JP2017123262A - Light-emitting module and luminaire - Google Patents

Abstract

A light emitting module that can be miniaturized is provided. A light emitting module according to an embodiment includes a substrate, a pair of conductor patterns, and a light emitting element. The substrate is formed long. The pair of conductor patterns is provided on the substrate along the longitudinal direction of the substrate at a predetermined interval in the short direction of the substrate. The light emitting element is placed on the pair of conductor patterns, and power is supplied from a surface opposite to the placement surface placed on the pair of conductor patterns. Further, the mounting surface of the light emitting element overlaps with the pair of conductor patterns. [Selection] Figure 1

Description

  Embodiments described herein relate generally to a light emitting module and a lighting fixture.

  In recent years, lighting fixtures using light emitting elements such as LEDs (Light Emitting Diodes) have been rapidly introduced as light sources due to power saving and the like. In recent years, a chip-on-board (COB) type light emitting module in which a plurality of light emitting elements are mounted on a substrate has been used for the purpose of increasing luminance.

  For example, as a COB type light emitting module, a bank for damming phosphor resin is formed on a substrate on which a large number of light emitting elements are mounted, and a resin containing phosphor in the bank (hereinafter referred to as “phosphor resin”). There is a known light emitting module that is cured by pouring. As a COB type light emitting module, a light emitting module in which light emitting elements are mounted on a substrate at a predetermined interval and a phosphor resin having high thixotropy is directly applied without forming a bank is known.

  For example, in the light emitting module 500 according to the conventional example shown in FIG. 7, a pair of conductors is formed on the long substrate 510 at a predetermined interval in the short direction of the substrate 510 along the longitudinal direction of the substrate 510. A pattern 520 is provided. In addition, between the pair of conductor patterns 520 on the substrate 510, a plurality of light emitting elements 530 are arranged at predetermined intervals along the longitudinal direction of the substrate 510. In addition, the light emitting element 530 disposed on the substrate 510 is sealed by a sealing portion 540 formed of a phosphor resin or the like.

  In addition, the light emitting element 530 is electrically connected to the pair of conductor patterns 520 by wires 550. In FIG. 7, a series of light emitting elements 530 (six in FIG. 7) are connected by wires 551. In addition, among the series of light emitting elements 530, the light emitting element 530 at one end (left end in FIG. 7) is connected to one conductor pattern 521 by a wire 552, and the light emitting element 530 at the other end (right end in FIG. 7) is The wire 553 is connected to the other conductor pattern 522. As described above, the light emitting module 500 is configured without forming a bank.

International Publication No. 2013/18177 Pamphlet

  However, in the conventional light emitting module as described above, since there is a conductor pattern outside the light emitting element, it is difficult to reduce the size of the light emitting module, particularly the width (length in the short direction) of the light emitting module. . Therefore, in the conventional light emitting module as described above, it is difficult to reduce the size of the lighting fixture.

  An object of this invention is to provide the light emitting module and lighting fixture which enabled size reduction.

  The light emitting module of the present embodiment includes a substrate, a pair of conductor patterns, and a light emitting element. The substrate is formed long. The pair of conductor patterns is provided on the substrate along the longitudinal direction of the substrate at a predetermined interval in the short direction of the substrate. The light emitting element is mounted on the pair of conductor patterns, and power is supplied from the surface opposite to the mounting surface mounted on the pair of conductor patterns, and the mounting surface overlaps the pair of conductor patterns.

  ADVANTAGE OF THE INVENTION According to this invention, the light emitting module and lighting fixture which enabled size reduction can be provided.

FIG. 1 is a plan view showing a light emitting module according to the embodiment. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 illustrating the light emitting module according to the embodiment. FIG. 3 is a cross-sectional view taken along the line AA of FIG. 1 showing the light emitting module according to the embodiment. FIG. 4 is a cross-sectional view showing the arrangement of light emitting elements according to a modification. FIG. 5 is a plan view showing a light emitting module according to a modification. FIG. 6 is a perspective view showing a lighting fixture using the light emitting module according to the embodiment. FIG. 7 is a plan view showing a light emitting module according to a conventional example.

  The light emitting modules 1 and 2 according to the embodiment and the modification described below are arranged on the substrate along the longitudinal direction of the substrate 10 with a predetermined interval in the short direction of the long substrate 10 and the substrate 10. A pair of conductor patterns 20 provided, and a light emitting element 30 mounted on the pair of conductor patterns 20 and fed from a surface 32 opposite to the mounting surface 31 mounted on the pair of conductor patterns 20. The mounting surface 31 includes a light emitting element 30 that overlaps the pair of conductor patterns 20.

