. It is a schematic diagram which shows the grinding tooth of the other Example of this invention. It is a schematic diagram which shows the grinding tooth of the other Example of this invention. It is a data figure of the grinding ratio corresponding to the tooth type of the grinding tooth in the grinding wheel disk diameter of 254 millimeters. It is a data figure of the grinding ratio corresponding to the tooth type of the grinding tooth in the grinding wheel disk diameter of 304 millimeters.

  In the following description, numerous practical details are set forth in the following description in order to explain and clearly explain several embodiments of the present invention with reference to the drawings. However, it should be understood that these actual details are not intended to limit the invention. That is, in some embodiments of the present invention, these actual details are not necessary. In addition, in order to simplify the drawings, some conventional and conventional structures and elements are schematically shown in the drawings. Moreover, the same element may be shown with the same number.

  Please refer to FIGS. FIG. 1 is a schematic perspective view showing a grinding apparatus 100 according to an embodiment of the present invention. 2A is a top view showing the grindstone disk 410 of FIG. FIG. 2B is a cross-sectional view showing the grindstone disk 410 of FIG. 2A. FIG. 3 is a top view showing that the workpiece 300 is ground by the mounting board 210 and the grindstone disk 410 of FIG. As shown in the drawing, the grinding apparatus 100 includes a mounting table 200, a plurality of objects to be ground 300, a grindstone table 400 and a plurality of grinding teeth 500, a grindstone rotating motor 610 and a mounting rotating motor 620.

  The mounting table 200 includes a mounting board 210 and a mounting rotating shaft 220, and the mounting board 210 is connected to the mounting rotating shaft 220 and rotates around the mounting rotating shaft 220. The mounting board 210 is circular. The mounting board 210 may rotate clockwise or counterclockwise. In this embodiment, the mounting board 210 rotates clockwise. The mounting rotation shaft 220 and the surface of the mounting board 210 are perpendicular to each other. Further, in the grinding apparatus 100, the surface of the mounting board 210 has a slight protrusion with an inclination angle with respect to the horizontal plane, the radially inner portion is high, and the radially outer portion is low. The effect of discharging waste is improved by the simple shape structure.

  The object to be ground 300 is positioned on the mounting board 210, and five objects to be ground 300 are provided on the mounting board 210. The workpiece 300 of this embodiment is a 4-inch wafer and is circular. Of course, the workpiece 300 may have a circular shape, an elliptical shape, a square shape, a triangular shape, other polygonal shapes, or other materials. In addition, the object to be ground 300 is separated into equal distances and fixed to the mounting board 210, and has a certain thickness. It should be noted that the quality of the grinding technique is generally determined by the magnitude of the total thickness variation (TTV), which indicates the difference between the maximum thickness and the minimum thickness of the workpiece 300. This minimization of total thickness variation is a requirement that determines the thickness tolerance of the final product, and this number has an impact on the realization of thinner wafers and devices. The chipping rate can be reduced.

  The grindstone base 400 includes a grindstone disk 410 and a grindstone rotating shaft 420, and the grindstone disk 410 is connected to the grindstone rotating shaft 420 and rotates around the grindstone rotating shaft 420. The grindstone disk 410 is circular. The grindstone disk 410 may rotate clockwise or counterclockwise. In this embodiment, the grindstone disk 410 rotates counterclockwise, and the mounting board 210 rotates clockwise. In other words, the mounting board 210 and the grindstone disk 410 operate in the same direction with respect to the grinding surface. Further, the mounting rotary shaft 220 and the grindstone rotating shaft 420 are parallel to each other, and the surface of the mounting plate 210 and the surface of the grindstone disk 410 are parallel to each other and have the same planar area. The grindstone disk 410 has a hollow annular structure and has a middle ring inclined surface 412, and the grindstone disk 410 and the grindstone rotating shaft 420 can be stably tightened by this structure.

