JP2017118108A - フレキシブル基板 - Google Patents
フレキシブル基板 Download PDFInfo
- Publication number
- JP2017118108A JP2017118108A JP2016242162A JP2016242162A JP2017118108A JP 2017118108 A JP2017118108 A JP 2017118108A JP 2016242162 A JP2016242162 A JP 2016242162A JP 2016242162 A JP2016242162 A JP 2016242162A JP 2017118108 A JP2017118108 A JP 2017118108A
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- stretchable
- flexible substrate
- strip
- sheet
- elastic modulus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
(1)従来のフレキシブル基板は、フレキシブル基板の延在方向に伸縮可能であるものの、当該延在方向と異なる方向には伸縮しにくい。それゆえ、市場のニーズに応える程の十分な伸縮性が呈され難い。
(2)従来のフレキシブル基板は、伸縮によって応力が集中し易い箇所で破断または断線する虞がある。
(3)従来のフレキシブル基板では、高い伸縮性を確保することと、予期せぬ引張り力による配線の破断または断線を防止することを両立することが極めて難しい。
(4)従来のフレキシブル基板では、一旦伸張された後に、伸びたままの状態が維持される虞がある。
(1)渦巻き状の伸縮ストリップ10Bの湾曲部は、蛇行状の伸縮ストリップ10Bの湾曲部よりも、大きな曲率半径で湾曲する。これにより、伸縮ストリップ10Bのゆとり長さをより大きく取ることができる。
(2)渦巻き状の伸縮ストリップ10Bは、渦巻きがほどけるように変位するため、この変位が伸縮ストリップの伸長を助力し得る。
伸縮性フレキシブル基板100の1つの例示的な構成について詳述しておく。図13は、渦巻状に湾曲した伸縮ストリップ10Bを含む配線層10と、繊維編物から構成された非線形弾性層50とを備える伸縮性フレキシブル基板100を示している。
10A 非伸縮部
10B 伸縮ストリップ
12 絶縁基材
16 導電配線
18 導電性部材
50 非線形弾性層
50a 繊維布
50b エラストマー
70 電子部品
80 封止層
100 伸縮性フレキシブル基板
Claims (18)
- 伸縮可能なシートと、
前記シート上に配置された非伸縮部材と、
前記シート上で前記非伸縮部材に接続され、伸縮可能なストリップとを備え、
前記シートは、
前記シートの伸張量が所定の値以下のとき、第1の弾性率を有し、
前記シートの前記伸張量が前記所定の値を超えるとき、前記第1の弾性率よりも大きく、かつ、前記ストリップの弾性率よりも大きい第2の弾性率を有する、
フレキシブル基板。 - 前記シート上に配置された複数の非伸縮部材と、前記シート上で前記複数の非伸縮部材の間を接続する、伸縮可能な複数のストリップとを備え、
前記非伸縮部材は、前記複数の非伸縮部材の1つであり、
前記ストリップは、前記複数のストリップの1つである、
請求項1に記載のフレキシブル基板。 - 前記所定の値は、前記ストリップに塑性変形を生じさせる伸張量よりも小さい、
請求項1又は2に記載のフレキシブル基板。 - 前記第2の弾性率は、前記第1の弾性率の10倍以上である、
請求項1から3のいずれか一項に記載のフレキシブル基板。 - 前記シートの前記伸張量が前記所定の値以下のとき、前記シートの前記第1の弾性率は、前記ストリップの前記弾性率の0.1倍以上、4倍未満である、
請求項1から4のいずれか一項に記載のフレキシブル基板。 - 前記シートの初期弾性率は、前記ストリップの初期弾性率よりも大きい、
請求項1から5のいずれか一項に記載のフレキシブル基板。 - 前記ストリップは、湾曲している、
請求項1から6のいずれか一項に記載のフレキシブル基板。 - 前記ストリップは、蛇行している、
請求項7に記載のフレキシブル基板。 - 前記ストリップは、前記非伸縮部材を半周以上囲む渦巻き形状を有する、
請求項7に記載のフレキシブル基板。 - 前記非伸縮部材は、導電層を含む平板である、
請求項1から9のいずれか一項に記載のフレキシブル基板。 - 前記ストリップは、導電配線を含む、
請求項1から10のいずれか一項に記載のフレキシブル基板。 - 前記ストリップは、絶縁性部材をさらに含む、
請求項11に記載のフレキシブル基板。 - 前記シートは、繊維布を含む、
請求項1から12のいずれか一項に記載のフレキシブル基板。 - 前記繊維布は、ニット構造を有する、
請求項13に記載のフレキシブル基板。 - 前記繊維布は、ネット構造を有する、
請求項13に記載のフレキシブル基板。 - 前記繊維布は、エラストマーをさらに含む、
請求項13から15のいずれか一項に記載のフレキシブル基板。 - 前記シート上で前記非伸縮部材に接続され、伸縮可能な絶縁性部材をさらに備え、
前記ストリップは、前記絶縁性部材上に配置される、
請求項1から16のいずれか一項に記載のフレキシブル基板。 - 前記非伸縮部材の上に配置された電子部品をさらに備える、
請求項1から17のいずれか一項に記載のフレキシブル基板。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015249034 | 2015-12-21 | ||
| JP2015249034 | 2015-12-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017118108A true JP2017118108A (ja) | 2017-06-29 |
| JP6660618B2 JP6660618B2 (ja) | 2020-03-11 |
Family
ID=59065275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016242162A Active JP6660618B2 (ja) | 2015-12-21 | 2016-12-14 | フレキシブル基板 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9844133B2 (ja) |
| JP (1) | JP6660618B2 (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200082370A (ko) * | 2018-12-28 | 2020-07-08 | 서울대학교산학협력단 | 신축성을 가지는 배선용 기판 장치 및 이의 제조 방법과, 상기 배선용 기판 장치를 포함하는 전자 기기 |
| KR20210012391A (ko) * | 2019-07-25 | 2021-02-03 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