  In the light emitting modules 1 and 2 according to the embodiment and the modification described below, the distance between the light emitting elements 30 in the longitudinal direction of the substrate 10 is 0.3 mm or less.

  In addition, the light emitting modules 1 and 2 according to the embodiment and the modification described below seal the light emitting element 30 and the substrate 10 with respect to the width in the short direction of the substrate 10 in a cross section orthogonal to the longitudinal direction of the substrate 10. The sealing portion 40 having a height ratio from 0.2 to 0.7 is provided.

  In addition, the light emitting modules 1 and 2 according to the embodiment and the modification described below have a direction between the short side direction and the long side direction of the substrate 10 from the electrode provided on the opposite surface 32 in a plan view of the substrate 10. The wires 52 and 53 extend in a direction away from the light emitting element 30 and are connected to one of the pair of conductor patterns 20.

  In the light emitting module 2 according to the modification described below, a plurality of light emitting elements 30 are provided by periodically changing the center position in the short direction of the substrate 10 with respect to the short direction of the substrate 10.

  The lighting fixture 100 described below includes light emitting modules 1 and 2.

[Embodiment]
First, the light emitting module 1 which concerns on embodiment of this invention is demonstrated based on drawing. FIG. 1 is a plan view showing a light emitting module according to the embodiment. The light emitting module 1 according to the present embodiment includes a substrate 10, a pair of conductor patterns 20, a light emitting element 30, a sealing portion 40, and a wire 50. Hereafter, each structure of the light emitting module 1 is explained in full detail using FIG.

  The substrate 10 is formed in a long shape. For example, the substrate 10 is formed of an insulating material. For example, the substrate 10 is formed of a material such as ceramic. For example, a ceramic substrate formed of a material containing alumina is used for the substrate 10.

  On the substrate 10, a pair of conductor patterns 20 are provided along the longitudinal direction of the substrate 10 with a predetermined interval in the short direction of the substrate 10. The pair of conductor patterns 20 is provided on the substrate 10 in order to supply power to the light emitting element 30 from the outside. The width and thickness of the conductor pattern 20 are appropriately set depending on the light emitting element 30 used. For example, the width and volume of the conductor pattern 20 are appropriately set depending on the current, voltage, etc. applied to the conductor pattern 20. The distance between the pair of conductor patterns 20 will be described later.

  For example, the pair of conductor patterns 20 is provided on the substrate 10 by being plated using a metal material. Specifically, the pair of conductor patterns 20 is provided on the substrate 10 by plating using gold (Au) or silver (Ag). The pair of conductor patterns 20 includes a conductor pattern 21 and a conductor pattern 22. Below, when distinguishing and explaining each conductor pattern 20, it describes with the conductor pattern 21 and the conductor pattern 22. FIG. Moreover, when describing without distinguishing the conductor pattern 21 and the conductor pattern 22, it describes as the conductor pattern 20. FIG.

  A plurality of light emitting elements 30 are mounted on the pair of conductor patterns 20. In FIG. 1, 24 light emitting elements 30 are placed on a pair of conductor patterns 20. In FIG. 1, each light emitting element 30 is placed across both of the pair of conductor patterns 20, so that two points in the short direction of the substrate 10 have a uniform height in each of the pair of conductor patterns 20. The position is fixed. Thereby, the light emitting module 1 facilitates the light distribution of the light emitting elements 30, particularly the light distribution in the short direction of the substrate.

  For example, an LED chip or the like is used for the light emitting element 30. The light emitting element 30 is supplied with power from a surface 32 opposite to the mounting surface 31 mounted on the pair of conductor patterns 20. The light emitting element 30 is supplied with power from the opposite surface 32 opposite to the substrate 10, that is, from the upper surface side. For example, the light emitting element 30 is supplied with power by an electrode (not shown) provided on the opposite surface 32. For example, the mounting surface 31 side of the light emitting element 30 is formed of an insulating material such as sapphire. Thereby, the light emitting element 30 can be placed on the pair of conductor patterns 20. The position of the light emitting element 30 is fixed with respect to the substrate 10 and the pair of conductor patterns 20 by a die bond material (not shown) made of, for example, silicone or the like. Details will be described later.