  The grinding teeth 500 are connected to the grinding wheel disk 410 and can contact and grind the workpiece 300. Each of the grinding teeth 500 may be elongated or arched, and the grinding teeth 500 of this embodiment are elongated and are arranged in a spiral. The outer end of the grinding tooth 500 is close to the outer edge of the grinding wheel disk 410. Each of the grinding teeth 500 intersects the center 430 of the grinding wheel disk 410 and the virtual radiation 440 that intersects the center of one grinding tooth 500 at a grinding angle θ. The ground surfaces of the grinding teeth 500 and the surface of the mounting plate 210 are parallel to each other. In addition, each of the grinding teeth 500 may grind the surface of one of the objects to be ground 300 to generate a grinding area. This grinding area corresponds to the grinding angle θ. Specifically, when the grinding angle θ changes, the grinding area also changes correspondingly. In addition, the grinding area has a corresponding correlation with many parameters such as the rotation speed, the rotation direction, the rotation radius, and the shape of the grinding tooth 500 of the mounting table 210 and the grinding wheel disk 410. If any of the parameters changes, the grinding area changes accordingly, which further affects the magnitude of the total thickness variation. Therefore, by selecting an appropriate parameter, a preferable grinding quality and an equivalent grinding effect can be obtained.

  The placement rotation motor 620 is connected to the placement rotation shaft 220 and controls the placement board 210 to rotate at the placement rotation speed. The grindstone rotation motor 610 is connected to the grindstone rotation shaft 420 and controls the grindstone disk 410 to rotate at the grindstone rotation speed. The parameters of one preferred embodiment of the present invention are as follows. First, the mounting rotation speed is smaller than the grindstone rotation speed. Second, the grinding angle θ is in the range of −20 degrees to +20 degrees (other than 0 degrees). 3. The diameter of the mounting board 210 is 187 millimeters or more and 550 millimeters or less, and the diameter of the grindstone disk 410 is 200 millimeters or more and 600 millimeters or less. Fourth, the grinding tooth 500 has an elongated shape or a long arch shape. 5. A plurality of objects to be ground 300 are provided on the mounting board 210. Thus, by combining the appropriate rotation speed, the size of the mounting table 210 and the grinding wheel disk 410, and the shape of the grinding teeth 500 with a special grinding angle θ, a large grinding area is generated on the surface of the workpiece 300. In addition, it is possible to cause the grinding apparatus 100 to smoothly discharge waste, and to further reduce the variation in the total thickness of the wafer after grinding.

  FIG. 4 is a top view showing a grindstone disk 410 according to another embodiment of the present invention. Grinding teeth 500a are provided on the grindstone disk 410, and the difference between the grinding teeth 500a and the grinding teeth 500 of FIG. When the top view is seen, the grinding tooth 500a has a long arch shape, but the grinding tooth 500 has a long and thin shape. Both of these two different grinding teeth 500 and 500a can effectively reduce the variation in the total thickness of the wafer after grinding, and can smoothly discharge waste during grinding.

  FIG. 5 is a schematic perspective view showing a grinding apparatus 100a according to another embodiment of the present invention. As shown in the drawing, the axial direction of the mounting rotating shaft 220 of the mounting table 200 is parallel to the axial direction of the grinding wheel rotating shaft 420 of the grindstone table 400, and both the mounting rotating shaft 220 and the grindstone rotating shaft 420 are X-axis. Parallel to the direction. Further, the mounting board 210, the grindstone disk 410, and the three in the Z-axis direction are parallel to each other. In the present embodiment, an appropriate rotation speed, a size of the mounting plate 210 and the grinding wheel disk 410, and a shape of the grinding tooth 500 are adjusted according to a special grinding angle θ, not only in the horizontal direction but also in the vertical direction. It is also used for grinding, and both of the grinding directions in both directions can reduce the total thickness variation of the wafer after grinding.