| KR20220026957A (ko) * | 2020-08-26 | 2022-03-07 | 재단법인 파동에너지 극한제어 연구단 | 신축성 패널 |
| WO2023013934A1 (ko) * | 2021-08-06 | 2023-02-09 | 재단법인 파동에너지극한제어연구단 | 감긴 미세힌지를 갖는 메타시트 및 이를 포함하는 신축성 소자 |
| JP2024003585A (ja) * | 2022-06-27 | 2024-01-15 | 株式会社村田製作所 | 伸縮性デバイス |
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| US9484209B1 (en) * | 2015-11-20 | 2016-11-01 | International Business Machines Corporation | Flexible and stretchable sensors formed by patterned spalling |
| KR101810050B1 (ko) * | 2016-08-11 | 2017-12-19 | 삼성디스플레이 주식회사 | 스트레처블 디스플레이 장치 및 스트레처블 디스플레이 장치의 제조 방법 |
| US11259409B2 (en) * | 2016-11-15 | 2022-02-22 | Showa Denko Materials Co., Ltd. | Conductor substrate, wiring substrate and method for producing wiring substrate |
| US10881001B2 (en) | 2017-03-02 | 2020-12-29 | Flex Ltd. | Micro conductive thread interconnect component to make an interconnect between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits |
| DE102017129336B3 (de) | 2017-12-08 | 2019-01-10 | Amohr Technische Textilien Gmbh | Elastische, elektrisch leitfähige, textile Bänder |
| KR102491653B1 (ko) * | 2018-03-08 | 2023-01-25 | 삼성디스플레이 주식회사 | 스트레처블 표시 장치 |
| KR102560102B1 (ko) * | 2018-07-13 | 2023-07-26 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102530672B1 (ko) | 2018-07-20 | 2023-05-08 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
| KR102554048B1 (ko) * | 2018-07-20 | 2023-07-10 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
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| US10985484B1 (en) | 2018-10-01 | 2021-04-20 | Flex Ltd. | Electronic conductive interconnection for bridging across irregular areas in a textile product |
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| JP2020188118A (ja) * | 2019-05-14 | 2020-11-19 | 株式会社ジャパンディスプレイ | フレキシブル基板 |
| KR102840257B1 (ko) * | 2019-08-23 | 2025-07-29 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
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| KR20200082370A (ko) * | 2018-12-28 | 2020-07-08 | 서울대학교산학협력단 | 신축성을 가지는 배선용 기판 장치 및 이의 제조 방법과, 상기 배선용 기판 장치를 포함하는 전자 기기 |
| KR102169470B1 (ko) * | 2018-12-28 | 2020-10-23 | 서울대학교산학협력단 | 신축성을 가지는 배선용 기판 장치 및 이의 제조 방법과, 상기 배선용 기판 장치를 포함하는 전자 기기 |
| KR20210012391A (ko) * | 2019-07-25 | 2021-02-03 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
| KR102652324B1 (ko) | 2019-07-25 | 2024-03-27 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 |
| KR20220026957A (ko) * | 2020-08-26 | 2022-03-07 | 재단법인 파동에너지 극한제어 연구단 | 신축성 패널 |
| KR102406243B1 (ko) * | 2020-08-26 | 2022-06-08 | 재단법인 파동에너지 극한제어 연구단 | 신축성 패널 |
| WO2023013934A1 (ko) * | 2021-08-06 | 2023-02-09 | 재단법인 파동에너지극한제어연구단 | 감긴 미세힌지를 갖는 메타시트 및 이를 포함하는 신축성 소자 |
| KR20230021848A (ko) * | 2021-08-06 | 2023-02-14 | 한국기계연구원 | 감긴 미세힌지를 갖는 메타시트 및 이를 포함하는 신축성 소자 |
| KR102552366B1 (ko) * | 2021-08-06 | 2023-07-07 | 한국기계연구원 | 감긴 미세힌지를 갖는 메타시트 및 이를 포함하는 신축성 소자 |
| JP2024003585A (ja) * | 2022-06-27 | 2024-01-15 | 株式会社村田製作所 | 伸縮性デバイス |
| JP7609130B2 (ja) | 2022-06-27 | 2025-01-07 | 株式会社村田製作所 | 伸縮性デバイス |
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| JP6660618B2 (ja) | 2020-03-11 |
| US9844133B2 (en) | 2017-12-12 |
| US20170181277A1 (en) | 2017-06-22 |
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