  Here, the plurality of light emitting elements 30 are arranged at predetermined intervals along the longitudinal direction of the substrate 10 across the conductor pattern 20 on the substrate 10. In each light emitting element 30, the mounting surface 31 overlaps the pair of conductor patterns 20. In the example of FIG. 1, the distance L10 between the light emitting elements 30 in the longitudinal direction of the substrate 10 is 0.2 mm. That is, in the example of FIG. 1, the plurality of light emitting elements 30 are arranged at intervals of 0.2 mm along the longitudinal direction of the substrate 10 across the conductor pattern 20 on the substrate 10. The distance L10 between the light emitting elements 30 in the longitudinal direction of the substrate 10 may be 0.3 mm or less. In addition, the distance L10 between the light emitting elements 30 in the longitudinal direction of the substrate 10 is desirably a distance that absorbs less light between the light emitting elements 30.

  Further, the light emitting element 30 arranged on the substrate 10 is sealed by a sealing portion 40 made of a phosphor resin. For example, the sealing portion 40 is made of a thixotropic high viscosity resin in which a predetermined amount of phosphor is dispersed. Thus, when the sealing part 40 is highly viscous and has thixotropy, the light emitting module 1 is comprised without forming a bank. In addition, although the sealing part 40 is provided so that the light emitting element 30 and a pair of conductor pattern 20 may be covered, the detail is mentioned later.

  Further, the light emitting element 30 is electrically connected to the pair of conductor patterns 20 by wires 50. In FIG. 1, a series (six in FIG. 1) of light emitting elements 30 are connected by wires 51. In addition, among the continuous light emitting elements 30, the light emitting element 30 at one end (left end in FIG. 1) is connected to one conductor pattern 21 by a wire 52, and the light emitting element 30 at the other end (right end in FIG. 1) is The wire 53 is connected to the other conductor pattern 22. The continuous light emitting element 30 here refers to the light emitting element 30 connected to one conductor pattern 21 by a wire 52 and connected to the other conductor pattern 22 by a wire 53. For example, the continuous light emitting element 30 refers to a group of light emitting elements 30 connected in series between a pair of conductor patterns 20.

  FIG. 1 illustrates a case where four sets of light emitting elements 30 are provided. In FIG. 1, four sets of the light emitting elements 30 have the same configuration. Therefore, numbers are assigned to the series of light emitting elements 30 and wires 50 on the left side, and illustrations of the numbers of other configurations are omitted. Below, when distinguishing and explaining each wire 50, it describes as the wire 51, the wire 52, and the wire 53. FIG. Further, when the wire 51, the wire 52, and the wire 53 are described without being distinguished, they are described as a wire 50. The details of the connection between the light emitting element 30 and the pair of conductor patterns 20 by the wires 52 and 53 will be described later.

  From here, the size and arrangement of each component in the short direction of the substrate 10 will be described. In the example of FIG. 1, the width W <b> 11 (see FIG. 2) of the substrate 10 in the light emitting element 30 placed on the pair of conductor patterns 20 is formed to be 0.4 mm. In addition, as for the width | variety of the transversal direction of the board | substrate 10 in the light emitting element 30 mounted on a pair of conductor pattern 20, it is desirable that it is 0.4 mm-1.5 mm.

  Here, in the light emitting element 30, the end surface 34 on the one conductor pattern 22 side in the short direction of the substrate 10 overlaps the one conductor pattern 22. Further, in FIG. 1, in the light emitting element 30, the end surface 33 on the other conductor pattern 21 side in the short direction of the substrate 10 overlaps the other conductor pattern 21. That is, the light emitting element 30 is disposed so as to overlap the pair of conductor patterns 20 in the plan view of the substrate 10.

  For example, in the light emitting module 500 shown in FIG. 7, the conductor pattern 520 is outside the light emitting element 530 in the short direction of the substrate 510, thereby increasing the distance between the pair of conductor patterns 520. Specifically, the distance between the outer ends of the pair of conductor patterns 520 in the short direction of the substrate 510 is longer than the sum of the width of the light emitting module 530 and the width of the two conductor patterns 520 in the short direction. .