  Please refer to FIG. 1 and FIG. 2A together. FIG. 6 is a schematic diagram showing a flow of a grinding method 700 according to an embodiment of the present invention. FIG. 7 is a schematic diagram showing the flow of a grinding method 700a according to another embodiment of the present invention. This grinding method 700 includes a rotation step S11 and a grinding step S12. In the rotation step S11, the mounting table 200 and the grindstone table 400 are rotated. In the grinding step S <b> 12, the workpiece 300 is ground with the grinding teeth 500. Each of the grinding teeth 500 grinds the surface of one workpiece 300 to generate a grinding area. Each of the grinding teeth 500 intersects the center 430 of the grinding wheel disk 410 and the virtual radiation 440 intersecting the center of one grinding tooth 500 at a grinding angle θ that is greater than 0 degree and less than 35 degrees. The grinding area corresponds to the grinding angle θ. The grinding angle θ of the preferred embodiment of the present invention is greater than 0 degrees and less than or equal to 20 degrees. In a further preferred embodiment of the present invention, the grinding angle θ is not less than 10 degrees and not more than 20 degrees. The grinding method 700a includes an axial direction control step S21, a rotation step S22, and a grinding step S23. Since the grinding step S23 is the same as the grinding step S12 of the grinding method 700, it will not be described. The axial direction control step S21 controls the axial direction of the mounting rotary shaft 220 of the mounting table 200 and the axial direction of the grindstone rotating shaft 420 of the grindstone table 400. In the axial direction control step S21, the mounting rotation shaft 220 and the grindstone rotation shaft 420 can be made parallel to the X-axis direction, the Y-axis direction, or the Z-axis direction. Since the mounting rotary shaft 220 and the grindstone rotating shaft 420 are parallel to each other, the mounting disc 210 and the grindstone disc 410 are also parallel to each other. The rotation step S22 includes a rotation speed control sub-step S221 and a rotation direction control sub-step S222. In the rotation speed control sub-step S221, the placement rotation motor 620 controls the placement board 210 to rotate at the placement rotation speed, and at the same time, the grinding wheel rotation motor 610 controls the grindstone disk 410 to rotate at the grinding wheel rotation speed. To do. The mounting rotation speed may be equal to or less than the grindstone rotation speed. In the rotation direction control sub-step S222, the mounting board 210 is controlled to rotate in the mounting rotation direction, and the control grindstone disk 410 is controlled to rotate in the grinding wheel rotation direction. The mounting rotation direction may be clockwise or counterclockwise, and the grindstone rotation direction may also be clockwise or counterclockwise. In the present invention, a large grinding area is generated on the surface of the object to be ground 300 by a combination of the above special parameters of the rotation direction, the rotation speed, and the grinding angle θ, and the total thickness variation of the wafer after grinding is further reduced to perform chipping. The rate can be reduced.

FIG. 8 is a data diagram of the total thickness variation corresponding to the grinding angle θ in the diameter of the 254 millimeter grinding wheel disk 410 of three 4-inch wafers. FIG. 9 is a data diagram of the total thickness variation corresponding to the grinding angle θ at the diameter of a 304 millimeter grinding wheel disk 410 of five 4-inch wafers. In order to select the most appropriate parameters to obtain the optimum grinding quality, the present invention analyzes various different parameters and data and is shown in Tables 1 and 2. Among them, the parameters in Table 1 correspond to the data in FIG. 8, and the parameters in Table 2 correspond to the data in FIG. As shown in the data diagram, it can be seen that the smaller the grinding angle θ is, the smaller the variation in the total thickness due to the other parameters being the same. It should be noted that when the grinding angle θ is smaller than the lower limit value, for example, equal to 0 degree, the grinding efficiency, quality, and smoothness of waste discharge decrease. When the grinding angle θ is 10 degrees, the grinding apparatus 100, 100a of this embodiment has a minimum total thickness variation and still maintains the excellent debris discharge effect.