  For example, when the width of the light emitting element 530 in the short direction of the substrate 510 is 0.4 mm and the width of the conductor pattern 520 is 0.2 mm, the distance between the outer ends of the pair of conductor patterns 520 in the short direction of the substrate 510. Is longer than at least 0.8 (= 0.4 + 0.2 + 0.2) mm. Specifically, the distance between the outer ends of the pair of conductor patterns 520 in the short direction of the substrate 510 is a value obtained by adding the distance between the light emitting element 530 and each conductor pattern 520 to 0.8 mm.

  On the other hand, in the light emitting module 1 shown in FIG. 1, the light emitting element 30 is disposed so as to overlap the pair of conductor patterns 20 in a plan view of the substrate 10, thereby shortening the distance W <b> 10 between the pair of conductor patterns 20. Specifically, the distance W10 between the outer ends of the pair of conductor patterns 20 in the short direction of the substrate 10 is shorter than the total of the width of the light emitting module 30 and the width of the two conductor patterns 520 in the short direction. Become.

  For example, when the width of the conductor pattern 20 is 0.2 mm, the distance W10 between the outer ends of the pair of conductor patterns 20 in the short direction of the substrate 10 is at least 0.8 (= 0.4 + 0.2 + 0.2). shorter than mm. Specifically, the distance W10 between the outer ends of the pair of conductor patterns 20 in the short direction of the substrate 10 is a value obtained by adding the distance between the conductor patterns 20 to the total width of 0.4 mm of the two conductor patterns 20. Become. For example, a space necessary for insulation between the conductor patterns 20 is provided between the conductor patterns 20. For example, when the distance between the conductor patterns 20 is 0.2 mm, the distance W10 between the pair of conductor patterns 20 is 0.6 (= 0.2 + 0.2 + 0.2) mm.

  As described above, the distance W10 between the outer ends of the pair of conductor patterns 20 in the short direction of the substrate 10 can be shortened as compared with the related art. Therefore, the light emitting module 1 in the present embodiment can be reduced in size compared to the conventional one, and in particular, the width (length in the short direction) of the substrate 10 can be reduced.

  From here, the connection between the light emitting element 30 and the pair of conductor patterns 20 by the wires 52 and 53 will be described with reference to FIGS. 1 and 2. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 illustrating the light emitting module according to the embodiment. Specifically, FIG. 2 is an AA cross-sectional view of the light emitting module 1 excluding the sealing portion 40.

  The wires 52 and 53 extend from an electrode provided on the opposite surface 32 in a plan view of the substrate 10 in a direction between the short side direction and the long side direction of the substrate 10 and away from the light emitting element 30. It is connected to either one of the conductor patterns 20. In FIG. 1, the wire 52 extends from one electrode provided on the opposite surface 32 in the upper left direction of the substrate 10 and is connected to the conductor pattern 21. In FIG. 1, the wire 53 extends from the other electrode provided on the opposite surface 32 in the lower right direction of the substrate 10 and is connected to the conductor pattern 22.

  Further, for example, as shown in FIG. 2, the wire 53 is connected to the portion extending in the direction away from the substrate 10 from the opposite surface 32 in the height direction of the substrate 10 and the conductor pattern 21 extending in the direction approaching the substrate 10. And have a portion. As described above, the wire 53 has a portion extending in the direction away from the substrate 10 from the opposite surface 32 in the height direction of the substrate 10, whereby the overall length can be increased. The same applies to the wire 52.

  As a result, the light emitting module 1 has a pair of conductors by pulling out the wires 52 and 53 as compared with the case of pulling out the wires 532 and 533 in the short direction (vertical direction in FIG. 7) of the substrate 530 as shown in FIG. An increase in the distance W10 between the patterns 20 can be suppressed. Therefore, the light emitting module 1 in the present embodiment can be reduced in size compared to the conventional one, and in particular, the width (length in the short direction) of the substrate 10 can be reduced.

  Further, as shown in FIG. 2, a gap AR <b> 10 is formed between the substrate 10 and the light emitting element 30. Specifically, a gap AR <b> 10 surrounded by the substrate 10, the light emitting element 30, and the pair of conductor patterns 20 is formed between the substrate 10 and the light emitting element 30. In the light emitting module 1, the light emitting element 30 is attached to the substrate 10 by providing a die bond material in the gap AR10. Thus, it can suppress that the die bond material which attaches the light emitting element 30 to the board | substrate 10 is exposed, and the designability of the light emitting module 1 falls by a pair of conductor pattern 20 blocking the die bond material.

  Further, the light emitting module 1 can fix the position of the light emitting element 30 to the substrate 10 with high accuracy by providing the die bonding material in the gap AR10. For example, in the case of the light emitting module 500 of the conventional example shown in FIG. 7, since no gap is formed between the substrate 510 and the light emitting element 530, the light emitting element 530 is directly attached to the substrate 510 with a die bond material. In this case, the position of the light emitting element 530 is difficult to fix because the position of the light emitting element 530 is not fixed with respect to the substrate 510 due to the fluidity of the die bond material until the die bond material is hardened. For example, when the light-emitting element 530 is attached to the substrate 510 and the die-bonding material is not evenly provided between the light-emitting element 530 and the substrate 510, the light-emitting element 530 is attached to be inclined with respect to the substrate 510.

  On the other hand, in the light emitting module 1, each light emitting element 30 is placed over both the pair of conductor patterns 20, so that the position is fixed with respect to the substrate 10 by the portion placed on the pair of conductor patterns 20. The Therefore, the light emitting module 1 can fix the position of the light emitting element 30 to the substrate 10 with high accuracy. That is, the light emitting module 1 can suppress the influence of the fluidity of the die bond material until the die bond material is hardened by the pair of conductor patterns 20 blocking the die bond material.

  Next, the shape of the sealing part 40 is demonstrated using FIG. FIG. 3 is a cross-sectional view taken along the line AA of FIG. 1 showing the light emitting module according to the embodiment. Specifically, FIG. 3 is a cross-sectional view taken along line AA of the light emitting module 1 excluding the wire 53.

  As described above, the sealing portion 40 is provided so as to cover the light emitting element 30 and the pair of conductor patterns 20. As shown in FIG. 3, the sealing portion 40 is formed in a substantially semicircular shape in a cross section orthogonal to the longitudinal direction of the substrate 10. Specifically, the sealing portion 40 is formed in a substantially semicircular shape that protrudes in a direction away from the substrate 10 in a cross section orthogonal to the longitudinal direction of the substrate 10. In FIG. 3, the sealing portion 40 functions as a lens (optical element).

  The sealing portion 40 has a ratio of the height H1 from the substrate 10 to the width L1 in the short direction of the substrate 10 (hereinafter referred to as “aspect ratio”) in a cross section orthogonal to the longitudinal direction of the substrate 10. ) Is 0.2 or more and 0.7 or less. That is, the sealing part 40 is formed so as to satisfy the following formula (1). As described above, the shape of the sealing portion 40 in the cross section orthogonal to the longitudinal direction of the substrate 10 is not limited to the semicircular shape, and may be, for example, a semielliptical shape. In addition, for example, the curvature of the sealing portion 40 in the cross section orthogonal to the longitudinal direction of the substrate 10 is not limited to 1 / L1, and any value can be used as long as the aspect ratio shown in the following formula (1) is satisfied. Also good.

  0.2 ≦ H1 / L1 ≦ 0.7 (1)

  Thereby, the light emitting module 1 can maintain the light extraction efficiency, and can suppress the enlargement of the sealing part 40. Therefore, the light emitting module 1 in the present embodiment can be reduced in size compared to the conventional one, and in particular, the width (length in the short direction) of the substrate 10 can be reduced. In the example illustrated in FIG. 3, the case where the light emitting element 30 and the pair of conductor patterns 20 are provided is illustrated. However, the sealing portion 40 is formed in any manner as long as the above aspect ratio is satisfied. May be. For example, the sealing part 40 may be positioned on the pair of conductor patterns 20 corresponding to both ends in the short direction of the substrate 10 as long as the aspect ratio is satisfied.

[Modification]
From here, arrangement | positioning of the light emitting element 30 which concerns on a modification is demonstrated based on drawing. FIG. 4 is a cross-sectional view showing the arrangement of light emitting elements according to a modification. In addition, in FIG. 4, the same code | symbol is attached | subjected to the same part as the light emitting module 1 which concerns on embodiment. Specifically, FIG. 4 is a diagram illustrating a modified example of the arrangement of the light emitting elements 30 in the AA sectional view of FIG. 1. Further, in FIG. 4, illustration of the sealing portion 40 and the wire 50 is omitted in order to explain the position of the light emitting element 30 on the pair of conductor patterns 20.