  Please also refer to FIGS. 10A to 10I. FIG. 10A is a top view showing a grindstone disk 410 of a grinding apparatus 100 according to another embodiment of the present invention. FIG. 10B is a schematic diagram showing the grinding tooth 500b of FIG. 10A. FIG. 10C is a top view showing that the workpiece 300 is ground by the mounting board 210 and the grindstone disk 410 of FIG. 10A. 10D to 10G are schematic views showing grinding teeth 500c, 500d, 500e, and 500f of other various embodiments of the present invention. As shown in the drawing, each of the grinding teeth 500b, 500c, 500d, and 500e includes a proximal end 510 having a proximal end width T1, a distal end 520 having a distal end width T2, a first side 530, and a second side 540. Have The base end 510 and the center 430 of the grindstone disc 410 are separated from each other by a base end distance D1, and the tip end 520 and the center 430 of the grindstone disc 410 are separated from each other by a tip end distance D2. The proximal distance D1 is smaller than the distal distance D2. That is, the tip 520 of the grinding tooth 500 is close to the outer edge of the grindstone disk 410. The proximal end width T1 is larger than the distal end width T2. That is, the grinding tooth 500 has a shape in which the width of the radially inner portion of the grindstone disk 410 is wide and the width of the radially outer portion is narrow. In this embodiment, the grinding device 100 has a larger wear amount at the proximal end 510 of the grinding tooth 500 during grinding than the distal end 520 due to the shape in which the radially inner portion is wide and the radially outer portion is narrow. Can be compensated for and the total thickness variation of the wafer after grinding can be effectively reduced. Specifically, with respect to the grinding tooth 500, when the grinding tooth 500 grinds the workpiece 300, the closer to the position of the center 430 of the grindstone disk 410, the larger the grinding amount, that is, the greater the wear amount. This is because the distal end 520 has a longer displacement distance than the base end 510 and the cooling effect of the front end 520 is good and the amount of grinding is reduced, but the base end 510 is cooled and the temperature is hardly lowered and the amount of grinding is increased. In other words, when the base end width T1 of the base end 510 having a large amount of grinding is increased to balance the grinding amount and the grinding amount of the tip 520 and achieve the same situation, the workpiece 300 ground under this condition is obtained. The total thickness variation is reduced, and the quality of grinding and the effectiveness of the workpiece 300 are further improved.

  Further, since the grinding angle θ is larger than 0 degree and smaller than 90 degrees, the grinding apparatus 100 can smoothly discharge the waste. Each grinding surface of the grinding tooth 500 and the surface of the mounting board 210 are parallel to each other, and the grinding surface of the grinding tooth 500 is parallel to the surface of the grinding wheel disk 410 and the surface of the workpiece 300. Furthermore, the total thickness variation of the workpiece 300 can be reduced. Note that the proximal end 510 and the distal end 520 may be planar or curved. The first side 530 corresponds to the second side 540, and the first side 530 and the second side 540 may be planar or curved. The side length of the first side 530 is equal to or shorter than the side length of the second side 540 and is larger than the base end width T1. Regardless of the shape of the base end 510, the front end 520, the first side 530, or the second side 540, if the base end width T1 is larger than the front end width T2, an improvement in the wear balance of the entire grinding tooth 500 is achieved. In addition, the total thickness fluctuation after grinding can be reduced. When the first side 530 and the second side 540 are both planar, the top view is tapered like the grinding teeth 500 and 500c, as shown in FIG. 10F. It becomes. When the first side 530 and the second side 540 are both curved, the top view is an ugly shape, as shown in FIG. 10D, like the grinding tooth 500a. Of course, as shown in FIG. 10G, the grinding tooth 500f has a wide width in the radially outer portion of the grinding wheel disk 410 so as to compensate and balance the wear amount at different positions of the grinding tooth 500f. The shape may be narrow and may be used for different grinding environment conditions. It should also be noted that during grinding, the scraps of the object to be ground 300 are likely to be deposited on the sides corresponding to the traveling direction of the grinding teeth 500, 500a, 500b, 500c, 500d, 500e, and 500f, that is, the rotational direction. 10C as an example, the grindstone disk 410 travels or rotates in the clockwise direction, and the waste of the object to be ground 300 is likely to be deposited on the second side 540. In order to improve this accumulation phenomenon, The extending direction of 540 needs to intersect the virtual radiation 440 at a certain depression angle. In other words, if the extending direction of the second side 540 is not parallel to the virtual radiation 440, the grinding apparatus 100 smoothly discharges the waste during grinding and discharges the waste to the outside or the inside of the grindstone disk 410. Can do. In addition, the grinding teeth 500, 500a, 500b, and 500c of the present invention have a taper shape or a moon shape, and the first side 530 or the second side 540 has a depression angle with respect to the virtual radiation 440 itself, This depression angle can cause a larger angle change together with the grinding angle θ. Therefore, the structure further contributes to the discharge of waste, and makes the discharge of waste even more smooth.