  In the example shown in FIG. 4, in the light emitting element 30, the end surface 34 on the side of the one conductor pattern 22 in the short direction of the substrate 10 overlaps the one conductor pattern 22. That is, in the plan view of the substrate 10, the end surface 34 of the light emitting element 30 is disposed so as to overlap the conductor pattern 22. In FIG. 4, the conductor pattern 22 is exposed in a plan view of the substrate 10.

  On the other hand, in FIG. 4, in the light emitting element 30, the end surface 33 on the other conductor pattern 21 side in the short direction of the substrate 10 does not overlap the other conductor pattern 21. That is, the end face 33 of the light emitting element 30 is disposed at a position protruding from the conductor pattern 22 in the short direction of the substrate 10. That is, the conductor pattern 21 is not exposed from the light emitting element 30 in a plan view of the substrate 10. As described above, the light emitting element 30 may be arranged so that only the end face 34 on the one conductor pattern 22 side in the short direction of the substrate 10 overlaps the one conductor pattern 22.

  For example, in the light emitting module 500 shown in FIG. 7, the conductor pattern 520 is outside the light emitting element 530 in the short direction of the substrate 510, thereby increasing the distance between the pair of conductor patterns 520. Specifically, the distance between the outer ends of the pair of conductor patterns 520 in the short direction of the substrate 510 is longer than the sum of the width of the light emitting element 530 and the width of the two conductor patterns 520 in the short direction. .

  Next, the light emitting module 2 according to the modification will be described with reference to the drawings. In the example described above, the case where the light emitting element 30 is arranged with the center in the short direction of the substrate 10 shown is shown. However, the light emitting element 30 shifts the center of the light emitting element 30 in the short direction of the substrate 10. May be arranged. This point will be described with reference to FIG. FIG. 5 is a plan view showing a light emitting module according to a modification.

  In FIG. 5, a plurality of light emitting elements 30 are placed on the pair of conductor patterns 20. In FIG. 5, 24 light emitting elements 30 are placed on the pair of conductor patterns 20. Here, the light emitting element 30 in FIG. 5 is provided by periodically changing the center position in the short direction of the substrate 10 with respect to the short direction of the substrate 10. Specifically, the light emitting elements 30 are arranged such that the center positions in the short direction of the substrate 10 are alternately shifted in the short direction (vertical direction in FIG. 1). For example, if the upper position in FIG. 1 is the first position and the lower position in FIG. 1 is the second position among the positions in the short direction of the substrate 10, the center of the substrate 10 in the short direction is Are arranged so that the light emitting elements 30 arranged at the first position and the light emitting elements 30 arranged at the second position are alternately arranged. The light emitting element 30 is arranged such that the center in the lateral direction of the substrate 10 is periodically located at the first to fifth positions, not limited to the case where the two positions are alternately repeated. May be.

  Thereby, the light emitting module 2 can suppress the absorption of light between the light emitting elements 30, and can output more desired light. The arrangement of the light emitting elements 30 shown in FIG. 5 is an example, and any arrangement may be employed as long as the center position of the substrate 10 in the short direction is changed based on a predetermined rule. . As described above, in the light emitting module 2, the light emitting elements 30 may be arranged in a zigzag manner, or the light emitting elements 30 may be arranged in a staggered manner based on a predetermined pattern. That is, the light emitting module 2 may arrange the light emitting element 30 at an appropriate position based on a predetermined rule for realizing desired light extraction.

[lighting equipment]
Moreover, the light emitting modules 1 and 2 are used as a light source of a lighting fixture. For example, the light emitting modules 1 and 2 are used as a light source of a light fixture used as a base light. This point will be described with reference to FIG. FIG. 6 is a perspective view showing a lighting fixture using the light emitting module according to the embodiment. In the lighting fixture 100 shown in FIG. 6, the light emitting module 1 is provided in the fixture main body 110, for example. Note that the lighting fixture 100 illustrated in FIG. 6 is an example, and the light emitting modules 1 and 2 may be used as light sources of various lighting fixtures depending on the purpose. For example, the light emitting modules 1 and 2 may be used as a linear light source for various lighting fixtures. For example, the light emitting modules 1 and 2 may be used as a light source such as a vehicle headlamp.