  Please refer to FIG. 10H and FIG. 10I together. FIG. 10H is a data diagram of the grinding ratio corresponding to the tooth profile of the grinding tooth 500 at a 254 millimeter grinding wheel disk 410 diameter. FIG. 10I is a data diagram of the grinding ratio corresponding to the tooth profile of the grinding tooth 500 at a diameter of the 304 millimeter grinding wheel disk 410. The object to be ground 300 in FIGS. 10H and 10I is a wafer. In FIG. 10H, there are 3, 4 and 5 wafers to be tested. In FIG. 10I, there are 5 and 7 wafers to be tested. The grinding ratio described in the present invention is a percentage obtained by dividing the average thickness of wear of the grinding teeth 500 by the unit grinding amount. As shown in the drawings, the inner side of the present invention is wide and the outer side is wide regardless of the number of wafers. The grinding ratios of the grinding teeth 500 of the narrow grinding teeth 500, that is, the width of the radially inner portion and the width of the radially outer portion are narrow. It can be seen that the portion and the radially outer portion are smaller than the grinding ratio of the tooth mold having the same width. In other words, since the average thickness of the wear of the grinding tooth 500 of the present invention is smaller than the average thickness of the wear of the traditional tooth mold, the grinding tooth 500 compensates for the difference that the wear amount of the base end 510 is larger than the tip 520. This balances the amount of wear on the entire grinding surface and further reduces the total thickness variation and chipping rate.

  According to the above embodiment, it can be seen that the present invention has the following merits. First, by controlling the rotation speed, the rotation direction, and related parameters according to a special grinding angle, a large grinding area can be generated on the surface of the object to be ground, and the variation in the total thickness of the wafer after grinding can be reduced. 2. By combining a certain range of grinding angles and appropriate grinding parameters, the grinding machine can not only grind the same amount during grinding and discharge waste smoothly, but also reduce the chipping rate . 3. A plurality of objects to be ground can be ground simultaneously at a predetermined display position, thereby not only greatly increasing the production volume but also improving the economic effect and reducing the production cost.

  Although the present invention has been disclosed in the embodiments as described above, it is not intended to limit the present invention, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention. it can. Therefore, the protection scope of the present invention is based on the contents specified in the claims.

100, 100a Grinding device 200 Placement table 210 Placement plate 220 Placement rotation shaft 300 Workpiece 400 Grinding wheel table 410 Grinding wheel disc 412 Middle ring inclined surface 420 Grinding wheel rotation shaft 430 Center 440 Virtual radiation 500, 500a, 500b Grinding teeth 500c, 500d, 500e Grinding tooth 500f Grinding tooth 510 Base end 520 Tip 530 First side 540 Second side 610 Grinding wheel rotation motor 620 Placement rotation motor 700, 700a Grinding method S11, S22 Rotation step S12, S23 Grinding step S21 Axial direction Control step S221 Rotational speed control sub-step S222 Rotation direction control sub-step θ Grinding angle T1 Base end width T2 Tip end width D1 Base end distance D2 Tip distance

Claims (14)

A mounting board that performs rotation,
At least one workpiece to be positioned on the table,
A grinding wheel disk that rotates relative to the mounting table, and
A plurality of grinding teeth connected to the grinding wheel disk and contacting and grinding the workpiece,
Each of the grinding teeth grinds the surface of the object to be ground to produce a grinding area, and the virtual radiation intersecting the center of the grinding wheel disk and the center of the grinding tooth, and grinding greater than 0 degrees and less than 35 degrees Grinding equipment that meets at an angle.   The grinding apparatus according to claim 1, wherein the grinding angle is greater than 0 degree and 20 degrees or less.   The mounting table and the grindstone disk are circular, and each of the grinding teeth is rectangular or arched and arranged in a spiral, and the workpiece is circular, elliptical, square or triangular. The grinding apparatus according to claim 1. A mounting rotation motor that is connected to a mounting rotation shaft connected to the mounting table and controls the mounting table to rotate at a mounting rotation speed;
A grindstone rotating motor connected to a grindstone rotating shaft connected between the grindstone disc and controlling the grindstone disc to rotate at a grindstone rotating speed;
The grinding apparatus according to claim 1, wherein the mounting rotational speed is equal to or lower than the grinding wheel rotational speed.   Each of the grinding teeth has a base end having a base end width and a tip end having a front end width, and the base end and the center of the grindstone disk are separated from each other by a base end distance. The grinding apparatus according to claim 1, wherein the center of the disc is separated from the tip distance, the base end distance is smaller than the tip distance, and the base end width is different from the tip width.   Each of the grinding teeth further has a first side and a second side, the first side corresponds to the second side, and the base end and the tip are flat. The first side and the second side are planar or curved, and the side length of the first side is equal to or less than the side length of the second side. The grinding apparatus according to claim 5, wherein a side length of the first side is larger than the base end width. A mounting table and a mounting rotating shaft, the mounting table is connected to the mounting rotating shaft, and the mounting table rotates about the mounting rotating shaft;
A plurality of objects to be ground positioned on the table,
A grindstone disk and a grindstone rotating shaft, the grindstone disk being connected to the grindstone rotating shaft, and a grindstone base that rotates about the grindstone rotating shaft;
A plurality of grinding teeth connected to the grinding wheel disk and contacting and grinding the workpiece,
Each of the grinding teeth grinds the surface of the object to be ground to produce a grinding area, and the virtual radiation intersecting the center of the grinding wheel disk and the center of the grinding tooth, and grinding greater than 0 degrees and less than 35 degrees Intersect at an angle,
The mounting table rotates clockwise or counterclockwise, the grindstone disk rotates clockwise or counterclockwise, the mounting rotating shaft and the grinding wheel rotating shaft are parallel to each other, and the mounting table is rotated. A grinding apparatus in which a board surface of the board and each grinding surface of the grinding teeth are parallel to each other, and the mounting rotary shaft and the board surface of the mounting board are perpendicular to each other. A rotating step of rotating the mounting plate and the grinding wheel disc;
The grinding teeth are contacted and ground to the object to be ground, and each of the grinding teeth grinds the surface of the object to be ground to generate a grinding area, and the center of the grinding wheel disk and one of the grinding teeth. A virtual radiation that intersects the center of the substrate at a grinding angle greater than 0 degrees and less than 35 degrees, and the grinding area corresponding to the grinding angle,
A grinding method using the grinding apparatus according to claim 1. The rotation process includes
The mounting rotation motor is controlled to rotate the mounting plate at the mounting rotational speed, and the grinding wheel rotating motor is controlled to rotate the grinding wheel disk at the grinding wheel rotational speed. The grinding method according to claim 8, further comprising a rotation speed control sub-step that is equal to or less than the rotation speed. The rotation process includes
The mounting table is controlled to rotate in the mounting rotation direction, and the grinding wheel disk is controlled to rotate in the rotation direction of the grinding wheel, and the mounting rotation direction is clockwise or counterclockwise, The grinding method according to claim 8, further comprising a rotation direction control sub-step in which the rotation direction is clockwise or counterclockwise.   The axial direction of the mounting rotary shaft and the axial direction of the grindstone rotating shaft are controlled, the mounting rotary shaft is connected to the mounting plate, the grindstone rotating shaft is connected to the grindstone disk, The grinding method according to claim 8, further comprising an axial direction control step in which the rotating shaft and the grindstone rotating shaft are parallel to each other, and the mounting plate and the grindstone disk are parallel to each other.   The grinding method according to claim 8, wherein the grinding angle is greater than 0 degree and 20 degrees or less.   Each of the grinding teeth has a base end having a base end width and a tip end having a front end width, and the base end and the center of the grindstone disk are separated from each other by a base end distance. The grinding method according to claim 8, wherein the center of the disk is separated from the tip distance, the base end distance is smaller than the tip distance, and the base end width is different from the tip width.   Each of the grinding teeth further includes a first side and a second side, the first side corresponds to the second side, and the proximal end and the distal end are planar. Or a curved surface, the first side and the second side are planar or curved, and the side length of the first side is equal to or less than the side length of the second side, and The grinding method according to claim 13, wherein the grinding method is larger than a base end width.

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