  The light emitting modules 1 and 2 according to the embodiment and the modified example having the above-described configuration are provided on the substrate along the longitudinal direction of the substrate 10 with a predetermined interval in the short direction of the long substrate 10 and the substrate 10. A pair of conductor patterns 20 provided, and a light emitting element 30 mounted on the pair of conductor patterns 20 and fed from a surface 32 opposite to the mounting surface 31 mounted on the pair of conductor patterns 20. The mounting surface 31 includes a light emitting element 30 that overlaps the pair of conductor patterns 20. As a result, in the light emitting modules 1 and 2, the distance between the outer ends of the pair of conductor patterns 20 in the short direction of the substrate 10 can be made shorter than in the conventional case. Therefore, the light emitting modules 1 and 2 can be reduced in size compared to the conventional one, and in particular, the width (length in the short direction) of the substrate 10 can be reduced. Moreover, the light emitting modules 1 and 2 can reduce manufacturing cost compared with the past by size reduction.

  In the light emitting modules 1 and 2 according to the embodiment and the modification having the above-described configuration, the distance between the light emitting elements 30 in the longitudinal direction of the substrate 10 is 0.3 mm or less. As a result, the light emitting modules 1 and 2 can suppress an increase in the length of the substrate 10 in the longitudinal direction, and eliminate a point of failure (non-lighting point) where the chip (light emitting element 30) does not exist. By being able to reduce, it is possible to suppress the occurrence of uneven brightness and to approach uniform light emission.

  Further, the light emitting modules 1 and 2 according to the embodiment and the modification having the above-described configuration seal the light emitting element 30 and the substrate 10 with respect to the width in the short direction of the substrate 10 in a cross section orthogonal to the longitudinal direction of the substrate 10. The sealing portion 40 having a height ratio from 0.2 to 0.7 is provided. Thereby, the light emitting modules 1 and 2 can maintain light extraction efficiency, and can suppress the enlargement of the sealing part 40.

  In addition, the light emitting modules 1 and 2 according to the embodiment and the modified example having the above-described configuration are directions between the short side direction and the long side direction of the substrate 10 from the electrode provided on the opposite surface 32 in the plan view of the substrate 10. The wires 52 and 53 extend in a direction away from the light emitting element 30 and are connected to one of the pair of conductor patterns 20. As a result, the light emitting modules 1 and 2 are formed by pulling out the wires 52 and 53 as compared with the case where the wires 552 and 553 are pulled out in the short direction (vertical direction in FIG. 7) of the substrate 530 as shown in FIG. The increase in the distance W10 between the conductor patterns 20 can be suppressed.

  Further, in the light emitting module 2 according to the modified example of the configuration described above, a plurality of light emitting elements 30 are provided by periodically changing the center position in the short direction of the substrate 10 with respect to the short direction of the substrate 10. Thereby, the light emitting module 2 can suppress the absorption of light between the light emitting elements 30, and can output more desired light.

  The lighting fixture 100 having the above-described configuration includes the light emitting modules 1 and 2. Thereby, the lighting fixture 100 can suppress an increase in size by using the small light emitting modules 1 and 2.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the invention described in the claims and equivalents thereof as well as included in the scope and gist of the invention.

DESCRIPTION OF SYMBOLS 1 Light emitting module 10 Board | substrate 21, 22 (20) Conductor pattern 30 Light emitting element 40 Sealing part 51,52,53 (50) Wire

Claims (6)

A long substrate;
A pair of conductor patterns provided on the substrate along the longitudinal direction of the substrate at a predetermined interval in the short direction of the substrate;
A light emitting element mounted on the pair of conductor patterns and fed from a surface opposite to the mounting surface mounted on the pair of conductor patterns, wherein the mounting surface overlaps the pair of conductor patterns A light emitting element;
A light emitting module comprising: The light emitting module according to claim 1, wherein a distance between the light emitting elements in the longitudinal direction of the substrate is 0.3 mm or less. The sealing portion that seals the light emitting element and has a ratio of a height from the substrate to a width in a short direction of the substrate of 0.2 to 0.7 in a cross section orthogonal to a longitudinal direction of the substrate ;
The light emitting module according to claim 1, further comprising: In a plan view of the substrate, one of the pair of conductor patterns extends from an electrode provided on the opposite surface in a direction between a short direction and a long direction of the substrate and in a direction away from the light emitting element. Wires connected to one side;
The light emitting module according to claim 1, further comprising: The said light emitting element is provided with two or more by changing periodically the position of the center in the transversal direction of the said board | substrate in the transversal direction of the said board | substrate. The light emitting module according to claim 1. The light emitting module of any one of Claims 1-5;
The lighting fixture characterized by comprising.

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